Laser processing apparatus

Abstract

To provide a small-sized laser beam machining device capable of three dimensional machining of a solid work and beveling of a bar-shaped work.SOLUTION: A laser machining device (91) includes a rod-shaped workpiece holder (3) configured to hold a rod-shaped workpiece (W2) in a posture extending in a first direction and to be rotatable about an axis (CLA) extending in the first direction, a positioner table (4) configured to change an inclination of a workpiece holding surface (411) configured to hold a three dimensional workpiece (W1), and a laser beam emitter configured to emit a laser beam (LS) at a changeable emission angle and to be independently movable in the first direction and a second direction orthogonal to the first direction in a horizontal plane. A laser machining device includes a laser machining head (2) that machines a rod-shaped workpiece (W2) in a first machining region (AR1) and machines a three dimensional workpiece (W1) in a second machining region (AR2) independent of the first machining region (AR1), and a control device (5) that controls rotation around an axis (CLA), movement of the laser machining head (2), and an emission angle of a laser beam (LS), and the control device (5) performs beveling on the rod-shaped workpiece (W2) by causing a change in the emission angle of the laser beam (LS) and the rotation around the axis (CLA) to cooperate with each other.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a laser processing device. [Background technology]

[0002] In laser processing, a laser beam emitted from a laser processing head is used to perform processing such as cutting on, for example, plate-shaped workpieces and rod-shaped workpieces. Patent Document 1 describes an apparatus that can perform two-dimensional laser processing on plate-shaped workpieces and rod-shaped workpieces with a single laser processing device by selectively allowing a flat plate processing table that holds plate-shaped workpieces and a rod-shaped workpiece processing table that holds rod-shaped workpieces to move in and out of an area that can be laser-processed by the laser processing head.

[0003] Furthermore, in laser processing, the laser processing head and the table for holding the workpiece provided in the laser processing device are each configured to be rotatable, for example, around two orthogonal axes, and three-dimensional laser processing is performed on a workpiece having a three-dimensional shape (hereinafter referred to as a three-dimensional workpiece). In such a laser processing device, the table for holding the three-dimensional workpiece and the table for processing a rod-shaped workpiece can be selectively moved in and out, and as described in Patent Document 2, groove processing can be performed on the rod-shaped workpiece so that the edge becomes an inclined surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-91180 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-46849 Summary of the Invention [Problem to be solved by the invention]

[0005] The configuration described in Patent Document 1, in which different types of tables are selectively moved in and out of the processing area of ​​the laser processing head to correspond to the processing mode of the workpiece, leaves room for improvement in that it takes time to change tables, etc. for processing setup. Therefore, for example, in the laser processing device capable of the above-mentioned three-dimensional processing, it is considered to make the three-dimensional processing area using a positioner table for processing three-dimensional workpieces, which are processed frequently, and the bar-shaped workpiece processing area for processing bar-shaped workpieces independent and adjacent areas.

[0006] However, even in this case, it is required to be able to perform three-dimensional processing such as groove cutting on rod-shaped workpieces, so the movable range of the laser processing head needs to be wider than when simply cutting a rod-shaped workpiece on a plane perpendicular to the axis, which results in a larger laser processing device. Therefore, it is desired that the laser processing device be compact and capable of three-dimensional processing of solid workpieces and three-dimensional processing such as groove cutting on rod-shaped workpieces. [Means for solving the problem]

[0007] One aspect of one or more embodiments is a laser beam forming apparatus including: a rod-shaped workpiece holding section that holds a rod-shaped workpiece in a position extending in a horizontal first direction and that can rotate the held rod-shaped workpiece around an axis extending in the first direction; a positioner table that has a workpiece holding surface that can hold a three-dimensional workpiece and that can change the inclination of the workpiece holding surface; and a laser beam forming apparatus that emits a laser beam at a changeable emission angle and is movable independently in the first direction and a second direction that is perpendicular to the first direction in a horizontal plane, and that performs a first processing on the rod-shaped workpiece held by the rod-shaped workpiece holding section by the emitted laser beam. The laser processing device comprises a laser processing head that processes the three-dimensional workpiece in a first processing area and processes the three-dimensional workpiece held on the workpiece holding surface in a second processing area independent of the first processing area, and a control device that controls the rotation of the rod-shaped workpiece about its axis, the movement of the laser processing head, and the emission angle of the laser beam, wherein the control device performs groove processing with an inclined cutting surface on the rod-shaped workpiece held in the rod-shaped workpiece holding section by coordinating the change in the emission angle of the laser beam with the rotation of the rod-shaped workpiece about its axis. [Effects of the Invention]

[0008] According to the laser processing device according to one or more embodiments, it is possible to obtain the effect of being compact and capable of three-dimensional processing such as three-dimensional processing of a solid workpiece and groove processing of a rod-shaped workpiece. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective partial cross-sectional view illustrating the configuration of a laser processing apparatus 91 according to one embodiment of the present invention. [Figure 2] FIG. 2 is a partial perspective view for explaining laser processing of a rod-shaped workpiece W2 held by the rod-shaped workpiece holding portion 3. As shown in FIG. [Figure 3] FIG. 3 is a schematic plan view for explaining the processing area of ​​the laser processing device 91. As shown in FIG. [Figure 4] FIG. 4 is a diagram for explaining the range of movement in the Y direction of the laser processing head 2 provided in the laser processing device 91. As shown in FIG. [Figure 5] FIG. 5 is a diagram for explaining the rotation range of the laser processing head 2 around the U axis. [Figure 6] FIG. 6 is a block diagram showing the configuration of the laser processing device 91. [Figure 7A] FIG. 7A is a plan view showing an opening WP to be formed in the rod-shaped workpiece W2. [Figure 7B] FIG. 7B is a cross-sectional view taken along the line S7B-S7B in FIG. 7A. [Figure 7C] FIG. 7C is a cross-sectional view taken along the line S7C-S7C in FIG. 7A. [Figure 8A] FIG. 8A is a diagram for explaining a first step of the process of forming an opening WP in a rod-shaped workpiece W2. [Figure 8B] FIG. 8B is a diagram for explaining the second step. [Figure 8C] FIG. 8C is a diagram illustrating the third step. [Figure 8D] FIG. 8D is a diagram for explaining the fourth step. [Figure 9A] FIG. 9A is a plan view showing a specific example of an opening WP1 formed in a rod-shaped workpiece W2. [Figure 9B] FIG. 9B is a flow diagram showing the first stage of the method for forming the opening WP1. [Figure 9C] FIG. 9C is a flowchart showing the latter stage of the method for forming the opening WP1. DETAILED DESCRIPTION OF THE INVENTION

[0010] The configuration of a laser processing apparatus 91, which is one aspect of a laser processing apparatus according to one or more embodiments of the present invention, will be described with reference to Figures 1 to 6. Note that the meaning of rotation in the following description includes rotation of 360° or more in one direction around an axis, rotation of 360° or more in the opposite direction to the one direction, and rotation of an angle less than 360° regardless of the direction of rotation.

[0011] FIG. 1 is a perspective partial cross-sectional view illustrating the configuration of a laser processing apparatus 91 according to one embodiment of the present invention. FIG. 2 is a partial perspective view illustrating laser processing of a rod-shaped workpiece W2 held by a rod-shaped workpiece holder 3. FIG. 3 is a schematic plan view illustrating the processing area of ​​the laser processing apparatus 91. FIG. 4 is a diagram illustrating the movement range in the Y direction of the laser processing head 2 provided in the laser processing apparatus 91. FIG. 5 is a diagram illustrating the rotation range around the U axis of the laser processing head 2. FIG. 6 is a block diagram illustrating the configuration of the laser processing apparatus 91.

[0012] For ease of explanation, the up / down, left / right, front / rear directions are defined as the directions of the arrows shown in Figure 1. The left / right direction is also called the X direction, the front / rear direction is also called the Y direction, and the up / down direction is also called the Z direction. The up / down direction is the vertical direction.

[0013] The main body 1 of the laser processing device 91 has an external appearance that is roughly a hexahedron surrounded by walls that serve as partitions. In Fig. 1, the top and front walls of the walls are not shown, and the left wall 11 and the right wall 13 are shown as cross-sectional views seen from the front at roughly the center position in the front-to-rear direction.

[0014] As shown in FIG. 1, the laser processing device 91 includes a main body 1, a laser processing head 2, a rod-shaped workpiece holder 3, a positioner table 4, a control device 5, and a laser oscillator 6, and is installed on an installation surface FL.

[0015] The main body 1 has a left wall 11, a rear wall 12, and a right wall 13 as partitions, as well as an upper wall and a front wall not shown in Fig. 1. The front wall not shown has a door that can be opened and closed, and opening the door allows workers to enter and exit the inside of the main body 1, and allows workpieces to be carried in and out. Furthermore, by closing the door on the front wall, the internal space of the main body 1 surrounded by the walls is isolated from the outside as a laser processing space.

[0016] A left rail 14 and a right rail 15 extending parallel to the front-rear direction are attached to the upper edges of the left wall 11 and the right wall 13, respectively. A linear beam 21 extending in the left-right direction is suspended between the left rail 14 and the right rail 15. The beam 21 moves in the front-rear direction by the operation of a Y drive unit K21 provided on the beam 21 (see arrow DR2). A shelf 121 is installed inside the rear wall 12 so as to protrude inward. Ancillary devices such as a control device 5 are housed inside the shelf 121.

[0017] The laser processing head 2 includes a main body 22 and an emission unit 23, and is attached to the beam 21 via an X drive unit K22 so as to be movable in the left-right direction (see arrow DR1). Specifically, the main body 22 has a base 221, and is attached to the beam 21 via the X drive unit K22 provided on the base 221. The base 221 also has a Z drive unit K23, and moves (raises and lowers) in the up-down direction relative to the beam 21 by operation of the Z drive unit K23 (see arrow DR3). In other words, the laser processing head 2 is configured to move independently in a first direction, which is the left-right direction, and a second direction, which is the front-rear direction, which is perpendicular to the left-right direction within a horizontal plane.

[0018] 6, the operations of the Y drive unit K21, X drive unit K22, and Z drive unit K23 are controlled by a control device 5. The control device 5 has a central processing unit 51 and a memory unit 52. The memory unit 52 stores information related to processing such as the shape, material, and cutting path of the workpiece W, such as a three-dimensional workpiece W1 and a rod-shaped workpiece W2, to be laser processed, as well as a processing program. The central processing unit 51 performs processing on the workpiece W based on the information, processing program, etc. stored in the memory unit 52.

[0019] As shown in Figure 1, the emission section 23 of the laser processing head 2 is connected to the lower part of the main body section 22, and has, in order from the main body section 22 side, a V-axis rotation section K2V, a first deflection section 222, a U-axis rotation section K2U, a second deflection section 231, a beam shaping section 232, and a nozzle 233.

[0020] A laser beam is supplied to the upper part of the main body 22 from the laser oscillator 6, which is a fiber laser oscillator, through a process fiber 61. When the laser processing head 2 is in the position shown in FIG. 1 , the supplied laser beam travels downward inside the main body 22, is deflected by 90° by the first deflection unit 222 to form a horizontal laser beam, and is then deflected by 90° by the second deflection unit 231 to form a laser beam that travels downward again. The laser beam emitted from the second deflection unit 231 is shaped by an optical system disposed inside the beam shaping unit 232 into a beam with a predetermined beam shape and that is focused at a predetermined distance, and is then emitted to the outside from the tip of the nozzle 233 as a laser beam LS.

[0021] 6, the operation of the laser oscillator 6 is controlled by the control device 5. Although the laser oscillator 6 is shown installed outside the main body 1 in FIG. 1, it may be placed inside the main body 1 by being housed inside the shelf 121, for example.

[0022] 1 and 4, the V-axis rotation unit K2V rotates the first deflection unit 222, the U-axis rotation unit K2U, the second deflection unit 231, the beam shaping unit 232, and the nozzle 233 as a whole within a predetermined angular range around the V-axis extending in the up-down direction (vertical direction) (see arrow DR41). The U-axis rotation unit K2U rotates the second deflection unit 231, the beam shaping unit 232, and the nozzle 233 as a whole within a predetermined angular range around the U-axis extending in the horizontal direction (perpendicular to the V-axis) (see arrow DR42). This allows the laser processing head 2 to change the emission angle of the emitted laser beam LS.

[0023] 6, the rotational operations of the V-axis rotation unit K2V and the U-axis rotation unit K2U are controlled by the control device 5. The V-axis rotation unit K2V and the U-axis rotation unit K2U constitute the head attitude drive unit K2.

[0024] 1, a rod-shaped workpiece holding part 3 for holding a rod-shaped workpiece W2 is disposed in the lower rear part of the internal space of the main body 1. The rod-shaped workpiece holding part 3 has a chuck part 31 and a plurality of workpiece supporters 32. In this example, there are two workpiece supporters 32.

[0025] The chuck part 31 includes a base part 311, a chuck unit 312, and an A-axis rotation part 313 (see FIGS. 3 and 4) installed in the base part 311. Here, the rod-shaped workpiece W2 is a workpiece in the form of a long rod, and the cross-sectional shape is not limited, and may be circular, rectangular, irregular, or the like. In addition, there is no limit to whether the workpiece is solid or hollow, and either may be used.

[0026] As shown in FIG. 4, the chuck unit 312 is a so-called jaw chuck, and in this example, it is a four-jaw chuck having gripping jaws 3121 to 3124. The chuck unit 312 holds one end of a rod-shaped workpiece W2 by clamping it between the four radially movable gripping jaws 3121 to 3124. The chuck unit 312 rotates about an axis CLA extending in the left-right direction (first direction) by being driven by the A-axis rotating part 313. That is, the chuck unit 312 holds one end of the rod-shaped workpiece W2 concentric with the axis CLA and can rotate the held rod-shaped workpiece W2 about the axis CLA. With respect to the rotation direction of the axis CLA, the counterclockwise direction is positive and the clockwise direction is negative when viewed from the left. The left view is a state in which the chuck unit 312 is viewed from the other end side (left side) of the held rod-shaped workpiece W2.

[0027] As shown in Fig. 1, the work supporter 32 is supported on the front surface of the shelf portion 121, is movable left and right along the axis CLA, and can be fixed at any position. As shown in Fig. 2, the work supporter 32 has an arm 321 that clamps and holds the outer circumferential surface of the rod-shaped workpiece W2, and holds one end of the rod-shaped workpiece W2, the other end of which is held by the chuck unit 312, thereby stably maintaining the holding posture of the rod-shaped workpiece W2. The rod-shaped workpiece W2 in Fig. 2 is tubular. As shown in Fig. 1, a tray 33 that receives dross and the like produced by laser processing is arranged below the range in which the work supporter 32 moves.

[0028] The positioner table 4 includes a base 43, a support arm 42, a table portion 41, a PTy rotating portion K42, and a PTz rotating portion K41. The base 43 of the positioner table 4 is fixed to the installation surface FL, and the positioner table 4 is installed adjacent to the front side of the rod-shaped workpiece holding portion 3.

[0029] A pair of support arms 42 are erected on the base 43, spaced apart in the front-to-rear direction. A PTz rotation unit K41 is supported between the pair of support arms 42 so as to be rotatable around a PTy axis extending horizontally in the front-to-rear direction. A PTy rotation unit K42 that rotates the PTz rotation unit K41 around the PTy axis is attached to one of the support arms 42. The PTz rotation unit K41 and the PTy rotation unit K42 form a positioner table drive unit K4.

[0030] A disk-shaped table unit 41 is attached to the drive shaft of the PTz rotation unit K41. The drive shaft of the PTz rotation unit K41 is an axis perpendicular to the PTz axis, and the table unit 41 rotates around the PTz axis by the operation of the PTz rotation unit K41. In FIG. 1, the PTz axis is shown in a position extending in the vertical direction, that is, the workpiece holding surface 411, which is the upper surface of the table unit 41, is shown in a horizontal position. A three-dimensional workpiece W1 (shown by a dashed line) to be laser processed is fixed to the workpiece holding surface 411 by a fixture (not shown).

[0031] The laser processing head 2 has a reference position shown in Fig. 1. Specifically, in the reference position, the nozzle 233 of the laser processing head 2 faces straight down, the laser beam LS is emitted vertically downward, and the optical axis of the laser beam LS is positioned forward in the front-to-rear direction away from the V axis. The rotational positions of the emission unit 23 around the V axis and the U axis in the reference position are each set to 0°.

[0032] The position in which the angle of the emission unit 23 around the V axis is 0° is a position in which the emission unit 23 is positioned forward relative to the main body unit 22, and when viewed from above, the V axis and the optical axis of the emitted laser beam LS are at the same position in the left-right direction and are spaced apart forward in the front-to-back direction.

[0033] Regarding the U axis, counterclockwise rotation is positive and clockwise rotation is negative when viewed from the front in Figure 1. Regarding the V axis, counterclockwise rotation is positive and clockwise rotation is negative when viewed from the top in Figure 1.

[0034] Next, the range of motion of the laser processing head 2 will be described with reference to FIGS. In particular, Figure 4 is a left-side view, and for the sake of simplicity, the front-most position Y1 and the rear-most position Y2 in the Y direction are shown for the lower part of the base 221 of the main body 22 of the laser processing head 2 and the injection part 23. The positions of the chuck part 31 and the positioner table 4 in the Y-axis direction, including the position of the axis CLA, are also shown. Furthermore, the flat workpiece processing table TAB is shown by a two-dot chain line in a state where it has been inserted into a predetermined position within the main body 1 after opening the front wall (not shown). In other words, the laser processing device 91 can optionally include the flat workpiece processing table TAB as equipment. The flat workpiece processing table TAB can be inserted into and removed from the inside of the main body 1 from the front, as shown in Figure 3. As shown in Figure 4, the flat workpiece processing table TAB is shaped so that when it is inserted into the main body 1, it does not interfere with the positioner table 4 fixed to the installation surface FL, and is located above the table portion 41 of the positioner table 4.

[0035] As shown in Fig. 3, the laser machining device 91 has, in a plan view, a first machining area AR1, which is an area where a rod-shaped workpiece W2 held by the rod-shaped workpiece holder 3 can be machined, and a second machining area AR2, which is an area where a three-dimensional workpiece W1 or a flat workpiece W fixed to the positioner table 4 or the flat workpiece machining table TAB can be machined. The first machining area AR1 and the second machining area AR2 are independent areas, have the same distance ARX in the left-right direction, do not overlap in the front-rear direction, and are set so that the second machining area AR2 is located adjacent to the front side of the first machining area AR1. The distance that can be moved from the rear end of the first machining area AR1 to the front end of the second machining area AR2 is the distance LY in the Y direction (see Fig. 4).

[0036] As shown in Figure 4, the laser processing head 2 has the first deflection unit 222 and the second deflection unit 231, so that the emission position of the laser beam LS is shifted in the horizontal direction by a distance LF2 relative to the V axis. Therefore, if the movement distance of the laser processing head 2 at the V axis position due to the operation of the Y drive unit K21 is distance LY, the processing range in the Y direction is maximum when the position around the V axis at its front end is 0° and the position around the V axis at its rear end is 180°. In other words, the maximum distance ARY is Distance ARY = distance LF2 × 2 + distance LY (Equation 1) is.

[0037] In this example, the Y-direction position of the axis CLA is a distance LFA behind the rearmost position Y2 of the V-axis. Therefore, the shape of the rod-shaped workpiece W2 that can be held by the rod-shaped workpiece holding part 3 and machined by the laser beam LS from vertically above is such that the distance from the axis CLA to the rear end of the rod-shaped workpiece W2 is (distance LF2 - distance LFA).

[0038] The range of motion around the U axis of the laser processing head 2 is shown in Fig. 5. As shown in Fig. 5, the range of rotation around the U axis is within the range of an angle θ = 135° in both positive and negative directions from the 0° position where the laser beam LS is directed vertically downward, where counterclockwise rotation is positive and clockwise rotation is negative when viewed from the front of the laser processing head 2 in the reference position.

[0039] 4, the distance LY between the foremost position Y1 and the rearmost position Y2 in the Y direction (front-rear direction) of the V axis is set to, for example, 800 mm. Also, the distance LF2 is set to 150 mm, the distance LFA is set to 20 mm, and the distance ARY is then 1100 mm from (Equation 1).

[0040] In addition, in movement in the X direction (left and right direction) of the V axis, the distance ARX in the left and right direction between the leftmost position X1 and the rightmost position X2 shown in FIG. 3 is set to, for example, 1000 mm.

[0041] The laser processing head 2 of the laser processing device 91 has the above-mentioned range of movement. An example of groove processing on a rod-shaped workpiece W2 using this laser processing device 91 will be described.

[0042] First, an outline of groove processing performed on a rod-shaped workpiece W2 will be described with reference to Figs. 7A to 7C. Fig. 7A is a plan view showing an opening WP formed in the rod-shaped workpiece W2. Fig. 7B is a cross-sectional view taken along the line S7B-S7B in Fig. 7A. Fig. 7C is a cross-sectional view taken along the line S7C-S7C in Fig. 7A.

[0043] Here, the rod-shaped workpiece W2 is a hollow pipe having a square cross section and side surfaces Wa to Wd. A rectangular opening WP is formed on one side surface Wa of the rod-shaped workpiece W2. The opening WP has a cut surface corresponding to the four sides of the rectangle that is inclined at an angle θb so that the opening narrows from the outer surface to the inner surface.

[0044] An example of a specific method for forming the opening WP will be described with reference to FIGS. 3, 4, 8A to 8D, and 9A to 9D. FIG. 8A is a diagram for explaining a first step of the process for forming the opening WP1 in the rod-shaped workpiece W2. FIG. 8B is a diagram for explaining a second step. FIG. 8C is a diagram for explaining a third step. FIG. 8D is a diagram for explaining a fourth step. FIG. 9A is a plan view showing a specific example of the opening WP1 formed in the rod-shaped workpiece W2. FIG. 9B is a flow chart showing the first stage of the method for forming the opening WP1. FIG. 9C is a flow chart showing the middle stage of the method for forming the opening WP1. FIG. 9D is a flow chart showing the latter stage of the method for forming the opening WP1.

[0045] Specific dimensions of the opening WP1 are shown in FIG. 9A with a rod-shaped workpiece W2 held by the chuck portion 31. The opening WP1 has four corners, points A to D, and four sides LN1 to LN4. Sides LN1 and LN3 extend in the left-right direction, and sides LN2 and LN4 extend in the front-to-back direction. Sides LN1 and LN3 connecting points A and B and points C and D are long sides with lengths of 100 mm, and short sides LN2 and LN4 are 80 mm long.

[0046] 4, the frontmost position Y1 is 0 mm, the rearmost position Y2 is 800 mm, and the Z-axis coordinate is the height position of the axis CLA is 0 mm. Also, the X-axis coordinate in FIG. 3 is the leftmost position X1 is 0 mm, and the rightmost position is 1000 mm, and the next machine origin is set based on these.

[0047] The mechanical origin is defined as a position where the laser processing head 2 is in the reference position (V=0°, U=0°) shown in Figure 1, the V axis is at the rearmost position Y2 of Y=800 mm, the rightmost position X2 of X=1000 mm, and the bottom end of the nozzle 233 in the reference position is Z=110 mm upward. That is, at the mechanical origin, the tip position of the nozzle 233 in the reference position on the V axis is at (X, Y, Z)=(1000, 800, 110).

[0048] 9B to 9D based on the movement of the laser processing head 2 from the machine origin, the groove processing method for the rod-shaped workpiece W2 will be described. Unless otherwise specified, the operations described below are controlled by the control device 5. In addition, the Z direction is assumed to be moved appropriately by the control device 5 depending on the characteristics of the laser beam LS and the outer shape of the rod-shaped workpiece W2.

[0049] First, the laser processing head 2 is set to the above-mentioned machine origin (S1). Next, the V axis is rotated from 0° to −180° (S2: see arrow DR8 in FIG. 8A), and the chuck unit 312 is rotated from 0° to −45° around the axis CLA (S3: see arrow DR8A in FIG. 8A).

[0050] The irradiation position of the laser beam LS is moved to match point A of the opening WP1 in Fig. 9A (S4). That is, (X, Y) is set to (900, Ya). When the rod-shaped workpiece W2 is assumed to be a regular square prism with a width W2d (see FIG. 9A), Ya can be calculated by the following (Equation 2). Ya = 820 - [(W2d / 2) - 40] × sin45° (Equation 2) When the width W2d is 100 mm, Ya≈812.9 is obtained from (Equation 2).

[0051] A laser beam LS is emitted (S5), and the laser processing head 2 is moved 100 mm in the X direction from a position 900 mm at point A to a position 800 mm at point B, thereby performing cutting processing of the side LN1 having an end face inclined at 45° (S6). When point B is reached, emission of the laser beam LS is stopped (S7).

[0052] Next, the chuck unit 312 is rotated from -45° to 0° around the axis CLA. Also, as shown in FIG. 8B, the emission part 23 is rotated from 0° to -45° around the U axis (see DR8B). Accordingly, the irradiation position of the laser beam LS is moved in the XY directions so as to follow point B, and (X, Y) is set to (800 - α, 860) (S8). α is set taking into consideration the Z position and depending on the characteristics of the laser beam LS, etc. These operations bring the rod-shaped workpiece W2 and laser processing head 2 into the posture shown in FIG. 8B.

[0053] The laser beam LS is emitted (S9), and the workpiece is moved 80 mm in the Y direction from point B (860 mm) to point C (780 mm), and the cutting process is performed on side LN2 having a 45° inclined end face (S10). When point C is reached, the emission of the laser beam LS is stopped (S11).

[0054] Next, the emission part 23 is rotated back around the U axis from -45° to 0°. The X direction is returned from (800 + α) mm to 800 mm. Then, as shown in FIG. 8C, the chuck unit 312 is rotated from 0° to +45° around the axis CLA (see DR8C). Accordingly, the irradiation position of the laser beam LS is moved in the Y direction to follow point C, and (X, Y) is set to (800, Yb) (S12). Yb can be calculated in the same way as Ya by the following formula (3). Ya = 820 + [(W2d / 2) - 40] × sin45° (Equation 3) When the width W2d is 100 mm, Ya≈827.1 from (Equation 3).

[0055] The laser beam LS is emitted (S13), and the workpiece is moved 100 mm in the X direction from the 800 mm position at point C to 900 mm at point D, and cutting is performed on the side LN3 having an end face inclined at 45° (S14). When point D is reached, emission of the laser beam LS is stopped (S15).

[0056] Next, as shown in FIG. 8D, the injection unit 23 is rotated from 0° to +45° around the U axis (see DR8D). Then, the chuck unit 312 is rotated from +45° to 0° around the axis CLA and returned. Accordingly, the irradiation position of the laser beam LS is moved in the XY directions to follow point D, and (X, Y) is set to (900 + β, 780) (S16). β is set taking into consideration the Z position according to the characteristics of the laser beam LS, and in this example, α and β are the same value. As a result, the rod-shaped workpiece W2 and the laser processing head 2 assume the posture shown in FIG. 8D.

[0057] The laser beam LS is emitted (S17), and the workpiece is moved 80 mm in the Y direction from point D (780 mm) to point A (860 mm), and the edge LN4 with a 45° inclined end face is cut (S18). When point A is reached, the emission of the laser beam LS is stopped (S19), and the laser processing head is returned to the machine origin (S20).

[0058] As a result of the above, the cutting position by the laser beam LS starts at point A, passes through points B, C, and D, and reaches point A again, and an opening WP1 is formed by groove processing with a rectangular inclined cutting surface.

[0059] As described above in detail, the laser processing device 91 performs 3D processing of the three-dimensional workpiece W1 using the positioner table 4 and 3D processing such as groove cutting on the rod-shaped workpiece W2 using the rod-shaped workpiece holder 3 in the first processing area AR1 and the second processing area AR2 that are separated and independent in the first direction (Y direction), respectively, thereby eliminating the need to switch tables and enabling efficient processing. Furthermore, while ensuring the independent first processing area AR1 and the second processing area AR2, in processing the rod-shaped workpiece W2, by coordinating the rotation of the chuck unit 312 that holds the rod-shaped workpiece W2 about the axis line (axis line CLA) of the rod-shaped workpiece W2 with the rotation of the emission unit 23 of the laser processing head 2 about the V axis and U axis, 3D processing such as groove cutting on the rod-shaped workpiece W2 can be performed without excessively long movement stroke of the laser processing head 2 in the first direction (front-back direction). As a result, the laser processing device 91 can be configured to be small in size while being capable of three-dimensional processing such as three-dimensional processing of the three-dimensional workpiece W1 and groove processing of the rod-shaped workpiece W2.

[0060] One aspect of the present invention is not limited to the above-described configuration and procedure, and modifications may be made without departing from the spirit of the present invention.

[0061] The laser oscillator 6 is not limited to a fiber laser. For example, it may be a YAG laser or a carbon dioxide laser. The control device 5 is not limited to being provided inside the main body 1. It may be arranged outside the main body 1.

[0062] As described above in detail, a first aspect of one or more embodiments of the present invention includes a rod-shaped workpiece holding unit 3 that holds a rod-shaped workpiece W2 in a position extending in a horizontal first direction and is capable of rotating the held rod-shaped workpiece W2 around an axis CLA that extends in the first direction; a positioner table 4 that has a workpiece holding surface 411 that can hold a three-dimensional workpiece W1 and is capable of changing the inclination of the workpiece holding surface 411; and a laser beam LS that emits a laser beam LS at a changeable emission angle and is movable independently in the first direction and a second direction that is perpendicular to the first direction in a horizontal plane, and that emits the laser beam LS to rotate the rod-shaped workpiece W2 held by the rod-shaped workpiece holding unit 3. The laser processing device 91 comprises a laser processing head 2 that processes a workpiece W2 in a first processing area AR1 and processes the three-dimensional workpiece W1 held on the workpiece holding surface 411 in a second processing area AR2 independent of the first processing area AR1, and a control device 5 that controls the rotation of the rod-shaped workpiece holding unit 3 about the axis CLA, the movement of the laser processing head 2, and the emission angle of the laser beam LS, wherein the control device 5 performs groove processing with an inclined cutting surface on the rod-shaped workpiece W2 held on the rod-shaped workpiece holding unit 3 by coordinating the change in the emission angle of the laser beam LS with the rotation of the rod-shaped workpiece W2 about the axis CLA.

[0063] According to the first aspect, three-dimensional machining of a three-dimensional workpiece and groove machining of a rod-shaped workpiece are possible, and the machine can be configured compactly.

[0064] In a first aspect, when viewed from above, the first machining area AR1 may be a rectangular area that includes the axis CLA and is long in the first direction, and the second machining area may be set adjacent to the first machining area in the second direction.

[0065] This allows the laser processing device 91 to be configured small in size in the second direction.

[0066] In the first aspect, the first processing area AR1 and the second processing area AR2 may have the same length in the first direction.

[0067] This allows the width dimension of the main body 1 in the first direction to be constant, simplifying the configuration.

[0068] In addition, in the first aspect, the laser processing head 2 has a main body portion 22 that moves in the second direction, and an emission portion 23 that is connected to the main body portion 22 and is rotatable around a V axis extending in the vertical direction, and emits the laser beam LS, and the position of the laser processing head 2 in the movement range in the second direction at the position of the V axis that is closest to the rod-shaped workpiece holding portion 3 may be closer to the second processing area AR2 than the position of the axis CLA of the rod-shaped workpiece holding portion 3.

[0069] This allows the dimension of the main body 1 in the second direction to be made smaller. [Explanation of symbols]

[0070] 1 Main body 11 Left wall 12 Rear wall 121 Shelf 13 Right wall 14 Left rail 15 Right Rail 2 Laser processing head 21 Beam 22 Main body 221 Base 222 1st deflection section 23 Injection part 231 Second deflection section 232 Beam shaping section 233 Nozzle 3 Rod-shaped workpiece holding section 31 Chuck part 311 Base 312 Chuck unit 3121~3124 Gripping claw 313 A-axis rotating part 32 Work Supporter 321 Arm 33 Tray 4 Positioner Table 41 Table section 411 Work holding surface 42 Support Arm 43 Pedestal 5. Control device 51 Central Processing Unit 52 Storage section 6 Laser oscillator 61 Process Fiber 91 Laser processing equipment ARX,ARY distance AR1 1st machining area AR2 2nd machining area CLA axis FL installation surface K2 Head posture drive unit K21 Y drive unit K22 X drive unit K23 Z drive unit K2U U-axis rotation part K2V V-axis rotation part K4 Positioner table drive unit K41 PTz rotating part K42 PTy rotating part LN1~LN4 area LS Laser Beam LY,LF2,LFA distance TAB Flat work processing table X1 Leftmost position X2 Rightmost position Y1 Frontmost position Y2 Last position double work W1 3D workpiece W2 Bar work W2d width Wa~Wd Side WP,WP1 opening θ,θb angle

Claims

1. a rod-shaped workpiece holding unit that holds a rod-shaped workpiece in a position extending in a horizontal first direction and that can rotate the held rod-shaped workpiece around an axis extending in the first direction; a positioner table having a workpiece holding surface capable of holding a three-dimensional workpiece and capable of changing the inclination of the workpiece holding surface; a laser processing head that emits a laser beam at a changeable emission angle and is movable independently in the first direction and a second direction perpendicular to the first direction in a horizontal plane, and that processes the rod-shaped workpiece held by the rod-shaped workpiece holding portion in a first processing area using the emitted laser beam, and processes the three-dimensional workpiece held on the workpiece holding surface in a second processing area independent of the first processing area; a control device that controls the rotation of the rod-shaped workpiece about the axis, the movement of the laser processing head, and the emission angle of the laser beam; Equipped with The control device A laser processing device that performs groove processing on a rod-shaped workpiece held in the rod-shaped workpiece holding section by coordinating a change in the emission angle of the laser beam with a rotation of the rod-shaped workpiece about the axis, thereby producing an inclined cutting surface.

2. When viewed from above, the first processing region is a rectangular region that includes the axis and is long in the first direction, 2. The laser processing device according to claim 1, wherein the second processing area is set adjacent to the first processing area in the second direction.

3. 3. The laser processing device according to claim 2, wherein the first processing area and the second processing area have the same length in the first direction.

4. The laser processing head has a main body that moves in the second direction, and an emission section that is connected to the main body and is rotatable around a V-axis extending in the vertical direction to emit the laser beam, and the position of the laser processing head's movement range in the second direction at the position of the V-axis that is closest to the rod-shaped workpiece holding section is closer to the second processing area than the position of the axis of the rod-shaped workpiece holding section.

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