Manufacturing method for ceramic substrates

Abstract

To provide a method for manufacturing ceramic substrates with high precision. [Solution] The method for manufacturing a ceramic substrate comprises the steps of pressing the ceramic substrate (5) with a press unit (100) to form holes (51, 52) in the ceramic substrate (5) (see, for example, Figure 1(a)), and firing the ceramic substrate (5) while it is pressed by the press unit (100) (see, for example, Figure 1(b)).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a ceramic substrate.

Background Art

[0002] In recent years, as a method for manufacturing a ceramic substrate, a method is known in which holes and cavities are formed in a ceramic green sheet, and then the ceramic green sheets are laminated and the laminate is fired (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, as described in Patent Document 1 above, when firing is performed separately after processing holes and cavities, there is a problem that the hole positions are displaced and the processing accuracy is reduced.

[0005] Therefore, an object of the present invention is to provide a method for manufacturing a ceramic substrate with high processing accuracy.

Means for Solving the Problems

[0006] One aspect of the present invention is a method for manufacturing a ceramic substrate, including a step of pressing a ceramic substrate by a pressing unit to form holes in the ceramic substrate, and a step of firing the ceramic substrate in a state where the ceramic substrate is pressed by the pressing unit. The method for manufacturing a ceramic substrate is characterized by this.

Effects of the Invention

[0007] According to the present invention, a ceramic substrate can be manufactured with high processing accuracy. [Brief explanation of the drawing]

[0008] [Figure 1] (a) A diagram showing the ceramic substrate placed in the press section, (b) A diagram showing the ceramic substrate being fired while being pressed by the press section, and (c) A diagram showing the through-hole being formed in the fired ceramic substrate. [Figure 2] (a) A diagram showing a raw ceramic substrate, (b) A diagram showing a pressed ceramic substrate, (c) A diagram showing a ceramic substrate with through holes formed. [Modes for carrying out the invention]

[0009] The following describes a method for manufacturing a substrate according to an embodiment of the present invention. As shown in Figure 1(a), the substrate manufacturing apparatus 1 in this embodiment includes a press section (press machine) 100 having an upper press machine 2 and a lower press machine 3. A raw ceramic substrate 5 is placed between the upper press machine 2 and the lower press machine 3 and pressed.

[0010] More specifically, when manufacturing a ceramic substrate using the substrate manufacturing apparatus 1 described above, first, a raw ceramic substrate (green sheet) 5 (see Figure 2(a)) before firing, as shown in Figure 1(a), is placed between the upper press machine 2 and the lower press machine 3.

[0011] When a raw ceramic substrate 5 is placed between the upper press machine 2 and the lower press machine 3, the upper press machine 2 and the lower press machine 3 move closer together, and as shown in Figure 1(b), the raw ceramic substrate 5 is pressed between the upper press machine 2 and the lower press machine 3. Alignment mark processing pins 21 are formed on the upper press machine (first mold) 2, protruding downward from its press surface (first mold surface), and cavity processing pins 31 are formed on the lower press machine (second mold) 3, protruding upward from its press surface (second mold surface). Therefore, when the ceramic substrate 5 is pressed, alignment marks 51 (four in this embodiment) and a cavity (one in this embodiment) are formed by these alignment mark processing pins 21 and cavity processing pins 31, as shown in Figure 2(b).

[0012] Next, the substrate manufacturing apparatus 1 fires and solidifies the ceramic substrate 5 while it is being pressed by the upper press machine 2 and the lower press machine 3, without releasing the press. The heating method for firing the ceramic substrate 5 using the heating section can be any method; for example, the ambient temperature around the press section 100 may be increased by the heating section, or the molding dies of the upper press machine 2 and the lower press machine 3 may be heated, or a combination of these may be used. In this embodiment, the pressed green sheet is fired at a temperature of approximately 1000°C or less.

[0013] Once the ceramic substrate 5 has been fired, the press from the upper press 2 and the lower press 3 is released, and through holes 53 are processed into the fired ceramic substrate 5 by a drilling unit (not shown). In this embodiment, the through holes 53 are laser-processed into the ceramic substrate 5 by the drilling unit based on the alignment marks 51.

[0014] The substrate manufacturing apparatus 1 then embeds conductors in the through holes 53, prints wiring material on the front and back surfaces of the substrate 5 to form a circuit pattern, and completes the processing of the single-layer ceramic substrate 5. This ceramic substrate 5 may then be laminated with other ceramic substrates 5 and fired to integrate them. Furthermore, this ceramic substrate 5 can be used, for example, as a substrate for an electronic circuit board.

[0015] <Summary> [Configuration 1] A method for manufacturing a ceramic substrate (5), A step of pressing the ceramic substrate (5) with a press unit (100) to form holes (51, 52) in the ceramic substrate (5) (see, for example, Figure 1(a)), The process includes a step of firing the ceramic substrate (5) while it is being pressed by the pressing section (100) (see, for example, Figure 1(b)), A method for manufacturing a ceramic substrate, characterized by the following:

[0016] Thus, in order to fire the ceramic substrate 5 in a pressed state, the influence of deformation of the ceramic substrate 5 due to heating is suppressed, and holes such as the alignment marks 51 and the cavities 52 described above can be accurately formed in the ceramic substrate 5. Further, in the present embodiment, since the ceramic substrate 5 is fired while being pressed, the drilling and firing of the ceramic substrate 5 can be performed in the same apparatus, and the processing efficiency can be improved. In particular, processing the cavities 52 and the like described above for the fired ceramic requires very advanced processing technology. However, since the processing is performed in the process of firing while pressing, the cavities 52 and the like can be easily processed. Note that the holes in the present embodiment include through holes and blind holes, and their shapes do not necessarily have to be circular. Further, in the above-described embodiment, both the alignment marks 51 and the cavities 52 are formed as holes in the ceramic substrate 5. However, for example, only the cavities 52 may be formed in the ceramic substrate 5 by pressing. Further, only the alignment marks 51 may be formed in the ceramic substrate 5 by pressing.

[0017] [Configuration 2] A step of forming a through hole (53) in the fired ceramic substrate (5) (see FIG. 1(c)), The manufacturing method of the ceramic substrate (5) according to Configuration 1, characterized in that.

[0018] Thus, by forming the through hole 53 in the ceramic substrate 5 after firing the ceramic substrate 5, the influence of firing on the through hole 53 can be suppressed, and the through hole can be processed with high precision. In particular, in the present embodiment, combined with the accurate formation of the alignment mark 51 serving as a reference for the through hole 53 as described above, the through hole can be processed more accurately.

[0019] [Configuration 3] The hole formed by the pressing includes at least one of an alignment mark and a cavity, The manufacturing method of the ceramic substrate according to Configuration 1 or 2, characterized in that.

[0020] By doing so, at least one of the alignment mark 51 and the cavity 52 can be formed with high precision.

Explanation of Signs

[0021] 5: Ceramic substrate 51, 52: Holes (alignment mark, cavity) 53: Through hole 100: Pressing part

Claims

1. A method for manufacturing a ceramic substrate, A process of pressing a ceramic substrate with a press unit to form holes in the ceramic substrate, The process includes firing the ceramic substrate while it is being pressed by the aforementioned pressing unit, A method for manufacturing a ceramic substrate, characterized by the following:

2. The process includes forming through holes in the fired ceramic substrate, A method for manufacturing a ceramic substrate according to claim 1.

3. The hole formed by the press includes at least one of an alignment mark and a cavity. A method for manufacturing a ceramic substrate according to claim 1 or 2, characterized in that it is as described above.

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