Substrate transfer robot system, semiconductor transfer apparatus, semiconductor manufacturing apparatus, and control method

Abstract

To provide a substrate transfer device which is effective for achieving both substrate transfer over a wide range and substrate transfer accuracy.SOLUTION: The substrate transfer robot system includes a first arm unit having a first set of arms connected to each other so as to rotate around a horizontal axis and changing a position of an end portion with respect to a base portion in a first plane, a second arm unit having a second set of arms connected in order from the end portion so as to rotate around an axis perpendicular to the horizontal axis and a hand supporting a substrate on an arm farthest from the end portion of the second set of arms and changing a position of the hand with respect to the end portion in a second plane perpendicular to the first plane, and a controller controlling the first arm unit and the second arm unit so as to move the hand while compensating for a displacement of the hand due to a change in a bending amount of the first arm unit and the second arm unit by the first arm unit.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transfer robot system, a semiconductor transfer device, a semiconductor manufacturing device, and a control method. [Background technology]

[0002] Patent Document 1 discloses a transport robot including a base, an arm, and a hand connected to the arm. The arm includes a vertical arm that operates vertically and a horizontal arm that operates horizontally. The vertical arm is connected to the base, the horizontal arm is connected to the vertical arm, and the hand is connected to the horizontal arm. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-167380 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate transport device that is effective in achieving both wide-range substrate transport and substrate transport accuracy. [Means for solving the problem]

[0005] A substrate transport robot system according to one aspect of the present disclosure comprises a first arm unit having a first set of arms connected to each other so that each arm rotates about a horizontal axis, and changing the position of the end relative to a base within a first plane; a second set of arms connected in order from the end so that each arm rotates about an axis perpendicular to the horizontal axis; a hand that supports a substrate on the arm of the second set farthest from the end, and a second arm unit that changes the position of the hand relative to the end within a second plane perpendicular to the first plane; and a control unit that controls the first arm unit and the second arm unit to move the hand while the first arm unit compensates for displacement of the hand due to changes in the amount of deflection of the first arm unit and the second arm unit.

[0006] A semiconductor transport device according to another aspect of the present disclosure includes a housing that houses the substrate transport robot system, a cassette support table provided in the housing that supports cassettes that store substrates, and a pre-aligner provided within the housing that rotates the substrates, and a control unit controls the first arm unit and the second arm to move substrates in and out to each of a plurality of transport destinations including the pre-aligner and the cassette, while the first arm unit compensates for displacement of the hand due to changes in the amount of deflection.

[0007] A semiconductor manufacturing apparatus according to yet another aspect of the present disclosure includes the semiconductor transport apparatus described above, and a processing apparatus connected to the semiconductor transport apparatus and configured to perform processing to form a semiconductor on a substrate.

[0008] A control method according to yet another aspect of the present disclosure includes controlling a first arm unit having a first set of arms connected to each other so that each arm rotates about a horizontal axis to transport a substrate to a destination, the first arm unit changing the position of the end relative to a base within a first plane, a second set of arms connected in order from the end so that each arm rotates about an axis perpendicular to the horizontal axis, and a hand that supports the substrate on the arm of the second set farthest from the end, the second arm unit changing the position of the hand relative to the end within a second plane perpendicular to the first plane, and controlling the first arm unit and the second arm unit so that, during transport of the substrate, the first arm unit compensates for displacement of the substrate due to changes in the amount of deflection of the first arm and the second arm, while moving the hand. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to provide a substrate transport device that is effective in achieving both wide-range substrate transport and substrate transport accuracy. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram illustrating a semiconductor manufacturing apparatus. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] 10A and 10B are diagrams illustrating an example of a displacement of a hand due to a change in the amount of deflection; [Figure 4] FIG. 1 is a schematic diagram illustrating an example of an operation path. [Figure 5] FIG. 10 is a schematic diagram illustrating the correction of a motion path. [Figure 6] FIG. 10 is a schematic diagram illustrating correction of input / output paths and relay paths. [Figure 7] FIG. 1 illustrates an example of an object sensor. [Figure 8] 10A and 10B are schematic diagrams illustrating an example of the relationship between the tilt angle of the hand and the detection result of the thickness of the substrate. [Figure 9] FIG. 10 is a schematic diagram illustrating the generation of an action path. [Figure 10]FIG. 10 is a schematic diagram illustrating the generation of input / output paths and relay paths. [Figure 11] FIG. 2 is a diagram illustrating an example of a hardware configuration of a controller. [Figure 12] 10 is a flowchart illustrating a path generation procedure. [Figure 13] 10 is a flowchart illustrating a path correction procedure. [Figure 14] 10 is a flowchart illustrating a control procedure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same functions are denoted by the same reference numerals, and redundant description will be omitted.

[0012] [Semiconductor manufacturing equipment] 1 and 2 is an apparatus that performs at least a part of a semiconductor manufacturing process. For example, the semiconductor manufacturing apparatus 1 includes a semiconductor transport apparatus 2 and a processing apparatus 7. The processing apparatus 7 performs processing such as film formation and etching on substrates W (e.g., semiconductor substrates). The semiconductor transport apparatus 2 removes substrates W from a cassette that stores multiple substrates W, transports them to the processing apparatus 7, and returns the processed substrates W from the processing apparatus 7 to the cassette.

[0013] The semiconductor transfer device 2 includes a cassette support table 3, a housing 4, a pre-aligner 5, and a substrate transfer robot system 6. The cassette support table 3 supports multiple cassettes 9 arranged in a horizontal arrangement direction D1. Each of the multiple cassettes 9 accommodates multiple substrates W. The housing 4 is interposed between the multiple cassettes 9 supported by the cassette support table 3 and the processing device 7, and accommodates the substrates W transferred between the multiple cassettes 9 and the processing device 7. The pre-aligner 5 is a device that rotates the substrate W to align the orientation of the substrate W (e.g., the orientation of the crystal orientation) with a predetermined orientation. For example, the pre-aligner 5 is housed within the housing 4. The substrate transfer robot system 6 transfers the substrate W within the housing 4 to a destination TD (e.g., multiple cassettes 9, the pre-aligner 5, and multiple chambers of the processing device 7). An example of the configuration of the substrate transfer robot system 6 is described below.

[0014] [Robot System] The substrate transfer robot system 6 includes a robot 10 and a controller 100. The housing 4 accommodates at least the robot 10. The robot 10 has a first arm unit 20 and a second arm unit 30. The first arm unit 20 has a base 21, arms 22 and 23, an end 24, and motors M1, M2, and M3, and the arms 22 and 23 change the position of the end 24 relative to the base 21 within a first plane PL1. For example, the first plane PL1 is aligned with the vertical direction D2 (up-down direction) and the arrangement direction D1.

[0015] The arms 22 and 23 of the first set are connected to each other so that they can rotate about a horizontal axis. Here, a "horizontal axis" is an axis along a horizontal plane. For example, arm 22 is connected to base 21 so that it can rotate about horizontal axis Ax1 and extends away from horizontal axis Ax1. Arm 23 is connected to base 21 so that it can rotate about horizontal axis Ax2 and extends away from horizontal axis Ax2. An end portion 24 is connected to arm 23 so that it can rotate about horizontal axis Ax3. As an example, horizontal axes Ax1, Ax2, and Ax3 are parallel to each other and perpendicular to first plane PL1.

[0016] With the above configuration, the first arm unit 20 has an end joint J3 that rotates the end 24 around the horizontal axis Ax3, and one or more (e.g., two) arm joints J1, J2 that change the position of the end joint J3 relative to the base 21 within the first plane PL1. Motors M1, M2, and M3 drive the arm joints J1, J2 and the end joint J3, respectively. For example, the motor M1 rotates the arm 22 around the horizontal axis Ax1 at the arm joint J1. The motor M2 rotates the arm 23 around the horizontal axis Ax2 at the arm joint J2. The motor M3 rotates the end 24 around the horizontal axis Ax3 at the end joint J3.

[0017] The second arm unit 30 has a second set of arms 31 and 32, a hand 33, and motors M11 and M12. The second set of arms 31 and 32 changes the position of the hand 33 relative to the end portion 24 within a second plane PL2. The second plane PL2 is a plane perpendicular to the first plane PL1. The second set of arms 31 and 32 are connected in order from the end portion 24 so that they rotate around axes perpendicular to the horizontal axis. For example, arm 31 is connected to the end portion 24 so that it rotates around axis Ax11 and extends away from axis Ax11. Arm 32 is connected to arm 31 so that it rotates around axis Ax12 and extends away from axis Ax12. The axes Ax11 and Ax12 are parallel to each other.

[0018] The hand 33 supports the substrate W on the arm 32. For example, the hand 33 is fixed to the arm 32 and extends along a plane perpendicular to the horizontal axis Ax3. The hand 33 supports the substrate W from below, perpendicular to the horizontal axis Ax3.

[0019] With the above configuration, the second arm unit 30 has joints J11 and J12 that change the position of the hand 33 relative to the end portion 24 within the second plane PL2. Motors M11 and M12 drive the joints J11 and J12, respectively. For example, the motor M11 rotates the arm 31 around the axis Ax11 at the joint J11. The motor M12 rotates the arm 32 around the axis Ax12 at the joint J12.

[0020] The configuration described above is an example and can be modified. For example, each of the first arm unit 20 and the second arm unit 30 may have at least one arm, and may have three or more arms. Furthermore, although the example in which the second arm unit 30 has one set of arm 32, hand 33, and motor M12 has been described, the second arm unit 30 may have two or more sets of arm 32, hand 33, and motor M12. In this case, in each of the two or more sets, the motor M12 rotates the arm 32 around the axis Ax12.

[0021] The controller 100 controls the robot 10 to move the hand 33 vertically and horizontally while maintaining the hand 33 substantially horizontal. By operating the first arm unit 20 and the second arm unit 30 in combination, the substrate W can be transported over a wide area. On the other hand, by combining the first arm unit 20 and the second arm unit 30, the displacement of the hand 33 due to changes in the amount of bending of the first arm unit 20 and the second arm unit 30 increases. The bending of the first arm unit 20 and the second arm unit 30 occurs in each of the arm joints J1 and J2, the end joint J3, the joints J11 and J12, the first set of arms 22 and 23, and the second set of arms 31 and 32. The amount of bending at each part changes depending on changes in the bending moment.

[0022] For example, when the hand 33 is displaced along the horizontal plane away from the base 21, the bending moment acting on each part increases. Therefore, as shown in Figure 3, the amount of deflection increases as the hand 33 moves away from the base 21, and the hand 33 tilts forward while slightly descending. On the other hand, when the hand 33 is displaced along the horizontal plane toward the base 21, the bending moment acting on each part decreases.

[0023] Therefore, the controller 100 controls the first arm unit 20 and the second arm unit 30 to move the hand 33 while compensating, by the first arm unit 20, for the displacement of the hand 33 caused by changes in the amount of bending of the first arm unit 20 and the second arm unit 30. Compensating for the displacement means reducing (e.g., substantially canceling) the displacement. By compensating for the displacement of the hand 33 caused by changes in the amount of bending, it is possible to achieve both transportation of the substrate W over a wide range and transportation accuracy of the substrate W.

[0024] For example, the controller 100 has a control unit 111 as a functional component (hereinafter referred to as a "functional block"). The control unit 111 drives the motors M1, M2, M3 and M11, M12 to move the hand 33 vertically and horizontally while maintaining the hand 33 substantially horizontal, thereby transporting the substrate W to the destination TD. As described above, the displacement of the hand 33 due to a change in the amount of deflection includes a tilt of the hand 33 and a change in the height of the hand 33. The control unit 111 may drive the motor M3 (by controlling the end joint J3) to compensate for the tilt of the hand 33 due to a change in the amount of deflection, and may drive the motors M1, M2 (by controlling the arm joints J1, J2) to compensate for a change in the height of the hand 33 due to a change in the amount of deflection. Both the tilt of the hand 33 due to a change in the amount of deflection and the height of the hand 33 can be easily compensated for by the first arm unit 20.

[0025] For example, the control unit 111 controls the first arm unit 20 to compensate for changes in the tilt and height of the hand 33 due to changes in the amount of bending while moving the hand 33 in the horizontal direction, thereby further improving the transport accuracy of the substrate W.

[0026] The control unit 111 may control the first arm unit 20 to compensate for the displacement of the hand 33 due to changes in the amount of deflection with a compensation amount specific to each of the transfer destinations TD. The compensation amount here is a compensation amount that substantially eliminates the displacement of the hand 33 due to the deflection of the first arm unit 20 and the second arm unit 30 at each position during movement. The "specific compensation amount" for each of the transfer destinations TD is not a value of 1, but a series of compensation amounts that change according to the displacement of the hand 33 along the horizontal direction.

[0027] The distance from the base 21 to the hand 33 in the horizontal direction differs depending on the destination TD. Therefore, the amount of deflection of the first arm unit 20 and the second arm unit 30 differs depending on the destination TD. Furthermore, the amount of displacement of the hand 33 due to the change in the amount of deflection also differs depending on the destination TD. Therefore, by compensating for the displacement of the hand 33 due to the change in the amount of deflection with a compensation amount specific to each destination TD, it is possible to further improve the transport accuracy of the substrate W.

[0028] 1 and 2, the destination TD that is the farthest from the base 21 is PA. In this example, the control unit 111 compensates for the displacement of the hand 33 due to the change in the amount of deflection with the maximum compensation amount for PA.

[0029] The control unit 111 may control the first arm unit 20 and the second arm unit 30 based on a motion path generated in advance so that the first arm unit 20 compensates for the displacement of the hand 33 due to changes in the amount of deflection. The amount of deflection is reproducible. Therefore, it is possible to incorporate a compensation amount for compensating for the displacement of the hand 33 due to changes in the amount of deflection into a motion pattern. By using a motion pattern incorporating a compensation amount, it is possible to easily compensate for the displacement of the hand 33 due to changes in the amount of deflection with high reproducibility.

[0030] For example, the controller 100 further includes a path storage unit 112. The path storage unit 112 stores a motion path that is generated in advance to compensate for the displacement of the hand 33 due to changes in the amount of flexure. The motion path includes a plurality of motion commands in a time series. Each of the plurality of motion commands includes a target position that uniquely determines the posture of the robot 10. The target position may include a target position and a target posture of the hand 33, and may also include target angles of the arm joints J1 and J2, the end joint J3, and the joints J11 and J12.

[0031] For example, as shown in FIG. 4 , the operation path includes a path MP1 that changes the tilt and height of the hand 33 in a direction opposite to the change in tilt and height of the hand 33 due to a change in the amount of deflection while the hand 33 moves horizontally. The control unit 111 controls the first arm unit 20 and the second arm unit 30 so that the tilt and height of the hand 33 are within a certain range relative to a horizontal line by combining the change in tilt and height of the hand 33 due to a change in the amount of deflection (DP) and the change in tilt and height of the hand 33 due to the above path (CDP) while the hand 33 moves horizontally. For example, the above path MP1 is a path that lowers the hand 33 while the hand 33 moves along the horizontal line toward the base 21 to prevent the hand 33 from rising due to a change in the amount of deflection. For example, the target position of the hand 33 included in each of the multiple operation commands of the path MP1 gradually descends as the hand 33 moves toward the base 21. Furthermore, the target posture of the hand 33 included in each of the multiple operation commands of the path MP1 gradually tilts forward as the hand 33 moves closer to the base 21.

[0032] The path MP1 may be a path for moving the hand 33 along a horizontal line between the destination TD of the substrate W and a predetermined position STD away from the destination TD. Along a horizontal line means that the inclination and height of the hand 33 are kept within a certain range with respect to the horizontal line.

[0033] 5, the controller 100 may further include a detection unit 113 and a path correction unit 114. The detection unit 113 detects the position and inclination of the destination TD of the substrate W in the actual environment. The path correction unit 114 corrects the operation path based on the detection results of the position and inclination of the destination TD. For example, the path correction unit 114 calculates the difference between the position and inclination of the destination TD and the design values, and shifts the path MP1 by the calculated difference. The position and inclination of the destination TD are the position and inclination relative to the base 21.

[0034] The position and inclination of the destination TD in the real environment may differ slightly from the design values. Hereinafter, the difference between the position and inclination of the destination TD in the real environment and the design values ​​will be referred to as the "positional deviation of the destination TD." Because the positional deviation of the destination TD is slight, if the generated motion path is shifted to match the positional deviation of the destination TD, it can be used as a motion path that compensates for the displacement of the hand 33 due to changes in the amount of deflection in the real environment. Because there is no need to regenerate a motion path that compensates for the displacement of the hand 33 due to changes in the amount of deflection from scratch in the real environment, motion paths for each real environment can be easily generated.

[0035] As shown in Figure 6(a), the operation path MP may include multiple input / output paths MP2 and one or more relay paths MP3. The multiple input / output paths MP2 are defined so that the hand 33 moves in and out horizontally relative to the destination TD while compensating for changes in the tilt and height of the hand 33 due to changes in the amount of deflection. The relay path MP3 is defined so as to connect the multiple input / output paths MP2 together.

[0036] The detection unit 113 may detect the position and tilt of each of the destinations TD. As shown in (b) of Figure 6, the path correction unit 114 may correct the corresponding input / output path MP2 based on the detection results of the position and tilt of each of the destinations TD. As shown in (c) of Figure 6, the path correction unit 114 may correct the relay path MP3 based on the corrected input / output paths MP2 so as to connect the corrected input / output paths MP2 together. Compensation for displacement of the substrate W due to changes in the amount of deflection can be easily adapted to the actual environment for each destination TD.

[0037] The detector 113 may detect the height and thickness of the substrate W placed at the destination TD, and detect the position and inclination of the destination TD based on the detection results of the height and thickness of the substrate W.

[0038] 7, the substrate transfer robot system 6 may further include an object sensor 40 provided on the hand 33. The object sensor 40 detects whether or not an object is present at the processing position. Examples of the object sensor 40 include a laser type, a capacitance type, and an ultrasonic type sensor.

[0039] For example, the object sensor 40 has a light-emitting device 41 and a light-receiving device 42. The light-emitting device 41 emits laser light toward the light-receiving device 42. The object sensor 40 detects whether an object is present between the light-emitting device 41 and the light-receiving device 42 based on whether the light-receiving device 42 receives the laser light emitted from the light-emitting device 41. For example, the hand 33 includes a pair of fork tips 35, 36 that support the substrate W, the light-emitting device 41 is provided at the fork tip 35, and the light-receiving device 42 is provided at the fork tip 36.

[0040] In order for the detection unit 113 to detect the substrate W, the control unit 111 controls the robot 10 to move the hand 33 to a position where a portion of the substrate W is between the light-emitting device 41 and the light-receiving device 42 when viewed from above. Thereafter, the control unit 111 controls the robot 10 to raise or lower the hand 33. The detection unit 113 detects the height and thickness of the substrate W based on the position of the hand 33 when the object sensor 40 detects the substrate W. For example, the detection unit 113 detects the height and thickness of the substrate W based on the height of the hand 33 while the object sensor 40 is detecting the substrate W.

[0041] The detection unit 113 may repeatedly detect the height and thickness of the substrate W while changing the inclination of the hand 33, and detect the inclination of the destination TD based on the inclination of the hand 33 when the thickness of the substrate W is minimum. Even when the thickness of the substrate W is unknown, the object sensor 40 provided on the hand 33 can be used to detect the inclination of the destination TD.

[0042] 8 is a schematic diagram illustrating the relationship between the tilt angle of the hand 33 and the detected thickness of the substrate W. At tilt angle θ1, thickness T1 is detected, at tilt angle θ2, thickness T2 is detected, and at tilt angle θ3, thickness T3 is detected. At tilt angle θ2, the tilt of the hand 33 matches the tilt of the substrate W, so thickness T2 is at its minimum. The detector 113 detects the tilt angle θ2 at which thickness T2 is at its minimum as the tilt of the substrate W.

[0043] The detection unit 113 may calculate the position of the hand 33 when the object sensor 40 detected the substrate W based on the respective rotation angles and deflection amounts of the arms 22, 23 and end 24 of the first set and the arms 31, 32 of the second set when the object sensor 40 detected the substrate W placed at the destination TD, and detect the height and thickness of the substrate W based on the calculated position of the hand 33. For example, the detection unit 113 calculates the position of the hand 33 by forward kinematics calculation using the rotation angles of the arm joints J1, J2, the end joint J3, and the joints J11, J12, and adds the deflection amount to the calculated position to detect the height and thickness of the substrate W. This can improve the detection accuracy of the position and tilt of the destination TD by the object sensor 40 provided on the hand 33.

[0044] For example, the detection unit 113 may detect the relative position and inclination of the substrate W with respect to the design position based on the rotation angles of the arm joints J1, J2, end joint J3, and joints J11, J12 when the object sensor 40 detects the substrate W placed at the design position, and the relative rotation angles of the arm joints J1, J2, end joint J3, and joints J11, J12 when the object sensor 40 actually detects the substrate W. The design position corresponds to the position of the hand 33 calculated by the above-mentioned forward kinematics calculation plus the amount of deflection.

[0045] 9, the controller 100 may further include an acquisition unit 115 and a path generation unit 116. The acquisition unit 115 acquires actual measurement results of the displacement of the hand 33 due to changes in the amount of deflection. The path generation unit 116 generates a motion path based on the actual measurement results so as to compensate for the displacement of the hand 33 due to changes in the amount of deflection.

[0046] The acquisition unit 115 detects the displacement of the hand 33 due to changes in the amount of deflection based on the position of the hand 33 detected by the laser tracker 50 or the like. For example, the laser tracker 50 is installed in a factory that manufactures the substrate transfer robot system 6 and detects the position of an object in three-dimensional space using a laser beam. For example, the acquisition unit 115 acquires actual measurement results of the height and tilt of the hand 33 and the angles of the arm joints J1 and J2, the end joint J3, and the joints J11 and J12 at a position corresponding to the transfer destination TD and a position corresponding to the predetermined position STD described above, and detects the displacement of the hand 33 due to changes in the amount of deflection based on the acquired information. The path generation unit 116 corrects the angles of the arm joints J1 and J2, the end joint J3, and the joints J11 and J12 so that the position and posture of the hand 33 approach the target position and posture at a position corresponding to the transfer destination TD and a position corresponding to the predetermined position STD described above. Then, the path generation unit 116 linearly interpolates between the corrected position and posture of the hand 33 at the position corresponding to the destination TD and the corrected position and posture of the hand 33 at the position corresponding to the specified position STD to generate the input / output path MP2.

[0047] The acquisition unit 115 may acquire actual measurement results of the displacement of the hand 33 due to changes in the amount of deflection at each of the destinations TD. The path generation unit 116 may generate, based on the actual measurement results, an input / output path MP2 for moving the hand 33 in and out along a horizontal line while compensating for the displacement of the substrate W due to changes in the amount of deflection for each of the destinations TD, as shown in (a) and (b) of FIG. 10. Thereafter, the path generation unit 116 may generate one or more relay paths MP3 connecting the multiple input / output paths MP2 together, as shown in (c) of FIG. 10. This generates a motion path MP including the multiple input / output paths MP2 and one or more relay paths MP3. It is possible to easily generate a motion path for each of the destinations TD that compensates for the displacement of the hand 33 due to changes in the amount of deflection with a specific compensation amount.

[0048] FIG. 11 is a block diagram illustrating a hardware configuration of the controller 100. As shown in FIG. 11, the controller 100 includes a circuit 190. The circuit 190 includes a processor 191, a memory 192, a storage 193, an input / output port 194, and a driver circuit 195. The storage 193 includes, for example, one or more nonvolatile storage media. The nonvolatile storage medium includes one or more storage devices. Examples of the one or more storage devices include a hard disk drive, a solid-state drive, and a flash memory. The nonvolatile storage medium may also include a portable storage medium such as an optical disk. The storage 193 stores a program for causing the controller 100 to control the robot 10. The program causes the controller 100 to control the first arm unit 20 and the second arm unit 30 to move the hand 33 while compensating for displacement of the hand 33 due to changes in the amount of bending of the first arm unit 20 and the second arm unit 30. For example, the program causes the controller 100 to configure the above-described functional blocks.

[0049] The memory 192 includes one or more volatile storage media. The volatile storage media includes one or more memory devices. An example of the one or more memory devices is a random access memory. The memory 192 temporarily stores a program loaded from the storage 193. The processor 191 includes one or more arithmetic devices. Examples of the arithmetic device include a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 191 executes the program loaded in the memory 192, causing the controller 100 to configure the above-mentioned functional blocks. The processor 191 may temporarily store the calculation results in the memory 192.

[0050] The input / output port 194 inputs and outputs electrical signals between the object sensor 40 and the laser tracker 50 in response to a request from the processor 191. The driver circuit 195 supplies drive power to the motors M1, M2, M3, M11, and M12 in response to a request from the processor 191.

[0051] [Control procedure] As an example of the control method, a control procedure executed by the controller 100 is illustrated. This control procedure includes controlling the first arm unit 20 and the second arm unit 30 so as to transport the substrate W to the destination TD, and controlling the first arm unit 20 and the second arm unit 30 so as to move the hand 33 while the first arm unit 20 compensates for displacement of the hand 33 due to changes in the amount of bending of the first arm unit 20 and the second arm unit 30 during transport of the substrate W.

[0052] This control procedure may include a path generation procedure for generating the above-mentioned motion path, a path correction procedure for correcting the above-mentioned motion path, and a control procedure using the corrected motion path. The path generation procedure is executed in a manufacturing factory for the substrate transport robot system 6. The path correction procedure is executed in the actual environment of the shipping destination of the substrate transport robot system 6 before starting operation of the substrate transport robot system 6. The control procedure is executed when the substrate transport robot system 6 is in operation. Examples of each procedure are provided below.

[0053] (Path generation procedure) This procedure is executed after multiple input / output paths MP2 have been provisionally generated by offline teaching or the like. Hereinafter, the provisionally generated input / output path MP2 will be referred to as the "provisional input / output path MP2." As shown in FIG. 12, the controller 100 first executes steps S01, S02, and S03. In step S01, the control unit 111 selects one of the transfer destinations TD. In step S02, the control unit 111 controls the robot 10 to move the hand 33 along the input / output path MP2 corresponding to the selected transfer destination TD. In addition, the acquisition unit 115 acquires actual measurement results of the height and tilt of the hand 33 and the angles of the arm joints J1 and J2, the end joint J3, and the joints J11 and J12 at a position corresponding to the transfer destination TD and a position corresponding to the predetermined position STD. In step S03, the path generation unit 116 corrects the provisional input / output path MP2 based on the actual measurement results to compensate for the displacement of the hand 33 due to changes in the amount of deflection, thereby generating the input / output path MP2.

[0054] Next, the controller 100 executes steps S04 and S05. In step S04, the path storage unit 112 checks whether the generation of input / output paths MP2 has been completed for all of the destinations TD. If it is determined in step S04 that there are any destinations TD for which input / output paths MP2 have not been generated, the controller 100 returns the process to step S01. If it is determined in step S04 that the generation of input / output paths MP2 has been completed for all of the destinations TD, the controller 100 executes step S05. In step S05, the path generation unit 116 generates one or more relay paths MP3 that connect multiple input / output paths MP2 together. This completes the path generation procedure.

[0055] (Path correction procedure) 13, the controller 100 first executes steps S11, S12, and S13. In step S11, the control unit 111 selects one of the destinations TD. In step S12, the detection unit 113 detects the position and tilt of the selected destination TD using the object sensor 40 or the like. In step S13, the path correction unit 114 corrects the input / output path MP2 based on the detection results of the position and tilt of the destination TD.

[0056] Next, the controller 100 executes steps S14 and S15. In step S14, the path correction unit 114 checks whether correction of the input / output paths MP2 has been completed for all of the destinations TD. If it is determined in step S14 that there are any destinations TD whose input / output paths MP2 have not been corrected, the controller 100 returns the process to step S11. If it is determined in step S14 that correction of the input / output paths MP2 has been completed for all of the destinations TD, the controller 100 executes step S15. In step S15, the path generation unit 116 generates one or more relay paths MP3 that connect multiple input / output paths MP2 together. This completes the path generation procedure.

[0057] (Control Procedure) 14, the controller 100 first executes steps S21 and S22. In step S21, the control unit 111 reads out the first operation command from among the above-mentioned plurality of operation commands. In step S22, the control unit 111 generates a target position and a target posture of the hand 33 in (one control cycle) (hereinafter referred to as "cycle target values").

[0058] Next, the controller 100 executes steps S23 and S24. In step S23, the control unit 111 generates current commands for the motors M1, M2, M3 and M11, M12 based on the cycle target value. In step S24, the control unit 111 outputs currents corresponding to the current commands to the motors M1, M2, M3 and M11, M12.

[0059] Next, the controller 100 executes steps S25 and S26. In step S25, the controller 100 waits for the control cycle to elapse. In step S26, the control unit 111 checks whether the execution of the operation command has been completed (whether the hand 33 has reached the target position and target posture of the operation command). If it is determined in step S26 that the execution of the operation command has not been completed, the controller 100 executes step S27. In step S27, the control unit 111 calculates the target value for the next cycle. Thereafter, the controller 100 returns the process to step S23.

[0060] If it is determined in step S26 that the execution of the operation commands has been completed, the controller 100 executes step S28. In step S28, the control unit 111 checks whether or not the execution of all operation commands has been completed. If it is determined in step S28 that an unexecuted operation command remains, the controller 100 executes step S29. In step S29, the control unit 111 reads out the next operation command. Thereafter, the controller 100 returns the process to step S22. If it is determined in step S28 that the execution of all operation commands has been completed, the controller 100 completes the control procedure.

[0061] 〔summary〕 The above-described exemplary embodiment includes the following configurations.

[0062] (1) A substrate transport robot system 6 comprising: a first arm unit 20 having a first set of arms 22, 23 connected to each other so as to rotate about horizontal axes Ax1, Ax2, Ax3, and changing the position of an end 24 relative to a base within a first plane PL1; a second set of arms 31, 32 connected in sequence from the end 24 so as to rotate about axes Ax11, Ax12 perpendicular to the horizontal axes Ax1, Ax2, Ax3; a second arm unit 30 having a hand 33 that supports a substrate W on the arm of the second set of arms 31, 32 that is farthest from the end 24, and changing the position of the hand 33 relative to the end 24 within a second plane PL2 perpendicular to the first plane PL1; and a control unit 111 that controls the first arm unit 20 and the second arm unit 30 to move the hand 33 while the first arm unit 20 compensates for displacement of the hand 33 due to changes in the amount of bending of the first arm unit 20 and the second arm unit 30. The combination of the first arm unit 20 and the second arm unit 30 allows the substrate W to be transported over a wide range. On the other hand, the combination of the first arm and the second arm increases the displacement of the substrate W due to changes in the amount of bending of the first arm and the second arm. In response to this, the control unit 111 controls the first arm so as to compensate for the displacement of the hand 33 due to changes in the amount of bending. Therefore, it is possible to achieve both the transportation of the substrate W over a wide range and the transportation accuracy of the substrate W.

[0063] (2) The first arm unit 20 has an end joint J3 that rotates the end 24 around horizontal axes Ax1, Ax2, Ax3, and one or more arm joints J1, J2 that change the position of the end joint J3 relative to the base within a first plane PL1, and the displacement of the hand 33 due to changes in the amount of deflection includes a tilt of the hand 33 and a change in height of the hand 33, and the control unit 111 controls the end joint J3 to compensate for the tilt of the hand 33 due to changes in the amount of deflection, and controls one or more arm joints J1, J2 to compensate for a change in height of the hand 33 due to changes in the amount of deflection, in the substrate transport robot system 6 described in (1). Both the tilt of 33 due to a change in the amount of bending and the change in height of 33 can be easily compensated for by the first arm.

[0064] (3) The substrate transport robot system 6 described in (1) or (2) in which the control unit 111 controls the first arm unit 20 to compensate for changes in the tilt and height of the hand 33 due to changes in the amount of deflection while moving the hand 33 horizontally. The transport accuracy of the substrate W can be further improved.

[0065] (4) The control unit 111 controls the first arm unit 20 and the second arm unit 30 to transport the substrate W to multiple destinations TD, and controls the first arm unit 20 to compensate for the displacement of the hand 33 due to changes in the amount of deflection with a compensation amount specific to each of the multiple destinations TD, in the substrate transport robot system 6 described in (3). The transport accuracy of the substrate W can be improved at each of the multiple transport destinations TD.

[0066] (5) The substrate transport robot system 6 described in (3) above, wherein the control unit 111 controls the first arm unit 20 and the second arm unit 30 based on a pre-generated motion path so that the first arm unit 20 compensates for the displacement of the hand 33 due to changes in the amount of deflection. The displacement of the hand 33 due to the change in the amount of flexure can be easily compensated for with high reproducibility.

[0067] (6) The substrate transport robot system 6 described in (5) includes an operating path that changes the inclination and height of the hand 33 in the opposite direction to the change in the inclination and height of the hand 33 due to the change in the amount of deflection while the hand 33 moves horizontally. The transport accuracy of the substrate W can be further improved.

[0068] (7) The control unit 111 controls the first arm unit 20 and the second arm unit 30 so that the inclination and height of the hand 33 are within a certain range relative to a horizontal line by combining the changes in the inclination and height of the hand 33 due to changes in the amount of deflection and the changes in the inclination and height of the hand 33 due to the path while the hand 33 moves horizontally. This is a substrate transport robot system 6 described in (6). The transport accuracy of the substrate W can be further improved.

[0069] (8) The substrate transport robot system 6 according to (7), wherein the path is a path for moving the hand 33 along a horizontal line between the destination TD of the substrate W and a predetermined position away from the destination TD. The transport accuracy of the substrate W can be further improved.

[0070] (9) The substrate transport robot system 6 described in (7), wherein the path is a path that lowers the hand 33 while the hand 33 moves along a horizontal line toward the base, so as to prevent the hand 33 from rising due to a change in the amount of deflection. The transport accuracy of the substrate W can be further improved.

[0071] (10) The substrate transport robot system 6 described in (5) further comprises a detection unit 113 that detects the position and inclination of the destination TD of the substrate W in the actual environment, and a path correction unit 114 that corrects the operation path based on the detection results of the position and inclination of the destination TD. Compensation for displacement of the substrate W due to changes in the amount of bending can be easily adapted to the actual environment.

[0072] (11) The operating path includes a plurality of input / output paths for inputting and outputting the hand 33 along the horizontal direction while compensating for changes in the tilt and height of the hand 33 due to changes in the amount of deflection for a plurality of transport destinations TD, and relay paths connecting the plurality of input / output paths, and the detection unit 113 detects the position and tilt of each of the plurality of transport destinations TD, and the path correction unit 114 corrects the corresponding input / output path based on the detection results of the position and tilt of each of the plurality of transport destinations TD, and corrects the relay path based on the corrected plurality of input / output paths. Compensation for displacement of the substrate W due to changes in the amount of bending can be easily adapted to the actual environment for each transfer destination TD.

[0073] (12) A substrate transport robot system 6 described in (10), wherein the detection unit 113 detects the height and thickness of the substrate W placed at the destination TD, and detects the position and inclination of the destination TD based on the detection results of the height and thickness of the substrate W. Information on the height and thickness of the substrate W can be used to detect the position and inclination of the destination TD.

[0074] (13) The substrate transport robot system 6 described in (12) further includes an object sensor provided on the hand 33, and the detection unit 113 detects the height and thickness of the substrate W based on the position of the hand 33 when the object sensor detects the substrate W placed at the transport destination TD. An object sensor provided on the hand 33 can be used to detect the position and inclination of the transport destination TD.

[0075] (14) The substrate transport robot system 6 described in (13) above, wherein the detection unit 113 repeatedly detects the height and thickness of the substrate W while changing the inclination of the hand 33, and detects the inclination of the transport destination TD based on the inclination of the hand 33 when the thickness of the substrate W is at its minimum. Even when the thickness of the substrate W is unknown, the object sensor provided on the hand 33 can be used to detect the inclination of the transfer destination TD.

[0076] (15) The substrate transport robot system 6 described in (13) above, wherein the detection unit 113 calculates the position of the hand 33 when the object sensor detects the substrate W based on the rotation angles and deflection amounts of the first set of arms 22, 23 and the second set of arms 31, 32 when the object sensor detects the substrate W placed at the transport destination TD, and detects the height and thickness of the substrate W based on the calculated position of the hand 33. The accuracy of detecting the position and inclination of the transport destination TD by the object sensor provided on the hand 33 can be improved.

[0077] (16) The substrate transport robot system 6 described in (5) further comprises an acquisition unit 115 that acquires actual measurement results of the displacement of the hand 33 due to changes in the amount of deflection, and a path generation unit 116 that generates an operating path based on the actual measurement results to compensate for the displacement of the substrate W due to changes in the amount of deflection. The efficiency of generating a motion path for compensating for the displacement of the substrate W can be improved.

[0078] (17) The substrate transport robot system 6 described in (16) in which the acquisition unit 115 acquires actual measurement results of the displacement of the hand 33 due to changes in the amount of deflection at each of the multiple transport destinations TD, and the path generation unit 116 generates, based on the actual measurement results, input / output paths for moving the hand 33 in and out along a horizontal line while compensating for the displacement of the substrate W due to changes in the amount of deflection for each of the multiple transport destinations TD, generates relay paths connecting the multiple input / output paths generated for each of the multiple transport destinations TD, and generates an operation path including the multiple input / output paths and the relay path. It is possible to easily generate an operation path that compensates for the displacement of the substrate W due to the change in the amount of bending with a specific compensation amount for each of the plurality of transfer destinations TD.

[0079] (18) A semiconductor transport device 2 comprising a housing 4 that houses the substrate transport robot system 6 described in (1), a cassette support table 3 provided in the housing 4 and supporting a cassette 9 that contains a substrate W, and a pre-aligner 5 provided within the housing 4 and rotating the substrate W, wherein a control unit 111 controls the first arm unit 20 and the second arm to move the substrate W in and out of each of a plurality of transport destinations TD including the pre-aligner 5 and the cassette 9, while compensating for displacement of the hand 33 due to changes in the amount of deflection using the first arm unit 20.

[0080] (19) A semiconductor manufacturing apparatus (1) comprising: a semiconductor transporting device (2) according to claim (15); and a processing device (7) connected to the semiconductor transporting device (2) and performing processing to form a semiconductor on a substrate (W).

[0081] (20) A control method including controlling a first arm unit 20 having a first set of arms 22, 23 connected to each other so as to rotate about horizontal axes Ax1, Ax2, Ax3, and changing the position of the end 24 relative to the base within a first plane PL1 so as to transport a substrate W to a destination TD; a second set of arms 31, 32 connected in sequence from the end 24 so as to rotate about axes Ax11, Ax12 perpendicular to the horizontal axes Ax1, Ax2, Ax3; and a second arm unit 30 having a hand 33 that supports the substrate W on the arm of the second set of arms 31, 32 that is farthest from the end 24, and changing the position of the hand 33 relative to the end 24 within a second plane PL2 perpendicular to the first plane PL1; and controlling the first arm unit 20 and the second arm unit 30 so as to move the hand 33 while the first arm unit 20 compensates for displacement of the substrate W due to changes in the amount of deflection of the first arm and the second arm during transport of the substrate W. Although the embodiments have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0082] 1...semiconductor manufacturing equipment, 2...semiconductor conveying device, 3...cassette support stand, 5...pre-aligner, 9...cassette, 4...housing, 6...substrate conveying robot system, 7...processing device, W...substrate, conveyance destination TD...conveyance destination, 111...control unit, 20...first arm unit, 22, 23...first set of arms, 24...end, PL1...first plane, Ax1, Ax2, Ax3...horizontal axis, J3...end joint, J1, J2...arm joint, 30...second arm unit, 31, 32...second set of arms, 33...hand, PL2...second plane, Ax11, Ax12...axis, 113...detection unit, 114...path correction unit, 115...acquisition unit, 116...path generation unit.

Claims

1. a first arm unit having a first set of arms connected to each other so as to rotate about a horizontal axis, the first arm unit varying the position of the end portion relative to the base portion in a first plane; a second arm unit including a second set of arms connected in order from the end so as to rotate about an axis perpendicular to the horizontal axis, and a hand for supporting a substrate on the arm of the second set of arms that is farthest from the end, and which changes the position of the hand relative to the end within a second plane perpendicular to the first plane; a control unit that controls the first arm unit and the second arm unit so as to move the hand while compensating for displacement of the hand due to changes in the amount of bending of the first arm unit and the second arm unit using the first arm unit; A substrate transfer robot system comprising:

2. The first arm unit an end joint that rotates the end about the horizontal axis; one or more arm joints that change the position of the end joints relative to the base in the first plane; and the displacement of the hand due to the change in the amount of deflection includes a change in the inclination of the hand and a change in the height of the hand, The control unit controlling the end joint so as to compensate for the tilt of the hand due to the change in the amount of deflection; controlling the one or more arm joints to compensate for a change in height of the hand due to a change in the amount of deflection; The substrate transport robot system according to claim 1 .

3. the control unit controls the first arm unit to compensate for changes in tilt and height of the hand caused by changes in the amount of deflection while moving the hand in the horizontal direction.

3. The substrate transport robot system according to claim 1.

4. the control unit controls the first arm unit and the second arm unit to transport the substrate to a plurality of transport destinations, and controls the first arm unit to compensate for displacement of the hand due to changes in the amount of deflection with a compensation amount specific to each of the plurality of transport destinations.

4. The substrate transport robot system according to claim 3.

5. the control unit controls the first arm unit and the second arm unit based on a motion path generated in advance so that the first arm unit compensates for the displacement of the hand due to the change in the amount of deflection.

4. The substrate transport robot system according to claim 3.

6. the motion path includes a path that changes the inclination and height of the hand in a direction opposite to the change in the inclination and height of the hand caused by the change in the amount of deflection while the hand moves in the horizontal direction.

6. The substrate transport robot system according to claim 5.

7. the control unit controls the first arm unit and the second arm unit so that the inclination and height of the hand are within a certain range with respect to a horizontal line by combining changes in the inclination and height of the hand due to changes in the amount of deflection and changes in the inclination and height of the hand due to the path while the hand moves in the horizontal direction.

7. The substrate transport robot system according to claim 6.

8. the path is a path along which the hand moves along the horizontal line between a destination of the substrate and a predetermined position away from the destination.

8. The substrate transport robot system according to claim 7.

9. the path is a path for lowering the hand so as to prevent the hand from rising due to a change in the amount of deflection while the hand moves toward the base along the horizontal line.

8. The substrate transport robot system according to claim 7.

10. a detection unit that detects the position and inclination of the substrate in a real environment of a destination; a path correction unit that corrects the operation path based on the detection results of the position and inclination of the transport destination; Further comprising:

6. The substrate transport robot system according to claim 5.

11. The motion path is: a plurality of input / output paths for inputting and outputting the hand along a horizontal direction to a plurality of transfer destinations while compensating for changes in the tilt and height of the hand due to changes in the amount of deflection; a relay path connecting the plurality of input / output paths; Including, the detection unit detects the position and inclination of each of the plurality of transport destinations; The path correction unit correcting the corresponding input / output paths based on the detection results of the positions and inclinations of the plurality of transfer destinations; correcting the relay path based on the corrected plurality of input / output paths; The substrate transport robot system according to claim 10.

12. The detection unit Detecting the height and thickness of the substrate placed at the destination; detecting the position and inclination of the destination based on the detection results of the height and thickness of the substrate; The substrate transport robot system according to claim 10.

13. The robot further includes an object sensor provided on the hand, the detection unit detects the height and thickness of the substrate based on the position of the hand when the object sensor detects the substrate placed at the destination. The substrate transport robot system according to claim 12.

14. the detection unit repeatedly detects the height and thickness of the substrate while changing the inclination of the hand, detecting an inclination of the destination based on an inclination of the hand when the thickness of the substrate becomes minimum; The substrate transport robot system according to claim 13.

15. the detection unit calculates the position of the hand when the object sensor detects the substrate based on the respective rotation angles of the arms of the first set and the arms of the second set and the amount of deflection when the object sensor detects the substrate placed at the destination, and detects the height and thickness of the substrate based on the calculated position of the hand. The substrate transport robot system according to claim 13.

16. an acquisition unit that acquires an actual measurement result of the displacement of the hand due to a change in the amount of deflection; a path generating unit that generates the motion path based on the actual measurement result so as to compensate for displacement of the substrate due to a change in the amount of bending; Further comprising:

6. The substrate transport robot system according to claim 5.

17. the acquisition unit acquires the actual measurement result of the displacement of the hand due to the change in the amount of deflection at each of a plurality of transport destinations, The path generation unit generating, for each of the plurality of transfer destinations, an entry / exit path for moving the hand in and out along a horizontal line while compensating for displacement of the substrate due to changes in the amount of bending, based on the actual measurement results; generating relay paths connecting the plurality of input / output paths generated for each of the plurality of destinations; generating the operational path including the plurality of input / output paths and the relay path; 17. The substrate transfer robot system according to claim 16.

18. a housing that houses the substrate transfer robot system according to claim 1; a cassette support provided in the housing and supporting a cassette that accommodates the substrate; a pre-aligner provided in the housing and configured to rotate the substrate; Equipped with The control unit controls the first arm unit and the second arm to move the substrate in and out to each of a plurality of transport destinations including the pre-aligner and the cassette, while compensating for displacement of the hand due to changes in the amount of deflection using the first arm unit.

19. a semiconductor transport device according to claim 15; a processing device connected to the semiconductor transport device, the processing device performing processing to form a semiconductor on the substrate.

20. To transport the substrate to the destination, a first arm unit having a first set of arms connected to each other so as to rotate about a horizontal axis, the first arm unit varying the position of the end portion relative to the base portion in a first plane; a second arm unit including a second set of arms connected in order from the end so as to rotate about an axis perpendicular to the horizontal axis, and a hand for supporting the substrate on the arm of the second set of arms that is farthest from the end, and which changes the position of the hand relative to the end within a second plane perpendicular to the first plane; and controlling the first arm unit and the second arm unit so as to move the hand while compensating for displacement of the substrate due to changes in the amount of bending of the first arm and the second arm by the first arm unit during transport of the substrate; A control method comprising:

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