Equipment for satellites, satellite, and method for manufacturing equipment for satellites
The satellite-mounted equipment with a backboard and modular connectors enables easy function addition or modification by allowing modules with specific functionalities to be connected or removed, addressing the inflexibility of existing satellite designs.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2026-03-24
AI Technical Summary
Existing artificial satellites face challenges in easily adding or modifying functions due to dedicated design configurations that limit flexibility and expandability of onboard equipment.
The satellite-mounted equipment features a backboard with connectors having common pin assignments and housings that accommodate modules with specific functions, allowing easy connection and disconnection of modules with different functionalities, enabling flexible function addition or modification.
This configuration facilitates easy addition, modification, or reconfiguration of satellite functions by allowing modules to be connected or removed as needed, enhancing flexibility and expandability.
Smart Images

Figure 2026052543000001_ABST
Abstract
Description
Technical Field
[0006]
[0001] The present disclosure relates to equipment for mounting on artificial satellites, artificial satellites, and methods for manufacturing equipment for mounting on artificial satellites.
Background Art
[0002] It is known that artificial satellites are equipped with mission equipment and bus equipment.
[0003] For example, Patent Document 1 describes "an artificial satellite structure including a payload structure portion formed in a box shape by an outer surface panel, a bus structure portion formed at the lower end of the payload structure portion, electronic equipment housed in the payload structure portion, and an electronic equipment mounting panel disposed and supported in the payload structure portion and installed in the payload structure portion." According to this, there is a description that "the space for mounting electronic equipment can be increased by increasing the number of electronic equipment mounting panels in the payload structure portion."
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] When a certain artificial satellite performs a certain mission, equipment designed to be optimal for performing that mission is mounted. Therefore, the design of the equipment mounted on each artificial satellite can be different. In the invention described in Patent Document 1, even if the space for mounting electronic equipment is increased, it is difficult to easily add or change the functions of the artificial satellite because the design of the equipment is a dedicated design for each artificial satellite. [[ID=A]]artificial satellite
[0006] The purpose of this disclosure is to provide satellite-mounted equipment, a satellite, and a method for manufacturing satellite-mounted equipment that solve the above-mentioned problems. [Means for solving the problem]
[0007] The satellite-mounted equipment of this disclosure comprises a backboard having a first connector including a first pin and a second pin, and a second connector including a third pin; a first housing capable of accommodating a first card that has a first function when connected to the first pin and is electrically connectable to the first connector; and a second housing capable of accommodating a second card that has a second function when connected to the second pin and is electrically connectable to the second connector, wherein the first connector is connectable to the second card.
[0008] The present disclosure's method for manufacturing satellite-mounted equipment includes the steps of: providing a first connector including a first pin and a second pin, and a second connector including a third pin, on a backboard; providing a first housing capable of accommodating a first card that has a first function when connected to the first pin and is electrically connectable to the first connector, in a position capable of holding the electrically connected first card; and providing a second housing capable of accommodating a second card that has a second function when connected to the second pin and is electrically connectable to the third pin, in a position capable of holding the electrically connected second card, wherein the first connector is connectable to the second card. [Effects of the Invention]
[0009] According to the satellite-mounted equipment, satellite, and method for manufacturing satellite-mounted equipment relating to this disclosure, it is easy to add or modify the functions of the satellite. [Brief explanation of the drawing]
[0010] [Figure 1] This is a perspective view showing an example of the configuration of the artificial satellite related to this disclosure. [Figure 2] This figure shows an example of the backboard configuration related to this disclosure. [Figure 3] Figure I shows an example of the additional functionality of the satellite related to this disclosure. [Figure 4] Figure II shows an example of the additional functionality of the satellite related to this disclosure. [Figure 5] Figure III shows an example of the additional functionality of the satellite related to this disclosure. [Figure 6] Figure IV shows an example of the additional functionality of the satellite related to this disclosure. [Figure 7] This is a cross-sectional view showing an example of a cooling structure for an artificial satellite related to this disclosure. [Figure 8] This is flowchart I, which shows an example of the process for manufacturing equipment for satellites related to this disclosure. [Figure 9] This figure shows an example of the configuration of equipment mounted on an artificial satellite related to this disclosure. [Figure 10] This is flowchart II, illustrating an example of the process for manufacturing equipment for satellites related to this disclosure. [Modes for carrying out the invention]
[0011] The embodiments of this disclosure will be described below with reference to the drawings. The drawings and specific configurations used in each embodiment should not be used to interpret the disclosure. In all drawings, identical or corresponding components are denoted by the same reference numerals, and common descriptions are omitted.
[0012] <First Embodiment> An embodiment of this disclosure will be described below with reference to the figures. An example of the bolometer configuration in this disclosure will be explained below with reference to Figures 1 to 7.
[0013] Hereinafter, the direction in which heat is transferred from the housing 3 to the heat dissipation member 4 through the mounting surface 4s is referred to as the Z direction. The direction in which the card-type module MO is connected to the backboard and intersects the Z direction is referred to as the Y direction. Also, the direction intersecting the Z direction and the Y direction is referred to as the X direction. Also, one direction in the X direction is the +X direction, and the other direction in the X direction is the -X direction. Also, one direction in the Y direction is the +Y direction, and the other direction in the Y direction is the -Y direction. Also, one direction in the Z direction is the +Z direction, and the other direction in the Z direction is the -Z direction.
[0014] For example, the X direction, the Y direction, and the Z direction may be directions orthogonal to each other. For example, the mounting surface 10s of the backboard 10 may be a surface along the ZX plane and facing the -Y direction. For example, the +Z direction may be the upward direction.
[0015] (Configuration of artificial satellite) As shown in FIG. 1, the artificial satellite 100 includes an artificial satellite-mounted device 1, at least one or more modules MO, a housing 3, and a heat dissipation member 4. The module MO is a device mounted on the artificial satellite 100 having a card-like form. For example, the module MO may have a substrate-like form. As shown in FIG. 1, the artificial satellite 100 of the present disclosure includes a plurality of modules MO_M. The performance of the artificial satellite 100 can change according to the type and number of each module MO connected to the backboard 10 described later.
[0016] (Configuration of artificial satellite-mounted device) The artificial satellite-mounted device 1 is used to add or change the functions of the artificial satellite 100. As shown in FIG. 1, the artificial satellite-mounted device 1 includes a backboard 10 and a plurality of accommodation portions R_M. Each accommodation portion R can partially accommodate each module MO. For example, each accommodation portion R has a rail-like form. Each accommodation portion R has a guiding function when mounting the module MO or a function of preventing the module MO from falling off. Each accommodation portion R is attached adjacent to each connector CN described later.
[0017] (Backboard configuration) The backboard 10 has multiple connectors CN_M to which multiple modules MO_M can be connected. The pin assignments of each connector CN are common to the backboard 10. Therefore, the backboard 10 has expandability, allowing for an increase or decrease in the number of connected modules MO. Note that some pins may be missing in certain connectors. For the following reasons, module MO connected to backboard 10 can receive a common signal on each pin.
[0018] As shown in Figure 2, the backboard 10 includes a plurality of connectors CN_M. In this disclosure, the plurality of housings R_M include a first connector CN_1, a second connector CN_2, a third connector CN_3, a fourth connector CN_4, a fifth connector CN_5, a sixth connector CN_6, and an Nth connector CN_N. The number of each connector in the plurality of connectors CN_M is not limited. The first connector CN_1 includes a first pin (PIN NAME: A) and a second pin (PIN NAME: B). The second connector CN_2 includes a third pin (PIN NAME: C). In addition, the second connector CN_2 may also include a fourth pin (PIN NAME: D). The fourth pin is physically connectable to the second card. There is no limit to the number of pins each connector CN_M has. In this disclosure, each connector CN has five pins. A common electrical signal can be conducted to specific pins included in each connector CN. For example, electrical signals F1, F2, F3, F4, and F5 are assigned to the backboard 10 from the +Z direction to the -Z direction and can be conducted within the backboard 10. For example, the electrical signal F1 can be conducted to the first pin, fourth pin, sixth pin (PIN NAME: F), eighth pin (PIN NAME: H), tenth pin (PIN NAME: J), and twelfth pin (PIN NAME: L). These pins are aligned along the X direction. For example, the F2 electrical signal can be conducted through the second, third, fifth (PIN NAME: E), seventh (PIN NAME: G), ninth (PIN NAME: I), and eleventh (PIN NAME: K) pins. These pins are aligned along the X direction. Similarly, for the electrical signals of F3, F4, and F5, a common electrical signal can be transmitted to the pins aligned along the X direction. In other words, when the arrangement order of each pin is assigned to the backboard 10 from the +Z direction to the -Z direction, a common electrical signal can be conducted to pins that are in the same order within each connector CN. Note that when a common electrical signal can be conducted to specific pins contained within each connector CN, there may be multiple such pins lined up along the X direction.
[0019] It is also acceptable that a common electrical signal does not flow through some of the pins.
[0020] Each connector CN may be aligned along the X direction. For example, the first connector CN_1, the second connector CN_2, the third connector CN_3, the fourth connector CN_4, the fifth connector CN_5, the sixth connector CN_6, and the Nth connector CN_N are aligned along the X direction. In this case, when each module MO is connected to the backboard 10 from the -Y direction to the +Y direction, each module MO is arranged in a line along the X direction.
[0021] As mentioned above, the pin assignments for each connector CN are common. Therefore, the distance between two pins in a particular connector is equal to the distance between two pins in another connector that are in the same order as those pins. Let's take the first connector CN_1 and the second connector CN_2 as an example. The distance between the first pin (PIN NAME: A) and the second pin (PIN NAME: B) is expressed as the first distance. The distance between the third pin (PIN NAME: C) and the fourth pin (PIN NAME: D) is expressed as the second distance. In this case, the first distance and the second distance are equal.
[0022] Here, I will discuss module MO again.
[0023] (Module configuration) Each module MO has a common interface. The pin assignments of each connector CN correspond to a common backboard 10. Therefore, each module MO can physically contact each pin included in the connector CN. When module MO and each pin are in physical contact, an electrical signal flows to a specific pin, electrically connecting that pin and module MO. When module MO is electrically connected to a specific pin, module MO can perform electrical processing with a specific function. Note that some interfaces may be missing in certain modules.
[0024] Each module MO can perform electrical processing with a specific function when it is electrically connected to a specific pin, depending on the electrical signal flowing through that pin. For example, each module MO can perform electrical processing with a first function when it is physically connected to a specific pin and then an electrical signal F1 flows from that pin. For example, each module MO can perform electrical processing with a second function when it is physically connected to a specific pin and then an electrical signal F2 flows from that pin. For example, each module MO can perform electrical processing with a third function when it is physically connected to a specific pin and then an electrical signal F3 flows from that pin. For example, each module MO can perform electrical processing with a fourth function when it is physically connected to a specific pin and then an electrical signal F4 flows from that pin. For example, each module MO can perform electrical processing with a fifth function when it is physically connected to a specific pin and then an electrical signal F5 flows from that pin.
[0025] For example, electrical processing having an Nth function (for example, including at least one of the first, second, third, fourth, or fifth functions) includes the following processes:
[0026] For example, as a result of having an Nth function of electrical processing, module MO may be capable of processing signals acquired from mission equipment. In that case, the following are examples. Note that the processing of module MO is not limited to these examples. As a result of having electrical processing with an Nth function, module MO may be capable of processing RF (Radio Frequency) signals. RF signal processing includes processes that generate RF signals and processes that modulate RF signals. As a result of having electrical processing with the Nth function, module MO may be capable of processing baseband signals. As a result of having electrical processing with the Nth function, module MO may be capable of processing signals other than the above-mentioned signals. As a result of having an electrical processing function with an Nth function, module MO may be able to generate timing signals used in the receiver. As a result of having an electrical processing function with the Nth function, the module MO may also function as a correlator. As a result of having electrical processing with the Nth function, module MO has the function of processing data. The data to be processed is telemetry data.
[0027] For example, as a result of having an Nth function of electrical processing, module MO may also have a function of signal processing of signals acquired from bus equipment. In that case, the following are examples. Note that the processing of module MO is not limited to these examples. As a result of having electrical processing with the Nth function, module MO may have the function of performing attitude control processing for the artificial satellite 100. As a result of having an electrical processing function with the Nth function, module MO may have the function of controlling the operation of an electric actuator such as a reaction wheel. As a result of having an electrical processing function with an Nth function, module MO may be able to control the exchange of power supply.
[0028] As shown again in Figure 1, each module included in the multiple modules MO_M (for example, the first module MO_1, the second module MO_2, the third module MO_3, the fourth module MO_4, the fifth module MO_5, and the sixth module MO_6) is selectively equipped with the above-mentioned functions by electrical signals flowing from specific pins after being physically connected. Note that the module MO and multiple pins may be electrically connected by the flow of electrical signals.
[0029] For example, as shown in Figure 3, the first module MO_1 (hereinafter referred to as the "first card") can be held in a housing R attached adjacent to the first connector CN_1. The second module MO_2 (hereinafter referred to as the "second card") can be held in a housing R attached adjacent to the second connector CN_2. The first card is capable of performing electrical processing with a first function when electrically connected to the first pin (PIN NAME: A) and is electrically connectable to the first connector. The second card is capable of performing electrical processing with a second function when electrically connected to the second pin (PIN NAME: B), and is also capable of performing electrical processing with a second function when electrically connected to the third pin (PIN NAME: C) and is electrically connectable to the second connector.
[0030] For example, as shown in Figure 4, the first connector CN_1 can be electrically connected to the second card. As described above, the electrical signal F2 can be conducted through the second, third, fifth, seventh, ninth, and eleventh pins. Therefore, the third connector CN_3, the fourth connector CN_4, the fifth connector CN_5, and the sixth connector CN_6 can all be electrically connected to the second card. As a result of having electrical processing with a second function when the electrical signal F2 flows from these pins, the second card can process signals acquired from mission equipment. For example, the second card can process RF signals.
[0031] For example, as shown in Figure 5, in addition to the first and second cards being connected to the backboard 10 according to the performance required for the satellite 100, other modules (e.g., third module MO_3: third card) are connected as appropriate, thereby adding the functions performed by each module MO to the satellite 100. For example, when the third card is connected to the backboard and electrically connected to the fifth pin, the satellite 100 is given electrical processing having the second function performed by the third card. Other modules can also perform electrical processing having the nth function when any of the electrical signals F1 to F5 flows from a specific pin. In other words, depending on the performance required for the satellite 100, the module MO is appropriately connected to the backboard 10, thereby appropriately adding the functions provided by the module MO to the satellite 100.
[0032] For example, as shown in Figure 6, suppose the first module MO_1, the second module MO_2, the third module MO_3, the fourth module MO_4, and the fifth module MO_5 are connected to the backboard 10. In this case, the satellite 100 has function FX by each module being electrically connected to a specific pin. For example, if the sixth module MO_6 is capable of modulating an RF signal as a result of having function N, then the satellite 100 has an additional function (function FX') as an RF modulation device by electrically connecting the sixth module MO_6 to the vacant fifth connector CN_5.
[0033] Alternatively, for example, the satellite 100 may also function as an RF receiving device by connecting a module MO having an RF signal receiving function to the backboard 10. Alternatively, for example, by connecting a module MO having a receiving antenna selection function to the backboard 10, the satellite 100 may also function as a positioning computing device. Furthermore, depending on the connection method of module MO to backboard 10, functions may be superimposed on the satellite 100. For example, when the satellite 100 has the function of an RF modulation device (function FX'), the functions of an RF receiving device and a positioning computing device may be superimposed on it.
[0034] Furthermore, if a particular function becomes unnecessary for the satellite 100, the module MO may be removed from the backboard 10. This allows the functions performed by module MO to be reconfigured or reallocated within the satellite 100.
[0035] (housing) As shown in Figure 7, the housing 3 houses the satellite-mounted equipment 1. The housing 3 contains, for example, a support member SM that supports the backboard 10. When the module MO, which is electrically connected to the connector CN on the backboard 10, generates heat, it transfers the heat to the housing 3 via the support member SM. The housing 3 is in contact with the mounting surface 4s. This allows heat transferred to the housing 3 to be dissipated through the heat dissipation member 4. In other words, the backboard 10 and the heat dissipation member 4 are thermally connected via the housing 3. For example, housing 3 is made of aluminum. For example, Housing 3 is a satellite structure.
[0036] (Heat dissipation component) The heat dissipation member 4 removes heat generated in the backboard 10 via the housing 3, thereby dissipating heat from the module MO. The heat dissipation member 4 has a mounting surface 4s that intersects with the Z direction. As described above, the housing 3 is in contact with the mounting surface 4s. For example, the heat dissipation component 4 is a satellite structure panel. Satellite structure panels are generally made of aluminum.
[0037] (Transmission pathway) As shown in Figure 7, first, the heat dissipated from module MO is dissipated towards the backboard 10. Next, the dissipated heat is received by the housing 3 via the support member SM, and then the housing 3 transfers heat in the Z direction toward the heat dissipation member 4. Furthermore, by connecting each module MO to the backboard 10 along the direction intersecting the mounting surface 4s, the heat transfer path from module MO to housing 3 becomes equal for each module MO. This improves the heat dissipation efficiency of each module MO compared to connecting each module MO to the backboard 10 along the mounting surface 4s. As the heat dissipation member 4 receives heat through the mounting surface 4s, a transfer path TR from the backboard 10 to the heat dissipation member 4 is shown.
[0038] Furthermore, the heat dissipation member 4 may be a heat transport member, such as a heat pipe or a vapor chamber. In this case, the housing 3 is in contact with one surface (mounting surface 4s) of the heat transport member, and the other surface is in contact with a member that has a heat dissipation function.
[0039] (Manufacturing method) A method for manufacturing the satellite-mounted equipment 1 in this embodiment will be described. The manufacturing method for the satellite-mounted equipment 1 in this embodiment is carried out according to the flow shown in Figure 8.
[0040] First, the manufacturer provides the backboard 10 with a first connector CN_1 including a first pin (PIN NAME: A) and a second pin (PIN NAME: B), and a second connector CN_2 including a third pin (PIN NAME: C) (Step ST10: Step of providing on the backboard). At this time, the first connector CN_1 can be connected to the second card, which will be described later.
[0041] Next, the manufacturer provides a first housing (housing R adjacent to the first connector CN_1) in a position capable of holding the electrically connected first card, which is an electrically processing first card having a first function when electrically connected to the first pin, and which is electrically connectable to the first connector CN_1 (step ST11: step of providing the first housing in a position capable of holding the first card).
[0042] Next, the manufacturer provides a second housing (housing R adjacent to the second connector CN_2) capable of housing a second card that is electrically connected to the second pin and capable of electrically performing electrical processing having a second function when electrically connected to the third pin, and which is electrically connected to the second connector CN_2, in a position capable of holding the electrically connected second card (Step ST12: Step of providing the second housing in a position capable of holding the second card). Here, a satellite-mounted device 1 is manufactured, which includes a backboard 10 having pin assignments on each connector that allow for the connection of a second card. (End)
[0043] (Mechanism of Action and Effects) According to the satellite-mounted equipment of this disclosure, the backboard 10 comprises a first connector CN_1 including a first pin and a second pin, and a second connector CN_2 including a third pin. The satellite-mounted equipment 1 further comprises a first housing section (housing section R) capable of housing a first card which is electrically capable of electrical processing having a first function when electrically connected to the first pin and is electrically connectable to the first connector CN_1. In addition, the satellite-mounted equipment 1 comprises a second housing section (housing section R) capable of housing a second card which is electrically capable of electrical processing having a second function when electrically connected to the second pin and also electrically capable of electrical processing having a second function when electrically connected to the third pin and is electrically connectable to the second connector CN_2. In this configuration, the first connector CN_1 is connectable to the second card, allowing the functions of the second card to be performed via the first connector. In addition, the second card can be connected to both the first connector CN_1 and the second connector CN_2. That is, depending on the performance required of the satellite, the second card is appropriately connected to the backboard 10, thereby adding the functions performed by the second card to the satellite as appropriate. Therefore, the satellite-mounted equipment related to this disclosure is easily modified to allow for additions or changes to the satellite's functions.
[0044] Furthermore, when a particular function becomes unnecessary for the satellite, the second card is removed from the backboard 10, allowing the functions previously performed by the second card to be reconfigured or reallocated within the satellite.
[0045] A positioning satellite system consists of multiple satellites. Within this system, the addition or replacement of specific satellites may be considered. In such cases, efforts may be made to add functions to specific satellites or improve their performance. However, because it was difficult to ensure expandability, reconfigurability, and flexibility in the equipment on each satellite constituting the positioning satellite system, many onboard devices were often designed from the outset.
[0046] The satellite-mounted equipment 1 described herein is equipped with a backboard 10 in which the pin assignments of each connector are common. By having equipment (module MO) connected to the satellite 100 have a common interface corresponding to specific pins of each connector, it becomes easier to add functions to the satellite 100 or to improve performance by adding equipment. Furthermore, because each module MO has a common interface, it is difficult to design the onboard equipment from the outset.
[0047] Furthermore, the satellite-mounted equipment 1 of this disclosure comprises a backboard 10 having a first connector CN_1 including a first pin and a second pin, and a second connector CN_2 including a third pin; a first housing (housing section R) capable of accommodating a first card (first module MO_1) that has a first function when connected to the first pin and is capable of electrical processing, and is electrically connectable to the first connector CN_1; and a second housing (housing section R) capable of accommodating a second card (second module MO_2) that has a second function when connected to the second pin and is capable of electrical processing when connected to the third pin and is electrically connectable to the second connector CN_2, wherein the first connector CN_1 is connectable to the second card (second module MO_2), thereby achieving the following effects. The satellite-mounted device 1 of this disclosure comprises a backboard 10 which includes a first connector CN_1 including a first pin and a second pin, and a second connector CN_2 including a third pin. The satellite-mounted device 1 further comprises a first housing section (housing section R) capable of housing a first card which is electrically capable of electrical processing having a first function when electrically connected to the first pin and is electrically connectable to the first connector CN_1. In addition, the satellite-mounted device 1 comprises a second housing section (housing section R) capable of housing a second card which is electrically capable of electrical processing having a second function when electrically connected to the second pin and also electrically capable of electrical processing having a second function when electrically connected to the third pin and is electrically connectable to the second connector CN_2. In this configuration, the first connector CN_1 can be electrically connected to the second card, thereby enabling the second card to function through the first connector. In addition, the second card can be electrically connected to both the first connector CN_1 and the second connector CN_2. This allows for the following effect: "In the satellite-mounted equipment of this disclosure, the second card is appropriately mounted on the backboard 10 according to the performance required of the satellite, thereby appropriately adding the functions performed by the second card to the satellite." Therefore, the satellite-mounted equipment related to this disclosure makes it easy to add or modify the functions of the satellite.
[0048] Furthermore, when a particular function becomes unnecessary for the satellite, the second card is removed from the backboard 10, allowing the functions previously performed by the second card to be reconfigured or reallocated within the satellite.
[0049] In addition, the satellite-mounted equipment 1 of this disclosure provides the further benefit that "a common electrical signal can be conducted to the second and third pins," thereby "the function of the second card can be performed at the first connector. Furthermore, the second card can be easily electrically connected to both the first connector CN_1 and the second connector CN_2."
[0050] In addition, the satellite-mounted equipment 1 of this disclosure also has the effect that, by having the second pin and the third pin aligned in the first direction (X direction), the positions of the second and third pins become easier to determine, and the second card is more easily electrically connected to the first connector CN_1 and the second connector CN_2, respectively.
[0051] In addition, the satellite-mounted equipment 1 of this disclosure has the further effect that, because "the first connector and the second connector are aligned in the first direction (X direction)", "the positions of the second and third pins are easier to determine, and the second card is easier to electrically connect to the first connector CN_1 and the second connector CN_2, respectively."
[0052] In addition, the satellite-mounted equipment 1 of this disclosure further provides the effect that "the second connector includes a fourth pin that can be physically connected to the second card, and when the distance between the first pin and the second pin is defined as the first distance, and the distance between the third pin and the fourth pin is defined as the second distance, the first distance and the second distance are equal," thereby "making it easier to determine the positions of the second and third pins, and making it easier to electrically connect the second card to the first connector CN_1 and the second connector CN_2, respectively."
[0053] In addition, the satellite-mounted equipment 1 of this disclosure also has the effect that "the second card is capable of signal processing of signals acquired from mission equipment," which makes it "easier to add or modify the functions of the satellite."
[0054] In addition, the satellite-mounted equipment 1 of this disclosure also has the effect that "the second card can process RF signals through its second function," which makes it "easier to add or modify functions to the satellite."
[0055] In addition, the satellite-mounted equipment 1 of this disclosure also has the effect that "the second card is capable of signal processing of signals acquired from bus equipment," which makes it "easier to add or modify functions to the satellite."
[0056] (modified version) The steps described herein can be rearranged as appropriate. For example, the order in which the first storage unit is positioned to hold an electrically connected first card (step S11) and the second storage unit is positioned to hold an electrically connected second card (step S12) may be reversed.
[0057] <Second Embodiment> An embodiment of this disclosure will be described below with reference to the figures. An example of the configuration of satellite-mounted equipment in this disclosure will be explained below with reference to Figure 9.
[0058] (composition) The satellite-mounted equipment 1m comprises a backboard 10m having a first connector CN_1m including a first pin and a second pin, and a second connector CN_2m including a third pin; a first housing R_1m capable of accommodating a first card that has a first function when connected to the first pin and is electrically connectable to the first connector CN_1m; and a second housing R_2m capable of accommodating a second card that has a second function when connected to the second pin and is electrically connectable to the second connector CN_2m, wherein the first connector CN_1m is connectable to the second card.
[0059] (Mechanism of Action and Effects) According to the satellite-mounted equipment of this disclosure, the backboard 10m comprises a first connector CN_1m including a first pin and a second pin, and a second connector CN_2m including a third pin. The satellite-mounted equipment 1m further comprises a first housing (housing R_1m) capable of housing a first card which has a first function when electrically connected to the first pin and is capable of electrical processing when electrically connected to the first connector CN_1m. In addition, the satellite-mounted equipment 1m comprises a second housing (housing R_2m) capable of housing a second card which has a second function when electrically connected to the second pin and is capable of electrical processing when electrically connected to the third pin and is capable of electrical processing when electrically connected to the second connector CN_2m. In this configuration, the first connector CN_1m can be electrically connected to the second card, thereby enabling the second card to perform its functions via the first connector CN_1m. In addition, the second card can be electrically connected to both the first connector CN_1m and the second connector CN_2m. In other words, depending on the performance required of the satellite, the second card can be appropriately connected to the backboard 10m, thereby adding the functions performed by the second card to the satellite as appropriate. Therefore, the satellite-mounted equipment related to this disclosure makes it easy to add or modify the functions of the satellite.
[0060] Furthermore, when a particular function becomes unnecessary for the satellite, the second card is removed from the backboard 10, allowing the functions previously performed by the second card to be reconfigured or reallocated within the satellite.
[0061] <Third Embodiment> An embodiment of this disclosure will be described below with reference to the figures. An example of a method for manufacturing satellite-mounted equipment as described in this disclosure will be explained below with reference to Figure 10. The method for manufacturing satellite-mounted equipment described in this disclosure is carried out according to the flow shown in Figure 10.
[0062] A method for manufacturing equipment for mounting on an artificial satellite includes the steps of: providing a first connector including a first pin and a second pin, and a second connector including a third pin on a backboard (step ST10m); providing a first housing capable of accommodating a first card that has a first function when connected to the first pin and is electrically connectable to the first connector, in a position capable of holding the electrically connected first card (step ST11m); and providing a second housing capable of accommodating a second card that has a second function when connected to the second pin and is electrically connectable to the second connector, in a position capable of holding the electrically connected second card (step ST12m), wherein the first connector is connectable to the second card.
[0063] (Mechanism of Action and Effects) According to the method for manufacturing satellite-mounted equipment of this disclosure, a backboard is provided with a first connector including a first pin and a second pin, and a second connector including a third pin. A first housing is provided, which is capable of electrical processing having a first function when electrically connected to the first pin, and which can accommodate the first card that can be electrically connected to the first connector. In addition, a second housing is provided, which is capable of electrical processing having a second function when electrically connected to the second pin, and also capable of electrical processing having a second function when electrically connected to the third pin, and which can accommodate the second card that can be electrically connected to the second connector. In this configuration, the first connector is electrically connectable to the second card, allowing the second card to perform its functions via the first connector. Furthermore, the second card is electrically connectable to both the first and second connectors. In other words, depending on the performance requirements of the satellite, the second card is appropriately connected to the backboard 10, thereby adding the functions provided by the second card to the satellite as appropriate. Therefore, the method for manufacturing satellite-mounted equipment described herein makes it easy to add or modify the functions of the satellite.
[0064] Furthermore, when a particular function becomes unnecessary for the satellite, the second card is removed from the backboard, allowing the functions previously performed by the second card to be reconfigured or reallocated within the satellite.
[0065] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure can be made as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.
[0066] Some or all of the above embodiments may also be described as follows, but are not limited to the following:
[0067] (Note 1) A backboard comprising a first connector including a first pin and a second pin, and a second connector including a third pin, A first card capable of performing electrical processing that has a first function when connected to the first pin, comprising a first housing capable of housing a first card that can be electrically connected to the first connector, A second card capable of performing electrical processing having a second function when connected to the second pin, and capable of performing electrical processing having a second function when connected to the third pin, comprising a second housing capable of housing a second card that can be electrically connected to the second connector, Equipped with, The first connector is connectable to the second card. Equipment onboard satellites.
[0068] (Note 2) A common electrical signal can be conducted through the second pin and the third pin. Equipment for satellites as described in Appendix 1.
[0069] (Note 3) The second pin and the third pin are aligned in the first direction. Equipment for mounting on artificial satellites as described in Appendix 1 or Appendix 2.
[0070] (Note 4) The first connector and the second connector are arranged in the first direction. Equipment for satellites as described in Appendix 3.
[0071] (Note 5) The second connector includes a fourth pin that can be physically connected to the second card, The distance between the first pin and the second pin is defined as the first distance. When the distance between the third pin and the fourth pin is defined as the second distance, The first distance and the second distance are equal. Equipment for mounting on artificial satellites as described in any one of the appendices 1 to 4.
[0072] (Note 6) The aforementioned second card is capable of processing signals acquired from the mission equipment. Equipment for mounting on artificial satellites as described in any one of the appendices 1 to 5.
[0073] (Note 7) The second card is capable of processing RF signals through the second function. Equipment for satellites as described in Appendix 6.
[0074] (Note 8) The aforementioned second card is capable of signal processing of signals acquired from bus equipment. Equipment for mounting on artificial satellites as described in any one of the appendices 1 to 5.
[0075] (Note 9) Equipment for satellites listed in any one of the appendices 1 to 8, A housing for storing the equipment mounted on the artificial satellite, Equipped with, artificial satellite.
[0076] (Note 10) The second card further comprises, The artificial satellite described in Appendix 9.
[0077] (Note 11) The housing further comprises a heat dissipation member that receives heat from the housing, The backboard and the heat dissipation member are thermally connected via the housing. The artificial satellites described in Appendix 9 or Appendix 10.
[0078] (Note 12) The heat dissipation member receives heat from the housing via the mounting surface. The second card is mounted on the backboard 10 in a direction intersecting the aforementioned mounting surface. The artificial satellite described in Appendix 11.
[0079] (Note 13) The steps include providing a first connector including a first pin and a second pin, and a second connector including a third pin, on the backboard, A first card capable of performing electrical processing that has a first function when connected to the first pin, comprising the step of providing a first housing portion capable of housing the first card that can be electrically connected to the first connector, in a position capable of holding the electrically connected first card, A second card capable of performing electrical processing having a second function when connected to the second pin, and capable of performing electrical processing having a second function when connected to the third pin, wherein a second housing portion capable of housing the second card that can be electrically connected to the second connector is provided in a position capable of holding the electrically connected second card, Includes, The first connector is connectable to the second card. A method for manufacturing equipment for use on artificial satellites. [Explanation of Symbols]
[0080] 100 satellites 1 Equipment onboard satellites 1m Satellite onboard equipment 3 Housing 4 Heat dissipation components 4s mounting surface 10 Backboard 10s mounting surface 10m backboard CN_M Multiple connectors CN connector CN_1 First Connector CN_2 Second connector CN_3 Third Connector CN_4 Fourth connector CN_5 Fifth Connector CN_6 Sixth Connector CN_N Nth connector CN_1m First Connector CN_2m Second connector MO_M Multiple modules MO Module MO_1 First Module MO_2 Second Module MO_3 Third Module MO_4 Fourth Module MO_5 Fifth Module MO_6 Sixth Module R_M Multiple storage compartments R containment section R_1m First containment area R_2m Second containment area FX function FX function SM support member TR transmission pathway
Claims
1. A backboard comprising a first connector including a first pin and a second pin, and a second connector including a third pin, A first card capable of performing electrical processing that has a first function when connected to the first pin, comprising a first housing capable of housing a first card that can be electrically connected to the first connector, A second card capable of performing electrical processing having a second function when connected to the second pin, and capable of performing electrical processing having a second function when connected to the third pin, comprising a second housing capable of housing a second card that can be electrically connected to the second connector, Equipped with, The first connector is connectable to the second card. Equipment onboard satellites.
2. A common electrical signal can be conducted through the second pin and the third pin. The satellite-mounted equipment according to claim 1.
3. The second pin and the third pin are aligned in the first direction. The satellite-mounted equipment according to claim 1 or claim 2.
4. The second connector includes a fourth pin that can be physically connected to the second card, The distance between the first pin and the second pin is defined as the first distance. When the distance between the third pin and the fourth pin is defined as the second distance, The first distance and the second distance are equal. The satellite-mounted equipment according to claim 1 or claim 2.
5. The aforementioned second card is capable of processing signals acquired from the mission equipment. The satellite-mounted equipment according to claim 1 or claim 2.
6. The second card is capable of processing RF signals through the second function. The satellite-mounted equipment according to claim 5.
7. The aforementioned second card is capable of signal processing of signals acquired from bus equipment. The satellite-mounted equipment according to claim 1 or claim 2.
8. The satellite-mounted equipment according to claim 1 or claim 2, A housing for storing the equipment mounted on the artificial satellite, Equipped with, artificial satellite.
9. The second card further comprises, The artificial satellite according to claim 8.
10. The steps include providing a first connector including a first pin and a second pin, and a second connector including a third pin, on the backboard, A first card capable of performing electrical processing that has a first function when connected to the first pin, comprising the step of providing a first housing portion capable of housing the first card that can be electrically connected to the first connector, in a position capable of holding the electrically connected first card, A second card capable of performing electrical processing having a second function when connected to the second pin, and capable of performing electrical processing having a second function when connected to the third pin, wherein a second housing portion capable of housing the second card that can be electrically connected to the second connector is provided in a position capable of holding the electrically connected second card, Includes, The first connector is connectable to the second card. A method for manufacturing equipment for use on artificial satellites.
Citation Information
Patent Citations
Artificial satellite structure
JP2003291898A