Method for manufacturing mounting substrate

Abstract

To provide a method of manufacturing a mounting substrate capable of suppressing occurrence of a bonding failure.SOLUTION: A method of manufacturing a mounting substrate includes a collective substrate 2 having a base material 21 and a plurality of pairs of mounting electrodes 22 formed on a first main surface 211 of the base material 21, and a plurality of mounting components 3 mounted on the plurality of pairs of mounting electrodes 22, respectively. In the method of manufacturing the mounting substrate, the plurality of mounting components 3 are sequentially mounted on the aggregate substrate 2 in a state where the aggregate substrate 2 is placed on the heat dissipation stage 5 from the second main surface 212 side of the base material 21. When mounting each of the mounting components 3 on the collective board 2, the mounting component 3 to be mounted is mounted on the pair of mounting electrodes 22 by irradiating a portion of the collective board 2 disposed in a projected region R of the mounting component 3 to be mounted with a laser beam from the side of the heat dissipation stage 5 opposite to the collective board 2, where the projected region R is defined as a region obtained by projecting the planned mounting positions 30 of the plurality of mounting components 3 in the thickness direction X of the collective board 2.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a mounting board. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing an imaging device having a plastic substrate and a plurality of LED arrays flip-chip connected to the plastic substrate using solder. In the method for manufacturing an imaging device in Patent Document 1, the mounting locations of the plurality of LED arrays on the plastic substrate are sequentially irradiated with laser light, thereby sequentially soldering the plurality of LED arrays to the plastic substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-340118 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the manufacturing method of an imaging device described in Patent Document 1, the heat generated when soldering an LED array is conducted in the planar direction within the plastic substrate, potentially remelting areas that have already been soldered, resulting in poor bonding.

[0005] The present invention has been made in view of the above circumstances, and has an object to provide a method for manufacturing a mounting substrate that can suppress the occurrence of poor bonding. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a mounting board including a substrate and an aggregate substrate having multiple pairs of mounting electrodes formed on a first main surface of the substrate, and multiple mounting components mounted on the multiple pairs of mounting electrodes, wherein the aggregate substrate is placed on a heat dissipation stage that dissipates heat from the aggregate substrate from a second main surface side of the substrate opposite the first main surface, and the multiple mounting components are sequentially mounted on the aggregate substrate, and when mounting each of the mounting components on the aggregate substrate, when multiple projection areas are defined as areas obtained by projecting planned mounting positions of the multiple mounting components in a thickness direction of the aggregate substrate, laser light is irradiated from the side of the heat dissipation stage opposite the aggregate substrate to the aggregate substrate to a portion of the aggregate substrate that is located within the projection area for a mounting component to be mounted, thereby melting a pair of bonding members that respectively bond the mounting component to the pair of mounting electrodes, and the mounting component to be mounted to the pair of mounting electrodes. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a method for manufacturing a mounting substrate that can suppress the occurrence of poor bonding. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view of a mounting substrate according to the embodiment. [Figure 2] FIG. 2 is a cross-sectional view of a portion of a mounting substrate according to an embodiment. [Figure 3] FIG. 2 is a plan view of an aggregate substrate according to the embodiment. [Figure 4] FIG. 2 is a cross-sectional view of a portion of an aggregate substrate according to an embodiment. [Figure 5] 1 is a cross-sectional view of a portion of an aggregate substrate on which a plurality of bonding members are arranged in an embodiment. [Figure 6] 10 is a cross-sectional view of a portion of the assembly substrate on which bonding members are arranged and the heat dissipation stage after a placing step in the embodiment. FIG. [Figure 7]10 is a plan view of the assembly substrate on which the bonding members are arranged and the heat dissipation stage after the placing step in the embodiment. FIG. [Figure 8] 4 is a cross-sectional view showing a heat dissipation stage, a substrate assembly, a bonding member, a mounting component, a mounting head, and a laser device during a mounting process according to an embodiment. FIG. [Figure 9] 10A to 10C are plan views of a plurality of light emitting devices illustrating a dividing step according to the embodiment. [Figure 10] FIG. 2 is a cross-sectional view of one light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Embodiment Mode] Embodiments of the present invention will be described with reference to Figures 1 to 10. The embodiments described below are shown as preferred specific examples for carrying out the present invention, and although some of the embodiments specifically exemplify various technically preferred aspects, the technical scope of the present invention is not limited to these specific embodiments.

[0010] (Manufacturing method of mounting substrate 1) Fig. 1 is a plan view of a mounting substrate 1 manufactured by the manufacturing method of this embodiment, and Fig. 2 is a cross-sectional view of a part of the mounting substrate 1.

[0011] This embodiment relates to a method for manufacturing a mounting substrate 1 having a plurality of mounting components 3 mounted on an aggregate substrate 2. For example, the mounting components 3 can be semiconductor elements, more specifically, light-emitting elements such as light-emitting diodes (LEDs: Light Emitting Diodes) and semiconductor lasers (LDs: Laser Diodes). In this embodiment, an example will be described in which the mounting components 3 are light-emitting diodes. In this embodiment, it is assumed that the aggregate substrate 2 is divided into a plurality of submounts (see reference numeral 20 in FIGS. 9 and 10 described later), each of which has a mounting component 3 mounted thereon, but this is not limiting and the substrate may be used with a plurality of mounting components 3 mounted thereon.

[0012] The method for manufacturing the mounting board 1 of this embodiment includes a pre-process, a placement process, and a mounting process.

[0013] Fig. 3 is a plan view of the aggregate substrate 2. Fig. 4 is a cross-sectional view of a portion of the aggregate substrate 2. Fig. 5 is a cross-sectional view of a portion of the aggregate substrate 2 on which a plurality of bonding members 4 are arranged. The pre-process is a process of preparing the aggregate substrate 2 and arranging a plurality of bonding members 4 on the aggregate substrate 2.

[0014] 3 and 4, the aggregate substrate 2 includes an electrically insulating plate-shaped base material 21, a plurality of pairs of mounting electrodes 22 formed on a first main surface 211 which is one main surface of the base material 21, and a plurality of pairs of back surface electrodes 23 formed on a second main surface 212 which is the main surface of the base material 21 opposite to the first main surface 211. Hereinafter, the thickness direction of the aggregate substrate 2 will be referred to as a height direction X, and one side of the height direction X toward which the first main surface 211 faces will be referred to as a front side X1, and the side toward which the second main surface 212 faces will be referred to as a back side X2.

[0015] The substrate 21 is made of a material that is opaque to the laser beam described below, such as a ceramic substrate made of aluminum nitride (AlN) or alumina (Al2O3). The substrate 21 can be, for example, a high temperature co-fired ceramic (HTCC) multilayer substrate or a low temperature co-fired ceramic (LTCC) multilayer substrate. The substrate 21 has a thermal conductivity of, for example, 20 W / (m K) or higher.

[0016] The aggregate substrate 2 has a plurality of rectangular unit areas 25 arranged lengthwise and breadthwise in a matrix, each of which will become a submount (see reference numeral 20 in FIGS. 9 and 10 described later) after a dividing step described later. Each unit area 25 includes a pair of mounting electrodes 22 and a pair of back electrodes 23 electrically connected to the pair of mounting electrodes 22, respectively. In FIGS. 1 to 8, the positions at which the aggregate substrate 2 is divided in a dividing step described later are indicated by two-dot chain lines L, and the areas surrounded by these two-dot chain lines L are the unit areas 25.

[0017] The pair of mounting electrodes 22 are arranged side by side with a gap therebetween in a direction perpendicular to the height direction X. The pair of mounting electrodes 22 are a cathode electrode and an anode electrode. The pair of back surface electrodes 23 are electrically connected to the pair of mounting electrodes 22, respectively. The mounting electrodes 22 and the back surface electrode 23 are electrically connected to each other through vias 24 formed to penetrate the base material 21 in the height direction X. In this embodiment, the pair of back surface electrodes 23 are arranged at positions overlapping the pair of mounting electrodes 22 in the height direction X, and are arranged side by side in the same direction as the arrangement direction of the pair of mounting electrodes 22. Note that the arrangement direction of the pair of back surface electrodes 23 may be a direction intersecting (e.g., perpendicular to) the arrangement direction of the pair of mounting electrodes 22.

[0018] 5, in a pre-process, a pair of bonding members 4 is placed on each pair of mounting electrodes 22 in each unit area 25 of the aggregate substrate 2. The bonding members 4 are made of solder, such as a gold-tin (AuSn) alloy. As an example, when the bonding members 4 are made of a gold-tin alloy, the tin (Sn) content can be 20% or more and 30% or less. The bonding members 4 are formed on the pair of mounting electrodes 22 at the mounting locations of the mounting components 3 by, for example, film formation using plating, vapor deposition, sputtering, or the like, or by applying a paste. As described above, the pre-processing is carried out, and then the placing process is carried out.

[0019] Fig. 6 is a cross-sectional view of the assembly substrate 2 on which the bonding members 4 are arranged and a portion of the heat dissipation stage 5 after the placing step. Fig. 7 is a plan view of the assembly substrate 2 on which the bonding members 4 are arranged and the heat dissipation stage 5 after the placing step.

[0020] In the placing step, the aggregate substrate 2 is placed on the placing surface 51 of the heat dissipation stage 5 from the second main surface 212 side. The heat dissipation stage 5 has a role of dissipating heat generated in the aggregate substrate 2 during the mounting step described below. The placing surface 51 of the heat dissipation stage 5 is formed in a flat shape, and after the placing step, the surfaces of the back sides X2 of the pairs of rear surface electrodes 23 abut against the placing surface 51. The aggregate substrate 2 is preferably fixed to the heat dissipation stage 5 using a fixing jig (not shown), for example, or is held by suction to the heat dissipation stage 5. This improves adhesion between the pairs of rear surface electrodes 23 and the heat dissipation stage 5, and improves heat dissipation from the aggregate substrate 2 to the heat dissipation stage 5.

[0021] The heat dissipation stage 5 is made of, for example, a material having a thermal conductivity equal to or higher than that of the base material 21. As an example, the heat dissipation stage 5 is made of a metal with high thermal conductivity such as aluminum, or a ceramic with high thermal conductivity such as aluminum nitride. The heat dissipation stage 5 is preferably made of a material with a thermal conductivity higher than that of the base material 21. The heat dissipation stage 5 has a thermal conductivity of, for example, 100 [W / (m·K)] or higher.

[0022] Note that the thermal conductivity of the heat dissipation stage 5 may be lower than that of the base material 21, as long as the heat dissipation stage 5 is capable of dissipating heat generated in the assembly substrate 2 during the mounting process. For example, even if the thermal conductivity of the material of the heat dissipation stage 5 is low, if a refrigerant flow path is formed in the heat dissipation stage 5 and the heat dissipation stage 5 is kept at a low temperature, the heat dissipation from the base material 21 can be dissipated to the heat dissipation stage 5. Furthermore, the heat dissipation performance may be ensured by forming a heat sink structure on the heat dissipation stage 5 that is made up of a number of fins protruding from the back side X2.

[0023] In this embodiment, the heat dissipation stage 5 is opaque to a laser beam used during soldering, which will be described later. Here, regions obtained by projecting the intended mounting positions 30 of the multiple components 3 in the height direction X are assumed to be multiple projection regions R. In this case, the heat dissipation stage 5 has multiple through holes 52 formed in portions that will be located within the multiple projection regions R when the assembly substrate 2 is placed on it. That is, the multiple through holes 52 are formed at the same pitch as the multiple components 3, and the assembly substrate 2 is placed on the heat dissipation stage 5 so that the multiple through holes 52 of the heat dissipation stage 5 are located in the multiple projection regions R, respectively. In this embodiment, each through hole 52 is formed so that its entirety is contained within the projection region R in which it is located, but this is not limited to this. However, it is preferable that the through holes 52 are not formed so as to span multiple projection regions R.

[0024] The through-holes 52 are formed to penetrate the heat dissipation stage 5 in the height direction X. In this embodiment, the through-holes 52 are formed to have a circular shape when viewed from the height direction X, but are not limited to this.

[0025] The through hole 52 is formed to open into the gap S between the pair of back electrodes 23. In this embodiment, the gap S between the pair of back electrodes 23 is larger than the diameter of the through hole 52, and the inner region of the through hole 52 does not overlap the pair of back electrodes 23 in the height direction X. Note that a part of the inner region of the through hole 52 may overlap a part of the back electrode 23 in the height direction X. After the placing step, a mounting step is performed.

[0026] Fig. 8 is a cross-sectional view showing the heat dissipation stage 5, the assembly substrate 2, the bonding member 4, the mounted components 3, the mounting head 6, and the laser device 7 during the mounting process. Fig. 8 shows a state in which the mounted components 3 on the left have already been mounted on the assembly substrate 2, the mounted components 3 in the center are in the process of being mounted on the assembly substrate 2, and no mounted components have been mounted in the rightmost unit area 25. Also in Fig. 8, an example of the outline position of the irradiation range of the laser light irradiated by the laser device 7 is shown by a dashed dotted line.

[0027] The mounting process is a process of mounting a plurality of components 3 one by one on the assembly board 2. In the mounting process, one component 3 to be mounted is held by the mounting head 6 by suction or the like. The component 3 has a pair of electrodes 31 formed on one side, and is held by the mounting head 6 in a position where the side on which the pair of electrodes 31 are formed faces away from the mounting head 6. The component 3 is then moved using the mounting head 6, and the pair of electrodes 31 of the component 3 is pressed against the pair of joining members 4 to be connected.

[0028] A laser device 7 is disposed on the side of the heat dissipation stage 5 opposite the side on which the assembly substrate 2 is placed. The laser device 7 irradiates laser light onto portions of the assembly substrate 2 that are located within the projection area R for the components 3 to be mounted. This locally heats the base material 21, and the heat is conducted and transferred to the pair of joining members 4 that join the components 3 to be mounted, melting the pair of joining members 4 and achieving soldering. In this embodiment, the laser light is irradiated only onto portions of the assembly substrate 2 that are located within the projection area R for the components 3 to be mounted. However, this is not limited to this, and as long as at least a portion of the laser light is irradiated onto portions of the assembly substrate 2 that are located within the projection area R for the components 3 to be mounted, another portion may be irradiated outside this projection area R. However, the laser light is not irradiated onto the assembly substrate 2 within the projection area R for the components 3 that are not the mounting target.

[0029] In this embodiment, the laser device 7 is disposed on the back side X2 of the through hole 52 located in the projection region R for the component 3 to be mounted. The laser device 7 then irradiates the aggregate substrate 2 with laser light through the through hole 52. In this embodiment, the laser light is irradiated onto the base material 21 through the gap S between the pair of back electrodes 23. In this embodiment, the laser light is irradiated so as not to hit the pair of back electrodes 23, but this is not limiting. For example, part of the pair of back electrodes 23 may be exposed in the through hole 52, and part of the laser light may hit the pair of back electrodes 23.

[0030] The heat dissipation stage 5 prevents the heat generated in the assembly substrate 2 from spreading in the plane direction within the base material 21. This prevents the heat from spreading to the bonding members 4 that bond the already mounted components 3 located next to the target components 3, causing the bonding members 4 to remelt and resulting in poor bonding.

[0031] The pair of bonding members 4 that bond the mounting components 3 to be mounted are brought into a molten state, and then cooled by natural cooling or the like and hardened. As a result, the mounting components 3 to be mounted are flip-chip mounted on the aggregate substrate 2.

[0032] This is performed sequentially for all of the components 3, thereby completing the mounting of the plurality of components 3 on the aggregate substrate 2. Here, the laser device 7 and the heat dissipation stage 5 on which the aggregate substrate 2 is placed are configured to be movable relative to each other. For example, the laser device 7 may be configured to be movable with respect to the heat dissipation stage 5, or the heat dissipation stage 5 may be configured to be movable with respect to the laser device 7. The heat dissipation stage 5 on which the laser device 7 or the aggregate substrate 2 is placed is moved sequentially so that the laser device 7 is positioned on the back side X2 of the through hole 52 located in the projection region R for the components 3 to be mounted. In this way, the mounting substrate 1 shown in FIGS. 1 and 2 is manufactured.

[0033] The heat dissipation stage 5 may be made of a material that is transparent to the laser light used in the mounting process. In this case, even if there are no through holes 52, the laser light can be irradiated onto the aggregate substrate 2 from the opposite side of the heat dissipation stage 5 to the aggregate substrate 2. Furthermore, in this embodiment, an example has been shown in which the bonding members 4 are placed on the mounting electrodes 22 in the pre-processing, but this is not limiting, and the bonding members 4 may also be placed on the electrodes 31 of the mounting components 3.

[0034] 9 is a plan view of a plurality of light emitting devices 10 illustrating the dividing process, and FIG.

[0035] In the dividing step, the assembly substrate 2 of the mounting substrate 1 is cut at the locations indicated by the two-dot chain lines L in Fig. 1, thereby dividing the assembly substrate 2 into a plurality of submounts 20 as shown in Fig. 9. The dividing step is achieved by using, for example, a known dicing method or breaking method. As shown in Figs. 9 and 10, the dividing step produces a plurality of CoS (Chip on Submount) type light emitting devices 10 in which mounting components 3 are mounted on the submounts 20.

[0036] (Actions and Effects of the Embodiments) In the manufacturing method of the mounting substrate 1 of this embodiment, the assembly substrate 2 is placed on a heat dissipation stage 5 that dissipates heat from the assembly substrate 2 from the second main surface 212 side of the base material 21, opposite the first main surface 211. Then, multiple components 3 are sequentially mounted on the assembly substrate 2. When mounting each component 3 on the assembly substrate 2, a laser beam is irradiated from the heat dissipation stage 5 opposite the assembly substrate 2 to a portion of the assembly substrate 2 that is located within the projection area R of the component 3 to be mounted. This melts the pair of bonding members 4 that respectively bond the component 3 to the pair of mounting electrodes 22, and the component 3 to be mounted is mounted to the pair of mounting electrodes 22. Therefore, heat generated in the assembly substrate 2 during mounting is dissipated to the heat dissipation stage 5, preventing it from spreading in the planar direction of the assembly substrate 2. This prevents the heat from spreading to the bonding members 4 that bond the already-mounted component 3 located next to the component 3 to be mounted, preventing the bonding members 4 from remelting and causing a connection failure.

[0037] The heat dissipation stage 5 is opaque to the laser light. The heat dissipation stage 5 has a plurality of through holes 52 formed in portions that are located within the plurality of projection regions R when the heat dissipation stage 5 is placed on the heat dissipation stage 5. The laser light is irradiated onto the assembly substrate 2 through the through holes 52. Therefore, even if the heat dissipation stage 5 is opaque to the laser light, the assembly substrate 2 can be irradiated with the laser light from the side of the heat dissipation stage 5 opposite to the assembly substrate 2.

[0038] The aggregate substrate 2 also includes a plurality of pairs of back electrodes 23 formed on the second main surface 212 of the substrate and electrically connected to the respective pairs of mounting electrodes 22. The aggregate substrate 2 is placed on the heat dissipation stage 5 so that the back electrodes 23 are in contact with the heat dissipation stage 5. This allows efficient heat dissipation from the bonding members 4 in contact with the mounting electrodes 22 via the back electrodes 23, further preventing unintended remelting of the bonding members 4.

[0039] Moreover, the laser light is irradiated onto the base material 21 through the gap between the pair of rear electrodes 23. Therefore, the base material 21 can be efficiently irradiated with the laser light.

[0040] Furthermore, the thermal conductivity of the heat dissipation stage 5 is equal to or greater than the thermal conductivity of the base material 21. Therefore, the heat dissipation performance of the heat dissipation stage 5 can be improved.

[0041] As described above, according to this embodiment, it is possible to provide a method for manufacturing a mounting substrate that can prevent the occurrence of poor bonding.

[0042] (Summary of the embodiment) Next, the technical ideas grasped from the above-described embodiments will be described by using the reference numerals and the like in the embodiments. However, the reference numerals and the like in the following description do not limit the components in the claims to the members and the like specifically shown in the embodiments.

[0043] [1] A first embodiment of the present invention is a manufacturing method of a mounting substrate 1 including an aggregate substrate 2 having a base material 21 and a plurality of pairs of mounting electrodes 22 formed on a first main surface 211 of the base material 21, and a plurality of mounting components 3 mounted on the plurality of pairs of mounting electrodes 22, respectively, the manufacturing method comprising the steps of: mounting the plurality of mounting components 3 on the aggregate substrate 2 in order in a state in which the aggregate substrate 2 is placed on a heat dissipation stage 5 that dissipates heat from the aggregate substrate 2 from a second main surface 212 side of the base material 21 opposite to the first main surface 211; In this manufacturing method for a mounting substrate 1, when regions obtained by projecting planned mounting positions 30 of the plurality of mounting components 3 in the thickness direction X of the aggregate substrate 2 are defined as a plurality of projection regions R, laser light is irradiated from the opposite side of the heat dissipation stage 5 to the aggregate substrate 2 to portions of the aggregate substrate 2 that are arranged within the projection regions R for the mounting components 3 to be mounted, thereby melting a pair of joining members 4 that respectively join the mounting components 3 to the pair of mounting electrodes 22, and mounting the mounting components 3 to the pair of mounting electrodes 22. This prevents poor bonding in the manufactured mounting board 1.

[0044] [2] A second embodiment of the present invention is the first embodiment, in which the heat dissipation stage 5 is opaque to the laser light, and a plurality of through holes 52 are formed in the heat dissipation stage 5 at locations that are arranged within the plurality of projection areas R when the collective substrate 2 is placed on the heat dissipation stage 5, and the laser light is irradiated onto the collective substrate 2 through the through holes 52. This allows the laser light to be irradiated onto the aggregate substrate 2 from the side of the heat dissipation stage 5 opposite to the aggregate substrate 2, even if the heat dissipation stage 5 is opaque to the laser light.

[0045] [3] A third embodiment of the present invention is that, in the first or second embodiment, the aggregate substrate 2 has multiple pairs of back electrodes 23 formed on the second main surface 212 of the base material 21 and electrically connected to the multiple pairs of mounting electrodes 22, respectively, and the aggregate substrate 2 is placed on the heat dissipation stage 5 so that the back electrodes 23 are in contact with the heat dissipation stage 5. This prevents poor bonding in the manufactured mounting board 1.

[0046] [4] A fourth embodiment of the present invention is the third embodiment, in which the laser light is irradiated onto the substrate 21 through a gap between the pair of rear electrodes 23. This allows the base material 21 to be efficiently irradiated with laser light.

[0047] [5] A fifth embodiment of the present invention is any one of the first to fourth embodiments, in which the heat dissipation stage 5 has a thermal conductivity equal to or higher than the thermal conductivity of the base material 21. This makes it possible to improve the heat dissipation performance of the heat dissipation stage 5.

[0048] (Addendum) Although the embodiments of the present invention have been described above, the invention according to the claims is not limited to the above-described embodiments. It should be noted that not all of the combinations of features described in the embodiments are necessarily essential to the means for solving the problems of the invention. Furthermore, the present invention can be appropriately modified and implemented within the scope of its spirit. [Explanation of symbols]

[0049] 1...Mounting board 2...Assembly board 21...Base material 211...First main surface 212...Second main surface 22...Mounting electrode 23...Back electrode 3...Mounted parts 30...Planned installation location 4... Joint material 5...Heat dissipation stage 52...Through hole R…Projection area X: Thickness direction

Claims

1. A method for manufacturing a mounting board including: an aggregate substrate having a base material and a plurality of pairs of mounting electrodes formed on a first main surface of the base material; and a plurality of mounting components mounted on the plurality of pairs of mounting electrodes, respectively; the assembly substrate is placed on a heat dissipation stage that dissipates heat from the assembly substrate from a second main surface side of the base material opposite to the first main surface, and the plurality of mounting components are sequentially mounted on the assembly substrate; When mounting each of the mounting components on the aggregate substrate, when regions obtained by projecting the planned mounting positions of the plurality of mounting components in the thickness direction of the aggregate substrate are defined as a plurality of projection regions, a laser beam is irradiated onto a portion of the aggregate substrate arranged within the projection region for the mounting component to be mounted from the opposite side of the heat dissipation stage to the aggregate substrate, thereby melting a pair of joining members that respectively join the mounting component to the pair of mounting electrodes, and mounting the mounting component to be mounted to the pair of mounting electrodes. Manufacturing method of mounting board.

2. the heat dissipation stage is opaque to the laser light; a plurality of through holes are formed in the heat dissipation stage at locations that are arranged within the plurality of projection areas when the assembly substrate is placed thereon; The laser light is irradiated onto the assembly substrate through the through-holes. The method for manufacturing the mounting substrate according to claim 1 .

3. the aggregate substrate includes a plurality of pairs of back surface electrodes formed on the second main surface of the base material and electrically connected to the plurality of pairs of mounting electrodes, respectively; The assembly substrate is placed on the heat dissipation stage so that the back electrode is in contact with the heat dissipation stage. The method for manufacturing a mounting substrate according to claim 1 or 2.

4. The laser light is irradiated onto the base material through a gap between the pair of rear electrodes. The method for manufacturing a mounting substrate according to claim 3 .

5. The thermal conductivity of the heat dissipation stage is equal to or greater than the thermal conductivity of the base material. The method for manufacturing a mounting substrate according to claim 1 or 2.

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