Film forming apparatus and film forming method

The film forming apparatus addresses misalignment issues in lithium metal film formation on both sides of a substrate by using a position detection and adjustment mechanism, ensuring accurate alignment and consistent film quality.

JP2026037725APending Publication Date: 2026-03-06ULVAC INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

The formation of lithium metal films on both sides of a substrate can result in misalignment, leading to issues in battery assembly.

Method used

A film forming apparatus with a position detection mechanism and adjustment mechanism to align the substrate and mask accurately on both sides, using a control unit to adjust the relative positions of the main roller, mask unwinding and winding rollers in the axial direction, and detect the film deposition positions on both surfaces.

Benefits of technology

Enables precise alignment of lithium metal films on both sides of the substrate, reducing misalignment and maintaining film quality by detecting and adjusting positions without direct detection of widthwise edges, thus ensuring consistent film formation.

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Abstract

The film formation positions on both sides of the substrate are aligned. [Solution] An apparatus for forming a lithium metal film L on both sides of a substrate B, comprising a film forming chamber 11, a film forming source 13, a main roller 12 that forms a film on the substrate placed along its circumferential surface, an unwinding roller 21 that unwinds the substrate, a winding roller 22 that winds up the substrate, a long mask M that adheres to the film forming surface of the substrate along the circumferential surface of the main roller to restrict the film forming area, a mask unwinding roller 31 that unwinds the mask, a mask winding roller 32 that winds up the mask, a position detection mechanism 50 that detects the relative position of the substrate and the mask after film formation on a first side and before film formation on a second side of the substrate, a position adjustment mechanism 40 that adjusts the relative position of the substrate and the mask on the circumferential surface of the main roller before film formation on the second side of the substrate, and a control unit 14.
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Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus and a film forming method. [Background technology]

[0002] In recent years, with the advancement of mobile devices such as mobile phones and smartphones, lithium ion secondary batteries installed in these devices have been attracting attention. In the manufacturing process of such lithium ion secondary batteries, the step of forming lithium metal on a substrate is particularly important.

[0003] A winding-type film-forming apparatus is known that forms a lithium metal film on a substrate, such as copper foil or a resin film, used as a current collector. In this case, a long substrate is unwound, a film is formed on the substrate while the substrate is wound around a main roller, and then the substrate is wound up by a take-up roller. Recently, a winding-type film-forming apparatus has been provided in which a long mask is unwound from a separate unwound roller, and a portion of the substrate is covered with the mask on the main roller, thereby forming a film on the portion of the substrate that is not covered by the mask (Patent Documents 1 and 2).

[0004] In recent years, lithium metal films have been formed on both sides of a substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2024-027829 [Patent Document 2] Japanese Patent Publication No. 2022-013227 Summary of the Invention [Problem to be solved by the invention]

[0006] A lithium metal film is formed on a first surface (one side) of the substrate using a mask, and then a lithium metal film is formed on a second surface (the surface opposite the first surface) of the substrate using a similar mask. At this time, there is a possibility that the lithium metal film may be misaligned on both sides. If the lithium metal film is misaligned on both sides, this may cause problems in the battery assembly, which is undesirable.

[0007] The present invention has been made in view of the above circumstances, and aims to achieve the following objects. 1. To enable the formation of lithium metal films on both sides of a substrate without misalignment. 2. Ensure that the mask is aligned correctly when forming the lithium metal film on both sides of the substrate. [Means for solving the problem]

[0008] (1) A film forming apparatus according to one aspect of the present invention, An apparatus for forming a lithium metal film on both sides of a long substrate, a deposition chamber; a deposition source for supplying a deposition material into the deposition chamber; a main roller that forms a film on the film-forming surface of the substrate along its circumferential surface; an unwinding roller that unwinds the substrate toward the main roller; a take-up roller that takes up the substrate from the main roller; a long mask that is in close contact with the film-forming surface of the substrate along the circumferential surface of the main roller and that restricts a film-forming region; a mask unwinding roller that unwinds the mask toward the main roller; a mask take-up roller that takes up the mask from the main roller; a position detection mechanism for detecting a relative position between the substrate and the mask after film formation on a first surface and before film formation on a second surface of the substrate; a position adjustment mechanism that adjusts the relative position between the substrate and the mask on the circumferential surface of the main roller before film formation on the second surface of the substrate; A control unit; Equipped with This solved the above problem. (2) A film forming apparatus according to one aspect of the present invention is the film forming apparatus according to the above (1), the position adjustment mechanism adjusts the relative positions of the main roller, the mask unwinding roller, and the mask winding roller in the axial direction under the control of the control unit. It is possible. (3) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first surface position detection unit that observes the substrate and the mask from a first surface before they are aligned along the circumferential surface of the main roller, and detects the relative positions of the substrate and the mask before film formation on a second surface; It is possible. (4) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from a first surface and detects a first-surface film-deposition position of the lithium metal film deposited on the first surface of the substrate; a second surface position detection unit that observes the substrate and the mask from a second surface and detects the relative position between the substrate and the mask before film formation on the second surface; having It is possible. (5) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from the first surface and detects a first-surface film-deposition position of a lithium metal film formed on the first surface of the substrate; It is possible. (6) The film forming apparatus of the present invention is the one described above in (1), a first-surface-side main roller for forming a film on a first surface of the substrate in the film-forming chamber; performing film formation on the first surface and film formation on the second surface consecutively in the film formation chamber; It is possible. (7) The film forming apparatus of the present invention is the one described above in (1), the position detection mechanism detects a relative position between an end of the base material in a width direction and an end of the mask in a width direction. It is possible. (8) The film forming apparatus of the present invention is the one described above in (1), the position detection mechanism detects a step between the substrate and the mask and / or a step between the substrate and the lithium metal film. It is possible. (9) The film forming apparatus of the present invention is the film forming apparatus of the above (3), a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the first surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller. It is possible. (10) The film forming apparatus of the present invention is the film forming apparatus of the above (4), a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the second surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller. It is possible. (11) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (3) above, Before the substrate and the mask are moved along the circumferential surface of the main roller, The first surface position detection unit detects a substrate end position in the width direction, a mask end position that protrudes outward in the width direction from the substrate end position, and a lithium end position in the width direction; The control unit, based on the detection result of the first surface position detection unit, Calculate the distance W in the width direction between the substrate end position and the lithium end position, Calculating a distance X in the width direction between the mask end position and the substrate end position; Calculating a distance Y from the edge position of the substrate to the edge position of the film formation position in the width direction defined by the mask from the mask width dimension and the distance X; Calculating a difference ΔZ between the distance W and the distance Y; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible. (12) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (4) above, Before the substrate is moved along the circumferential surface of the main roller, detecting a substrate end position in the width direction and a lithium end position in the width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculate the distance W in the width direction between the substrate end position and the lithium end position, The second surface position detection unit detects a mask inner edge position that overlaps with the base material; The control unit adds the detection result of the second surface position detection unit to the Calculating a distance Y from the mask width dimension to the substrate edge position and the film formation position edge position in the width direction defined by the mask; Calculating a difference ΔZ between the distance W and the distance Y; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible. (13) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (5) above, Before the substrate is moved along the circumferential surface of the main roller, detecting an end position of lithium in a width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculating a difference ΔZ in distance between a film formation end position in the width direction defined by the mask from a preset position in the width direction of the mask and the lithium end position; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible.

[0009] (1) A film forming apparatus according to one aspect of the present invention, An apparatus for forming a lithium metal film on both sides of a long substrate, a deposition chamber; a deposition source for supplying a deposition material into the deposition chamber; a main roller that forms a film on the film-forming surface of the substrate along its circumferential surface; an unwinding roller that unwinds the substrate toward the main roller; a take-up roller that takes up the substrate from the main roller; a long mask that is in close contact with the film-forming surface of the substrate along the circumferential surface of the main roller and that restricts a film-forming region; a mask unwinding roller that unwinds the mask toward the main roller; a mask take-up roller that takes up the mask from the main roller; a position detection mechanism for detecting a relative position between the substrate and the mask after film formation on a first surface and before film formation on a second surface of the substrate; a position adjustment mechanism that adjusts the relative position between the substrate and the mask on the circumferential surface of the main roller before film formation on the second surface of the substrate; A control unit; Equipped with This solved the above problem.

[0010] In the above configuration, the position detection mechanism detects the position of the lithium metal film deposited on the first surface of the substrate and outputs the result to the control unit, and the control unit controls the position adjustment mechanism to adjust the position of the mask relative to the substrate, so that the deposition position of the lithium metal film on the second surface of the substrate can be made to coincide with the deposition position on the first surface. This film formation apparatus is a so-called roll-to-roll type. The film formation apparatus can continuously form a lithium metal film on a substrate. Furthermore, from the time when the mask and the substrate come into contact with each other before film formation until they are separated, the mask and the substrate do not move relative to each other in the direction along the circumferential surface of the main roller, which is the direction in which film formation progresses, i.e., in the direction of movement of the substrate.

[0011] (2) A film forming apparatus according to one aspect of the present invention is the film forming apparatus according to the above (1), the position adjustment mechanism adjusts the relative positions of the main roller, the mask unwinding roller, and the mask winding roller in the axial direction under the control of the control unit. It is possible.

[0012] In the above configuration, the position adjustment mechanism changes the positions of the substrate and the mask by moving the mask, which is overlapped with the substrate along the circumferential surface of the main roller and contacts the deposition surface of the substrate, in the axial direction of the main roller, thereby moving the deposition area in the axial direction of the main roller and adjusting the deposition position on the deposition surface. Here, the film formation position is adjusted by the substrate and the mask in the direction along the axial direction of the main roller. The film formation position is adjusted by the substrate and the mask in the direction intersecting the direction of movement of the substrate and the mask. The film formation position is adjusted by the substrate and the mask in the width direction.

[0013] (3) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first surface position detection unit that observes the substrate and the mask from a first surface before they are aligned along the circumferential surface of the main roller, and detects the relative positions of the substrate and the mask before film formation on a second surface; It is possible.

[0014] In the above configuration, the first surface position detection unit detects the positional relationship between the first surface of the substrate and the lithium metal film already formed on the first surface relative to the first surface of the substrate, and the positional relationship between the widthwise edge of the substrate and the widthwise edge of the mask. In the present invention, the above positional relationship is detected in order to align the widthwise edge of the film formation area, which is located on the second surface and cannot be detected by the first surface position detection unit, with the lithium metal film on the first surface. Based on these detection results, the control unit controls the position adjustment mechanism so that the widthwise edge of the lithium metal film formed on the first surface coincides with the widthwise edge of the film formation area. Therefore, it is possible to accurately set the film formation position for second surface formation by adjusting the positions of the substrate and the mask without directly detecting the positional relationship between the widthwise edge of the substrate and the widthwise edge of the film formation area.

[0015] (4) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from a first surface and detects a first-surface film-deposition position of the lithium metal film deposited on the first surface of the substrate; a second surface position detection unit that observes the substrate and the mask from a second surface and detects the relative position between the substrate and the mask before film formation on the second surface; having It is possible.

[0016] In the above configuration, after the first-side film formation, the first-side film formation position detection unit first detects the positional relationship between the first side of the substrate and the lithium metal film already formed on the first side relative to the first side of the substrate. Then, before the second-side film formation, the second-side position detection unit detects the positional relationship between the widthwise ends of the mask. Furthermore, by combining these detection results, the control unit controls the position adjustment mechanism so that the widthwise ends of the lithium metal film formed on the first side coincide with the widthwise ends of the film formation area. Therefore, it is possible to accurately set the film formation position for the second-side film formation by adjusting the positions of the substrate and the mask without directly detecting the positional relationship between the widthwise ends of the substrate and the widthwise ends of the film formation area.

[0017] (5) The film forming apparatus of the present invention is, in the above (2), The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from the first surface and detects a first-surface film-deposition position of a lithium metal film formed on the first surface of the substrate; It is possible.

[0018] In the above configuration, after the first-side film formation, the first-side film formation position detection unit first detects the positional relationship between the first side of the substrate and the lithium metal film already formed on the first side relative to the first side of the substrate. The control unit then controls the position adjustment mechanism based on the previously acquired mask position relative to the substrate and mask width dimension so that the widthwise edges of the lithium metal film formed on the first side coincide with the widthwise edges of the film formation area. Therefore, it is possible to accurately set the film formation position for the second-side film formation by adjusting the positions of the substrate and the mask without directly detecting the positional relationship between the widthwise edges of the substrate and the widthwise edges of the film formation area before the second-side film formation.

[0019] (6) The film forming apparatus of the present invention is the one described above in (1), a front-side main roller for depositing a film on a first surface of the substrate in the film-deposition chamber; performing film formation on the first surface and film formation on the second surface consecutively in the film formation chamber; It is possible.

[0020] In the above configuration, by continuously depositing the lithium metal films on both sides in the same chamber, it is possible to reduce the influence of moisture in the atmosphere and prevent a decrease in the quality of the deposited film. Note that forming lithium metal films on both sides in the same chamber means maintaining an environment in which the atmosphere of the lithium metal films on both sides does not change, and is not limited to all components being housed in a single, physically sealed chamber.

[0021] (7) The film forming apparatus of the present invention is the one described above in (1), the position detection mechanism detects a relative position between an end of the base material in a width direction and an end of the mask in a width direction. It is possible.

[0022] In the above configuration, it is possible to detect a step formed between the substrate and the mask in contact with each other along the circumferential surface of the main roller or stretched between rollers that transport the substrate or the mask, and to acquire positional information thereof. Furthermore, it is possible to detect a step formed at the boundary position between the first surface of the substrate and the lithium metal film formed on the first surface, and to acquire positional information thereof.

[0023] Specifically, examples include a configuration capable of detecting a step by measuring the distance using laser irradiation, a configuration consisting of a combination of an optical camera and a light source capable of adjusting the illuminance at the imaging position, etc. Here, when a laser detector is employed, there are no particular limitations on the arrangement as long as it can measure the step formed on the substrate and the mask at a predetermined position.

[0024] When a configuration including an optical camera and a light source is adopted, it is necessary to arrange them in a predetermined positional relationship that allows the detection of the step to be detected. Specifically, with respect to the step formed along the movement direction of the base material, the optical camera and the light source can be arranged on both sides of the step in the width direction of the base material.

[0025] (8) The film forming apparatus of the present invention is the one described above in (1), the position detection mechanism detects a step between the substrate and the mask and / or a step between the substrate and the lithium metal film. It is possible.

[0026] In the above configuration, by detecting these steps and determining their position relative to the widthwise end of the substrate, it is possible to grasp the positional relationship between the substrate and the mask, control the position adjustment mechanism, and accurately set the deposition position for second surface deposition. When the substrate and mask are made of a metal material such as copper, it is difficult to detect the step using conventional methods. It is also difficult to detect the edge position of the lithium metal film through the substrate. Therefore, the position detection mechanism is preferably configured to detect the step by measuring the distance using laser irradiation, or configured to include a combination of an optical camera and a light source that can adjust the illuminance relative to the imaging position.

[0027] (9) The film forming apparatus of the present invention is the film forming apparatus of the above (3), a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the first surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller. It is possible.

[0028] In the above configuration, the substrate and the mask are in contact with each other between the tension roller and the main roller but are not pressed against the circumferential surface of the main roller. Therefore, they are relatively movable in the width direction, which intersects with the traveling direction of the substrate. Therefore, the first-surface position detection unit can easily detect the relative positions of the substrate and the mask between the tension roller and the main roller, and the position adjustment mechanism can easily adjust the alignment or misalignment between the lithium metal film formed on the first surface and the film formation position on the second surface.

[0029] (10) The film forming apparatus of the present invention is the film forming apparatus of the above (4), a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the second surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller. It is possible.

[0030] In the above configuration, the substrate and the mask are in contact with each other between the tension roller and the main roller but are not pressed against the circumferential surface of the main roller. Therefore, they are relatively movable in the width direction, which intersects with the traveling direction of the substrate. Therefore, the second surface position detection unit can easily detect the relative position of the substrate and the mask between the tension roller and the main roller, and the position adjustment mechanism can easily adjust the alignment or misalignment between the lithium metal film formed on the first surface and the film formation position on the second surface.

[0031] (11) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (3) above, Before the substrate and the mask are moved along the circumferential surface of the main roller, The first surface position detection unit detects a substrate end position in the width direction, a mask end position that protrudes outward in the width direction from the substrate end position, and a lithium end position in the width direction; The control unit, based on the detection result of the first surface position detection unit, Calculate the distance W in the width direction between the substrate end position and the lithium end position, Calculating a distance X in the width direction between the mask end position and the substrate end position; Calculating a distance Y from the edge position of the substrate to the edge position of the film formation position in the width direction defined by the mask from the mask width dimension and the distance X; Calculating a difference ΔZ between the distance W and the distance Y; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible.

[0032] In the above configuration, the position detection mechanism detects the substrate and mask only from the first surface and detects the widthwise edge positions of the substrate, lithium metal film, and mask as described above. The control unit calculates the respective distances W, X, Y, and ΔZ from these detection results. This allows the control unit to accurately obtain the relative positions of the substrate and mask without detecting from the second surface. Furthermore, the position adjustment mechanism can easily adjust the alignment or misalignment between the lithium metal film deposited on the first surface and the deposition position on the second surface.

[0033] (12) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (4) above, Before the substrate is moved along the circumferential surface of the main roller, detecting a substrate end position in the width direction and a lithium end position in the width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculate the distance W in the width direction between the substrate end position and the lithium end position, The second surface position detection unit detects a mask inner edge position that overlaps with the base material; The control unit adds the detection result of the second surface position detection unit to the Calculating a distance Y from the mask width dimension to the substrate edge position and the film formation position edge position in the width direction defined by the mask; Calculating a difference ΔZ between the distance W and the distance Y; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible.

[0034] In the above configuration, the position detection mechanism first detects the substrate and mask from the first surface, and then from the second surface. This accurately obtains the widthwise end positions of the substrate, lithium metal film, and mask, as described above. The control unit calculates the respective distances W, Y, and ΔZ from these detection results. This allows the control unit to accurately calculate the relative positions of the substrate and mask by performing detection from the first surface and the second surface. Furthermore, the position adjustment mechanism can easily adjust the alignment or misalignment between the lithium metal film deposited on the first surface and the deposition position on the second surface.

[0035] (13) A film forming method according to another aspect of the present invention comprises: A method for forming a film in the film forming apparatus according to (5) above, Before the substrate is moved along the circumferential surface of the main roller, detecting an end position of lithium in a width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculating a difference ΔZ in distance between a film formation end position in the width direction defined by the mask from a preset position in the width direction of the mask and the lithium end position; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount according to a product standard; It is possible.

[0036] In the above configuration, the position detection mechanism detects the substrate only from the first surface and detects the widthwise end position (lithium end) of the lithium metal film as described above. The control unit calculates the difference ΔZ in the distance between the lithium end position and the end of the film formation position on the second surface based on this detection result, the previously acquired width dimension of the mask, and the relative position of the mask and substrate during film formation on the second surface. This allows the control unit to accurately obtain the difference ΔZ in the relative position between the substrate and the mask without detecting from the second surface. Furthermore, the position adjustment mechanism can easily adjust the alignment or misalignment between the lithium metal film formed on the first surface and the film formation position on the second surface. In particular, with this configuration, it is possible to detect the substrate only from the first surface immediately after the film is formed on the first surface.

[0037] Furthermore, in the present invention, the position adjustment mechanism adjusts the relative position of the tension roller with respect to the main roller in the axial direction together with the mask unwinding roller and the mask winding roller. It is possible. Here, the first surface position detector can easily detect the edge position between the tension roller and the main roller. Furthermore, the tension adjustment of the substrate and mask and the detection by the first surface position detector can be performed simultaneously. This reduces the number of parts.

[0038] Further, in the present invention, the position adjustment mechanism adjusts the relative positions of the mask unwinding roller, the main roller, and the mask winding roller in the axial direction under the control of the control unit. It is possible. This makes it possible to easily adjust the relative positions of the substrate and the mask without causing wrinkles in the mask and the substrate. [Effects of the Invention]

[0039] According to the present invention, it is possible to easily form the lithium metal films on both sides of the substrate so that the positions of the films are aligned. [Brief explanation of the drawings]

[0040] [Figure 1] 1 is a schematic diagram showing a first embodiment of a film forming apparatus according to the present invention. [Figure 2] 1 is a cross-sectional view showing the positional relationship between a substrate, a mask, and a lithium metal film in a first embodiment of a film forming method according to the present invention. [Figure 3] 1 is a schematic diagram showing the arrangement of a position detection mechanism in a first embodiment of a film formation apparatus according to the present invention. [Figure 4]1 is a schematic diagram showing the arrangement of a position detection mechanism in a first embodiment of a film formation apparatus according to the present invention. [Figure 5] 1 is a flowchart showing a first embodiment of a film forming method according to the present invention. [Figure 6] FIG. 2 is a schematic diagram showing a second embodiment of a film forming apparatus according to the present invention. [Figure 7] FIG. 4 is a schematic view showing a third embodiment of a film forming apparatus according to the present invention. [Figure 8] FIG. 10 is a cross-sectional view showing the positional relationship between a substrate, a mask, and a lithium metal film in a third embodiment of the film forming method according to the present invention. [Figure 9] FIG. 10 is a schematic view showing a fourth embodiment of the film forming apparatus according to the present invention. [Figure 10] FIG. 10 is a cross-sectional view showing the positional relationship between a substrate, a mask, and a lithium metal film in a fourth embodiment of a film forming method according to the present invention. [Figure 11] FIG. 10 is a partial schematic view showing a film formation apparatus according to a fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0041] A first embodiment of a film deposition apparatus and a film deposition method according to the present invention will be described below with reference to the drawings. Fig. 1 is a schematic diagram showing a film forming apparatus according to this embodiment. Fig. 2 is a schematic cross-sectional view showing a film forming method according to this embodiment. In the figure, reference numeral 10 denotes the film forming apparatus.

[0042] As shown in FIG. 1, the film forming apparatus 10 according to this embodiment forms a lithium metal film L on a substrate B by a roll-to-roll method. The substrate B is a long metal film of a predetermined width, made of a metal material that functions as a current collector, such as copper, nickel, or titanium. Alternatively, the substrate B may be made of a resin film. The thickness of the substrate B is not particularly limited, and is, for example, several μm to several tens of μm. The width and length of the substrate B are also not particularly limited, and can be determined appropriately depending on the specifications and applications. The substrate B may have a length of, for example, several tens of meters to several hundreds of meters. The substrate B may have a width dimension of, for example, several tens of mm to several hundreds of mm.

[0043] The thickness of the lithium metal film L is not particularly limited and is, for example, several μm to several tens of μm. The width dimension of the lithium metal film L is smaller than the width dimension of the substrate B. In this embodiment, the lithium metal film L is formed over the entire length of the substrate B unless otherwise specified. The lithium metal film L is formed on both sides of the substrate B. As shown in FIG. 2, a lithium metal film Lf is formed on a first surface Bf of the substrate B. A lithium metal film Lb is formed on a second surface Bb of the substrate B. The lithium metal films Lf and Lb are formed so that their film formation positions coincide when viewed in the thickness direction of the substrate B.

[0044] 1, the film formation apparatus 10 according to this embodiment includes a film formation chamber 11, a main roller 12, a film formation source 13, a control unit 14, an unwinding roller 21, a winding roller 22, tension rollers 23, 24, a mask unwinding roller 31, a mask winding roller 32, tension rollers 33, 34, a position adjustment mechanism 40, and a position detection mechanism 50. Note that in FIG. 1, the illustration of the connection with the control unit 14 is omitted in some places.

[0045] The film formation chamber 11 can maintain a film formation atmosphere. The film formation chamber 11 is sealed. An atmosphere adjustment unit 11g is connected to the film formation chamber 11. The atmosphere adjustment unit 11g has an exhaust unit and a gas supply unit. The atmosphere adjustment unit 11g maintains the film formation atmosphere in the film formation chamber 11 at predetermined conditions. The film formation atmosphere is a condition suitable for lithium, which is the target of film formation. For example, the film formation atmosphere can be such that the moisture content is kept within a predetermined range. The atmosphere adjusting section 11g controls the entire atmosphere in the film forming chamber 11. Alternatively, the atmosphere adjusting section 11g may be configured to control the atmosphere only in the portion of the film forming chamber 11 to which the lithium metal film Lf is exposed.

[0046] The film formation chamber 11 houses therein a main roller 12, a film formation source 13, an unwinding roller 21, a winding roller 22, a tension roller 23, a tension roller 24, a mask unwinding roller 31, a mask winding roller 32, a tension roller 33, a tension roller 34, a position adjustment mechanism 40, a position detection mechanism, a substrate B, and a mask M.

[0047] The main roller 12 brings the substrate B into close contact with its circumferential surface. The main roller 12 rotates together with the substrate B in close contact with it. The main roller 12 forms a film on the outer circumferential surface of the substrate B as the circumferential surface rotates. The main roller 12 may be made of a metal material such as stainless steel, iron, or aluminum. The main roller 12 maintains the substrate B in contact with the circumferential surface at a predetermined temperature by a temperature control medium such as cooling water circulating inside. A film formation source 13 is disposed on the main roller 12 near the circumferential surface where the film is formed.

[0048] The film forming source 13 supplies a film forming material toward the circumferential surface of the main roller 12. The film forming material contains lithium. The film forming source 13 is disposed opposite the circumferential surface of the main roller 12. The film forming source 13 is an evaporation source for vacuum evaporation. The configuration of the film forming source 13 as an evaporation source is not particularly limited. The film forming source 13 may be a resistance heating type, an induction heating type, or an electron beam heating type. The film forming source 13 is not limited to an evaporation source, and may also be a sputtering cathode for sputter film formation. The film forming source 13 and the main roller 12 constitute a film forming unit.

[0049] The unwinding roller 21 constitutes a substrate conveying system. The unwinding roller 21 unwinds the substrate B. The unwinding roller 21 unwinds the substrate B having a lithium metal film Lf formed on its first surface Bf. The substrate B unwound from the unwinding roller 21 is sent to the main roller 12 where a film is formed. The unwinding roller 21 is configured to be rotatable in the direction of the arrow shown in the figure at a predetermined rotation speed in a direction in which the substrate B is unwound. The unwinding roller 21 has a rotation drive unit. The rotation drive unit of the unwinding roller 21 is drive-controlled by the control unit 14.

[0050] The winding roller 22 constitutes a substrate conveying system. The winding roller 22 is paired with the unwinding roller 21. The winding roller 22 winds up the substrate B having a lithium metal film Lf formed on a first surface Bf and a lithium metal film Lb formed on a second surface Bb. The winding roller 22 winds up the substrate B having the films formed by the main roller 12. The winding roller 22 is configured to be rotatable at a predetermined rotation speed in the direction indicated by the arrow in the figure, in which the substrate B is unwound. The winding roller 22 has a rotation drive unit. The rotation drive unit of the winding roller 22 is drive-controlled by the control unit 14.

[0051] The tension roller 23 is disposed between the unwinding roller 21 and the main roller 12. The tension roller 23 detects the tension of the substrate B between the unwinding roller 21 and the main roller 12. The tension roller 23 has a detection unit that enables the tension of the substrate B to be detected. Furthermore, the tension roller 23 adjusts the tension of the substrate B between the unwinding roller 21 and the main roller 12. The tension roller 23 has a drive unit that enables adjustment of the tension of the substrate B. Examples of adjustment of the tension of the substrate B include positional movement of the tension roller 23 with respect to the unwinding roller 21 and the main roller 12, which involves varying the distance between them, and adjustment of the rotation speed. The tension roller 23 may also serve as a guide roller. It is also possible to use only a guide roller without providing the tension roller 23.

[0052] The tension roller 24 is disposed between the take-up roller 22 and the main roller 12. The tension roller 24 adjusts the tension of the substrate B between the take-up roller 22 and the main roller 12. The tension roller 24 has a drive unit that enables adjustment of the tension of the substrate B. Examples of adjustment of the tension of the substrate B include moving the position of the tension roller 24 with a change in the distance between the take-up roller 22 and the main roller 12, or adjusting the rotation speed. The tension roller 24 may also serve as a guide roller. It is also possible to use only a guide roller without providing the tension roller 24. It is also possible not to provide the tension roller 24.

[0053] The mask unwinding roller 31 constitutes a mask transport system. The mask unwinding roller 31 unwinds the mask M. Two masks M are used so that they overlap on both widthwise end portions of the substrate B. For this reason, two mask unwinding rollers 31 are provided at positions offset in the axial direction relative to the unwinding roller 21 and the main roller 12. The axes of the two mask unwinding rollers 31 can be positioned on the same straight line. Alternatively, one mask unwinding roller 31 may be used so as to overlap the center in the width direction of the base material B. In this case, one mask unwinding roller 31 is provided at the center position in the axial direction relative to the unwinding roller 21 and the main roller 12.

[0054] The mask unwinding roller 31 is configured to be rotatable in the direction indicated by the arrow at a predetermined rotation speed so as to unwind the mask M. The mask unwinding roller 31 has a rotation drive unit. The rotation drive unit of the mask unwinding roller 31 is drive-controlled by the control unit 14. A position adjustment mechanism 41 is connected to the mask unwinding roller 31. The mask unwinding roller 31 is movable in the axial direction. The axial movement of the mask unwinding roller 31 is performed by the position adjustment mechanism 41. The position adjustment mechanism 41 is not limited as long as it is configured to be able to move the mask unwinding roller 31 in the axial direction. The position adjustment mechanism 41 is controlled by the control unit 14.

[0055] The mask take-up roller 32 constitutes a mask transport system. The mask take-up roller 32 takes up the mask M after film formation. The mask take-up roller 32 is paired with the mask unwinding roller 31. Two mask take-up rollers 32 are provided corresponding to the mask unwinding roller 31. The axes of the two mask take-up and unwinding rollers 32 can be positioned on the same straight line. One mask unwinding roller 32 is provided corresponding to one mask unwinding roller 31.

[0056] The mask winding roller 32 is configured to be rotatable in the direction indicated by the arrow at a predetermined rotation speed so as to wind up the mask M. The mask winding roller 32 has a rotation drive unit. The rotation drive unit of the mask winding roller 32 is drive-controlled by the control unit 14. A position adjustment mechanism 42 is connected to the mask take-up roller 32. The mask take-up roller 32 is movable in the axial direction. The axial movement of the mask take-up roller 32 is performed by the position adjustment mechanism 42. The position adjustment mechanism 42 is not limited as long as it is configured to be able to move the mask take-up roller 32 in the axial direction. The position adjustment mechanism 42 is controlled by the control unit 14.

[0057] The tension roller 33 constitutes a mask conveying system. The tension roller 33 is disposed between the mask unwinding roller 31 and the main roller 12. The tension roller 33 detects the tension of the mask M between the mask unwinding roller 31 and the main roller 12. The tension roller 33 may have a drive unit that enables adjustment of the tension of the mask M. Examples of adjustment of the tension of the mask M include moving the position of the tension roller 33 with a change in the distance between the mask unwinding roller 31 and the main roller 12, or adjusting the rotation speed. The tension roller 33 may also serve as a guide roller. It is also possible to use only a guide roller without providing the tension roller 33.

[0058] A position adjustment mechanism 43 may be connected to the tension roller 33. The tension roller 33 may be movable in the axial direction. The axial movement of the tension roller 33 may be performed by the position adjustment mechanism 43. The position adjustment mechanism 43 is not limited as long as it is configured to be able to move the tension roller 33 in the axial direction. The position adjustment mechanism 43 is controlled by the control unit 14.

[0059] The tension roller 34 constitutes a mask transport system. The tension roller 34 is disposed between the mask take-up roller 32 and the main roller 12. The tension roller 34 detects the tension of the mask M between the mask take-up roller 32 and the main roller 12. The tension roller 34 may have a detection unit that enables detection of the tension of the mask M. The tension roller 34 adjusts the tension of the mask M between the mask take-up roller 32 and the main roller 12. The tension roller 34 may have a drive unit that enables adjustment of the tension of the mask M. Examples of adjustment of the tension of the mask M include moving the position of the tension roller 34 with a change in the distance between the mask take-up roller 32 and the main roller 12, or adjusting the rotation speed. The tension roller 34 may also serve as a guide roller. It is also possible to use only a guide roller without providing the tension roller 34. It is also possible not to provide the tension roller 34.

[0060] A position adjustment mechanism 44 may be connected to the tension roller 34. The tension roller 34 may be movable in the axial direction. The axial movement of the tension roller 34 may be performed by the position adjustment mechanism 44. The position adjustment mechanism 44 is not limited as long as it is configured to be able to move the tension roller 34 in the axial direction. The position adjustment mechanism 44 is controlled by the control unit 14.

[0061] The control unit 14 controls the atmosphere adjustment unit 11g, the main roller 12, the film forming source 13, the unwinding roller 21, the winding roller 22, the tension roller 23, the tension roller 24, the mask unwinding roller 31, the mask winding roller 32, and the position adjustment mechanism 40. The control unit 14 receives the detection result from the position detection mechanism 50. Based on the detection result from the position detection mechanism 50, the control unit 14 calculates the positional relationship between the substrate B, the mask M, and the lithium metal film Lf. Based on the calculation result, the control unit 14 controls the position adjustment mechanism 40. By controlling the position adjustment mechanism 40, the control unit 14 adjusts the positional relationship between the substrate B, the mask M, and the lithium metal film Lf.

[0062] The position adjustment mechanism 40 is a mechanism that adjusts the widthwise position of the mask M relative to the main roller 12. The position adjustment mechanism 40 has a position adjustment mechanism 41, a position adjustment mechanism 42, a position adjustment mechanism 43, and a position adjustment mechanism 44. The position adjustment mechanism 40 is provided for each roller of the mask transport system. The position adjustment mechanism 41 adjusts the position of the mask unwinding roller 31. The position adjustment mechanism 42 adjusts the position of the mask unwinding roller 32.

[0063] The position detection mechanism 50 detects (senses) the positional relationship in the width direction S between the edge of the substrate B, the edge of the mask M, and the edge of the lithium metal film Lf. Specifically, it detects the boundaries formed by these edges. That is, the position detection mechanism 50 detects the step LfE between the first surface Bf of the substrate B and the lithium metal film Lf, or the step BE between the first surface Mf of the mask M and the substrate B, or the step MiE between the second surface Bb of the substrate B and the mask M.

[0064] Therefore, the position detection mechanisms 50 can be provided on both sides in the width direction S of the substrate B in correspondence with the step E to be detected. In other words, the position detection mechanisms 50 can be disposed for the masks M that form both inner end portions MiE (see FIG. 2) of the film formation region in the width direction S. Alternatively, if one position detection mechanism 50 can detect both of the inner ends MiE, there is no need to provide a plurality of position detection mechanisms 50.

[0065] The position detection mechanism 50 detects the lithium end LfE of the lithium metal film Lf relative to the first surface Bf of the substrate B, or the end BE of the substrate B relative to the first surface Mf of the mask M, the inner end MiE of the mask M relative to the second surface Bb of the substrate B, and the outer end MoE of the mask M.

[0066] The edges formed as steps detected by the position detection mechanism 50 are on the order of microns, depending on the thickness of each edge, and are therefore difficult to detect with an optical camera. Also, steps formed from lithium and copper, or steps formed from the same copper foil, are difficult to detect with an optical camera. Therefore, the position detection mechanism 50 is arranged as follows in accordance with the step to be detected.

[0067] Fig. 3 is a schematic cross-sectional view showing the arrangement of a position detection mechanism in the film deposition apparatus of this embodiment, and Fig. 4 is a schematic plan view showing the arrangement of a position detection mechanism in the film deposition apparatus of this embodiment. As shown in Fig. 3, the position detection mechanism 50 has an optical camera 50a and a light source 50b. In Fig. 3, the step E is used to represent the steps detected by the position detection mechanism 50. The surface on the lower side of the step E is referred to as a bottom surface D, and the surface on the higher side of the step E is referred to as a top surface U.

[0068] The optical camera 50a captures an image of a predetermined portion of the step E. The light source 50b is an illuminator that irradiates the area to be imaged by the optical camera 50a with light of a predetermined wavelength. The step E to be imaged by the optical camera 50a only needs to be able to identify the position of the step E in the width direction S. Therefore, the area to be imaged by the optical camera 50a can be an area including a step E having a length of at most several millimeters to several tens of millimeters.

[0069] Here, as shown in Figure 3, the step E extends along the movement direction A. Furthermore, the wall surface of the step E is assumed to be a plane along the thickness direction T and the movement direction A. The movement direction A is the direction in which the substrate B advances. The movement direction A is along the first surface of the substrate B. The width direction S intersects with the movement direction A. The width direction S is perpendicular to the movement direction A. The width direction S is along the first surface of the substrate B. The thickness direction T is perpendicular to the movement direction A. The thickness direction T is the direction in which the mask M, substrate B, and lithium metal film L are stacked. The thickness direction T is perpendicular to the width direction S.

[0070] The position detection mechanism 50 is arranged such that an optical camera 50a and a light source 50b are disposed in the width direction S with a step E interposed therebetween. Specifically, the position detection mechanism 50 is arranged such that the optical camera 50a is positioned in a region including the lower surface D in the width direction S from the step E when viewed in the thickness direction T. The position detection mechanism 50 is arranged such that the light source 50b is positioned in a region including the lower surface D in the width direction S from the step E when viewed in the thickness direction T. The optical camera 50a and the light source 50b may be arranged on either side of a step E when viewed in the thickness direction T. The step E is substantially linear when viewed in the thickness direction T. The optical camera 50a and the light source 50b may be arranged line-symmetrically with respect to the step E when viewed in the thickness direction T. The position detection mechanisms 50 can be provided on both sides of the substrate B in the width direction S in correspondence with the step E to be detected.

[0071] In addition, the position detection mechanism 50 is arranged such that the optical camera 50a and the light source 50b are each disposed within a predetermined angle range from the width direction S to the thickness direction T relative to the step E when viewed in the movement direction A. Specifically, when viewed in the movement direction A, the step E is a short straight line along the thickness direction T. Here, the optical camera 50a can be positioned on the ST surface along the width direction S and thickness direction T, with the angle θa formed between the S axis along the width direction S and the contact point (contact point) of the lower surface D and the step E as the center, in the range of 10° to 80°. Furthermore, the optical camera 50a is preferably positioned such that the angle θa is in the range of 20° to 75°.

[0072] The light source 50b can be positioned on the ST surface such that the angle θb formed between the S axis along the width direction S and the contact point (contact point) of the upper surface U and the step E is in the range of 10° to 80°. Furthermore, the optical camera 50a is preferably positioned such that the angle θb is in the range of 20° to 75°. The irradiation direction of the light source 50b may be set so as to include the step E, which is the detection position of the optical camera 50a.

[0073] In addition, in the position detection mechanism 50, the optical camera 50a and the light source 50b are disposed within a predetermined angular range from the width direction S with respect to the step E when viewed in the thickness direction T. Specifically, when viewed in the thickness direction T, the step E is a straight line extending along the movement direction A. Here, the optical camera 50a is disposed at a position spaced apart in the width direction S from the step E, which is the center point of the area to be imaged by the optical camera 50a when viewed in the thickness direction T. When viewed in the thickness direction T, the optical camera 50a can be positioned such that the angle φa between the optical camera 50a and the A axis extending along the movement direction A is in the range of 10° to 170° on the SA plane extending along the width direction S and the movement direction A. The optical camera 50a can be positioned such that the angle φa is in the range of 20° to 160°.

[0074] Similarly, light source 50b is disposed at a position spaced apart in the width direction S from a step E, which is the center point of the area to be imaged by optical camera 50a, as viewed in the thickness direction T. Light source 50b can be positioned such that the angle φa between light source 50b and the A axis along the movement direction A is in the range of 10° to 170° on the SA plane along the width direction S and the movement direction A. Light source 50b can be positioned such that the angle φa is in the range of 20° to 160°.

[0075] With this arrangement, the optical camera 50a can accurately capture an image of the step E, which is the detection target. Furthermore, the light source 50b can emit light so that the step E, which is the detection target, can be accurately captured by the optical camera 50a. This allows the position detection mechanism 50, which is configured by a pair of the optical camera 50a and the light source 50b, to reliably detect the step E.

[0076] Alternatively, the position detection mechanism 50 can be configured to measure the position of the step E using distance measurement by laser irradiation. In this case, if the position of the step E in the width direction S can be measured, the degree of freedom in the installation position relative to the step E is greater than in the case of a combination of the optical camera 50a and the light source 50b. Also, there is no need to provide the light source 50b.

[0077] In this embodiment, the position detection mechanism 50 has a first surface position detection unit 51. The first surface position detection unit 51 detects the lithium end LfE of the lithium metal film Lf on the first surface Bf, the end BE of the substrate B, and the outer end MoE of the mask M. For this reason, the first surface position detection unit 51 is disposed at a position where it can detect (sensor) the first surface Bf of the substrate B stretched between the tension roller 23 and the main roller 12. In other words, the first surface position detection unit 51 is disposed at a position where it can detect (sensor) the first surface Mf of the mask M stretched between the tension roller 33 and the main roller 12. The first surface position detection unit 51 is disposed downstream of the tension roller (transport roller) 33 and upstream of the main roller 12.

[0078] Next, a film forming method according to this embodiment will be described.

[0079] FIG. 5 is a flowchart showing the film forming method according to this embodiment. As shown in FIG. 5, the film forming method in this embodiment includes a preparation step S01, a substrate mask preparation confirmation step S02, an atmospheric transport test step S03, an exhaust step S04, a film forming step S05, a substrate mask position confirmation step S06, a film forming state confirmation step S07, a post-processing step S08, and a roll removal step S09.

[0080] The preparation step S01 includes preprocessing such as preparing the film-forming material in the film-forming source 13, checking the heating of the film-forming source 13, checking the temperature state of the main roller 12, checking the position of each roller, setting the film-forming conditions, preparing a substrate B and a mask M of a predetermined length, and checking the inside of the film-forming chamber 11. Note that any of the preparation steps in the preparation step S01 can be performed before or after the substrate mask preparation and confirmation step S02.

[0081] The substrate B prepared in the preparation step S01 of this embodiment has a lithium metal film Lf formed on a first surface Bf thereof. The prepared substrate B has a length of, for example, about 1000 m. In the preparation step S01, the control unit 14 acquires in advance the width dimension Mt of the mask M in the width direction S, the width dimension of the substrate B in the width direction S, the width dimension of the deposited lithium metal film Lf, and the width dimension of the lithium metal film Lb to be deposited.

[0082] In the substrate mask preparation confirmation step S02, as the next preparation step, the substrate B is placed around each transport roller and the main roller 12 to be ready for transport. Similarly, the mask M is placed around each transport roller and the main roller 12 to be ready for transport. Furthermore, the substrate mask preparation confirmation step S02 is a confirmation step of confirming whether the substrate B is set at the correct position in the axial direction of the rollers.The substrate mask preparation confirmation step S02 is a confirmation step of confirming whether the mask M is set at the correct position in the axial direction of the rollers.

[0083] In the substrate mask preparation confirmation step S02, the relative position of the substrate B and the mask M is detected using the position detection mechanism 50 during the confirmation step. The position detection mechanism 50 outputs the detection result to the control unit 14. If the detection result falls within a predetermined range, the process proceeds to the exhaust step S03.

[0084] If the detection result is not within a predetermined range, the control unit 14 controls the driving of the position adjustment mechanism 40. The relative position of the substrate B and the mask M is adjusted by driving the position adjustment mechanism 40. At this time, the position adjustment mechanism 40 adjusts the axial positions (width direction positions) of the mask unwinding roller 31 and the mask winding roller 32. When checking again, the position detection mechanism 50 is used to detect the relative position of the substrate B and the mask M. The adjustment is repeated until the relative position of the substrate B and the mask M reaches a predetermined state.

[0085] In the substrate mask preparation confirmation step S02, a confirmation step is performed to check whether wrinkles have occurred in the substrate B. In the substrate mask preparation confirmation step S02, a confirmation step is performed to check whether wrinkles have occurred in the mask M. If wrinkles have occurred in either the substrate B or the mask M, the position detection mechanism 50 is used to adjust the winding state of the substrate B and the mask M to eliminate the wrinkles.

[0086] In the atmospheric transfer test step S03, transfer is performed in the atmosphere as a transfer test prior to the actual film formation. At this time, the atmospheric transfer test step S03 checks whether wrinkles have occurred in the substrate B. In the atmospheric transfer test step S03, it checks whether wrinkles have occurred in the mask M. If wrinkles have not occurred in either the substrate B or the mask M, the process proceeds to the exhaust step S04. If wrinkles have occurred in either the substrate B or the mask M, the position detection mechanism 50 is used to adjust the winding state of the substrate B and the mask M to eliminate the wrinkles.

[0087] In the exhaust step S04, the controller 14 controls the atmosphere adjustment unit 11g to reduce the pressure of the atmosphere inside the film formation chamber 11. The atmosphere adjustment unit 11g may supply an atmospheric gas necessary for the film formation atmosphere. Once the predetermined film formation atmosphere is reached, the process proceeds to the film formation step S05. The atmosphere adjustment unit 11g can also adjust the film formation atmosphere at least in the vicinity of the main roller 12 to predetermined conditions. The atmosphere adjustment unit 11g can also adjust the atmosphere in the entire area where the metal lithium film Lf is transported to predetermined conditions. In particular, it is preferable to reduce the moisture content in the vicinity of the metal lithium film Lf.

[0088] In the film formation step S05, the control unit 14 controls the atmosphere adjusting unit 11g to maintain the film formation atmosphere inside the film formation chamber 11, and the control unit 14 controls the film formation source 13 to supply the film formation material to the film formation position on the circumferential surface of the main roller 12. In the film formation step S05, the control unit 14 controls each conveying roller to convey the substrate B and the mask M.

[0089] In the substrate mask position confirmation step S06, the relative position of the substrate B and the mask M is detected using the position detection mechanism 50 during film formation. In the substrate-mask position confirmation step S06, the position detection mechanism 50 looks only at the first surface Bf of the substrate B and the first surface Mf of the mask M, and detects the lithium end LfE of the lithium metal film Lf on the first surface Bf, the end BE of the substrate B, and the outer end MoE of the mask M. The first surface position detection unit 51 detects the step LfE between the first surface Bf of the substrate B and the lithium metal film Lf, or the step BE between the first surface Mf of the mask M and the substrate B, and the inner step MiE between the second surface Bb of the substrate B and the mask M. The position detection mechanism 50 outputs the detection results to the control unit 14. In this embodiment, the position detection mechanism 50 does not detect the second surface Bb of the substrate B.

[0090] In the substrate mask position confirmation step S06, the control unit 14 calculates the distance W in the width direction S between the edge position BE of the substrate B and the lithium edge LfE of the lithium metal film Lf, as shown in FIG. 2, from the detection result of the first surface position detection unit 51. In the substrate mask position confirmation step S06, the control unit 14 calculates the distance X in the width direction between the outer edge MoE of the mask M and the edge BE of the substrate B, from the detection result of the first surface position detection unit 51. In the substrate mask position confirmation step S06, the control unit 14 calculates the distance Y between the edge BE of the substrate B and the film formation edge MiE defined by the inner edge MiE of the mask M, from the width dimension Mt of the mask M and the distance X. In the substrate mask position confirmation step S06, the control unit 14 calculates the difference ΔZ between the distance W and the distance Y.

[0091] where: Y=Mt-X ΔZ=WY ΔZ=W+X-Mt is.

[0092] Furthermore, in the substrate mask position confirmation step S06, the control unit 14 controls the position adjustment mechanism 40 so as to reduce the difference ΔZ to the allowable amount within the product specifications. Specifically, when the difference ΔZ is a positive value, that is, when the difference ΔZ is a value that would increase the width dimension of the lithium metal film Lb to be formed, the mask M is moved toward the center of the substrate B, and the position adjustment mechanism 40 is controlled to reduce the difference ΔZ.

[0093] Furthermore, if the difference ΔZ is a negative value, that is, if the difference ΔZ is a value that reduces the width dimension of the lithium metal film Lb to be formed, the position adjustment mechanism 40 is controlled to move the mask M away from the center of the substrate B and bring the difference ΔZ closer to zero. The control unit 14 controls the position adjustment mechanism 40 to move the mask unwinding roller 31 and the mask winding roller 32 to axial positions (widthwise positions) to optimize the relative positions of the substrate B and the mask M.

[0094] Here, the difference ΔZ is adjusted to within a range of, for example, 0.1 mm, and the difference ΔZ is adjusted to within a range of a few mm at most, and approximately 1 mm at most. In the substrate mask position confirmation step S06, if the difference ΔZ is within a predetermined range, the process proceeds to the film formation state confirmation step S07. In the substrate mask position confirmation step S06, if the difference ΔZ is not within the predetermined range, the relative positions of the substrate B and the mask M are detected again, and then the relative positions of the substrate B and the mask M are adjusted. In the substrate mask position confirmation step S06, if the difference ΔZ is within the predetermined range, the film formation step S05 continues.

[0095] In the film formation state confirmation step S07, it is confirmed whether the thickness of the formed lithium metal film Lb is within a predetermined range, and whether the thickness of the formed lithium metal film Lb is within a predetermined variation range. In the film formation state checking step S07, if the film thickness of the lithium metal film Lb is within a predetermined range and the film thickness of the lithium metal film Lb is within a predetermined variation range, the film formation step S05 is continued. The substrate mask position checking step S06 and the film formation state checking step S07 continue in parallel during the film formation step S05.

[0096] After the film forming step S05 is completed, the process proceeds to the post-treatment step S08. The post-processing step S08 is initiated when the film formation process is completed up to a predetermined length, for example, the entire length of the substrate B. The post-processing step S08 involves cooling the substrate B after film formation, cooling the film formation source 13, cooling the main roller 12, or stopping the heating of these. Furthermore, the post-processing step S08 involves stopping the transport of the substrate B and mask M, supplying a post-processing gas into the film formation chamber 11 by the atmosphere adjustment unit 11g, and stopping the exhaust by the atmosphere adjustment unit 11g. The post-processing gas supply may include argon gas and carbon dioxide gas. The post-processing step S08 involves performing a passivation process on the lithium metal film Lb after film formation.

[0097] After the post-treatment step S08 is completed, the process proceeds to the roll removal step S09. In the roll removal step S09, the substrate B, which has been wound around the winding roller 22 after the formation of the lithium metal film Lb, is removed from the film formation chamber 11. This completes the film formation.

[0098] According to the film formation apparatus 10 and film formation method of this embodiment, in the substrate-mask position confirmation step S06, only the first surface Bf of the substrate B and the first surface Mf of the mask M are detected, and the positional relationship in the width direction S between the edge BE of the substrate B, the lithium edge LfE of the lithium metal film Lf, and the outer edge MoE of the mask M is detected as described above. The control unit 14 calculates the respective distances W, X, and Y from these detection results and calculates the difference ΔZ based on these. This allows the control unit 14 to accurately obtain the relative position between the substrate B and the mask M without detecting from the second surface Bb. Furthermore, the control unit 14 adjusts the positions of the substrate B and the mask M based on the obtained difference ΔZ. This allows the position adjustment mechanism 40 to easily adjust the lithium metal film Lf formed on the first surface to coincide with the film formation position on the second surface.

[0099] A second embodiment of the film deposition apparatus and film deposition method according to the present invention will be described below with reference to the drawings. FIG. 6 is a schematic diagram showing a film forming apparatus according to this embodiment. This embodiment differs from the first embodiment described above in terms of the front-side main roller 12f, and other configurations corresponding to those of the first embodiment described above are given the same reference numerals and descriptions thereof will be omitted.

[0100] 6, the film forming apparatus 10 in this embodiment has a front-side main roller 12f, and also has a film forming source 13f, a tension roller 23f, a tension roller 24f, a mask unwinding roller 31f, a mask winding roller 32f, a tension roller 33f, and a tension roller 34f.

[0101] In the film forming apparatus 10 of this embodiment, a film is formed on a first surface of the substrate B at the front side main roller 12f. The film forming source 13f, tension roller 23f, tension roller 24f, mask unwinding roller 31f, mask winding roller 32f, tension roller 33f, and tension roller 34f all have the same reference numerals as the corresponding components in the first embodiment, with the addition of f. Note that, in the components related to the front side main roller 12f, a component corresponding to the position adjustment mechanism 40 may or may not be provided.

[0102] In the film-forming apparatus 10 of this embodiment, after the front-side main roller 12f forms a lithium metal film Lf on the first surface Bf of the substrate B, the main roller 12 successively forms a lithium metal film Lb on the second surface Bb of the substrate B. The front-side main roller 12f and the main roller 12 are housed in the same film-forming chamber 11. The substrate B is transported within the same film-forming chamber 11. The lithium metal films L are formed on both surfaces of the substrate B while the film-forming atmosphere is maintained without being exposed to the external atmosphere.

[0103] In this embodiment, the same effects as those of the above-described embodiment can be achieved.

[0104] A third embodiment of the film deposition apparatus and film deposition method according to the present invention will be described below with reference to the drawings. Fig. 7 is a schematic diagram showing a film forming apparatus in this embodiment, and Fig. 8 is a schematic cross-sectional view showing a film forming method in this embodiment. This embodiment differs from the second embodiment described above in terms of the position detection mechanism 50, and the other corresponding components are denoted by the same reference numerals and the description thereof will be omitted.

[0105] In the film forming apparatus 10 of this embodiment, as shown in FIG. 7, the position detection mechanism 50 has a first surface film forming position detection unit 52 and a second surface position detection unit 53. The first-side film-forming position detection unit 52 observes the substrate B from the first side Bf, and detects the substrate B and the first-side film-forming position of the lithium metal film Lf formed on the first side of the substrate B. The first-side film-forming position detection unit 52 observes the substrate B from the first side Bf after film formation on the first side. The first-side film-forming position detection unit 52 is located downstream of the front-side main roller 12f and upstream of the main roller 12 in the transport direction of the substrate B.

[0106] 7, the first-side film-forming position detection unit 52 is provided at a position where the first side Bf of the substrate B can be observed between the front-side main roller 12f and the tension roller (transport roller) 24f. Alternatively, the first-side film-forming position detection unit 52 may be provided at a position where the first side Bf of the substrate B can be observed between the tension roller (transport roller) 24f and the tension roller (transport roller) 23. The first-side film-forming position detection unit 52 may be provided at a position where the first side Bf of the substrate B can be observed between the tension roller (transport roller) 23 and the tension roller (transport roller) 33. Furthermore, the first-side film-forming position detection unit 52 may be provided at a position where the first side Bf of the substrate B can be observed between the tension roller (transport roller) 23 and the main roller 12.

[0107] The second surface position detection unit 53 observes the substrate B and the mask M from the second surface Bb, and detects the relative positions of the substrate B and the mask M before film formation on the second surface. The second surface position detection unit 53 is provided at a position corresponding to the position where the first surface position detection unit 51 in the second embodiment can observe the second surface Bb. In other words, the second surface position detection unit 53 is provided at a position where it can observe the second surface Bb of the substrate B and the second surface Mb of the mask M. The second surface position detection unit 53 is located downstream of the tension roller (conveyor roller) 33 and upstream of the main roller 12.

[0108] In the film forming method of this embodiment, in the substrate mask position confirmation step S06, the first surface Bf is detected by the first surface film forming position detection unit 52, and the second surface Bb is detected by the second surface position detection unit 53. 8 , in the substrate mask position confirmation step S06, after the first-side film formation on the front-side main roller 12f, first, the positional relationship between the first surface Bf of the substrate B and the lithium metal film Lf on the first surface Bf is detected by the first-side film formation position detection unit 52. Specifically, the first-side film formation position detection unit 52 detects the position of the end BE of the substrate B in the width direction S and the position of the lithium end LfE of the lithium metal film Lf in the width direction S. The first-side film formation position detection unit 52 outputs the detection result to the control unit 14.

[0109] The control unit 14 calculates the distance W in the width direction S between the position of the substrate end BE and the position of the lithium end LfE from the detection result of the first surface film formation position detection unit 52.

[0110] Thereafter, in a substrate mask position confirmation step S06, before the second surface deposition, the second surface Bb of the substrate B is observed by the second surface position detection unit 53 to detect the positional relationship of the inner end MiE in the width direction S of the mask M. The second surface position detection unit 53 detects the position of the mask inner end MiE of the mask M that overlaps the substrate B. The second surface position detection unit 53 outputs the detection result to the control unit 14.

[0111] The control unit 14 adds the detection result of the second surface position detection unit 53 to the calculation result of the distance W, and calculates the distance Y from the previously acquired mask width dimension Mt to the substrate end BE position and the film formation position end position defined by the mask inner end MiE of the mask M. The control unit 14 calculates the difference ΔZ between the distance W and the distance Y. The control unit 14 can accurately calculate the relative position of the substrate B and the mask M by performing detection from the first surface Bf and the second surface Bb.

[0112] where: ΔZ=WY The substrate edge BE is not observed from the second surface Bb side. Furthermore, there is no step on the mask M when viewed from the second surface Mb, and the mask M is not made of a light-transmitting material. For this reason, the detection results from the first surface Bf and the detection results from the second surface Bb are combined to calculate the difference ΔZ.

[0113] Furthermore, similarly to the above-described embodiment, in the substrate mask position confirmation step S06, the control unit 14 controls the position adjustment mechanism 40 so as to reduce the difference ΔZ to the allowable amount in the product specifications.

[0114] In this way, the control unit 14 can combine the detection results of the first surface film formation position detection unit 52 and the detection results of the second surface position detection unit 53 to control the position adjustment mechanism 40 so that the lithium end LfE of the lithium metal film Lf formed on the first surface coincides with the film formation end MiE in the width direction S in the film formation area. Therefore, it is possible to accurately set the deposition position for second surface deposition by adjusting the positions of the substrate B and the mask M without simultaneously detecting the positional relationship between the end BE in the width direction S of the substrate B and the deposition end MiE of the deposition area. In this embodiment, the positions of the lithium metal film Lf formed on the first surface and the lithium metal film Lb formed on the second surface can be easily aligned.

[0115] A fourth embodiment of the film deposition apparatus and film deposition method according to the present invention will be described below with reference to the drawings. Fig. 9 is a schematic diagram showing a film forming apparatus in this embodiment, and Fig. 10 is a schematic cross-sectional view showing a film forming method in this embodiment. This embodiment differs from the third embodiment described above in terms of the position detection mechanism 50, and the other corresponding components are denoted by the same reference numerals and descriptions thereof will be omitted.

[0116] In the film forming apparatus 10 of this embodiment, the position detection mechanism 50 has a first surface film forming position detection unit 52, as shown in FIG.

[0117] In the film forming apparatus 10 of this embodiment, the first surface Bf is detected by the first surface film forming position detection unit 52 in the substrate mask position confirmation step S06. 8, in the substrate mask position confirmation step S06, after the first-side film formation on the front-side main roller 12f, first, the first-side film-forming position detection unit 52 detects the positional relationship of the lithium metal film Lf on the first side Bf of the substrate B. Specifically, the first-side film-forming position detection unit 52 detects the position of the lithium end LfE in the width direction S of the lithium metal film Lf. The first-side film-forming position detection unit 52 outputs the detection result to the control unit 14.

[0118] The control unit 14 provisionally calculates the distance W in the width direction S between the position of the substrate end BE and the position of the lithium end LfE from the detection result of the first surface film formation position detection unit 52.

[0119] Thereafter, in a substrate mask position confirmation step S06, before the film formation on the second surface, the control unit 14 acquires in advance the position of the mask M relative to the substrate B in the film formation area of ​​the main roller 12. This position of the mask M relative to the substrate B on the main roller 12 is acquired from the set positions of the mask unwinding roller 31 and the mask winding roller 32 by the position adjustment mechanism 40. At the same time, before the second surface film formation, the control unit 14 acquires the mask width dimension Mt.

[0120] The control unit 14 calculates the difference ΔZ between the position of the lithium end LfE and the distance Y to the film formation position end position defined by the inner end MiE of the mask M from the provisional calculation result of the distance W, the position of the mask M relative to the substrate B acquired in advance, and the mask width dimension Mt.

[0121] Here, the first-surface film-forming position detection unit 52 does not detect the position of the end BE of the substrate B in the width direction S. The position of the lithium metal film Lf is identified by observation from the first surface Bf side. This is because, in later processes for manufacturing a lithium-ion secondary battery, both ends of the substrate B are removed, and the vicinity of the cut portion BE is not required, and only the vicinity of the lithium end LfE is used. Therefore, the necessary information is the position of the lithium end LfE, and in order to align the lithium end LfE with the lithium end LbE, the movement amount of the mask M in the width direction S is calculated as the difference ΔZ.

[0122] Furthermore, similarly to the above-described embodiment, in the substrate mask position confirmation step S06, the control unit 14 controls the position adjustment mechanism 40 so as to reduce the difference ΔZ to the allowable amount in the product specifications. By controlling the position adjusting mechanism 40, it is possible to adjust the lithium end LfE of the lithium metal film Lf formed on the first surface so as to coincide with the film formation end MiE of the film formation region.

[0123] In the above configuration, the position detection mechanism 50 can observe the substrate B and mask M only from the first surfaces Bf, Mf and detect the necessary information, i.e., the lithium end LfE in the width direction S of the lithium metal film Lf. The control unit 14 calculates the difference ΔZ required for movement control from this detection result, the previously acquired mask width dimension Mt, and the setting state of the relative position between the mask M and substrate B for film formation on the second surface. This allows the control unit 14 to obtain the information required for accurate control of the relative position between the substrate B and mask M without detecting from the second surface Bb. Furthermore, the position adjustment mechanism 40 can perform film formation in a state where the positions of the lithium metal film Lf formed on the first surface and the lithium metal film Lb formed on the second surface are aligned. In particular, with this configuration, it is possible to detect the substrate B and the mask M only from the first surface Bf immediately after the first surface film formation is performed.

[0124] A fifth embodiment of the film deposition apparatus and film deposition method according to the present invention will be described below with reference to the drawings. FIG. 11 is a partial schematic diagram showing a film forming apparatus according to this embodiment. This embodiment differs from the above-described embodiments in terms of the tension roller 38, and the other corresponding components are given the same reference numerals and their description will be omitted.

[0125] The film forming apparatus 10 of this embodiment has a tension roller 38, as shown in FIG. The tension roller 38 is disposed immediately upstream of the main roller 12. The substrate B and the mask M are stretched over the tension roller 38. The tension roller 38 is provided between the main roller 12 and the tension roller 23 in the movement direction A in which the substrate B is transported. The tension roller 38 is provided between the main roller 12 and the tension roller 33 in the movement direction A in which the mask M is transported. Between the tension roller 38 and the main roller 12, tension is applied so that the substrate B and the mask M come into close contact with each other.

[0126] Here, if the tension roller 38 is not present, the substrate B is stretched over the tension roller 23 and the main roller 12 so as to form a straight line when viewed in the axial direction. In contrast, the tension roller 38 is provided at a position where it presses the substrate B against the main roller 12 and the tension roller 23 in a direction in which the second surface Bb protrudes. By providing the tension roller 38, the substrate B and the mask M can be brought into closer contact with each other before coming into contact with the main roller 12. This enables the position detection mechanism 50 to more accurately detect the relative positions of the substrate B and the mask M.

[0127] Furthermore, in the present invention, it is also possible to individually select and combine the individual configurations in the above-described embodiments. [Explanation of symbols]

[0128] 10…Film deposition equipment 11...Film formation chamber 12...Main roller 13…Film formation source 14...Control unit 21...Unwinding roller 22... Winding roller 23, 24...Tension rollers (transport rollers) 31...Mask unwinding roller 32...Mask winding roller 33, 34...Tension rollers (transport rollers) 38...Tension roller 40,41,42,43,44…Position adjustment mechanism 50...Position detection mechanism 51...First surface position detection unit 52...First surface deposition position detection unit 53...Second surface position detection unit B...Base material Bf...front page Bb…Second side L, Lf, Lb...Lithium metal film M...Mask E...Step BE…Base material edge (step) LfE...Lithium edge (step) MoE: Outer edge (step) MiE: Inner edge, coating edge (step) W, X, Y... distance ΔZ…difference

Claims

1. An apparatus for forming a lithium metal film on both sides of a long substrate, a deposition chamber; a deposition source for supplying a deposition material into the deposition chamber; a main roller that forms a film on the film-forming surface of the substrate along its circumferential surface; an unwinding roller that unwinds the substrate toward the main roller; a take-up roller that takes up the substrate from the main roller; a long mask that is in close contact with the film-forming surface of the substrate along the circumferential surface of the main roller and that restricts a film-forming region; a mask unwinding roller that unwinds the mask toward the main roller; a mask take-up roller that takes up the mask from the main roller; a position detection mechanism for detecting a relative position between the substrate and the mask after film formation on a first surface and before film formation on a second surface of the substrate; a position adjustment mechanism that adjusts the relative position between the substrate and the mask on the circumferential surface of the main roller before film formation on the second surface of the substrate; A control unit; Equipped with A film forming apparatus characterized by:

2. the position adjustment mechanism adjusts the relative positions of the main roller, the mask unwinding roller, and the mask winding roller in the axial direction under the control of the control unit.

2. The film forming apparatus according to claim 1.

3. The position detection mechanism includes: a first surface position detection unit that observes the substrate and the mask from a first surface before they are aligned along the circumferential surface of the main roller, and detects the relative positions of the substrate and the mask before film formation on a second surface; 3. The film forming apparatus according to claim 2.

4. The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from a first surface and detects a first-surface film-deposition position of the lithium metal film deposited on the first surface of the substrate; a second surface position detection unit that observes the substrate and the mask from a second surface and detects the relative position between the substrate and the mask before film formation on the second surface; having 3. The film forming apparatus according to claim 2.

5. The position detection mechanism includes: a first-surface film-deposition position detection unit that observes the substrate from the first surface and detects a first-surface film-deposition position of a lithium metal film formed on the first surface of the substrate; 3. The film forming apparatus according to claim 2.

6. a first-surface-side main roller for forming a film on a first surface of the substrate in the film-forming chamber; A first surface film formation and a second surface film formation are performed successively in the film formation chamber.

2. The film forming apparatus according to claim 1.

7. the position detection mechanism detects a relative position between an end of the base material in a width direction and an end of the mask in a width direction.

2. The film forming apparatus according to claim 1.

8. the position detection mechanism detects a step between the substrate and the mask and / or a step between the substrate and the lithium metal film.

2. The film forming apparatus according to claim 1.

9. a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the first surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller.

4. The film forming apparatus according to claim 3.

10. a tension roller for detecting tension of the substrate and the mask between the mask unwinding roller and the main roller; the second surface position detection unit detects the relative position of the substrate and the mask between the tension roller and the main roller.

5. The film forming apparatus according to claim 4.

11. A method for forming a film in the film forming apparatus according to claim 3, Before the substrate and the mask are moved along the circumferential surface of the main roller, The first surface position detection unit detects a substrate end position in the width direction, a mask end position that protrudes outward in the width direction from the substrate end position, and a lithium end position in the width direction; The control unit, based on the detection result of the first surface position detection unit, Calculating the distance W in the width direction between the substrate end position and the lithium end position; Calculating a distance X in the width direction between the mask end position and the substrate end position; Calculating a distance Y from the substrate edge position to the film formation edge position in the width direction defined by the mask based on the mask width dimension and the distance X; A difference ΔZ between the distance W and the distance Y is calculated, controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount in a product standard; A film forming method characterized by:

12. A method for forming a film in the film forming apparatus according to claim 4, Before the substrate is moved along the circumferential surface of the main roller, detecting a substrate end position in the width direction and a lithium end position in the width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculating the distance W in the width direction between the substrate end position and the lithium end position; The second surface position detection unit detects a mask inner edge position that overlaps with the base material; The control unit adds the detection result of the second surface position detection unit to the Calculating a distance Y from the mask width dimension to the substrate edge position and the film formation position edge position in the width direction defined by the mask; A difference ΔZ between the distance W and the distance Y is calculated, controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount in a product standard; A film forming method characterized by:

13. A method for forming a film in the film forming apparatus according to claim 5, Before the substrate is moved along the circumferential surface of the main roller, detecting an end position of lithium in a width direction by the first surface film formation position detection unit; The control unit, based on the detection result of the first surface film formation position detection unit, Calculating a difference ΔZ between a film formation end position in the width direction defined by the mask from a preset position in the width direction of the mask and the lithium end position; controlling the position adjustment mechanism so as to reduce the difference ΔZ to an allowable amount in a product standard; A film forming method characterized by:

Citation Information

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