Display device and semiconductor manufacturing system

Abstract

To provide a display device which can be operated in a short time and hardly causes erroneous operation, and to provide a semiconductor manufacturing system.SOLUTION: The display device includes a storage unit configured to store a plurality of instruction keys for causing the semiconductor manufacturing apparatus to perform operations different from each other, a search unit configured to search for and extract the instruction key related to a character input by a user from the storage unit based on the character, and a display unit configured to display the instruction key extracted by the search unit in a state where the instruction key can be selected by the user.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a display device and a semiconductor manufacturing system. [Background technology]

[0002] Conventionally, substrate processing apparatuses (semiconductor manufacturing apparatuses) that polish and clean substrates are known (see, for example, Patent Document 1). Such semiconductor manufacturing apparatuses are sometimes used together with a display device. The display device displays instruction keys in a state that allows a user to select them. The instruction keys are virtual buttons that are selected (pressed) on the display screen by the user to cause the semiconductor manufacturing apparatus to perform a predetermined operation corresponding to the instruction key.

[0003] Fig. 1 is a diagram showing an example of a screen displayed by a conventional display device. As shown in Fig. 1, in a conventional display device, a plurality of instruction keys K may be displayed in a state separated by a plurality of frames F and tabs T. In the example of Fig. 1, the tabs T correspond to objects to be made to perform an action (action objects), and the frames F correspond to types of actions to be performed by the action objects (action types). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-40806 Summary of the Invention [Problem to be solved by the invention]

[0005] In the example of FIG. 1, a user needs to find a desired command key K from among multiple frames F and tabs T. For example, if a user who is unfamiliar with operating a display device uses the display device, it may take a long time to find the desired command key K. Furthermore, in the example of FIG. 1, multiple command keys K are arranged within a single frame F or a single tab T. This may result in a user selecting an command key K other than the desired command key K, resulting in an erroneous operation. Such problems may also occur in display devices used with devices other than semiconductor manufacturing devices.

[0006] The present invention has been made in consideration of the above circumstances, and has as its object to provide a display device and a semiconductor manufacturing system that can be operated in a short time and that are less likely to cause operational errors. [Means for solving the problem]

[0007] In order to solve the above problem, a display device according to a first aspect of the present invention includes a memory unit that stores a plurality of command keys for causing a semiconductor manufacturing device to perform different operations, a search unit that searches for and extracts the command keys related to characters entered by a user from the memory unit based on the characters, and a display unit that displays the command keys extracted by the search unit in a state that allows the user to select them.

[0008] Furthermore, in a second aspect of the present invention, in the display device of the first aspect, the plurality of instruction keys include a group of instruction keys corresponding to a series of operations performed in the semiconductor manufacturing equipment, and when the characters input by the user are characters indicating the series of operations, the display unit displays the instruction keys included in the group of instruction keys in an order based on the order in the series of operations.

[0009] Furthermore, in a third aspect of the present invention, the display device of the first or second aspect further includes a storage unit that stores in the memory unit a group of instruction keys selected by a user in a series of operations performed in the semiconductor manufacturing device, in association with the order of selection by the user.

[0010] Furthermore, aspect 4 of the present invention relates to a display device according to any one of aspects 1 to 3, further comprising a prediction unit that predicts the instruction key that the user should select next based on information about the instruction key selected by the user, and the display unit displays the instruction key predicted by the prediction unit.

[0011] Furthermore, aspect 5 of the present invention, in any one of aspects 1 to 4 of the display device, further comprises a prediction unit that predicts the instruction key that the user should select next based on information about the instruction key selected by the user, and a warning unit that issues a warning when the user selects an instruction key that is different from the instruction key predicted by the prediction unit.

[0012] Furthermore, in aspect 6 of the present invention, in the display device of aspect 4 or aspect 5, the prediction unit predicts the instruction key that the user should select next by inputting information about the instruction key selected by the user into a trained model, and the trained model is trained to output the instruction key that the user should select next when information about the instruction key selected by the user is input.

[0013] A semiconductor manufacturing system according to a seventh aspect of the present invention includes the semiconductor manufacturing apparatus and the display device according to any one of the first to fifth aspects.

[0014] In order to solve the above problem, a display device according to aspect 8 of the present invention comprises a memory unit that stores a plurality of command keys for causing the device to perform different operations, a search unit that searches for and extracts the command keys related to characters entered by a user from the memory unit based on the characters, and a display unit that displays the command keys extracted by the search unit in a state that allows the user to select them. [Effects of the Invention]

[0015] According to the above aspects of the present invention, it is possible to provide a display device and a semiconductor manufacturing system that can be operated in a short time and that are less likely to cause operational errors. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a diagram showing an example of a screen displayed by a conventional display device. [Figure 2] 1 is a plan view showing the overall configuration of a semiconductor manufacturing system according to an embodiment of the present invention; [Figure 3] 1 is a block diagram showing a system configuration of a control device according to an embodiment of the present invention; [Figure 4] 5A and 5B are diagrams illustrating examples of instruction keys stored in a storage unit according to an embodiment of the present invention. [Figure 5] FIG. 10 is a diagram illustrating an example of a screen displayed by an operation panel according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A display device and a semiconductor manufacturing system according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0018] <Semiconductor manufacturing system overview> FIG. 2 is a plan view showing the overall configuration of the semiconductor manufacturing system S according to this embodiment. 2, the semiconductor manufacturing system S according to this embodiment includes a semiconductor manufacturing apparatus 1 and a control device (control panel) 100. The control device 100 controls the overall operation of the semiconductor manufacturing apparatus 1.

[0019] 2 is a chemical mechanical polishing (CMP) device that polishes the surface of a substrate W such as a silicon wafer to a flat surface. The semiconductor manufacturing device 1 includes a rectangular box-shaped housing 2. The housing 2 is formed in a substantially rectangular shape in a plan view.

[0020] The housing 2 has a substrate transport path 3 extending longitudinally through its center. A load / unload unit 10 is disposed at one longitudinal end of the substrate transport path 3. A polishing unit 20 is disposed on one side of the width direction of the substrate transport path 3 (a direction perpendicular to the longitudinal direction in a plan view), and a cleaning unit 30 is disposed on the other side. The substrate transport path 3 is provided with a substrate transport unit 40 that transports substrates W. The semiconductor manufacturing apparatus 1 also has the load / unload unit 10, the polishing unit 20, and the cleaning unit 30.

[0021] The load / unload unit 10 includes a front load unit 11 that accommodates substrates W. A plurality of front load units 11 are provided on one longitudinal side of the housing 2. The plurality of front load units 11 are arranged in the width direction of the housing 2. The front load unit 11 is equipped with, for example, an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF and FOUP are airtight containers that accommodate cassettes of substrates W and are covered with a partition wall, and can maintain an environment that is independent from the external space.

[0022] The loading / unloading section 10 also includes two transport robots 12 that take in and out substrates W from the front loading section 11, and a traveling mechanism 13 that causes each transport robot 12 to travel along the row of front loading sections 11. Each transport robot 12 has two hands, one on top and one on bottom, which are used before and after processing of the substrate W. For example, the upper hand is used when returning the substrate W to the front loading section 11, and the lower hand is used when removing the unprocessed substrate W from the front loading section 11.

[0023] The polishing section 20 includes a plurality of substrate polishing apparatuses 21 (21A, 21B, 21C, 21D) that polish (planarize) substrates W. The plurality of substrate polishing apparatuses 21 are arranged in the longitudinal direction of the substrate transport path 3. Each substrate polishing apparatus 21 includes a polishing table 23 that rotates a polishing pad 22 having a polishing surface, a top ring 24 that holds the substrate W and polishes the substrate W while pressing it against the polishing pad 22 on the polishing table 23, a polishing liquid supply nozzle 25 that supplies a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 22, a dresser 26 that dresses the polishing surface of the polishing pad 22, and an atomizer 27 that sprays a mist of a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) onto the polishing surface.

[0024] The substrate polishing apparatus 21 polishes the substrate W to a flat surface by pressing the substrate W against the polishing pad 22 with the top ring 24 while supplying a polishing liquid onto the polishing pad 22 from the polishing liquid supply nozzle 25 and then moving the top ring 24 and polishing table 23 relative to each other. The dresser 26 has hard particles such as diamond particles or ceramic particles fixed to the rotating part at the tip that contacts the polishing pad 22. By rotating and oscillating the rotating part, the entire polishing surface of the polishing pad 22 is uniformly dressed to form a flat polished surface. The atomizer 27 uses high-pressure fluid to wash away polishing debris and abrasive grains remaining on the polishing surface of the polishing pad 22, thereby cleaning the polished surface and reconditioning the polished surface using the mechanical contact of the dresser 26, i.e., regenerating the polished surface.

[0025] Cleaning section 30 includes a plurality of substrate cleaning apparatuses 31 (31A, 31B) for cleaning substrates W, and a substrate drying apparatus 32 for drying the cleaned substrates W. The plurality of substrate cleaning apparatuses 31 and substrate drying apparatuses 32 are arranged in the longitudinal direction of substrate transport path 3. Substrate cleaning apparatus 31A is provided in first substrate cleaning tank 37. Substrate cleaning apparatus 31B is provided in second substrate cleaning tank 38.

[0026] A first transfer chamber 33 is provided between the first substrate cleaning tank 37 and the second substrate cleaning tank 38. The first transfer chamber 33 is provided with a transfer robot 35 that transfers substrates W between the substrate transfer section 40, the substrate cleaning apparatus 31A, and the substrate cleaning apparatus 31B. A second transfer chamber 34 is provided between the substrate cleaning apparatus 31B and the substrate drying apparatus 32. The second transfer chamber 34 is provided with a transfer robot 36 that transfers substrates W between the substrate cleaning apparatus 31B and the substrate drying apparatus 32.

[0027] The substrate cleaning apparatus 31A is equipped with a roll sponge type cleaning module (described later) and performs primary cleaning of the substrate W. The substrate cleaning apparatus 31B is also equipped with a roll sponge type cleaning module and performs secondary cleaning of the substrate W. The substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B may be the same type or may have different types of cleaning modules, such as pencil sponge type cleaning modules or two-fluid jet type cleaning modules. The substrate drying apparatus 32 is equipped with a drying module that performs, for example, Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). After drying, a shutter 1a provided in a partition between the substrate drying apparatus 32 and the load / unload unit 10 is opened, and the substrate W is removed from the substrate drying apparatus 32 by the transfer robot 12.

[0028] The substrate transfer section 40 includes a lifter 41, a first linear transporter 42, a second linear transporter 43, and a swing transporter 44. The substrate transfer path 3 is provided with, in order from the loading / unloading section 10 side, a first transfer position TP1, a second transfer position TP2, a third transfer position TP3, a fourth transfer position TP4, a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer position TP7.

[0029] The lifter 41 is a mechanism that transports the substrate W up and down at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the load / unload section 10 at the first transfer position TP1. The lifter 41 also delivers the substrate W received from the transport robot 12 to the first linear transporter 42. A shutter 1b is provided on a partition wall between the first transfer position TP1 and the load / unload section 10, and when the substrate W is to be transported, the shutter 1b is opened and the substrate W is delivered from the transport robot 12 to the lifter 41.

[0030] The first linear transporter 42 is a mechanism for transporting substrates W between the first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. The first linear transporter 42 includes a plurality of transport hands 45 (45A, 45B, 45C, 45D) and a linear guide mechanism 46 for moving each transport hand 45 horizontally at a plurality of heights. The transport hand 45A moves between the first transfer position TP1 and the fourth transfer position TP4 by the linear guide mechanism 46. This transport hand 45A is a pass hand for receiving the substrate W from the lifter 41 and transferring it to the second linear transporter 43. This transport hand 45A is not provided with a lifting / lowering drive unit.

[0031] The transport hand 45B moves between a first transfer position TP1 and a second transfer position TP2 by a linear guide mechanism 46. This transport hand 45B receives the substrate W from the lifter 41 at the first transfer position TP1, and delivers the substrate W to the substrate polishing apparatus 21A at the second transfer position TP2. The transport hand 45B is provided with an elevation drive unit that rises when delivering the substrate W to the top ring 24 of the substrate polishing apparatus 21A, and descends after delivering the substrate W to the top ring 24. Note that the transport hands 45C and 45D are also provided with similar elevation drive units.

[0032] The transport hand 45C moves between the first transfer position TP1 and the third transfer position TP3 by means of a linear guide mechanism 46. The transport hand 45C receives the substrate W from the lifter 41 at the first transfer position TP1, and delivers the substrate W to the substrate polishing apparatus 21B at the third transfer position TP3. The transport hand 45C also functions as an access hand that receives the substrate W from the top ring 24 of the substrate polishing apparatus 21A at the second transfer position TP2, and delivers the substrate W to the substrate polishing apparatus 21B at the third transfer position TP3.

[0033] The transport hand 45D moves between the second transfer position TP2 and the fourth transfer position TP4 by the linear guide mechanism 46. The transport hand 45D functions as an access hand for receiving the substrate W from the top ring 24 of the substrate polishing apparatus 21A or the substrate polishing apparatus 21B at the second transfer position TP2 or the third transfer position TP3, and for transferring the substrate W to the swing transporter 44 at the fourth transfer position TP4.

[0034] The swing transporter 44 has a hand that is movable between the fourth transfer position TP4 and the fifth transfer position TP5, and transfers the substrate W from the first linear transporter 42 to the second linear transporter 43. The swing transporter 44 also transfers the substrate W polished in the polishing unit 20 to the cleaning unit 30. A temporary placement table 47 for the substrate W is provided on the side of the swing transporter 44. The swing transporter 44 turns the substrate W received at the fourth transfer position TP4 or the fifth transfer position TP5 upside down and places it on the temporary placement table 47. The substrate W placed on the temporary placement table 47 is transferred to the first transfer chamber 33 by the transfer robot 35 of the cleaning unit 30.

[0035] The second linear transporter 43 is a mechanism that transports the substrate W between the fifth transfer position TP5, the sixth transfer position TP6, and the seventh transfer position TP7. The second linear transporter 43 includes a plurality of transport hands 48 (48A, 48B, 48C) and a linear guide mechanism 49 that moves each transport hand 48 horizontally at a plurality of heights. The transport hand 48A moves between the fifth transfer position TP5 and the sixth transfer position TP6 by the linear guide mechanism 49. The transport hand 48A functions as an access hand that receives the substrate W from the swing transporter 44 and delivers it to the substrate polishing apparatus 21C.

[0036] The transport hand 48B moves between the sixth transfer position TP6 and the seventh transfer position TP7. The transport hand 48B functions as an access hand for receiving a substrate W from the substrate polishing apparatus 21C and transferring it to the substrate polishing apparatus 21D. The transport hand 48C moves between the seventh transfer position TP7 and the fifth transfer position TP5. The transport hand 48C functions as an access hand for receiving a substrate W from the top ring 24 of the substrate polishing apparatus 21C or the substrate polishing apparatus 21D at the sixth transfer position TP6 or the seventh transfer position TP7 and transferring the substrate W to the swing transporter 44 at the fifth transfer position TP5. Although not described here, the operation of the transport hand 48 when transferring a substrate W is the same as that of the first linear transporter 42 described above.

[0037] <Display device> FIG. 3 is a block diagram showing the system configuration of the control device 100 according to this embodiment. The control device 100 is configured using an information device such as a dedicated device. However, the control device 100 may also be configured using an information device such as a smartphone, a tablet, or a personal computer. As shown in FIG. 3, the control device 100 according to this embodiment includes an operation panel 110, a processing unit 120, and a storage unit 130. The control device 100 including the operation panel 110 (display unit) is also referred to as a display device.

[0038] The operation panel 110 according to this embodiment functions as an input unit operated by a user when inputting user instructions to the semiconductor manufacturing apparatus 1. The operation panel 110 according to this embodiment also functions as an output unit that outputs information in a form that can be recognized by the user. More specifically, the operation panel 110 according to this embodiment functions as a display unit that displays (outputs) information as an image. The operation panel 110 according to this embodiment may be a touch panel that combines the functions of an input unit and a display unit.

[0039] The operation panel 110 displays information based on the control of the display control unit 122, which will be described later. For example, the operation panel 110 (display unit) displays instruction keys 131, which will be described later, in a state where they can be selected by the user. The operation panel 110 according to this embodiment also displays a narrowing-down display 111 (see FIG. 5 , which will be described in detail later). The operation panel 110 (input unit) outputs information (instruction information) indicating the instruction key 131 selected by the user to the processing unit 120. The operation panel 110 according to this embodiment outputs information (search character information) input by the user into the narrowing-down display 111 to the processing unit 120. The operation panel 110 may display information indicating the operating status of the semiconductor manufacturing equipment 1, abnormality information indicating the location where an abnormality (alarm) has occurred in the semiconductor manufacturing equipment 1, etc.

[0040] The storage unit 130 is configured using a storage device such as a magnetic hard disk drive or a semiconductor storage device. The storage unit 130 stores data used by the processing unit 120. The storage unit 130 stores data required when the processing unit 120 performs processing.

[0041] The storage unit 130 according to this embodiment stores a plurality of command keys 131 for causing the semiconductor manufacturing equipment 1 to perform different operations. The command keys 131 are displayed on the operation panel 110 (display unit) in a state selectable by the user. When the user selects a command key 131 on the operation panel 110, the equipment control unit 121 (described later) causes the semiconductor manufacturing equipment 1 to perform an operation corresponding to the selected command key 131.

[0042] FIG. 4 is a diagram showing an example of the instruction keys 131 stored in the storage unit 130 according to this embodiment. 4, each command key 131 according to this embodiment is stored in the storage unit 130 in a state linked to a plurality of pieces of information (first module information to third module information and task group information). Each piece of module information is information related to a module included in the semiconductor manufacturing apparatus 1. Note that a "module" according to this embodiment refers to a mechanism that performs a predetermined operation on a task target (substrate W).

[0043] In the example of FIG. 4, the first module information corresponds to the name of a module, such as "Polisher (corresponding to the substrate polishing apparatus 21)." The second module information corresponds to the configuration of a module (module configuration), such as "Topring (corresponding to the top ring 24)," "Turn Table (corresponding to the polishing table 23)," and "Dresser (corresponding to the dresser 26)." The third module information corresponds to the type of operation of a module configuration, such as "Rotation (corresponding to the rotation operation)," "Up / Down (corresponding to the lifting operation)," "Swing (corresponding to the swinging operation)," and "Slurry (corresponding to the slurry)." The name of each command key indicates a specific operation performed by the module configuration. For example, the command key "Rotate" located in the top row of the table in FIG. 4 corresponds to the operation of rotating the Topring (corresponding to the top ring 24) of the Polisher (corresponding to the substrate polishing apparatus 21).

[0044] The task group information is information linked to a task key 131 (a task group) corresponding to a series of operations (task groups) performed in the semiconductor manufacturing equipment 1, among the multiple task keys 131 stored in the storage unit 130. In the semiconductor manufacturing equipment 1, there are routine tasks in which a specific task is performed in a specific order each time, such as when replacing the polishing pad 22. Such routine tasks (routine task groups) may be stored in the storage unit 130 as task group information. In the example shown in FIG. 4, "Pad exchange (corresponding to the task of replacing the polishing pad 22)" is an example of such a task group. When multiple task groups are expected to be performed in the semiconductor manufacturing equipment 1, the storage unit 130 may store multiple different task group information corresponding to the multiple task groups.

[0045] Furthermore, information indicating the order of operations in the operation group (order information) is added to the operation group information linked to each command key 131. In the example of Fig. 4, the numbers added to the names of the operation groups indicate the order of operations in the replacement work of the polishing pad 22 (i.e., the order in which the command key 131 should be selected by the user in the operation group).

[0046] The above-described command keys 131 and the information associated therewith may be input and stored in advance in semiconductor manufacturing apparatus 1 by a user operating operation panel 110. As will be described later, task group information may be stored (saved) in memory unit 130 by storage unit 124 (described later).

[0047] The storage unit 130 according to this embodiment (see FIG. 3) stores operation history information 132 and prediction information 133 in addition to the command keys 131 described above. The operation history information 132 is information indicating a history of operations of the operation panel 110 by the user. The operation history information 132 includes information indicating the operation order (selection order) of the command keys 131 by the user in the task group. The prediction information 133 is information used for prediction by the prediction unit 125, which will be described later. The prediction information 133 will be described in detail later.

[0048] The processing unit 120 is configured using a processor such as a CPU (Central Processing Unit) and a memory (main storage device). When the processor executes a program, the processing unit 120 functions as a device control unit 121, a display control unit 122, a search unit 123, a storage unit 124, and a prediction unit 125. Note that all or part of the functions of the processing unit 120 may be implemented using hardware such as an ASIC (Application Specific Integrated Circuit), a PLD (Programmable Logic Device), or an FPGA (Field Programmable Gate Array). The above program may be recorded on a computer-readable recording medium. Examples of computer-readable recording media include portable media such as a flexible disk, a magneto-optical disk, a ROM, a CD-ROM, and a semiconductor storage device (e.g., a solid-state drive (SSD)), as well as storage devices such as a hard disk or semiconductor storage device built into a computer system. The above program may be transmitted via a telecommunications line.

[0049] The equipment control unit 121 controls the semiconductor manufacturing equipment 1 based on instruction information output from the operation panel 110. That is, the equipment control unit 121 controls the semiconductor manufacturing equipment 1 so that the semiconductor manufacturing equipment 1 performs an operation corresponding to the instruction key 131 selected by the user.

[0050] Search unit 123 searches for and extracts command keys 131 related to (corresponding to) the search character information from storage unit 130, based on the search character information output from operation panel 110. Here, the search character information and narrowing-down display 111 will be described in detail.

[0051] FIG. 5 is a diagram showing an example of a screen displayed on operation panel 110 according to this embodiment. The search character information is character information used by search unit 123 to search for command key 131. Narrowing-down display 111 is a display that accepts input of search character information by the user. As shown in each of FIGS. 5(a) to 5(c), operation panel 110 according to this embodiment displays two narrowing-down displays 111A and 111B.

[0052] The narrowing-down display 111A corresponds to the first module information, second module information, and task group information described above. That is, the narrowing-down display 111A accepts input of the first module information, second module information, or task group information by the user. In the illustrated example, the narrowing-down display 111A is a so-called pull-down display. That is, the narrowing-down display 111A displays information that the user can select in the form of a list. In such a narrowing-down display 111A, the information selected by the user from the list corresponds to the search character information.

[0053] Narrowing-down display 111B corresponds to the third module information described above. That is, narrowing-down display 111B accepts input of third module information by the user. In the illustrated example, narrowing-down display 111B is a so-called free input field that accepts free input of characters by the user. In such narrowing-down display 111B, the characters freely input by the user correspond to search character information.

[0054] Operation panel 110 according to the present embodiment outputs search character information input into narrowing-down display 111A, 111B to processing unit 120 (search unit 123). Based on the search character information output from operation panel 110, search unit 123 searches for and extracts command keys 131 related to (corresponding to) the search character information from storage unit 130. More specifically, search unit 123 searches for and extracts command keys 131 linked to information (first module information to third module information and task group information) that matches or is similar to the search character information. When the search character information input into narrowing-down display 111 (111A) is task group information, search unit 123 extracts command keys 131 related to (corresponding to) the search character information together with the above-described order information. When search character information is not input in narrowing-down display 111A, 111B, search unit 123 may extract all command keys 131 stored in storage unit 130. Alternatively, when search character information is not input in narrowing-down display 111B, search unit 123 may be configured to extract a predetermined command key 131 from command keys 131 stored in storage unit 130.

[0055] The display control unit 122 controls the display of information by the operation panel 110. For example, the display control unit 122 causes the operation panel 110 to display the command keys 131 extracted by the search unit 123 in a state selectable by the user. When the search character information input into the narrowing-down display 111 (111A) is task group information, the display control unit 122 causes the operation panel 110 to display the extracted command keys 131 (i.e., the command keys 131 included in the corresponding task group) in an order based on the order information extracted by the search unit 123. The display control unit 122 also causes the operation panel 110 to display the narrowing-down display 111 described above.

[0056] FIG. 5(a) is a diagram showing a screen displayed by the operation panel 110 when the search character information "Polisher" is entered in the narrowing-down display 111A. In the example shown in FIG. 5(a), second module information and third module information are displayed together with the command keys 131 (the same applies to FIGS. 5(b) and 5(c)). FIG. 5(b) is a diagram showing a screen displayed by the operation panel 110 when the search character information "Topring" is entered in the narrowing-down display 111A and the search character information "Up / Down" is entered in the narrowing-down display 111B. As shown in FIG. 5(b), in this embodiment, the operation panel 110 displays only the command keys 131 extracted (filtered) based on the search character information entered by the user. This reduces the time required for the user to find the desired command key 131. Furthermore, because command keys 131 other than the command keys 131 extracted based on the search character information are not displayed, the possibility of an erroneous operation is reduced.

[0057] FIG. 5(c) is a diagram showing a screen displayed by the operation panel 110 when the search character information "Pad exchange" is entered in the narrowing-down display 111A. Here, the search character information "Pad exchange" is a character indicating a task group (specifically, a task group related to replacing the polishing pad 22). In this case, the extracted command keys 131 are displayed on the operation panel 110 in the order based on the order information by the above-described operations of the search unit 123 and the display control unit 122. In the example of FIG. 5(c), the extracted four command keys 131 are displayed aligned in one direction (vertically in the illustrated example) based on the order information. As a result, the command keys required for the task group (e.g., routine tasks) specified by the user are displayed in the order of operation. Therefore, even a user who is unfamiliar with operating the operation panel 110 can improve the work speed and reduce the possibility of operational errors when performing the task group.

[0058] The saving unit 124 (see FIG. 3) saves in the memory unit 130 a plurality of command keys 131 (command key group) selected by the user in a task group of the semiconductor manufacturing equipment 1, linked to the order of selection by the user. For example, the saving unit 124 may store new task group information and new order information linked to the command keys 131 corresponding to the task group, based on the operation history information 132 stored in the memory unit 130. As a result, the command keys 131 (command key group) corresponding to the new task group are stored (saved) in the memory unit 130, linked to the task group information and order information.

[0059] Whether or not to associate such task group information and order information with command keys 131 may be determined based on a user instruction. For example, when the user has finished performing a series of tasks (task group), the display control unit 122 may cause the operation panel 110 to display a message asking whether or not to register the task group in the storage unit 130. When the user inputs an instruction to register the task group into the operation panel 110, the storage unit 124 may generate new task group information and order information based on the command keys 131 selected by the user for the task group and the order in which they were selected. The generated task group information and order information may then be newly associated with the command keys 131 corresponding to the task group and stored.

[0060] The prediction unit 125 predicts at least one command key 131 (predicted command key) that the user should select next, based on predetermined input information and prediction information 133. The "predetermined input information" includes at least information on the command key 131 selected by the user (e.g., operation history information 132). The input information may further include information indicating the operating state of the semiconductor manufacturing equipment 1, abnormality information indicating the location where an abnormality (alarm) has occurred in the semiconductor manufacturing equipment 1, and the like.

[0061] The prediction information 133 may be, for example, information indicating a condition for linking input information with a predicted instruction key. That is, the prediction information 133 may be information for outputting a predicted instruction key on a so-called rule basis when input information is input. For example, the prediction information 133 may be information configured to determine whether or not the input information satisfies a predetermined condition and output a predicted instruction key based on the result of the determination.

[0062] Alternatively, the prediction information 133 may be a trained model trained to output a prediction instruction key when input information is input. Specifically, the prediction information 133 may be data indicating parameters, a connection structure, function characteristics, and the like of the trained model used in processing by the prediction unit 125. Such a trained model may be created using pairs of multiple pieces of input information and prediction instruction keys associated with the multiple pieces of input information in a one-to-one correspondence as training data. The trained model may be created by the processing unit 120. That is, the processing unit 120 may have a function as a learning processing unit that trains the trained model. Alternatively, the trained model may be created by a learning device provided separately from the control device 100, and then the created trained model may be stored in the storage unit 130. The specific method for training (machine learning) the trained model is not particularly limited, and for example, a neural network (deep learning) such as CNN or RNN may be used.

[0063] The display control unit 122 may cause the operation panel 110 to display a warning when the user selects a command key 131 different from the predicted command key predicted by the prediction information 133. In other words, the operation panel 110 (display unit) may function as a warning unit that issues a warning when the user selects a command key 131 different from the predicted command key predicted by the prediction information 133.

[0064] The processing unit 120 may be configured to restrict control of the semiconductor manufacturing equipment 1 by the equipment control unit 121 based on the instruction key 131 selected by the user when the user selects an instruction key 131 different from the predicted instruction key. In this case, the warning displayed by the operation panel 110 may include a message asking whether or not it is OK to control the semiconductor manufacturing equipment 1 based on the instruction key 131 selected by the user. Then, when the user inputs an instruction to the operation panel 110 that it is OK to control the semiconductor manufacturing equipment 1 based on the instruction key 131 selected by the user, the restriction may be lifted.

[0065] <Summary> As described above, the control device 100 (display device) according to this embodiment includes a storage unit 130 that stores a plurality of command keys 131 for causing the semiconductor manufacturing device 1 to perform different operations; a search unit 123 that searches for and extracts command keys 131 associated with characters entered by a user from the storage unit 130 based on the characters; and an operation panel 110 (display device) that displays the command keys 131 extracted by the search unit 123 in a manner that allows the user to select them. This configuration can shorten the time it takes for the user to find the desired command key 131. Furthermore, because command keys 131 other than the command keys 131 extracted based on the character information entered by the user are not displayed, the possibility of erroneous operation can be reduced.

[0066] Furthermore, the plurality of instruction keys 131 includes an instruction key group corresponding to a series of operations (task group) performed in semiconductor manufacturing equipment 1, and when the character input by the user is a character indicating the task group, operation panel 110 displays the instruction keys 131 included in the instruction key group in an order based on the order of the task group. With this configuration, even a user who is unfamiliar with operating operation panel 110 can improve the work speed and reduce the possibility of operating erroneously when performing a task group.

[0067] The control device 100 according to this embodiment further includes a storage unit 124 that stores the command keys selected by the user in the task group in association with the order of selection by the user in the storage unit 130. This configuration makes it possible to improve the usability of the task group-based narrowing function in accordance with the needs of the user.

[0068] The control device 100 according to this embodiment further includes a prediction unit 125 that predicts the command key 131 (predicted command key) that the user should select next based on information (input information) of the command key 131 selected by the user, and a warning unit (operation panel 110) that issues a warning when the user selects a command key 131 that is different from the predicted command key predicted by the prediction unit 125. This configuration can improve the safety of control of the semiconductor manufacturing device 1 using the control device 100.

[0069] Furthermore, the prediction unit 125 may predict a predicted instruction key by inputting the input information into a trained model, and the trained model may be trained to output a predicted instruction key when the input information is input. This configuration can further improve the prediction accuracy of the prediction unit 125. A configuration in which the input information further includes information indicating the operating state of the semiconductor manufacturing equipment 1 and abnormality information indicating the location where an abnormality (alarm) has occurred in the semiconductor manufacturing equipment 1 is preferable in that it can output an appropriate predicted instruction key based on the actual operating status of the semiconductor manufacturing equipment 1. A configuration in which the control device 100 includes a learning processing unit that learns such a trained model is preferable in that it can optimize the output of the predicted instruction key for each user of the control device 100.

[0070] <Modification> The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0071] For example, in the above embodiment, the operation panel 110 is a touch panel that serves as an input unit, an output unit, and a display unit, but the configurations of the input unit, output unit, and display unit are not limited to this and can be changed as appropriate. For example, the control device 100 may include an existing input device such as a keyboard, a pointing device (mouse, tablet, etc.), or a button as the input unit. The input unit may be configured using a microphone and a voice recognition device. In this case, the input unit acquires an acoustic signal generated by a user's speech, performs voice recognition on the words spoken by the user, and inputs character string information of the recognition result to the control device 100. The voice recognition process may be performed by the processing unit 120. The input unit may be configured in any way as long as it is capable of inputting user instructions to the control device 100. The control device 100 may also have an image display device such as a liquid crystal display or an organic EL (Electro Luminescence) display as an output unit. The input unit and the image display device as an output unit may cooperate to function as a display unit that displays the instruction keys 131 in a selectable state. The control device 100 may also have an audio output device (such as a speaker) that outputs sound as an output unit. In this case, the audio output device may function as the warning unit described above. That is, when the user selects an instruction key 131 that is different from the predicted instruction key predicted by the prediction information 133, the audio output device may issue a warning sound.

[0072] Furthermore, in the above embodiment, a warning is issued when the user selects a command key 131 that is different from the predicted command key predicted by the prediction unit 125. However, the use of the prediction unit 125 (predicted command key) is not limited to this. For example, the operation panel 110 (display unit) may be configured to display the predicted command key. For example, the operation panel 110 (display unit) may display the predicted command key separately from the command key 131 extracted based on the search character information input to the narrowing-down display 111. Alternatively, the operation panel 110 (display unit) may display only the command keys 131 that match the predicted command key, among the command keys 131 extracted based on the search character information input to the narrowing-down display 111.

[0073] Furthermore, processing unit 120 may not have the functions of saving unit 124 and / or prediction unit 125. In this case, storage unit 130 may not store operation history information 132 and / or prediction information 133.

[0074] Furthermore, although operation panel 110 according to the embodiment displays both narrowing-down display 111A, which is a pull-down display, and narrowing-down display 111B, which is a free input field, the configuration of narrowing-down display 111 can be changed as appropriate. For example, narrowing-down display 111 may include at least one of a pull-down display and a free input field.

[0075] Furthermore, it is possible to appropriately change the information linked to the instruction keys 131. Similarly, it is possible to appropriately change the search character information that can be input to the narrowing down display 111.

[0076] Furthermore, the control device 100 (display device) may be implemented using a plurality of information processing devices communicably connected via a network. The network may be a network using wireless communication or a network using wired communication. The network may be configured using, for example, the Internet or a local area network (LAN). The network may be configured by combining a plurality of networks. For example, the control device 100 may be implemented using a device such as a cloud. For example, in the control device 100, the processing unit 120 and the storage unit 130 may be implemented in different information processing devices. For example, the storage unit 130 of the control device 100 may be distributed and implemented in a plurality of information processing devices.

[0077] Furthermore, in the above embodiment, the semiconductor manufacturing apparatus 1 is a chemical mechanical polishing apparatus, but the semiconductor manufacturing apparatus 1 may be a semiconductor manufacturing apparatus (substrate processing apparatus) other than a chemical mechanical apparatus. Furthermore, in the above embodiment, the control device 100 (display device) used with the semiconductor manufacturing apparatus 1 is described, but the display device can also be applied to apparatuses other than semiconductor manufacturing apparatuses. For example, the display device may be used in a manufacturing apparatus for manufacturing an article, a processing apparatus for processing an article, or an inspection apparatus for inspecting an article. Furthermore, the display device may be used in a copy machine, which is an example of an image forming apparatus. The content of the command keys 131 displayed on the display device may correspond to the operation performed by the apparatus to which the display device is applied. The above-described apparatus is merely an example. The apparatus to which the display device is applied can be changed as appropriate, as long as it is operated by a user operating the command keys 131 displayed on the display device.

[0078] In addition, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate, without departing from the spirit of the present invention. [Explanation of symbols]

[0079] 1...Semiconductor manufacturing equipment 100...Control device (display device) 110...Operation panel (display unit, warning unit) 123...Search unit 124...Storage unit 125...Prediction unit 131...Instruction key 133...Prediction information (trained model)

Claims

1. a storage unit that stores a plurality of instruction keys for causing the semiconductor manufacturing equipment to perform different operations; a search unit that searches the storage unit for and extracts the command key associated with a character input by a user based on the character; a display unit that displays the instruction keys extracted by the search unit in a state that allows the user to select the instruction keys. Display device.

2. the plurality of command keys include a group of command keys corresponding to a series of operations performed in the semiconductor manufacturing equipment, When the characters input by the user are characters indicating the series of actions, the display unit displays the command keys included in the command key group in an order based on the order of the series of actions. The display device according to claim 1 .

3. a storage unit that stores a group of command keys selected by a user in a series of operations performed in the semiconductor manufacturing equipment in the storage unit in association with the order of selection by the user; 3. The display device according to claim 1 or 2.

4. a prediction unit that predicts the instruction key that the user should select next based on information about the instruction key selected by the user, the display unit displays the instruction key predicted by the prediction unit. The display device according to claim 1 .

5. a prediction unit that predicts the instruction key that the user should select next based on information about the instruction key selected by the user; a warning unit that issues a warning when the user selects the command key different from the command key predicted by the prediction unit. The display device according to claim 1 .

6. the prediction unit predicts the instruction key to be selected next by the user by inputting information of the instruction key selected by the user into a trained model; The trained model is trained to output the instruction key to be selected next by the user when information of the instruction key selected by the user is input. The display device according to claim 4 or 5.

7. the semiconductor manufacturing equipment; The display device according to claim 1 or 2, Semiconductor manufacturing systems.

8. a storage unit for storing a plurality of command keys for causing the device to perform different operations; a search unit that searches the storage unit for and extracts the command key associated with a character input by a user based on the character; a display unit that displays the instruction keys extracted by the search unit in a state that allows the user to select the instruction keys. Display device.

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