De-icing system and control

Abstract

The present invention provides a method and system for heating the outer surface of bulk media such as aircraft. [Solution] The system includes a series of individual heating elements, sensors, and a control system. The heating elements are located on the aircraft's outer skin. The sensors are located on the outer skin at locations corresponding to relatively low-temperature regions within the heating pattern generated by the heating elements. The control system is connected to the heating elements and sensors. The control system is configured to control the power supplied to the heating elements in response to the output from the sensors.

Description

[Technical Field]

[0001] This invention relates to a heating system for conductive materials. [Background technology]

[0002] Many conductive surfaces in cars, aircraft, satellites, etc., are exposed to low temperatures and freezing conditions during daily use. When ice or water accumulates on the conductive surfaces of these structures, it can lead to inefficient or dangerous operation. A condition can occur. For example, if ice accumulates on the wings of an aircraft, lift will decrease and drag will increase. The number may increase.

[0003] Many of these structures either lack heating systems or contain bulky electronics or other equipment. It is equipped with a heating system that requires use. The use of such bulky devices is industry This is a challenge for them. [Overview of the Initiative]

[0004] This invention discloses techniques for heating conductive surfaces. These techniques generally involve high Using a frequency alternating current ("AC") signal (e.g., 1 kHz or higher), a conductive bulk medium (e.g.) For example, the current density in a target region of a conductive material is shaped, generating Joule heat in the medium.

[0005] Joule heating, also known as ohmic heating or resistance heating, is the process of generating heat by passing an electric current through a conductor. It is a process that generates heat. The amount of heat generated by a conductive medium is equal to the amount of current passing through the medium. It is based on the quantity and electrical resistance of the medium. As a result, heating depends on the current, voltage, resistance, or combination thereof. The combination can be controlled (for example, increased or decreased) by adjusting its properties.

[0006] The resistance of a given conductor limits the volume within the conductor through which current can flow, and increases the length through which the current can travel. This can be increased by doing so. Embodiments of the present invention are, for example, close to the skin effect. By utilizing the contact effect, the electric current within a conductive medium (e.g., bulk medium, conductor) is shaped (for example) By manipulating mechanisms (such as contraction and extension), heat is generated within the bulk medium. It can be configured in this way. Both effects involve high-frequency AC current being applied to the conductive medium being heated. It depends on the flow of current. The skin effect is that the current density increases near the surface of the conductor and within the conductor. By utilizing the tendency for alternating current to decrease with increasing depth within a conductor, the current... Suppress the flow. Using the proximity effect, another AC current can be placed near an existing current flowing through a conductor. By arranging the path, the current flowing through the conductor can be further suppressed. (Proximity effect) It also has the function of lengthening the current path.

[0007] For example, an embodiment of the present invention suppresses the flow of current along the current path, It is configured to increase the resistance of the bulk medium along the current path through the bulk medium. As a result, this embodiment provides the conductive medium with increased heating performance while simultaneously generating heat. This reduces the current required to perform the operation along a specific current path. By increasing the effective resistance of the conductive medium, it is necessary to generate Joule heat within the medium. The required current can be reduced compared to the case where it is not needed.

[0008] The subject matter described herein is intended to achieve one or more of the following advantages. This can be done by using a lighter and smaller electrical system to heat the conductor. It can be done. Furthermore, heating can be localized to the target area, and overheating of the heating system circuit does not occur. This heating system, for example, instead of generating heat with a heating element or a heating layer attached to a bulk medium, can be more efficient by directly generating heat in the bulk medium itself (e.g., an aircraft wing). This system also requires less current and voltage for heating, and there is a possibility of improving safety and reliability. In some embodiments the stress of components can also be reduced. This system can be simpler, faster, or less expensive for installation or modification. This system can be less expensive and also easier to maintain. This system can be non-invasive when retrofitting an existing system . This system enables faster de-icing. The details of one or more embodiments of the subject matter of this specification are described in the accompanying drawings and the following description. Other features, aspects, and advantages of the subject matter will become apparent from this description, the drawings, and the claims .

Brief Description of the Drawings

[0009] It is a plot showing the increase in the concentration of current density due to the skin effect as a function of the applied AC current. Figures 4A - D are schematic diagrams showing an exemplary configuration for heating a bulk medium by concentrating the current density in a second direction of a bulk conductor using the proximity effect.

[0010] [Figure 1] [Figure 2] [Figure 3] [Figure 4] [Figure 5]Figures 5A - B are simulation diagrams showing the increase in the concentration of the current density of the bulk conductor adjacent to the second conductor as a function of the distance between conductors due to the proximity effect. [Figure 6] Figure 6A is a schematic diagram of an exemplary configuration for heating a bulk medium using an array of electrodes. Figures 6B - 6D are schematic diagrams of exemplary configurations for heating a bulk medium using various electrode arrangements. [Figure 7] Schematic diagram of an exemplary signal conversion unit ( "STU") including a standard power conversion ( "TSP") and an AC generation ( "ACG") main subunit. [Figure 8] Schematic diagram of an exemplary STU including TSP, ACG, and a control main subunit. [Figure 9] Figure 9A is a schematic diagram of an exemplary TSP subunit including a flyback converter and a common - mode choke. Figure 9B is a schematic diagram of an exemplary flyback converter. [Figure 10] Figure 10A is a schematic diagram of an exemplary ACG subunit including a class - D amplifier with a dual MOSFET transistor, a temperature - controlled crystal oscillator ( "TCXO"), and a gate driver. Figure 10B is a schematic diagram of an exemplary class - D switch - mode amplifier. Figure 10C is a schematic diagram of an exemplary ACG subunit including a class - D amplifier with a dual MOSFET transistor, TCXO, gate driver, and a low - power conversion stage ( "LPC"). [Figure 11] Schematic diagram of an exemplary control subunit including a microcontroller and LPC. [Figure 12] Diagram of an impedance - matching network between a power source and a load. Figures 13A - D are schematic diagrams of the building blocks of an exemplary impedance - matching network. [Figure 14] Schematic diagram of an exemplary adjustment network unit including a passive adjustment subunit. [Figure 15]Figure 15A is a schematic diagram of an exemplary tuning network unit, including an active tuning subunit and a control subunit. Figure 15B is a schematic diagram of an exemplary tuning network unit, including an active tuning subunit, an LPC, and a control subunit. [Figure 16] This is a schematic diagram of the cable section in an exemplary heating system. [Figure 17] This is a schematic diagram of an exemplary electrode for a heating system. [Figure 18A] This is a schematic diagram of an example brazed joint between an electrode and a bulk medium. [Figure 18B] This is a schematic diagram illustrating an example of riveted fastener installation between an electrode and a bulk medium. [Figure 18C] This is a schematic diagram illustrating an example of air seal tape installation between an electrode and a bulk medium. [Figure 18D] This is a schematic diagram of an exemplary combination mounting between an electrode and a bulk medium. [Figure 19] This is a cross-sectional view of an exemplary coupling strip for providing a high-frequency heating signal to a bulk medium as a result of implementing the present disclosure. [Figure 20] Figure 19 shows an exemplary layout of the connecting strips placed on the wing of an aircraft. [Figure 21] Several exemplary top views of bonding strips are shown to illustrate the various configurations of the conductive layers within the bonding strip. [Figure 22A] The graph shows the simulated current density generated in the aircraft skin by an exemplary coupling strip, and the electric field density between the coupling strip and the aircraft skin. [Figure 22B] Figure 22A shows a plot of the simulated current density generated in the aircraft skin. [Figure 23] The following are layout diagrams of several exemplary conductive layer arrangements within a bonding strip. [Figure 24A] Figure 23 shows a cross-sectional view of the connecting strip along line AA according to layout A. [Figure 24B]Figure 23 shows a cross-sectional view of the connecting strip along line BB according to layout B. [Figure 24C] Figure 23 shows a cross-sectional view of the connecting strip along the CC line according to layout C. [Figure 25A] A cross-sectional view of an exemplary configuration for attaching a bonding strip to a bulk medium is shown. [Figure 25B] A cross-sectional view of another exemplary configuration for attaching the bonding strip to the bulk medium is shown. [Figure 26A] This is a cross-sectional view of a bonding strip with a double-sided adhesive bottom layer before being installed in a bulk medium. [Figure 26B] This is a cross-sectional view of the bonding strip shown in Figure 26A, placed on a bulk medium. [Figure 27] Figures 27A to 27F show cross-sectional views of various embodiments of the embedded bonding strip. [Figure 28] This is a diagram showing an embodiment of a coupling strip connector. [Figure 29] This figure shows another embodiment of the coupling strip connector. [Figure 30] This is a block diagram of a first exemplary bulk medium heating system utilizing a bonding strip as a result of the implementation of this disclosure. [Figure 31] This is a block diagram of a second exemplary bulk medium heating system utilizing a bonding strip according to an embodiment of the present disclosure. [Figure 32] This is a block diagram of a third exemplary bulk medium heating system utilizing a bonding strip as a result of implementing the present disclosure. [Figure 33] This diagram illustrates a portion of an aircraft pilot's field of view, along with a wing temperature overlay. [Figure 34] This figure shows the time-domain reflectance measurement (TDR) method. [Figure 35] Figure 35A is a plot showing a comparison of two transmission lines measured by TDR, one of which includes a 2-meter connector. Figure 35B is a plot showing a frequency domain analysis illustrating the impedance change associated with a dent caused by impact. [Figure 36] This plot shows a comparison of two transmission lines measured by TDR, with one transmission line having a depression in its test panel. [Figure 37] Figures 37A, 37B, and 37C illustrate exemplary cockpit notification displays. [Figure 38] A schematic diagram of an exemplary embodiment of a coupling strip composed of fault sense lines is shown. [Figure 39] Figure 39A shows a schematic diagram of another exemplary embodiment of a coupling strip composed of fault sense lines. Figure 39B shows a schematic diagram of yet another exemplary embodiment of a coupling strip composed of fault sense lines. [Figure 40] The graph shows the impedance and temperature of the coupling strip as a function of time during the de-icing operation. [Figure 41] This is a 3D plot of the dielectric constant of an exemplary acrylic adhesive material against a certain range of operating temperatures. [Figure 42] This is a plot of the dielectric constant of an exemplary acrylic adhesive material against a certain range of operating temperatures. [Figure 43] The frequency responses of the unobstructed and obstructed lines are plotted. The same reference numbers and names in the various figures indicate similar elements. [Modes for carrying out the invention]

[0011] The heating system of the present invention uses AC current to heat conductive materials (e.g., aluminum, carbon This method increases the effective electrical resistance of fiber composite materials, making them easier to heat. Furthermore, the heat generated in the conductive material is used to melt the ice that has formed on the surface of the conductive material. This can be done. This heat keeps the conductive material at a high temperature and prevents vapor from accumulating on the surface, This is to prevent water from freezing on surfaces, as well as to prevent freezing rainfall (e.g., snow, freezing rain, fog, ice crystal rain). ) can be used to prevent ice from forming on the surface. For example, when generated on conductive materials Heat can be conducted (e.g., spread) throughout the entire conductive material. Furthermore, the generated heat This causes convection across the interface between the conductive material and the liquid on its surface, for example, when adding a liquid. Heating can prevent freezing.

[0012] By using alternating current, several electromagnetic effects are induced that increase the effective resistance of conductive materials. This allows us to utilize the Joule heating of conductive materials to promote heat generation. These effects include the skin effect, proximity effect, induction, eddy currents, hysteresis loss, and This includes dielectric loss. If the frequency of the current in the conductor is set to a sufficiently high value, Due to the skin effect, most of the current is transmitted through conductive materials that are significantly thinner than the geometric thickness of the conductive material. It passes through the skin. Furthermore, using a specific device geometry, proximity effect occurs within the conductive material. This can be produced, and this effect further suppresses the range of current density, thereby the conductive material This further increases the effective resistance along the current path within the material. These two effects are beneficial for conductive materials. They can be used together to increase the electrical resistance and generate Joule heat.

[0013] For example, Joule heating generally refers to the heat generated by passing an electric current through a conductor. The heat generated in a constant current-carrying conductor is the product of the material's resistance and the root mean square of the square of the current's amplitude:

number

[0014] The heat output from a heating element is generally generated by increasing the current passing through a conductor. This can be increased by using a heat-generating element with relatively high resistance. However, the implementation of this disclosure The form utilizes specific electromagnetic phenomena (e.g., the skin effect and proximity effect) within the bulk medium. By contracting the current density of the local current, Joule heat is generated. The contraction increases the effective resistance along the current path within the bulk medium. Individual effects are... Although it may vary depending on the material and shape, for a specific length along the current path through the bulk medium Effective resistance can generally be expressed as follows:

number

[0015] Some embodiments of this disclosure use these electromagnetic phenomena to enable current flowing through a bulk medium. The length of the path can be increased. For example, as explained below with reference to Figure 4D. Furthermore, using the techniques described herein, the electrical current between two electrodes attached to a bulk medium is The flow path can be "guided" along a non-orthogonal path (for example, a meandering path). The path is generated, for example, by a current flowing between two electrodes in the absence of electromagnetic effects such as the proximity effect. The effective length (l) is generally longer than the substantially straight path. eff ) generates a current path having It is possible. Therefore, the system described herein has a current path length l, The current has a longer orthogonal path than the one it would take in the absence of the various systems and conductor arrangements described in the book. Effective length (l eff ) can be increased to . Therefore, such an embodiment is a val Effective cross-sectional area (A) of the current flowing through the medium eff ) contraction and current passing through bulk medium Excessive effective length (l eff By both increasing the effective resistance (R), eff ) increase This allows the effective resistance of the bulk medium to the DC current of the bulk medium. The effective resistance can be increased even further. In such embodiments, the effective resistance is In general, it can be expressed as follows:

number

[0016] As used herein, the skin effect generally refers to the phenomenon where alternating current is unevenly distributed within a conductor. The density is higher near the surface of the conductor and decreases as the distance to the surface of the conductor increases. This refers to a tendency. The strength of the skin effect increases with the frequency of the current and the conductivity of the material carrying the current. Some embodiments of this disclosure describe a conductor whose outer surface (for example,) is exposed to a current at a higher AC frequency. The epidermal effect can be adjusted to allow more fluid to flow through the "epidermal thickness."

[0017] In general, the skin effect of a conductor can be expressed by the following equation:

number

Equation

[0018] In the case of an infinitely long and wide rectangular plate through which surface current flows, the skin effect can be expressed by the following formula. It can be expressed.

Equation

[0019] For example, the chart shown in Figure 3 and described in detail below shows an example of the current density contraction within the depth of the material (e.g., skin depth) caused by the skin effect. As shown in Figure 3 and described in detail below, the chart shows an example of the current density contraction within the depth of the material (e.g., skin depth) caused by the skin effect.

[0020] As used herein, the proximity effect generally refers to the influence of an AC current flowing through a first current path (e.g., a conductor) on the current density of an AC current flowing through a nearby second current path. For example, as shown in Figures 5A-5B and described in detail below, the AC current in the first current path concentrates or contracts the density of the AC current in the second current path around the first current path. For example, as shown in Figures 5A-5B and described in detail below, the AC current in the first current path <00​​In embodiments of this disclosure, for example, the density of current passing through the bulk medium is bulk When another conductor carrying AC current is placed near the current passing through the medium, the other conductor carrying AC current It is "pulled" toward the conductor. Contraction of current density caused by proximity effect. For example, the degree and direction of concentration are determined by several variables, such as two or more AC current paths. The distance between them, the relative direction of current flowing through each current path, and the frequency of the AC current in the current path. It depends on the number of currents and the magnitude of the individual currents in the current path.

[0021] For clarity, the heating system of this disclosure is a de-icing and anti-icing system for the outer surface of an aircraft. This will be explained in relation to an exemplary situation of the Tem. However, the heating system of this disclosure is other In situations such as other aircraft, drones, wind turbines, cryogenic devices, heat pumps, and Trains, radio towers, railway track surfaces, manned or unmanned military vehicles, roofs, or ice or water formations It can be used to heat other conductive surfaces that benefit from the suppression of formation, but These are not the only uses. This heating system can be used for de-icing or ice prevention. In some embodiments, this heating system is used, for example, to heat a conductive material on or inside a non-conductive material. By adding a layer, it can be used to heat low-conductivity materials. Embodiments include roads (such as private roads), building materials, roofs, floors, or other low- or non-conductive materials. It can be used to heat the surface of a material.

[0022] As used herein, de-icing generally refers to the removal of snow, ice, or frost from the surface (collectively referred to as "ice"). This refers to the removal of (the existing) on ​​the conductive surface. In some embodiments, the heating system is used to remove the existing It would be enough if we could melt a portion of the ice. After that, the ice (for example, the melting process begins, and the ice and When the surface bonds break, it is removed from the surface (by sliding off).

[0023] The de-icing methods used herein generally refer to the formation of snow, ice, or frost (collectively referred to as "ice"). Or it refers to preventing adhesion to the surface. In some embodiments, the heating system is (for example) (From freezing rainfall such as snow, frost, freezing rain, and ice crystal rain) ice builds up on the surface. Maintain a surface temperature high enough to prevent accumulation or formation.

[0024] Figure 1 shows a block diagram of an exemplary heating system 100 for heating a bulk medium. The heating system 100 is coupled to the electrodes 116 and 118 with a power control system 104 This includes electrodes 116 and 118, which are located in a target area of ​​the bulk medium 102 (e.g., an aircraft wing). The power control system 104 is connected to a wire (or path or cable). ) 106, bulk medium 102, and finally via wire (or return path) 108 It generates alternating current (AC current) (for example, with a frequency of 1 kHz or higher) across the closed / open circuit. The direction of the current 112 flowing through the tube is indicated by the dashed arrow.

[0025] In some embodiments, the heating system 100 includes a power control system 104 and an electrode 1 Includes 16 and 118, and dedicated cables (e.g., wires 108 and 106). This is possible, but is not limited to these. In some embodiments, the heating system is electrode 1 It is configured to be coupled to 16 and 118. In some embodiments, heating The stem is configured to be connected to a special cable (e.g., 108 or 116). In some embodiments, the power control system 104 includes a signal generation unit and a power supply. , signal conversion unit, impedance adjustment network, control unit, and sensors It may include, but is not limited to, certain configurations described in detail below. As detailed below, in some embodiments, the impedance matching network is It is a impedance-matched network.

[0026] In some embodiments, electrodes 116 and 118 are contact electrodes. For example, electrode 1 16 and 118 are physically connected to the bulk medium 102 and are controlled by the power control system 104. The current is conducted to the bulk medium. In some embodiments, electrodes 116 and 118 are It can be bonded to the bulk medium 102, but it can be electrically isolated from the bulk medium 102. It is also possible to do so. For example, in such an embodiment, electrodes 116 and 118 are bulk media Current is supplied to the bulk medium 102 as the input and output of an induction coil positioned in close proximity to 102. It can be guided by energy.

[0027] The power control system 104 adjusts the skin effect between electrodes 116 and 118. A current high enough (e.g., 1 kHz or higher) to contract the current flow in the z direction between them This can be supplied to create high resistance in the bulk medium 102. Power control system 10 4 can provide AC current with frequencies from 1kHz to 300GHz. In some embodiments, the current frequency is 100 kHz to 450 MHz. The current frequencies are 1MHz~50MHz, 100MHz~150MHz, 200MHz~ In the range of 300MHz, 400MHz to 500MHz, or 800MHz to 1GHz be.

[0028] In some embodiments, the return path 108 is located close to the surface of the bulk medium 102. The return path 108 to the surface of the bulk medium is positioned in close proximity to the electrode 116 and It can be used to adjust the proximity effect of the current flowing between 118, thereby, This can further suppress flow and increase heating within the bulk medium by utilizing proximity effects. To shape the current flowing between electrodes 116 and 118, from the heating system circuit itself It is not necessary to use the return current path 108. In some embodiments, a different current path The path 122 (for example, from a different circuit) is placed in close proximity to the bulk medium 102 (for example, at a distance of 1 20a) This can be done. For example, current path 108 or 12 from bulk medium 102. If the distance 120 or 120a between the two is sufficiently small, the proximity effect can be used to move the bulk medium. This allows for further suppression of the current flowing through the circuit.

[0029] For example, the distance 120 (or 120) between the bulk medium and path 108 (or 122) a) To generate the proximity effect, the distance must be less than 1m, or less than 50cm, or less than 10cm. It can be made to the fullest extent. If a closer distance is possible after carefully considering the design constraints, (For example, if the wing of an airplane is a bulk medium, the ribs or spars of the airplane are return-to-the-plane (As long as it doesn't obstruct roads 108 / 122), distance 120 (or 120a) is 25cm less It can be full or less than 10 cm.

[0030] Bulk medium 102 is aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, This may include, but is not limited to, materials such as steel. For example, the bulk medium is the fuselage, Any part of the aircraft's fuselage, such as wings, understructure, or tail (for example, as the "skin" of the aircraft) It can also be the outermost shell or surface of an aircraft.

[0031] The electrodes (116 and 118) are made of aluminum, silver, copper, alloys thereof, or other conductive materials. This may include, but is not limited to, electrolytic materials. In some embodiments, electrode materials It has at least the same conductivity as the bulk medium 102. In some embodiments, Poles 116 and 118 can be placed in the electrode array. The electrodes are in the bulk medium. Various methods, for example, by bonding to the top or bottom surface of the medium, or by embedding it within the medium. It is possible.

[0032] The heating system 100 shapes the density of the current flowing through the medium, thereby controlling the bulk medium It is configured to produce effective resistance through 102. In other words, for aircraft applications, The existing aircraft airframe is used as part of the electrical circuitry for the heating system. Heating system 10 0 adjusts the density of the current by adjusting the skin effect, proximity effect, or a combination thereof. The degree is formed, and the effective resistance of the bulk medium 102 along the current path between electrodes 116 and 118 This increases the proximity effect, for example, as seen in Figure 4D. The current path can also be directed to heat a desired portion of the bulk medium. The desired heating area may be called the "target heating location" or "target location".

[0033] In some embodiments, an alternating current with a frequency of 1 kHz or higher is supplied to the aircraft fuselage. It can be passed through directly. As a result, Joule heat is generated in the part of the machine near the surface through which the current flows. Furthermore, the heat generated by the electric current spreads throughout the bulk medium 102 by conduction. ru.

[0034] Referring to Figures 2A-2B, the heating system 100 utilizes the skin effect to reach the target region of the medium. The current density passing through region 102 is formed. Similar to Figure 1, the AC current (direction 212) is bulk It is supplied between electrodes 116 and 118 through the target region of medium 102. Figure 2A shows the epidermis. If it is ineffective (for example, at current frequencies below 1 kHz), the target of bulk medium 102 This is a schematic diagram showing the current density 202 profile (e.g., side view) passing through the region. The current flows in the y direction (212), and most of the current flows within the volume of the medium 102 indicated by the arrow. For example, the current has a depth of approximately 2 mm, for example, almost the entire thickness of the bulk medium. Thus, Figure 2A shows that there is little or no shaping of the current density due to the skin effect. This demonstrates the operation of Stem 100.

[0035] Figure 2B shows the result of applying a high-frequency AC current (e.g., 1 kHz or higher) between the electrodes. This is a schematic diagram of the current density profile of 202. Figure 2B shows the current density due to the skin effect. This shows the operation of the system 100 for shaping. For example, the heating system 100 is heated at high frequency. Due to the skin effect caused by operation, the current density flowing through the bulk medium 102 is 2 The depth of 02 is contracted in the z direction, becoming a narrow region near the surface of the bulk medium 102. Therefore, the effective resistance of the current flow region of the bulk medium 102 increases sufficiently, so in this region Heat can be obtained from the remaining circuit (e.g., wires, power supply, inverter, adjustment net). The workpiece (electrode) will not be overheated. The effective resistance of the bulk medium to the AC current in the target region. The resistance can be greater than the resistance of the bulk medium to DC current. For example, the effective resistance The resistance can be more than two orders of magnitude greater than the resistance of the bulk medium to DC current.

[0036] Figure 3 shows the depth of the material due to the skin effect as a function of the applied AC current (x-axis, normalized to 1). This plot shows the concentration of current density (y-axis, normalized to 1) at the (where it is located). The current density decreases exponentially along the thickness of the medium (in the z-direction). The frequency is 1 kHz. As the frequency increases from MHz to 10 MHz, the current density becomes even more concentrated near the surface of the bulk medium. Therefore, the higher the frequency, the more pronounced the attenuation. In other words, the skin effect is when the current The current density is reduced to pass through a thin layer near the surface of the bulk medium. As a result, Heat is generated in this layer.

[0037] Figure 4A shows a side view of system 400 for further reducing current density by utilizing the proximity effect. This is a diagram. Similar to Figure 1, electrodes 116 and 118 are connected to the bulk medium 102 (e.g., aircraft body). It is attached to the target area above and passes an AC signal (e.g., 1 kHz or higher) through the medium. It generates a current density (or path) 410 in direction 412 through it. The return path 108 is The current path (or density) within the medium is located within a distance of 120 from 410, and the direction 412 is It has different directions 112. In some embodiments, the return path 108 is a bulk medium It is electrically insulated from body 102. The path 108 is within a distance 120 from bulk medium 102. It may be a wire or cable that is positioned. The return path 108 is of system 400 These could be wires or cables that complete a circuit.

[0038] If the return path 108 is sufficiently close to the current path 410 (for example, less than 50 cm), The AC current in turn path 108 is the current in current path 410. It contracts in the direction that crosses it. In other words, the return path 108 is sufficiently connected to the current path 410. By arranging them close together, the cross-sectional area of ​​the current flow within the current path 410 is reduced. For example, referring to Figures 4A-4C, the current flows in two directions between electrodes 116 and 118 (e.g. For example, it is contracted in the x and z directions as shown in the figure. For example, as shown in Figure 4D Therefore, the proximity effect occurs in either the x or y direction, depending on the direction of the current flow. This reduces the current density to 410. For example, if the current flows in the x direction, the proximity effect reduces the current in the y direction. It contracts in the direction of current flow. For example, the proximity effect primarily contracts the current in a direction that is perpendicular to the direction of current flow. However, the skin effect mainly affects the current density within the depth of the bulk medium (for example, Figures 2A and 2B). It contracts in the z direction as shown. In some cases, the proximity effect is applied to the bulk medium 102 In addition to the contraction of the current density in the depth (e.g., in the z direction), it can also be added, for example, the skin effect and near In embodiments that utilize both contact effects, the skin effect can also be enhanced. In the embodiment, the proximity effect is used to determine the direction of current flow through the bulk medium (e.g., current). It is also possible to define the path through which the bulk medium 102 passes.

[0039] Figures 4B-4C are schematic diagrams illustrating the system 400 as viewed from above. Electrodes 116 and 118 is attached to the target region 102 of the bulk medium and receives an AC signal (for example, 1 kHz or higher). By passing the current through the medium, a current density (or current path) 410 in the direction 412 is generated. The return path 108 is different from the current path (or density) 410 in the bulk medium 102. It is arranged in the xy-plane (dotted line). In some embodiments, within the return path 108 The current is in a direction 112 that is different from direction 412. For example, in some embodiments, The direction of current 112 in turn path 108 is opposite to the direction of current 412 in current path 410. If the distance between the current path 412 and the return path 108 is sufficiently small (for example, 50 cm), (less than) the current flowing through the bulk medium 102 between electrodes 116 and 118 is shown in Figure 4C. Therefore, due to the proximity effect, they cluster close to the return path wire (e.g., y and z). (It contracts in that direction). The greater the distance of the return path 108 from the bulk medium 102, the greater the contraction. As shown in Figure 4B, fewer current paths 412 are contracted within the bulk medium 102. This will happen.

[0040] Figure 4D is an illustrative schematic diagram of another embodiment of system 450 viewed from above. Similar to the stem 100, electrodes 116 and 118 are used to target areas of the bulk medium 102. It is attached. The return path 108 is adjacent to the bulk medium 102, and the bulk medium 10 The current path 410 in 2 is located in a different xy-plane. The illustrated embodiment shows current 410 How to shape the path through which the bulk medium 102 flows, and the return path 108 (also This indicates whether a different, separate current path can be used. For example, a second current path (e.g., Rita A current-carrying wire or cable (such as a wire path 108) is placed in close proximity to the bulk medium 102. By doing so, the proximity effect is used to narrow the width of the current density across the direction of current flow. To do both and to form the current path 410 within the bulk medium 102. This is possible. Figure 4D also shows that the proximity effect increases the current density along the current path 410, and the current flow. This indicates that it contracts in a direction that crosses the direction of . For example, in Figure 4D, current path 4 The current density along 10 is substantially in the direction of current flow in each segment of path 410. The current path 410 in the bulk medium 102 is contracted in a direction perpendicular to the return path 108 It matches according to the shape. More specifically, in section A of the current path 410, The flow is guided to flow along the x-direction, and the current density is contracted in the y- and z-directions. In section B of the current path 410, the current is guided to flow along the y-direction. The current density is reduced in the x and z directions.

[0041] As shown in Figure 4D, the proximity effect allows current paths to be shaped into more complex forms. This offers several advantages. Firstly, such a path shape increases the effective current path length l. It can be used for this purpose. As mentioned above, resistance increases as the path length increases. Secondly, the shape of such a current path allows the current to heat up. It can be configured to direct the current to strategic locations. Thirdly, the shape of such current paths. This generates areas of increased heating (e.g., hot spots) at sharp angles in the current path. It is possible.

[0042] The combination of proximity effect and skin effect affects the bulk medium's AC current in the target region. The effective resistance can be made greater than the resistance of the bulk medium to DC current. For example, The effective resistance can be more than two orders of magnitude greater than the resistance of the bulk medium to DC current. .

[0043] Figures 5A-B show the second conductor / path 1 as a function of the distance between conductors 120, due to the proximity effect. A simulation showing an increase in current density concentration in the bulk conductor target region 102 near 08. This is a diagram. The current in the bulk conductor and the second path exhibits a proximity effect as the distance of 120 decreases. Sufficient to cause it (for example, above 1 kHz or 10 MHz). For example, distance If 120 is 20 cm, the current density 410 is in the xy plane, as shown in Figure 5A. It remains almost uniform. As shown in Figure 5B, the distance 120 decreases to 2 cm. Then, due to the proximity effect, the current 410 is "dense" around the return path 108 in the xz plane. " or "contraction" occurs. This is because most of the current 410 is in a narrow strip along the bulk conductor. The lip is densely packed with the path of the second conductor (108) (e.g., the return path, or other currents). This is achieved by following the carrier wire. In other words, the current 410 is the bulk medium Instead of spreading uniformly throughout the entire body, it follows the path with the minimum inductance.

[0044] In some embodiments, similar to path 122 in Figure 1, to cause a proximity effect, Use a wire other than turn path 108. In that case, the current oscillation of that wire will be on path 1 Driven by the same system as 06 and 108 (e.g., power control system 104) It is optional. In that case, the proximity effect of wire 122 is the current in the bulk conductor. It depends on the distance from path 412 to wire 112. Similar to return path 108, Route 122 needs to be sufficiently close to route 412 (for example, less than 50 cm).

[0045] Generally, the power control system 104 has electrodes (e.g., 116 and 118) and dedicated Current is supplied to the bulk medium 102 via a conductor (e.g., a dedicated wire or dedicated cable). This is done to form a closed circuit (see Figure 1). These three components will be discussed further below. I will explain in more detail later.

[0046] In some embodiments, electrodes 116 and 118 are connected to the input as shown in Figure 6A. The electrode system 600 includes an array of electrodes and output electrodes. The electrode system 600 forms an electrode array 116. Three input electrodes 116(1)~(3) and three output electrodes forming an electrode array 118 This includes 118(1)~(3) and provides an adjacent current path 410 within the bulk medium. As detailed, the proximity effect due to the current 112 in the return wire 108 is due to the bulk medium's current The fluid density is reduced to 410.

[0047] Generally, in order to achieve the desired heating in the target region of the bulk medium 102, various electric fields are used. A polar shape can be used. For example, referring to Figure 6B, system 610 is a val Two electrode arrangements 116 and used to supply current to the target region 102 of the medium 118 is shown (equipped with input / output wires 106 and 108). Electrode arrangement 116 Electrodes 118 may be arrays of one or more electrodes as shown in Figure 6A. Figures 6C-D For example, other electrode configurations 620 and 63 for heating a target area 120 of an aircraft wing. These are schematic diagrams of each of the 0s. Electrode arrangements are shown by 116, 118, and 640. This may be a single electrode, as shown in Figure 6A, or an array of one or more electrodes. The details of the electrode shape and design are as follows:

[0048] In some embodiments, the bulk medium is the aircraft skin, and the target region for heating is Wings, fuselage, vertical stabilizer, horizontal stabilizer, windows, winglets, windshield, control surfaces (flaps, etc.) (Irreversible controls, rudder, elevator, air brakes, etc.), nose / nose cone, landing gear A. Landing gear brakes, landing gear doors, engines and engine nacelles, AC inlets And outlets, fuel tank vents, pitot heads, static ports, and other antennas. This includes sensors, external lights, fuel tank vents, service panels, etc. Not limited to. In other words, the proposed technology may, in some cases, be shown in Figures 6A-6D. One or more of these configurations may include placing electrodes inside the aircraft body. In some embodiments, the heating system 100 generates Joule heat in a portion of the target area. Furthermore, conduction within the material can then lead to further heat diffusion.

[0049] Generally, the power control system 104 controls high-frequency (e.g., 1 kHz or higher) AC electrical signals. It is designed to generate (AC) and send it through the aforementioned target region 102 of the bulk medium. Includes a signal generation system. Low impedance in the target region (in some cases, 1Ω or less). In some embodiments (at a much lower level), the signal generation system generates Joule heat in the target region. To generate, it is configured to generate and maintain the desired current level. This assumes that the impedance of other parts of the system (such as conductors and wires that transmit signals) is zero. To exceed this limit, the large currents flowing through these sections cause undesirable jelly outside the target region. Heat is generated. Therefore, in some embodiments, the signal generation system uses high current to target region. It is designed to be supplied only to areas near the region.

[0050] In some embodiments, some or all of the elements / units of the signal generation system, Furthermore, the conductive elements / cables connecting them transmit high-current and high-frequency electromagnetic signals. It is designed to minimize, as much as possible, the undesirable power losses that sometimes occur.

[0051] In some embodiments, the signal generation system uses an existing power supply (e.g., an existing power supply on an aircraft). It can receive power from the electric bus. In some embodiments, the system can receive power from the sys Uses a dedicated battery or dedicated power supply that is part of the system. For example, such a dedicated Power sources for this include fuel-based generators, solar-powered generators, and wind-powered generators. This may include, but is not limited to, machines, gas-powered generators, etc. Signal generation systems The system involves a power source (e.g., an existing electric bus, a dedicated battery, a dedicated power supply) and a target area. It can be placed within the circuit between them.

[0052] Furthermore, in some embodiments, the signal generation system exists as an independent unit. to do and / or embed within a combination of other units that are part of a signal generation system It may include integrated control circuits and devices.

[0053] In some embodiments, the heating system 100 heats several separate target areas. Used for this purpose. In such cases, each element or unit of the heating system (for example, Signal conversion units, impedance matching networks, etc. are centralized throughout the entire system. Alternatively, they may be distributed as one or more separate units for each target area or group of target areas. It is possible to do so. Centralized or distributed configuration is one of many criteria, in particular, of system functionality and Used to improve energy efficiency, cost, regulatory compliance, weight, size, and complexity, etc. This is possible. For example, in some embodiments, the signal conversion unit is centralized. However, the impedance matching network is distributed across one or more units for each target region. In some embodiments, the signal conversion unit is a centralized TSP ("conversion to standard power"). )Partially centralized as a subunit, but ACG ("AC generation") subunit The set is distributed as one or more subunits for each target area or group of target areas. In some embodiments, the signal conversion unit is completely distributed, and each of its subunits The target is distributed across one or more subunits for each target area or group of target areas.

[0054] In some embodiments, the power control system 104 is activated when the heating / de-icing / anti-icing operation is completed. Power is continuously supplied to the target region 102 until [the specified time]. In some embodiments, the system To achieve the desired heat generation and heat distribution in the conductive material 102, improved / efficiency The power can be turned on and off in a conventional way (for example, using a control unit). For example, when the system is on, heat is generated at a specific location in the target area, and throughout the entire target area. It is conducted through the body and "diffuses" to the rest of the target area. Heat continues to conduct within the target region.

[0055] In some embodiments, the system has different power levels relative to the ON state, and It is possible to periodically alternate between the off state and different power levels in a well-designed manner. In this embodiment, instead of a one-step power increment or decrement, the power is increased or decreased smoothly. This allows you to reach a specific power level. The system can be fully predefined when the system is built, or it can be defined by the system's control unit. It can be dynamically improved by changing it based on a feedback loop that forms part of it. ru.

[0056] In some embodiments of the heating system, which includes multiple target regions, the pulse power pattern described above Because the line can be used asynchronously across all target areas, all target areas can be used across all While maintaining both the average and overall instantaneous power levels below the set threshold, for the required amount of time It can be heated. For example, the wings, fuselage, and horizontal and vertical stabilizers of an aircraft can be heated. In the case of the machine's de-icing system, such a stepped power pattern means the system is working on one eye at a time. It can be designed to turn on only for the target area. Several embodiments So, the stepped power pattern applies power to the system in the following order: left wing, fuselage, right wing, vertical stabilizer, and horizontal stabilizer. Turn on the power.

[0057] In some embodiments, the desired heat, average power, instantaneous power level, and acceptable To achieve the desired heat distribution, improved timing can be used at each stage. In several embodiments, similar to the patterns described above, any subset of the target region is selected at a specific time. It can be heated in between.

[0058] In some embodiments, one or more are mentioned as part of the design of the heating system. Multiple units or elements have an enclosure. Such an enclosure is They can be designed for a single unit or any combination of units. In terms of construction methods, enclosures are designed in accordance with environmental certification standards. For example, enclosure The mounting provides fire resistance, protection from rain, and protection from external shocks and vibrations. Structure, electrical insulation, protection from external electromagnetic interference ("EMI"), and EMI emission of enclosed circuits It can be designed to comply with standards such as shielding and thermal relief.

[0059] In some embodiments, some enclosures contain heated objects (e.g., bath The structure of a conductive material can be designed to be used as a heat sink. If one or more heating system units are placed in relation to the bulk medium in which they are placed It can be housed within a metal or conductive structure that is mounted to have high thermal conductivity. One possible advantage of this mounting is that it heats the bulk medium while simultaneously heating the electronic equipment. The purpose is to provide the necessary cooling. Another possible advantage of this design is to distribute the losses. This eliminates the need for a separate heatsink, thus reducing the heating system (or the The weight of the vise is reduced. In some embodiments, the target area is heated by the system. It can be used as part of the heat sink of the heating unit. The stem circuitry inevitably generates heat loss, which can be conducted to the target region and heat them. Therefore, the efficiency of the heating system can be improved.

[0060] In some embodiments, multiple adhesives are used to attach the enclosure to the bulk medium. A type of agent or mounting can be used. For example, the casing can be positioned in a predetermined location. To hold it in place, an adhesive can be used, which is primarily used for mechanical rigidity retention. , providing a low thermal impedance path for the enclosure's heat sink function Adhesives (or surfactants) can also be used.

[0061] In some embodiments, one or more heating system units are configured to rotate the units One or more measurements taken in a road, surrounding cables, other units, or target area, for example. For example, it can be configured to detect voltage, current, temperature, forward power, and reflected power. This is possible, but is not limited to, these methods. In some embodiments, such measurements are used This is used to monitor the operating status of the units and improve their operation, for example, by switching On / off switching of the swivel and adjustable section, output level, and in-circuit control It is possible to control (using a feedback mechanism) such as (dynamic (See below for details on controlling the switching and adjustable parts within the adjustment network.) The parameters controlled include power and / or current to the load, and the regulating network. This includes voltage control of the signal and other related signals.

[0062] In some embodiments, the measured values ​​used as part of the feedback loop described above are used. This may also include certain ice sensors that can be placed in or near the target area. The sensor, for example, notifies the heating system and / or the user of the de-icing completion status. It can be used to adjust the power level during the de-icing and anti-icing operation phases. It can be used as a force. In some embodiments, the ice sensor is used to detect faults in the system. It can also be used to determine service requests.

[0063] In some embodiments, the heating system is used by the user (in the case of an aircraft de-icing system). (May be the pilot or co-pilot) and / or receive input from the system's sensors A protocol converter control unit that outputs control signals to the receiver and all other units. It may include a knit (or "control unit" or "control subunit"). In some embodiments, user input is on / off state, de-icing / anti-icing / off state, This may include, but is not limited to, the target temperature of the target region and the target output of the target region. It is not possible. In some embodiments, the input from the sensor is voltage, current, temperature, forward power. And reflected power, impedance, and ice sensors, squat switches, various navigators This includes data from the aircraft logic unit, information from avionics, and other information. However, it is not limited to these. In some embodiments, the protocol converter unit The system is centrally located throughout the entire system. In some embodiments, the target area or target area One protocol converter control unit is distributed among the groups.

[0064] In some embodiments, user input is via a wired connection (e.g., a digital input such as ARINC 429). Using data transfer standards, or wirelessly (e.g., Low Energy Bluetooth or It can be transmitted to the control unit using a Wi-Fi connection. Several implementations In this scenario, the user's input device is integrated into the system being heated (for example, aircraft defrosting). (Integrate into on-screen controls for the ice system in the cockpit) or touchscreen A tablet (for example, another tablet mounted in the cockpit, or on an aircraft) In the case of the de-icing system, a dedicated app is installed on the pilot's touchscreen tablet. It can be a separate device, such as an application.

[0065] In some embodiments, the power control system 104 generates current in the bulk medium. Therefore, an existing electric bus or any other power source for a dedicated battery or heating system A signal conversion unit ("STU") or circuit that converts these signals into a desired high-frequency AC waveform. This includes, for example, in aircraft applications, the signal conversion unit is the electric bus of the aircraft. It can receive available DC power and convert it into the desired high-frequency AC signal. In the example of an aircraft, the signal conversion unit converts the available power from the aircraft's electric bus into AC signals. It can be received in the form of a number and converted into a desired high-frequency AC signal. Several embodiments The signal conversion unit uses a dedicated battery or any dedicated power source (e.g., a heated battery). It takes available DC power (which forms part of the stem) and converts it into the desired high-frequency AC signal. This is possible. In some embodiments, a dedicated battery or power supply is used for signal conversion. It can be integrated into the same enclosure and / or circuit board as the unit.

[0066] Figure 7 shows an exemplary signal conversion unit ("STU") 7 for the power control system 104. This is a schematic diagram of 00, including conversion to standard power ("TSP") and AC generation ("ACG"). )720 main subunits, and these subunits constitute the remainder of device 100 It precedes the other circuit 730. The power control system 104 is already as shown in Figure 7. It can draw power from existing power sources.

[0067] Figure 8 shows an exemplary signal conversion unit ("STU") 8 for the power control system 104. This is a schematic diagram of 00, including TSP810, ACG820, and control subunit 830. nothing.

[0068] In some embodiments, the TSP draws power from an existing power source or the battery of the heating system. To unleash its full potential, improve the operation of the ACG, and improve the power transmission efficiency of the signal conversion unit. Therefore, that power is converted to a standard input such as 250VDC.

[0069] In some embodiments, an existing electric bus receives power in the form of a 400Hz, 115VAC signal. When supplying to the TSP, the TSP applies a filter such as a common mode choke to the output side. It includes a flyback converter to prevent electromagnetic interference from reaching the ACG or damaging it. Yes, it is possible. Figure 9A shows the flyback converter 910 and the common mode choke 920. Figure 9B shows an exemplary TSP subunit 900, including a schematic diagram of the flybar. This is a schematic diagram of the 910 converter.

[0070] In some embodiments, the TSP converts AC power from an existing power supply to any DC voltage. It is a bridge rectifier that replaces a battery. In some embodiments, the TSP is a battery or existing It draws DC power from the power supply (for example, the typical 28VDC of an aircraft) and converts it to a different Converts to DC or AC voltage. For example, DC-DC conversion is used in the control of heating systems. It is useful for supplying power to knits and elements, in which case the possible voltage levels and And these include ±3.3V, ±5V, and / or ±12V. Finally, some actual Depending on the application, a power factor correction ("PFC") stage can be included in the TSP design. In some embodiments, the PFC may carry a nonlinear load on the power supply that may be required. This can be helpful for correction. Both active and passive PFC stages are available. .

[0071] In some embodiments, the ACG uses the input power from the TSP to achieve the desired high Converts to a frequency AC signal. In some embodiments, the ACG is powered by the signal conversion unit. It is designed to improve transmission efficiency. In some embodiments, the ACG is a power amplifier or including AC or RF generators or oscillators.

[0072] In some embodiments, the main power amplification stage of the power amplifier is "linear" or "switched" It is either "G" or "G". The relevant trade-offs between these two architectures are effective. This may include rate, power handling, and linearity. Examples of linear amplifiers include Class A, Class B, and Class C are included. Examples of switching amplifiers include Class D, Class -E and Class-F are included. In some embodiments, the linear amplifier is a sw Compared to a switching amplifier, it has high linearity and low efficiency. Low efficiency leads to thermal management issues. This could lead to problems such as increased difficulty and the need for high-spec components. Low linearity leads to increased harmonic components, resulting in regulatory compliance, reduced efficiency, and physical and electrical problems. Problems such as difficulties in layout design may arise.

[0073] In some embodiments, the ACG includes a full-bridge Class D amplifier. For example, amplification The device design involves dual MOSFET transistors powered by a gate driver and the desired frequency A temperature-compensated crystal oscillator ("TCXO") is used to generate the wavenumber. Figure 10A shows a dual MOSFET transistor, temperature-controlled crystal oscillator ("TCXO") 1020, and gauge An exemplary ACG subunit includes a Class D amplifier 1010 with a driver 1030. This is a schematic diagram of the T1000. Figure 10B is an exemplary class using a dual MOSFET. This is a theoretical schematic diagram of a D amplifier. In some embodiments, a full-bridge architecture is used. Compared to a half-bridge architecture, it provides differential (balanced) drive functionality. Furthermore, it is possible to provide four times the power output for a given bus voltage level under a given load. Yes, it is possible. Differential drive provides exhaust gas under balanced load conditions, as expected by the wing structure. It may also be suitable for compliance. Furthermore, in some embodiments, Class D This architecture may have a higher switch utilization rate than other switching architectures.

[0074] In some embodiments, within a Class D architecture, a single frequency drive Under these conditions, many input parameters can be changed to improve the output parameters. Examples of input parameters include dead time. Examples of output parameters include efficiency. Peak components include stress, etc.

[0075] In some embodiments, the Class D architecture has high switch utilization and Complete the implementation of the recon base components and make them suitable for potential ASIC development. This can be done. In such development, all control components and power electronics The electronics are mounted on either the same die or an MCP (multi-chip package). System-on-a-chip (SoC) implementation is possible. In some embodiments, Class D The architecture involves SoCs mounted in various distributed locations in designated functional parts of the aircraft. It has a distributed module that houses the support circuitry.

[0076] In other embodiments, a single-switch architecture, such as Class E or Class F, is used. Other switch-mode designs such as are used. In some embodiments, such The kitech offers the possibility of higher switching frequency implementations and high-side gate drivers. Iba can become difficult or impractical. In some embodiments, Cla at high frequencies Due to the potential limitations of the SS-D implementation, as the frequency increases, the Class-D implementation... A single-switch architecture can be used relatively easily.

[0077] In some embodiments, harmonic reduction and harmonic rejection techniques are used with a switch-mode amplifier. They are used together to mitigate the adverse effects of nonlinear distortion inherent in some switching architectures. This can be mitigated. For example, by changing the duty cycle of the base waveform, or by changing the pulse bracing. Harmonics can be removed during signal generation using techniques such as honking and other methods. .

[0078] In some embodiments, the ACG includes a transistor such as a silicon MOSFET. In some embodiments, the transistor is a gallium nitride (GaN) MOSFET. In certain embodiments, the GaN transistor exhibits on-resistance, turn-on-gate charge, and reverse recovery. It has advantageous properties such as charge. In some embodiments, GaN is suitable for higher frequencies. They are doing it.

[0079] In some embodiments, the TSP draws power from an existing power supply to drive the ACG. To convert it into a power input signal suitable for elements such as gate drivers or crystal oscillators, It further includes a low-power conversion ("LPC") stage such as a linear regulator. Figure 10C is illustrative. This is a schematic diagram of the ACG subunit 1050, which has dual MOSFET transistors. Equipped with a Class D amplifier 1010, a temperature-controlled crystal oscillator ("TCXO") 1020, and a gate Includes drivers 1030 and LPC1050.

[0080] In some embodiments, the AC generation subunit is located near the target region. Possible advantages of the design include the AC generation subunit and the control network through which the target area is controlled. The purpose is to limit the losses and emissions that occur when alternating current is passed through it. In this embodiment, the TSP subunit is located near the AC generation unit, or near an existing power supply or It can be placed near the dedicated battery. If the TSP is close to the ACG, the ACG and Because they can be integrated, it may be possible to reduce the number and complexity of modules within the system. If the TSP is close to an existing power source or dedicated battery, AC power from the power source or battery. The power transmission to G can be designed to be improved (by increasing efficiency and reducing EMI). For example, if the existing power supply provides power in the form of 400Hz, 115VAC voltage, TSP It includes an AC-DC converter, which converts the power supply voltage to 250VDC, and the AC current... This reduces the EMI caused by the increased voltage and the current flowing from the TSP to the ACG. Efficiency can be increased by reducing the flow rate.

[0081] In some embodiments, the control subunit controls the status of the signal conversion unit, based on the input of relevant data available for the application for which the device (heating system) is being developed, such as, for example, on / off mode, power output, frequency, and other parameters, and outputs a control signal to other signal conversion subunits, such as drivers for TSP and ACG. In an example of an aircraft de-icing and anti-icing heating system, in some embodiments, the data input includes manual pilot input from cockpit switches, temperature from temperature sensors inside and outside the aircraft, wheel-on-weight status from squat switches, various aircraft logic units, information from avionics, feedback information from the device (heating system) itself, and other data. In some embodiments, the control subunit includes a microcontroller supervisor powered at a low power conversion (LPC) stage, such as a linear regulator, draws power from an existing power source, converts it into an appropriate power input signal, and outputs control signals to the TSP and ACG. FIG. 11 is a schematic diagram of an exemplary control subunit 1100 including a microcontroller 1110 and a low power conversion stage (LPC) 1120. In some embodiments, for example, in the case of a de-icing heating system retrofitted to an aircraft, the signal conversion unit can be installed in a central location near the available electrical bus. This can reduce the complexity of installation, labor time, and the cost of the unit. In some embodiments, the signal conversion unit is decentralized and installed near the target area. This shortens the length that the AC signal has to travel between the signal conversion unit and the target area.

[0082] ​​​​​​​​​​​​This includes shielding signals from electromagnetic interference ("EMI") and for transmitting such AC signals. This can reduce costs associated with cable requirements.

[0083] In some embodiments, the heating system has an output impedance of the heating system that is desired An impedance matching network ("IAN") configured to adjust to the level It has. For example, IAN is the output impedance of the heating system to the bulk medium being heated. It can be configured to adjust to the input impedance of I. AN sets the impedance between the output of the heating system and the input of the bulk medium relative to the desired impedance. It can be configured to adjust within a range. In some embodiments, impedance The adjustment network controls the output impedance of the heating system relative to the impedance of the bulk medium. It is configured to adjust to be sufficiently aligned with the system. In other words, the aligned network is The output impedance of the STU ("source") is set within a reasonable engineering tolerance to the target domain. It is configured to match the impedance of the "load". In some embodiments, Matching the source impedance and load impedance is important for the heating system's source impedance. This includes adjusting the impedance to be the complex conjugate of the impedance of the bulk medium. In some embodiments, the impedance matching network is used at the output of the heating system. The impedance will be within 10 to 30% of the impedance of the bulk medium being heated. It will be adjusted accordingly.

[0084] Figure 12 shows the impedance matching network 1 between source 1210 and load 1220. This is a conceptual diagram of the 200. Figure 12 shows an impedance-matched input port to the output of the STU. It receives input power from the STU ("source") via and inputs it to correspond to the target region. A regulated output port that outputs power to the target area ("load") via a pedance-controlled output port. Show the network.

[0085] Generally, in AC signals, the output impedance of the source corresponds to the impedance of the load. If not, some of the signal sent from the source to the load will not pass through the load. It reflects back to the source. In some embodiments, an impedance matching network is used. By suppressing the increase in signal reflection and voltage standing waves, several advantages are achieved, for example, • Reduction of terminal voltage and arc discharge risk in heating systems • Improved efficiency of the heating system • Reduction of total power output required from the STU, thus reducing the size, weight, and cost of the STU. Reduction • Reduces stress on system components • Improved reliability • Reduction of temperature gradients in cables and bulk media These can be achieved.

[0086] In some embodiments, the output impedance of the STU is equal to the impedance in the target region. The voltage also increases. In that case, this adjustment network receives a relatively high voltage from the STU and Converts low-current power into relatively low-voltage and high-current power supplied to the target region. In these embodiments, this means that a large current is regulated after the regulating network, and therefore the target region This means that it is supplied only nearby, reducing joule losses in the rest of the SGU and heating system To improve the overall efficiency of the system.

[0087] In various embodiments, this tuning network may be centrally located or distributed throughout the target area. By distributing this tuning network, while enabling the cable to function as a filter, the peak voltage, peak current, and / or temperature effects on specific components can potentially be reduced. Distributed placement can also add modularity to the system design, thereby improving component maintainability / replacement. Furthermore, distributed placement can position the system away from dangerous areas such as sensitive equipment or fuel tanks.

[0088] A distributed impedance tuning network, such as an impedance matching network placed at the input of the coupling strip 1900, can also facilitate local monitoring of each coupling strip even in embodiments where the power control system 104 supplies power to multiple coupling strips. It can also provide means for various localized functions, including the ability to switch the coupling strip 1900 on or off and communicate information to the power control system 104. Communication can be easily performed via a separate communication cable or via power cable encoding (e.g., the power cable connected to the coupling strip 1900) to reduce weight and cable clutter. For example, this tuning network can trigger a special impedance state, which can be used by the power control system 104 based on the intentional use of impedance changes, such as digital communication style encoding or analog

[0089] impedance changes, such as digital communication style encoding or analog encoding, for example, based on the use of intentional impedance changes by the power control system 104. The signal transmitted back over the power line is encoded using either threshold-level coding techniques. Based on this, it is detectable. As another example, a distributed impedance tuning network is In addition to the heating power signal, an additional data signal can be added to the power cable. Alternatively, or in addition, one of the units or elements mentioned as part of the heating system. Alternatively, multiple devices can relay information via wireless means.

[0090] In one embodiment, the impedance matching network further supports fault indication. In these embodiments, the heating system is described in the "Control and Sensing" section below. As explained in more detail, this may be due to a fault or malfunction present in the heating system. It may include a local fault sensor that is triggered or tripped. For example, a local fault The harmful sensor can be placed on the coupling strip 1900. This regulating network is , different types of failures in specific parts and sections of the heating system, as well as the type of failure A controller that maintains a lookup table specifying corresponding different impedance values. It may include a RA. Next, this adjustment network is observed by the power control system. The input impedance is adjusted to a specific value, and certain types that may exist It can also be configured to indicate a fault or malfunction.

[0091] Furthermore, in some embodiments, additional capacitive components are included, resulting in a symmetrical network. The adjustment network can be balanced by grounding the inter-point. When driven by this, this network operates in a balanced manner, providing a high common-mode rejection ratio and excellent performance. This enables noise immunity. In some embodiments, such balance is not achieved, and adjustments are made. The return path of the network terminates at the ground of the circuit.

[0092] In general, in some embodiments, the coordination network is a specific building block The configuration may include passive electronic components. For example, these building blocks The configuration includes transformers, L networks, π networks, T networks, and others. The configuration may include. Figures 13A-D show an exemplary impedance matching network build. This is a schematic diagram of the building block.

[0093] In some embodiments, the heating system's adjustment network includes a passive adjustment subunit. Includes. Figure 14 shows an exemplary adjustment network unit including a passive adjustment subunit 1410. This is a schematic diagram of the T1400. In some embodiments, the passive adjustment subunit is as described above. It can include one or more building block configurations, and other configurations together. In some embodiments, the passive electronic component of the passive adjustment subunit is, for example, a net. To improve the efficiency of the twerking process, materials with a high quality factor are selected.

[0094] In some embodiments, the heating system adjustment network is a high quality coefficient (high It can be designed to have a low-Q factor (-Q) or a low-Q factor. Networks can be used to remove harmonic signal components. Harmonic components are linear Because it can be more expensive than in the case of conventional amplifiers, the design of switching amplifiers involves fill Taring may be more advantageous. However, high-Q networks depend on component tolerances and external conditions. It can be more sensitive to variations in operation, assembly, and other variations within the system. Therefore, high-Q systems can potentially cause practical problems during system implementation. There is. For example, in the case of an aircraft wing de-icing system, if the system is High-Q, The pulsedance regulation network is disrupted by small perturbations (such as flap movements). This could potentially lead to a risk of malfunction. Lowering the harmonic components outside the fundamental drive frequency is not possible. For regulatory certification, there are also practical design concerns, such as the inclusion of stray signals within the design. Excessive stress on components (within peak or time-averaged rating), control algorithm This can also be beneficial for rhythmic instability, etc. In some cases, dynamic adjustment elements can be used. By using this method, these sensitivity concerns can be mitigated or even eliminated.

[0095] In some embodiments, the design of the heating system's regulating network is based on the regulating of the power lines. It can be based on thought. For example, the case at the input and / or output of the adjustment network. A bull connection can be considered part of a coordination network. In some embodiments, By selecting the appropriate cable material, form factor, dimensions, and length, This allows for precise impedance adjustment.

[0096] In some embodiments, the heating system's adjustment network is an active adjustment sub-unit. This is a dynamic adjustment network including the knit and control subunits. Figure 15A shows the active An exemplary adjustment network including adjustment subunit 1510 and control subunit 1520 This is a schematic diagram of the work unit 1500. In some embodiments, the active adjustment sub-unit The Knit consists of one or more regulating network configurations controlled by control subunits. Includes. In some embodiments, the passive electronics of the active adjustment network subunit. Components are selected, for example, those with a high quality factor to improve network efficiency. Selected. In some embodiments, the control subunit transmits and receives to and from the target region. The system receives input data (forward power, reflected power, voltage standing wave ratio, etc.) from the signal and activates the Dynamically control the tuning network subunit to adjust impedance in real time. Adjustment is performed using the settings of the active adjustment network subunit. For example, this type of control is performed using the settings of the active adjustment network subunit. This can be achieved through adjustment elements included in the system. For example, dynamic adjustment elements are adjustable It may include adjustable capacitors and / or adjustable inductors. Furthermore, adjustable components Basic examples include PIN diodes, BST capacitors, and DTC (discrete adjustable capacitors). Varactor diodes, MEMS, ferroelectric varactors, ferromagnetic components, Y Examples include IG adjustment filters. These are evaluations that can be considered during the evaluation of such devices. Examples of criteria include operating frequency range, DC voltage adjustment, control signal linearity adjustment, and control complexity. The adjustment ratio of capacitance / inductance, adjustment speed, quality factor (Q), switching life, and Casing cost, power handling, power consumption, breakdown voltage, linearity, third-order interface It includes features such as Sept (IP3) and integration capabilities.

[0097] In some embodiments, feedback is provided between the target region and the adjustment network. The control unit allows you to control the impedance of the target region or the STU output impedance. External changes that may affect the target area, the location of the heating system, the system Changes in temperature and geometric configuration of the environment surrounding the target area, and other parameters. The network can be adapted to various configurations. In some embodiments, the adapted network can be used. The system draws power from the existing power supply and uses it to create a power input signal suitable for the control subunit. It further includes a low-power conversion ("LPC") stage, such as a linear regulator, which converts to [the specified value]. Figure 15B This includes the active adjustment subunit 1510, the low power conversion stage ("LPC") 1560, and Schematic of an exemplary adjustment network unit 1550, including a control subunit 1520. This is a diagram.

[0098] In some embodiments, the spectrum of possible situations during use of the heating system is For all configurations and environmental conditions, special impedance measurements are taken in the target area. This can be done. These measurements will provide appropriate impedance across the entire spectrum of the above situation. - Dynamic adjustment network that adapts to the narrowest impedance range, enabling dance adjustment. It may be possible to design a unit. In some embodiments, such a design is possible with Algo By optimizing the rhythm or performing it using computer simulation, the adjustment network can be optimized. To improve system efficiency while reducing the weight, complexity, and cost of the network. It is possible.

[0099] In some embodiments, a dedicated cable can be used in the heating system, and the cable The bull improves efficiency and shields the power signals being transported to the target area, with special features at each stage. They can be designed or selected separately. Figure 16 shows a cable in an exemplary heating system. This is a schematic diagram of the cable section. In various embodiments, the cable section of the heating system is a cable section. It can be customized, for example, the cable between power supply 1620 and STU1610 (cable Stage 1) 1630, the cable inside the STU between the TSP1640 and ACG1650 subunits Cable (cable section 2) 1660, cable between STU 1610 and adjustment network 1670 Bull (cable section 3) 1680, and coordination network 1670 and target area 1690 It can include the intermediate cable (cable section 4) 1695.

[0100] Generally, designing dedicated cables for an entire heating system involves various design considerations. It may be relevant. In some embodiments, thermal considerations may be relevant. For example, In one embodiment, the adjustment network is connected to the target region (or near the target region) The cable (which may return to the coordination network in some cases) runs from the cable to the target area. It can be fixed in a way that increases the flow of heat. This is when current flows through the cable. A portion of the heat generated is recovered (otherwise lost), with the aim of generating heat. This is advantageous when the data is transmitted to a specified target area, improving system efficiency.

[0101] In some embodiments, fasteners are used to route the cable near the target area. This can be done. In such cases, a thermally conductive material with good thermal conductivity can be used to improve thermal contact. This allows for filling the air gap between the cable, fastener, and target area interface.

[0102] In some embodiments, the cable is attached directly to the target area. To improve thermal contact, a highly thermally conductive adhesive is used to connect the cables to the contact area. It can be installed. Furthermore, a thermal interface material with high thermal conductivity can be used to connect cables and eyes. It is possible to fill some or all of the remaining air gaps between the target areas.

[0103] In some embodiments, depending on the unit, target area, or power supply to which the cable is connected This allows for the use of different cross-sectional shapes and different cable form factors. In some embodiments, the cable is protected by a protective jacket (electrical insulation and / or corrosion protection). Includes only the main body, with or without (for environmental protection purposes such as humidity, extreme temperature, and friction). This configuration is used in a system that carries a DC signal or transmits a signal to a target area. It could be advantageous.

[0104] In some embodiments, the cable is a coaxial cable. The coaxial cable has a shield. It can reduce EMI emissions when transporting AC signals, and also when transporting any signal. It can be protected from EMI in the surrounding area.

[0105] In some embodiments, the cable is a triaxial cable. This design allows for the transmission of any signal. During transport, more specifically, the balance of the output of the balancing embodiment of the adjustment network unit, for example. This may be beneficial for EMI protection and isolation during the transmission of balanced signals.

[0106] In some embodiments, the cable is a two-axis cable. This design uses a three-axis cable. Similar advantages may be offered by [the other party].

[0107] In some embodiments, depending on the unit, target area, or power supply to which the cable is connected Therefore, different cable cross-sectional shapes can be used.

[0108] In some embodiments, the cross-section of the cable conductor has a circular shape. This design is For coaxial / triaxial / two-axis form factors, manufacturing costs are relatively low (non-repetitive engineering). It has the advantage of low ring costs.

[0109] In some embodiments, the cross-section of the cable is flat and / or rectangular. For example This cross-section is advantageous for the final stage of a system where the cable supplies current to a target region. It can be cable-shaped. In the final stage, the rectangular shape is for the current circulating within the cable. By mitigating the effects of proximity and skin effects, losses are reduced and system efficiency is improved. This improves performance. Furthermore, this shape reduces the total amount of conductive material required for the cable, The weight of the stem may decrease, which should be considered in the case of aircraft de-icing systems. This is an important matter.

[0110] In some embodiments, specific input and output currents and signals are carried by the cable. Depending on the cross-sectional shape and other factors, the size of the cross-section specifies the operating temperature. The scope (for example, for compliance and the materials used in the manufacture of the cable) To limit (which is determined) and to reduce its weight and size, It is possible.

[0111] In some embodiments, the cable is connected to a unit, target area, or power supply. Therefore, different cable shielding types (and cross-sectional shapes) are used.

[0112] In some embodiments, the cable does not include a shield. This is because DC current is being carried. The stage where (and therefore when EMI suppression requirements are low), and where it is necessary to carry the return current. A stage without a (for example, the target region carries the return current and a nearby cable is connected to the target region) It is likely to be advantageous in the later stages of the system in embodiments that supply current.

[0113] In some embodiments, a single shield is used. This is, for example, in a cable. In situations where one shielding layer is sufficient to comply with EMI / EMC requirements and other environmental requirements... It is advantageous for the match.

[0114] In some embodiments, double shielding is used, which adds another shielding layer. For example, this further reduces EMI radiation and lowers the EMI sensitivity of the cable. It can be made to happen.

[0115] In some embodiments, three or more layers of shielding are used. This is based on the same reasoning as described above. An additional shield layer is added.

[0116] In some embodiments, a cable that supplies current to a specific target region is used for a particular target region. The route may be made to follow different possible paths.

[0117] In some embodiments, the cable is routed approximately from one side of the target area to the other side. It simply involves following a straight path. In some cases, these paths may be parallel. In some embodiments, the cable passes diagonally through the target area, and in various locations within the target area... They may intersect at this point. This, for example, generates more uniform heat across the entire surface of the target area. This helps to create relatively high-temperature spots at desired locations where cables cross.

[0118] In some embodiments, the cable follows a zigzag path, a winding path, and Alternatively, it follows a path that can be modeled using a 2D spline curve. This design is for flowing through the target region. By lengthening the path the current follows, the effectiveness of the system is increased, and therefore the effective resistance This can be further improved. This can be achieved, for example, with higher efficiency, lower current, and This can help achieve more stable impedance adjustment using a stem.

[0119] In some embodiments, the cable routing design is based on the above options and other options. It is based on a combination of elements.

[0120] In some embodiments, depending on the cable design, stage, and purpose, the cable Different materials can be used in the manufacturing process.

[0121] Depending on local voltage, current, temperature, power, bending radius, durability requirements, and other criteria The conductor material of the cable has been improved in terms of efficiency, conductivity, weight, cost, size, and thermal aspects. You can choose to have it done that way.

[0122] In some embodiments, the conductive material is copper, silver, aluminum, carbon fiber composite, titanium It consists of n, or an alloy thereof. In some embodiments, the conductor is one of the aforementioned materials. Made from [unclear material], and coated with other materials such as silver to improve the conductivity of the conductor's skin. It will be done.

[0123] In some embodiments, the conductor may be made of a solid material or a stranded wire. For example, in some embodiments, an insulating coating such as enamel is used. This allows the strands of wire to be insulated from each other. For example, using Litz wire, This can reduce the effects of skin and proximity effects within the table.

[0124] In some embodiments (e.g., for coaxial / triaxial / biaxial cables), local voltage, current, and temperature are measured. The dielectric material of the cable depends on the degree, power, bending radius, durability requirements, and other criteria. Materials, efficiency (e.g., by reducing dielectric loss), weight, cost, flexibility, maximum voltage tolerance , maximum power tolerance, temperature rating (high temperature tolerance and / or high thermal capacity of the cable and Select one that improves (or improves dielectric loss and / or good thermal conductivity) It is possible.

[0125] In some embodiments, transmission line adjustment is used within the adjustment network unit. In addition, the associated cables are dielectrics selected to reach the desired impedance level. Body materials can also be used. Exemplary materials include polyethylene and Teflon-based materials. There are materials, as well as other materials.

[0126] In some embodiments, local voltage, current, temperature, power, bending radius, durability requirements, Depending on the and other criteria, the cable jacket material is selected based on weight, cost, flexibility, and maximum Voltage tolerance, temperature rating, and nearby heatsink (e.g., used as a heatsink) The parameters such as heat conduction to the target region are selected to improve these parameters.

[0127] In some embodiments, transmission line adjustment is used as part of an adjustment network. In addition to its dielectric, in order to reach the target impedance level, The length of the cable used for adjustment can be controlled. For example, to control the current in a target area. The supplied cables are used as part of a transmission line adjustment system, and impedance adjustment is performed. This adds extra length and allows it to be locally coiled to occupy a smaller space. To be wrapped up.

[0128] In some embodiments, specific fastening techniques are used to route the cables along the structure of the system. This allows for wiring. Such technology reduces installation costs and time, and the weight of the system. (By reducing the required wire length and the weight of the fasteners) and the proximity of the target area It can be selected to improve the desired electromagnetic effects and heat transfer of the cable.

[0129] In some embodiments, the fastener is connected to a cable that supplies power to a target area and the target area. This design is chosen to reduce the distance between them. This design can generate a stronger proximity effect. In some embodiments, conventional cable retainers are used to shorten the distance between the cable and the target area. You can choose the design of the fastener.

[0130] In some embodiments, the fastener is used to enhance heat conduction from the cable to the target area. It is also used.

[0131] In some embodiments, fastener materials are selected to reduce the weight and cost of the system. It is selected. This can be achieved, for example, by using composite materials. The fastener is eye In some embodiments, which are also used for heat conduction to a target region, a high thermal conductivity is A material (for example, a metallic material that typically has a relatively high thermal conductivity) is selected.

[0132] In some embodiments, adhesive is used to secure fasteners to their adhesive areas. The agent is selected to increase the bonding strength to the target area and ensure long-term bonding. Adhesive The strength is present when the bonding region is relatively small and relatively strong mechanical constraints are imposed on the bonding region. It is advantageous. Furthermore, how many fasteners are used for heat conduction from the cable to the target area? In that embodiment, an adhesive is also selected to increase thermal conductivity.

[0133] Finally, some implementations where fasteners are used for heat conduction from the cable to the target area. In terms of form, to improve the flow of heat from the cable to the target area, the cable, fasteners and eyes The void between the target region and the surrounding region is filled with a thermally conductive thermal interface material.

[0134] In some embodiments, the cable is directly attached to the surrounding structure, such as a bulk medium, with adhesive. It is attached, allowing for better heat transfer from the cable to the structure to which the cable is attached. The adhesive is selected based on the same criteria as those used for fasteners.

[0135] In some embodiments, the design of the cable assembly involves two or more predetermined cable paths. This involves splitting into a separate set of branches, for example, one coordinating net. This is useful for embodiments in which the workpiece delivers current to a set of multiple target regions. In this configuration, one cable can be the sole output of the adjustment network, and that cable The cable supplies current to each of the target regions so that the cable reaches multiple target regions. It can be split into separate branches. In some embodiments, such a split is Divide a given strand of conductor into several smaller strands, or divide the cable into stranded conductors If there is a body, a subset of stranded wires is sent to each of the separate branches, or the electric This can be achieved by using a power divider. A power divider divides the cables. Useful for controlling the amount of current, voltage, and power flowing through each of the resulting branches. That is the case.

[0136] Similarly, in some embodiments, two or more cables are fused into a smaller number of cables. Signals from all merged cables can be stored. Such fusion is predetermined Fusing conductor strands with other strands, or using a subset of different strands in a new stranded cable Regroup them into a single unit, or use a power combiner (e.g., the same device as a power divider). However, this can be achieved by using a power combiner (which is used in the reverse direction). This controls the amount of current, voltage, and power flowing through each branch to which the cable is connected. It is useful.

[0137] In some embodiments, each cable stage of the heating system is designed according to the unique cable design considerations. There are some points to consider.

[0138] In some embodiments, efficient power transmission from the power supply to the TSP subunit is enabled. Cable stage 1 is selected for this purpose. In some embodiments, the power supply outputs DC current. Cable section 1 includes stranded copper wire insulated with suitable material and supplies to the TSP subunit. It has a total equivalent gauge suitable for the power, voltage, and current being measured. Power supply is 400Hz, 11 In some embodiments that output a 5VAC signal, the cable stage 1 is insulated with a suitable material. Furthermore, it has a total equivalent gauge suitable for the power, voltage, and current supplied to the TSP subunit. It includes stranded copper wire.

[0139] In some embodiments, efficient power transmission from the TSP to the ACG subunit is possible. Cable stage 2 is selected for this purpose. The TSP outputs power in the form of a 250VDC signal. In some embodiments, the cable section 2 is insulated with a suitable material and is a TSP subunit. Includes stranded copper wire having a total equivalent gauge suitable for the power, voltage, and current supplied to the device.

[0140] Some embodiments involve a high-frequency AC power signal from the STU output to the regulating network. Cable stage 3 is selected and customized to enable efficient power transmission. Example For example, this cable reduces resistance and electromagnetic loss caused by high-frequency signals. Furthermore, it shields against external interference that could alter the integrity of the signal, and protects surrounding equipment and materials. It can be designed to prevent signal leakage from cables that could potentially cause problems. In some embodiments, the cable section 3 is a high-speed version of a customized coaxial cable. The output is a high-frequency transmission line. In some embodiments, this coaxial cable is an adjustable line. A core conductor that carries the input signal of a network, capable of carrying power with low resistance loss. A core conductor consisting of stranded copper wires of a certain outer diameter, and for enhanced electrical insulation and high voltage and high temperature A dielectric surrounding a core selected to maintain a certain temperature range, and a power carrier with low resistive losses. A signal return to an ACG made of twisted and braided copper of sufficient size and equivalent gauge. A shield conductor that provides a path and is selected to maintain high voltage and high temperature ranges. A first casing insulates the conductive shield, and an external shield similar to the conductive shield. However, it does not directly conduct current, but is used to protect the cable from external interference and prevent leakage. An outer shield, and finally, a second casing similar to the first casing that insulates the outer shield. It is made with G.

[0141] In some embodiments, AC power of high-frequency high current from the regulating network to the target region Cable section 4 is selected and customized to enable efficient signal transmission. In some embodiments, this cable has an impedance between the adjustment network and the target area. Adjust the dance and reduce resistance and electromagnetic losses caused by high-frequency signals, It shields against external interference that could alter the integrity of the unit and affect surrounding equipment and materials. Designed to prevent signal leakage from cables that may be leaking. Several implementations In this configuration, cable stage 4 is a customized coaxial cable for high power, high frequency and These are high-current transmission lines, and in order to improve high-current performance and further reduce resistance losses, Aside from using a larger conductor gauge and diameter, and an additional silver coating on the same conductor, This is the same as the embodiment of cable stage 3 described above. In some embodiments, the cable Stage 4 is further customized based on the Litz wire design. The purpose of such a design is Individually insulated (for example, using enamel coating), and twisted together in perfect symmetry By manufacturing conductors thinner than the outer layer from a braided brand, the cable This is to reduce losses due to proximity and skin effects.

[0142] Generally, electrodes contain a material that conducts electric current, and they are used to introduce or remove electric current from a target region of a bulk medium. In some embodiments, a connector is used to connect the electrodes to the bulk medium. A connector refers to a fitting that connects electrodes to a bulk medium. Several embodiments Therefore, electrodes and connectors are designed to reduce contact resistance between the electrodes and the bulk medium. In other words, the electrodes are generated between both ends of the target region for a given return path. It is designed to smooth out the potential difference. This contact resistance is the resistance of the target region between the two electrodes. If the resistance is higher, more heat is generated at the contact point than along the target area, and elsewhere... This becomes equal, and the heating efficiency of the heating system decreases. In some embodiments, a similar principle applies. Therefore, the electrodes and connectors are located between the electrodes and the wires (or cables) of the heating system. Designed to reduce contact resistance. In some embodiments, the electrodes and connectors are Furthermore, it is designed to reduce electromagnetic losses (e.g., electromagnetic radiation).

[0143] In some embodiments, electrode design considerations for achieving one or more of the above objectives Therefore, (1) select an electrode material with high conductivity, and (2) the electrode and bulk This involves increasing the "actual" contact area between the medium and the electrode, and between the electrode and the wire. The "actual" contact area is the minute contact between metals or materials through which an electric current flows from one material to another. It refers to a touch and is often called a "spot." In some embodiments, a connector It is also designed to achieve these goals.

[0144] In some embodiments, the electrode material is silver, copper, aluminum, carbon fiber composite, etc. It may contain tan or an alloy thereof.

[0145] In some embodiments, the electrodes are cables used to transmit current to the bulk medium. It is part of the bull.

[0146] In some embodiments, the shape of the electrode is adapted to fit a specific target area, and / Or to reduce contact resistance between the electrode and the bulk medium, and / or electromagnetic losses It is designed to reduce.

[0147] In some embodiments, the electrodes are circular.

[0148] In some embodiments, the electrodes are cables used to transmit current to the bulk medium. This is the shape of the end of the bull.

[0149] In some embodiments, line electrodes (for example, rectangular electrodes whose length is greater than their width) This is used.

[0150] In some embodiments, a 2D spline curve having a thin thickness (third spatial dimension) Electrodes of a specific shape are used.

[0151] In some embodiments, the cable conductor is sandwiched between the connector plate and the target area. It can be connected to the target area by and For example, a connector plate that makes contact with the target area A portion of the side of the cable can be milled. The cable conductor can be connected to this milled portion. By installing it in this configuration, the cable conductor can be connected to the target area. Furthermore, the electrode connector plate can be clamped or glued under the cable conductor. There is no need to bend the connection to ensure proper coupling with the target region.

[0152] In general, various implementation and design considerations for electrodes and connectors are discussed.

[0153] Figure 17 is a photograph of an exemplary circular stud electrode 1700 for the heating system 100. The electrodes are circles bonded to a disk 1710 made of a conductive material (e.g., aluminum). It includes a shaped grounding stud, on which a threaded conductive part 1720 (for example, aluminum) is attached. It is installed.

[0154] In some embodiments, the conductor of the cable connected to the target region via the electrode 1700 It is wrapped around the threaded conductive part 1720, laid flat, and the threaded conductive part and It covers a significant portion of the surface area of ​​both discs. In some embodiments, the nut and w Using the shear on the threaded conductive part 1720, press the conductor against the disk 1710, This ensures a higher contact area and lower contact resistance.

[0155] In some embodiments, the air gear between the washer, cable, and disc 1710 The cap is filled with an electrically and / or thermally conductive thermal interface material, and the cable is studless. An improvement in thermal and / or electrical conductivity to 1700 is guaranteed.

[0156] In some embodiments, the circular stud electrode 1700 heats the target area from the cable. and a specially selected adhesive with sufficient electrical and thermal conductivity to conduct electrical signals. Therefore, it is attached to the target area. In some embodiments, the adhesive is also used for nuts and It also possesses sufficient strength to withstand the torque generated by the washer.

[0157] In some embodiments, the connector has considerable compressive strength between the electrode and the bulk medium. As given, it is a U-shaped fixture attached to the bulk medium and electrodes.

[0158] In some embodiments, the materials of the electrodes and connectors are chosen to reduce their weight. It can be selected. In some embodiments, the electrode material is chosen to reduce its weight. In addition, it is selected to improve the electrical and / or thermal conductivity through the material. The conductivity is determined by the electrode design, where the current flowing from the cable to the target region passes through the electrodes (for example, This could be advantageous for circular studs (one-plate design).

[0159] In some embodiments, a specific enclosure is included as part of the design of the connector and electrodes. Included. For example, such an enclosure provides thermal mitigation and / or insulation, and electrical insulation. EMI shielding, corrosion protection, seismic and shock resistance, durability, protection from external contamination and deposits It can be selected for environmental conditions, including standards for protection of [unclear / unclear].

[0160] Generally, various adhesive configurations between electrodes and / or connectors and bulk media (and so These combinations are being considered. In some embodiments, their configurations include electrodes. To reduce contact resistance between the bulk medium and / or to reduce electromagnetic losses.

[0161] In some embodiments, electrodes are connected to a bulk medium using brazing. Figure 18A shows electrode 1802 and the target bulk medium which is part of a large bulk medium 1806. This is a schematic diagram of an exemplary brazed joint attachment 1800 between region 102 and region 102. Brazed joint Brazing material is used to produce part 1804. For example, low-temperature brazing filler material ( For example, an electrode can be brazed to a target area using AL802 to create a low-resistance contact. This is possible. In some embodiments, oxidation (the aluminum oxide layer at the brazing site) To reduce the formation of the filler material, it is coated with flux. This material dissolves oxides at high temperatures and prevents the surface from re-oxidizing until the filler material wets the surface.

[0162] In some embodiments, the electrode and the target area are covered together under pressure and heating. For example, in some embodiments, a compressive force is applied between the electrode and the target region. If bundling is not desired, the compressive force between the electrode and the bulk medium is given by the following equation: This can reduce contact resistance.

number

[0163] In some embodiments, a mechanical fastening connector is used to apply compressive force to the electrode and bulk A medium can be connected. Figure 18B shows an electrode 1802 and a large bulk medium 1806. This is a schematic diagram of an exemplary mounting configuration 1820 between a part of the target area 102. Use the VETH 1822 to apply compressive force and connect the electrodes to the target region.

[0164] In some embodiments, a vacuum tape or similar material is used between the electrode and the target area. The connection can be pressurized and sealed. Figure 18C shows electrode 1802 and large bulk medium 180 This is a schematic diagram of an exemplary mounting configuration 1840 between the target area 102, which is part of 6. Air seal tape 1842 is used to connect the pole and the target area. After completion, a suction device is used to create a vacuum between the electrode and the target area, thereby separating the two. They can be crimped together.

[0165] In some embodiments, the compressive force is applied by clamps that sandwich the electrode and the target area, such as C-clamps. This can be done by using a PU to increase the pressure at those interfaces.

[0166] In some embodiments, the compressive force can be applied using a magnet or a magnetized surface. In some embodiments, either the surface of the electrode or the surface of the target area is magnetized, and the magnet An attractive force becomes possible between the electrode and / or the contact area, resulting in the desired compressive force. In some embodiments, two or more magnets are used, and the electrodes and target area are connected to them. When sandwiched between them, the attractive force between the magnets becomes possible, resulting in the desired compressive force. Several implementations In this configuration, both the electrode surface and the target region surface are magnetized, and an attractive force is generated between the electrode and the target region. This allows the desired compressive force to be achieved.

[0167] In some embodiments, the compressive force is applied to an external surface that adheres to or near the target area. Alternatively, it is applied by an internal compression fixing connector, converting the adhesive strength into the desired compressive force. In some embodiments, an adhesive (e.g., a curing adhesive) is combined with the fastener connector. It can be used in this way.

[0168] In some embodiments, one of the methods described above or an alternative technique is used to partially move the electrode It can be embedded in bulk media either individually or as a whole.

[0169] In some embodiments, a conductive material (e.g., graphene) is placed between the electrode and the target region. They are placed.

[0170] In some embodiments, the connector material used to connect the electrodes to the target region is The adhesive was selected to enhance strength and ensure long-term bonding to the target area. The strength of the adhesive is determined by the relatively small size of the bonding area and the relatively strong mechanical constraints imposed on the bonding area. This may be advantageous for bonding (for example, in the case of a U-shaped stud electrode). In one embodiment, the electrodes are bonded If the electrode needs to be held in place after application of the adhesive for curing, the electrode should be positioned in the correct location. To maintain it, use internal or external / disposable fasteners that utilize adhesive and mechanical force. It is possible.

[0171] In some embodiments, the connector material used to connect the electrodes to the target region is also To improve the flow of current and heat from the cable to the target area, a higher thermal conductivity is used. The name and / or electrical conductivity is selected. For example, a higher conductivity means the adhesive is better suited to the cable / The electrodes used are mounted so as to be located along the path of the current flowing from the electrodes to the target region. In some cases, this may be a consideration (for example, when using circular stud electrodes and single-plate electrodes). (In the case of design electrodes). For this purpose, in some embodiments, nanomaterials (e.g., C NT) is placed between the electrode and the bulk medium. In some embodiments, the surface of the electrode The portion of the bulk medium surface that comes into contact with the electrode (e.g., the target area) is the "actual" area between them. The process can be used to increase the contact area at the edge.

[0172] In some embodiments, the connector is used in combination with the embodiments described above and other embodiments. The electrodes and a portion of the target area are covered with a material that reduces or eliminates electromagnetic loss.

[0173] In some embodiments, any combination of the above methods can be used for any electrode and connector. It is used in conjunction with the embodiment shown. For example, Figure 18D shows an electrode 1802 and bulk medium 180 This is a schematic diagram of an exemplary combination mounting portion 1860 between the target area 102 of 6. The mounting section includes a brazed joint 1804 and a solid rivet 1822.

[0174] In some embodiments, physical contact is not required to generate the desired current. Therefore, the system may not require connectors / cables. In that case, In some embodiments, the signal return path is an additional wire that returns to the regulating network. It can be divided into parts.

[0175] Embodiments of heating systems described herein involve applying high-frequency waves to a target area of ​​the aircraft's skin / airframe. By supplying AC current (for example, by generating Joule heat) from the surface of the aircraft It can be used as a de-icing / anti-icing device to melt ice. The heat is conducted to the surface of the aircraft and then convects across the interface between the aircraft and the ice into the ice. In some embodiments, the ice melts completely. In some embodiments, a portion of the ice (in direct contact with the aircraft) melts. The layer (in contact with the aircraft) melts, forming a layer of water between the ice and the aircraft, causing the ice to slide off or to fall off the aircraft. It can be mechanically removed. In some embodiments, heating occurs before ice is present, and ice formation occurs. To prevent this.

[0176] In some embodiments, when the ice melts, a high-frequency AC current continues to be supplied inside the machine. The generation of Joule heat is maintained, and that heat is formed / remains on the surface by conduction and convection. It is transmitted through the water.

[0177] Figures 19-32 show the transport and supply of electromagnetic energy for a bulk medium heating system. Examples of assemblies are provided. These assemblies (referred to herein as “joining strips”) These, in conjunction with the bulk conductive medium to which they are attached, function similarly to a transmission line. It is configured in such a way. For example, in some embodiments, the design of the coupling strip is such that The bulk medium itself conducts current, just like the current flowing through the transmission line. The coupling strip is The AC signal from the line can be electromagnetically coupled to the bulk medium, thereby the bulk medium It generates an electrical signal corresponding to the body. Therefore, in effect, the design of the binding strip is There are devices that allow the fluorocarbon medium to also function as a transmission line (in combination with coupling strips). This involves a bulk medium and a coupling strip working together to form a system that operates like a transmission line. It can be said that it is something that exists, and it can be analyzed and designed as such.

[0178] For example, as described above, embodiments of this disclosure involve a conductive medium (e.g., bulk medium, conductor). A mechanism for shaping the current within (e.g., contraction, extension, etc.), for example, a skin effect By manipulating the effect and proximity effect, it is configured to generate heat within the bulk medium. This can be achieved by passing a high-frequency AC current through the conductive medium to be heated. It depends. The skin effect is that alternating current ("AC") has the highest current density near the surface of the conductor. By utilizing the tendency for current to be distributed within a conductor in such a way that it decreases as the depth of the conductor increases, The proximity effect suppresses the flow. The proximity effect places another AC current path close to an existing current flowing through a conductor. This can be used to further suppress the current flowing through the conductor. The effect may also be to lengthen the current path. The coupling strip is in the system described above. In addition to the process, it can be used to generate and control such effects. For example, coupling strips can be used in the various power control systems described above. .

[0179] Figure 19 is a cross-sectional view of an exemplary bonding strip 1900. Bonding strip 1900 This involves supplying a high-frequency current signal to bulk media such as the aircraft skin (1902) to add to the bulk media. It can be used for heating. The bonding strip 1900 is on the bulk medium 1902. The first dielectric layer 1908, the conductive layer 1904 on the first dielectric layer 1908, the conductive layer 190 4. A second dielectric layer 1908 on top of, and a conductive shielding layer 1 on top of the second dielectric layer 1908. It has a multilayer structure including 906.

[0180] The first dielectric layer 1908 has a thickness D1. The conductive layer 1904 has a thickness D2. The second dielectric layer 1908 has a thickness D3. The conductive shielding layer 1906 has a thickness D It has 4. The overall thickness of the bonding strip 1900 is D5. The conductive layer 1904 is copper copper alloys (e.g., brass or bronze), silver, silver alloys, aluminum, aluminum alloys Gold, titanium, titanium alloys, chromium, nickel, nickel alloys, cobalt alloys, corrosion-resistant steel, Made from conductive materials including, but not limited to, laphite or combinations thereof. The conductive shielding layer 1906 is made of copper, copper alloy (for example, brass or blue). Copper, silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy, chromium, nickel Nickel, nickel alloys, cobalt-based alloys, corrosion-resistant steel, graphite, or combinations thereof It can be made from conductive materials including, but not limited to, those with a specific pattern. In this configuration, the conductive shielding layer 1906 is made of metal foil (e.g., copper foil or aluminum foil) or braided It can be formed as a composite metal layer. Dielectric layer 1908 is made of Kapton, Mylar, Poly Ethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, They can be made from dielectric materials including, but not limited to, combinations thereof. ru.

[0181] In some embodiments, the bonding strip 1900 is a protective layer on top of the conductive shielding layer. Includes, for example, the protective layer is polyurethane, polyfluoride, paint, paint substitute film, This may include one or more layers of sealant, or a combination thereof. These are not the only options.

[0182] As shown in Figure 20, the connecting strip 1900 is connected to the aircraft skin 2000 (for example It is placed on the surface of a bulk medium such as a wing, and supplies current to the bulk medium, and current within the bulk The bulk medium can be heated by generating and shaping the flow. Bonding strip 190 The 0s extend along the surface of the aircraft's outer skin 2000 and are spaced apart from one another. In some embodiments, one or more binding strips 1900 are binding strips ( For example, short bonds that electrically connect at least a portion of the conductive layer 1904) to the bulk medium 1902. Includes entanglement termination. For example, the coupling strip 1900 is terminated with electrodes as described above, and includes therein A closed circuit (e.g., a short circuit) is formed between the conductive layer 1904 and the bulk medium 1902. This is possible. The termination of the coupling strip 1900 is on the opposite side from the end to which current is supplied (for example, This is the far end of the strip (opposite the power input terminal). In some embodiments, one or Multiple coupling strips 1900 are terminated with an open circuit. An open circuit termination means that coupling strip 19 The end of 00 remains open, and the bulk medium 1902 or coupling strip 1900 is not connected. This means that it is not connected to electrical ground via any of the electrical shielding layers. In that embodiment, one or more binding strips 1900 are binding strips 190 An impedance adjustment component connected between 0 and bulk medium 1902 (for example) , terminated with circuit elements. For example, coupling strip 1900 is capacitive, resistive, or It can be terminated with an inductive termination. For example, a capacitor, inductor, or resistor. Which circuit element is between the conductive layer 1904 of the coupling strip 1900 and the bulk medium 1902? It can connect to

[0183] Referring to Figures 19 and 20, the power control system (for example, the power control system described above) M104) is connected to one end of each coupling strip in order to supply current to each coupling strip. They are combined. For example, the power lines from the power control system are connected to each carrier strip 190 It can be bonded to a conductive layer of 0, and to a bulk medium 1902 (e.g., aircraft skin 2000) One or both of them can be connected to electrical ground.

[0184] The power control system supplies AC current to each carrier strip 1900. For example, The power control system can provide AC current at frequencies from 1kHz to 450MHz. In some embodiments, the frequency is 1 MHz to 450 MHz. In terms of configuration, the frequency is 1kHz to 1MHz. The power control system is for each coupling strip. It can be configured to supply AC current of 0.1 amperes to 200 amperes to 1900. Yes, it is possible. For example, the electrical arrangement of the power supply and coupling strip 1900 of the power control system is A desired amount of current (e.g., 0.1 amperes to 200 amperes) is supplied to each coupling strip 1900. a) can be configured to supply. One common example is a binding strip. When 1900s are coupled in series to a power control system, each coupling strip 1900 A 100-amp power supply can be used to supply 100 amps of current to it. When 10 coupling strips 1900 are coupled to a power control system in parallel with each other, A 100-amp power supply is used to provide 10 amps of current to each coupling strip 1900. This can be supplied. In this example, the impedance of each coupling strip is the same. Please note. As explained below, the impedance of coupling strip 1900 is Control the current distribution between the strips to be as desired or required for a specific heating application. To achieve this, it can be adjusted in various ways.

[0185] The AC current for heating the aircraft skin 1902 is supplied through the conductive layer 1904. The AC current supplied through the conductive layer 1904 is as shown in Figures 22A-22B. , within the aircraft skin 1902 (for example, by electromagnetic capacitance and inductive coupling) the corresponding current To generate. Figures 22A and 22B show an exemplary configuration attached to a conductive bulk medium 1902. Output of electromagnetic finite element analysis (FEA) simulating the operation of coupling strip 1900 Lot diagram is shown. Bulk medium 1902 (for example, simulated as the outer skin of an aircraft) ), conductive layer 1904, and conductive shielding layer 1906 are plotted as shown in Figure 22A. As shown in the figure. Figure 22B shows the individual components of the coupling strip 1900. Not present, but rather a binding strip 1900 (as commonly depicted) and bulk medium 1902. The area indicated by 2206 in both plots represents the background environment (atmosphere, etc.). Both plots are shown, induced in bulk medium 1902 and indicated in shaded region 2204. Normalized current density (A / m 2 ) shows. The current density of bulk medium 1902 is shown by bulk medium 19 It is maximum in a narrow region near the surface of 02. Furthermore, the plot in Figure 22A shows the bonded stream The normalized electric field strength in the dielectric layer of 1900 (light gray scale region 2202) This is shown. In particular, the conductive shielding layer 1906 is generated by the current passing through the conductive layer 1904. Shielding the surrounding environment 2206 from the electric field, for example, reducing or eliminating electromagnetic radiation and coupling The strip 1900 is protected from external electromagnetic interference. The bulk medium 1902 is, for example, an electric field. It also functions as a shielding layer by minimizing or blocking the conduction. Therefore, conductive shielding layer 1 906 and the bulk medium 1902 connect in an electric field in an embodiment of the coupling strip 1900. Within the composite strip 1900 (for example, between the conductive shielding layer 1906 and the bulk medium 1902) This can help contain the heating system between other nearby electrical components. Reduces or prevents electromagnetic interference between them. Bonding strip in combination with bulk medium 1902. The 1900 embodiment achieves operational performance comparable to that of a stripline type transmission line. It is possible.

[0186] Referring again to Figure 19, the heating effect of the carrier strip 1900 on the bulk medium, The impedance of each coupling strip 1900 is determined by the characteristics of the carrier strip, for example. various layers 1904, 1906, and 1908 have different thicknesses, conductive layer widths, and conductive layer layouts. Furthermore, by changing the materials of each layer (including their dielectric constant and conductivity characteristics), Alternatively, by including impedance adjustment elements (capacitors, inductors, resistors, etc.) And it can be adjusted. Furthermore, the heating effect of the current generated in the bulk medium 1902 is As described above, the proximity effect and path of the heating current passing through the bulk medium 1902 are adjusted. These properties, which are also useful for this purpose, can be changed by altering them.

[0187] For example, layers 1904, 1906, and 1908 are generally 0.1 mil to 1 inch. Between 'chi', or in some embodiments, each in the range of 0.5 mil to 10 mil It can be formed with a thickness (D1~D4). In some embodiments, the bonding strip P1900 separates the conductive layer 1904 from the bulk medium 1902, and the conductive layer 1904 is conductive The shielding layer 1906 can be formed at different distances from the shielding layer. Several implementations In this state, these distances are related by ratio. For example, the coupling strip 1900 is The relative thicknesses D1 and D3 of the electrolytic layer 1908 are formed to be related in proportion. This can be done. For example, in some embodiments, the ratio of D1:D3 can be changed from 1:1 to 1:5. It can be set to a range. The ratio D1:D3 can be, for example, set to the desired current density for a given application. In other embodiments, to obtain the and / or impedance values, in the range of 1:1 to 5:1 It can be reversed. In one exemplary embodiment, D1 is 3 mils, D2 is 1 mil, D3 is 3 mils, and D4 is 1 mil. In another exemplary embodiment, D1 is 7.2 mils. D2 is 1.4 mil, D3 is 2.4 mil, and D4 is 1.4 mil. Furthermore, another exemplary example... In terms of application method, D1 is 1000 mils, D2 is 50 mils, D3 is 500 mils, and D4 is 50 It is a mill. In yet another exemplary embodiment, D1 is 10 mills, D2 is 2.5 mills, D 3 is 50 mils, and D4 is 2.5 mils. In yet another example, D1 is 2.4 mils, D 2 is 1.4 mil, D3 is 7.2 mil, and D4 is 1.4 mil. In another example, D1 is D2 is 17.6 mils, D3 is 9.8 mils, and D4 is 24.5 mils. In yet another example, D1 is 100 mils, D2 is 20 mils, D3 is 250 mils, and D 4 is 20 mils. In yet another example, D1 is 5.5 mils, D2 is 2.5 mils, and D3 is 9.0 mils, and D4 is 2.5 mils. In yet another example, D1 is 1.5 inches. D2 is 0.25 inches, D3 is 2.2 inches, and D4 is 0.25 inches. In another example, D1 is 3.8 mil, D2 is 2 mil, D3 is 3.8 mil, and D4 is 2 mil In another example, D1 is 2.9 mil, D2 is 1.5 mil, and D3 is 5.8 mil. , and D4 is 2.5 mil. In yet another example, D1 is 5 mil and D2 is 2.5 mil. D3 is 25 mils, and D4 is 1.5 inches. In yet another example, D1 is 11 mils. For example, D2 is 3 mils, D3 is 5.5 mils, and D4 is 3 mils. In yet another example, D1 is 21 mils, D2 is 1.5 mils, D3 is 7 mils, and D4 is 2.5 mils. In other examples, D1 is 10 mils, D2 is 2.5 mils, D3 is 2 mils, and D4 is 2. It is 5 inches. In other examples, D1 is 4.5 inches, D2 is 0.25 inches, D3 D4 is 1.5 inches, and D4 is 0.25 inches. In another example, D1 is 3 mils, and D2 is 1 mil, D3 is 3 mil, D4 is 1 mil. In yet another example, D1 is 10.2 mil, D D2 is 3.5 mils, D3 is 40.8 mils, and D4 is 2.5 mils. In yet another example... D1 is 4.8 mil, D2 is 0.5 mil, D3 is 14.4 mil, and D4 is 0.5 mil In another example, D1 is 15 mil, D2 is 1.4 mil, D3 is 3 mil, D4 It is 1.4 mils. In yet another example, D1 is 113 mils, D2 is 10 mils, and D3 is 2 8.25 mils, and D4 is 10 mils. In yet another example, D1 is 127 mils, D 2 is 5 mil, D3 is 254 mil, and D4 is 10 mil. In yet another example, D1 D1 is 53 mils, D2 is 12 mils, D3 is 159 mils, and D4 is 12 mils. In another example, D1 is 13 mils, D2 is 1.4 mils, D3 is 2.6 mils, and D4 is 1.4 mils. In yet another example, D1 is 23 mils, D2 is 4 mils, D3 is 46 mils, and D 4 is 4 mils. In yet another example, D1 is 11.5 mils, D2 is 2.8 mils, and D3 is 57.5 mils, and D4 is 2.8 mils. In yet another example, D1 is 10 mils, D D2 is 1.4 mil, D3 is 2.5 mil, and D4 is 1.4 mil.

[0188] Furthermore, the width of the conductive layer 1904 is generally in the range of several inches or several mills across the entire layer. Figure 21 illustrates various configurations of the conductive layer 1904 within the bonding strip 1900. To that end, top views of several exemplary bonding strips (Examples 1-9) are shown. Figure 21 shows the bonding strips For illustrative purposes, the composite strip 1900 is a layer on top of the conductive layer 1904 (for example, a second dielectric layer). The image shows the body layer and conductive shielding layer removed. Cross-section of conductive layer 1904. The product can be varied along its length. For example, the width of the conductive layer 1904 is the bond Adjust the impedance of strip 1900, and in some cases, the bulk medium and conductive The current density of the layer can be adjusted by changing it along its length. Examples 1- 9 shows several exemplary width variation patterns of the conductive layer 1904 of the bonding strip 1900. For example, the width of the conductive layer 1904 across the bonding strip 1900 is the maximum width and minimum width. It can vary between these two values. In some embodiments, the maximum width is only about 1.5 times the minimum width. Yes. In other embodiments, the maximum width can be 100 times the minimum width. For example, as shown in Example 1. The width of the conductive layer 1904 is 1.5 inches at its widest point (e.g., the top edge), The narrowest point (e.g., the lower end) can be 1 inch. In another example, the conductive material shown in Example 1 The width of layer 1904 is 1 inch at its widest point (e.g., top edge) and its narrowest point (e.g., For example, the lower end could be 10 mils.

[0189] In some embodiments, the thickness of the conductive layer 1904 may vary along its length. For example, the width of the conductive layer 1904 is used to adjust the impedance of the coupling strip 1900. The thickness of the conductive layer 1904 and Both the width and the material can vary along its length.

[0190] In some embodiments, the impedance of the coupling line 1900 is the impedance of the conductive layer 1904. Impedance adjustment components (e.g., one or more locations along the length) This can be adjusted by including components such as densifiers, inductors, and resistors. For example For example, the conductive layer is divided into several segments along its length, and those segments are then combined into one. Alternatively, it can be connected with multiple impedance adjustment components. For example, see Figure 21. Referring to Example 4 of the bonding strip, the conductive layer 1904 has two cells in region 2102 It can be divided into components, and impedance adjustment components (e.g., capacitors) Electrically connect each segment (a resistor, inductor, or a combination thereof) between them. It is possible to do so. Alternatively, or further, the impedance adjustment component can be placed in the conductive layer 1 Shank between 904 and either the bulk medium 1902 or the conductive shielding layer 1906 It can be connected to a conductive layer as a component.

[0191] In some embodiments, the width, thickness, or both of the conductive shield layer 1906 are bonded It can be varied along the length of the strip 1900. In some embodiments, dielectric Vary the width, thickness, or both of the body layer 1908 along the length of the binding strip 1900. This is possible. For example, in some embodiments, a conductive layer 1904, a dielectric layer 1908, and the cross-sectional area of ​​the conductive shielding layer 1906 is varied along the length of the strip 1900. It is possible.

[0192] Figure 23 shows several exemplary arrangements of the conductive layer 1904 within the bonding strip 1900. The layout diagram (AE) is shown. First, in the linear arrangement (shown in Figure 21), The conductive layer 1904 extends linearly along the length of the bonding strip. Layout AE is The conductive layer 1904 is arranged so as to extend along a nonlinear pattern or path. This shows lip 1900. Specifically, the example shown in Figure 23 illustrates various different meandering patterns. The diagram shows the conductive layer 1904. The illustrated meandering pattern is the conductive layer 1904. The segments are positioned side by side in the width direction of the joining strip 1900. The arrangement shortens the overall length of the bonding strip 1900 while maintaining the desired overall length of the conductive layer 1904. It allows for shrinkage. In some applications, different conductive layers of bonding strip 1900. Maintaining a relatively uniform length relative to 1904 is possible with bond strips of different lengths 19 Helps maintain consistent impedance between 00 and 00. For example, layout A and In each of B, the conductive layer 1904 can be formed to the same length. However, However, the total length of the coupling strip 1900 in layout B is (for example, as shown in Figure 21) (Una) The length of the coupling strip 1900 having a linearly arranged conductive layer can be shortened to half. Yes, it is possible. Similarly, the total length of the coupling strip 1900 in layout C is the length of the linearly arranged conductive layers. The length of the provided coupling strip 1900 can be shortened to one-third of its original length. The length-reducing connecting strip 1900 is intended to be placed in spatially constrained locations on the aircraft body. This is possible. For example, a coupling strip having conductive layers arranged according to layouts A to E. 1900 is too long to fit because the coupling strip 1900, which has a linear conductive layer arrangement, is too long. It can be placed in a narrow area of ​​the wing (for example, the wingtip).

[0193] Each layout A to E is arranged along a non-linear path from input terminal 2302 to termination terminal 2304. The diagram shows a bonded strip 1900 having a conductive layer 1904. Layout A is double A coupling strip 1900 having a conductive layer 1904 in the arrangement is shown. Conductive layer of layout A 1904, for example, along a U-shaped path from input terminal 2302 to termination terminal 2304 Includes two segments arranged side by side. Figure 24A shows the combined strip by layout A. A cross-sectional view of the AA' line of point 1900 is shown.

[0194] Layout B shows a coupling strip 1900 with a triple-arranged conductive layer 1904. The conductive layer 1904 of layout B extends, for example, from the input terminal 2302 to the termination terminal 2304. It includes three segments arranged side by side along an S-shaped path. Figure 24B shows the This shows a cross-sectional view of the connecting strip 1900 by Iout B along the BB' line.

[0195] Layouts C and D are bonded strips 1 with four different conductive layers 1904 arranged in a quadruple configuration. It shows 900. The conductive layers 1904 of layouts C and D are aligned with each other. It includes four segments arranged in the layout C. In layout C, the segment of conductive layer 1904 For example, an M-shaped path (or a W-shaped path) from input terminal 2302 to terminal 2304. ) are arranged in ). In layout D, the segments of conductive layer 1904 are, for example, double-arranged. They are arranged as folded and lined up. A similar technique is applied to the triple-arranged conductive layer 1904. It can also be applied and then folded and arranged side by side. Figure 24C shows layout C This shows a cross-sectional view of the coupling strip 1900 along the CC' line according to layout D.

[0196] Layout E shows a more typical arrangement of the conductive layer 1904. For example, layout E is an example of a conductive layer 1904 in which multiple segments of different widths are arranged side by side. This shows that, in some embodiments, the conductive layer 1904 is shown in layout E. Therefore, the segment interconnections 2306 are included at various locations between segments. This is possible. In some embodiments, the coupling strip 1900 also has multiple signal input terminals. It may include 2302.

[0197] Figure 25A shows an exemplary method for attaching the binding strip 1900 to the bulk medium 1902. A cross-sectional view of the configuration is shown. Figure 25A shows the bottom mounting configuration. , the bottom surface of the bonding strip 1900 (e.g., the bottom dielectric layer) and the surface of the bulk medium 1902 An adhesive 2502 is placed between them. For example, the adhesive is a double-sided adhesive layer (for example, both This may be, but is not limited to, hook-and-loop tape, resin, or epoxy.

[0198] Figure 25B shows another example of attaching the binding strip 1900 to the bulk medium 1902. A cross-sectional view of an exemplary configuration is shown. Figure 25B shows the top mounting configuration. Top mounting configuration Next, the adhesive layer 2504 is applied to the bonding strip 1900, and the bonding strip 1 900 is attached to the aircraft skin 1902. The adhesive layer 2504 is, for example, an adhesive coating. It can be an adhesive film or tape.

[0199] Figure 26A shows the bonded strip with a double-sided adhesive bottom layer before being placed on the bulk medium 1902. Figure 26B is a cross-sectional view of part 1900, and Figure 26B shows the part of Figure 26A installed on the bulk medium 1902. This is a cross-sectional view of the coupling strip 1900. Several embodiments, such as a bottom mounting configuration, are shown. The bonding strip 1900 includes an adhesive bottom layer 2608. The adhesive bottom layer is made of double-sided adhesive (e.g. For example, it can be formed from double-sided tape. In such embodiments, the double-sided adhesive is It can function as a lower dielectric layer (for example, the lower dielectric layer 1908 in Figure 19). In some embodiments, the adhesive bottom layer 2608 is, for example, the bottom of the lower dielectric layer 1908. This can be an adhesive coating or adhesive film applied to the surface. Before installation, the adhesive bottom layer 2608 The bonding strip 1900 having the adhesive bottom layer 2608 may include a liner 2610. Liner 2610 can be, for example, a release layer. For example, Liner 2610 is installed The adhesive bottom layer 2608 may be protected beforehand. During installation, the liner 2610 will protect the adhesive bottom layer 260 Remove from 8 to expose the bonding surface, and place the bonding strip 1900 on the bulk medium 1902. It can be attached to a surface.

[0200] In some embodiments, the dielectric layer 1908 is attached to the conductive layer 1904, And / or to attach the conductive shielding layer 1906 to the dielectric layer 1908, one or This can include multiple adhesive layers 2604 and 2606. In some embodiments, The bonding strip 1900 includes a protective layer 2602 on top of a conductive shielding layer 1906. For example, protective layer 2602 is polyurethane, polyfluoride, paint, paint substitute film, This may include one or more layers of sealant, or a combination thereof. These are not the only options.

[0201] In some applications, it may be necessary to heat non-conductive bulk media. In such cases, the heating system and bonding strip described herein are non-inductive. The electrolytic bulk medium can be modified to be heated. For example, the embedding layer can be bonded to the bulk medium. It can be used in conjunction with a lip heating system to heat non-conductive bulk media.

[0202] Figures 27A to 27F show cross-sectional views of various embodiments of the embedded bonding strip. Figure 2 7A shows a coupling strip 2700 similar to coupling strip 1900 in Figure 19. Similar to strip 1900, the bonded strip 2700 is first on the bulk medium 1902 dielectric layer 1908, conductive layer 1904 on the first dielectric layer 1908, conductive layer 1904 A second dielectric layer 1908, and a conductive shielding layer 1906 on the second dielectric layer 1908. , and a multilayer structure including an optional protective layer 2706 on a conductive shield layer 1906 The protective layer 2706 is the same as the protective layer 2602 described above. The bonding strip 2700 It is attached to the surface of the non-conductive bulk medium 2702, and the non-conductive bulk medium 2702 is The bonding strip 190 includes a bulk conductive material 2704 embedded within it. It is different from 0. For example, bulk conductive material 2704 can be used as metal foil, metal tape, or It can be formed as a metal layer embedded in a non-conductive bulk medium 2702. For example. The non-conductive bulk medium 2702 is a non-conductive bulk medium 2702 with a b Layered material having a conductive material 2704 (e.g., carbon fiber composite, glass fiber composite, It may be (or Kevlar composite). Bulk conductive material 2704 is copper, copper alloy (e.g., brass) (Bronze or copper), silver, silver alloy, aluminum, aluminum alloy, titanium, titanium alloy chromium, nickel, nickel alloys, cobalt-based alloys, corrosion-resistant steel, graphite, or so These can be made from conductive layers such as combinations thereof, but are not limited to them.

[0203] In each of the examples shown in Figures 27A to 27F, the conductive layer of the coupling strip 2700 The AC current that passed through 1904 passes through bulk conductive material 2, not non-conductive bulk medium 2702. A heating current is generated in 704. Next, the heat generated in the bulk conductive material 2704 is (for example) If conducted (by thermal conduction), it is conducted into the non-conductive bulk medium 2702. In some examples, non-conductive If the electrically conductive bulk medium exhibits some conductive behavior, in addition to the bulk conductive material layer, a non-conductive layer is added. Heat is generated even in certain parts.

[0204] Figure 27B shows a configuration including only the protective layer 2706, the conductive layer 1904, and the dielectric layer 1908. An embodiment of the bonding strip 2700 is shown. The bonding strip 2700 is a conductive layer 1904 A protective layer 2706 is placed on top, and a conductive layer 1904 is placed on top of the dielectric layer 1908. The dielectric layer 1908 is made from the embedded bulk conductive material 2704 and the non-conductive bulk medium 2 It is separated by part of 702.

[0205] Figure 27C shows a bond including a conductive layer 1904 embedded in a non-conductive bulk medium 2702. An embodiment of strip 2700 is shown. The bonded strip 2700 in Figure 27C has a protective layer 2 It includes 706, a conductive shielding layer 1906, a dielectric layer 1908, and a conductive layer 1904. The bonding strip 2700 consists of a protective layer 2706, a conductive shielding layer 1906, and a dielectric layer. Layer 1908 is placed on top of conductive layer 1904. Conductive layer 1904 is non-conductive bulk Embedded within the medium 2702, and a portion of the non-conductive bulk medium 2702 is conductive bulk It is separated from material 2704. For example, conductive layer 1904 and bulk conductive material 2704 These can be placed between different layers of the nonconductive bulk medium 2702.

[0206] Figure 27D shows a modified example of the bonding strip 2700 shown in Figure 27C, but with a protective layer 2 Layer 706, the conductive shielding layer 1906, and the dielectric layer 1908 are not present.

[0207] Figure 27E shows a modified example of the bonding strip 2700 shown in Figure 27D, with a conductive layer 19 The geometric arrangement of 04 and bulk conductive material 2704 is reversed. That is, in Figure 27E In the arrangement of the bond strip 2700 shown, the bulk conductive material 2704 is connected to the conductive layer 190 It is located closer to the surface of the non-conductive bulk medium 2702 than 4.

[0208] Figure 27F shows the conductive layer 1904 embedded in the non-conductive bulk medium 2702 and the conductive An embodiment of the bonding strip 2700 including the shielding layer 1906 is shown. Figure 27F shows In the bonding strip 2700, the portion of the nonconductive bulk medium 2702 (for example, nonconductive) The bulk medium 2702 layer consists of a conductive layer 1904, a conductive shielding layer 1906, and a bulk medium. It is separated from the conductive material 2704. The non-conductive bulk medium 2702 is shown in Figure 19. It serves a similar purpose to the dielectric layer 1908 within the coupling strip 1900.

[0209] Figure 28 shows a diagram of one embodiment of the coupling strip connector 2802. Figure 2805 This is the circuit diagram of connector 2802. Connector 2802 is an integrated impedance matching connector. Includes the 2804 impedance matching network. The 2804 impedance matching network adjusts the input signal input. The surface 2806 and the coupling strip 1900 are electrically coupled. For example, The input signal interface 2806 may be connected via coaxial cable. The input terminal 2810 of face 2806 (for example, the center wire of a coaxial cable connection) is distributed The conductive layer 1904 of the coupling strip 1900 is coupled by line 2808. Input signal A The grounding terminal 2814 of interface 2806 (for example, the shield for coaxial cable connection) , by one or more wirings 2812, the bulk medium 1902 or the binding strip 1 It is bonded to one or both of the conductive shielding layers 1906 of 900.

[0210] The impedance matching network 2804 adjusts the input impedance of the coupling strip 1900. Adjust the dance to the desired level measured by the input signal interface 2806. It is configured as follows. The impedance adjustment network 2804 has fixed or variable impedance It can be used as an impedance adjustment network. For example, impedance adjustment network 2804 is As one of the impedance matching networks described with reference to Figures 12-15B It can be implemented. In Figure 2805, the impedance matching network 2804 is grounded and The conductive shielding layer 1906 and bulk medium 1902 of the bonding strip 1900 (or Either of the bulk conductive materials (2704) when implemented for non-conductive bulk media. This is implemented as a parallel capacitor C1 connected between the two.

[0211] Figure 29 shows a diagram of another embodiment of the coupling strip connector 2902. Connector 29 02 is, for example, two connecting strips 1900 to chain together Includes input signal interfaces 2906A and 2906B. Figure 2905 shows the connector. This is the circuit diagram for 2902. Connector 2902 is an integrated impedance matching network 2 Includes 904. The impedance matching network 2904 is an input signal interface. 2906A, 2906B and coupling strip 1900 are electrically coupled in series. This includes parallel impedance adjustment elements 2904A, 2904B, and 2904C. The input signal interfaces 2906A and 2906B can be connected via coaxial cable. The input terminals 2910 of the input signal interfaces 2906A and 2906B are The conductive layer 1904 of the coupling strip 1900 is coupled to each other by the wiring 2908. The ground terminals 29 of the input signal interfaces 2906A and 2906B are combined. 14 is connected by one or more wirings 2912 to the bulk medium of the coupling strip 1900 Either 1902 or the conductive shielding layer 1906, or both, are bonded to it.

[0212] In Figure 2905, the impedance matching network 2904 is connected to ground and coupling stream The conductive shielding layer 1906 and bulk medium 1902 (or non-conductive bulk medium) of the top 1900 Between any or both of the bulk conductive materials (2704) when implemented for use as a medium Implemented as a connected series capacitor C1 and two shunt capacitors C2 and C3. It will be done.

[0213] Figure 30 shows a first exemplary batter using the coupling strip 1900 according to an embodiment of the present disclosure. This is a block diagram of the Lux medium heating system 3000. The heating system 3000 is arranged between each other. Multiple units are spaced apart and attached to bulk media 1902 (e.g., aircraft wings). Includes coupling strips 1900. Each coupling strip 1900 is connected to the power control system 30 It is connected to 02. Power control system 3002 is connected to the power control system 104 described above. It can be implemented as any of the embodiments. The power control system 3002 is each strike It supplies AC current to the lip.

[0214] One end of each coupling strip 1900 (referred to herein as the "input end") is a connector It is coupled to the power control system 3002 via 3004. In the illustrated example, each coupling string The opposite end of the pp 1900 (referred to as the "terminus" in this specification) is either an open termination 3006 or a closed termination The coupling strip 1900 has one of the terminations 3008. The coupling strip 1900 is adjacent to the coupling strip Each of the 1900 pairs is arranged in an alternating pattern with different types of terminations. For example, each One coupling strip 1900 of the adjacent pair has an open-circuit termination 3006 at its end, and the other The coupling strip 1900 has a closed end 3008 at its end. The open end 3006 is The end of the coupling strip 1900 remains open, and the bulk medium 1902 or coupling Connected to electrical ground via one of the conductive shielding layers of the composite strip 1900 This indicates that there is no such thing. In some embodiments, the closed-circuit termination 3008 is a coupling strip 190 The conductive layer of 0 and the conductive shielding layer of the bulk medium 1902 or the bonding strip 1900 It is a short-circuit open circuit between one or both of them. In some embodiments, the closed circuit termination 3 008 is a capacitive termination, and the capacitor is electrically grounded to the conductive layer of coupling strip 1900. It is connected between the conductive layer of coupling strip 1900 and the valve. Contact between either the medium 1902 or the conductive shielding layer of the bonding strip 1900 It continues. In some embodiments, the closed-circuit termination 3008 is an inductive termination, and the inductor is It is connected between the conductive layer of the coupling strip 1900 and electrical ground. For example, an inductor. The conductive layer of the bonding strip 1900 and the bulk medium 1902 or bonding strip 1900 It is connected between one of the conductive shielding layers. In some embodiments, it terminates the circuit. 3008 is a resistor termination, and the resistor is connected to the conductive layer of coupling strip 1900 and electrical ground. A connection is made between the conductive layer of the coupling strip 1900 and the bulk medium 1. Connected between either 902 or the conductive shielding layer of the bonding strip 1900 .

[0215] To provide the power control system 3002 with the desired input impedance, bulk medium 1 To provide the desired heating distribution throughout 902, or a combination thereof. A complementary termination type can be applied to the adjacent coupling strip 1900. For example, the coupling strip 1900 is adjacent to the coupling strip having complementary termination types. It can be installed on the bulk medium 1902 in 1900 patterns. For example, adjacent The end of the coupling strip 1900 is an open-circuit end 3006 and a short-circuit end (for example, as a short circuit). It can be alternated with the equipped closed terminus 3008). In another example, adjacent connections The termination of the combined strip 1900 is a closed-circuit termination 3008 implemented as a capacitive termination and an inductive termination. It can be alternated with the closed-circuit termination 3008 implemented as the termination.

[0216] Figure 31 shows a second exemplary batter using the coupling strip 1900 according to an embodiment of the present disclosure. This is a block diagram of the Luc medium heating system 3100. The heating system 3100 is the heating Similar to system 3000, but with a detachable end attached to each coupling strip 1900. A control system 3102 configured to drive the variable termination 3106 is added. The variable termination 3106 includes a switchable termination. In some embodiments, the variable termination 31 06 is configured to switch between short-circuit termination and open-circuit termination. For example, variable termination Terminal 3106 is a controllable coupling between the conductive layer of coupling strip 1900 and electrical ground. Includes controllable switches. Controllable switches are electronic switches (e.g., transistors, galvanic switches). (War diodes, thyristors, silicon-controlled rectifiers, etc.) or mechanical switches (e.g., It can be implemented as a relay. For example, a controllable switch can be a coupling strip. Conductive shielding of the conductive layer 1900 and bulk medium 1902 or bonding strip 1900 It is connected between any of the layers. The output of the control system is the control terminal of the controllable switch. It will be joined to

[0217] The end of each coupling strip 1900 is controlled by opening and closing a controllable switch ( (Or by turning an electronic switch off or on) the circuit can be changed between an open circuit and a short circuit. For example, the control system 3102 can control the variable termination of the coupling strip 1900. The operation of the 3106 is controlled by operating the controllable switches, and the coupling strip The system heats the bulk medium 1902 by changing the termination type of 1900 as needed. 3102 can independently control the variable termination 3106 of each coupling strip. In some embodiments, the control system 3102 controls the variable end 3106 of the coupling strip. Groups (for example, pairs or larger groups) can be controlled in a synchronized manner. In some embodiments, the control system 3102 has one or more coupling strips 1 The variable termination 3106 of 900 is switched at regular intervals, for example, at regular operating cycles. It can be controlled. The operating cycle for switching the variable termination 3106 is 0.01H The range can be from z to 100Hz.

[0218] In some embodiments, the control system 3102 controls the variable termination 3106 to be open and closed. The operation of the variable termination 3106 is controlled by alternately switching between it and the road termination. Example For example, the control system 3102 controls half of the variable termination 3106 during the first half of the operating cycle. Switch to short-circuit termination, and switch half of the variable termination 3106 to open-circuit termination. Next, the operating size During the latter half of the cycle, the control system 3102 controlled the variable termination 3106, which was an open termination. The control is set so that it can be switched to the closed circuit termination and vice versa. The variable termination 3106 is switched. The operating cycle for this can be in the range of 0.01 Hz to 100 Hz.

[0219] In some embodiments, each pair of adjacent coupling strips 1900 has variable ends 3106 It is controlled to maintain the opposite type of termination. That is, control system 3102 This alternately terminates one end of the coupling strip 1900 of each adjacent pair every half of the operating cycle. The first part is configured as an open circuit, and the end of the other coupling strip 1900 of that pair is configured as a closed circuit. The variable termination 3106 is controlled to achieve this.

[0220] The control system 3102 is configured to control the operation of the variable termination 3106. or computing devices equipped with multiple processors or microcontrollers This is possible. For example, the control system 3102 may store a memory instruction (for example, a software code The instruction includes (d), and when the instruction is executed by the control system 3102, within the variable terminal 3106 Provides appropriate control signals to controllable switches. In some embodiments, power control System 3002 and control system 3102 are integrated into a common power and control system. It is possible.

[0221] In some embodiments, the variable termination 3106 switches between capacitive and inductive termination. It is configured as follows. For example, the controllable switch controls the conductive layer of the coupling strip 1900 Either connect to a capacitor connected to ground, or connect the conductive layer of coupling strip 1900 to ground. It can be configured to switch between coupling to a connected inductor. The grounding is the conductive shield layer of the bulk medium 1902 or the bonding strip 1900. This can be done through either method. Furthermore, in such embodiments, the control system 3 By operating 102 as described above, the variable termination 3106 is crossed between the conductive termination and the inductive termination. They can be switched between each other.

[0222] In other embodiments, the variable termination 3106 can be used between different termination types, for example, an open-circuit termination. Between capacitive termination and short-circuit termination and inductive termination, between open-circuit termination and inductive termination, short circuit Trying capacitive and open circuits, trying resistive and short circuits, Alternatively, it can be modified to switch between other combinations of those.

[0223] Figure 32 shows a third exemplary bulk medium using a binding strip according to an embodiment of the present disclosure. This is a block diagram of the heating system 3200. The heating system 3200 consists of adjacent coupling stations. The lip 1900 is configured to drive alternately. The heating system 3200 is configured as described above. Similar to the heating system 3000, but with a cut attached to the input end of each coupling strip. A control system 3202 configured to drive a replaceable connector 3204 is added. The switchable connector 3204 controls the power of the associated coupling strip 1900. Includes controllable switches positioned to connect to and disconnect from your system 3002. Possible switches include electronic switches (e.g., transistors, power diodes, thyristors). It can be implemented as a silicon-controlled rectifier or a mechanical switch (e.g., a relay). Yes, it is possible. For example, a controllable switch can switch between the conductive layer of the coupling strip 1900 and the controllable switch. It is connected between the input terminal of connector 3204 and the control system. The output of the control system is controllable It is connected to the control terminal of the switch.

[0224] The control system 3202 controls the operation of the switchable connector 3204, and the coupling system Lip 1900 is alternately connected to and disconnected from the power control system 3202, and the coupling strip Effectively turns 1900 on and off. For example, control system 3202 switches The possible connector 3204 controls the coupling strip 1900 to alternately turn on and off. For example, the control system 3202 can operate a controllable switch. Therefore, the operation of the switchable connector 3204 of the coupling strip 1900 is controlled, To heat the medium 1902, the bonding strip 1900 is turned on and off as needed. In some embodiments, the control system 3102 controls each coupling strip. The variable termination 3106 can be controlled independently. In some embodiments, the control system Mu 3102 is a group of binding strips (e.g., a pair or a larger group) The variable terminations 3106 can be controlled in synchronous manner. In some embodiments, Your system 3102 controls the variable termination 3106 of one or more coupling strips 1900, The switching can be controlled at intervals such as, for example, according to the normal operating cycle. The operating cycle for switching the termination 3106 is in the range of 0.01Hz to 100Hz. It is possible. In some embodiments, the control system 3202, during the first half of the operating cycle, The coupling strip 1900 with open termination 3006 is turned on, and the closed termination 3008 is turned on. Turn off coupling strip 1900. Then, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 and connects with the open circuit termination 3006. Turn off coupling strip 1900 and coupling strip 1900 with closed termination 3008 Turn it on.

[0225] The control system 3202 is configured to control the operation of the variable termination 3106. or computing devices equipped with multiple processors or microcontrollers This is possible. For example, the control system 3202 may store a memory instruction (for example, a software code The instruction includes (d), and when the instruction is executed by the control system 3202, within the variable terminal 3106 Provides appropriate control signals to controllable switches. In some embodiments, power control System 3002 and control system 3202 are integrated into a common power and control system. It is possible.

[0226] As used herein, “perpendicular” or “substantially perpendicular” or “normal” or The term "substantially normal" refers to two points that form a 90-degree angle within the allowable engineering or measurement tolerance range. It refers to the relationships between elements (e.g., lines, directions, axes, planes, surfaces, or constituent elements). For example If the angle between directions is within a tolerance of 90 degrees (for example, ±1 to 2 degrees), the directions are relative to each other. It can be considered vertical.

[0227] This specification includes details of many specific embodiments, but these are not within the scope of the invention. This should not be interpreted as a limitation on the scope of what can be claimed, but rather as a limitation on the specific embodiment of a particular invention. This should be interpreted as a description of an inherent feature. (As described herein in the context of a separate embodiment) The specific features described can also be implemented in combination in a single embodiment. Conversely, Various features described in the context of a single embodiment may be described separately or optionally in multiple embodiments. It can also be implemented with an appropriate partial combination of these. Furthermore, various features can be combined in specific ways. As described above, even if it is initially claimed that it acts in conjunction with other things, One or more features from the selected combination may, in some cases, be derived from those combinations. It can be deleted, and the claimed combination is a partial combination or a partial combination. It can be directed towards variations of that.

[0228] Similarly, the operation is shown in a specific order in the diagram, which is to achieve the desired result. Therefore, such actions are to be performed in the specific order or sequence shown, or illustrated. It should not be understood as requiring all specified actions to be performed. In some situations, multitasking and parallel processing are advantageous. Furthermore, in the above embodiment... The separation of various system modules and components is, in all embodiments, Such separation should not be understood as necessary, and the program code described Components and systems generally consist of a single software and / or hardware. To integrate into a product, or package into multiple software and / or hardware products It should be understood that this can be processed into a digital format.

[0229] While specific embodiments of the subject matter have been described, other embodiments are included in the following claims. For example, the actions described in the claims may be performed in different orders. It is possible, and even then, the desired results can be achieved. For example, as shown in the attached figure. The process involves following a specific sequence or sequence of steps to achieve the desired result. The order is not necessarily required. In some cases, multitasking and parallel processing are advantageous. There is.

[0230] Control and sensing: In some embodiments, the controller controls, senses, and controls the power control system. It is a group of sensors and circuits that perform monitoring functions. The controller is, for example, This can be the power control system 104 described with reference to Figure 1.

[0231] In some embodiments, the control function switches the entire power control system on and off. Replacing, power control systems designated to supply power to a specific target area of ​​the bulk medium Switching specific sections of the stem on and off, specific areas of the bulk medium This includes adjusting the amount of power output.

[0232] In some embodiments, the control function includes the control of a dynamic adjustment network.

[0233] In some embodiments, the monitoring function includes: the overall health of the heating system and Evaluation of proper function, the integrity and proper function of specific components and sections of the heating system. Evaluation, performing fault detection on the entire heating system, and specific parts and sections of the heating system. Execute fault detection, execute fault notification to system users or multiple users, maintenance This includes any combination of the following: sending fault notifications to the system or inspection personnel.

[0234] In some embodiments, fault detection refers to the following types of faults: electrical fault detection, heating function fault detection. Detection of defects, detection of binding strip failures, detection of damage to bulk media (heating system functioning properly) This means any combination of (including cases where it is functioning and undamaged). The connecting strips are called "strip lines" or, in some cases, simply "lines". This can also happen. The connecting strips are described, for example, with reference to Figures 19 and 23-27F. It includes a structural layer. In some embodiments, as described below, the bonding strip is This may include multiple conductive paths, such as sense lines and carrier lines. The carrier line carries the current used to heat the bulk medium. Refers to a conductive path within a coupling strip. A sense line is a carrier line or the entire coupling strip. A smaller current can be intermittently or continuously applied to detect the fault. These are separate conductive paths.

[0235] In some embodiments, an electrical fault occurs at any stage of the power control system's input. This includes, but is not, the output power, voltage, and current being at levels that are not within the set interval. It is not limited to these. In some embodiments, an electrical fault occurs in the circuitry of the power control system. The temperature of the device or component is higher than what is expected under normal operation of the heating system. This also includes being high or low. In some embodiments, an electrical fault is a power system At any given stage, the input and output impedances are not at levels within the set interval. This includes doing so.

[0236] In some embodiments, the heating function failure is bulk compared to the normal operation of the heating system. Overheating state of any region of the medium, compared to the normal operation of the heating system, of any region of the bulk medium This includes, but is not limited to, a heat deficiency in the region. In the application method, the heating function failure occurs when any area of ​​the bulk medium is not completely defrosted, or defrosting or This includes either freezing or refrozing of the precipitate on the bulk medium during or after de-icing treatment. It is visible.

[0237] In some embodiments, the failure of the binding strip is one of the following: binding strip The temperature above or near the heating system, and at one or more locations on the bulk medium, The temperature is higher or lower than what is expected during normal operation, or any of the bonding strips Disconnection at location, short circuit within the coupling strip (between the trace and shield or within the trace itself) ), short circuits between the coupling strip and bulk media, short circuits and openings at the input connector of the coupling strip Circuit, open circuit within the coupling strip, delamination of the coupling strip structure, burning of the coupling strip Partial delamination, separation between the binding strip and the bulk medium, detachment of the binding strip from the bulk medium. hail, lightning strikes, improper handling of coupling strips by maintenance personnel, etc. Mechanical damage such as dents, holes, bumps, cuts, wrinkles, and burrs caused by events such as walking on the surface. Scratches, corrosion of bonding strips, between bonding strips and bulk medium, electrodes / connectors and bonding strips During tripping, or electrostatic discharge between electrodes / connectors and bulk media, corrosion of the coupling strip. Examples include phagocytosis or the formation of an oxide film.

[0238] In some embodiments, the sensing function includes voltage, current, power, forward power, and reflected power. Controlling force, voltage standing wave ratio (VSWR), time-domain reflectivity measurement (TDR), temperature, etc. All sensors used for input and feedback, including ice sensors. .

[0239] In some embodiments, some or all elements of the controller are part of a power control system. They are distributed within. In some embodiments, some or all elements of the controller are It is installed independently of the rest of the control system. Several embodiments These elements are then housed in separate, dedicated enclosures.

[0240] In some embodiments, two or more elements of the controller are independent of each other, For the roller to malfunction, at least two of these elements must fail simultaneously. It is configured so that it does not. In such an embodiment, the controllers are independent of each other. Therefore, controller reliability is improved, and each of these is necessary to meet the controller requirements. The reliability required for the elements decreases, making their design, implementation, and integration easier. This also simplifies things. This is because safety and controller reliability are important or regulated. This is particularly advantageous in applications such as heating systems installed in aircraft.

[0241] In some embodiments, monitoring functions are performed to achieve reliability and safety requirements. Two or more subsystems are configured independently. In some embodiments, reliability and safety Two or more subsystems independently perform sensing functions to achieve the requirements. It is configured. In some embodiments, control functions are used to achieve reliability and safety requirements. Two or more subsystems that perform the function are configured independently. In some embodiments, To meet reliability and safety requirements, the control, sensing, and monitoring subsystems are responsible for... The combination of meanings is constructed individually.

[0242] In some embodiments, two identical sensors are used at several sensor locations. In such an embodiment, both sensors are connected to the same monitoring subsystem and provide data. They can be supplied. For example, each of them can be connected to a separate monitoring subsystem. The monitoring subsystems may be configured to be independent of each other, and each of them may be configured to be independent of each other. To connect to two or more monitoring subsystems configured to operate independently of each other. You can do that.

[0243] In some embodiments, two independent sensors are used to obtain information about similar regions. Collect data. Independence is achieved by using different sensor types and / or keeping them close to each other. By being located within a certain distance, or by monitoring the same area or gathering equivalent information... This can be achieved. In such embodiments, both sensors are in the same monitoring subsystem. It can connect to and supply data, and each of them can be connected to a separate monitoring subsystem. They can be connected and configured to be independent of each other. , two or more monitoring systems, each configured to operate independently of the others. It can connect to a subsystem.

[0244] In some embodiments, the controller control, sensing, and monitoring subsystems are included. Any combination of these is configured to optimize the reliability and safety of its most important function. In the case of heating systems used for de-icing and anti-icing of aircraft, several implementations exist. In this state, such functions include the following combination: detecting a failure in the heating system and pilot To notify, to detect electrical faults in the power control system and communicate with the pilot, Detecting coupling strip failures and notifying the pilot, power control system and bulk This includes detecting overheating failures in the medium and notifying the pilot of these failures.

[0245] In some embodiments where the heating system is used for de-icing and anti-icing of aircraft, The roller has been further optimized to prevent freezing, freezing precipitation, and freezing on critical surfaces of aircraft once de-iced. Verify that there are no contaminants. Contaminants are substances that adhere to the aircraft's outer skin and interfere with proper operation. Refers to sleet, snow, slush, ice, or other substances that can fall.

[0246] In some embodiments, the layout of the controller and binding strip on the bulk medium They are designed and optimized to work together. In such embodiments, the bulk medium The binding strip layout on the body is positioned to create a region of interest at the selected location. Such areas may occur, for example, when the heating system is started, due to the remaining bulk medium. Also, regions that remain low temperature due to the design, or while the heating system is operating or after it has been deactivated. For example, from ongoing freezing or freezing precipitation, or from frozen precipitates, or bulk media Areas that are likely to first experience a refreezing event (from molten contaminants flowing on the surface) It is possible. In such an embodiment, the controller's sensors provide information about these areas. Collect the data to determine if the heating system is functioning correctly, or if the bulk media is frozen or It can be positioned to help assess whether a refreeze event has occurred. In some embodiments, the bulk medium is locally modified in some of these regions. Therefore, those regions become colder than other regions of the bulk medium during the operation of the heating system. And, or ensure that they are the first areas to experience a refreeze event. (For example, by adding relatively small features such as edges and ridges, the dissolved water becomes colder.) (By accumulating and stagnating in a certain region, and by facilitating refreezing). In some embodiments, Such areas should be easily observable by users of the heating system (for example, in an aircraft). In the case of de-icing systems, the pilot can easily see from the aircraft cabin or cockpit. (to be selected in this way), and as a result, the user can make bulk decisions based on visual observation of these areas. It is possible to infer whether the medium has experienced a de-icing event.

[0247] In some embodiments where the heating system is used for de-icing and anti-icing of aircraft, Laura will perform verification to ensure that there is no freezing or freezing precipitation and contaminants in the specified area. Therefore, it is further optimized. In such areas, vertical and near-vertical precipitation This may include horizontal and inclined upper surfaces, the upper surfaces of wings and horizontal stabilizers.

[0248] In some embodiments, the data collected by the sensing subsystem is used for Using analytical methods that leverage machine learning, computer vision, and artificial intelligence technologies Then, part of the monitoring function is performed. In some embodiments of this analysis method, The technology is trained using data empirically collected from tests performed on thermal systems. It can be used to continue using data collected by the installed heating system. It allows for targeted training and improvement.

[0249] In some embodiments, the controller sets the startup time of the heating system, and the heating system The elapsed time since the system was last started, and the elapsed time since the system was last shut down. Any timer can be used to measure time information. In some embodiments The information from the timer is coordinated with the information from the sensing subsystem for analysis. It can be used to help the controller perform its intended function.

[0250] As shown in Figure 37A, the cockpit display and notification system has several It may be provided in that embodiment. This system informs the pilot of the system's status. It can have multiple indicators to show when power is supplied to the system. The "ON" indicator lights up, and some or all of the required temperature sensors are above 15°C. If it is working, the "WARM" indicator will light up. For example, the "OK" indicator is when some or all of the required temperature sensors indicate a temperature of 15°C or higher for at least 15 minutes. It can be illuminated. The "OVHT" indicator lights up when an overheat condition is detected. For example, if any of the temperature sensors reach a temperature of 150°C or higher. The "TEM FAIL" indicator shows a variety of reasons for potential system failure. It may light up. For example, the system may light up without reaching at least a "warm" state. This is the case if it was "on" for a certain amount of time (for example, 25 minutes). In another example, the system If "ON" is selected and the state remains "OVHT" for more than 10 seconds, "SYSTEM FAIL" will be displayed. It may light up. The above temperatures and times are illustrative and do not deviate from the scope and spirit of this disclosure. It can be modified or adjusted without removing it.

[0251] Figure 37B shows an alternative example of the cockpit display, showing the "DE-ICE" system status and This indicates the system function state of the "ANTI-ICE" system. In this example diagram, the cock The pit display will show the system as "OFF", "GROUND DE-ICE", and "GROUND This indicates whether the status is "D ANTI-ICE" or "FAULT". Yes, it is possible. In some embodiments, separate displays are presented for each area of ​​the aircraft or area of ​​interest. It is possible.

[0252] Figure 37C shows the actual location of the cockpit display in Figure 37B within the aircraft cabin. Examples are shown. Figure 37B shows an example of placement in an aircraft cabin. In Figure 37C, the dashed line indicates As shown by the hex, the cockpit indicator is located in the upper right corner of the aircraft's cockpit. It will be placed.

[0253] In some of the embodiments described above, the sensing subsystem of the controller is wireless One or more that can be configured to transmit data to a central receiver via a data network. This includes multiple wireless sensors, for example, one or more wireless temperature sensors or one Alternatively, it can include multiple wireless ice sensors, which would require additional sensor wires. This reduces the need for physical access to various physically distant locations on bulk media. The wireless sensor is, for example, a low-voltage, low-current sensor held in a coupling strip 1900. Utilize DC bias, or directly draw power from AC current passing through coupling strips. By consolidating, power is drawn from the coupling strip 1900 using direct electrical connections. Alternatively, the wireless sensor can be directly connected to the coupling strip 1900. For example, by utilizing short-range electromagnetic radiation via an antenna or coil, It can unlock your potential.

[0254] Temperature sensing In some embodiments, the controller's sensing subsystem includes a temperature sensor. The temperature sensor is used for point measurement, or (for example, to extract area information) (Using a sensor mat equipped with multiple sensors) Maximum, minimum, and horizontal values ​​across a specified area. It can be used to measure parameters such as averaging or temperature mapping. .

[0255] In some embodiments, the temperature sensor is a thermocouple, a resistance temperature detector (RTD), or a thermistor. It may include any of the sensor types such as stylus, optical fiber, and infrared sensors. Thermocouples are Thermocouples can be used to measure temperature by measuring changes in voltage. It is simple to implement and has a wide measurement range. The signal is on the order of tens of millivolts, and electromagnetic To perform accurate measurements in the presence of interference, significant noise reduction may be necessary. The RTD (Real-Time Temperature Discharge) can measure temperature by measuring the change in sensor resistance. These elements are typically made of platinum and possess extremely high precision. This includes 4-wire measurement. It is necessary to perform this, or, for example, a local voltage that will then be converted to a digital signal. The leads need to be kept short when performing measurements. Thermistors are based on resistance measurements. It is similar to an RTD in that it calculates the temperature by measuring the baseline resistance. Thermistors have a high baseline resistance. It has the additional advantage of potentially being able to ignore lead resistance. The grating is typically based on fiber Bragg grating. It reflects light of a certain wavelength. As the temperature changes, the reflected wavelength changes as expected. , the temperature can be calculated. Each grating reflects only a small wavelength band, so multiple The sensor can be integrated into a single optical fiber element, allowing measurement with a single instrument. The Iba element itself is very small, with a diameter of ~0.1 mm, but its length is meter or tens of meters. It can be made into a torque. Since the measurement is optical, it needs to be free from RF interference.

[0256] In some embodiments, the temperature sensor can be positioned as described above herein. It is placed on the bulk medium in a manner that allows it to be placed on the bulk medium. In some embodiments, the temperature sensor is, for example, solid Supported by a lumped volume model that assumes the body temperature is spatially uniform within the volume They can be placed under the surface of the medium, or both, and widely separated from each other. This is the case when the Biot number Bi is sufficiently small (for example, Bi < 0.1), and the Biot number Bi = h It is defined as / k·L, where k is the thermal conductivity of the solid, h is the convective heat transfer coefficient, and L is the volume. These are characteristic dimensions of the unit. In the concentrated capacitance model, within a volume where Bi is sufficiently small, This model is particularly useful because it can be assumed that the temperature of the bulk medium is nearly uniform. This reduces the number of sensors attached to the body, the complexity of the system, the cost, and the installation work. Such technologies utilize materials with high thermal conductivity, such as aluminum alloys that commonly make up the skin of aircraft. It is particularly effective for high bulk media, and the bio-number remains sufficiently low over a relatively wide range. Therefore, the use of a limited number of temperature sensors and sensing points is justified. Several implementations In this state, the temperature sensor detects hot spots, cold spots, and other spots in particular. It can be placed on a bulk medium so that it is positioned in specific locations such as refrozen spots. Hot spots occur when the heating system is activated, and other parts of the bulk medium become hotter. It may also be a location chosen to operate at relatively high temperatures. Hotspot sensor It can be used to perform general controller functions, and bulk media or bound strips It can be used to detect overheating events in the top. The cold spot indicates that the heating system When started, it is selected to operate at a relatively lower temperature than other locations on the bulk media. It may be in any location. The cold spot sensor performs general controller functions. It can be used to detect improper heating of bulk media or binding strips. It can be used. The refreezing spot can be used when the heating system is started or after it has been stopped. It is selected to experience freezing or refreezing events earlier than other locations on the Luk medium. It is a location. The refreeze spot sensor is used to perform general controller functions. It is possible to also prevent refreezing events or failures on bulk media or binding strips. It can be used to detect proper heating. Other spots of interest mentioned herein It can be placed in a certain area.

[0257] In some embodiments, the layout of the binding strips on the bulk medium is as described above. The presence of a lattice, ease of access, ease of installation, or visual accessibility for the user of the heating system. Optimization so that there is a specified region to select for parameters such as ease of observation. This is possible. For example, as shown in Figure 33, an aircraft pilot can access the cockpit from It has a limited line of sight 3302. As a result, part of the aircraft is not visible to the pilot. (3304), part of the aircraft is visible (3306). In some embodiments, the aircraft Select a refreeze spot or cold spot within the visible area (3306) and pilot This allows for visual confirmation using a marker.

[0258] Figure 33 further illustrates an exemplary temperature overlay on the wing when the system is active. Position 3308 on the wing is where the pilot can see to check the de-icing condition before takeoff. Examples of cold spots that are selected or designed and monitored to enable this. As shown in the figure, position 3308 is the wing in the heating pattern generated by the heating element The majority (shown in red gradient) and the relatively low temperature region (yellow) It correlates with (shown by a gradient).

[0259] The location of cold spots and / or hot spots is, for example, on the surface of an aircraft. A heated strip (such as a bonding strip) is applied locally to the aircraft's surface relative to the rest of the aircraft. To place in a pattern that generates a heating pattern with a low or warm skin temperature Therefore, it can be designed. For example, the coupling strip is locally low (or high (i) Can be arranged in a shape that provides power density (increase wire spacing), or select To operate the coupling strip at a high (low) thermal mass position with a low (or high) power density, Alternatively, it can locally adjust the output power to provide a cold / hot spot at the desired location. It can generate thermal patterns.

[0260] In some embodiments, at least two independent temperature sensor sets are used. By adding redundancy to the controller subsystem, the reliability of critical controller functions is improved. It can be improved. In some embodiments, two identical sensors are placed at each designated sensor position. Isolation can be achieved by adding one temperature sensor. In this configuration, two different temperature sensors (for example, different manufacturers) are installed at each designated sensor position. Isolation can be achieved by adding a car or other type of sensor. In some embodiments, two temperature sensors are added at positions sufficiently far apart from each other, and both It is possible to monitor equivalent parameters while reducing the possibility of simultaneous sensor failures. Independence can be achieved by positioning it in a specific location. In some embodiments, These methods can be combined in any way to achieve independence. In this configuration, a set of independent sensors transmits information to a single monitoring subsystem. Each set of independent sensors sends information to its own dedicated set of independent monitoring subsystems. To trust, or to send all information to two independent sets of monitoring subsystems. It is possible.

[0261] In some embodiments, for example, temperature sensors are used that are separately located on the bulk. In addition to, or instead of, one or more integral parts of the binding strip Temperature sensing can be achieved by using a temperature sensor (or temperature element). Yes, it is possible. Examples of temperature sensors are explained in detail in the "Temperature Sensing" section above. It has been revealed. For example, the temperature sensor is connected to a coupling strip or a nearby sense line (sensor). The Sline can be attached to (which will be explained in detail below), and the temperature is predetermined When the threshold value is exceeded, a short circuit or open circuit can be created. A short circuit or open circuit can occur at other locations. For example, detection in an input connector or power control system (system 104) Yes, it's possible. This allows temperature detection at the location of the temperature sensor.

[0262] In some embodiments, arrays of temperature sensors can be arranged in parallel. For example , parallel arrangement is a parallel overheat sensor or low-temperature sensor arranged as a thermostat control loop. It can include an array of sensors. The thermostat control loop utilizes temperature sensor information. Then, the temperature of the system, for example, the heating system 100 in Figure 1, is brought within a predetermined range, for example, Hiss is used to maintain a minimum temperature Tmin above the maximum temperature Tmax below the maximum temperature. This is a teresis control method.

[0263] In some embodiments, arrays of temperature elements can be arranged in series. For example, The degree element is along the joining strip 1900, for example, on the joining strip or nearby. It is mounted on the running line or along another cable strip, and its series configuration It is configured to force an overheating shutdown if the temperature becomes too high at any point within the system. It is possible.

[0264] In some embodiments, temperature elements such as periodic thermistors of different values ​​are arranged in parallel. And when a specific temperature element along the line is overheated, an analog value is detected and Decoding revealed that not only was overheating detected in the coupling strip, but there was also a fault along the coupling line. It can also indicate the specific location where the incident occurred.

[0265] In some embodiments, temperature sensing uses traces on a flexible circuit. By doing so, an additional sense line runs along the carrier line within the coupling strip ( Sense lines function as wiring to and from temperature sensors mounted within the same strip. By using ) or by installing sensing strips independently of the coupling strip By using additional sense lines and sensors implemented within the lip, or by using temperature sensors A capacitor is coupled to a carrier line within a strip, for example, a periodic capacitor, a parallel plate. By implementing it with a capacitor, trace inductor, or a combination thereof, It can be achieved.

[0266] In some embodiments, temperature can be measured as a function of time. For example, Temperature changes are measured and recorded at regular sampling intervals, and rather than static temperature measurements, temperature changes are recorded. It can be stored as a vector representing the time-based change. For time-based temperature measurement. More complex mathematical components such as rate of change (time-based derivative, etc.) and total heat output (integral, etc.) Analysis may become possible. In such embodiments, the controller is related to temperature changes. Based on temporal information, perform one of several assessments, including an evaluation of the current de-icing status. This is possible. As a specific example, the temperature sensed by a temperature sensor that remains stagnant around 0°C In response to the reading, the controller was supplied by the bulk medium heating system. Energy is being converted into latent heat of dissolution, and therefore it can be determined that the de-icing operation is in progress. Furthermore, the temperature measurement detected by the sensor remains stagnant around 0°C before rising. Then the controller directs the energy supplied by the bulk medium towards a temperature increase. Once the freeze contaminants are dissolved and removed from the bulk medium, they do not transfer to latent heat, and the de-icing operation is complete. It can be determined that the bulk medium is de-iced. In other words, the point in time when the bulk medium is de-iced is, with respect to time The plotted temperature shows a period of positive gradient followed by a relatively flat period over a given time (e.g., For example, it can be determined when the gradient becomes zero.

[0267] In some cases, as further explained in the "Ice Detection / Sensing" section below, Furthermore, temperature can be measured as a function of time, and the de-icing state can be estimated in a similar manner.

[0268] Figure 40 shows the impedance and temperature as a function of time on the coupling strip. This shows the situation. As shown in plot 4000, while the de-icing operation is in progress (approximately 07:00) During the period from 07:30 until 07:30, the temperature reading remained around a fixed value (10°C), and de-icing operation was performed. Once this is complete, the temperature reading will rise (starting around 07:30).

[0269] Furthermore, in embodiments where the bulk medium is composed of a material with high thermal conductivity (such as aluminum), Therefore, we will use a centripetal capacitive thermal model as the basis for evaluating the de-icing state of the system. This is possible. The controller uses a centralized capacitive thermal model to determine the cold temperature on the bulk medium. You can also determine the position of the pot and the temperature of the cold spot. This reduces the total number of sensors required and facilitates more effective sensor placement. This involves placing the sensors under the aircraft's outer skin (i.e., not on top), or This includes both utilizing the thermal conductivity of the bulk medium.

[0270] Ice detection / sensing In some embodiments, the sensing subsystem of the controller is an ice detector or Includes sensors. Ice detection refers to detecting snow, ice, slush, or similar forms of ice accumulating on a surface. Those who recognize freezing or freezing precipitation or contaminants, including but not limited to precipitation. It refers to the law.

[0271] In some embodiments, ice detection is used to determine whether de-icing of a structure is necessary. The system tracks and monitors the de-icing process, as well as the accumulation of ice after de-icing.

[0272] In some embodiments, a transducer or multiple transducers are used Ice detection is achieved, including but not limited to the damping coefficient, resonant frequency, and frequency response. The acoustic parameters of the structure are monitored. In some embodiments, ice detection is polarized. This is achieved by observing the changes. In some embodiments, variable polarization is used After interacting with the ice, we observe the change in the incident unpolarized light. In some embodiments, Observe the change in incident polarization. In some embodiments, the change in the intensity of reflected light is used. Ice formation can be detected. In some embodiments, ice is collected in a table. It is detected by one or more sensors on the surface. When snow or ice accumulates on the surface, the sensor aperture Close the gate to indicate the presence of ice. In some embodiments, infrared radiation from the surface This can indicate the presence of ice. This includes variations in surface emissivity and whether conditions are suitable for ice formation. This includes, but is not limited to, the calculation of surface temperature to determine. In this configuration, ice detection can be achieved using sensors attached to the critical surface. When freezing or freezing precipitation accumulates on the sensor, a measurable change occurs in the electrical impedance. In some embodiments, the ice sensor detects the presence of ice near the binding strip. The frequency-domain and / or time-domain response of the coupling strip to an electrical signal can be detected. This method utilizes the fact that it exerts a powerful influence and affects the electromagnetic field surrounding the aforementioned line. These changes can be measured and used to indicate the presence of structural ice. In this embodiment, the presence of ice is determined by the temperature gradient of the entire structure or by the rate of change of temperature. This can be predicted, and this can be measured with the temperature sensor mentioned above. In the embodiments described herein, any of the sensors can be surface-mounted onto a structure.

[0273] In some embodiments, the ice sensor is a temperature sensor arranged as described above herein. It is placed on the bulk medium in a similar manner to the S. In some embodiments, the ice sensor is In particular, they are placed in specific locations such as hot spots, cold spots, and refreezing spots. It can be placed on a bulk medium. Hotspot sensors are common. It can be used to perform control functions and to detect overheating events in bulk media or bonded strips. It can be used to detect a cold spot. A cold spot occurs when the heating system is activated. This location is selected to operate at a relatively lower temperature than other locations on the bulk medium. This is possible. Cold spot sensors are used to perform general controller functions. It can be used to detect improper heating of bulk media or binding strips. The refreezing spots occur on the bulk medium when the heating system is started or after it has been stopped. Selected to be more likely to experience freezing or refreezing events earlier than other locations. It can be designated as a refreezing spot. The refreezing spot sensor performs general controller functions. It can be used for refreezing events or bulk media or bonded strips. It can be used to detect improper heating. Other spots are previously listed herein. It can be placed in other areas of interest, such as the area mentioned above.

[0274] In some implementations, the layout of the binding strips on the bulk medium is for access Ease of use, ease of installation, or the availability of visual observation for users of the heating system, etc. The above spots exist so that the specified area selected for the parameters exists. It can be optimized in this way.

[0275] In some embodiments, redundancy is added to the sensing subsystem. To improve the reliability of the controller's critical functions, at least two independent ice sensors are required. A set of sensors can be used. In some embodiments, each specified sensor position Isolation can be achieved by adding two identical ice sensors. In some embodiments, two different ice sensors (for example, different) are placed at each designated sensor position. Independence can be achieved by adding sensors from a different manufacturer or of a different type. In some embodiments, two ice sensors are added at locations sufficiently far apart from each other. To monitor equivalent parameters while reducing the possibility of both sensors failing simultaneously. Independence can be achieved by placing them close enough. Several embodiments Therefore, independence can be achieved by arbitrarily combining these methods. In this configuration, a set of independent sensors transmits information to a single monitoring subsystem. Each set of independent sensors sends information to its own dedicated set of independent monitoring subsystems. To trust, or to put all information into at least two independent monitoring subsystems It can be sent.

[0276] In some embodiments, the controller's sensing subsystem is one or more This may include a capacitance sensor. One or more of these capacitance sensors may be used independently. Alternatively, it can be used in combination with other sensors such as temperature sensors to distinguish between ice and water. Yes, it is possible. For example, a circuit board, for example, including an array of one or more capacitive sensors. A flexible printed circuit board (or flex PCB) is placed on the surface of a bulk medium. For example, it is possible to measure the change in capacitance readings on a surface due to the presence of ice or water. As another example, a capacitive sensor can have a cover layer on the bulk medium (e.g., a paint substitute film). It can be placed below (Mu).

[0277] In some embodiments, the temperature on the coupling strip 1900 is similar as a function of time. From the impedance measurement values ​​that can be measured, for example, that impedance measurement value By comparing with a database of reference plots of frequency response at various temperatures, the derivation is obtained. It is possible to output data as a function of ambient temperature. For example, collect data in a test system and input it as an input. The frequency response can be recorded. The controller can utilize the recorded data. By using this method, the temperature of the coupling strip can be estimated based on the impedance reading. can.

[0278] In some such embodiments, the binding strip 1900 exhibits significant changes in temperature. Furthermore, it includes a material that exhibits predictable impedance fluctuations, thereby targeting the bulk medium. This facilitates the use of impedance measurements to evaluate the temperature of a region. For example, coupled stock Lip 1900 is a dielectric material in which the dielectric constant or conductivity can change predictably with temperature. Alternatively, it can be partially constructed using conductors, thereby changing the impedance. The target region of the medium can be locally altered. For example, the binding strip 1900 Acrylic adhesive, silicone adhesive, ethylene vinyl acetate adhesive, polysulfide sealant Polyurethane sealant, Mylar, PTFE, FEP, Kapton, or epoxy It can be constructed using one or more of the materials from the base.

[0279] For example, to determine the current temperature of a particular bond strip, the controller is specific Measure the impedance value of the coupling strip and look up that impedance value. It can be compared with the temperature value inside the bull. As another example, the controller is impedance After performing the measurement, (for example, based on the mathematical relationship between impedance and temperature) The temperature can be calculated from the impedance value obtained. As a specific example, coupled string To construct the lower dielectric layer of the strip that separates the top from the bulk medium, acrylic A special adhesive material can be used.

[0280] Figure 41 is a 3D plot of the dielectric constant of an exemplary acrylic adhesive material. Figure 42 is an example. This is a plot of the dielectric constant of typical acrylic adhesive materials.

[0281] As shown in Figure 41, the dielectric constant (ε) of the acrylic adhesive r ) changes with temperature (°C) Specifically, the dielectric constant is the characteristic impedance of the system including the coupling strip and bulk medium. - Drives the dance. Therefore, when the temperature of the bonding strip changes, the induction is triggered accordingly. The power efficiency changes. This causes the system's impedance to fluctuate.

[0282] In some embodiments, impedance can be measured as a function of time, and impedance Since impedance generally changes with temperature, the same detection method as for temperature measurement is used to determine impedance. The de-icing state can be determined from the dance measurement. In particular, the point at which the bulk medium is de-iced is The impedance plotted with respect to time follows a predetermined period of positive or negative slope. This can be determined when the terrain becomes relatively flat (e.g., zero gradient) over a certain period. As shown in plot 4500 of Figure 40, the de-icing operation is in progress (from approximately 07:00 to 07 (Up to 20) The impedance reading remained around a fixed value (5.7Ω), and the de-icing operation Once this is complete, the impedance reading will increase (around 07:20).

[0283] Electrical related In some embodiments, the controller is used to measure electrical parameters and performance. This includes control, sensing, and monitoring subsystems used. Such parameters include Heating system including power control system, interconnects, cables, connectors, and electrodes The voltage, current, input, and output power at any output impedance in any stage include Born.

[0284] In some embodiments, the controller uses and minutes the collected electrical parameters. By analyzing the system, the integrity of the heating system and its components is evaluated, and the bulk medium is directed towards the target region. It controls the amount of power used, ensures that proper heating is being performed, and detects faults and errors. Report to system users and collect data from system users or maintenance personnel. Log this for further diagnosis.

[0285] In some embodiments, the controller performs its control and monitoring functions in order to This allows us to confirm that all measured electrical parameters are within the expected range.

[0286] In some embodiments, the output and input power of any stage of a power control system are measured simultaneously. This allows the controller to evaluate the power level and efficiency of the aforementioned stage. By monitoring the power level and efficiency (input power divided by the power supplied to the heating element), This allows the system to detect failures and notify of de-icing failures. For example, using this By using this method, it can be estimated that if the power supplied to the load is insufficient, de-icing will be incomplete. Cut.

[0287] In some embodiments, the voltage-to-current ratio of the input and output of any stage of the heating system The rate is measured and used by the controller. For example, in an embodiment of a heating system... In some stages, changes in downstream electrical elements affect the voltage-to-current ratio of the upstream stages of the electrical system. By detecting changes in ratios, we can identify remote downstream failures and performance indicators. Detection becomes possible.

[0288] Frequency domain analysis, for example, analyzes the input impedance of a circuit across various frequencies. By determining the size and phase of the signal, it is commonly used in the analysis of cables and high-frequency systems. It is being used. This information can be used to assess the health of the heating system, and the system In embodiments where the M includes a coupled strip (which operates as a transmission line), the characteristics of the strip It can be used to evaluate impedance, propagation constant, termination, and length.

[0289] For example, in the case of an open-terminated transmission line with a known characteristic impedance, the impedance to investigate is The dance is a length equal to an odd multiple of one-quarter of the wavelength of the traffic signal, ranging from 0 to a multiple of half the wavelength. It can vary up to Z0 with a length equal to .

[0290] This analysis can be performed from a single point, and also if both ends of the cable are accessible. This involves performing a "2-port" measurement to determine the signal passing from one port to the other. It is possible to analyze the transmission and reflection of signals.

[0291] Measurements across the entire frequency domain are most commonly performed with a network analyzer. A twerk analyzer transmits a range of frequencies at high levels and calculates the impedance from the voltage / current ratio. This is a tool that calculates, interpolates, and displays the data.

[0292] These are tools that can be used to verify whether there have been any changes in the transmission line system. It is also a problem. In complex electrical systems where cables travel long distances and access is difficult, transmission Transmission line analysis is very useful for checking cable damage and other undesirable changes. It is a valuable tool.

[0293] Cutting of coupling strips or other cables within the heating system, or other direct damage. This can be detected by impedance measurement. See the example for details. For example The connecting strip or cable is either completely cut or partially cut. It is also possible to determine this. An example of a detectable error is a change in length. For example, combined If it trips or the cable is cut, it will become shorter (and its end may change). (It may be), and its input impedance changes according to the following formula.

number

[0294] Faults can also be detected when the termination deviates from the expected value. For example, when it is normally open. If a terminated coupling strip is short-circuited, or if a coupling strip that is normally short-circuited is short-circuited This can occur, for example, when the trip is cut or detached, resulting in an open termination.

[0295] Passive monitoring of the operating power control system can detect impedance at the operating frequency. It is important to note that the diagnostic functions described in the remainder of this specification are It can be executed during the operation.

[0296] When using a network analyzer, a sinusoidal signal is sent to the device being measured. It is assumed that frequency response will be acquired, and it is an active measurement method, but passive Monitoring involves monitoring the signals (voltage and current) flowing through the device during normal operation and determining its impedance. This includes calculating the frequency. Since information can only be extracted from the operating signal and state, the frequency It cannot provide as much information as a full sweep. However, for fault monitoring, a pull scan is useful. It can be used again. Furthermore, it can be operated continuously, including while the heating system is running. It is possible.

[0297] There are three basic elements to implementing passive monitoring. • Interface: The interface between the power system and the monitoring system must be designed carefully. Example For example, to prevent excessive power, such as the power designated for ice protection, from entering the monitoring system. It is important to do so. ·division: Another important element of the system is impedance from voltage and current (V / I, etc.). This is the calculation. This requires not only maintaining phase information but also being accurate, appropriate, and fast. There is. • Signal conversion: Once the impedance signal is calculated, that signal is typically, for example, analog-digital A TAL converter is used to convert the data into a format more useful to the monitoring subsystem.

[0298] Passive monitoring is a useful tool for protecting the entire system, and in real time Detect the fault and prevent damage to the power system that may be caused by the fault. It can be protected.

[0299] In some embodiments, the controller controls the operation of the network analyzer system and The power supply to the coupling strips can be alternated. For example, the controller can Connect a wire analyzer to check for faults while supplying power to the coupling strip. The power can be switched intermittently. After the network analyzer acquires the measurement, Power flow to the coupling strip can be resumed. Then, the network analyzer... By cutting the wire, damage from power signals can be prevented. In some embodiments, the net The work analyzer can rotate while performing measurements on different bond strips. For example, a controller or control system may have a network analyzer on the strip. While acquiring measurements, the power flow to other coupled strips can be alternately interrupted. Therefore, adjacent coupling strips are subjected to network analyzer measurements. Some heat can be retained on the aircraft surface near the bonding strip.

[0300] In some embodiments, the network analyzer is different from the power supply system in terms of range. It can be configured to operate using a signal frequency. For example, the power signal is 100 It can supply within the range of ~450MHz, but the network analyzer is 1~10M The system is configured to measure the impedance of the coupling strip using a test signal within the Hz range. This can be achieved. A low-pass filter is placed between the input / output and power supply of the network analyzer. A safety feature is provided to prevent damage to the network analyzer from power signals and to stop the heating operation. This allows for impedance measurement of the coupling strip without requiring any additional steps.

[0301] In some embodiments, the controller further performs its function in the time domain Reflectometry is used. Time-domain reflectivity (TDR) is the study of reflections in transmission lines. It is often used to detect faults in very long or hard-to-reach cables. The main difference from the previously described method is that it focuses on the time domain. This means that the signal jumps from the end of the cable or coupling strip to its entry point. This means that the travel time until the signal bounces back can be measured. This can be used, for example, in transmission lines and couplings. An effective tool for measuring parameters such as strip length and characteristic impedance. TDR is a tool that derives parameters from frequency plots that are difficult to reverse. Because it can do this, it is an important tool that complements frequency domain analysis.

[0302] Figure 34 shows an example of TDR implementation, with a coupling attached to an aluminum panel. Using the TDR on the lip, for example, open circuits, short circuits, and impedance mismatches can be detected. This shows whether it can be detected in this way.

[0303] As a result, using TDR allows for the transmission lines, cables, or coupling strips Discontinuities, defects, or flaws can be characterized and identified. For example, in consistent materials. In the case of this cable, the propagation speed of electrical signals can be measured. Using this propagation speed Then, measure the distance from the measurement point and perturbations, faults, changes in the endpoint, or modifications, and use TDR. This can be detected as a local change in impedance.

[0304] TDR uses a very fast pulse generator to send signals to the system being measured. The key pulse parameters, including the time taken for the transition from low voltage to high voltage, are the required data. To obtain the data, it is adjusted to the specific system being tested and the specific measurement target. Next, measure this pulse with an oscilloscope. (Pulse optimized for periodic measurements) A special measuring instrument combining a generator and a sampling oscilloscope can be used. However, special equipment is not necessarily required. Time-domain representation is frequency-domain. It can be reconstructed from. Using the inverse Fourier transform, the network analyzer The output can be converted into an approximation of the expected time-domain behavior.

[0305] TDR enables the characterization and localization of discontinuities in transmission lines using a heating system. Short circuits, open circuits, delamination of line layers, and other transmission lines (such as cables and coupling strips), and other transmission line problems. It can be used to detect road damage.

[0306] Figure 35A shows a comparison of two of our transmission lines measured by TDR. One line after the section shows a large change in impedance localized to a narrow region. There are connectors that appear on the plot. The same technique is used similarly for transmission lines or couplings. It can detect trip deformation, short circuits, and delamination of transmission lines from the bulk medium. In some embodiments, the controller performs automatic analysis of the results. Appropriate signal processing and advanced analytical techniques (machine learning, computer vision, deep learning, artificial intelligence, By utilizing other database techniques, etc., the live results are stored in the base Compared to the baseline, we detect, characterize, and quantify the changes, and interpret the plots. You can also determine parameters such as impedance, termination, and length.

[0307] Elements of the heating system, such as cables and connecting strips, included in some embodiments, It can be shown that it has temperature-dependent geometric and material properties. For example, Furthermore, the shape of the transmission line and coupling strip may be affected by thermal expansion and contraction. Furthermore, the conductivity, dielectric constant, and magnetic permeability of the materials included in the binding strip vary with temperature. This shows that it can change. In the previous section, we discussed the system A method for detecting faults by measuring changes in impedance at various points. As explained, in addition to detecting changes in the physical structure of the binding strip or bulk medium, The de-icing state of the stem can also be evaluated. Impedance change versus temperature can be calculated and simulated. It can be measured by ration or empirically. In some embodiments, coupled storage By measuring the impedance and impedance change of the lip over time, their temperatures are estimated. This allows the controller to be provided with additional methods for performing that function.

[0308] Another useful metric can be the rate of change of the measured impedance. During a phase change, The substance (in this case, ice that dissolves in water) continues to absorb energy, but the temperature does not change (this In some cases, it remains at 0°C until it is completely melted. In some embodiments, the controller is coupled Measure the impedance of the strip and use this property to determine if de-icing is in progress or complete. It helps in performing that function, such as determining whether it has been done.

[0309] Detection of damage and changes in bulk media The coupling strip is placed on the bulk medium, so that the bulk medium appears as part of the transmission line shape. Embodiments installed (for example, an aluminum skin bonded to a strip and aluminum To become one of the contact surfaces of the strip line resulting from the combination of Kin These methods (by placing the bonding strip on top of the aluminum skin) Even if the binding strip itself has not been changed, changes to the bulk medium can be detected. , and damage can be detected. These lines are the heating system described herein. With proper coverage of the binding strip on the bulk medium that is returned to the electrical system, etc. In the case of such a structure, analyze the sections of the bulk structure and the potential for damage from concentrated measurement points. It can be monitored.

[0310] In some embodiments, the change in the structure of the bulk medium is due to the binding of the bulk medium to the bounds To display and analyze the geometric changes in the transmission line formed by the strips. This can be done. For example, a dent changes the shape of the bulk medium and alters the characteristic impedance of the transmission line within the region. - The dance can be changed.

[0311] The system described herein, when attached to the aircraft skin, enables the detection of damage to the skin and structure. This function can be provided. This damage detection is integrated into the aircraft's control and sensing systems. Specialized diagnostic equipment is transported by air or by maintenance personnel to a designated location on the aircraft. It can be used and executed autonomously. Currently, this type of damage is usually time-consuming and error-free. It is detected by visual inspection, a method that is prone to occurrence. Furthermore, damage detection during flight This is limited to events large enough that the crew can notice them without the help of the diagnostic system. It can be done.

[0312] In the case of composite-skin aircraft, transmission lines can be embedded in the composite layers of the skin material (even In addition to using a lightning protection shield, a conductor is added to another layer and embedded in Micros Enables damage detection, including delamination of composite materials (forming trips or striplines). It is possible.

[0313] In some embodiments, the system is configured to detect failures in the coupling strip. It may include separate sense lines. For example, a combined strip may be of a certain type. The defect is a delamination shadow in which the binding strip is at least partially detached from the bulk medium. It may be susceptible to resonance. In some such embodiments, the sense line is particularly It can be configured to be more sensitive to certain faults. In some embodiments, The join strips within the join strip 1900 can include sense lines.

[0314] Figure 38 shows a coupling line consisting of sense line 3820 and carrier line 3810. A schematic diagram of an exemplary embodiment of lip 3800 is shown. Carrier line 3810 is bulk medium The conductive path within the coupling strip 3800 carries the electric current used to heat the body. The sense line 3820 is the carrier line 3910 or the entire coupling strip 3800. It is a separate conductive path configured to detect a fault. Sense line 3810 is a key Current (AC) used to detect faults in the entire carrier line or coupling strip. It can carry DC intermittently or continuously. The current in the sense line is usually, In its operating state (for example, without faults), it is smaller than the current of the carrier line. For example, the coupling strip 3800 may correspond to the coupling strip 1900 in Figure 19. The sense line 3820 is on the same layer as the carrier line of the binding strip (for example, Figure 1). It can be added to the conductive path 1904) of 9, or to a layer separate from the carrier line 3910. can.

[0315] In the configuration shown in Figure 38, sense line 3820 is a transmission line loop detection sense line. It can be called [this]. The illustrated embodiment uses DC impedance measurement to detect delamination. To facilitate detection.

[0316] As described above with reference to Figure 23, in layout B of Figure 23, the coupling strip 381 The conductive layers within 0 are arranged in a triple overlap configuration. The conductive layers in layout B are, for example For example, an S-shaped path from the input end to the terminal end, with three segments arranged side by side. Includes. In the example in Figure 38, an open circuit or a short circuit is defined based on DC impedance, i.e. Each circuit is used to perform a DC connectivity test or a DC open-circuit test. Therefore, it can be detected.

[0317] Figure 39A shows a coupling consisting of carrier line 3910 and sense line 3920. Figure 39B shows a schematic diagram of another exemplary embodiment of the trip 3900A. The coupling strip 3900B, which consists of line 3910 and sense line 3920, A schematic diagram of another exemplary embodiment is shown. This embodiment is shown in Figures 39A and 39B. Therefore, sense line 3920 can be called a terminating sense line.

[0318] In all examples, the sense line 3920 is relative to the conductive shielding layer 3940. It is positioned closer to the carrier line 3910, that is, the sense line 392 The distance between 0 and carrier line 3910 is between carrier line 3910 and shield layer 39 Closer than the interval between 40. In some embodiments, the heating carrier line 3910 and The spacing between the bulk media 3930 and the sense line 3920 and the carrier line 3910 It is even smaller than the interval between them.

[0319] In the example shown in Figure 39A, the AC signal on carrier line 3910 is transmitted to coupling strip 3910. If properly installed and not detached, electrically coupled to bulk medium 3930 It remains as is. When delamination occurs, that is, when carrier line 3910 becomes bulk medium 393 When disconnected from 0, the coupled strip signal is disconnected from the bulk medium 3930 and instead It will then be connected to Senseline 3920.

[0320] It was determined that more current than usual was flowing through sense line 3920, and therefore To detect correlation separation, a device is configured to detect changes in the flow of electricity in a wire or circuit. The system can use current sensors that can perform the task. Specifically, the system has thresholds. Value-based delamination detection can be performed. For example, in a properly stacked line, sense The current measured in the line will be relatively low. However, (partially) delaminated In this case, the current exceeds the threshold current value. The threshold is 3900A or 390A for the coupled strip. The height is sufficient to avoid false detection during normal operation of 0B, while maintaining a given peel length (e.g.) For example, it can be selected to enable detection at a distance of 10 cm.

[0321] In addition, or alternatively, a 2-port network analyzer sensor can be used in the system. This is possible, and the first ground reference port is connected to the coupling strip, and the second ground reference port is connected to the It connects to the 3920 network analyzer sensor. One or more S-parameters (such as S21 parameters) for the 2-port network are selected. By measuring at a specific frequency, the coupling between the sense strip and the coupling strip can be quantified. It can be configured to do so when the S21 parameter exceeds a predetermined threshold. Delamination can be detected.

[0322] In some embodiments, the heating system assists in detecting system failures, including delamination. It can include one of the various self-modifying components that can be used to do so. In particular, the coupling strip 1900 is easily detectable when it is in a specific failure mode. It can be configured to be a faulty configuration. The coupling strip 1900 is such a faulty configuration. The fault configuration is quickly detected, and undesirable failures occur, for example, in bulk media 1902. It can be configured to happen before it is triggered.

[0323] As an example, dielectric isolation between the conductive layer 1904 and the conductive shielding layer 1906 is achieved at the temperature Once the temperature exceeds the threshold temperature and melting begins, the dielectric separation starts to change shape, altering the insulating properties. It can be composed of one or more predetermined materials so that it begins to lose heat, for example, heat bonded together Local delamination of the bonding strip 1900 from the bulk medium 1902 onto the lip 1900. When it accumulates in a portion, the peeled portion of the bonding strip gives a heating signal (instead of bulk medium 1902) When bonded to the conductive shielding layer, the unbonded portion of the bonding strip It self-heats. Modified between the conductive layer 1904 and the conductive shielding layer 1906, for example, Electrically short-circuited dielectric isolation dramatically affects the performance and input impedance of the coupling strip. This brings about a change, and from that change, for example, a current sensor or impedance sensor can be used. This allows for easy detection of delamination. For example, a sudden change in impedance can be detected. Compared to the impedance of a coupling strip during normal (fault-free) operation, the coupling strip The impedance of the top can increase or decrease by more than an order of magnitude.

[0324] For example, in the case of de-icing the exterior of an aircraft, the heating system is typically in the range of 50°C to 60°C. For it to function, the threshold temperature is higher than the upper limit of the normal range but is a harmful temperature (e.g., burning). The temperature can be set to a value far below the ignition temperature of the fuel tank, for example, 130°C. In this example, polysulfide-based materials are suitable for use in constructing dielectric isolation. Here is an example of the price.

[0325] As another example, the conductive layer 1904 becomes more conductive as the temperature rises. Composed of one or more predetermined materials such that it loses its properties and deteriorates, for example, to an open state. This allows for the direct detection of delamination. In this example, copper and aluminum Aluminum and alloys are suitable materials for constructing conductive layers.

[0326] As another example, the dielectric constant of the bottom dielectric layer can change significantly with temperature. It can be composed of one or more predetermined materials, thereby enabling detection of an impedance A change in impedance occurs, and this change in impedance can indicate a problem, and also impedance Measurement allows for accurate temperature measurement. In this example, acrylic adhesive and silicone adhesive are used. ethylene vinyl acetate adhesive, polysulfide sealant, polyurethane sealant, Mylar, PTFE, FEP, and Kapton are suitable materials for constructing the bottom layer.

[0327] In some embodiments, the conductive layer 1904 is located on one side of the system relative to another side. It can be configured to have lower sensitivity than the conductive layer. For example, the conductive layer 1904 is a conductive layer The impedance, cross-sectional area, or both of the conductive layer 1904 is relatively temperature-dependent. It can be configured so that it does not exist. In this way, it causes a significant impedance change. System failures such as delamination can be easily identified from normal system operation variations. It becomes u.

[0328] Specifically, in these embodiments, in order to achieve the desired sensitivity of the conductive layer 1904 Different constituent materials, different joining materials and associated joining methods, different cross-sectional dimensions, etc. A geometric design or different terminal configuration can be considered. For example, a water-based connection. The adhesive shows a rapid change in impedance around 0°C, but ethylene vinyl acetate (EVA) Which alcohol-based adhesives provide more consistent or stable impedance changes? This demonstrates that epoxy also exhibits relatively stable dielectric behavior.

[0329] • Frequency domain analysis for detecting mechanical changes in bulk media Changes in impedance are mechanical changes in the aircraft's outer skin and other bulk media (e.g., It can also be used to detect dents and cracks. For example, impedance The change is detectable following an effect on the structure on or outside the binding strip. This was demonstrated using an impact test setup. A 1.2kg indenter was applied to a 2.8m indenter. It was dropped onto the panel from that height. This attaches the aircraft's outer skin to structural elements such as wing ribs. To create a 4mm indentation 25mm from the nearest zipper, it was selected. The observed changes were small enough not to cause system malfunction. It was large enough to be detected.

[0330] Figure 35B shows the normalized real part of the impedance immediately before and after the impact. "P", "Near Connector", and "Middle" are connectors for the coupling strip at the specified location. This shows the effect. "Between" and "far" are two branches of the combined strip. This shows the effect between the strips and the distance from the nearest binding strip (~18cm). It's illustrated in the diagram. A jump in impedance is observed after impact.

[0331] As shown in Figure 35B, after the impact, there is a relatively small jump in impedance (approximately 5 %) is observed. This is detectable from both impacts to the binding strip and impacts to the outside. Therefore, changes in impedance can be detected even with impacts occurring at a distance from the coupling strip. It can be used for impact detection between railway tracks, etc. The line covers most of the surface of the aircraft. Therefore, it can be used to monitor the structure and detect mechanical changes (such as dents and cracks). can.

[0332] • Frequency domain analysis for cable fault detection In some embodiments, frequency domain analysis plots are used to analyze the heating system 100. Possible cable faults, such as delamination of coupling strip 1900, can be detected. It also detects mechanical changes (such as dents and cracks) in the aircraft's outer skin and other bulk media. It can also be used for plot transformation techniques (e.g., Fourier transform) and machine learning. Using advanced graph analysis techniques, including learning techniques (e.g., neural networks), From a frequency response plot or data derived from a frequency response plot, or both. Extract features or characteristics that can detect the presence of cable faults or mechanical changes in bulk media. It is possible. Generally, various features or characteristics can cause various types of cable failures. This may cause harm and mechanical changes in the bulk medium.

[0333] For example, features or characteristics include the minimum or maximum resistance or theta value, and these This may include the value of the associated frequency where the minimum or maximum value of is located. Another example is a feature or Characteristics include, for example, the dominance of resonance peaks, the distance between peaks, and the frequency interval between peaks. It can include resonance peak pattern information, including consistency between the peaks.

[0334] Figure 43 shows a healthy bond (e.g., a defect-free bond strip) placed on a bulk medium. The frequency response plots of the coupled strip and the defective coupled strip are shown. In the example, a specific type of cable fault is a resonant peak over a given frequency range, for example. For example, whether each value of the resonance peak 4310 is monotonically decreasing or monotonically increasing. Based on the judgment, delamination can be detected. As shown in plot 4300. As such, the resonance peak value decreases monotonically with respect to a healthy coupling strip. However, Then, as shown in plot 4350, unhealthy (e.g., detached) bond strips In this case, the resonance peak value may first decrease, then increase, and then decrease again.

[0335] In some embodiments, the measured impedance versus frequency of a particular cable is used to determine the fault This shows the expected impedance-to-frequency pattern of a harmless (e.g., healthy) cable. By comparing with the data, short circuits, open circuits, and more can be detected in cables (e.g., coupling strips). Alternatively, defects such as delamination can be detected. For example, a spectral analyzer or This uses a TDR device to determine the impedance versus frequency or time domain of a particular cable. The pattern can be measured. The measured impedance versus frequency or time-domain pattern can be measured. The turn is the expected impedance versus frequency or time domain of a similar cable without interference. It can be compared with regional patterns (for example, as shown in plot 4350). In the wavenumber domain example, the measured impedance versus frequency pattern resonant peak pattern The changes in the characteristics or properties of the impedance are compared with the expected impedance-to-frequency pattern. It can be used to identify faults in cables.

[0336] • TDR for detecting mechanical changes in bulk media Dents and other mechanical changes in the bulk medium are local deformations of the bulk medium, This can cause localized changes in the characteristic impedance of transmission lines installed in bulk media. Therefore, TDR is suitable for detecting and locating mechanical changes in bulk media.

[0337] Figure 36 shows examples of TDR in two different coupling strip designs. The red line indicates a dent. The test panel is shown, and the blue line represents the baseline panel. Using TDR, the dent The impedance changes abruptly along the coupled strip, which is typical for a panel without a recess. It can be seen that this appears as an impedance fluctuation around the value of . Using this information, The damage can be limited to a specific area of ​​the cable. Therefore, the location of the damage to the underlying structure. This allows us to identify the average characteristic impedance along the length of the bond strip. Because the dances are almost the same, it can be difficult to detect them using only the frequency response. However, using TDR, it is possible to identify local discontinuities.

[0338] In one embodiment of the heating system, the obtained data is analyzed (for example, using the advanced method described above). (Used) in combination with TDR measurements performed on binding strips covering the bulk medium It can be used to map the outer shell, structure, and health status of bulk media. This can be used as a maintenance and service diagnostic tool, or as a real-time monitoring tool. It can be used.

[0339] In an embodiment of an electric de-icing system that uses a binding strip to heat a bulk medium, In this embodiment, multiple coupling strips are powered from the same high-frequency source. To prevent it from physically coming into contact with the problematic coupling strip, an additional cable can be included. In these embodiments, the aforementioned fault detection and de-icing evaluation are still possible. A single monitoring system for AC power supplies monitors the performance of all connected coupling strips. This is possible. However, in another embodiment, an additional monitor is added to the input of each coupling strip. - can also be placed. Each combined strip can be considered a parallel element, and additional k A cable is used as a serial element in a network. This network is composed of Defined by geometry parameters and material parameters.

[0340] In some embodiments, multiple AC power sources are combined, one or more as described above. It is possible to power a number of combined strips. As above, this allows a single The controller subsystem has one or more AC power supplies and one or more coupling strips This will allow for the detection of faults between power sources. However, individual monitoring of each AC power source is required. This can also be done. This allows you to isolate the cause of the failure to a single system element. In this embodiment, a fault detection system is used to compensate for the fault while completing de-icing. It is possible to install redundant AC power supplies so that redundant elements can be brought online. be.

[0341] Some embodiments of electric de-icing systems distribute energy between the AC power supply and the coupling strip. This may include a path or inline circuit. This circuit is a passive circuit (inductor, con It may include only a capacitor, resistor, and transformer. On the other hand, this circuit is active It may also be a circuit (for example, in the case of an active IAN, a transistor, logic gate, (or other elements). In embodiments where this circuit is active, this circuit is fault-detected. It can be used for de-icing and de-icing evaluation. Multiple bonding strips are single or bonded A In an embodiment powered by a C power supply, a distributed active circuit connects each individual monitor. By placing the fault in a strip element, the fault can be isolated into a single combined strip element. This is possible. Furthermore, if additional redundant coupling strip elements are installed, distributed acts The IV circuit supplies power to other coupled strips, mitigating failures in a single coupled strip. This allows for complete de-icing. This distributed circuit can be operated using cable wiring or known wireless communication. via a protocol, or by manipulating the system's voltage, current, or impedance. It can communicate with an AC power supply or any "upstream" circuit. For example, in one embodiment... This distributed circuit uses electrical or electromechanical switches to detect impedance outside the normal range. - Any coupling strip with a dance can be cut. This cut is AC power As soon as the monitoring system detects it, the faulty coupling strip will not receive power. In this way, damage to the system can be prevented. In another embodiment, other sensors (for example) For example, temperature sensors and ice sensors are coordinated with such a distributed circuit, and power is supplied when ice accumulation is large. It can be directed directly to the area.

[0342] In embodiments where multiple binding strips are attached to the same bulk medium, a single binding strip By sending a signal to the coupling strip, a fault in a nearby coupling strip can be detected. This is possible. All bonding strips attached to the same bulk structure have a certain degree of electrical Magnetic coupling is possible. Transmitter to one coupling strip (AC power, network analyzer) Place the receiver (such as an oscilloscope) on a separate coupling strip (e.g., TDR). This allows us to pick up the guiding signal. This confirms that the coupling is within the expected range. It can be used for this purpose. If the coupling coefficient is outside the expected range, it may indicate a problem. There are such features. For example, in one possible embodiment, the electrical connection of the bonding strip to the bulk structure If the connection is insufficient, it may increase the binding to other binding strips. This can also lead to insufficient heating for de-icing. Monitoring the induction signal with other coupling strips This allows us to detect this error.

[0343] In some embodiments, as described above, a TDR plot is used, for example, in a graph. Using analytical techniques, specific details are drawn from the TDR plot or extracted in other ways. By analyzing the characteristics, it is possible to assist in the detection of delamination in bond strips. .

[0344] In addition to detecting defects in the bonding strip or dents in the bulk medium, the same as above. Using the method, either TDR or frequency domain analysis is performed on the bulk medium. To detect the presence of various contaminants such as water and ice, as well as the presence of various contaminants on bulk media. It is possible to determine the type of pollutant present.

[0345] As used herein, the term “electrically connected” means that two electrical components are connected (For example, a wire or without additional components such as resistors, capacitors, or inductors) In contrast to "direct connection," where electrical functions are directly coupled to each other (via circuit traces), This includes cases where the first component is connected to the second component. The mention of electrically connecting to a specific terminal of the component is related to the second component. It is not intended to include an electrical path passing through the gate itself. For example, the gate of a transistor. A capacitor electrically connected to its terminals is electrically connected to another object that has an electrical function. This may include cases where the electrical connection passes through a component, but where the electrical connection is at another terminal of the transistor itself (e.g.) For example, this does not include cases where the current passes through the source / drain to the gate of the transistor.

Claims

1. A system for heating the outer skin of an aircraft, the system is A series of individual heating elements arranged on the outer skin of the aircraft, The field corresponding to the relatively low temperature region within the heating pattern generated by the aforementioned heating element The sensor is located on the outer shell, A control system connected to the heating element and the sensor, wherein the sensor A control system configured to control the power supplied to the heating element in response to the output. and, A system equipped with these features.

2. The heating element, in combination with the aircraft skin, forms a power transmission line. A bonding strip comprising a multilayer structure extending along the surface, wherein the multilayer structure is The first dielectric layer on the aircraft skin, A conductive layer on the first dielectric layer, A second dielectric layer on the conductive layer, A conductive shielding layer on the aforementioned second dielectric layer, The system according to claim 1, including the following:

3. The aforementioned location, when the heating element is active, raises the local temperature of the location outside the aircraft. Structural features on the aircraft skin are positioned to be kept at a temperature lower than the majority of the skin. The system according to any one of claims 1 and 2, including

4. The aforementioned structural features are designed to provide less heat to the area compared to the majority of the aircraft skin. The system according to claim 3, comprising an arrangement of heating elements.

5. The aforementioned location includes a structural feature on the aircraft skin, which causes ice formation at the location. The system according to any one of claims 1 to 4, arranged in such manner.

6. The system according to claim 5, wherein the structural feature includes a ridge, edge, or wall.

7. The sensor is a temperature sensor or an ice sensor, according to any one of claims 1 to 6. system.

8. The system according to any one of claims 1 to 7, wherein the aforementioned location is visible from the window of an aircraft.

9. The control system is Based on the output from the aforementioned sensor, the characteristics of the aircraft's skin at that location are detected. The value of the aforementioned characteristic is compared with the reference characteristic, In response to the determination that the value of the aforementioned characteristic indicates freezing at that location, the display of the freezing state is made. Trigger The system according to any one of claims 1 to 8, configured as described above.

10. A second corresponding to a relatively high-temperature region within the heating pattern generated by the aforementioned heating element The aircraft also has a second sensor located on its outer shell at the location, The control system is connected to the second sensor, The control system, based on the output from the second sensor, at the second location The temperature of the aircraft's outer skin is detected, and that temperature is compared to the reference temperature of that location. In response to a determination that the temperature is higher than the target temperature, the system triggers an overheating indicator. The system according to any one of claims 1 to 9, configured as described above.

11. The control system is Based on the output from the aforementioned sensor, the characteristics of the aircraft's skin at that location are detected. The value of the aforementioned characteristic is compared with the reference characteristic, In response to the determination that the value of the aforementioned characteristic indicates freezing at that location, power is supplied to the heating element. The system according to any one of claims 1 to 10, configured to supply a

12. A second corresponding to a relatively high-temperature region within the heating pattern generated by the aforementioned heating element The aircraft also has a second sensor located on its outer shell at the location, The control system is connected to the second sensor, The control system, based on the output from the second sensor, at the second location The temperature of the aircraft's outer skin is detected, Compare that temperature to the reference temperature for that location. In response to the determination that the temperature is higher than the reference temperature, the power to the heating element is reduced. The system according to any one of claims 1 to 11, comprising the above configuration.

13. The control system is connected to the coupling strip and is an impedance monitoring subsystem. The impedance monitoring subsystem includes, The input impedance of the heating element is monitored, From the input impedance, a failure of the heating element is detected. The system according to claim 2, configured as follows.

14. The detection of the failure of the heating element is as follows: The first impedance-to-frequency pattern of the heating element is obtained, The first impedance-to-frequency pattern described above represents the expected impedance without faults. By comparing it with a second impedance-to-frequency pattern, faults are detected, The system described in item 13.

15. The impedance monitoring subsystem responds to the power signal applied to the heating element. Based on the electrical characteristics of the heating element, the impedance of the heating element is detected. The system according to claim 13, comprising a configured passive system.

16. The impedance monitoring subsystem transmits a test signal to the heating element and the test In response to the signal, the impedance of the heating element is detected based on the electrical characteristics of the heating element. The system according to claim 13, comprising an active system configured to emit.

17. The control system is connected to the coupling strip and is an impedance monitoring subsystem. The impedance monitoring subsystem includes, The input impedance of the heating element is monitored, From the aforementioned input impedance, mechanical changes in the aircraft's outer skin are detected. The system according to claim 2, configured as follows.

18. The control system monitors time-domain reflectance (TDR) measurements connected to the coupling strip. The TDR monitoring subsystem includes a visual subsystem, The time-domain electrical pulse response of the heating element is monitored, From the time-domain electrical pulse response, a failure in the heating element is detected. The system according to claim 2, configured as follows.

19. Detection of the failure of the heating element is To obtain a first time-domain reflectance (TDR) pattern of the heating element, and The first TDR pattern shown above represents the expected TDR pattern of a fault-free heating element. By comparing it with a second TDR pattern, a fault can be detected. The system according to claim 18, including the system described in claim 18.

20. The control system is connected to the coupling strip for time-domain reflectance measurement (TDR). The TDR monitoring subsystem includes a monitoring subsystem, The time-domain electrical pulse response of the heating element is monitored, From the aforementioned time-domain electrical pulse response, mechanical changes in the aircraft's skin are detected. It is structured in such a way. The system according to claim 2.

21. A system for heating the outer sheath of a bulk conductor, the system is A series of individual heating elements arranged on the outer sheath of a bulk conductor, At locations corresponding to relatively low-temperature regions within the heating pattern generated by the aforementioned heating element A sensor disposed on the outer shell, A control system connected to the heating element and the sensor, wherein the output from the sensor A control system configured to control the power supplied to the heating element in response to the following: A system that includes this.

22. The heating element, in combination with the outer sheath of the bulk conductor, forms a power transmission line. A bonding strip comprising a multilayer structure extending along the surface of the outer sheath of a conductor, the multilayer structure teeth, The first dielectric layer on the bulk conductor skin, A conductive layer on the first dielectric layer, A second dielectric layer on the conductive layer, A conductive shielding layer on the aforementioned second dielectric layer, The system according to claim 21, including the above.

23. The aforementioned location, when the heating element is active, will have a local temperature at the location that is lowered to the bulk conductor. Structural features positioned to maintain a temperature lower than that of the majority of the outer shell are located outside the bulk conductor. The system according to any one of claims 21 and 22, comprising a skin.

24. The aforementioned structural features result in less heat being transferred to that location compared to the majority of the bulk conductor sheath. The system according to claim 23, comprising the arrangement of the heating elements.

25. The aforementioned location includes structural features on the bulk conductor sheath that cause ice formation at the aforementioned location The system according to any one of claims 21 to 24, arranged to rub against each other.

26. The system according to claim 25, wherein the structural features include a ridge, edge, or wall.

27. The sensor is a temperature sensor or an ice sensor, as described in any one of claims 21 to 26. The system.

28. The location is visible from the window of the bulk conductor, according to any one of claims 21 to 27. system.

29. The control system is Based on the output from the sensor, the characteristics of the bulk conductor skin are detected at that location. The value of that characteristic is compared to a reference characteristic, and the determination is made that the value of that characteristic indicates freezing at that location. Respond and trigger the display of the frozen state. The system according to any one of claims 21 to 28, configured as described above.

30. The relatively high-temperature region within the heating pattern generated by the heating element corresponds to the Claim 2 further comprises a second sensor disposed on the outer sheath of the bulk conductor at location 2. In the system described in any one of items 1 to 29, The control system is connected to the second sensor, The control system is Based on the output from the second sensor, the bulk conductor skid at the second location The temperature of the n is detected, The aforementioned temperature is compared with the reference temperature of that location. In response to the determination that the temperature is higher than the reference temperature, an overheating indicator is triggered. ru, A system that is configured in such a way.

31. The control system is Based on the output from the sensor, the characteristics of the bulk conductor skin at the location are detected. 、 The value of the aforementioned characteristic is compared with the reference characteristic, In response to the determination that the value of the aforementioned characteristic indicates freezing at the aforementioned location, power is supplied to the heating element. to supply The system according to any one of claims 21 to 30, configured as described above.

32. The relatively high-temperature region within the heating pattern generated by the heating element corresponds to the Claim 2 further comprises a second sensor disposed on the outer sheath of the bulk conductor at location 2. In the system described in any one of items 1 to 31, The control system is connected to the second sensor, The control system is Based on the output from the second sensor, the bulk conductor skid at the second location The temperature of the n is detected, The temperature is compared with the reference temperature of the location, In response to the determination that the temperature is higher than the reference temperature, the power applied to the heating element is reduced. Rasu, The system according to any one of claims 21 to 31, configured as described above.

33. The control system is connected to the coupling strip and is an impedance monitoring subsystem. The impedance monitoring subsystem includes, The input impedance of the heating element is monitored, The fault of the heating element is detected from the input impedance. The system according to claim 22, configured as follows.

34. Detection of the failure of the heating element is To obtain the first impedance-to-frequency pattern of the heating element, and The first impedance-to-frequency pattern described above represents the expected impedance without interference. By comparing it with a second impedance-to-frequency pattern, a fault can be detected. The system according to claim 32, including.

35. The control system is connected to the coupling strip and is an impedance monitoring subsystem. The impedance monitoring subsystem includes, The input impedance of the heating element is monitored, From the input impedance, a mechanical change in the outer sheath of the bulk conductor is detected. The system according to claim 22, configured as follows.

36. The control system monitors time-domain reflectance (TDR) measurements connected to the coupling strip. The TDR monitoring subsystem includes a visual subsystem, The time-domain electrical pulse response of the heating element is monitored, From the time-domain electrical pulse response, a failure in the heating element is detected. The system according to claim 22, configured as follows.

37. The detection of a malfunction in the heating element is performed by To obtain a first time-domain reflectance (TDR) pattern of the heating element, and The first TDR pattern is used to show the expected TDR pattern of a heating element without defects. Claim 36 includes detecting a fault by comparing it with a TDR pattern. The system.

38. The control system is connected to the coupling strip for time-domain reflectance measurement (TDR). The TDR monitoring subsystem includes a monitoring subsystem, The time-domain electrical pulse response of the heating element is monitored, From the time-domain electrical pulse response, a mechanical change in the outer layer of the bulk medium is detected. The system according to claim 22, configured as follows.

39. At least one of the conductive layers in the coupling strip has sense lines and caps. The sense line, which includes a rear line and is located within the coupling strip, is the carrier A system according to claim 2 or 22 that senses a fault in the line or the coupling strip. Hmm.

40. The first end of the sense line is electrically connected to the carrier line, and the sense line The system according to claim 39, wherein the second end of the n is electrically connected to a connectivity test terminal.

41. The first end of the sense line is electrically connected to the conductive shield layer, and the sense line The system according to claim 39, wherein the second terminal of the input is electrically connected to an AC voltage source.

42. The sense line can measure temperature based on the change in the impedance of the sense line. The system according to claim 39, comprising one or more capacitors arranged in such manner.

43. The coupling strip fails in a predetermined manner to indicate a failure of the coupling strip. The claim 2 or 22 includes one or more self-modifying components configured as described above. The system.

44. The control system is The temperature indicated by the sensor is measured over a certain period of time. The temperature gradient remained constant at approximately zero degrees Celsius for a certain period, and then began to rise. In response to that decision, by determining that de-icing is complete, The configuration described in any one of claims 1 to 43, which is configured to detect the state of de-icing operation. The system.

45. The control system measures the impedance frequency response of the coupling strip, and the measured It is configured to estimate the temperature of the coupling strip based on the impedance frequency response. The system according to any one of claims 1 to 44.

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