Implementation system, control method for implementation system, server device, and control method for server device

Abstract

To provide an implementation system capable of appropriately determining the state of a specific location, a control method for the implementation system, a server device, and a control method for the server device. [Solution] The implementation system 1 comprises a production apparatus 10 having an imaging unit 101 and a control unit 122, and a management apparatus 20 having a management unit 211 and a calculation unit 212. The image obtained by the imaging unit 101 imaging a specific location is used for visual evaluation to assess the condition of the specific location. The management unit 211 stores actual data, including specific location information which is information about the specific location included in the image, and lighting condition information which is information indicating the lighting conditions when the imaging unit 101 imaged the specific location and obtained the image, in the storage unit 202 for each visual evaluation. The calculation unit 212 calculates the frequency of use of lighting conditions for visual evaluation based on the multiple actual data. The management unit 211 adjusts the lighting conditions based on the frequency of use calculated by the calculation unit 212.

Description

Technical Field

[0001] The present disclosure generally relates to an implementation system, a control method for an implementation system, a server device, and a control method for a server device. More specifically, the present disclosure relates to an implementation system including an imaging unit that images a specific location on a substrate, a control method for the implementation system, a server device that communicates with a production device included in the implementation system, and a control method for the server device.

Background Art

[0002] Patent Document 1 discloses a visual inspection support device for assisting in the visual inspection of a substrate on which a plurality of components are mounted. The visual inspection support device includes an imaging unit, a storage unit, and a display unit. The imaging unit images the components on the substrate. The storage unit stores, as a good product image, an image that has been previously imaged of a component with a good mounting state. The display unit displays, on one screen, the images of the plurality of components imaged by the imaging unit in pairs with the corresponding good product images for each component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the visual inspection support device described in Patent Document 1, in the imaged image, it may be difficult to distinguish between the component that is the inspection target and solder, lands, etc. that exist around the location on the substrate where the component is mounted. For this reason, there may be cases where the state of a specific location including the component and the location on the substrate where the component is mounted cannot be appropriately determined.

[0005] The purpose of this disclosure is to provide an implementation system capable of appropriately determining the state of a specific location, a control method for the implementation system, a server device, and a control method for the server device. [Means for solving the problem]

[0006] An implementation system according to one aspect of the present disclosure comprises a production device and a management device. The production device has an imaging unit and a control unit. The imaging unit images a specific location on a substrate. The control unit controls the imaging unit to image the specific location under lighting conditions. The management device has a management unit for managing the lighting conditions. The image obtained by the imaging unit imaging the specific location is displayed on a display unit. The image displayed on the display unit is used for a visual evaluation to assess the state of the specific location. The management unit stores performance data, including specific location information which is information about the specific location included in the image, and lighting condition information which is information indicating the lighting conditions when the imaging unit imaged the specific location and obtained the image, in a storage unit for each visual evaluation. The management device further has a calculation unit that calculates the frequency of use of the lighting conditions for the visual evaluation based on a plurality of performance data. The management unit adjusts the lighting conditions based on the frequency of use.

[0007] A control method for an implementation system according to one aspect of this disclosure includes an imaging step, a display step, and a management step. In the imaging step, a specific location on a substrate is imaged under illumination conditions. In the display step, the imaged image obtained by imaging the specific location in the imaging step is displayed. In the management step, the illumination conditions are managed. The imaged image displayed in the display step is used for a visual evaluation to assess the state of the specific location. The management step includes a storage step, a calculation step, and an adjustment step. In the storage step, actual data including specific location information, which is information about the specific location included in the imaged image, and illumination condition information, which is information indicating the illumination conditions when the imaged image was obtained by imaging the specific location in the imaging step, is stored in the storage unit for each visual evaluation. In the calculation step, the frequency of use of the illumination conditions for the visual evaluation is calculated based on a plurality of the actual data. In the adjustment step, the illumination conditions are adjusted based on the frequency of use.

[0008] A server device according to one aspect of this disclosure comprises a communication unit, an acquisition unit, a calculation unit, and a management unit. The communication unit communicates with each of a plurality of mounting devices, each included in a different mounting line, which mounts components onto a substrate. The acquisition unit acquires actual data for each visual evaluation that assesses the state of the specific location, which includes specific location information, which is information about the specific location included in an image captured by an imaging unit of each of the plurality of mounting devices that captures the specific location on the substrate, and illumination condition information, which is information indicating the illumination conditions when the imaging unit captured the specific location and obtained the image. The calculation unit calculates the frequency of use of the illumination conditions used in the visual evaluation based on the plurality of actual data. The management unit adjusts the illumination conditions under which the imaging unit captures the specific location based on the frequency of use and the type of substrate.

[0009] A control method for a server device according to one aspect of the present disclosure includes a communication step, an acquisition step, a calculation step, and a management step. In the communication step, communication is performed with each of a plurality of mounting devices, each belonging to a different mounting line and mounting components onto a substrate. In the acquisition step, actual data is acquired for each visual evaluation that assesses the state of the specific location, including specific location information, which is information about the specific location included in an image captured by an imaging unit of each of the plurality of mounting devices that captures the specific location on the substrate, and illumination condition information, which is information indicating the illumination conditions when the imaging unit captured the specific location and obtained the image. In the calculation step, the frequency of use of the illumination conditions used in the visual evaluation is calculated based on the plurality of actual data. In the management step, the illumination conditions under which the imaging unit captures the specific location are adjusted based on the frequency of use and the type of substrate. [Effects of the Invention]

[0010] According to this disclosure, there is an advantage in being able to appropriately determine the condition of a specific part. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a block diagram showing the schematic configuration of the implementation system according to Embodiment 1. [Figure 2] Figure 2 is a conceptual diagram showing the production process of a circuit board assembly using the same mounting system. [Figure 3] Figure 3 is a schematic diagram of the mounting device in the same mounting system. [Figure 4] Figure 4 is a flowchart showing the control method for the implementation system described above. [Figure 5] Figure 5 is a block diagram showing the schematic configuration of the implementation system according to the first modified example described above. [Figure 6] Figure 6 is a flowchart showing the control method of the implementation system according to the first modified example described above. [Figure 7]Figure 7 is a flowchart, different from Figure 6, showing the control method of the implementation system according to the first modified example described above. [Figure 8] Figure 8 is a block diagram showing the schematic configuration of the implementation system according to the second modified example described above. [Figure 9] Figure 9 is a flowchart showing the control method of the implementation system according to the second modified example described above. [Figure 10] Figure 10 is an explanatory diagram illustrating how the illumination unit changes the illumination angle that illuminates a specific area to be imaged as an illumination condition in an implementation system relating to another modification of the above. [Figure 11] Figure 11 is a block diagram showing the schematic configuration of the implementation system according to Embodiment 2. [Figure 12] Figure 12 is a flowchart showing the control method for the server device in the same implementation system. [Modes for carrying out the invention]

[0012] The embodiments and modifications described below are merely examples of the present disclosure. This disclosure is not limited to these embodiments and modifications, and various modifications are possible depending on the design, etc., as long as they do not depart from the technical idea of ​​the present disclosure. The figures described in the embodiments and modifications below are schematic diagrams, and the ratios of the size and thickness of each component in the figures do not necessarily reflect the actual dimensional ratios.

[0013] (1) Embodiment 1 (1.1 Overview) The following describes the outline of the implementation system 1 according to Embodiment 1 with reference to Figures 1 to 3.

[0014] The mounting system 1 according to Embodiment 1 is a system for mounting (attaching) the component 30 (see FIG. 3) captured by the capturing unit 142 (see FIGS. 1 and 3) to the substrate 40 (see FIG. 3). The mounting system 1 is used, for example, in facilities such as factories, research institutes, offices, and educational institutions for operations in the manufacture of various products such as electronic devices and automobiles.

[0015] As shown in FIG. 1, the mounting system 1 includes a production apparatus 10 and a management apparatus 20. The production apparatus 10 has an imaging unit 101 and an imaging control unit 122. The imaging control unit 122 corresponds to the control unit of the present disclosure. The imaging unit 101 images a specific location on the mounting surface 401 of the substrate 40. The imaging control unit 122 controls the imaging unit 101 to image the specific location under the illumination conditions. The captured image obtained by the imaging unit 101 imaging the specific location is displayed on the display unit 103. The captured image displayed on the display unit 103 is used for visual evaluation to evaluate the state of the specific location. Here, the "visual evaluation" in the present disclosure means, for example, that an operator of the production apparatus 10 or the like visually observes the captured image displayed on the display unit 103 and evaluates whether the specific location is in a desired state by the production apparatus 10.

[0016] The management apparatus 20 has a management unit 211 and a calculation unit 212. The management unit 211 manages the illumination conditions of the imaging unit 101. The management unit 211 stores performance data including specific location information, which is information about the specific location included in the above captured image, and illumination condition information indicating the illumination conditions when the imaging unit 101 images the specific location to obtain the above captured image, in the storage unit 202 for each visual evaluation. The calculation unit 212 calculates the usage frequency of the illumination conditions for visual evaluation based on a plurality of performance data stored in the storage unit 202. The management unit 211 adjusts the illumination conditions based on the usage frequency calculated by the calculation unit 212.

[0017] In the implementation system 1 of Embodiment 1, the captured image obtained by imaging a specific location under lighting conditions adjusted based on the usage frequency calculated by the calculation unit 212 is highly likely to be an image that allows for more accurate visual evaluation by workers of the production equipment 10 (i.e., an image that makes it easier to accurately evaluate the state of the specific location). Therefore, the implementation system 1 of Embodiment 1 has the effect of enabling more accurate visual evaluation by utilizing the captured image obtained by imaging a specific location under lighting conditions adjusted based on the usage frequency calculated by the calculation unit 212. In other words, the implementation system 1 of Embodiment 1 has the advantage of being able to appropriately determine the state of a specific location.

[0018] (1.2) Detailed configuration (1.2.1) Implementation System The detailed configuration of the implementation system 1 of Embodiment 1 will be described below with reference to Figures 1 to 3.

[0019] The mounting system 1 comprises multiple devices that constitute the mounting line Y1. Here, the mounting line Y1 consists of one or more (one in the example in Figure 2) solder forming devices (printing devices) X2, one or more (three in the example in Figure 2) mounting devices X1, and one or more (one in the example in Figure 2) reflow ovens X4. These solder forming devices X2, three mounting devices X1, and reflow ovens X4 are connected to each other and, together with inspection devices (image inspection devices X31, X32, X33), constitute a single mounting line Y1. That is, in Embodiment 1, as an example, the mounting line Y1 consists of the solder forming device X2, three mounting devices X1, and reflow oven X4, in addition to one or more (three in the example in Figure 2) image inspection devices X31, X32, X33.

[0020] The mounting system 1, as shown in Figure 2, comprises a production device 10 (see Figure 1) which is one of three mounting devices X1 and image inspection devices X31, X32, and X33, and a management device 20 which manages the production device 10. The production device 10 of Embodiment 1 is one of the three mounting devices X1 which have a mounting section 104 (see Figure 1) that holds the component 30 and mounts the component 30 onto the substrate 40.

[0021] Multiple devices included in the mounting system 1 (solder forming device X2, three mounting devices X1, reflow oven X4, and three image inspection devices X31, X32, X33) are arranged in a line and connected to form the mounting line Y1. Specifically, the solder forming device X2, image inspection device X31, three mounting devices X1, image inspection device X32, reflow oven X4, and image inspection device X33 are arranged in this order from the upstream side of the mounting line Y1. In other words, in the mounting line Y1, the left end of Figure 2 (solder forming device X2) is upstream, and the right end of Figure 2 (image inspection device X33) is downstream.

[0022] Therefore, in the mounting system 1 according to Embodiment 1, the soldering apparatus X2 is at the front, followed by the image inspection apparatus X31, three mounting apparatuses X1, image inspection apparatus X32, reflow oven X4, and finally the image inspection apparatus X33, as the substrate 40 (see Figure 3) moves between multiple apparatuses in that order. In other words, the substrate 40 moves from the left end to the right end of Figure 2, passing through multiple apparatuses in sequence. The mounting system 1 mounts one or more (multiple in Embodiment 1) components 30 onto the substrate 40 while the substrate 40 passes through the three mounting apparatuses X1. Thus, the mounting system 1 introduces the substrate 40 from the soldering apparatus X2 side, mounts multiple components 30 (electronic components) onto the substrate 40, and then discharges the substrate assembly from the image inspection apparatus X33 side.

[0023] The solder forming apparatus X2 is a device that places (forms) a bonding member on the surface of the substrate 40. In Embodiment 1, as an example, the bonding member is a paste-type solder, so the solder forming apparatus X2 is a solder printing machine (paste solder printing machine) such as a screen printing machine. For this reason, in the drawing of Figure 2, the solder forming apparatus X2 is labeled "Printer". In the solder application process, the solder forming apparatus X2 places the bonding member on the substrate 40 by printing (applying) a bonding member of a desired shape (pattern) onto the surface of the substrate 40 using a mask such as a metal mask. The mask has holes formed in it according to the positions of the pads formed on the surface of the substrate 40, and the bonding member is attached to the surface of the substrate 40 by a squeegee through these holes.

[0024] A raw substrate 40 is introduced into the solder forming apparatus X2. In other words, a substrate 40 without any components or bonding members is introduced into the solder forming apparatus X2, and a substrate 40 with bonding members arranged (formed) is discharged from the solder forming apparatus X2.

[0025] The mounting device X1 is a device that mounts components 30 onto a substrate 40 during the mounting process. The substrate 40, with the bonding members formed by the soldering device X2, is introduced into the mounting device X1. In other words, the substrate 40 with the bonding members attached is introduced into the mounting device X1, and the substrate 40 with the components 30 placed (mounted) is discharged from the mounting device X1. In the state of the substrate 40 discharged from the mounting device X1, the bonding of the components 30 by the bonding members is incomplete. The mounting device X1, which is the production device 10 in the mounting system 1 of Embodiment 1, will be described in more detail in the "(1.2.2) Mounting Device" section below.

[0026] The reflow oven X4 is a device that joins components 30 to a substrate 40 using a bonding member. In Embodiment 1, as an example, the bonding member is a paste-type solder, so the reflow oven X4 performs soldering by heating the substrate 40 with the components 30 mounted on it during the soldering process, thereby melting the bonding member. In other words, the reflow oven X4 is a device that joins components 30 to a substrate 40 by heating and melting the bonding member placed on the surface of the substrate 40, and as an example, it is a far-infrared air reflow oven. For this reason, in the drawing in Figure 2, the reflow oven X4 is labeled "Reflow".

[0027] A substrate 40 is introduced into the reflow oven X4, in which bonding members have been formed by the soldering device X2 and components 30 have been placed (mounted) by the mounting device X1. In other words, a substrate 40 with components 30 and bonding members attached is introduced into the reflow oven X4, and a substrate 40 with components 30 bonded by bonding members, i.e., a substrate assembly, is discharged from the reflow oven X4.

[0028] The image inspection device X31 is positioned between the solder formation device X2 and the mounting device X1, that is, downstream of the solder formation device X2 and upstream of the mounting device X1. Therefore, the substrate 40 discharged from the solder formation device X2 is sent to the mounting device X1 via the image inspection device X31. The image inspection device X31 is an inspection device that inspects the state of the bonding members placed on the mounting surface 401 of the substrate 40 before the components 30 are mounted on the substrate 40. In other words, the image inspection device X31 inspects the substrate 40 after the bonding members have been formed and before the components 30 have been mounted, and inspects, for example, the amount of bonding members attached (amount of solder), or whether the bonding members are properly attached. In Embodiment 1, as an example, the image inspection device X31 is a solder paste inspection device (SPI) that inspects the state of the bonding members formed on the substrate 40 using two-dimensional or three-dimensional images. Therefore, in the diagram in Figure 2, the image inspection device X31 is labeled "SPI".

[0029] The image inspection device X32 is positioned between the mounting device X1 and the reflow oven X4, that is, downstream of the mounting device X1 and upstream of the reflow oven X4. Therefore, the substrate 40 discharged from the mounting device X1 is sent to the reflow oven X4 via the image inspection device X32. The image inspection device X32 is an inspection device that inspects the state of at least one of the bonding member and the component 30, which are placed on the mounting surface 401 of the substrate 40, after the component 30 has been mounted on the substrate 40. In other words, the image inspection device X32 inspects the substrate 40 after the component 30 has been mounted and the bonding of the component 30 by the bonding member is incomplete, and for example, it inspects whether the position of the component 30 on the substrate 40 is correct (whether the deviation is within an acceptable range). In Embodiment 1, as an example, the image inspection device X32 is a substrate inspection device that inspects the substrate 40 (including the bonding member) in a state where the component 30 has been mounted and the bonding of the component 30 by the bonding member is incomplete, using two-dimensional or three-dimensional images. The term "substrate inspection equipment" as used herein includes automated optical inspection equipment (AOI), also known as substrate visual inspection equipment, and automated X-ray inspection equipment (AXI), etc. In Embodiment 1, as an example, the image inspection equipment X32 is an automated optical inspection equipment (AOI). Therefore, in drawings such as Figure 2, the image inspection equipment X32 is labeled "AOI".

[0030] The image inspection device X33 is positioned downstream of the reflow oven X4. The image inspection device X33 is an inspection device that inspects the state of at least one of the bonding member and the component 30, which are placed on the mounting surface 401 of the substrate 40, after the component 30 has been mounted on the substrate 40. In other words, the image inspection device X33 inspects the substrate 40 after the component 30 has been mounted and the bonding of the component 30 by the bonding member has been completed, for example, whether the position of the component 30 on the substrate 40 is correct, or whether the bonding member is properly attached. In Embodiment 1, as an example, the image inspection device X33 is a substrate 40 inspection device that inspects the state of the substrate 40 (including the bonding member) in a state where the component 30 has been mounted and the bonding of the component 30 by the bonding member has been completed, using two-dimensional or three-dimensional images. In Embodiment 1, as an example, the image inspection device X33 is an automated optical inspection device (AOI). Therefore, in drawings such as Figure 2, the image inspection device X33 is labeled "AOI".

[0031] (1.2.2) Mounting device The mounting device X1, which is the production apparatus 10 of Embodiment 1, has, as shown in Figure 1, an imaging unit 101, a control unit 102, a display unit 103, a mounting unit 104, a detection unit 105, a moving unit 106, a transport unit 191, a plurality of component supply units (feeders) 192, a communication unit 193, and an operation unit 194. However, the moving unit 106 and the transport unit 191 are not essential components of the mounting device X1. In other words, all or part of the moving unit 106 and the transport unit 191 may not be included as components of the mounting device X1.

[0032] (Implementation Department) The mounting unit 104 has a capture unit 142 that captures components 30 from a component supply medium 14 (see Figure 3) that stores components 30, and mounts the components 30 captured by the capture unit 142 onto the substrate 40. In other words, the mounting unit 104 is a so-called mounting head. The mounting unit 104, under the control of the mounting control unit 121 (described later) of the control unit 102, captures multiple components 30 from multiple component supply units 192 and performs a turn operation, which is the operation of mounting the multiple captured components onto the substrate 40. The mounting unit 104 has at least one capture unit 142. In Embodiment 1, the mounting unit 104 has one capture unit 142. The mounting unit 104 moves (lowers) the capture unit 142 to approach the capture position, and causes the capture unit 142 to capture the component 30 located at the capture position. The capture position (suction position) is the region in the component supply unit 192 that supplies the components 30 where the component 30 is captured (suctioned). In the mounting device X1, the component supply unit 192 supplies the component 30 to the component supply port 1921, so the component supply port 1921 corresponds to the capture position.

[0033] Furthermore, the mounting unit 104, with the component 30 captured by the capture unit 142, moves (lowers) the capture unit 142 closer to the mounting position on the mounting surface 401 of the substrate 40, thereby mounting (attaching) the component 30 to the mounting position. The mounting position is the area on the mounting surface 401 of the substrate 40 where the component 30 is mounted. In the mounting device X1, the pads or lands provided on the mounting surface 401 of the substrate 40 correspond to the mounting position. In this way, the mounting unit 104 holds the capture unit 142 so that it can move toward the capture position (component supply port 1921) and the mounting position.

[0034] The capture unit 142 is, for example, a suction nozzle. The capture unit 142 is controlled by the mounting control unit 121 and can switch between a suction state in which it suctions (holds) the component 30 and a release state in which it releases (releases suction) the component 30. However, the capture unit 142 is not limited to a suction nozzle, and may be configured to capture (hold) the component 30 by grasping (pinching) the component 30, for example, a robot hand or a mechanical chuck. In other words, "capturing a component" as used in this disclosure includes both suctioning the component and grasping the component.

[0035] Regarding the capture of the component 30 by the capture unit 142, the mounting unit 104 operates by receiving pneumatic (vacuum) power. In other words, the mounting unit 104 switches between the suction state and the release state of the capture unit 142 by opening and closing a valve on the pneumatic (vacuum) supply path connected to the capture unit 142.

[0036] The mounting unit 104 further includes a head unit 141 that holds the capture unit 142, in addition to the capture unit 142. In Embodiment 1, one capture unit 142 is attached to one head unit 141. This allows the mounting unit 104 to capture (hold) one component 30.

[0037] The head unit 141 is, for example, made of metal and formed in the shape of a rectangular parallelepiped. The head unit 141 holds the capture unit 142 and the vertical drive unit 162 (see Figure 1) which will be described later, by being assembled to the head unit 141. In Embodiment 1, the capture unit 142 is indirectly held by the head unit 141 via the vertical drive unit 162, in a state in which it can move in the Z-axis direction and the θ direction which will be described later. The mounting unit 104 also moves in the XY plane as the head unit 141 is moved in the XY plane by the horizontal drive unit 161 (see Figure 1) which will be described later. The "XY plane" here is a plane that includes the X axis and the Y axis and is perpendicular to the Z axis.

[0038] According to the above configuration, the mounting unit 104 can move (lower) the capture unit 142 to approach the capture position (component supply port 1921), and capture the component 30 located at the capture position with the capture unit 142. Furthermore, with the component 30 captured (attached) by the capture unit 142, the mounting unit 104 can move (lower) the capture unit 142 to approach the mounting position on the mounting surface 401 of the substrate 40, and mount (attach) the component 30 to the mounting position.

[0039] (Detection unit) The detection unit 105 detects a mounting error in which the capture unit 142 of the mounting unit 104 has failed to mount the component 30 to a predetermined mounting position on the mounting surface 401 of the substrate 40. In this disclosure, the "planned mounting position" refers to a position on the mounting surface 401 of the substrate 40 that is pre-set so that the component 30 is mounted by the capture unit 142 of the mounting unit 104. The detection unit 105 of Embodiment 1 detects the above mounting error based on the flow rate (i.e., suction amount) of air supplied to the capture unit 142. The flow rate of the capture unit 142 decreases when a component is captured and increases when a component is not captured. Therefore, it has been empirically found that if the capture unit 142 has switched from a suction state to a release state, but the mounting unit 104 has failed to mount the component 30 to the planned mounting position and has moved from the mounting position to the capture position while still capturing the component 30 (i.e., the mounting unit 104 has taken the component back), the flow rate of the capture unit 142 does not change or does not exceed a predetermined value. Therefore, the detection unit 105 of Embodiment 1 detects the above-mentioned implementation error when the flow rate of the capture unit 142 is less than a predetermined value after the capture unit 142 has been switched from the adsorption state to the release state.

[0040] (Imaging Department) When the detection unit 105 detects the above-mentioned mounting error, the imaging unit 101 captures an image of the planned mounting location as a specific point. The imaging unit 101 captures an image of the planned mounting location as a specific point under one of several different lighting conditions, controlled by the imaging control unit 122, which will be described later, of the control unit 102. When the detection unit 105 correctly detects the mounting error, the image obtained by the imaging unit 101 capturing the specific point includes the planned mounting location on the mounting surface 401 of the substrate 40 where the component 30 is not mounted. On the other hand, when the detection unit 105 incorrectly detects the mounting error, the image obtained by the imaging unit 101 capturing the specific point includes both the planned mounting location on the mounting surface 401 of the substrate 40 where the component 30 is mounted, and the component 30 itself. For example, the imaging unit 101 is fixed to the head unit 141 of the mounting unit 104.

[0041] As shown in Figure 1, the imaging unit 101 includes an image sensor 111 and an illumination unit 112. The image sensor 111 is, for example, an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor). The image sensor 111 converts the image formed on the light-receiving surface into an electrical signal and outputs it.

[0042] The illumination unit 112 illuminates a specific location to be imaged (i.e., the planned mounting location). The illumination unit 112 changes the illumination conditions for illuminating the specific location to be imaged by the imaging unit 101, under the control of the imaging control unit 122. That is, the illumination unit 112 changes the illumination conditions each time the imaging unit 101 images the planned mounting location, so that the imaging unit 101 can image the planned mounting location as a specific location under one of several different illumination conditions. In Embodiment 1, the illumination unit 112 changes the brightness that illuminates the specific location to be imaged as an illumination condition. The illumination unit 112 is implemented using an appropriate illumination method, such as a diffuse type or oblique light type.

[0043] The imaging unit 101 images a specific location under one of several lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency (details will be described later). In Embodiment 1, the imaging unit 101 images a specific location under one of several lighting conditions, including candidate lighting conditions which are candidate brightness levels determined by the management unit 211 and will be described later.

[0044] (Display) The display unit 103 is, for example, a liquid crystal display, an organic EL (Electro-Luminescence) display, etc. The operation unit 194 has the function of receiving operations from an operator of the production device 10. In Embodiment 1, the mounting device X1 is equipped with a touch panel display, and the touch panel display functions as both the display unit 103 and the operation unit 194. However, the operation unit 194 is not limited to a touch panel display, but may be, for example, a keyboard, a pointing device, or a mechanical switch, etc. In this embodiment, the production device 10 is equipped with a display unit 103, but the display unit 103 only needs to be able to display the captured image obtained by the imaging unit 101, and it is not essential that the production device 10 is equipped with a display unit 103.

[0045] The display unit 103 displays multiple captured images obtained by the imaging unit 101 capturing images of a specific location under multiple different lighting conditions, under the control of the display control unit 123. One of the captured images displayed on the display unit 103 is used for visual evaluation. Since the production device 10 is a mounting device X1, in the visual evaluation, an operator of the production device 10 visually inspects the captured images displayed on the display unit 103 and evaluates whether the component 30 has been mounted in the intended mounting position by the mounting device X1. If the visual evaluation determines that the component 30 has not been mounted in the intended mounting position, the transport unit 191 discharges the substrate 40 in which the component 30 was evaluated as not being mounted in the intended mounting position from the mounting device X1.

[0046] Operators of the production equipment 10 use the image that allows for the most accurate visual evaluation (i.e., the image that allows for the most accurate evaluation of the condition of a specific location) from among the multiple captured images displayed on the display unit 103 as the "used image" to perform a visual evaluation. In other words, the used image is the image obtained when the imaging unit 101 captures a specific location under lighting conditions that allow for the most accurate visual evaluation by the operators of the production equipment 10, from among the multiple captured images displayed on the display unit 103.

[0047] The control unit 194 receives instructions from the operator of the production device 10, etc., for each visual evaluation, indicating which of the multiple captured images was used as the image used above.

[0048] (Control Unit) The control unit 102 can be implemented, for example, by a computer system having one or more processors and one or more memories. That is, the control unit 102 functions by one or more processors executing a program recorded in one or more memories of the computer system. In this case, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunication line such as the Internet, or it may be provided recorded on a non-temporary recording medium such as a memory card.

[0049] As shown in Figure 1, the control unit 102 includes an implementation control unit 121, an imaging control unit 122, and a display control unit 123. The imaging control unit 122 corresponds to the control unit of this disclosure.

[0050] The mounting control unit 121 controls each part of the mounting device X1. The mounting control unit 121 is electrically connected to each of the following: for example, the mounting unit 104, the moving unit 106, the transport unit 191, and the multiple component supply units 192. The mounting control unit 121 outputs a control signal to the moving unit 106 and controls the drive of the moving unit 106 so that the component 30 captured by the capture unit 142 is mounted on the mounting surface 401 of the substrate 40.

[0051] Furthermore, the mounting control unit 121 outputs a control signal to the transport unit 191 and controls the transport unit 191 so that the substrate 40 is positioned in the mounting space. The mounting control unit 121 also outputs control signals to a plurality of component supply units 192 and controls the plurality of component supply units 192 so that the component 30 is positioned in each component supply port 1921.

[0052] The imaging control unit 122 controls the imaging unit 101. The imaging control unit 122 is electrically connected to the imaging unit 101, for example. The imaging control unit 122 outputs control signals to the imaging unit 101 to control the imaging unit 101, and acquires images obtained by the imaging unit 101 from the imaging unit 101. The imaging control unit 122 controls the illumination unit 112, which changes the illumination conditions each time the imaging unit 101 images the planned mounting location. The imaging control unit 122 acquires the illumination conditions each time the imaging unit 101 images the planned mounting location from the illumination unit 112.

[0053] The imaging control unit 122 controls the imaging unit 101 to image a specific location under one of several different lighting conditions. More specifically, the imaging control unit 122 controls the imaging unit 101 to image a specific location under one of several lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency (details to be described later). In other words, the imaging control unit 122 controls the imaging unit 101 to image a specific location under one of several lighting conditions, including candidate lighting conditions determined by the management unit 211 (details to be described later).

[0054] The imaging control unit 122 of Embodiment 1 controls the imaging unit 101 to image a specific location under a plurality of lighting conditions, including a candidate lighting condition which is a candidate brightness determined by the management unit 211 and described later. More specifically, the imaging control unit 122 of Embodiment 1 controls the imaging unit 101 to image a specific location under three lighting conditions: a candidate lighting condition which is a candidate brightness determined by the management unit 211 and described later; a lighting condition with a brightness lower by a predetermined value than the candidate brightness; and a lighting condition with a brightness higher by a predetermined value than the candidate brightness. The control contents of the imaging control unit 122 will be explained below with specific examples. Assume that the management unit 211 has determined a lighting condition with a brightness of 100 as a candidate lighting condition. In the above case, the imaging control unit 122 controls the imaging unit 101 to image a specific location under three lighting conditions, for example, a first lighting condition with a brightness of 80; a second lighting condition with a brightness of 100; and a third lighting condition with a brightness of 120.

[0055] The display control unit 123 controls the display unit 103. The display control unit 123 is electrically connected to the display unit 103, for example. The display control unit 123 causes the image captured by the imaging unit 101 and acquired by the imaging control unit 122 to be displayed on the display unit 103.

[0056] The display control unit 123 displays the captured image obtained by the imaging unit 101 capturing a specific location under multiple lighting conditions, including candidate lighting conditions determined by the management unit 211 (described later), on the display unit 103. In other words, the display unit 103 displays the captured image obtained by the imaging unit 101 capturing a specific location under multiple lighting conditions, including candidate lighting conditions determined by the management unit 211.

[0057] In Embodiment 1, the display control unit 123 controls the operation unit 194 in addition to the display unit 103. The display control unit 123 is electrically connected to the operation unit 194, for example. The display control unit 123 acquires information regarding operations received by the operation unit 194.

[0058] (Moving part) The moving unit 106 positions (aligns) the capture unit 142 of the mounting unit 104 to the capture position of the component 30 and the mounting position of the component 30 on the substrate 40. In other words, the moving unit 106 is a device for moving the mounting unit 104, which includes the capture unit 142 and the imaging unit 101. The moving unit 106 moves the head unit 141 horizontally in the XY plane and moves the capture unit 142 vertically along the Z axis. In other words, the moving unit 106 moves the head unit 141 in the X-axis direction and the Y-axis direction. In Embodiment 1, since the capture unit 142 and the imaging unit 101 are fixed to the head unit 141, the moving unit 106 also moves the capture unit 142 and the imaging unit 101 together with the head unit 141 in the X-axis direction and the Y-axis direction. In Figure 1, the mounting unit 104 moves by the moving unit 106 between above the component supply port 1921 of the component supply unit 192 (see Figure 3) and above the substrate 40 positioned in the mounting space of the transport unit 191.

[0059] Specifically, as shown in Figure 1, the moving unit 106 includes a horizontal drive unit 161 and a vertical drive unit 162.

[0060] The horizontal drive unit 161 includes an X-axis drive unit 163 and a Y-axis drive unit 164. The X-axis drive unit 163 moves the mounting unit 104 linearly in the X-axis direction. The Y-axis drive unit 164 moves the mounting unit 104 linearly in the Y-axis direction. The Y-axis drive unit 164 moves the mounting unit 104 along the Y-axis, together with the X-axis drive unit 163, thereby moving the mounting unit 104 linearly in the Y-axis direction. The X-axis drive unit 163 includes an X-axis motor (not shown) and drives the X-axis motor. The Y-axis drive unit 164 includes a Y-axis motor (not shown) and drives the Y-axis motor. Each of the X-axis motor and the Y-axis motor is, for example, a linear motor. Therefore, in Embodiment 1, the X-axis drive unit 163 moves the mounting unit 104 linearly in the X-axis direction by the driving force generated by the X-axis motor in response to the power supply. Furthermore, the Y-axis drive unit 164 moves the mounting unit 104 in a straight line in the Y-axis direction using the driving force generated by the Y-axis motor after receiving power.

[0061] The vertical drive unit 162 moves the capture unit 142 linearly in the Z-axis direction. Furthermore, the vertical drive unit 162 rotates the capture unit 142 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In other words, the vertical drive unit 162 is an actuator that moves the capture unit 142 linearly in the Z-axis direction and rotates the capture unit 142 in the θ direction. In Embodiment 1, as an example, the vertical drive unit 162 is driven by a driving force generated by a linear motor for the movement of the capture unit 142 in the Z-axis direction. Also, the vertical drive unit 162 is driven by a driving force generated by a rotary motor for the movement of the capture unit 142 in the θ direction. As described above, the head unit 141 of the mounting unit 104 moves linearly in the X-axis direction and the Y-axis direction by the horizontal drive unit 161. As a result, the capture unit 142 attached to the head unit 141 is movable in the X-axis direction, Y-axis direction, Z-axis direction, and θ direction by the horizontal drive unit 161 and the vertical drive unit 162.

[0062] (Transportation section) The transport unit 191 is a device for transporting the substrate 40. The transport unit 191 has a pair of conveyor mechanisms 1911, for example, as shown in Figure 3. The transport unit 191 transports the substrate 40 in the X-axis direction (the direction perpendicular to the plane of the paper in Figure 3) by the pair of conveyor mechanisms 1911. The transport unit 191 transports the substrate 40 to the mounting space at least below the mounting unit 104, that is, to the mounting space facing the capture unit 142 in the Z-axis direction. The transport unit 191 then stops the substrate 40 in the mounting space until the mounting of components 30 onto the substrate 40 by the mounting unit 104 is completed.

[0063] (Parts Supply Department) Each of the multiple component supply units 192 is a component supply unit that supplies multiple components 30 to the mounting unit 104. In Embodiment 1, each of the multiple component supply units 192 supplies multiple components 30 to the mounting unit 104 using a component supply medium 14 (see Figure 3) which has multiple recesses (not shown) that accommodate each of the multiple components 30. The recesses are provided on the supply surface of the component supply medium 14. The component supply medium 14 is, for example, a carrier tape. In short, each component supply unit 192 has a tape feeder that supplies the components 30 that are contained in the recesses of the component supply medium 14, which is, for example, a carrier tape. Each component supply unit 192 moves the components 30 to the component supply port 1921 by feeding the component supply medium 14 in the Y-axis direction using the tape feeder.

[0064] The component supply medium 14 may also be a tray. That is, each component supply unit 192 may have a tray feeder that supplies components 30 housed in recesses of a tray, either instead of a tape feeder or together with a tape feeder. Alternatively, each component supply unit 192 may have a bulk feeder, either instead of a tape feeder or together with a tape feeder. In the above case, the leading edge of the bulk feeder that supplies components 30 is provided with recesses for housing the components 30.

[0065] (Communications Department) The communication unit 193 has a communication interface for communicating with the management device 20. Communication between the communication unit 193 and the management device 20 (more specifically, the communication unit 203 described later) may be via wired communication or wireless communication.

[0066] The communication unit 193 transmits to the management device 20 the illumination conditions acquired by the imaging control unit 122 each time the imaging unit 101 images the planned installation location. Furthermore, the communication unit 193 transmits to the management device 20 information regarding the operation received by the operation unit 194, which has been acquired by the display control unit 123.

[0067] (1.2.3) Management device As shown in Figure 1, the management device 20 includes a control unit 201, a storage unit 202, and a communication unit 203.

[0068] (Control Unit) The control unit 201 can be implemented, for example, by a computer system having one or more processors and one or more memories. That is, the control unit 201 functions by one or more processors executing a program recorded in one or more memories of the computer system. In this case, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunication line such as the Internet, or it may be provided recorded on a non-temporary recording medium such as a memory card.

[0069] As shown in Figure 1, the control unit 201 includes a management unit 211 and a calculation unit 212.

[0070] The management unit 211 stores performance data, including specific location information and lighting condition information, in the storage unit 202 for each visual evaluation. In other words, the storage unit 202 stores performance data corresponding to each of multiple visual evaluations. The storage unit 202 is composed of a device selected from ROM, RAM, or EEPROM, etc.

[0071] The specific location information is information about a specific location included in the image used for visual evaluation from among the multiple captured images displayed on the display unit 103. In Embodiment 1, the specific location information is information about the planned mounting position of the component 30 included in the image used for visual evaluation from among the multiple captured images displayed on the display unit 103. The planned mounting position where the mounting unit 104 of the mounting device X1, which is the production device 10, will mount the component 30 is set in advance according to the mounting device X1, so the specific location information is also set in advance according to the mounting device X1.

[0072] Furthermore, the lighting condition information is information indicating the lighting conditions when the imaging unit 101 imaged a specific location and obtained the above-mentioned usable image. Based on the operation information received by the operation unit 194, the management unit 211 acquires which of the multiple captured images was used as the above-mentioned usable image, and acquires the lighting conditions when the imaging unit 101 imaged a specific location and obtained the usable image from the imaging control unit 122. That is, each of the multiple actual data sets includes, as lighting conditions included in the lighting condition information, the lighting conditions corresponding to the usable image used for visual evaluation among the multiple captured images. Here, "multiple actual data sets" refers to the actual data corresponding to each of the multiple visual evaluations.

[0073] For example, the management unit 211 may store in the storage unit 202, for each visual evaluation, actual data that includes, in addition to specific location information and lighting condition information, date and time information regarding the date and time the visual evaluation was performed, visual evaluation result information regarding the judgment result of the visual evaluation, and unused condition information indicating the lighting conditions when the imaging unit 101 captured images that were not used for the visual evaluation from among the multiple captured images displayed on the display unit 103.

[0074] The calculation unit 212 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. The calculation unit 212 of Embodiment 1 calculates the frequency of use of the luminance that illuminates the specific location to be imaged, which is the lighting condition when the imaging unit 101 images each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. As a specific example, the calculation unit 212 of Embodiment 1 uses an aggregation table that divides the luminance range that can be adopted as the above luminance into multiple predetermined ranges, and aggregates and calculates the frequency of use of the above luminance for visual evaluation for each of the multiple predetermined ranges.

[0075] The management unit 211 adjusts (manages) the lighting conditions based on the usage frequency calculated by the calculation unit 212. More specifically, the management unit 211 adjusts the lighting conditions by determining the lighting condition with the highest usage frequency calculated by the calculation unit 212 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202 as a candidate lighting condition. In Embodiment 1, the management unit 211 determines the luminance that falls within a predetermined range with the highest usage frequency calculated by the calculation unit 212 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202 as a candidate luminance, which is a candidate lighting condition.

[0076] (Communications Department) The communication unit 203 has a communication interface for communicating with the mounting device X1, which is the production device 10. The communication between the communication unit 203 and the mounting device X1 (more specifically, the communication unit 193) may be via wired communication or wireless communication.

[0077] The communications unit 203 transmits information regarding the candidate lighting conditions determined by the management unit 211 to the mounting device X1.

[0078] (1.3) Control method of the implemented system Here, the control method for the mounting system 1 will be explained with reference to Figure 4. In the following explanation, we assume the control method for the mounting system 1 when the mounting device X1, which is the production device 10, performs the operation of mounting components 30 onto one substrate 40 (hereinafter also referred to as the current mounting operation). After the current mounting operation is completed, the mounting device X1 starts the operation of mounting components 30 onto the next substrate 40 (the next mounting operation). The flowchart shown in Figure 4 is merely one example of the control method described above according to this disclosure, and the order of processing may be changed as appropriate, or processing may be added or omitted as appropriate.

[0079] The control method for the implemented system 1, as shown in Figure 4, includes an implementation step S101, a detection step S102, an adjustment step S103, an imaging step S104, a display step S105, an ejection step S107, a storage step S108, and a calculation step S109. Note that the adjustment step S103, the storage step S108, and the calculation step S109 are management steps for managing the lighting conditions. In other words, the management steps for managing the lighting conditions include the adjustment step S103, the storage step S108, and the calculation step S109.

[0080] In the mounting step S101, the mounting unit 104 mounts the component 30, which has been captured by the capture unit 142, onto the substrate 40. Then, in the detection step S102, the detection unit 105 detects a mounting error in which the capture unit 142 of the mounting unit 104 has not mounted the component 30 to a predetermined mounting position on the mounting surface 401 of the substrate 40. If the detection unit 105 does not detect a mounting error (S102: No), the current mounting operation is terminated and the next mounting operation is started. In short, if the detection unit 105 does not detect a mounting error (S102: No), the control method of the mounting system 1 for when the mounting device X1 performs the current mounting operation is terminated, and the control method of the mounting system 1 for when the mounting device X1 performs the next mounting operation is started.

[0081] If the detection unit 105 detects an implementation error (S102: Yes), the management unit 211 performs an adjustment step S103 to adjust the lighting conditions based on the usage frequency calculated by the calculation unit 212 in the calculation step S109 when a previous implementation operation was performed. Here, "previous implementation operation" refers to an implementation operation performed by the implementation device X1 prior to the current implementation operation. More specifically, in the adjustment step S103, the management unit 211 adjusts the lighting conditions by determining the lighting condition with the highest usage frequency calculated by the calculation unit 212 in the calculation step S109 when a previous implementation operation was performed as a candidate lighting condition, from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202. In the adjustment step S103 of Embodiment 1, the management unit 211 determines the luminance included in the predetermined range with the highest usage frequency calculated by the calculation unit 212, from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202, as a candidate luminance, which is a candidate lighting condition.

[0082] In the imaging step S104, the imaging unit 101 images a specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency in the adjustment step S103. In the imaging step S104 of Embodiment 1, the imaging unit 101 images a specific location under multiple lighting conditions, including candidate lighting conditions which are candidate brightness levels determined by the management unit 211 in the adjustment step S103, as described later. In the display step S105, the display unit 103 displays multiple images obtained by the imaging unit 101 imaging a specific location under multiple different lighting conditions in the imaging step S104.

[0083] Then, in the display step S105, the image used, which is one of the multiple captured images displayed on the display unit 103, is used for visual evaluation by the operator of the production device 10 (visual evaluation step S106). If the visual evaluation determines that the component 30 has been mounted in the planned mounting position (S106: Yes), the management unit 211 performs a storage step S108 to store the actual data, including specific location information and lighting condition information, in the storage unit 202. On the other hand, if the visual evaluation determines that the component 30 has not been mounted in the planned mounting position (S106: No), the transport unit 191 performs a discharge step S107 to discharge the substrate 40, which was evaluated as not having the component 30 mounted in the planned mounting position, from the mounting device X1. After that, the management unit 211 performs a storage step S108 to store the actual data, including specific location information and lighting condition information, in the storage unit 202. In other words, in the memory step S108 of the control method of the implemented system 1, the management unit 211 causes the memory unit 202 to store performance data, including specific location information and lighting condition information, for each visual evaluation.

[0084] Subsequently, in calculation step S109, the calculation unit 212 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. In calculation step S109 of Embodiment 1, the calculation unit 212 calculates the frequency of use of the luminance used to illuminate the specific location to be imaged, which is the lighting condition when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. As a specific example, in calculation step S109 of Embodiment 1, the calculation unit 212 uses an aggregation table that divides the luminance range that can be adopted as the above luminance into multiple predetermined ranges, and aggregates and calculates the frequency of use of the above luminance for visual evaluation for each of the multiple predetermined ranges.

[0085] (1.4) Effects The mounting system 1 according to Embodiment 1 comprises a production device 10 and a management device 20. The production device 10 has an imaging unit 101 and an imaging control unit 122. The imaging unit 101 images a specific location on the mounting surface 401 of the substrate 40. The imaging control unit 122 controls the imaging unit 101 to image the specific location under lighting conditions. The image obtained by the imaging unit 101 imaging the specific location is displayed on the display unit 103. The image displayed on the display unit 103 is used for visual evaluation to assess the state of the specific location. The management device 20 has a management unit 211 and a calculation unit 212. The management unit 211 manages the lighting conditions of the imaging unit 101. The management unit 211 stores performance data, including specific location information which is information about the specific location included in the above-mentioned image, and lighting condition information which indicates the lighting conditions when the imaging unit 101 imaged the specific location and obtained the above-mentioned image, in the storage unit 202 for each visual evaluation. The calculation unit 212 calculates the frequency of use of lighting conditions for visual evaluation based on multiple actual data stored in the storage unit 202. The management unit 211 adjusts the lighting conditions based on the frequency of use calculated by the calculation unit 212. As a result, the implementation system 1 of Embodiment 1 has the effect of enabling more accurate visual evaluation by using captured images obtained by imaging a specific location under lighting conditions adjusted based on the frequency of use calculated by the calculation unit 212. In other words, the implementation system 1 of Embodiment 1 has the advantage of being able to appropriately determine the state of a specific location.

[0086] In the implementation system 1 according to Embodiment 1, the imaging control unit 122 controls the imaging unit 101 to image a specific location under one of several different lighting conditions. The display unit 103 displays multiple imaged images obtained by the imaging unit 101 imaging a specific location under multiple different lighting conditions, under the control of the display control unit 123. Each of the multiple performance data includes the lighting conditions corresponding to the imaged image used for visual evaluation among the multiple imaged images, as part of the lighting condition information. As a result, the operator of the production equipment 10 uses the image that allows for more accurate visual evaluation (i.e., the image that makes it easier to more accurately evaluate the state of the specific location) from among the multiple imaged images displayed on the display unit 103 as the image used for visual evaluation. Therefore, the management unit 211 can adjust the lighting conditions to conditions that make it easier for the operator of the production equipment 10 to more accurately evaluate the state of the specific location. In other words, there is an advantage in that the state of the specific location can be judged more appropriately.

[0087] In the implementation system 1 according to Embodiment 1, the management unit 211 determines the lighting condition with the highest usage frequency, calculated by the calculation unit 212, from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202, as a candidate lighting condition. The display unit 103 displays the captured image obtained by the imaging unit 101 when it captures a specific location under the candidate lighting condition determined by the management unit 211. This has the advantage of making it easier for the management unit 211 to adjust the lighting conditions.

[0088] In the mounting system 1 according to Embodiment 1, the production apparatus 10 is a mounting apparatus X1 having a mounting unit 104 that holds a component 30 and mounts the component 30 onto a substrate 40. The mounting apparatus X1 has a detection unit 105 that detects mounting errors where the capture unit 142 of the mounting unit 104 has failed to mount the component 30 to a predetermined mounting position on the mounting surface 401 of the substrate 40. When the detection unit 105 detects the above mounting error, the imaging unit 101 images the mounting position as a specific location. This has the advantage that the mounting apparatus X1 can appropriately determine the state of the specific location when mounting the component 30 onto the substrate 40.

[0089] (1.5) Variant Embodiment 1 described above is merely one of many embodiments of this disclosure. Embodiment 1 can be modified in various ways depending on the design, etc., as long as the objectives of this disclosure are achieved. The following modifications may be implemented by combining them as appropriate. Components similar to those in Embodiment 1 described above are denoted by the same reference numerals and their description is omitted.

[0090] (1.5.1) First variation In the mounting system 1 of the above-described embodiment 1, when the detection unit 105 detects a mounting error, the display unit 103 displays multiple captured images obtained by the imaging unit 101 capturing a specific location under multiple different lighting conditions, and the workers of the production equipment 10 use one of the captured images displayed on the display unit 103 as the usable image to perform a visual evaluation. In contrast, in the mounting system 1a of the first modified example shown in Figure 5, when the detection unit 105 detects a mounting error, before the workers of the production equipment 10 perform a visual evaluation, the evaluation unit 213 uses an evaluation learning model to evaluate the state of the specific location based on the captured image obtained by the imaging unit 101 capturing that location. The mounting system 1a of the first modified example differs from the mounting system 1 in the above respect.

[0091] (Configuration of the implementation system of the first modified example) The first modified implementation system 1a, as shown in Figure 5, comprises a production device 10 which is one of three implementation devices X1, and a management device 20a which manages the production device 10. The management device 20a has a control unit 201a, a storage unit 202, and a communication unit 203.

[0092] The control unit 201a can be implemented, for example, by a computer system having one or more processors and one or more memories. That is, the control unit 201a functions by one or more processors executing a program recorded in one or more memories of the computer system. In this case, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunication line such as the Internet, or it may be provided recorded on a non-temporary recording medium such as a memory card.

[0093] As shown in Figure 5, the control unit 201a includes a management unit 211, a calculation unit 212, an evaluation unit 213, and an evaluation learning unit 214.

[0094] The evaluation unit 213 uses the evaluation learning model created by the evaluation learning unit 214 to evaluate the state of a specific location based on the image captured by the imaging unit 101 under lighting conditions different from the candidate lighting conditions determined by the management unit 211. Here, "evaluating the state of a specific location" means evaluating whether the state of the specific location is good or bad, that is, evaluating whether the state of the specific location is in the desired state. More specifically, the evaluation unit 213 uses the evaluation learning model created by the evaluation learning unit 214 to evaluate whether the component 30 has been mounted in the planned mounting position by the mounting device X1 based on the image captured by the imaging unit 101 under the different lighting conditions mentioned above.

[0095] The evaluation learning model is created to receive an image captured by the imaging unit 101 under lighting conditions different from the candidate lighting conditions determined by the management unit 211, and to output information indicating the state of the specific location included in the image. More specifically, the evaluation learning model is created to receive an image captured by the imaging unit 101 under the different lighting conditions mentioned above, and to output information indicating whether or not the component 30 has been mounted in the planned mounting position by the mounting device X1.

[0096] In the first modified example, if the evaluation unit 213 evaluates that the state of a specific location is not in the desired state, that is, if the evaluation unit 213 evaluates that the component 30 has not been mounted in the planned mounting position by the mounting device X1, the imaging unit 101 images the specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency. More specifically, in the above case, the imaging unit 101 of the first modified example images the specific location under multiple lighting conditions, including candidate lighting conditions, which are candidate brightness levels determined by the management unit 211 and described later. On the other hand, if the evaluation unit 213 evaluates that the state of a specific location is in the desired state, that is, if the evaluation unit 213 evaluates that the component 30 has been mounted in the planned mounting position by the mounting device X1, the imaging unit 101 of the first modified example does not image the specific location.

[0097] In short, the display unit 103 of the first modified example displays multiple captured images obtained by the imaging unit 101 under multiple different lighting conditions when the evaluation unit 213 evaluates that the state of a specific location is not in the desired state, that is, when the evaluation unit 213 evaluates that the component 30 has not been mounted in the planned mounting position by the mounting device X1. The operator of the production device 10 uses one of the multiple captured images displayed on the display unit 103 as the usable image to perform a visual evaluation.

[0098] On the other hand, in the first modified example, the display unit 103 does not display the captured image if the evaluation unit 213 evaluates that the state of a specific location is in the desired state, that is, if the evaluation unit 213 evaluates that the component 30 has been mounted in the planned mounting position by the mounting device X1. In other words, the operators of the production device 10 do not perform visual evaluation.

[0099] The evaluation learning unit 214 learns an evaluation learning model (i.e., creates an evaluation learning model) using the following as input information: the lighting conditions when the imaging unit 101 images a specific area and obtains the image used by the evaluation unit 213 (i.e., lighting conditions different from the candidate lighting conditions determined by the management unit 211), the evaluation results from the evaluation unit 213, and (if a visual evaluation was performed, the evaluation results of the visual evaluation as well).

[0100] The above configuration has the advantage of reducing the number of times that workers on the production device 10 perform visual evaluations. In other words, it reduces the workload on the workers.

[0101] (Control method for the implementation system of the first modified example) Next, the control method for the first modified mounting system 1a will be described with reference to Figure 6. In the following description, we assume a control method for the mounting system 1 when the mounting device X1, which is the production device 10, performs an operation to mount components 30 onto one substrate 40 (hereinafter also referred to as the current mounting operation). After the current mounting operation is completed, the mounting device X1 starts an operation to mount components 30 onto the next substrate 40 (the next mounting operation). The flowchart shown in Figure 6 is merely one example of the control method described above according to this disclosure, and the order of processing may be changed as appropriate, or processing may be added or omitted as appropriate.

[0102] The control method for the implementation system 1a of the first modified example includes an implementation step S201, a detection step S202, a first imaging step S203, an evaluation step S204, an adjustment step S205, a second imaging step S206, a display step S207, an ejection step S209, a storage step S210, a calculation step S211, a storage step S212, and a learning step S213. The second imaging step S206 corresponds to the imaging step in this disclosure.

[0103] In the first modified example, the implementation step S201, detection step S202, adjustment step S205, second imaging step S206, display step S207, ejection step S209, storage step S210, and calculation step S211 are the same as the implementation step S101, detection step S102, adjustment step S103, imaging step S104, display step S105, ejection step S107, storage step S108, and calculation step S109 in Embodiment 1, respectively, so their explanations are omitted.

[0104] If the detection unit 105 detects an installation error (S202: Yes), the imaging unit 101 performs a first imaging step S203 in which it takes an image under lighting conditions different from the candidate lighting conditions determined by the management unit 211. Then, in the evaluation step S204, the evaluation unit 213 uses the evaluation learning model created by the evaluation learning unit 214 in the learning step S213 when a previous installation operation was performed to evaluate the state of the specific location based on the image obtained when the imaging unit 101 took an image of the specific location in the first imaging step S203. More specifically, in the evaluation step S204, the evaluation unit 213 uses the evaluation learning model created by the evaluation learning unit 214 in the learning step S213 when a previous installation operation was performed to evaluate whether the component 30 has been installed in the planned installation position by the installation device X1, based on the image obtained when the imaging unit 101 took an image of the specific location in the first imaging step S203.

[0105] If the evaluation unit 213 evaluates that the state of a specific location is in the desired state, that is, if the evaluation unit 213 evaluates that the component 30 has been mounted in the planned mounting position by the mounting device X1 (S204: Yes), the evaluation unit 213 performs the save step S212. On the other hand, if the evaluation unit 213 evaluates that the state of a specific location is not in the desired state (S204: No), that is, if the evaluation unit 213 evaluates that the component 30 has not been mounted in the planned mounting position by the mounting device X1, the adjustment step S205, the second imaging step S206, the display step S207, the ejection step S209, the storage step S210, and the calculation step S211 are performed. After the calculation unit 212 performs the calculation step S211, the evaluation unit 213 performs the save step S212.

[0106] In the saving step S212, the evaluation unit 213 stores in the storage unit 202 the captured image obtained by the imaging unit 101 when it imaged a specific area in the first imaging step S203, and the evaluation result of the evaluation unit 213 in the evaluation step S204. Subsequently, in the learning step S213, the evaluation learning unit 214 learns an evaluation learning model (i.e., creates an evaluation learning model) using the illumination conditions when the imaging unit 101 imaged a specific area and obtained the captured image used in the evaluation step S204, the evaluation result of the evaluation unit 213 in the evaluation step S204, and (if a visual evaluation was performed, further, the evaluation result of the visual evaluation in the visual evaluation step S208) as input information. In other words, in the learning step S213, the evaluation learning unit 214 learns an evaluation learning model (i.e., creates an evaluation learning model) using the illumination conditions in the first imaging step S203, the evaluation results of the evaluation unit 213 in the evaluation step S204, and (if a visual evaluation was performed, further, the evaluation results of the visual evaluation in the visual evaluation step S208) as input information.

[0107] (Other configurations of the implementation system of the first modified example) The evaluation unit 213 may determine whether the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value. In this case, the imaging unit 101 of the first modified example will image the specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency, when the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value. That is, if the evaluation unit 213 evaluates that the state of the specific location is not in the desired state, the imaging unit 101 of the first modified example will image the specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency, when the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value.

[0108] In short, the display unit 103 of the first modified example displays multiple captured images obtained by the imaging unit 101 capturing a specific location under multiple different lighting conditions when the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value. That is, when the evaluation unit 213 evaluates that the state of the specific location is not in the desired state, and the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value, the display unit 103 of the first modified example displays multiple captured images obtained by the imaging unit 101 capturing the specific location under multiple different lighting conditions. This configuration has the advantage of being able to accurately evaluate the state of the specific location.

[0109] More specifically, in the first modified example, the evaluation unit 213 may calculate the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection for each visual inspection and store it in the storage unit 202. In this case, the imaging unit 101 of the first modified example will image a specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency, when the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is less than a threshold. That is, in the imaging unit 101 of the first modified example, if the evaluation unit 213 evaluates that the state of a specific location is not in the desired state, and the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is less than a threshold, the imaging unit 101 will image the specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency. The threshold referred to here is, for example, set in advance within the range of 80% to 95%, and it is desirable to set it to 95%.

[0110] In short, the display unit 103 of the first modified example displays multiple captured images obtained by the imaging unit 101 capturing a specific location under multiple different lighting conditions when the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is smaller than a threshold. That is, if the evaluation unit 213 evaluates that the state of the specific location is not in the desired state, the display unit 103 of the first modified example displays multiple captured images obtained by the imaging unit 101 capturing a specific location under multiple different lighting conditions when the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is smaller than a threshold. This configuration has the advantage of being able to evaluate the state of the specific location with high accuracy.

[0111] (Other control methods for the implementation system of the first modified example) Next, a control method for the implementation system 1a of the first modified example, when the evaluation unit 213 determines whether the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value, will be described with reference to Figure 7. The flowchart shown in Figure 7 is merely one example of the control method described above according to this disclosure, and the order of processing may be changed as appropriate, or processing may be added or omitted as appropriate.

[0112] The control method for the implementation system 1a of the first modified example, when the evaluation unit 213 determines whether the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value, includes, as shown in Figure 7, an implementation step S301, a detection step S302, a first imaging step S303, an evaluation step S304, an adjustment step S305, a second imaging step S306, a display step S307, an ejection step S309, a storage step S310, a calculation step S311, a storage step S312, a learning step S313, and a determination step S314. The second imaging step S306 corresponds to the imaging step in this disclosure.

[0113] Note that the implementation step S301, detection step S302, first imaging step S303, evaluation step S304, adjustment step S305, second imaging step S306, display step S307, ejection step S309, memory step S310, calculation step S311, storage step S312, and learning step S313 are the same as the implementation step S201, detection step S202, first imaging step S203, evaluation step S204, adjustment step S205, second imaging step S206, display step S207, ejection step S209, memory step S210, calculation step S211, storage step S212, and learning step S213 described above, so their explanations are omitted.

[0114] If the evaluation unit 213 evaluates that the state of a specific location is in the desired state, that is, if the evaluation unit 213 evaluates that the component 30 has been mounted in the planned mounting position by the mounting device X1 (S304: Yes), the evaluation unit 213 performs the save step S312. On the other hand, if the evaluation unit 213 evaluates that the state of a specific location is not in the desired state (S304: No), the evaluation unit 213 performs the determination step S314 to determine whether the accuracy of the evaluation by the evaluation unit 213 is lower than a predetermined value. More specifically, in the determination step S314, the evaluation unit 213 determines whether the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is less than a threshold.

[0115] If the evaluation unit 213 determines that the accuracy of its evaluation is lower than a predetermined value, that is, if the evaluation unit 213 determines that the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is less than a threshold (S304: Yes), the adjustment step S305 is performed. After the calculation unit 212 performs the calculation step S311, the evaluation unit 213 performs the save step S312. On the other hand, if the evaluation unit 213 determines that the accuracy of its evaluation is greater than or equal to a predetermined value, that is, if the evaluation unit 213 determines that the agreement rate between the evaluation result by the evaluation unit 213 and the evaluation result by visual inspection is greater than or equal to a threshold (S304: No), the evaluation unit 213 performs the save step S312.

[0116] (1.5.2) Second variation In the mounting system 1 of the embodiment 1 described above, the production apparatus 10 is one of three mounting devices X1, each having a mounting unit 104 that holds the component 30 and mounts the component 30 onto the substrate 40. In contrast, in the mounting system 1b of the second modified example shown in Figure 8, the production apparatus 10 is one of image inspection devices X31, X32, or X33, each having an inspection unit 124 that inspects the condition of a specific location based on an image obtained by an imaging unit 101 that images the specific location. The mounting system 1b of the second modified example differs from the mounting system 1 in the above respect.

[0117] (Configuration of the implementation system for the second modified example) The implementation system 1b of the second modified example, as shown in Figure 8, comprises a production device 10b which is one of the image inspection devices X31, X32, or X33, and a management device 20b which manages the production device 10b. The production device 10b of the second modified example has an imaging unit 101, a control unit 102b, a display unit 103, a transport unit 191, a communication unit 193, and an operation unit 194. Each of the image inspection devices X31, X32, and X33 corresponds to the inspection device of this disclosure.

[0118] In the second modified example, the imaging unit 101 images a specific location. In the second modified example, the specific location is either a location on the substrate 40 where a bonding member is placed, or a location on the substrate 40 where a component 30 is mounted. The specific location is preset according to, for example, any of the image inspection devices X31, X32, or X33. More specifically, if the production device 10b is an image inspection device X31 that inspects the state of a bonding member placed on the mounting surface 401 of the substrate 40, the specific location is a location on the substrate 40 where a bonding member is placed. Also, if the production device 10b is any of the image inspection devices X32 or X33 that inspect the state of at least one of the bonding member and the component 30 placed on the mounting surface 401 of the substrate 40 after the component 30 has been mounted on the substrate 40, the specific location is either a location on the substrate 40 where a bonding member is placed, or a location on the substrate 40 where a component 30 is mounted.

[0119] The imaging unit 101 of the second modified example has an image sensor 111 and an illumination unit 112, similar to the imaging unit 101 of the first modified example.

[0120] The control unit 102b can be implemented, for example, by a computer system having one or more processors and one or more memories. That is, the control unit 102b functions by one or more processors executing a program recorded in one or more memories of the computer system. In this case, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunication line such as the Internet, or it may be provided recorded on a non-temporary recording medium such as a memory card.

[0121] As shown in Figure 8, the control unit 102b includes an imaging control unit 122, a display control unit 123, and an inspection unit 124. The imaging control unit 122 corresponds to the control unit of this disclosure.

[0122] The inspection unit 124 inspects the condition of a specific location based on an inspection image, which is an image obtained by the imaging unit 101 when it images the specific location. More specifically, the inspection unit 124 controls the imaging unit 101 to take images under different lighting conditions than the candidate lighting conditions determined by the management unit 211, and inspects the condition of the specific location based on the inspection image, which is an image obtained by the imaging unit 101 when it images the specific location under the different lighting conditions. The inspection unit 124 uses an inspection learning model created by the inspection learning unit 215, which will be described later, to inspect the condition of the specific location. Here, "condition of the specific location" means whether or not the condition of the specific location is in the desired state.

[0123] In the second modified image control unit 122, when the inspection unit 124 determines that the condition of a specific location is poor, the imaging unit 101 controls the imaging unit 101 to image the specific location under multiple different lighting conditions. More specifically, in the second modified image control unit 122, when the inspection unit 124 determines that the condition of a specific location is poor, the imaging unit 101 controls the imaging unit 101 to image the specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency. That is, in the second modified image control unit 122, when the inspection unit 124 determines that the condition of a specific location is poor, the imaging unit 101 controls the imaging unit 101 to image the specific location under multiple lighting conditions, including candidate lighting conditions determined by the management unit 211 and described later.

[0124] Therefore, when the inspection unit 124 determines that the condition of a specific location is poor, the display control unit 123 displays the image obtained by the imaging unit 101 capturing the specific location under multiple lighting conditions, including candidate lighting conditions determined by the management unit 211, on the display unit 103. In other words, when the inspection unit 124 determines that the condition of a specific location is poor, the display unit 103 displays the image obtained by the imaging unit 101 capturing the specific location under multiple lighting conditions, including candidate lighting conditions determined by the management unit 211, on the display unit 103. The image used, which is one of the multiple image obtained by the imaging unit 101, is used for visual evaluation to assess whether the condition of the specific location is good or bad. Since the production device 10 is one of the image inspection devices X31, X32, or X33, in the visual evaluation, an operator of the production device 10 visually inspects the image obtained by the display unit 103 and evaluates whether the location on the substrate 40 where the bonding member is placed, or the location on the substrate 40 where the component 30 is mounted, is in the desired condition. If visual inspection determines that the location on the substrate 40 where the bonding member is placed, or the location on the substrate 40 where the component 30 is mounted, is not in the desired condition, the transport unit 191 discharges the substrate 40 that was evaluated as not in the desired condition from the production device 10. The above configuration has the advantage that the quality of a specific location in any of the image inspection devices X31, X32, or X33 can be appropriately determined.

[0125] The second modified control device 20b, as shown in Figure 8, includes a control unit 201b, a storage unit 202, and a communication unit 203. The control unit 201b includes a management unit 211, a calculation unit 212, and an inspection and learning unit 215.

[0126] The inspection learning unit 215 generates an inspection learning model used by the inspection unit 124 to determine whether the condition of a specific location is good or bad. The inspection learning model is created to receive an image taken by the imaging unit 101 under lighting conditions different from the candidate lighting conditions determined by the management unit 211, and to output information indicating the condition of the specific location contained in the image. The inspection learning unit 215 learns the inspection learning model using the results of the inspection unit 124's determination of whether the condition of the specific location is good or bad, the lighting conditions when the imaging unit 101 took an image of the specific location and obtained an inspection image, and the results of the visual evaluation as input information. In other words, the inspection learning model is a model learned using the results of the inspection unit 124's determination of whether the condition of the specific location is good or bad, the lighting conditions when the imaging unit 101 took an image of the specific location and obtained an inspection image, and the results of the visual evaluation as input information. With the above configuration, there is an advantage that the inspection unit 124 can inspect whether the condition of the specific location is good or bad with high accuracy.

[0127] The management unit 211 stores performance data, including specific location information and lighting condition information, in the storage unit 202 for each visual evaluation. The storage unit 202 is composed of a device selected from ROM, RAM, or EEPROM, etc.

[0128] The specific location information is information about a specific location included in the image used for visual evaluation from among the multiple captured images displayed on the display unit 103. In the second modified example, the specific location information is information about the location on the substrate 40 where the bonding member is placed, or the location on the substrate 40 where the component 30 is mounted, included in the image used for visual evaluation from among the multiple captured images displayed on the display unit 103.

[0129] The lighting condition information is information indicating the lighting conditions when the imaging unit 101 imaged a specific location and obtained the above-mentioned usable image. In the second modified example, the management unit 211 acquires which of the multiple captured images was used as the above-mentioned usable image based on the operation information received by the operation unit 194, and acquires the lighting conditions when the imaging unit 101 imaged a specific location and obtained the usable image from the imaging control unit 122.

[0130] The calculation unit 212 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. The calculation unit 212 of the second modified example calculates the frequency of use of the luminance used to illuminate the specific location being imaged, which is the lighting condition when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. As a specific example, the calculation unit 212 of the second modified example uses an aggregation table that divides the luminance range that can be adopted as the above luminance into multiple predetermined ranges, and aggregates and calculates the frequency of use of the above luminance for visual evaluation for each of the multiple predetermined ranges.

[0131] The management unit 211 adjusts (manages) the lighting conditions based on the usage frequency calculated by the calculation unit 212. More specifically, the management unit 211 adjusts the lighting conditions by determining the lighting condition with the highest usage frequency calculated by the calculation unit 212 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202 as a candidate lighting condition. In the second modified example, the management unit 211 determines the luminance that falls within a predetermined range with the highest usage frequency calculated by the calculation unit 212 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202 as a candidate luminance for the candidate lighting condition.

[0132] (Control method for the implementation system of the second modified example) Next, the control method for the second modified implementation system 1b will be described with reference to Figure 9. In the following description, we assume the control method for the implementation system 1b when one of the image inspection devices X31, X32, or X33 of the production device 10 performs an operation to inspect the condition of a specific location on one substrate 40 (hereinafter also referred to as the current inspection operation). After the current inspection operation is completed, the production device 10 starts an operation to inspect the condition of a specific location on the next substrate 40 (the next inspection operation). The flowchart shown in Figure 9 is merely one example of the control method described above according to this disclosure, and the order of processing may be changed as appropriate, or processing may be added or omitted as appropriate.

[0133] The control method for the second modified implementation system 1b includes, as shown in Figure 9, a control step S401, an inspection step S402, an adjustment step S403, an imaging step S404, a display step S405, an ejection step S407, a storage step S408, and a calculation step S409.

[0134] In control step S401, the inspection unit 124 controls the imaging unit 101 to image a specific location under lighting conditions different from the candidate lighting conditions determined by the management unit 211. Then, in inspection step S402, the inspection unit 124 inspects whether the condition of the specific location is good or bad based on the image obtained in control step S401 when the imaging unit 101 imaged the specific location under the different lighting conditions. In short, in inspection step S402, the inspection unit 124 inspects whether the condition of the specific location is bad or not based on the image obtained in control step S401 when the imaging unit 101 imaged the specific location under the different lighting conditions. If the inspection unit 124 determines that the condition of the specific location is not bad (S402: No), it terminates the current inspection operation and starts the next inspection operation. In short, if the inspection unit 124 determines that the condition of a specific part is not defective (S402: No), the control method for the mounting system 1b when the production device 10 performs the current inspection operation ends, and the control method for the mounting system 1b when the production device 10 performs the next inspection operation begins.

[0135] If the inspection unit 124 determines that the condition of a specific part is defective (S402: Yes), the management unit 211 performs an adjustment step S403 to adjust the lighting conditions based on the usage frequency calculated by the calculation unit 212 in calculation step S409 when a previous inspection operation was performed. Here, "previous inspection operation" refers to an inspection operation performed by the production equipment 10 prior to the current inspection operation. More specifically, in adjustment step S403, the management unit 211 adjusts the lighting conditions by determining the lighting condition with the highest usage frequency calculated by the calculation unit 212 in each of the multiple calculation steps S409 when a previous inspection operation was performed, from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202, as a candidate lighting condition. In adjustment step S403 of Embodiment 1, the management unit 211 determines the luminance included in the predetermined range with the highest usage frequency calculated by the calculation unit 212, from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data stored in the storage unit 202, as a candidate luminance, which is a candidate lighting condition.

[0136] In the imaging step S404, the imaging unit 101 images a specific location under multiple lighting conditions, including lighting conditions adjusted by the management unit 211 based on usage frequency in the adjustment step S403. In the imaging step S404 of Embodiment 1, the imaging unit 101 images a specific location under multiple lighting conditions, including candidate lighting conditions which are candidate brightness levels determined by the management unit 211 in the adjustment step S403, as described later. In the display step S405, the display unit 103 displays multiple captured images obtained by the imaging unit 101 imaging a specific location under multiple different lighting conditions in the imaging step S404.

[0137] Then, in the display step S405, the image used, which is one of the multiple captured images displayed on the display unit 103, is used for visual evaluation by an operator of the production device 10 (visual evaluation step S406). If the visual evaluation determines that the location on the substrate 40 where the bonding member is placed or the location on the substrate 40 where the component 30 is mounted is in the desired state (S406: Yes), the management unit 211 performs a storage step S408 to store the actual data, including specific location information and lighting condition information, in the storage unit 202. On the other hand, if the visual evaluation determines that the location on the substrate 40 where the bonding member is placed or the location on the substrate 40 where the component 30 is mounted is not in the desired state (S406: No), the transport unit 191 performs a discharge step S407 to discharge the substrate 40 that was evaluated as not in the desired state from the production device 10. After that, the management unit 211 performs a storage step S408 to store the actual data, including specific location information and lighting condition information, in the storage unit 202. In other words, in the memory step S408 of the control method for the implemented system 1b, the management unit 211 causes the memory unit 202 to store performance data, including specific location information and lighting condition information, for each visual evaluation.

[0138] Subsequently, in calculation step S409, the calculation unit 212 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. In calculation step S409 of Embodiment 1, the calculation unit 212 calculates the frequency of use of the luminance used to illuminate the specific location to be imaged, which is the lighting condition when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data stored in the storage unit 202. As a specific example, in calculation step S409 of Embodiment 1, the calculation unit 212 uses an aggregation table that divides the luminance range that can be adopted as the above luminance into multiple predetermined ranges, and aggregates and calculates the frequency of use of the above luminance for visual evaluation for each of the multiple predetermined ranges.

[0139] (1.5.3) Other variations The following are some other modifications of Embodiment 1 described above. These modifications may be implemented in combination as appropriate.

[0140] In the above-described embodiment 1, the illumination unit 112 changes the brightness illuminating a specific area to be imaged as an illumination condition. However, the illumination unit 112 may also change the illumination angle illuminating a specific area to be imaged as an illumination condition. For example, as shown in Figure 10, the illumination unit 112 has two light sources 113a and 113b with different illumination angles for illuminating a specific area to be imaged, and the illumination angle illuminating a specific area to be imaged may be changed by switching the light source used from the two light sources 113a and 113b. In Figure 10, the specific area is the area on the substrate 40 where the component 30 is mounted, and the illumination unit 112 is shown assuming the illumination of the component 30. Light source 113a is a light source that irradiates illumination light L1 from an oblique angle to the thickness direction of the component 30, and is a so-called oblique light type illumination light source. On the other hand, light source 113b is a light source that irradiates illumination light L2 parallel to the thickness direction of the component 30, and is a so-called coaxial light type illumination light source.

[0141] In the above-described embodiment 1, the management device 20 is equipped with a storage unit 202, but a device other than the management device 20 (for example, an external device) may also be equipped with a storage unit 202. Furthermore, the storage unit 202 may be implemented by the cloud (cloud computing) or the like.

[0142] Furthermore, it is not essential for the management device 20 to have its multiple functions integrated into a single enclosure; the components of the management device 20 may be distributed across multiple enclosures. In addition, at least some of the functions of the management device 20 may be implemented by the cloud (cloud computing) or the like.

[0143] (2) Embodiment 2 (2.1) Detailed Configuration The implementation system 1c according to Embodiment 2 comprises a plurality of production devices 10 and a server device 50.

[0144] Each of the multiple production devices 10 in Embodiment 2 is a mounting device X1 included in a different mounting line Y1 (see Figure 2). Since each of the multiple production devices 10 in Embodiment 2 has the same configuration as the production device 10 in Embodiment 1, a detailed explanation is omitted.

[0145] As shown in Figure 11, the server device 50 includes a control unit 501 and a communication unit 502.

[0146] (Control Unit) The control unit 501 can be implemented, for example, by a computer system having one or more processors and one or more memories. That is, the control unit 501 functions by one or more processors executing a program recorded in one or more memories of the computer system. In this case, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunication line such as the Internet, or it may be provided recorded on a non-temporary recording medium such as a memory card.

[0147] As shown in Figure 11, the control unit 501 includes an acquisition unit 511, a management unit 512, and a calculation unit 513.

[0148] The acquisition unit 511 acquires performance data, including specific location information and lighting condition information, for each visual evaluation of the condition of the specific location. More specifically, the acquisition unit 511 acquires performance data, including specific location information and lighting condition information, from each of the multiple production devices 10 via the communication unit 502 for each visual evaluation of the condition of the specific location.

[0149] The specific location information is information about specific locations included in the captured images captured by the imaging unit 101 of each of the multiple production devices 10 (mounting devices X1) included in different mounting lines Y1. More specifically, it is information about specific locations included in the image used for visual evaluation from among the multiple captured images captured by the imaging unit 101 and displayed on the display unit 103 in each of the multiple mounting devices X1 included in different mounting lines Y1. The specific location information in Embodiment 2 is information about the planned mounting position of the component 30 included in the image used for visual evaluation from among the multiple captured images displayed on the display unit 103. Since the planned mounting position where the mounting unit 104 of each mounting device X1, which is each of the multiple production devices 10, will mount the component 30 is set in advance according to the mounting device X1, the specific location information is also set in advance according to each of the multiple production devices 10.

[0150] The lighting condition information is information indicating the lighting conditions when the imaging unit 101 of each of the multiple production devices 10 (mounting devices X1) included in each of the different mounting lines Y1 captures a specific location and obtains an image. More specifically, it is information indicating the lighting conditions when the imaging unit 101 captures and obtains a usable image used for visual evaluation from among the multiple captured images captured by the imaging unit 101 and displayed on the display unit 103 in each of the multiple mounting devices X1 included in each of the different mounting lines Y1. The acquisition unit 511 of Embodiment 2 acquires from each of the multiple production devices 10 via the communication unit 502 which image was used as the usable image from among the multiple captured images, based on information about the operation received by the operation unit 194, and acquires the lighting conditions when the imaging unit 101 captured a specific location and obtained the usable image from the imaging control unit 122.

[0151] The calculation unit 513 of Embodiment 2 calculates the frequency of use of the lighting conditions used for visual evaluation when an imaging unit 101, which is located in each of the multiple production devices 10 (mounting devices X1) included in different mounting lines Y1, images a specific location and obtains an image, based on multiple actual data acquired by the acquisition unit 511. More specifically, the calculation unit 513 of Embodiment 2 calculates the frequency of use of the luminance used to illuminate the specific location to be imaged, which is the lighting condition when an imaging unit 101, which is located in each of the multiple production devices 10 (mounting devices X1) included in different mounting lines Y1, images a specific location and obtains an image, based on multiple actual data acquired by the acquisition unit 511. As a specific example, the calculation unit 513 of Embodiment 2 uses an aggregation table that divides the luminance range that can be adopted as the above luminance into multiple predetermined ranges, and aggregates and calculates the frequency of use of the above luminance for visual evaluation for each of the multiple predetermined ranges.

[0152] In Embodiment 2, the management unit 512 adjusts (manages) the lighting conditions based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 produced by each of the multiple production devices 10 (mounting devices X1). In other words, the management unit 512 in Embodiment 2 adjusts the lighting conditions based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 that each of the multiple mounting devices X1 is mounting. More specifically, the management unit 512 in Embodiment 2 adjusts the lighting conditions when the imaging unit 101 in each of the multiple mounting devices X1 takes an image, based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 that each of the multiple mounting devices X1 is mounting.

[0153] In Embodiment 2, the management unit 512 adjusts the lighting conditions by determining the lighting condition with the highest usage frequency calculated by the calculation unit 513 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data acquired by the acquisition unit 511 as a candidate lighting condition. More specifically, in Embodiment 2, the management unit 512 determines the luminance that falls within the predetermined range with the highest usage frequency calculated by the calculation unit 513 from among the lighting conditions indicated by the lighting condition information contained in each of the multiple actual data acquired by the acquisition unit 511 as a candidate luminance, which is a candidate lighting condition.

[0154] (Communications Department) The communication unit 502 communicates with each of the multiple mounting devices X1, each included in a different mounting line Y1. More specifically, the communication unit 502 has a communication interface for communicating with each of the multiple mounting devices X1, each included in a different mounting line Y1. The communication between the communication unit 502 and each of the multiple mounting devices X1 (more specifically, the communication unit 193 in each of the multiple mounting devices X1) may be wired or wireless.

[0155] (2.2) Control method for server equipment Here, the control method for the server device 50 will be described with reference to Figure 12. The flowchart shown in Figure 12 is merely one example of the control method described above according to this disclosure, and the order of processing may be changed as appropriate, or processing may be added or omitted as appropriate.

[0156] The control method for the server device 50 includes a communication step S501, an acquisition step S502, a calculation step S503, and a management step S504, as shown in Figure 12.

[0157] In communication step S501, the communication unit 502 communicates with each of the multiple mounting devices X1 included in different mounting lines Y1. As a result of the communication unit 502 communicating with each of the multiple mounting devices X1 in communication step S501, the acquisition unit 511 performs acquisition step S502, which acquires actual data including specific location information and lighting condition information for each visual evaluation that assesses the condition of the specific location.

[0158] Then, in calculation step S503, the calculation unit 513 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data acquired by the acquisition unit 511. More specifically, in calculation step S503, the calculation unit 513 calculates the frequency of use of the luminance used to illuminate the specific location being imaged, which is the lighting condition when the imaging unit 101 images a specific location and obtains each of the multiple captured images, based on the multiple actual data acquired by the acquisition unit 511, for visual evaluation.

[0159] Subsequently, in management step S504, the management unit 512 adjusts (manages) the lighting conditions based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 produced by each of the multiple production devices 10 (mounting devices X1). In other words, in management step S504, the management unit 512 adjusts the lighting conditions based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 that each of the multiple mounting devices X1 is mounting.

[0160] (2.3) Effects The server device 50 according to Embodiment 2 comprises a communication unit 502, an acquisition unit 511, a management unit 512, and a calculation unit 513. The communication unit 502 communicates with each of the multiple mounting devices X1 included in different mounting lines Y1. The acquisition unit 511 acquires performance data, including specific location information and lighting condition information, for each visual evaluation of the state of a specific location. The specific location information is information about a specific location included in the captured image captured by the imaging unit 101 of each of the multiple mounting devices X1 included in different mounting lines Y1. The lighting condition information is information indicating the lighting conditions when the imaging unit 101 of each of the multiple mounting devices X1 included in different mounting lines Y1 captured a specific location and obtained an captured image. The calculation unit 513 calculates the frequency of use of the lighting conditions used for visual evaluation when the imaging unit 101 captured a specific location and obtained each of the multiple captured images, based on the multiple performance data acquired by the acquisition unit 511. The management unit 512 adjusts the lighting conditions based on the usage frequency calculated by the calculation unit 513 and the type of substrate 40 that each of the multiple mounting devices X1 is mounting. As a result, the server device 50 according to Embodiment 2 has the effect of enabling more accurate visual evaluation by using the captured images obtained by imaging a specific location under lighting conditions adjusted based on the usage frequency calculated by the calculation unit 513 in each of the multiple mounting devices X1 included in different mounting lines Y1. In other words, the server device 50 according to Embodiment 2 has the advantage of enabling appropriate determination of the state of a specific location in each of the multiple mounting devices X1 included in different mounting lines Y1. It also has the advantage that when adding mounting lines Y1, the lighting conditions adjusted by the management unit 512 can be easily reflected in the mounting devices X1 of the added mounting lines Y1.

[0161] (summary) The first embodiment of the implementation system (1, 1a, 1b) comprises a production device (10, 10b) and a management device (20, 20a, 20b). The production device (10, 10b) has an imaging unit (101) and a control unit (122). The imaging unit (101) images a specific location on the substrate (40). The control unit (122) controls the imaging unit (101) to image the specific location under lighting conditions. The management device (20, 20a, 20b) has a management unit (211) that manages the lighting conditions. The image obtained by the imaging unit (101) imaging the specific location is displayed on the display unit (103). The image displayed on the display unit (103) is used for visual evaluation to assess the condition of the specific location. The management unit (211) stores performance data in the storage unit (202) for each visual evaluation, which includes specific location information, which is information about a specific location included in the captured image, and lighting condition information, which is information indicating the lighting conditions when the imaging unit (101) captured the specific location and obtained the captured image. The management devices (20, 20a, 20b) further include a calculation unit (212) that calculates the frequency of use of lighting conditions for visual evaluation based on multiple performance data. The management unit (211) adjusts the lighting conditions based on the frequency of use.

[0162] This embodiment has the advantage of being able to appropriately determine the condition of a specific part.

[0163] In the implementation system of the second embodiment (1, 1a, 1b), in the first embodiment, the control unit (122) controls the imaging unit (101) to image a specific location under one of a plurality of different lighting conditions. The display unit (103) displays a plurality of captured images obtained by the imaging unit (101) imaging the specific location under the plurality of lighting conditions. Each of the plurality of performance data includes the lighting conditions included in the lighting condition information, which correspond to the lighting conditions of the captured images used for visual evaluation among the plurality of captured images.

[0164] This embodiment has the advantage of allowing for a more accurate determination of the condition of a specific location.

[0165] In the third embodiment of the implementation system (1, 1a, 1b), in the first or second embodiment, the management unit (211) determines the most frequently used lighting condition among the lighting conditions indicated by the lighting condition information contained in each of the multiple performance data as a candidate lighting condition. The display unit (103) displays the captured image obtained by the imaging unit (101) capturing a specific location under the candidate lighting condition.

[0166] This configuration has the advantage that it makes it easier for the control unit (211) to adjust the lighting conditions.

[0167] The implementation system (1a) of the fourth embodiment further comprises an evaluation unit (213) and an evaluation learning unit (214) in the third embodiment. The evaluation unit (213) uses an evaluation learning model to evaluate the state of a specific location based on an image captured by the imaging unit (101) under lighting conditions different from the candidate lighting conditions. The evaluation learning unit (214) creates an evaluation learning model. The evaluation learning model is created to receive an image captured by the imaging unit (101) under lighting conditions different from the candidate lighting conditions as input and output information indicating the state of the specific location contained in the image. The display unit (103) displays the image captured by the imaging unit (101) under the candidate lighting conditions when the accuracy of the evaluation by the evaluation unit (213) is lower than a predetermined value.

[0168] This embodiment has the advantage of being able to accurately evaluate the condition of a specific location.

[0169] In the implementation system of the fifth embodiment (1a), in the fourth embodiment, the display unit (103) displays an image obtained by the imaging unit (101) imaging a specific location under candidate illumination conditions when the agreement rate between the evaluation result by the evaluation unit (213) and the evaluation result by visual inspection is smaller than a threshold.

[0170] This embodiment has the advantage of being able to accurately evaluate the condition of a specific location.

[0171] In the sixth embodiment of the mounting system (1, 1a), in any one of the first to fifth embodiments, the production apparatus (10, 10b) is a mounting apparatus (X1) having a mounting unit (104) that holds a component (30) and mounts the component (30) onto a substrate (40). The mounting apparatus (X1) further has a detection unit (105) that detects mounting errors in which the mounting unit (104) has failed to mount the component (30) to a predetermined mounting position on the substrate (40). When the detection unit (105) detects a mounting error, the imaging unit (101) images the mounting position as a specific location.

[0172] This embodiment has the advantage that the mounting device (X1) can appropriately determine the state of a specific location when mounting a component (30) onto a substrate (40).

[0173] In the seventh embodiment of the mounting system (1b), in any one of the first to sixth embodiments, the specific location is a location on the substrate (40) where a bonding member is placed, or a location on the substrate (40) where a component (30) is mounted. The production equipment (10, 10b) is an inspection device (X31, X32, X33) having an inspection unit (124) that inspects the condition of the specific location based on an inspection image, which is an image obtained by an imaging unit (101) imaging the specific location. The display unit (103) displays the image obtained by the imaging unit (101) imaging the specific location under lighting conditions adjusted by the control unit (211) based on the frequency of use, when the inspection unit (124) determines that the condition of the specific location is poor. The image displayed on the display unit (103) is used for visual evaluation to assess the condition of the specific location.

[0174] This embodiment has the advantage that the inspection unit (124) can accurately inspect the condition of a specific location.

[0175] The implementation system (1b) of the eighth embodiment further comprises an inspection learning unit (215) that generates an inspection learning model used by the inspection unit (124) to determine whether the condition of a specific location is good or bad. The inspection learning model is a model that has been learned using the results of the inspection unit (124)'s determination of whether the condition of a specific location is good or bad, the lighting conditions when the imaging unit (101) captured an image of the specific location using the image used by the inspection unit (124) to determine whether the condition of the specific location is good or bad, and the results of the visual evaluation as input information.

[0176] This embodiment has the advantage of being able to appropriately determine whether the condition of a specific part in the image inspection device (X31, X32, X33) is good or bad.

[0177] The control method for the ninth embodiment of the implementation system (1, 1a, 1b) includes an imaging step (S104, S206, S306, S404), a display step (S105, S207, S307, S405), and a management step. In the imaging step (S104, S206, S306, S404), a specific location on the substrate (40) is imaged under illumination conditions. In the display step (S105, S207, S307, S405), the imaged image obtained by imaging the specific location in the imaging step (S104, S206, S306, S404) is displayed. In the management step, the illumination conditions are managed. The imaged image displayed in the display step (S105, S207, S307, S405) is used for visual evaluation to assess the state of the specific location. The management steps include storage steps (S108, S210, S310, S408), calculation steps (S109, S211, S311, S409), and adjustment steps (S103, S205, S305, S403). In the storage steps (S108, S210, S310, S408), specific location information, which is information about specific locations included in the captured image, is stored, along with the specific location identified in the imaging steps (S104, S206, S306, S404). Actual data, including lighting condition information which indicates the lighting conditions when a location is imaged and an image is obtained, is stored in the storage unit (202) for each visual evaluation. In the calculation steps (S109, S211, S311, S409), the frequency of use of lighting conditions for visual evaluation is calculated based on multiple actual data. In the adjustment steps (S103, S205, S305, S403), the lighting conditions are adjusted based on the frequency of use.

[0178] This embodiment has the advantage of being able to appropriately determine the condition of a specific part.

[0179] The server device (50) of the tenth embodiment comprises a communication unit (502), an acquisition unit (511), a calculation unit (513), and a management unit (512). The communication unit (502) communicates with each of a plurality of mounting devices (X1) that are each included in different mounting lines (Y1) and mount components (30) onto a substrate (40). The acquisition unit (511) acquires actual data for each visual evaluation that assesses the state of a specific location, which includes specific location information, which is information about a specific location included in an image captured by an imaging unit (101) of each of the plurality of mounting devices (X1) when it images a specific location on the substrate (40), and illumination condition information, which is information indicating the illumination conditions when the imaging unit (101) images the specific location and obtains the image. The calculation unit (513) calculates the frequency of use of the illumination conditions for the visual evaluation based on the plurality of actual data. The control unit (512) adjusts the lighting conditions for the imaging unit (101) to image a specific area based on the frequency of use and the type of substrate (40).

[0180] This embodiment has the advantage of enabling appropriate determination of the state of a specific location in each of the multiple mounting devices (X1) included in different mounting lines (Y1).

[0181] The control method for the server device (50) of the 11th embodiment includes a communication step (S501), an acquisition step (S502), a calculation step (S503), and a management step (S504). In the communication step (S501), communication is performed with each of the multiple mounting devices (X1) that are included in different mounting lines (Y1) and mount components (30) onto a substrate (40). In the acquisition step (S502), actual data is acquired for each visual evaluation that assesses the state of the specific location, including specific location information, which is information about the specific location included in the captured image obtained by the imaging unit (101) of each of the multiple mounting devices (X1) imaging the specific location, and illumination condition information, which is information indicating the illumination conditions when the imaging unit (101) imaged the specific location and obtained the captured image. In the calculation step (S503), the frequency of use of the illumination conditions used in the visual evaluation is calculated based on the multiple actual data. In the management step (S504), the illumination conditions for the imaging unit (101) to image a specific area are adjusted based on the frequency of use and the type of substrate (40).

[0182] This embodiment has the advantage of enabling appropriate determination of the state of a specific location in each of the multiple mounting devices (X1) included in different mounting lines (Y1). [Explanation of Symbols]

[0183] 1, 1a, 1b Implementation System 10, 10b Production equipment 101 Imaging Unit 103 Display section 104 Implementation Section 105 Detection unit 122 Control Unit (IMAGING Control Unit) 124 Inspection Department 20, 20a, 20b management device 202 Storage section 211 Management Department 212 Calculation Section 213 Evaluation Department 214 Evaluation and Learning Department 215 Inspection and Learning Department 30 parts 40 circuit boards 50 Server Devices 502 Communications Department 511 Acquisition Department 512 Management Department 513 Calculation Unit X1 mounting device X31, X32, X33 Inspection equipment (image inspection equipment) Y1 Implementation Line S103, S205, S305, S403 Adjustment Steps S104, S206, S306, S404 Imaging steps (second imaging step) S105, S207, S307, S405 Display Steps S108, S210, S310, S408 Memory Steps S109, S211, S311, S409 Calculation Steps S501 Communication Step S502 Acquisition Steps S503 Calculation Step S504 Management Step

Claims

1. An imaging unit that images a specific location on the substrate, A production apparatus having a control unit that controls the imaging unit to image the specific location under lighting conditions, and The control device includes a control unit that manages the aforementioned lighting conditions, The image obtained by the imaging unit capturing the specific location is displayed on the display unit. The captured image displayed on the display unit is used for visual evaluation to assess the condition of the specific location. The management unit stores performance data, which includes specific location information, which is information relating to the specific location included in the captured image, and lighting condition information, which is information indicating the lighting conditions when the imaging unit captured the specific location and obtained the captured image, in the storage unit for each visual evaluation. The management device further includes a calculation unit that calculates the frequency of use of the lighting conditions used for the visual evaluation based on a plurality of performance data, The management unit adjusts the lighting conditions based on the frequency of use. Implementation system.

2. The control unit controls the imaging unit to image the specific location under one of the multiple different lighting conditions. The display unit displays a plurality of captured images obtained by the imaging unit imaging the specific location under the plurality of illumination conditions. Each of the aforementioned plurality of performance data includes, as lighting conditions included in the lighting condition information, the lighting conditions corresponding to the image used for the visual evaluation among the plurality of captured images, The implementation system according to claim 1.

3. The management unit determines, among the lighting conditions indicated by the lighting condition information included in each of the multiple performance data, the lighting condition with the highest usage frequency as a candidate lighting condition. The display unit displays the captured image obtained when the imaging unit captures the specific location under the candidate illumination conditions. The implementation system according to claim 1 or 2.

4. An evaluation unit that uses an evaluation learning model to evaluate the state of the specific location based on the captured image obtained by the imaging unit capturing the specific location under lighting conditions different from the candidate lighting conditions, An evaluation learning unit that creates the aforementioned evaluation learning model, and further comprising, The evaluation learning model is created to receive the captured image obtained when the imaging unit captures the specific location under the lighting conditions, and to output information indicating the state of the specific location included in the captured image. The display unit displays the captured image obtained by the imaging unit capturing the specific location under the candidate illumination conditions when the accuracy of the evaluation by the evaluation unit is lower than a predetermined value. The implementation system according to claim 3.

5. The display unit displays the captured image obtained by the imaging unit capturing the specific location under the candidate illumination conditions when the agreement rate between the evaluation result by the evaluation unit and the evaluation result by the visual evaluation is less than a threshold. The implementation system according to claim 4.

6. The production apparatus is a mounting apparatus having a mounting section that holds components and mounts the components onto the substrate, The mounting apparatus further includes a detection unit that detects mounting errors in which the mounting unit has failed to mount the component to a predetermined mounting position on the substrate. The imaging unit, when the detection unit detects the mounting error, captures the planned mounting location as the specified location. The implementation system according to claim 1 or 2.

7. The aforementioned specific location is a location on the substrate where a bonding member is placed, or a location on the substrate where a component is mounted. The production apparatus is an inspection apparatus having an inspection unit that inspects the condition of the specific location based on an inspection image, which is an image obtained by the imaging unit imaging the specific location. The display unit, when the inspection unit determines that the condition of the specific location is poor, displays the image obtained when the imaging unit images the specific location under the lighting conditions adjusted by the management unit based on the frequency of use. The captured image displayed on the display unit is used for the visual evaluation to assess the condition of the specific location. The implementation system according to claim 1 or 2.

8. The system further comprises an inspection learning unit that generates an inspection learning model used by the inspection unit to determine whether the condition of the specific location is good or bad, The inspection learning model is a model that has learned using the following as input information: the result of the inspection unit determining whether the condition of the specific location is good or bad, the lighting conditions when the imaging unit captured the specific location and obtained the inspection image, and the result of the visual evaluation. The implementation system according to claim 7.

9. An imaging step in which a specific area on the substrate is imaged under lighting conditions, A display step which displays the captured image obtained by capturing the specific location in the aforementioned imaging step, Includes a management step for managing the lighting conditions, The captured image displayed in the display step is used for visual evaluation to assess the condition of the specific location. The aforementioned management step is, A storage step in which actual data including specific location information, which is information relating to the specific location included in the captured image, and lighting condition information, which is information indicating the lighting conditions when the specific location was imaged in the imaging step to obtain the captured image, is stored in the storage unit for each visual evaluation. A calculation step of calculating the frequency of use of the lighting conditions used in the visual evaluation based on multiple performance data, Includes an adjustment step of adjusting the lighting conditions based on the frequency of use, A method for controlling the implemented system.

10. Each of the following is included in a different mounting line and communicates with each of the multiple mounting devices that mount components onto the circuit board: An acquisition unit acquires performance data, which includes specific location information, which is information about the specific location included in the captured image obtained by the imaging unit of each of the plurality of mounting devices imaging the specific location on the substrate, and illumination condition information, which is information indicating the illumination conditions when the imaging unit imaged the specific location and obtained the captured image, for each visual evaluation that evaluates the state of the specific location. A calculation unit that calculates the frequency of use of the lighting conditions used for the visual evaluation based on multiple performance data, The system includes a control unit that adjusts the lighting conditions for the imaging unit to image the specific location based on the frequency of use and the type of substrate, Server device.

11. A communication step that communicates with each of multiple mounting devices that are located on different mounting lines and mount components onto a circuit board, An acquisition step of acquiring actual data, which includes specific location information, which is information about the specific location included in the captured image obtained by the imaging unit of each of the plurality of mounting devices imaging the specific location on the substrate, and lighting condition information, which is information indicating the lighting conditions when the imaging unit imaged the specific location to obtain the captured image, for each visual evaluation of the state of the specific location, A calculation step of calculating the frequency of use of the lighting conditions used in the visual evaluation based on multiple performance data, Includes a management step of adjusting the lighting conditions for the imaging unit to image the specific location based on the frequency of use and the type of substrate, A method for controlling server equipment.

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