Heat dissipation member and cooling structure

Abstract

To achieve both reduction in reaction force of a heat radiation member and improvement in heat radiation performance.SOLUTION: A heat dissipation member 1 includes a plate-like heat conduction substrate 10 including a first surface 11 and a second surface 15 opposite to each other, and one or more first heat conduction bodies 40 softer than the heat conduction substrate 10, and the one or more first heat conduction bodies 40 are provided in a partial region of the first surface 11.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a heat dissipation member and a cooling structure. [Background technology]

[0002] Batteries and other devices installed in electric vehicles and plug-in hybrid vehicles are heat-generating bodies that generate heat when they are generating high power. Heat dissipators such as heat sinks are used to dissipate the heat generated by the heat-generating body. A heat dissipation member is placed between the heat-generating body and the heat dissipation member to improve the efficiency of heat conduction to the heat dissipation member. For example, Patent Document 1 discloses a battery unit that includes a battery cell, a heat dissipation sheet, a curable heat dissipation member, and a cooler, in this order, so that they are in contact with each other. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2024-64633 Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology of Patent Document 1, an elastically deformable plate-shaped heat dissipation sheet contacts the battery cell, and heat is transferred to the cooler through the heat dissipation sheet and the hardening heat dissipation material. The above configuration has the problem that the reaction force of the heat dissipation sheet increases due to vibration of the battery during driving and compression caused by swelling due to battery deterioration. Taking the above into consideration, one aspect of the present disclosure aims to achieve both low reaction force of the heat dissipation material and improved heat dissipation. [Means for solving the problem]

[0005] In order to solve the above problems, a heat dissipation member according to one embodiment of the present disclosure comprises a plate-shaped thermally conductive substrate having a first surface and a second surface opposite each other, and one or more first thermal conductors that are softer than the thermally conductive substrate, and the one or more first thermal conductors are provided in a partial region of the first surface.

[0006] A cooling structure according to one embodiment of the present disclosure comprises a heat generating body, a heat sink, and a heat dissipation member, the heat dissipation member comprising a plate-shaped heat conductive substrate having a first surface and a second surface opposite each other, and one or more first heat conductors softer than the heat conductive substrate, and the one or more first heat conductors are provided in a partial region of the first surface. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view of a cooling structure according to a first embodiment. [Figure 2] 3 is a cross-sectional view of a heat dissipation member before being sandwiched between a heat generating body and a heat dissipation body. FIG. [Figure 3] FIG. 2 is a plan view of a first surface according to the first embodiment. [Figure 4] FIG. 2 is a plan view of a second surface according to the first embodiment. [Figure 5] 10A and 10B are schematic diagrams showing changes that occur when the heat dissipation member is sandwiched between a heat generating body and a heat dissipation body. [Figure 6] FIG. 10 is a plan view of a heat dissipation member according to a second embodiment. [Figure 7] FIG. 10 is a cross-sectional view of a heat dissipation member according to a second embodiment. [Figure 8] FIG. 10 is a cross-sectional view of a heat dissipation member according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0008] The embodiments for carrying out the present disclosure will be described with reference to the drawings. Note that the dimensions and scale of each element in each drawing may differ from those of the actual product. Furthermore, the embodiment described below is an exemplary embodiment that may be envisioned when carrying out the present disclosure. Therefore, the scope of the present disclosure is not limited to the embodiment exemplified below.

[0009] A: First embodiment 1 is a cross-sectional view of a cooling structure 100 according to a first embodiment of the present disclosure. The cooling structure 100 of this embodiment includes a heat generating element 2, a heat dissipating element 3, a fixing bolt 4, and a heat dissipating member 1. The heat dissipating member 1 is sandwiched between the heat generating element 2 and the heat dissipating element 3.

[0010] 1 is referred to as the Z axis. One direction of the Z axis is referred to as the Z1 direction, and the other direction is referred to as the Z2 direction. The Z1 direction is the direction from the heat generating element 2 to the heat dissipating element 3.

[0011] The heating element 2 is a device that generates heat. Specifically, the heating element 2 can be a battery, electronic device, lighting device, display device, semiconductor element, heater, etc. A support portion 60 protrudes from the side of the heating element 2. A mounting hole 61 is formed in the support portion 60. The mounting hole 61 is a through hole into which the fixing bolt 4 is inserted.

[0012] The heat dissipator 3 is a device for dissipating heat generated from the heat generating element 2. Specifically, a heat sink, an air-cooled cooling device, a water-cooled cooling device, or the like is conceivable as the heat dissipator 3. The heat dissipator 3 includes a flat substrate 70 and a side wall 71 that protrudes in the Z2 direction from the periphery of the substrate 70. A screw hole 72 into which a fixing bolt 4 is inserted is provided on the top surface of the side wall 71.

[0013] The fixing bolt 4 is a fastener for fixing the heating element 2 to the heat sink 3. Specifically, the fixing bolt 4 passes through the mounting hole 61 in the support part 60 of the heating element 2 and is inserted into the screw hole 72 provided in the top surface of the side wall part 71 of the heat sink 3. The fixing bolt 4 inserted into the screw hole 72 is fastened so that the support part 60 of the heating element 2 and the top surface of the side wall part 71 of the heat sink 3 come into contact with each other.

[0014] The heat dissipation member 1 is placed between the heat generating body 2 and the heat dissipation body 3. The heat dissipation member 1 is in contact with the heat generating body 2 and the heat dissipation body 3, and transfers heat generated by the heat generating body 2 to the heat dissipation body 3. The heat dissipation member 1 includes a thermally conductive substrate 10, a first thermal conductor 40, and a second thermal conductor 50.

[0015] The thermal conductive substrate 10 is a plate-shaped elastic rubber body. Examples of materials for the thermal conductive substrate 10 include various rubber materials such as chloroprene rubber (CR), silicone rubber (SR), acrylic rubber (ACM), urethane rubber (U), polyurethane rubber (PUR), vinyl methyl silicone rubber (VMQ), ethylene propylene diene rubber (EPDM), and fluororubber (FKM).

[0016] The thermally conductive substrate 10 has thermal conductivity and transfers heat generated from the heat-generating element 2 to the heat sink 3. The thermal conductivity of the thermally conductive substrate 10 is preferably 1.2 W / mK. The durometer hardness (type A) of the thermally conductive substrate 10 is preferably 60. The thermally conductive substrate 10 includes a first surface 11 and a second surface 15 that are opposite to each other. As illustrated in FIG. 1 , the first surface 11 is the surface of the thermally conductive substrate 10 that faces the heat-generating element 2.

[0017] Fig. 2 is a cross-sectional view of the heat dissipation member 1 before it is sandwiched between the heat generating element 2 and the heat dissipation element 3. Fig. 3 is a plan view of the first surface 11 according to this embodiment. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 3. As illustrated in Figs. 2 and 3, the first surface 11 includes a first flat surface 14, a plurality of second convex portions 16, and a plurality of first concave portions 13. The first flat surface 14 is a plane of the first surface 11 excluding the plurality of second convex portions 16 and the plurality of first concave portions 13.

[0018] The second protrusions 16 protrude from the first flat surface 14 in the Z2 direction. The second protrusions 16 are generally truncated cones that gradually narrow at a constant rate toward their tips in the Z2 direction. The first recesses 13 are recessed from the first flat surface 14 in the Z1 direction.

[0019] In the following description, a direction parallel to a plane perpendicular to the Z axis is referred to as the Y direction, and a direction perpendicular to the Y direction is referred to as the X direction. As illustrated in FIG. 3 , the second protrusions 16 and the first recesses 13 are arranged in a matrix in the X and Y directions on the first surface 11. Specifically, the second protrusions 16 and the first recesses 13 are alternately arranged vertically and horizontally (in the X and Y directions). That is, the second protrusions 16 and the first recesses 13 are alternately arranged in the horizontal direction, and also alternately arranged in the vertical direction. That is, the second protrusions 16 and the first recesses 13 are evenly distributed across the entire first surface 11. The number and arrangement of the second protrusions 16 and the first recesses 13 can be changed as appropriate depending on the dimensions of the thermally conductive substrate 10.

[0020] 1, the second surface 15 is the surface of the thermally conductive substrate 10 opposite to the first surface 11, and faces the heat sink 3. Fig. 4 is a plan view of the second surface 15 according to this embodiment. In Fig. 4, the X direction is reversed from that in Fig. 3.

[0021] 2 and 4, the second surface 15 includes a second flat surface 18, a plurality of first convex portions 12, and a plurality of second concave portions 17. The second flat surface 18 is a plane excluding the plurality of first convex portions 12 and the plurality of second concave portions 17.

[0022] The multiple first protrusions 12 protrude in the Z1 direction from the second flat surface 18. The multiple first protrusions 12 are shaped like truncated cones that gradually narrow at a constant rate toward their tips in the Z1 direction. The multiple second recesses 17 are recessed from the second flat surface 18 in the Z2 direction.

[0023] As illustrated in FIG. 4 , the plurality of first protrusions 12 and the plurality of second recesses 17 are arranged in a matrix on the second surface 15 in the X and Y directions. Specifically, the plurality of first protrusions 12 and the plurality of second recesses 17 are arranged alternately vertically and horizontally (in the X and Y directions). That is, the first protrusions 12 and the second recesses 17 are arranged alternately in the horizontal direction, and the first protrusions 12 and the second recesses 17 are also arranged alternately in the vertical direction. That is, the plurality of first protrusions 12 and the plurality of second recesses 17 are evenly distributed across the entire area of ​​the second surface 15. The number and arrangement of the plurality of first protrusions 12 and the plurality of second recesses 17 can be changed as appropriate depending on the dimensions of the thermally conductive substrate 10, etc.

[0024] 2 to 4, the multiple first recesses 13 correspond to the multiple first protrusions 12, respectively. That is, the multiple first recesses 13 and the multiple first protrusions 12 correspond one-to-one. Specifically, the first protrusions 12 and the first recesses 13 overlap each other when viewed in the Z-axis direction. For example, the center of the planar shape of the first recess 13 and the center of the planar shape of the first protrusion 12 coincide in plan view.

[0025] 3 and 4, the second recesses 17 correspond to the second protrusions 16, respectively. That is, the second recesses 17 correspond one-to-one to the second protrusions 16. Specifically, the second protrusions 16 and the second recesses 17 overlap each other when viewed in the Z-axis direction. For example, the center of the planar shape of the second recess 17 and the center of the planar shape of the second protrusion 16 coincide in plan view.

[0026] As illustrated in FIG. 2, the first protrusions 12 and first recesses 13 corresponding to each other constitute a first protrusion 20. The first protrusion 20 is a hollow portion with the first protrusions 12 as the outer surface and the first recesses 13 as the inner surface. The apex of the first protrusion 20 (i.e., the apex of the first protrusion 12) faces the Z1 direction. The first protrusion 20 opens in a circular shape on the first surface 11. The thickness of the first protrusion 20 (i.e., the distance between the first protrusion 12 and the first recess 13) is approximately constant. The planar shape of the first protrusion 20 is circular. As illustrated in FIGS. 3 and 4, the multiple first protrusions 20 are arranged in a matrix in the X and Y directions.

[0027] As illustrated in FIG. 2, the corresponding second protrusions 16 and second recesses 17 constitute a second protrusion 30. The second protrusion 30 is a hollow portion with the second protrusions 16 as the outer surface and the second recesses 17 as the inner surface. The apex of the second protrusion 30 (i.e., the apex of the second protrusion 16) faces the Z2 direction. The second protrusion 30 opens in a circular shape on the second surface 15. The thickness of the second protrusion 30 (i.e., the distance between the second protrusion 16 and the second recess 17) is approximately constant. The planar shape of the second protrusion 30 is circular. As illustrated in FIGS. 3 and 4, the multiple second protrusions 30 are arranged in a matrix in the X and Y directions.

[0028] As described above, the thermally conductive substrate 10 includes a concave-convex structure including a plurality of first protrusions 20 and a plurality of second protrusions 30. FIG. 5 is a schematic diagram showing the changes that occur when the heat dissipation member 1 is sandwiched between the heat generating element 2 and the heat dissipation element 3. As illustrated in FIG. 5, the pressure acting on the heat conducting substrate 10 from the heat generating element 2 causes the second protrusions 30 to deform so as to be crushed in the Z1 direction. That is, the pressure from the heat generating element 2 is absorbed by the deformation of the second protrusions 30. Therefore, compared to a configuration in which the heat conducting substrate 10 is a simple flat plate material, the reaction force acting from the heat conducting substrate 10 to the heat generating element 2 can be reduced. On the other hand, for example, in a configuration in which the heat dissipation member 1 is composed only of the heat conducting substrate 10, an air gap between the heat conducting substrate 10 and the heat generating element 2 increases, resulting in reduced heat dissipation performance, compared to a configuration in which the heat conducting substrate 10 is a simple flat plate material.

[0029] Similarly, the first protrusions 20 are deformed so as to be crushed in the Z2 direction due to the pressure acting from the heat sink 3 to the thermally conductive substrate 10. In other words, the pressure from the heat sink 3 is absorbed by the deformation of the first protrusions 20. Therefore, compared to a configuration in which the thermally conductive substrate 10 is made of a simple flat plate material, the reaction force acting from the thermally conductive substrate 10 to the heat sink 3 can be reduced. On the other hand, for example, in a configuration in which the heat dissipation member 1 is made only of the thermally conductive substrate 10, the air gap between the thermally conductive substrate 10 and the heat sink 3 increases, and heat dissipation performance decreases compared to a configuration in which the thermally conductive substrate 10 is made of a simple flat plate material.

[0030] In order to suppress the deterioration of heat dissipation performance described above, the heat dissipation member 1 of this embodiment includes not only the thermally conductive substrate 10 but also a first thermal conductor 40 and a second thermal conductor 50. The thermally conductive substrate 10 is a hard member, and the first thermal conductor 40 and the second thermal conductor 50 are soft members.

[0031] The first thermal conductor 40 is a clay-like or semi-solid (paste-like) thermally conductive member. Specifically, the first thermal conductor 40 is a plastic body softer than the thermally conductive substrate 10. That is, the first thermal conductor 40 is more easily deformed than the thermally conductive substrate 10. Therefore, when the same load is applied to the first thermal conductor 40 and the thermally conductive substrate 10, the deformation amount of the first thermal conductor 40 is greater than the deformation amount of the thermally conductive substrate 10. The material of the first thermal conductor 40 is assumed to be grease or the like. However, the grease is preferably silicone grease. The hardness of the first thermal conductor 40 is 70 or less in type OO hardness, but is preferably 0.5 to 60, and more preferably 0.5 to 50. The first thermal conductor 40 has higher thermal conductivity than the thermally conductive substrate 10. Specifically, the thermal conductivity of the first thermal conductor 40 is preferably 2.0 W / m·K or more and 4.0 W / m·K or less, and more preferably 2.0 W / m·K or more and 3.5 W / m·K or less. The thermal conductivity of the second thermal conductor 50 can be adjusted appropriately by adjusting the amount of filler mixed, which has a higher thermal conductivity than grease.

[0032] 2 and 3, a plurality of first thermal conductors 40 are provided in each of the plurality of first recesses 13. That is, the first thermal conductors 40 are provided in a partial region of the first surface 11. A configuration in which the first thermal conductors 40 are provided in a partial region of the first surface 11 means that the first thermal conductors 40 do not cover the entire surface of the first surface 11, but only cover a portion of the first surface 11.

[0033] Specifically, the first thermal conductor 40 is provided so as to fill the space inside the first recess 13. The surface of the first thermal conductor 40 in the Z2 direction that is exposed from the first flat surface 14 of the thermal conductive substrate 10 is located in the same plane as the first flat surface 14.

[0034] The second thermal conductor 50 is a clay-like or semi-solid (paste-like) thermal conductive member. Specifically, the second thermal conductor 50 is a plastic body softer than the thermal conductive substrate 10. That is, the second thermal conductor 50 is more easily deformed than the thermal conductive substrate 10. Therefore, when the same load is applied to the second thermal conductor 50 and the thermal conductive substrate 10, the amount of deformation of the second thermal conductor 50 is greater than the amount of deformation of the thermal conductive substrate 10. The second thermal conductor 50 may be made of a material such as grease. However, silicone grease is preferred. The hardness of the second thermal conductor 50 is 70 or less in type OO hardness, but is preferably 0.5 to 60, and more preferably 0.5 to 50. The second thermal conductor 50 has higher thermal conductivity than the thermal conductive substrate 10. Specifically, the thermal conductivity of the second thermal conductor 50 is preferably 2.0 W / m·K or more and 4.0 W / m·K or less, and more preferably 2.0 W / m·K or more and 3.5 W / m·K or less. The thermal conductivity of the second thermal conductor 50 can be adjusted appropriately by adjusting the amount of filler mixed, which has a thermal conductivity higher than that of grease. Furthermore, the material of the first thermal conductor 40 and the material of the second thermal conductor 50 may be the same.

[0035] 2 and 4, a plurality of second thermal conductors 50 are provided in each of the plurality of second recesses 17. That is, the second thermal conductors 50 are provided in a partial region of the second surface 15. A configuration in which the second thermal conductors 50 are provided in a partial region of the second surface 15 means that the second thermal conductors 50 do not cover the entire surface of the second surface 15, but only cover a portion of the second surface 15.

[0036] Specifically, the second thermal conductor 50 is provided so as to fill the space inside the second recess 17. The surface of the second thermal conductor 50 in the Z1 direction that is exposed from the second flat surface 18 of the thermal conductive substrate 10 is located in the same plane as the second flat surface 18.

[0037] The process of placing the heat dissipation member 1 between the heat generating element 2 and the heat dissipation member 3 will be described with reference to Figure 5. Figure 5 shows the heat dissipation member 1 before it is sandwiched between the heat generating element 2 and the heat dissipation member 3, as well as the heat dissipation member 1 in a state where it is sandwiched between the heat generating element 2 and the heat dissipation member 3. As illustrated below, the heat dissipation member 1 is deformed by being compressed by the heat generating element 2 and the heat dissipation member 3 during the process of being placed between the heat generating element 2 and the heat dissipation member 3.

[0038] As illustrated in FIG. 5 , the heat dissipation member 1 is sandwiched between the heat generating element 2 and the heat dissipation element 3 with the first surface 11 facing the heat generating element 2 and the second surface 15 facing the heat dissipation element 3. The first protrusions 12 are pressed in the Z2 direction by the heat dissipation element 3, causing the first protrusions 12 to deform and be crushed in the Z2 direction. The deformation of the first protrusions 12 causes the first thermal conductors 40 to be pushed out of the first recesses 13 in the Z2 direction. Specifically, the first thermal conductors 40 are raised from the first surface 11 in the Z2 direction. The raised first thermal conductors 40 in the Z2 direction come into contact with the heat generating element 2 and undergo plastic deformation to conform to the shape of the heat generating element 2. As described above, the multiple first protrusions 12 and the multiple first thermal conductors 40 come into contact with the heat generating element 2.

[0039] Similarly, with respect to the second thermal conductor 50, when the second protrusions 16 are pressed in the Z1 direction by the heat generating element 2, the second protrusions 16 are deformed so as to be crushed in the Z1 direction. Due to the deformation of the second protrusions 16, the second thermal conductor 50 is pushed out of the second recesses 17 in the Z1 direction. Specifically, the second thermal conductor 50 is raised in the Z1 direction from the second surface 15. The second thermal conductor 50 raised in the Z1 direction comes into contact with the heat dissipator 3 and undergoes plastic deformation to follow the shape of the heat dissipator 3. As explained above, the multiple second protrusions 16 and the multiple second thermal conductors 50 come into contact with the heat dissipator 3.

[0040] In a configuration in which the first thermal conductor 40 is harder than the thermal conductive substrate 10, the first thermal conductor 40 does not deform sufficiently even when the first protrusions 12 deform. Therefore, the first thermal conductor 40 does not rise sufficiently above the heating element 2, and as a result, the first thermal conductor 40 may not come into contact with the heating element 2. Alternatively, even if the first thermal conductor 40 comes into contact with the heating element 2, plastic deformation that follows the shape of the heating element 2 may not occur. In contrast, in the first embodiment, because the first thermal conductor 40 is softer than the thermal conductive substrate 10, the first thermal conductor 40 deforms sufficiently in conjunction with the deformation of the first protrusions 12, and as a result, rises in the Z2 direction to the extent that it comes into contact with the heating element 2.

[0041] Similarly, in a configuration in which the second thermal conductor 50 is harder than the thermal conductive substrate 10, the second thermal conductor 50 does not deform sufficiently even when the second protrusion 16 deforms. Therefore, the second thermal conductor 50 may not rise sufficiently above the heat sink 3, resulting in the second thermal conductor 50 not coming into contact with the heat sink 3. Alternatively, even if the second thermal conductor 50 comes into contact with the heat sink 3, plastic deformation that follows the shape of the heat sink 3 may not occur. In contrast, in the first embodiment, the second thermal conductor 50 is softer than the thermal conductive substrate 10, and therefore the second thermal conductor 50 deforms sufficiently in conjunction with the deformation of the second protrusion 16, resulting in the second thermal conductor 50 rising in the Z1 direction to the extent that it comes into contact with the heat sink 3. For these reasons, compared to a configuration in which the first thermal conductor 40 and the second thermal conductor 50 are harder than the thermal conductive substrate 10, the contact area of ​​the heat sink 1 with the heating element 2 and the heat sink 3 is larger, improving heat dissipation.

[0042] B: Second embodiment A second embodiment of the present disclosure will be described. Note that, for elements in the following exemplary aspects that have the same functions as those in the first embodiment, the same reference numerals as those in the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

[0043] 6 is a plan view of the first surface 11 in the second embodiment. As illustrated in FIG. 6, each of the multiple second protrusions 16 is formed in a planar shape that extends linearly along the Y direction on the first surface 11. Similarly, each of the multiple first recesses 13 is formed in a planar shape that extends linearly along the Y direction. The multiple second protrusions 16 and the multiple first recesses 13 have a rectangular shape that is elongated in the Y direction on the first surface 11. The multiple second protrusions 16 and the multiple first recesses 13 are arranged alternately in the X direction on the first surface 11. The second protrusions 16 and the first recesses 13 are arranged side by side at regular intervals in the X direction.

[0044] Similarly, the multiple first protrusions 12 are formed in a planar shape that extends linearly along the Y direction on the second surface 15. Similarly, each of the multiple second recesses 17 is formed in a planar shape that extends linearly along the Y direction. The multiple first protrusions 12 and the multiple second recesses 17 have a rectangular shape that is elongated in the Y direction on the first surface 11. The multiple first protrusions 12 and the multiple second recesses 17 are arranged alternately in the X direction on the second surface 15. The first protrusions 12 and the second recesses 17 are arranged side by side at regular intervals in the X direction.

[0045] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG.

[0046] The first protrusions 20 are protrusions with the first convex portions 12 as their outer surfaces and the first concave portions 13 as their inner surfaces. The planar shape of the first protrusions 20 is rectangular. As illustrated in FIGS. 6 and 7, the multiple first protrusions 20 are arranged in the X direction. The cross-sectional shape of the multiple first protrusions 12 is a trapezoid that gradually narrows at a constant rate toward the tip in the Z1 direction.

[0047] The second protrusion 30 is a protrusion with the second convex portion 16 as its outer surface and the second concave portion 17 as its inner surface. The planar shape of the second protrusion 30 is rectangular. As illustrated in FIGS. 6 and 7, the multiple second protrusions 30 are arranged in a row in the X direction. The cross-sectional shape of the multiple second protrusions 16 is a trapezoid that gradually narrows at a constant rate toward the tip in the Z2 direction.

[0048] 6 and 7, a plurality of first thermal conductors 40 are provided in each of the plurality of first recesses 13. That is, the first thermal conductors 40 are provided in a partial region of the first surface 11. Specifically, the first thermal conductors 40 are provided so as to fill the space inside the first recesses 13. Therefore, the first thermal conductors 40 extend linearly along the Y direction. The Z2-direction surface of the first thermal conductors 40 exposed from the first flat surface 14 of the thermal conductive substrate 10 is located in the same plane as the first flat surface 14.

[0049] 7, a plurality of second thermal conductors 50 are provided in the plurality of second recesses 17, respectively. That is, the second thermal conductors 50 are provided in a partial region of the second surface 15. Specifically, the second thermal conductors 50 are provided so as to fill the space inside the second recesses 17. Therefore, the second thermal conductors 50 extend linearly along the Y direction. The Z1-direction surface of the second thermal conductors 50 exposed from the second flat surface 18 of the thermal conductive substrate 10 is located in the same plane as the second flat surface 18.

[0050] C: Modified Example Specific modified embodiments that can be added to each of the embodiments exemplified above are exemplified below. Two or more embodiments arbitrarily selected from the following examples may be appropriately combined within a range that does not contradict each other.

[0051] (1) In the above-described embodiment, the second protrusion 16 has a generally truncated cone shape that gradually narrows at a constant rate toward the tip in the Z2 direction, whereas in the second embodiment, it has a trapezoid shape that gradually narrows at a constant rate toward the tip in the Z2 direction. However, the shape of the second protrusion 16 can be changed as desired. For example, the shape of the second protrusion 16 may be a polygonal pyramid with a curved tip, a hemispherical shape that gradually narrows at a variable rate, or a configuration with a generally semicylindrical cross section.

[0052] (2) In the first embodiment, the first protrusion 12 in the above-described embodiment has a generally truncated cone shape that gradually narrows at a constant rate toward the tip in the Z1 direction, and in the second embodiment, it has a trapezoid shape that gradually narrows at a constant rate toward the tip in the Z1 direction. However, the shape of the first protrusion 12 can be changed as desired. For example, the shape of the first protrusion 12 may be a polygonal pyramid with a curved tip, a hemispherical shape that gradually narrows at a variable rate, or a configuration with a generally semicylindrical cross section.

[0053] (3) In the above-described embodiments, the first recess 13 has a substantially truncated cone shape corresponding to the first protrusion 12 in the first embodiment, and a trapezoid shape corresponding to the first protrusion 12 in the second embodiment. However, the shape of the first recess 13 can be changed as desired. For example, the shape of the first recess 13 may be a polygonal pyramid with a curved tip, a hemispherical shape that gradually narrows at a variable ratio, or a rectangular shape in plan view and a substantially semicylindrical cross section. In addition, the thickness of the first protrusion 20 is not limited to being substantially constant.

[0054] (4) In the above-described embodiments, the second recess 17 has a substantially truncated cone shape corresponding to the second protrusion 16 in the first embodiment, and a trapezoid shape corresponding to the second protrusion 16 in the second embodiment. However, the shape of the second recess 17 can be changed as desired. For example, the shape of the second recess 17 may be a polygonal pyramid with a curved tip, a hemispherical shape that gradually narrows at a variable ratio, or a rectangular shape in plan view and a substantially semicylindrical cross section. Furthermore, the thickness of the second protrusion 30 is not limited to being substantially constant.

[0055] (5) In the above-described embodiment, the first thermal conductor 40 is configured to fill the hollow of the first recess 13 from its tip in the Z1 direction to its bottom surface. However, as long as the first thermal conductor 40 is configured to contact the heat generating element 2 or the heat dissipating element 3 when the heat dissipating member 1 is sandwiched between the heat generating element 2 and the heat dissipating element 3, the first thermal conductor 40 may be configured to be provided as a thin film along the inner wall of the first recess 13, to fill the hollow of the first recess 13 from its tip in the Z1 direction to the bottom surface of the first recess 13, or to protrude from the bottom surface of the first recess 13 in the Z2 direction.

[0056] (6) In the above-described embodiment, the second thermal conductor 50 is configured to fill the hollow of the second recess 17 from its tip in the Z1 direction to its bottom surface. However, as long as the second thermal conductor 50 is configured to contact the heat generating element 2 or the heat dissipating element 3 when the heat dissipating member 1 is sandwiched between the heat generating element 2 and the heat dissipating element 3, the second thermal conductor 50 may be configured to be provided as a thin film along the inner wall of the second recess 17, to fill the hollow of the second recess 17 from its tip in the Z2 direction to the bottom surface of the second recess 17, or to protrude from the bottom surface of the second recess 17 in the Z1 direction.

[0057] (7) In the above-described embodiment, the first thermal conductor 40 is provided in each of the plurality of first recesses 13. However, as long as at least one first thermal conductor 40 is provided, the first thermal conductor 40 may be provided in only some of the plurality of first recesses 13.

[0058] (8) In the above-described embodiment, the second thermal conductor 50 is provided in each of the plurality of second recesses 17. However, as long as at least one second thermal conductor 50 is provided, the second thermal conductor 50 may be provided in only some of the plurality of second recesses 17.

[0059] (9) In the above-described embodiment, the thermally conductive substrate 10 includes a concave-convex structure having a plurality of first protrusions 20 and a plurality of second protrusions 30. However, the thermally conductive substrate 10 may have a simple flat structure in which the plurality of first protrusions 20 and the plurality of second protrusions 30 are omitted, as illustrated in FIG. 8. In the configuration of FIG. 8, the plurality of first thermal conductors 40 are provided on a partial region of the first surface 11. Similarly to the plurality of first thermal conductors 40, the plurality of second thermal conductors 50 are provided on a partial region of the second surface 15. Therefore, when the heat dissipation member 1 is sandwiched between the heat generating body 2 and the heat dissipation body 3, the first thermal conductors 40 are pressed in the Z1 direction by the heat generating body 2.

[0060] For example, a plurality of first thermal conductors 40 each having a circular planar shape are arranged along the X and Y directions. Similarly, a plurality of second thermal conductors 50 each having a circular planar shape are arranged along the X and Y directions. Alternatively, as in the second embodiment, a plurality of first thermal conductors 40 each elongated in the Y direction may be formed on the first surface 11, and a plurality of second thermal conductors 50 each elongated in the Y direction may be formed on the second surface 15.

[0061] 8, compared to a configuration in which the first thermal conductor 40 is provided over the entire first surface 11, a space is secured between the first surface 11 and the first thermal conductor 40 for the first thermal conductor 40 to expand. Therefore, the first thermal conductor 40 undergoes plastic deformation to conform to the shape of the heat generating element 2. That is, the pressure from the heat generating element 2 is absorbed by the deformation of the first thermal conductor 40. Similar to the first thermal conductor 40, the second thermal conductor 50 is pressed in the Z2 direction by the heat dissipator 3. Compared to a configuration in which the second thermal conductor 50 is provided over the entire second surface 15, a space is secured between the second surface 15 and the second thermal conductor 50 for the second thermal conductor 50 to expand. Therefore, the first thermal conductor 40 undergoes plastic deformation to conform to the shape of the heat dissipator 3. That is, the pressure from the heat dissipator 3 is absorbed by the deformation of the second thermal conductor 50. Therefore, the configuration in FIG. 8 also achieves the same effects as the embodiment.

[0062] (10) In the above-described embodiment, the first surface 11 faces the heat generating element 2, and the second surface 15 faces the heat dissipating element 3. However, for example, the first surface 11 may face the heat dissipating element 3, and the second surface 15 may face the heat generating element 2.

[0063] (11) In the above-described embodiment, the first thermal conductor 40 and the second thermal conductor 50 are plastic bodies. However, the first thermal conductor 40 and the second thermal conductor 50 may be elastic bodies. In a configuration in which the first thermal conductor 40 and the second thermal conductor 50 are elastic bodies, the rigidity of the first thermal conductor 40 and the second thermal conductor 50 is lower than the rigidity of the thermal conductive substrate 10.

[0064] (12) In the above-described embodiment, the first thermal conductor 40 and the second thermal conductor 50 have higher thermal conductivity than the thermally conductive substrate 10. However, the first thermal conductor 40 and the second thermal conductor 50 may have lower thermal conductivity than the thermally conductive substrate 10, or the thermal conductivity of the first thermal conductor 40 and the second thermal conductor 50 may be the same as the thermal conductivity of the thermally conductive substrate 10. However, the thermal conductivity of the first thermal conductor 40 and the thermal conductivity of the second thermal conductor 50 are preferably 0.4 W / m K or more.

[0065] (13) The term "nth" (n is a natural number) in this application is used only as a formal and convenient label to distinguish each element in the description and does not have any substantive meaning. Therefore, there is no room for restrictive interpretation of the position of each element or the order of production, etc., based on the term "nth."

[0066] D: Notes From the above-described exemplary embodiments, the following configurations can be understood, for example.

[0067] A heat dissipation member according to one aspect (Aspect 1) of the present disclosure includes a plate-shaped thermally conductive substrate having a first surface and a second surface opposite each other, and one or more first thermal conductors softer than the thermally conductive substrate. The one or more first thermal conductors are provided on a partial region of the first surface. In the above aspect, the first thermal conductors are provided on a partial region of the first surface of the thermally conductive substrate. According to the above configuration, when the heat dissipation member is assembled to a target component with the first surface facing the target component, the soft first thermal conductors, rather than the thermally conductive substrate, come into contact with the target component. Furthermore, compared to a configuration in which the first thermal conductors are provided on the entire first surface, a space is secured between the first surface and the target component for the first thermal conductor to expand. Therefore, the first thermal conductors undergo plastic deformation conforming to the shape of the target component. In other words, the first thermal conductors can reduce the reaction force acting from the thermally conductive substrate on the target component. Therefore, compared to when the first thermal conductor is harder than the thermally conductive substrate, both a lower reaction force and improved heat dissipation performance of the heat dissipation member can be achieved. The term "provided on a portion of the first surface" refers to a configuration in which a portion of the first surface overlaps with the first thermal conductor, while the remaining portion does not. That is, the first surface includes a portion that overlaps with the first thermal conductor and a portion that does not overlap with the first thermal conductor. Specifically, a configuration in which only a portion of the first surface is covered with a first thermal conductor of a predetermined shape is conceivable. The term "softer" than the thermally conductive substrate means that the first thermal conductor is more easily deformed (flexible) than the thermally conductive substrate. Specifically, when the same load is applied to the first thermal conductor and the thermally conductive substrate, the deformation amount of the first thermal conductor is greater than the deformation amount of the thermally conductive substrate. The first thermal conductor may also be described as having a lower hardness than the thermally conductive substrate. For example, the first thermal conductor is a soft member (e.g., paste-like), and the thermally conductive substrate is a hard member. Also, for example, if the first thermal conductor is a member that undergoes plastic deformation and the thermally conductive substrate is a member that undergoes elastic deformation, the first thermal conductor is "softer" than the thermally conductive substrate. While the above explanation focuses on the relationship between the first thermal conductor and the thermally conductive substrate, the same applies to the relationship between the second thermal conductor and the thermally conductive substrate.

[0068] In a heat dissipation member according to a specific example (Aspect 2) of Aspect 1, the second surface includes a first protrusion, the first surface includes a first recess corresponding to the first protrusion, and the one or more first thermal conductors are provided within the first recess. In the above aspect, the second surface includes a first protrusion, the first surface includes a first recess corresponding to the first protrusion, and the first thermal conductor is provided within the first recess. In the above configuration, assume that the heat dissipation member is installed between a first target member and a second target member. For example, one of the heating element and the heat dissipation element is the first target member, and the other is the second target member. The first protrusion is deformed by being pressed by the first target member. Compared to a configuration in which the entire flat second surface is in close contact with the first target member, the reaction force acting from the thermally conductive substrate to the target member is reduced. As a result of the deformation of the first protrusion, the first recess also deforms, and a portion of the first thermal conductor within the first recess is pushed out of the first recess and comes into contact with the second target member. Therefore, it is possible to realize efficient heat dissipation from the second target member via the first thermal conductor while reducing the reaction force acting from the first thermal conductor to the second target member. The first convex portion is a convex surface protruding from the second surface. The first concave portion is a concave surface recessed into the first surface. The planar shape of the first convex portion and the planar shape of the first concave portion do not need to be the same shape.

[0069] In a heat dissipation member according to a specific example (Aspect 3) of Aspect 1 or Aspect 2, the one or more first thermal conductors are a plurality of first thermal conductors, the second surface includes a plurality of first protrusions, the first surface includes a plurality of first recesses corresponding to the plurality of first protrusions, and the plurality of first thermal conductors are respectively provided in the plurality of first recesses. In the above aspect, there are a plurality of pairs of first protrusions and first recesses (first protrusions) and a plurality of first thermal conductors. That is, the first protrusions are dispersed within the second surface, and the first recesses and first thermal conductors are dispersed within the first surface. Therefore, compared to a case where there is only one pair of first protrusions and first recesses (first protrusions) and a single first thermal conductor, the heat dissipation member is supported at multiple points, which has the advantage of stabilizing the position of the heat dissipation member and enabling a wider area of ​​the first surface to be used for heat dissipation. The first protrusions are convex surfaces protruding from the second surface. The first recesses are concave surfaces recessed relative to the first surface. The planar shape of the first convex portion and the planar shape of the first concave portion do not need to be the same shape.

[0070] A heat dissipation member according to any one of Aspects 1 to 3 (Aspect 4) further includes one or more second thermal conductors softer than the thermally conductive substrate, and the one or more second thermal conductors are provided in a partial region of the second surface. In the above aspects, the second thermal conductors are provided in a partial region of the second surface of the thermally conductive substrate. According to the above configuration, when the heat dissipation member is attached to a target member with the second surface facing the target member, the soft second thermal conductor, not the thermally conductive substrate, contacts the target member. Compared to a configuration in which the second thermal conductor is provided on the entire second surface, a space is secured between the second surface and the target member for the second thermal conductor to expand. Therefore, the second thermal conductor undergoes plastic deformation that follows the shape of the object it comes into contact with. In other words, the second thermal conductor can reduce the reaction force acting from the thermally conductive substrate on the target member. Therefore, compared to a configuration in which the second thermal conductor is harder than the thermally conductive substrate, it is possible to achieve both a lower reaction force and improved heat dissipation performance of the heat dissipation member. The one or more second thermal conductors, which are softer than the thermally conductive substrate, may be made of the same material as or a different material from the first thermal conductor, as long as they are softer than the thermally conductive substrate and have thermal conductivity. The term "provided on a partial region of the second surface" refers to a configuration in which a partial region of the second surface overlaps with the second thermal conductor, and the remaining region does not overlap with the second thermal conductor. In other words, the second surface includes a region that overlaps with the second thermal conductor and a region that does not overlap with the second thermal conductor. Specifically, a configuration in which only a partial region of the second surface is covered with a second thermal conductor of a predetermined shape is conceivable.

[0071] In a heat dissipation member according to any one of Aspects 1 to 4 (Aspect 5), the first surface includes a second convex portion, the second surface includes a second concave portion corresponding to the second convex portion, and the one or more second thermal conductors are provided in the second concave portion. In the above aspects, the first surface includes a second convex portion, the second surface includes a second concave portion corresponding to the second convex portion, and the second thermal conductors are provided in the second concave portion. In the above configuration, it is assumed that the heat dissipation member is installed between a first target member and a second target member. For example, one of the heating element and the heat dissipation element is the first target member, and the other is the second target member. The second convex portion is deformed by being pressed by the second target member. Compared to a configuration in which the entire flat first surface is in close contact with the target member, the reaction force acting from the thermally conductive substrate to the target member is reduced. As a result of the deformation of the second convex portion, the second concave portion also deforms, and as a result, a portion of the second thermal conductor in the second concave portion is pushed out of the second concave portion and comes into contact with the first target member. Therefore, efficient heat dissipation from the first target member via the second thermal conductor can be achieved while reducing the reaction force acting from the second thermal conductor to the first target member. The second convex portion is a convex surface protruding from the first surface. The second concave portion is a concave surface recessed into the second surface. The planar shape of the second convex portion and the planar shape of the second concave portion do not need to be the same shape.

[0072] In a heat dissipation member according to any one of Aspects 1 to 5 (Aspect 6), the one or more second thermal conductors are a plurality of second thermal conductors, the first surface includes a plurality of second protrusions, the second surface includes a plurality of second recesses corresponding to the plurality of second protrusions, and the plurality of second thermal conductors are respectively provided in the plurality of second recesses. In the above aspect, there are a plurality of pairs of second protrusions and second recesses (second protrusions) and a plurality of second thermal conductors. That is, the second protrusions are dispersed within the first surface, and the second recesses and second thermal conductors are dispersed within the second surface. Therefore, compared to a case where there is a single second protrusion, a single second recess, and a single second thermal conductor, the heat dissipation member can be supported at multiple points, which has the advantage of stabilizing the position of the heat dissipation member and enabling a wider area of ​​the second surface to be used for heat dissipation. The second protrusions are convex surfaces protruding from the first surface. The second recesses are concave surfaces recessed relative to the second surface. The planar shape of the second convex portion and the planar shape of the second concave portion do not need to be the same shape.

[0073] In a heat dissipation member according to any one of Aspects 1 to 6 (Aspect 7), the planar shape of the plurality of first protrusions is circular, and the area of ​​the circle representing the outer diameter of the plurality of first protrusions gradually narrows toward the tip in the protruding direction. The planar shape of the plurality of second protrusions is circular, and the area of ​​the circle representing the outer diameter of the plurality of second protrusions gradually narrows toward the tip in the protruding direction. In the above configuration, assume that the heat dissipation member is installed between a first target member and a second target member. For example, one of the heat generating element and the heat dissipation element is the first target member, and the other is the second target member. The plurality of first protrusions are deformed by being pressed against the first target member, and the plurality of second protrusions are deformed by being pressed against the second target member. Compared to a configuration in which the first protrusions and the second protrusions are formed into a cylindrical shape with a constant width, the first protrusions and the second protrusions are more easily deformed by being pressed. When the first protrusions deform, the first thermal conductor is pushed out, and when the second protrusions deform, the second thermal conductor is pushed out. The extruded first thermal conductor contacts the first target member, and the extruded second thermal conductor contacts the second target member. Therefore, the heat dissipation member can easily contact the target member, thereby realizing more efficient heat dissipation. The protruding direction is the direction in which the first convex portion or the second convex portion protrudes. Specifically, the protruding direction of the first convex portion is the direction from the first surface toward the second surface, and the protruding direction of the second convex portion is the direction from the second surface toward the first surface.

[0074] In a heat dissipation member according to any one of the specific examples (Aspect 8) of Aspects 1 to 7, the thermal conductivity of the first thermal conductor and the second thermal conductor is higher than the thermal conductivity of the thermally conductive substrate. In the above aspects, the first thermal conductor and the second thermal conductor have a higher heat dissipation property than the thermally conductive substrate. According to the above configuration, the first thermal conductor and the second thermal conductor, which are in close contact with the shape of the target component, have a higher heat dissipation property than the thermally conductive substrate. Therefore, the heat dissipation property is significantly higher than in a configuration in which the thermal conductivity of the thermally conductive substrate is equal to the thermal conductivity of the first thermal conductor and the second thermal conductor.

[0075] A cooling structure according to one aspect (Aspect 9) of the present disclosure includes a heat generating element, a heat sink, and a heat dissipation member. The heat dissipation member includes a plate-shaped thermally conductive substrate having a first surface and a second surface opposite each other, and one or more first thermal conductors softer than the thermally conductive substrate, the one or more first thermal conductors being provided on a partial region of the first surface. In the above aspect, the first thermal conductors are provided on a partial region of the first surface of the thermally conductive substrate. According to the above configuration, when the heat dissipation member is attached to a target member with the first surface facing the target member, the soft first thermal conductors, rather than the thermally conductive substrate, come into contact with the target member. Furthermore, compared to a configuration in which the first thermal conductors are provided on the entire first surface, a space is secured between the first surface and the target member for the first thermal conductor to expand. Therefore, the first thermal conductors undergo plastic deformation to conform to the shape of the object they come into contact with. Therefore, compared to when the first thermal conductor is harder than the thermal conductive substrate, it is possible to achieve both a lower reaction force and improved heat dissipation of the heat dissipation member. Examples of the heat-generating body include batteries, electronic devices, lighting devices, display devices, semiconductor elements, and heaters. Examples of the heat dissipating body include heat sinks, air-cooled cooling devices, and water-cooled cooling devices. [Explanation of symbols]

[0076] 1...heat dissipation member, 2...heat generating element, 3...heat dissipation element, 4...fixing bolt, 10...thermal conductive substrate, 11...first surface, 12...first convex portion, 13...first concave portion, 14...first flat surface, 15...second surface, 16...second convex portion, 17...second concave portion, 18...second flat surface, 20...first protrusion portion, 30...second protrusion portion, 40...first thermal conductor, 50...second thermal conductor, 60...support portion, 61...mounting hole, 70...substrate portion, 71...side wall portion, 72...screw hole, 100...cooling structure.

Claims

1. a plate-shaped thermally conductive substrate including a first surface and a second surface opposite to each other; one or more first thermal conductors that are softer than the thermally conductive substrate; Equipped with The one or more first thermal conductors are provided on a partial region of the first surface. Heat dissipation material.

2. the second surface includes a first convex portion, the first surface includes a first recess corresponding to the first protrusion, The one or more first thermal conductors are disposed within the first recess. The heat dissipation member according to claim 1.

3. the one or more first thermal conductors are a plurality of first thermal conductors, the second surface includes a plurality of first protrusions, the first surface includes a plurality of first recesses corresponding to the plurality of first protrusions, The plurality of first thermal conductors are respectively provided in the plurality of first recesses. The heat dissipation member according to claim 1.

4. Further comprising one or more second thermal conductors softer than the thermally conductive substrate; The one or more second thermal conductors are provided on a partial region of the second surface. The heat dissipation member according to any one of claims 1 to 3.

5. the first surface includes a second convex portion, the second surface includes a second recess corresponding to the second protrusion, The one or more second thermal conductors are provided in the second recess. The heat dissipation member according to claim 4.

6. the one or more second thermal conductors are a plurality of second thermal conductors, the first surface includes a plurality of second protrusions, the second surface includes a plurality of second recesses corresponding to the plurality of second protrusions, The plurality of second thermal conductors are provided in the plurality of second recesses, respectively. The heat dissipation member according to claim 5.

7. the plurality of first protrusions have a circular planar shape, the areas of the circles of the outer diameters of the plurality of first protrusions gradually become narrower toward the tips in the protruding direction, the second protrusions each have a circular planar shape, The area of ​​the circle of the outer diameter of the plurality of second protrusions gradually becomes smaller toward the tip in the protruding direction. The heat dissipation member according to claim 6.

8. The thermal conductivity of the first thermal conductor and the second thermal conductor is higher than the thermal conductivity of the thermal conductive substrate. The heat dissipation member according to claim 7.

9. A heating element; A heat sink; a heat dissipation member, The heat dissipation member is a plate-shaped thermally conductive substrate including a first surface and a second surface opposite to each other; one or more first thermal conductors that are softer than the thermally conductive substrate; Equipped with The one or more first thermal conductors are provided on a partial region of the first surface. Cooling structure.

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