Organic light-emitting device and method for manufacturing the same

Abstract

To provide an organic light-emitting device having a plurality of pixels, in which a leakage current between adjacent pixels is suppressed and light-emitting characteristics are improved.SOLUTION: The insulating layer 15 that electrically insulates the plurality of first electrodes 14 has a three layer structure, and the first insulating layer 15a, the third insulating layer 15c, and the second insulating layer 15b are formed of different materials, and the angle θ 1 of the side S1 of the first insulating layer 15a with respect to the lower surfaces of the first electrodes 14 and the angle θ 3 of the side S3 of the third insulating layer 15c with respect to the lower surfaces of the first electrodes 14 are both greater than the angle θ 2 of the side 15b of the second insulating layer S2 with respect to the lower surfaces of the first electrodes 14.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an organic light-emitting device and a method for manufacturing the same. [Background technology]

[0002] In recent years, display devices using organic electroluminescence elements (hereinafter referred to as "organic EL elements") as electroluminescence elements have become known. Organic EL elements generally have a structure in which pixel regions are electrically separated by an insulating layer formed of an insulating material, allowing each pixel to be driven to emit light independently. However, as the pixel density of display devices using organic EL elements increases, the problem of leakage current through the organic layer shared between adjacent pixels has become apparent. Leakage current between adjacent pixels can cause light emission in pixels that are not intended to emit light, contributing to color mixing and reduced light-emitting characteristics such as luminous efficiency. As a means to address this issue, Patent Document 1 discloses a structure in an organic EL element in which a groove is disposed outside the element opening on the anode to reduce leakage current between adjacent pixels. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-164291 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 does not consider the side shape of the insulating layer. Therefore, depending on the side shape of the insulating layer, there is a possibility that the suppression of leakage current between adjacent pixels may be insufficient. If leakage current occurs, light emission may occur in pixels that are not intended to emit light, resulting in a deterioration of light-emitting characteristics. An object of the present invention is to suppress, for example, leakage current between adjacent pixels and improve light-emitting characteristics. [Means for solving the problem]

[0005] An organic light-emitting device according to one embodiment of the present disclosure includes a substrate, a first electrode disposed on the substrate, and an insulating layer disposed on the substrate, the insulating layer having an opening above the first electrode and covering the outer periphery of the first electrode; an organic compound layer covering the first electrode and the insulating layer; a second electrode disposed on the organic compound layer, the insulating layer includes, from the substrate side, a first insulating layer, a second insulating layer, and a third insulating layer; the second insulating layer is made of a material different from both the first insulating layer and the third insulating layer; a side surface S1 of the first insulating layer, a side surface S2 of the second insulating layer, and a side surface S3 of the third insulating layer, which form the opening of the insulating layer, are all in contact with the organic compound layer; The angle θ1 of the side surface S1 of the first insulating layer relative to the lower surface of the first electrode and the angle θ3 of the side surface S3 of the third insulating layer relative to the lower surface of the first electrode are both larger than the angle θ2 of the side surface S2 of the second insulating layer relative to the lower surface of the first electrode. A method for manufacturing an organic light-emitting device according to another aspect of the present disclosure includes forming a first insulating film, a second insulating film, and a third insulating film in this order on a substrate on which a first electrode is disposed; etching the third insulating film, the second insulating film, and the first insulating film to form a third insulating layer, a second insulating layer, and a first insulating layer; and In the step of etching the first insulating film, the first electrode is exposed, In the etching steps of the third insulating film, the second insulating film, and the first insulating film, the etching rate of the second insulating film is slower than the etching rate of the third insulating film. [Effects of the Invention]

[0006] According to the present disclosure, an organic light-emitting device is provided in which leakage current between adjacent pixels is suppressed and which has better light-emitting properties. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view of an organic light-emitting device according to an embodiment of the present invention; [Figure 2] FIG. 2 is a plan view schematically illustrating the organic light-emitting device of FIG. [Figure 3] 2 is a partial enlarged view of an insulating layer of the organic light-emitting device of FIG. 1. [Figure 4] 2A to 2C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 5] 2A to 2C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 6] 2A to 2C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 7] 2A to 2C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 8] 2A to 2C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 9] FIG. 10 is a cross-sectional view schematically illustrating a side surface of an insulating layer of an organic light-emitting device according to another embodiment. [Figure 10] 10A to 10C are diagrams illustrating a manufacturing process of the organic light-emitting device of FIG. [Figure 11] FIG. 1 is a schematic diagram illustrating an example of a display device according to an embodiment. [Figure 12] 1A is a schematic diagram illustrating an example of an imaging device according to an embodiment, and FIG. 1B is a schematic diagram illustrating an example of an electronic device according to an embodiment. [Figure 13] 1A is a schematic diagram illustrating an example of a display device according to an embodiment, and FIG. 1B is a schematic diagram illustrating an example of a foldable display device. [Figure 14] FIG. 1 is a schematic diagram illustrating an example of a lighting device according to an embodiment. [Figure 15] 1A and 1B are schematic diagrams showing an example of an automobile having a vehicle lamp according to an embodiment of the present invention; [Figure 16]1A is a schematic diagram illustrating an example of a wearable device according to an embodiment, and FIG. 1B is a schematic diagram illustrating an example of a wearable device according to an embodiment, the example having an imaging device. [Figure 17] 1A is a schematic diagram illustrating an example of an image forming apparatus according to an embodiment, FIG. 1B is a schematic diagram illustrating an example of an exposure light source of an image forming apparatus according to an embodiment, and FIG. 1C is a schematic diagram illustrating an example of an exposure light source of an image forming apparatus according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] One aspect of this embodiment is characterized in that, in an organic light-emitting device having a plurality of pixels, the insulating layer that insulates and separates the pixels is made to have a three-layer structure, and on the side surface that forms the opening on the first electrode, the inclination angle of the central insulating layer is made lower than the inclination angles of the lower and upper insulating layers, thereby suppressing leakage current between pixels. Hereinafter, the organic light-emitting device of the present embodiment and the manufacturing method thereof will be described with reference to the following embodiments.

[0009] FIG. 1 is a cross-sectional view of an organic light-emitting device according to one aspect of the present embodiment, taken along the thickness direction of a substrate. A drive circuit layer 11 is provided on a substrate 10, and a planarized first planarization layer 12 made of an insulating material is provided on the substrate 10. An organic EL element is provided on the first planarization layer 12. The organic EL element has a configuration in which a first electrode 14 as an anode, an insulating layer 15, an organic compound layer 16, and a second electrode 17 as a cathode are laminated in this order.

[0010] FIG. 2 shows an example of a plan view of the display device according to this embodiment. FIG. 1 corresponds to a schematic cross-sectional view of the B-B' portion in FIG. 2. To clarify the positional relationship, only the conductive plug 13, the first electrode 14, and the opening 30 in the insulating layer 15 are shown, and the rest are omitted. The first electrode 14 may be circular when viewed from above. The opening 30 may also be polygonal, such as a hexagon. FIG. 3 shows an enlarged view of the area A surrounded by the dashed line in FIG. 1.

[0011] In this embodiment, the insulating layer 15, which electrically insulates and separates pixels, covers the periphery of the first electrode 14 on the upper surface thereof and is composed of a laminate having, in this order from the substrate side, a first insulating layer 15a, a second insulating layer 15b, and a third insulating layer 15c. The first insulating layer 15a is disposed on the surface of the first planarization layer 12 that is not in contact with the first electrode 14 and on the edge of the first electrode 14. The second insulating layer 15b is disposed, via the first insulating layer 15a, on the surface of the first planarization layer 12 that is not in contact with the first electrode 14 and on the edge of the first electrode 14. The third insulating layer 15c is disposed, via the first insulating layer 15a and the second insulating layer 15b, on the surface of the first planarization layer 12 that is not in contact with the first electrode 14 and on the edge of the first electrode 14.

[0012] The organic compound layer 16 includes a first organic compound layer 16a including at least one of a hole injection layer and a hole transport layer, a second organic compound layer 16b having a light-emitting function, and a third organic compound layer 16c including at least one of an electron injection layer and an electron transport layer. The first organic compound layer 16a is disposed on the first electrode 14 and the insulating layer 15, and the second organic compound layer 16b is disposed on the first electrode 14 and the insulating layer 15 via the first organic compound layer 16a. The third organic compound layer 16c is disposed on the first electrode 14 and the insulating layer 15 via the first organic compound layer 16a and the second organic compound layer 16b. The thickness of each of these organic compound layers can be, for example, 1 nm to 500 nm. The second electrode 17 is disposed on the first electrode 14 and the insulating layer 15 with the organic compound layer 16 interposed therebetween.

[0013] Next, the shapes of the side surfaces of the first insulating layer 15a, the second insulating layer 15b, and the third insulating layer 15c will be described. 3, first insulating layer 15a has a side surface S1, second insulating layer 15b has a side surface S2, and third insulating layer 15c has a side surface S3 in opening 30. An angle θ1 of side surface S1 of first insulating layer 15a relative to the lower surface of first electrode 14 is larger than an angle θ2 of side surface S2 of second insulating layer 15b relative to the lower surface of first electrode 14, and an angle θ3 of side surface S3 of third insulating layer 15c relative to the lower surface of first electrode 14 is larger than angle θ2 (θ1>θ2, θ3>θ2).

[0014] That is, by making the side surface S1 of the first insulating layer 15a and the side surface S3 of the third insulating layer 15c steeply inclined, the film thickness of the low-resistance first organic compound layer 16a can be reduced. This makes it possible to suppress leakage current between adjacent pixels. Furthermore, by making the side surfaces S1 and S3 steeply inclined, the aperture ratio of the device can be improved. To achieve these effects, it is desirable that θ1 and θ3 are each greater than 50° and less than 90°.

[0015] On the other hand, since the side surface S2 has a gentler inclination than the side surfaces S1 and S3, it is possible to prevent the organic compound layer 16 from becoming too thin, which would otherwise cause leakage current between the first electrode 14 and the second electrode 17. To achieve this effect, θ2 is preferably greater than 0° and equal to or less than 50°.

[0016] The film thicknesses of the first insulating layer 15a and the third insulating layer 15c are desirably greater than the film thickness of the first organic compound layer 16a. Specifically, the film thicknesses of the first insulating layer 15a and the third insulating layer 15c are desirably greater than 1.4 times the film thickness of the first organic compound layer 16a. This makes it possible to reduce the film thickness of the first organic compound layer 16a provided along the side surface S1 of the first insulating layer 15a and the side surface S3 of the third insulating layer 15c, thereby suppressing leakage current between adjacent pixels.

[0017] The film thickness of the first insulating layer 15a and the third insulating layer 15c is preferably smaller than the film thickness of the organic compound layer 16. This can suppress the occurrence of leakage current between the first electrode 14 and the second electrode 17, which occurs when the film thickness of the organic compound layer 16 provided along the side surface S1 of the first insulating layer 15a and the side surface S3 of the third insulating layer 15c becomes too thin.

[0018] The first organic compound layer 16a may include an organic light-emitting layer and a charge generation layer in addition to at least one of a hole injection layer and a hole transport layer. The charge generation layer can be thinned by the steep slopes of the side surface S1 of the first insulating layer 15a and the side surface S3 of the third insulating layer 15c. The charge generation layer has low resistance, similar to the hole injection layer and hole transport layer, and this increases the resistance, thereby suppressing leakage current between adjacent pixels.

[0019] The first insulating layer 15a and the second insulating layer 15b are made of different materials. The second insulating layer 15b and the third insulating layer 15c are made of different materials. This makes it easier to process the layers by dry etching, maintaining the relationships θ1>θ2 and θ3>θ2, without changing the processing conditions.

[0020] If the first insulating layer 15a, the second insulating layer 15b, and the third insulating layer 15c are all made of the same material, attempting to achieve the relationships θ1>θ2 and θ3>θ2 by dry etching requires changing the etching conditions midway through the process, which can cause particle generation and reduce yield.

[0021] During dry etching, the thickness of the layer removed per unit time is defined as the etching rate. When two-layer stacked films formed on a substrate and patterned by photolithography using materials with different etching rates are continuously etched under certain dry etching conditions, differences in the angles of the sides of the two stacked films relative to the substrate occur. When the etching rate of the lower layer of a two-layer stacked film formed on a substrate is lower than that of the upper layer, the angle of the side of the upper layer relative to the substrate will be greater than the angle of the side of the lower layer relative to the substrate. Conversely, when the etching rate of the lower layer of a two-layer stacked film formed on a substrate is higher than that of the upper layer, the angle of the side of the upper layer relative to the substrate will be smaller than the angle of the side of the lower layer relative to the substrate.

[0022] In this embodiment, when the etching rate of the second insulating layer 15b is smaller than that of the first insulating layer 15a, θ1 is larger than θ2. Furthermore, when the etching rate of the second insulating layer 15b is smaller than that of the third insulating layer 15c, θ3 is larger than θ2. In this manner, when the first insulating layer 15a and the second insulating layer 15b are made of different materials and the second insulating layer 15b and the third insulating layer 15c are made of different materials, it is possible to process the shape of this embodiment without changing the dry etching conditions, and it is possible to suppress a decrease in yield due to particle generation.

[0023] As described above, in this embodiment, it is desirable that the etching rate of the second insulating layer 15b is smaller than the etching rate of the first insulating layer 15a and the third insulating layer 15c. For example, when a hydrogen-free fluorocarbon gas is used as the dry etching gas, a silicon oxide film (SiO x ), and a silicon nitride film (SiN x) can be used. Here, hydrogen-free fluorocarbon gas refers to a fluorocarbon gas that does not contain hydrogen atoms, and examples include tetrafluoromethane (CF4), hexafluoroethane (C2F6), hexafluorobutadiene (C4F6), octafluorocyclobutane (C4F8), and octafluorocyclopentene (C5F8). However, "not containing hydrogen atoms" means that they are not intentionally contained, and does not exclude the case where they are contained in trace amounts in the processing chamber during dry etching. Furthermore, oxygen gas (O2) and argon gas (Ar) or nitrogen gas (N2) may be used as diluent gases during dry etching.

[0024] The first insulating layer 15a and the third insulating layer 15c may be formed of the same material. By doing so, when etching the insulating layer 15 without switching the dry etching conditions, θ1 and θ3 can be processed to the same angle. This allows the film thickness of the first organic compound layer 16a to be reduced to the same extent on the side surface S1 and the side surface S3, effectively suppressing leakage current between adjacent pixels.

[0025] When the first electrode 14 is made of indium tin oxide (ITO), the first insulating layer 15a is made of a silicon oxide film (SiO x It is preferable to use a silicon nitride film (SiN x ) causes roughness on the surface of first insulating layer 15a, which affects the formation of second insulating layer 15b and third insulating layer 15c.

[0026] Next, a method for manufacturing the organic light-emitting device of FIG. 1 will be described with reference to FIGS. First, as shown in FIG. 4(a), transistors, capacitors, and the like of the driving circuits including the pixel driving circuits are formed on the substrate 10 by a known MOS process to form a driving circuit layer 11.

[0027] Next, for example, by using a plasma CVD method, a high density plasma method, or a combination of these manufacturing methods, an oxide film (SiO xAn insulating film such as a silicon dioxide film (SiON) or an oxynitride film (SiON) is deposited to form the first planarization layer 12. After the first planarization layer 12 is deposited, the surface including the pixel region may be planarized by a CMP method.

[0028] Next, photolithography and dry etching are used to form a plurality of openings at predetermined positions in the first planarization layer 12. For example, tungsten (W) is placed in each opening, and excess portions are removed by CMP or etch-back to form conductive plugs 13 made of a conductive material (tungsten).

[0029] 4(b), a laminated metal film made of titanium (Ti), titanium nitride (TiN), an aluminum alloy, and titanium (Ti) is formed by, for example, sputtering on the first planarization layer 12. Next, this laminated metal film is patterned into a predetermined shape by photolithography and dry or wet etching to form a plurality of first electrodes 14 connected to the aforementioned conductive plugs 13 in the display area.

[0030] Next, as shown in FIG. 5, an oxide film (SiO x ), silicon nitride film (SIN x The first insulating film 25a, the second insulating film 25b, and the third insulating film 25c are laminated using an insulating material such as SiO 2. The thickness of each insulating layer can be set to, for example, 1 nm to 500 nm.

[0031] The method for forming the first insulating film 25a, the second insulating film 25b, and the third insulating film 25c is not limited to the above, and any known method for forming an insulating layer can be applied. For example, other manufacturing methods than those described above include high density plasma CVD, ALD, and sputtering, and the coating material may be selected from spin coating and slit coating methods.

[0032] Next, the third insulating film 25c, the second insulating film 25b, and the first insulating film 25a are patterned into a predetermined shape by photolithography and dry etching to form an opening 30 corresponding to the first electrode 14. As a result, the insulating layer 15 including the first insulating layer 15a, the second insulating layer 15b, and the third insulating layer 15c is formed, as shown in FIG. 6. At this time, the dry etching process is performed so as to satisfy the above-mentioned relationships θ1>θ2 and θ3>θ2. At the same time, an opening is also formed (not shown) for connecting the second electrode 17, which will be formed in a later process, to the same metal layer as the first electrode 14.

[0033] Next, by washing, foreign matter on the substrate (first electrode 14, insulating layer 15) is removed before the next step of forming the organic compound layer 16. After such a washing step, a dehydration treatment is carried out to remove moisture from the substrate surface.

[0034] 7, organic layers having lower resistance than the light-emitting layer, such as a hole injection layer and a hole transport layer, an emitting layer, and an electron transport layer are sequentially deposited by, for example, vacuum deposition to form an organic compound layer 16. Examples of vacuum deposition methods that can be used include rotary deposition, linear deposition, and transfer deposition. The organic compound layer 16 may also be a hole injection layer, a hole transport layer, an emitting layer, a charge generation layer, an emitting layer, and an electron transport layer.

[0035] Next, as shown in FIG. 8, the second electrode 17 is formed by vacuum deposition without subsequently exposing the substrate from the reduced pressure atmosphere to the atmosphere.

[0036] Furthermore, the moisture-proof layer 18, the second planarization layer 19, and the color filter layer 20 are formed to cover the second electrode 17 by, for example, plasma CVD, sputtering, ALD, or a combination thereof, to obtain the organic light-emitting device shown in FIG. 1. The deposition temperature for the moisture-proof layer 18 is preferably below the decomposition temperature of the organic material constituting the organic compound layer 16, for example, 120°C or below. The color filter layer 20 is formed by, for example, applying a red filter material onto the second planarization layer 19 and patterning it by photolithography to form a red filter. Subsequently, green and blue filters are sequentially formed in the same manner as the red filter. The second planarization layer 19 is a transparent member that is provided between the color filter layer 20 and the moisture-proof layer 18 as needed to improve their mutual adhesion. Finally, a pad portion (not shown) for leading out a terminal in the display device is formed by patterning into a predetermined shape using photolithography and dry etching.

[0037] In this embodiment, as shown in FIG. 9 , in a plan view of the lower surface of the first electrode 14, the third insulating layer 15c preferably has a groove 40 surrounding the opening 30 of the insulating layer 15 on the first electrode 14. The second insulating layer 15b is exposed in the groove 40, and the first organic compound layer 16a disposed on the groove 40 has a locally thin portion or a discontinuous portion within the groove 40. The embodiment shown in FIG. 9 illustrates a case in which the first organic compound layer 16a is discontinuous at the bottom of the groove 40. By having the locally thin or discontinuous portion of the first organic compound layer 16a in this manner, the resistance of the first organic compound layer 16a can be increased, and leakage current that propagates from the first electrode 14 through the first organic compound layer 16a and flows between adjacent pixels can be reduced or prevented.

[0038] In order to increase the resistance of the first organic compound layer 16a and reduce leakage current, the aspect ratio of the groove 40 is preferably 0.3 or greater, and more preferably 1.0 or greater. The aspect ratio of the groove 40 refers to the ratio (D1 / L1) of the depth D1 of the groove 40 in the stacking direction to the length L1 of the groove 40 in the direction perpendicular to the stacking direction. As will be described later, when the second insulating layer 15b is used as an etching stopper film when the groove 40 is formed, the depth D1 of the groove 40 is the film thickness of the second insulating layer 15b. Furthermore, by making the width L1 of the groove 40 larger than the film thickness of the first organic compound layer 16a, the first organic compound layer 16a can be locally thinned or discontinuous, which is preferable.

[0039] In this embodiment, when the groove 40 is processed by dry etching, the second insulating layer 15b can be used as an etching stopper film. As described above, when the etching rate of the second insulating layer 15b is smaller than that of the third insulating layer 15c, the relationship that θ3 is larger than θ2 can be achieved by processing under the same dry etching conditions. In addition, when such a combination of insulating layers having different etching rates is used, the second insulating layer 15b can also be used as an etching stopper film when forming the groove 40, thereby reducing variations in the depth of the groove 40.

[0040] The first organic compound layer 16a may include an organic light-emitting layer and a charge generation layer in addition to at least one of a hole injection layer and a hole transport layer. The charge generation layer has large θ1 and θ3 and steeply inclined side surfaces S1 and S3, which allows the film thickness thereof to be thin, and also allows the film thickness thereof to be thin in the groove portion 40. The charge generation layer has low resistance, similar to the hole injection layer and hole transport layer, and this increases the resistance, thereby suppressing leakage current between adjacent pixels.

[0041] The flow of the method for manufacturing the organic light-emitting device of Fig. 9 will be described. First, as in the organic light-emitting device of Fig. 1, as shown in Fig. 5, an oxide film (SiO x ), silicon nitride film (SiN x The first insulating film 25a, the second insulating film 25b, and the third insulating film 25c are formed using an insulating material such as SiO 2 .

[0042] Next, the third insulating film 25c, the second insulating film 25b, and the first insulating film 25a are patterned into a predetermined shape by photolithography and dry etching to form an opening 30 corresponding to the first electrode 14. As a result, an insulating layer 15 including a first insulating layer 15a, a second insulating layer 15b, and a third insulating layer 15c is formed, as shown in FIG.

[0043] Next, as shown in FIG. 10, the third insulating layer 15c is patterned into a predetermined shape by photolithography and dry etching to form grooves 40. At this time, the second insulating layer 15b made of a material different from that of the third insulating layer 15c can be used as an etching stopper film. When a hydrogen-free fluorocarbon gas is used as the dry etching gas, an oxide film (SiO x ), and a nitride film (SiN x ) is preferable. The etching step of forming the groove 40 in the third insulating layer 15c may at least partially overlap with the step of etching the third insulating film 25c. The subsequent steps are the same as those in the method for manufacturing the organic light-emitting device shown in FIG.

[0044] <Configuration of organic light-emitting device> Other configurations of the organic light-emitting device of this embodiment will be described below. As shown in FIG. 1, an organic light-emitting device typically has an organic EL element composed of a first electrode 14, an organic compound layer 16, and a second electrode 17, and the organic compound layer 16 has at least a light-emitting layer. The organic light-emitting device further has a substrate 10 and a first planarization layer 12. A moisture-proof layer 18, a second planarization layer 19, and a color filter layer 20 may be provided on the second electrode 17, and microlenses (not shown) may also be provided. A third planarization layer may also be provided between the color filter layer 20 and the microlenses (not shown). A preferred configuration of the organic light-emitting device of this embodiment and a device including the organic light-emitting device will be described below.

[0045] [substrate] Examples of the substrate 10 include quartz, glass, a silicon wafer, resin, and metal. As shown in FIG. 1, the substrate 10 is provided with a drive circuit layer 11 including switching elements such as transistors and wiring, and a first planarization layer 12 is provided thereon. Any material can be used for the first planarization layer 12, as long as it allows the formation of conductive plugs 13 and ensures insulation from unconnected wiring. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0046] [electrode] When an electric field is applied in the direction in which the organic light-emitting device emits light, the electrode with the higher potential is the anode, and the other electrode is the cathode. Alternatively, the electrode that supplies holes to the light-emitting layer can be considered an anode, and the electrode that supplies electrons to the light-emitting layer can be considered a cathode. In this embodiment, either the anode or the cathode can be used as the first electrode 14.

[0047] [Organic compound layer] The organic compound layer 16 is composed of, for example, a hole transport layer / light emitting layer / electron transport layer, but it can also be a multilayer film incorporating multiple functional layers such as a hole injection layer or electron injection layer to make it easier to supply holes and electrons to the light emitting layer, a hole blocking layer or electron blocking layer to prevent excessive movement of holes and electrons, and a buffer layer to adjust the movement of holes and electrons from the electrodes, or a single layer film. The organic compound layer 16 is formed as a common layer over a plurality of sub-pixels and a plurality of pixels. A common layer means that it is disposed across a plurality of pixels.

[0048] The organic compound layer 16 can be formed by a dry process such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively, a wet process can be used in which the organic compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.). Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining with an appropriate binder resin.

[0049] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0050] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, if necessary.

[0051] [Moisture-proof layer] The moisture-proof layer 18 can be formed by adhering glass with a moisture absorbent on the second electrode 17, thereby reducing the penetration of water and other contaminants into the organic compound layer 16 and reducing the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the second electrode 17 to reduce the penetration of water and other contaminants into the organic compound layer 16. For example, the moisture-proof layer 18 may be formed by transporting the second electrode 17 to another chamber without breaking the vacuum after formation and forming a 2 μm-thick silicon nitride film by CVD. The moisture-proof layer 18 may also be formed using atomic layer deposition (ALD) after the CVD film formation. The material of the film formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed on the film formed by ALD by CVD. The film formed by ALD may have a smaller thickness than the film formed by CVD. Specifically, it may be 50% or less, or even 10% or less.

[0052] [Second planarization layer] A second planarization layer 19 may be provided between the color filter layer 20 and the moisture-proof layer 18. The second planarization layer 19 is provided for the purpose of reducing unevenness of the underlying layer. It may also be called a material resin layer without limiting its purpose. The second planarization layer 19 may be composed of an organic compound, and may be either a low molecular weight or a high molecular weight, but is preferably a high molecular weight. The second planarization layer 19 may be provided above or below the color filter layer 20, and may be made of the same or different materials. Specific examples include polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0053] [Color filter layer] The color filter layer 20 can be formed on the moisture-proof layer 18, or on a second planarization layer 19 provided on the moisture-proof layer 18. Alternatively, a color filter taking into consideration the size of the organic light-emitting device may be provided on a separate substrate and then bonded to the substrate on which the organic light-emitting device is provided, or the color filter may be made of a polymer.

[0054] [Microlens] The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0055] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0056] [Counter substrate] An opposing substrate may be provided on the color filter layer 20 or on the planarization layer on the color filter layer 20. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate 10. The constituent material of the opposing substrate may be the same as that of the substrate 10.

[0057] [Drive circuit layer] The organic light-emitting device has a drive circuit layer 11. The drive circuit layer 11 may be a drive circuit layer for an active matrix display device that independently controls the emission of a plurality of organic EL elements. The active matrix circuit may be voltage-programmed or current-programmed. The drive circuit layer 11 has transistors that drive the organic EL elements, and a pixel circuit for each pixel. Specifically, the pixel circuit has a transistor that controls the emission brightness of the organic EL element. The pixel circuit may also have one or more of a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0058] The organic light-emitting device has a display area and a peripheral area arranged around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of a transistor constituting the pixel circuit may be smaller than the mobility of a transistor constituting the display control circuit. The slope of the current-voltage characteristics of the transistor constituting the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistor constituting the display control circuit. The slope of the current-voltage characteristics can be measured by the so-called Vg-Ig characteristics. The transistor constituting the pixel circuit is a transistor connected to an organic EL element.

[0059] [Pixels] The organic light emitting device may have a plurality of pixels, each of which has sub-pixels that emit different colors, and each of which may emit, for example, RGB colors. A pixel has an area, also called a pixel aperture, from which light is emitted. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc. The distance between subpixels may be 10 μm or less, more specifically, it may be 8 μm, 7.4 μm, or 6.4 μm.

[0060] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0061] <Applications of organic light-emitting devices> The organic light-emitting device of this embodiment can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, or a light-emitting device having a white light source and a color filter.

[0062] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit that processes the input information, and displays the input image on a display unit. The display device may have a plurality of pixels, at least one of which has the organic light-emitting device according to this embodiment and a transistor connected to the organic light-emitting device.

[0063] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0064] Next, the display device according to this embodiment will be described with reference to the drawings. 11 is a schematic diagram showing an example of a display device according to this embodiment. The display device 1000 has a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0065] The display device according to this embodiment may have color filters having red, green, and blue colors, and the red, green, and blue colors may be arranged in a delta configuration in the color filters.

[0066] The display device according to the present embodiment is used as a display unit of a mobile terminal. In this case, the display device may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0067] The display device according to this embodiment is used in a display unit of an imaging device having an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit located within the viewfinder. The imaging device may be a digital camera or a digital video camera.

[0068] 12(a) is a schematic diagram showing an example of an imaging device according to this embodiment. The imaging device 1100 has a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 has a display device according to this embodiment. In this case, the display device may display not only the captured image but also environmental information, imaging instructions, etc. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, etc.

[0069] Since the optimum timing for capturing an image is very short, it is better to display information as soon as possible. Therefore, it is preferable to use a display device using the organic light-emitting device according to this embodiment. This is because the organic light-emitting device has a fast response speed. A display device using an organic light-emitting device can be used more preferably than a liquid crystal display device, which requires a high display speed.

[0070] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be called a photoelectric conversion device. Instead of sequentially capturing images, the photoelectric conversion device can include an imaging method that detects the difference from the previous image, or a method of cutting out an image from a constantly recorded image, etc.

[0071] FIG. 12(b) is a schematic diagram showing an example of an electronic device according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a laptop computer.

[0072] FIG. 13 is a schematic diagram illustrating an example of a display device according to this embodiment. FIG. 13(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 includes a frame 1301 and a display unit 1302. The display unit 1302 uses the organic light-emitting device according to this embodiment. The display device 1300 includes the frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 13(a). The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0073] FIG. 13(b) is a schematic diagram illustrating another example of a display device according to this embodiment. The display device 1310 in FIG. 13(b) is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 each have an organic light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single, seamless display unit. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may display a single image.

[0074] FIG. 14 is a schematic diagram illustrating an example of a lighting device according to this embodiment. The lighting device 1400 includes a housing 1401, a light source 1402, a circuit board 1403, an optical filter 1404, and a light diffusion unit 1405. The light source 1402 includes an organic light-emitting device according to this embodiment. The optical filter 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source 1402, such as for illumination, and deliver the light over a wide area. The optical filter 1404 and the light diffusion unit 1405 may be provided on the light output side of the lighting device. If necessary, a cover may be provided on the outermost surface.

[0075] The lighting device is, for example, a device that illuminates a room. The lighting device may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit that dims these colors. The lighting device has an organic light-emitting device according to this embodiment and a power supply circuit connected to it. The power supply circuit is a circuit that converts AC voltage into DC voltage. Furthermore, white has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device may have a color filter. The lighting device according to this embodiment may also include a heat dissipation unit, which dissipates heat from within the device to the outside, and may be made of a material such as metal or liquid silicone with a high specific heat.

[0076] Fig. 15(a) is a schematic diagram of an automobile, which is an example of a moving body according to this embodiment. As shown in Fig. 15(a), the automobile has tail lamps, which are an example of lighting fixtures. The automobile 1500 may have tail lamps 1501, and may be configured to turn on the tail lamps when braking or the like is performed. A tail lamp 1501 includes an organic light-emitting device according to this embodiment. The tail lamp 1501 may include a protective member for protecting the organic light-emitting device. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but it is preferable that the protective member be made of polycarbonate or the like. Polycarbonate may also be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0077] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window 1502 may be a transparent display, as long as it is not a window for checking the front and rear of the automobile. The transparent display has an organic light-emitting device according to this embodiment. In this case, the constituent materials of the electrodes and the like of the organic light-emitting device are made of transparent materials.

[0078] 15(b), the automobile 1500 includes a steering wheel 1504 for controlling the direction of travel of the vehicle, a display unit 1505 for displaying a map, the position of the vehicle, turning directions, etc., and is mounted on the vehicle body 1503. The display unit 1505 includes the organic light-emitting device according to this embodiment. Here, an example of a moving body is shown in which the moving body is an automobile, but the moving body according to this embodiment may also be a ship, an airplane, a drone, or the like. The moving body has a body, a lighting device, and a display unit provided on the body. The lighting device emits light to indicate the position of the body. Either the lighting device or the display unit has the organic light-emitting device according to this embodiment.

[0079] An application example of the display device of each of the above-described embodiments will be described with reference to Fig. 16. The display device can be applied to a system that can be attached as a wearable device, such as smart glasses, an HMD, or a smart contact lens. The image capturing and display device used in such an application example includes an image capturing device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0080] 16(a) is a schematic diagram of glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a display device according to any of the above-described embodiments is provided on the back side of the lens 1601.

[0081] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0082] FIG. 16(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 in FIG. 16(a) and a display device. A lens 1611 includes an optical system for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the display device, and controls the operation of the imaging device and the display device. The control device 1612 may also include a gaze detection unit for detecting the wearer's gaze. Infrared light may be used for gaze detection. The infrared light emitter emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit with a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. A reduction unit for reducing light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality.

[0083] The user's line of sight with respect to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using an image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used. More specifically, gaze detection processing is performed based on the pupil-corneal reflex method. Using the pupil-corneal reflex method, a gaze vector representing the direction (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image contained in the image of the eyeball, thereby detecting the user's gaze.

[0084] The display device according to this embodiment may include an imaging device having a light receiving element, and may control the display image of the display device based on user line-of-sight information from the imaging device. Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0085] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0086] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI ​​program may be included in the display device, the imaging device, or an external device. If included in an external device, it is transmitted to the display device via communication. When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0087] FIG. 17A is a schematic diagram showing an example of an image forming apparatus according to this embodiment. The image forming apparatus 1700 is an electrophotographic image forming apparatus and includes a photoconductor 1707, an exposure light source 1708, a charging unit 1710, a developing unit 1711, a transfer unit 1712, transport rollers 1713, and a fixing unit 1715. Light 1709 is irradiated from the exposure light source 1708, and an electrostatic latent image is formed on the surface of the photoconductor 1707. This exposure light source 1708 includes an organic light-emitting device according to this embodiment. The developing unit 1711 includes toner and the like. The charging unit 1710 charges the photoconductor 1707. The transfer unit 1712 transfers the developed image to a recording medium 1714. The transport rollers 1713 transport the recording medium 1714. The recording medium 1714 is, for example, paper. The fixing unit 1715 fixes the image formed on the recording medium 1714.

[0088] 17(b) and 17(c) are diagrams showing an exposure light source 1708 and are schematic diagrams illustrating a state in which multiple light-emitting units 1726 are arranged on a long substrate. Arrow 1727 indicates the direction parallel to the axis of the photoconductor, representing the column direction in which the organic light-emitting devices are arranged. This column direction is the same as the axis direction about which the photoconductor 1707 rotates. This direction can also be referred to as the long axis direction of the photoconductor 1707. FIG. 17(b) shows a configuration in which the light-emitting units 1726 are arranged along the long axis of the photoconductor 1707. The light-emitting units 1726 include organic light-emitting devices according to this embodiment. FIG. 17(c) shows a different configuration from FIG. 17(b), in which the light-emitting units 1726 are alternately arranged in the column direction in the first and second columns. The first and second columns are arranged at different positions in the row direction. In the first column, multiple light-emitting units 1726 are arranged at intervals. The second column has light emitting units 1726 at positions corresponding to the spacing between the light emitting units 1726 in the first column. That is, the light emitting units 1726 are also arranged at intervals in the row direction. The arrangement in Figure 17(c) can also be described as, for example, a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0089] As described above, by using the organic light-emitting device according to this embodiment, it is possible to achieve a stable display with good image quality even over a long period of time.

[0090] [Included components] The disclosure of this embodiment includes the following configuration. (Configuration 1) a substrate; and a first electrode disposed on the substrate; an insulating layer disposed on the substrate, the insulating layer having an opening above the first electrode and covering the outer periphery of the first electrode; an organic compound layer covering the first electrode and the insulating layer; a second electrode disposed on the organic compound layer, the insulating layer includes, from the substrate side, a first insulating layer, a second insulating layer, and a third insulating layer; the second insulating layer is made of a material different from both the first insulating layer and the third insulating layer; a side surface S1 of the first insulating layer, a side surface S2 of the second insulating layer, and a side surface S3 of the third insulating layer, which form the opening of the insulating layer, are all in contact with the organic compound layer; The angle θ1 of the side surface S1 of the first insulating layer relative to the lower surface of the first electrode and the angle θ3 of the side surface S3 of the third insulating layer relative to the lower surface of the first electrode are both larger than the angle θ2 of the side surface S2 of the second insulating layer relative to the lower surface of the first electrode. (Configuration 2) 2. The organic light-emitting device according to claim 1, wherein θ1 is greater than 50° and less than 90°. (Configuration 3) 3. The organic light-emitting device according to claim 1, wherein θ2 is greater than 0° and equal to or less than 50°. (Configuration 4) 4. The organic light-emitting device according to any one of configurations 1 to 3, wherein θ3 is greater than 50° and less than 90°. (Configuration 5) 5. The organic light-emitting device according to any one of configurations 1 to 4, wherein the first insulating layer and the third insulating layer are made of the same material. (Configuration 6) 6. The organic light-emitting device of configuration 5, wherein the first and third insulating layers comprise silicon oxide, and the second insulating layer comprises silicon nitride. (Configuration 7) The organic light-emitting device described in any one of structures 1 to 6, characterized in that the third insulating layer has a groove portion surrounding the opening in a planar view relative to the lower surface of the first electrode, and the second insulating layer is exposed in the groove portion. (Configuration 8) 8. The organic light-emitting device according to any one of structures 1 to 7, wherein, when etching is performed using a hydrogen-free fluorocarbon gas, the etching rate of the first insulating layer is higher than the etching rate of the second insulating layer, and the etching rate of the third insulating layer is higher than the etching rate of the second insulating layer. (Configuration 9) forming a first insulating film, a second insulating film, and a third insulating film in this order on a substrate on which a first electrode is disposed; etching the third insulating film, the second insulating film, and the first insulating film to form a third insulating layer, a second insulating layer, and a first insulating layer; and In the step of etching the first insulating film, the first electrode is exposed, A method for manufacturing an organic light-emitting device, wherein in the etching steps of the third insulating film, the second insulating film, and the first insulating film, the etching rate of the second insulating film is slower than the etching rate of the third insulating film. (Configuration 10) The method for manufacturing an organic light-emitting device according to structure 9, wherein in the etching process of the third insulating film, the second insulating film, and the first insulating film, the etching rate of the second insulating film is slower than the etching rate of the first insulating film. (Configuration 11) 11. The method for manufacturing an organic light-emitting device according to configuration 9 or 10, wherein the etching step uses a hydrogen-free fluorocarbon gas. (Configuration 12) 12. The method for manufacturing an organic light-emitting device according to any one of Structures 9 to 11, wherein the first insulating layer and the third insulating layer are made of the same material. (Configuration 13) 13. The method for manufacturing an organic light-emitting device according to claim 12, wherein the first insulating layer and the third insulating layer are made of silicon oxide, and the second insulating layer is made of silicon nitride. (Configuration 14) The method for manufacturing an organic light-emitting device according to any one of structures 9 to 13, further comprising an etching step of forming a groove in the third insulating layer surrounding the opening on the first electrode and exposing the second insulating layer in the groove. (Configuration 15) 15. The method for manufacturing an organic light-emitting device according to claim 14, wherein the etching step of forming a groove in the third insulating layer is performed at least partially simultaneously with the step of etching the third insulating film. (Configuration 16) A method for manufacturing an organic light-emitting device described in any one of structures 9 to 15, characterized in that in the step of exposing the first electrode, the etching is performed so that the angle θ2 of the side surface S2 of the second insulating layer relative to the lower surface of the first electrode is smaller than the angle θ1 of the side surface S1 of the first insulating layer relative to the lower surface of the first electrode and the angle θ3 of the side surface S3 of the third insulating layer relative to the lower surface of the first electrode. (Configuration 17) 9. A display device comprising: a display unit having the organic light-emitting device according to any one of configurations 1 to 8; and a housing in which the display unit is provided. (Configuration 18) an imaging element that receives light; and a display unit that displays an image captured by the imaging element; 9. A photoelectric conversion device, wherein the display unit comprises the organic light-emitting device according to any one of the first to eighth aspects. (Configuration 19) 9. An electronic device comprising: a display unit having the organic light-emitting device according to any one of configurations 1 to 8; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with an external device. (Configuration 20) A wearable device comprising: a display unit having the organic light-emitting device according to any one of configurations 1 to 8; an optical system that focuses light from the display unit; and a control device that controls the display of the display unit. (Configuration 21) 9. A lighting device comprising: a light source having the organic light-emitting device according to any one of configurations 1 to 8; and a housing in which the light source is provided. (Configuration 22) A moving object comprising: a display unit having the organic light-emitting device according to any one of configurations 1 to 8; and a body on which the display unit is provided. (Configuration 23) 9. An image forming apparatus comprising: a photosensitive member; and an exposure light source for exposing the photosensitive member, the exposure light source comprising the organic light-emitting device according to any one of the first to eighth aspects. [Explanation of symbols]

[0091] 10: substrate, 14: first electrode, 15: insulating layer, 15a: first insulating layer, 15b: second insulating layer, 15c: third insulating layer, 16: organic compound layer, 16a: first organic compound layer, 16b: second organic compound layer, 16c: third organic compound layer, 17: second electrode, 25a: first insulating film, 25b: second insulating film, 25c: third insulating film, 30: opening in insulating layer, 40: groove, S1: side surface of first insulating layer, S2: side surface of second insulating layer, S3: side surface of third insulating layer, θ1: angle of side surface of first insulating layer, θ2: angle of side surface of second insulating layer, θ3: angle of side surface of third insulating layer

Claims

1. a substrate; and a first electrode disposed on the substrate; an insulating layer disposed on the substrate, the insulating layer having an opening above the first electrode and covering the outer periphery of the first electrode; an organic compound layer covering the first electrode and the insulating layer; a second electrode disposed on the organic compound layer, the insulating layer includes, from the substrate side, a first insulating layer, a second insulating layer, and a third insulating layer; the second insulating layer is made of a material different from both the first insulating layer and the third insulating layer; The side surface S of the first insulating layer on the side surface forming the opening of the insulating layer 1 , the side surface S of the second insulating layer 2 , the side surface S of the third insulating layer 3 are in contact with the organic compound layer, The side surface S of the first insulating layer relative to the lower surface of the first electrode 1 Angle θ 1 and a side surface S of the third insulating layer relative to the lower surface of the first electrode. 3 Angle θ 3 are the side surfaces S of the second insulating layer relative to the lower surface of the first electrode. 2 Angle θ 2 The organic light-emitting device is characterized in that

2. Said θ 1 2. The organic light emitting device of claim 1, wherein: is greater than 50° and less than 90°.

3. Said θ 2 2. The organic light-emitting device of claim 1, wherein the angle is greater than 0° and less than or equal to 50°.

4. Said θ 3 2. The organic light emitting device of claim 1, wherein: is greater than 50° and less than 90°.

5. 2. The organic light emitting device of claim 1, wherein the first insulating layer and the third insulating layer comprise the same material.

6. 6. The organic light emitting device of claim 5, wherein the first and third insulating layers comprise silicon oxide, and the second insulating layer comprises silicon nitride.

7. 2. The organic light-emitting device according to claim 1, wherein the third insulating layer has a groove surrounding the opening in a plan view relative to the lower surface of the first electrode, and the second insulating layer is exposed in the groove.

8. 2. The organic light-emitting device according to claim 1, wherein, when etching is performed using a hydrogen-free fluorocarbon gas, the etching rate of the first insulating layer is higher than the etching rate of the second insulating layer, and the etching rate of the third insulating layer is higher than the etching rate of the second insulating layer.

9. forming a first insulating film, a second insulating film, and a third insulating film in this order on a substrate on which a first electrode is disposed; etching the third insulating film, the second insulating film, and the first insulating film to form a third insulating layer, a second insulating layer, and a first insulating layer; and In the step of etching the first insulating film, the first electrode is exposed, 10. A method for manufacturing an organic light-emitting device, wherein, in the steps of etching the third insulating film, the second insulating film, and the first insulating film, an etching rate of the second insulating film is slower than an etching rate of the third insulating film.

10. 10. The method of claim 9, wherein in the etching of the third insulating film, the second insulating film, and the first insulating film, the etching rate of the second insulating film is slower than the etching rate of the first insulating film.

11. 10. The method for manufacturing an organic light-emitting device according to claim 9, wherein the etching step uses a hydrogen-free fluorocarbon gas.

12. The method for manufacturing an organic light-emitting device according to claim 9 , wherein the first insulating layer and the third insulating layer are made of the same material.

13. 13. The method for manufacturing an organic light-emitting device according to claim 12, wherein the first insulating layer and the third insulating layer are made of silicon oxide, and the second insulating layer is made of silicon nitride.

14. 10. The method for manufacturing an organic light-emitting device according to claim 9, further comprising an etching step of forming a groove in the third insulating layer surrounding the opening on the first electrode and exposing the second insulating layer in the groove.

15. The method for manufacturing an organic light-emitting device according to claim 14 , wherein the etching step of forming the groove in the third insulating layer is performed at least partially simultaneously with the step of etching the third insulating film.

16. In the step of exposing the first electrode, a side surface S of the second insulating layer relative to a lower surface of the first electrode is 2 Angle θ 2 is the side surface S of the first insulating layer relative to the lower surface of the first electrode. 1 Angle θ 1 and the side surface S of the third insulating layer 3 Angle θ 3 The method for manufacturing an organic light-emitting device according to claim 9, wherein the etching is performed so that the size of the insulating film becomes smaller.

17. A display device comprising: a display unit having the organic light-emitting device according to claim 1; and a housing in which the display unit is provided.

18. an imaging element that receives light; and a display unit that displays an image captured by the imaging element; The photoelectric conversion device, wherein the display unit comprises the organic light-emitting device according to claim 1 .

19. 9. An electronic device comprising: a display unit having the organic light-emitting device according to claim 1; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with an external device.

20. A wearable device comprising: a display unit having the organic light-emitting device according to claim 1; an optical system for concentrating light from the display unit; and a control device for controlling the display of the display unit.

21. A lighting device comprising: a light source having the organic light-emitting device according to claim 1 ; and a housing in which the light source is provided.

22. A moving object comprising: a display unit having the organic light-emitting device according to claim 1; and a body on which the display unit is provided.

23. An image forming apparatus comprising: a photosensitive member; and an exposure light source for exposing the photosensitive member, the exposure light source comprising the organic light-emitting device according to claim 1 .

Images