Contactless data transmitter / receiver label, label sheet, and method for manufacturing contactless data transmitter / receiver label
The contactless data transmitter/receiver label with an IC chip and antenna, detection wiring, and intervening sheet simplifies installation by eliminating the need for folding, ensuring easy and secure attachment while protecting the detection wiring.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2026-03-13
AI Technical Summary
Existing IC labels require folding to form a flap for installation, making the process cumbersome.
A contactless data transmitter/receiver label comprising an inlet sheet with an IC chip and antenna, detection wiring, adhesive layer, intervening sheet, pseudo-adhesive layer, and cover sheet, allowing easy attachment to objects without folding.
Facilitates easy installation and reduces damage to detection wiring, enabling simple and secure attachment to objects.
Smart Images

Figure 2026046292000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a non-contact data transmitter label, a label sheet, and a method for manufacturing a non-contact data transmitter label.
Background Art
[0002] For example, IC labels are used for the purpose of efficiently performing distribution management, history management, article management, etc. In an IC label, for example, an IC chip and an antenna are provided on a base material (see, for example, Patent Document 1). The IC label can be attached to an installation object by an adhesive layer, for example.
[0003] In the label described in Patent Document 1, a transponder is provided on a sheet-like base material. This label can be attached to an object by folding the base material to form a flap.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, since the label needs to fold the base material to form a flap, the work of installing it on an object may be troublesome.
[0006] One aspect of the present invention aims to provide a non-contact data transmitter label, a label sheet, and a method for manufacturing a non-contact data transmitter label that can be easily installed on an object.
Means for Solving the Problems
[0007] One aspect of the present invention provides a contactless data transmitter / receiver label comprising: an inlet sheet; a communication unit provided on the inlet sheet and having an IC chip and an antenna connected to the IC chip; a detection wiring provided on the inlet sheet and connected to the IC chip; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer for attaching the intervening sheet to the release sheet, wherein the intervening sheet is provided in a portion of the inlet sheet in a plan view and overlaps with at least a portion of the detection wiring.
[0008] The contactless data transmitter / receiver label further comprises a cover sheet that covers the inlet sheet, and preferably the cover sheet has an end region that extends longitudinally from the inlet sheet in a plan view.
[0009] One aspect of the present invention is a label sheet on which a plurality of contactless data transmitter / receiver labels are connected, wherein the plurality of contactless data transmitter / receiver labels are connected longitudinally with the detection wiring facing one end of the label sheet.
[0010] One aspect of the present invention provides a method for manufacturing a non-contact data transmitter / receiver label, comprising: a first step of attaching an intervening sheet to one side of a release sheet with a pseudo-adhesive layer; and a second step of attaching an inlet sheet, which is provided with an IC chip, an antenna connected to the IC chip, and detection wiring connected to the IC chip, to the intervening sheet and the release sheet with an adhesive layer, wherein in the second step, the intervening sheet is positioned in a portion of the inlet sheet in a plan view, overlapping at least a portion of the detection wiring. [Effects of the Invention]
[0011] According to one aspect of the present invention, it is possible to provide a contactless data transmitter / receiver label, a label sheet, and a method for manufacturing a contactless data transmitter / receiver label that can be easily attached to an object. [Brief explanation of the drawing]
[0012] [Figure 1] This is a plan view of an IC label according to the embodiment. [Figure 2] This is a cross-sectional view of an IC label according to an embodiment. [Figure 3] This is a plan view of the label sheet according to the embodiment. [Figure 4] This is a schematic diagram showing an example of how to use the label sheet according to the embodiment. [Figure 5] This is a cross-sectional view showing an example of how to use the label sheet according to the embodiment. [Figure 6] This is a plan view showing an example of how to use an IC label according to the embodiment. [Figure 7] This is a cross-sectional view showing an example of how to use an IC label according to the embodiment. [Figure 8] This is a schematic diagram showing an example of how an IC label is used according to the embodiment. [Figure 9] This is a schematic diagram showing an example of how an IC label is used according to the embodiment. [Figure 10] This is a schematic diagram showing an example of how an IC label is used according to the embodiment. [Figure 11] This is a schematic diagram showing an example of how an IC label is used according to the embodiment. [Figure 12] This is a process diagram showing a method for manufacturing an IC label according to an embodiment. [Figure 13] This is a process diagram showing a method for manufacturing an IC label according to an embodiment. [Figure 14] This is a process diagram showing a method for manufacturing an IC label according to an embodiment. [Modes for carrying out the invention]
[0013] Hereinafter, with reference to the drawings, a non-contact data transmitter label, a label sheet, and a method for manufacturing a non-contact data transmitter label according to an embodiment will be specifically described.
[0014] [Non-contact data transmitter label (IC label)] FIG. 1 is a plan view showing a non-contact data transmitter label 10 according to an embodiment. The non-contact data transmitter label can be abbreviated as an "IC label". FIG. 2 is a cross-sectional view of the IC label 10. FIG. 2 is a cross-sectional view taken along the line I-I of FIG. 1.
[0015] As shown in FIG. 2, the IC label 10 includes an inlet sheet 1, a communication unit 2, a detection wiring 9 (see FIG. 1), an adhesive layer 3, an intervening sheet 4, a pseudo-adhesive layer 5, a release sheet 6, a cover sheet 7, and an adhesive layer 8.
[0016] The inlet sheet 1, the communication unit 2, the adhesive layer 3, the detection wiring 9 (see FIG. 1), the intervening sheet 4, the pseudo-adhesive layer 5, the cover sheet 7, and the adhesive layer 8 can be collectively referred to as a "laminated body L". It can be said that the IC label 10 has a structure in which the laminated body L is attached to the release sheet 6.
[0017] The longitudinal direction (the left-right direction in FIG. 2) of the inlet sheet 1 is the X direction. One direction in the X direction (the right side in FIG. 2) is the +X side. The direction opposite to the +X side is the -X side. The short-side direction (the up-down direction in FIG. 1) of the inlet sheet 1 is the Y direction. The Y direction is perpendicular to the X direction. One direction in the Y direction (the upper side in FIG. 1) is the +Y side. The direction opposite to the +Y side is the -Y side. The Z direction is perpendicular to the X direction and the Y direction. Looking from the Z direction is referred to as a plan view. In the present embodiment, the vertical positional relationship is provisionally defined according to FIG. 2. The upper side (+Z side) in FIG. 2 is the upper side. The lower side (-Z side) in FIG. 2 is the lower side.
[0018] As shown in Figure 1, the inlet sheet 1 comprises a first portion 13 and a second portion 14. The first portion 13 is formed in a rectangular shape in plan view. The first portion 13 is, for example, rectangular with a long side along the X direction and a short side along the Y direction. The second portion 14 extends to the -X side from the -X side end 13c of the first portion 13. The second portion 14 is formed in a rectangular shape in plan view. The second portion 14 is, for example rectangular with a long side along the X direction and a short side along the Y direction. The width (Y-direction dimension) of the second portion 14 is smaller than the width (Y-direction dimension) of the first portion 13.
[0019] The -X side end of inlet sheet 1 (the -X side end of the second part 14) is the first end 1c. The +X side end of inlet sheet 1 (the +X side end of the first part 13) is the second end 1d.
[0020] As shown in Figure 2, the inlet sheet 1 may be made of, for example, a paper substrate, a resin substrate, etc. Examples of resin substrate materials include polyester resins such as polyethylene terephthalate (PET). The -Z side surface of the inlet sheet 1 is the bottom surface 1a (first main surface). The surface of the inlet sheet 1 opposite the bottom surface 1a is the top surface 1b (second main surface).
[0021] As shown in Figure 1, the communication unit 2 includes an IC chip 11 and an antenna 12. The communication unit 2 is located on the lower surface 1a of the inlet sheet 1 (first portion 13) (see Figure 2). The IC chip 11 can write and read information in a contactless manner via the antenna 12.
[0022] The antenna 12 is electrically connected to the IC chip 11. In this embodiment, the antenna 12 is formed in a rectangular annular loop shape in a plan view. For example, the antenna 12 is rectangular in shape with a longer side along the Y direction. Specifically, the antenna 12 has two first line portions 12a, two second line portions 12b, and a third line portion 12c. The base ends of the two first line portions 12a are electrically connected to the IC chip 11. The two first line portions 12a extend away from each other along the Y direction, starting from the IC chip 11. The two second line portions 12b extend from the tips of the first line portions 12a toward the +X side. The third line portion 12c is formed along the Y direction and connects the tips of the two second line portions 12b.
[0023] The detection wiring 9 is formed on the lower surface 1a of the inlet sheet 1 (see Figure 2). The detection wiring 9 has a first wiring 9a, a second wiring 9b, and a connecting wiring 9c. The first wiring 9a and the second wiring 9b are referred to as "wiring 9a, 9b". One end of wiring 9a, 9b (the +X side end) is electrically connected to the IC chip 11. Wiring 9a, 9b extends from the IC chip 11 towards the -X side. Wiring 9a, 9b is formed from the first section 13 to the second section 14. Wiring 9a, 9b are arranged in parallel. The first wiring 9a and the second wiring 9b are formed with a gap in the Y direction. Wiring 9a, 9b in the portion formed in the second section 14 extends along the length direction of the second section 14. In a plan view, wiring 9a, 9b reaches a position close to the first end 1c of the inlet sheet 1.
[0024] The connecting wire 9c electrically connects the -X end of the first wire 9a to the -X end of the second wire 9b. The detection wire 9 has wires 9a and 9b and the connecting wire 9c that connects them, and is therefore formed in a loop shape overall.
[0025] If the detection wiring 9 is damaged (for example, if it is disconnected), it will enter a low-conductivity state (for example, a non-conductive state). A "low-conductivity state" is a state in which the conductivity is lower than that of an undamaged state. When the detection wiring 9 is in a low-conductivity state, its electrical resistance increases. When the electrical resistance of the detection wiring 9 increases, the IC chip 11 can transmit the detection result to an external device (for example, a reader / writer) via wireless communication through the antenna 12. For example, the IC chip 11 can transmit flag information based on the comparison result between the electrical resistance of the detection wiring 9 and a threshold value.
[0026] The antenna 12 and the detection wiring 9 are formed from, for example, conductive ink, a thin metal film, or metal foil. Examples of conductive inks include known polymer-type conductive inks and silver ink compositions. The thin metal film is formed by electroplating, electrostatic plating, metal vapor deposition, or the like.
[0027] It is desirable that the antenna 12 and the detection wiring 9 have a brittle property that makes them easily damaged when force is applied. Brittleness can be imparted to the antenna 12 and the detection wiring 9 by forming them from conductive ink, a thin metal film, a metal foil, or the like.
[0028] The X-direction position of the X-side end (connecting wire 9c) of the detection wire 9 in the inlet sheet 1 is close to the first end 1c. That is, the connecting wire 9c is formed at a position where its distance to the first end 1c is smaller than its distance to the second end 1d. The position of the connecting wire 9c is, for example, a position closer to the first end 1c than the center in the longitudinal direction (X direction) of the inlet sheet 1 (a position slightly to the left of the center in Figure 1).
[0029] The position of the communication unit 2 in the inlet sheet 1 in the X direction is close to the second end 1d. That is, the communication unit 2 is formed at a position where its distance to the second end 1d is smaller than its distance to the first end 1c. The position of the communication unit 2 is, for example, a position on the second end 1d side of the center in the longitudinal direction (X direction) of the inlet sheet 1 (a position slightly to the right of the center in Figure 1).
[0030] As shown in Figure 2, the adhesive layer 3 (first adhesive layer) is formed over the entire area of the lower surface 1a of the inlet sheet 1. A known adhesive commonly used for labels can be used as the adhesive for the adhesive layer 3. The adhesive layer 3 adheres the inlet sheet 1 to the upper surface 4b of the interlining sheet 4 and the upper surface 6b of the release sheet 6.
[0031] The intervening sheet 4 is provided between the adhesive layer 3 and the release sheet 6. The intervening sheet 4 may be, for example, a paper substrate, a resin substrate, etc. Examples of resin substrate materials include polyester resins such as polyethylene terephthalate (PET). The -Z side surface of the intervening sheet 4 is the bottom surface 4a (first main surface). The surface of the intervening sheet 4 opposite to the bottom surface 4a is the top surface 4b (second main surface).
[0032] As shown in Figure 1, in a plan view, the intervening sheet 4 overlaps with the intermediate region 15 (partial region), which is a part of the length of the second portion 14 of the inlet sheet 1. The intervening sheet 4 is rectangular in a plan view. The length of the intervening sheet 4 (dimension in the X direction) is smaller than the length of the second portion 14 (dimension in the X direction). The width of the intervening sheet 4 (dimension in the Y direction) is approximately the same as the width of the second portion 14 (dimension in the Y direction).
[0033] In a plan view, the intervening sheet 4 encompasses the middle portion of the detection wiring 9 in the longitudinal direction. More specifically, the intervening sheet 4 encompasses the middle portion of the wirings 9a and 9b in the longitudinal direction. The first end 4c (the -X side end) of the intervening sheet 4 is located on the +X side of the tip (connecting wiring 9c) of the detection wiring 9. Therefore, in a plan view, the portion of the detection wiring 9 including the tip (connecting wiring 9c) protrudes from the first end 4c of the intervening sheet 4 on the -X side. The second end 4d (the +X side end) of the intervening sheet 4 is located close to the base end (the +X side end) of the second part 14 in a plan view. The second end 4d may also be located on the -X side of the base end of the second part 14 in a plan view.
[0034] The region of the laminate L in which the intervening sheet 4 is formed is called "partial region L1". Partial region L1 is the middle portion of the laminate L in the longitudinal direction.
[0035] In a plan view, the intervening sheet 4 is provided in an area that overlaps with a portion of the detection wiring 9 (the middle portion in the longitudinal direction), but the intervening sheet may encompass the entire length of the detection wiring. In other words, the intervening sheet only needs to be provided in an area that overlaps with at least a portion of the detection wiring.
[0036] As shown in Figure 2, the pseudo-adhesive layer 5 is formed over the entire area of the lower surface 4a of the intervening sheet 4. The pseudo-adhesive layer 5 adheres the intervening sheet 4 to the upper surface 6b of the release sheet 6. When the pseudo-adhesive layer 5 is peeled off after being attached to the object (release sheet 6), its adhesive strength becomes lower than the adhesive strength at the time of attachment (when it was first attached to the object). Therefore, the pseudo-adhesive layer 5 is difficult to re-adhere to the object after being peeled off.
[0037] The adhesive strength of the pseudo-adhesive layer 5 can be measured, for example, in accordance with JIS K6854. The adhesive strength can be measured, for example, by the resistance value when the substrate is peeled from the object using a peel tester (Shimadzu Corporation's "Autograph AGSH") at a speed of 300 mm / min and a peel angle of 90° (i.e., T-shaped peel).
[0038] Examples of adhesives that constitute the pseudo-adhesive layer 5 include UV-curing varnish. Known pressure-sensitive adhesives may also be used as the adhesive.
[0039] Since the intervening sheet 4 is located in a position that overlaps with the intermediate region 15 of the inlet sheet 1, the region including the first end 1c of the inlet sheet 1 (first end region 1A) extends from the first end 4c of the intervening sheet 4 to the -X side in a plan view. The region including the second end 1d of the inlet sheet 1 (second end region 1B) extends from the second end 4d of the intervening sheet 4 to the +X side in a plan view (see Figure 1).
[0040] The release sheet 6 is sized to encompass the entire inlet sheet 1 in a plan view. In this embodiment, the area of the release sheet 6 is larger than the area of the inlet sheet 1. The release sheet 6 is made of, for example, paper, a resin sheet, or the like.
[0041] The cover sheet 7 covers the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6. The cover sheet 7 may be made of, for example, a paper substrate, a resin substrate, etc. The cover sheet 7 is formed to be longer than the inlet sheet 1, for example. The first end 7c (the -X side end) of the cover sheet 7 is located in a position that overlaps with the first end 1c of the inlet sheet 1 in a plan view. The region of the cover sheet 7 including the first end 7c (first end region 7A) overlaps with the first end region 1A of the inlet sheet 1.
[0042] The second end 7d (the +X side end) of the cover sheet 7 is located on the +X side in a plan view compared to the second end 1d of the inlet sheet 1. The region including the second end 7d of the cover sheet 7 (second end region 7B) extends from the second end 1d of the inlet sheet 1 on the +X side in a plan view.
[0043] The adhesive layer 8 (second adhesive layer) is formed over the entire area of the lower surface 7a of the cover sheet 7. A known adhesive commonly used for labels can be used as the adhesive for the adhesive layer 8. The adhesive layer 8 adheres the cover sheet 7 to the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6.
[0044] [Label Sheet] Figure 3 is a plan view of the label sheet 20 according to the embodiment. Figure 4 is a schematic diagram showing an example of how to use the label sheet 20. Figure 5 is a cross-sectional view showing an example of how to use the label sheet 20. Figure 6 is a plan view showing an example of how to use the IC label 10. Figure 7 is a cross-sectional view showing an example of how to use the IC label 10. Figures 8 to 11 are schematic diagrams showing examples of how to use the IC label 10.
[0045] As shown in Figure 3, the label sheet 20 is composed of multiple IC labels 10 (see Figure 1) connected in the longitudinal direction (X direction). Adjacent IC labels 10 are connected at their longitudinal ends on the release sheet 6. The label sheet 20 comprises a long release sheet 6 and multiple laminates L. The multiple laminates L are arranged in a line along the longitudinal direction of the release sheet 6. Adjacent laminates L may be spaced apart in the longitudinal direction of the release sheet 6.
[0046] Multiple IC labels 10 are connected with the tip of the detection wire 9 (connection wire 9c) facing the -X side (one end) of the label sheet 20.
[0047] [How to use IC labels and label sheets] As shown in Figure 4, the label sheet 20 can be in the form of a roll (label roll 21). When using IC labels, the release sheet 6 of the label sheet 20 is taken up by the take-up roller 23 via the direction change roller 22, if necessary.
[0048] As shown in Figure 5, the region including the -X end of the laminate L is detached from the release sheet 6 using the direction changing roller 22. This detaches at least a portion of the partial region L1 (the region where the intervening sheet 4 is formed) from the release sheet 6. The adhesive strength of the pseudo-adhesive layer 5 decreases as it peels off from the release sheet 6. Since the region including the +X end of the laminate L is attached to the release sheet 6 by the adhesive layers 3 and 8, the laminate L is stably held on the release sheet 6 in a form in which the portion including the partial region L1 protrudes.
[0049] For example, a user can grasp a portion of the laminate L by pinching it in the thickness direction with their fingers and peel the laminate L off the release sheet 6. At this time, the pseudo-adhesive layer 5 has reduced adhesive strength and is less likely to stick to the fingers. Therefore, the operation of peeling off the laminate L becomes easy.
[0050] As shown in Figures 6 and 7, the peeled laminate L has the adhesive layer 3 exposed in the first end region 1A and the second end region 1B. In the second end region 7B (end region) of the laminate L, the adhesive layer 8 is exposed.
[0051] As shown in Figure 8, in this embodiment, the object 30 on which the laminate L is installed is, for example, the handle portion of a bag. The laminate L is made into a loop shape so that the object 30 can be inserted through it. The first end region 1A and the second end region 1B are facing each other.
[0052] As shown in Figure 9, the adhesive layer 3 of the first end region 1A and the adhesive layer 3 of the second end region 1B are attached. As a result, the laminate L forms an annular shape surrounding the object 30. Since a pseudo-adhesive layer 5 is formed all around the inner surface of the annular laminate L, the laminate L does not easily adhere to the object 30.
[0053] As shown in Figure 10, the second end region 7B is folded back at an intermediate position in the longitudinal direction (X direction). The second end region 7B is folded back with the adhesive layer 8 facing inward. As shown in Figure 11, the portion of the second end region 7B including the second end 7d is attached to the outer surface of the first end region 7A by the adhesive layer 8. As a result, the laminate L is in a state where the adhesive layer 8 is not exposed on the outer surface.
[0054] [How IC labels work] The behavior of the laminate L when an attempt is made to remove the laminate L attached to the object 30 (see Figure 9) will be described. Assume that a force is applied to the area where the first end region 1A and the second end region 1B are attached, in a direction that causes them to separate, in order to break the laminate L. When the first end region 1A and the second end region 1B separate, the detection wiring 9 is damaged (for example, it breaks). As a result, the detection wiring 9 enters a low conductivity state (for example, a non-conductive state), and its electrical resistance increases.
[0055] When the electrical resistance of the detection wiring 9 increases, the IC chip 11 can transmit the detection result to an external device (e.g., a reader / writer) via wireless communication through the antenna 12. For example, the IC chip 11 can transmit flag information based on the comparison result between the electrical resistance of the detection wiring 9 and a threshold value. This makes it possible to detect damage to the laminate L.
[0056] [Method of manufacturing IC labels] An example of a method for manufacturing the IC label 10 (see Figure 1) will be explained with reference to Figures 12 to 14. Figures 12 to 14 are process diagrams showing the manufacturing method of the IC label 10.
[0057] (Step 1: Attaching the intervening sheet) As shown in Figure 12, the intervening sheet 4 is attached to the upper surface 6b of the release sheet 6 by the pseudo-adhesive layer 5. Therefore, the intervening sheet 4 can be stably held to the release sheet 6.
[0058] (Step 2: Attaching the inlet sheet) As shown in Figure 13, the inlet sheet 1, on which the communication unit 2 and detection wiring 9 are provided, is attached to the upper surface 4b of the intervening sheet 4 and the upper surface 6b of the release sheet 6 by the adhesive layer 3. In this step, the inlet sheet 1 is attached so that the intervening sheet 4 is positioned in an area that overlaps with at least a portion of the detection wiring 9 (see Figure 1).
[0059] (Step 3: Applying the cover sheet) As shown in Figure 14, the cover sheet 7 is attached to the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6 by the adhesive layer 8. This yields the IC label 10 shown in Figure 1.
[0060] [Effects of the IC label and label sheet according to this embodiment] In this embodiment, the IC label 10 has an intervening sheet 4 in an area that overlaps with at least a portion of the detection wiring 9 (see Figure 1). Therefore, the laminate L is less likely to adhere to the object 30 without the need to fold the sheet (see Figure 1). Thus, the IC label 10 can be easily installed on the object.
[0061] The IC label 10 protects the detection wiring 9 because the intervening sheet 4 covers a portion of the detection wiring 9. Therefore, unintended damage to the detection wiring 9, such as from contact with the object 30, becomes less likely.
[0062] The IC label 10 has a cover sheet 7. The cover sheet 7 has a second end region 7B that can be folded back and attached, making it difficult to remove the laminate L.
[0063] In the label sheet 20 according to this embodiment, multiple IC labels 10 are connected in a manner that the detection wiring 9 faces the -X side (one end) (see Figure 3). Therefore, the laminate L can be stably held on the release sheet 6 in a form in which a partial region L1 has been peeled off from the release sheet 6 (see Figure 5). Thus, the laminate L can be peeled off the release sheet 6 by grasping the partial region L1. Therefore, the operation of installing the laminate L on an object is made easy.
[0064] [Effects of the IC label manufacturing method according to this embodiment] According to the aforementioned method for manufacturing the IC label 10, when installing the inlet sheet 1, the intervening sheet 4 is placed in an area that overlaps with at least a portion of the detection wiring 9. Therefore, the intervening sheet 4 can be placed in a predetermined position with simple operation. Thus, the IC label 10 can be easily manufactured.
[0065] Although embodiments of the present invention have been described above, the configurations and combinations thereof in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications to the configurations are possible without departing from the spirit of the present invention.
[0066] The IC label 10 shown in Figure 2 includes a cover sheet 7. However, if the second end region including the second end 1d of the inlet sheet 1 is long enough, this portion can be folded back and used in place of the second end region 7B (see Figure 11).
[0067] For example, in the IC label 10 shown in Figure 1, the antenna 12 is rectangular and ring-shaped, but the shape of the antenna is not particularly limited. The antenna may be circular, elliptical, polygonal, or the like.
[0068] The objects to be installed in the stacked structure can be any items that require information management. Examples of objects to be installed in the stacked structure include bags, clothing, linen products, and other apparel products. The objects to be installed in the stacked structure can also be shoes, accessories, etc. The objects to be installed in the stacked structure are not particularly limited and may include, for example, jewelry, watches, furniture, toys, clothing, electronic devices, etc. [Explanation of symbols]
[0069] 1…Inlet sheet, 2…Communication section, 3…Adhesive layer, 4…Intermediate sheet, 5…Pseudo-adhesive layer, 6…Release sheet, 7…Cover sheet, 7B…Second end region (end region), 9…Detection wiring, 10…IC label (contactless data transmitter / receiver label), 11…IC chip, 12…Antenna, 20…Label sheet
Claims
1. Inlet sheet and, A communication unit provided in the inlet sheet, having an IC chip and an antenna connected to the IC chip, A detection wire is provided in the inlet sheet and connected to the IC chip, The adhesive layer formed on the inlet sheet, The release sheet attached to the adhesive layer, An intervening sheet provided between the release sheet and the adhesive layer, The system comprises a pseudo-adhesive layer for attaching the intervening sheet to the release sheet, The intervening sheet is provided in a portion of the inlet sheet in a plan view, in a region that overlaps with at least a portion of the detection wiring. Contactless data receiver / transmitter label.
2. The inlet sheet is further provided with a cover sheet, The cover sheet has an end region that extends longitudinally from the inlet sheet in a plan view. A contactless data receiver / transmitter label according to claim 1.
3. A label sheet comprising a plurality of contactless data transmitter / receiver labels as described in claim 1, Multiple contactless data transmitter / receiver labels are connected longitudinally with the detection wiring facing one end of the label sheet. Label sheet.
4. The first step involves attaching an intervening sheet to one side of a release sheet using a pseudo-adhesive layer, The process includes a second step of attaching an inlet sheet, which is provided with an IC chip, an antenna connected to the IC chip, and detection wiring connected to the IC chip, to the intervening sheet and the release sheet using an adhesive layer. In the second step described above, the intervening sheet is placed in a region of the inlet sheet in a plan view that overlaps with at least a portion of the detection wiring. A method for manufacturing labels for contactless data receivers and transmitters.
Citation Information
Patent Citations
Labels having transponders, and components comprising transponders
JP4728336B2