Substrate treating apparatus and substrate treating method using the same

Abstract

To provide a substrate processing technique in which a process time is shortened.SOLUTION: The substrate processing method includes loading a substrate into a first load lock chamber, loading the substrate and a carrier into a bonding chamber including a first transportation unit, placing the substrate on a first stage connected to the first transportation unit, transporting the carrier in a first direction by the first transportation unit and bonding the carrier to the substrate placed on the first stage, and unloading the substrate and the carrier from the bonding chamber.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly to a substrate processing apparatus used for coupling and separating a substrate and a carrier, and a substrate processing method using the same. [Background technology]

[0002] When multiple processes are performed on multiple substrates in a vacuum, the more complex the position changes and movement paths of the carrier that carries the substrates and moves them through each process chamber, the more chambers there are in the process equipment, and the longer the process time.

[0003] As the manufacturing process becomes more complex, the manufacturing time and manufacturing costs increase, and therefore it is necessary to reduce the residence time of the substrate and the carrier on the moving path. To solve this problem, research is being conducted to reduce the time it takes for the substrate and the carrier to be bonded and separated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Korean Patent Publication No. 10-2017-0064616 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a substrate processing apparatus with a reduced processing time.

[0006] Another object of the present invention is to provide a substrate processing method that utilizes the substrate processing apparatus.

[0007] However, the object of the present invention is not limited to the above-mentioned object, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Means for solving the problem]

[0008] In order to achieve the object of the present invention, a substrate processing method according to the present invention is characterized in that it includes the steps of: loading a substrate into a first load lock chamber; loading the substrate and carrier into a combination chamber including a first transport unit; placing the substrate on a first stage connected to the first transport unit; transporting the carrier in a first direction by the first transport unit and combining the carrier with the substrate placed on the first stage; and removing the substrate and the carrier from the combination chamber.

[0009] The method further includes, after the step of placing the substrate on the first stage, rotating the first stage.

[0010] In the step of rotating the first stage, the first stage is rotated so that the acute angle of the inclination angle between the first base surface of the first base layer of the first stage and the first transport surface of the first transport section is approximately 5 degrees to approximately 10 degrees.

[0011] After the step of rotating the first stage and before the step of coupling the substrate to the carrier, the method further includes the step of transferring the substrate to a clamp portion of the carrier by a first grip portion coupled to the first stage.

[0012] The step of bonding the substrate and the carrier occurs within 2 minutes.

[0013] In the step of carrying the carrier into the bonding chamber, a mounting surface of the carrier on which the substrate is mounted faces a second direction intersecting the first direction.

[0014] After the step of transporting the carrier into the coupling chamber, the method further includes the step of rotating the carrier so that the mounting surface of the carrier faces a third direction that intersects the first direction and the second direction.

[0015] The method further includes, after the step of removing the substrate and the carrier from the bonding chamber, the step of depositing a film on the substrate through a plurality of process chambers.

[0016] After the step of forming a film on the substrate, the method further includes the steps of transporting the substrate and the carrier into a separation chamber including a second transport unit, placing one end of the substrate on a second stage connected to the second transport unit, transporting the carrier in a direction opposite to the first direction by the second transport unit and separating the carrier from the substrate, and transporting the substrate and the carrier out of the separation chamber.

[0017] After the step of placing one end of the substrate on a second stage connected to the second transport unit, the entire surface of the substrate is placed on the second stage by a second grip unit connected to the second stage.

[0018] In the step of separating the substrate and the carrier, the substrate is raised along the second rotating member of the second stage.

[0019] The step of separating the substrate and the carrier occurs within about 2 minutes.

[0020] The method further includes rotating the second stage after the step of separating the substrate and the carrier and before the step of removing the substrate and the carrier from the separation chamber.

[0021] In the step of rotating the second stage, the second base surface of the second base layer of the second stage is rotated so as to be parallel to one surface of the second transfer surface of the second transfer section.

[0022] The method further includes, after the step of separating the substrate and the carrier, rotating the carrier so that a mounting surface of the carrier on which the substrate is mounted faces a second direction.

[0023] In order to achieve another object of the present invention, a substrate processing apparatus according to the present invention includes a first transport unit disposed in a coupling chamber and transporting a carrier in a first direction, a first stage connected to the first transport unit and rotatable about a rotation axis extending in a second direction intersecting the first direction, and a first grip unit connected to the first stage and transporting a substrate in the same direction as the carrier.

[0024] The first stage includes a base layer and a plurality of rotating members disposed on the base layer.

[0025] The acute angle of the inclination angle formed by the base surface of the base layer and the conveying surface of the first conveying part is about 5 degrees to about 10 degrees.

[0026] The wafer transport system further includes a second transport unit disposed in a separation chamber separated from the bonding chamber and configured to transport a carrier, a second stage connected to the second transport unit and having an inclination angle with one surface of the second transport unit, and a second grip unit connected to the second stage and configured to transport the substrate in the same direction as the carrier. [Effects of the Invention]

[0027] A substrate processing technique that shortens the process time can be provided.

[0028] However, the effects of the present invention are not limited to the above effects, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a schematic view showing a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged perspective view of region A of the coupling chamber of FIG. [Figure 3] FIG. 3 is an enlarged perspective view of region B of the separation chamber of FIG. [Figure 4]FIG. 4 is a cross-sectional view showing the rotation of the carrier in the region 1-1 of FIG. [Figure 5] 5 is a cross-sectional view showing the first stage and the first transfer section of FIG. 2. FIG. [Figure 6] 6 is a cross-sectional view showing the first stage and the first transfer section of FIG. 2. FIG. [Figure 7] FIG. 7 is a flowchart showing a substrate processing method using the substrate processing apparatus of FIG. [Figure 8] FIG. 8 is a flow chart illustrating an embodiment of the step in FIG. 7 where the substrate and carrier are bonded. [Figure 9] FIG. 9 is a perspective view showing an embodiment in which a substrate and a carrier are bonded in the bonding chamber of FIG. [Figure 10] FIG. 10 is a perspective view illustrating an embodiment in which a substrate and a carrier are bonded in the bonding chamber of FIG. [Figure 11] FIG. 11 is a perspective view showing an embodiment in which a substrate and a carrier are bonded in the bonding chamber of FIG. [Figure 12] FIG. 12 is a perspective view illustrating an embodiment in which a substrate and a carrier are bonded in the bonding chamber of FIG. [Figure 13] FIG. 13 is a flow chart illustrating an embodiment of the step of separating the carrier and the substrate in FIG. [Figure 14] FIG. 14 is a perspective view showing an embodiment in which the substrate and carrier are separated in the separation chamber of FIG. [Figure 15] FIG. 15 is a perspective view showing an embodiment in which the substrate and carrier are separated in the separation chamber of FIG. [Figure 16] FIG. 16 is a perspective view showing an embodiment in which the substrate and carrier are separated in the separation chamber of FIG. [Figure 17] FIG. 17 is a perspective view showing an embodiment in which the substrate and carrier are separated in the separation chamber of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0030] Specific structural or functional descriptions of the embodiments of the present invention set forth herein are merely exemplary for purposes of describing the embodiments of the present invention, and the example embodiments of the present invention may be embodied in various forms and should not be construed as being limited to the embodiments set forth herein.

[0031] The present invention can be modified in various ways and can have various forms, and specific embodiments are shown by way of example in the drawings and will be described in detail herein, but it should be understood that this is not to limit the invention to the particular forms disclosed, but rather to include all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

[0032] Terms such as "first" and "second" are used to describe various components, but the components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first component can be referred to as a second component, and similarly, a second component can be referred to as a first component, without departing from the scope of the present invention.

[0033] When a component is said to be "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, or that there may be other components in between. Other expressions describing the relationship between components, such as "between" and "immediately between," or "adjacent to" and "directly adjacent to," should be interpreted similarly.

[0034] The terms used in this application are merely used to describe specific embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprise" or "have" and the like are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or possible addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0035] Terms such as "below," "below side," "bottom," "upper," "upper," and the like are used to describe the relative relationships of components shown in the drawings. These terms are relative concepts and are described with reference to the directions shown in the drawings.

[0036] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as having an idealized or overly formal meaning unless expressly defined in this application.

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used to designate the same components in the drawings, and redundant description of the same components will be omitted.

[0038] In this specification, a plane is defined by a first direction (D1) and a second direction (D2) that intersects with the first direction (D1). For example, the second direction (D2) is perpendicular to the first direction (D1). Furthermore, a third direction (D3) is the normal direction of the plane. That is, the third direction (D3) is perpendicular to the plane formed by the first direction (D1) and the second direction (D2).

[0039] FIG. 1 is a schematic view showing a substrate processing apparatus according to one embodiment of the present invention.

[0040] As shown in Figures 1 and 2, the substrate processing apparatus (SPA) includes a first and second load lock chamber (LC1, LC2), a first and second robot chamber (RC1, RC2), a bonding chamber (CC), a separation chamber (SC), a carrier storage chamber (CAC), first to fifth transfer chambers (TC1, TC2, TC3, TC4, TC5), first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, PC10), and a turn-around chamber (BC).

[0041] A substrate (SUB) is loaded into the substrate processing apparatus (SPA) through the first load lock chamber (LC1). After the substrate (SUB) is loaded into the first load lock chamber (LC1), the first load lock chamber (LC1) evacuates the air therein. This minimizes residual air within the first load lock chamber (LC1) and maintains the first load lock chamber (LC1) in a vacuum state. For example, the air pressure within the first load lock chamber (LC1) is approximately 50 mmtorr or less. However, embodiments of the present invention are not limited thereto.

[0042] The first robot chamber (RC1) is connected to the first load lock chamber (LC1). The first robot chamber (RC1) includes a first robot that transfers the substrate (SUB). The first robot disposed in the first robot chamber (RC1) transfers the substrate (SUB) to the bonding chamber (CC). That is, the first robot disposed in the first robot chamber (RC1) transfers the substrate (SUB) that has been loaded via the first load lock chamber (LC1) to the bonding chamber (CC).

[0043] The bonding chamber (CC) is connected to the first robot chamber (RC1). The bonding chamber (CC) is a chamber in which the substrate (SUB) and carrier (CAR) are bonded. That is, the substrate (SUB) carried in via the first load lock chamber (LC1) and the carrier (CAR) carried in from the carrier storage chamber (CAC) are bonded in the bonding chamber (CC). The bonding chamber (CC) will be described in detail later with reference to FIG. 2. The carrier (CAR) is a transport means for supporting and transporting the substrate (SUB), and may be, for example, a transport tray on which the substrate (SUB) can be placed.

[0044] The first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, PC10) are chambers that perform film formation processes on the substrate (SUB). The substrate (SUB) is sequentially passed through the first to fifth process chambers (PC1, PC2, PC3, PC4, PC5) to have films formed thereon, and then rotated by the turning chamber (BC). Thereafter, the substrate (SUB) rotated to the turning chamber (BC) is sequentially passed through the sixth to tenth process chambers (PC6, PC7, PC8, PC9, PC10) to undergo further film formation processes.

[0045] For example, each of the first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, and PC10) may include a deposition chamber, an etching chamber, a developing chamber, an exposure chamber, etc. However, embodiments of the present invention are not limited thereto. Although FIG. 1 shows that the substrate processing apparatus (SPA) includes ten process chambers, the substrate processing apparatus (SPA) may include nine or fewer process chambers or eleven or more process chambers.

[0046] The first to fifth transfer chambers (TC1, TC2, TC3, TC4, TC5) are connected to one another along the first direction (D1). Specifically, the first transfer chamber (TC1) is connected to the connecting chamber (CC) and the second transfer chamber (TC2). The second transfer chamber (TC2) is connected to the first transfer chamber (TC1) and the third transfer chamber (TC3). The third transfer chamber (TC3) is connected to the second transfer chamber (TC2) and the fourth transfer chamber (TC4). The fourth transfer chamber (TC4) is connected to the third transfer chamber (TC3) and the fifth transfer chamber (TC5). The fifth transfer chamber (TC5) is connected to the fourth transfer chamber (TC4) and the turning chamber (BC).

[0047] Also, as shown in FIG. 1, the first transfer chamber (TC1) is connected to the first process chamber (PC1) and the tenth process chamber (PC10). The second transfer chamber (TC2) is connected to the second process chamber (PC2) and the ninth process chamber (PC9). The third transfer chamber (TC3) is connected to the third process chamber (PC3) and the eighth process chamber (PC8). The fourth transfer chamber (TC4) is connected to the fourth process chamber (PC4) and the seventh process chamber (PC7). The fifth transfer chamber (TC5) is connected to the fifth process chamber (PC5) and the sixth process chamber (PC6).

[0048] The first to fifth transfer chambers (TC1, TC2, TC3, TC4, TC5) transfer the substrate (SUB), respectively. The first to fifth transfer chambers (TC1, TC2, TC3, TC4, TC5) transfer the substrate (SUB) carried out from the bonding chamber (CC) to the first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, PC10).

[0049] The separation chamber (SC) is connected to the first transfer chamber (TC1). The separation chamber (SC) is a location where the substrate (SUB) and the carrier (CAR) transferred through the first transfer chamber (TC1) are separated from each other after the film formation process is completed. The substrate (SUB) separated from the carrier in the separation chamber (SC) is transferred into the second load lock chamber (LC2), and the carrier (CAR) is transferred into the carrier storage chamber (CAC).

[0050] The second robot chamber (RC2) is connected to the separation chamber (SC). The second robot chamber (RC2) includes a second robot that transfers the substrate (SUB). The second robot disposed in the second robot chamber (RC2) transfers the substrate (SUB) to the second load lock chamber (LC2). That is, the second robot disposed in the second robot chamber (RC2) transfers the substrate (SUB) that has been loaded via the separation chamber (SC) to the second load lock chamber (LC2).

[0051] The second load lock chamber (LC2) serves as a passageway through which the substrate (SUB) is transferred out of the substrate processing apparatus (SPA). When the substrate (SUB) is transferred into the second load lock chamber (LC2), air at a pressure similar to the pressure outside the substrate processing apparatus (SPA) flows into the second load lock chamber (LC2). This allows the second load lock chamber (LC2) to be maintained at a pressure similar to atmospheric pressure.

[0052] FIG. 2 is an enlarged perspective view of region A of the coupling chamber of FIG.

[0053] As shown in FIGS. 1 and 2, the coupling chamber (CC) includes a first transfer part (MP1) and a first stage (ST1).

[0054] The first transfer unit (MP1) transfers the carrier (CAR). Specifically, the first transfer unit (MP1) transfers the carrier (CAR) in the first direction (D1). That is, the carrier (CAR) loaded into the coupling chamber (CC) is placed on the first transfer unit (MP1) and transferred sequentially through the first-1 region (A1), the first-2 region (A2), and the first-3 region (A3). In the example of FIG. 2, the first transfer unit (MP1) includes a plurality of rotatable rollers extending in the second direction (D2), and the rollers are arranged side by side in the first direction (D1) on a plane including the first direction (D1) and the second direction (D2). While FIG. 2 illustrates an example in which the first transfer unit (MP1) is roller-shaped, the present invention is not limited thereto. The first transfer unit (MP1) may also include a conveyor belt, etc.

[0055] The first stage (ST1) is connected to the first transfer unit (MP1). That is, the first stage (ST1) is connected to a part of the first transfer unit (MP1) and is disposed at a fixed position. In the example of FIG. 2, the first stage (ST1) is connected to the first transfer unit (MP1) in the 1-2 region (A2) of the first transfer unit (MP1). The substrate (SUB) carried into the bonding chamber (CC) is placed on the first stage (ST1). The first stage (ST1) is rotatable about a first rotation axis (e.g., a first rotation axis (RX1) along the second direction (D2) in FIG. 5). The shape and function of the first stage (ST1) will be described later with reference to FIGS. 5 and 6.

[0056] The substrate (SUB) placed on the first stage (ST1) is coupled to the carrier (CAR) which descends along the slope of the first stage (ST1) and passes under the first stage (ST1). The substrate (SUB) is coupled to the clamp part (CP) of the carrier (CAR) by a first grip part (GP1) connected to the first stage (ST1). The method of coupling the substrate (SUB) and the carrier (CAR) will be described later with reference to FIGS. 9 to 12.

[0057] FIG. 3 is an enlarged perspective view of region B of the separation chamber of FIG.

[0058] As shown in Figures 1 to 3, the separation chamber (SC) includes a second transfer unit (MP2) and a second stage (ST2). The second transfer unit (MP2) and the second stage (ST2) in Figure 3 have the same functions and arrangements as the first transfer unit (MP1) and the first stage (ST1) in Figure 2. Therefore, overlapping content will be omitted or simplified.

[0059] The second transfer unit (MP2) transfers the carrier (CAR). Specifically, the second transfer unit (MP2) transfers the carrier (CAR) in the opposite direction to the first direction (D1). That is, the carrier (CAR) loaded into the separation chamber (SC) is placed on the second transfer unit (MP2) and transferred sequentially in the opposite direction to the first direction (D1) along the 2-3 region (B3), the 2-2 region (B2), and the 2-1 region (B1). While FIG. 3 illustrates an example in which the second transfer unit (MP2) is roller-shaped, the present invention is not limited thereto. The second transfer unit (MP2) may also include a conveyor belt, etc.

[0060] The second stage (ST2) is connected to the second transfer unit (MP2). That is, the second stage (ST2) is connected to a part of the second transfer unit (MP2) and arranged at a fixed position. In the example of FIG. 3, the second stage (ST2) is connected to the second transfer unit (MP2) in the 2-2 region (B2) of the second transfer unit (MP2). The substrate (SUB) carried into the separation chamber (SC) is placed on the second stage (ST2). The second stage (ST2) is rotatable about a second rotation axis similar to the first rotation axis (RX1) of FIG. 5.

[0061] The substrate (SUB) placed on the second stage (ST2) rises along the slope of the second stage (ST2) and is separated from the carrier (CAR) passing under the second stage (ST2). The substrate (SUB) is separated from the carrier (CAR) by a second gripper (GP2) connected to the second stage (ST2). A method for separating the substrate (SUB) and the carrier (CAR) will be described later with reference to FIGS. 14 to 17.

[0062] FIG. 4 is a cross-sectional view showing the rotation of the carrier in the region 1-1 of FIG.

[0063] As shown in FIGS. 1 to 4, the carrier (CAR) has a placement surface (SF) and a clamping unit (CP). The placement surface (SF) of the carrier (CAR) has an area larger than that of the substrate (SUB) so that it can be coupled to the substrate (SUB). The substrate (SUB) is coupled to the placement surface (SF) of the carrier (CAR) and transported within the substrate processing apparatus (SPA). The clamping unit (CP) fixes the substrate (SUB) placed on the placement surface (SF) of the carrier (CAR) to the placement surface (SF). The clamping unit (CP) may be, but is not limited to, a member capable of gripping the substrate (SUB). The position of the clamping unit (CP) on the carrier (CAR) is not limited, but may be, for example, provided at a position where it can grip two opposing sides of a rectangular substrate (SUB). 2 etc., a pair of clamping parts (CP) are provided corresponding to two opposing sides of the substrate (SUB), and each of the pair of clamping parts (CP) is arranged along the second direction (D2) while facing the first direction (D1) on the carrier (CAR). However, the clamping parts (CP) may be provided in positions on the carrier (CAR) that allow them to grip, for example, the four opposing sides of the rectangular substrate (SUB), or may be provided on only one of the sides.

[0064] In one embodiment, as shown in FIGS. 2 and 4, in the first-1 region (A1), the carrier (CAR) rotates within the coupling chamber (CC) along an imaginary first axis extending along the first direction (D1). Specifically, the carrier (CAR) is attached to a rotation device (RA) located within the coupling chamber (CC) and rotates along the imaginary first axis extending along the first direction (D1) as the rotation device (RA) rotates. For example, the rotation device (RA) includes an arrangement surface on which the carrier (CAR) is arranged and an imaginary first axis located near the lower end of the rotation device (RA). In the example of FIG. 2, before rotation, the rotation device (RA) stands along the third direction (D3) on the side opposite the second direction (D2) with respect to the first transfer section (MP1), and in the standing state, the arrangement surface is a surface along the third direction (D3). A carrier (CAR) is placed on the placement surface of the rotation device (RA) so that its placement surface (SF) is exposed. The rotation device (RA) on which the carrier (CAR) is placed rotates around an imaginary first axis, causing the rotation device (RA) to change from an upright state to a state along a horizontal plane including a first direction (D1) and a second direction (D2). Accordingly, the carrier (CAR) is rotated and placed on the first transfer section (MP1) so that its placement surface (SF) faces upward in a third direction (D3), as shown in Figures 2 and 4. In the 1-3 region (A3), the carrier (CAR) and the substrate (SUB) placed on the placement surface (SF) of the carrier (CAR) rotate in a direction away from the first transfer unit (MP1) in accordance with the rotation of the rotation device (RA) along the virtual first axis (rotation in the opposite direction to the rotation of the rotation device (RA) in the 1-1 region (A1)). As a result, just as before the rotation, the rotation device (RA) stands up along the third direction (D3) on the side opposite to the second direction (D2) relative to the first transfer unit (MP1).

[0065] In one embodiment, as shown in FIG. 3 and similarly to FIG. 4, the carrier (CAR) rotates along a virtual second axis within the separation chamber (SC) in the second-third region (B3). Specifically, the carrier (CAR) is attached to a rotation device (RA) located within the separation chamber (SC) and rotates along the virtual second axis extending along the first direction (D1) as the rotation device (RA) rotates. For example, the rotation device (RA) includes a placement surface on which the carrier (CAR) is placed and a virtual second axis located near the lower end of the rotation device (RA). In the example of FIG. 3, before rotation, the rotation device (RA) stands along a third direction (D3) on the side of the second direction (D2) relative to the second transfer section (MP2), and in this standing state, the placement surface is a surface along the third direction (D3). The carrier (CAR) and the substrate (SUB) are placed on the placement surface of the rotation device (RA). The rotation device (RA) on which the carrier (CAR) and the substrate (SUB) are placed rotates around the virtual second axis, so that the rotation device (RA) changes from an upright state to a state along a horizontal plane including the first direction (D1) and the second direction (D2). Accordingly, the carrier (CAR) and the substrate (SUB) rotate so that the surface on which the substrate (SUB) is placed faces upward in the third direction (D3), as shown in Figure 3, and are placed on the second transfer part (MP2). In the 2-1 region (B1), the carrier (CAR) from which the substrate (SUB) has been separated rotates in a direction away from the second transfer unit (MP2) in accordance with the rotation of the rotation device (RA) along the virtual second axis (opposite to the rotation of the rotation device (RA) in the 2-3 region (B3)). As a result, the rotation device (RA) stands upright along the third direction (D3) on the side of the second direction (D2) relative to the second transfer unit (MP2), just as it did before the rotation.

[0066] Figures 5 and 6 are cross-sectional views showing the first stage and first transfer unit of Figure 2. Although Figures 5 and 6 have been described with reference to the first stage (ST1), the second stage (ST2) of Figure 3 also has the same shape and function as the first stage (ST1). Therefore, overlapping content will be omitted or simplified.

[0067] As shown in Figures 2, 5 and 6, the first stage (ST1) includes a first base layer (BL1), a first rotating member (RP1), and the first grip portion (GP1).

[0068] The first base layer (BL1) supports the substrate (SUB) carried into the bonding chamber (CC) via a first rotating member (RP1).

[0069] The first rotation axis (RX1) extending in the second direction (D2) is disposed at an end of the first base layer (BL1). The first rotation axis (RX1) is provided on the side of the first stage (ST1) where the carrier (CAR) and the substrate (SUB) are transported (the first direction (D1) side in the example of FIG. 2). For example, the first stage (ST1) is disposed along the first transfer unit (MP1) before rotation (before rotation, the first base layer (BL1) and the first transfer unit (MP1) are disposed along a plane including the first direction (D1) and the second direction (D2)), and rotates around the first rotation axis (RX1) in a direction away from the first transfer unit (MP1). As the first stage (ST1) rotates around the first rotation axis (RX1), a first base surface (BLF1), which is the bottom surface of the first base layer (BL1), and a first transfer surface (MPF1), which is the top surface of the first transfer part (MP1), have an inclination angle (GR) on their end surfaces.

[0070] In one embodiment, the acute angle of the inclination angle (GR) formed by the first base surface (BLF1) of the first base layer (BL1) and the first transfer surface (MPF1) of the first transfer part (MP1) is about 10 degrees or less. Desirably, the acute angle of the inclination angle (GR) formed by the first base surface (BLF1) of the first base layer (BL1) and the first transfer surface (MPF1) of the first transfer part (MP1) is about 5 degrees or more and about 10 degrees or less. If the acute angle of the inclination angle (GR) is less than about 5 degrees, the speed at which the substrate (SUB) placed on the first stage (ST1) descends (e.g., descends due to the substrate's own weight) becomes slow. If the acute angle of the inclination angle (GR) is greater than about 10 degrees, the speed at which the substrate (SUB) descends becomes too fast, resulting in damage to the substrate (SUB).

[0071] A plurality of the first rotating members (RP1) are arranged on the first base layer (BL1). The first rotating members (RP1) are arranged in a matrix along the first direction (D1) and the second direction (D2). By arranging the first rotating members (RP1), the substrate (SUB) placed on the first stage (ST1) descends along the slope of the first base layer (BL1) as the plurality of first rotating members (RP1) rotate. As long as the transport means can transport the substrate (SUB), it is not limited to the plurality of first rotating members (RP1).

[0072] The first grip unit (GP1) is connected to the first base layer (BL1). The first grip unit (GP1) may be connected to the first base layer (BL1) so as to be movable along the plane of the first base layer (BL1) rather than being in a fixed position. The first grip unit (GP1) grips the substrate (SUB) placed on the first base layer (BL1). Specifically, for example, the first grip unit (GP1) has a pressing unit. The pressing unit grips the substrate (SUB) placed on a plurality of first rotating members (RP1) by pressing it toward the plurality of first rotating members (RP1). The first grip unit (GP1) grips the substrate (SUB) and pulls and lowers the substrate (SUB) along the first base layer (BL1) of the first stage (ST1). For example, the first gripping portion (GP1) grips the substrate (SUB) between the plurality of first rotating members (RP1) and the pressing portion, and pulls and sends out the substrate (SUB) so as to descend along the slope of the first base layer (BL1). This allows the substrate (SUB) to descend smoothly in the direction of the slope of the first base layer (BL1). An embodiment in which the first gripping portion (GP1) pulls and descends the substrate (SUB) will be described later with reference to Figures 9 and 12. The position of the first gripping portion (GP1) on the first base layer (BL1) is not limited as long as it allows the substrate (SUB) to descend smoothly along the slope.

[0073] As described in FIGS. 5 and 6, the second stage (ST2) in FIG. 3 includes a second base layer, a second rotating member, and the second grip unit (GP2). The second stage (ST2) also includes a second rotation axis extending in the second direction (D2) and rotates around the second rotation axis. The second rotation axis is provided on the side of the second stage (ST2) opposite to the side on which the carrier (CAR) and the substrate (SUB) are transported (the first direction (D1) side in the example of FIG. 3). For example, the second stage (ST2) is disposed along the second transport unit (MP2) before rotation (before rotation, the second base layer and the second transport unit are disposed along a plane including the first direction (D1) and the second direction (D2)), and rotates around the second rotation axis in a direction away from the second transport unit. The inclination angle between the second base surface, which is the bottom surface of the second base layer, and the second transfer surface, which is the top surface of the second transfer part (MP2), is the same as the inclination angle (GR) shown in Fig. 6. The second grip part (GP2) grips the substrate (SUB) and pulls and lifts the substrate (SUB) along the inclination of the second base layer of the second stage (ST2).

[0074] FIG. 7 is a flowchart showing a substrate processing method using the substrate processing apparatus of FIG.

[0075] 1 and 7, the substrate (SUB) and the carrier (CAR) are bonded in the bonding chamber (CC) (S100). After the substrate (SUB) is bonded to the carrier (CAR), the substrate (SUB) is passed through the first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, and PC10) to undergo the film formation process (S200). After the film formation process on the substrate (SUB) is completed, the substrate (SUB) and the carrier (CAR) are separated in the separation chamber (SC) (S300).

[0076] Figure 8 is a flow chart illustrating an embodiment of the step of bonding the substrate and carrier in Figure 7. Figures 9 to 12 are perspective views illustrating an embodiment of bonding the substrate and carrier in the bonding chamber of Figure 2.

[0077] 1, 7, and 8, the substrate (SUB) is loaded into the substrate processing apparatus (SPA) via the first load lock chamber (LC1) (S110). The substrate (SUB) loaded into the first load lock chamber (LC1) is then loaded into the coupling chamber (CC) including the first transfer part (MP1) via the first robot chamber (RC1). In addition, the carrier (CAR) stored in the carrier storage chamber (CAC) is also loaded into the coupling chamber (CC) (S120).

[0078] The carrier (CAR) carried into the bonding chamber (CC) moves toward the side opposite the second direction (D2) relative to the first transfer unit (MP1) and is positioned in the 1-1 region (A1) as shown in Fig. 2. Thereafter, the carrier (CAR) is rotated about the virtual first axis by the rotation device (e.g., the rotation device (RA) in Fig. 4) for bonding with the substrate (SUB) (S130).

[0079] In one embodiment, the placement surface (SF) of the carrier (CAR) in FIG. 4 faces the opposite direction to the second direction (D2) before rotation. That is, the carrier (CAR) stands upright along the third direction (D3), and is transported into the coupling chamber (CC) with the placement surface (SF) of the carrier (CAR) facing the opposite direction to the second direction (D2) in the first-1 region (A1). Thereafter, the carrier (CAR) rotates around the virtual first axis, so that the placement surface (SF) faces the third direction (D3), i.e., faces upward. By moving from the carrier storage chamber (CAC) with the placement surface (SF) of the carrier (CAR) facing the opposite direction to the second direction (D2), the planar area of ​​the substrate processing apparatus (SPA) is reduced. However, the carrier (CAR) may not rotate. The placement surface (SF) of the carrier (CAR) can also be moved in a state facing the third direction (D3) when being moved within the carrier storage room (CAC).

[0080] 9 and 10, the substrate (SUB) loaded into the bonding chamber (CC) and placed in the 1-2 region (A2) is first positioned on the side of the first transfer part (MP1) in the second direction (D2). At this time, the carrier (CAR) is transported by the first transfer part (MP1) and positioned below the first stage (ST1), i.e., between the first stage (ST1) and the first transfer part (MP1). The substrate (SUB) is then transported in the opposite direction to the second direction (D2) and placed on the first stage (ST1) (S140).

[0081] 6 and 11, the first stage (ST1) rotates after the substrate (SUB) is placed thereon (S150). Specifically, the first stage (ST1) rotates around the first rotation axis (RX1) of the first base layer (BL1). As a result, the first base surface (BLF1) of the first base layer (BL1) has the inclination angle (GR) with the first transfer surface (MPF1) of the first transfer unit (MP1). Then, the first grip unit (GP1) connected to the first stage (ST1) grips the substrate (SUB) and transfers it to the clamp unit (CP) of the carrier (CAR) (S160). For example, the first grip unit (GP1) grips the substrate (SUB) and moves downward along the inclined plane of the first base layer (BL1) to transfer the substrate (SUB) to the clamp unit (CP). Then, the clamping portion (CP) fixes the substrate (SUB), and the substrate (SUB) is fixed to the carrier (CAR). Furthermore, for example, when a pair of clamping parts (CP) facing each other in the first direction (D1) and arranged along the second direction (D2) are provided on the carrier (CAR), the first gripping part (GP1) transfers the substrate (SUB) in the first direction (D1) so that a first end of the substrate (SUB) is positioned in the clamping part (CP) positioned in the first direction (D1) of the pair of clamping parts (CP), thereby fixing the first end of the substrate (SUB) to the clamping part (CP) positioned in the first direction (D1).

[0082] 6 and 12, the substrate (SUB) fixed to the clamp portion (CP) of the carrier (CAR) descends along the first rotating member (RP1) of the first stage (ST1). As the substrate (SUB) descends along the first stage (ST1), the carrier (CAR) moves in the first direction (D1). As a result, the substrate (SUB) is coupled to the carrier (CAR) while descending along the first stage (ST1) (S170). With the entire surface of the substrate (SUB) coupled to the carrier (CAR), the substrate (SUB) and carrier (CAR) proceed to the first-third region (A3). Furthermore, for example, when the pair of clamp parts (CP) described above is provided on the carrier (CAR), the substrate (SUB) that is lowered along the first stage (ST1) and placed on the carrier (CAR) has one second end (an end opposite the first end in the first direction (D1)) fixed to the remaining clamp part (CP) located on the opposite side of the first direction (D1). As a result, the first end and second end of the substrate (SUB) are fixed by the pair of clamp parts (CP), and the substrate (SUB) is fixed to the carrier (CAR). Furthermore, the substrate (SUB) and carrier (CAR) coupled to each other rotate around an imaginary first axis, so that the substrate (SUB) and carrier (CAR) stand upright along a third direction (D3) opposite to the second direction (D2) relative to the first transfer part (MP1).

[0083] After the substrate (SUB) and the carrier (CAR) are bonded, the substrate (SUB) and the carrier (CAR) are carried out from the bonding chamber (for example, the bonding chamber (CC) in FIG. 1) (S180). Thereafter, the substrate (SUB) is passed through the first to tenth process chambers (PC1, PC2, PC3, PC4, PC5, PC6, PC7, PC8, PC9, and PC10) to undergo the film formation process (S200).

[0084] In one embodiment, the step of bonding the substrate (SUB) and the carrier (CAR) is performed within about 2 minutes. Preferably, the step of bonding the substrate (SUB) and the carrier (CAR) is performed within about 1 minute. When the time required for the step of bonding the substrate (SUB) and the carrier (CAR) satisfies the above range, the process efficiency of the substrate processing apparatus (SPA) is improved.

[0085] Figure 13 is a flow chart illustrating an embodiment of the step of separating the carrier and substrate in Figure 7. Figures 14 to 17 are perspective views illustrating an embodiment of how the substrate and carrier are separated in the separation chamber of Figure 3.

[0086] As shown in FIGS. 1, 3, 13, and 14, the substrate (SUB) and the carrier (CAR) that have completed the film formation process step are loaded into the separation chamber (SC) (S310). The substrate (SUB) and the carrier (CAR) loaded into the separation chamber (SC) proceed in the second direction (D2) relative to the second transfer part (MP2) as shown in FIG. 3 and are placed in the 2-3 region (B3). Thereafter, the carrier (CAR) and the substrate (SUB) are rotated around the virtual second axis by the rotation device (e.g., the rotation device (RA) in FIG. 4) so ​​that the plane of the substrate (SUB) faces in the third direction (D3), i.e., upward. The carrier (CAR) and the substrate (SUB) are then placed on the second transfer part (MP2). Furthermore, the substrate (SUB) and the carrier (CAR) are transported by the second transport part (MP2) in the separation chamber (SC) in the opposite direction to the first direction (D1) to the second stage (ST2) arranged to have a slope in the 2-2 region (B2).

[0087] 15, the second transfer unit (MP2) places one end (either the first end or the second end) of the substrate (SUB) transferred to the second stage (ST2) on the second stage (ST2) (S320). Thereafter, the second grip unit (GP2) of the second stage (ST2) grips one end of the substrate (SUB) and places one end of the substrate (SUB) on the second stage (ST2). For example, the second grip unit (GP2) grips and pulls one end of the substrate (SUB), thereby placing the substrate (SUB) on the second stage (ST2). For example, if one end of the substrate (SUB) is fixed to the carrier (CAR) by a clamp unit (CP), the second grip unit (GP2) grips and pulls one end of the substrate (SUB), thereby releasing the clamp unit (CP) and placing the substrate (SUB) on the second stage (ST2). The substrate (SUB) is placed on the second stage (ST2), and the carrier (CAR) is moved in the opposite direction to the first direction (D1), thereby separating the substrate (SUB) and the carrier (CAR) (S330). The substrate (SUB) rises along the slope of the second base layer of the second stage (ST2). At this time, the substrate (SUB) is placed on the second stage (ST2), while the carrier (CAR) is transported by the second transfer part (MP2) and is positioned below the second stage (ST2), i.e., between the second stage (ST2) and the second transfer part (MP2).

[0088] In one embodiment, the step of separating the substrate (SUB) and the carrier (CAR) is performed within about 2 minutes. Preferably, the step of separating the substrate (SUB) and the carrier (CAR) is performed within about 1 minute. When the time required for the step of separating the substrate (SUB) and the carrier (CAR) satisfies the above range, the process efficiency of the substrate processing apparatus (SPA) is improved.

[0089] 6 and 16, after the substrate (SUB) and the carrier (CAR) are separated in the 2-2 region (B2), the second stage (ST2) rotates (S340). That is, the second stage (ST2) rotates around the second rotation axis. As a result, the second base surface of the second base layer of the second stage (ST2) becomes parallel to the second transfer surface of the second transfer part (MP2).

[0090] Thereafter, as shown in Figures 3 and 4, the carrier (CAR) is transported to the 2-1 region (B1) by the second transfer unit (MP2) and rotates around the virtual second axis. Specifically, the carrier (CAR) rotates around the virtual second axis so that the placement surface (SF) of the carrier (CAR) changes from a state facing the third direction (D3) to a state facing the second direction (D2) (S350). As a result, the carrier (CAR) is positioned in the second direction (D2) relative to the second transfer unit (MP2) and stands upright along the third direction (D3).

[0091] 1 and 17, the substrate (SUB) and the carrier (CAR) that have been separated from each other are transferred to the second load lock chamber (LC2) and the carrier storage chamber (CAC), respectively. The substrate (SUB) that has been separated from the carrier (CAR) may be removed in the opposite direction to the second direction (D2) relative to the second transfer part (MP2) and transferred to the second load lock chamber (LC2). Finally, the substrate (SUB) that has completed the film formation process is unloaded from the substrate processing apparatus (SPA) via the second load lock chamber (LC2) (S360).

[0092] As a result, the carrier (CAR) moves and couples with the substrate (SUB), thereby reducing the residence time of the substrate (SUB) and the carrier (CAR) in the coupling chamber (CC).Furthermore, the carrier (CAR) moves and separates from the substrate (SUB), thereby reducing the separation time of the substrate (SUB) and the carrier (CAR) in the separation chamber (SC), thereby improving the overall process efficiency of the substrate processing apparatus (SPA). 1, the combining chamber (CC) and the separation chamber (SC) are positioned adjacent to each other in the second direction (D2), and the paths along which the carriers (CAR) are transported and placed in the first-first region (A1) and the first-third region (A3) of the combining chamber (CC) are adjacent to the paths along which the carriers (CAR) are transported and placed in the second-third region (B3) and the second-first region (B1) of the separation chamber (SC) are adjacent to each other in the second direction (D2). Therefore, the paths along which the combining chamber (CC), the separation chamber (SC), and the carriers (CAR) are transported and placed can be integrated, minimizing their layout area. The paths along which the carriers (CAR) are transported and placed can also be shared between the combining chamber (CC) and the separation chamber (SC).

[0093] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will recognize that various modifications and variations can be made thereto without departing from the spirit and scope of the invention as set forth in the following claims. [Industrial Applicability]

[0094] The present invention is applicable to display devices and electronic devices including the same, such as high-resolution smartphones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, and notebook computers.

[0095] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will recognize that various modifications and variations can be made thereto without departing from the spirit and scope of the invention as set forth in the following claims. [Explanation of symbols]

[0096] LC1, LC2: First and second load lock chambers RC1, RC2: First and second robot rooms CC: Combined chamber SC: Separation room CAC: Carrier Storage Room BC: Return room PC1~PC10: Process rooms 1~10 TC1~TC5: Transfer chambers 1~5 MP1, MP2: First and second transfer sections GP1, GP2: First and second grip sections ST1, ST2: First and second stages RP1, RP2: first and second rotating members BL1: First base layer CP: Clamp section SUB: Substrate CAR: Carrier GR: Inclination angle RX: Rotation axis SF: Placement surface RA: Rotating device

Claims

1. loading a substrate into a first load lock chamber; loading the substrate and carrier into a bonding chamber including a first transport; placing the substrate on a first stage coupled to the first transport; a step of transferring the carrier in a first direction by the first transfer unit and coupling the substrate placed on the first stage with the carrier; and removing the substrate and the carrier from the bonding chamber.

2. After the step of placing the substrate on the first stage, 2. The substrate processing method of claim 1, further comprising a step of rotating the first stage so that the acute angle of the inclination angle between the first base surface of the first base layer of the first stage and the first transfer surface of the first transfer part is 5 degrees to 10 degrees.

3. After the step of rotating the first stage and before the step of coupling the substrate with the carrier, 3. The substrate processing method of claim 2, further comprising the step of transferring the substrate to a clamping portion of the carrier by a first gripping portion coupled to the first stage.

4. 2. The substrate processing method of claim 1, wherein the step of coupling the substrate and the carrier is performed within two minutes.

5. 2. The substrate processing method according to claim 1, wherein in the step of transporting the carrier into the coupling chamber, a mounting surface of the carrier on which the substrate is mounted faces a second direction intersecting the first direction.

6. After the step of removing the substrate and the carrier from the bonding chamber, forming a film on the substrate through a plurality of process chambers; loading the substrate and the carrier into a separation chamber including a second transport unit; placing one end of the substrate on a second stage coupled to the second transporter; The carrier is transported by the second transport unit in a direction opposite to the first direction, and the carrier and the substrate are separated; 2. The substrate processing method according to claim 1, further comprising the step of: unloading the substrate and the carrier from the separation chamber.

7. After the step of placing one end of the substrate on a second stage coupled to the second transport part, 7. The substrate processing method according to claim 6, wherein the entire surface of the substrate is placed on the second stage by a second gripping portion connected to the second stage.

8. 7. The method of claim 6, wherein the step of separating the substrate and the carrier is performed within two minutes.

9. After the step of separating the substrate and the carrier and before the step of removing the substrate and the carrier from the separation chamber, 7. The substrate processing method of claim 6, further comprising: rotating the second stage so that a second base surface of the second base layer of the second stage is parallel to one surface of the second transfer surface of the second transfer part.

10. a first transfer unit disposed in the coupling chamber and configured to transfer the carrier in a first direction; a first stage coupled to the first transport unit and rotatable about a rotation axis extending in a second direction intersecting the first direction; a first gripping unit connected to the first stage and configured to transport the substrate in the same direction as the carrier.

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