Display substrate and manufacturing method thereof, and display device

Abstract

A display substrate, a manufacturing method thereof, and a display device are provided.SOLUTION: A display substrate includes a flexible base substrate 10, a first filling layer 61, and an encapsulation layer 40. The flexible base substrate 10 includes at least one stretching display area A2. The stretched display area A2 includes a plurality of pixel island areas 100 separated from each other, a plurality of hole areas 300, and a connecting bridge area 200 between the pixel island areas 100 and the hole areas 300. At least one hole region 300 is provided with one or more first through holes K1 penetrating through the flexible base substrate 10. The first filling layer 61 is located in the hole region 300 and filled in the first through hole K1. The encapsulation layer 40 is located on a side of the first filling layer 61 away from the flexible base substrate 10, and an orthographic projection of the encapsulation layer 40 on the flexible base substrate 10 partially overlaps or does not overlap with the first filling layer 61.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] TECHNICAL FIELD The embodiments of the present disclosure relate to, but are not limited to, the display technology field, and more particularly to a display substrate and a manufacturing method thereof, and a display device. [Background technology]

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display element that has the advantages of autonomous light emission, ultra-light and thin design, fast response speed, wide viewing angle, low power consumption, etc. With the development of OLED display technology, display products that use OLED display technology are gradually evolving from the current bendable product form to foldable and even stretchable product forms. Summary of the Invention [Means for solving the problem]

[0003] The following is a general overview of the subject matter discussed in detail in the text, which is not intended to limit the scope of protection of the claims.

[0004] The embodiments of the present disclosure provide a display substrate, a manufacturing method thereof, and a display device.

[0005] In one aspect, an embodiment of the present disclosure provides a display substrate, comprising a flexible base substrate, a first filler layer, and a packaging layer. The flexible base substrate comprises at least one extended display region. The extended display region includes a plurality of pixel island regions separated from one another, a plurality of hole regions, and a connecting bridge region located between the pixel island regions and the hole regions. At least one hole region has one or more first through-holes penetrating the flexible base substrate. A first filler layer is located in the hole regions and filled in the first through-holes. A packaging layer is located on a side of the first filler layer away from the flexible base substrate. An orthogonal projection of the packaging layer on the flexible base substrate may or may not overlap with the first filler layer.

[0006] In some exemplary embodiments, the display substrate further comprises a first planar layer located in the pixel island region and the connecting bridge region, and the first planar layer and the first filling layer have the same layer structure and the same material.

[0007] In some exemplary embodiments, the hole region further comprises a composite insulating layer laminated to the flexible base substrate, the composite insulating layer having second through holes that penetrate the composite insulating layer and connect to the corresponding first through holes, and the composite insulating layer includes at least one inorganic layer, or at least one organic layer, or at least one inorganic layer and at least one organic layer.

[0008] In some exemplary embodiments, the display substrate further includes a second filler layer located in the hole region, the second filler layer filling the second through-hole. The second filler layer contacts the first filler layer, and an orthogonal projection of the second filler layer on the flexible base substrate at least partially overlaps with an orthogonal projection of the first filler layer on the flexible base substrate. An orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap with an orthogonal projection of the second filler layer on the flexible base substrate.

[0009] In some exemplary embodiments, the display substrate further comprises a second planar layer located in the pixel island region and the connecting bridge region, the second planar layer being located on the side of the first planar layer away from the flexible base substrate, and the second planar layer and the second filling layer having the same layer structure and the same material.

[0010] In some exemplary embodiments, a surface of the second filler layer facing away from the flexible base substrate and a surface of the composite insulating layer facing away from the flexible base substrate are aligned.

[0011] In some exemplary embodiments, the cross-sectional shape of the second through hole in a direction perpendicular to the display substrate is an inverted trapezoid.

[0012] In some exemplary embodiments, a surface of the first filler layer and a surface of the flexible base substrate are aligned.

[0013] In some exemplary embodiments, the at least one hole region includes a second isolation groove formed in the flexible base substrate and the first filling layer, the second isolation groove penetrating to a second through-hole in the composite insulating layer. At least one insulating layer in the composite insulating layer has a second extension portion, and an orthogonal projection of the second extension portion on the flexible base substrate is located within an orthogonal projection of the second isolation groove on the flexible base substrate. An orthogonal projection of the second isolation groove on the flexible base substrate covers an orthogonal projection of the first filling layer on the flexible base substrate.

[0014] In some exemplary embodiments, the second isolation trench has a depth of about 1.5 micrometers to 2.0 micrometers.

[0015] In some exemplary embodiments, in a direction perpendicular to the display substrate, the distance between the sidewall of the second extension portion of at least one insulating layer of the composite insulating layer and the sidewall of the second separation groove on the same side is approximately 0.3 micrometers to 0.5 micrometers.

[0016] In some exemplary embodiments, the display substrate further includes a second planar layer located on a side of the first planar layer away from the flexible base substrate, and a passivation layer located on a side of the second planar layer away from the flexible base substrate. The connection bridge region includes a first isolation trench formed through the passivation layer and a portion of the second planar layer. The passivation layer has a first extension portion, and an orthogonal projection of the first extension portion on the flexible base substrate lies within an orthogonal projection of the first isolation trench on the flexible base substrate.

[0017] In some exemplary embodiments, the packaging layer includes a stacked first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer.

[0018] In another aspect, an embodiment of the present disclosure provides a display device, comprising the display substrate described above.

[0019] In another aspect, an embodiment of the present disclosure provides a method for manufacturing a display substrate, the display substrate having at least one extended display region, the extended display region including a plurality of pixel island regions separated from each other, a plurality of hole regions, and a connecting bridge region located between the pixel island regions and the hole regions, the method including: forming one or more first through-holes penetrating a flexible base substrate in the hole regions; forming a first filling layer in the hole regions to fill the first through-holes; and forming a package layer, wherein an orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap the first filling layer.

[0020] In some exemplary embodiments, the manufacturing method further includes forming a first planar layer in the pixel island region and the connecting bridge region simultaneously with forming the first filling layer in the hole region.

[0021] In some exemplary embodiments, the above manufacturing method further includes forming a composite insulating layer on the flexible base substrate before forming the first filling layer in the hole area, and forming a second through hole in the composite insulating layer in the hole area, the second through hole penetrating the composite insulating layer and penetrating to the corresponding first through hole.

[0022] In some exemplary embodiments, the manufacturing method further includes, after forming the first fill layer in the hole region, forming a second planar layer in the pixel island region and the connecting bridge region, and forming a second fill layer in the hole region, the second fill layer filling the second through-hole, the second fill layer contacting the first fill layer, an orthogonal projection of the second fill layer on the flexible base substrate at least partially overlapping with an orthogonal projection of the first fill layer on the flexible base substrate, and an orthogonal projection of the package layer on the flexible base substrate partially overlapping or not overlapping with an orthogonal projection of the second fill layer on the flexible base substrate.

[0023] In some exemplary embodiments, the manufacturing method further includes, after forming the first filling layer in the hole region, forming a second isolation groove in the hole region, the second isolation groove penetrating the composite insulating layer, a portion of the second planar layer, and a portion of the flexible base substrate. The second isolation groove penetrates a second through-hole of the composite insulating layer, and at least one insulating layer in the composite insulating layer has a second extension portion, and an orthogonal projection of the second extension portion on the flexible base substrate is located within an orthogonal projection of the second isolation groove on the flexible base substrate. The orthogonal projection of the second isolation groove on the flexible base substrate covers an orthogonal projection of the first filling layer on the flexible base substrate.

[0024] In another aspect, an embodiment of the present disclosure further provides a display substrate, comprising a flexible base substrate. The flexible base substrate has at least one extended display area, the extended display area including a plurality of pixel island areas separated from each other, a plurality of hole areas, and a connecting bridge area located between the pixel island areas and the hole areas, at least one hole area having one or more first through-holes penetrating the flexible base substrate. The hole area further comprises a composite insulating layer laminated on the flexible base substrate, the composite insulating layer having second through-holes, the second through-holes penetrating the composite insulating layer and penetrating to corresponding first through-holes. An orthographic projection of the composite insulating layer on the flexible base substrate overlaps with an orthographic projection of the first through-holes on the flexible base substrate.

[0025] In some exemplary embodiments, the composite insulating layer includes a first insulating layer in contact with the flexible base substrate, the second through hole includes a first through hole opened in the first insulating layer, and the orthogonal projection of the first through hole on the flexible base substrate is located within the orthogonal projection of the first through hole on the flexible base substrate.

[0026] In some exemplary embodiments, the display substrate further includes a packaging layer located on a side of the composite insulating layer away from the flexible base substrate, the packaging layer covering the side walls of the first through hole and the second through hole in the hole area.

[0027] In some exemplary embodiments, the first through hole includes a first sub-through hole and a second sub-through hole that communicate with each other, and the first sub-through hole penetrates to the second through hole, and an orthogonal projection of the first sub-through hole on the flexible base substrate is located within an orthogonal projection of the second sub-through hole on the flexible base substrate.

[0028] In some exemplary embodiments, the display substrate further includes a packaging layer located on a side of the composite insulating layer away from the flexible base substrate, the packaging layer covering the side walls of the first sub-through hole and the second through hole in the hole area.

[0029] In some exemplary embodiments, the cross-sectional shape of the second sub-through hole in a direction perpendicular to the display substrate is trapezoidal.

[0030] In some exemplary embodiments, the packaging layer includes a first inorganic packaging layer and a second inorganic packaging layer stacked together.

[0031] Other aspects may be understood after reading and understanding the accompanying drawings and detailed description.

[0032] The drawings are intended to facilitate a better understanding of the technical solutions of the present disclosure, constitute a part of the specification, and are used to explain the technical solutions of the present disclosure together with the embodiments of the present disclosure, but are not intended to limit the technical solutions of the present disclosure. The shapes and sizes of one or more components in the drawings do not reflect actual scale, and are intended only to schematically illustrate the contents of the present disclosure. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a schematic diagram showing how the peeling between the display substrate and the glass substrate is lost. [Figure 2] FIG. 2 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure. [Figure 3] FIG. 3 is a partial schematic diagram of an extended display area of ​​a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 4] FIG. 4 is a partial cross-sectional schematic view taken along the line QQ′ in FIG. [Figure 5A] FIG. 5A is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5B] FIG. 5B is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5C] FIG. 5C is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5D] FIG. 5D is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5E] FIG. 5E is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5F] FIG. 5F is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5G] FIG. 5G is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5H] FIG. 5H is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5I] FIG. 5I is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5J] FIG. 5J is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 5K] FIG. 5K is a schematic diagram of a manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 6] FIG. 6 is another partial cross-sectional schematic view taken along the QQ′ direction in FIG. [Figure 7] FIG. 7 is another partial cross-sectional schematic view taken along the QQ′ direction in FIG. [Figure 8A] FIG. 8A is a schematic diagram of another manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 8B] FIG. 8B is a schematic diagram of another manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 8C] FIG. 8C is a schematic diagram of another manufacturing process for a display substrate in accordance with at least one embodiment of the present disclosure. [Figure 9] FIG. 9 is a schematic cross-sectional view of a portion of a display substrate according to at least one embodiment of the present disclosure. [Figure 10] FIG. 10 is a partial cross-sectional view of a display substrate after first and second through holes are formed according to at least one embodiment of the present disclosure. [Figure 11] FIG. 11 is another partial cross-sectional schematic view of a display substrate according to at least one embodiment of the present disclosure. [Figure 12] FIG. 12 is another partial cross-sectional schematic view of the display substrate after the first through-holes and the second through-holes are formed according to at least one embodiment of the present disclosure. [Figure 13] FIG. 13 is a schematic diagram of a display device in accordance with at least one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0034] The following describes in detail the embodiments of the present disclosure with reference to the drawings. The embodiments may be implemented in a number of different forms. As those skilled in the art can easily understand, the method and content may be converted into other forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be construed as being limited to the content described in the following embodiments. Unless there is a conflict, the embodiments and features in the embodiments in the present disclosure may be arbitrarily combined.

[0035] In the drawings, the size, layer thickness, or area of ​​one or more components may be exaggerated for clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to the size, and the shape and size of one or more members in the drawings do not reflect the actual scale. Note that the drawings schematically show ideal examples, but one embodiment of the present disclosure is not limited to the shapes, values, etc. shown in the drawings.

[0036] In this specification, ordinal numbers such as "first," "second," and "third" are used to avoid confusion of elements and are not intended to limit the number. In this disclosure, "plurality" refers to a number of two or more.

[0037] For convenience, the present specification uses terms indicating orientations or positional relationships, such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," to describe the positional relationships of components with reference to the drawings. However, these terms are merely for the purpose of simplifying the description of the specification and do not explicitly or implicitly indicate that the indicated devices or elements necessarily have a specific orientation or are constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure. The positional relationships of components are appropriately changed depending on the direction in which each component is described. Therefore, no limitation is imposed on the terms described in the specification, and they can be appropriately substituted depending on the situation.

[0038] In this specification, unless otherwise clearly specified or limited, the terms "attached" and "connected" should be understood in a broad sense. For example, they may mean fixedly connected, detachably connected, or integrally connected, may be mechanically connected or electrically connected, may be directly connected, may be indirectly connected via an intermediate member, or may be in communication within two elements. Those skilled in the art can understand the meaning of the above terms in the present disclosure depending on the context.

[0039] In this specification, "electrical connection" includes cases where components are connected via an element having some electrical function. The "element having some electrical function" is not particularly limited as long as it is capable of transmitting an electrical signal between the connected components. Examples of the "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0040] In this specification, a transistor refers to an element having at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, channel region, and source electrode. In this specification, a channel region refers to a region through which current mainly flows.

[0041] In this specification, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. When using transistors with reversed polarity, or when the current direction changes during circuit operation, the functions of a "source electrode" and a "drain electrode" may be interchangeable. Therefore, in this specification, the terms "source electrode" and "drain electrode" may be interchangeable.

[0042] In this specification, "parallel" refers to a state in which the angle between two lines is -10° or more and 10° or less, and therefore also includes a state in which the angle is -5° or more and 5° or less. "Perpendicular" refers to a state in which the angle between two lines is 80° or more and 100° or less, and therefore also includes a state in which the angle is 85° or more and 95° or less.

[0043] In this specification, the terms "film" and "layer" can be used interchangeably. For example, a "conductive layer" can be used interchangeably with a "conductive film." Similarly, an "insulating film" can be used interchangeably with an "insulating layer."

[0044] In this disclosure, "about" refers to not strictly limiting the limit but allowing for margins of error in processes and measurements.

[0045] In this disclosure, "stretchable" refers to the ability of a material, structure, device, or device assembly to deform (e.g., become longer or wider, or longer and wider) under tension without permanent deformation or failure such as rupture, e.g., the ability to stretch in length by at least 10% without permanent deformation, rupture, or breakage. "Stretchable" is also intended to include substrates having assemblies (whether or not these assemblies themselves are independently stretchable as described above) configured to accommodate stretchable, inflatable, or deployable surfaces and maintain functionality when applied to the stretched, inflated, or deployed stretchable, inflatable, or deployable surfaces. "Stretchable" is also intended to include substrates that are elastically or plastically deformable (i.e., after being stretched, the substrate can return to its original size when the stretching force is released, or the substrate can not return to its original size and in some instances can maintain the stretched configuration), and that may undergo deformation (e.g., stretching and selective bending) during manufacture of the substrate, assembly of a device having the substrate (which may be considered part of the manufacturing operation), or use (e.g., a user stretching and selective bending the substrate).

[0046] In some implementations, stretchable display substrates generally adopt a large aperture structure design. However, during the manufacturing process of the stretchable display substrate, after the aperture structure is formed in the flexible base substrate, the step is large (e.g., larger than 10 micrometers), so deep hole exposure residue is likely to occur in subsequent processes, which affects the stretchability of the display substrate. Furthermore, when the display substrate is peeled off from the glass substrate, the packaging layer is likely to tear and become defective, resulting in the packaging of the stretchable display substrate becoming defective.

[0047] FIG. 1 is a schematic diagram illustrating the failure of peeling between a display substrate and a glass substrate. As shown in FIG. 1, a package layer 03 covers an opening region D0 of a flexible base substrate 02. In the opening region D0, the package layer 03 directly contacts the sidewall of the flexible base substrate 02 and the glass substrate 01. When the flexible base substrate 02 is peeled from the glass substrate 01, the package layer 03 that directly contacts the glass substrate 01 within the opening region D0 is difficult to separate from the glass substrate 01. As a result, a tearing fracture point is likely to occur in the package layer 03 at a first position D1 during the peeling process, resulting in the failure of the display substrate package.

[0048] At least one embodiment of the present disclosure provides a display substrate, comprising a flexible base substrate, a first filling layer, and a packaging layer. The flexible base substrate comprises at least one extended display region. The extended display region includes a plurality of pixel island regions separated from each other, a plurality of hole regions, and a connecting bridge region located between the pixel island regions and the hole regions. At least one hole region is provided with one or more first through-holes penetrating the flexible base substrate. The first filling layer is located in the hole regions and filled into the first through-holes. The packaging layer is located on a side of the first filling layer away from the flexible base substrate, and an orthogonal projection of the packaging layer on the flexible base substrate partially overlaps or does not overlap with the first filling layer.

[0049] The display substrate according to the embodiment of the present disclosure fills the first through-hole penetrating the flexible base substrate with a first filling layer, thereby avoiding residues during the deep hole exposure process and improving the stretchability of the display substrate. It also prevents the packaging layer from rupturing and failing when the display substrate and the glass substrate are peeled off, thereby improving the packaging reliability of the display substrate.

[0050] In some exemplary embodiments, the adhesiveness of the first filler layer may be different from that of the flexible base substrate, and by using first filler layers with different adhesiveness to fill the first through-holes of the flexible base substrate, the stretchable effect of the display substrate can be ensured.

[0051] In some exemplary embodiments, the display substrate may further include a first planar layer located in the pixel island region and the connecting bridge region. The first planar layer and the first filling layer have the same layer structure and are made of the same material. In this example, the first planar layer and the first filling layer may be manufactured synchronously, thereby simplifying the manufacturing process.

[0052] In some exemplary embodiments, the surface of the first filling layer and the surface of the flexible base substrate may be aligned. In this example, by aligning the first filling layer and the surface of the flexible base substrate, a film layer subsequently formed on the flexible base substrate can be smoothed and less likely to crack. However, this example is not limited thereto. In some exemplary embodiments, the surface of the first filling layer and the surface of the flexible base substrate may not be aligned. For example, the surface of the first filling layer may be higher than the surface of the flexible base substrate, or the surface of the first filling layer may be lower than the surface of the flexible base substrate.

[0053] In some exemplary embodiments, the hole region further comprises a composite insulating layer laminated on the flexible base substrate. The composite insulating layer has a second through-hole. The second through-hole penetrates the composite insulating layer and connects to the corresponding first through-hole. The composite insulating layer may include at least one inorganic layer, or at least one organic layer, or at least one inorganic layer and at least one organic layer. In some examples, the composite insulating layer may include only an inorganic layer, i.e., an inorganic composite insulating layer, or may include only an organic layer, i.e., an organic composite insulating layer, or may include both an inorganic layer and an organic layer. In this example, drilling the composite insulating layer in the hole region can improve the stretchability of the display substrate. However, this example is not limited thereto.

[0054] In some exemplary embodiments, the display substrate further includes a second filling layer located in the hole region, the second filling layer filling the second through-hole. The second filling layer contacts the first filling layer, and the orthogonal projection of the second filling layer on the flexible base substrate at least partially overlaps with the orthogonal projection of the first filling layer on the flexible base substrate. The orthogonal projection of the packaging layer on the flexible base substrate partially or completely overlaps with the orthogonal projection of the second filling layer on the flexible base substrate. In this example, the packaging layer does not cover or does not completely cover the second filling layer, thereby ensuring the stretchability of the display substrate. Filling the second through-hole with the second filling layer can avoid residues during the deep hole exposure process, improve the stretchability of the display substrate, and prevent the packaging layer from being ruptured and destroyed when the display substrate is peeled off from the glass substrate, thereby improving the packaging reliability of the display substrate.

[0055] In some examples, the composite insulating layer may include an organic layer, and the second filling layer and the organic layer of the composite insulating layer may have the same layer structure and material, but this embodiment is not limited thereto.

[0056] In some exemplary embodiments, the display substrate may further include a second planar layer located in the pixel island region and the connecting bridge region. The second planar layer is located on the side of the first planar layer away from the flexible base substrate, and the second planar layer and the second filling layer have the same layer structure and the same material. In this example, the second planar layer and the second filling layer may be manufactured synchronously, thereby simplifying the manufacturing process.

[0057] In some exemplary embodiments, the surface of the second filler layer facing away from the flexible base substrate and the surface of the composite insulating layer facing away from the flexible base substrate may be aligned. By aligning the surfaces of the second filler layer and the composite insulating layer, the film layer subsequently formed on the composite insulating layer can be smoothed and less likely to form cracks. However, this embodiment is not limited thereto. For example, the surface of the second filler layer facing away from the flexible base substrate may be lower than the surface of the composite insulating layer facing away from the flexible base substrate.

[0058] In some exemplary embodiments, at least one hole region may be provided with a second separation groove formed in the flexible base substrate and the first filling layer. The second separation groove penetrates the second through-hole of the composite insulating layer. At least one insulating layer in the composite insulating layer has a second extension portion, and the orthogonal projection of the second extension portion on the flexible base substrate is located within the orthogonal projection of the second separation groove on the flexible base substrate. In this example, a portion of the second separation groove may be formed in the first filling layer, and the remaining portion may be formed in the flexible base substrate. The second extension portion of the at least one insulating layer in the composite insulating layer is located in the notch of the second separation groove, thereby the orthogonal projection of the notch of the second separation groove on the flexible base substrate is located within the orthogonal projection of the second separation groove on the flexible base substrate. The orthogonal projection of the second separation groove on the flexible base substrate covers the orthogonal projection of the first filling layer on the flexible base substrate. The cross-sectional shape of the second separation groove may be convex in a direction perpendicular to the display substrate. In this example, by forming a second separation groove in the flexible base substrate filled with the first filling layer, the organic light-emitting layer of the light-emitting element and the cathode can be isolated, thereby improving the packaging reliability of the display substrate.

[0059] In some exemplary embodiments, the display substrate may further include a second planar layer located on a side of the first planar layer away from the flexible base substrate, and a passivation layer located on a side of the second planar layer away from the flexible base substrate. A first separation groove is formed in the connecting bridge region, penetrating the passivation layer and a portion of the second planar layer. The passivation layer has a first extension, and an orthogonal projection of the first extension on the flexible base substrate is located within an orthogonal projection of the first separation groove on the flexible base substrate. In this example, the first separation groove is formed in the second planar layer, and the first extension of the passivation layer is located in a cutout of the first separation groove, such that an orthogonal projection of the cutout of the first separation groove on the flexible base substrate is located within an orthogonal projection of the first separation groove on the flexible base substrate. The cross-sectional shape of the first separation groove may be convex in a direction perpendicular to the display substrate. In this example, by forming a first isolation groove in the connecting bridge region, the organic light-emitting layer and the cathode formed near the hole region of the pixel island region can be blocked at the first isolation groove, thereby preventing water, oxygen, etc. in the hole region from corroding the light-emitting element.

[0060] In some exemplary embodiments, the package layer may include a stacked first inorganic package layer, an organic package layer, and a second inorganic package layer, in which case the package layer adopts an inorganic-organic-inorganic three-layer package structure to improve the package effect.

[0061] The present invention will be explained below with some examples.

[0062] FIG. 2 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. 2, the display region of the display substrate may include a main display region A1 and at least one stretched display region A2 (e.g., four stretched display regions). The display substrate may be a rectangular display substrate, and the four stretched display regions A2 may be located at four corner regions of the display substrate, with the remaining display region being the main display region. In this example, because the four sides of the display substrate are curved, providing the stretched display regions at the four corner regions can provide stress relief and prevent breakage when the display substrate is bent. However, this example is not limited thereto. In some examples, the stretched display region may be provided at any position where the display region of the display substrate needs to be bent. For example, the display substrate may be a triangular display substrate, and the display substrate may have three stretched display regions, which may be located at three corner regions of the display substrate. For example, the stretched display regions may all be provided near the sides of the display substrate. This allows the stretchable function of the corresponding partial area of ​​the display substrate to be realized.

[0063] In some exemplary embodiments, the stretched display area A2 may be a rectangular area, as shown in Figure 2. However, this embodiment is not limited thereto. For example, the stretched display area may be a circular area, a pentagonal area, or another shape.

[0064] 3 is a partial schematic diagram of an extended display region of a display substrate according to at least one embodiment of the present disclosure, which diagrammatically illustrates the structure of a partial region of the extended display region, which can be viewed as a repeating unit of the extended display region.

[0065] 3 , in a plane parallel to the display substrate, the stretched display region A2 of the display substrate may include a plurality of pixel island regions 100 separated from each other, hole regions 300 located between adjacent pixel island regions 100, and connecting bridge regions 200 connecting the adjacent pixel island regions 100 to each other. Each pixel island region 100 may be surrounded by a plurality of hole regions 300, and a connecting bridge region 200 may be located between the pixel island region and the hole region 300, and a connecting bridge region 200 may also be located between adjacent hole regions 300. The pixel island regions 100 are used for image display, the hole regions 300 are used for providing deformation space during stretching, and the connecting bridge regions 200 are used for wiring (connecting signals between adjacent pixel island regions 100) and transmitting tensile force.

[0066] In some exemplary embodiments, each pixel island region 100 may include one or more pixel units, and each pixel unit may include three light-emitting units (e.g., red, green, blue) that emit light of different colors or four light-emitting units (e.g., red, green, blue, white) that emit light of different colors. Each light-emitting unit may include a light-emitting element and a pixel circuit configured to drive the light-emitting element to emit light. The light-emitting element may be an OLED element including a stacked anode, an organic light-emitting layer, and a cathode. The organic light-emitting layer emits light when a voltage is applied between the anode and the cathode. When the stretched display area is stretched by an external force, distortion occurs mainly in the connecting bridge region 200, while the light-emitting units in the pixel island region 100 essentially maintain their shape and are not destroyed. However, this embodiment is not limited thereto. For example, the light-emitting elements of the light-emitting units may be arranged in the pixel island region, while the pixel circuits may not be arranged in the pixel island region. For example, the pixel circuits may be arranged in the connecting bridge region or a peripheral region surrounding the display area.

[0067] In some exemplary embodiments, as shown in FIG. 3 , a plurality of connecting bridge regions 200 may connect a plurality of pixel island regions 100 to each other in a plane parallel to the display substrate. Each pixel island region 100 may be rectangular. However, this embodiment is not limited thereto. In some examples, the pixel island region may be circular, regular polygonal, or other irregular shape. Alternatively, in some examples, the shapes of the pixel island regions may be different.

[0068] In some exemplary embodiments, as shown in FIG. 3 , in a plane parallel to the display substrate, when the display substrate is in an unstretched state, the hole regions 300 may have a shape such as a U-shape, a T-shape, an L-shape, a rectangle, an arc, or a line-shape. In some examples, each hole region 300 may be considered as a through-hole, and the width of the through-hole may be approximately 10 micrometers to 500 micrometers. The connecting bridge region 200 is located between the pixel island region 100 and the hole region 300, or between adjacent hole regions 300, and connects to the adjacent pixel island regions 100. The connecting bridge region 200 may have an L-shape or a shape in which multiple L-shapes are connected to each other, for example:

[0069]

number

[0070] The width of the connection bridge region 200 may be about 10 micrometers to 500 micrometers, but this embodiment is not limited thereto.

[0071] FIG. 4 is a partial cross-sectional schematic view taken along the Q-Q′ direction in FIG. 3 . In some exemplary embodiments, as shown in FIG. 4 , in a direction perpendicular to the display substrate, a pixel island region 100 may include a flexible base substrate 10, a driving structure layer, a light-emitting structure layer, a packaging layer 40, and a buffer protection layer 50, which are sequentially arranged on the flexible base substrate 10. The driving structure layer may include a plurality of gate lines and a plurality of data lines, which perpendicularly intersect with each other to define a plurality of sub-pixel regions, and a pixel circuit is arranged in each sub-pixel region. Each pixel circuit includes a plurality of transistors and at least one capacitor, and may have, for example, a 2T1C (two transistors and one capacitor), a 3T1C (three transistors and one capacitor), or a 7T1C (seven transistors and one capacitor) structure. The light-emitting structure layer may include a plurality of light-emitting elements. The pixel circuits and the light-emitting elements may be electrically connected in a one-to-one correspondence. FIG. 4 shows a schematic illustration of only one light emitting element, one transistor and one capacitor of the pixel circuit in the pixel island region 100 as an example.

[0072] In some exemplary embodiments, as shown in FIG. 4 , in a direction perpendicular to the display substrate, the connection bridge region 200 may include a flexible base substrate 10, a composite insulating layer provided on the flexible base substrate 10, a signal line (only one signal line 23 is shown in FIG. 4 ) provided on the composite insulating layer, and a first flat layer 16, a second flat layer 17, a passivation layer 18, a package layer 40, and a buffer protection layer 50 sequentially covering the signal line. In this example, the composite insulating layer is an inorganic composite insulating layer including multiple inorganic layers. The inorganic composite insulating layer may include a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, a fourth insulating layer 14, and a fifth insulating layer 15 stacked on the flexible base substrate 10. A first separation groove H1 is formed in the connection bridge region 200, penetrating the passivation layer 18 and the second flat layer 17. The passivation layer 18 has a first extension that shields a portion of the first separation groove H1, so that the orthogonal projection of the notch of the first separation groove H1 on the flexible base substrate 10 is located within the orthogonal projection of the first separation groove H1 on the flexible base substrate 10. In this example, the first insulating layer 11 to the fifth insulating layer 15 are all inorganic layers. However, this example is not limited thereto. For example, the fifth insulating layer may be an organic layer.

[0073] In some examples, the signal lines of the connecting bridge region 200 are configured to realize signal connection between adjacent pixel island regions 100, for example, to transmit signals to or from the pixel island region 100. The signal connection between adjacent pixel island regions 100 refers to the signal connection between the light-emitting units in one pixel island region 100 and the light-emitting units in another adjacent pixel island region 100. The multiple signal lines of the connecting bridge region 200 may include, for example, connection lines connecting gate lines in adjacent pixel island regions 100, connection lines connecting data lines in adjacent pixel island regions 100, and connection lines for power signals. In some examples, the multiple signal lines may be multiple flexible signal lines.

[0074] In some exemplary embodiments, as shown in FIG. 4 , in a direction perpendicular to the display substrate, the flexible base substrate 10 in the hole region 300 has a first through-hole, which penetrates the flexible base substrate 10. A first filling layer 61 is filled in the first through-hole. The hole region 300 further has a first opening G1. The first opening G1 exposes the first filling layer 61 filled in the first through-hole. The first opening G1 is disposed in the hole region 300 to provide a deformation space during stretching, thereby achieving a stretching effect.

[0075] In some exemplary embodiments, as shown in FIG. 4 , the package layer 40 in the pixel island region 100 and the connecting bridge region 200 may include a stacked first inorganic package layer 41, an organic package layer 42, and a second inorganic package layer 43. In the hole region 300, the first inorganic package layer 41 covers the sidewall of the first opening G1, and the orthogonal projection of the first inorganic package layer 41 on the flexible base substrate 10 does not overlap with the first filling layer 61. That is, the package layer 40 does not cover the first filling layer 61 in the hole region 300, thereby ensuring the stretching effect of the display substrate. However, this embodiment is not limited thereto. In some examples, the orthogonal projection of the first inorganic package layer 41 on the flexible base substrate 10 may partially overlap with the first filling layer 61, for example, the first inorganic package layer 41 may cover the edge of the first filling layer 61.

[0076] 5A to 5K, the technical solution of this embodiment will be described through an example of a manufacturing process of the display substrate of this embodiment. The structural schematic diagrams of FIGS. 5A to 5K are all partial cross-sectional views taken along the Q-Q' direction in FIG. 3.

[0077] The "patterning process" referred to in this embodiment includes processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping for metal materials, inorganic materials, or transparent conductive materials, and processes such as organic material coating, mask exposure, and development for organic materials. Deposition may employ any one or more of sputtering, evaporation, and chemical vapor deposition; coating may employ any one or more of spray coating, spin coating, and inkjet printing; and etching may employ any one or more of dry etching and wet etching, and the embodiments of the present disclosure are not limited thereto. A "thin film" refers to a thin film of a material fabricated on a substrate by deposition, coating, or other processes. If the "thin film" does not require a patterning process during the entire manufacturing process, the "thin film" may also be referred to as a "layer." If the "thin film" requires a patterning process during the entire manufacturing process, the "thin film" is referred to as a "thin film" before the patterning process and as a "layer" after the patterning process. After the patterning process, a "layer" contains at least one "pattern."

[0078] The phrase "A and B are arranged in the same layer" in the embodiments of the present disclosure means that A and B are formed simultaneously by the same patterning process. The phrase "same layer" does not necessarily mean that the layer thickness or layer height is the same in a cross-sectional view. The phrase "the orthogonal projection of A includes the orthogonal projection of B" means that the orthogonal projection of B is within the range of the orthogonal projection of A, or that the orthogonal projection of A covers the orthogonal projection of B.

[0079] The manufacturing process of the display substrate of this embodiment may include the following steps (1) to (12).

[0080] (1) Fabricating the flexible base substrate 10 on a glass substrate 60. In some exemplary embodiments, a flexible material is coated on the glass substrate 60 and cured to form a film, forming the flexible base substrate 10. In some examples, the thickness of the flexible base substrate 10 may range from about 6 micrometers (μm) to 10 μm. In some examples, the flexible material may employ materials such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film.

[0081] After this process, the pixel island region 100, the connecting bridge region 200, and the hole region 300 all comprise the flexible base substrate 10, as shown in FIG. 5A.

[0082] (2) In the flexible base substrate 10, the first insulating layer 11, the second insulating layer 12, the semiconductor layer, the third insulating layer 13, the first metal layer, the fourth insulating layer 14, the second metal layer, and the fifth insulating layer 15 are fabricated in sequence.

[0083] In some exemplary embodiments, as shown in FIG. 5A, a first insulating thin film and a second insulating thin film are sequentially deposited on the flexible base substrate 10 to form a first insulating layer 11 and a second insulating layer 12 that cover the entire flexible base substrate 10.

[0084] Then, a semiconductor thin film is deposited and patterned by a patterning process to form a semiconductor layer disposed on the second insulating layer 12, the semiconductor layer including at least a first active layer 210 located in the pixel island region 100.

[0085] Then, a third insulating thin film and a first metal thin film are sequentially deposited, and the first metal thin film is patterned by a patterning process to form a third insulating layer 13 covering the semiconductor layer and a first metal layer disposed on the third insulating layer 13. The first metal layer includes at least a first gate electrode 211 and a first capacitor electrode 221 located in the pixel island region 100.

[0086] Thereafter, a fourth insulating thin film and a second metal thin film are sequentially deposited, and the second metal thin film is patterned by a patterning process to form a fourth insulating layer 14 covering the first metal layer and a second metal layer provided on the fourth insulating layer 14. The second metal layer includes at least a second capacitor electrode 222 located in the pixel island region 100. The orthogonal projections of the second capacitor electrode 222 and the first capacitor electrode 221 on the flexible base substrate 10 overlap.

[0087] Thereafter, a fifth insulating thin film is deposited to form a fifth insulating layer 15 that covers the second metal layer.

[0088] After this process, both the connection bridge region 200 and the hole region 300 may include a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, a fourth insulating layer 14, and a fifth insulating layer 15, which are arranged in this order on the flexible base substrate 10. The first insulating layer 11 to the fifth insulating layer 15 may be collectively referred to as an inorganic composite insulating layer.

[0089] In some exemplary embodiments, the first insulating layer 11, the second insulating layer 12, the third insulating layer 13, the fourth insulating layer 14, and the fifth insulating layer 15 may be made of one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multilayer, or a composite layer. The first insulating layer 11 may also be referred to as a blocking layer, and the second insulating layer 12 may also be referred to as a buffer layer. The first insulating layer 11 and the second insulating layer 12 may be used to improve the water resistance and oxygen resistance of the flexible base substrate 10. The third insulating layer 13 and the fourth insulating layer 14 may also be referred to as a gate insulator (GI) layer, and the fifth insulating layer 15 may also be referred to as an interlayer dielectric (ILD) layer.

[0090] In some exemplary embodiments, the first metal thin film and the second metal thin film employ a metal material, such as one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may have a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc. The semiconductor thin film employs one or more materials, such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, polythiophene, etc. That is, the present disclosure is applicable to transistors fabricated based on oxide technology, silicon technology, and organic technology.

[0091] (3) The inorganic composite insulating layer in the hole region 300 is etched to form the second through-hole K2.

[0092] 5B , the fifth insulating layer 15, the fourth insulating layer 14, the third insulating layer 13, the second insulating layer 12, and the first insulating layer 11 are etched to form second through holes K2 in the hole region 300, exposing the surface of the flexible base substrate 10. In some examples, a fifth through hole K25 is formed in the fifth insulating layer 15 in the hole region 300, and the fifth through hole K25 exposes the surface of the fourth insulating layer 14. A fourth through hole K24 is formed in the portion of the fourth insulating layer 14 exposed by the fifth through hole K25, and the fourth through hole K24 exposes the surface of the third insulating layer 13. A third through hole K23 is formed in the portion of the third insulating layer 13 exposed by the fourth through hole K24, and the third through hole K23 exposes the surface of the second insulating layer 12. A second through-hole K22 is formed in the portion of the second insulating layer 12 exposed by the third through-hole K23, and the second through-hole K22 exposes the surface of the first insulating layer 11. A first through-hole K21 is formed in the portion of the first insulating layer 11 exposed by the second through-hole K22. The first through-hole K21 to the fifth through-hole K25 communicate with each other to form the second penetrating hole K2.

[0093] In some examples, the orthogonal projection of the fifth through hole K25 on the flexible base substrate 10 includes the orthogonal projection of the fourth through hole K24 on the flexible base substrate 10, the orthogonal projection of the fourth through hole K24 on the flexible base substrate 10 includes the orthogonal projection of the third through hole K23 on the flexible base substrate 10, the orthogonal projection of the third through hole K23 on the flexible base substrate 10 includes the orthogonal projection of the second through hole K22 on the flexible base substrate 10, and the orthogonal projection of the second through hole K22 on the flexible base substrate 10 includes the orthogonal projection of the first through hole K21 on the flexible base substrate 10. In other words, the size of the first through hole K21 may be smaller than the size of the second through hole K22, the size of the second through hole K22 may be smaller than the size of the third through hole K23, the size of the third through hole K23 may be smaller than the size of the fourth through hole K24, and the size of the fourth through hole K24 may be smaller than the size of the fifth through hole K25. However, this embodiment is not limited thereto. For example, the first through hole, the second through hole, the third through hole, the fourth through hole, and the fifth through hole may be approximately the same size.

[0094] In some examples, the second through-hole K2 may have a rectangular or circular cross-sectional shape in a plane parallel to the display substrate. In a direction perpendicular to the display substrate, the cross-sectional shape of the second through-hole K2 may be an inverted trapezoid. However, this embodiment is not limited thereto.

[0095] In this disclosure, pore size refers to a measure of the size of the pore, for example, it may be the pore diameter in the case of a circular pore, or the side length in the case of a square pore.

[0096] After this process, the film layer structure of the pixel island region 100 and the connecting bridge region 200 remains unchanged.

[0097] (4) The flexible base substrate 10 is etched to form the first through-holes K1 in the hole region 300.

[0098] In some exemplary embodiments, as shown in FIG. 5C , the flexible base substrate 10 is etched using the fifth insulating layer 15 as a mask to form a first through hole K1 in the flexible base substrate 10 in the hole region 300. The first through hole K1 penetrates the flexible base substrate 10 and then penetrates to a second through hole K2. The orthogonal projection of the second through hole K2 on the flexible base substrate 10 covers the first through hole K1. In some examples, the first through hole K1 may be rectangular or circular in a plane parallel to the display substrate, and the cross-sectional shape of the first through hole K1 may be rectangular in a direction perpendicular to the display substrate. However, this embodiment does not limit the shape of the first through hole K1.

[0099] After this process, the film layer structure of the pixel island region 100 and the connecting bridge region 200 remains unchanged.

[0100] (5) A third metal layer is formed on the flexible base substrate 10 on which the above-described pattern has been formed.

[0101] In some exemplary embodiments, the fifth insulating layer 15 is patterned by a patterning process to form at least one first connection hole in the fifth insulating layer 15 in the pixel island region 100. The fifth insulating layer 15, the fourth insulating layer 14, and the third insulating layer 13 in the first connection hole are etched to expose the surface of the semiconductor layer.

[0102] Then, a third metal thin film is deposited and patterned by a patterning process to form a third metal layer, as shown in FIG. 5D . The third metal layer includes at least a first source electrode 212 and a first drain electrode 213 located in the pixel island region 100, and a signal line 23 located in the connecting bridge region 200. The first source electrode 212 may be electrically connected to the first doping region of the first active layer 210 through one first contact hole, and the first drain electrode 213 may be electrically connected to the second doping region of the first active layer 210 through another first contact hole. The signal line 23 in the connecting bridge region 200 may be configured to realize signal connection between adjacent pixel island regions 100. In some examples, the signal line 23 may be a connecting line connecting gate lines in adjacent pixel island regions 100, a connecting line connecting data lines in adjacent pixel island regions 100, or a connecting line for power supply signals. However, this embodiment is not limited thereto. In some examples, the connecting lines disposed within the connecting bridge region 200 and configured to connect gate lines in adjacent pixel island regions 100 may be located in the first metal layer or the second metal layer.

[0103] This completes the fabrication of the driving structure layers for multiple pixel island regions 100 on the flexible base substrate 10. As shown in Figure 4, in the driving structure layer for one pixel island region 100, the first active layer 210, the first gate electrode 211, the first source electrode 212, and the first drain electrode 213 may form a first transistor 21, and the first capacitor electrode 221 and the second capacitor electrode 222 may form a first capacitor 22.

[0104] After this process, the connection bridge region 200 comprises an inorganic composite insulating layer and a signal line 23 laminated on the flexible base substrate 10. The film layer structure of the hole region 300 remains unchanged.

[0105] (6) A first flat layer 16 and a first filling layer 61 are formed on the flexible base substrate 10 on which the above-described pattern has been formed.

[0106] In some exemplary embodiments, as shown in FIG. 5E , a first planar thin film made of an organic material is coated on the flexible base substrate 10 on which the above-described pattern has been formed, and the first planar thin film is then patterned by a patterning process to form a first planar layer 16 and a first filling layer 61. The first planar layer 16 is located in the connecting bridge region 200 and the pixel island region 100, and the first filling layer 61 is located in the hole region 300. The first planar layer 16 covers the third metal layer, and the first filling layer 61 fills the first through-hole K1 of the flexible base substrate 10. A sixth through-hole K26 is opened in the hole region 300 of the first planar layer 16, and the sixth through-hole K26 communicates with the second through-hole K2. The orthogonal projection of the sixth through-hole K26 on the flexible base substrate 10 may include the orthogonal projection of the second through-hole K2 on the flexible base substrate 10.

[0107] In some exemplary embodiments, the surface of the first filling layer 61 facing away from the glass substrate 60 and the surface of the flexible base substrate 10 facing away from the glass substrate 60 may be flush with each other. However, this embodiment is not limited thereto. For example, the surface of the first filling layer 61 facing away from the glass substrate 60 may be slightly lower than the surface of the flexible base substrate 10 facing away from the glass substrate 60, or may be slightly higher than the surface of the flexible base substrate 10 facing away from the glass substrate 60.

[0108] In this example, by filling the first through-holes K1 of the flexible base substrate 10 with the first filling layer 61, the problem of deep hole exposure residue in subsequent processes can be avoided and the stretchability of the display substrate can be improved. The first filling layer 61 and the first flat layer 16 are provided in the same layer, which simplifies the process. The first filling layer 61 and the flexible base substrate 10 may also be made of organic materials with different adhesive properties, which makes the adhesive force between them relatively weak and avoids affecting the stretchability of the flexible base substrate 10, thereby achieving the same stretchability effect as using a through-hole structure in the flexible base substrate.

[0109] (7) On the flexible base substrate 10 on which the above-described pattern has been formed, a fourth metal layer, a second planar layer 17, a passivation layer 18, an anode layer, a pixel definition layer 34, and spacer posts 19 are sequentially formed.

[0110] In some exemplary embodiments, the first planar layer 16 is patterned by a patterning process to form at least one second connection hole in the first planar layer 16 in the pixel island region 100. As shown in Figure 5F, the first planar layer 16 in the second connection hole is removed to expose the surface of the third metal layer. After this process, the film layer structure of the connection bridge region 200 and the hole region 300 remains unchanged.

[0111] Then, a fourth metal thin film is deposited and patterned by a patterning process to form a fourth metal layer, as shown in FIG. 5F. The fourth metal layer includes at least a connecting electrode 24 located in the pixel island region 100. The connecting electrode 24 may be electrically connected to the first drain electrode 213 of the first transistor 21 through the second connecting hole. After this process, the film layer structures of the connecting bridge region 200 and the hole region 300 remain unchanged.

[0112] 5F, a second planar thin film made of an organic material is coated on the flexible base substrate 10 on which the above-described pattern has been formed, and the second planar thin film is patterned using a patterning process to form a second planar layer 17 covering the fourth metal layer in the pixel island region 100 and the connecting bridge region 200. A seventh through-hole K27 is opened in the second planar layer 17 in the hole region 300, and the seventh through-hole K27 communicates with the sixth through-hole K26. The orthogonal projection of the seventh through-hole K27 on the flexible base substrate 10 may also include the orthogonal projection of the sixth through-hole K26 on the flexible base substrate 10. After this process, the film layer structure in the hole region 300 remains unchanged.

[0113] A passivation thin film is then deposited on the flexible base substrate 10 on which the above-described pattern has been formed, and the passivation thin film is patterned using a patterning process to form a passivation layer 18 in the pixel island region 100 and the connecting bridge region 200. At least one third connection hole is formed in the passivation layer 18 in the pixel island region 100. The passivation layer 18 and the second planar layer 17 in the third connection hole are removed to expose the surface of the fourth metal layer. An eighth through-hole K28 is opened in the passivation layer 18 in the hole region 300, and the eighth through-hole K28 communicates with the seventh through-hole K27. The orthogonal projection of the eighth through-hole K28 on the flexible base substrate 10 may include the orthogonal projection of the seventh through-hole K27 on the flexible base substrate 10. After this process, the film layer structure in the hole region 300 remains unchanged. In this example, the eighth through-hole K28, the seventh through-hole K27, the sixth through-hole K26, and the second through-hole K2 are in communication with each other to form the first opening G1 of the hole region 300.

[0114] Then, as shown in FIG. 5F, a first conductive thin film is deposited and patterned by a patterning process to form an anode layer. The anode layer is formed on the passivation layer 18 of the pixel island region 100. The anode layer includes multiple anodes. FIG. 5F schematically illustrates only one anode 31. The anode 31 is electrically connected to the connection electrode 24 through the third contact hole, and is electrically connected to the first drain electrode 213 of the first transistor 21 through the connection electrode 24. In some examples, the anode may be a reflective anode. For example, the anode layer may include a stacked first light-transmitting conductive layer, a reflective layer, and a second light-transmitting conductive layer. The first light-transmitting conductive layer and the second light-transmitting conductive layer may be made of a light-transmitting conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The reflective layer may be a metal layer, for example, made of silver. However, this embodiment is not limited thereto. In some examples, the first conductive thin film may be made of a metal material, such as one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and may have a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti. After this process, the film layer structure of the connecting bridge region 200 and the hole region 300 remains unchanged.

[0115] Then, as shown in FIG. 5F , a pixel-defining thin film is coated on the flexible base substrate 10 on which the above-described pattern has been formed, and the pixel-defining thin film is patterned by a patterning process to form a pixel-defining layer 34 in the pixel island region 100. A plurality of pixel openings are opened in the pixel-defining layer 34 in the pixel island region 100. FIG. 5F schematically illustrates only one pixel opening V1 as an example. The pixel-defining layer 34 in the pixel opening V1 is developed to expose the surface of the anode 31. In some examples, the pixel-defining layer 34 may be made of a material such as polyimide, acrylic, or polyethylene terephthalate. After this process, the film layer structures in the connecting bridge region 200 and the hole region 300 remain unchanged.

[0116] 5F, a spacer post thin film is coated on the flexible base substrate 10 on which the above-mentioned pattern has been formed, and the spacer post thin film is patterned by a patterning process to form spacer posts 19 in the pixel island region 100 and the connecting bridge region 200. In some examples, the spacer posts 19 may be made of materials such as polyimide, acrylic, or polyethylene terephthalate. After this process, the film layer structure in the hole region 300 remains unchanged.

[0117] Next, photoresist is coated on the passivation layer 18, exposed to light, and developed to form separation holes penetrating the passivation layer 18. Then, using the passivation layer 18 with the separation holes as a mask, at least a portion of the second flat layer 17 is dry-etched to form a first groove in the second flat layer 17. The separation holes in the passivation layer 18 communicate with the first groove in the second flat layer 17, and the orthogonal projection of the first groove on the flexible base substrate 10 includes the orthogonal projection of the separation holes on the flexible base substrate 10. In this example, the separation holes in the passivation layer 18 and the first groove in the second flat layer 17 form a first separation groove H1. The passivation layer 18 has a first extension portion located above the first groove, and the orthogonal projection of the first extension portion of the passivation layer 18 on the flexible base substrate 10 is located within the orthogonal projection of the first groove on the flexible base substrate 10. The first extension of the passivation layer 18 partially covers the cutout of the first separation groove H1, so that the orthogonal projection of the cutout of the first separation groove H1 on the flexible base substrate 10 is located within the orthogonal projection of the first recessed groove on the flexible base substrate 10. The size of the cutout of the first separation groove H1 may be determined by the size of the separation hole in the passivation layer 18. In a direction perpendicular to the display substrate, the cross-sectional shape of the first separation groove H1 may be convex. After this process, the film layer structure of the hole region 300 remains unchanged.

[0118] In some examples, the first isolation groove H1 may be located in the connecting bridge region 200 adjacent to the hole region 300. The first isolation groove H1 is used to isolate the organic light-emitting layer and the cathode near the hole region 300 of the pixel island region 100 or the connecting bridge region 200, so that water vapor cannot penetrate from the hole region 300 along the organic light-emitting layer and the cathode into the light-emitting element and damage it.

[0119] In some examples, the depth of the first separation groove H1 may be approximately 1.5 μm to 2.5 μm, thereby ensuring that the drop depth can completely isolate the organic light-emitting layer and the cathode. The depth of the first separation groove H1 may be the distance between the surface of the first extension portion of the passivation layer 18 that is closer to the flexible base substrate 10 and the bottom surface of the first groove.

[0120] (8) An organic light-emitting layer 32 and a cathode 33 are sequentially formed on the flexible base substrate 10 on which the above-described pattern has been formed.

[0121] In some exemplary embodiments, the organic light-emitting layer 32 and the cathode 33 may be formed in the pixel island region 100, the connecting bridge region 200, and the hole region 300 by employing a vapor deposition process. The organic light-emitting layer 32 in the pixel island region 100 and the connecting bridge region 200 may cover the pixel definition layer 34, and the organic light-emitting layer 32 in the pixel island region 100 may directly contact the anode 31 exposed from the pixel opening V1 in the pixel definition layer 34. As shown in FIG. 5G , the organic light-emitting layer 32 in the connecting bridge region 200 is located in the first isolation groove H1, and the organic light-emitting layer 32 in the hole region 300 covers the sidewalls and bottom of the first opening G1.

[0122] In some examples, the cathode 33 is formed on the organic light-emitting layer 32. The stacked anode 31, organic light-emitting layer 32, and cathode 33 in the pixel island region 100 form a light-emitting element. In some examples, the cathode 33 may be made of a light-transmitting conductive material such as ITO or IZO. The light-emitting element may emit light from the side away from the flexible base substrate 10 by using the transparent cathode, thereby achieving top emission.

[0123] In some examples, the organic light-emitting layer 32 may include a stacked hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, thereby increasing the efficiency of injection of electrons and holes into the light-emitting layer, although this embodiment is not limited thereto.

[0124] In this example, due to the presence of the first separation groove H1, the organic light-emitting layer 32 and the cathode 33 formed by evaporation are separated by the first separation groove H1. By separating the organic light-emitting layer 32 and the cathode 33 in the pixel island region 100 and the connecting bridge region 200, the path of water vapor penetration from the hole region 300 to the organic light-emitting layer 32 and the cathode 33 in the pixel island region 100 is completely blocked, thereby ensuring the effectiveness and reliability of the package.

[0125] After this process, the organic light-emitting layer 32 and the cathode 33 are laminated on the flexible base substrate 10 in the hole area 300. The flexible base substrate 10 is filled with a first filling layer 61.

[0126] (9) A package layer 40 is formed on the flexible base substrate 10 on which the above-described pattern is formed.

[0127] In some exemplary embodiments, a first package film is deposited on the flexible base substrate 10 on which the above-described pattern has been formed, forming a first inorganic package layer 41 that covers the entire flexible base substrate 10. An inkjet printing process is then used to form an organic package layer 42. A second package film is then deposited to form a second inorganic package layer 43 that covers the entire flexible base substrate 10. In this example, as shown in FIG. 5H, the package layer 40 is an inorganic-organic laminate structure including a three-layer structure consisting of a first inorganic package layer 41, an organic package layer 42, and a second inorganic package layer 43. In some examples, the inorganic material may be silicon oxide, aluminum oxide, silicon nitride, or silicon oxynitride, and the organic material may be a flexible polymer material based on PET, which has good packaging properties, can effectively prevent water and oxygen from penetrating the organic light-emitting layer, and has flexible deformation characteristics that enable the display substrate to be stretched and deformed. However, this example is not limited thereto. For example, the package layer may have a five-layer structure consisting of inorganic / organic / inorganic / organic / inorganic.

[0128] After this process, the hole area 300 comprises a flexible base substrate 10, an organic light-emitting layer 32, a cathode 33, a first inorganic packaging layer 41, an organic packaging layer 42, and a second inorganic packaging layer 43, which are sequentially stacked on the glass substrate 60. The flexible base substrate 10 is filled with a first filling layer 61.

[0129] (10) Etching the organic package layer 42 and the second inorganic package layer 43 in the hole region 300.

[0130] In some exemplary embodiments, the second inorganic package layer 43 is patterned by a patterning process, and the second inorganic package layer 43 in the hole region 300 is removed. As shown in FIG. 5I, the organic package layer 42 is patterned using the patterned second inorganic package layer 43 as a mask, and the organic package layer 42 in the first opening G1 of the hole region 300 is removed. In some examples, the organic package layer 42 may be etched using oxygen to avoid etching the inorganic package layer. After etching the second inorganic package layer 43 and the organic package layer 42 in the hole region 300, the surface of the first inorganic package layer 41 in the hole region 300 may be exposed.

[0131] (11) In the hole area 300, the organic light-emitting layer 32, the cathode 33, and the first inorganic package layer 41 are patterned.

[0132] 5J , in the hole region 300, the first inorganic packaging layer 41, the cathode 33, and the organic light-emitting layer 32 are sequentially patterned by a patterning process, and the first inorganic packaging layer 41, the cathode 33, and the organic light-emitting layer 32 covering the first filling layer 61 and a portion of the flexible base substrate 10 are removed to expose the surface of the first filling layer 61. In this example, the first filling layer 61 in the hole region 300 may not be covered by the remaining film layer structure, thereby ensuring the stretchable effect of the display substrate.

[0133] (12) Form the buffer protection layer 50.

[0134] 5K , a buffer protection thin film is deposited on the flexible base substrate 10 on which the above-described pattern has been formed, and the buffer protection thin film is patterned by a patterning process to form a buffer protection layer 50. The buffer protection layer 50 in the hole region 300 is etched to expose the surface of the first filling layer 61. In this example, the orthogonal projection of the buffer protection layer 50 on the flexible base substrate 10 includes the orthogonal projection of the first inorganic package layer 41 on the flexible base substrate 10, and may not overlap with the orthogonal projection of the first filling layer 61 on the flexible base substrate 10. In some examples, the buffer protection layer 50 may serve as a base substrate for a touch structure layer, and the touch structure layer may be disposed on the buffer protection layer 50.

[0135] In some examples, after the manufacturing of the display substrate is completed, the flexible base substrate 10 may be peeled off from the glass substrate 60 by a laser lift-off (LTO) process. In this example, a first filling layer 61 is filled in the first through-hole of the flexible base substrate 10 to prevent the package layer 40 from directly contacting the glass substrate 60, thereby preventing the package layer 40 from being torn and damaged when the glass substrate 60 is peeled off.

[0136] The structure of the display substrate and its manufacturing process in this embodiment are merely illustrative. In some exemplary embodiments, the corresponding structure can be modified according to actual needs, and the patterning process can be increased or decreased. For example, the second planar layer and the fourth metal layer can be omitted, the anode of the light-emitting element can be directly connected to the third metal layer, and a first isolation groove can be formed in the passivation layer and the first planar layer. The present disclosure is not limited thereto.

[0137] In some exemplary embodiments, the structure of the main display area of ​​the display substrate can refer to the structure of the pixel island area of ​​the stretched display area, and will not be described again here.

[0138] In this exemplary embodiment, by filling the first through hole of the flexible base substrate 10 with the first filling layer, it is possible to avoid deep hole exposure residue in subsequent processes, and it is possible to avoid the packaging layer being torn and the package being ruined when separating the flexible base substrate and the glass substrate, thereby improving the packaging effect of the display substrate and increasing the yield rate of the display substrate.

[0139] 6 is another partial cross-sectional schematic view taken along the Q-Q' direction in FIG. 3. In some exemplary embodiments, as shown in FIG. 6, in a direction perpendicular to the display substrate, the pixel island region 100 may include a flexible base substrate 10, a driving structure layer, a light-emitting structure layer, a packaging layer 40, and a buffer protection layer 50, which are sequentially arranged on the flexible base substrate 10. FIG. 6 schematically illustrates only one light-emitting element, one transistor of a pixel circuit, and one capacitor of the pixel island region 100. The connection bridge region 200 may include the flexible base substrate 10, an inorganic composite insulating layer provided on the flexible base substrate 10, a signal line (only one signal line 23 is illustrated in FIG. 6) provided on the inorganic composite insulating layer, and a first flat layer 16, a second flat layer 17, a passivation layer 18, a packaging layer 40, and a buffer protection layer 50, which sequentially cover the signal line. The structures of the pixel island region 100 and the connecting bridge region 200 can be referred to in the description of the previous embodiment, and will not be described again here.

[0140] In some exemplary embodiments, as shown in FIG. 6 , in the direction perpendicular to the display substrate, the flexible base substrate 10 in the hole region 300 has a first through-hole, which penetrates the flexible base substrate 10. A first filling layer 61 of the first flat layer 16 is filled in the first through-hole. The inorganic composite insulating layer in the hole region 300 has a second through-hole, which penetrates the inorganic composite insulating layer. A second filling layer 71 is filled in the second through-hole. The second filling layer 71 and the first filling layer 61 are in direct contact. The orthogonal projection of the second filling layer 71 on the flexible base substrate 10 may cover the orthogonal projection of the first filling layer 61 on the flexible base substrate 10. The hole region 300 has a second opening G2, which exposes the second filling layer 71. In this example, by filling the first through-hole and the second through-hole in the hole region 300 with the first filling layer 61 and the second filling layer 71, the problem of deep hole exposure residue can be avoided.

[0141] In some exemplary embodiments, as shown in FIG. 6 , in the hole region 300, the orthogonal projection of the package layer 40 on the flexible base substrate 10 may not overlap with the orthogonal projection of the second filling layer 71 on the flexible base substrate 10, and may not overlap with the orthogonal projection of the first filling layer 61 on the flexible base substrate 10, thereby ensuring the stretching effect of the display substrate. However, this embodiment is not limited thereto. For example, the orthogonal projection of the package layer 40 on the flexible base substrate 10 may partially overlap with the orthogonal projection of the second filling layer 71 on the flexible base substrate 10, and may not overlap with the orthogonal projection of the first filling layer 61 on the flexible base substrate 10. Alternatively, the orthogonal projection of the package layer 40 on the flexible base substrate 10 may partially overlap with the orthogonal projection of the second filling layer 71 on the flexible base substrate 10, and may also partially overlap with the orthogonal projection of the first filling layer 61 on the flexible base substrate 10.

[0142] In some exemplary embodiments, during the manufacturing process of the display substrate, after forming the fourth metal layer, a second planar thin film made of an organic material may be coated on the flexible base substrate 10, and the second planar thin film may be patterned by a patterning process. A second planar layer 17 covering the fourth metal layer may be formed in the pixel island region 100 and the connecting bridge region 200, and a second filling layer 71 may be formed in the hole region 300. The second planar layer 17 may have a seventh through-hole K27 formed in the hole region 300, and the seventh through-hole K27 may communicate with the sixth through-hole K26 formed in the hole region 300 of the first planar layer 16. The orthogonal projection of the seventh through-hole K27 on the flexible base substrate 10 may include the orthogonal projection of the sixth through-hole K26 on the flexible base substrate 10. The second filling layer 71 is filled in the second through-hole in the hole region 300. The surface of the second filling layer 71 facing away from the flexible base substrate 10 and the surface of the fifth insulating layer 15 facing away from the flexible base substrate 10 may be aligned. However, this embodiment is not limited thereto. For example, the surface of the second filling layer 71 facing away from the flexible base substrate 10 may be lower than the surface of the fifth insulating layer 15 facing away from the flexible base substrate 10.

[0143] In this exemplary embodiment, the sixth through-hole in the first flat layer 16, the seventh through-hole in the second flat layer 17, and the eighth through-hole in the passivation layer 18 may communicate with each other to form a second opening G2 in the display substrate. The organic light-emitting layer 32, the cathode 33, the first inorganic package layer 41, and the buffer protection layer 50 may cover part of the sidewall and bottom of the second opening G2 and may not overlap with the second filling layer 71, thereby avoiding affecting the stretchable effect of the display substrate.

[0144] For the remaining structure and manufacturing process of this embodiment, the description of the previous embodiment can be referred to, and will not be repeated here.

[0145] The structure (or method) shown in this embodiment may be combined as appropriate with the structure (or method) shown in other embodiments.

[0146] FIG. 7 is another partial cross-sectional schematic view taken along the Q-Q′ direction in FIG. 3 . In some exemplary embodiments, as shown in FIG. 7 , a second separation groove H2 is provided in the hole region 300 in a direction perpendicular to the display substrate. The second separation groove H2 is formed by penetrating the inorganic composite insulating layer, a portion of the first filling layer 61, and a portion of the flexible base substrate 10. The inorganic composite insulating layer may include a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, a fourth insulating layer 14, and a fifth insulating layer 15, which are sequentially stacked on the flexible base substrate 10. The second separation groove H2 penetrates the second through-hole of the inorganic composite insulating layer. At least one insulating layer of the inorganic composite insulating layer has a second extension portion. The orthogonal projection of the second extension portion on the flexible base substrate 10 is located within the orthogonal projection of the second separation groove H2 on the flexible base substrate. The second extending portion of the inorganic composite insulating layer partially shields the cutout of the second separation groove H2, so that the orthogonal projection of the cutout of the second separation groove H2 on the flexible base substrate 10 is located within the orthogonal projection of the second separation groove H2 on the flexible base substrate 10. The orthogonal projection of the second separation groove H2 on the flexible base substrate 10 may cover the orthogonal projection of the first filling layer 61 on the flexible base substrate 10.

[0147] Regarding the structures of the pixel island region 100 and the connecting bridge region 200 of the display substrate of this embodiment, the description of the previous embodiment can be referred to, and the description will not be repeated here.

[0148] Next, the manufacturing process of the display substrate shown in FIG. 7 will be illustrated with reference to the manufacturing process of the previous embodiment and FIGS. 8A to 8C.

[0149] In some exemplary embodiments, as shown in Figure 5E, a first planar layer 16 is formed in the pixel island region 100 and the connecting bridge region 200, and a first filling layer 61 is formed in the hole region 300 to fill the first through-holes of the flexible base substrate 10. Then, as shown in Figure 8A, a fourth metal layer, a second planar layer 17, a passivation layer 18, an anode layer, a pixel definition layer 34, and a spacer pillar 19 are sequentially formed.

[0150] Next, photoresist is coated on the passivation layer 18, and the photoresist is exposed and developed to form separation holes penetrating the passivation layer 18. Then, using the passivation layer 18 with the separation holes as a mask, at least a portion of the second flat layer 17 is dry-etched to form a first groove. Finally, using the first insulating layer 11 with the first through-holes as a mask, at least a portion of the flexible base substrate 10 and the first filling layer 61 is dry-etched to form a second groove. In this example, the separation holes in the passivation layer 18 and the first groove in the second flat layer 17 communicate with each other to form a first separation groove H1. The size of the cutout of the first separation groove H1 is determined by the size of the separation holes in the passivation layer 18.

[0151] In some examples, the inorganic composite insulating layer has a second extending portion located above the second groove, and the orthogonal projection of the second extending portion of the inorganic composite insulating layer on the flexible base substrate 10 is located within the orthogonal projection of the second groove on the flexible base substrate 10. The second extending portion of the inorganic composite insulating layer partially shields the cutout of the second separation groove H2, so that the orthogonal projection of the cutout of the second separation groove H2 on the flexible base substrate 10 is located within the orthogonal projection of the second groove on the flexible base substrate 10. In some examples, the second extending portion of the inorganic composite insulating layer may be formed from at least one of the first insulating layer 11 to the fifth insulating layer 15, which overlaps with the orthogonal projection of the second groove on the flexible base substrate 10. In some examples, the second extending portion of the inorganic composite insulating layer may be formed from the first insulating layer 11, the first insulating layer 12, and the third insulating layer 13, which overlap with the orthogonal projection of the second groove on the flexible base substrate 10. The first through hole in the first insulating layer 11 and the second groove in the flexible base substrate 10 communicate with each other. The size of the cutout of the second separation groove H2 is determined by the size of the first through hole in the first insulating layer 11. The orthogonal projection of the second groove on the flexible base substrate 10 may include the orthogonal projection of the first through hole on the flexible base substrate 10. However, this embodiment is not limited thereto. For example, the size of the cutout of the second separation groove may be determined by the size of the through hole in the second insulating layer or the third insulating layer.

[0152] In some examples, a mixed gas (CF4, O2) of carbon tetrafluoride (CF4) and oxygen (O2) may be used as the etching gas, and by adjusting the ratio of the two, lateral etching of the second planar layer 17 is achieved to form the first groove, and lateral etching of the first filling layer 61 and the flexible base substrate 10 is achieved to form the second groove.

[0153] In some examples, the thickness of the flexible base substrate 10 may be approximately 6 μm to 10 μm, for example, approximately 6 μm or 8 μm. The depth L2 of the second separation groove H2 (i.e., the distance between the surface of the first insulating layer 11 closest to the flexible base substrate 10 and the bottom surface of the second groove) may be approximately 1.5 μm to 2.0 μm, for example, approximately 1.5 μm or 1.8 μm. The distance L1 between the sidewall of the second extension portion of the inorganic composite insulating layer and the sidewall of the second separation groove H2 on the same side (i.e., the distance between the notch edge of the second separation groove H2 and the sidewall of the second separation groove H2 on the same side of the notch edge) may be approximately 0.3 μm to 0.5 μm, for example, approximately 0.3 μm or 0.4 μm. In this example, L1 is the maximum distance between the hole wall of the first through-hole in the first insulating layer 11 and the sidewall of the second groove on the same side. However, this example is not limited thereto.

[0154] 8B, an evaporation process is then used to form an organic light-emitting layer 32 and a cathode 33 in the pixel island region 100, the connecting bridge region 200, and the hole region 300. The organic light-emitting layer 32 and the cathode 33 are cut at the first separation groove H1 and the second separation groove H2. A first package thin film is then deposited on the flexible base substrate 10 on which the above-mentioned pattern has been formed, forming a first inorganic package layer 41 that covers the entire flexible base substrate 10. An inkjet printing process is then used to form an organic package layer 42. A second package thin film is then deposited to form a second inorganic package layer 43 that covers the entire flexible base substrate 10. In this embodiment, the first inorganic package layer 41 is interrupted at the second separation groove H2. However, this embodiment is not limited thereto.

[0155] 8C , the organic package layer 42 and the second inorganic package layer 43 in the hole region 300 are etched to expose the surface of the first inorganic package layer 41 in the hole region 300. In the hole region 300, the organic light-emitting layer 32, the cathode 33, and the first inorganic package layer 41 are patterned to remove the first inorganic package layer 41, the cathode 33, and the organic light-emitting layer 32 in the flexible base substrate 10 and the first filling layer 61 in the second separation groove H2, thereby exposing the surface of the first filling layer 61 or the surface of the first filling layer 61 and a portion of the flexible base substrate 10. For example, an etching process is used to remove the first inorganic package layer 41, the cathode 33, and the organic light-emitting layer 32 covering the flexible base substrate 10 and the first filling layer 61 at the bottom of the second separation groove H2, thereby exposing the surface of the first filling layer 61 or the surface of the first filling layer 61 and a portion of the flexible base substrate 10. In this embodiment, the first filling layer 61 is not covered by the remaining film layer structure, thereby ensuring the extensibility of the display substrate. However, this embodiment is not limited thereto. For example, the edge of the first filling layer 61 may be covered by the buffer protection layer 50, as long as the extensibility of the display substrate is ensured.

[0156] Thereafter, a buffer protection thin film is deposited on the flexible base substrate 10 on which the above-mentioned pattern has been formed, and the buffer protection thin film is patterned by a patterning process to form the buffer protection layer 50. The buffer protection layer 50 in the hole region 300 is etched to expose the surface of the first filling layer 61.

[0157] In this exemplary embodiment, by filling the first through-hole of the flexible base substrate 10 with a first filling layer and forming the second separation groove H2, it is possible to prevent the packaging layer from being torn and the package from being damaged when separating the flexible base substrate 10 and the glass substrate 60, thereby improving the packaging effect of the display substrate. Furthermore, the provision of the second separation groove H2 isolates the organic light-emitting layer from the cathode and prevents water vapor from entering the light-emitting element, thereby further improving the packaging effect of the display substrate.

[0158] For the remaining structure and manufacturing process of this embodiment, the description of the previous embodiment can be referred to, and will not be repeated here.

[0159] The structure (or method) shown in this embodiment may be combined as appropriate with the structure (or method) shown in other embodiments.

[0160] An embodiment of the present disclosure further provides a method for manufacturing a display substrate, the display substrate having at least one extended display region, the extended display region including a plurality of pixel island regions separated from each other, a plurality of hole regions, and a connecting bridge region located between the pixel island regions and the hole regions. The manufacturing method of this embodiment includes: forming one or more first through-holes penetrating a flexible base substrate in the hole regions; forming a first filling layer in the hole regions to fill the first through-holes; and forming a package layer, wherein an orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap the first filling layer.

[0161] In some exemplary embodiments, the manufacturing method of this embodiment may further include forming a first planar layer in the pixel island region and the connecting bridge region, while forming a first filling layer in the hole region.

[0162] In some exemplary embodiments, the manufacturing method of this embodiment may further include forming a composite insulating layer on the flexible base substrate before forming a first filling layer in the hole region, and forming a second through hole in the composite insulating layer in the hole region, the second through hole penetrating the composite insulating layer and penetrating to the corresponding first through hole.

[0163] In some exemplary embodiments, the manufacturing method of this embodiment may further include, after forming the first fill layer in the hole region, forming a second planar layer in the pixel island region and the connecting bridge region, and forming a second fill layer in the hole region, the second fill layer filling the second through-hole. The second fill layer contacts the first fill layer, and the orthogonal projection of the second fill layer on the flexible base substrate at least partially overlaps with the orthogonal projection of the first fill layer on the flexible base substrate, and the orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap with the orthogonal projection of the second fill layer on the flexible base substrate.

[0164] In some exemplary embodiments, the manufacturing method may further include, after forming the first filling layer in the hole region, forming a second isolation groove in the hole region, the second isolation groove penetrating the composite insulating layer, a portion of the second planar layer, and a portion of the flexible base substrate. The second isolation groove penetrates the second through-hole of the composite insulating layer, and at least one insulating layer in the composite insulating layer has a second extending portion, and the orthogonal projection of the second extending portion on the flexible base substrate is located within the orthogonal projection of the second isolation groove on the flexible base substrate. The orthogonal projection of the second isolation groove on the flexible base substrate covers the orthogonal projection of the first filling layer on the flexible base substrate.

[0165] For the relevant description of the manufacturing method of this embodiment, please refer to the description of the previous embodiment, and the description will not be repeated here.

[0166] At least one embodiment of the present disclosure further provides a display substrate, comprising a flexible base substrate. The flexible base substrate has at least one extended display region, the extended display region including a plurality of pixel island regions separated from each other, a plurality of hole regions, and a connecting bridge region located between the pixel island regions and the hole regions. At least one hole region has one or more first through-holes penetrating the flexible base substrate. The hole region further comprises a composite insulating layer laminated on the flexible base substrate. The composite insulating layer has second through-holes. The second through-holes penetrate the composite insulating layer and connect to the corresponding first through-holes. An orthogonal projection of the composite insulating layer on the flexible base substrate overlaps with an orthogonal projection of the first through-holes on the flexible base substrate.

[0167] The display substrate according to this exemplary embodiment forms an undercut structure between the flexible base substrate in the hole region or between the flexible base substrate and the composite insulating layer, thereby improving the adhesion between the package layer in the hole region and the glass substrate, avoiding the situation where the package layer is ruptured and becomes useless when the display substrate is peeled off from the glass substrate, and improving the package reliability of the display substrate.

[0168] In some exemplary embodiments, the composite insulating layer includes a first insulating layer in contact with the flexible base substrate. The second through hole includes a first through hole opened in the first insulating layer. The orthogonal projection of the first through hole on the flexible base substrate is located within the orthogonal projection of the first through hole on the flexible base substrate. In this example, the package layer covers the first through hole and the sidewall of the first through hole in the hole region. In this example, the flexible base substrate and the composite insulating layer in the hole region form an undercut structure.

[0169] In some exemplary embodiments, the first through-hole includes a first sub-through-hole and a second sub-through-hole that are connected to each other, and the first sub-through-hole penetrates to the second through-hole. An orthogonal projection of the first sub-through-hole on the flexible base substrate is located within an orthogonal projection of the second sub-through-hole on the flexible base substrate. In this example, the package layer covers the sidewalls of the first sub-through-hole and the second through-hole in the hole region. In this example, an undercut structure is formed using the first through-hole in the flexible base substrate.

[0170] The present invention will be explained below with some examples.

[0171] 9 is a partial cross-sectional view of a display substrate according to at least one embodiment of the present disclosure, and FIG. 10 is a partial cross-sectional view of a display substrate after first and second through holes are formed according to at least one embodiment of the present disclosure.

[0172] In some exemplary embodiments, as shown in FIGS. 9 and 10 , in a plane perpendicular to the display substrate, the flexible base substrate 10 in the hole region 300 has a first through hole K1. The first through hole K1 penetrates the flexible base substrate 10. In this example, the composite insulating layer is an inorganic composite insulating layer including multiple inorganic layers. The composite insulating layer has a second through hole K2 corresponding to the first through hole K1. The second through hole K2 penetrates the inorganic composite insulating layer and then to the first through hole K1. The inorganic composite insulating layer includes a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, a fourth insulating layer 14, and a fifth insulating layer 15 laminated on the flexible base substrate 10. A first through hole K21 is formed in the first insulating layer 11, a second through hole K22 is formed in the second insulating layer 12, a third through hole K23 is formed in the third insulating layer 13, a fourth through hole K24 is formed in the fourth insulating layer 14, and a fifth through hole K25 is formed in the fifth insulating layer 15. The first through hole K21 to the fifth through hole K25 are connected to each other to form a second through hole K2. The sizes of the first through hole K21 to the fifth through hole K25 increase sequentially. The cross-sectional shape of the second through hole K2 may be an inverted trapezoid.

[0173] In some exemplary embodiments, as shown in FIG. 10 , the first through hole K1 includes a first sub-through hole K11 and a second sub-through hole K12 that communicate with each other. The first sub-through hole K11 penetrates the first through hole K21. The orthogonal projection of the first sub-through hole K11 on the glass substrate 60 is located within the orthogonal projection of the second sub-through hole K12 on the glass substrate 60. The size of the second sub-through hole K12 gradually increases along the side closer to the glass substrate 60. For example, the cross-sectional shape of the second sub-through hole K12 may be trapezoidal, and the cross-sectional shape of the first sub-through hole K11 may be rectangular. However, this embodiment is not limited thereto.

[0174] 10, the maximum distance L3 between the sidewall of the first sub-through hole K11 and the sidewall of the second sub-through hole K12 on the same side may be 0.3 μm or more, for example, about 0.3 μm or 0.5 μm, but the present embodiment is not limited thereto.

[0175] In some exemplary embodiments, as shown in FIGS. 9 and 10 , the orthogonal projection of the first insulating layer 11 of the inorganic composite insulating layer on the flexible base substrate 10 overlaps with the orthogonal projection of the second sub-through-hole K12 on the flexible base substrate 10. In the hole region 300, the second sub-through-hole K12 forms an undercut structure, thereby cutting the organic light-emitting layer 32 and the cathode 33 within the first through-hole K1. The organic light-emitting layer 32 and the cathode 33 cover only the sidewall of the first sub-through-hole K11 within the first through-hole K1, but do not cover the sidewall of the second sub-through-hole K12. The package layer may include a stacked first inorganic package layer 41 and a second inorganic package layer 43. Both the first inorganic package layer 41 and the second inorganic package layer 43 cover the sidewall of the second through-hole K2 and the sidewall of the first sub-through-hole K11, but do not contact the sidewall of the second sub-through-hole K12. In this example, the package layer and the glass substrate 60 are not completely bonded together, and it is possible to prevent the package layer from bursting and becoming useless when the glass substrate 60 is peeled off.

[0176] For the remaining structure and manufacturing process of the display substrate of this embodiment, please refer to the description of the previous embodiment, and the description will not be repeated here.

[0177] The structure (or method) shown in this embodiment may be combined as appropriate with the structure (or method) shown in other embodiments.

[0178] Fig. 11 is another partial cross-sectional view of a display substrate according to at least one embodiment of the present disclosure. Fig. 12 is a partial cross-sectional view of a display substrate after first and second through holes are formed according to at least one embodiment of the present disclosure.

[0179] In some exemplary embodiments, as shown in FIGS. 11 and 12 , in a plane perpendicular to the display substrate, the flexible base substrate 10 in the hole region 300 has a first through hole K1. The first through hole K1 penetrates the flexible base substrate 10. In this example, the composite insulating layer is an inorganic composite insulating layer including multiple inorganic layers. The inorganic composite insulating layer has a second through hole K2 corresponding to the first through hole K1. The second through hole K2 penetrates the inorganic composite insulating layer and then to the first through hole K1. The inorganic composite insulating layer includes a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, a fourth insulating layer 14, and a fifth insulating layer 15 laminated on the flexible base substrate 10. A first through hole K21 is formed in the first insulating layer 11, a second through hole K22 is formed in the second insulating layer 12, a third through hole K23 is formed in the third insulating layer 13, a fourth through hole K24 is formed in the fourth insulating layer 14, and a fifth through hole K25 is formed in the fifth insulating layer 15. The first through hole K21 to the fifth through hole K25 are connected to each other to form a second through hole K2. The sizes of the first through holes K21 to the fifth through holes K25 increase sequentially. The cross-sectional shape of the second through hole K2 may be an inverted trapezoid. The orthogonal projection of the first through hole K21 on the flexible base substrate 10 is located at the orthogonal projection of the first through hole K1 on the flexible base substrate. The cross-sectional shape of the first through hole K1 may be rectangular.

[0180] 12, the maximum distance L4 between the sidewall of the first through hole K21 and the sidewall of the first through hole K1 on the same side may be 0.3 μm or more, for example, about 0.3 μm or 0.4 μm, but the present embodiment is not limited thereto.

[0181] In some exemplary embodiments, as shown in FIGS. 11 and 12 , the size of the first through-hole K21 in the hole region 300 is set smaller than the size of the first through-hole K1, thereby forming an undercut structure, and thereby the organic light-emitting layer 32 and the cathode 33 are cut within the first through-hole K1. The package layer includes a stacked first inorganic package layer 41 and a second inorganic package layer 43. The first inorganic package layer 41 covers the sidewalls of the second through-hole K2 and the first through-hole K1 and is cut at the boundary between the first through-hole K1 and the first through-hole K21. The second inorganic package layer 43 may continuously cover the sidewalls of the second through-hole K2 and the first through-hole K1. In this example, the first inorganic package layer is cut within the first through-hole K1, thereby weakening the package at the first through-hole K1 and preventing the package layer from cracking and becoming ineffective when the flexible base substrate is peeled off from the glass substrate.

[0182] For the remaining structure and manufacturing process of the display substrate of this embodiment, please refer to the description of the previous embodiment, and the description will not be repeated here.

[0183] The structure (or method) shown in this embodiment may be combined as appropriate with the structure (or method) shown in other embodiments.

[0184] FIG. 13 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. As shown in FIG. 13, this embodiment provides a display device 91, which includes a display substrate 910. The display substrate 910 is a display substrate according to the previous embodiment. In some examples, the display substrate 910 may be an OLED display substrate. The display device 91 may be any product or component having a display function, such as an OLED display device, a mobile phone, a tablet PC, a television, a display, a notebook PC, a digital photo frame, a navigation system, an in-vehicle display, a wristwatch, a bracelet, etc. However, this embodiment is not limited thereto.

[0185] In describing the embodiments of the present disclosure, the orientations or positional relationships indicated by terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. are based on the orientations or positional relationships shown in the drawings, and are merely for the purpose of explaining and simplifying the present disclosure, and do not expressly or imply that the indicated devices or elements necessarily have a particular orientation or are constructed and operated in a particular orientation, and therefore should not be understood as limitations on the present disclosure.

[0186] Although the embodiments disclosed in the present disclosure are as above, the contents of the description are merely embodiments adopted for understanding the present disclosure and are not intended to limit the present disclosure. Those skilled in the art may make modifications and changes in the implementation form and details without departing from the spirit and scope disclosed in the present disclosure, but the patent protection scope of the present disclosure should be in accordance with the scope described in the claims. [Explanation of symbols]

[0187] 10 Flexible base substrate 11 First insulating layer 12 Second insulating layer 13 Third insulating layer 14 Fourth insulating layer 15 5th insulating layer 16 1st flat layer 17 Second flat layer 18 Passivation layer 23 Signal line 40 Package Layer 50 Buffer Protection Layer 60 Glass substrate 100 pixel island area 200 Connection Bridge Area 300 hole area

Claims

1. A display substrate comprising a flexible base substrate, a first filling layer, and a packaging layer; the flexible base substrate has at least one extended display area, the extended display area including a plurality of pixel island areas separated from each other, a plurality of hole areas, and a connecting bridge area located between the pixel island areas and the hole areas, and at least one hole area is provided with one or more first through-holes penetrating the flexible base substrate; the first filling layer is located in the hole region and filled in the first through-hole; the package layer is located on a side of the first filling layer that is away from the flexible base substrate, and an orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap the first filling layer; The hole region further comprises a composite insulating layer laminated on the flexible base substrate, the composite insulating layer having a second through hole; The display substrate further includes a second filling layer located in the hole region, the second filling layer filling the second through-hole; the second filling layer is in contact with the first filling layer, an orthogonal projection of the second filling layer on the flexible base substrate at least partially overlaps with an orthogonal projection of the first filling layer on the flexible base substrate, and an orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap with an orthogonal projection of the second filling layer on the flexible base substrate; The display substrate further comprises a second flat layer located in the pixel island region and the connecting bridge region, and the second flat layer and the second filling layer have the same layer structure and are made of the same material.

2. 2. The display substrate of claim 1, further comprising a first planar layer located in the pixel island region and the connecting bridge region, the first planar layer and the first filling layer having the same layer structure and the same material, and the second planar layer located on the side of the first planar layer away from the flexible base substrate.

3. the second through holes extend through the composite insulating layer and into the corresponding first through holes; The display substrate of claim 1 , wherein the composite insulating layer comprises at least one inorganic layer, or at least one organic layer, or at least one inorganic layer and at least one organic layer.

4. The display substrate according to claim 1 , wherein a surface of the second filling layer facing away from the flexible base substrate and a surface of the composite insulating layer facing away from the flexible base substrate are aligned.

5. The display substrate according to claim 1 , wherein the cross-sectional shape of the second through hole in a direction perpendicular to the display substrate is an inverted trapezoid.

6. The display substrate according to claim 2 , wherein a surface of the first filling layer and a surface of the flexible base substrate are flush with each other.

7. The display substrate of claim 3, wherein the at least one hole region is provided with a second separation groove formed in the flexible base substrate and the first filling layer, the second separation groove penetrates into a second through hole of the composite insulating layer, at least one insulating layer in the composite insulating layer has a second extension portion, the orthogonal projection of the second extension portion on the flexible base substrate is located within the orthogonal projection of the second separation groove on the flexible base substrate, and the orthogonal projection of the second separation groove on the flexible base substrate covers the orthogonal projection of the first filling layer on the flexible base substrate.

8. further comprising a passivation layer located on a side of the second planar layer away from the flexible base substrate; 3. The display substrate of claim 2, wherein the connecting bridge region has a first separation groove formed through the passivation layer and a portion of the second planar layer, the passivation layer having a first extension portion, and the orthogonal projection of the first extension portion on the flexible base substrate is located within the orthogonal projection of the first separation groove on the flexible base substrate.

9. The display substrate of claim 1 , wherein the package layer comprises a first inorganic package layer, an organic package layer, and a second inorganic package layer that are stacked.

10. A display device comprising the display substrate according to claim 1.

11. A method for manufacturing a display substrate, the display substrate comprising at least one extended display area, the extended display area including a plurality of pixel island areas separated from each other, a plurality of hole areas, and connecting bridge areas located between the pixel island areas and the hole areas; The manufacturing method includes: forming one or more first through holes through the flexible base substrate in the hole region; forming a composite insulating layer on the flexible base substrate and forming a second through hole in the composite insulating layer in the hole region; forming a first filling layer in the hole region to fill the first through-hole; forming a second flat layer in the pixel island region and the connecting bridge region, and forming a second filling layer in the hole region, the second filling layer filling the second through-hole and contacting the first filling layer, the orthogonal projection of the second filling layer on the flexible base substrate at least partially overlapping with the orthogonal projection of the first filling layer on the flexible base substrate, and the orthogonal projection of the package layer on the flexible base substrate partially overlapping or not overlapping with the orthogonal projection of the second filling layer on the flexible base substrate; A method for manufacturing a display substrate, comprising: forming a package layer, and an orthogonal projection of the package layer on the flexible base substrate partially overlaps or does not overlap the first filler layer.

12. The manufacturing method of claim 11 , further comprising: forming a first planarization layer in the pixel island region and the connecting bridge region simultaneously with forming the first filling layer in the hole region.

13. The method of claim 11 , wherein the second vias extend through the composite insulating layer and into corresponding first vias.

14. The manufacturing method described in claim 13, wherein the surface of the second filling layer facing away from the flexible base substrate and the surface of the composite insulating layer facing away from the flexible base substrate are aligned, and the cross-sectional shape of the second through hole in a direction perpendicular to the display substrate is an inverted trapezoid.

15. The manufacturing method described in claim 13 further includes, after forming the first filling layer in the hole area, forming a second isolation groove in the hole area that penetrates the composite insulating layer, a portion of the second flat layer, and a portion of the flexible base substrate, wherein the second isolation groove penetrates a second through hole of the composite insulating layer, at least one insulating layer in the composite insulating layer has a second extension portion, the orthogonal projection of the second extension portion on the flexible base substrate is located within the orthogonal projection of the second isolation groove on the flexible base substrate, and the orthogonal projection of the second isolation groove on the flexible base substrate covers the orthogonal projection of the first filling layer on the flexible base substrate.

16. A display substrate comprising a flexible base substrate; the flexible base substrate has at least one extended display area, the extended display area including a plurality of pixel island areas separated from each other, a plurality of hole areas, and a connecting bridge area located between the pixel island areas and the hole areas, and at least one hole area is provided with one or more first through-holes penetrating the flexible base substrate; The hole region further comprises a composite insulating layer laminated on the flexible base substrate, the composite insulating layer having a second through hole, the second through hole penetrating the composite insulating layer and penetrating the corresponding first through hole, and a first flat layer and a second flat layer are formed in the pixel island region and the connecting bridge region; A display substrate, wherein an orthogonal projection of the composite insulating layer on the flexible base substrate overlaps with an orthogonal projection of the first through hole on the flexible base substrate.

17. the composite insulating layer includes a first insulating layer in contact with the flexible base substrate, and the second through hole includes a first through hole opened in the first insulating layer; The display substrate of claim 16 , wherein an orthogonal projection of the first through-hole on the flexible base substrate is located within an orthogonal projection of the first penetrating hole on the flexible base substrate.

18. The display substrate of claim 17 , further comprising a packaging layer located on a side of the composite insulating layer away from the flexible base substrate, the packaging layer covering the side walls of the first through hole and the second through hole in the hole region.

19. the first through hole includes a first sub-through hole and a second sub-through hole that communicate with each other, the first sub-through hole penetrating into the second through hole; The display substrate of claim 16 , wherein an orthogonal projection of the first through-hole sub-hole on the flexible base substrate is located within an orthogonal projection of the second through-hole sub-hole on the flexible base substrate.

20. The display substrate of claim 19, further comprising a package layer located on a side of the composite insulating layer away from the flexible base substrate, the package layer covering the side walls of the first sub-through hole and the second through hole in the hole region.

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