Vapor deposition apparatus and maintenance method thereof

Abstract

To provide a vapor deposition apparatus whose maintenance is easy.SOLUTION: The deposition apparatus includes a process chamber providing a space for processing a substrate and having an opening at one side, a door opening and closing the opening of the process chamber, and a deposition source supplying a deposition material to the substrate in the process chamber and having at least a portion of a top surface exposed through the opening when the opening is opened by the door.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a vapor deposition apparatus and a maintenance method thereof, and more particularly to a vapor deposition apparatus for vacuum vapor deposition and a maintenance method thereof. [Background technology]

[0002] The manufacturing process of semiconductors or display devices includes a vacuum deposition method for forming a thin film on a substrate. The vacuum deposition method involves placing a substrate, which is the substrate to be deposited, and an evaporation source containing a raw material for deposition particles in a chamber, and heating and vaporizing the evaporation source to vaporize the raw material and spray it onto the substrate to form a thin film.

[0003] In recent years, as the size of substrates to be deposited has increased, the size of deposition apparatuses for depositing the deposition objects has also increased. As a result, the components constituting the larger deposition apparatuses have also become larger and heavier, which makes it difficult for workers to perform maintenance work on the deposition apparatuses, such as by directly entering the deposition apparatuses to resupply raw materials or by directly removing components that need to be replaced. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Korean Utility Model Publication No. 1999-0011016 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a vapor deposition apparatus that is easy to maintain.

[0006] Another object of the present invention is to provide a method for maintaining the deposition apparatus.

[0007] However, the object of the present invention is not limited to the above-mentioned object, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Means for solving the problem]

[0008] In order to achieve the object of the present invention, a deposition apparatus according to one aspect of the present invention includes a process chamber that provides a space for processing a substrate and has an opening defined on one side thereof, a door that opens and closes the opening of the process chamber, and a deposition source that supplies a deposition material to the substrate in the process chamber and has at least a portion of an upper surface exposed through the opening when the opening is opened by the door.

[0009] The door drive unit further includes a door drive unit that moves the door.

[0010] The door drive unit rotates the door to open and close the opening.

[0011] The door drive unit slides the door to open and close the opening.

[0012] When the opening is closed by the door, a first contact surface of the process chamber adjacent to the opening contacts a second contact surface of the door.

[0013] On the cross section, each of the first contact surface and the second contact surface is inclined with respect to the normal direction of the substrate.

[0014] The door defines a groove recessed from the second contact surface toward the interior of the door.

[0015] When the opening is closed by the door, the groove and the opening are connected to each other.

[0016] In cross section, the width of the door decreases from the top to the bottom.

[0017] In cross section, the width of the process chamber increases from the top to the bottom.

[0018] The deposition apparatus further includes a deposition source moving unit that moves the deposition source in a direction parallel to the substrate within the process chamber.

[0019] When the opening is opened by the door, the deposition source moving unit moves the deposition source toward the door.

[0020] In order to achieve another object of the present invention, a deposition apparatus according to another aspect of the present invention includes a process chamber that provides a space for processing a substrate and has an opening defined on one side thereof; a door that opens and closes the opening of the process chamber and has a cross-sectional width that gradually decreases from top to bottom; and a deposition source that supplies a deposition material to the substrate within the process chamber.

[0021] The process chamber has a cross-sectional width that increases from the top to the bottom.

[0022] When the opening is opened by the door, at least a portion of the upper surface of the deposition source is exposed through the opening.

[0023] In order to achieve another object of the present invention, a maintenance method for a deposition apparatus according to one aspect of the present invention includes the steps of: moving a deposition source, which supplies a deposition material to a substrate in a process chamber, toward a door contacting one side of the process chamber; opening an opening defined in the one side of the process chamber using the door; and replacing an object positioned in the process chamber from outside the process chamber through the opening.

[0024] In the step of opening the opening, the opening is opened so that a center portion of the deposition source is exposed.

[0025] In the step of moving toward the door, the deposition source is moved in a direction parallel to the substrate using a deposition source moving unit coupled to the deposition source, and in the step of opening the opening, the deposition source moving unit supports the center of the deposition source.

[0026] In the step of opening the opening, the door is rotated to open the opening.

[0027] In the step of opening the opening, the door is slid to open the opening. [Effects of the Invention]

[0028] According to the present invention, a deposition technique that is easy to maintain can be provided. The deposition technique of the present invention can be expressed in various ways, and for example, the deposition technique employing the following configuration can achieve the following effects.

[0029] In a deposition apparatus according to an embodiment of the present invention, a door opens and closes an opening defined on one side of a process chamber. When the door opens the opening, a deposition source is exposed through the opening. When using such a deposition apparatus, an operator can easily perform maintenance work on the deposition apparatus periodically from outside the process chamber, thereby improving the efficiency of maintenance work on the deposition apparatus.

[0030] Furthermore, in a deposition apparatus according to an embodiment of the present invention, if a guide rail, a mobile cart, etc. for accessing the process chamber can be eliminated, the efficiency of maintenance work for the deposition apparatus can be further improved and the maintenance work time can be reduced.

[0031] In addition, in a deposition apparatus according to an embodiment of the present invention, the door may have a width that narrows from top to bottom in cross section, and the process chamber may have a width that widens from top to bottom. In this case, the opening can be easily opened and closed using the door, which further improves the efficiency of maintenance work on the deposition apparatus.

[0032] In a maintenance method according to an embodiment of the present invention, the deposition source may be moved toward the door so that the center of the deposition source is exposed through the opening, and an object located within the process chamber may be replaced from outside the process chamber. In this case, the worker can perform maintenance work outside the process chamber without directly entering the process chamber, thereby improving the efficiency of maintenance work for large deposition equipment. Furthermore, during the maintenance method, there is no need to wear a gas mask or gas suit, which is normally worn when entering the process chamber. As a result, the maintenance method can reduce maintenance costs and time.

[0033] However, the effects of the present invention are not limited to the above effects, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Brief explanation of the drawings]

[0034] [Figure 1] FIG. 1 is a perspective view showing a vapor deposition apparatus according to one embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view showing the vapor deposition apparatus in FIG. 1 with the door closed. [Figure 3] FIG. 3 is a cross-sectional view showing a cross section taken along line II in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line II-II in FIG. [Figure 5] FIG. 5 is a plan view showing a part of the vapor deposition apparatus of FIG. [Figure 6] FIG. 6 is a flowchart showing a maintenance method for the vapor deposition apparatus of FIG. [Figure 7]FIG. 7 is a cross-sectional view illustrating a step of moving the vapor deposition source shown in FIG. 6 toward the door. [Figure 8] FIG. 8 is a plan view for explaining the step of rotating the door of FIG. 6 to open the opening. [Figure 9] FIG. 9 is a view illustrating a method for replacing an object located in the process chamber from the outside of the process chamber of FIG. [Figure 10] FIG. 10 is a plan view showing a part of a vapor deposition apparatus according to another embodiment of the present invention. [Figure 11] FIG. 11 is a flowchart showing a maintenance method for the vapor deposition apparatus of FIG. [Figure 12] FIG. 12 is a plan view for explaining the step of sliding the door of FIG. 11 to open the opening. DETAILED DESCRIPTION OF THE INVENTION

[0035] Specific structural or functional descriptions of the embodiments of the present invention set forth herein are merely exemplary for purposes of describing the embodiments of the present invention, and the example embodiments of the present invention may be embodied in various forms and should not be construed as being limited to the embodiments set forth herein.

[0036] The present invention can be modified in various ways and can have various forms, and specific embodiments are shown by way of example in the drawings and will be described in detail herein, but it should be understood that this is not to limit the invention to the particular forms disclosed, but rather to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

[0037] Terms such as "first" and "second" are used to describe various components, but the components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first component can be referred to as a second component, and similarly, a second component can be referred to as a first component, without departing from the scope of the present invention.

[0038] When a component is said to be "coupled" or "connected" to another component, it should be understood that the component may be directly coupled or connected to the other component, but there may also be other components in between. On the other hand, when a component is said to be "directly coupled" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationship between components, such as "between" and "immediately between," or "adjacent to" and "directly adjacent to," should be interpreted similarly.

[0039] The terms used in this application are merely used to describe specific embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprise" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or possibility of addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0040] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as having an idealized or overly formal meaning unless expressly defined in this application.

[0041] However, when an embodiment can be implemented differently, the functions or operations specified in a particular block may occur differently from the sequence specified in the flowchart. For example, two consecutive blocks may actually occur substantially simultaneously, or the blocks may be reversed depending on the functions or operations involved.

[0042] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used to designate the same elements in the drawings, and redundant description of the same elements will be omitted.

[0043] Fig. 1 is a perspective view showing a vapor deposition apparatus according to one embodiment of the present invention. Fig. 2 is a perspective view showing the vapor deposition apparatus in Fig. 1 with the door closed. Fig. 3 is a cross-sectional view showing a cross section taken along II in Fig. 2. Fig. 4 is a cross-sectional view showing a cross section taken along II-II in Fig. 2.

[0044] As shown in FIGS. 1 to 4, a deposition apparatus 100 according to one embodiment of the present invention includes a process chamber 110, a door 120, a door driver 130, a deposition source 140, a deposition source moving unit 150, an adhesion prevention plate 160, and a fixing unit 170.

[0045] In this specification, a plane is defined by a first direction (DR1) and a second direction (DR2). For example, the first direction (DR1) and the second direction (DR2) are perpendicular to each other. Furthermore, a third direction (DR3) is perpendicular to the plane.

[0046] The deposition apparatus 100 is used in a deposition process for depositing a deposition material on a deposition target (e.g., a substrate (SUB)). The deposition apparatus 100 maintains an internal vacuum state during the deposition process. For example, the interior of a process chamber 110 is maintained in a vacuum state during the deposition process. In one embodiment, the deposition apparatus 100 is a large-scale deposition apparatus for performing the deposition process.

[0047] The deposition process includes a process in which a source material placed in a deposition source 140 is heated, vaporized, and transported toward the substrate (SUB) to be deposited on the target. The source material may be in a liquid or solid state. The substrate (SUB) on which the deposition material is deposited is used in manufacturing a semiconductor device or display device. The deposition material is a thin film deposited on the semiconductor device or display device. For example, the deposition material may include an organic material that forms an emission layer of the display device. However, the type of the deposition material according to an embodiment of the present invention is not limited thereto, and the deposition material may also form an electrode layer, a metal layer, an inorganic insulating layer, an organic insulating layer, etc. included in the display device.

[0048] The deposition process performed in the deposition apparatus 100 includes a vacuum deposition method, a physical vapor deposition (PVD) method such as ion plating or sputtering, and a chemical vapor deposition (CVD) method using a gas reaction.

[0049] A mask (MSK) is disposed between the deposition source 140 and the substrate (SUB). The deposition material is deposited on the substrate (SUB) through the mask (MSK). The mask (MSK) has openings with a specific pattern formed therein, and the deposition material has a pattern corresponding to the pattern of the mask (MSK) and is deposited on the substrate (SUB). The mask (MSK) also includes an alignment member. The alignment member fixes the substrate (SUB) at a specific position on the mask (MSK) so that the substrate (SUB) corresponds to the pattern of the mask (MSK).

[0050] The process chamber 110 provides a space for processing a substrate (SUB). In one embodiment, the process chamber 110 includes a metal material. However, the material included in the process chamber 110 according to an embodiment of the present invention is not limited thereto, and the process chamber 110 may include various materials, such as a rigid plastic.

[0051] The process chamber 110 is maintained in a low vacuum state or a high vacuum state during the deposition process. The process chamber 110 includes a vacuum pump for maintaining the vacuum state. For example, the vacuum pump serves to exhaust air from the process chamber 110 to the outside of the process chamber 110, thereby maintaining the inside of the process chamber 110 in a low vacuum state or a high vacuum state. The vacuum pump may be located inside or outside the process chamber 110.

[0052] An opening 200 is defined on one side of the process chamber 110, and is connected to the space. In one embodiment, the process chamber 110 has a cross-sectional shape that increases in width from the top to the bottom in the third direction (DR3). For example, the width of the top of the process chamber 110 in the third direction (DR3) in the first direction (DR1) is smaller than the width of the bottom of the process chamber 110 in the first direction (DR1). Specifically, the cross-section is a cross-section of the process chamber 110 taken along a line that includes the opening 200 and is parallel to the first direction (DR1). The cross-section is also a cross-section of the process chamber 110 taken along a plane that includes the first direction (DR1) and the third direction (DR3), as shown in FIG. 4. That is, the process chamber 110 has a narrower top and wider bottom shape, in which the width of the top is narrower than the width of the bottom. The process chamber 110 has, in a cross-sectional view of a plane including the first direction (DR1) and the third direction (DR3), a front portion (front portion on the first direction (DR1) side) that includes the opening 200 and is inclined so that its width increases from top to bottom as described above, and a rear portion (rear portion on the side opposite to the first direction (DR1)) that continues from the portion including the opening 200 to the front portion in the direction opposite to the first direction (DR1). The connecting surface between the front portion and the rear portion is along a plane including the first direction (DR1) and the second direction (DR2).

[0053] The process chamber 110 is defined with a first contact surface 102 that contacts the door 120. For example, the first contact surface 102 is a portion of the process chamber 110 adjacent to the opening 200. In one embodiment, the first contact surface 102 is inclined with respect to a normal direction perpendicular to the substrate (SUB) (e.g., a third direction (DR3) or a plane direction including the second direction (DR2) and the third direction (DR3)). Specifically, the inclination direction of the first contact surface 102 is a diagonal direction between the direction opposite to the first direction (DR1) and the third direction (DR3). Furthermore, as shown in FIG. 4, the first contact surface 102 is also a plane that intersects at an angle with a plane including the first direction (DR1) and the second direction (DR2). The first contact surface 102 is a surface that surrounds the opening 200 and is generally flush with the plane of the opening 200.

[0054] The door 120 opens and closes the opening 200. For example, the door 120 moves away from the side of the process chamber 110 to open the opening 200. Alternatively, the door 120 comes into contact with the side of the process chamber 110 to close the opening 200. When the door 120 opens the opening 200, an operator can perform maintenance on components (e.g., the deposition source 140, the shield 160) located within the process chamber 110.

[0055] The door 120 is defined with a second contact surface 122 that contacts the process chamber 110. For example, the second contact surface 122 of the door 120 contacts the first contact surface 102 of the process chamber 110. Specifically, when the door 120 closes the opening 200, the first contact surface 102 and the second contact surface 122 contact each other. In one embodiment, the second contact surface 122 has a size corresponding to the size of the first contact surface 102 so as to contact the first contact surface 102.

[0056] In one embodiment, the width of the door 120 decreases from the top to the bottom in the third direction (DR3) on a cross section. For example, the width of the top of the door 120 in the third direction (DR3) in the first direction (DR1) is greater than the width of the bottom of the door 120 in the third direction (DR3) in the first direction (DR1). Specifically, the cross section is a cross section of the door 120 cut along a line parallel to the first direction (DR1). Here, the width of the door 120 in the first direction (DR1) is defined without including the groove 220 (i.e., the width is described by including the groove 220 in the width of the door 120, rather than excluding the groove 220 as a space in the width of the door 120). The cross section is also a cross section of the door 120 along a plane including the first direction (DR1) and the third direction (DR3). That is, the door 120 has a shape in which the width of the upper part is wider than the width of the lower part, and the lower part is narrower.

[0057] In one embodiment, the second contact surface 122 is tilted with respect to the normal direction perpendicular to the substrate (SUB). For example, the tilt direction of the second contact surface 122 corresponds to the tilt direction of the first contact surface 102. Specifically, when the first contact surface 102 and the second contact surface 122 contact each other, the tilt direction of the second contact surface 122 is a diagonal direction between the direction opposite to the first direction (DR1) and the third direction (DR3).

[0058] A groove 220 corresponding to the opening 200 is defined in the door 120. The groove 220 is recessed from the second contact surface 122 toward the inside of the door 120. When the first contact surface 102 and the second contact surface 122 contact each other, the opening 200 and the groove 220 are connected to each other. In one embodiment, the groove 220 has a U-shape in cross section. Specifically, the cross section is a cross section of the door 120 cut along a line that includes the groove 220 and is parallel to the first direction (DR1). Alternatively, the cross section may be a cross section of the door 120 cut along a plane that includes the first direction (DR1) and the third direction (DR3), as shown in FIG. 4 . However, the shape of the groove 220 according to an embodiment of the present invention is not limited thereto, and the groove 220 may have various shapes. As shown in FIG. 4, the door 120 is formed in a box shape including a groove 220 having an opening corresponding to the opening 200. In a cross-sectional view including the first direction (DR1) and the third direction (DR3), the door 120 has a rear portion (the rear portion on the side opposite to the first direction (DR1)) that is inclined as described above at the opening of the groove 220, and a front portion (the front portion on the first direction (DR1) side) that continues from the rear portion to the rear portion in the first direction (DR1). The connecting surface between the front portion and the rear portion is along a plane that includes the first direction (DR1) and the second direction (DR2). Furthermore, the front end surface of the front portion in the first direction (DR1) is along the second direction (DR2) and the third direction (DR3).

[0059] The door driver 130 moves the door 120. For example, the door driver 130 moves the door 120 in a direction away from the process chamber 110 to open the opening 200. Alternatively, the door driver 130 moves the door 120 in a direction toward the process chamber 110 to close the opening 200. The door driver 130 is connected to the door 120 or is formed integrally with the door 120 to move the door 120.

[0060] In one embodiment, the door driver 130 includes a drive motor. For example, the drive motor automatically moves the door 120. Specifically, before an operator performs maintenance work, the drive motor automatically operates to move the door 120 away from the process chamber 110. The manner in which the door driver 130 moves the door 120 will be described in detail with reference to FIGS. 5 and 10.

[0061] The deposition source 140 stores and preserves the source material. The deposition source 140 also evaporates the source material. For example, the deposition source 140 includes a crucible that stores and preserves the source material. The deposition source 140 also includes a heating unit that heats the source material to spray the deposition material onto the substrate (SUB).

[0062] The heating unit is adjacent to the crucible and transfers heat to the crucible. In one embodiment, the heating unit has a coil shape. The heating unit generates heat by resistance using a power source supplied from the outside or inside of the process chamber 110 or by electromagnetic induction.

[0063] The deposition source 140 moves in a direction parallel to the substrate (SUB) (e.g., a first direction (DR1) and / or a second direction (DR2)) within the process chamber 110. This allows the deposition source 140 to spray the deposition material toward a specific portion of the substrate (SUB) or to spray the deposition material evenly toward the substrate (SUB). In one embodiment, the deposition source 140 includes a nozzle that sprays the deposition material.

[0064] Before the opening 200 is opened by the door 120, the deposition source 140 moves toward the opening 200. For example, the deposition source 140 moves to one side of the process chamber 110 adjacent to the door 120 for maintenance. After the opening 200 is opened by the door 120, at least a portion of the upper surface 142 of the deposition source 140 is exposed through the opening 200. Specifically, when the opening 200 is opened by the door 120, a worker located outside the process chamber 110 can easily access the deposition source 140 through the opening 200. In addition, the worker can observe at least a portion of the upper surface 142 of the deposition source 140 from outside the process chamber 110.

[0065] The deposition source moving unit 150 moves the deposition source 140. For example, the deposition source moving unit 150 moves the deposition source 140 in a first direction (DR1) and / or a second direction (DR2). Specifically, the deposition source 140 is coupled to the deposition source moving unit 150, and the deposition source moving unit 150 moves the deposition source 140 toward a specific position on the substrate (SUB). The deposition source moving unit 150 includes a guide rail, a motor, and the like for moving the deposition source 140 in a specific direction. The deposition source moving unit 150 moves the deposition source 140 from the center of the process chamber 110 or from the side opposite to the side where the opening 200 is defined of the process chamber 110 toward the opening 200 so that at least a portion of the upper surface of the deposition source 140 is exposed through the opening 200.

[0066] The deposition source moving unit 150 fixes the deposition source 140. For example, the deposition source moving unit 150 includes a fixing means, such as a fixing groove or a fixing pin, for fixing the deposition source 140 after moving the deposition source 140 to a specific position. The deposition source 140 is fixed at a position on the deposition source moving unit 150 by the fixing means, or is moved onto the deposition source moving unit 150 when the fixing means is released.

[0067] The deposition shield 160 covers at least a portion of the inner wall surface of the process chamber 110. The deposition shield 160 reduces contamination of the inner wall surface caused by the deposition material being deposited on the inner wall surface of the process chamber 110 during the deposition process. The deposition shield 160 is a plate coupled to the process chamber 110 and parallel to the inner wall surface. The deposition shield 160 surrounds at least a portion of the deposition source 140 and the deposition source moving unit 150 in cross section. The deposition shield 160 extends from the bottom of the process chamber 110 toward the substrate (SUB). However, the shape and arrangement of the deposition shield 160 according to the embodiment of the present invention are merely examples and are not limiting. The shape and arrangement of the deposition shield 160 may be various.

[0068] The fixing unit 170 has a surface on which the substrate (SUB) is seated, and supports and fixes the substrate (SUB). In one embodiment, the fixing unit 170 moves in a vertical direction (e.g., a third direction (DR3) and a direction opposite to the third direction (DR3)) corresponding to the loading time, unloading time, or execution time of the deposition process of the deposition object. In another embodiment, the fixing unit 170 includes a heating member or is connected to a heating member to heat and maintain the deposition object placed on the fixing unit 170 at a predetermined temperature.

[0069] However, the components included in the deposition apparatus 100 according to the embodiment of the present invention are not limited thereto, and the deposition apparatus 100 may further include various components for performing the deposition process.

[0070] FIG. 5 is a plan view showing a part of the vapor deposition apparatus of FIG.

[0071] 5, the door driver 130 includes a shaft 132 that is parallel to a third direction (DR3). The door 120 is connected to the shaft 132 by a connection 134.

[0072] In one embodiment, the coupling 134 is part of the door 120. For example, the coupling 134 extends from one side of the door 120 and is part of the coupling 134 that is coupled to the shaft 132.

[0073] In one embodiment, the connecting portion 134 is a part of the door actuator 130. For example, the connecting portion 134 extends from the shaft 132 toward the door 120 and is a part of the door actuator 130 that is coupled to the door 120. However, the connecting portion 134 according to an embodiment of the present invention is not limited thereto and may be any of various types of components that connect the door 120 and the door actuator 130.

[0074] In one embodiment, the door driver 130 rotates the door 120 to open and close the opening 200. For example, the door 120 can rotate around the shaft 132 with the connecting portion 134 as a radius. Specifically, the door 120 rotates around the shaft 132 in a direction away from the process chamber 110 to open the opening 200. Also, the door 120 rotates around the shaft 132 in a direction toward the process chamber 110 to close the opening 200.

[0075] In one embodiment, the shaft 132 to which the coupling part 134 is connected is adjacent to the door 120. For example, the shaft 132 to which the coupling part 134 is connected is adjacent to one side of the door driver 130 facing in the direction opposite to the first direction (DR1). However, the position of the shaft 132 according to an embodiment of the present invention is not limited thereto, and the shaft 132 to which the coupling part 134 is connected may have various arrangements. For example, the shaft 132 to which the coupling part 134 is connected may not be adjacent to the door 120, but may be adjacent to the other side of the door driver 130 facing in the first direction (DR1).

[0076] As described above, in the deposition apparatus 100 according to the embodiment of the present invention, the door 120 opens and closes the opening 200 defined on one side of the process chamber 110. When the door 120 opens the opening 200, the deposition source 140 is exposed through the opening 200. As a result, when performing maintenance work on the deposition apparatus 100, an operator can easily perform the maintenance work periodically from outside the process chamber 110, thereby improving the efficiency of the maintenance work on the deposition apparatus 100.

[0077] Furthermore, since there is no need for a guide rail or a moving cart for accessing the process chamber 110, the efficiency of maintenance work for the deposition apparatus 100 can be further improved and the maintenance work time can be reduced.

[0078] In addition, in cross section, the width of the door 120 decreases from the top to the bottom, while the width of the process chamber 110 increases from the top to the bottom. This makes it easy to open and close the opening 200 using the door 120, further improving the efficiency of maintenance work on the deposition apparatus 100.

[0079] Fig. 6 is a flowchart showing a maintenance method for the deposition apparatus of Fig. 1. Fig. 7 is a cross-sectional view illustrating a step of moving the deposition source toward the door in Fig. 6. Fig. 8 is a plan view illustrating a step of rotating the door to open the opening in Fig. 6. Fig. 9 is a view illustrating a method of replacing an object located in the process chamber from outside the process chamber in Fig. 6.

[0080] 6 to 9, the maintenance method (S1) according to an embodiment of the present invention includes a step (S10) of moving the deposition source 140 toward the door 120, a step (S20) of rotating the door 120 to open the opening 200, and a step (S30) of replacing a target object located in the process chamber 110 from outside the process chamber 110. In one embodiment, the maintenance method (S1) is a method of performing maintenance work on the deposition apparatus 100 shown in FIG. 1. However, the target of the maintenance method (S1) according to the embodiment of the present invention is not limited thereto.

[0081] The step (S10) of moving the deposition source 140 toward the door 120 is performed after the deposition process of heating the deposition source 140 and depositing the deposition material on the substrate (SUB) is completed. That is, the step (S10) of moving the deposition source 140 toward the door 120 is performed while the deposition process is being performed in the process chamber 110.

[0082] In the step (S10) of moving the deposition source 140 toward the door 120, the deposition source 140 is moved using the deposition source moving unit 150. For example, the deposition source 140 is moved using the deposition source moving unit 150 in a direction parallel to the substrate (SUB) (e.g., a first direction (DR1) and / or a second direction (DR2)).

[0083] In one embodiment, the deposition source 140 is moved such that its center is exposed through the opening 200. For example, when the step (S20) of rotating the door 120 to open the opening 200 is performed, the center of the deposition source 140 is exposed to the outside of the process chamber 110 through the opening 200. That is, the deposition source moving unit 150 moves the deposition source 140 toward the opening 200 in advance (e.g., before the opening 200 is opened by the door 120) so that the center of the deposition source 140 is exposed to the outside of the process chamber 110 when the door 120 opens the opening 200.

[0084] The center of the deposition source 140 is defined by a centerline 240 that is parallel to the third direction (DR3) and passes through the center of the deposition source 140. The centerline 240 extends in the third direction (DR3) at the center of the width of the deposition source 140 in the first direction (DR1). In one embodiment, the center of the deposition source 140 is a location for storing and storing the source material. The center of the deposition source 140 is also a location for replacing the source material.

[0085] In step S10 of moving the deposition source 140 toward the door 120, the deposition source moving unit 150 moves the deposition source 140 to a position where it can support the deposition source 140. For example, the deposition source moving unit 150 moves the deposition source 140 so that the center of the deposition source 140 contacts one end of the deposition source moving unit 150 (the tip of the deposition source moving unit 150 in the first direction (DR1)). Specifically, the deposition source moving unit 150 moves the deposition source 140 so that the center line 240 does not extend from the one end of the deposition source moving unit 150 facing the first direction (DR1) to the first direction (DR1). That is, the center line 240 extends from the one end of the deposition source moving unit 150 in the opposite direction to the first direction (DR1) or overlaps the one end.

[0086] However, in the step S10 of moving the deposition source 140 toward the door 120 according to an embodiment of the present invention, the maximum position to which the deposition source 140 can be moved is not limited thereto, and the position at which the deposition source 140 is supported may vary depending on the shape of the deposition source moving unit 150. For example, since the center of gravity of the deposition source 140 and the deposition source moving unit 150 may change depending on the shape of the deposition source moving unit 150, the deposition source moving unit 150 may have a shape that supports the deposition source 140 even when the position of the center line 240 is away from the deposition source moving unit 150 in the first direction (DR1).

[0087] The step (S20) of rotating the door 120 to open the opening 200 is performed after the step (S10) of moving the deposition source 140 toward the door 120 is completed. In the step (S20) of rotating the door 120 to open the opening 200, the door 120 rotates around the shaft 132 in a direction away from the door 120. For example, the door 120 is rotated clockwise by the door drive unit 130 in a top view in the third direction (DR3) to open the opening 200. Furthermore, the door 120 is rotated counterclockwise by the door drive unit 130 in a top view in the third direction (DR3) to close the opening 200.

[0088] The door 120 is opened to expose the top surface of the deposition source 140. In one embodiment, in the step (S20) of rotating the door 120 to open the opening 200, the opening 200 is opened to expose the center portion of the deposition source 140. Furthermore, when the door 120 opens the opening 200, the first contact surface 102, the deposition source moving unit 150, the adhesion prevention plate 160, etc. are exposed. Therefore, the opening 200 does not overlap with the process chamber 110 in a plan view. The dotted line in FIG. 8 indicates the trajectory of the door 120 moving while the door 120 opens the opening 200. However, the components included in the deposition apparatus 100 exposed by the movement of the door 120 according to an embodiment of the present invention are not limited thereto. Furthermore, the trajectory of the door 120 shown by the dotted line is merely an example and is not limiting. The door 120 may open the opening 200 along various trajectories.

[0089] In the step S30 of replacing a target object located in the process chamber 110 from outside the process chamber 110, the target object is an object that needs to be replaced for maintenance work. For example, the target object may include the source material stored in the deposition source 140 or a contaminated deposition shield 160. However, the target object according to an embodiment of the present invention is not limited thereto.

[0090] In one embodiment, when the source material stored in the deposition source 140 is depleted or insufficient, the source material is replaced by a new one by the operator. In one embodiment, in the step (S30) of replacing the object located in the process chamber 110 from outside the process chamber 110, the deposition material is deposited on the contaminated deposition shield 160 and the deposition shield 160 is replaced with a new deposition shield 160 by the operator.

[0091] The worker can perform the replacement work outside the process chamber 110. For example, during the step (S30) of replacing the object positioned in the process chamber 110 from outside the process chamber 110, the worker can replace the source material stored in the deposition source 140, the center of which is exposed through the opening 200, outside the process chamber 110, without directly entering the process chamber 110. Also, during the step (S30) of replacing the object positioned in the process chamber 110 from outside the process chamber 110, the worker can replace the contaminated shield 160 outside the process chamber 110.

[0092] As described above, in the maintenance method (S1) according to an embodiment of the present invention, the deposition source 140 is moved toward the door 120 so that the center portion of the deposition source 140 is exposed through the opening 200, and the target item located inside the process chamber 110 can be replaced from outside the process chamber 110. This allows the worker to perform maintenance work outside the process chamber 110 without directly entering the process chamber 110, thereby improving the efficiency of maintenance work on the large deposition apparatus 100. Furthermore, during the maintenance method (S1), there is no need to wear a gas mask or gas suit when entering the process chamber 110. As a result, the maintenance method (S1) can reduce maintenance costs and time. Furthermore, as described above, the width of the process chamber 110 increases from its top to its bottom. Therefore, by positioning the deposition source 140, etc., at the leading end of the process chamber 110 in the first direction (DR1), at least a portion of the deposition source 140, etc., e.g., an upper portion, can be easily exposed to the outside of the process chamber 110. The shape of the process chamber 110 and the corresponding shape of the door 120 also facilitate maintenance and the like.

[0093] FIG. 10 is a plan view showing a part of a vapor deposition apparatus according to another embodiment of the present invention.

[0094] Except for the door driving unit 130a, the deposition apparatus 100a described in Figure 10 is substantially the same as or similar to the deposition apparatus 100 described in Figure 1. In the following, the content that overlaps with the content described in Figures 1 and 5 will be omitted or simplified.

[0095] 10, the deposition apparatus 100a includes a door driver 130a. In one embodiment, the door driver 130a slides the door 120. The door driver 130a includes a sliding guide 132a for sliding the door 120. The door 120 is connected to the sliding guide 132a by a connector 134a.

[0096] In one embodiment, the coupling portion 134a is a part of the door 120. For example, the coupling portion 134a is a part of the coupling portion 134a that extends from one side of the door 120 and is coupled with the sliding guide 132a.

[0097] In one embodiment, the connecting portion 134a is a part of the door driver 130a. For example, the connecting portion 134a extends from the sliding guide 132a toward the door 120 and is a part of the door driver 130a that is coupled to the door 120. However, the connecting portion 134a according to the embodiment of the present invention is not limited thereto and may correspond to various types of components that connect the door 120 and the door driver 130a.

[0098] In one embodiment, the door driver 130a slides the door 120 to open and close the opening 200 in FIG. 1 . For example, the door driver 130a slides the door 120 in a first direction (DR1) along the sliding guide 132a to open the opening 200. The door driver 130a also slides the door 120 along the sliding guide 132a in the direction opposite to the first direction (DR1) to close the opening. Specifically, the door 120 rotates clockwise in a top view in a third direction (DR3) while sliding in the first direction (DR1) to open the opening. The door 120 also rotates counterclockwise in a top view in a third direction (DR3) while sliding in the direction opposite to the first direction (DR1) to close the opening.

[0099] However, the movement and rotation of the door 120 according to an embodiment of the present invention is not limited thereto, and the door 120 may slide in various ways to open and close the opening using the sliding guide 132a. For example, the door 120 may slide in the first direction (DR1) or the direction opposite to the first direction (DR1) without rotating. Specifically, the door 120 may slide in the first direction (DR1) or the direction opposite to the first direction (DR1) while maintaining a state parallel to the one side of the process chamber 110.

[0100] As described above, in the deposition apparatus 100a according to the embodiment of the present invention, the door 120 opens and closes the opening 200 defined on one side of the process chamber 110. When the door 120 opens the opening 200, the deposition source 140 is exposed through the opening 200. As a result, when performing maintenance work on the deposition apparatus 100a, an operator can easily perform the maintenance work periodically from outside the process chamber 110, thereby improving the efficiency of the maintenance work on the deposition apparatus 100a.

[0101] Furthermore, since there is no need for a guide rail or a moving cart for accessing the process chamber 110, the efficiency of maintenance work for the deposition apparatus 100a can be further improved and the maintenance work time can be reduced.

[0102] Furthermore, in cross section, the width of the door 120 decreases from the top to the bottom, while the width of the process chamber 110 increases from the top to the bottom. This allows the opening 200 to be easily opened and closed using the door 120, further improving the efficiency of maintenance work on the deposition apparatus 100a. Furthermore, as described above, at least a portion of the deposition source 140, etc., for example, the upper portion, is easily exposed to the outside of the process chamber 110, which facilitates maintenance, etc.

[0103] Fig. 11 is a flowchart showing a maintenance method for the vapor deposition device of Fig. 10. Fig. 12 is a plan view illustrating the step of sliding the door in Fig. 11 to open the opening.

[0104] 11 and 12 is substantially the same as or similar to the maintenance method (S1) of the vapor deposition device 100 described with reference to FIGS. 6 to 9, except for the step (S20A) of sliding the door 130a to open the opening 200. In the following, the content that overlaps with the content described with reference to FIGS. 6 to 9 will be omitted or simplified.

[0105] 11 and 12, the maintenance method S2 according to the embodiment of the present invention includes a step S10 of moving the deposition source 140 toward the door 120, a step S20A of sliding the door 120 to open the opening 200, and a step S30 of replacing a target object located in the process chamber 110 from outside the process chamber 110. In one embodiment, the maintenance method S2 is a method of performing maintenance on the deposition apparatus 100a of FIG. 10. However, the target of the maintenance method S2 according to the embodiment of the present invention is not limited thereto.

[0106] In step (S20A) of sliding the door 120 to open the opening 200, the door 120 is slid along the sliding guide 132a in a direction away from the door 120. For example, the door 120 is moved in a first direction (DR1) by the door driver 130a to open the opening 200, or moved in the direction opposite to the first direction (DR1) to close the opening 200. Specifically, as the connecting part 134a connected to the sliding guide 132a and the door 120 respectively moves in the first direction (DR1), the door 120 also slides in the first direction (DR1), and as the connecting part 134a moves in the direction opposite to the first direction (DR1), the door 120 also slides in the direction opposite to the first direction (DR1).

[0107] However, the manner in which the door moving unit according to an embodiment of the present invention (e.g., the door moving units 130, 130a in Figures 1 and 10) moves the door 120 is not limited to rotation, sliding, etc., and the door 120 can be moved in various ways to open and close the opening 200.

[0108] As described above, in the maintenance method (S2) according to an embodiment of the present invention, the deposition source 140 is moved toward the door 120 so that the center portion of the deposition source 140 is exposed through the opening 200, and the target item located inside the process chamber 110 can be replaced from outside the process chamber 110. This allows the worker to perform maintenance work outside the process chamber 110 without directly entering the process chamber 110, thereby improving the efficiency of maintenance work for the large deposition apparatus 100a. Furthermore, during the maintenance method (S2), there is no need to wear a gas mask or gas suit, which is normally worn when entering the process chamber 110. As a result, the maintenance method (S2) can reduce maintenance costs and time. [Industrial Applicability]

[0109] The present invention can be applied to the manufacture of display devices and electronic devices including the same, such as high-resolution smartphones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, and notebook computers.

[0110] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will recognize that various modifications and variations can be made to the present invention without departing from the spirit and scope of the invention as set forth in the following claims. [Explanation of symbols]

[0111] 100, 100a: Vapor deposition equipment 110: Process chamber 120: Door 130: Door drive unit 140: Vapor deposition source 150: Evaporation source moving part 102: First contact surface 122: Second contact surface 200:Aperture 220: Groove 300: Target item

Claims

1. a process chamber providing a space for processing a substrate and having an opening defined on one side; a door for opening and closing the opening of the process chamber; a deposition source configured to supply a deposition material to the substrate within the process chamber, the deposition source having at least a portion of an upper surface exposed through the opening when the opening is opened by the door.

2. The deposition apparatus according to claim 1 , further comprising a door driving unit that moves the door.

3. The deposition apparatus according to claim 2 , wherein the door driving unit rotates the door to open and close the opening.

4. The deposition apparatus according to claim 2 , wherein the door driving unit slides the door to open and close the opening.

5. 2. The deposition apparatus of claim 1, wherein when the opening is closed by the door, a first contact surface of the process chamber adjacent to the opening contacts a second contact surface of the door.

6. 6. The deposition apparatus according to claim 5, wherein, in a cross section, the first contact surface and the second contact surface are each inclined with respect to a normal direction of the substrate.

7. The deposition apparatus of claim 5 , wherein the door has a groove defined therein that is recessed from the second contact surface toward the inside of the door.

8. The deposition apparatus of claim 7 , wherein the groove and the opening are connected to each other when the opening is closed by the door.

9. 2. The deposition apparatus according to claim 1, wherein the width of the door narrows from the top to the bottom in cross section.

10. 2. The deposition apparatus of claim 1, wherein the process chamber has a cross-sectional width that increases from its top to its bottom.

11. 2. The deposition apparatus of claim 1, further comprising a deposition source moving unit that moves the deposition source in the process chamber in a direction parallel to the substrate.

12. The vapor deposition apparatus according to claim 11 , wherein when the opening is opened by the door, the vapor deposition source moving unit moves the vapor deposition source toward the door.

13. a process chamber providing a space for processing a substrate and having an opening defined on one side; a door for opening and closing the opening of the process chamber, the door having a cross-sectional width that gradually decreases from top to bottom; a deposition source for supplying a deposition material to the substrate within the process chamber.

14. 14. The deposition apparatus of claim 13, wherein the process chamber has a cross-sectional width that increases from top to bottom.

15. The deposition apparatus of claim 13 , wherein when the opening is opened by the door, at least a portion of an upper surface of the deposition source is exposed through the opening.

16. moving a deposition source that supplies a deposition material to a substrate in a process chamber toward a door that contacts one side of the process chamber; opening an opening defined on the one side of the process chamber using the door; and replacing an object positioned in the process chamber from outside the process chamber through the opening.

17. 17. The maintenance method for a vapor deposition apparatus according to claim 16, wherein in the opening, the opening is opened so that a center portion of the vapor deposition source is exposed.

18. In the step of moving the deposition source toward the door, the deposition source is moved in a direction parallel to the substrate using a deposition source moving unit coupled to the deposition source; The maintenance method for a vapor deposition apparatus according to claim 17 , wherein, in the opening, the vapor deposition source moving unit supports the center portion of the vapor deposition source.

19. 17. The maintenance method for a vapor deposition apparatus according to claim 16, wherein in the step of opening the opening, the door is rotated to open the opening.

20. 17. The maintenance method for a vapor deposition apparatus according to claim 16, wherein in the step of opening the opening, the door is slid to open the opening.

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