Liquid ejection substrate and method of manufacturing the same

Abstract

To provide a technique for suppressing peeling of a substrate when a flexible member functioning as a damper is arranged on a liquid ejection substrate.SOLUTION: A liquid ejection substrate includes a support substrate, a first bonding member, a sheet-like flexible member, a second bonding member, and a flow path substrate in which a flow path for guiding a liquid to an ejection port is formed, wherein the support substrate is provided with a recessed portion at a position corresponding to at least a part of the flow path formed in the flow path substrate, the flexible member is disposed between the flow path and the recessed portion, and the first bonding member and the second bonding member are partially in contact with each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection substrate and a method for manufacturing the same. [Background technology]

[0002] An inkjet head mounted on an inkjet recording device is known as an example of a liquid ejection head for ejecting droplets. The inkjet head has multiple pressure chambers and ejection ports, and is configured so that a drive unit applies pressure to the ink in the pressure chambers to eject ink droplets from the ejection ports.

[0003] Here, pressure fluctuations that occur in one pressure chamber as ink droplets are ejected may propagate to other pressure chambers via the liquid flow paths, which may result in ejection defects due to so-called crosstalk.

[0004] One example of a method for reducing the effects of crosstalk is to use a damper to attenuate pressure fluctuations. Patent Document 1 discloses a liquid ejection substrate in which a flexible member that functions as a damper is provided in a liquid flow path. The flexible member in Patent Document 1 is sandwiched between substrates via a bonding member. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 7196740 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the configuration of Patent Document 1, if the adhesion between the flexible member and the bonding member is low at the position where the flexible member is sandwiched between the substrates, there is a possibility that the substrates may peel off.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technique for preventing peeling of a liquid ejection substrate when a flexible member that functions as a damper is disposed on the liquid ejection substrate. [Means for solving the problem]

[0008] In order to achieve the above object, the liquid ejection substrate of the present disclosure comprises: A liquid ejection substrate in which a support substrate, a first bonding member, a sheet-like flexible member, a second bonding member, and a flow path substrate in which a flow path that guides liquid to an ejection port is formed are laminated, a recess is provided in the support substrate at a position corresponding to at least a part of the flow path formed in the flow path substrate, and the flexible member is disposed between the flow path and the recess; The first joint member and the second joint member are in partial contact with each other. It is characterized by:

[0009] The method for manufacturing a liquid ejection substrate according to the present disclosure includes: forming a through hole in a support substrate and forming a recess at a position different from the through hole; a step of arranging a first bonding member in an area of ​​the surface of the support substrate on which the recess is formed, where the through hole and the recess are not formed; placing a sheet-like flexible member on an upper surface of the first bonding member; An opening is formed in the flexible member at a position corresponding to the through hole of the support substrate. and a step of arranging a second bonding member on a surface of the flexible member opposite to a surface bonded to the support substrate via the first bonding member, the second bonding member being in partial contact with the first bonding member; The present invention is characterized by having the following. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a technique for suppressing peeling of the substrate when a flexible member that functions as a damper is disposed on the liquid ejection substrate. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic cross-sectional perspective view of a liquid ejection substrate according to an embodiment; [Figure 2] FIG. 1 is a diagram illustrating a bonding state of a flexible member; [Figure 3] Schematic enlarged view of the area functioning as a damper [Figure 4] Schematic diagram showing a state in which joining members are in contact with each other in one embodiment. [Figure 5] 1 is a diagram illustrating a manufacturing process of a liquid ejection substrate according to an embodiment; [Figure 6] 1 is a diagram illustrating a manufacturing process of a liquid ejection substrate according to an embodiment; [Figure 7] 1 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment; [Figure 8] 1 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment; [Figure 9] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate; [Figure 10] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate; [Figure 11] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate; [Figure 12] 1 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment; [Figure 13] 1 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment; [Figure 14] FIG. 1 is a diagram illustrating a position where a flexible member is formed. [Figure 15] 10A and 10B are diagrams showing modified examples of the liquid ejection substrate; [Figure 16] FIG. 1 is a diagram illustrating an example of the configuration of a liquid ejection device. [Figure 17] FIG. 1 is a diagram showing an example of the configuration of a liquid ejection head; DETAILED DESCRIPTION OF THE INVENTION

[0012] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative positions, and the like of the components described in these embodiments are not intended to limit the scope of the present invention to those dimensions. Furthermore, the materials, shapes, and the like of components described once in the following description will remain the same in subsequent descriptions unless otherwise specified. Well-known or publicly known technologies in the relevant technical field can be applied to configurations and processes not specifically illustrated or described. Furthermore, the present invention is not limited to these embodiments, and not all of the combinations of features described in the embodiments are necessarily essential to the solution of the present invention.

[0013] [First embodiment] <Liquid discharge device> The liquid ejection device 600 in this embodiment includes a liquid ejection head 710 that performs recording on a recording medium P while ejecting liquid. The liquid ejection head 710 includes a housing having a liquid storage section that can store liquid, a liquid ejection substrate provided on the bottom surface of the housing, and an electrical connection section that sends power and control signals to the liquid ejection substrate.

[0014] <Configuration of Liquid Ejection Device and Liquid Ejection Head> A liquid ejection device 600 equipped with a liquid ejection head 710 of the present disclosure will be described with reference to Figs. 15 and 16. The liquid ejection device 600 here ejects ink onto a recording medium P to record an image. Fig. 15 is a partially exploded view showing the schematic configuration of the liquid ejection device 600 (recording device). 16 is a perspective view of a liquid ejection head 710 (recording head).

[0015] The liquid ejection device 600 includes a carriage 605 to which a liquid ejection head 710 can be detachably attached. The carriage 605 is attached to a belt 606 that is stretched around a drive pulley 603A and a driven pulley 603B, and is slidably mounted on a guide shaft 602. The belt 606 rotates due to the rotation of the drive pulley 603A, which is driven by a carriage motor 604, causing the carriage 605 to move back and forth in the direction of arrow A. An encoder sensor 608 detects the position of the carriage 605 in the direction A by detecting slits in a linear scale 607 that extends in the direction A.

[0016] The first pair of transport rollers 609, 610 and the second pair of transport rollers 611, 612 are rotated by a transport motor to transport the recording medium P in the direction of arrow B. Hereinafter, the first and second pairs of transport rollers will also be referred to as a transport roller group. While driving the carriage motor 604, the liquid ejection device 600 ejects ink from the liquid ejection head 710 onto the recording medium P in accordance with the print data, based on the detection results of the encoder sensor 608. In this way, one band of image is recorded on the recording medium P. Thereafter, the transport roller group transports the recording medium P by the distance of one band in the direction of arrow B. By alternately repeating the printing operation and the transport operation in this manner, a desired image is formed on the recording medium P.

[0017] The liquid ejection device 600 is provided with a recovery unit 613 at one end in direction A. The recovery unit 613 includes a cap member that protects the liquid ejection head 710, a pump that sucks ink and generates negative pressure inside the cap member, and the like.

[0018] In the present disclosure, carriage 605 is equipped with four liquid ejection heads 710, each containing cyan, magenta, yellow, and black ink (only the cyan liquid ejection head 710C is shown in the figure). This allows full-color printing. However, the application of the present disclosure is not limited to this, and may also be applied to a monochrome printing device.

[0019] 16 includes a tank portion 704 that stores ink therein, and a recording head portion. The recording head portion also includes a wiring tape 702 for supplying recording data, power, and the like to the first liquid ejection substrate 100. The wiring tape 702 is formed with contacts 703, which are electrical connection portions for electrically connecting with head-side contacts when the liquid ejection head 710 is mounted on the carriage 605. Note that the liquid ejection head 710 is not limited to one in which the tank portion and recording head portion are integrated, and may have a separate configuration.

[0020] <Description of the First Liquid Ejection Substrate 100> The first liquid ejection substrate 100 disposed in the liquid ejection head 710 in this embodiment will now be described. FIG. 1 is a schematic cross-sectional perspective view of the first liquid ejection substrate 100. FIG. 2 is a cross-sectional view illustrating the bonding state of the flexible member 101. FIG. 2 corresponds to a view of the first liquid ejection substrate 100 as viewed from the +Y direction in FIG. 1. In each drawing in this disclosure, the X direction indicates the width direction of the first liquid ejection substrate 100. The Y direction indicates the depth direction of the first liquid ejection substrate 100. The Z direction indicates the height direction of the first liquid ejection substrate 100. The surface of the first liquid ejection substrate 100 facing the +Z direction will be referred to as the "top surface" as appropriate. The surface of the first liquid ejection substrate 100 facing the -Z direction will be referred to as the "bottom surface" as appropriate. The X direction, Y direction, and Z direction are all orthogonal to each other.

[0021] The liquid ejection substrate 100 in this embodiment is also referred to as a first liquid ejection substrate 100. The first liquid ejection substrate 100 includes a support substrate 102 that supports a flexible member 101 from the bottom surface, and a flow path substrate 103 that supports the flexible member 101 from the top surface. A layer of first bonding members 104 is formed between the flexible member 101 and the bottom surface of the flow path substrate 103. A layer of second bonding members 105 is formed between the top surface of the flexible member 101 and the bottom surface of the flow path substrate 103. In this way, the flexible member 101 is sandwiched and fixed between the support substrate 102 and the flow path substrate 103 via the first bonding members 104 and the second bonding members 105.

[0022] The flow path substrate 103 includes a first substrate member 106 having a second bonding member 105 attached to its bottom surface. The first substrate member 106 has an accommodation space 107 formed therein, recessed from the top surface to the bottom surface. A vibration plate 108 is bonded to the top surface of the first substrate member 106 so as to cover the accommodation space 107. A piezoelectric element 109 is disposed on the bottom surface of the vibration plate 108. The piezoelectric element 109 is accommodated in the accommodation space 107.

[0023] The flow path substrate 103 further includes a second substrate member 110 bonded to the upper surface of the vibration plate 108. An ejection port 111 for ejecting liquid as droplets is formed on the upper surface of the second substrate member 110. An example of the support substrate 102, the first substrate member 106, and the second substrate member 110 is a silicon substrate. A recess 112 recessed from the upper surface to the bottom surface of the support substrate 102 is formed in the support substrate 102, and an air vent port 119 is formed in the bottom surface of the recess 112. Furthermore, a third flow path 115 is formed at a position different from the recess 112 of the support substrate 102, penetrating the support substrate 102, the flexible member 101, and a portion of the bottom surface side of the first substrate member 106.

[0024] The flexible member 101 has a first opening 116 formed therein for connecting the third flow path 115 from the support substrate 102 to the first substrate member 106. One example of a method for forming the first opening 116 in the flexible member 101 is dry etching. The flexible member 101 contains a resin. Examples of the resin contained in the flexible member 101 include polyimide and polyamide.

[0025] Furthermore, the bottom surface of the flexible member 101 is bonded to the upper surface of the support substrate 102 so as to cover the recess 112. With this configuration, when an external force is applied to the flexible member 101 due to a pressure fluctuation or the like, which will be described later, the flexible member 101 can elastically deform toward the recess 112. Thereafter, the flexible member 101 can return from the elastically deformed shape to its original shape due to an elastic restoring force.

[0026] The first substrate member 106 is formed with a plurality of first flow paths 113 communicating with the first opening 116, and second flow paths 114 individually communicating with each of the first flow paths 113. The first substrate member 106 has a plurality of storage spaces 107 arranged in the Y direction, with the vibration plate 108 as the top surface. Each storage space 107 houses a plurality of piezoelectric elements 109 arranged on the bottom surface of the vibration plate 108.

[0027] The vibration plate 108 has a vibration plate opening 117 that connects the second flow path 114 from the first substrate member 106 to the second substrate member 110. The second substrate member 110 has a plurality of pressure chambers 118 formed on the bottom surface of the vibration plate 108. The second substrate member 110 has a plurality of discharge ports 111 that connect to the plurality of pressure chambers 118, respectively, arranged in the Y direction.

[0028] With this configuration, when liquid is ejected from the first liquid ejection substrate 100, the liquid passes from the third flow path 115 through the first opening 116 and is supplied to the first flow path 113. The liquid supplied to the first flow path 113 passes through the second flow path 114 and the diaphragm opening 117 and is supplied to the pressure chamber 118.

[0029] The piezoelectric element 109 elastically deforms the vibration plate 108 in response to an electrical signal received from the control unit of the main body of the liquid ejection device 600, thereby changing the volume inside the pressure chamber 118. This causes a pressure fluctuation in the pressure chamber 118, pressurizing the liquid in the pressure chamber 118, and causing droplets (for example, ink droplets) to be ejected in the +Z direction from the ejection port 111. Note that the liquid that is not ejected from the ejection port 111 is collected.

[0030] When pressure fluctuations occur, the flexible member 101, which forms one wall surface of the first flow path 113, elastically deforms toward the recess 112, thereby damping the pressure fluctuations. In other words, the entire first flow path 113 functions as a damper. With this configuration, pressure fluctuations at ejection ports other than the ejection port where the ejection operation has been performed can be alleviated, and the effects of crosstalk can be reduced.

[0031] 2, the first liquid ejection substrate 100 is formed by laminating a support substrate 102, a first substrate member 106, and a second substrate member 110 with a bonding member interposed therebetween. A third flow path 115, which is a liquid supply flow path, is formed in the support substrate 102. A first flow path 113 capable of containing liquid supplied from the third flow path 115 is formed in the first substrate member 106 included in the flow path substrate 103. A plurality of pressure chambers 118 communicating with the first flow path 113 are formed in the second substrate member 110 included in the flow path substrate 103. A plurality of ejection ports 111, each arranged for each pressure chamber 118, are formed in the second substrate member 110 included in the flow path substrate 103. The ejection ports 111 are arranged for each pressure chamber 118 and are capable of ejecting the liquid contained in the pressure chamber 118. A portion of the wall surface of the first flow path 113 is formed by a sheet-like flexible member 101 stretched in the hollow space defined by the support substrate 102 and the first substrate member 106 (i.e., the space formed by the recess 112 and the first flow path 113).

[0032] 3 is a schematic enlarged view of the vicinity of the region functioning as a damper shown in FIG. 2. For convenience, the flexible member 101 is divided into a first region 201 bonded to the support substrate 102 and the first substrate member 106, a second region 202 that forms part of the first flow path 113, and a third region 203 bonded to the support substrate 102. In the first region 201, the top and bottom surfaces of the flexible member 101 are bonded to the substrate via a bonding member. Therefore, if the adhesive strength between the flexible member 101 and the bonding member is low, there is a risk that the flexible member 101 will peel off from the bonding member when the flexible member 101 elastically deforms. If the flexible member 101 peels off from the bonding member, the damping function of the flexible member 101 will be reduced, and the substrates will peel off from each other. In view of the above circumstances, in this embodiment, a distinctive joining method is applied to the first region 201.

[0033] FIG. 4 is a schematic diagram showing the state in which bonding members are in contact with each other in this embodiment, and is a diagram showing the first liquid ejection substrate 100. In FIG.

[0034] As shown in FIG. 4, the flexible member 101 has a first opening 116 that connects the third flow path 115 and the first flow path 113 when the support substrate 102 and the flow path substrate 103 are joined together.

[0035] The flexible member 101 also has a first region 201 that is supported by being sandwiched between the support substrate 102 and the first substrate member 106. The flexible member 101 also has a second region 202 that covers the recess 112, is not supported by the support substrate 102 or the first substrate member 106, and can elastically deform toward the recess 112 when subjected to an external force. The second region 202 functions as a damper region for attenuating pressure fluctuations that occur when liquid is ejected. The flexible member 101 also has a third region 203 whose bottom surface is supported by the support substrate 102 and whose top surface is not supported.

[0036] In the first region 201 of this embodiment, the first bonding member 104 applied to the upper surface of the support substrate 102 is attached to the bottom surface of the flexible member 101. In this example, the second bonding member 105 applied to the bottom surface of the first substrate member 106 extends outside the first region 201 in the -X direction and is continuously attached to the outer peripheral side surface of the flexible member 101 in the -X direction and part of the outer peripheral side surface of the first bonding member 104 in the -X direction.

[0037] With this configuration, the bonding members can come into contact with each other. As a result, even if the flexible member 101 and the bonding member peel off in the first region 201, the substrates can be prevented from peeling off because they are bonded together by the bonding members. Furthermore, since the bonding area between the flexible member 101 and the second bonding member 105 is increased, the bonding strength can be improved compared to conventional bonding. Therefore, with the liquid ejection substrate 100 of the present disclosure, the substrates can be firmly fixed to each other even when the adhesion between the flexible member 101 and the bonding member is low and there is a possibility that the substrates may peel off.

[0038] <Jointing materials> The following describes the first bonding member 104 and the second bonding member 105. When there is no need to particularly distinguish between the first bonding member 104 and the second bonding member 105, they will simply be referred to as "bonding members." Furthermore, when there is no need to particularly distinguish between the support substrate 102, the first substrate member 106, and the second substrate member 110, they will simply be referred to as "substrates."

[0039] As the bonding member, organic or inorganic materials can be used. Depending on the material used for the substrate, deterioration at high temperatures may be an issue, so organic materials that can be bonded at relatively low temperatures are preferred because they provide greater flexibility in the substrate material. Although adhesive materials can also be used as organic bonding members, materials that harden when bonded are preferred because they make it easier to increase bonding strength. Thermoplastic materials are preferred because they are materials that soften and adhere due to heat, and then harden as the temperature drops, making them easy to handle. Materials that harden through a chemical reaction after bonding are preferred because they make it easier to increase bonding strength. Thermosetting materials are preferred because the hardening reaction is easy to control.

[0040] The bonding member may be made of epoxy, acrylic, urethane, silicone, benzocyclobutene, polyimide, polyamide, polyamideimide, cyanoacrylate, phenol, melamine, styrene, cyclized rubber, or a mixture thereof. Among these, resins containing epoxy, silicone, benzocyclobutene, or polyimide as a main component are preferred, as they have excellent chemical resistance.

[0041] The type of epoxy is not particularly limited, and examples thereof include bisphenol-type epoxy, novolac-type epoxy, epoxy polyol-type epoxy, alicyclic epoxy, glycidyl-type epoxy, urethane-modified epoxy, chelate-modified epoxy, rubber-modified epoxy, and mixtures thereof.

[0042] The silicone is not particularly limited. For example, condensation type silicone or addition type silicone can be used. Among them, addition type silicone, which has little cure shrinkage, is preferred. For example, epoxy-modified silicone, acrylic-modified silicone, methyl-based silicone, phenyl-based silicone, methylphenyl-based silicone, alkyd-modified silicone, polyester-modified silicone, or a mixture thereof can be used.

[0043] The polyimide is not particularly limited. A thermoplastic polyimide may be used in the form of a film. A polyamic acid may be used as a precursor. It is preferable to use a precursor and then cure it after bonding, since this makes it easier to increase the bonding strength.

[0044] A filler may be added to the joining member. For example, a fibrous filler is preferable because it has a relatively high effect of suppressing defects such as breakage of the joining member. Examples of fibrous fillers include carbon fiber, metal fiber, glass fiber, and cellulose fiber. Examples include:

[0045] The substrate may have a functional layer to improve chemical resistance or to increase the bonding strength with a bonding member. The functional layer may be disposed on a portion of the substrate. The functional layer may be disposed on the entire surface of the substrate. A coupling agent may be disposed between the support substrate 102 and the flexible member 101, and between the first substrate member 106 and the flexible member 101. By selecting a coupling agent that is suited to the substrate material or functional layer material and the bonding member, a covalent bond can be formed, thereby achieving the effect of increasing the bonding strength. Of course, a coupling agent may be disposed between the flexible member 101 and the first substrate member 106.

[0046] Furthermore, in the liquid ejection substrate of the present disclosure, the bonding members may be made of the same material. However, it is preferable that the adhesion between the second bonding member 105 and the first bonding member 104 is stronger than the adhesion between the second bonding member 105 and the flexible member 101. This allows the second bonding member 105 to contact the first bonding member 104 in the first region 201, thereby improving the bonding strength. Furthermore, when the adhesion between the second bonding member 105 and the first bonding member 104 is stronger than the adhesion between the second bonding member 105 and the flexible member 101, the bonding members may be made of different materials. This allows the first bonding member 104 and the second bonding member 105 to be functionally separated. For example, using a flexible material for the first bonding member 104 that absorbs vibrations of the flexible member 101 can prevent peeling due to vibration, and using a material with high adhesion for the second bonding member 105 can improve reliability.

[0047] <Method of manufacturing a liquid ejection substrate> 5 and 6 are diagrams for explaining an example of a manufacturing process for the first liquid ejection substrate 100 in this embodiment.

[0048] FIG. 5(a) is a diagram illustrating the first step. A recess 112 and a third flow path 115 are formed in the support substrate 102. At this stage, the third flow path 115 is a through-hole 404 that penetrates the support substrate 102. As shown in FIG. 5(a), in the first step, the first bonding member 104 before hardening is applied to the surface of the support substrate 102 where the recess 112 is formed, in an area where the recess 112 and the through-hole 404 are not formed. The first bonding member 104 before hardening is applied by a method commonly used for applying resin materials. For example, when applying the first bonding member 104 to the entire surface of the support substrate 102, the first bonding member 104 is applied by spin coating, spraying, or the like. When applying the first bonding member to only a portion of the support substrate 102, the first bonding member 104 is applied by a dispenser, screen printing, or by transferring a dry film of the bonding member.

[0049] On the other hand, the flexible member 101 is laminated in a state in which the portion corresponding to the first opening 116 is not opened in FIG. 5(a). At the time of FIG. 6(a) described below, the portion that will become the first opening 116 in the future is opened as an opening 406. One example of a method for forming the opening 406 is a method of forming it by dry etching using a mask material (not shown). When the flexible member 101 is made of a photosensitive resin, a method of patterning by exposure to light may also be used.

[0050] 5(b) is a diagram showing the second step. As shown in FIG. 5(b), in the second step, a sheet-like flexible member 101 is placed on a first bonding member 104, and the support substrate 102 and the flexible member 101 are bonded together by the first bonding member 104. When bonding the support substrate 102 and the flexible member 101, an appropriate temperature, pressure, or time is selected depending on the structure or thickness of the support substrate 102, or the material of the first bonding member 104, etc. Because the first bonding member 104 may be affected by oxygen in the atmosphere, it is preferable that the support substrate 102 and the flexible member 101 be bonded together under reduced pressure.

[0051] FIG. 5(c) is a diagram illustrating the third step. As shown in FIG. 5(c), in the third step, the first bonding members 104 are cured. In the fourth step, the first bonding members 104 are cured using a chemical reaction, thereby increasing the bonding strength. To cure the first bonding members 104, the temperature, time, atmosphere, or the like can be selected depending on the material of the first bonding members 104. One example of a method for adjusting the flow of the first bonding members 104 is to irradiate the first support substrate 102 with electromagnetic waves or the like to rapidly heat it. Another example is to cure the first bonding members 104 by irradiating electromagnetic waves or the like through the first support substrate 102.

[0052] 6(a) is a diagram showing the fourth step. As shown in FIG. 6(a), in the fourth step, an opening 406 is formed in the flexible member 101. One example of a method for forming the opening 406 is a method of forming it by dry etching using a mask material (not shown). If the flexible member 101 is made of a photosensitive resin, a method of patterning it by exposure to light may also be used.

[0053] FIG. 6(b) illustrates the fifth step. As shown in FIG. 6(b), in the fifth step, the first substrate member 106, having the second bonding material 105 applied to the inner periphery of its bottom surface, is bonded to the flexible member 101. By applying the second bonding material 105 to the bottom surface of the first substrate member 106, it is possible to prevent the second bonding material 105 from spilling onto the flexible member 101 stretched over the recess 112. This prevents the protruding second bonding material 105 from interfering with the elastic deformation of the flexible member 101. In the fifth step, appropriate temperature, pressure, and time are selected depending on the structure or thickness of the first substrate member 106, the material of the second bonding material 105, and other factors. Because the second bonding material 105 may be affected by oxygen in the atmosphere, bonding is preferably performed under reduced pressure. The uncured second bonding material 105 is crushed during bonding and protrudes outside the first region 201. Furthermore, as shown on the left side of FIG. 6(b), the second bonding members 105 before hardening partially flow and come into contact with the first bonding members 104 due to their low viscosity.

[0054] FIG. 6(c) is a diagram illustrating the sixth step. As shown in FIG. 6(c), in the sixth step, the second bonding members 105 are cured. In the sixth step, the second bonding members 105 are cured using a chemical reaction, which has the effect of increasing the bonding strength. To cure the second bonding members 105, the temperature, time, atmosphere, etc. can be selected depending on the material of the second bonding members 105. One example of a method for adjusting the flow of the second bonding members 105 is to irradiate the first substrate member 106 with electromagnetic waves or the like to rapidly heat it. Another example is to cure the second bonding members 105 by irradiating electromagnetic waves or the like through the first substrate member 106.

[0055] The method for forming the flexible member 101 is not limited to the above example. A method may be used in which another support substrate 102 on which the flexible member 101 has been formed is prepared in advance, and then the flexible member 101 is bonded to the support substrate 102 via a bonding member, and the other support substrate 102 is then removed.

[0056] [Example] An example of the manufacturing method shown in Figures 5 and 6 will be described below. Although the following description will be given with reference to Figures 5 and 6, it is merely a technically preferred example. In particular, the technical scope of the present disclosure is not limited thereto.

[0057] As shown in FIG. 5(a), a 625 μm silicon substrate was prepared as the support substrate 102. A positive resist was exposed to light on both sides of this silicon substrate and developed. After that, a recess 112 with a depth of 300 μm and a width of 300 μm and a first flow path 113 with a width of 200 μm were formed by dry etching. After that, a first bonding member 104 with a thickness of 2 μm before hardening was made into a dry film and transferred to the support substrate 102. In this example, the first bonding member 104 was A thermosetting resin was applied as the member 104 .

[0058] Next, as shown in FIG. 5(b), the support substrate 102 and the flexible member 101 were bonded via the uncured first bonding member 104. For example, a 3 μm thick polyimide film was used as the flexible member 101. The flexible member 101 was formed by laminating while applying pressure. The laminating temperature was set to a temperature at which the uncured first bonding member 104 would not harden.

[0059] 5(c), the uncured first bonding members 104 were cured by performing a heat treatment at 250° C. in an oven with a nitrogen atmosphere.

[0060] 6(a), a mask pattern (not shown) was formed on the flexible member 101. After that, an opening 406 was formed by a commonly known reactive dry etching method using a mixed gas of CF4 gas (tetrafluoromethane gas) and oxygen gas.

[0061] Next, as shown in FIG. 6(b), a first substrate member 106 coated with an uncured second bonding member 105 was bonded to the flexible member 101. A silicon substrate, for example, was used as the first substrate member 106. In this manner, the first substrate member 106 and the second substrate member 110 as shown in FIG. 4 were formed. In addition, at this time, the second bonding member 105 was formed by dispensing a thermosetting epoxy resin, which is a material that has a stronger adhesive strength with the first bonding member 104 than with the flexible member 101, to a thickness of 40 μm. By bonding the first substrate member 106 and the flexible member 101, in the first region 201, the second bonding member 105 before hardening protrudes onto the upper surface of the flexible member 101 and outside the first region 201 in the -X direction, and is continuously attached to the outer peripheral side surface of the flexible member 101 in the -X direction and part of the outer peripheral side surface of the first bonding member 104 in the -X direction.

[0062] 6(c), the second bonding member 105 was cured by performing a heat treatment at 160° C. in an oven with a nitrogen atmosphere.

[0063] A liquid ejection head 710 equipped with the first liquid ejection substrate 100 manufactured as described above was used to perform an ejection operation for a predetermined period of time. During this operation, stable ejection was possible for the predetermined period of time. Furthermore, after the ejection operation was completed, no peeling was observed in the support substrate 102, flexible member 101, or first substrate member 106 of the first liquid ejection substrate 100.

[0064] <Summary> As described above, in the first liquid ejection substrate 100 of this embodiment, the second bonding member 105, which has a stronger adhesive force with the first bonding member 104 than the flexible member 101, is continuously attached to the upper surface of the flexible member 101, the outer peripheral side surface of the flexible member 101 in the -X direction, and a portion of the outer peripheral side surface of the first bonding member 104 in the -X direction in the first region 201 where the flexible member 101 is sandwiched between the substrates. This configuration allows the bonding members to come into contact with each other. As a result, even if the flexible member 101 and the bonding member peel off in the first region 201, the bonding between the bonding members prevents the substrates from peeling off. Furthermore, the bonding area between the flexible member 101 and the second bonding member 105 is increased, thereby improving bonding strength compared to conventional methods. Therefore, according to the liquid ejection substrate 100 of the present disclosure, even when the adhesion between the flexible member 101 and the bonding member is low and there is a possibility that the substrates may peel off, the substrates can be firmly fixed together.

[0065] [Second embodiment] Hereinafter, a second embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals and names are used for the same or corresponding configurations as those in the first embodiment. The present embodiment differs from the first embodiment in that the second bonding member 105 is in contact with the upper surface of the first substrate member 106 in the first region 201.

[0066] 7 is a schematic cross-sectional front view of a second liquid ejection substrate 300 according to this embodiment. As shown in Fig. 7, in the first region 201, the end of the flexible member 101 is located on the recess 112 side in the +X direction. Therefore, in the first region 201, the second bonding member 105 is continuously attached to the upper surface of the flexible member 101, the side surface of the flexible member 101 in the -X direction, and the upper surface of the first bonding member 104.

[0067] According to this configuration, the contact area between the second bonding member 105 and the first bonding member 104 can be increased compared to the first embodiment shown in Fig. 4. In other words, according to the liquid ejection substrate 100 of this embodiment, the substrates can be firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0068] [Third embodiment] A third embodiment of the technology of the present disclosure will be described below with reference to the drawings. In the following description, the same reference numerals and names are used for configurations similar to or corresponding to the first or second embodiment, and explanations will be omitted as appropriate, with the focus being on differences. This embodiment differs from the first embodiment in that no second opening 501 is formed in the flexible member 101 in the first region 201.

[0069] FIG. 8 is a schematic cross-sectional front view of a third liquid ejection substrate 500 according to this embodiment. As shown in FIG. 8(a), one or more annular second openings 501 are formed in the first region 201 according to this embodiment. One example of a method for forming the second openings 501 in the flexible member 101 is dry etching. The position of the second openings 501 is not limited as long as it is within the first region 201. In the first region 201, the first bonding member 104 flows onto the inner circumferential surface of the second opening 501. With this configuration, excess first bonding member 104 can be accommodated inside the second opening 501.

[0070] Fig. 8(b) is a cross-sectional view taken along line Vb-Vb in Fig. 8(a). As shown in Fig. 8(b), the flexible member 101 has openings, namely, a first opening 116 and a second opening 501. The first opening 116 connects the third flow channel 115 and the first flow channel 113 when the support substrate 102 and the first substrate member 106 of the second flow channel substrate 103 are joined together.

[0071] In the first region 201 in this embodiment, the first bonding member 104 applied to the upper surface of the support substrate 102 flows into the inner peripheral surface of the second opening 501 formed on the bonding surface with the support substrate 102. Therefore, the second bonding member 105 continuously adheres to the upper surface of the flexible member 101 and the upper surface of the first bonding member 104.

[0072] According to such a configuration, the contact area between the first bonding member 104 and the second bonding member 105 can be increased compared to the first embodiment shown in FIG. 4. According to the liquid ejection substrate 100 of this embodiment, the substrates can be firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0073] [Modification Example 1 of the Third Embodiment]<..000304>FIG. 9 is a diagram showing a third liquid ejection substrate 500 in this modification example. As shown in FIG. 9, the flexible member 101 of this modification example has a second opening 501 that is continuously formed along the inside of the first region 201. That is, the second opening 501 in this modification example is an opening that extends along the bonding surface with the support substrate 102 (see FIG. 1) in the first region 201. extends.

[0074] According to such a configuration, the bonding area between the second bonding member 105 and the first bonding member 104 increases compared to the example of FIG. 8(a). Therefore, according to the liquid ejection substrate in this modification example, the substrates can be more firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0075] [Modification Example 2 of the Third Embodiment] FIG. 10 is a diagram showing a third liquid ejection substrate 500 in this modification example. As shown in FIGS. 10(a) and (b), in the first region 201, the end portion of the flexible member 101 is located on the side of the concave portion 112 in the +X direction. Furthermore, the flexible member 101 of this modification example has one or more annular second openings 501 inside the first region 201 in the +X direction.

[0076] With this configuration, the annular opening ensures a bonding area between the flexible member 101 and the bonding member, and further, the bonding area with the first bonding member 104 is increased compared to the example in Fig. 8(a). Therefore, with the liquid ejection substrate 100 in this modified example, the substrates can be more firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0077] [Modification 3 of the third embodiment] 11A and 11B are diagrams showing a third liquid ejection substrate 500 according to the present embodiment. As shown in Fig. 11A, one or more annular second openings 501 are formed in the first region 201 according to the present embodiment. The position of the second openings 501 is not limited as long as it is within the first region 201. In the first region 201, the first bonding member 104 passes through the second openings 501 and extends beyond the upper surface of the flexible member 101.

[0078] Fig. 11(b) is a cross-sectional view taken along line Vb-Vb in Fig. 11(a). As shown in Fig. 11(b), in the first region 201 of this embodiment, the first bonding material 104 applied to the upper surface of the support substrate 102 passes through the second opening 501 formed on the bonding surface with the support substrate 102 and spreads over the upper surface of the flexible member 101.

[0079] As a result, in the first region 201, the first bonding members 104 adhere to the bottom surface of the flexible member 101, the inner circumferential surface of the second opening 501, and the top surface of the flexible member 101. In other words, while the first bonding members 104 flow into the second opening 501 and then spread over the top surface of the flexible member 101, the first bonding members 104 fix the flexible member 101 like an anchor. In this example, the formation of multiple second openings 501 in the first region 201 promotes the anchor effect of the first bonding members 104.

[0080] With this configuration, the bonding area between the support substrate 102 and the flexible member 101 can be made relatively large. This makes it possible to improve the bonding strength between the support substrate 102 and the flexible member 101 in the first region 201 compared to conventional cases. Furthermore, since the bonding area between the first bonding member 104 and the second bonding member 105 is also increased, the substrates can be firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0081] [Fourth embodiment] A fourth embodiment of the technology of the present disclosure will be described below with reference to the drawings. In the following description, the same reference numerals and names will be used for configurations similar to or corresponding to the above embodiments, and explanations will be omitted as appropriate, with differences being mainly described. The purpose of this embodiment is to firmly secure substrates to each other without processing the substrates.

[0082] FIG. 12 is a schematic front cross-sectional view of a fourth liquid ejection substrate 1000 according to this embodiment. 12(a) is an enlarged view of a first region 201 of a fourth liquid ejection substrate 1000 in this embodiment.

[0083] 12(a), in the first region 201 of this embodiment, the second bonding member 105 is continuously attached from the upper surface of the flexible member 101 to the inner circumferential surface of the second opening 501. The first bonding member 104 is applied to the upper surface of the support substrate 102. However, the first bonding member 104 is applied to a position where it does not adhere to the inner circumferential surface of the second opening 501.

[0084] With this configuration, the second bonding member 105 is in communication from the top surface of the flexible member 101 to the first bonding member 104, which is located below (in the -Z direction) the bottom surface of the flexible member 101. This increases the bonding area between the second bonding member 105 and the first bonding member 104 in the first region 201. In other words, the substrates can be firmly fixed together at the position where the flexible member 101 is sandwiched between the substrates.

[0085] Furthermore, since excess second bonding members 105 can be accommodated in the second opening 501, it is also possible to adjust the amount of second bonding members 105 that protrude into the second region 202. This prevents the second bonding members 105 from adhering to the second region 202 and impairing the damper function of the second region 202.

[0086] [Modification 1 of the Fourth Embodiment] Fig. 12(b) is a diagram showing a fourth liquid ejection substrate 1000 in this modified example. As shown in Fig. 12(b), in the first region 201 in this modified example, the second bonding member 105 is continuously attached from the upper surface of the flexible member 101, passing through the second opening 501, and reaching the upper surface of the support substrate 102. In this modified example, a layer of the first bonding member 104 is not formed in the portion through which the second bonding member 105 passes.

[0087] Even with this configuration, the bonding area between the second bonding member 105 and the first bonding member 104 can be increased at the position where the flexible member 101 is sandwiched between the substrates, so that the substrates can be firmly fixed together.

[0088] [Modification 2 of the Fourth Embodiment] Fig. 12(c) is a diagram showing a fourth liquid ejection substrate 1000 in this modified example. As shown in Fig. 12(c), in the first region 201 in this modified example, the second bonding member 105 is continuously attached to the upper surface of the flexible member 101, the inner circumferential surface of the second opening 501, and the support substrate 102. In this modified example, the layer of the first bonding member 104 is not formed in the portion through which the second bonding member 105 passes.

[0089] With this configuration, the second bonding member 105 can fix the flexible member 101 like an anchor. Therefore, with the fourth liquid ejection substrate 1000 in this modified example, peeling of the flexible member 101 can be suppressed more effectively than with the examples in Figures 12(a) and 12(b).

[0090] [Fifth embodiment] A fifth embodiment of the technology of the present disclosure will be described below with reference to the drawings. In the following description, the same reference numerals and names will be used for configurations similar to or corresponding to the above embodiments, and explanations will be omitted as appropriate, with differences being mainly described. In this embodiment, the substrates are processed to firmly secure them to each other and to prevent protrusion.

[0091] 13A and 13B are schematic front cross-sectional views of a fifth liquid ejection substrate 1100 according to this embodiment. FIG. 13A is a schematic enlarged view of a first region 201 according to this embodiment. As shown in 13(a), the support substrate 102 in this embodiment has a first groove 1101 to which a first bonding member 104 is attached. Note that a plurality of first grooves 1101 may be formed.

[0092] According to this configuration, when the first bonding members 104 are applied, they can be prevented from spilling over into the second region 202. That is, the substrates can be firmly fixed together, and the spilled first bonding members 104 can be prevented from impeding the damper function.

[0093] [Modification of the fifth embodiment] Fig. 13(b) is a diagram showing a fifth liquid ejection substrate 1100 in this modified example. As shown in Fig. 13(b), a second opening 501 is formed in the flexible member 101 in this modified example. The support substrate 102 in this modified example has a second groove 1102 to which a second bonding member 105 is attached. Note that a plurality of second grooves 1102 may be formed.

[0094] With this configuration, in the first region 201 of this modified example, when the second bonding member 105 is applied to the upper surface of the flexible member 101, the second bonding member 105 communicates from the upper surface of the flexible member 101 to the inside of the second groove 1102. Therefore, the second bonding member 105 can fix the flexible member 101 like an anchor. Therefore, with the fifth liquid ejection substrate 1100 of this modified example, the substrates can be firmly fixed together, and a situation in which the protruding second bonding member 105 impedes the function as a damper can be prevented.

[0095] As described above, according to each embodiment of the present disclosure, the substrates can be firmly fixed to each other at the position where the flexible member 101 is sandwiched between the substrates.

[0096] [Other embodiments] As described above, the first to fifth embodiments have shown a configuration in which the flexible member 101 is formed on the first surface 401, which is the bottom surface side in the -Z direction of the flow path substrate 103 shown in Fig. 14. However, the surface on which the flexible member 101 and the support substrate 102 are formed is not limited to the first surface 401. For example, as shown in Fig. 15(a), which is a schematic front cross-sectional view of a sixth liquid ejection substrate 2100 in this embodiment, the flexible member 101 may be formed on the second surface 402, which is the top surface side in the +Z direction of the flow path substrate 103 shown in Fig. 14.

[0097] 15(b), the flexible member 101 may be formed on the third surface 403, which is the same layer as the vibration plate of the flow path substrate 103 shown in Fig. 14. In this case, the upper surface of the flow path substrate 103 includes a damper region where the flexible member 101 is provided, and a drive region where the accommodation space 107 and the vibration plate 108 are provided.

[0098] The above embodiments may be implemented in combination as appropriate.

[0099] In the above embodiment, the support substrate 102, the first substrate member 106, and the second substrate member 110 are separate members, but they do not have to be separate members. For example, the support substrate 102, the first substrate member 106, and the second substrate member 110 may be included in a single substrate.

[0100] In the above embodiment, dry etching has been given as an example of a method for forming the first opening 116 and the second opening 501 in the flexible member 101. As another example, when the flexible member 101 contains a photosensitive resin, the first opening 116 and the second opening 501 may be formed by patterning the resin through exposure to light.

[0101] 5(e), the flow path substrate 103, on the bottom surface of which the second bonding member 105 is applied, is bonded to the flexible member 101. As another example of the fifth step, the bottom surface of the first substrate member 106, on which the second bonding member 105 is not applied, is bonded to the top surface of the flexible member 101, on which the second bonding member 105 is applied. do.

[0102] In the above embodiment, a piezoelectric system using a piezoelectric element is given as an example of a driving means for applying pressure to ink in a pressure chamber. Other examples of driving means for applying pressure to ink in a pressure chamber include a system using electrostatic force, a system using a heat generating element, etc.

[0103] [Configuration 1] A liquid ejection substrate in which a support substrate, a first bonding member, a sheet-like flexible member, a second bonding member, and a flow path substrate in which a flow path that guides liquid to an ejection port is formed are laminated, a recess is provided in the support substrate at a position corresponding to at least a part of the flow path formed in the flow path substrate, and the flexible member is disposed between the flow path and the recess; The first joint member and the second joint member are in partial contact with each other. A liquid ejection substrate characterized by: [Configuration 2] The adhesive force between the second bonding member and the first bonding member is stronger than the adhesive force between the second bonding member and the flexible member. 2. The liquid ejection substrate according to configuration 1. [Configuration 3] The second bonding member disposed on the upper surface of the flexible member is in continuous contact with an end of the flexible member and an end of the first bonding member on the outer peripheral side surface of the liquid ejection substrate. 3. The liquid ejection substrate according to configuration 1 or 2. [Configuration 4] When a direction in which the first bonding member, the flexible member, and the second bonding member are stacked is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, at least a part of an end of the flexible member is located between an outer peripheral side surface of the liquid ejection substrate and an end of the recess in the second direction. 3. The liquid ejection substrate according to configuration 1 or 2. [Configuration 5] an opening is provided in the flexible member in a region joined by the second joining member; At least one of the first joining member and the second joining member is disposed inside the opening, so that the first joining member and the second joining member are in contact with each other at the opening. 5. The liquid ejection substrate according to any one of configurations 1 to 4. [Configuration 6] 6. The liquid ejection substrate according to configuration 5, wherein a plurality of the openings are provided along the bonding surface between the flexible member and the support substrate. [Configuration 7] The opening extends along a bonding surface between the flexible member and the support substrate. 6. The liquid ejection substrate according to configuration 5. [Configuration 8] a plurality of the openings are provided along a bonding surface with the support substrate, When the direction in which the first bonding member, the flexible member, and the second bonding member are stacked is defined as a first direction, and the direction perpendicular to the first direction is defined as a second direction, At least a part of the end of the flexible member is located between the outer peripheral side surface of the liquid ejection substrate and the end of the recess. 6. The liquid ejection substrate according to configuration 5. [Configuration 9] The first joining member is in continuous contact with the bottom surface and top surface of the flexible member and the inner circumferential surface of the opening. 9. The liquid ejection substrate according to any one of configurations 5 to 8. [Configuration 10] an opening is provided in the flexible member in a region joined by the second joining member; The first joint member has a groove formed in a region corresponding to the opening, and the second joint member is disposed in the groove formed in the first joint member. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 11] The support substrate has a groove formed in a region bonded by the first bonding member, and the first bonding member is disposed in the groove formed in the support substrate. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 12] The flexible member has an opening in a region joined by the second joining member, and the first joining member has a groove communicating with the support substrate in a region corresponding to the opening, and the second joining member contacts the support substrate via the opening of the flexible member and the groove of the first joining member. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 13] The first and second joining members are made of the same material. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 14] The first joining member is a member having higher flexibility than the second joining member, and the second joining member is a member having higher adhesion to the flexible member than the first joining member. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 15] The flow path substrate has a plurality of the ejection ports, a plurality of pressure chambers corresponding to the plurality of ejection ports, a second flow path that guides the liquid from the flow path to the plurality of pressure chambers, and a plurality of driving means that are disposed in the plurality of pressure chambers and apply pressure to the liquid to eject it. 4. The liquid ejection substrate according to any one of configurations 1 to 3. [Configuration 16] In the liquid ejection substrate, the support substrate, the first bonding member, the flexible member, the second bonding member, and the flow path substrate are laminated in this order. 16. The liquid ejection substrate according to any one of configurations 1 to 15. [Configuration 17] In the liquid ejection substrate, the flow path substrate, the second bonding member, the flexible member, the first bonding member, and the support substrate are laminated in this order, The discharge port is provided in an area on the upper surface of the flow path substrate where the second bonding member is not disposed. 16. The liquid ejection substrate according to any one of configurations 1 to 15. [Configuration 18] In the liquid ejection substrate, the flow path substrate includes a damper region in which the first bonding member, the flexible member, and the second bonding member are laminated, and a drive region in which a drive means for applying pressure to the liquid to eject it is provided, and the support substrate is laminated on the upper surfaces of the damper region and the drive region. 16. The liquid ejection substrate according to any one of configurations 1 to 15. [Configuration 19] A liquid ejection substrate according to any one of configurations 1 to 18; a housing capable of containing the liquid to be supplied to the flow path; electrical connections for providing power and control signals to the liquid ejection substrate; A liquid ejection head comprising: [Method 1] forming a through hole in a support substrate and forming a recess at a position different from the through hole; a step of arranging a first bonding member in an area of ​​the surface of the support substrate on which the recess is formed, where the through hole and the recess are not formed; placing a sheet-like flexible member on an upper surface of the first bonding member; forming an opening in the flexible member at a position corresponding to the through hole in the support substrate; a step of arranging a second bonding member on a surface of the flexible member opposite to a surface bonded to the support substrate via the first bonding member, the second bonding member being in partial contact with the first bonding member; A method for manufacturing a liquid ejection substrate, comprising: [Explanation of symbols]

[0104] 100: liquid ejection substrate, 101: flexible member, 102: support substrate, 103: flow path substrate, 104: first joining member, 105: second joining member, 111: ejection port, 112: recess

Claims

1. A liquid ejection substrate in which a support substrate, a first bonding member, a sheet-like flexible member, a second bonding member, and a flow path substrate in which a flow path that guides liquid to an ejection port is formed are stacked, a recess is provided in the support substrate at a position corresponding to at least a part of the flow path formed in the flow path substrate, and the flexible member is disposed between the flow path and the recess; The first joining member and the second joining member are in partial contact with each other. A liquid ejection substrate characterized by:

2. The adhesive force between the second bonding member and the first bonding member is stronger than the adhesive force between the second bonding member and the flexible member.

2. The liquid ejection substrate according to claim 1.

3. The second bonding member disposed on the upper surface of the flexible member is in continuous contact with an end of the flexible member and an end of the first bonding member on the outer peripheral side surface of the liquid ejection substrate.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

4. When a direction in which the first bonding member, the flexible member, and the second bonding member are stacked is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, at least a part of an end of the flexible member is located between an outer peripheral side surface of the liquid ejection substrate and an end of the recess in the second direction.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

5. an opening is provided in the flexible member in a region joined by the second joining member; At least one of the first joining member and the second joining member is disposed inside the opening, so that the first joining member and the second joining member are in contact with each other at the opening.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

6. 6. The liquid ejection substrate according to claim 5, wherein a plurality of the openings are provided along the bonding surface between the flexible member and the support substrate.

7. The opening extends along a bonding surface between the flexible member and the support substrate.

6. The liquid ejection substrate according to claim 5.

8. a plurality of the openings are provided along a bonding surface with the support substrate, When a direction in which the first bonding member, the flexible member, and the second bonding member are stacked is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, at least a part of an end of the flexible member is located between an outer peripheral side surface of the liquid ejection substrate and an end of the recess in the second direction.

6. The liquid ejection substrate according to claim 5.

9. The first joining member is in continuous contact with the bottom surface and top surface of the flexible member and the inner circumferential surface of the opening.

6. The liquid ejection substrate according to claim 5.

10. an opening is provided in the flexible member in a region joined by the second joining member; a groove is provided in the first joint member in a region corresponding to the opening, and the second joint member is disposed in the groove formed in the first joint member; 3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

11. The support substrate has a groove formed in a region bonded by the first bonding member, and the first bonding member is disposed in the groove formed in the support substrate.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

12. The flexible member has an opening in a region joined by the second joining member, and the first joining member has a groove communicating with the support substrate in a region corresponding to the opening, and the second joining member contacts the support substrate via the opening of the flexible member and the groove of the first joining member.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

13. The first joining member and the second joining member are made of the same material.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

14. The first joining member is a member having higher flexibility than the second joining member, and the second joining member is a member having higher adhesion to the flexible member than the first joining member.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

15. The flow path substrate has a plurality of the ejection ports, a plurality of pressure chambers corresponding to the plurality of ejection ports, a second flow path that guides the liquid from the flow path to the plurality of pressure chambers, and a plurality of driving means that are disposed in the plurality of pressure chambers and apply pressure to the liquid to eject it.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

16. In the liquid ejection substrate, the support substrate, the first bonding member, the flexible member, the second bonding member, and the flow path substrate are laminated in this order.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

17. In the liquid ejection substrate, the flow path substrate, the second bonding member, the flexible member, the first bonding member, and the support substrate are laminated in this order, The ejection port is provided in an area on the upper surface of the flow path substrate where the second bonding member is not disposed.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

18. In the liquid ejection substrate, the flow path substrate includes a damper region where the first bonding member, the flexible member, and the second bonding member are laminated, and a drive region where a drive means for applying pressure to the liquid to eject it is provided, and the support substrate is laminated on the upper surfaces of the damper region and the drive region.

3. The liquid ejection substrate according to claim 1, wherein the liquid ejection substrate is a liquid ejection substrate.

19. The liquid ejection substrate according to claim 1 or 2; a housing capable of containing the liquid to be supplied to the flow path; electrical connections for providing power and control signals to the liquid ejection substrate; A liquid ejection head comprising:

20. forming a through hole in a support substrate and forming a recess at a position different from the through hole; The through hole and the recess are formed on the surface of the support substrate on which the recess is formed. placing a first bonding member in the unbonded area; placing a sheet-like flexible member on an upper surface of the first bonding member; forming an opening in the flexible member at a position corresponding to the through hole in the support substrate; a step of disposing a second bonding member on a surface of the flexible member opposite to a surface bonded to the support substrate via the first bonding member, the second bonding member being in partial contact with the first bonding member; A method for manufacturing a liquid ejection substrate, comprising:

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