Electronic device and method for manufacturing the same

Abstract

The present invention provides a method for manufacturing an adhesive member, which includes two or more coating steps, and a method for manufacturing a display device, which includes the same. [Solution] A method for manufacturing a display device DD according to one embodiment includes the steps of: fixing a substrate in which a first region and a second region surrounding the first region are defined onto a stage; and forming an adhesive member on the substrate, wherein the step of forming the adhesive member includes the steps of: applying a first resin composition to the substrate so that the first region and the second region overlap; curing the first resin composition by providing a first light; applying a second resin composition on the cured first resin composition so that it overlaps the second region; and curing the second resin composition by providing a second light, wherein the first resin composition and the second resin composition each have a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C.

Description

Technical Field

[0001] The present invention relates to an electronic device including an adhesive member and a method for manufacturing the same.

Background Art

[0002] A variety of display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game machines, etc. have been developed. In particular, recently, developments have been made regarding display devices that are equipped with a flexible display member that bends to facilitate portability and improve user convenience and can be folded, bent, or rolled up.

[0003] In the case of such a flexible display device, each member used needs to ensure reliability through folding and bending operations. In addition, the adhesive resin used to form an adhesive layer applied to display devices of various shapes needs to have excellent coating properties for members of display devices in various forms.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a method for manufacturing an adhesive member including two or more coating steps and a method for manufacturing a display device including the same.

[0005] Another object of the present invention is to provide an electronic device formed from a method for manufacturing a display device and including an adhesive member.

Means for Solving the Problems

[0006] A method for manufacturing a display device according to one embodiment of the present invention includes the steps of: fixing a substrate having a first region and a second region surrounding the first region onto a stage; and forming an adhesive member on the substrate, wherein the step of forming the adhesive member includes the steps of: applying a first resin composition onto the substrate so as to overlap the first region and the second region; curing the first resin composition by providing a first light; applying a second resin composition onto the cured first resin composition so as to overlap the second region; and curing the second resin composition by providing a second light, wherein the first resin composition and the second resin composition each have a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C.

[0007] In the step of applying the first resin composition, the first amount of the first resin composition applied to the first region can be greater than the second amount of the first resin composition applied to the second region.

[0008] The second region of the substrate can be divided into two or more first unit regions with different amounts of the first resin composition applied.

[0009] The second region of the substrate can be divided into a first-1 unit region adjacent to and surrounding the first region, and a first-2 unit region separated from the first region with the first-1 unit region in between, and surrounding the first-1 unit region.

[0010] The amount of the first resin composition applied to the 1-1 unit region can be smaller than the amount of the first resin composition applied to the 1-2 unit region.

[0011] The step of forming the adhesive member may further include, before the step of applying the first resin composition, the step of configuring the substrate with a bitmap that includes m pixels in a first direction and n pixels in a second direction intersecting the first direction; the step of dividing the second region on the bitmap into two or more first unit regions; and the step of setting the amount of the first resin composition to be applied in the first region and the first unit regions.

[0012] The average coating amount of the first resin composition in the first unit region, calculated by the following formula 1, can be 50 or more and 85 or less.

[0013] [Formula 1] [(X1×A1)…(Xn×An)]÷(A1+…An) In the above formula 1, X1...Xn are the amounts of the first resin composition applied to each of the first unit regions from the first to the nth unit region, respectively, when the total amount of the first resin composition applied to the first region is set to 100, where n is an integer of 2 or more, and A1...An are the number of pixels in each of the first to the nth unit regions, respectively, where n is an integer of 2 or more.

[0014] The step of forming the adhesive member may further include, before the step of applying the second resin composition, the steps of: configuring the substrate with a bitmap that includes p pixels in a first direction and q pixels in a second direction intersecting the first direction; dividing the second region on the bitmap into two or more second unit regions; and setting the amount of the second resin composition to be applied in the second unit region.

[0015] The second unit region includes a second-first unit region adjacent to the first region and surrounding the second region, and a second-second unit region separated from the first region with the second-first unit region in between and surrounding the second-first unit region, and the amount of the second resin composition applied to the second-first unit region may be different from the amount of the second resin composition applied to the second-second unit region.

[0016] The amount of the second resin composition applied to the 2-1 unit region can be greater than the amount of the second resin composition applied to the 2-2 unit region.

[0017] The adhesive member overlaps the second region and includes a peak portion where the height between the lower surface and the upper surface of the adhesive member is maximum, with respect to the thickness direction, and the horizontal distance from the edge of the adhesive member to the peak portion can be 300 μm or more and 600 μm or less.

[0018] In the step of forming the adhesive member, the temperature of the stage can be 20°C or higher and 30°C or lower.

[0019] The first resin composition and the second resin composition can be applied by an inkjet printing method.

[0020] The width of the second region can be 3 mm or less.

[0021] In the step of applying the second resin composition, the second resin composition applied to the substrate does not need to overlap the first region.

[0022] A method for manufacturing a display device according to one embodiment of the present invention includes the steps of: preparing a display panel in which a first region and a second region surrounding the first region are defined; forming an adhesive member on the display panel using an inkjet method; and attaching a window to the display panel via the adhesive member, wherein the step of forming the adhesive member includes the steps of: applying the first resin composition on the display panel; curing the first resin composition to form a preliminary adhesive member; applying the second resin composition on the preliminary adhesive member along the edge of the preliminary adhesive member; and curing the second resin composition, wherein the viscosity of the first resin composition and the second resin composition can be 10 mPa·s or more and 30 mPa·s or less at 25°C.

[0023] The step of applying the first resin composition can control the application amount of the first resin composition ejected from an inkjet head, and apply the first resin composition at a first application amount onto the first region of the display panel, and apply the first resin composition at a second application amount different from the first application amount onto the second region of the display panel.

[0024] The step of forming the adhesive member further includes a step of dividing the second region into two or more first unit regions with different application amounts of the first resin composition before the step of applying the first resin composition, and a step of setting the application amounts of the first resin composition in the first region and the first unit regions. The step of applying the first resin composition can be a step of applying the first resin composition onto the first region and the first unit regions according to the set application amounts.

[0025] The edge of the preliminary adhesive member can correspond to the second region of the display panel.

[0026] An electronic device according to an embodiment of the present invention includes a display panel in which a first region and a second region surrounding the first region are defined, a window disposed on the display panel, and an adhesive member disposed between the display panel and the window and derived from a resin composition having a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C. The adhesive member overlaps the second region and includes a peak portion having the maximum height from the lower surface to the upper surface of the adhesive member with respect to the thickness direction. The horizontal distance from the edge of the adhesive member to the peak portion is 300 μm or more and 600 μm or less.

Advantages of the Invention

[0027] A manufacturing method of a display device according to an embodiment can form a thin film with good spraying of film thickness near the edge of a target substrate.

[0028] One embodiment of the electronic device can exhibit excellent adhesive reliability by including an adhesive member whose shape is controlled near the edge. [Brief explanation of the drawing]

[0029] [Figure 1] This is a perspective view of a display device according to one embodiment of the present invention. [Figure 2] This figure shows the folded state of the display device shown in Figure 1. [Figure 3] This is a perspective view of a display device according to one embodiment of the present invention. [Figure 4] This figure shows the folded state of the display device shown in Figure 3. [Figure 5] This is a cross-sectional view of a display device according to one embodiment of the present invention. [Figure 6] This is a disassembled perspective view of a display device according to one embodiment of the present invention. [Figure 7] This is a cross-sectional view of a display device according to one embodiment of the present invention. [Figure 8] This is a cross-sectional view of a display device according to one embodiment of the present invention. [Figure 9] This is a cross-sectional view of a display device according to one embodiment of the present invention. [Figure 10] This is a block diagram of an electronic device according to one embodiment. [Figure 11] These are schematic diagrams of electronic devices based on various embodiments. [Figure 12a] This is a sequence diagram showing a method for manufacturing a display device according to one embodiment of the present invention. [Figure 12b] This is a sequence diagram showing in detail the step of forming an adhesive member in a method for manufacturing a display device according to one embodiment of the present invention. [Figure 13a] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13b] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13c] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13d] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13e] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13f] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13g] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13h] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13i] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13j] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 13k] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 14a] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 14b] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Figure 14c] This figure schematically shows the steps for forming an adhesive member according to one embodiment of the present invention. [Modes for carrying out the invention]

[0030] Because the present invention can be modified in various ways and take on various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this should not be understood as limiting the present invention to specific embodiments, but rather as including all modifications, equivalents, or substitutes that fall within the spirit and technical scope of the present invention.

[0031] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on top of," "connected to," or "joined" another component, it means that it can be directly placed on top of, connected to, or joined to the other component, or that a third component can be placed between them.

[0032] On the other hand, in this application, "directly arranged" may mean that there are no additional layers, films, regions, plates, etc. between one part and another. For example, "directly arranged" may mean that two layers or two members are arranged without using additional members such as adhesive members.

[0033] The same drawing reference numeral indicates the same component. Furthermore, in drawings, the thickness, proportions, and dimensions of components are exaggerated for the sake of effective explanation of the technical content.

[0034] "and / or" includes all combinations of one or more that are defined by the relevant configuration.

[0035] Terms such as "first," "second," etc., are used to describe a variety of components, but the components are not limited to those defined by these terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may also be named the first component. A singular form may include plural expressions unless the context clearly indicates otherwise.

[0036] Furthermore, terms such as "below," "on the lower side," "above," and "on the upper side" are used to describe the relationships of the configuration shown in the drawings. These terms are relative concepts and are described in reference to the directions shown in the drawings. In this specification, "placed on top" may refer not only to the top of any one member but also to the bottom.

[0037] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art in the field to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and, unless interpreted in an ideal or overly formal sense, as expressly defined herein.

[0038] Terms such as “includes” or “possesses” should be understood to indicate the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, without prejudice to the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof.

[0039] Hereinafter, with reference to the drawings, a resin composition, an adhesive member, and a display device according to one embodiment of the present invention will be described.

[0040] Figure 1 is a perspective view of a display device according to one embodiment. Figure 2 is a diagram showing the folded state of the display device shown in Figure 1.

[0041] Referring to Figure 1, the display device DD according to one embodiment may have a rectangular shape with a long side extending in a first direction DR1 and a short side extending in a second direction DR2 that intersects with the first direction DR1. However, the embodiment is not limited to this, and the display device DD may have various shapes on a plane, such as circles and polygons. The display device DD may also be a flexible display device.

[0042] In one embodiment of the display device DD, the display surface DS on which the image IM is displayed may be parallel to the surfaces defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DS, that is, the thickness direction of the display device DD, is indicated by the third direction DR3. The front (or top) and back (or bottom) surfaces of each component are separated by the third direction DR3. However, the directions indicated by the first to third directions DR1, DR2, and DR3 are relative concepts and may be converted to other directions.

[0043] The display device DD of one embodiment may include at least one folding region FA. Referring to Figures 1 and 2, the display device DD includes a folding region FA and a plurality of non-folding regions NFA. The folding region FA is arranged between the non-folding regions NFA, and the folding region FA and the non-folding regions NFA may be arranged adjacent to each other in a first direction DR1.

[0044] The folding region FA may be a part that can be deformed into a folded form based on a folding axis FX that extends in a second direction DR2 which is one direction. The radius of curvature RD of the folding region FA may be 5 mm or less.

[0045] Figures 1 and 2 show, as an example, one folding region FA and two non-folding regions NFA, but the number of folding regions FA and non-folding regions NFA is not limited to these. For example, the display device DD may include more than two non-folding regions NFA and multiple folding regions FA positioned between the non-folding regions NFA.

[0046] In one embodiment of the display device DD, the non-folding regions NFA are arranged symmetrically with respect to the folding regions FA. However, the embodiment is not limited to this, and the folding regions FA may be arranged between the non-folding regions NFA, and the areas of the two non-folding regions NFA facing each other with respect to the folding region FA may be different.

[0047] The display surface DS of the display device DD may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display images, while the non-display area NDA may not display images. The emergency area NDA may surround the display area DA and define a frame for the display area DA.

[0048] Referring to Figure 2, the display device DD may be a collapsible (foldable) display device DD that can be folded or not. For example, the display device DD may be folded by bending the folding region FA with respect to a folding axis FX parallel to the second direction DR2. The folding axis FX may be defined as a minor axis parallel to the short side of the display device DD.

[0049] When the display device DD is folded, the non-folding areas NFA may face each other, and the display device DD may be folded inward so that it is not exposed to the outside of the display surface DS (in-folding). However, the embodiment is not limited to this, and contrary to the illustration, the display device DD may be folded outward so that the display surface DS is exposed to the outside (out-folding).

[0050] Figure 3 is a perspective view of a display device according to one embodiment. Figure 4 is a diagram showing the folded state of the display device shown in Figure 3.

[0051] Except for the folding operation, the display device DD-a shown in Figure 3 may have essentially the same configuration as the display device DD shown in Figure 1. Therefore, the following explanation of the display device DD-a shown in Figures 3 and 4 will focus on the folding operation.

[0052] Referring to Figures 3 and 4, the display device DD-a includes a foldable region FA-a and a plurality of non-foldable regions NFA-a. The foldable region FA-a is positioned between the non-foldable regions NFA-a, and the foldable region FA-a and the non-foldable regions NFA-a may be arranged adjacent to each other in the second direction DR2.

[0053] The folding region FA-a is bent with respect to a folding axis FX-a parallel to the first direction DR1, causing the display device DD-a to fold. The folding axis FX-a may be defined as the major axis parallel to the long side of the display device DD-a. The display device DD shown in Figure 1 folds with respect to the minor axis, but the display device DD-a shown in Figure 3 may fold with respect to the major axis. In Figure 4, the display device DD-a is shown to fold inward so that the display surface DS is not exposed to the outside, but the embodiment is not limited to this, and the display device DD-a may fold with respect to the major axis or fold outward.

[0054] Figure 5 is a perspective view of a display device according to one embodiment. The display device DD-b of one embodiment includes folding regions BA1 and BA2 and a non-folding region NBA, wherein the folding regions BA1 and BA2 may be folded from one side of the non-folding region NBA.

[0055] Referring to Figure 5, the display device DD-b of one embodiment may include a non-foldable area NBA on the front where the image IM is displayed, and a first foldable area BA1 and a second foldable area BA2 on the sides where the image IM is displayed. The first foldable area BA1 and the second foldable area BA2 may be folded from both sides of the non-foldable area NBA, respectively.

[0056] Referring to Figure 5, the non-folding region NBA may provide an image IM in the third direction DR3, which is the front of the display device DD-b, the first folding region BA1 may provide an image in the fifth direction DR5, and the second folding region BA2 may provide an image in the fourth direction DR4. The fourth direction DR4 and the fifth direction DR5 may be directions that intersect with the first to third directions DR1, DR2, and DR3. However, the directions indicated by the first to fifth directions DR1 to DR5 are relative concepts and are not limited to the directional relationships shown in the figure.

[0057] In one embodiment, the display device DD-b includes a non-folding region NBA and folding regions BA1 and BA2, respectively, located on both sides of the non-folding region NBA. It may also be a bending display device. On the other hand, although not shown, the display device in one embodiment may also be a bending display device including one non-folding region and one folding region. In this case, the folding region may be provided folded only on one side of the non-folding region.

[0058] Figures 1 to 5 above illustrate foldable and bendable display devices, but the embodiments are not limited to these. One embodiment of the display device may be a rollable display device, a flat rigid display device, or a bent rigid display device.

[0059] In the following description of one embodiment of a display device, we will use a display device DD that folds based on a single axis as the basis for explanation. However, the embodiment is not limited to this, and may be applied not only to display devices DD-a that fold based on a long axis as described later, and display devices DD-b that include a folding area, but also to various other forms of display devices.

[0060] Figure 6 is an exploded perspective view of a display device DD according to one embodiment. Figure 7 is a cross-sectional view of the display device DD according to one embodiment. Figure 7 is a cross-sectional view of the portion corresponding to the line I-I' in Figure 1.

[0061] One embodiment of the display device DD may include a display module DM and a window WP disposed on the display module DM. In one embodiment of the display device DD, the display module DM may include a display panel DP including a display element layer DP-EL and an input sensing unit TP disposed on the display panel DP. One embodiment of the display device DD may include a connecting member AP disposed between the display panel DP and the window WP. For example, in one embodiment of the display device DD, the adhesive member AP may be disposed between the input sensing unit TP and the window WP. The adhesive member AP may be an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR).

[0062] The adhesive resin AP may be formed from an adhesive member manufacturing method according to one embodiment described later. The adhesive member AP may consist of resin compositions RS1 and RS2 (see Figures 11d and 11g) described later. The adhesive member AP may also contain polymers derived from resin compositions RS1 and RS2 (see Figures 11d and 11g) described later. The liquid resin composition may be cured by ultraviolet irradiation and formed into a film or thin film after ultraviolet curing. The resin composition that forms the adhesive member AP by a polymerization reaction with a photoinitiator may have a viscosity of 10 mPa·s to 30 mPa·s at 20°C to 30°C as measured by the JIS K 2283 method.

[0063] The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a sealing layer TFE covering the display element layer DP-EL. For example, the display panel DP may include a plurality of organic light-emitting elements or a plurality of quantum dot light-emitting elements in the display element layer DP-EL.

[0064] On the other hand, the configuration of the display panel DP shown in Figure 7 is illustrative, and the configuration of the display panel DP is not limited to that shown in Figure 7. For example, the display panel DP may include liquid crystal display elements, in which case the sealing layer TFE may be omitted.

[0065] The input sensing unit TP may be positioned on the display panel DP. For example, the input sensing unit TP may be positioned directly on the sealing layer TFE of the display panel DP. The input sensing unit TP may sense an external input, convert it into a predetermined input signal, and provide the input signal to the display panel DP. For example, in a display device DD of one embodiment, the input sensing unit TP may be a touch sensing unit that senses touches. The input sensing unit TP may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, or an indirect touch by an object. On the other hand, the input sensing unit TP senses at least one of the position of an externally applied touch and the intensity (pressure) of the touch. The input sensing unit TP in one embodiment of the present invention may have a variety of structures or be made of a variety of materials, and is not limited to any one embodiment. The input sensing unit TP may include a plurality of sensing electrodes (not shown) for sensing an external input. The sensing electrodes (not shown) may sense the external input in a capacitive manner. The display panel DP may receive an input signal from the input sensing unit TP and generate an image in response to the input signal.

[0066] The window WP may protect the display panel DP and the input sensing unit TP. The image IM generated by the display panel DP may be provided to the user through the window WIN. The window WP may provide the touch surface of the display device DD. In a display device DD that includes a folding area FA, the window WP may be a flexible window.

[0067] The window WP may include a base layer BL and a print layer BM. The window WP may also include a transparent area TA and a bezel area BZA. The front of the window WP, including the transparent area TA and the bezel area BZA, is the front of the display device DD.

[0068] The transmission region TA may be an optically transparent region. The bezel region BZA may be a region with relatively lower light transmittance compared to the transmission region TA. The bezel region BZA may have a predetermined color. The bezel region BZA may be adjacent to and surround the transmission region TA. The bezel region BZA may define the shape of the transmission region TA. However, the embodiments are not limited to these, and the bezel region BZA may be located adjacent to only one side of the transmission region TA, or a portion of it may be omitted.

[0069] The base layer BL may be a glass or plastic substrate. For example, tempered glass may be used as the base layer BL. Alternatively, the base layer BL may be made of a flexible polymer resin. For example, the base layer BL may be made of polyimide, polyacrylate, polymethacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof. However, the embodiments are not limited to these, and any common material known as the base layer BL of a window WP in the art may be used without limitation.

[0070] The print layer BM may be placed on one surface of the base layer BL. In one embodiment, the print layer BM may be provided on the lower surface of the base layer BL adjacent to the display module DM. The print layer BM may be placed in the edge region of the base layer BL. The print layer BM may be an ink print layer. Alternatively, the print layer BM may be a layer formed containing a pigment or dye. In the window WP, the bezel region BZA may be the portion where the print layer BM is provided.

[0071] On the other hand, the window WP may further include at least one functional layer (not shown) provided on the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the embodiments are not limited thereto.

[0072] In one embodiment, the adhesive member AP included in the display device DD may be provided on one surface of the window WP or one surface of the display module DM in the form of a liquid resin composition, and formed by ultraviolet curing the provided liquid resin composition. Alternatively, the adhesive member AP may be provided by forming the adhesive member AP by ultraviolet curing the liquid resin composition in a separate process, laminating one surface of the adhesive member AP in the form of an adhesive film onto one surface of the window WP or one surface of the display module DM, and attaching the one surface of the window WP or one surface of the display module DM that is not attached to the remaining surface of the adhesive member AP. The thickness of the adhesive member AP may be 50 μm or more and 200 μm or less. For example, the adhesive member AP may have a thickness of 50 μm or more and 150 μm or less.

[0073] Figure 8 is a cross-sectional view showing a display device according to one embodiment. In the following description of the display device according to the embodiment shown in Figure 8, we will not repeat the content that was explained above with reference to Figures 1 to 7, and will focus on the differences.

[0074] Compared to the display device DD described with reference to Figures 6 to 7, the display device DD-1 of one embodiment shown in Figure 8 may further include a light control layer PP and an optical adhesive layer AP-a. The display device DD-1 of one embodiment may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0075] The optical control layer PP is positioned on the display panel DP and may control the reflected light on the display panel DP due to external light. The optical control layer PP may include, for example, a polarizing layer or a color filter layer.

[0076] The optical adhesive layer AP-a may be an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR). The optical adhesive layer AP-a may also consist of the same resin composition as the adhesive member AP (Figure 7) of the above-described embodiment. The resin composition that forms the optical adhesive layer AP-a by polymerization reaction with a photoinitiator may have a viscosity of 10 mPa·s to 30 mPa·s at 20°C to 30°C as measured by the JIS K 2283 method.

[0077] Figure 9 is a cross-sectional view showing a display device according to one embodiment. In the following description of the display device according to the embodiment shown in Figure 9, we will not repeat any information that overlaps with the information described above with reference to Figures 1 to 7, and will focus on the differences.

[0078] Compared to the display device DD described with reference to Figures 6 to 7, the display device DD-2 of one embodiment shown in Figure 9 may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. The display device DD-2 of one embodiment may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP, as shown in the display device DD-1 of one embodiment shown in Figure 8.

[0079] In one embodiment of the display device DD-2, the adhesive member AP may be placed between the display panel DP and the input sensing unit TP. That is, the input sensing unit TP may not be directly placed on the display panel DP, but rather the display panel DP and the input sensing unit TP may be bonded to each other by the adhesive member AP. For example, the adhesive member AP may be placed between the sealing layer TFE of the display panel DP (see Figure 7) and the input sensing unit TP.

[0080] An interlayer adhesive layer PIB may be provided beneath the light control layer PP. The interlayer adhesive layer PIB is positioned between the input sensing unit TP and the light control layer PP and may be made of an adhesive material with excellent moisture-proof properties. For example, the interlayer adhesive layer PIB may be formed containing polyisobutylene. The interlayer adhesive layer PIB may be positioned above the input sensing unit TP to prevent corrosion of the sensing electrode of the input sensing unit TP.

[0081] The display device according to one embodiment can be applied to a variety of electronic devices. The electronic device according to one embodiment includes the above-described display device and may further include modules or devices having other additional functions besides the display device.

[0082] The electronic device may include a display device comprising an adhesive member made of the resin composition AP of one embodiment, and a control unit for controlling the display device. The electronic device of one embodiment may be a device activated by an electrical signal. The electronic device may include electronic devices of various embodiments. For example, the display device may include large display devices such as televisions, monitors, or external billboards, as well as medium- and small-sized display devices such as personal computers, laptop computers, personal information terminals, vehicle display devices, game consoles, portable electronic devices, and cameras.

[0083] Figure 10 is a block diagram of an electronic device according to one embodiment. Referring to Figure 10, the electronic device 10 according to one embodiment may include a display module 11, a processor 12, a memory 13, and a power supply module 14.

[0084] The processor 12 may include at least one of the following: a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0085] Memory 13 may store data information necessary for the operation of the processor 12 and the display module 11. When the processor 12 executes an application stored in memory 13, video data signals and / or input control signals are transmitted to the display module 11, and the display module 11 can process the provided signals and output video information via the display screen.

[0086] The power module 14 may include a power supply module such as a power adapter or a battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power necessary for the operation of the electronic device 10.

[0087] At least one of the components of the electronic device 10 described above may be included in the display device according to the embodiment described above. Furthermore, some of the individual modules functionally contained within a single module may be included in the display device, while others may be provided separately from the display device. For example, the display device may include a display module 11, while the processor 12, memory 13, and power supply module 14 may be provided in the form of other devices within the electronic device 10 rather than in the display device itself.

[0088] Figure 11 is a schematic diagram of an electronic device according to various embodiments.

[0089] Referring to Figure 11, the various electronic devices to which the display device according to the embodiment is applied may include not only image display electronic devices such as smartphones 10_1a, tablet PCs 10_1b, laptops 10_1c, televisions 10_1d, and desk monitors 10_1e, but also wearable electronic devices including display modules such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, and vehicle electronic devices 10_3 including display modules such as CIDs (Center Information Displays) and rearview mirror displays located on the instrument panel, center fascia, and dashboard of automobiles.

[0090] Hereinafter, a method for manufacturing a display device according to one embodiment will be described with reference to Figures 12a, 12b, and 13a to 13k. In the description of the method for manufacturing a display device according to one embodiment, the display device may be the same as the display device described above. Hereafter, in the description of the method for manufacturing a display device according to one embodiment, any content that overlaps with the description of the display device according to one embodiment described above will not be explained again, and the focus will be on the differences.

[0091] One embodiment of the method for manufacturing a display device may be a method for manufacturing the display devices DD, DD-a, and DD-b of one embodiment described in Figures 1 to 9. One embodiment provides a method for manufacturing a display device that includes an adhesive member AP disposed on the display panel DP of the display devices DD, DD-a, and DD-b.

[0092] Figure 12a is a sequence diagram showing a method for manufacturing a display device according to one embodiment. Figure 12b is a sequence diagram showing in detail the step of forming an adhesive member in the method for manufacturing a display device according to one embodiment. Figures 13a to 13k are schematic diagrams showing the step of forming an adhesive member according to one embodiment.

[0093] Referring to Figure 12a, a method for manufacturing a display device according to one embodiment includes the steps of: fixing a substrate having a first region and a second region surrounding the first region defined onto a stage (step S100); and forming an adhesive member on the substrate (step S200).

[0094] Referring to Figure 12b, step S200 for forming the adhesive member of one embodiment may include step S201 of applying a first resin composition to a substrate so as to overlap the first and second regions, step S202 of curing the first resin composition by providing a first light, step S203 of applying a second resin composition so as to overlap the second region on top of the first resin composition, and step S204 of curing the second resin composition by providing a second light. On the other hand, in this specification, step S201 of applying the first resin composition may be referred to as the first application step, and step S203 of applying the second resin composition may be referred to as the second application step.

[0095] A method for manufacturing a display device according to one embodiment may include the step of fixing a substrate RP onto a stage ST. The step of fixing the substrate RP onto the stage ST may also be the step of preparing a substrate RP for forming an adhesive member. Referring to Figure 13a, a method for manufacturing a display device according to one embodiment may include the step of providing a substrate RP on which an adhesive member AP is formed. The substrate RP may provide a reference surface on which the adhesive member AP is formed. For example, the substrate RP may be a display panel DP as described in Figure 7, or a window WP.

[0096] The stage ST may provide a space for the substrate RP to be fixed in place. The stage ST may be provided in the form of a plate. In Figure 13a, the stage ST is shown as a rectangle on a plane as an example, but the embodiment is not limited to this, and the shape and size of the stage ST on a plane can be varied in many ways.

[0097] A first region AA1 and a second region AA2 may be defined on the substrate RP. The first region AA1 and the second region AA2 may be regions arbitrarily set on the substrate RP for the inkjet printing process described later. The first region and AA1 may correspond to the central part of the substrate RP. The second region AA2 may correspond to the edge part of the substrate RP relative to the first region AA1. On the plane defined by the first direction DR1 and the second direction DR2, the second region AA2 may surround the first region AA1.

[0098] The area of ​​the first region AA1 on the plane may be relatively larger than the area of ​​the second region AA2 on the plane. In one embodiment, the first region AA1 of the substrate RP may correspond to at least a part of the display area DA of the display device DD (Figure 1). Also, the second region AA2 of the substrate RP may correspond to at least a part of the relative display area NDA of the display device DD (Figure 1).

[0099] In one embodiment, the width of the second region AA2 may be 3 mm or less. As shown in Figure 13b, the first width W1 of the second region AA2 in the second direction DR2 and the second width W2 in the second direction DR2 diameter may each be 3 mm or less.

[0100] Referring to Figures 13b and 13c, a method for manufacturing a display device according to one embodiment of the present invention may further include the steps of: configuring the substrate RP with a first bitmap before the step S201 of applying the first resin composition; dividing the second region AA2 on the first bitmap into two or more first unit regions SUA1 and SUA2; and setting the amount of the first resin composition RS1 (Figure 13d) to be applied to the first region AA1 and the first unit regions SUA1 and SUA2, respectively. If the method for manufacturing a display device according to one embodiment further includes the step of configuring the substrate RP with a first bitmap, the first region AA1 and the second region AA2 of the substrate RP may be set based on the number of pixels PX included in the first bitmap.

[0101] Referring to Figure 13b, the substrate RP may be composed of a first bitmap containing a plurality of pixels PX arranged along a first direction DR1 and a second direction DR2. The substrate RP may be divided into m pixels arranged along the first direction DR1 and n pixels arranged along the second direction DR2. Thus, the substrate RP may be divided into m × n pixels PX arranged along the first direction DR1 and the second direction DR2.

[0102] Each of the m pixels PX arranged along the first direction DR1 may have the same width relative to the first direction DR1, and each of the n pixels PX arranged along the second direction DR2 may have the same width relative to the second direction DR2, but the embodiment is not limited to this. The length of the substrate RP in the first direction DR1 may be about m times the length of the pixel PX in the first direction DR1. The length of the substrate RP in the second direction DR2 may be about n times the length of the pixel PX in the second direction DR2.

[0103] On the other hand, Figure 13b exemplifies a case where the substrate RP is divided into 15 pixels PX in the first direction DR1 and 23 pixels PX in the second direction DR2, but the embodiment is not limited to this. For example, the number of pixels PX stored to constitute the substrate RP with the first bitmap, and the lengths of the pixels PX in the first direction DR1 and the second direction DR2 may be appropriately adjusted depending on the process conditions, the resolution of the inkjet printing equipment, etc.

[0104] After configuring the substrate RP with a first bitmap containing m × n pixels PX, the second region AA2 may be divided into two or more first unit regions SUA1 and SUA2. The second region AA2 may be divided into multiple first unit regions SUA1 and SUA2 with different amounts of the first resin composition RS1 (see Figure 13d) applied. Each of the multiple first unit regions SUA1 and SUA2 may be positioned at the edge of the substrate RP and have a shape that surrounds the first region AA1 on a plane.

[0105] After dividing the second region AA2 into multiple first unit regions SUA1 and SUA2 on the first bitmap, a step may be performed to set the coating amount RS1 (see Figure 13d) of the first resin composition in the first region AA1 and the multiple first unit regions SUA1 and SUA2. The coating amount in each region may be set such that the coating amount of the first resin composition RS1 (see Figure 13d) applied to the multiple first unit regions SUA1 and SUA2 is smaller than the coating amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1. Here, the coating amount of the first resin composition RS1 (see Figure 13d) applied to the multiple first unit regions SUA1 and SUA2 means the average coating amount of the first resin composition RS1 applied to each of the multiple first unit regions SUA1 and SUA2.

[0106] As shown in Table 1 below, the second region AA2 on the first bitmap may be divided into two or more first unit regions SUA1, ..., SUAn, and the amount of resin composition RS1 (see Figure 13d) to be applied may be set for each of the multiple first unit regions SUA1, ..., SUAn. In this case, the application amounts for the multiple first unit regions SUA1, ..., SUAn represent the comparative amounts in the multiple first unit regions SUA1, ..., SUAn when the application amount for the first region AA1 is set to 100.

[0107] [Table 1]

[0108] Referring to Table 1, the second region AA2 may be divided into n first unit regions SUA1, ..., SUAn. In Table 1, n may be an integer of 2 or more. On the other hand, in this specification, the first to nth first unit regions SUA1, ..., SUAn may be referred to as the 1-1 unit region to the 1-n unit region, respectively. For example, if n is 2, the first first unit region SUA1 may mean the 1-1 unit region, and the second first unit region SUA2 may mean the 1-2 unit region.

[0109] Referring to both Figure 13b and Table 1, the n first unit regions SUA1, ..., SUAn may be arranged sequentially with reference to one direction from the first region AA1 toward the edge of the substrate RP. For example, as shown in Figure 13b, if n is 2, the 1-1 unit region SUA1 and the 1-2 unit region SUA2 may be arranged sequentially with reference to one direction from the first region AA1 toward the edge of the substrate RP. Also, if n is 3, the 1-1 unit region SUA1, the 1-2 unit region SUA2, and the 1-3 unit region SUA3 may be arranged sequentially with reference to one direction from the first region AA1 toward the edge of the substrate RP. Each of the n first unit regions SUA1, ..., SUAn may have a closed line shape on a plane that surrounds the first region AA1.

[0110] Each of the n first unit regions SUA1, ..., SUAn may contain a predetermined number of pixels PX. In Table 1, A1, ..., An may represent the pixels contained in the first to the nth first unit regions SUA1, ..., SUAn.

[0111] The coating amounts X1, ..., Xn of the first resin composition RS1 (see Figure 13d) in each of the n first unit regions SUA1, ..., SUAn may be set. At least one of the coating amounts X1, ..., Xn for each of the n first unit regions SUA1, ..., SUAn may have different values. If the second region AA2 contains two first unit regions, the coating amount X1 of the first-1 unit region SUA1, which corresponds to the first first unit region, and the coating amount X2 of the second first unit region SUA2, which corresponds to the second first unit region, may be different from each other. Alternatively, if the second region AA2 contains three first unit regions, at least one of the coating amounts X1 of the first-1 unit region SUA1, which corresponds to the first first unit region, the coating amount X2 of the second first unit region SUA2, and the coating amount X3 of the third first unit region SUA2, which corresponds to the third first unit region, may have different values. For example, the coating amounts X1 for the 1st-1st unit region SUA1, X2 for the 1st-2nd unit region SUA2, and X3 for the 1st-3rd unit region SUA3 may be different from each other.

[0112] In one embodiment, when the coating amount of the first resin composition in the first region AA1 is set to 100, the average coating amount of the first resin composition RS1 (see Figure 13d) in multiple first unit regions SUA1, SUA2 may be smaller than the coating amount of the first resin composition RS1 (see Figure 13d) in the first region AA1. That is, when the coating amount of the first resin composition in the first region AA1 is set to 100, the average coating amount of the first resin composition RS1 (see Figure 13d) in n first unit regions SUA1, ..., SUAn may be smaller than the coating amount of the first resin composition RS1 (see Figure 13d) in the first region AA1. The average coating amount of the first resin composition RS1 (see Figure 13d) in multiple first unit regions SUA1, SUA2 may be calculated by the following formula 1. In one embodiment, the average coating amount of the first resin composition RS1 in multiple first unit regions SUA1, SUA2 calculated by the following formula 1 may be 50 or more and 85 or less.

[0113] [Formula 1] [(X1×A1)…(Xn×An)]÷(A1+…An) In Equation 1, X1...Xn are the amounts of the first resin composition RS1 (see Figure 13d) applied to each of the first unit regions SUA1, ..., SUAn, respectively, when the total amount of the first resin composition RS1 applied to the first region AA1 is set to 100. In other words, the amounts of the first resin composition RS1 (see Figure 13d) applied to each of the first unit regions SUA1, ..., SUAn, respectively, may represent the comparative values ​​when the total amount of the first resin composition RS1 applied to the first region AA1 is set to 100.

[0114] In Equation 1, A1...An are the number of pixels PX in the first to the nth first unit regions SUA1, ..., SUAn, respectively.

[0115] In Equation 1, n is an integer greater than or equal to 2. For example, n may be an integer between 2 and 4, inclusive.

[0116] Hereinafter, with reference to Figures 13b and 13c, a method for manufacturing a display device according to one embodiment will be described in detail, including the steps of dividing the second region AA2 into two first unit regions SUA1 and SUA2, and setting the amount of the first resin composition RS1 (see Figure 13d) to be applied to each of the two first unit regions SUA1 and SUA2. Although Figures 13b and 13c exemplify the division of the second region AA2 into two first unit regions SUA1 and SUA2, the method is not limited to this, and the second region AA2 may be divided into three or more first unit regions as described above.

[0117] As shown in Figure 13b, the second region AA2 can be divided into two first unit regions SUA1 and SUA2. That is, the second region AA2 can be divided into the first unit region SUA and the first-second unit region SUA2. The first-first unit region SUA1 may be adjacent to the first region AA1. On a plane, the first-first unit region SUA1 may surround the first region AA1. The first-second unit region SUA2 may be separated from the first region AA1 with the first-first unit region SUA1 in between. On a plane, the second unit region SUA2 may surround the first-first unit region SUA1.

[0118] In one embodiment, the first unit regions SUA1 and SUA2 may each be divided by a pixel interval. "Pixel interval" may mean the number of pixels contained within the width interval of each unit region. The width of each unit region may mean the width in the first direction DR1 and the width in the second direction DR2. In each unit region, the number of pixels contained within the width interval in the first direction DR1 and the number of pixels contained within the width interval in the second direction DR2 may be the same. For example, the 1-1 unit region SUA1 shown in Figure 13b contains one pixel within the width intervals of the first and second directions DR1 and DR2, in which case the pixel interval of the 1-1 unit region SUA1 may be 1. Also, the 1-2 unit region SUA2 shown in Figure 13b contains one pixel within the width intervals of the first and second directions DR1 and DR2, in which case the pixel interval of the 1-2 unit region SUA2 may be 1.

[0119] Figure 13c is a graph that optionally shows the steps for setting the amount of the first resin composition RS1 (see Figure 13d) to be applied to the first region AA1 and the two first unit regions SUA1 and SUA2 of the substrate RP shown in Figure 13b. In the graph of Figure 13c, the vertical axis represents the amount of application. In the graph of Figure 13c, "X1" is the amount of the first resin composition RS1 (see Figure 13d) applied to the first-first unit region SUA1, "X2" is the amount of the second resin composition RS1 (see Figure 13d) applied to the first-second unit region SUA2, and "Z" is the amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1. The amount of the first resin composition RS1 (see Figure 13d) applied to the 1-1 and 1-2 unit regions SUA1 and SUA2 may represent a comparative value when the amount of the first resin composition RS1 (see Figure 13d) applied to the 1st region AA1 is set to 100.

[0120] Referring to Figure 13c, the amount Z of the first resin composition RS1 (see Figure 13d) applied to the first region AA1 may be constant. When the amount Z of the first resin composition RS1 (see Figure 13d) applied to the first region AA1 is set to 100, the application amounts for the first unit regions SUA1 and SUA2 may be set separately. For example, the application amount of the first resin composition RS1 (see Figure 13d) applied to the 1-1 unit region SUA1 and the application amount of the first resin composition RS1 (see Figure 13d) applied to the 1-2 unit region SUA2 may be set separately. The average application amount of the first resin composition RS1 (see Figure 13d) applied to the two first unit regions SUA1 and SUA2 may be smaller than the application amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1. Here, the average application amount may be calculated by Equation 1 described above.

[0121] Figures 13d and 13e show step S201, in which a first resin composition is applied to a substrate RP, as part of the steps for forming an adhesive member according to one embodiment of the present invention. Figure 13e may be a cross-sectional view of the portion corresponding to the line II-II' in Figure 11d.

[0122] Referring to Figures 13d and 13e, the first resin composition RS1 may be applied to the substrate RP so as to overlap the first region AA1 and the second region AA2. The first resin composition RS1 may be provided onto the substrate RP by an inkjet printing method. The first resin composition RS1 may be ejected from the first inkjet head IHD1 and provided onto the substrate RP.

[0123] The first inkjet head IHD1 may be positioned on top of the stage ST. The first inkjet head IHD1 may be positioned at a predetermined distance from the top surface of the stage ST so that an ejection process is performed in which the first resin composition RS1 is ejected from the first inkjet head IHD1 onto the substrate RP.

[0124] The first inkjet head IHD1 may include a plurality of first nozzles NZ1. The plurality of first nozzles NZ1 may be spaced apart at a certain interval along one direction. The plurality of first nozzles NZ1 may be arranged in a single row. However, the embodiment is not limited to this, and the plurality of first nozzles NZ1 may be arranged in two or more rows. Each of the plurality of first nozzles NZ1 may eject ink toward the substrate RP. For example, the ejection direction of each of the plurality of first nozzles NZ1 may be perpendicular to the substrate RP. However, the embodiment is not limited to this.

[0125] Each of the multiple first nozzles NZ1 may include an ejection port having a circular hole shape. However, the embodiment is not limited to this, and the shape of the ejection port of each of the multiple first nozzles NZ1 may be varied. Also, the number and size of the multiple first nozzles NZ1 included in the first inkjet head IHD1 may be varied.

[0126] Multiple first nozzles NZ1 included in the first inkjet head IHD1 may be independently controlled by a control unit (not shown). The control unit (not shown) controls the ejection of the first resin composition RS1 from each first nozzle NZ1, making it possible to apply ink to the substrate in a desired shape. Although not shown, the first inkjet head IHD1 may further include a storage unit (not shown) for storing the first resin composition RS1 to be ejected onto the substrate RP.

[0127] Referring to Figures 13b to 13e, the step of applying the first resin composition RS1 may be a step of applying the first resin composition S1 onto the first region AA1 and the second region AA2 according to a set application amount. In the step of applying the first resin composition RS1, the first inkjet head IHD1 may eject the first resin composition RS1 onto the first region AA1 and the second region AA2 while moving in the second direction DR2. However, the embodiment is not limited to this, and the first inkjet head IHD1 may eject the first resin composition RS1 while moving in the first direction DR1.

[0128] The amount of the first resin composition RS1 ejected from multiple first nozzles NZ1 of the first inkjet head IHD1 may be controlled to coat the first resin composition with a first coating amount onto the first region AA1 of the substrate RP, and the first resin composition RS1 with a second coating amount onto the second region AA2 of the substrate RP. In one embodiment, the second coating amount may be smaller than the first coating amount.

[0129] If the second region AA2 is divided into two or more first unit regions SUA1 and SUA2, the first resin composition RS1 may be applied according to the set application amounts for each of the first unit regions SUA1 and SUA2. For example, the second region AA2 is divided into the 1-1 unit region SUA1 and the 1-2 unit region SUA2, where the first resin composition RS1 may be applied in the 1-1 unit application amount in the 1-1 unit region SUA1, and in the 1-2 unit region SUA2, the first resin composition RS1 may be applied in the 1-2 unit application amount. In one embodiment, the 1-1 unit application amount may be smaller than the 1-2 unit application amount. However, the embodiments are not limited thereto.

[0130] The first resin composition RS1 may have a viscosity of 10 mPa·s to 30 mPa·s at 20°C to 30°C. For example, the first resin composition RS1 may have a viscosity of 10 mPa·s to 30 mPa·s at 25°C. The viscosity of the first resin composition RS1 may be measured by the JIS K 2283 method.

[0131] If the viscosity of the first resin composition RS1 is less than 10 mPa·s in the range of 20°C to 30°C, the low viscosity may cause dripping of the resin composition liquid provided to form the component, making it difficult to form a coating film of uniform thickness using the first resin composition RS1. Also, if the viscosity of the first resin composition RS1 of one embodiment exceeds 30 mPa·s in the range of 20°C to 30°C, it may be difficult to dispense the first resin composition RS1 in an appropriate amount from the coating equipment used to apply the first resin composition RS1.

[0132] The first resin composition RS1 may further contain at least one photoinitiator. If it contains multiple photoinitiators, the different photoinitiators may be activated by ultraviolet light with different central wavelengths.

[0133] The photoinitiator may be any one selected from 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexylphenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0134] Additionally, photoinitiators, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine The resin composition may be selected from any one of the following: bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyryl)phenyl]titanium(IV). The resin composition of one embodiment may contain at least one of Omnirad TPO-H (IGM Resins), Omnirad819 (IGM Resins), and Esacure 3644 (IGM Resins) as a photoinitiator.

[0135] The first resin composition RS1 may further contain additives as needed. The additives may be commonly known in the art and appropriately selected to adjust the physical properties required of the adhesive composition. For example, they may include, but are not limited to, light stabilizers, crosslinking agents, antioxidants, chain transfer agents, photosensitizers, polymerization inhibitors, surfactants, adhesion promoters, plasticizers, UV absorbers, preservatives, antistatic agents, inorganic fillers, pigments, and dyes. Additives may be used individually or in combination of two or more.

[0136] Figure 13f is a diagram showing the step of curing the first resin composition RS1 in the steps of forming an adhesive member according to one embodiment of the present invention. Figure 13f may also be a cross-sectional view of the portion corresponding to the line II-II' in Figure 13d.

[0137] Referring to Figure 13f, after the step of applying the first resin composition RS1 onto the substrate RP, a step of curing the first resin composition RS1 may be performed. The first resin composition RS1, which is provided in liquid form on the substrate RP, may be irradiated with a first light L1. The first light L1 may be ultraviolet light, but is not limited to this. The first resin composition RS1 may be cured by being exposed to the first light L1. On the other hand, in this specification, the first resin composition RS1 cured by the first light L1 may be referred to as a pre-adhesive member P-AP (see Figure 13g). That is, the first resin composition RS1 may be polymerized by the provided first light L1 and then cured to form a pre-adhesive member P-AP.

[0138] On the other hand, in the step of curing the first resin composition RS1, the amount of first light L1 irradiated onto the first resin composition RS1 may be sufficient to completely cure the first resin composition RS1. However, the embodiment is not limited to this, and in the step of curing the first resin composition RS1, the polymerization reaction of the first resin composition RS1 may be partially carried out, and then in the step of curing the second resin composition RS2, the unreacted first resin composition RS1 may be further reacted to form the final adhesive member AP (see Figure 13j).

[0139] The preliminary adhesive member P-AP (see Figure 13g) formed by curing the first resin composition RS1 may have different thicknesses in the first region AA1 and the second region AA2. The first application amount of the first resin composition RS1 provided to the first region AA1 may be greater than the second application amount of the second resin composition RS2 provided to the second region AA2. Therefore, the average thickness of the preliminary adhesive member P-AP superimposed on the first region AA1 may be greater than the average thickness of the preliminary adhesive member P-AP superimposed on the second region AA2.

[0140] The first resin composition RS1 is provided on the first region AA1 in a constant coating amount. Therefore, the pre-adhesive member P-AP superimposed on the first region AA1 may have a constant thickness. When the pre-adhesive member P-AP superimposed on the first region AA1 is referred to as the first pre-adhesive portion, and the pre-adhesive member P-AP superimposed on the second region AA2 is referred to as the second pre-adhesive portion, the thickness deviation of the second pre-adhesive portion may be larger than the thickness deviation of the first pre-adhesive portion. The second region AA2 is divided into a plurality of first unit regions SUA1, SUA2, and the first resin composition RS1 may be applied to each of the plurality of first unit regions SUA1, SUA2 in a coating amount set for each. Since the coating amount of at least one of the plurality of first unit regions SUA1, SUA2 is different from the coating amount of the other first unit regions, a weight deviation of the provided liquid composition may occur. Therefore, the thickness deviation of the second region AA2 may be relatively larger than the thickness deviation of the first region AA1.

[0141] Figures 13g and 13h show step S203, in which a second resin composition RS2 is applied, as part of the steps for forming an adhesive member according to one embodiment of the present invention. Figure 13h may be a cross-sectional view of the portion corresponding to the line III-III' in Figure 13g.

[0142] The second resin composition RS2 may be provided on the substrate RP by an inkjet printing method. The second resin composition RS2 may be ejected from the second inkjet head IHD2 and provided on the substrate RP.

[0143] The second inkjet head IHD2 may be positioned on top of the stage ST. The second inkjet head IHD2 may be positioned at a predetermined distance from the top surface of the stage ST so that an ejection process is performed in which the second resin composition RS2 is ejected from the second inkjet head IHD2 onto the preliminary adhesive member P-AP.

[0144] The second inkjet head IHD2 may include a plurality of second nozzles NZ2. The plurality of second nozzles NZ2 may be spaced apart at a certain interval along one direction. The plurality of second nozzles NZ2 may be arranged in a single row. However, the embodiment is not limited to this, and the plurality of second nozzles NZ2 may be arranged in two or more rows. Each of the plurality of second nozzles NZ2 may eject ink toward the substrate RP. For example, the ejection direction of each of the plurality of second nozzles NZ2 may be perpendicular to the substrate RP. However, the embodiment is not limited to this.

[0145] Each of the multiple second nozzles NZ2 may include a discharge port having a circular hole shape. However, the embodiment is not limited to this, and the shape of the discharge port of each of the multiple second nozzles NZ2 may be varied in various ways. In addition, the number and size of the multiple second nozzles NZ2 included in the multiple second nozzles NZ2 may be varied in various ways.

[0146] Multiple second nozzles NZ2 included in the second inkjet head IHD2 may be independently controlled by a control unit (not shown). The control unit (not shown) controls the ejection of the second resin composition RS2 from each second nozzle NZ2, making it possible to apply ink to the substrate in a desired shape. Although not shown, the second inkjet head IHD2 may further include a storage unit (not shown) for storing the second resin composition RS2 to be ejected onto the substrate RP.

[0147] Referring to Figures 13g and 13h, the second resin composition RS2 may be applied to the pre-adhesive member P-AP so as to overlap the second region AA2 of the substrate RP. The second resin composition RS2 may be applied to the pre-adhesive member P-AP so as to overlap the second region AA2 of the substrate RP. In the step of applying the second resin composition RS2, the second resin composition RS2 may be applied only to the second region AA2 and not to the first region AA1.

[0148] In the step of applying the second resin composition RS2, the second resin composition RS2 may be applied to the second region AA2 in a third application amount. The second application amount may be appropriately set considering the desired thickness of the preliminary adhesive member P-AP. In one embodiment, the third application amount may be smaller than the second application amount described above. That is, in the step of applying the first resin composition RS1, when the application amount of the first resin composition RS1 applied to the first region AA1 is set to 100, the application amount of the second resin composition RS2 applied to the second region AA2 in the step of applying the second resin composition RS2 may be less than 100.

[0149] The second inkjet head IHD2 may apply the second resin composition RS2 onto the second region AA2 while moving along the second direction DR2 on the substrate RP. When the second inkjet head IHD2 moves along the second direction DR2 and faces the first region AA1 and the second region AA2, the second resin composition RS2 may be applied onto the second region AA2 according to a preset application amount. Applying the second resin composition RS2 onto the second region AA2 may reduce the thickness deviation of the pre-adhesive member P-AP.

[0150] The second resin composition RS2 may have a viscosity of 10 mPa·s to 30 mPa·s at 20°C to 30°C. For example, the second resin composition RS2 may have a viscosity of 10 mPa·s to 30 mPa·s at 25°C. The viscosity of the second resin composition RS2 may be measured by the JIS K 2283 method.

[0151] If the viscosity of the second resin composition RS2 is less than 10 mPa·s in the range of 20°C to 30°C, the low viscosity may cause dripping of the resin composition liquid provided to form the component, making it difficult to form a coating film of uniform thickness using the second resin composition RS2. Also, if the viscosity of the second resin composition RS2 in one embodiment exceeds 30 mPa·s in the range of 20°C to 30°C, it may be difficult to dispense the second resin composition RS2 in an appropriate amount from the coating equipment used to apply the second resin composition RS2.

[0152] The second resin composition RS2 may further contain at least one photoinitiator. If multiple photoinitiators are included, different photoinitiators may be activated by ultraviolet light with different central wavelengths. The same provisions described above for the first resin composition RS1 may also apply to the photoinitiators. The second resin composition RS2 may also further contain additives as needed. The same provisions described above for the first resin composition RS1 may also apply to the additives.

[0153] In one embodiment, the first resin composition RS1 and the second resin composition RS2 may be the same. Also, the first inkjet head IHD1 that applies the first resin composition S1 and the second inkjet head IHD2 that applies the second resin composition S2 may be the same. However, the embodiments are not limited thereto.

[0154] Figures 13i and 13j show step S204, in the step of forming an adhesive member according to one embodiment of the present invention, in which the second resin composition RS2 is cured to form the adhesive member AP. Figure 13k may be a cross-sectional view of the portion corresponding to the line IV-IV' in Figure 13j.

[0155] Referring to Figures 13i and 13k, after the step of applying the second resin composition RS2, a step of curing the second resin composition RS2 may be performed. The second resin composition RS2 provided on the substrate RP may be irradiated with a second light L2. The second light L2 may be ultraviolet light, but is not limited to this. The second resin composition RS2 may be cured by being exposed to the second light L2. After the second resin composition RS2 is polymerized and cured by the provided second light L2, it may be formed together with the pre-adhesive member P-AP to form an adhesive member AP (see Figure 13j). On the other hand, Figure 13i exemplifies the irradiation of both the first region AA1 and the second region AA2 with the second light L2, but is not limited to this, and the second light L2 may be selectively irradiated only on the second region AA2 depending on the degree of curing of the pre-adhesive member P-AP.

[0156] Referring to Figures 13j and 13k, the adhesive member AP may include a first adhesive portion superimposed on the first region AA1 and a second adhesive portion superimposed on the second region AA2. The adhesive member AP may have a flat upper surface in the first adhesive portion. The adhesive member AP may have a peak portion PK in the second adhesive portion where the thickness in the third direction DR3 is greatest towards the edge of the adhesive member AP. The peak portion PK superimposed on the second region AA2 has a maximum height h from the lower surface AP-LF of the adhesive member AP adjacent to the substrate RP to the upper surface AP-UF of the adhesive member AP separated from the substrate RP. m This may mean a portion having the above characteristics. In one embodiment of the adhesive member AP, the thickness of the adhesive member AP in the third direction DR3 may gradually decrease from the peak portion PK towards the end. In this specification, in the second adhesive portion, the portion in which the thickness decreases from the peak portion PK towards the end may be referred to as a slope.

[0157] The horizontal distance d from the end of adhesive member AP to the peak portion PK p The thickness may be 600 μm or less. For example, the horizontal distance d from the edge of the adhesive member AP to the peak portion PK. p The thickness may be between 300 μm and 600 μm. The horizontal distance d from the edge to the peak portion PK. pThis may mean the shortest distance measured between the first virtual line LN, which extends from the peak portion PX in the third direction DR3, and the end of the adhesive member AP. The horizontal distance d from the end of the adhesive member AP to the peak portion PK. p If the slope becomes longer, the slope may be visible outside the display devices DD, DD-a, and DD-b (see Figures 1, 3, and 5), which may degrade the image quality.

[0158] According to the present invention, in the process of applying a resin composition by inkjet printing, two application steps are introduced and the amount of resin composition provided is controlled by the region, thereby controlling the length of the slope formed on the adhesive member, that is, the horizontal distance d from the edge of the adhesive member AP to the peak portion PK. p It has the effect of reducing within a certain range.

[0159] Figures 14a to 14c show a part of the method for manufacturing a display device according to one embodiment of the present invention. Figures 14a to 14c schematically show the step of forming an adhesive member according to one embodiment of the present invention. Hereinafter, when describing the method for manufacturing a display device according to one embodiment of the present invention with reference to Figures 14a to 14c, the same reference numerals will be used for the same components as those described earlier, and detailed explanations will be omitted.

[0160] The method for manufacturing the display device shown in Figures 14a to 14c differs from the method for manufacturing the display device described in Figures 13a to 13k in that the second resin composition RS2 is applied to the second region AA2 in the step of applying the second resin composition RS2.

[0161] Referring to Figures 14a to 14c, the method may further include, before the step of applying the second resin composition RS2 onto the preliminary adhesive member P-AP, the steps of configuring the substrate RP with a second bitmap, dividing the second region AA2 on the second bitmap into two or more second unit regions SUB1 and SUB2, and setting the application amount in the second unit regions SUB1 and SUB2. If the method for manufacturing the display device of one embodiment further includes the step of configuring the substrate RP with a first bitmap, the first region AA1 and the second region AA2 of the substrate RP may be set based on the number of pixels PX included in the second bitmap.

[0162] Referring to Figure 14a, the substrate RP may be composed of a second bitmap containing a plurality of pixels PX arranged along a first direction DR1 and a second direction DR2. In the step of composing the second bitmap, the substrate RP may be divided into p pixels arranged along the first direction DR1 and q pixels arranged along the second direction DR2. Thus, the substrate RP may be divided into p × q pixels PX arranged along the first direction DR1 and the second direction DR2. p and q in Figure 14a may be the same as m and n described above in Figure 13b, respectively. In other words, the total number of pixels on the second bitmap may be the same as the total number of pixels on the first bitmap described above. However, the embodiments are not limited thereto.

[0163] Each of the p pixels PX arranged along the first direction DR1 may have the same width relative to the first direction DR1, and each of the q pixels PX arranged along the second direction DR2 may have the same width relative to the second direction DR2, but the embodiment is not limited to this. The length of the substrate RP in the first direction DR1 may be about p times the length of the pixel PX in the first direction DR1. The length of the substrate RP in the second direction DR2 may be about q times the length of the pixel PX in the second direction DR2.

[0164] On the other hand, Figure 14a shows that in the step of constructing the second bitmap, the substrate RP is divided into 15 pixels PX in the first direction DR1 and 23 pixels PX in the second direction DR2, but the embodiment is not limited to this. The number of pixels PX stored to construct the substrate RP with the second bitmap, and the lengths of the pixels PX in the first direction DR1 and the second direction DR2 may be appropriately adjusted depending on the process conditions, the resolution of the inkjet printing equipment, etc.

[0165] After configuring the substrate RP with a second bitmap containing p × q pixels PX, the second region AA2 may be divided into two or more second unit regions SUB1 and SUB2. The second region AA2 may be divided into multiple 2-unit regions SUB1 and SUB2 with different amounts of the second resin composition RS2 applied. Each of the multiple 2-unit regions SUB1 and SUB2 may be located at the edge of the substrate RP and have a shape that surrounds the first region AA1 on a plane. Each of the multiple 2-unit regions SUB1 and SUB2 may have a closed line shape that surrounds the first region AA1 on a plane.

[0166] As shown in Figure 14a, the second region AA2 may be divided into the second-first unit region SUB1 and the second-second unit region SUB2. The second-first unit region SUB1 may be adjacent to the first region AA1. On a plane, the second-first unit region SUB1 may surround the first region AA1. The second-second unit region SUB2 may be separated from the first region AA1 with the second-first unit region SUB2 in between. On a plane, the second-first unit region SUB1 may surround the second-first unit region SUB1. On the other hand, Figure 13b exemplifies the division of the second region AA2 into two second unit regions SUB1 and SUB2, but it is not limited to this, and the second region AA2 may be divided into three or more second unit regions.

[0167] In one embodiment, the second unit regions SUB1 and SUB2 may each be divided by a pixel interval. "Pixel interval" may mean the number of pixels contained within the width interval of each unit region. The width of each unit region may mean the width in the first direction DR1 and the width in the second direction DR2. In each unit region, the number of pixels contained within the width interval in the first direction DR1 and the number of pixels contained within the width interval in the second direction DR2 may be the same. For example, in the second-first unit region SUB1 shown in Figure 14a, one pixel is contained within the width intervals of the first and second directions DR1 and DR2, in which case the pixel interval of the second-first unit region SUB1 may be 1. Also, in the second-second unit region SUB2 shown in Figure 14a, one pixel is contained within the width intervals of the first and second directions DR1 and DR2, in which case the pixel interval of the second-second unit region SUB2 may be 1.

[0168] Referring to Figures 14a and 14b, after dividing the second region AA2 on the second bitmap into two or more second unit regions SUB1 and SUB2, a step may be performed to set the coating amount RS2 of the second resin composition in the first region AA1 and the multiple second unit regions SUB1 and SUB2. The coating amount in each second unit region may be set such that the coating amount of the second resin composition RS2 applied to the second unit regions SUB1 and SUB2 is smaller than the coating amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1. In other words, the average coating amount of the second resin composition RS2 in the second unit regions SUB1 and SUB2 may be set to be smaller than the coating amount of the first resin composition RS1 (see Figure 13d) in the first region AA1. The amount of the second resin composition RS2 applied in each of the multiple second unit regions SUB1 and SUB2 may represent a comparative value when the amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1 is set to 100 during the step of applying the first resin composition RS1 (see Figure 13d).

[0169] In the step of applying the first resin composition RS1, when setting the amount of the first resin composition applied to the first region AA1 to 100, the application amounts for each of the multiple second unit regions SUB1 and SUB2 may be set. For example, the application amounts for the second resin composition RS2 applied to the second-first unit region SUB1 and the application amounts for the second resin composition RS2 applied to the second-second unit region SUB2 may be set separately.

[0170] As shown in Table 2 below, the second region AA2 is divided into two or more second unit regions SUB1, ..., SUBm on the second bitmap, and the coating amount of the second resin composition RS2 may be set for each of the multiple second unit regions SUB1, ..., SUBm. In this case, the coating amounts for the multiple second unit regions SUB1, ..., SUBm represent the comparative amounts for each of the multiple second unit regions SUB1, ..., SUBm when the coating amount of the first resin composition RS1 in the first region AA1 (see Figure 11) is set to 100.

[0171] [Table 2]

[0172] Referring to Table 2, the second region AA2 may be divided into n second unit regions SUB1, ..., SUBm. In Table 1, m may be an integer of 2 or more. On the other hand, in this specification, the first to mth second unit regions SUB1, ..., SUBm may be referred to as the 2-1st unit region to the 2-mth unit region, respectively. For example, if m is 2, the first second unit region SUB1 may mean the 2-1st unit region, and the second second unit region SUB2 may mean the 2-2nd unit region.

[0173] Referring to both Figure 14a and Table 2, m second unit regions SUB1, ..., SUBm may be arranged sequentially with reference to one direction from the first region AA1 toward the edge of the substrate RP. For example, if m is 2, then the 2-1 unit region SUB1 and the 2-2 unit region SUB2 may be arranged sequentially with reference to one direction from the first region AA1 toward the edge of the substrate RP. Each of the m second unit regions SUB1, ..., SUBm may have a closed line shape on a plane that surrounds the first region AA1.

[0174] Each of the m second unit regions SUB1, ..., SUBm may contain a predetermined number of pixels PX. In Table 2, B1, ..., Bm may represent the number of pixels contained in each of the m second unit regions SUB1, ..., SUBm.

[0175] The coating amounts Y1, ..., Ym of the second resin composition RS2 in each of the m second unit regions SUB1, ..., SUBm may be set. At least one of the coating amounts Y1, ..., Ym of the m second unit regions SUB1, ..., SUBm may have different values. As shown in Figure 14a, if the second region AA2 contains two first unit regions, the coating amount Y1 of the 2-1 unit region SUB1, which corresponds to the first second unit region, and the coating amount Y2 of the 2-2 unit region SUB2, which corresponds to the second second unit region, may be different from each other.

[0176] In one embodiment, when the coating amount of the first resin composition in the first region AA1 is set to 100, the average coating amount of the second resin composition RS2 in m second unit regions SUB1, ..., SUBm may be smaller than the coating amount of the first resin composition RS1 in the first region AA1 (see Figure 13d). In other words, when the coating amount of the first resin composition in the first region AA1 is set to 100, the average coating amount of the second resin composition RS2 in m second unit regions SUB1, ..., SUBm may be smaller than the coating amount of the first resin composition RS1 in the first region AA1 (see Figure 13d). The average coating amount of the second resin composition RS2 in the second unit regions SUB1, ..., SUBm may be calculated by the following formula 1.

[0177] [Formula 1] [(Y1×B1)…(Yn×Bm)]÷(B1+…Bm) In Equation 1, Y1, ..., Ym are the amounts of the second resin composition RS2 applied in each of the first to mth second unit regions SUB1, ..., SUBm, respectively, when the amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1 is set to 100. In other words, the amounts of the first resin composition RS1 (see Figure 13d) applied in each of the first to mth second unit regions SUB1, ..., SUBm may represent the comparative values ​​when the amount of the first resin composition RS1 (see Figure 13d) applied to the first region AA1 is set to 100.

[0178] In Equation 1, B1...Bm are the number of pixels PX in the first to the mth second unit region SUB1, ..., SUBm, respectively.

[0179] In Equation 1, m is an integer greater than or equal to 2.

[0180] Referring further to Figures 14b and 14c, the second resin composition RS2 may be applied on top of the preliminary adhesive member P-AP so as to overlap the second region AA2. Applying the second resin composition RS2 may be a step of applying the second resin composition RS2 on top of the second region AA2 according to a set application amount. In the step of applying the second resin composition RS2, the second inkjet head IHD2 may eject the second resin composition RS2 onto the second region AA2 while moving in the second direction DR2. However, the embodiment is not limited to this, and the second inkjet head IHD2 may eject the second resin composition RS2 while moving in the first direction DR1.

[0181] The second region AA2 may be divided into two or more second unit regions SUB1 and SUB2, and the second resin composition RS2 may be applied according to the application amount set for each of the second unit regions SUB1 and SUB2. For example, the second region AA2 may be divided into a second-first unit region SUB1 and a second-second unit region SUB2, where the second resin composition RS2 is applied in a second-first unit application amount in the second-first unit region SUB1, and the first resin composition RS1 is applied in a second-second unit application amount in the second-second unit region SUB2. In one embodiment, the second-first unit application amount may be different from the second-second unit application amount. In one embodiment, the second-first unit application amount may be greater than the second-second unit application amount.

[0182] Next, as shown in Figures 13h to 13k, the second resin composition RS2, provided in the same manner as described above, may be cured to form an adhesive member AP (see Figure 13i).

[0183] The following describes in detail, with reference to examples and comparative examples, an adhesive member and a display device according to one embodiment of the present invention. Furthermore, the following examples are illustrative to aid in understanding the present invention, and the scope of the present invention is not limited thereto.

[0184] [Examples] 1. Preparation of a curable liquid resin composition The resin compositions used in the examples and comparative examples were prepared according to the mixing ratios shown in Table 3. After providing the constituent materials of the resin composition in the weight proportions disclosed in Table 3 into a heat-resistant light-shielding container, Omnirad 819 was provided as a photoinitiator at a concentration of 2% by weight based on 100% by weight of the total resin composition. Next, the provided material was stirred at 100 rpm for 1 hour using a rotational stirring and defoaming apparatus (SHASHIN KAGAKU CO., LTD. product) at room temperature to obtain a curable resin composition. The viscosity of the obtained curable resin composition at 25°C was 13 mPa·s. The viscosity of the resin composition was measured at 25°C using the JIS K 2283 method, and the viscosity of the liquid photocurable resin composition was measured using a viscometer (TVE-25L: TOKI SANGYO CO., LTD. product) at a speed of 10 rpm.

[0185] [Table 3]

[0186] <Information regarding materials used as components of resin compositions> The following is a list of information regarding each component used in the manufacture of the resin composition disclosed in Table 3 above. UF-C051: KYOEISHA CHEMICAL CO.,LTD. Urethane Acrylate UF-C052: KYOEISHA CHEMICAL CO.,LTD. Urethane Acrylate UN6304: NEGAMI CHEMICAL INDUSTRIAL CO.,LTD. Urethane Acrylate 4-HBA: OSAKA ORGANIC CHEMICAL INDUSTRY LTD. 4-Hydroxybutyl acrylate 2-EHA: TOAGOSEI CO.,LTD. 2-Ethylhexyl acrylate THF-A: KYOEISHA CHEMICAL CO.,LTD. Tetrahydrofurfurylacrylate EHDG-AT: TOAGOSEI CO.,LTD. 2-Ethylhexyl-diglycol acrylate

[0187] 2. Manufacturing and evaluation of adhesive materials [Creating an application pattern] In the examples and comparative examples, the coating pattern for the first coating step was prepared using the method shown in Table 1 above and is shown in Table 4 below, and the coating pattern for the second coating step was prepared using the method shown in Table 2 above and is shown in Table 5 below.

[0188] A monochrome bitmap file with dimensions of 550 pixels x 25500 pixels was created for the target substrate, and the coating amount for each unit area was set. The resin compositions used in the first and second coating processes were both resin compositions manufactured by the preparation of the curable liquid resin composition described above. The setting for each unit area was specified based on the number of pixels at the edges of the bitmap file. The average coating amount for the first unit areas SUA1, SUA2, SUA3, and SUA4 was calculated using Equation 1 described above and is shown in Table 4. In Tables 4 and 5 below, 100% coating amount is approximately 58 g / inch 2 This means that a 10% application rate is 5.8g / inch 2 It means...

[0189] Table 4 shows the coating amount for the first region AA1 in the first coating process, as well as the coating amounts and pixel spacing for each of the first unit regions SUA1, SUA2, SUA3, and SUA4. Table 4 also shows the coating amount for the first region AA1 in the second coating process, as well as the coating amounts and pixel spacing for each of the second unit regions SUB1 and SUB2. As mentioned above, "pixel spacing" refers to the number of pixels contained within the width interval of each unit region. The total number of pixels contained in each of the first unit regions SUA1, SUA2, SUA3, and SUA4, which are divided based on the pixel spacing, was used in the calculation of Equation 1 to derive the result value. On the other hand, the number of pixels in the first region AA1 in the first coating process is the total number of pixels minus the sum of the number of pixels in the first unit regions SUA1, SUA2, SUA3, and SUA4. The number of pixels in the first region AA1 in the second coating process is the total number of pixels minus the sum of the number of pixels in the second unit regions SUB1 and SUB2.

[0190] [Manufacturing of adhesive materials] To manufacture the adhesive members of the examples and comparative examples, a DevicePrinter-CX (MICROJET CORP.) equipped with a KM1024i (KONICA MINOLTA, INC.) inkjet printer was used. The voltage, pulse drive period, and temperature were adjusted to achieve an ejection speed of 5.5 m / s to 6.5 m / s. The resolution was set to 260 dpi × 5400 dpi, and the coating conditions were set to achieve the specified coating amount using the coating patterns in Tables 4 and 5 below. The coating was then applied to a PET film (SK CHEMICALS CO., LTD. SH86) that had been cleaned using an atmospheric pressure plasma processing device.

[0191] [Table 4]

[0192] [Table 5]

[0193] [Evaluation of coating film shape of adhesive material] Table 6 below shows the cured coating shape of the adhesive members in the examples and comparative examples. The shape of the coating on the adhesive members in the examples and comparative examples was evaluated using the following method.

[0194] The shape of the coating film of a curable resin composition applied to a PET film was measured using a KEYENCE VK-X3000 laser microscope. The horizontal distance from the edge of the formed adhesive member to the peak of the edge of the adhesive member was measured and is shown in Table 6 below. The result obtained from the horizontal distance measurement was rounded to one decimal place and measured as the "edge-to-peak distance".

[0195] [Table 6]

[0196] Referring to the results in Table 6, it can be confirmed that the "edge-to-peak distance" measured in Examples 1 to 3 is 600 μm or less. In contrast, it can be confirmed that the "edge-to-peak distance" exceeds 600 μm in Comparative Examples 1 to 3.

[0197] Comparing Examples 1 and 2 with Comparative Examples 1 and 2, it can be confirmed that the "edge-to-peak distance" in Comparative Examples 1 and 2 is significantly increased compared to Examples 1 and 2. Comparative Example 1 omits the second coating step compared to Example 1, and Comparative Example 2 omits the second coating step compared to Example 2. When the second coating step is omitted, as in Comparative Examples 1 and 2, the thickness-increasing region that occurs near the edge of the adhesive member is formed further inward, and a phenomenon can occur where the length of the slope, that is, the horizontal distance from the edge of the adhesive member to the peak, increases. During the inkjet process, the film thickness gradually decreases towards the edge of the inkjet ejection area, and then a thickness-increasing region that becomes even hotter due to the spreading properties of the solution near the edge can be formed. The thickness-increasing region formed at this time can correspond to the peak. If the thickness-increasing region is formed further inward, as in Comparative Examples 1 and 2, the bent slope of the adhesive member may be visible outside the display device, potentially degrading the image quality. In contrast, the embodiment introduces two coating steps in the process of applying the resin composition by inkjet printing. By controlling the amount of resin composition applied depending on the area, the length of the slope formed at the edge of the adhesive layer is reduced, thereby improving the durability and reliability of the display device.

[0198] Comparing the Example with Comparative Example 3, it can be confirmed that the "edge-to-peak distance" in Comparative Example 3 is increased compared to the Example. Comparative Example 3 is the case where the resin composition is applied only to the first region AA1 in both the first and second coating steps. In Comparative Example 3, the amount of resin provided near the edge of the substrate in the two coating steps is relatively small, so the "edge-to-peak distance" can be smaller compared to Comparative Examples 1 and 2, in which the second coating step is omitted. However, even if the resin composition is applied to the central part of the substrate excluding some areas near the edge, it is difficult to control the flow of the resin composition, and as a result, it can be confirmed that Comparative Example 3 shows an increased "edge-to-peak distance" compared to the Example.

[0199] A liquid resin composition applied to a substrate diffuses on the substrate, forming a film thickness. During this process, the resin composition applied to the substrate also flows outwards near the edges, resulting in uneven thickness and an unclear boundary shape for the adhesive. According to the present invention, by introducing two application steps during the inkjet printing process and controlling the amount of resin composition applied to different areas, the distribution of the adhesive film thickness at the edges of the substrate can be improved. Furthermore, process efficiency can be improved because the shape of the adhesive thickness at the edges can be easily controlled without the use of additional structures.

[0200] Although preferred embodiments of the present invention have been described so far with reference, a person skilled in the art or with ordinary knowledge in the art will understand that the present invention can be modified and altered in various ways without departing from the spirit and art domain of the invention as described in the claims below.

[0201] Therefore, the technical scope of the present invention is not limited to what is described in the detailed description of the specification, but should be determined by the claims. [Explanation of Symbols]

[0202] DD, DD-a, DD-b, DD-1, DD-2: Display devices DP: Display Panel WP: Window AP: Adhesive member AA1: First area AA2: Second region RS1: First resin composition RS2: Second resin composition

Claims

1. The steps include: fixing a substrate on a stage, in which a first region and a second region surrounding the first region are defined; The step includes forming an adhesive member on the substrate, The step of forming the adhesive member is: The steps include applying the first resin composition onto the substrate so that the first region and the second region overlap, A step of curing the first resin composition by providing a first light, The steps include applying the second resin composition to the cured first resin composition so as to overlap the second region, The step of curing the second resin composition by providing a second light, A method for manufacturing a display device, wherein the first resin composition and the second resin composition each have a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C.

2. In the step of applying the first resin composition, The method for manufacturing a display device according to claim 1, wherein the first amount of the first resin composition applied to the first region is greater than the second amount of the first resin composition applied to the second region.

3. The method for manufacturing a display device according to claim 1, wherein the second region of the substrate is divided into two or more first unit regions with different amounts of the first resin composition applied.

4. The second region of the substrate is A first-1 unit region adjacent to and surrounding the first region, A method for manufacturing a display device according to claim 3, wherein the first unit region is separated from the first region by the first unit region in between, and the first unit region is divided into a first unit region and a first unit region that surrounds the first unit region.

5. The method for manufacturing a display device according to claim 4, wherein the amount of the first resin composition applied to the 1-1 unit region is smaller than the amount of the first resin composition applied to the 1-2 unit region.

6. The step of forming the adhesive member is: Before the step of applying the first resin composition, The steps include configuring the substrate with a bitmap that includes m pixels in a first direction and n pixels in a second direction intersecting the first direction, The steps of dividing the second region on the bitmap into two or more first unit regions, A method for manufacturing a display device according to claim 3, further comprising the step of setting the amount of the first resin composition to be applied in the first region and the first unit region.

7. A method for manufacturing a display device according to claim 6, wherein the average coating amount of the first resin composition in the first unit region, calculated by the following formula 1, is 50 or more and 85 or less, [Formula 1] [(X1×A1)…(Xn×An)]÷(A1+…An) In the above formula 1, X1...Xn are the amounts of the first resin composition applied to each of the first to nth first unit regions, respectively, when the total amount of the first resin composition applied to the first region is set to 100, where n is an integer of 2 or more. A1...An are the number of pixels in each of the first to nth unit regions, respectively, and n is an integer of 2 or more.

8. The step of forming the adhesive member is: Before the step of applying the second resin composition, The steps include configuring the substrate with a bitmap that includes p pixels in a first direction and q pixels in a second direction intersecting the first direction, The steps of dividing the second region on the bitmap into two or more second unit regions, A method for manufacturing a display device according to claim 1, further comprising the step of setting the amount of the second resin composition applied in the second unit region.

9. The aforementioned second unit region is, A second-first unit region adjacent to the first region and surrounding the second region, Separated from the first region with the second-first unit region in between, and including the second-second unit region that surrounds the second-first unit region, The method for manufacturing a display device according to claim 8, wherein the amount of the second resin composition applied to the second-first unit region is different from the amount of the second resin composition applied to the second-second unit region.

10. The method for manufacturing a display device according to claim 9, wherein the amount of the second resin composition applied to the second-first unit region is greater than the amount of the second resin composition applied to the second-second unit region.

11. The adhesive member overlaps the second region and includes a peak portion where the height from the lower surface of the adhesive member to the upper surface of the adhesive member is the maximum, with respect to the thickness direction. The method for manufacturing a display device according to claim 1, wherein the horizontal distance from the end of the adhesive member to the peak portion is 300 μm or more and 600 μm or less.

12. The method for manufacturing a display device according to claim 1, wherein in the step of forming the adhesive member, the temperature of the stage is 20°C or more and 30°C or less.

13. A method for manufacturing a display device according to claim 1, wherein the first resin composition and the second resin composition are applied by an inkjet printing method.

14. The method for manufacturing a display device according to claim 1, wherein the width of the second region is 3 mm or less.

15. A method for manufacturing a display device according to claim 1, wherein in the step of applying the second resin composition, the second resin composition applied on the substrate does not overlap the first region.

16. The steps include: preparing a display panel in which a first region and a second region surrounding the first region are defined; The steps include forming an adhesive member on the display panel using an inkjet method, The step of attaching the window to the display panel via the adhesive member is included, The step of forming the adhesive member is: The steps include applying the first resin composition onto the display panel, The steps include curing the first resin composition to form a pre-adhesive member, The steps include applying a second resin composition to the pre-adhesive member along the edge of the pre-adhesive member, The process includes the step of curing the second resin composition, A method for manufacturing a display device, wherein each of the first resin composition and the second resin composition has a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C.

17. The step of applying the first resin composition is: A method for manufacturing a display device according to claim 16, comprising controlling the amount of the first resin composition sprayed from an inkjet head to apply the first resin composition to the first region of the display panel with a first application amount, and applying the first resin composition to the second region of the display panel with a second application amount different from the first application amount.

18. The step of forming the adhesive member is: Before the step of applying the first resin composition, The steps of dividing the second region into two or more first unit regions with different amounts of the first resin composition applied, The method further includes the step of setting the amount of the first resin composition to be applied in the first region and the first unit region, The method for manufacturing a display device according to claim 16, wherein the step of applying the first resin composition is to apply the first resin composition to the first region and the first unit region according to a set application amount.

19. The method for manufacturing a display device according to claim 16, wherein the end of the pre-adhesive member corresponds to the second region of the display panel.

20. A display panel in which a first region and a second region surrounding the first region are defined, A window positioned on the aforementioned display panel, The adhesive member is placed between the display panel and the window and is derived from a resin composition having a viscosity of 10 mPa·s or more and 30 mPa·s or less at 25°C. The adhesive member is Superimposed on the second region, and including the peak portion where the height from the lower surface of the adhesive member to the upper surface of the adhesive member is the greatest, with respect to the thickness direction, An electronic device in which the horizontal distance from the end of the adhesive member to the peak portion is 300 μm or more and 600 μm or less.

21. The electronic device according to claim 20, wherein the electronic device is selected from among large display devices such as televisions, monitors, and external billboards, personal computers, laptop computers, personal information terminals, vehicle display devices, game consoles, portable electronic devices, and small to medium-sized display devices such as cameras.

22. The electronic device according to claim 20, further comprising at least one of a processor, memory, and power supply module.

Images