Complex

Abstract

To provide an article having no protrusion of a material from the end part of a laminate.SOLUTION: A composite in which a first composition I is completely covered with a second composition O, wherein the first composition I contains a first resin, the second composition O contains a second resin, a softening point of the first resin is 100 °C. or lower, and a shortest distance dimension of the composite is 5 μm or more.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a composite. [Background technology]

[0002] For example, Patent Document 1 discloses a method for manufacturing a solar cell module using a laminate made of multiple members including a sealing film. Patent Document 1 discloses that the sealing film melts and flows when pressurized and heated, causing it to protrude from the edge of the laminate, resulting in problems such as reduced power generation efficiency and appearance characteristics. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-245375 Summary of the Invention [Problem to be solved by the invention]

[0004] Thus, in a laminate, even if the inner layer is not located on the surface in the stacking direction of the laminate, if the material of the inner layer is a highly fluid material, the material may protrude from the edge, which may impair the original function of the laminate or may cause contamination by adhering to the surrounding area.

[0005] Therefore, an object of the present invention is to provide a product that does not have material protruding from the edges. [Means for solving the problem]

[0006] The present invention provides a composite in which a first composition I is completely coated with a second composition O, the first composition I comprises a first resin; the second composition O comprises a second resin; The softening point of the first resin is 100°C or less, The shortest dimension of the composite is 5 μm or more, which makes it possible to prevent the material from spilling out from the edge.

[0007] In one embodiment of the composite of the present invention, the first resin has a glass transition temperature of 50° C. or lower.

[0008] In one embodiment of the composite of the present invention, the viscosity I of the first composition I at 180° C. is 500,000 mPa·s or less.

[0009] In one embodiment of the composite of the present invention, the viscosity O of the second composition O at 180°C is higher than the viscosity I.

[0010] In one embodiment of the composite of the present invention, the first resin is a thermosetting resin or a UV-curable resin, and the softening point of the first resin before curing is 100° C. or lower.

[0011] In one embodiment of the composite of the present invention, the first resin is a thermosetting resin or a UV-curable resin, and the glass transition temperature of the first resin before curing is 50° C. or lower.

[0012] In one embodiment of the complex of the present invention, said first composition I further comprises microparticles.

[0013] In one embodiment of the composite of the present invention, the second composition O is a pressure sensitive adhesive or adhesive.

[0014] In one embodiment of the composite of the present invention, the pressure sensitive adhesive or adhesive is a hot melt type, a heat curing type, or a UV curing type. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a composite that can prevent material from spilling out from the edges. [Brief explanation of the drawings]

[0016] [Figure 1]FIG. 1 is a schematic cross-sectional view of an example of the composite of the present invention. [Figure 2] FIG. 2 is a schematic cross-sectional view of another example of the composite of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described. These descriptions are for the purpose of illustrating the present invention and are not intended to limit the present invention in any way.

[0018] In the present invention, two or more embodiments can be combined in any manner.

[0019] Unless otherwise specified, the materials, components, compounds, resins, catalysts, and solvents described herein may be used alone or in combination of two or more.

[0020] In the present invention, the viscosity I of the first composition I at 180° C. and the viscosity O of the second composition O at 180° C. are measured by the method described in the examples.

[0021] (complex) The present invention provides a composite in which a first composition I is completely coated with a second composition O, the first composition I comprises a first resin; the second composition O comprises a second resin; The softening point of the first resin is 100°C or less, The shortest distance dimension of the complex is 5 μm or more.

[0022] 1 is a schematic diagram of a cross section of an example of a composite of the present invention. In composite 1, the first composition I (10) is completely covered with the second composition O (20).

[0023] Fig. 2 is a schematic diagram of a cross section of another example of the composite of the present invention. In Fig. 2, composite 1 is present on adherend 30. Adherend 30 is not included in composite 1. In the example of Fig. 2, the shape of second composition O(20) is deformed by contact with adherend 30.

[0024] (First Composition I) The first composition I includes a first resin having a softening point of 100° C. or less. The first composition is different from the second composition.

[0025] The first resin is not particularly limited as long as it has a softening point of 100°C or less, and can be appropriately selected depending on the application of the composite, etc. Examples include UV-curable resins, thermosetting resins, thermoplastic resins, silicone-based polymers, natural rubber, and synthetic rubber.

[0026] Examples of UV-curable resins include radically polymerizable compounds, photocationically polymerizable compounds, and photoanionically polymerizable compounds.

[0027] The radical polymerizable compound may be any compound having one or more radical polymerizable functional groups in the molecule, and is preferably a compound having one or more ethylenically unsaturated groups in one molecule, such as a vinyl group, a (meth)acryloyl group, or an allyl group.

[0028] Examples of the radically polymerizable compound having a vinyl group include aromatic vinyl compounds such as styrene and vinyl toluene; heterocycle-containing vinyl compounds such as vinyl imidazole and vinyl pyridine; and vinyl ethers such as n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, 2-hydroxyethyl vinyl ether, cyclohexanedimethanol monovinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether, cyclohexyl vinyl ether, dodecyl vinyl ether, octadecyl vinyl ether, lauryl vinyl ether, cetyl vinyl ether, and 2-ethylhexyl vinyl ether.

[0029] Examples of radically polymerizable compounds having a (meth)acryloyl group include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, and maleic acid, as well as salts, esters, acid amides, and acid anhydrides thereof; urethane acrylate, acrylonitrile, styrene derivatives, various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides, and unsaturated polyurethanes.

[0030] The (meth)acryloyl group refers to an acryloyl group or a methacryloyl group.

[0031] Specific examples of the allyl compound include monofunctional allyl compounds such as allyl alcohol.

[0032] The photocationically polymerizable compound may be any compound having one or more photocationically polymerizable functional groups in one molecule, and is preferably a compound having one or more photocationically polymerizable functional groups in one molecule, such as an epoxy group, an oxetanyl group, a hydroxyl group, a vinyl ether group, an episulfide group, an ethyleneimine group, or an oxazoline group.

[0033] As the photocationically polymerizable compound having an epoxy group, a compound having one or more epoxy groups in one molecule can be used, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, polyhydroxynaphthalene type epoxy resin, isocyanate-modified epoxy resin, 10-(2,5-dihydroxyphenyl)-9,10-dihydro Examples of the epoxy resin include 9-oxa-10-phosphaphenanthrene-10-oxide modified epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, hexanediol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, dicyclopentadiene-phenol addition reaction type epoxy resins, phenol aralkyl type epoxy resins, naphthol novolac type epoxy resins, naphthol aralkyl type epoxy resins, naphthol-phenol co-condensed novolac type epoxy resins, naphthol-cresol co-condensed novolac type epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenolic resin type epoxy resins, biphenyl-modified novolac type epoxy resins, trimethylolpropane type epoxy resins, alicyclic epoxy resins, acrylic resins having epoxy groups, polyurethane resins having epoxy groups, polyester resins having epoxy groups, and flexible epoxy resins.

[0034] Examples of photocationically polymerizable compounds having an oxetanyl group include oxetane compounds such as 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,4-bis[(3-methyl-3-oxetanylmethoxy)methyl]benzene, 3-methyl-3-glycidyloxetane, 3-ethyl-3-glycidyloxetane, 3-methyl-3-hydroxymethyloxetane, 3-ethyl-3-hydroxymethyloxetane, and di{1-ethyl(3-oxetanyl)}methyl ether.

[0035] Other examples of UV-curable resins include the acrylic copolymers described in JP-A-2022-033767, the acrylic polymers described in JP-A-2021-059711, and photopolymerizable compounds.

[0036] Examples of thermosetting resins include urethane resins, phenolic resins, unsaturated polyester resins, epoxy resins, acrylic resins, urea resins, melamine resins, benzoguanamine resins, alkyd resins, vinyl ester resins, diallyl terephthalate resins, silicone resins, furan resins, ketone resins, xylene resins, thermosetting polyimide resins, benzoxazine resins, active ester resins, aniline resins, cyanate ester resins, and styrene-maleic anhydride (SMA) resins.

[0037] Specific examples of epoxy resins include bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, aliphatic type epoxy resins, dicyclopentadiene type epoxy resins such as dicyclopentadiene-phenol addition reaction type epoxy resins, biphenyl type epoxy resins, tetramethylbiphenyl type epoxy resins, polyhydroxynaphthalene type epoxy resins, isocyanate-modified epoxy resins, 10-(2,5-dihydroxyphenyl)-9,10-dihydro Examples of epoxy resins that can be used include 9-oxa-10-phosphaphenanthrene-10-oxide modified epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, phenol aralkyl type epoxy resins, naphthol novolac type epoxy resins, naphthol aralkyl type epoxy resins, naphthol-phenol co-condensed novolac type epoxy resins, naphthol-cresol co-condensed novolac type epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenolic resin type epoxy resins, and biphenyl modified novolac type epoxy resins.

[0038] Examples of thermoplastic resins include polyolefin resins such as polypropylene and polymethylpentene, polycarbonate resins, (meth)acrylic resins, polystyrene resins, polyvinyl chloride resins, polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, cyclic olefin resins, polyamide resins, polyarylate resins and polyimide resins.

[0039] Other examples of the thermoplastic resin include the thermoplastic resins described in JP-A-09-216966.

[0040] The softening point of the first resin is 100° C. or lower, preferably −40 to 100° C., −20 to 100° C., or 0 to 100° C. When the softening point is 100° C. or lower, the first composition I of the present invention can be stably discharged in a desired shape from the nozzle of a liquid application device when the composition I is applied using the device.

[0041] When the first resin is a curable resin, the softening point of the first resin before curing is 100°C or lower, preferably -40 to 100°C, -20 to 100°C, or 0 to 100°C.

[0042] When the first resin is a curable resin, the softening point of the first resin after curing is 250°C or lower, preferably -40 to 250°C, -40 to 100°C, -20 to 100°C, or 0 to 100°C.

[0043] The glass transition temperature (Tg) of the first resin is not particularly limited and is, for example, −80 to 200° C. In one embodiment, the Tg of the first resin is 50° C. or lower. From the viewpoint of being able to adjust the viscosity of the first composition I of the present invention to an appropriate level when it is applied using a liquid application device, the Tg of the first resin is preferably −80° C. or higher and 40° C. or lower, more preferably −70° C. or higher and 30° C. or lower.

[0044] When the first resin is a curable resin, the Tg of the first resin before curing is, for example, −80 to 200° C. In one embodiment, when the first resin is a curable resin, the Tg of the first resin before curing is 50° C. or less. The Tg of the first resin before curing is preferably −80° C. or more and 40° C. or less, more preferably −70° C. or more and 20° C. or less.

[0045] The first composition I may contain, depending on the application and function, for example, fine particles, plasticizers, antioxidants, ultraviolet absorbers, antistatic agents, surfactants, colorants, light stabilizers, foaming agents, lubricants, crystal nucleating agents, crystallization accelerators, crystallization retarders, catalysts, catalyst deactivators, impact modifiers, slip agents, crosslinking agents, crosslinking aids, tackifiers, silane coupling agents, processing aids, mold release agents, hydrolysis inhibitors, heat stabilizers, antiblocking agents, antifogging agents, flame retardants, flame retardant aids, light diffusing agents, antibacterial agents, antifungal agents, dispersants, resins other than the first resin (i.e., resins having a softening point higher than 100°C), solvents, and the like.

[0046] Examples of the fine particles include organic fine particles and inorganic fine particles.

[0047] Examples of organic fine particles include polyester-based resin fine particles, polyurethane-based resin fine particles, polyolefin-based resin fine particles, polymer-based fine particles made of styrene and polyolefin, and fine particles made of hydrogenated products thereof, cellulose-based resin fine particles, silicone-based fine particles, melamine-based resin fine particles, acrylic-based resin fine particles, acrylic-styrene copolymer fine particles, polycarbonate-based resin fine particles, polystyrene-based resin fine particles, and benzoguanamine-based resin fine particles.

[0048] Examples of inorganic fine particles include silica, alumina, mica, talc, aluminum flakes, and glass flakes.

[0049] The fine particles may also contain conductive fine particles, such as conductive metal particles of gold, silver, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, cadmium, etc., conductive metal oxide particles of indium tin oxide (ITO), ZnO, SnO, etc., conductive carbon particles of carbon nanotubes, Ketjen black, etc., and conductive polymers of polypyrrole, polyacetylene, polythiophene, etc.

[0050] The fine particles may also contain thermally conductive fine particles, such as boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum oxide, silicon carbide, silicon dioxide, diamond, magnesium oxide, anhydrous magnesium carbonate, magnesium hydroxide, and aluminum hydroxide.

[0051] In one embodiment of the complex of the present invention, said first composition I further comprises microparticles.

[0052] The viscosity of the first composition I is not particularly limited and can be selected appropriately. In one embodiment, the viscosity I of the first composition I at 180°C is 500,000 mPa·s or less. It is preferably 10 to 500,000 mPa·s, more preferably 100 to 450,000 mPa·s, particularly preferably 500 to 400,000 mPa·s, and most preferably 1,000 to 400,000 mPa·s. When the viscosity is 500,000 mPa·s or less, when the first composition I of the present invention is applied using a liquid application device, the composition I can be stably discharged in a desired shape from the nozzle of the device.

[0053] The viscosity of the first composition I and the second composition O in the present invention can be measured by placing the composition in a Thermosel: Model 106 and heating it to a desired temperature, and using a composition viscosity measuring device: HA DVPlus manufactured by Brookfield Corporation.

[0054] (Second Composition O) The second composition O includes a second resin.

[0055] The second resin may be any of the materials exemplified as the first resin. Also, the second resin may be a resin with a softening point higher than 100° C. The first resin and the second resin may be the same or different.

[0056] The second composition O may contain, depending on the application and function, for example, fine particles, plasticizers, antioxidants, ultraviolet absorbers, antistatic agents, surfactants, colorants, light stabilizers, foaming agents, lubricants, crystal nucleating agents, crystallization accelerators, crystallization retarders, catalyst deactivators, thermoplastic resins, thermosetting resins, impact modifiers, slip agents, crosslinking agents, crosslinking aids, tackifiers, silane coupling agents, processing aids, mold release agents, hydrolysis inhibitors, heat stabilizers, antiblocking agents, antifogging agents, flame retardants, flame retardant aids, light diffusing agents, antibacterial agents, antifungal agents, dispersants, solvents, and the like.

[0057] Examples of the fine particles include organic fine particles and inorganic fine particles.

[0058] Examples of organic fine particles include polyester-based resin fine particles, polyurethane-based resin fine particles, polyolefin-based resin fine particles, polymer-based fine particles made of styrene and polyolefin, and fine particles made of hydrogenated products thereof, cellulose-based resin fine particles, silicone-based fine particles, melamine-based resin fine particles, acrylic-based resin fine particles, acrylic-styrene copolymer fine particles, polycarbonate-based resin fine particles, polystyrene-based resin fine particles, and benzoguanamine-based resin fine particles.

[0059] Examples of inorganic fine particles include silica, alumina, mica, talc, aluminum flakes, and glass flakes.

[0060] The fine particles may also contain conductive fine particles, such as conductive metal particles of gold, silver, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, cadmium, etc., conductive metal oxide particles of indium tin oxide (ITO), ZnO, SnO, etc., conductive carbon particles of carbon nanotubes, Ketjen black, etc., and conductive polymers of polypyrrole, polyacetylene, polythiophene, etc.

[0061] The fine particles may also contain thermally conductive fine particles, such as boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum oxide, silicon carbide, silicon dioxide, diamond, magnesium oxide, anhydrous magnesium carbonate, magnesium hydroxide, and aluminum hydroxide.

[0062] The viscosity of the second composition O is not particularly limited and can be selected appropriately. The viscosity O of the second composition O at 180°C is, for example, 100 to 1,000,000 mPa·s. It is preferably 500 to 1,000,000 mPa·s, more preferably 500 to 800,000 mPa·s, and particularly preferably 1,000 to 500,000 mPa·s. When the viscosity is 100 to 1,000,000 mPa·s, dripping of the composition O from the nozzle of a liquid application device can be suppressed when the second composition O of the present invention is applied with the device. In one embodiment, the viscosity O of the second composition O at 180°C is higher than the viscosity I of the first composition I at 180°C.

[0063] In one embodiment, the second composition O is an adhesive or a adhesive. In another embodiment, the second composition O is a hot melt adhesive or a hot melt adhesive. In yet another embodiment, the second composition O is a heat-curable adhesive or a heat-curable adhesive. In yet another embodiment, the second composition O is a UV-curable adhesive or a UV-curable adhesive.

[0064] In one embodiment, the second composition O is a cured composition O. In another embodiment, the second composition O is a cured pressure sensitive adhesive or a cured adhesive.

[0065] In the composite of the present invention, the first composition I is required to be completely covered by the second composition O, and the third composition may be present inside the first composition I, or the third composition may be present between the first composition I and the second composition O.

[0066] The composite of the present invention may have a shortest dimension (width, depth, or height) of 5 μm or more. The shortest dimension is, for example, preferably 5 to 5,000 μm, more preferably 10 to 3,000 μm, particularly preferably 50 to 3,000 μm, even more preferably 70 to 3,000 μm, and most preferably 100 to 2,000 μm. When the shortest dimension (width, depth, or height) is 5 μm or more, the distance between the nozzle of the composition application device and the adherend is within an appropriate range, preventing contact between the nozzle and the adherend and enabling the composite to be applied with precision. Dimensions other than the shortest dimension are not particularly limited and may be adjusted as appropriate. For example, when the height is the shortest dimension, the width and depth dimensions are not limited.

[0067] The shape of the complex is not particularly limited, and examples thereof include a sphere, an ellipsoid, a cylinder, a rectangular parallelepiped, a cone, a pyramid, other regular solids, and amorphous shapes.

[0068] (Method of manufacturing the composite) The composite of the present invention can be produced, for example, by the following steps: step (1) of preparing a first composition I and a second composition O, step (2) of preparing a liquid application device (wherein the liquid application device has a double structure in which the discharge area of ​​a discharge nozzle for discharging the first composition I is surrounded by the discharge area of ​​a discharge nozzle for discharging the second composition O), and step (3) of applying the first composition I and the second composition O using the liquid application device to completely cover the first composition I with the second composition O to form a composite.

[0069] The liquid application device has a double structure in which the discharge area of ​​the discharge nozzle for discharging the first composition I is surrounded by the discharge area of ​​the discharge nozzle for discharging the second composition O. This allows the first composition I to be completely covered by the second composition O when the first composition I and the second composition O are applied.

[0070] The method for producing the composite may include a step (4) of heating at least one of the first composition I and the second composition O to adjust the viscosity of the composition to a suitable level for application. A suitable heating device can be used to heat the composition. [Example]

[0071] The present invention will be described in more detail below by way of examples, but these examples are intended to illustrate the present invention and are not intended to limit the present invention in any way.

[0072] The materials used in the examples are as follows: First resin: polyester resin, manufactured by Unitika Ltd., trade name "Elitel (registered trademark) UE3400", softening point: 40°C, Tg: -20°C, viscosity at 180°C: 98670 mPa·s Second resin: polyester resin, manufactured by Unitika Ltd., trade name "Elitel (registered trademark) UE3231G", softening point: 45°C, Tg: 4°C, viscosity at 180°C: 132000 mPa·s

[0073] Example 1 The first resin (first composition I) and the second resin (second composition O) were heated to 160°C and filled into separate syringes. Both compositions were then heated to 180°C. The first composition I was dispensed onto a 75 μm thick PET film using a Musashi Engineering dispenser "ML-808GX," and the second composition O was dispensed onto a 75 μm thick PET film using a Musashi Engineering dispenser "ML-8000X." A composite with a cross-sectional shape of 4000 μm wide and 900 μm high was obtained. The cross-sectional shape was measured using a KEYENCE VHX-H6M. Discharge nozzles are attached to the tips of the two dispensers, and as shown in the cross-sectional shape of the discharge part below, the discharge part of the discharge nozzle has a double structure in which a discharge area for discharging the first composition I is surrounded by a discharge area for discharging the second composition O. Cross-sectional shape of the discharge part of the double discharge nozzle in a cross section perpendicular to the discharge direction: First composition I: Discharge part: 1 mm diameter circular shape Thickness of the partition between the first composition I discharge part and the second composition O discharge part: 0.4 mm Second composition O discharge part: a circular shape with a diameter of 3.8 mm and a circular part with a diameter of 1.8 mm missing The coating device uses two dispensers to deliver the liquid, with the discharge portions of each dispenser connected to a double discharge nozzle. The coating device has a structure in which the first composition I delivered from the ML-808GX is discharged from the inner discharge portion (first composition I discharge portion), and the second composition O delivered from the ML-8000X is discharged from the outer discharge portion (second composition O discharge portion) surrounding the inner discharge portion.

[0074] Discharge conditions Distance to PET film: 1 mm Discharge pressure of first composition I: 0.4 MPa Discharge pressure of second composition O: 0.2 MPa Dispenser movement speed during application: 10m / min [Industrial Applicability]

[0075] According to the present invention, it is possible to provide a composite that can prevent material from spilling out from the edges. [Explanation of symbols]

[0076] 1: Complex 10: First composition I 20: Second composition O 30: Adherent

Claims

1. A composite in which a first composition I is completely coated with a second composition O, the first composition I comprises a first resin; the second composition O comprises a second resin, the softening point of the first resin is 100°C or less; A composite, wherein the shortest distance dimension of the composite is 5 μm or greater.

2. 2. The composite of claim 1, wherein the first resin has a glass transition temperature of 50°C or less.

3. 2. The composite according to claim 1, wherein the viscosity I of the first composition I at 180°C is 500,000 mPa·s or less.

4. The composite of claim 3, wherein the viscosity O of the second composition O at 180°C is higher than the viscosity I.

5. 2. The composite according to claim 1, wherein the first resin is a thermosetting resin or a UV-curable resin, and the softening point of the first resin before curing is 100°C or lower.

6. 3. The composite according to claim 2, wherein the first resin is a thermosetting resin or a UV-curable resin, and the glass transition temperature of the first resin before curing is 50°C or lower.

7. The composite of claim 1 , wherein the first composition I further comprises microparticles.

8. The composite of claim 1 , wherein the second composition O is a pressure-sensitive adhesive or adhesive.

9. 9. The composite of claim 8, wherein the pressure sensitive adhesive or glue is a hot melt type, a heat curing type, or a UV curing type.

Images