Pickup device, joining device, and control method

Abstract

To provide a pickup device that can increase the likelihood of proper parts transfer. [Solution] The pickup device 100 is a pickup unit 14 for non-contact pickup of a chip 6a, and includes a pickup nozzle 14a having a suction hole for sucking up the chip 6a, and an ultrasonic generating unit 152a that vibrates to generate ultrasonic waves from the pickup nozzle 14a, a component mounting nozzle 20a that receives the chip 6a from the pickup unit 14 and adsorbs the chip 6a, and a control unit 101 that controls the pickup unit 14 and the component mounting nozzle 20a. The control unit 101 vibrates the ultrasonic generating unit 152a to output ultrasonic waves from the pickup nozzle 14a toward the chip 6a adsorbed by the component mounting nozzle 20a.

Description

Technical Field

[0001] The present disclosure relates to a pickup device that picks up components, etc.

Background Art

[0002] For the high functionality of semiconductor packages, hybrid bonding without using bumps, bonding materials, etc. is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or the like using hydrogen bonds or the like in a state where the surface of the semiconductor chip is cleaned. Therefore, in hybrid bonding, it is necessary to keep the surface cleanliness of the semiconductor chip high from the time when the semiconductor chip is picked up from the dicing tape, which is an adhesive sheet, until the semiconductor chip is bonded.

[0003] Therefore, conventionally, a mounting device that picks up electronic components such as semiconductor chips non - contact and mounts them on a substrate has been proposed (see, for example, Patent Document 1). Specifically, the mounting device includes a pickup collet and a mounting head. The pickup collet picks up and holds an electronic component non - contact and delivers the electronic component to the mounting head. The mounting head sucks and holds the electronic component and mounts it on the substrate. As a result, since the electronic component is picked up non - contact, the surface cleanliness of the electronic component (that is, the semiconductor chip) can be kept high. Note that such a mounting device can be said to be equipped with a pickup device because it picks up components such as electronic components. Furthermore, since the mounting device mounts the component on the substrate by bonding the component to the substrate, it is also called a bonding device.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when attempting to pick up semiconductor chips non-contact using sound waves such as ultrasound, there is a problem in that the mounting device (i.e., pickup device or bonding device) described in Patent Document 1 may have difficulty properly transferring the semiconductor chip to the mounting head.

[0006] Therefore, this disclosure provides a pickup device and the like that can increase the likelihood of proper transfer of components such as semiconductor chips. [Means for solving the problem]

[0007] A pickup device according to one aspect of the present disclosure is a pickup unit for non-contact pickup of a component, comprising: a pickup nozzle having a suction hole for sucking up the component; a vibrator that vibrates to generate sound waves from the pickup nozzle; a suction nozzle that receives the component from the pickup unit and adsorbs the component; and a control unit that controls the pickup unit and the suction nozzle, wherein the control unit vibrates the vibrator of the pickup unit to cause the pickup nozzle to output sound waves toward the component adsorbed by the suction nozzle.

[0008] These comprehensive or specific embodiments may be implemented by apparatus or method, or by any combination of systems, apparatus, and methods. [Effects of the Invention]

[0009] The pickup device of this disclosure can increase the likelihood of proper transfer of parts.

[0010] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and configurations described in the specification and drawings, but not all configurations are necessarily required. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a perspective view of the component mounting apparatus in Embodiment 1. [Figure 2] Figure 2 is a diagram illustrating the operation of the component mounting apparatus in Embodiment 1 in which a chip is mounted onto a substrate. [Figure 3] Figure 3 is a schematic and illustrative diagram showing the main configuration of the pickup device provided in the component mounting device in Embodiment 1. [Figure 4A] Figure 4A is a diagram illustrating a part of the operation in which the pickup device in Embodiment 1 picks up a chip using a pickup nozzle and transfers it to a component mounting nozzle. [Figure 4B] Figure 4B is an illustrative diagram showing the remaining part of the operation in which the pickup device in Embodiment 1 picks up a chip using a pickup nozzle and transfers it to a component mounting nozzle. [Figure 5] Figure 5 shows an example of the appearance of the pickup unit in Embodiment 1. [Figure 6] Figure 6 is a diagram illustrating the electrical configuration of the pickup unit in Embodiment 1. [Figure 7] Figure 7 is a diagram illustrating the state when a chip is transferred from the pickup nozzle to the component mounting nozzle in Embodiment 1. [Figure 8] Figure 8 is a diagram illustrating the state of the chip after it has been transferred to the component mounting nozzle in Embodiment 1. [Figure 9] Figure 9 shows an example of a detected value indicated by the detection signal in Embodiment 1. [Figure 10]FIG. 10 is a flowchart showing an example of the processing operation of the component mounting apparatus in Embodiment 1. [Figure 11] FIG. 11 is a diagram showing various examples of the first adjustment process and the second adjustment process in Embodiment 1. [Figure 12] FIG. 12 is a diagram for explaining the electrical configuration of the pickup unit in a modification of Embodiment 1. [Figure 13] FIG. 13 is a diagram showing an example of the configuration of the component mounting apparatus in Embodiment 2. [Figure 14A] FIG. 14A is a diagram for exemplarily explaining a part of the processing operation of the pickup apparatus in Embodiment 2. [Figure 14B] FIG. 14B is a diagram for exemplarily explaining the remaining part of the processing operation of the pickup apparatus in Embodiment 2. [Figure 15] FIG. 15 is a flowchart showing an example of the processing operation of the pickup apparatus in Embodiment 2. [Figure 16] FIG. 16 is a diagram showing an example of the configuration and operation of the mounting unit in a modification of Embodiment 2.

MODE FOR CARRYING OUT THE INVENTION

[0012] The inventor of the present invention has found that the following problems occur with respect to the mounting device of Patent Document 1 described in the "Background Art" section. In the mounting device of Patent Document 1, the pickup collet holds a component in a non-contact manner using the ejection of gas from pores and the negative pressure of the suction holes. On the other hand, in order to hold a component in a non-contact manner, sound waves such as ultrasonic waves can be used instead of the ejection of gas. However, in the mounting device of Patent Document 1, if sound waves are used instead of the ejection of gas from the pores, the component held in a non-contact manner may be shaken by the sound waves. As a result, when the component held in a non-contact manner by the pickup collet is transferred to the mounting nozzle and is shaken, the component may be sucked and held at a position deviated from the predetermined position of the mounting nozzle. Therefore, there is a problem that appropriate transfer of the component may not be achieved.

[0013] In order to solve such problems, a pickup device according to a first aspect of the present disclosure is a pickup unit that picks up a component in a non-contact manner, and includes a pickup nozzle having a suction hole for sucking the component, and a vibrator that vibrates to generate a sound wave from the pickup nozzle. A pickup unit, a suction nozzle that receives the component from the pickup unit and adsorbs the component, and a control unit that controls the pickup unit and the suction nozzle, wherein the control unit vibrates the vibrator of the pickup unit to cause the sound wave to be output from the pickup nozzle toward the component adsorbed by the suction nozzle. Note that the sound wave is a sound wave used in a broad sense and may be an ultrasonic wave. Further, when the pickup device is provided in a bonding device such as a component mounting device, the suction nozzle is also called a component mounting nozzle.

[0014] As a result, the component held by the suction nozzle vibrates when it receives sound waves emitted from the pickup nozzle, allowing the component to be moved while still held by the suction nozzle. In other words, the positional relationship between the component and the suction nozzle can be corrected. For example, self-centering of the component can be achieved. Consequently, even if the component is accidentally picked up from a predetermined position on the suction nozzle when it is transferred from the pickup nozzle to the suction nozzle, the likelihood of moving the component back to that predetermined position can be increased. Therefore, the likelihood of proper component transfer can be increased.

[0015] Furthermore, in the pickup device according to the second embodiment, the control unit may further weaken the suction force of the suction nozzle for attracting the component when it outputs the sound waves from the pickup nozzle toward the component that is attracted to the suction nozzle. The second embodiment may be dependent on the first embodiment.

[0016] This weakens the suction force, allowing the part to be easily moved while it is attached to the suction nozzle.

[0017] Furthermore, in the pickup device according to the third embodiment, the control unit may determine whether the component is attached to the suction nozzle while deviating from a predetermined position, which is a specified position of the suction nozzle, and if it determines that the component is attached to the suction nozzle while deviating from the specified position, it may output the sound waves from the pickup nozzle toward the component. Note that the third embodiment may be dependent on the first or second embodiment.

[0018] This design ensures that when a component is held in a position other than its designated location, sound waves are emitted from the pickup nozzle towards that component. Therefore, when the component is held in its designated position, sound wave generation is prohibited. In other words, it prevents the unnecessary generation of sound waves even when the component is held in its designated position. As a result, the power consumption of the pickup device can be reduced.

[0019] Furthermore, in the pickup device according to the fourth embodiment, the control unit may acquire an image obtained by imaging with a camera showing the component and the suction nozzle that is adsorbing the component, and determine based on the image whether the component has moved away from the predetermined position and is being adsorbed by the suction nozzle. Note that the fourth embodiment may be dependent on the third embodiment.

[0020] This allows for accurate determination of whether a part has moved from its designated position and is being held by the suction nozzle.

[0021] Furthermore, in the pickup device according to the fifth embodiment, if the control unit determines that the part has moved away from the specified position and is being held by the suction nozzle, it may set the vibration intensity of the vibrator based on the image and vibrate the vibrator at the set intensity. Note that the fifth embodiment may be dependent on the fourth embodiment. The intensity may also be defined by at least one of the vibration amplitude, frequency, and vibration velocity. For example, the control unit may increase the vibration intensity by increasing the vibration velocity of the vibrator.

[0022] This allows for appropriate setting of vibration intensity, enabling effective self-centering of components.

[0023] Furthermore, in the pickup device according to the sixth embodiment, the greater the displacement shown in the image, where the displacement of the position of the component being held by the suction nozzle relative to the specified position, the stronger the vibration intensity set by the control unit may be. Note that the sixth embodiment may be dependent on the fifth embodiment.

[0024] This enables more effective self-centering of parts.

[0025] Furthermore, in the pickup device according to the seventh embodiment, if the control unit determines that the part has moved away from the specified position and is being held by the suction nozzle, it may set the vibration time of the vibrator based on the image and vibrate the vibrator for the set time. Note that the seventh embodiment may be dependent on any one of the fourth to sixth embodiments.

[0026] This allows for appropriate setting of the vibration time, enabling effective self-centering of the component.

[0027] Furthermore, in the pickup device according to the eighth embodiment, the longer the displacement shown in the image, which represents the displacement of the position of the component being held by the suction nozzle relative to the specified position, the longer the time set by the control unit may be. Note that the eighth embodiment may be dependent on the seventh embodiment.

[0028] This enables more effective self-centering of parts.

[0029] Furthermore, in the pickup device according to the ninth embodiment, the control unit may further vibrate the vibrator at a first intensity to allow the pickup unit to pick up the component non-contact, and when outputting sound waves from the pickup nozzle toward the component being adsorbed by the adsorption nozzle, it may vibrate the vibrator at a second intensity which is stronger than the first intensity. Note that the ninth embodiment may be dependent on any one of the first to eighth embodiments. The first intensity and the second intensity may also be degrees defined by at least one of the amplitude, frequency, and velocity of the vibration. For example, the control unit may switch the vibration intensity from the first intensity to the second intensity by increasing the vibration velocity of the vibrator.

[0030] For example, when a component is transferred from the pickup unit to the suction nozzle, the distance between the pickup nozzle and the component becomes longer than when the pickup unit is picking up the component non-contact. On the other hand, in the ninth embodiment, when a component is transferred from the pickup unit to the suction nozzle, the vibration intensity of the vibrator increases, so even if the aforementioned distance increases, the component can receive sound waves of appropriate intensity, and self-centering can be easily achieved.

[0031] A pickup device according to a tenth aspect of the present disclosure is a pickup unit for non-contact pickup of a component, comprising: a pickup nozzle having a suction hole for sucking up the component; a vibrator that vibrates to generate sound waves from the pickup nozzle; a suction unit including a suction nozzle that receives the component from the pickup unit and adsorbs the component; and a vibrator that vibrates to generate sound waves from the suction nozzle; and a control unit that controls the pickup unit and the suction unit, wherein the control unit vibrates the vibrator of the suction unit when the suction nozzle receives the component from the pickup unit and adsorbs the component.

[0032] As a result, sound waves are generated from the suction nozzle, and even if the pickup unit is not near the suction nozzle, the sound waves from the suction nozzle can achieve self-centering of the component, similar to the first to ninth embodiments described above.

[0033] A bonding apparatus according to a first aspect of the present disclosure comprises a pickup device according to any one of the first to tenth aspects, wherein the suction nozzle of the pickup device is a component mounting nozzle that receives the component from the pickup unit and bonds the received component to another component.

[0034] This makes it possible to achieve the same effects and advantages as the pickup device according to the first to tenth embodiments.

[0035] A control method according to a first aspect of the present disclosure is a control method for controlling a pickup device, wherein the pickup device is a pickup unit for non-contact pickup of a component, and includes a pickup nozzle having a suction hole for sucking up the component, a vibrator that vibrates to generate sound waves from the pickup nozzle, and a suction nozzle for adsorbing the component, wherein the control method causes the pickup unit and the suction nozzle to transfer the component from the pickup unit to the suction nozzle, and causes the vibrator of the pickup unit to vibrate so that the pickup nozzle outputs sound waves toward the component adsorbed by the suction nozzle.

[0036] This makes it possible to achieve the same effects and advantages as the pickup device according to the first embodiment.

[0037] A control method according to a second aspect of the present disclosure is a control method for controlling a pickup device, the pickup device being a non-contact pickup unit for picking up a part, comprising: a pickup unit including a pickup nozzle having a suction hole for sucking up the part and a vibrator that vibrates to generate sound waves from the pickup nozzle; and a suction unit including a suction nozzle for adsorbing the part and a vibrator that vibrates to generate sound waves from the suction nozzle, wherein the control method causes the pickup unit and the suction nozzle to transfer the part from the pickup unit to the suction nozzle, and vibrates the vibrator of the suction unit when the suction nozzle has received the part from the pickup unit and is adsorbing the part.

[0038] This makes it possible to achieve the same effects and advantages as the pickup device according to the tenth embodiment.

[0039] The embodiments will be described in detail below with reference to the drawings.

[0040] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection forms of components, steps, and the order of steps shown in the following embodiments are examples and are not intended to limit the scope of this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim indicating the highest-level concept are described as optional components. In addition, each figure is a schematic diagram and is not necessarily a strict illustration. In each figure, the same component is denoted by the same reference numeral. Furthermore, in the following embodiments, expressions such as "approximately the same" are used. For example, "approximately the same" means not only that they are exactly the same, but also that they are substantially the same, including, for example, an error of a few percent. Also, "approximately the same" means that they are the same to the extent that the effects of this disclosure can be achieved. The same applies to other expressions using "approximately".

[0041] (Embodiment 1) Figure 1 is a perspective view of the component mounting device in this embodiment.

[0042] In this embodiment, the component mounting device 1 picks up components and mounts the picked-up components onto the substrate 7. Therefore, the component mounting device 1 in this embodiment is equipped with a pick-up device for picking up components. The mounting of components onto the substrate 7 is also called bonding of components to the substrate 7. Therefore, the component mounting device 1 is also called a bonding device. Furthermore, the substrate 7 in this embodiment is not limited to a specific type of substrate, but may be a silicon substrate, a component, or a silicon chip. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, one direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction or lateral direction, and the direction perpendicular to the Y-axis direction in that vertical plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is right or right, and the negative side of the Y-axis direction is left or left. In this disclosure, the positive side in the X-axis direction is the back side or rear, and the negative side in the X-axis direction is the front side or front. An example of a component is a semiconductor chip or chip. In this disclosure, "pickup" means the action of holding a component, or, among the actions of holding a component, the action of picking up a component from an adhesive sheet such as a dicing tape.

[0043] The component mounting device 1 comprises a base 2, a component supply unit 3, a substrate holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting device 1 and supports each component included in the component mounting device 1.

[0044] The component supply unit 3 is mounted on the base 2 and supplies components to the component holding unit 15. This component supply unit 3 comprises a holding table 3a, an XY table mechanism 31, a moving plate 32, and a plurality of support members 33. The holding table 3a holds the semiconductor wafer unit 6 in a horizontal position. The semiconductor wafer unit 6 consists of an adhesive sheet 6b and a plurality of chips 6a. The plurality of chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet, also called a dicing tape. The plurality of chips 6a are attached to the upper surface of this adhesive sheet 6b. Each of the plurality of support members 33 is a columnar member mounted on the moving plate 32 so as to stand upright from the moving plate 32. These plurality of support members 33 support the holding table 3a in a position where the semiconductor wafer unit 6 held by the holding table 3a is separated upward from the moving plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis and Y-axis directions. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis and Y-axis directions. In other words, multiple chips 6a move along the XY plane.

[0045] The pickup camera 21 is positioned above the component supply unit 3 and captures images of the chip 6a to be picked up from the semiconductor wafer unit 6.

[0046] The substrate holder 5 holds the substrate 7 in a horizontal position. This substrate holder 5 is equipped with a transport rail 5a. The substrate holder 5 then positions and holds the substrate 7, which has been transported by the transport rail 5a, at the mounting position. The mounting position is the position where the chip 6a is mounted.

[0047] The component holding section 15 comprises an arm 15a, a rotational movement mechanism 15b, and a pickup unit 14. The arm 15a is a columnar member and is attached to the rotational movement mechanism 15b in a manner aligned with the X-axis direction. In other words, one end of the arm 15a in the longitudinal direction (i.e., the base end) is attached to the rotational movement mechanism 15b. The other end of the arm 15a (i.e., the tip) is attached to the pickup unit 14.

[0048] The rotational movement mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the rotational movement mechanism 15b rotates the arm 15a about a central axis along the longitudinal direction of the arm 15a. In other words, the rotational movement mechanism 15b rotates the arm 15a around the X-axis. The pickup unit 14 is attached to the end of the arm 15a as described above. The pickup unit 14 also includes a pickup nozzle 14a, for example, made of metal, which holds the tip 6a non-contact by vacuum suction and ultrasound. Vacuum suction is the operation of sucking in air and is also simply called suction. Therefore, the pickup nozzle 14a moves in the X-axis, Y-axis, and Z-axis directions and rotates around the X-axis, driven by the rotational movement mechanism 15b. The rotational movement mechanism 15b also moves the pickup nozzle 14a based on the imaging results from the pickup camera 21. This allows the rotational movement mechanism 15b to lower its pickup nozzle 14a and bring it precisely close to the upper surface of the tip 6a to be picked up. In this embodiment, the pickup nozzle 14a is also simply called a nozzle and has an opening for non-contact holding of the tip 6a by vacuum suction and ultrasound.

[0049] The frame 11 is positioned on the positive side of the X-axis on the base 2 and comprises two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b so that it is aligned with the Y-axis direction and is positioned above the upper surface of the base 2. In other words, the Y-axis frame 11b is suspended by the two support posts 11a. As described above, a rotational movement mechanism 15b is suspended from this Y-axis frame 11b.

[0050] The Y-axis drive mechanism 12 is attached to the negative X-axis side of the Y-axis frame 11b and moves the component mounting section 13 in the Y-axis direction. The component mounting section 13 includes a mounting unit 20. The component mounting section 13 uses its mounting unit 20 to receive the chip 6a held by the pickup nozzle 14a from the pickup nozzle 14a and mounts the chip 6a onto the substrate 7 positioned at the mounting location.

[0051] Figure 2 is a diagram illustrating the operation of the component mounting device 1 in which it mounts the chip 6a onto the substrate 7.

[0052] The component mounting device 1 picks up a chip 6a from among several chips 6a attached to an adhesive sheet 6b that is positioned at a pre-set pickup work position P in the XY plane, and mounts that chip 6a onto the substrate 7.

[0053] Specifically, the XY table mechanism 31 moves the movable plate 32 in the X-axis and Y-axis directions to position the chip 6a to be picked up at the pickup work position P. The chip 6a to be picked up, positioned at this pickup work position P, is then pushed up by the push-up section 34.

[0054] In other words, the component mounting apparatus 1 in this embodiment includes a push-up section 34 located at the pickup work position P, as shown in Figure 2. The push-up section 34 may also be provided in the component supply section 3. The push-up section 34 pushes up the chip 6a attached to the adhesive sheet 6b from below through the adhesive sheet 6b. Specifically, the push-up section 34 pushes up the chip 6a to be picked up, which is located at the pickup work position P.

[0055] The pickup camera 21 is positioned above the component supply unit 3 and at the pickup work position P. This pickup camera 21 images the pickup work position P and its surroundings from above the component supply unit 3, among the multiple chips 6a attached to the adhesive sheet 6b. As a result, the chip 6a to be picked up is imaged, and the position of the chip 6a to be picked up is recognized based on the image result. In other words, the position of the chip 6a is recognized.

[0056] The pickup nozzle 14a of the pickup unit 14 descends by the drive of the rotational movement mechanism 15b, approaches the chip 6a whose position has been recognized based on the imaging results of the pickup camera 21 from above, and holds the chip 6a. Then, the pickup nozzle 14a rises while holding the chip 6a and moves further, for example, to the negative side in the Y-axis direction. At this point, the rotation of the arm 15a by the rotational movement mechanism 15b causes the pickup nozzle 14a to face upwards with the lower surface (i.e., bottom surface) of the held chip 6a facing upwards. As a result, the chip 6a is held by the pickup nozzle 14a in an inverted state.

[0057] As shown in Figure 2, the component mounting section 13 includes not only the mounting unit 20 described above, but also a movable plate 13a, a lifting mechanism 13b, and a lifting plate 13c. The movable plate 13a is a plate that is mounted on the Y-axis drive mechanism 12 so as to be movable in the Y-axis direction. In other words, the movable plate 13a moves in the Y-axis direction by the drive of the Y-axis drive mechanism 12.

[0058] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from, for example, the pickup nozzle 14a which holds the chip 6a in an inverted state. For example, the component mounting nozzle 20a moves above the chip 6a by the drive of the Y-axis drive mechanism 12 and the lifting mechanism 13b, respectively, and holds the chip 6a by, for example, vacuum suction. Then, with the chip 6a in its grasp, the component mounting nozzle 20a moves along the Y-axis toward the substrate 7 and mounts the chip 6a onto the substrate 7.

[0059] In other words, the component mounting nozzle 20a in this embodiment receives the chip 6a from the pickup unit 14 of the component holding unit 15 and adsorbs the chip 6a. The component mounting nozzle 20a in this embodiment may also be called an adsorption nozzle because it adsorbs the chip 6a. Furthermore, as described above, the component mounting nozzle 20a is configured to receive the chip 6a from the pickup unit 14 and bond the received chip 6a to another component such as the substrate 7.

[0060] Figure 3 is a schematic and illustrative diagram showing the main configuration of the pickup device provided in the component mounting device 1 in this embodiment.

[0061] The pickup device 100 in this embodiment is provided in the component mounting device 1 and includes, for example, a component mounting section 13 having a component mounting nozzle 20a, a Y-axis drive mechanism 12, a control unit 101, a component holding section 15, and a push-up section 34.

[0062] The component holding section 15 comprises a pickup unit 14, a negative pressure generating section 153, and a rotational movement mechanism 15b. The pickup unit 14 is a mechanism for non-contact pickup of the chip 6a and includes a pickup nozzle 14a, an ultrasonic generating section 152a, and an ultrasonic horn 152b.

[0063] The ultrasonic generator 152a vibrates to generate ultrasonic waves from the pickup nozzle 14a. Specifically, the ultrasonic generator 152a has, for example, a Langevin-type ultrasonic transducer and vibrates (i.e., ultrasonically vibrates) in accordance with the voltage applied to the ultrasonic transducer. The ultrasonic horn 152b is connected to the ultrasonic generator 152a and the pickup nozzle 14a, and amplifies the vibration of the ultrasonic generator 152a and transmits it to the pickup nozzle 14a. As a result, ultrasonic waves are generated around the opening 14b of the pickup nozzle 14a. Specifically, the ultrasonic vibration of the pickup nozzle 14a in the vertical direction transmits the vibration to the air in contact with the lower surface of the pickup nozzle 14a. For example, the ultrasonic generator 152a causes the pickup nozzle 14a to vibrate ultrasonically with an amplitude of up to 10-20 μm. The pickup nozzle 14a uses the ultrasonic waves generated by this vibration to pick up the tip 6a non-contactually.

[0064] In this embodiment, the ultrasonic generator 152a generates ultrasonic waves having a frequency of, for example, 20 kHz or higher, but it may also generate sound waves in a broader sense. In this case, the ultrasonic generator 152a may be called a sound wave generator, a sound wave transducer, or a transducer. In other words, the sound waves generated by the ultrasonic generator 152a may be sound waves in a narrow sense, that is, elastic waves propagating through the air at a frequency audible to humans (for example, 10 kHz or more and less than 20 kHz), or they may be ultrasonic waves. To put it another way, the ultrasonic generator 152a in this embodiment may generate elastic waves of any frequency in the air as long as it can exert a repulsive force on the tip 6a.

[0065] The negative pressure generating unit 153 generates negative pressure in the suction hole 14c of the pickup nozzle 14a. In this embodiment, the negative pressure generating unit 153 is configured as, for example, a vacuum pump. Specifically, the ultrasonic horn 152b is provided with a suction path 152c, which is a hole for sucking up the tip 6a, and the pickup nozzle 14a has a suction hole 14c that is connected to the suction path 152c and communicates with the opening 14b. The negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a by creating negative pressure in the suction path 152c and the suction hole 14c. In other words, the negative pressure generating unit 153 generates negative pressure around the opening 14b by sucking in air around the opening 14b through the suction path 152c and the suction hole 14c. The negative pressure generating unit 153 also has an adjustment valve to adjust the negative pressure and generates negative pressure of a magnitude corresponding to the opening of the adjustment valve.

[0066] The pickup nozzle 14a is a nozzle having a suction hole 14c for sucking up the tip 6a. The pickup nozzle 14a also holds the tip 6a non-contact around the opening 14b based on a repulsive force obtained by the ultrasonic waves of the ultrasonic wave generating unit 152a that pulls the tip 6a away from the pickup nozzle 14a, and an attractive force obtained by the negative pressure of the negative pressure generating unit 153 that attracts the tip 6a to the pickup nozzle 14a. The repulsive force mentioned above is a force obtained by the formation of a squeeze film by ultrasonic waves. Furthermore, such a repulsive force is not limited to ultrasonic waves, but may be a force obtained by sound waves in a broad sense.

[0067] The rotational movement mechanism 15b, for example, is equipped with a motor and moves the pickup nozzle 14a in the X, Y, and Z directions. The rotational movement mechanism 15b also rotates the pickup nozzle 14a of the pickup unit 14 attached to the tip of the arm 15a by rotating the arm 15a. The time it takes for the pickup nozzle 14a to rotate 180 degrees, that is, the time it takes for the pickup nozzle 14a to reverse direction, is, for example, less than 0.5 seconds.

[0068] The push-up section 34 is equipped with multiple push-up pins 34a, which are raised and lowered. When these multiple push-up pins 34a rise and push up the adhesive sheet 6b, the chip 6a attached to the adhesive sheet 6b is pushed up.

[0069] The control unit 101 controls the component mounting unit 13, the Y-axis drive mechanism 12, the push-up unit 34, and the component holding unit 15. In other words, the control unit 101 controls the component mounting nozzle 20a, the Y-axis drive mechanism 12, the push-up unit 34, the pickup unit 14, the negative pressure generating unit 153, and the rotational movement mechanism 15b. For example, the control unit 101 adjusts the repulsive force on the chip 6a by controlling the voltage applied to the ultrasonic transducer of the ultrasonic generating unit 152a included in the pickup unit 14. The control unit 101 also adjusts the attractive force on the chip 6a by controlling the adjustment valve of the negative pressure generating unit 153. This allows for effective adjustment of the repulsive and attractive forces on the chip 6a. Furthermore, the control unit 101 controls the component mounting unit 13 and the Y-axis drive mechanism 12 to raise and lower the component mounting nozzle 20a, move the component mounting nozzle 20a in the Y-axis direction, and attract the chip 6a to the component mounting nozzle 20a. Furthermore, the component mounting nozzle 20a attracts the chip 6a by drawing in air. In other words, the component mounting nozzle 20a attracts and attracts the chip 6a by drawing in the surrounding air, or in other words, by drawing in the chip 6a.

[0070] In this embodiment, the component holding section 15 includes the ultrasonic generating section 152a and the negative pressure generating section 153, but the ultrasonic generating section 152a and the negative pressure generating section 153 do not necessarily have to be included in the component holding section 15. Also, in this embodiment, the ultrasonic horn 152b and the pickup nozzle 14a are separate components, but they may be configured as a single unit. In other words, the pickup unit 14 does not necessarily have to include the ultrasonic horn 152b.

[0071] Figures 4A and 4B show an example of the operation in which the pickup device 100 in this embodiment picks up the chip 6a using the pickup nozzle 14a and transfers it to the component mounting nozzle 20a.

[0072] For example, the XY table mechanism 31 moves the movable plate 32, causing the adhesive sheet 6b held on the holding table 3a to move in the X-axis and Y-axis directions. This movement of the adhesive sheet 6b positions the chip 6a to be picked up at the pickup work position P, as shown in Figure 4A(a). That is, the chip 6a to be picked up is positioned on the multiple push-up pins 34a of the push-up section 34.

[0073] Next, as shown in Figure 4A(b), the push-up section 34 raises a plurality of push-up pins 34a to push up the chip 6a via the adhesive sheet 6b. Then, as shown in Figure 4A(c), the pickup nozzle 14a descends and the ultrasonic generating section 152a generates ultrasonic waves. Specifically, the ultrasonic generating section 152a vibrates the pickup nozzle 14a via the ultrasonic horn 152b in response to control by the control unit 101, generating ultrasonic waves from around the opening 14b of the pickup nozzle 14a. The ultrasonic waves generated by the ultrasonic generating section 152a are generated by the vibration of the pickup nozzle 14a at a vibration speed of, for example, 10 mm / s to 5000 mm / s. Next, as shown in Figure 4A(d), the negative pressure generating section 153 sucks in air in response to control by the control unit 101. This generates negative pressure around the opening 14b of the pickup nozzle 14a. As a result, the control unit 101 uses the suction force due to the negative pressure around the opening 14b and the repulsive force due to the ultrasonic waves around the opening 14b to hold the tip 6a in a non-contact manner with the pickup nozzle 14a. In other words, the pickup nozzle 14a holds the tip 6a in a non-contact manner by using the suction force that tries to pull the tip 6a toward the opening 14b of the pickup nozzle 14a and the repulsive force that tries to move the tip 6a away from the opening 14b.

[0074] In other words, the pickup unit 14, specifically the pickup nozzle 14a, picks up the chip 6a without contact. Alternatively, the pickup unit 14, specifically the pickup nozzle 14a, enters a non-contact holding state. In this non-contact holding state, a gap of, for example, approximately 20 to 60 μm in width is created between the pickup nozzle 14a and the chip 6a.

[0075] Subsequently, as shown in Figure 4B(a), the control unit 101 raises the pickup nozzle 14a by controlling the rotational movement mechanism 15b. In other words, the chip 6a is peeled off the adhesive sheet 6b and rises. Furthermore, as shown in Figure 4B(b), the control unit 101 rotates the pickup nozzle 14a by controlling the rotational movement mechanism 15b. In other words, as shown in Figures 4B(b) and (c), the rotational movement mechanism 15b rotates the arm 15a, thereby rotating the pickup nozzle 14a by 180 degrees so that the opening 14b of the pickup nozzle 14a faces upward from below. In other words, in accordance with the rotation of the arm 15a, the pickup unit 14 attached to the tip of the arm 15a inverts. As a result, the pickup nozzle 14a included in the pickup unit 14 inverts. This also inverts the chip 6a that is held non-contact by the pickup nozzle 14a, and the lower surface of the chip 6a, which was attached to the adhesive sheet 6b, faces upward. The rotational movement mechanism 15b may move the pickup nozzle 14a to the chip transfer position in the X-axis and Y-axis directions before reversing the pickup nozzle 14a. The chip transfer position is the position where the chip 6a is transferred to the component mounting nozzle 20a.

[0076] Then, as shown in Figure 4B(c), the component mounting nozzle 20a attracts the inverted chip 6a from above. As a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0077] Figure 5 shows an example of the appearance of the pickup unit 14. Figure 5(a) is a perspective view of the pickup unit 14, and Figure 5(b) shows the appearance of the pickup unit 14 viewed from the negative side in the Z-axis direction.

[0078] As shown in Figure 5(a), the pickup unit 14 comprises an ultrasonic generating unit 152a, an ultrasonic horn 152b, and a pickup nozzle 14a, which are connected in order from the positive Z-axis side. The pickup nozzle 14a has a first part 14aa, a second part 14ab, and a third part 14ac, which are arranged in order from the positive Z-axis side. The third part 14ac has a shape corresponding to the shape of the tip 6a. As a result, because there is a third part 14ac with a shape corresponding to the shape of the tip 6a, the tip 6a can be held appropriately without contact without being constrained by the shape and size of the second part 14ab. Specifically, the third part 14ac is connected to the lower surface of the second part 14ab and has a rectangular parallelepiped shape. This rectangular parallelepiped shape corresponds to the shape of the tip 6a. In other words, the lower surface of the third part 14ac has approximately the same shape and size as the upper surface of the tip 6a. More specifically, the third portion 14ac, i.e., the lower surface of the third portion 14ac, has a rectangular shape with longitudinal and transverse sides. This allows the rectangular chip 6a to be held appropriately without contact.

[0079] Such a pickup unit 14 outputs a detection signal corresponding to the vibration of the pickup nozzle 14a. Then, the control unit 101 in this embodiment controls the component mounting nozzle 20a based on the detection signal.

[0080] Figure 6 is a diagram illustrating the electrical configuration of the pickup unit 14.

[0081] The ultrasonic generating unit 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a. Specifically, the piezoelectric element 51 is included in the vibrator described above. An AC voltage is applied to this piezoelectric element 51 by the AC power supply 201. As a result, the piezoelectric element 51 vibrates periodically. Consequently, the pickup nozzle 14a vibrates.

[0082] Furthermore, the pickup unit 14 in this embodiment includes a detection element 52 that detects vibrations of the pickup nozzle 14a and outputs the above-mentioned detection signal. Specifically, this detection element 52 is a piezoelectric element and outputs a detection signal indicating a detection value corresponding to the vibration speed of the pickup nozzle 14a. More specifically, the detection element 52 outputs a detection signal indicating a larger detection value the faster the vibration speed of the pickup nozzle 14a. For example, the detection signal is a sinusoidal signal corresponding to the frequency of the AC power supply 201, and the detection value indicated by the detection signal is a voltage value. The faster the vibration speed, the larger the amplitude of the detection signal, that is, the larger the detection value at the peak of each crest included in the wave of the detection signal. The vibration speed and the amplitude of the detection signal may be proportional.

[0083] The monitoring circuit 53 monitors the detection signal output from the detection element 52 and outputs the detection signal to the control unit 101. The monitoring circuit 53 may be provided in the ultrasonic generator 152a, the pickup unit 14, the control unit 101, or the pickup device 100. Alternatively, the monitoring circuit 53 may perform digital signal processing on the detection signal to convert it into a signal format that can be processed by the control unit 101, and output the converted detection signal to the control unit 101. For example, the monitoring circuit 53 may output to the control unit 101 a signal that shows only the detection values ​​at the peaks of each wave in the detection signal output from the detection element 52 as the converted detection signal.

[0084] In this embodiment, the control unit 101 controls the component mounting nozzle 20a based on such detection signals.

[0085] Figure 7 is a diagram illustrating the state when the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0086] As shown in Figure 4B(c), the pickup nozzle 14a rotates so that its opening 14b faces upward from below. At this time, as shown in Figure 7(a), the pickup nozzle 14a holds the tip 6a in a non-contact manner on the upper side. In other words, a pressure Pr1 is generated between the pickup nozzle 14a and the tip 6a due to the ultrasonic waves generated around the opening 14b of the pickup nozzle 14a. This pressure Pr1 creates the repulsive force described above, causing the tip 6a to float away from the pickup nozzle 14a. Due to the influence of the ultrasonic waves, the tip 6a vibrates slightly in the vertical direction. For example, the frequency of the vibration of the tip 6a is approximately the same as the frequency of the vibration of the pickup nozzle 14a. When the pickup nozzle 14a and the tip 6a are in this state, the component mounting nozzle 20a descends toward the tip 6a.

[0087] Here, as shown in Figure 7(b), when the component mounting nozzle 20a approaches the chip 6a, the chip 6a vibrates, and a pressure Pr2 is generated between the chip 6a and the component mounting nozzle 20a. This pressure Pr2 creates a repulsive force that pulls the chip 6a and the component mounting nozzle 20a apart. Then, as shown in Figure 7(c), the component mounting nozzle 20a descends further toward the chip 6a in order to receive the chip 6a from the pickup nozzle 14a, that is, to attract the chip 6a. As a result, the space between the component mounting nozzle 20a and the pickup nozzle 14a narrows, the chip 6a moves closer to the pickup nozzle 14a, and the pressures Pr1 and Pr2 increase.

[0088] The tip 6a is subjected to large repulsive forces from the vertical direction due to the large pressures Pr1 and Pr2. As a result, as shown in Figure 7(d), the tip 6a may wobble or shift in the Y-axis or X-axis direction, or rotate around an axis along the Z-axis direction.

[0089] Figure 8 is a diagram illustrating the state of the chip 6a after it has been transferred to the component mounting nozzle 20a.

[0090] As shown in Figure 7(b), the component mounting nozzle 20a starts suction when the chip 6a is held without contact with the pickup nozzle 14a and is not in contact with the component mounting nozzle 20a. In other words, the control unit 101 generates negative pressure in the suction hole 20b formed in the component mounting nozzle 20a by controlling, for example, the negative pressure generating unit 153 provided in the component mounting unit 13. As a result, the chip 6a is attracted to the component mounting nozzle 20a. This transfers the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. When the chip 6a is transferred properly, as shown in Figure 8(a), the chip 6a is attracted to the component mounting nozzle 20a at a predetermined position and oriented in a predetermined direction.

[0091] However, if the component mounting nozzle 20a starts to pick up the chip 6a while it is misaligned, wobbly, or rotated, as shown in Figure 7(d), the chip 6a may be improperly picked up, as shown in Figure 8(b). In other words, the chip 6a may be picked up at a position away from the predetermined position on the component mounting nozzle 20a, as shown in Figure 8(b). Alternatively, the chip 6a may be picked up while oriented in a direction different from the predetermined orientation described above. As a result, the accuracy of the pickup of the chip 6a to the component mounting nozzle 20a deteriorates. There is also a risk that the chip 6a may come into contact with the pickup nozzle 14a.

[0092] Therefore, in this embodiment, the control unit 101 controls the component mounting nozzle 20a based on the detection signal so that the chip 6a is properly handed over. The control unit 101 may also further control the pickup unit 14.

[0093] Figure 9 shows an example of a detected value indicated by a detection signal. Specifically, the detected value is the voltage value of the peak of each crest in the sinusoidal voltage waveform output from the detection element 52, and Figure 9 shows this voltage value graphically. The vertical axis of the graph represents the voltage value, and the horizontal axis represents time.

[0094] For example, the state of the detection signal can be any of the first to fifth states. Note that the state of the detection signal is the state during the detection period when the pickup nozzle 14a and component mounting nozzle 20a are not moving, and the suction force and ultrasonic output of the pickup unit 14 are kept constant.

[0095] Specifically, when the detection signal is in the first state, the detected value indicated by that detection signal is greater than or equal to value V3. In this first state, as shown in Figure 7(a), the component mounting nozzle 20a is far above the chip 6a and the pickup nozzle 14a, causing the pickup nozzle 14a to vibrate significantly. In this first state, because the component mounting nozzle 20a is far from the chip 6a, even if suction by the component mounting nozzle 20a is initiated, the chip 6a may not be attracted to the component mounting nozzle 20a and may not be transferred to the component mounting nozzle 20a.

[0096] On the other hand, when the detection signal is in the fourth state, the detected value indicated by the detection signal is smaller than the value V2. Note that the value V2 is smaller than the value V3 mentioned above. In this fourth state, as shown in Figures 7(c) and (d), the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, so the vibration of the pickup nozzle 14a is greatly suppressed by pressures Pr1 and Pr2. Furthermore, in this fourth state, because the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, the chip 6a may shift, wobble, or rotate. Therefore, when suction by the component mounting nozzle 20a is started, the chip 6a may be improperly transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0097] Furthermore, when the detection signal is in the fifth state, the detected value indicated by that detection signal is smaller than value V1. Note that value V1 is smaller than the value V2 mentioned above. In this fifth state, the component mounting nozzle 20a is even closer to the chip 6a and the pickup nozzle 14a until the chip 6a makes contact with the pickup nozzle 14a. As a result, the vibration of the pickup nozzle 14a is further suppressed. When the chip 6a makes contact with the pickup nozzle 14a, the chip 6a may be scratched or otherwise damaged, and the chip 6a is treated as a defective product. Therefore, value V1 can be said to be a threshold for whether or not to treat the chip 6a as a defective product. Consequently, when the detection signal is in the fifth state, the chip 6a is discarded.

[0098] Furthermore, when the detection signal is in the second state, the detected value indicated by the detection signal is kept approximately constant and stable within a predetermined range of V2 or greater and less than V3. In this second state, as shown in Figure 7(b), the component mounting nozzle 20a is neither too close nor too far from the chip 6a and the pickup nozzle 14a. As a result, the pickup nozzle 14a vibrates less than in the first state and more than in the fourth state. Therefore, when suction by the component mounting nozzle 20a is started when the detection signal is in the second state, the chip 6a is appropriately transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0099] Furthermore, when the detection signal is in the third state, the detected value indicated by that detection signal is unstable because it is fluctuating. In such a third state, the chip 6a may be shaken significantly, for example, in the vertical direction. Therefore, when the detection signal is in the third state and suction by the component mounting nozzle 20a is started, the chip 6a may be improperly transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0100] Therefore, in this embodiment, the control unit 101 determines which of the first to fifth states the state of the detection signal is in, and controls the component mounting nozzle 20a according to the determination result. The control unit 101 may further control the pickup unit 14 together with the component mounting nozzle 20a according to the determination result, or it may control the pickup unit 14 without controlling the component mounting nozzle 20a.

[0101] Figure 10 is a flowchart showing an example of the processing operation of the component mounting device 1, which is a bonding device in this embodiment.

[0102] First, the control unit 101 rotates the pickup unit 14 by controlling the rotational movement mechanism 15b (step S1). As a result, the pickup nozzle 14a rotates, as shown in Figure 4B. Then, the control unit 101 moves the component mounting nozzle 20a of the mounting unit 20 above the pickup nozzle 14a by controlling the Y-axis drive mechanism 12 and the like. Furthermore, the control unit 101 lowers the component mounting nozzle 20a by controlling the lifting mechanism 13b and the like so that the component mounting nozzle 20a approaches the chip 6a that is held non-contact with the pickup nozzle 14a (step S2).

[0103] Next, the control unit 101 acquires a detection signal output from the detection element 52 via the monitoring circuit 53 (step S3). In other words, the control unit 101 acquires the detection value for a predetermined detection period. Then, the control unit 101 determines whether the acquired detection value is within a predetermined range and is stable (step S4). In other words, the control unit 101 determines whether the state of the detection signal is in the second state. Here, if the control unit 101 determines that the detection value is within a predetermined range and is stable (Yes in step S4), that is, if it determines that the state of the detection signal is in the second state, it starts suction by the component mounting nozzle 20a (step S5). As a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a. Thus, in this embodiment, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a based on the detection signal. In other words, if the detection value indicated by the detection signal is within a predetermined range, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a.

[0104] Then, the control unit 101 stops the suction and ultrasonic output by the pickup unit 14 (step S6). In other words, the control unit 101 stops the generation of negative pressure by the negative pressure generation unit 153 and also stops the vibration of the pickup nozzle 14a by the ultrasonic generation unit 152a. After that, the component mounting nozzle 20a moves while attracting the chip 6a and mounts the chip 6a onto the substrate 7.

[0105] On the other hand, in step S4, if the control unit 101 determines that the acquired detected value is not within a predetermined range and is not stable (No in step S4), it further determines whether the detected value is unstable or not (step S7). In other words, the control unit 101 determines whether the state of the detected signal is in the third state or not. Here, if the control unit 101 determines that the detected value is unstable (Yes in step S7), that is, if it determines that the state of the detected signal is in the third state, it executes the first adjustment process (step S8). In the first adjustment process, for example, the control unit 101 adjusts the position of the component mounting nozzle 20a by controlling the lifting mechanism 13b based on the detected signal. The control unit 101 then repeatedly executes the process from step S3.

[0106] Furthermore, if the control unit 101 determines that the detected value is not unstable (No in step S7), it then determines whether the detected value is less than the lower limit of a predetermined range, V2, and greater than or equal to the threshold V1 (step S9). In other words, the control unit 101 determines whether the state of the detected signal is in the fourth state. Here, if the control unit 101 determines that the detected value is less than the value V2 and greater than or equal to the threshold V1 (Yes in step S9), that is, if it determines that the state of the detected signal is in the fourth state, it executes the second adjustment process (step S10). In the second adjustment process, for example, the control unit 101 raises the component mounting nozzle 20a by controlling the lifting mechanism 13b. In other words, if the detected value indicated by the detection signal is smaller than a predetermined value, the control unit 101 moves the component mounting nozzle 20a away from the pickup unit 14. That predetermined value is, for example, the lower limit of a predetermined range, V2. The control unit 101 then repeatedly executes the process from step S3.

[0107] On the other hand, in step S9, if the control unit 101 determines that the acquired detected value is not less than the value V2 and greater than or equal to the threshold V1 (No in step S9), it further determines whether the detected value is less than the threshold V1 (step S11). In other words, the control unit 101 determines whether the state of the detected signal is the fifth state. Here, if the control unit 101 determines that the detected value is less than the threshold V1 (Yes in step S11), that is, if it determines that the state of the detected signal is the fifth state, it executes a process to discard the chip 6a (step S12).

[0108] For example, in the process of discarding a chip 6a, the control unit 101 moves the pickup nozzle 14a to a predetermined location and stops suction, thereby dropping the chip 6a held by the pickup nozzle 14a to that location. This disposal of the chip 6a prevents the transfer of the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a.

[0109] Furthermore, in step S11, if the control unit 101 determines that the detected value is not less than the threshold V1 (No. in step S11), that is, if it determines that the state of the detection signal is the first state, it repeatedly executes the process from step S2. As a result, the component mounting nozzle 20a descends toward the pickup nozzle 14a. In other words, the control unit 101 brings the component mounting nozzle 20a closer to the pickup unit 14 until the detected value indicated by the detection signal falls within a predetermined range.

[0110] Through the processing in steps S1 to S12, the control unit 101 can position the component mounting nozzle 20a in the appropriate position in the Z-axis direction, and can accurately transfer the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. If the pickup unit 14 picks up a new chip 6a after step S6 or step S12, the control unit 101 repeats the processing from step S1 for that new chip 6a.

[0111] Here, several other examples can be considered for the first and second adjustment processes besides those described above.

[0112] Figure 11 shows various examples of the first and second adjustment processes.

[0113] The first adjustment process is performed to stabilize the detected value when the state of the detected signal is in the third state, that is, when the detected value is unstable. Here, there are various possible causes for the state of the detected signal to be in the third state, and these causes may be resolved over time. Therefore, as the first adjustment process, the control unit 101 performs actions such as waiting, raising and lowering the component mounting nozzle 20a, changing the ultrasonic output from the pickup nozzle 14a, and changing the suction force of the pickup nozzle 14a.

[0114] When the first adjustment process is in standby mode, the control unit 101 maintains the movement of the component mounting nozzle 20a and the pickup nozzle 14a in a stopped state. Furthermore, the control unit 101 maintains the vibration from the ultrasonic generating unit 152a and the negative pressure generated by the negative pressure generating unit 153 at a constant level. In other words, the control unit 101 maintains the ultrasonic output and suction force of the pickup nozzle 14a at a constant level.

[0115] If the first adjustment process is raising or lowering the component mounting nozzle 20a, the control unit 101 raises the component mounting nozzle 20a by, for example, controlling the lifting mechanism 13b. Alternatively, the control unit 101 lowers the component mounting nozzle 20a.

[0116] If the first adjustment process involves changing the ultrasonic output of the pickup nozzle 14a, the control unit 101 weakens the intensity of the ultrasonic waves generated from the pickup nozzle 14a by controlling the ultrasonic generating unit 152a. Alternatively, the control unit 101 strengthens the intensity of the ultrasonic waves.

[0117] If the first adjustment process involves changing the suction force of the pickup nozzle 14a, the control unit 101 strengthens the suction force of the pickup nozzle 14a by controlling the negative pressure generation unit 153. Alternatively, the control unit 101 weakens the suction force.

[0118] This first adjustment process can change the influence on the chip 6a, thereby stabilizing the vibration of the chip 6a and increasing the likelihood of stabilizing the detection signal.

[0119] The second adjustment process is performed when the state of the detected signal is in the fourth state, that is, when the detected value is smaller than a predetermined range, in order to increase the detected value. Here, one possible reason why the state of the detected signal is in the fourth state is that the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a. Therefore, as the second adjustment process, the control unit 101 performs actions such as raising the component mounting nozzle 20a, reducing the ultrasonic output of the pickup nozzle 14a, and increasing the suction force of the pickup nozzle 14a.

[0120] If the second adjustment process is to raise the component mounting nozzle 20a, the control unit 101 raises the component mounting nozzle 20a by, for example, controlling the lifting mechanism 13b.

[0121] If the second adjustment process is to reduce the ultrasonic output of the pickup nozzle 14a, the control unit 101 controls the ultrasonic generating unit 152a to weaken the intensity of the ultrasonic waves generated from the pickup nozzle 14a so that the chip 6a moves closer to the pickup nozzle 14a. In other words, in this embodiment, the control unit 101 is configured to control the transducer of the pickup unit 14. Then, when the component mounting nozzle 20a receives the chip 6a from the pickup unit 14, the control unit 101 adjusts the vibration intensity of the transducer based on the detection signal.

[0122] If the second adjustment process is to increase the suction force of the pickup nozzle 14a, the control unit 101 strengthens the suction force of the pickup nozzle 14a by controlling the negative pressure generation unit 153 so that the chip 6a is attracted to the pickup nozzle 14a. Thus, in this embodiment, the control unit 101 is configured to control the suction force at which the chip 6a is attracted by the pickup unit 14. Then, when the component mounting nozzle 20a receives the chip 6a from the pickup unit 14, the control unit 101 adjusts the suction force of the pickup unit 14 based on the detection signal.

[0123] Furthermore, if the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, the chip 6a may come too close to the pickup nozzle 14a. In other words, the chip 6a may come into contact with the pickup nozzle 14a. Therefore, in the second adjustment process, the ultrasonic output may be increased so that the chip 6a moves away from the pickup nozzle 14a. Alternatively, in the second adjustment process, the suction force may be reduced so that the chip 6a moves away from the pickup nozzle 14a.

[0124] This second adjustment process increases the likelihood of changing the state of the detection signal from the fourth state to the second state by raising the detected value indicated by the detection signal.

[0125] As described above, in this embodiment, the control unit 101 controls the component mounting nozzle 20a based on the detection signal. Here, the state of the detection signal differs depending on whether there is a high probability or low probability that the chip 6a will be transferred from the pickup unit 14 to the component mounting nozzle 20a without wobbling. Note that the state of the detection signal is the state immediately before the chip 6a is transferred. Therefore, in this embodiment, since the component mounting nozzle 20a is controlled based on the detection signal, the pickup unit 14 can transfer the non-contactingly picked-up chip 6a to the component mounting nozzle 20a with reduced wobbling. Thus, the probability of proper transfer of the chip 6a can be increased.

[0126] Furthermore, in this embodiment, the control unit 101 starts sucking up the chip 6a with the component mounting nozzle 20a based on the detection signal. This allows the control unit 101 to start sucking up the chip 6a with the component mounting nozzle 20a when there is a high probability that the chip 6a will be handed over without wobbling. As a result, the component mounting nozzle 20a can receive the chip 6a from the pickup unit 14 in a state where wobbling is suppressed. Therefore, the likelihood of proper handover of the chip 6a can be increased.

[0127] Furthermore, in this embodiment, the control unit 101 starts sucking up the chip 6a with the component mounting nozzle 20a if the detected value is within a predetermined range. For example, it has been confirmed in advance that when the detected value is within a predetermined range, there is a high probability that the chip 6a will be transferred from the pickup unit 14 to the component mounting nozzle 20a without wobbling. Therefore, when the detected value is within that predetermined range, there is a high probability that the chip 6a will not wobble. For this reason, in this embodiment, by starting the sucking up of the chip 6a with the component mounting nozzle 20a at that time, the possibility of achieving proper transfer of the chip 6a can be increased.

[0128] Furthermore, in this embodiment, the control unit 101 adjusts the position of the component mounting nozzle 20a based on the detection signal. This makes it possible to change the position of the component mounting nozzle 20a, for example, in the vertical direction, according to the state of the detection signal. The influence that the chip 6a, which is picked up by the pickup unit 14 without contact, receives, that is, the influence that it receives from sound waves such as ultrasonic waves generated by the vibration of the transducer, can be changed by the position of the component mounting nozzle 20a. Therefore, it is possible to increase the possibility of reducing the vibration of the chip 6a and to increase the possibility of achieving proper transfer of the chip 6a.

[0129] Furthermore, in this embodiment, even if the detected value is not within a predetermined range, the control unit 101 brings the component mounting nozzle 20a closer to the pickup unit 14 until the detected value falls within the predetermined range. When the detected value falls within that predetermined range, there is a high probability that the chip 6a will not wobble, and by starting the suction of the chip 6a by the component mounting nozzle 20a at that time, the possibility of achieving proper transfer of the chip 6a can be increased.

[0130] Furthermore, in this embodiment, if the detected value is smaller than a predetermined value, the control unit 101 moves the component mounting nozzle 20a away from the pickup unit 14. In other words, even if the detected value is smaller than a predetermined range, the component mounting nozzle 20a moves away from the pickup unit 14 until the detected value falls within the predetermined range. When the detected value falls within that predetermined range, there is a high probability that the chip 6a will not wobble, and by starting the suction of the chip 6a by the component mounting nozzle 20a at that time, the possibility of achieving proper transfer of the chip 6a can be increased.

[0131] Furthermore, in this embodiment, the intensity of the transducer's vibration is controlled based on the detection signal. Therefore, the influence on the chip 6a, which is picked up by the pickup unit 14 without contact, that is, the influence on it from sound waves such as ultrasonic waves generated by the transducer's vibration, can be changed. As a result, the possibility of reducing the vibration of the chip 6a can be increased, and the pickup unit 14 can transfer the chip 6a, which is picked up without contact, to the component mounting nozzle 20a while suppressing vibration. Therefore, the possibility of achieving proper transfer of the chip 6a can be increased.

[0132] Furthermore, in this embodiment, the suction force of the pickup unit 14 is adjusted based on the detection signal. This allows the chip 6a to be attracted to or moved away from the pickup nozzle 14a. As a result, the influence on the chip 6a, which is being picked up by the pickup unit 14 without contact, that is, the influence on it from sound waves such as ultrasonic waves generated by the vibration of the transducer, can be changed. Therefore, the possibility of reducing the vibration of the chip 6a can be increased, and the pickup unit 14 can transfer the chip 6a, which is being picked up without contact, to the component mounting nozzle 20a while suppressing vibration. Thus, the possibility of achieving proper transfer of the chip 6a can be increased.

[0133] (Modified version of Embodiment 1) In the above embodiment 1, the pickup unit 14 is equipped with a detection element 52. On the other hand, in this modified example, the pickup unit 14 is not equipped with a detection element 52, and a signal indicating the current flowing through the piezoelectric element 51 of the ultrasonic generating unit 152a is output as the detection signal.

[0134] Figure 12 is a diagram illustrating the electrical configuration of the pickup unit 14 in this modified example.

[0135] The ultrasonic generating unit 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a, similar to the embodiment 1 described above. A predetermined AC voltage is applied to this piezoelectric element 51 by the AC power supply 201. As a result, the piezoelectric element 51 vibrates periodically. Consequently, the pickup nozzle 14a vibrates. Here, the current flowing through the piezoelectric element 51 fluctuates according to the vibration speed of the pickup nozzle 14a.

[0136] Therefore, in this modified example, the pickup unit 14 outputs a signal indicating the current flowing through the piezoelectric element 51 as a detection signal corresponding to the vibration of the pickup nozzle 14a. The monitoring circuit 54 monitors the current flowing through the piezoelectric element 51 and outputs a detection signal indicating that current to the control unit 101. The monitoring circuit 54 may be provided in the ultrasonic generator 152a, the pickup unit 14, the control unit 101, or the pickup device 100. Alternatively, the monitoring circuit 54 may perform digital signal processing on the detection signal to convert it into a signal format that can be processed by the control unit 101, and output the converted detection signal to the control unit 101.

[0137] In this modified example, the control unit 101 controls the component mounting nozzle 20a and the like based on such detection signals. Therefore, in this modified example, the piezoelectric element 51 can be used for both the vibration of the pickup nozzle 14a and the output of a detection signal corresponding to that vibration, thereby simplifying the configuration of the pickup unit 14.

[0138] (Embodiment 2) In Embodiment 1 and its modified form, the control unit 101 controls the component mounting nozzle 20a and the like based on the detection signal, thereby enabling accurate transfer of the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. However, even with such control of the component mounting nozzle 20a and the like, there is a possibility that the chip 6a may be accidentally transferred inappropriately, as shown in Figure 8(b). In other words, as shown in Figure 8(b), the chip 6a may be attracted to a position outside of the predetermined position on the component mounting nozzle 20a. Hereafter, this predetermined position will also be referred to as the specified position.

[0139] Therefore, in this embodiment, if the chip 6a is attracted to the component mounting nozzle 20a while it is not in a designated position, the control unit 101 controls the pickup unit 14 so that the chip 6a moves to that designated position. In other words, the control unit 101 determines whether or not the chip 6a is attracted to the component mounting nozzle 20a while it is not in a designated position. When the control unit 101 determines that the chip 6a is attracted to the component mounting nozzle 20a while it is not in a designated position, it vibrates the ultrasonic generating unit 152a of the pickup unit 14. As a result, ultrasonic waves are generated from the pickup nozzle 14a of the pickup unit 14, and these ultrasonic waves cause the chip 6a, which is attracted to the component mounting nozzle 20a, to vibrate. This vibration generates ultrasonic waves from the chip 6a toward the component mounting nozzle 20a, and a squeeze film is formed between the chip 6a and the component mounting nozzle 20a. The chip 6a then moves to the designated position due to the ultrasonic waves or the squeeze film. In other words, the positional relationship between the chip 6a and the component mounting nozzle 20a is corrected. This movement of the chip 6a to the designated position is also called self-centering. In other words, the pickup device 100 in this embodiment can be said to have a self-centering function for the chip 6a.

[0140] Figure 13 shows an example of the configuration of the component mounting apparatus 1a in this embodiment.

[0141] The component mounting apparatus 1a in this embodiment has the same configuration as the component mounting apparatus 1 in Embodiment 1, and further includes a suction confirmation camera 41.

[0142] The adsorption confirmation camera 41 captures an image of the chip 6a, which is adsorbed onto the component mounting nozzle 20a, from below at the chip transfer position Q. The chip transfer position Q is a position on the XY plane, and as shown in Figure 4B(c), it is the position where the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a. This imaging provides an adsorption confirmation image showing the chip 6a and the component mounting nozzle 20a that is adsorbing the chip 6a. In other words, this adsorption confirmation image shows the lower surface of the component mounting nozzle 20a and the chip 6a that is adsorbed onto that lower surface.

[0143] The pickup device 100 included in the component mounting device 1a may also be equipped with a suction confirmation camera 41.

[0144] The control unit 101 acquires the adsorption confirmation image from the adsorption confirmation camera 41. In other words, the control unit 101 acquires an adsorption confirmation image obtained by the adsorption confirmation camera 41, which shows the chip 6a and the component mounting nozzle 20a that is adsorbing the chip 6a. Based on this adsorption confirmation image, the control unit 101 determines whether the chip 6a has moved away from a predetermined position on the component mounting nozzle 20a and is adsorbed onto the component mounting nozzle 20a.

[0145] The predetermined position, or specified position, is, for example, the location of the area in the center of the lower surface of the component mounting nozzle 20a. Specifically, when viewing the component mounting nozzle 20a holding the chip 6a from the negative side to the positive side in the Z-axis direction, if the center of the chip 6a approximately overlaps with the center of the suction hole 20b of the component mounting nozzle 20a, the chip 6a is held in place without deviating from the specified position. On the other hand, if their centers do not approximately overlap, the chip 6a is held in place outside the specified position.

[0146] When the control unit 101 determines that the chip 6a has moved away from its designated position and is being attracted to the component mounting nozzle 20a, it outputs ultrasonic waves from the pickup nozzle 14a toward the chip 6a.

[0147] Figures 14A and 14B are diagrams illustrating an example of the processing operation of the pickup device 100 in this embodiment.

[0148] For example, in this embodiment, the control unit 101 of the pickup device 100, similar to the first embodiment, causes the pickup nozzle 14a and the component mounting nozzle 20a to perform the transfer of the chip 6a at the chip transfer position Q, as shown in Figure 14A(a). Through this transfer, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0149] Next, as shown in Figure 14A(b), the control unit 101 moves the pickup unit 14 away from the chip transfer position Q by controlling the rotational movement mechanism 15b. For example, the control unit 101 moves the pickup unit 14 from the chip transfer position Q to the positive side of the Y-axis. After that, the control unit 101 causes the suction confirmation camera 41 to image the chip 6a that is adsorbed onto the component mounting nozzle 20a. This imaging provides the suction confirmation image described above.

[0150] The control unit 101 then acquires an adsorption confirmation image from the adsorption confirmation camera 41 and determines, based on the adsorption confirmation image, whether or not the chip 6a is adsorbed away from the designated position. If the control unit 101 determines that the chip 6a is adsorbed away from the designated position, it controls the rotational movement mechanism 15b, as shown in Figure 14A(c), to return the retracted pickup unit 14 to the chip transfer position Q. For example, the control unit 101 returns the pickup unit 14 to the chip transfer position Q by moving it to the negative side in the Y-axis direction.

[0151] Next, the control unit 101 generates ultrasonic waves from the pickup nozzle 14a, as shown in Figure 14B(a). In other words, the control unit 101 vibrates the ultrasonic wave generating unit 152a of the pickup unit 14, causing the pickup nozzle 14a to output ultrasonic waves toward the chip 6a that is attracted to the component mounting nozzle 20a. At this time, the control unit 101 weakens the suction force of the component mounting nozzle 20a. This suction force is weaker than the suction force of the component mounting nozzle 20a in the state shown in Figures 14A(a) to (c). In other words, when the control unit 101 outputs sound waves from the pickup nozzle 14a toward the chip 6a that is attracted to the component mounting nozzle 20a, it weakens the suction force that the component mounting nozzle 20a uses to attract the chip 6a. For example, this suction force is a force based on the negative pressure generated by the negative pressure generating unit 153, and this negative pressure is generated at the suction hole 20b of the component mounting nozzle 20a. In this case, the control unit 101 weakens the suction force by controlling the negative pressure generating unit 153 or by reducing the opening of the valve between the negative pressure generating unit 153 and the suction hole 20b. As a result, the suction force, which was, for example, -80kPa, is weakened to a value less than that.

[0152] As a result, as shown in Figure 14B(b), the chip 6a moves toward the designated position while vibrating in the Z-axis direction due to self-centering. In other words, the chip 6a vibrates in the Z-axis direction when it receives ultrasonic waves while the attractive force toward the component mounting nozzle 20a is weakened. This vibration generates ultrasonic waves from the chip 6a toward the component mounting nozzle 20a, and a squeeze film is formed between the chip 6a and the component mounting nozzle 20a. The chip 6a then moves to the designated position due to the ultrasonic waves or the squeeze film. This allows the positional relationship between the chip 6a and the component mounting nozzle 20a to be corrected even if the chip 6a is out of the designated position, and the chip 6a can be moved to the designated position.

[0153] Figure 15 is a flowchart showing an example of the processing operation of the pickup device 100 in this embodiment. It should be noted that this processing operation is also the processing operation of the component mounting device 1a.

[0154] First, the control unit 101 instructs the pickup nozzle 14a and the component mounting nozzle 20a to transfer the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a (step S20). The process in step S20 is the process shown in Figure 14A(a), and may be carried out according to the flowchart shown in Figure 10.

[0155] Next, the control unit 101 retracts the pickup unit 14 from the chip transfer position Q (step S21). The process in step S21 is the process shown in Figure 14A(b).

[0156] Next, the control unit 101 causes the adsorption confirmation camera 41 to image the chip 6a that is adsorbed onto the component mounting nozzle 20a (step S22). Then, based on the adsorption confirmation image obtained from the image, the control unit 101 determines whether or not the chip 6a is adsorbed away from the designated position (step S23). If the control unit 101 determines that the chip 6a is adsorbed away from the designated position (Yes in step S23), it returns the pickup unit 14 to the chip transfer position Q (step S24). Then, the control unit 101 weakens the suction force of the component mounting nozzle 20a and emits ultrasonic waves from the pickup nozzle 14a (step S25). As a result, the chip 6a moves towards the designated position. After that, the control unit 101 repeats the process from step S21.

[0157] On the other hand, if the control unit 101 determines in step S23 that the chip 6a is being held in place without detaching from the specified position (No. in step S23), it moves the component mounting nozzle 20a that is holding the chip 6a in place towards the substrate 7 (step S26). At this time, if the suction force of the component mounting nozzle 20a has been weakened in step S25, the control unit 101 may strengthen the suction force back to its original strength before moving the component mounting nozzle 20a towards the substrate 7.

[0158] Furthermore, when step S25 is executed repeatedly, the control unit 101 may weaken the suction force of the component mounting nozzle 20a each time. Alternatively, even when step S25 is executed repeatedly, if the suction force has been weakened once in the past, the control unit 101 may maintain that suction force. Also, when step S25 is executed repeatedly, the control unit 101 may increase the intensity of the ultrasonic waves output from the pickup nozzle 14a or increase the duration for which the ultrasonic waves are output each time.

[0159] As described above, in this embodiment, ultrasonic waves are emitted from the pickup nozzle 14a toward the chip 6a that is attracted to the component mounting nozzle 20a. As a result, the chip 6a that is attracted to the component mounting nozzle 20a vibrates upon receiving the ultrasonic waves emitted from the pickup nozzle 14a, allowing the chip 6a to be moved while it is attracted to the component mounting nozzle 20a. In other words, the positional relationship between the chip 6a and the component mounting nozzle 20a can be corrected. For example, self-centering of the chip 6a can be achieved. As a result, even if the chip 6a is accidentally attracted to the component mounting nozzle 20a at a predetermined position when it is transferred from the pickup nozzle 14a to the component mounting nozzle 20a, the possibility of moving the chip 6a to that predetermined position can be increased. Therefore, the possibility of proper transfer of the chip 6a can be increased.

[0160] Furthermore, as described above, when ultrasonic waves are emitted from the pickup nozzle 14a, the suction force of the component mounting nozzle 20a is weakened, so that the chip 6a can be easily moved while it is attached to the component mounting nozzle 20a.

[0161] Furthermore, in this embodiment, it is determined whether the chip 6a has moved away from its designated position and is being attracted to the component mounting nozzle 20a. When the chip 6a has moved away from its designated position and is being attracted, ultrasonic waves are emitted from the pickup nozzle 14a toward the chip 6a. Therefore, when the chip 6a is attracted to its designated position, the generation of ultrasonic waves can be prohibited. In other words, it is possible to suppress the unnecessary generation of ultrasonic waves even when the chip 6a is attracted to its designated position. As a result, the power consumption of the pickup device 100 can be reduced.

[0162] Furthermore, in this embodiment, the control unit 101 determines, based on the suction confirmation image, whether the chip 6a has detached from its designated position and is being adsorbed onto the component mounting nozzle 20a. This allows for an appropriate determination of whether the chip 6a has detached from its designated position and is being adsorbed.

[0163] Here, if the control unit 101 determines that the chip 6a has moved away from its designated position and is being held by the component mounting nozzle 20a, it may set the vibration intensity of the ultrasonic generator 152a based on the suction confirmation image and vibrate the ultrasonic generator 152a at the set intensity. The intensity may be defined by at least one of the vibration amplitude, frequency, and vibration velocity. For example, the control unit 101 may increase the vibration intensity by increasing the vibration velocity of the ultrasonic generator 152a. This allows the vibration intensity to be set appropriately, enabling effective self-centering of the chip 6a. For example, the greater the displacement shown in the suction confirmation image, which represents the displacement of the chip 6a being held by the component mounting nozzle 20a relative to its designated position, the stronger the vibration intensity set by the control unit 101 may be. This enables more effective self-centering of the chip 6a.

[0164] Alternatively, if the control unit 101 determines that the chip 6a has moved away from its designated position and is being held by the component mounting nozzle 20a, it may set the vibration time of the ultrasonic generator 152a based on the suction confirmation image and vibrate the ultrasonic generator 152a for the set time. This allows the vibration time to be set appropriately, enabling effective self-centering of the chip 6a. For example, the longer the displacement shown in the suction confirmation image, which represents the displacement of the chip 6a from its designated position while being held by the component mounting nozzle 20a, the longer the time set by the control unit 101 may be. This enables more effective self-centering of the chip 6a. The control unit 101 may set not only the intensity and duration of the vibration of the ultrasonic generator 152a, but both.

[0165] Furthermore, the intensity at which the ultrasonic generator 152a vibrates for the self-centering of the chip 6a may be stronger than the intensity at which the ultrasonic generator 152a vibrates for the non-contact pickup of the chip 6a. In other words, the control unit 101 vibrates the ultrasonic generator 152a at a first intensity so that the pickup unit 14 can pick up the chip 6a non-contact. Then, when the control unit 101 outputs ultrasound from the pickup nozzle 14a toward the chip 6a that is adsorbed to the component mounting nozzle 20a, it may vibrate the ultrasonic generator 152a at a second intensity that is stronger than the first intensity. Note that the first and second intensities may be defined by at least one of the amplitude, frequency, and velocity of the vibration. For example, the control unit 101 may switch the vibration intensity from the first intensity to the second intensity by increasing the vibration velocity of the ultrasonic generator 152a.

[0166] For example, when the chip 6a is transferred from the pickup unit 14 to the component mounting nozzle 20a, the distance between the pickup nozzle 14a and the chip 6a becomes longer than when the pickup unit 14 is picking up the chip 6a non-contactually. On the other hand, as described above, when the chip 6a is transferred from the pickup unit 14 to the component mounting nozzle 20a, the vibration intensity of the ultrasonic generating unit 152a increases. Therefore, even if the distance increases, the chip 6a can receive ultrasonic waves of appropriate intensity, and self-centering can be easily achieved.

[0167] (Modified version of Embodiment 2) In Embodiment 2, the control unit 101 vibrates the ultrasonic generating unit 152a of the pickup unit 14 to move the chip 6a, which is attracted to the pickup unit but has moved away from its designated position, back to its designated position. In this modified example, the mounting unit 20 of the component mounting unit 13 is equipped with an ultrasonic generating unit, similar to the pickup unit 14. The control unit 101 then vibrates the ultrasonic generating unit of the mounting unit 20 instead of the ultrasonic generating unit 152a of the pickup unit 14 to move the chip 6a, which has moved away from its designated position, back to its designated position.

[0168] Figure 16 shows an example of the configuration and operation of the implementation unit 20 in this modified example.

[0169] The mounting unit 20, like the pickup unit 14, includes a component mounting nozzle 20a, an ultrasonic generator 23, and an ultrasonic horn 22a. The ultrasonic generator 23 is, for example, a transducer similar to the ultrasonic generator 152a of the pickup unit 14. The ultrasonic horn 22a is connected to the ultrasonic generator 23 and the component mounting nozzle 20a, and amplifies the vibrations of the ultrasonic generator 23 and transmits them to the component mounting nozzle 20a. As a result, ultrasonic waves are generated from the component mounting nozzle 20a. The ultrasonic generator 23, like the ultrasonic generator 152a, generates ultrasonic waves with a frequency of, for example, 20 kHz or higher, but may also generate sound waves in a broader sense. The ultrasonic horn 22a has a suction path 22b formed therein, which is a hole that communicates with the suction hole 20b of the component mounting nozzle 20a. For example, the negative pressure generator 153 is connected to the suction hole 20b via this suction path 22b, and suction is performed by generating negative pressure in the suction hole 20b. This suction causes the component mounting nozzle 20a to attract the chip 6a.

[0170] In this modified example, the ultrasonic horn 22a and the component mounting nozzle 20a are separate components, but they may be integrated into a single unit. In other words, the mounting unit 20 does not need to include the ultrasonic horn 22a.

[0171] As described above, the mounting unit 20 in this modified example is a unit that includes a component mounting nozzle 20a, which is a suction nozzle, and an ultrasonic generating unit 23 that vibrates to generate ultrasonic waves from the component mounting nozzle 20a, and is also called a suction unit. The control unit 101 in this modified example controls the pickup unit 14 and the mounting unit 20. For example, the control unit 101 causes the pickup unit 14 and the mounting unit 20 to transfer the chip 6a from the pickup unit 14 to the component mounting nozzle 20a. As a result, as shown in Figure 16(a), the component mounting nozzle 20a adsorbs the chip 6a at the chip transfer position Q by the suction described above. The control unit 101 then causes the adsorption confirmation camera 41 to image the chip 6a, and determines whether the chip 6a has been adsorbed away from the specified position based on the adsorption confirmation image obtained from the image.

[0172] Here, when the control unit 101 determines that the chip 6a is attracted to the component 6a while it is not in the designated position, it weakens the suction force that the component mounting nozzle 20a uses to attract the chip 6a by controlling, for example, the negative pressure generating unit 153, as shown in Figure 16(b). Furthermore, as shown in Figure 16(c), when the component mounting nozzle 20a receives the chip 6a from the pickup unit 14 and is attracting the chip 6a, the control unit 101 vibrates the ultrasonic generating unit 23 of the mounting unit 20.

[0173] As a result, as shown in Figure 16(c), the chip 6a moves toward the designated position while vibrating in the Z-axis direction due to self-centering. In other words, the chip 6a receives ultrasonic waves from the component mounting nozzle 20a with a weakened suction force toward the component mounting nozzle 20a, and a squeeze film is formed between the chip 6a and the component mounting nozzle 20a. Therefore, at this time, the component mounting nozzle 20a holds the chip 6a in a non-contact manner, similar to non-contact pickup by the pickup nozzle 14a. The chip 6a then moves to the designated position due to the ultrasonic waves or the squeeze film. This allows the chip 6a to be moved to the designated position even if it is out of position.

[0174] As described above, in this modified example, since ultrasonic waves are generated from the component mounting nozzle 20a, even if the pickup unit 14 is not near the component mounting nozzle 20a, the ultrasonic waves from the component mounting nozzle 20a can achieve self-centering of the chip 6a, similar to the second embodiment. In other words, in the second embodiment, when the chip 6a is attracted to the component mounting nozzle 20a while deviated from its designated position, it is necessary to return the retracted pickup unit 14 to the chip transfer position Q, as shown in Figure 14A(c), in order to self-center the chip 6a. However, in this modified example, self-centering of the chip 6a can be achieved without returning the pickup unit 14 to the chip transfer position Q. Furthermore, in this modified example, as shown in Figures 16(a) to (c), the control unit 101 can control the ultrasonic generation unit 23 while observing the adsorption confirmation image obtained from the adsorption confirmation image as a moving image by having the adsorption confirmation camera 41 image the chip 6a at the chip transfer position Q. As a result, the movement of the pickup unit 14 can be reduced, and work efficiency can be effectively improved.

[0175] The above has described component mounting devices 1, 1a, which are bonding devices according to one or more embodiments, and a pickup device 100 provided in the component mounting devices 1, 1a, based on each embodiment and each modification. However, this disclosure is not limited to each embodiment and each modification. Any modifications that a person skilled in the art can conceive of, without departing from the spirit of this disclosure, may also be included in this disclosure.

[0176] For example, in Embodiment 2 and its modified version, the process of step S20 shown in Figure 15 is the process of Embodiment 1, and specifically, it is performed according to the flowchart in Figure 10. However, the process of step S20 does not have to be performed according to the flowchart in Figure 10. For example, the process of step S20 may include steps S1, S2, S5, and S6 shown in Figure 10. In this case, there is a higher possibility that the chip 6a will be dislodged from its designated position and attracted to the component mounting nozzle 20a, but the process in Embodiment 2 or its modified version can move the chip 6a to its designated position. In other words, the process of Embodiment 2 can be applied to the chip 6a regardless of Embodiment 1, regardless of how the chip 6a is attracted to the component mounting nozzle 20a.

[0177] Furthermore, in the above embodiment 2 and its modified form, if the control unit 101 determines, based on the adsorption confirmation image, that the chip 6a has moved away from the designated position and is adsorbed onto the component mounting nozzle 20a, it outputs ultrasonic waves from the pickup nozzle 14a toward the chip 6a. However, the control unit 101 may output ultrasonic waves from the pickup nozzle 14a without making such a determination. In other words, after the chip 6a has been transferred from the pickup nozzle 14a to the component mounting nozzle 20a, the control unit 101 may output ultrasonic waves from the pickup nozzle 14a toward the chip 6a without acquiring an adsorption confirmation image. This eliminates the need for determination based on the adsorption confirmation image and simplifies the processing operation.

[0178] Furthermore, in the above embodiment 2 and its modified form, the control unit 101 weakens the suction force of the component mounting nozzle 20a when it outputs ultrasonic waves from the pickup nozzle 14a toward the chip 6a. However, the control unit 101 does not need to weaken the suction force. In other words, the control unit 101 sets the suction force to a weak strength from the beginning, that is, from the moment the component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a and picks it up. Then, when the control unit 101 outputs ultrasonic waves from the pickup nozzle 14a toward the chip 6a, it does not change the suction force of the component mounting nozzle 20a, and strengthens the suction force after the chip 6a has self-centered due to the ultrasonic waves. After that, the control unit 101 moves the component mounting nozzle 20a toward the substrate 7. This eliminates the need to weaken the suction force and simplifies the processing operation.

[0179] Furthermore, in the above embodiment 2 and its modified form, an adsorption confirmation image is used to determine whether the chip 6a is adsorbed away from its designated position. However, this determination may be made without using such an adsorption confirmation image. For example, the pickup device 100 is equipped with a flow meter that detects the flow rate of air flowing into the suction hole 20b of the component mounting nozzle 20a. The control unit 101 may then determine whether the chip 6a is adsorbed away from its designated position based on the flow rate detected by the flow meter. For example, the higher the flow rate, the larger the area covered by the chip 6a to the suction hole 20b of the component mounting nozzle 20a, and therefore the more likely the chip 6a is adsorbed away from its designated position. In this case, the control unit 101 may determine that the chip 6a is adsorbed away from its designated position if the flow rate is greater than a threshold.

[0180] Furthermore, in the above embodiment 2 and its modifications, ultrasonic waves are output for the self-centering of the chip 6a, and these ultrasonic waves may be output instantaneously or as impulses. Also, these ultrasonic waves may be output after the ultrasonic waves that were output from the pickup nozzle 14a for non-contact pickup have stopped. Alternatively, the ultrasonic waves for the self-centering of the chip 6a may be output from the pickup nozzle 14a without interruption, following the ultrasonic waves that were output from the pickup nozzle 14a for non-contact pickup.

[0181] Furthermore, in the embodiments 1 and 2 described above and their variations, the suction force of at least one of the pickup nozzle 14a and the component mounting nozzle 20a is adjusted. This adjustment of the suction force is performed by adjusting an adjustment valve or the opening degree of a valve. This adjustment of the adjustment valve or the opening degree of a valve may be performed, for example, by an electro-pneumatic regulator.

[0182] Furthermore, in the above embodiments 1 and 2 and their modified forms, the pickup nozzle 14a holds the chip 6a without contact, but the component mounting nozzle 20a may also hold the chip 6a without contact, similar to the pickup nozzle 14a.

[0183] Furthermore, in the first embodiment described above, the control unit 101 controls the component mounting nozzle 20a, etc., based on a detection signal indicating a voltage value as the detected value, and in a modified version of the first embodiment, the control unit 101 controls the component mounting nozzle 20a, etc., based on a detection signal indicating a current value as the detected value. However, the detection signal can be any signal that indicates a value corresponding to the vibration velocity of the pickup nozzle 14a. For example, the detection signal may be a signal indicating impedance.

[0184] Furthermore, the detection element 52 in the above embodiment 1 may have a dielectric constant greater than or equal to that of the piezoelectric element 51 of the ultrasonic generating unit 152a. Also, the detection element 52 may have substantially the same configuration as the piezoelectric element 51.

[0185] Furthermore, in each of the above embodiments 1 and its modifications, the control unit 101 may estimate the vibration velocity of the pickup nozzle 14a based on the detection signal and control the component mounting nozzle 20a, etc., based on that vibration velocity. For example, the control unit 101 may estimate the vibration velocity by multiplying the detected value indicated by the detection signal by a coefficient.

[0186] Furthermore, in the above embodiment 1 and its modified form, the control unit 101 controls the component mounting nozzle 20a based on the detection signal, but the pickup unit 14 may be controlled without controlling the component mounting nozzle 20a. In other words, the control unit 101 may control at least one of the suction force and ultrasonic output of the pickup nozzle 14a.

[0187] Furthermore, in the embodiments 1 and 2 and their modified forms described above, the control unit 101 controls the component holding unit 15 including the pickup nozzle 14a, the push-up unit 34, the Y-axis drive mechanism 12, and the component mounting unit 13. However, multiple control units may control these components. For example, one of the multiple control units may control the pickup nozzle 14a, while the other control units control the Y-axis drive mechanism 12 and the component mounting unit 13.

[0188] Furthermore, in the above embodiments 1 and 2 and their variations, the pickup device 100 is provided in the component mounting device 1 or 1a, which is a bonding device, but the pickup device 100 may be provided in other devices. An example of other devices is a semiconductor chip sorter, but it is not limited to this. When the other device is a semiconductor chip sorter, the pickup in the above embodiments 1 and 2 and their variations means, for example, the operation of picking up a semiconductor chip from a tray.

[0189] In the embodiments 1 and 2 described above and their variations, the control unit 101, etc., may be implemented by being composed of dedicated hardware or by executing a software program suitable for the control unit 101. The control unit 101 may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the control unit 101, etc., causes the computer to execute each step of the flowchart shown in Figure 10 or Figure 15, for example. Such a processing method by the control unit 101 is also called a control method.

[0190] The following cases are also included in this disclosure.

[0191] (1) The control unit 101 may specifically be a computer system consisting of a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its function by operating the microprocessor in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0192] (2) The control unit 101 may be composed of a single system LSI (Large Scale Integration). The system LSI is a multi-functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system composed of a microprocessor, ROM, RAM, etc. The RAM stores a computer program. The system LSI achieves its function by operating the microprocessor according to the computer program.

[0193] (3) The control unit 101 may consist of a detachable IC card or a standalone module. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned multi-functional LSI. The IC card or module achieves its function by the operation of the microprocessor according to the computer program. The IC card or module may be tamper-resistant. [Industrial applicability]

[0194] This disclosure can be used, for example, in devices, units, and systems that pick up parts and perform work using those parts. [Explanation of symbols]

[0195] 1. 1a Component mounting equipment (bonding equipment) 2 bases 3. Parts Supply Department 3a Holding table 5 Board holding part 5a Conveyor rail 6 Semiconductor wafer unit 6a Chip (component) 6b Adhesive sheet 7 circuit boards 11 frames 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13. Component mounting section 13a Mobile plate 13b Lifting mechanism 13c Lifting Plate 14 Pickup Unit 14a Pickup nozzle 14aa Part 1 14ab 2nd part 14ac 3rd part 14b opening 14c Suction hole 15. Parts holding section 15a Arm 15b Rotational movement mechanism 20 Mounting Units (Adsorption Units) 20a Component mounting nozzle (suction nozzle) 20b Suction hole 21 Pickup Camera 22a Ultrasonic horn 22b Suction route 23. Ultrasonic generating unit (transducer) 31 XY Table Mechanism 32 Mobile Plates 33 Support member 34. Push-up section 34a Push-up pin 41 Adhesion Confirmation Camera 51 Piezoelectric element 52. Detection element (piezoelectric element) 53, 54 Monitoring circuit 100 Pickup device 101 Control Unit 152a Ultrasonic generating unit (transducer) 152b Ultrasonic horn 152c Suction route 153 Negative pressure generation section 201 AC power supply

Claims

1. A pickup unit for non-contact pickup of a component, comprising a pickup nozzle having a suction hole for attracting the component, and a vibrating element that vibrates to generate sound waves from the pickup nozzle, A suction nozzle that receives the component from the pickup unit and adsorbs the component, The system comprises a control unit that controls the pickup unit and the suction nozzle, The control unit, By vibrating the vibrator of the pickup unit, the pickup nozzle is made to output sound waves toward the component that is being held by the suction nozzle. Pickup device.

2. The control unit further, When the pickup nozzle outputs sound waves toward the component that is adsorbed by the adsorption nozzle, the suction force of the adsorption nozzle for adsorbing the component is weakened. The pickup device according to claim 1.

3. The control unit, It is determined whether the component is attached to the suction nozzle in a position other than the predetermined position of the suction nozzle, When it is determined that the component has moved away from the specified position and is being held by the suction nozzle, the pickup nozzle is made to output sound waves toward the component. The pickup device according to claim 1.

4. The control unit, An image showing the component and the suction nozzle adsorbing the component is obtained by imaging with a camera. Based on the aforementioned image, it is determined whether the part has moved away from the specified position and is being held by the suction nozzle. The pickup device according to claim 3.

5. The control unit, If it is determined that the component has moved away from the specified position and is being held in place by the suction nozzle, the vibration intensity of the vibrator is set based on the image. The vibrator is vibrated at the set intensity. The pickup device according to claim 4.

6. The greater the displacement shown in the image above, the greater the displacement of the position of the component being held by the suction nozzle relative to the specified position, and the stronger the vibration intensity set by the control unit. The pickup device according to claim 5.

7. The control unit, If it is determined that the component has moved away from the specified position and is being held by the suction nozzle, the vibration time of the vibrator is set based on the image. The oscillator is vibrated for the set time. The pickup device according to claim 4.

8. The longer the displacement shown in the image above, the longer the displacement of the position of the component being held by the suction nozzle relative to the specified position, and the longer the time set by the control unit. The pickup device according to claim 7.

9. The control unit further, In order for the pickup unit to pick up the component without contact, the vibrator is vibrated at a first intensity, When the pickup nozzle outputs the sound waves toward the component that is adsorbed by the adsorption nozzle, the vibrator is vibrated with a second intensity that is stronger than the first intensity. The pickup device according to claim 1.

10. A pickup unit for non-contact pickup of a component, comprising a pickup nozzle having a suction hole for attracting the component, and a vibrating element that vibrates to generate sound waves from the pickup nozzle, A suction unit including a suction nozzle that receives the component from the pickup unit and adsorbs the component, and a vibrator that vibrates to generate sound waves from the suction nozzle, The system comprises a control unit that controls the pickup unit and the suction unit, The control unit, When the suction nozzle receives the component from the pickup unit and is holding the component in place, the vibrator of the suction unit is vibrated. Pickup device.

11. A pickup device according to any one of claims 1 to 10, The suction nozzle of the pickup device is a component mounting nozzle that receives the component from the pickup unit and joins the received component to another component. Bonding equipment.

12. A control method for controlling a pickup device, The pickup device is A pickup unit for non-contact pickup of a component, comprising a pickup nozzle having a suction hole for attracting the component, and a vibrating element that vibrates to generate sound waves from the pickup nozzle, The system comprises a suction nozzle for adsorbing the aforementioned component, The control method described above is The transfer of the component from the pickup unit to the suction nozzle is performed by the pickup unit and the suction nozzle. By vibrating the vibrator of the pickup unit, the pickup nozzle is made to output sound waves toward the component that is being held by the suction nozzle. Control method.

13. A control method for controlling a pickup device, The pickup device is A pickup unit for non-contact pickup of a component, comprising a pickup nozzle having a suction hole for attracting the component, and a vibrating element that vibrates to generate sound waves from the pickup nozzle, The suction unit includes a suction nozzle for adsorbing the aforementioned component and a vibrator that vibrates to generate sound waves from the suction nozzle, The control method described above is The transfer of the component from the pickup unit to the suction nozzle is performed by the pickup unit and the suction nozzle. When the suction nozzle receives the component from the pickup unit and is holding the component in place, the vibrator of the suction unit is vibrated. Control method.

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