IC card and method of manufacturing the same

Abstract

To provide an IC card capable of suppressing abuse by replacement of an IC module with a simple configuration.SOLUTION: The IC card 1 is provided with a card base body 2 and an IC module 70 arranged in a recessed part 9. The IC module 70 includes a substrate 72, external connection terminals 71, an IC chip 74, and separation detection terminals 53a. Peeling detection contacts 51 and peeling detection input terminals 53a provided on a card base body 2 are overlapped and separated from each other in the plan view of the card base body 2, and an IC (integrated circuit) chip determines whether a peeling detection circuit 50 constituting capacitance components is in a first state or a second state. The IC chip determines the first state when the peeling detection circuit 50 has a capacitance within a predetermined range, and determines the second state when the peeling detection circuit 50 does not have a capacitance within the predetermined range. In the second state, the IC chip restricts at least a part of processing which is possible in the first state.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an IC card capable of contact communication with an external device. [Background technology]

[0002] Conventionally, contact IC cards that input and output electrical signals through external connection terminals on the surface of the card and contactless IC cards that input and output electrical signals through an antenna using electromagnetic induction or the like have been widely used as IC cards. In addition to these, dual interface IC cards that combine the functions of a contact IC card and a contactless IC card with a single IC chip are also in use. In particular, contact IC cards and dual interface IC cards are configured such that an IC module equipped with an IC chip is embedded and fixed in a predetermined recess in the card base so that the external connection terminals of the IC module are exposed on the surface of the card base.

[0003] Incidentally, since contact IC cards and dual interface IC cards have a portion of the IC module exposed, it is relatively easy to remove the IC module from the card base by, for example, dissolving the adhesive that secures the IC module to the card base. For example, suppose someone removes IC module a from IC card A, removes IC module b from another IC card B, and inserts IC module a into the card base of IC card B. This allows a malicious third party, who is not the owner of IC card A, to use a counterfeit IC card B. Because IC card B is equipped with IC module a that stores the owner's information, the malicious third party can masquerade as the owner and misuse IC card B.

[0004] In order to prevent the misuse of IC cards that can communicate with external devices through an external connection terminal by replacing the IC module as described above, for example, Patent Document 1 describes the following IC card. That is, this IC card has a magnetic material attached to a part of the IC module, and the magnetic material can be detected from the outer surface of the card to verify the authenticity of the IC module. This makes it possible to verify the authenticity of the IC chip by detecting the magnetic material attached to the IC module, thereby providing a highly secure IC card that prevents counterfeiting, data tampering, etc. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 7-306924 Summary of the Invention [Problem to be solved by the invention]

[0006] In this way, in an IC card that is capable of contact communication with an external device via an external connection terminal, it is desirable to be able to prevent misuse by replacing the IC module with a relatively simple configuration.

[0007] The present disclosure has been made in consideration of this situation, and aims to provide an IC card and a manufacturing method thereof that can prevent misuse by replacing the IC module with a relatively simple configuration in an IC card that is capable of contact communication with external devices through an external connection terminal. [Means for solving the problem]

[0008] A first configuration of an IC card capable of contact communication with an external device according to this embodiment comprises a card body and an IC module arranged in a recess of the card body, the IC module comprising a substrate, an external connection terminal formed on one side of the substrate, an IC chip arranged on the other side of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip, the external connection terminal being arranged so as to be exposed on the surface of the card body, the card body being provided with a peeling detection contact which is an electric conductor, and the peeling detection contact and the peeling detection input terminal being arranged so as to partially overlap each other in a plan view of the card body and to be spaced apart from each other. The peel detection input terminal and the peel detection contact constitute a capacitance component, and the IC chip determines that the peel detection circuit constituted by the IC chip, the peel detection input terminal, and the peel detection contact is in a first state or a second state different from the first state. If the peel detection circuit has a capacitance within a predetermined range, the IC chip determines that the peel detection circuit is in the first state, and if the peel detection circuit does not have a capacitance within the predetermined range, the IC chip determines that the peel detection circuit is in the second state, and when the peel detection circuit is in the second state, the IC chip restricts at least some of the processes that are possible when the peel detection circuit is in the first state.

[0009] In addition, an IC card according to a second configuration of another embodiment of the present invention may be configured such that, in the first configuration, the peeling detection input terminal is a terminal of the external connection terminal that is not used for contact communication, and an insulating layer may be laminated on the surface of the terminal that is not used for contact communication.

[0010] In addition, in an IC card according to a third configuration of another embodiment of the present invention, in the first or second configuration, whether the IC card is in the first state or the second state may be determined by the IC chip of the peel detection circuit by charging a predetermined amount of electric charge from the IC chip and then measuring the capacitance of the peel detection input terminal and the peel detection contact.

[0011] In addition, an IC card according to a fourth configuration of another form of this embodiment may be such that, in the first or second configuration, the IC chip has a built-in switch that opens and closes a part of the peel detection circuit, and whether the IC chip is in the first state or the second state may be determined by the IC chip charging a predetermined amount of electric charge from the IC chip of the peel detection circuit to the peel detection input terminal, then opening the switch and measuring the capacitance of the peel detection circuit.

[0012] In addition, an IC card according to a fifth configuration of another embodiment of this invention is any one of the first to fourth configurations, wherein the IC card is a dual interface IC card further capable of contactless communication with an external device, and includes an antenna arranged inside the card base, the antenna having an antenna wire and multiple ends, the multiple tips of the antenna wire and the multiple ends being electrically connected to each other, and a portion of the end being exposed in the recess of the card base when the IC module is removed, and the IC module further includes multiple terminals arranged on the other surface of the substrate, and the multiple terminals are electrically connected to corresponding multiple ends on the surface of the end facing the opening side of the recess.

[0013] In addition, an IC card according to a sixth configuration of another embodiment of the present invention may be an IC card according to the fifth configuration, wherein the plurality of ends are bellows portions formed by a repeated folding structure from the outer periphery of the recess toward the center by the conductive plate or the antenna wire.

[0014] In addition, an IC card according to a seventh configuration of another embodiment of the present invention may be configured such that, in the fourth configuration, the plurality of ends and the peeling detection contacts are all formed from the conductive plate of the same material, or are all formed from the bellows portion of the same material.

[0015] A method for manufacturing an IC card capable of contact communication with an external device, according to an eighth configuration of this embodiment, includes the steps of: preparing a card base provided with a peeling detection contact that is a conductor; and an IC module, the IC module including a substrate, an external connection terminal formed on one side of the substrate, an IC chip disposed on the other side of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip; forming a recess in the card base for embedding the IC module; and embedding the IC module in the recess in the card base so that the external connection terminal is exposed on the surface of the card base, the peeling detection contact and the peeling detection input terminal partially overlap each other in a plan view of the card base and are spaced apart from each other. and a step of embedding the IC module in the recess of the card base so that the peeling detection input terminal and the peeling detection contact constitute a capacitance component, the IC chip determining that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state, and if the peeling detection circuit has a capacitance within a predetermined range, the IC chip determining that the peeling detection circuit is in the first state, and if the peeling detection circuit does not have a capacitance within the predetermined range, the IC chip determining that the peeling detection circuit is in the second state, and when in the second state, the IC chip restricts at least some of the processes that are possible when the peeling detection circuit is in the first state. [Effects of the Invention]

[0016] According to this embodiment, it is possible to provide an IC card capable of contact communication with an external device through an external connection terminal, which has a relatively simple configuration and can prevent misuse by replacing the IC module, and a method for manufacturing the same. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a plan view illustrating the structure of a dual interface IC card according to a first embodiment. [Figure 2] 2A and 2B are enlarged plan and bottom views of the IC module. [Figure 3] 2 is a cross-sectional view showing a cross section taken along line AA and line BB in FIG. 1. [Figure 4] 10 is an enlarged plan view of the vicinity of the recess of the card base when the IC module is removed. FIG. [Figure 5] FIG. 2 is another functional block diagram illustrating the functional configuration of the IC card according to the first embodiment. [Figure 6] FIG. 3 is a flowchart showing the operation of the IC card according to the first embodiment. [Figure 7] FIG. 10 is a flowchart showing another operation of the IC card according to the first embodiment. [Figure 8] 10 is an enlarged plan view corresponding to FIG. 2 of an IC module of a contact IC card according to a second embodiment. FIG. [Figure 9] FIG. 10 is a plan view illustrating the structure of a dual interface IC card according to a third embodiment. [Figure 10] 10 is a cross-sectional view showing a cross section taken along line CC and line DD in FIG. 9. [Figure 11] 10 is an enlarged plan view of the vicinity of the recess of the card base when the IC module is removed. FIG. [Figure 12] FIG. 10 is a plan view illustrating the structure of a contact IC card according to a fourth embodiment. [Figure 13] 10A and 10B are an enlarged plan view of an IC module of a contact IC card according to a fourth embodiment, corresponding to FIG. 2, and a cross-sectional view showing a cross section taken along line EE. DETAILED DESCRIPTION OF THE INVENTION

[0018] An example of an IC card according to the present disclosure will be described below with reference to the drawings, etc. However, the IC card according to the present disclosure is not limited to the embodiments and examples described below.

[0019] The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Furthermore, hatching indicating the cross section of a member is omitted as appropriate in each figure. The numerical values ​​such as dimensions of each member and the names of materials described in this specification are examples of embodiments and are not limited to these, and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same state.

[0020] 1. First embodiment An example of a first embodiment of an IC card of the present disclosure will be described. The IC card 1 of this embodiment is a dual-interface IC card. For convenience of explanation, an XYZ coordinate system is set for the IC card 1. First, as shown in FIG. 1, 3(a), 3(b), etc., the Z axis is taken as the normal direction of the main surface of the IC card 1. The direction from the main surface on which the external connection terminals 71 of the IC module 70 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0021] When IC card 1 is viewed from the +Z direction, the line perpendicular to both short sides of IC card 1 and the Z axis is defined as the X axis. The direction from one short side closer to external connection terminal 71 toward the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. The axis perpendicular to the X and Z axes is defined as the Y axis, and the direction from one long side farther from external connection terminal 71 toward the other long side is defined as the +Y direction or upward direction, and the opposite direction is defined as the -Y direction or downward direction.

[0022] FIG. 1 is a plan view of the IC card 1 as viewed from the +Z direction. FIG. 2(a) is an enlarged plan view illustrating the internal configuration of the IC module 70 of the IC card 1 of FIG. 1, with the IC chip 74a, molded portion 74b, wires 75, and other components located on the -Z direction side of the external connection terminal 71, i.e., the back side of the page, indicated by dashed lines. FIG. 2(b) is an enlarged bottom view of the IC module 70 of FIG. 2(a) as viewed from the -Z direction, i.e., the back side, without the card base 2. FIG. 3(a) is a cross-sectional view of the IC card 1 of FIG. 1 taken along line AA parallel to the X axis, as viewed from the -Y direction. FIG. 3(b) is a cross-sectional view of the IC card 1 of FIG. 1 taken along line BB parallel to the Y axis, as viewed from the +X direction. FIG. 4 is an enlarged plan view illustrating the configuration of the card base 2 of FIG. 1 without the IC module 70.

[0023] As shown in FIG. 1, IC card 1 has a generally rectangular thin plate shape with rounded corners in a plan view from the +Z direction. An IC module 70 including an external connection terminal 71 is disposed on the surface of the dual-interface IC card on the +Z direction side, slightly to the upper left of the center, i.e., closer to the -X direction and closer to the +Y direction than the center. As shown in FIGS. 1, 3(a), and 3(b), IC module 70 is embedded in a recess 9 formed in card base 2, and is disposed so that the surface of external connection terminal 71 on the +Z direction side is substantially flush with the surface of card base 2 on the +Z direction side. This configuration of IC card 1 complies with ISO / IEC 7816-1, an international IC card standard. As shown in FIG. 1, each external terminal section of external connection terminal 71 is defined in accordance with ISO / IEC 7816-2 and ISO / IEC 7816-3.

[0024] This standard specifies the following external terminals: C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal). Note that the C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. Note that the C1, C2, C3, C5, and C7 terminals may be abbreviated as VCC, RST, CLK, GND, and I / O, respectively.

[0025] 2(b), a plurality of pads 74p are formed on the IC chip 74a, and each of the plurality of pads 74p on the IC chip 74a is electrically connected to terminals C1, C2, C3, C5, and C7 of the external connection terminals 71 via conductive wires 75. Two of the pads 74p on the IC chip 74a other than those mentioned above are electrically connected to antenna connection terminals 73a and 73b formed on the surface of the substrate 72 opposite the external connection terminals 71 via conductive wires 75. Pads 74q and 74r on the IC chip 74a other than those mentioned above are electrically connected to peeling detection input terminals 53a and 53b formed on the surface of the substrate 72 opposite the external connection terminals 71 via conductive wires 75. The antenna connection terminals may be simply referred to as terminals.

[0026] As shown in FIG. 1 and FIG. 3(a), the antenna connecting terminal 73a is electrically connected to the conductive first plate 110 via the conductive adhesive layer 11. The first plate 110 is welded to one end of the antenna wire 83. Furthermore, although not shown in FIG. 3(a), the antenna connecting terminal 73b is also electrically connected to the conductive second plate 120 via the conductive adhesive layer 11, and the second plate 120 is welded to the other end of the antenna wire 83. As a result, the antenna connecting terminals 73a and 73b are electrically connected to both ends of the antenna wire 83, respectively.

[0027] On the other hand, as shown in FIGS. 1 and 3(b), the peeling detection input terminal 53a is positioned opposite the peeling detection contact 51, which is a conductive plate, via the non-conductive adhesive layer 13. The peeling detection contact 51 and the peeling detection input terminal 53a are partially overlapping and spaced apart when viewed in a plan view of the card base 2 along the Z-axis direction. The peeling detection contact 51 and the peeling detection input terminal 53a being spaced apart refers to a state in which the peeling detection contact 51 and the peeling detection input terminal 53a are not in direct contact with each other, but rather there is a gap between them or some kind of insulating material is sandwiched between them, separating their end faces by a certain distance. In this embodiment, the insulating material can be the adhesive layer 13 made of an insulating adhesive. The certain distance between their end faces can be, for example, 0.01 mm or more and 0.5 mm or less.

[0028] The peeling detection contact 51 and the peeling detection input terminal 53a are not in direct contact. Furthermore, although not shown in FIG. 3(b), the peeling detection input terminal 53b is also disposed opposite the peeling detection contact 51, which is a conductive plate, via the adhesive layer 13. The peeling detection contact 51 and the peeling detection input terminal 53b are partially overlapping and spaced apart when viewed in plan of the card base 2 along the Z-axis direction. The peeling detection contact 51 and the peeling detection input terminal 53b are not in direct contact. In other words, the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are partially overlapping and spaced apart from each other.

[0029] As a result, the pads 74p of the IC chip 74a and the antenna connecting terminals 73a and 73b are electrically connected to each other via the wires 75, and the antenna connecting terminal 73a is electrically connected to one end of the antenna 80 via the conductive adhesive layer 11 and the first plate 110. The antenna connecting terminal 73b is electrically connected to the other end of the antenna 80 via the conductive adhesive layer 11 and the second plate 120. As a result, the IC chip 74a and the antenna 80 can form a closed communication circuit.

[0030] On the other hand, pad 74q of IC chip 74a and peeling detection input terminal 53a are electrically connected via wire 75, and pad 74r and peeling detection input terminal 53b are electrically connected via wire 75. Furthermore, peeling detection input terminals 53a and 53b are each mechanically connected to peeling detection contact 51 via adhesive layer 13. However, peeling detection input terminals 53a and 53b at least partially overlap peeling detection contact 51, and peeling detection input terminals 53a and 53b are disposed at a distance from peeling detection contact 51.

[0031] Here, Fig. 5(a) is a functional block diagram showing the functional configuration of the IC card 1, and Fig. 5(b) is a functional block diagram showing the detailed functional configuration of the CPU 210 in Fig. 5(a). Also, Fig. 6 is an example of a flow diagram showing the operation of the IC card 1.

[0032] As shown in FIG. 5(a), the IC card includes a detachment detection circuit 50 that detects whether the IC module 70 has been detached from the card body 2. The detachment detection circuit 50 is composed of an IC chip 74a and external wiring connected to pads 74q and 74r of the IC chip 74a. As shown in FIG. 5(b), the CPU 210 of the IC chip 74a includes an internal switch control unit 330 that opens and closes the detachment detection circuit 50, and a capacitance measurement unit 310 that measures the capacitance of the detachment detection input terminals 53a and 53b of the detachment detection circuit 50 and the detachment detection contact 51, which function as a capacitance element. The CPU 210 also includes a state determination unit 320 that determines whether the IC chip 74a has been detached from the card body 2 based on the measurement results of the capacitance measurement unit 310. Note that hereinafter, capacitance may also be simply referred to as capacitance.

[0033] The state determination unit 320 of the IC chip 74a determines whether the peel detection circuit 50 is in a first state or a second state different from the first state when the peel detection contact 51 and the peel detection input terminals 53a and 53b satisfy a predetermined relationship. If the peel detection circuit 50 has a capacitance within a predetermined range, the state determination unit 320 determines that the peel detection circuit 50 is in the first state. If the peel detection circuit 50 does not have a capacitance within the predetermined range, the state determination unit 320 determines that the peel detection circuit 50 is in the second state. The capacitance within a predetermined range may refer to, for example, an upper threshold value or a lower threshold value of the capacitance value, and the measurement result of the capacitance measurement unit 310 is a capacitance value that does not exceed the upper threshold value or does not fall below the lower threshold value. Alternatively, a capacitance within a predetermined range can refer to, for example, a capacitance value in which a first threshold value representing the upper limit of the capacitance value and a second threshold value representing the lower limit are predetermined, and the measurement result of the capacitance measuring unit 310 is a capacitance value that falls between the first threshold value and the second threshold value.

[0034] Whether the removal detection circuit 50 of the IC card 1 is in the first state or the second state can be determined, for example, by the operation flow of the IC card 1 shown in FIG. 6. That is, the internal switch of the removal detection circuit 50 is turned ON (step S402 in FIG. 6). Then, the capacitance element formed by the removal detection input terminals 53a and 53b and the removal detection contact 51 of the removal detection circuit 50 is charged (step S403). Thereafter, the capacitance measurement unit 310 measures the capacitance of the removal detection circuit 50 (step S404). If the measured capacitance of the removal detection circuit 50 is within a predetermined capacitance range (step S405), the state determination unit 320 determines that the IC card 1 is a normal card (step S406). On the other hand, if the measured capacitance of the removal detection circuit 50 is not within the predetermined capacitance range (step S405), the state determination unit 320 determines that the IC card 1 is an unauthorized card (step S408).

[0035] Assuming that the IC module 70 has not been removed from the card base 2 of the IC card 1, there will be no change in the constituent materials or positional relationship of the capacitive elements formed by the peeling detection input terminals 53a and 53b and the peeling detection contact 51. Therefore, the capacitance of the peeling detection circuit 50 when an electric charge is applied from the IC chip 74a will be dominated by the capacitance of the capacitive elements formed by the peeling detection input terminals 53a and 53b and the peeling detection contact 51, and should be within a predetermined range of capacitance that a typical original IC card 1 has.

[0036] On the other hand, if the IC module 70 is peeled off from the card base 2 of the IC card 1 and then reattached or embedded in another card, it is thought that there will be changes in the constituent materials and positional relationship of the capacitive elements formed by the peel detection input terminals 53a and 53b and the peel detection contact 51. Therefore, it is presumed that the capacitance of the peel detection circuit 50 when charged by the IC chip 74a will deviate significantly from the predetermined range of capacitance that the original typical IC card 1 has.

[0037] As described above, if the peeling detection circuit 50 has a capacitance within a predetermined range, the IC chip 74a determines that the peeling detection circuit 50 is in a first state. If the peeling detection circuit 50 does not have a capacitance within the predetermined range, the IC chip 74a determines that the peeling detection circuit 50 is in a second state. The first state is a state in which the IC card 1 is considered to be a normal card, and the second state is a state in which the IC card 1 is considered to be an unauthorized card. Therefore, if the IC card 1 is determined to be in the second state, the IC chip 74a can restrict at least some of the processing in response to signals from the reader / writer (step S409). That is, in the second state, the IC chip 74a restricts at least some of the processing that is possible when the peeling detection circuit 50 is in the first state.

[0038] This makes it possible to prevent the misuse of fraudulent cards by restricting the processing of IC cards 1 that are suspected to be fraudulent. In this way, the IC card 1 of the present disclosure is an IC card that is capable of contact communication with external devices via the external connection terminal 71, and can prevent misuse by replacing the IC module with a relatively simple configuration.

[0039] The configuration of the IC card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0040] (a) Card base The card base 2 refers to the card body excluding the IC module 70 that constitutes the IC card 1. As shown in Figures 3(a) and 3(b), the card base 2 typically has a configuration in which an over-sheet layer 8, a core layer 7, antenna holding layers 6 and 5, a core layer 4, and an over-sheet layer 3 are laminated in this order from one end on the -Z direction side in the thickness direction. In addition, an antenna 80 is arranged between the antenna holding layers 6 and 5, and includes an antenna wire 83 wound in a loop shape and formed from a coated conductor wire or the like, and a plate-shaped end portion 100.

[0041] The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card without the antenna 80 and the card including the antenna 80. In addition, both ends of the antenna wire 83 of the antenna 80 are electrically connected to a first plate 110 on the -X direction side and a second plate 120 on the +X direction side, which are arranged along the X axis direction. The first plate 110 and the second plate 120 are each element of the end portion 100.

[0042] In this embodiment, for convenience of explanation, the antenna wire 83 of the antenna 80 is described as a single conductor wire wound in a loop shape without branches, etc. However, the present disclosure is not limited to this and includes antenna wires 83 that are appropriately branched and have three or more ends. Furthermore, three or more plate-shaped end portions 100 can also be arranged depending on the number of ends of the antenna wires 83.

[0043] The layer structure of the card base 2 is not limited to the above, and may be a three-layer structure of an over-sheet layer, an antenna holding layer, and an over-sheet layer, or a two-layer structure of an antenna holding layer and an antenna holding layer. Alternatively, the layer structure of the card base 2 may be a multi-layer structure of eight or more layers, such as an over-sheet layer, a core layer, an inner layer, an antenna holding layer, an antenna holding layer, an inner layer, a core layer, and an over-sheet layer. Furthermore, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 3 or 8 of the card base 2 opposite the core layer 4 or 7, or printing may be applied to the surface of the core layer 4 or 7 adjacent to the over-sheet layer 3 or 8.

[0044] From the standpoint of conforming to standards such as ISO / IEC 7816-1, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0045] (i) Core layer The core layer is also referred to as the inner layer. A wide variety of white or colored plastic sheets can be used for the core layers 4 and 7, including the following single films or composite films: polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core layers 4 and 7 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0046] (ii) Antenna support layer The antenna holding layer, like the core layer, is also referred to as the inner layer. Antenna holding layers 5 and 6 have the function of sandwiching and holding antenna 80, and a wide variety of plastic sheets can be used, similar to those used for core layers 4 and 7. Antenna holding layers 5 and 6 may be made of the same material as core layers 4 and 7, or may be made of a different material. The thickness of antenna holding layers 5 and 6 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0047] (iii) Oversheet layer The over-sheet layers 3 and 8 are typically made of the same material as the core layer and antenna holding layer, but a transparent material with a thickness of approximately 0.05 mm or more and 0.18 mm or less is often used. From the viewpoint of preventing curling when the laminate of the core layer, antenna holding layer, and over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 8 have the same thickness, but they do not necessarily have to be the same. This also applies to the core layers 4 and 7 and the antenna holding layers 5 and 6 described above.

[0048] The material of the over-sheet layer may be any material that is heat-adhesive. However, even if the over-sheet layer itself is not heat-adhesive, the core layer and the over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated between them. Furthermore, when IC card 1 is used as a magnetic card, a magnetic stripe may be embedded in advance in one or both of over-sheet layers 3 and 8 by thermal transfer or the like on the main surface opposite to both or one of core layers 4 and 7.

[0049] (iv) Antenna sheet In this embodiment, as described below, an antenna 80 is formed on one surface of the antenna holding layer 5 or 6, and both ends of an antenna wire 83 constituting the antenna 80 are electrically connected to a first plate 110 and a second plate 120, which are plate-shaped conductive end portions 100. Formation of the antenna 80 on the antenna holding layer 5 or 6 is performed, for example, as follows. First, the first plate 110 and the second plate 120 are adhered and fixed to the surface of the antenna holding layer 6 facing the antenna holding layer 5 before lamination by applying heat and pressure or the like. At this time, an adhesive may be applied to the surface of the antenna holding layer 6 before the first plate 110 and the second plate 120 are placed. The first plate 110 and the second plate 120 are aligned in the left-right direction at the intended position for mounting the IC module 70, and are positioned so that portions of the plates overlap the antenna connection terminals 73a and 73b of the IC module 70 when placed.

[0050] Thereafter, the tip of the antenna wire 83 is welded to either the first plate 110 or the second plate 120. Then, starting from this point, a predetermined heat pressure is applied to the antenna wire 83, and the antenna wire 83, which is a coated conductor covered with an insulating material, is embedded in the surface of the antenna holding layer 6 by a wire winding former. That is, while applying a predetermined heat pressure to the antenna wire 83, an antenna supply head is drawn into a loop shape as shown in FIG. 1, and the antenna wire 83 supplied from the antenna supply head is sequentially embedded in the antenna holding layer 6. The antenna wire 83 that has been embedded is cut, and the tip of the cut antenna wire 83 is used as the end point and welded to the other of the first plate 110 or the second plate 120.

[0051] The starting and ending ends of the antenna wire 83 are electrically connected to either the first plate 110 or the second plate 120 by welding. In this way, an antenna holding layer 6 (antenna sheet 12) on which the antenna 80 is formed is obtained. The intermediate product in which the antenna 80 is embedded in the antenna holding layer 5 or 6 is sometimes referred to as the antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a component for manufacturing an IC card 1. Alternatively, a commercial model may exist in which a sheet material such as an antenna holding layer is supplied to a processor, who processes it into an antenna sheet 12 and delivers it to the supplier.

[0052] (v) Antenna In the antenna 80 formed on the antenna holding layer 5 or 6, the multiple tips of the antenna wire 83 are electrically connected to a pair of end portions 100, which are the first plate 110 and the second plate 120, and the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to them, respectively. As a result, the IC chip 74a and the antenna 80 provided in the IC module 70 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using, for example, the 13.56 MHz HF frequency band specified in ISO / IEC 18092 or ISO / IEC 144443. Alternatively, it may be one that performs communication using other frequency bands, such as the 920 MHz UHF frequency band, the 125 kHz LF frequency band, or the 2.45 GHz microwave frequency band.

[0053] When IC card 1 is held over an external device such as a reader / writer, the magnetic field and radio waves generated by the reader / writer generate electromotive force and current in the communication circuit, which then supplies power to IC chip 74a. This enables IC chip 74a to be driven, enabling contactless transmission and reception of information with the reader / writer, and reading and rewriting of information from and to the memory.

[0054] The antenna wire 83 constituting the antenna 80 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum, can also be selected. By using a coated conductor wire, the IC card 1 can be manufactured more inexpensively than, for example, a copper foil etching method. However, the IC card 1 of the present disclosure may also use an antenna wire formed by a copper foil etching method, a metal foil punching method, or the like.

[0055] The diameter of the antenna wire 83 is not particularly limited as long as it can ensure the characteristics as a contactless communication circuit, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure during embedding and external forces due to cutting can be improved, and good communication characteristics can be ensured.

[0056] (vi) Ends (first plate and second plate) Next, the configuration of the first plate 110 and the second plate 120, which are the conductive end portion 100, will be described in detail. The first plate 110 and the second plate 120 are both plate-like members that are approximately rectangular in plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1. As shown in Fig. 4, the first plate 110 and the second plate 120 have a region that overlaps with the first recess 91 in the plan view, i.e., a region that is exposed from the card base 2, and a region that is located outside the first recess 91 and is embedded inside the card base 2.

[0057] 4 , in the outer periphery 93 of the recess 9 in the plan view, the straight lines that overlap the edge 93a on the −X direction side along the Y axis and the edge 93b on the +X direction side along the Y axis are defined as lines m1 and m2, respectively. In this case, the region of the first plate 110 on the +X direction side of the line m1 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the −X direction side of the line m2 is covered by the card base 2. Similarly, the region of the second plate 120 on the −X direction side of the line m2 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the +X direction side of the line m2 is covered by the card base 2.

[0058] Taking the first plate 110 as an example, the width along the X-axis direction of the first plate 110 exposed from the card base 2 in the first recess 91 is W12, the same as the width of the first recess 91, and is narrower than the width W11 including the width of the portion covered by the card base 2. Furthermore, the vertical width along the Y-axis direction of the first plate 110 exposed from the card base 2 in the first recess 91 is W2. Note that a portion of the end portion 100 is exposed in the recess 9 of the card base 2 when the IC module 70 is removed. The term "exposed" used here refers to a state in which, when viewed from the IC card 1, the first plate 110 and the second plate 120, which are the end portion 100, are not exposed because they are covered by the IC module 70, but if the IC module 70 were to be peeled off, the first plate 110 and the second plate 120 would be directly visible from the outside through the bottom surface of the recess 9 of the card base 2. That is, when the IC module 70 can be removed from the IC card 1, the first plate 110 and the second plate 120 can be directly seen from the bottom surface of the recess 9 of the card body 2 from the outside.

[0059] The sizes and ratios of W12, W11, and W2 are arbitrary, but it is preferable that the area of ​​the antenna connection terminal 73a when the IC module 70 is placed be included within the area of ​​the vertical width W2 and horizontal width W12 of the first plate 110. This is because a stable contact area for electrical connection between the antenna connection terminal 73a and the first plate 110 can be obtained. The same applies to the second plate 120. In this way, the multiple antenna connection terminals 73a, 73b are electrically connected to the corresponding multiple end parts 100 (first plate 110 and second plate 120) on the surfaces of the first plate 110 and second plate 120, which are end parts 100, that face the opening side of the recess 9 of the card base 2.

[0060] Furthermore, since the first plate 110 and the second plate 120 are partially covered by the card base 2 in this manner, the first plate 110 and the second plate 120 are more effectively held against external forces such as the cutting resistance of the end mill blade when forming the recess 9. This prevents the plates from accidentally peeling off from the card base 2 and becoming misaligned.

[0061] The first plate 110 and the second plate 120 may have a laminated structure including at least two layers: a first member and a second member laminated on the +Z direction side of the first member. In this case, it is preferable that the second member is a member that is less susceptible to oxidation than the first member. A member that is less susceptible to oxidation can be rephrased as a metal having a lower ionization tendency than the first member, for example, when both the first member and the second member are metals. Examples of such metals include aluminum, iron, nickel, or copper for the first member, and silver, palladium, platinum, or gold for the second member.

[0062] Considering the ease of material procurement, cost, processability, electrical properties, etc., it is preferable to use highly conductive copper for the first member and silver plating for the second member among the above listed materials. By using copper, which can ensure sufficient conductivity, as the first member and silver plating, which is resistant to oxidation and easily exposes the metal interface when the resin layer is cut with an end mill, for the second member, good electrical properties and processability can be obtained while suppressing increases in cost.

[0063] On the other hand, the first plate 110 and the second plate 120 may be configured as a single member only, without having the above-mentioned two-layer or three-layer or more laminated structure. In this case, the single member is limited to a conductive member, and for example, the above-mentioned members exemplified as the first member and the second member, or alloys thereof, etc. can be used. Preferably, copper, aluminum, stainless steel, or the like, which have high conductivity, can be selected. Using a single member makes it easier to obtain and process materials, and also leads to cost reduction.

[0064] In this embodiment, as described above, a configuration will be described in which the multiple ends of the antenna wire 83 are welded to the pair of end portions 100, that is, the first plate 110 and the second plate 120, but the ends of the antenna wire 83 do not necessarily need to be connected to such plates. As will be described later, for example, by configuring the multiple ends of the antenna wire 83 to be folded back multiple times in a zigzag shape, a meander shape, or a bellows shape, the antenna wire 83 can perform the same function as the above-mentioned plates.

[0065] (vii) Peel detection contact Next, the configuration of the conductive peeling detection contact 51 will be described in detail. Like the first plate 110 and the second plate 120 described above, the peeling detection contact 51 is a plate-like member that is approximately rectangular in plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1. Typically, the peeling detection contact 51 has the same material, structure, and thickness as the first plate 110 and the second plate 120, which form the end portion 100. By using the same material for the end portion and the peeling detection contact, a change in material due to replacement of the IC module can cause the card to malfunction, making it easier to detect the replacement. As shown in FIG. 4 , the peeling detection contact 51 has an area overlapping the first recess 91 in plan view and an area located outside the first recess 91. In both areas, the peeling detection contact 51 is embedded inside the card base 2. However, like the first plate 110 and the second plate 120, the area of ​​the peeling detection contact 51 that overlaps the first recess 91 in plan view may be exposed from the card base 2.

[0066] 4, a straight line that overlaps with a side 93c along the X-axis on the outer periphery 93 of the recess 9 in the plan view is defined as a straight line m3. In this case, the peeling detection contact 51 is covered by the card base 2 in an area on the +Y side of the line m3 and an area on the −Y side of the line m3. However, as described above, the peeling detection contact 51 may be configured such that an area on the +Y side of the line m3 is exposed from the card base 2 in the first recess 91, and an area on the −Y side of the line m3 is covered by the card base 2.

[0067] The vertical width along the Y-axis direction of the peeling detection contact 51 that overlaps with the first recess 91 in plan view is W32, the same as the vertical width of the first recess 91, and is narrower than the overall horizontal width W31 of the peeling detection contact 51. Furthermore, the horizontal width along the X-axis direction of the peeling detection contact 51 that overlaps with the first recess 91 in plan view is W4. The sizes and ratios of W32, W31, and W4 are arbitrary, but it is preferable that the area of ​​the peeling detection input terminals 53a and 53b when the IC module 70 is placed be included within the area of ​​the vertical width W32 and horizontal width W4 of the peeling detection contact 51. This ensures a stable overlap area between the peeling detection input terminals 53a and 53b and the peeling detection contact 51 in plan view, ensuring appropriate capacitance.

[0068] Also, similar to the first plate 110 and the second plate 120, a portion of the peeling detection contact 51 is covered by the card base 2, which enhances the effect of holding the peeling detection contact 51 against external forces such as the cutting resistance of the end mill blade when forming the recess 9. This prevents the plate from accidentally peeling off from the card base 2 and becoming misaligned.

[0069] The peeling detection contact 51 may have the same material configuration, thickness, and the like as the first plate 110 and the second plate 120 described above. By configuring the peeling detection contact 51 in this manner as the first plate 110 and the second plate 120, the burden of material preparation and the manufacturing process can be reduced compared to providing the peeling detection contact 51 on the card base 2 using a different material or a different process. Meanwhile, the peeling detection contact 51 does not have to be a metal plate like the first plate 110 and the second plate 120. For example, the peeling detection contact 51 may be formed by transferring aluminum foil to the card base 2. Furthermore, the peeling detection contact 51 may be formed by printing or applying an ink or paste containing metal particles such as aluminum powder or silver particles to the card base 2. Furthermore, the peeling detection contact 51 may be formed by adhering a graphite film to the card base 2. Configuring the peeling detection contact 51 in this manner reduces the cost of the material itself that provides the peeling detection contact 51.

[0070] (b) IC module Next, each of the main components of the IC module 70 will be described mainly with reference to Figures 2(a), 2(b) and 3(a) and 3(b). The IC module 70 is embedded in a recess 9 formed in the card base 2, and antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to the first plate 110 and the second plate 120 of the antenna 80, respectively, via a conductive adhesive layer 11. This allows the formation of a communication circuit for contactless communication.

[0071] Furthermore, peeling detection input terminals 53a and 53b of IC module 70 are arranged so as to partially overlap peeling detection contact 51 and card base 2 in a plan view, with non-conductive adhesive layer 13 sandwiched therebetween, but spaced apart from each other. By arranging peeling detection input terminals 53a and 53b and peeling detection contact 51 in this manner, peeling detection circuit 50 can be configured, in which IC chip 74a, peeling detection input terminals 53a and 53b, and peeling detection contact 51 form a closed circuit. In peeling detection circuit 50, peeling detection input terminals 53a and 53b and peeling detection contact 51 form a capacitance component. Meanwhile, IC chip 74a can communicate with a contact-type reader / writer or the like via external connection terminal 71 provided on IC module 70.

[0072] The substrate 72 is made by bonding copper foil to the front and back of a flexible insulating resin film such as glass epoxy resin or polyimide resin with an adhesive, and leaving the copper foil on the front and back of the resin film so as to form a predetermined pattern. Specifically, an external connection terminal 71 is formed on one copper foil surface of the resin film, and antenna connection terminals 73a and 73b and peel detection input terminals 53a and 53b are formed on the other copper foil surface. Specifically, a photosensitive material is applied to one and the other copper foil surfaces of the resin film, a film plate with a predetermined pattern is placed on it, exposed to light, and the non-photosensitive portions are removed by etching.

[0073] This forms a substrate 72 with some copper foil remaining in a predetermined pattern on the front and back surfaces of the resin film. Furthermore, the substrate 72 is provided in advance with bonding holes 76, which are through holes for wire bonding to the external connection terminals 71, at multiple locations. The external connection terminals 71 are arranged so as to be exposed on the surface of the card base 2. The term "exposed" used here refers to a state in which the external connection terminals 71 are not concealed within the card base 2 and can be directly seen from outside the IC card 1.

[0074] As shown in Figures 1 and 2(a), the external connection terminal 71 is defined as each external terminal section defined by the ISO / IEC 7816-2 standard. Specifically, as previously mentioned, the external connection terminal 71 is defined as having the C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal). The C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. These terminal areas are defined by insulating grooves 71a. Specifically, the external connection terminal 71 has a predetermined pattern of terminal areas formed of copper foil or the like on one side of an insulating substrate 72, and the insulating grooves 71a are areas where the copper foil is interrupted, exposing the substrate 72.

[0075] As shown in FIG. 2(a), the C1 through C4 terminals are partitioned from top to bottom in the area on the left side of the external connection terminal 71 when viewed from the +Z direction, and the C5 through C8 terminals are partitioned from top to bottom in the area on the right side. While the C5 terminal extends downward toward the center of the external connection terminal 71, this arrangement is not necessary; an area insulated from any of the C1 through C8 terminals may be partitioned. Note that in FIG. 2(a), the IC chip 74a, molded portion 74b, bonding hole 76, pads 74p, 74q, and 74r, antenna connection terminals 73a and 73b, and peel detection input terminals 53a and 53b are positioned further back in the page than the external connection terminal 71 and are shown with dashed lines. However, to clearly distinguish between the wire 75 and the lead-out lines, all of the lead-out lines are shown with solid lines.

[0076] 2(b), the outline of molded portion 74b is shown with a dashed line, and the outlines of IC chip 74a, bonding holes 76, wires 75, pads 74p, 74q, 74r, antenna connection terminals 73a, 73b, and peel detection input terminals 53a and 53b hidden inside molded portion 74b should also be dashed lines. However, for ease of viewing, these are all shown with solid lines, assuming that molded portion 74b does not exist.

[0077] The surface of IC chip 74a facing away from substrate 72 is a circuit surface, and is provided with a circuit pattern, a plurality of pads 74p which are electrodes, as well as pads 74q and 74r on the surface. At locations corresponding to each section of external connection terminal 71, the back surface of external connection terminal 71 can be seen from the -Z direction side through bonding holes 76 which are holes formed in substrate 72. That is, pads 74p of IC chip 74a and predetermined sections of external connection terminal 71 can be electrically connected to each other by connecting them with wires 75 such as gold wires through bonding holes 76.

[0078] Furthermore, on the surface of the substrate 72 opposite the external connection terminal 71, a pair of antenna connection terminals 73a and 73b, which are conductive regions that are approximately H-shaped in plan view, are arranged on both left and right sides of the IC chip 74a. Similarly, on the surface of the substrate 72 opposite the external connection terminal 71, a pair of peeling detection input terminals 53a and 53b, which are conductive regions that are approximately rectangular in plan view, are arranged below the IC chip 74a, i.e., on the -Y direction side. The multiple antenna connection terminals 73a, 73b are electrically connected to the corresponding multiple end parts 100 (the first plate 110 and the second plate 120) on the surfaces of the first plate 110 and the second plate 120, which are end parts 100, that face the opening side of the recess 9 of the card base 2.

[0079] Taking FIG. 2(a) as an example, multiple pads 74p on IC chip 74a are connected to terminals C1, C2, C3, C5, and C7 by wires 75. Other pads 74p on IC chip 74a are also connected to antenna connection terminals 73a and 73b by wires 75. Other pads 74q on IC chip 74a are also connected to peeling detection input terminal 53a by wires 75, and pad 74r is also connected to peeling detection input terminal 53b by wires 75. These bonding holes 76 and wires 75 are covered and protected by molded portion 74b. In this embodiment, seven pads 74p are provided on IC chip 74a, but the number and arrangement are merely an example and any number and arrangement may be used.

[0080] In the IC module 70 of this embodiment, two pads 74q and 74r on the IC chip 74a are electrically connected to a pair of peeling detection input terminals 53a and 53b formed on the substrate 72. At this point, the IC chip 74a and the peeling detection input terminals 53a and 53b form an open circuit rather than a closed circuit. However, as described above, when the IC module 70 is embedded in the recess 9 of the card body 2, the conductive peeling detection contact 51 is disposed inside the card body 2 so as to partially overlap the peeling detection input terminals 53a and 53b in a plan view but be spaced apart. By arranging the peeling detection input terminals 53a and 53b and the peeling detection contact 51 facing each other but spaced apart, the IC chip 74a and the peeling detection input terminals 53a and 53b form a peeling detection circuit 50, which is a closed circuit. At this time, the peeling detection input terminals 53a and 53b and the peeling detection contact 51 constitute capacitive components in the peeling detection circuit 50.

[0081] In this case, the closed circuit indicates that the circuit formed outside the IC chip 74a from pads 74q to 74r is closed, including the capacitive element, on the assumption that pads 74q and 74r of the IC chip 74a are closed inside the IC chip 74a. However, strictly speaking, as shown in another embodiment described later, pads 74q and 74r of the IC chip 74a may be opened by a switch or the like in the internal circuit of the IC chip 74a.

[0082] On the other hand, suppose a malicious third party removes IC module 70 from IC card 1 and embeds it in a recess in the base of another card. In this case, if there are no conductive portions in predetermined positions on the card base that face peeling detection input terminals 53a and 53b, the IC chip 74a and peeling detection input terminals 53a and 53b cannot form peeling detection circuit 50, which is a closed circuit. Naturally, if only peeling detection input terminals 53a and 53b exist and no portion corresponding to peeling detection contact 51 exists, charge will not be properly accumulated even if it is applied from IC chip 74a to peeling detection input terminals 53a and 53b.

[0083] Furthermore, suppose a malicious third party were to remove IC module 70 from IC card 1 and embed it in a recess in another card body, and a conductive portion facing peeling detection input terminals 53a and 53b were present in a predetermined position on the card body. Even in this case, it is unlikely that the conductive portion would be made of the same material and have the same configuration as peeling detection contact 51 located on the original card body 2. Therefore, the characteristics of the capacitance component formed by peeling detection input terminals 53a and 53b and the conductive portion of the other card body would differ from the capacitance component formed by peeling detection input terminals 53a and 53b and peeling detection contact 51 that constitute the original peeling detection circuit 50. In this case, even if an electric charge is applied from IC chip 74a to peeling detection input terminals 53a and 53b, the charge accumulation characteristics would change, and the resulting circuit would likely exhibit characteristics different from those of the original peeling detection circuit 50.

[0084] In this way, it is assumed that the IC card to be verified has a peeling detection circuit similar to the original peeling detection circuit 50. Then, when a predetermined charge is charged from the IC chip 74a to the assumed peeling detection circuit, if the assumed peeling detection circuit has a capacitance within a predetermined range, the IC chip 74a determines that the assumed peeling detection circuit is in a first state. On the other hand, when a predetermined charge is charged from the IC chip 74a to the assumed peeling detection circuit, if the assumed peeling detection circuit does not have a capacitance within the predetermined range, the IC chip 74a determines that the assumed peeling detection circuit is in a second state. As a result, it is possible to determine whether the IC card is a genuine card by determining whether it is in the first state or the second state.

[0085] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a adhered and fixed to the substrate 72 with an adhesive, bonding wires 75 for connection, and a molded portion 74b made of sealing resin for protecting these. The IC chip 74a includes a CPU for controlling both contact and contactless communication operations, and storage devices such as RAM, ROM, EEPROM, and flash memory. The IC chip 74a also includes various circuits, such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit. Note that these various circuits may be provided as elements separate from the IC chip 74a.

[0086] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. The molded portion 74b is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0087] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a provided therein and the shape of the bonded wires, but can be, for example, 0.45 mm to 0.75 mm. The total thickness of the IC module 70 can be, for example, 0.35 mm to 1.0 mm, and preferably 0.40 mm to 0.65 mm. By keeping the thickness within the latter range, the maximum depth of the recess 9 can be 0.7 mm or less, and the overall thickness of the IC card 1 can be kept to 0.84 mm or less, as defined by the ISO / IEC 7816-1 standard.

[0088] Next, the functions of the IC chip 74a will be described. FIG. 5(a) is a functional block diagram showing the functional configuration of the IC card 1. FIG. 5(b) is a functional block diagram showing the functional configuration of the internal switch control unit 330, capacitance measurement unit 310, and state determination unit 320, which are particularly included in the CPU 210. FIGS. 5(c) and 5(d) are schematic diagrams showing an example of an equivalent circuit of the peeling detection circuit 50, including the internal circuitry of the IC chip 74a. As shown in FIG. 5(a), the IC card 1 includes at least the IC chip 74a, an external connection terminal 71, and an antenna 80. In addition to the CPU 210, the IC chip 74a includes at least the peeling detection circuit 50, a memory 230, a contact interface unit 220, and a contactless interface unit 240.

[0089] An electrical signal input through the external connection terminal 71 is converted by the contact interface unit 220 into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. In the IC chip 74a, the CPU 210 reads, writes, calculates, etc. data while using the memory 230, and outputs some information as a result of these processes to the contact interface unit 220. The contact interface unit 220 converts this information into a predetermined electrical signal intended for an external device such as a contact reader / writer, and outputs it from the external connection terminal 71. As described above, the memory 230 is composed of the EEPROM 231, which is a rewritable nonvolatile memory, the RAM 232, which is a volatile memory for temporary storage, the ROM 233, which is a non-rewritable nonvolatile memory, etc. The EEPROM 231 may be replaced with a flash memory, etc.

[0090] Furthermore, the electrical signal input through the antenna 80 is converted by the contactless interface unit 240 into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. In the IC chip 74a, the CPU 210 reads, writes, calculates, etc. data while using the memory 230, and outputs some information as a result of these processes to the contactless interface unit 240. The contactless interface unit 240 converts this information into a predetermined electrical signal intended for an external device such as a contactless reader / writer, and outputs it from the antenna 80.

[0091] On the other hand, the peel detection circuit 50 is configured as a predetermined circuit including peel detection input terminals 53a and 53b. Examples of equivalent circuits are shown in Figures 5(c) and 5(d). When the equivalent circuit of the peel detection circuit 50 is shown in Figure 5(c), two switches (switches SW1 and SW2) in the internal circuit of the IC chip 74a are both open (OFF state), and no electric charge is stored in the capacitors C1 and C2 that configure the peel detection circuit. Note that capacitance C1 represents the capacitance component configured by the peel detection input terminal 53a and the peel detection contact 51, and capacitance C2 represents the capacitance component configured by the peel detection input terminal 53b and the peel detection contact 51.

[0092] Here, as shown in FIG. 5(d), assume that the internal switch control unit 330 issues an instruction to close both switches (ON state), causing switches SW1 and SW2 to close. Then, the IC chip 74a charges the capacitors C1 and C2 with a predetermined charge from the power supply V. From this state, the capacitance measurement unit 310 (CM in FIG. 5(c) or 5(d)) measures the capacitance of each of C1 and C2 or the combined capacitance of C1 and C2 using a known measurement method. There are various methods for measuring capacitance, but the following method can be given as an example.

[0093] For example, let's assume that the capacitance component formed by the peel detection input terminals 53a and 53b and the peel detection contact 51 is a parallel conductor plate with an area of ​​S and a gap of d. In this case, the dielectric constant of the adhesive layer 13, which is the insulator sandwiched between them, is Es, and the dielectric constant in a vacuum is E0. The required capacitance C can be calculated as C = E0 × Es × S / d. Even if such simplification is not possible, there is a measurement method called the constant-current discharge method. This involves charging C1 and C2 at a rated voltage, holding them for a predetermined time, and then discharging them at a constant current. The voltage change and the time required for this change are measured, and the capacitance is calculated from the data. Assuming that the terminal voltage of the capacitive element decreases from V01 to V02 during discharge, and the elapsed times at each voltage are T01 and T02, and the discharge current is I, the required capacitance C can be calculated as C = I × (T02 - T01) / (V01 - V02).

[0094] The capacitance measurement unit 310 of the CPU 210 measures the capacitance of the detachment detection circuit 50, centering on the capacitance component formed by the detachment detection input terminals 53a and 53b and the detachment detection contact 51. Furthermore, the state determination unit 320 determines whether the IC module 70 is in a legitimate state (i.e., not detached from the card body 2) or in an unauthorized state (i.e., detached from the card body 2) based on the information from the capacitance measurement unit 310. For example, if the capacitance measurement result of the capacitance measurement unit 310 indicates that the detachment detection circuit 50 has a capacitance within a predetermined range, the state determination unit 320 determines that the detachment detection circuit 50 is in a first state. If the capacitance measurement result does not indicate that the detachment detection circuit 50 has a capacitance within the predetermined range, the state determination unit 320 determines that the detachment detection circuit 50 is in a second state. If the detachment detection circuit 50 is in the first state, the state determination unit 320 determines that the IC module 70 or the IC card 1 is in a legitimate state. On the other hand, if the detachment detection circuit 50 is in the second state, the state determination unit 320 determines that the IC module 70 or the IC card 1 is in an unauthorized state (i.e., once detached).

[0095] (c) Conductive adhesive layer and adhesive layer After forming a recess 9 for embedding an IC module 70 in the card base 2 by cutting or the like using an end mill, the conductive adhesive layer 11 and adhesive layer 13 that embed and fix the IC module 70 in the recess 9 and electrically and mechanically connect it will be described. As shown in FIG. 3(a), the conductive adhesive layer 11 is a liquid or tape-like material that is arranged to be sandwiched between the first plate 110, the second plate 120 (not shown), the substrate 72 of the IC module 70, and the antenna connection terminals 73a and 73b formed on the substrate 72. As shown in FIG. 3(b), the adhesive layer 13 is a non-conductive liquid or tape-like material that is arranged to be sandwiched between the peeling detection contact 51, the substrate 72 of the IC module 70, and the peeling detection input terminal 53a and the peeling detection input terminal 53b (not shown) formed on the substrate 72.

[0096] The conductive adhesive layer 11 or the adhesive layer 13 may be applied or attached in advance to the surface of the substrate 72 of the IC module 70 opposite the external connection terminal 71, or may be applied or attached to the bottom surface of the recess 9 of the card base 2 after cutting.

[0097] A typical conductive adhesive layer 11 is applied and stuck to the back surface of the substrate 72 so as to cover only the areas of the antenna connection terminals 73a and 73b, and a separate adhesive layer 13 that is not conductive is applied and stuck to the rest of the back surface of the substrate 72. Since the conductivity of the separate adhesive does not need to be taken into consideration, it is easy to select an adhesive that is advantageous for mechanical connection.

[0098] The conductive adhesive layer 11, which provides electrical connection, can be anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). Alternatively, conductive paste or solder paste, which is an epoxy resin with silver particles dispersed as a filler, can be used. When using ACF, the ACF can be thermally laminated onto a portion of the back surface of the substrate 72 of the IC module 70, and then a film-like adhesive forming the adhesive layer 13 can be thermally laminated onto another portion of the back surface of the substrate 72 of the IC module 70. After embedding the IC module 70 in the recess 9 of the cut card base 2, the IC module 70 can be heat-pressed at a predetermined temperature and load. This simultaneously develops adhesive strength between the ACF (conductive adhesive layer 11) and the adhesive layer 13, facilitating electrical connection between the IC chip 74a and the antenna 80. Furthermore, since the IC module 70 can be mechanically connected to the card base 2 at the same time, the process of mounting the IC module 70 on the card base 2 can be simplified.

[0099] The electrical connection between the IC chip 74a and the antenna 80 when ACF is used as the conductive adhesive layer 11 can be explained as follows, based on FIG. 3(a). The conductive adhesive layer 11 has a structure in which conductive particles 11a, consisting of spherical resin or metal spheres surrounded by a metal film, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. The conductive particles may be resin coated with nickel or gold, or solder particles. Various solder particles, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, and SnZnAl-based, as well as alloys of these with other metals, can be used. These structures are similar when ACP is used.

[0100] Here, thermal pressure is applied to the substrate 72 from the +Z direction to the -Z direction so as to compress the conductive adhesive layer 11, which is arranged so as to be sandwiched between the first plate 110 electrically connected to the tip of the antenna wire 83, the substrate 72 of the IC module 70, and the antenna connection terminal 73a formed on the substrate 72.

[0101] As a result, strong thermal pressure is applied to a particularly narrow portion of the conductive adhesive layer 11, which is sandwiched between the antenna holding layer 5 and the antenna connecting terminal 73a. The conductive particles 11a of the conductive adhesive layer 11 in this portion are pressed against the first plate 110 exposed from the antenna holding layer 5 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. Furthermore, if the conductive particles 11a are small, the conductive particles 11a overlap in a daisy chain manner from the first plate 110 to the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. In other words, the exposed first plate 110 and the antenna connecting terminal 73a are electrically connected via the conductive particles 11a.

[0102] On the other hand, between the antenna holding layer 5 and the substrate 72 in the region where the antenna connecting terminal 73a is not present, the conductive particles 11a are not compressed to the extent that they are pressed by the first plate 110 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11, or to the extent that they overlap in a daisy chain manner. However, the adhesive force of the adhesive 11b generated by the thermal pressure mechanically connects the antenna holding layer 5 and the substrate 72. One possible reason for the adhesive force of the adhesive 11b is a wedge effect that occurs when the adhesive 11b penetrates into minute irregularities on the surfaces of the antenna holding layer 5 and the substrate 72.

[0103] As described above, in IC module 70, antenna connection terminals 73a and 73b facing each other and first plate 110 and second plate 120 are electrically connected to each other via, for example, ACF. The ACF is arranged in a region along the outer periphery 93 of recess 9 so as to overlap with first recess 91 in a plan view along the Z-axis direction.

[0104] The above-mentioned explanation of the electrical and mechanical connection via the ACF between the mutually opposing antenna connection terminals 73a and 73b and the first plate 110 and the second plate 120 also applies to the explanation of Fig. 3(b). That is, the same applies to the mechanical connection via the adhesive layer 13 between the mutually opposing peel detection input terminals 53a and 53b and the peel detection contact 51 in Fig. 3(b).

[0105] (d) IC card operation Next, the operation of the IC card 1 will be described. Fig. 6 is an example of a flow diagram showing the operation of the IC card 1. Fig. 7 is another example of a flow diagram showing the operation of the IC card 1. First, the explanation will be given along with the flow diagram of Fig. 6. This will be tentatively called the first pattern.

[0106] (i) First pattern First, the IC chip 74a is started up when power is supplied to the IC chip 74a from either the external connection terminal 71 or the antenna 80 (step S401 in FIG. 6). At this time, the internal switch control unit 330 of the CPU 210 opens both the internal switches SW1 and SW2 of the IC chip 74a that constitute the peeling detection circuit 50, i.e., sets them to the OFF state, as shown in the equivalent circuit diagram of FIG. 5(c). The IC chip 74a will be described as having two internal switches, SW1 and SW2. However, the number of internal switches may be one, or three or more.

[0107] Thereafter, the internal switch control unit 330 turns on the internal switch of the peel detection circuit 50 (step S402). Then, the IC chip 74a charges the capacitive element formed by the peel detection input terminals 53a and 53b of the peel detection circuit 50 and the peel detection contact 51 (step S403). Thereafter, the capacitance measurement unit 310 measures the capacitance of the peel detection circuit 50 (step S404). The capacitance of the peel detection circuit 50 can be measured using a known measurement method such as that described above.

[0108] If the measured capacitance of the peeling detection circuit 50 is within the predetermined range (step S405), the state determination unit 320 determines that the IC card 1 is a normal card (step S406). On the other hand, if the measured capacitance of the peeling detection circuit 50 is not within the predetermined range (step S405), the state determination unit 320 determines that the IC card 1 is an unauthorized card (step S408).

[0109] If the state determination unit 320 determines that the IC card 1 is a normal card (step S406), normal communication is then performed in accordance with an input signal from an external device such as a contact reader / writer or a contactless reader / writer (step S407). At the same time as or after this, the internal switch control unit 330 turns off the internal switch of the peeling detection circuit 50 (step S410). The state determination unit 320 determining that the IC card 1 is a normal card is synonymous with determining that the IC card 1 and the IC module 70 are in the first state.

[0110] On the other hand, if the state determination unit 320 determines that the IC card 1 is an unauthorized card (step S408), then at least some of the processing of input signals from an external device such as a contact reader / writer or a contactless reader / writer is restricted (step S409). At the same time as or after this, the internal switch control unit 330 turns off the internal switch of the peeling detection circuit 50 (step S410). The state determination unit 320 determining that the IC card 1 is an unauthorized card is synonymous with determining that the IC card 1 and the IC module 70 are in the second state.

[0111] Here, restricting at least some of the processes means restricting at least some of the processes that are possible when the IC card 1 or the IC module 70 is in the first state. For example, if all processes of contact communication and contactless communication are possible in the first state, then in the second state, either one or both of the contact communication and contactless communication processes may be disabled. Also, for example, if all processes of contact communication and contactless communication are possible in the first state, then in the second state, either one or both of the contact communication and contactless communication processes may be disabled.

[0112] Also, for example, if in the first state payment processing, withdrawal processing, settlement processing, cash advance processing, etc. are possible up to a predetermined first amount, in the second state only payment processing, withdrawal processing, settlement processing, cash advance processing, etc. are possible up to a predetermined second amount that is less than the first amount.

[0113] In the first pattern of operation of the IC card 1 described above, immediately before using the IC card 1, an electric charge is charged to the capacitance element formed by the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51. As a result, even if the amount of charge in the capacitance element changes due to some factor, such as the influence of external static electricity, before using the IC card 1, these influences are reset, and the capacitance of the capacitance element can be measured correctly.

[0114] (ii) Second pattern When the IC card 1 operates according to the second pattern, first, the IC chip 74a is started up by receiving power from either the external connection terminal 71 or the antenna 80 (step S421 in FIG. 7). At this time, the internal switch control unit 330 of the CPU 210 opens both the internal switches SW1 and SW2 of the IC chip 74a, which constitute the peeling detection circuit 50, i.e., turns them off.

[0115] Thereafter, the internal switch control unit 330 switches the internal switch of the peel detection circuit 50 to the ON state (step S422), and then the capacitance measurement unit 310 measures (step S423) the capacitance of the peel detection circuit 50. The capacitance of the peel detection circuit 50 can be measured using the known measurement method described above.

[0116] If the measured capacitance of the peeling detection circuit 50 is within the predetermined range (step S424), the state determination unit 320 determines that the IC card 1 is a normal card (step S425). On the other hand, if the measured capacitance of the peeling detection circuit 50 is not within the predetermined range (step S424), the state determination unit 320 determines that the IC card 1 is an unauthorized card (step S427).

[0117] If the state determination unit 320 determines that the IC card 1 is a normal card (step S425), normal communication is then performed in accordance with an input signal from an external device, such as a contact reader / writer or a contactless reader / writer (step S426). Then, the IC chip 74a charges the capacitance element formed by the peeling detection input terminals 53a and 53b and the peeling detection contact 51 of the peeling detection circuit 50 (step S429). Further thereafter, the internal switch control unit 330 turns off the internal switch of the peeling detection circuit 50 (step S430). The state determination unit 320 determining that the IC card 1 is a normal card is synonymous with determining that the IC card 1 and the IC module 70 are in the first state.

[0118] On the other hand, if the state determination unit 320 determines that the IC card 1 is an unauthorized card (step S427), then it restricts at least some of the processing of input signals from an external device such as a contact reader / writer or a contactless reader / writer (step S428). Then, the IC chip 74a charges the capacitance element formed by the peeling detection input terminals 53a and 53b and the peeling detection contact 51 of the peeling detection circuit 50 (step S429). Further, after that, the internal switch control unit 330 turns off the internal switch of the peeling detection circuit 50 (step S430). The state determination unit 320 determining that the IC card 1 is an unauthorized card is synonymous with determining that the IC card 1 and the IC module 70 are in the second state.

[0119] In the second pattern of operation of the IC card 1 described above, both of the internal switches SW1 and SW2 of the IC chip 74a that constitutes the peeling detection circuit 50 are in the open state, i.e., the OFF state, even before the IC card 1 is used. Then, just before that, both of the internal switches SW1 and SW2 are turned ON, and then the capacitance of the capacitive element formed by the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51 is measured. Thereafter, the IC chip 74a charges the capacitive element formed by the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51, and then the internal switch control unit 330 again turns both of the internal switches SW1 and SW2 to the OFF state.

[0120] Before use, the IC card 1 maintains a state in which a predetermined electric charge is charged in the capacitive element formed by the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51. This is because, before use, the IC card 1 has both internal switches SW1 and SW2 of the IC chip 74a that constitute the peeling detection circuit 50 in the OFF state, and the electric charge stored in the capacitive element is trapped. Then, the internal switch control unit 330 turns both internal switches SW1 and SW2 on, and then measures the capacitance of the capacitive element formed by the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51.

[0121] As a result, if some kind of fraud is committed on IC card 1 before use, for example, if IC module 70 is removed from card base 2 and embedded in another card base, the charge stored in the capacitance element formed by peeling detection input terminals 53a and 53b of peeling detection circuit 50 and peeling detection contact 51 will be discharged. Therefore, when the capacitance of the capacitance element is measured for a circuit considered to be a peeling detection circuit, a measurement result different from that under normal circumstances will appear. In this way, in the second pattern, if fraud is committed on IC card 1 before use, the IC card 1 itself can detect the fraud.

[0122] (e) IC card manufacturing method Next, an example of a method for manufacturing the IC card 1, which is a dual interface IC card, using the card base 2, IC module 70, and conductive adhesive layer 11 described above will be described.

[0123] First, the first plate 110 and the second plate 120, which are plate-shaped end portions 100, are bonded to the surface of either the antenna holding layer 5 or 6, on the side not adjacent to the core layer 4 or 7. Both may be bonded and fixed to the surface of the antenna holding layer 5 or 6 via an adhesive. Furthermore, the peeling detection contact 51 is bonded to the same surface of the antenna holding layer 5 or 6 as the surface to which the first plate 110 and the second plate 120 are bonded. The peeling detection contact 51 is bonded and fixed to either the opposing surface of the core layer 7 or the antenna holding layer 6 via an adhesive, although it is located between layers different from the first plate 110 and the second plate 120. However, the peeling detection contact 51 may also be bonded and fixed to either the opposing surface of the antenna holding layer 5 or 6, which is located between layers the same as the first plate 110 and the second plate 120. The first plate 110, the second plate 120, and the peeling detection contact 51 can all be made of the same material and have the same configuration.

[0124] Next, the coated conductor coated with an insulating member is used as the antenna wire 83 and is embedded by a winding machine into the formation surface of the antenna holding layer 5 or 6 on which the end portion 100 is formed, with the start point being either the first plate 110 or the second plate 120 and the end point being the other. Here, the winding machine welds the tip of the antenna wire 83 to the first plate 110 and the second plate 120 at the start and end points of the antenna wire 83.

[0125] 1 while applying a predetermined heat and pressure to the antenna holding layer 6, and the antenna wire 83 supplied from the antenna supply head is successively embedded in the antenna holding layer 6. In this case, the antenna holding layer 6 may be referred to as a first substrate.

[0126] Next, as shown in Figures 3(a) and 3(b), over-sheet layer 8, core layer 7, antenna holding layers 6 and 5, core layer 4, and over-sheet layer 3 are stacked in this order from bottom to top in the thickness direction. Then, the laminate of large sheets with cards arranged vertically and horizontally in multiple faces is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates. At this time, for example, antenna 80 is formed in advance on the surface of antenna holding layer 6 so that it is sandwiched between antenna holding layers 5 and 6. At this time, antenna holding layer 5, which is positioned opposite antenna holding layer 6 as the first substrate and is stacked on the first substrate so as to sandwich antenna 80, may be referred to as the second substrate.

[0127] By undergoing this heat pressing process, a large-sized sheet-unit card base can be obtained in which each layer of the laminate, including the first substrate and the second substrate, is integrated. Furthermore, if any of the oversheet layer, core layer, and antenna-holding layer has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heat fused at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. Then, by subjecting these to a heat pressing process, an integrated large-sized sheet-unit card base can be obtained.

[0128] The large-sized card substrate obtained as described above, on which the cards are arranged in a multi-faceted array, is punched out by a punching machine into a card substrate 2 conforming to the ISO / IEC 7816-1 card size. A recess 9 for embedding the IC module 70 is formed in the card substrate 2 by cutting using an end mill. This results in a cut card substrate 2. The recess 9 has two stages: a first recess 91 with a first depth for accommodating the flat substrate 72 of the IC module 70, and a second recess 92 with a second depth deeper than the first recess 91 for accommodating the convex IC chip body 74. The surfaces of the first plate 110 and the second plate 120 are exposed at the bottom of the first recess 91 of the card substrate 2. Meanwhile, the surface of the peel detection contact 51 is not exposed at the bottom of the first recess 91 of the card substrate 2, but is located inside the card substrate 2. However, the surface of the peel detection contact 51 may be exposed at the bottom of the first recess 91 of the card substrate 2.

[0129] Separately from the manufacturing of the card base 2 and the cutting process for forming the recess 9, the conductive adhesive layer 11 and adhesive layer 13 are attached to the IC module 70. The IC module 70 is typically a module tape in which the IC module 70 is continuously formed on a long tape in one or two rows. A tape-shaped ACF is attached to the side of the module tape opposite the side on which the external connection terminals 71 are formed, while applying a certain amount of heat and pressure. However, the area that overlaps the peel detection contact 51 is removed so that the ACF will not be attached when the IC module 70 is embedded in the recess 9 of the card base 2. Then, adhesive layer 13, which is a non-conductive liquid adhesive or adhesive tape, is applied to or attached to the side of the module tape opposite the side on which the external connection terminals 71 are formed. The module tape with the ACF attached is then punched out into a roughly rectangular IC module 70 with rounded corners using a punching machine, thereby obtaining the IC module 70 with the conductive adhesive layer 11 and adhesive layer 13 attached.

[0130] Next, the IC module 70 with the conductive adhesive layer 11 and adhesive layer 13 attached is embedded in the card base 2 with the recess 9 formed therein. A predetermined heat block is pressed against the external connection terminal 71, and a predetermined heat pressure is applied toward the card base 2 for a predetermined time. This melts the conductive adhesive layer 11 made of ACF and the adhesive layer 13 made of a conventional adhesive, thereby establishing electrical connections between the antenna connection terminals 73a and 73b of the IC module 70 and the first plate 110 and the second plate 120. Furthermore, the IC module 70 is mechanically connected to the card base 2. The application time and heat pressure conditions for the ACF vary depending on the type and composition of the ACF. For example, the application time and heat pressure conditions can be 0.5 seconds or more to 10.0 seconds or less, the temperature can be 150°C or more to 250°C or less, and the pressure can be 20 MPa or more to 100 MPa or less. It is preferable that the adhesive layer 13 be capable of bonding under similar conditions.

[0131] (f) Regarding the IC card of the first embodiment In summary, the IC card 1 of the first embodiment is capable of contact communication with an external device. The IC card 1 includes a card base 2 and an IC module 70 disposed in the recess 9 of the card base 2. The IC module 70 includes a substrate 72, an external connection terminal 71 formed on one surface of the substrate 72, and an IC chip 74a disposed on the other surface of the substrate 72, the external connection terminal 71, and peeling detection input terminals 53a, 53b electrically connected to the IC chip 74a. The external connection terminal 71 is disposed so as to be exposed on the surface of the card base 2. The card base 2 is provided with a peeling detection contact 51, which is an electrical conductor. The peeling detection contact 51 and the peeling detection input terminals 53a, 53b are disposed so as to partially overlap each other and be spaced apart when viewed from above the card base 2.

[0132] The peel detection input terminals 53a, 53b and the peel detection contact 51 constitute a capacitance component, and the IC chip 74a determines whether the peel detection circuit 50 constituted by the IC chip 74a, the peel detection input terminals 53a, 53b and the peel detection contact 51 is in a first state or a second state different from the first state. If the peel detection circuit 50 has a capacitance within a predetermined range, the IC chip 74a determines that the peel detection circuit 50 is in the first state. If the peel detection circuit 50 does not have a capacitance within the predetermined range, the IC chip 74a determines that the peel detection circuit 50 is in the second state. In the second state, the IC chip limits at least some of the processes that are possible when the peel detection circuit 50 is in the first state.

[0133] When the IC chip 74a operates according to the first pattern described above, the IC chip 74a can determine whether it is in the first state or the second state as follows. That is, the IC chip 74a determines whether it is in the first state or the second state by measuring the capacitance of the peel detection input terminals 53a and 53b and the peel detection contact 51 after charging a predetermined amount of electric charge from the IC chip 74a of the peel detection circuit 50. When the IC chip 74a operates according to the second pattern described above, the IC chip 74a can determine whether it is in the first state or the second state as follows. That is, the IC chip 74a has built-in internal switches SW1 and SW2 that open and close part of the peel detection circuit 50. The IC chip 74a determines whether it is in the first state or the second state by charging a predetermined amount of electric charge from the IC chip of the peel detection circuit 50 to the peel detection input terminals, opening the internal switches SW1 and SW2, and measuring the capacitance of the peel detection circuit 50.

[0134] In particular, the IC card 1 of this embodiment is a dual-interface IC card that is also capable of contactless communication with external devices. The IC card 1 includes an antenna 80 disposed inside the card base 2. The antenna 80 includes an antenna wire 83 and multiple end portions 100, and the multiple tips of the antenna wire 83 are electrically connected to the multiple end portions 100. A portion of the end portion 100 is exposed in the recess 9 of the card base 2 when the IC module 70 is removed. The IC module 70 further includes multiple antenna connection terminals 73a, 73b disposed on the other surface of the substrate 72. The multiple antenna connection terminals 73a, 73b are electrically connected to the corresponding multiple end portions 100 on the surface of the end portion 100 facing the opening of the recess 9.

[0135] The IC card 1 of the first embodiment has the above-described configuration, which makes it possible to restrict the processing of an IC card 1 that is suspected to be a fraudulent card, thereby preventing the misuse of fraudulent cards. In this way, the IC card 1 of the present disclosure is an IC card that is capable of contact communication with an external device via the external connection terminal 71, and can prevent misuse by replacing the IC module with a relatively simple configuration.

[0136] 2. Second embodiment Next, an IC card according to a second embodiment of the present disclosure will be described.

[0137] The IC card of the second embodiment is a contact IC card that does not have a contactless communication function and has only a contact communication function. Figure 8 is an enlarged bottom view illustrating the internal configuration of an IC module 70a used in the IC card of this embodiment, and corresponds to Figure 2(b). As in Figure 2(b), the IC chip 74a, molded part 74b, wires 75, etc., which are arranged on the -Z direction side of the external connection terminal 71, i.e., on the back side of the paper, are indicated by dashed lines.

[0138] In the IC module 70a, the pair of antenna connection terminals 73a and 73b, which are conductive areas that are approximately H-shaped in plan view, are not present on either side of the IC chip 74a on the side opposite the external connection terminal 71 of the substrate 72. However, on the side of the substrate 72 opposite the external connection terminal 71, the pair of peeling detection input terminals 53a and 53b, which are conductive areas that are approximately rectangular in plan view, are arranged below the IC chip 74a, i.e., on the -Y direction side.

[0139] 8, a plurality of pads 74p on IC chip 74a are connected to terminals C1, C2, C3, C5, and C7 by wires 75. A pad 74q other than the above on IC chip 74a is connected to peeling detection input terminal 53a by wires 75, and a pad 74r is connected to peeling detection input terminal 53b by wires 75. That is, IC module 70a of this embodiment differs from IC module 70 of the first embodiment only in that it does not have antenna connection terminals 73a and 73b, but is otherwise the same.

[0140] Although not shown, in the IC module 70a of this embodiment, as in the first embodiment, two pads 74q and 74r of the IC chip 74a are electrically connected to a pair of peeling detection input terminals 53a and 53b formed on the substrate 72. At this point, the IC chip 74a and the peeling detection input terminals 53a and 53b form an open circuit rather than a closed circuit, because there is no wiring electrically connecting the peeling detection input terminals 53a and 53b.

[0141] However, suppose that this IC card has a peeling detection contact 51 similar to that in the first embodiment in the recess 9 of the card body 2. In this case, when the IC module 70a is embedded in the recess 9 of the card body 2, the peeling detection input terminals 53a, 53b and the peeling detection contact 51 are arranged at a distance so as to face each other. In this case, the IC chip 74a and the peeling detection input terminals 53a and 53b form a peeling detection circuit 50, which is a closed circuit. In this case, the peeling detection input terminals 53a, 53b and the peeling detection contact 51 constitute a capacitance component in the peeling detection circuit 50. This allows the IC chip 74a and the peeling detection input terminals 53a and 53b to form the peeling detection circuit 50, which is a closed circuit.

[0142] On the other hand, suppose the IC module 70a is removed from the IC card 1 and embedded in a recess of another card base. If there are no conductive portions in the recess facing the peeling detection input terminals 53a and 53b, the IC chip 74a and the peeling detection input terminals 53a and 53b do not form a closed circuit, i.e., the peeling detection circuit 50. Conversely, the peeling detection circuit 50 would be in an open state. Therefore, by measuring the capacitance of the peeling detection circuit using the first or second pattern described above, the IC chip 74a of the IC module 70a can determine whether the peeling detection circuit is in the first or second state. As a result, it is possible to determine whether the IC card is a genuine card. In other words, even with the contact-type IC card of the second embodiment, peeling of the IC module 70a can be detected using the same principle as with the dual-interface IC card of the first embodiment.

[0143] 3. Third embodiment Next, an example of an IC card according to a third embodiment of the present disclosure will be described. The IC card 1a of this embodiment is a dual-interface IC card similar to that of the first embodiment. However, the IC card 1a of this embodiment differs from the first embodiment in that the end portion, to which the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected, is not a conductive plate but a bellows portion in which the antenna wire 83 is arranged in a bellows shape. Furthermore, in the IC card 1a of this embodiment, the capacitive element disposed apart from and facing the peeling detection input terminals 53a and 53b of the IC module 70 is formed not on a conductive plate but on a peeling detection contact in a bellows portion in which wiring similar to the antenna wire 83 is arranged in a bellows shape. This difference from the first embodiment is that the end portion, which is the bellows portion, and the peeling detection contact are formed by a repeated folding structure of the antenna wire 83, which is a coated conductor or the like. This structure is also called a zigzag or meander shape.

[0144] Fig. 9 is a plan view corresponding to Fig. 1, showing an IC card 1a viewed from the +Z direction. Fig. 10(a) is a cross-sectional view corresponding to Fig. 3(a), showing the IC card 1a of Fig. 9 cut along line CC parallel to the X axis, viewed from the -Y direction. Fig. 10(b) is a cross-sectional view corresponding to Fig. 3(b), showing the IC card 1 of Fig. 9 cut along line DD parallel to the Y axis, viewed from the +X direction. Fig. 11 is an enlarged view corresponding to Fig. 4, showing the configuration of the card base 2a from which the IC module 70 in Fig. 9 has been removed.

[0145] 9 and 10(a), antenna connecting terminal 73a is electrically connected to first bellows portion 130, which is end portion 100a formed by a repeated folding structure of antenna wire 83 from the outer periphery toward the center of recess 9 of card base 2a, via conductive adhesive layer 11. Furthermore, although not shown in FIG. 10(a), antenna connecting terminal 73b is also electrically connected to second bellows portion 140, which is end portion 100a and has the same configuration as first bellows portion 130, via conductive adhesive layer 11. As a result, antenna connecting terminals 73a and 73b are electrically connected to both ends of antenna wire 83, respectively.

[0146] 9 and 10(b), peeling detection input terminal 53a is disposed opposite peeling detection contact 52 at a distance via non-conductive adhesive layer 13, which is different from conductive adhesive layer 11. Peeling detection contact 52 is a bellows portion formed by repeatedly folding back from the outer periphery toward the center of recess 9 of card base 2a using a coated conductor wire similar to antenna wire 83. In this manner, peeling detection input terminals 53a and 53b and peeling detection contact 52, which is a bellows portion, are disposed opposite each other at a distance. In this case, IC chip 74a, peeling detection input terminals 53a and 53b, and peeling detection contact 52 form a closed circuit, peeling detection circuit 50a.

[0147] 2(a) of the first embodiment, multiple pads 74p of IC chip 74a and antenna connecting terminals 73a and 73b are electrically connected to each other via wires 75. Furthermore, antenna connecting terminal 73a is electrically connected to one end of antenna 80a via conductive adhesive layer 11 and first bellows portion 130. Furthermore, antenna connecting terminal 73b is electrically connected to the other end of antenna 80a via conductive adhesive layer 11 and second bellows portion 140. As a result, IC chip 74a and antenna 80a can form a closed communication circuit.

[0148] Meanwhile, pad 74q of IC chip 74a and peeling detection input terminal 53a are electrically connected via wire 75, and pad 74r and peeling detection input terminal 53b are electrically connected via wire 75. Furthermore, peeling detection input terminals 53a and 53b are mechanically connected to peeling detection contact 52 via adhesive layer 13 while being spaced apart and facing each other. This allows for the formation of a peeling detection circuit 50a similar to peeling detection circuit 50 of the first embodiment.

[0149] The IC card 1a of this embodiment differs from the IC card 1 of the first embodiment in the physical shapes of the first plate 110 and second plate 120 constituting the end portion 100 and the peeling detection contact 51. That is, in the IC card 1a of this embodiment, the first bellows portion 130 and second bellows portion 140 constituting the end portion 100a and the peeling detection contact 52 are not made of conductive plates but are made of a folded structure consisting of the antenna wire 83 and similar wiring. However, the action and effect related to peeling detection of the IC card 1a are the same as those of the IC card 1, and therefore a description thereof will be omitted.

[0150] Next, an example of a method for manufacturing the IC card 1a will be briefly described, focusing on the differences from the IC card 1.

[0151] First, a coated conductor coated with an insulating member is used as the antenna wire 83 on the surface of either the antenna holding layer 5 or 6 on the side not adjacent to the core layer 4 or 7, and the first bellows portion 130 and the second bellows portion 140 are formed at both ends of the antenna wire 83. The antenna wire 83 is embedded using a winding machine, starting from the side where either the first bellows portion 130 or the second bellows portion 140 of the antenna wire 83 is located and ending from the side where the other is located. The first bellows portion 130 and the second bellows portion 140 are formed by moving the head of the winding machine in a zigzag manner in the Y-axis direction while moving it in the X-axis direction.

[0152] After forming either the first bellows portion 130 or the second bellows portion 140, a predetermined heat and pressure is applied to the antenna holding layer 6 while an antenna supply head is drawn into a loop shape as shown in Fig. 9. Then, the antenna wires 83 supplied from the antenna supply head are embedded sequentially into the antenna holding layer 6. Thereafter, the other of the first bellows portion 130 or the second bellows portion 140 is formed to complete the formation of the antenna 80a.

[0153] Furthermore, on the same surface of the antenna holding layer 5 or 6 as the surface on which the first bellows portion 130 and the second bellows portion 140 are formed, an additional peeling detection contact 52 is formed using an antenna wire 83 that is separate from the antenna 80a and independent of the antenna 80a. As with the first bellows portion 130 and the second bellows portion 140, the peeling detection contact 52 is also formed by moving the head of the winding forming machine in a zigzag pattern in the X-axis direction while moving it in the Y-axis direction. The first bellows portion 130, the second bellows portion 140, and the peeling detection contact 52 can all be made of the same material and have the same configuration. The other steps are the same as those in the first embodiment, so a description thereof will be omitted.

[0154] It is preferable that peeling detection contact 52 is formed on one surface of antenna holding layer 6 in the same process as first bellows portion 130 and second bellows portion 140, but it is preferable that only the area of ​​peeling detection contact 52 is embedded slightly deeper than first bellows portion 130 and second bellows portion 140. By doing so, when forming recess 9 in card base 2a, the top surfaces of first bellows portion 130 and second bellows portion 140, which need to be electrically connected to IC module 70, can be appropriately cut, and peeling detection contact 52 can be prevented from being cut. As a result, the processing reliability of peeling detection contact 52 is improved.

[0155] In this embodiment, first bellows portion 130 and second bellows portion 140 are formed by moving the head of the winding forming machine in the X-axis direction while moving it in a zigzag pattern around the Y-axis direction. Also, peeling detection contact 52 is formed by moving the head of the winding forming machine in the Y-axis direction while moving it in a zigzag pattern around the X-axis direction. That is, first bellows portion 130 and second bellows portion 140 are formed such that the folding of the bellows concaves and convexes is formed along the Y-axis, i.e., along the outer periphery of recess 9, and the direction in which the folding is repeated is along the X-axis, i.e., from the outer periphery toward the center of recess 9.

[0156] However, the configuration of first bellows portion 130 and second bellows portion 140 according to the embodiment of the present disclosure is not limited to this. For example, the direction in which the folds of the concave and convex portions of the bellows are formed may be along the X-axis, i.e., the direction from the outer periphery of recess 9 toward the center, and the direction in which the folds are repeated may be along the Y-axis, i.e., the direction along the outer periphery of recess 9 and the direction from the outer periphery of recess 9 toward the center.

[0157] Similarly, the peel detection contact 52 is formed so that the folds of the bellows' concave and convex portions are formed in a direction along the X-axis, i.e., in a direction along the outer periphery of the recess 9, and the direction in which the folds repeat is a direction along the Y-axis, i.e., in a direction from the outer periphery toward the center of the recess 9. However, the peel detection contact 52 of the embodiment of the present disclosure is not limited to this, and the folds of the bellows' concave and convex portions may be formed in a direction along the Y-axis, i.e., in a direction from the outer periphery toward the center of the recess 9, and the direction in which the folds repeat is a direction along the X-axis, i.e., in a direction along the outer periphery of the recess 9.

[0158] The IC card 1a of the third embodiment has the above-described configuration, and like the first and second embodiments, it is possible to provide an IC card and a manufacturing method thereof that can prevent misuse by replacing the IC module with a relatively simple configuration. Furthermore, in this embodiment, by forming only a portion of the antenna wire 83 into a bellows-like shape, it is possible to easily establish electrical continuity between the antenna 80a and the IC chip 74a and form the peeling detection circuit 50a. In other words, in this embodiment, there is no need to prepare any extra material other than the antenna wire 83, and the end portion 100a and the peeling detection contact 52 can be formed using the same processing method, thereby reducing costs and shortening processing time.

[0159] 4. Fourth embodiment Next, an example of an IC card according to a fourth embodiment of the present disclosure will be described. The IC card 1b of this embodiment is a contact IC card equipped with only a contact communication function, similar to the second embodiment. However, the IC card 1b of the present disclosure may also be a dual-interface IC card. The IC card 1b differs from the second embodiment in that the peeling detection input terminals 54a and 54b provided on the IC module 70b are not dedicated terminals provided on the surface of the substrate 72 opposite the external connection terminal 71, but instead utilize unused external connection terminals C4, C8, etc.

[0160] Fig. 12 is a plan view of IC card 1b viewed from the +Z direction, corresponding to Fig. 1. Fig. 13(a) is an enlarged bottom view illustrating the internal configuration of IC module 70b used in the IC card of this embodiment, corresponding to Fig. 2(b). Fig. 13(b) is a cross-sectional view of IC card 1b of Fig. 12 taken along line EE parallel to the Y axis, viewed from the +X direction, corresponding to Fig. 3(b). Fig. 13(a) shows, as in Fig. 2(b), the IC chip 74a, molded portion 74b, wires 75, etc., which are arranged on the -Z direction side of external connection terminal 71, i.e., on the far side of the paper, by dashed lines.

[0161] In the IC module 70b, the pair of peeling detection input terminals 53a and 53b, which are conductive regions having a substantially rectangular shape in a plan view, are not arranged below the IC chip 74a, i.e., on the -Y direction side, on the surface of the substrate 72 opposite the external connection terminal 71. Instead, the C4 terminal and C8 terminal of the external connection terminal 71 correspond to peeling detection input terminals 54a and 54b, which have the same functions as the peeling detection input terminals 53a and 53b, respectively.

[0162] 13(a) as an example, multiple pads 74p of IC chip 74a are connected to the C1, C2, C3, C5, and C7 terminals by wires 75. A pad 74q other than the above on IC chip 74a is connected to peeling detection input terminal 54a, which is the C4 terminal, by wires 75. Pad 74r is connected to peeling detection input terminal 54b, which is the C8 terminal, by wires 75. The pads 74q and 74r of IC chip 74a can be connected to the C4 and C8 terminals in the same way as the pad 74p of IC chip 74a is connected to terminals such as C1.

[0163] In the IC module 70b of this embodiment, as in the second embodiment, two pads 74q and 74r of the IC chip 74a are electrically connected to a pair of peeling detection input terminals 54a and 54b, which are replaced by the C4 and C8 terminals. At this point, the IC chip 74a and the peeling detection input terminals 54a and 54b form an open circuit rather than a closed circuit, because there is no wiring electrically connecting the peeling detection input terminals 54a and 54b.

[0164] However, suppose that the IC card 1b has a peeling detection contact 51 in the recess 9 of the card body 2, similar to that of the first embodiment. In this case, when the IC module 70b is embedded in the recess 9 of the card body 2b, the peeling detection input terminals 54a, 54b and the peeling detection contact 51 are arranged to face each other at a distance. In other words, when the IC module 70b is embedded in the recess 9 of the card body 2b, the C4 and C8 terminals of the external connection terminal 71 and the peeling detection contact 51 are arranged to face each other at a distance. In this case, the IC chip 74a and the peeling detection input terminals 54a and 54b form a peeling detection circuit 50b, which is a closed circuit. In this case, the peeling detection input terminals 54a, 54b and the peeling detection contact 51 constitute a capacitance component in the peeling detection circuit 50b. As a result, the IC chip 74a and the peeling detection input terminals 54a and 54b can form the peeling detection circuit 50b, which is a closed circuit.

[0165] On the other hand, suppose the IC module 70a is removed from the IC card 1b and embedded in a recess of another card base. If there are no conductive portions in the recess facing the peeling detection input terminals 54a and 54b, the IC chip 74a and the peeling detection input terminals 54a and 54b do not form a closed circuit, the peeling detection circuit 50b. Conversely, the peeling detection circuit 50b would be in an open state. Therefore, by measuring the capacitance of the peeling detection circuit using the first or second pattern described above, the IC chip 74a of the IC module 70b can determine whether the peeling detection circuit is in the first or second state. As a result, it is possible to determine whether the IC card is a genuine card. In other words, even with the contact-type IC card of the fourth embodiment, peeling of the IC module 70b can be detected using the same principle as with the IC cards of the first to third embodiments.

[0166] In this embodiment, the peeling detection input terminals 54a and 54b are terminals that are not used for contact communication among the external connection terminals 71. In this embodiment, the C4 and C8 terminals are exemplified as terminals that are not used for contact communication among the external connection terminals 71, but any two of the C4, C6, and C8 terminals may be assigned to the peeling detection input terminals 54a and 54b.

[0167] Note that, unlike the second embodiment, since the peeling detection input terminals 54a and 54b are exposed on the surface of the IC card 1b in this embodiment, the charges charged in the capacitance elements formed by the peeling detection input terminals 54a and 54b of the peeling detection circuit 50b and the peeling detection contacts 51 are likely to be discharged to the outside. Alternatively, there is a risk of malfunction due to charges being charged to the peeling detection input terminals 54a and 54b at an unintended timing. Therefore, in this embodiment, an insulating layer 77 is laminated on the surface sides of the C4 and C8 terminals of the external connection terminal 71 constituting the peeling detection input terminals 54a and 54b so as to meet the same conditions as in other embodiments. The insulating layer can be formed by known insulating material coating techniques such as silicone varnish coating, urethane coating, fluorine coating, polyethylene coating, vinyl chloride coating, epoxy coating, polyester coating, acrylic coating, etc.

[0168] Thus, in this embodiment, the peeling detection circuit can be easily formed by diverting the unused terminals of the existing external connection terminal 71 without separately adding a peeling detection input terminal to the IC chip 74a. Needless to say, the IC card 1b of the present disclosure may be a dual interface IC card, and the configuration of an IC card in which the peeling detection input terminals 53a and 53b of the first embodiment and the third embodiment are replaced with the peeling detection input terminals 54a and 54b of this embodiment is also within the scope of the present disclosure.

Explanation of Reference Numerals

[0169] 1, 1a IC card 2, 2a Card substrate 3, 8 Over sheet layer 4, 7 Core layer 5, 6 Antenna holding layer 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 12 Antenna sheet 13 Adhesive layer 50, 50a, 50b Peeling detection circuit 51, 52 Peeling detection contacts 53a, 53b Peel detection input terminals 54a, 54b Peel detection input terminals 70, 70a IC module 71 External connection terminal 71a Insulation groove 72 PCB 73a, 73b Antenna connection terminals 74 IC chip body 74a, 74c IC chip 74b molded part 74p, 74q, 74r pads 75 wire 76 Bonding Hole 77 Insulating layer 80, 80a antenna 83 Antenna Wire 91 First recess 92 Second recess 93 Outer circumference Areas 93a, 93b, and 93c 100, 100a end 110 First Plate 120 Second Plate 130 First bellows section 140 Second bellows section 210, 210a CPUs 220 Contact interface part 230 memory 231 EEPROM 232 RAM 233 ROM 240 Non-contact interface unit 310 Capacity measurement section 320 Status determination unit 330 Internal switch control section

Claims

1. An IC card capable of contact communication with an external device, A card base; an IC module disposed in a recess of the card base, the IC module comprises a substrate, an external connection terminal formed on one surface of the substrate, an IC chip disposed on the other surface of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip; the external connection terminals are arranged so as to be exposed on the surface of the card base, a peeling detection contact that is an electrical conductor is provided on the card base, and the peeling detection contact and the peeling detection input terminal are arranged to partially overlap each other and spaced apart from each other in a plan view of the card base; the IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state, with the peeling detection input terminal and the peeling detection contact constituting a capacitance component; When the peeling detection circuit has a capacitance within a predetermined range, the IC chip determines that the peeling detection circuit is in a first state, If the peel detection circuit does not have a capacitance within a predetermined range, the IC chip determines that the peel detection circuit is in a second state, In the second state, the IC chip limits at least some of the processes that are possible when the peeling detection circuit is in the first state.

2. the peeling detection input terminal is a terminal of the external connection terminal that is not used for contact communication, 2. The IC card according to claim 1, wherein an insulating layer is laminated on the surface of the terminals not used for contact communication.

3. 2. An IC card as described in claim 1, wherein the IC chip determines whether the card is in the first state or the second state by charging a predetermined amount of electric charge from the IC chip of the peel detection circuit and then measuring the capacitance of the peel detection input terminal and the peel detection contact.

4. the IC chip has a built-in switch that opens and closes a part of the peeling detection circuit, 2. An IC card as described in claim 1, wherein the IC chip determines whether the state is the first state or the second state by charging a predetermined amount of electric charge from the IC chip of the peel detection circuit to the peel detection input terminal, then opening the switch and measuring the capacitance of the peel detection circuit.

5. the IC card is a dual interface IC card that is further capable of contactless communication with an external device, an antenna disposed inside the card base; the antenna includes an antenna wire and a plurality of ends, the plurality of tips of the antenna wire and the plurality of ends are electrically connected to each other, and a portion of the ends is exposed in the recess of the card base when the IC module is removed; the IC module further includes a plurality of terminals arranged on the other surface of the substrate; 2. The IC card according to claim 1, wherein the plurality of terminals are electrically connected to the corresponding plurality of end portions on a surface of the end portion facing the opening of the recess.

6. 6. The IC card according to claim 5, wherein the plurality of end portions are bellows portions formed by a structure in which the conductive plate or the antenna wire is repeatedly folded back from the outer periphery of the recess toward the center.

7. 7. The IC card according to claim 6, wherein the plurality of end portions and the peel detection contact are all formed on the conductive plate made of the same material, or are all formed on the bellows portion made of the same material.

8. A method for manufacturing an IC card capable of contact communication with an external device, comprising: a card base provided with a peel detection contact that is an electrical conductor; An IC module, preparing a substrate, an external connection terminal formed on one surface of the substrate, and an IC module disposed on the other surface of the substrate, the IC module including an IC chip electrically connected to the external connection terminal and a peeling detection input terminal electrically connected to the IC chip; forming a recess in the card base for embedding the IC module; a step of embedding the IC module in the recess of the card body so that the external connection terminals are exposed on the surface of the card body, and embedding the IC module in the recess of the card body so that the peeling detection contact and the peeling detection input terminal partially overlap each other in a plan view of the card body and are spaced apart from each other, the IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state, with the peeling detection input terminal and the peeling detection contact constituting a capacitance component; When the peeling detection circuit has a capacitance within a predetermined range, the IC chip determines that the peeling detection circuit is in a first state, If the peel detection circuit does not have a capacitance within a predetermined range, the IC chip determines that the peel detection circuit is in a second state, In the method for manufacturing an IC card, when the peeling detection circuit is in the second state, the IC chip restricts at least some of the processes that are possible when the peeling detection circuit is in the first state.

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