Display device

Abstract

To provide a display device with improved reliability.SOLUTION: A display device according to an embodiment of the present disclosure may include a substrate including a display area including a plurality of pixels and a non-display area around the display area, one or more pixel driving circuits disposed on the substrate, a plurality of inorganic light emitting elements connected to the one or more pixel driving circuits, an optical layer around the plurality of inorganic light emitting elements, and a first passivation layer disposed on the optical layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to a display device. [Background technology]

[0002] Display devices are applied to various electronic devices such as TVs, mobile phones, notebooks, tablets, etc.

[0003] Display devices include organic light emitting displays (OLEDs) that emit light themselves and liquid crystal displays (LCDs) that require a separate light source.

[0004] In recent years, displays incorporating light-emitting diodes (LEDs) have been gaining attention as next-generation display devices. Because LEDs are made of inorganic materials rather than organic materials, they offer faster lighting speeds, superior luminous efficiency, and the ability to display images with high brightness compared to LCDs and OLEDs. Summary of the Invention [Problem to be solved by the invention]

[0005] A display device including an inorganic light-emitting element (for example, a micro LED; Micro Light Emitting Diode) may be susceptible to external moisture penetration, which may reduce the reliability of the display device.

[0006] An object of the present invention is to provide a display device with improved reliability.

[0007] The problems to be solved by the embodiments of the present specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] A display device according to an embodiment of the present specification may include a substrate including a display area including a plurality of pixels and a non-display area surrounding the display area, one or more pixel driving circuits disposed on the substrate, a plurality of inorganic light-emitting elements coupled to the one or more pixel driving circuits, an optical layer surrounding the plurality of inorganic light-emitting elements, a first passivation layer disposed on the optical layer, and trenches disposed between the plurality of inorganic light-emitting elements.

[0009] A display device according to various embodiments of the present disclosure may include a display panel configured with a plurality of pixels each including a plurality of light-emitting elements, and trenches in the plurality of pixels, the trenches including first trenches disposed between the plurality of light-emitting elements and second trenches disposed between the plurality of light-emitting elements.

[0010] A display device according to various embodiments of the present specification may include a substrate including a display area and a non-display area surrounding the display area, a plurality of light-emitting elements in the display area, a plurality of dummy light-emitting elements in the non-display area, a first passivation layer disposed on the plurality of light-emitting elements and the plurality of dummy light-emitting elements, and a trench in the non-display area and disposed between the plurality of dummy light-emitting elements.

[0011] Specific matters according to various examples of the present specification other than the means for solving the problems mentioned above are included in the following description and drawings.

[0012] According to the present specification, the display device can be protected from moisture penetration from the outside, and therefore the reliability of the display device can be improved.

[0013] Since moisture penetration from the outside of the display device can be prevented, the life of the display device can be improved, thereby reducing the power consumption of the display device and providing a display device that can be driven with low power.

[0014] The probability of defective transfer of light emitting elements during the manufacturing process of a display panel can be reduced, thereby improving the productivity of display devices.

[0015] The effects of this specification are not limited to those mentioned above, and other effects not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the technical idea of ​​this specification belongs from the following description. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is an exploded perspective view of a display device according to an embodiment of the present specification; [Figure 2] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 3] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 4] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 5] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 6] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 7] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 8] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 9] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 10] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 11] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 12] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 13] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 14] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 15] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 16] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 17] 1 is a plan view illustrating a display device according to an embodiment of the present specification. [Figure 18] 1 is an enlarged view illustrating a display device according to an embodiment of the present specification. [Figure 19] FIG. 1 illustrates a circuit structure according to an embodiment of the present specification. [Figure 20] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 21] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 22] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 23] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 24] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 25] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 26] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 27] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 28] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 29] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 30] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 31] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 32] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 33] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 34] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 35] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 36] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 37] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 38] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present specification. [Figure 39] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 40] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 41] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 42] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present specification is applied. DETAILED DESCRIPTION OF THE INVENTION

[0017] The advantages and features of the present specification, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, and may be embodied in various different forms. These embodiments are provided solely to ensure that the disclosure of the present specification is complete and to fully convey the scope of the invention to those skilled in the art.

[0018] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating the embodiments of this specification are illustrative only and the specification is not limited to the details shown in the drawings. The same reference symbols refer to the same elements throughout this specification. Furthermore, when describing this specification, if a detailed description of related prior art is deemed to unnecessarily obscure the gist of this specification, such a detailed description will be omitted. When the terms "comprise," "have," or "consist of" are used in this specification, other parts may be added unless "only" or "only" is used. When an element is expressed in the singular, it may also include a plural, unless otherwise expressly specified.

[0019] When interpreting elements, they are interpreted as including a range of error even if there is no separate explicit description of the range of error.

[0020] When describing a positional relationship between two parts, for example, using terms such as "above," "on top of," "below," "next to," or "adjacent," one or more other parts may be located between the two parts, as long as terms such as "immediately," "directly," or "close to" are not used.

[0021] When describing a temporal relationship, if the temporal sequence is described using terms such as "after," "following," "next," or "before," then "immediately" or "directly" are not used, it can also include cases where the relationship is not consecutive.

[0022] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical concept of this specification.

[0023] In describing elements of the present specification, terms such as first, second, A, B, (a), or (b) may be used. These terms are used only to distinguish the elements from other elements, and do not limit the nature, order, sequence, or number of the elements.

[0024] When a component is described as being "coupled," "coupled," "connected," or "attached," "mounted," or "mounted" to another component, it should be understood that the component can be directly coupled, coupled, connected, or attached, mounted, or mounted to the other component, but that there can also be other components between the components that are indirectly coupled, coupled, connected, or attached, mounted, or mounted, unless otherwise expressly stated.

[0025] When a component or layer is described as "contacting" or "overlapping" another component or layer, it should be understood that the component or layer can directly contact or be overlaid on the other component or layer, but that other components can also be interposed between components that can indirectly contact or be overlaid unless otherwise explicitly stated.

[0026] "At least one" should be understood to include all combinations of one or more of the associated components. For example, "at least one of a first, second, and third component" means not only the first, second, or third component, but also all combinations of two or more of the first, second, and third components.

[0027] The terms "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be construed solely as having a geometric relationship in which the relationship between them is perpendicular, but may also mean having a broader directionality within the range in which the configuration of this specification can function.

[0028] The features of the various embodiments of this specification may be partially or fully combined or combined with each other, and various technical interlocking and driving mechanisms may be possible, and each embodiment may be performed independently or in conjunction with each other.

[0029] Various embodiments of the present specification will now be described in detail with reference to the accompanying drawings.

[0030] Fig. 1 is an exploded perspective view showing a display device according to an embodiment of the present specification. Fig. 2 is a plan view showing a display device according to an embodiment of the present specification. Fig. 3 is a plan view showing a display device according to an embodiment of the present specification. Fig. 18 is an enlarged view showing a display device according to an embodiment of the present specification.

[0031] As shown in Figures 1, 2, and 18, the display device 1000 according to an embodiment of the present specification may include a display panel 100, a polarizing layer 293, an adhesive layer 295, a cover member 120, a support substrate 110, a flexible circuit board CB, and a printed circuit board 160.

[0032] For example, the display device 1000 may include a substrate 110. The substrate 110 may be a member that supports other components of the display device 1000. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide (PI). However, the embodiments of the present specification are not limited thereto.

[0033] The display panel 100 can realize information, pictures, and / or images to be provided to a user. For example, the display panel 100 can include a display area AA and a non-display area NA. For example, the substrate 110 can include the display area AA and the non-display area NA. The display area AA and the non-display area NA are not limited to the substrate 110, but can be described in terms of the entire display device 1000.

[0034] The display area AA may be an area where an image is displayed. The display area AA may include a plurality of pixels PX. Each of the plurality of pixels PX may be composed of a plurality of sub-pixels. A plurality of light-emitting elements may be arranged in each of the plurality of sub-pixels. The plurality of light-emitting elements may be configured differently depending on the type of display device 1000. For example, if the display device 1000 is an inorganic light-emitting display device, the light-emitting elements may be LEDs (Light-emitting Diodes), micro LEDs (Micro Light-emitting Diodes), or mini LEDs (Mini Light-emitting Diodes), but the embodiments and the like of the present specification are not limited thereto.

[0035] The non-display area NA may be an area where no image is displayed. The non-display area NA may be located on the periphery of the display area AA or may surround the display area AA. Various wiring and circuits for driving the pixels PX of the display area AA may be disposed in the non-display area NA. For example, various wiring and driving circuits may be implemented in the non-display area NA, and a pad unit PAD to which an integrated circuit, a printed circuit, etc. may be connected may be disposed, but the embodiments of the present specification are not limited thereto.

[0036] For example, the driving circuit may be a data driving circuit and / or a gate driving circuit, although the embodiments of the present specification are not limited thereto. Wiring to which control signals for controlling the driving circuits are supplied may be arranged in the display panel 100. For example, the control signals may include various timing signals, including a clock signal, an input data enable signal, and a synchronization signal, although the embodiments of the present specification are not limited thereto. The control signals may be received via a pad unit PAD. For example, link wiring LL for transmitting signals may be arranged in the non-display area NA. For example, driving components such as a flexible circuit board CB and a printed circuit board 160 may be connected to the pad unit PAD.

[0037] According to the present specification, the non-display area NA may include a first non-display area NA1, a bending area BA, and a second non-display area NA2. For example, the first non-display area NA1 may be an area surrounding at least a portion of the display area AA. The bending area BA may be an area extending from at least one of the multiple sides of the first non-display area NA1 and may be a bendable area. The second non-display area NA2 is an area extending from the bending area BA and may have a pad section PAD disposed therein. For example, the bending area BA may be curved, and the remaining area of ​​the substrate 110 excluding the bending area BA may be flat. In this case, by bending the bending area BA, the second non-display area NA2 may be positioned on the back surface of the display area AA. However, the embodiments of the present specification are not limited thereto.

[0038] The trench T in FIG. 3 will be described later with reference to FIGS.

[0039] The display area AA of the substrate 110 or the display device 1000 may be configured in various shapes depending on the design of the display device 1000. For example, the display area AA may be configured in a rectangular shape with four rounded corners, but the embodiments of the present specification are not limited thereto. As another example, the display area AA may be configured in a rectangular shape with four right-angled corners or a circular shape, but the embodiments of the present specification are not limited thereto.

[0040] According to the present specification, the width of the second non-display area NA2 where the plurality of pad electrodes PE are arranged may be wider than the width of the bending area BA where only the plurality of link lines LL are arranged. Also, the width of the display area AA where the plurality of sub-pixels are arranged may be wider than the width of the bending area BA where only the plurality of link lines LL are arranged. Although the drawings illustrate that the width of the bending area BA is narrower than the width of other areas of the substrate 110, the shape of the substrate 110 including the bending area BA is merely an example, and the embodiments of the present specification are not limited thereto.

[0041] As shown in FIG. 18 , multiple pixel driving circuits PD may be arranged in the display area AA. The multiple pixel driving circuits PD may be circuits for driving light-emitting elements of multiple sub-pixels. Each of the multiple pixel driving circuits PD includes multiple transistors, including driving transistors, and storage capacitors, and can supply control signals, power, and driving currents to the light-emitting elements of the multiple sub-pixels to control the light-emitting operations of the multiple light-emitting elements. For example, the pixel driving circuit PD may include power wiring and signal wiring for controlling the light-emitting on / off and / or light-emitting time of the light-emitting elements. For example, the multiple pixel driving circuits PD may be driver circuits manufactured on a semiconductor substrate using a MOSFET (Metal-Oxide-Silicon Field Effect Transistor) manufacturing process, but the embodiments of the present specification are not limited thereto. The driver circuit includes multiple pixel driving circuits PD and can drive multiple sub-pixels.

[0042] 1, a flexible circuit board CB and a printed circuit board 160 may be disposed below the display panel 100. The flexible circuit board CB and the printed circuit board 160 may be disposed at least on one side of the display panel 100, although embodiments of the present specification are not limited thereto. One side of the flexible circuit board CB may be attached to the display panel 100 and the other side may be attached to the printed circuit board 160, although embodiments of the present specification are not limited thereto. The flexible circuit board CB may be a flexible film, although embodiments of the present specification are not limited thereto.

[0043] A pad unit PAD including a plurality of pad electrodes PE may be arranged in the second non-display area NA2. Driving components including one or more flexible circuit boards (or flexible films) CB and a printed circuit board 160 may be attached or bonded to the pad unit PAD. The plurality of pad electrodes PE of the pad unit PAD are electrically connected to the one or more flexible circuit boards (or flexible films) CB and can transmit various signals (or power) from the printed circuit board 160 and the flexible circuit boards (or flexible films) CB to a plurality of pixel driving circuits PD in the display area AA.

[0044] The flexible circuit board (or flexible film) CB may be a film in which various components are disposed on a flexible base film. For example, a driving IC such as a gate driver IC or a data driver IC may be disposed on the flexible circuit board (or flexible film) CB, but the embodiments of the present specification are not limited thereto. The driving IC may be a component that processes data and driving signals for displaying images. Depending on the mounting method, the driving IC may be disposed in a manner such as chip-on-glass (COG), chip-on-film (COF), or tape carrier package (TCP), but the embodiments of the present specification are not limited thereto. The flexible circuit board (or flexible film) CB may be attached or bonded to a plurality of pad electrodes PE via a conductive adhesive layer, but the embodiments of the present specification are not limited thereto.

[0045] The printed circuit board 160 may be electrically connected to one or more flexible circuit boards (or flexible films) CB and may be a component that supplies signals to the driving ICs. The printed circuit board 160 may be disposed on one side of the flexible circuit boards (or flexible films) CB and electrically connected to the flexible circuit boards (or flexible films) CB. Various components for supplying various signals to the driving ICs may be disposed on the printed circuit board 160. For example, various components such as a timing controller, a power supply, a memory, or a processor may be disposed on the printed circuit board 160. For example, the printed circuit board 160 may include a power management integrated circuit (PMIC), although embodiments of the present specification are not limited thereto.

[0046] The printed circuit board 160 may include at least one hole 180, although embodiments and the like herein are not limited thereto. An internal component for sensing ambient light or temperature, which may be provided as a plurality of sensors, may be disposed in an area corresponding to the at least one hole 180. For example, the internal component may include an ambient light sensor (ALS) or a temperature sensor, although embodiments and the like herein are not limited thereto. For example, the hole 180 may be a transmission hole, although embodiments and the like herein are not limited thereto.

[0047] 1, a polarizing layer 293 may be disposed on the display panel 100. The polarizing layer 293 may prevent or reduce light generated from an external light source from entering the display panel 100 and affecting light-emitting elements, etc.

[0048] The cover member 120 may be disposed on the polarizing layer 293. The cover member 120 may be a member for protecting the display panel 100. An adhesive layer 295 may be disposed between the polarizing layer 293 and the cover member 120. The adhesive layer 295 may attach the cover member 120 to the display panel 100. The adhesive layer 295 may include an optically cleared adhesive (OCA), an optically cleared resin (OCR), a pressure sensitive adhesive (PSA), or the like, but the embodiments and the like of the present specification are not limited thereto.

[0049] A support substrate 110 may be disposed between the display panel 100 and the printed circuit board 160. The support substrate 110 may reinforce the rigidity of the display panel 100. The support substrate 110 may be a backplate, but the embodiments and the like of the present specification are not limited thereto.

[0050] 1, 2, and 18, a plurality of link wirings LL may be arranged in the non-display area NA. The plurality of link wirings LL may be wirings that transmit various signals from one or more flexible circuit boards (or flexible films) CB and printed circuit board 160 to the display area AA. The plurality of link wirings LL may extend from the plurality of pad electrodes PE in the second non-display area NA2 toward the bending area BA and the first non-display area NA1 and be electrically connected to the plurality of drive wirings VL in the display area AA. The plurality of pixel drive circuits PD may be driven by receiving signals from one or more flexible circuit boards (or flexible films) CB and printed circuit board 160 via the drive wirings VL in the display area AA and the link wirings LL in the non-display area NA.

[0051] For example, the plurality of drive wirings VL, together with the plurality of link wirings LL, may be wirings for transmitting signals output from the flexible circuit board (or flexible film) CB and the printed circuit board 160 to the plurality of pixel driving circuits PD. The plurality of drive wirings VL may be disposed in the display area AA and electrically connected to each of the plurality of pixel driving circuits PD. The plurality of drive wirings VL may extend from the display area AA toward the non-display area NA and electrically connected to the plurality of link wirings LL. Therefore, signals output from the flexible circuit board (or flexible film) CB and the printed circuit board 160 may be transmitted to each of the plurality of pixel driving circuits PD via the plurality of link wirings LL and the plurality of drive wirings VL.

[0052] As the bending area BA is bent, portions of the link lines LL may also be bent. Stress may be concentrated in the bent portions of the link lines LL, which may cause cracks in the link lines LL. Therefore, the link lines LL may be made of a conductive material with excellent flexibility to reduce cracks during bending of the bending area BA. For example, the link lines LL may be made of a conductive material with excellent flexibility, such as gold (Au), silver (Ag), or aluminum (Al), but the embodiments of the present specification are not limited thereto. The link lines LL may also be made of one of various conductive materials used in the display area AA. For example, the link lines LL may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of silver (Ag) and magnesium (Mg), or alloys thereof, but the embodiments of the present specification are not limited thereto. The link lines LL may have a multilayer structure including various conductive materials. For example, the link wirings LL may be configured with a triple layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments and the like of the present specification are not limited to this.

[0053] The link wires LL may be configured in various shapes to reduce stress. At least a portion of the link wires LL arranged on the bending area BA may extend in the same direction as the extension direction of the bending area BA, or may extend in a direction different from the extension direction of the bending area BA to reduce stress. For example, if the bending area BA extends in one direction from the first non-display area NA1 to the second non-display area NA2, at least a portion of the link wires LL arranged on the bending area BA may extend in a direction oblique to the one direction. As another example, at least a portion of the link wires LL may be configured in various patterns. For example, at least a portion of the link wires LL arranged on the bending area BA may have a shape in which conductive patterns having at least one of the following shapes are repeatedly arranged: diamond, rhombus, trapezoid, triangular wave, sawtooth, sine wave, circular, and omega (Ω) shapes; however, the embodiments of the present specification are not limited thereto. Therefore, in order to minimize the stress concentrated on the link wires LL and the resulting cracks, the shape of the link wires LL may be various shapes including the shapes described above, but the embodiments of the present specification are not limited thereto.

[0054] 4 to 6 are plan views showing display devices according to embodiments of the present specification.

[0055] 4 and 6 are enlarged views of a display area including a plurality of pixels, and are partial enlarged views showing an enlarged portion A (A) of FIG.

[0056] 5 is an enlarged view of a display area including one pixel, and is a partial enlarged view showing one pixel PX.

[0057] 4 and 5, only a plurality of signal wirings TL, a plurality of communication wirings NL, a plurality of first electrodes CE1, a plurality of banks BNK, and a plurality of light-emitting elements ED are illustrated, but the embodiments of the present specification are not limited to this. Fig. 6 is an enlarged plan view in which a plurality of second electrodes CE2 are further arranged in Fig. 4.

[0058] 4 and 5, a plurality of pixels PX each including a plurality of sub-pixels may be arranged in a display area AA. Each of the plurality of sub-pixels may include a light-emitting element ED and independently emit light. The plurality of sub-pixels may be arranged in a matrix having a plurality of rows and a plurality of columns, although the embodiments of the present specification are not limited thereto.

[0059] The plurality of subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be a red subpixel, another may be a green subpixel, and the remaining may be blue subpixels. The types of the plurality of subpixels are merely exemplary, and the embodiments and the like of the present specification are not limited thereto.

[0060] Each of the pixels PX may include one or more first subpixels SP1, one or more second subpixels SP2, and one or more third subpixels SP3. For example, one pixel PX may include a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3. The pair of first subpixels SP1 may be composed of a 1-1 subpixel SP1a and a 1-2 subpixel SP1b. The pair of second subpixels SP2 may be composed of a 2-1 subpixel SP2a and a 2-2 subpixel SP2b. The pair of third subpixels SP3 may be composed of a 3-1 subpixel SP3a and a 3-2 subpixel SP3b. For example, one pixel PX may include a 1-1 subpixel SP1a and a 1-2 subpixel SP1b, a 2-1 subpixel SP2a and a 2-2 subpixel SP2b, and a 3-1 subpixel SP3a and a 3-2 subpixel SP3b, but the embodiments and the like of this specification are not limited to this.

[0061] The subpixels constituting one pixel PX may be arranged in various ways. For example, in one pixel PX, a pair of first subpixels SP1 may be arranged in the same column, a pair of second subpixels SP2 may be arranged in the same column, and a pair of third subpixels SP3 may be arranged in the same column. The first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be arranged in the same row. The number and arrangement of the subpixels constituting one pixel PX are merely examples, and the embodiments and the like of this specification are not limited thereto.

[0062] A plurality of signal lines TL may be arranged in regions between the plurality of subpixels. The plurality of signal lines TL may extend in the column direction from between the plurality of subpixels. The plurality of signal lines TL may be lines that transmit an anode voltage from a pixel driving circuit PD to the plurality of subpixels. For example, the plurality of signal lines TL may be electrically connected to the plurality of pixel driving circuits PD and the first electrodes CE1 of the plurality of subpixels. The anode voltage output from the pixel driving circuit PD may be transmitted to the first electrodes CE1 of the plurality of subpixels via the plurality of signal lines TL. For example, the first electrodes CE1 may be electrodes electrically connected to the anode electrodes 134 of the light-emitting elements ED. Thus, the anode voltage from the signal lines TL may be transmitted to the anode electrodes 134 of the light-emitting elements ED via the first electrodes CE1.

[0063] Therefore, instead of forming multiple transistors and storage capacitors in each of the multiple subpixels, the structure of the display device 1000 can be simplified by using a pixel driving circuit PD in which multiple pixel circuits are integrated. Furthermore, by integrating circuits disposed in each of the multiple subpixels SP into a single pixel driving circuit PD, highly efficient, low-power driving may be possible. Integrating circuits disposed in each of the multiple subpixels SP into a single pixel driving circuit PD may mean that the pixel driving circuit PD includes multiple pixel circuits capable of driving multiple light-emitting elements ED. Multiple light-emitting elements ED can be driven by a single pixel driving circuit PD in which multiple pixel circuits are integrated. For example, the first light-emitting element 130a, the second light-emitting element 140a, and the third light-emitting element 150a can be driven by a single pixel driving circuit PD in which multiple pixel circuits are integrated. For example, the light-emitting element ED may have a vertical structure, but the embodiments of the present specification are not limited thereto.

[0064] The plurality of signal lines TL may include a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. Each of the first signal line TL1 and the second signal line TL2 may be electrically connected to each of the pair of first sub-pixels SP1. Each of the third signal line TL3 and the fourth signal line TL4 may be electrically connected to each of the pair of second sub-pixels SP2. Each of the fifth signal line TL5 and the sixth signal line TL6 may be electrically connected to each of the pair of third sub-pixels SP3.

[0065] A first signal line TL1 may be arranged on one side of the pair of first subpixels SP1, and a second signal line TL2 may be arranged on the other side of the pair of first subpixels SP1. The first signal line TL1 may be electrically connected to the first electrode CE1 of one of the pair of first subpixels SP1, for example, the 1-1th subpixel SP1a. The second signal line TL2 may be electrically connected to the first electrode CE1 of the other of the pair of first subpixels SP1, for example, the 1-2th subpixel SP1b.

[0066] A third signal line TL3 may be arranged on one side of the pair of second subpixels SP2, and a fourth signal line TL4 may be arranged on the other side of the pair of second subpixels SP2. For example, the third signal line TL3 may be arranged adjacent to the second signal line TL2. The third signal line TL3 may be electrically connected to the first electrode CE1 of one of the pair of second subpixels SP2, for example, the 2-1st subpixel SP2a. The fourth signal line TL4 may be electrically connected to the first electrode CE1 of the other of the pair of second subpixels SP2, for example, the 2-2nd subpixel SP2b.

[0067] A fifth signal line TL5 may be arranged on one side of the pair of third subpixels SP3, and a sixth signal line TL6 may be arranged on the other side of the pair of third subpixels SP3. For example, the fifth signal line TL5 may be arranged adjacent to the fourth signal line TL4. The sixth signal line TL6 may be arranged adjacent to the first signal line TL1 connected to the adjacent pixel PX. The fifth signal line TL5 may be electrically connected to the first electrode CE1 of one of the pair of third subpixels SP3, for example, the 3-1 subpixel SP3a. The sixth signal line TL6 may be electrically connected to the first electrode CE1 of the other of the pair of third subpixels SP3, for example, the 3-2 subpixel SP3b.

[0068] The signal wirings TL may be made of a conductive material. For example, the signal wirings TL may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present specification are not limited thereto. As another example, the signal wirings TL may be made of a multi-layer structure of conductive materials. For example, the signal wirings TL may be made of a titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO) multi-layer structure, but the embodiments of the present specification are not limited thereto.

[0069] A plurality of communication lines NL may be arranged in the region between the plurality of pixels PX. The plurality of communication lines NL may be arranged extending in the row direction from the region between the plurality of pixels PX. The plurality of communication lines NL may be arranged in the region between the plurality of second electrodes CE2 and may not overlap the plurality of second electrodes CE2. For example, the plurality of communication lines NL may be lines used for short-range communication such as NFC (Near Field Communication). The plurality of communication lines NL may function as an antenna. For example, the plurality of communication lines NL may be a plurality of connecting lines, but the embodiments and the like of this specification are not limited thereto.

[0070] According to the present specification, a bank BNK may be disposed in each of a plurality of sub-pixels. The plurality of banks BNK may be structures to which a plurality of light-emitting elements ED are fixed. The plurality of banks BNK may guide the positions of the plurality of light-emitting elements ED in a transfer process for transferring the plurality of light-emitting elements ED to the display device 1000. In a transfer process for the plurality of light-emitting elements ED, the plurality of light-emitting elements ED may be transferred onto the plurality of banks BNK. The plurality of banks BNK may be bank patterns or structures, but the embodiments of the present specification are not limited thereto.

[0071] The banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 can be spaced apart from one another. The banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 can be configured to be separated from one another. This makes it easy to distinguish the banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3, to which different types of light-emitting elements ED are transferred.

[0072] The bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b may be connected to each other, or may be spaced apart or separated from each other. For example, taking into consideration design requirements such as transfer process requirements, the bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b, in which the same type of light-emitting element ED is arranged, may be connected to each other, spaced apart or separated from each other. The bank BNK of the 2-1 subpixel SP2a and the bank BNK of the 2-2 subpixel SP2b may be connected to each other, or may be spaced apart or separated from each other. The bank BNK of the 3-1 subpixel SP3a and the bank BNK of the 3-2 subpixel SP3b may be connected to each other, or may be spaced apart or separated from each other. Therefore, the banks BNK of the pair of first subpixels SP1, the banks BNK of the pair of second subpixels SP2, and the banks BNK of the pair of third subpixels SP3 can be formed in various ways, and the embodiments of this specification are not limited thereto.

[0073] For example, the plurality of banks BNK may be made of an organic insulating material. The plurality of banks BNK may be made of a single layer or multiple layers of an organic insulating material. For example, the plurality of banks BNK may be made of a photoresist, polyimide (PI), an acrylic-based material, or the like, but the embodiments of the present specification are not limited thereto.

[0074] A first electrode CE1 may be disposed in each of the plurality of subpixels. The first electrode CE1 may be disposed on a bank BNK. The first electrode CE1 may be electrically connected to one signal line TL among the plurality of signal lines TL. At least a portion of the first electrode CE1 may extend outside the bank BNK and be electrically connected to the signal line TL closest to the first electrode CE1. For example, a portion of the first electrode CE1 of the 1-1 subpixel SP1a may extend to one side region of the 1-1 subpixel SP1a and be electrically connected to the first signal line TL1, and a portion of the first electrode CE1 of the 1-2 subpixel SP1b may extend to the other side region of the 1-2 subpixel SP1b and be electrically connected to the second signal line TL2. A portion of the first electrode CE1 of the 2-1 subpixel SP2a extends to one side region of the 2-1 subpixel SP2a and is electrically connected to the third signal line TL3, a portion of the first electrode CE1 of the 2-2 subpixel SP2b extends to the other side region of the 2-2 subpixel SP2b and is electrically connected to the fourth signal line TL4, a portion of the first electrode CE1 of the 3-1 subpixel SP3a extends to one side region of the 3-1 subpixel SP3a and is electrically connected to the fifth signal line TL5, and a portion of the first electrode CE1 of the 3-2 subpixel SP3b extends to the other side region of the 3-2 subpixel SP3b and is electrically connected to the sixth signal line TL6.

[0075] The first electrode CE1 is electrically connected to the anode electrode 134 of the light-emitting element ED and can transmit an anode voltage from the pixel driving circuit PD to the light-emitting element ED via the signal line TL. Different voltages can be applied to the first electrodes CE1 of the plurality of sub-pixels depending on the image to be displayed. For example, different voltages can be applied to the first electrodes CE1 of the plurality of sub-pixels. Therefore, the first electrodes CE1 may be pixel electrodes, and the embodiments of the present specification are not limited thereto.

[0076] The first electrode CE1 may be made of a conductive material. For example, the first electrode CE1 may be integrally formed with the plurality of signal lines TL. For example, the first electrode CE1 may be made of the same conductive material as the plurality of signal lines TL, but the embodiments of the present specification are not limited thereto. For example, the first electrode CE1 may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but the embodiments of the present specification are not limited thereto. As another example, the first electrode CE1 may be made of a multi-layer structure of conductive materials. For example, the plurality of first electrodes CE1 may be made of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but the embodiments and the like of the present specification are not limited thereto.

[0077] A light-emitting element ED may be disposed in each of the plurality of sub-pixels. The light-emitting elements ED may be either light-emitting diodes (LEDs) or micro light-emitting diodes (micro LEDs), but the embodiments of the present specification are not limited thereto. The light-emitting elements ED may be disposed on the bank BNK and the first electrode CE1. The light-emitting elements ED may be disposed on the first electrode CE1 and electrically connected to the first electrode CE1. Therefore, the light-emitting elements ED may emit light when an anode voltage is applied from the pixel driving circuit PD via the signal line TL and the first electrode CE1.

[0078] The plurality of light-emitting elements ED may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be disposed in a first sub-pixel SP1. The second light-emitting element 140 may be disposed in a second sub-pixel SP2. The third light-emitting element 150 may be disposed in a third sub-pixel SP3. For example, one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the remaining may be blue light-emitting elements; however, the embodiments and the like herein are not limited thereto. As a result, light of various hues, including white, can be realized by combining the red light, green light, and blue light emitted from the plurality of light-emitting elements ED. The types of the plurality of light-emitting elements ED are merely exemplary, and the embodiments and the like herein are not limited thereto.

[0079] The first light-emitting element 130 may include a 1-1 light-emitting element 130a arranged in a 1-1 sub-pixel SP1a and a 1-2 light-emitting element 130b arranged in a 1-2 sub-pixel SP1b. The second light-emitting element 140 may include a 2-1 light-emitting element 140a arranged in a 2-1 sub-pixel SP2a and a 2-2 light-emitting element 140b arranged in a 2-2 sub-pixel SP2b. The third light-emitting element 150 may include a 3-1 light-emitting element 150a arranged in a 3-1 sub-pixel SP3a and a 3-2 light-emitting element 150b arranged in a 3-2 sub-pixel SP3b.

[0080] 4 to 6, a second electrode CE2 may be disposed in each of the plurality of sub-pixels. The second electrode CE2 may be disposed on the light-emitting element ED. The second electrode CE2 may be electrically connected to the pixel driving circuit PD via a plurality of contact electrodes CCE.

[0081] For example, the second electrode CE2 may be electrically connected to the cathode electrode 135 of the light-emitting element ED and transmit a cathode voltage from the pixel driving circuit PD to the light-emitting element ED. The same cathode voltage may be applied to the second electrode CE2 of each of the plurality of sub-pixels. For example, the same voltage may be applied to the second electrode CE2 of each of the plurality of sub-pixels and the cathode electrode 135 of the light-emitting element ED. Thus, the second electrode CE2 may be a common electrode, but the embodiments of the present specification are not limited thereto.

[0082] At least some of the subpixels may share the second electrode CE2. At least some of the second electrodes CE2 of the subpixels may be electrically connected to one another. The same voltage may be applied to the second electrode CE2, allowing the second electrode CE2 of at least some of the subpixels to be shared. For example, the second electrodes CE2 of at least some of the pixels PX arranged in the same row may be connected to one another. For example, one second electrode CE2 may be arranged for multiple pixels PX. One second electrode CE2 may be arranged for every n subpixels.

[0083] For example, some of the second electrodes CE2 of the plurality of subpixels may be spaced apart or separated from each other. For example, the second electrode CE2 connected to the pixels PX in the nth row and the second electrode CE2 connected to the pixels PX in the (n+1)th row may be spaced apart or separated from each other. For example, the plurality of second electrodes CE2 may be spaced apart from each other across a plurality of communication lines NL extending in the row direction. As a result, the number of the plurality of subpixels may be greater than the number of the plurality of second electrodes CE2. As another example, all of the second electrodes CE2 of the plurality of subpixels may be connected to each other, and only one second electrode CE2 may be disposed on the substrate 110; however, the embodiments of the present specification are not limited thereto.

[0084] The plurality of second electrodes CE2 may be made of a transparent conductive material, but embodiments of the present specification are not limited thereto. The plurality of second electrodes CE2 may be made of a transparent conductive material and may direct light emitted from the light emitting element ED toward the top of the second electrodes CE2. For example, the second electrodes CE2 may be made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but embodiments of the present specification are not limited thereto.

[0085] A plurality of contact electrodes CCE may be arranged on the substrate 110. For example, the plurality of contact electrodes CCE may be arranged at a distance from the plurality of banks BNK and the plurality of signal wirings TL. Each of the plurality of second electrodes CE2 may overlap at least one contact electrode CCE. For example, one second electrode CE2 may overlap a plurality of contact electrodes CCE.

[0086] For example, the contact electrodes CCE may be electrically connected to the second electrodes CE2. The contact electrodes CCE may be disposed between the substrate 110 and the second electrodes CE2 to transmit a cathode voltage from the pixel driving circuit PD to the second electrodes CE2.

[0087] For example, when micro LEDs are used as the light emitting elements ED, the display device 1000 can be manufactured by forming multiple micro LEDs on a wafer and transferring the micro LEDs to the substrate 110 of the display device 1000. Various defects may occur during the process of transferring multiple light emitting elements ED having minute sizes from the wafer to the substrate 110. For example, a transfer defect may occur in which the light emitting element ED is not transferred to some subpixels, and a transfer defect may occur in which the light emitting element ED is transferred out of position due to an alignment error to other subpixels. Furthermore, the transfer process may proceed normally, but the transferred light emitting element ED itself may be defective. Therefore, taking into account defects during the transfer process of multiple light emitting elements ED, multiple light emitting elements ED of the same type may be transferred to one subpixel. A lighting test of multiple light emitting elements ED is performed, and only one light emitting element ED that is ultimately determined to be normal may be used.

[0088] For example, both the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b can be transferred to one pixel PX and inspected for defects. If both the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b are determined to be normal, only the 1-1 light-emitting element 130a can be used, and the 1-2 light-emitting element 130b can be left unused. As another example, if, of the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b, only the 1-2 light-emitting element 130b is determined to be normal, the 1-1 light-emitting element 130a can be left unused, and only the 1-2 light-emitting element 130b can be used. Therefore, even if multiple light-emitting elements ED of the same type are transferred to one pixel PX, ultimately only one light-emitting element ED can be used.

[0089] Therefore, one of the pair of light emitting elements ED may be a main (or primary) light emitting element ED, and the other may be a redundancy light emitting element ED. The redundancy light emitting element ED may be an extra light emitting element ED transferred in preparation for a defect in the main light emitting element ED. When the main light emitting element ED is defective, the redundancy light emitting element ED can be used in place of the main light emitting element ED. Therefore, by transferring both the main light emitting element ED and the redundancy light emitting element ED to one pixel PX, it is possible to minimize degradation of display quality due to defects in the main light emitting element ED and the redundancy light emitting element ED.

[0090] For example, the 1-1 light-emitting element 130a, the 2-1 light-emitting element 140a, and the 3-1 light-emitting element 150a transferred to one pixel PX can be used as the main light-emitting element ED, and the 1-2 light-emitting element 130b, the 2-2 light-emitting element 140b, and the 3-2 light-emitting element 150b can be used as the redundancy light-emitting element ED.

[0091] 7 to 17 are plan views showing display devices according to embodiments of the present specification.

[0092] 7 to 12 are partial enlarged views (B1, B2, B3, B4, B5, B6) showing an enlarged view of part B (B) of FIG. 3. FIGS. 7 to 12 show display devices according to first to sixth embodiments, respectively. Components having substantially the same functions among the embodiments are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0093] 7 to 12, the display device according to the first embodiment can include a display area AA and a first non-display area NA1. The display area AA can include a plurality of light-emitting elements 130, 140, and 150, a second electrode CE2, a first optical layer 117a, a second optical layer 117b, and a third optical layer 117c. The first non-display area NA1 can include a plurality of light-emitting elements 130, 140, and 150, the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c.

[0094] The plurality of light-emitting elements 130, 140, 150 arranged in the display area AA can emit light by applying a high potential power supply voltage to the first electrode by disposing a plurality of second electrodes CE2. The second electrode CE2 can be formed to entirely cover the plurality of pixels so as to be common to the plurality of pixels. The second electrode CE2 can be formed to be common only to the plurality of light-emitting elements 130, 140, 150 arranged in each pixel. However, the present invention is not limited to this.

[0095] The plurality of light-emitting elements 130, 140, and 150 arranged in the display area AA and the first non-display area NA1 may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may respectively realize a first color, a second color, and a third color. The first, second, and third colors may be different hues. For example, the first, second, and third colors may be any one of red, green, and blue so as not to overlap with each other, but the embodiments herein are not limited thereto. For example, the first color may be red, the second color may be green, and the third color may be blue, but are not limited thereto.

[0096] The first light-emitting element 130 may have a first size, the second light-emitting element 140 may have a second size, and the third light-emitting element 150 may have a third size. The first size may be different from the second size and / or the third size. The first size may be larger than the second size and / or the third size. By designing the first size of the first light-emitting element 130 that achieves a first color to be different from the second size of the second light-emitting element 140 and / or the size of the third light-emitting element 150, the light efficiency of the display device 1000 may be improved.

[0097] The first non-display area NA1 may include a dummy area DUA. The dummy area DUA may include dummy pixels including a plurality of dummy light-emitting elements. The first non-display area NA1 in which the plurality of dummy light-emitting elements are arranged may not be provided with a second electrode CE2. Therefore, even if a high potential power supply voltage is applied to the first electrode arranged in the dummy light-emitting element, the dummy light-emitting element may not be able to emit light.

[0098] As further shown in FIG. 3, the first non-display area NA1 may include an area where the trench T is disposed. The area where the trench T is disposed may be formed to have substantially the same shape as the first non-display area NA1. For example, the first non-display area NA1 may be rectangular with four rounded corners. In this case, the area where the trench T is disposed may also be rectangular with four rounded corners. The area of ​​the rectangle formed around the outermost periphery of the area where the trench T is disposed may be smaller than the area of ​​the rectangle formed around the outermost periphery of the first non-display area NA1. The area where the trench T is formed may be disposed to surround a plurality of pixels PX.

[0099] In one embodiment, the display area AA includes an area where trenches T are formed. The area where trenches T are formed can be arranged to surround a plurality of pixels PX.

[0100] The trench T may be arranged to surround the plurality of pixels PX. At least a portion of the trench T may be arranged between the plurality of light-emitting elements 130, 140, and 150. The plurality of light-emitting elements 130, 140, and 150 may be arranged in the display area AA and / or the first non-display area NA1. The trench T may be arranged between the display area AA and the bending area BA. The trench T may be arranged between the display panel 100 and the bending area BA. The trench T may be arranged between at least a portion of the display panel 100 and the bending area BA.

[0101] As shown in FIG. 7 , a first trench T1 may be disposed between the plurality of light emitting elements 130, 140, and 150. The first trench T1 may be disposed to extend in a first direction (e.g., the X-axis direction). The first trench T1 may be disposed between the first light emitting element 130 and the second light emitting element 140, but is not limited thereto. The first trench T1 may protect the display panel 100 from external moisture penetration and the like. For example, moisture penetration prevention effects may be achieved, thereby improving the reliability of the display device 1000.

[0102] One pixel can include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. A third optical layer 117c can be disposed between multiple pixels arranged in a first direction (e.g., the X-axis direction). For example, the third optical layer 117c can be disposed to extend in a second direction (e.g., the Y-axis direction) that intersects with the first direction.

[0103] The first optical layer 117a and the second optical layer 117b may be arranged to overlap each other in a region where pixels or dummy pixels are arranged and in a planar direction (e.g., the Z-axis direction) of the display panel 100. A third optical layer 117c may be arranged between the plurality of first optical layers 117a or the plurality of second optical layers 117b (e.g., in the X-axis direction).

[0104] In one embodiment, the first optical layer 117a may extend to one end (or one side) of the display panel. The second optical layer 117b may be disposed in the display area AA. The second optical layer 117b may be disposed on the first optical layer 117a. Therefore, the thickness of the optical layers 117a and 117b of the display panel 100 may decrease in the second direction (e.g., the Y-axis direction). The ends (or one side) of the second electrode CE2 and the second optical layer 117b in the first direction may be formed to meet at substantially the same point. The display area AA may include the second electrode CE2 and the second optical layer 117b.

[0105] As shown in FIG. 8, in the display device according to the second embodiment, a first trench T1 may be disposed between the plurality of light-emitting elements 130, 140, and 150. The first trench T1 may be disposed so as to extend in a first direction (e.g., the X-axis direction). The first trench T1 may be disposed between the third light-emitting element 150 and the first light-emitting element 130, but is not limited thereto. The presence of the first trench T1 can protect the display panel 100 from external moisture penetration and the like. For example, moisture penetration prevention and other effects can be achieved, thereby improving the reliability of the display device 1000.

[0106] As shown in FIG. 9 , in the display device according to the third embodiment, a first trench T1 may be disposed between a plurality of light emitting elements 130, 140, and 150. The first trench T1 may be disposed to extend in a first direction (e.g., the X-axis direction). The first trench T1 may be disposed between the second light emitting element 140 and the third light emitting element 150, but is not limited thereto. Since the trench is disposed between the second light emitting element 140 and the third light emitting element 150, which are relatively small in size, a design margin for the display panel may be secured. Therefore, the probability of defective transfer of light emitting elements during the manufacturing process of the display panel may be reduced. This may improve the productivity of the display device.

[0107] As shown in FIG. 10 , in the display device according to the fourth embodiment, an eleventh trench T11 and / or a twelfth trench T12 may be disposed between the plurality of light emitting elements 130, 140, and 150. The eleventh trench T11 and / or the twelfth trench T12 may be disposed to extend in a first direction (e.g., the X-axis direction). The eleventh trench T11 may be disposed between the second light emitting element 140 and the third light emitting element 150, and the twelfth trench T12 may be disposed between the first light emitting element 130 and the second light emitting element 140, but is not limited thereto. Because the trenches are disposed between the second light emitting element 140 and the third light emitting element 150, which are relatively small in size, a design margin for the display panel may be secured. Furthermore, because multiple trenches are disposed, effects such as moisture prevention may be further improved.

[0108] As shown in FIG. 11 , in the display device according to the fifth embodiment, an eleventh trench T11 and / or a twelfth trench T12 may be disposed between the plurality of light emitting elements 130, 140, and 150. The eleventh trench T11 and / or the twelfth trench T12 may be disposed to extend in a first direction (e.g., the X-axis direction). The eleventh trench T11 may be disposed between the second light emitting element 140 and the third light emitting element 150, and the twelfth trench T12 may be disposed between another second light emitting element 140 and another third light emitting element 150, but is not limited thereto. Since the trenches are disposed between the second light emitting element 140 and the third light emitting element 150, which are relatively small in size, the design margin of the display panel may be secured. Furthermore, since multiple trenches are disposed, effects such as moisture prevention may be further improved.

[0109] As shown in FIG. 12 , in the display device according to the sixth embodiment, an eleventh trench T11 and / or a twelfth trench T12 may be disposed between the plurality of light emitting elements 130, 140, and 150. The eleventh trench T11 and / or the twelfth trench T12 may be disposed to extend in a first direction (e.g., the X-axis direction). The eleventh trench T11 may be disposed between the second light emitting element 140 and the third light emitting element 150, and the twelfth trench T12 may be disposed between the third light emitting element 150 and the first light emitting element 130, but is not limited thereto. Since the trenches are disposed between the second light emitting element 140 and the third light emitting element 150, which are relatively small in size, a design margin for the display panel may be secured. Furthermore, since multiple trenches are disposed, effects such as moisture prevention may be further improved.

[0110] 13 to 16 are partial enlarged views (C1, C2, C3, C4) showing an enlarged view of part C (C) of FIG. 3. FIGS. 13 to 16 show display devices according to seventh to tenth embodiments, respectively. The same reference numerals are used for components that are substantially the same as those in the above-described embodiments or between the embodiments, and detailed descriptions thereof may be omitted.

[0111] As shown in FIG. 13 , the display device may include a rounded corner RE, but the embodiments herein are not limited thereto. The rounded corner RE may include a thirteenth trench T13, a fourteenth trench T14, and a second trench T2. The thirteenth trench T13 and the fourteenth trench T14 may be arranged to extend in a first direction. The second trench T2 may be arranged to extend in a second direction intersecting the first direction. As illustrated, the first direction and the second direction intersect with the X-axis direction and the Y-axis direction, respectively, at a perpendicular angle to each other. However, the directions in which the thirteenth trench T13, the fourteenth trench T14, and the second trench T2 extend are not limited thereto. For example, the trench arrangement angles may be set or adjusted.

[0112] The display device according to the seventh embodiment can include a display area AA and a first non-display area NA1.

[0113] The plurality of light-emitting elements 130, 140, and 150 arranged in the display area AA can emit light by applying a high potential power supply voltage to the first electrode by disposing the plurality of second electrodes CE2. The second electrodes CE2 can be formed to correspond to the shape of the display area AA with rounded corners RE. For example, the area covering the plurality of light-emitting elements 130, 140, and 150 can decrease in the first direction (e.g., the X-axis direction).

[0114] The first non-display area NA1 may include a dummy area DUA. The dummy area DUA may also be formed to correspond to the shape of the first non-display area NA1 with rounded corners RE. For example, the area covering the plurality of dummy light-emitting elements may decrease in the first direction (e.g., the X-axis direction).

[0115] A thirteenth trench T13, a fourteenth trench T14, and a second trench T2 may be arranged between the plurality of light-emitting elements 130, 140, and 150. The thirteenth trench T13 may be arranged between the first light-emitting element 130 and the second light-emitting element 140. The fourteenth trench T14 may be arranged in a dummy pixel arranged in a first direction (e.g., the X-axis direction) from a dummy pixel including the first light-emitting element 130 and the second light-emitting element 140 in which the thirteenth trench T13 is arranged. The fourteenth trench T14 may be arranged between the first light-emitting element 130 and the second light-emitting element 140. The second trench T2 may be arranged between a plurality of pixels. The second trench T2 may be arranged between the dummy pixels arranged in the first direction (e.g., the X-axis direction) to extend in a second direction (e.g., the Y-axis direction) intersecting the first direction. The second trench T2 may be disposed between the plurality of light emitting elements 130, 140, and 150. The second trench T2 may be disposed between the second light emitting elements 140, the third light emitting elements 150, or the first light emitting elements 130, each of which realizes the same color. This may protect the corners of the display panel. For example, moisture prevention may be achieved. Therefore, the reliability of the display device may be improved. Although the embodiments herein have been described with respect to rounded corners RE, this is not limiting. If the corners have a different shape, the trenches disposed to correspond to the corners may be configured by modifying the above-described embodiments.

[0116] The first optical layer 117a, the second optical layer 117b, and the third optical layer 117c may be formed to correspond to the shape of the first non-display area NA1 by the rounded corners RE. For example, the size of the area where the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c overlap with the display panel may decrease in the first direction. The second optical layer 117b may be disposed in the display area AA. Ends (or one side) of the second electrode CE2 and the second optical layer 117b in the first direction may be formed to meet at substantially the same point. The display area AA may include the second electrode CE2 and the second optical layer 117b.

[0117] 14 , in the display device according to the eighth embodiment, a thirteenth trench T13, a fourteenth trench T14, and a second trench T2 may be disposed between the plurality of light-emitting elements 130, 140, and 150. The thirteenth trench T13 may be disposed between the first light-emitting element 130 and the second light-emitting element 140. The fourteenth trench T14 may be disposed between the second light-emitting element 140 and the third light-emitting element 150. The second trench T2 may be disposed between a plurality of pixels. The second trench T2 may be disposed between the second light-emitting elements 140 that each realize the same color or between the first light-emitting elements 130.

[0118] 15 , in the display device according to the ninth embodiment, a thirteenth trench T13, a fourteenth trench T14, and a second trench T2 may be arranged between a plurality of light-emitting elements 130, 140, and 150. The thirteenth trench T13 may be arranged between the second light-emitting element 140 and the third light-emitting element 150. The fourteenth trench T14 may be arranged between the third light-emitting element 150 and the first light-emitting element 130. The second trench T2 may be arranged between a plurality of pixels. The second trench T2 may be arranged between the first light-emitting elements 130 or between the second light-emitting elements 140 that each realize the same color.

[0119] 16, according to the tenth embodiment, a thirteenth trench T13, a fourteenth trench T14, and a second trench T2 may be arranged between a plurality of light-emitting elements 130, 140, and 150. The thirteenth trench T13 may be arranged between the second light-emitting element 140 and the third light-emitting element 150. The fourteenth trench T14 may be arranged between the second light-emitting element 140 and the third light-emitting element 150. The second trench T2 may be arranged between a plurality of pixels. The second trench T2 may be arranged between the third light-emitting elements 150, the first light-emitting elements 130, or the second light-emitting elements 140, each of which realizes the same color.

[0120] Fig. 17 is a partially enlarged view showing a portion D (D) in Fig. 3. Fig. 17 shows a display device according to an eleventh embodiment.

[0121] 17, the display device according to the eleventh embodiment may include a display area AA and a first non-display area NA1. The display area AA may include a second electrode CE2 and a second optical layer 117b. Ends of the second electrode CE2 and the second optical layer 117b in the first direction may be formed to meet at substantially the same point.

[0122] The first non-display region NA1 may be disposed between the bending region BA and the display region AA. The first non-display region NA1 may include a third trench T3. The third trench T3 may be disposed to extend in a second direction intersecting the first direction. The third trench T3 may be disposed between the bending region BA and the display region AA. When the bending region BA is bent, the end of the first non-display region NA1 in the first direction may form one side of the display device. The third trench T3 may block moisture and other contaminants that may penetrate in the direction in which the bending region BA is disposed. This may improve the reliability of the display device and extend its lifespan.

[0123] FIG. 19 is a diagram illustrating a circuit structure according to an embodiment of the present specification.

[0124] 19 illustrates an example in which one light emitting element ED is connected to a microdriver (μDriver), but this is not limiting. For example, eight light emitting elements ED may be connected to one microdriver (μDriver). In other examples, 16 light emitting elements ED may be connected to one microdriver (μDriver), or 32 light emitting elements ED or 64 light emitting elements ED may be connected to one microdriver (μDriver) simultaneously. The light emitting element ED may be a micro light emitting element (μLED).

[0125] One microdriver (μDriver) drives the driving transistor T DR and light-emitting transistor T EM However, the embodiments and the like of the present specification are not limited thereto.

[0126] For example, the driving transistor T DR In the example shown in FIG. 1, a high potential power supply voltage VDD is applied to the first electrode, and a light-emitting transistor T EM The first electrodes of the driving transistors T are connected to each other, and a scan signal SC can be applied to the gate electrodes of the driving transistors T. DR The scan signal SC applied to the gate electrode is a direct current power supply, and a fixed reference voltage Vref may be applied for each frame, but the embodiments and the like of this specification are not limited to this.

[0127] Light-emitting transistor T EM is connected to the first electrode of the driving transistor T DR The light emitting transistor TEM may have a second electrode connected to the first electrode, a light emitting element ED connected to the second electrode, and a light emitting signal EM applied to the gate electrode of the light emitting transistor TEM. The light emitting signal EM applied to the gate electrode of the light emitting transistor TEM may be a pulse width modulation signal that is varied for each frame, but the embodiments of the present specification are not limited thereto.

[0128] The first electrode of the light-emitting element ED is connected to the light-emitting transistor T EM The first electrode of the light-emitting element ED may be connected to the second electrode of the light-emitting element ED, and the second electrode of the light-emitting element ED may be connected to ground. For example, the first electrode of the light-emitting element ED may be an anode electrode, and the second electrode of the light-emitting element ED may be a cathode electrode, but the embodiments and the like of the present specification are not limited thereto.

[0129] The driving transistor TDR and the light-emitting transistor TEM may each be an n-type transistor or a p-type transistor.

[0130] The microdriver (μDriver) drives the driving transistor T by the scan signal SC applied from the timing controller T-CON. DR is turned on, and the light-emitting transistor T EM can be turned on. DR A high potential power supply voltage VDD applied to the first electrode of the driving transistor T DR and light-emitting transistor T EM The light emitting element ED can emit light by applying a voltage to the light emitting element ED via the voltage Vcc.

[0131] 20 and 22 are cross-sectional views showing a display device according to an embodiment of the present specification. Fig. 21 is a cross-sectional view showing a display device according to an embodiment of the present specification.

[0132] 20 and 22 are cross-sectional views of the display area AA, the first non-display area NA1, the bending area BA, and the second non-display area NA2. Fig. 22 is a cross-sectional view taken along the line CC' in Fig. 18.

[0133] 21 is a cross-sectional view of the dummy area DUA. The same reference numerals are used to designate substantially the same components between cross-sectional views, and detailed descriptions thereof will be omitted.

[0134] As shown in FIGS. 20, 21, and 22, a first buffer layer 111a and a second buffer layer 111b may be disposed in the remaining area of ​​the substrate 110 except for the bending area BA.

[0135] The first buffer layer 111a and the second buffer layer 111b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b may reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may be made of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may be made of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), although the embodiments of the present specification are not limited thereto.

[0136] For example, portions of the first buffer layer 111a and the second buffer layer 111b on the bending region BA may be removed. The top surface of the substrate 110 located in the bending region BA may be exposed from the first buffer layer 111a and the second buffer layer 111b. By removing the first buffer layer 111a and the second buffer layer 111b made of an inorganic insulating material in the bending region BA, cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending may be minimized.

[0137] A plurality of align keys MK may be disposed between the first buffer layer 111a and the second buffer layer 111b. The plurality of align keys MK may be configured to identify the positions of the pixel driving circuits PD during the manufacturing process of the display device 1000. For example, the plurality of align keys MK may be configured to align the positions of the pixel driving circuits PD transferred onto the adhesive layer 112. As another example, the plurality of align keys MK may be omitted.

[0138] An adhesive layer 112 may be disposed on the second buffer layer 111b. The adhesive layer 112 may be disposed in the display area AA, the first non-display area NA1, the bending area BA, and the second non-display area NA2. As another example, at least a portion of the adhesive layer 112 may be removed from the non-display area NA including the bending area BA. For example, the adhesive layer 112 may be made of any one of an adhesive polymer, an epoxy resin, a UV-curable resin, a polyimide-based material, an acrylate-based material, a urethane-based material, and polydimethylsiloxane (PDMS), but the embodiments of the present specification are not limited thereto.

[0139] In the display area AA, a pixel driving circuit PD may be disposed on the adhesive layer 112. When the pixel driving circuit PD is realized by a driver, the driver may be mounted on the adhesive layer 112 by a transfer process, but the embodiments and the like of this specification are not limited thereto.

[0140] A first protective layer 113a and a second protective layer 113b may be disposed on the adhesive layer 112 and the pixel driving circuit PD. The first protective layer 113a and the second protective layer 113b may be disposed to surround the side surfaces of the pixel driving circuit PD, but the embodiments of the present specification are not limited thereto. For example, the second protective layer 113b may be disposed to cover at least a portion of the upper surface of the pixel driving circuit PD. For example, at least one of the first protective layer 113a and the second protective layer 113b disposed on the bending region BA may be omitted. For example, the first protective layer 113a may be disposed entirely in the display region AA and the non-display region NA, and the second protective layer 113b may be disposed partially in the display region AA, the first non-display region NA1, and the second non-display region NA2. For example, the portion of the second protective layer 113b in the bending region BA may be removed. However, the embodiments of the present specification are not limited thereto.

[0141] The first protective layer 113a and the second protective layer 113b may be made of an organic insulating material, but the embodiments of the present specification are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiments of the present specification are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be an overcoating layer or an insulating layer, but the embodiments of the present specification are not limited thereto.

[0142] According to the present specification, a plurality of first connecting wires 121 may be disposed on the second protective layer 113b in the display area AA. The plurality of first connecting wires 121 may be wires for electrically connecting the pixel driving circuit PD to other components. For example, the pixel driving circuit PD may be electrically connected to a plurality of signal wires TL and a plurality of contact electrodes CCE via the plurality of first connecting wires 121. For example, the plurality of first connecting wires 121 may include a 1-1 connecting wire 121a, a 1-2 connecting wire 121b, a 1-3 connecting wire 121c, and a 1-4 connecting wire 121d, but the embodiments of the present specification are not limited thereto.

[0143] For example, a plurality of first-first connecting wires 121a may be disposed on the second protective layer 113b. The plurality of first-first connecting wires 121a may be electrically connected to the pixel driving circuit PD. The plurality of first-first connecting wires 121a may transmit a voltage output from the pixel driving circuit PD to the first electrode CE1 or the second electrode CE2.

[0144] For example, the third protective layer 114 may be disposed on the second protective layer 113b. The third protective layer 114 may be disposed over the entire display area AA and the non-display area NA. In the bending area BA, the third protective layer 114 may cover or encase the side surfaces of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may be made of an organic insulating material. For example, the third protective layer 114 may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be made of the same material, but the embodiments of the present disclosure are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be insulating layers.

[0145] A plurality of first-second connecting wires 121b may be disposed on the third protective layer 114. The plurality of first-second connecting wires 121b may be directly connected to the pixel driving circuit PD. For example, some of the first-second connecting wires 121b may be directly connected to the pixel driving circuit PD through contact holes in the third protective layer 114. Other parts of the first-second connecting wires 121b may be electrically connected to the first-first connecting wire 121a through contact holes in the third protective layer 114. However, the embodiments of the present specification are not limited thereto. A voltage output from the pixel driving circuit PD may be transmitted to the first electrode CE1 or the second electrode CE2 through the plurality of first-second connecting wires 121b and other connecting wires.

[0146] A first insulating layer 115a may be disposed on the plurality of first and second connecting wires 121b. The first insulating layer 115a may be disposed over the entire display area AA and non-display area NA, although embodiments of the present disclosure are not limited thereto. The first insulating layer 115a may be made of an organic insulating material, although embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 115a may be made of a photoresist, polyimide (PI), or a photoacryl-based material, although embodiments of the present disclosure are not limited thereto.

[0147] A plurality of first to third connecting wires 121c may be disposed on the first insulating layer 115a. The plurality of first to third connecting wires 121c may be electrically connected to the plurality of first to second connecting wires 121b. For example, the first to third connecting wires 121c may be electrically connected to the first to second connecting wires 121b through contact holes in the first insulating layer 115a.

[0148] A second insulating layer 115b may be disposed on the first to third connecting wires 121c. The second insulating layer 115b may be disposed in the remaining area excluding the bending area BA, but the embodiments of the present specification are not limited thereto. The second insulating layer 115b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2, but the embodiments of the present specification are not limited thereto. For example, a portion of the second insulating layer 115b disposed in the bending area BA may be removed. The second insulating layer 115b may be made of an organic insulating material, but the embodiments of the present specification are not limited thereto. For example, the second insulating layer 115b may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiments of the present specification are not limited thereto.

[0149] A plurality of first to fourth connecting wires 121d may be disposed on the second insulating layer 115b. The plurality of first to fourth connecting wires 121d may be electrically connected to the plurality of first to third connecting wires 121c. For example, the first to fourth connecting wires 121d may be electrically connected to the first to third connecting wires 121c through contact holes in the second insulating layer 115b.

[0150] According to this specification, the plurality of first connecting wires 121 may be made of titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments and the like of this specification are not limited to this.

[0151] According to the present specification, the plurality of first connecting wires 121 may be alternately arranged in different layers with the plurality of insulating layers 115 interposed therebetween. The plurality of first connecting wires 121 may be arranged in a stepped or zigzag pattern with the plurality of insulating layers 115 interposed therebetween. For example, the plurality of first-second connecting wires 121b may be arranged in a different layer from the plurality of first-third connecting wires 121c with the first insulating layer 115a interposed therebetween. The plurality of first-second connecting wires 121b may be arranged alternately with the plurality of first-third connecting wires 121c with the first insulating layer 115a interposed therebetween. For example, the plurality of first-third connecting wires 121c may be arranged in a different layer from the plurality of first-fourth connecting wires 121d with the second insulating layer 115b interposed therebetween. The first to fourth connecting wires 121c can be arranged alternately with the first to fourth connecting wires 121d, with the second insulating layer 115b sandwiched therebetween. As a result, the first connecting wires 121 are arranged alternately in different layers with the insulating layers 115 sandwiched therebetween, thereby preventing moisture from penetrating into the first connecting wires 121. Furthermore, moisture penetration into the first connecting wires 121 can prevent oxidation of aluminum (Al) among the titanium (Ti) / aluminum (Al) / titanium (Ti) constituting the first connecting wires 121, thereby preventing corrosion of the first connecting wires 121 due to oxidation of aluminum (Al).

[0152] According to the present specification, a plurality of second connecting wires 122 may be disposed on the second protective layer 113b in the non-display area NA. The plurality of second connecting wires 122 may be wires for transmitting signals transmitted to the pad unit PAD from the flexible circuit board (or flexible film) CB and the printed circuit board 160 (see FIG. 1) to the pixel driving circuit PD in the display area AA. For example, the plurality of second connecting wires 122 may be electrically connected to a plurality of pad electrodes PE, and may receive signals from the flexible circuit board (or flexible film) CB and the printed circuit board.

[0153] For example, the plurality of second connecting wires 122 may extend from the pad unit PAD toward the display area AA and transmit signals to the wires in the display area AA. In this case, the plurality of second connecting wires 122 may function as link wires LL. The plurality of second connecting wires 122 may include a 2-1 connecting wire 122a, a 2-2 connecting wire 122b, a 2-3 connecting wire 122c, and a 2-4 connecting wire 122d.

[0154] A plurality of second-1 connecting wires 122a may be disposed on the second protective layer 113b. The plurality of second-1 connecting wires 122a may extend from the second non-display area NA2 to the bending area BA and the first non-display area NA1. The plurality of second-1 connecting wires 122a may transmit signals transmitted to the pad unit PAD from the flexible circuit board (or flexible film) CB and the printed circuit board to the pixel driving circuit PD in the display area AA.

[0155] A plurality of second-second connecting wires 122b may be disposed on the third protective layer 114. The plurality of second-second connecting wires 122b may be disposed in the second non-display area NA2. The second-second connecting wires 122b may be electrically connected to the second-first connecting wires 122a through contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) CB and the printed circuit board may be transmitted to the second-first connecting wires 122a through the second-second connecting wires 122b.

[0156] A second-third connecting wire 122c may be disposed on the first insulating layer 115a. The second-third connecting wire 122c may be disposed in the second non-display area NA2. The second-third connecting wire 122c may be electrically connected to the second-second connecting wire 122b through a contact hole in the first insulating layer 115a. Therefore, signals from the flexible circuit board (or flexible film) CB and the printed circuit board may be transmitted to the second-first connecting wire 122a via the second-third connecting wire 122c and the second-second connecting wire 122b.

[0157] A second-fourth connecting wire 122d may be disposed on the second insulating layer 115b. The second-fourth connecting wire 122d may be disposed in the second non-display area NA2. The second-fourth connecting wire 122d may be electrically connected to the second-third connecting wire 122c through a contact hole in the second insulating layer 115b. Therefore, signals from the flexible film FF and the printed circuit board may be transmitted to the second-first connecting wire 122a via the second-fourth connecting wire 122d, the second-third connecting wire 122c, and the second-second connecting wire 122b.

[0158] The plurality of first connecting wires 121 and the plurality of second connecting wires 122 may be formed of a flexible conductive material or any one of various conductive materials used in the display area AA. For example, the second connecting wire 122 disposed in a portion of the bending area BA may be formed of a flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al), but the embodiments of the present specification are not limited thereto. As another example, the plurality of first connecting wires 121 and the plurality of second connecting wires 122 may be formed of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg), or an alloy thereof, but the embodiments of the present specification are not limited thereto.

[0159] A third insulating layer 115c may be disposed on the plurality of first connecting wires 121 and the plurality of second connecting wires 122. The third insulating layer 115c may be disposed in the remaining area excluding the bending area BA, but the embodiments of the present disclosure are not limited thereto. The third insulating layer 115c may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. A portion of the third insulating layer 115c in the bending area BA may be removed. The third insulating layer 115c may be made of an organic insulating material, but the embodiments of the present disclosure are not limited thereto. For example, the third insulating layer 115c may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiments of the present disclosure are not limited thereto.

[0160] A plurality of banks BNK may be arranged on the third insulating layer 115c in the display area AA. The plurality of banks BNK may be arranged to overlap each of the plurality of sub-pixels. One or more light-emitting elements ED of the same type may be arranged on top of each of the plurality of banks BNK.

[0161] A plurality of signal lines TL may be arranged on the third insulating layer 115c in the display area AA. The signal lines TL may be arranged in the areas between the banks BNK. For example, the signal lines TL may be arranged adjacent to any one of the banks BNK.

[0162] A plurality of contact electrodes CCE may be disposed on the third insulating layer 115c in the display area AA. The plurality of contact electrodes CCE may supply a cathode voltage from the pixel driving circuit PD to the second electrode CE2.

[0163] A first electrode CE1 may be disposed on the bank BNK. For example, the first electrode CE1 may be disposed extending from the adjacent signal wiring TL toward the top of the bank BNK. The first electrode CE1 may be disposed on the top surface of the bank BNK and on the side surface of the bank BNK. For example, the first electrode CE1 may be disposed extending from the signal wiring TL on the top surface of the third insulating layer 115c to the side surface of the bank BNK and on the top surface of the bank BNK.

[0164] The first optical layer 117a may be disposed around the plurality of light-emitting elements ED in the display area AA. For example, the first optical layer 117a may surround the plurality of light-emitting elements ED. For example, the first optical layer 117a may be disposed to cover the plurality of light-emitting elements ED and the banks BNK in the region of the plurality of subpixels. For example, the first optical layer 117a may cover the banks BNK, a portion of the second passivation layer 116b, and spaces between the plurality of light-emitting elements ED. The first optical layer 117a may be disposed or cover spaces between the plurality of light-emitting elements ED and the plurality of banks BNK included in one pixel PX. For example, the first optical layer 117a may extend in the first direction X and be spaced apart in the second direction Y. For example, the first optical layer 117a may be disposed between the second passivation layer 116b and the second electrode CE2 so as to surround the sides of the light-emitting elements ED and the banks BNK, but the embodiments of the present specification are not limited thereto. For example, the first optical layer 117a may be a diffusing layer or a sidewall diffusing layer, but the embodiments herein are not limited thereto.

[0165] The first optical layer 117a may include an organic insulating material in which fine particles are dispersed, but the embodiments of the present specification are not limited thereto. For example, the first optical layer 117a may be made of siloxane in which fine metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but the embodiments of the present specification are not limited thereto. Light from the plurality of light emitting elements ED may be scattered by the fine particles dispersed in the first optical layer 117a and emitted to the outside of the display device 1000. As a result, the first optical layer 117a may improve the extraction efficiency of light emitted from the plurality of light emitting elements ED.

[0166] For example, the first optical layer 117a may be disposed in each of the plurality of pixels PX, or may be disposed together in some of the pixels PX arranged in the same row, but the embodiments and the like of the present specification are not limited thereto. For example, the first optical layer 117a may be disposed in each of the plurality of pixels PX, or a single first optical layer 117a may be shared by the plurality of pixels PX. As another example, each of the plurality of sub-pixels may include a separate first optical layer 117a, but the embodiments and the like of the present specification are not limited thereto.

[0167] Referring to the plan views of FIGS. 7 to 16, the third optical layer 117c may be disposed between the first optical layers 117a. The third optical layer 117c may be disposed on the second passivation layer 116b in the display area AA. For example, the third optical layer 117c may be located around the first optical layer 117a. For example, the third optical layer 117c may be disposed to surround the first optical layer 117a. For example, the third optical layer 117c may contact a side of the first optical layer 117a. For example, the third optical layer 117c may be disposed in a region between a plurality of pixels PX. However, embodiments of the present specification are not limited thereto. For example, the third optical layer 117c may be a diffusion layer, a diffusion window, a window diffusion layer, or the like, but the embodiments of the present specification are not limited thereto.

[0168] The third optical layer 117c may be made of an organic insulating material, but embodiments of the present specification are not limited thereto. The third optical layer 117c may be made of the same material as the first optical layer 117a, but embodiments of the present specification are not limited thereto. For example, the first optical layer 117a may include fine particles, and the third optical layer 117c may not include fine particles. For example, the third optical layer 117c may be made of siloxane, but embodiments of the present specification are not limited thereto.

[0169] For example, the thickness of the first optical layer 117a may be smaller than the thickness of the third optical layer 117c, but the embodiments of the present specification are not limited thereto. As a result, when viewed from above, the area where the first optical layer 117a is disposed may include a recess that is recessed inward from the top surface of the third optical layer 117c.

[0170] According to the present specification, a second electrode CE2 may be disposed on the first optical layer 117a and the third optical layer 117c. For example, the second electrode CE2 may be electrically connected to the plurality of contact electrodes CCE through contact holes in the third optical layer 117c. For example, the second electrode CE2 may be disposed on the plurality of light-emitting elements ED. For example, the second electrode CE2 may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present specification are not limited thereto. For example, the second electrode CE2 may be disposed to be in contact with the cathode electrode 135. For example, the second electrode CE2 may overlap the first optical layer 117a. For example, the second electrode CE2 may cover the outer plane of the first optical layer 117a.

[0171] The second electrode CE2 may extend continuously in the first direction X of the substrate 110. Thus, the second electrode CE2 may be commonly connected to a plurality of pixels PX arranged in the first direction X of the substrate 110. For example, the second electrode CE2 may be commonly connected to a plurality of pixels PX.

[0172] According to this specification, the second electrode CE2 may extend continuously over the first optical layer 117a, the third optical layer 117c, and the light-emitting element ED. The region where the first optical layer 117a is disposed may include a recess recessed inward from the top surface of the third optical layer 117c. As a result, a first portion of the second electrode CE2 disposed on the first optical layer 117a is disposed along the recess and may be positioned lower than a second portion of the second electrode CE2 disposed on the third optical layer 117c.

[0173] A second optical layer 117b may be disposed on the second electrode CE2. The second optical layer 117b may be disposed to overlap the plurality of light-emitting elements ED and the first optical layer 117a. The second optical layer 117b is disposed on the second electrode CE2 and the plurality of light-emitting elements ED, thereby improving unevenness that may occur in some of the plurality of light-emitting elements ED. For example, when the plurality of light-emitting elements ED are transferred onto the substrate 110 of the display device 1000, regions where the spacing between the plurality of light-emitting elements ED is not uniform may occur due to process deviations, etc. If the spacing between the plurality of light-emitting elements ED is not uniform, the light-emitting areas of each of the plurality of light-emitting elements ED may be unevenly arranged, which may cause the user to perceive unevenness. As a result, the second optical layer 117b is configured to uniformly diffuse light over the plurality of light-emitting elements ED, thereby reducing the likelihood that light emitted from some of the light-emitting elements ED will appear as uneven. Therefore, the second optical layer 117b evenly diffuses the light emitted from the light emitting elements ED and extracts it to the outside of the display device 1000, thereby improving the luminance uniformity of the display device 1000.

[0174] The second optical layer 117b may be made of an organic insulating material in which fine particles are dispersed, but the embodiments of the present specification are not limited thereto. For example, the second optical layer 117b may be made of siloxane in which fine metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but the embodiments of the present specification are not limited thereto. For example, the second optical layer 117b may be made of the same material as the first optical layer 117a, but the embodiments of the present specification are not limited thereto. For example, the second optical layer 117b may be a diffusion layer or a top diffusion layer, but the embodiments of the present specification are not limited thereto.

[0175] According to the present specification, light from the plurality of light emitting elements ED may be scattered by the fine particles dispersed in the second optical layer 117b and emitted to the outside of the display device 1000. The second optical layer 117b may evenly mix the light emitted from the plurality of light emitting elements ED to further improve the luminance uniformity of the display device 1000. In addition, the light scattered by the plurality of fine particles may improve the light extraction efficiency of the display device 1000, thereby enabling the display device 1000 to be driven with low power.

[0176] According to the present specification, the first passivation layer 116a may be disposed on the first optical layer 117a. Alternatively, the first passivation layer 116a may be disposed on the second optical layer 117b. Alternatively, the first passivation layer 116a may be disposed on the third optical layer 117c. For example, the first passivation layer 116a may be disposed in the display area AA and the first non-display area NA1. The first passivation layer 116a is disposed to cover the first optical layer 117a, the second optical layer 117b, and / or the third optical layer 117c disposed in the display area AA and the first non-display area NA1, thereby reducing the penetration of moisture or impurities into the first optical layer 117a, the second optical layer 117b, and / or the third optical layer 117c. For example, the first passivation layer 116a may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but the embodiments and the like herein are not limited thereto. For example, the first passivation layer 116a may be a protective layer or an insulating layer, but the embodiments and the like herein are not limited thereto.

[0177] The thickness of the first passivation layer 116a may be thicker than the thickness of the second passivation layer 116b, although embodiments and the like herein are not limited thereto. Because the first optical layer 117a is composed of a material with dispersed fine particles, unevenness may occur due to the diffusion of the fine particles during the formation of the first optical layer 117a. Therefore, the first passivation layer 116a can prevent or reduce the unevenness caused by the first optical layer 117a. Furthermore, by making the thickness of the first passivation layer 116a thicker than the thickness of the second passivation layer 116b, the unevenness caused by the first optical layer 117a can be prevented or reduced. For example, the thickness of the first passivation layer 116a may be 3,000 Å to 5,000 Å, although embodiments and the like herein are not limited thereto. For example, the thickness of the second passivation layer 116b may be 500 Å to 1,500 Å. Alternatively, it may be 800 Å to 1,200 Å. However, the embodiments and the like of the present specification are not limited to this.

[0178] A black matrix BM may be disposed on the second electrode CE2, the first optical layer 117a, the third optical layer 117c, and the second optical layer 117b in the display area AA. For example, the black matrix BM may fill the contact hole of the third optical layer 117c. Because the black matrix BM is configured to cover the display area AA, it is possible to reduce color mixing of light from multiple sub-pixels and external light reflection. For example, the black matrix BM is also disposed in the contact hole connecting the second electrode CE2 and the contact electrode CCE, so it is possible to prevent light leakage between adjacent sub-pixels.

[0179] For example, the black matrix BM may be made of an opaque material, but the embodiments of the present specification are not limited thereto. For example, the black matrix BM may be made of an organic insulating material to which a black pigment or black dye is added, but the embodiments of the present specification are not limited thereto.

[0180] A cover layer 118 may be disposed on the black matrix BM in the display area AA. The cover layer 118 may protect the components below the cover layer 118. For example, the cover layer 118 may be made of an organic insulating material, but the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be an overcoating layer or an insulating layer, but the embodiments of the present specification are not limited thereto.

[0181] A polarizing layer 293 may be disposed on the cover layer 118 via a first adhesive layer 291. A cover member 120 may be disposed on the polarizing layer 293 via a second adhesive layer 295. For example, the first adhesive layer 291 and the second adhesive layer 295 may include an optically cleared adhesive (OCA), an optically cleared resin (OCR), a pressure sensitive adhesive (PSA), or the like, but the embodiments and the like of the present specification are not limited thereto.

[0182] According to the present specification, a plurality of pad electrodes PE may be disposed on the third insulating layer 115c in the second non-display area NA2. For example, at least a portion of the plurality of pad electrodes PE may be exposed from the second passivation layer 116b. For example, the plurality of pad electrodes PE may be electrically connected to the second to fourth connecting wires 122d through contact holes in the third insulating layer 115c.

[0183] An adhesive layer ACF may be disposed on the plurality of pad electrodes PE. The adhesive layer ACF may be an adhesive layer in which conductive balls are dispersed in an insulating material, but the embodiments of the present specification are not limited thereto. When heat or pressure is applied to the adhesive layer ACF, the conductive balls may be electrically connected in the areas where heat or pressure is applied, thereby providing conductive properties. The adhesive layer ACF may be disposed between the plurality of pad electrodes PE and a flexible circuit board (or flexible film) CB, and the flexible circuit board (or flexible film) CB may be attached or bonded to the plurality of pad electrodes PE. For example, the adhesive layer ACF may be an anisotropic conductive film (ACF), but the embodiments of the present specification are not limited thereto.

[0184] A flexible circuit board (or flexible film) CB may be disposed on the adhesive layer ACF. The flexible circuit board (or flexible film) CB may be electrically connected to a plurality of pad electrodes PE via the adhesive layer ACF. Therefore, signals output from the flexible circuit board (or flexible film) CB and the printed circuit board may be transmitted to the pixel driving circuit PD of the display area AA via the pad electrodes PE, the second-fourth connecting wire 122d, the second-third connecting wire 122c, the second-second connecting wire 122b, and the second-first connecting wire 122a.

[0185] 21, a first electrode CE1 and multiple light-emitting elements 130, 140, and 150 may be arranged in the dummy area DUA. The second electrode CE2 may not be arranged in the dummy area DUA. Therefore, a cathode voltage may not be supplied to the dummy area DUA via the second electrode CE2, and the light-emitting elements 130, 140, and 150 may not be able to emit light. Furthermore, the second optical layer 117b may not be arranged in the dummy area DUA, but this is not limiting.

[0186] 23 to 28 are cross-sectional views showing display devices according to embodiments of the present specification. Components having substantially the same functions as those in the above-described embodiments are denoted by the same reference numerals, and detailed descriptions thereof may be omitted.

[0187] Fig. 23 is a cross-sectional view corresponding to the display device according to embodiment 1. Fig. 24 is a partially enlarged view showing a portion P (P) in Fig. 23 in an enlarged manner.

[0188] As shown in FIGS. 23 and 24 , the display device may include a plurality of light-emitting elements 130, 140, and 150 arranged in a display area AA and a first non-display area NA1. A first optical layer 117a may be arranged between the plurality of light-emitting elements 130, 140, and 150. The first optical layer 117a may be located around the plurality of light-emitting elements 130, 140, and 150. For example, the first optical layer 117a may surround the plurality of light-emitting elements 130, 140, and 150. A second optical layer 117b may be arranged on the first optical layer 117a. The second optical layer 117b may be arranged in the display area AA and the dummy area DUA. In the first non-display area NA1, a region where the second optical layer 117b is not arranged may have a thinner thickness (e.g., length in the Z-axis direction) formed by the optical layer than the dummy area DUA.

[0189] A first passivation layer 116a may be disposed on the first optical layer 117a. A first passivation layer 116a may be disposed on the second optical layer 117b. The first passivation layer 116a may be formed in at least a portion of the display area AA and the first non-display area NA1. The first passivation layer 116a may be formed on the first optical layer 117a and / or the second optical layer 117b so as to cover the display area AA and the first non-display area NA1. For example, the first passivation layer 116a may be formed on the first optical layer 117a and / or the second optical layer 117b so as to entirely cover the display area AA and the first non-display area NA1. For example, the first passivation layer may be disposed throughout the entire display area AA and the first non-display area NA1. The display device 1000 according to the embodiment of the present specification includes the first passivation layer 116a and the first trench T1, which can prevent moisture from penetrating from the outside of the display device and improve the lifespan of the display device, thereby reducing power consumption and providing a display device that can be driven with low power.

[0190] According to the present specification, the first optical layer 117a and / or the second optical layer 117b can be protected by the first passivation layer 116a, which can protect the display device from external moisture penetration, thereby improving the reliability of the display device.

[0191] The second passivation layer 116b may be formed to cover the bank BNK in which the plurality of light emitting elements 130, 140, and 150 are arranged. The second passivation layer 116b may include a hole 116bh that exposes the solder pattern SDP. The display device according to the embodiment of the present specification further includes the second passivation layer 116b that protects the lower portion of the bank BNK and the first passivation layer 116a that protects the first optical layer 117a and / or the second optical layer 117b. This can protect the display device from external moisture and the like, thereby extending the life of the display device.

[0192] 23, the display device may include a first trench T1. Referring to a coordinate system, the first trench T1 may be arranged to extend in a first direction (e.g., the X-axis direction). The first non-display area NA1 may include the first trench T1. The dummy area DUA may include the first trench T1. The first trench T1 may be formed between the plurality of light-emitting elements 130, 140, and 150. The first trench T1 may be formed between the plurality of dummy light-emitting elements (the plurality of light-emitting elements arranged in the dummy area DUA).

[0193] For example, if the first passivation layer 116a is too thick, warpage may occur in the area where the first trench T1 is located, and the deposition time and / or etching (e.g., dry etching) process time may increase, resulting in an increase in the overall process time (Turn Around Time (TAT)).

[0194] For example, if the thickness of the first passivation layer 116a is too thin, there is a problem that the fine particles contained in the first optical layer 117a present in the portion of the first trench T1 where a slope is formed cannot be fixed to the sloped surface.

[0195] In one embodiment, the thickness of the first passivation layer 116a may be 3,000 Å to 5,000 Å, but the embodiments of this specification are not limited to this, which has the advantage of preventing bending and efficiently fixing the fine particles to the inclined surface.

[0196] For example, if the width of the first trench T1 is too short, the tilt angle of the first trench T1 will be too high, and the first passivation layer 116a may not be able to be formed or deposited in the first trench T1.

[0197] For example, if the width of the first trench T1 is too long, the first optical layer 117a may not be able to protect the light emitting element ED after the light emitting element ED is transferred and the first optical layer 117a is formed or deposited, which may result in the light emitting element ED not being properly fixed or formed in a subsequent process and being washed away.

[0198] The first optical layer 117a formed in the first non-display area NA1 and / or the dummy area DUA may include a first trench T1. The second optical layer 117b formed in the first non-display area NA1 and / or the dummy area DUA may include a first trench T1. The first trench T1 may be formed by removing at least a portion of the first optical layer 117a and / or the second optical layer 117b. The first passivation layer 116a may be disposed in the first trench T1. At least a portion of the black matrix BM may be disposed in the first trench T1.

[0199] 24, the first trench T1 may include a first end E1 and a second end E2 facing each other. The first light emitting element 130 may include an eleventh end E11 that is relatively far from the first end E1 and a twelfth end E12 that is relatively close to the first end E1. The second light emitting element 140 may include a twenty-first end E21 that is relatively far from the second end E2 and a twenty-second end E22 that is relatively close to the second end E2. For example, the ends may be on one side, but are not limited thereto.

[0200] The distance BT1 between the first end E1 and one end (or one side) of the bank BNK on which the first light-emitting element 130 is arranged and the distance BT1 between the second end E2 and one end (or one side) of the bank BNK on which the second light-emitting element 140 is arranged may be substantially the same. The distance BT2 between one end (or one side) of the bank BNK on which the first light-emitting element 130 is arranged and the distance BT2 between one end (or one side) of the bank BNK on which the second light-emitting element 14 ... the one end (or one side) of the bank BNK on which the light-emitting element is arranged and the other end (or the other side) of the bank BNK may be substantially the same. The distance TT between the first end E1 and the second end E2 may be smaller than the distance BT1 between the one end (or one side) of the bank BNK on which the light-emitting element is arranged and the other end (or the other side) of the bank BNK on which the light-emitting element is arranged. The distance TT between the first end E1 and the second end E2 may be smaller than the distance BT2 between one end (or one side) of the bank BNK on which the light-emitting element is arranged and the other end (or the other side).

[0201] The first light emitting element 130 may have a first size. The first size may be proportional to a distance S1 between the eleventh end E11 and the twelfth end E12. The second light emitting element 140 may have a second size. The second size may be proportional to a distance S2 between the twenty-first end E21 and the twenty-second end E22. The second size may be different from the first size. The second size may be smaller than the first size. Since the first size is relatively large, the light efficiency of the first light emitting element 130 may be improved. Since the first size is relatively large compared to the second size, the distance 130T between the first end E1 and the twelfth end E12 may be smaller than the distance 140T between the second end E2 and the twenty-second end E22.

[0202] Fig. 25 is a cross-sectional view corresponding to the display device according to embodiment 3. Fig. 26 is a partial enlarged view showing a portion Q (Q) of Fig. 25 in an enlarged manner.

[0203] 26 , the first trench T1 may include a first end E1 and a second end E2 facing each other. The second light-emitting element 140 may include a 21st end E21 relatively far from the first end E1 and a 22nd end E22 relatively close to the first end E1. The third light-emitting element 150 may include a 31st end E31 relatively far from the second end E2 and a 32nd end E32 relatively close to the second end E2.

[0204] The distance BT1 between the first end E1 and one end (or one side) of the bank BNK on which the second light-emitting element 140 is arranged and the distance BT1 between the second end E2 and one end (or one side) of the bank BNK on which the third light-emitting element 150 is arranged may be substantially the same. The distance BT2 between one end (or one side) of the bank BNK on which the second light-emitting element 140 is arranged and the distance BT2 between one end (or one side) of the bank BNK on which the third light-emitting element 15 ... the one end (or one side) of the bank BNK on which the third light-emitting element 150 is arranged and the other end (or the other side) of the bank BNK may be substantially the same. The distance TT between the first end E1 and the second end E2 may be smaller than the distance BT1 between the one end (or one side) of the bank BNK on which the light-emitting elements are arranged and the other end (or the other side) of the bank BNK on which the light-emitting elements are arranged. The distance TT between the first end E1 and the second end E2 may be smaller than the distance BT2 between one end (or one side) of the bank BNK on which the light-emitting elements are arranged and the other end (or the other side).

[0205] The second light emitting element 140 may have a second size. The second size may be proportional to the distance S2 between the 21st end E21 and the 22nd end E22. The third light emitting element 150 may have a third size. The third size may be proportional to the distance S3 between the 31st end E31 and the 32nd end E32. The third size may be substantially the same as the second size. By disposing the first trench T1 between the second light emitting element 140 and the third light emitting element 150, the distance 140T between the first end E1 and the 22nd end E22 may be larger than in the embodiment shown in FIG. 24 above. Therefore, a design margin for the light emitting element may be secured, thereby reducing the probability of defective transfer of the light emitting element during the display panel manufacturing process. This may further improve the productivity of the display device.

[0206] Fig. 27 is a cross-sectional view corresponding to the display device according to the sixth embodiment. Fig. 28 is a cross-sectional view taken along the line A-A' in Fig. 13. The same reference numerals are used to designate components having substantially the same functions as those in the above-described embodiments, and detailed descriptions thereof may be omitted.

[0207] 27, the display device may include a plurality of trenches T11 and T12. The eleventh trench T11 may be disposed between the second light-emitting element 140 and the third light-emitting element 150. The twelfth trench T12 may be disposed between the third light-emitting element 150 and the first light-emitting element 130.

[0208] As shown in FIG. 28, the display device may include a first optical layer 117a. At least a portion of the first optical layer 117a may be removed to form a third trench T3. Referring to a plan view corresponding to the sixth embodiment, a light-emitting element may not be disposed between the bending region. Also, since the region in which the second optical layer extends is substantially the same as the region in which the second electrode extends, the display device may not include the second optical layer. Therefore, the thickness (e.g., length in the Z-axis direction) may be smaller than the region in which the second optical layer is formed.

[0209] According to the present specification, the first passivation layer 116a may be disposed over the entire display area AA and the first non-display area NA1. The display device according to the embodiment of the present specification includes the first passivation layer 116a and the third trench T3, which prevents moisture from penetrating from outside the display device, thereby improving the lifespan of the display device. This reduces power consumption and provides a display device that can be driven with low power.

[0210] Fig. 29 is a cross-sectional view showing a display device according to an embodiment of the present specification. Fig. 36 is a cross-sectional view showing a display device according to an embodiment of the present specification.

[0211] FIG. 29 is a cross-sectional view showing a sub-pixel including a light-emitting element arranged in the display area AA.

[0212] 36 is a cross-sectional view showing a sub-pixel including a light emitting element disposed in a dummy area DUA. Components having substantially the same functions between cross-sectional views are denoted by the same reference numerals, and detailed descriptions thereof may be omitted.

[0213] 29 and 36, the first electrode CE1 may be composed of multiple conductive layers. For example, the first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d, but the embodiments and the like of the present specification are not limited thereto.

[0214] The first conductive layer CE1a may be disposed on the bank BNK. The second conductive layer CE1b may be disposed on the first conductive layer CE1a. The third conductive layer CE1c may be disposed on the second conductive layer CE1b. The fourth conductive layer CE1d may be disposed on the third conductive layer CE1c. For example, each of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be composed of titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide (ITO), although the embodiments and the like herein are not limited thereto.

[0215] According to the present specification, among the plurality of conductive layers constituting the first electrode CE1, some conductive layers with high reflective efficiency may be configured as an alignment key and / or a reflector for aligning the light emitting element ED. For example, among the plurality of conductive layers of the first electrode CE1, the second conductive layer CE1b may include a reflective material. For example, the second conductive layer CE1b may include aluminum (Al), but the embodiments of the present specification are not limited thereto. As a result, the second conductive layer CE1b may be configured as a reflector. Furthermore, the high reflective efficiency of the second conductive layer CE1b may facilitate identification during the manufacturing process, and thus the position or transfer position of the light emitting element ED may be aligned based on the second conductive layer CE1b.

[0216] For example, to configure the second conductive layer CE1b as a reflector, the third conductive layer CE1c and the fourth conductive layer CE1d covering the second conductive layer CE1b may be partially removed or etched. For example, portions of the third conductive layer CE1c and the fourth conductive layer CE1d disposed on the bank BNK may be removed or etched to expose the top surface of the second conductive layer CE1b. For example, the central portion and the frame portion (or edge portion) of the third conductive layer CE1c and the fourth conductive layer CE1d where the solder pattern SDP is disposed may be left, and the remaining portions may be removed. For example, the frame portion (or edge portion) of the third conductive layer CE1c made of titanium (Ti) and the frame portion (or edge portion) of the fourth conductive layer CE1d made of indium tin oxide (ITO) may not be etched. This prevents other conductive layers of the first electrode CE1 from being corroded by a TMAH (TetraMethylAmmonium Hydroxide) solution used in the masking process of the first electrode CE1. For example, the solder pattern SDP may be a pattern layer or a pattern, but is not limited to these terms.

[0217] According to the present specification, the first conductive layer CE1a and the third conductive layer CE1c may include titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b may include aluminum (Al). The fourth conductive layer CE1d may include a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide (IZO), which has good adhesion to the solder pattern SDP and is corrosion-resistant and acid-resistant. However, embodiments of the present specification are not limited thereto.

[0218] The first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be sequentially deposited and then patterned by performing a photolithography process and an etching process, but the embodiments of the present specification are not limited thereto.

[0219] According to the present specification, the signal wiring TL, the contact electrode CCE, and the pad electrode PE, which are arranged in the same layer as the first electrode CE1, may be made of multiple layers of conductive materials, but the embodiments of the present specification are not limited thereto. For example, the signal wiring TL, the contact electrode CCE, and the pad electrode PE may be made of multiple layers of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments of the present specification are not limited thereto.

[0220] According to the present specification, a solder pattern SDP may be disposed on the first electrode CE1 in each of the plurality of subpixels. The solder pattern SDP may bond the light emitting element ED to the first electrode CE1. The first electrode CE1 and the light emitting element ED may be electrically connected to each other through eutectic bonding using the solder pattern SDP, but embodiments of the present specification are not limited thereto. The first electrode CE1 and the anode electrode 134 of the light emitting element ED may be electrically connected to each other through eutectic bonding using the solder pattern SDP, but embodiments of the present specification are not limited thereto. For example, if the solder pattern SDP is made of indium (In) and the anode electrode 134 of the light emitting element ED is made of gold (Au), the solder pattern SDP and the anode electrode 134 may be bonded to each other by applying heat and pressure during the light emitting element ED transfer process. The light emitting element ED may be bonded to the solder pattern SDP and the first electrode CE1 through eutectic bonding without any additional adhesive. For example, the solder pattern SDP may be made of indium (In), tin (Sn), or an alloy thereof, but the embodiments and the like of the present specification are not limited thereto. For example, the solder pattern SDP may be a bonding pad or a bonding pad, but the embodiments and the like of the present specification are not limited thereto.

[0221] According to this specification, the second passivation layer 116b may be disposed on the plurality of signal lines TL, the plurality of first electrodes CE1, the plurality of contact electrodes CCE, and the third insulating layer 115c. For example, the second passivation layer 116b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. A portion of the second passivation layer 116b disposed in the bending area BA may be removed. A portion of the second passivation layer 116b covering the plurality of pad electrodes PE in the second non-display area NA2 may be removed. Since the second passivation layer 116b is disposed to cover the remaining areas excluding the bending area BA, the plurality of pad electrodes PE, and the area where the solder pattern SDP is disposed, it is possible to reduce the penetration of moisture or impurities into the light emitting element ED. For example, the second passivation layer 116b may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but the embodiments and the like herein are not limited thereto. For example, the second passivation layer 116b may be a protective layer or an insulating layer, but the embodiments and the like herein are not limited thereto. For example, the second passivation layer 116b may include a hole 116bh that exposes the solder pattern SDP.

[0222] A light-emitting element ED may be arranged on the solder pattern SDP in each of the plurality of sub-pixels. A first light-emitting element 130 may be arranged in the first sub-pixel SP1. A second light-emitting element 140 may be arranged in the second sub-pixel SP2. A third light-emitting element 150 may be arranged in the third sub-pixel SP3.

[0223] The light-emitting element ED can be formed on a silicon wafer by methods such as metal organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering, but the embodiments of this specification are not limited thereto.

[0224] 29 and 36, the first light-emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136, but the embodiments and the like of the present specification are not limited thereto. For example, the first light-emitting element 130 may not include the sealing film 136.

[0225] A first semiconductor layer 131 may be disposed on the solder pattern SDP. A second semiconductor layer 133 may be disposed on the first semiconductor layer 131.

[0226] For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be realized by a compound semiconductor such as a III-V group or a II-VI group, and may be doped with an impurity (or a dopant). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with an n-type impurity, and the other may be a semiconductor layer doped with a p-type impurity, but the embodiments and the like of the present specification are not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be a layer in which a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), aluminum indium phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs) is doped with n-type or p-type impurities, but the embodiments of the present specification are not limited thereto. For example, the n-type impurities may be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn), but the embodiments of the present specification are not limited thereto. For example, the p-type impurity may be magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be), but the embodiments and the like of this specification are not limited thereto.

[0227] For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively, but the embodiments and the like of the present specification are not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities, but the embodiments and the like of the present specification are not limited thereto.

[0228] The active layer 132 may be disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 may emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 may have one of a single well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum wire structure, but the embodiments of the present specification are not limited thereto. For example, the active layer 132 may have indium gallium nitride (InGaN) or gallium nitride (GaN), but the embodiments of the present specification are not limited thereto.

[0229] As another example, the active layer 132 may include a multi-quantum well (MQW) structure having well layers and barrier layers with a bandgap higher than that of the well layers. For example, the active layer 132 may be configured with InGaN well layers and AlGaN barrier layers, but the embodiments and the like of this specification are not limited thereto.

[0230] The anode electrode 134 may be disposed between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 may electrically connect the first semiconductor layer 131 and the first electrode CE1. An anode voltage output from the pixel driving circuit PD may be applied to the first semiconductor layer 131 via the signal line TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 may be made of a conductive material capable of eutectic bonding with the solder pattern SDP, but embodiments of the present specification are not limited thereto. For example, the anode electrode 134 may be made of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), copper (Cu), or alloys thereof, but the embodiments of the present specification are not limited thereto.

[0231] The cathode electrode 135 may be disposed on the second semiconductor layer 133. For example, the cathode electrode 135 may electrically connect the second semiconductor layer 133 and the second electrode CE2. A cathode voltage output from the pixel driving circuit PD may be applied to the second semiconductor layer 133 via the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 may be made of a transparent conductive material so that light emitted from the light emitting element ED can be directed toward the upper side of the light emitting element ED, but the embodiments of the present specification are not limited thereto. For example, the cathode electrode 135 may be made of a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present specification are not limited thereto.

[0232] The sealing film 136 can be disposed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the sealing film 136 can surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0233] For example, the sealing film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the sealing film 136 can be disposed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0234] For example, the sealing film 136 may be disposed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, an edge portion (or end portion or one side) of the anode electrode 134 and an edge portion (or end portion or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed from the sealing film 136 to connect the anode electrode 134 to a solder pattern SDP. For example, at least a portion of the cathode electrode 135 may be exposed from the sealing film 136 to connect the cathode electrode 135 to a second electrode CE2. For example, the sealing film 136 may be made of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), but embodiments of the present specification are not limited thereto.

[0235] As another example, the encapsulation layer 136 may have a structure in which a reflective material is dispersed in a resin layer, but the embodiments of the present specification are not limited thereto. For example, the encapsulation layer 136 may be manufactured using a reflector of various structures, but the embodiments of the present specification are not limited thereto. Light emitted from the active layer 132 may be reflected upward by the encapsulation layer 136, thereby improving light extraction efficiency. For example, the encapsulation layer 136 may be a reflective layer, but the embodiments of the present specification are not limited thereto.

[0236] Although the light emitting device ED has been described as having a vertical structure in this specification, the embodiments of this specification are not limited thereto. For example, the light emitting device ED may have a lateral structure or a flip chip structure.

[0237] 29 and 36, the first light emitting element 130 has been described, but the second light emitting element 140 and the third light emitting element 150 may have substantially the same structure as the first light emitting element 130. For example, the second light emitting element 140 and the third light emitting element 150 may have substantially the same first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and sealing film 136 as the first light emitting element 130. However, the present invention is not limited thereto.

[0238] As shown in FIG. 36, a first electrode CE1 and a plurality of light-emitting elements may be arranged in the dummy area. A second electrode CE2 may not be arranged in the dummy area. Therefore, a cathode voltage may not be supplied to the dummy area via the second electrode CE2, and the light-emitting elements may not be able to emit light. A second optical layer 117b may not be arranged in the dummy area.

[0239] 30 to 35 and 37 to 38 are cross-sectional views showing display devices according to embodiments of the present specification.

[0240] 30 to 35 are partial enlarged views (R1, R2, R3, R4, R5, R6) showing an enlarged R portion (R) of FIG. 29. FIGS. 30 to 35 show display devices according to 12th to 17th embodiments, respectively. Configurations that have substantially the same functions as those in the above-described embodiments are given the same reference numerals, and detailed descriptions thereof may be omitted.

[0241] As shown in FIG. 30, the display device R1 according to the twelfth embodiment may include a first passivation layer 116a disposed on a first optical layer 117a. A second electrode CE2 may be disposed on the first optical layer 117a. The second electrode CE2 may have a structure for contacting the light-emitting element for light emission. For example, at least a portion of the first passivation layer 116a may be removed, and the second electrode CE2 may have a structure covering the first passivation layer 116a so that the light-emitting element can contact the second electrode CE2. A second optical layer 117b may be disposed on the second electrode CE2. A black matrix BM may be disposed on the second optical layer 117b.

[0242] 31, a display device R2 according to the thirteenth embodiment may include a second electrode CE2 disposed on a first optical layer 117a. The second electrode CE2 may be in contact with a light-emitting element. A first passivation layer 116a may be disposed on the second electrode CE2. A second optical layer 117b may be disposed on the first passivation layer 116a. A black matrix BM may be disposed on the second optical layer 117b.

[0243] As shown in FIG. 32, in a display device R3 according to the fourteenth embodiment, at least a portion of the first passivation layer 116a disposed on the second electrode CE2 may be removed. A second optical layer 117b may be disposed on the first passivation layer 116a. A black matrix BM may be disposed on the second optical layer 117b. When the first passivation layer 116a is made of an opaque material, this configuration allows light from the light-emitting element to pass through the second optical layer 117b without passing through the first passivation layer 116a. This may improve the light efficiency of the light-emitting element.

[0244] As shown in FIG. 33, the display device R4 according to the fifteenth embodiment may include a first passivation layer 116a disposed on a second optical layer 117b. The second optical layer 117b may be disposed on the second electrode CE2. A black matrix BM may be disposed on the first passivation layer 116a. This allows the first passivation layer 116a to protect both the first optical layer 117a and the second optical layer 117b, thereby improving the reliability and color gamut of the display device. The black matrix BM may be disposed on the first passivation layer 116a.

[0245] As shown in FIG. 34, in a display device R5 according to the sixteenth embodiment, the second electrode CE2 may be disposed on the first optical layer 117a. The second optical layer 117b may be disposed on the second electrode CE2. A first passivation layer 116a and a black matrix BM may be disposed on the second optical layer 117b. The black matrix BM may be disposed around or at one end of the first passivation layer 116a. When the first passivation layer 116a is formed of a transparent material, this configuration may improve visibility through the black matrix BM.

[0246] As shown in FIG. 35, in a display device R6 according to the seventeenth embodiment, the second electrode CE2 may be disposed on the first optical layer 117a. The second optical layer 117b may be disposed on the second electrode CE2. At least a portion of the first passivation layer 116a disposed on the second optical layer 117b may be removed. A black matrix BM may be disposed around or at one end of the first passivation layer 116a. If the first passivation layer 116a is made of an opaque material, this configuration prevents light from the light-emitting element from passing through the first passivation layer 116a. This may increase the luminous efficiency of the display device.

[0247] Figures 37 and 38 are partial enlarged views (S1, S2) showing an enlarged S portion (S) of Figure 36. Figures 37 and 38 show display devices according to the 18th and 19th embodiments, respectively.

[0248] 37 and 38, in the display devices S1 and S2 according to the eighteenth and nineteenth embodiments, a first passivation layer 116a may be disposed on the second optical layer 117b. A black matrix BM may be disposed on the first passivation layer 116a. The black matrix BM may be disposed around or at one end of the first passivation layer 116a.

[0249] 39 to 42 are diagrams showing devices to which the display device according to the embodiment of the present specification is applied.

[0250] 39 to 42, the display device 1000 according to the embodiment of the present specification can be included in various devices or electronic devices, etc. For example, as shown in Fig. 39 to 42, the various electronic devices can include a wearable device 1100, a mobile device 1200, a notebook 1300, and a monitor or TV (1400), but the embodiment of the present specification is not limited thereto.

[0251] The wearable device 1100, mobile device 1200, notebook 1300, and monitor or TV (1400) may each include case portions 1005, 1010, 1015, 1020 and other display panels 100 and display devices 1000, such as those described in the embodiments of this specification above.

[0252] For example, the display device according to the embodiments of the present specification may be applied to a mobile device, an image telephone, a smart watch, a watch phone, a wearable apparatus, a foldable apparatus, a rollable apparatus, a bendable apparatus, a flexible apparatus, a curved apparatus, a sliding apparatus, a variable apparatus, an electronic organizer, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, a vehicle display device, a theater display device, a television, a wallpaper device, a signage device, a game device, a notebook, a monitor, a camera, a camcorder, and a home appliance.

[0253] A display device according to various embodiments of the present specification can be described as follows.

[0254] A display device according to various embodiments herein may include a substrate including a display area including a plurality of pixels and a non-display area surrounding the display area, one or more pixel driving circuits disposed on the substrate, a plurality of inorganic light-emitting elements coupled to the one or more pixel driving circuits, an optical layer surrounding the plurality of inorganic light-emitting elements, a first passivation layer disposed on the optical layer, and trenches disposed between the plurality of inorganic light-emitting elements.

[0255] According to various embodiments herein, the display device may further include a black matrix disposed on the first passivation layer.

[0256] According to various embodiments herein, the display device may further include a second passivation layer disposed between the one or more pixel driving circuits and the plurality of inorganic light emitting elements.

[0257] According to various embodiments herein, the thickness of the first passivation layer can be different from the thickness of the second passivation layer.

[0258] According to various embodiments herein, the pixel may further include a plurality of banks disposed between the one or more pixel driving circuits and the second passivation layer.

[0259] According to various embodiments herein, the second passivation layer can further include a patterned layer disposed between the plurality of banks and the plurality of inorganic light emitting elements. The second passivation layer can include holes exposing the patterned layer.

[0260] According to various embodiments herein, the device may further include a plurality of first electrodes disposed between the plurality of banks and the pattern layer.

[0261] According to various embodiments herein, trenches can be included around the periphery of the display area and in the non-display area.

[0262] According to various embodiments herein, the non-display area may include a dummy area that includes dummy pixels.

[0263] According to various embodiments herein, the non-display area may include a plurality of dummy light-emitting elements, and the trench may be disposed between the plurality of dummy light-emitting elements.

[0264] According to various embodiments herein, a first passivation layer can be disposed in the trench.

[0265] According to various embodiments herein, the plurality of inorganic light-emitting elements may include an anode electrode, a first semiconductor layer disposed on the anode electrode, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a cathode electrode disposed on the second semiconductor layer.

[0266] According to various embodiments herein, the plurality of inorganic light emitting devices can have a vertical structure.

[0267] According to various embodiments of the present disclosure, the light-emitting device may include a first electrode disposed below the plurality of inorganic light-emitting elements and electrically connecting the anode electrode, and a pattern layer disposed between the first electrode and the anode electrode. The first electrode and the anode electrode may be electrically connected by eutectic bonding through the pattern layer.

[0268] According to various embodiments of the present disclosure, the pixel driving circuit may further include a plurality of interconnections disposed on the pixel driving circuit and connected to the pixel driving circuit, and the interconnections may be disposed in the same layer and spaced apart from each other.

[0269] According to various embodiments of the present disclosure, the pixel display device may further include a plurality of connecting wires disposed on and connected to the one or more pixel driving circuits, and a plurality of insulating layers disposed between the connecting wires, and the plurality of connecting wires may be alternately disposed in different layers with the insulating layers interposed therebetween.

[0270] According to various embodiments of the present disclosure, a bending region extending from the non-display region may be included, and among the plurality of insulating layers, an insulating layer adjacent to the plurality of banks in each of the plurality of inorganic light emitting elements may not be disposed in the bending region.

[0271] According to various embodiments of the present specification, among the plurality of insulating layers, the thickness of the insulating layer adjacent to the plurality of banks in each of the plurality of inorganic light-emitting elements and the thickness of the insulating layer on one or more pixel driving circuits may be thicker than the thickness of the insulating layer between the plurality of banks and one or more pixel driving circuits.

[0272] According to various embodiments of the present disclosure, the pixel display device may further include a plurality of pad electrodes connected to one or more pixel driving circuits, and other connecting wiring connecting the plurality of pad electrodes to one or more pixel driving circuits.

[0273] According to various embodiments herein, the other interconnect lines may be in the same layer as the interconnect lines on one or more pixel driving circuits of the plurality of interconnect lines.

[0274] A display device according to various embodiments of the present disclosure may include a display panel configured with a plurality of pixels each including a plurality of light-emitting elements, and trenches in the plurality of pixels, the trenches including first trenches disposed between the plurality of light-emitting elements and second trenches disposed between the plurality of light-emitting elements.

[0275] According to various embodiments herein, the first trench can be disposed to extend in a first direction, and the second trench can be disposed to extend in a second direction that intersects the first direction.

[0276] According to various embodiments herein, the trench may include a bending region disposed in a first direction from the display panel, and the trench may further include a third trench disposed between the display panel and the bending region.

[0277] According to various embodiments herein, the third trench can be disposed to extend in a second direction that intersects with the first direction.

[0278] According to various embodiments herein, the plurality of light-emitting elements can include a plurality of first light-emitting elements that realize a first color, a plurality of second light-emitting elements that realize a second color, and a plurality of third light-emitting elements that realize a third color, and the first trench can be disposed between the plurality of first light-emitting elements and the plurality of second light-emitting elements.

[0279] According to various embodiments herein, the light-emitting device may further include an optical layer on the plurality of light-emitting elements and a first passivation layer disposed on the optical layer. The first passivation layer may be disposed in the trench.

[0280] A display device according to various embodiments of the present specification may include a substrate including a display area and a non-display area surrounding the display area, a plurality of light-emitting elements in the display area, a plurality of dummy light-emitting elements in the non-display area, a first passivation layer disposed on the plurality of light-emitting elements and the plurality of dummy light-emitting elements, and a trench disposed between the plurality of dummy light-emitting elements.

[0281] According to various embodiments of the present disclosure, an optical layer may be further included in the plurality of light-emitting elements or the plurality of dummy light-emitting elements. The optical layer may include a trench. The first passivation layer may be disposed in the trench.

[0282] According to various embodiments herein, the optical layer can include a first optical layer over the plurality of light-emitting elements and the plurality of dummy light-emitting elements, and a second optical layer over the plurality of light-emitting elements.

[0283] According to various embodiments herein, the display device may further include a black matrix disposed on the first passivation layer.

[0284] According to various embodiments herein, the plurality of light-emitting elements may be disposed between the plurality of first electrodes and the plurality of second electrodes disposed on the plurality of first electrodes, and the plurality of dummy light-emitting elements may be disposed on the plurality of first electrodes.

[0285] According to various embodiments herein, a first passivation layer can be disposed on the second electrode.

[0286] According to various embodiments herein, the light emitting device can further include a patterned layer disposed between the plurality of first electrodes and the plurality of light emitting elements.

[0287] According to various embodiments herein, the plurality of first electrodes and the plurality of light emitting elements can be connected by eutectic bonding through the pattern layer.

[0288] Although the embodiments of the present invention have been described in more detail above with reference to the accompanying drawings, the present invention is not necessarily limited to such embodiments and can be implemented in various modified forms within the scope of the technical concept of the present invention.

[0289] Therefore, the embodiments disclosed in the present invention are intended to illustrate, rather than limit, the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by such embodiments.

[0290] Therefore, the above-described embodiments should be understood in all respects as illustrative and not restrictive.

[0291] The scope of protection of the present invention should be interpreted by the scope of the claims, and any technical ideas within the equivalent range should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0292] 100 Display Panel 110 Substrate 116 Passivation Layer 130, 140, 150 Light-emitting element 160 Printed Circuit Board AA display area BA bending area BM Black Matrix SDP Pattern Layer SP, SP1, SP2, SP3 subpixels T, T1, T2, T3 trenches

Claims

1. a substrate including a display area including a plurality of pixels and a non-display area located around the display area; one or more pixel drive circuits disposed on the substrate; a plurality of inorganic light emitting devices coupled to the one or more pixel driving circuits; an optical layer located around the inorganic light-emitting elements; a first passivation layer disposed on the optical layer; and a trench disposed between the inorganic light emitting elements; A display device comprising:

2. a black matrix disposed on the first passivation layer; a second passivation layer disposed between the one or more pixel driving circuits and the plurality of inorganic light emitting elements; The display device of claim 1 further comprising:

3. The display device of claim 2 , further comprising a plurality of banks disposed between the one or more pixel driving circuits and the second passivation layer.

4. further comprising a pattern layer disposed between the plurality of banks and the plurality of inorganic light emitting elements; The display device of claim 3 , wherein the second passivation layer includes holes that expose the patterned layer.

5. The display device of claim 4 , further comprising a plurality of first electrodes disposed between the plurality of banks and the pattern layer.

6. The display device according to claim 1 , wherein the trenches are located around the periphery of the display area and in the non-display area.

7. The display device according to claim 6 , wherein the non-display area includes a dummy area including dummy pixels.

8. the non-display area includes a plurality of dummy light-emitting elements, The display device according to claim 6 , wherein the trench is disposed between the plurality of dummy light-emitting elements.

9. The plurality of inorganic light-emitting elements are an anode electrode; a first semiconductor layer disposed on the anode electrode; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; a cathode electrode disposed on the second semiconductor layer; The display device of claim 1 , comprising:

10. a first electrode disposed under the inorganic light emitting devices and electrically connected to the anode electrode; a patterned layer between the first electrode and the anode electrode; Including, The display device according to claim 9 , wherein the first electrode and the anode electrode are electrically connected by the pattern layer through eutectic bonding.

11. further comprising a plurality of connecting wires disposed on the one or more pixel driving circuits and connected to the one or more pixel driving circuits; The display device according to claim 1 , wherein the plurality of interconnecting lines are arranged in the same layer and spaced apart from each other.

12. a plurality of connecting wires disposed on the one or more pixel driving circuits and connected to the one or more pixel driving circuits; a plurality of insulating layers between the plurality of interconnections; further comprising The display device according to claim 1 , wherein the plurality of interconnections are alternately arranged in different layers with the plurality of insulating layers interposed therebetween.

13. further comprising a bending region extending from the non-display region; The display device of claim 12 , wherein among the plurality of insulating layers, insulating layers adjacent to the plurality of banks in each of the plurality of inorganic light emitting elements are not disposed in the bending region.

14. 14. The display device according to claim 13, wherein the thickness of the insulating layer adjacent to the banks in each of the inorganic light-emitting elements and the thickness of the insulating layer on the one or more pixel driving circuits are each greater than the thickness of the insulating layer between the banks and the one or more pixel driving circuits.

15. a plurality of pad electrodes connected to the one or more pixel driving circuits; other connecting wires connected to the plurality of pad electrodes and the one or more pixel driving circuits; The display device of claim 11 further comprising:

16. The display device of claim 15 , wherein the other connecting wires are in the same layer as connecting wires on the one or more pixel driving circuits among the plurality of connecting wires.

17. Bank and a first electrode disposed on the bank; a second electrode disposed on the plurality of inorganic light-emitting elements; further comprising The display device according to claim 7 , wherein the plurality of inorganic light-emitting elements are disposed on the bank and the first electrode.

18. a display panel configured of a plurality of pixels each including a plurality of light-emitting elements; trenches in the plurality of pixels; Including, The display device, wherein the trenches include first trenches disposed between the plurality of light-emitting elements and second trenches disposed between the plurality of light-emitting elements.

19. the first trench is disposed to extend in a first direction; The display device according to claim 18 , wherein the second trenches are arranged to extend in a second direction that intersects with the first direction.

20. a substrate including a display area and a non-display area surrounding the display area; a plurality of light-emitting elements in the display area; a plurality of dummy light-emitting elements in the non-display area; a first passivation layer disposed on the plurality of light-emitting elements and the plurality of dummy light-emitting elements; a trench in the non-display region, the trench being disposed between the plurality of dummy light-emitting elements; A display device comprising:

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