Devices and methods for wafer center discovery

Abstract

This invention provides a device and method for wafer center discovery. [Solution] This disclosure generally relates to the field of semiconductor processing, and more particularly to devices and methods for handling and precisely positioning wafers during various stages of semiconductor manufacturing. This disclosure further relates to a semiconductor processing system including the specially designed devices.

Description

Technical Field

[0001] The present disclosure generally relates to the field of semiconductor processing, and more particularly to devices and methods for handling and accurately positioning wafers during various stages of semiconductor manufacturing.

Background Art

[0002] In semiconductor manufacturing, wafers and other substrates are typically transferred from one location to another within a processing system using a robotic handler. However, misalignment or improper handling can lead to defects, throughput reduction, and increased costs. Therefore, methods and devices for handling and positioning wafers are important for ensuring high yields and device performance during semiconductor processing. Despite significant progress, current wafer positioning methods face challenges such as alignment accuracy limits, especially with the increasing wafer size and decreasing feature size. Additionally, the emergence of optically transparent wafers has steadily made existing optical methods for positioning wafers less reliable.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of the above, there is still a need for simple and reliable devices and methods for properly positioning wafers and other substrates during transfer from one location to another by a robot.

Means for Solving the Problems

[0004] It has now been found herein that by using the devices and methods described herein, some or all of the above problems can be addressed either individually or in any combination, and the objectives can be achieved.

[0005] This summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail below in the detailed description of exemplary embodiments of the present disclosure. This summary is not intended to identify any major or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] Generally, the technologies disclosed herein relate to the field of semiconductor processing, and more particularly to improved devices and methods for handling and precisely positioning wafers during semiconductor manufacturing. More specifically, this disclosure is at least in part based on the finding that conventional optical sensors used to determine the position of wafers described in the art can be affected by problems of electrical noise, signal distortion, saturation, and interference, which can lead to a decrease in signal reliability. Furthermore, the increasing demand for optically transparent wafers makes accurate detection and positioning even more challenging.

[0007] Surprisingly, the present invention has found that certain devices configured to detect the position coordinates of a wafer or other substrate using light in the UV range (i.e., approximately 10–400 nm) can circumvent these aforementioned problems. This advantageously makes it possible to determine wafer coordinates, such as the wafer center, with enhanced sensitivity. Furthermore, the device has the added advantage of being conveniently integrated into existing semiconductor manufacturing systems, and therefore constitutes a cost-effective solution to current needs. Another advantage of the device is that it enables more accurate determination of wafer coordinates, regardless of whether the wafer is composed of an optically transparent material or not.

[0008] According to one aspect of the present disclosure, a device is provided for determining the center of a wafer in a semiconductor processing system. The device preferably comprises a plurality of light sources, each independently operable to emit UV light including radiation having wavelengths of at least 10 nm to a maximum of 400 nm; a plurality of detectors, each independently operable to receive the UV light and generate an electrical signal; and a processor operably connected to the plurality of detectors and configured to process the generated electrical signals to determine the center of the wafer.

[0009] This specification has shown that the device provides improved localization efficiency for positional coordinates, such as the wafer center and / or wafer radius, of various wafers and other substrates during semiconductor processing. This has the advantage that this disclosure is not tied to any particular material and can be conveniently applied to various wafers and other suitable substrates as defined herein.

[0010] Another advantage of this device is that the multiple light sources and detectors are configured to operate within corresponding (narrow) wavelength ranges, leading to more accurate and reliable measurements.

[0011] In certain embodiments, each light source of the device is independently operable to emit UV-A light including radiation having wavelengths of at least 315 nm to a maximum of 400 nm, and each detector is independently operable to receive the UV-A light and generate an electrical signal.

[0012] In certain embodiments, each light source of the device can operate independently to emit UV-A light at a peak wavelength of approximately 365 nm, and preferably, each detector can operate independently to receive UV-A light at a peak wavelength of approximately 365 nm.

[0013] In certain embodiments, the plurality of light sources are light-emitting diodes.

[0014] In certain embodiments, the plurality of detectors are photodiodes.

[0015] In certain embodiments, the wafer comprises one or more materials selected from the group consisting of silicon carbide, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, sapphire, and combinations thereof, and preferably the wafer comprises silicon carbide as the bulk semiconductor material.

[0016] Another aspect of this disclosure provides a method for finding the center of a wafer in a semiconductor processing system. The method is preferably, - A step of providing a wafer to a device according to an aspect of this disclosure or a (preferred) embodiment thereof, - The process of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors, and thereby generating an electrical signal, - The process includes converting an electrical signal within the processor to determine the center of the wafer.

[0017] Another aspect of this disclosure provides a method for precisely positioning a wafer in a semiconductor processing system. The method is preferably, - A step of providing a wafer to a robot-coupled device according to an aspect of this disclosure or a (preferred) embodiment thereof, - A step of moving the wafer along the path using the robot, - The process of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors positioned on the opposite side of the wafer, thereby generating an electrical signal, - A step of converting an electrical signal into a digital output signal within the processor, thereby determining the center of the wafer, - determining a difference in the position of the wafer relative to an ideal center point of the wafer by using the device; - correcting any difference in position during subsequent movement of the wafer by a robot.

[0018] In certain embodiments, correcting any difference in position is performed during movement of the wafer from an original location to a destination location.

[0019] In certain embodiments, the semiconductor processing system is a single wafer or batch processing system.

[0020] In certain embodiments, the semiconductor processing system includes a vertical furnace configured to process wafers.

[0021] It will be understood that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, some dimensions of elements in the figures may be exaggerated relative to other elements to assist in understanding the exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] [Figure 1] FIG. schematically shows an exemplary embodiment of a device (100) configured to find the center of a wafer within a semiconductor processing system according to the present disclosure. [Figure 2] FIG. schematically shows another exemplary embodiment of a device (200) configured to find the center of a wafer within a semiconductor processing system according to the present disclosure. [Figure 3] FIG. schematically shows another exemplary embodiment of a device (300) configured to find the center of a wafer within a semiconductor processing system according to the present disclosure. [Figure 4]FIG. (400) schematically shows an exemplary embodiment in which the device is connected or connectable to a robot configured to move wafers within a semiconductor processing system. [Figure 5] FIG. (500) schematically shows an exemplary embodiment of a method (500) for finding the center of a wafer within a semiconductor processing system. [Figure 6] FIG. (600) schematically shows an exemplary embodiment of a method (600) for accurately positioning a wafer within a semiconductor processing system.

DETAILED DESCRIPTION OF THE INVENTION

[0023] Certain embodiments and examples are disclosed below, but it will be understood by those skilled in the art that the disclosure extends beyond the specifically disclosed embodiments and / or uses of the present disclosure, as well as their obvious modifications and equivalents. Accordingly, it is intended that the scope of the present disclosure should not be limited by the specific disclosed embodiments described below.

[0024] In the following detailed description, the underlying technology of the present disclosure is described in its different aspects. The aspects of the present disclosure may be configured, arranged, substituted, combined, and designed in a variety of different configurations, as generally described herein and as shown in the figures, all of which are clearly contemplated and are easily understood to form part of the present disclosure. Although this description is intended to assist the reader in more easily understanding the technical concept, it is not intended to limit the scope of the present disclosure, which is limited only by the claims. Accordingly, the following description should be regarded as essentially exemplary and not restrictive.

[0025] As used herein, the singular forms "a", "an", and "the" include both singular and plural referents unless the context clearly dictates otherwise. By way of example, "a step" means one step or more than one step.

[0026] As used herein, the terms “comprising,” “comprises,” and “comprised of” are synonymous with “including,” “includes,” or “containing,” and are comprehensive or open-ended, not excluding additional, undescribed components, elements, or process steps. These terms also include “consisting of” and “consisting essentially of,” which enjoy established meanings in patent terminology.

[0027] The terms “one or more” or “at least one,” for example, at least one of one or more members or groups of members, are self-evident, but by further example, the terms include, among other things, any one of the members, or any two or more of the members, such as three or more, four or more, five or more, six or more, or seven or more, and up to all of the members. In another example, “one or more” or “at least one” could mean 1, 2, 3, 4, 5, 6, 7 or more.

[0028] In this description and claims, the terms 1, 2, 3, and similar are used to distinguish between similar elements, unless otherwise specified, and not necessarily to indicate order or chronology. It should be understood that such terms are interchangeable under appropriate circumstances, and that embodiments of the disclosure described herein may be capable of operating in any order other than those described or illustrated herein.

[0029] As used herein, the term "and / or" when used in a list of two or more items means that any one of the listed items may be used alone, or any combination of two or more of the listed items may be used. For example, if a list is described as containing group A, B, and / or C, the list may contain only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, or a combination of A, B, and C.

[0030] Throughout this specification, any reference to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment of the present invention. Therefore, the occurrences of the phrases “in one embodiment” or “in an embodiment” in various parts of this specification do not necessarily all refer to the same embodiment, although they may. Furthermore, certain features, structures, or characteristics may be combined in any preferred manner in one or more embodiments, as will be apparent to those skilled in the art from this disclosure. Moreover, while a particular embodiment described herein includes some features included in other embodiments but not others, combinations of features from different embodiments mean that, as will be understood to those skilled in the art, they are within the scope of the present invention and form different embodiments.

[0031] Enumerations of numerical ranges by endpoint include all integers and, where appropriate, fractions within that range (for example, 1–5 may include 1, 2, 3, 4 if referring to the number of elements, and 1.5, 2, 2.75, 3.80 if referring to measured values). Enumerations of endpoints also include the endpoint values ​​themselves (for example, 1.0–5.0 includes both 1.0 and 5.0). Any numerical range enumerated herein is intended to include all subranges contained within it. This applies to numerical ranges whether they begin with expressions such as "from... to...", "between... and...", or other expressions.

[0032] As used herein, the terms “about” or “approximately” are used to provide flexibility to numerical or range endpoints by specifying that a given value may be “slightly above” or “slightly below” the value or endpoint, depending on the particular context. Thus, as used herein, when referring to measurable values ​​such as parameters, quantities, durations, and the like, the terms “about” or “approximately” mean to include variations from a specified value or endpoint, such as variations of + / -10% or less, preferably + / -5% or less, more preferably + / -1% or less, and even more preferably + / -0.1% or less, insofar as it is appropriate to perform such variations in the disclosed invention.

[0033] Unless otherwise stated, the use of the terms “approximately” or “about” in reference to a particular number or range should also be understood as supporting such a numerical term or range without the term “approximately.” For example, the statement “approximately 30” should be interpreted not only as supporting values ​​slightly above and slightly below 30, but also as supporting the actual number 30.

[0034] As used herein, the term “substantially” refers to the complete or near-complete range or extent of a function, feature, characteristic, state, structure, item, or result. For example, an object “substantially” enclosed means that the object is completely enclosed or nearly completely enclosed. The exact acceptable degree of deviation from absolute completeness may, in some cases, depend on the specific context. However, generally speaking, near-complete means having the same overall result as if absolute and complete completeness had been achieved. The use of “substantially” is equally applicable when used in a negative sense to refer to the complete or near-complete absence of a function, feature, characteristic, state, structure, item, or result.

[0035] The terms "wt.%", "vol%", and "mol%" refer to the weight percentage, volume percentage, or mole percentage of an ingredient, respectively, based on the total weight, volume, or total number of moles of the material containing the ingredient.

[0036] References herein may be made to devices, structures, systems, or methods that “improve” performance (e.g., increase or decrease results, depending on the context). Unless otherwise stated, such “improvement” should be understood to be a measure of benefit obtained based on comparison with devices, structures, systems, or methods in the prior art. Furthermore, it should be understood that the degree of performance improvement may vary among the disclosed embodiments, and that the quantity, degree, or uniformity or consistency in the realization of performance improvement should not be assumed to be universally applicable.

[0037] The relative terms used herein, such as “left,” “right,” “front,” “back,” “top,” “bottom,” “up,” and “down,” are used for descriptive purposes only and are not necessarily intended to describe permanent relative positions. It should be understood that such terms are interchangeable under appropriate circumstances, and that embodiments as described herein are capable of operating in orientations other than those illustrated or described herein unless the context clearly indicates otherwise.

[0038] In this specification, objects described as “adjacent” to each other reflect a functional relationship between the objects described. That is, the term indicates that the objects described must be adjacent to each other to perform a specified function, where appropriate to the context in which the phrase is used, and this may be direct (i.e., physical) or indirect (i.e., very close or nearby) contact.

[0039] In this specification, objects described as “connected” or “joined” reflect a functional relationship between the objects described. That is, the term indicates that the objects described must be connected to perform a specified function, where appropriate to the context in which the term is used, and this may be a direct or indirect connection in an electrical or non-electrical (i.e., physical) manner.

[0040] Furthermore, embodiments of the present disclosure may include hardware, software, and electronic components or modules, which may be illustrated and described as if, for the purposes of discussion, the majority of the components were implemented solely in hardware. However, those skilled in the art will recognize, by reading this detailed description, that in at least one embodiment, the electronic-based aspects of the present disclosure may be implemented in software (e.g., instructions stored on a non-temporary computer-readable medium) executable by one or more processing units, such as microprocessors and / or application-specific integrated circuits. It should be noted that multiple hardware and software-based devices, as well as multiple different structural components, may be used to implement the technology of the present disclosure. For example, the “server” and “computing device” as described herein may include one or more processing units, one or more computer-readable medium modules, one or more input / output interfaces, and various connections connecting the components.

[0041] As used herein, the term “substrate” may refer to any underlying material or material that can be used to form a device, circuit, or film, or on which a device, circuit, or film can be formed. A “substrate” may be continuous or discontinuous, rigid or flexible, solid or porous, or a combination thereof. Substrates may include materials such as crystalline silicon, silicon carbide, silicon oxide, strained silicon, silicon germanium, sapphire, doped or undoped polysilicon, doped or undoped silicon, patterned or unpatterned silicon-on-insulator (SOI), carbon-doped silicon oxide, silicon nitride, germanium, gallium arsenide, glass, or sapphire.

[0042] The embodiments described herein are further described below with reference to devices and associated methods for finding the center of a wafer that can be performed in a semiconductor processing system. However, it is clear that other systems that would benefit from a center-finding process may also be adapted to benefit from the embodiments described herein. The devices described herein are illustrative and should not be intended or construed as limiting the scope of the embodiments described herein.

[0043] Aspects of this disclosure provide a device for finding the center of a wafer in a semiconductor processing system. The device preferably comprises, - A set of multiple light sources, each capable of independently emitting UV light containing radiation with wavelengths of at least 10 nm to a maximum of 400 nm, - A plurality of detectors, each of which is capable of operating independently to receive the UV light and generate an electrical signal, - A processor operably connected to the plurality of detectors and configured to process the generated electrical signals to determine the center of the wafer.

[0044] In other words, this specification describes techniques for detecting and positioning wafers during semiconductor manufacturing. The devices can advantageously improve the determination of wafer coordinates, such as the wafer center and / or wafer radius, which can increase the throughput and reduce costs of semiconductor manufacturing.

[0045] Herein, the device will be described in more detail with reference to Figure 1, which shows a schematic top view of an exemplary embodiment of the device 100 described herein. The device 100 may be used to perform the methods described herein to find the center of a wafer and / or to precisely position a wafer in a semiconductor processing system.

[0046] In the illustrated example, device 100 includes three light sources 101, three detectors 102, a processor 103 operably connected to the detectors 102, and a support 104. Device 100 allows a substantially circular wafer 105 to be handled by a robot (not shown), while simultaneously detecting the wafer's coordinates, such as the wafer's center and / or its radius.

[0047] Generally, the device 100 may have a U-shape with two spaced-apart legs for passing the wafer 105 as it moves along a defined path. The first leg 106 may support three spaced-apart light sources 101, and the second leg 107 may support three spaced-apart detectors 102, so that the light sources 101 and detectors 102 are positioned on either side of the wafer 105 as it passes through the device. The interior of the device 108 is not limited to a specific shape, but may be substantially circular with a radius sufficient to accommodate the wafer 105.

[0048] As used herein, the term “wafer” generally refers to all substrates and other materials that may be handled by semiconductor processing systems. While the following descriptions apply to wafers, and some exemplary embodiments specifically refer to wafers, it will be understood that a variety of other objects may be handled within a semiconductor facility, including production wafers, test wafers, cleaning wafers, calibration wafers, or similar, as well as other substrates (such as reticles, magnetic heads, flat panels, and similar) that have various shapes and sizes, such as circular, square, and rectangular substrates. All such workpieces are intended to be included within the scope of the term “wafer” as used herein, unless explicitly provided to have a different meaning or otherwise evident from the context of this disclosure. For example, a wafer as described herein may be a thin, flat object having a substantially circular shape. Typical wafer sizes today are about 100 mm, about 150 mm, about 200 mm, about 300 mm, or greater than 300 mm. Therefore, it will be understood that the shape and size of the components of this device may vary, and a person skilled in the art will understand the shape and size of the legs 106 and 107, as well as how to adapt such components, such as the support 104, to specific wafer dimensions.

[0049] While not particularly limited to a specific composition, the wafers described herein may contain one or more materials selected from the group consisting of silicon carbide, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, sapphire, and combinations thereof. Preferably, the wafers described herein contain silicon carbide as the bulk semiconductor material.

[0050] In certain embodiments, the wafer described herein may be at least partially transparent. The device has the advantage of being able to efficiently detect wafers regardless of whether transparent materials are used.

[0051] As used herein, the term “light source” refers to any object or component configured to emit electromagnetic radiation in the UV wavelength range (i.e., approximately 10–400 nm). This radiation may be continuous, pulsed, or modulated, and may originate from a variety of technologies, including but not limited to light-emitting diodes (LEDs), lasers, lamps, or other photon devices.

[0052] In some embodiments, each light source may be able to operate independently to emit UV-A light, including radiation having wavelengths from at least 315 nm to a maximum of 400 nm.

[0053] In some embodiments, each light source may be able to operate independently to emit UV-B light, including radiation having wavelengths from at least 280 nm to a maximum of 315 nm.

[0054] In some embodiments, each light source may be able to operate independently to emit UV-C light, including radiation having wavelengths from at least 100 nm to a maximum of 280 nm.

[0055] In some embodiments, each light source may be able to operate independently to emit NUV light, including radiation having wavelengths of at least 300 nm to a maximum of 400 nm.

[0056] In some embodiments, each light source may be able to operate independently to emit MUV light, which includes radiation having wavelengths of at least 200 nm to a maximum of 300 nm.

[0057] In some embodiments, each light source may be able to operate independently to emit FUV light, including radiation having wavelengths from at least 122 nm to a maximum of 200 nm.

[0058] In some embodiments, each light source may be able to operate independently to emit EUV light, including radiation having wavelengths from at least 10 nm to a maximum of 121 nm.

[0059] In a preferred embodiment, the light source 101 of the present invention is an LED configured to emit UV light, preferably UV-A light, when current flows through it. Advantageously, the LED can be configured to allow rapid switching of each individual element on / off to enable multiple measurements using different angles at any given wafer position. These multiple light sources may consist of DIP (dual in-line package) LEDs, SMD (surface mount diode) LEDs, COB (chip-on-board) LEDs, or a combination thereof. However, the disclosure is not limited to the above design, and in alternative embodiments, the LEDs may be soldered to a printed circuit board (PCB) or mounted as separate components (e.g., through-hole diodes).

[0060] Multiple light sources 101 used in this device 100 can irradiate, project, or transmit light such that an optical path is formed between the light sources 101 and the detector 102.

[0061] The light rays emitted from the light source 101 may be directed towards the outer edge of the wafer 105 as the wafer 105 passes through the device 100. Typically, the light rays strike the edge of the wafer, and depending on the setting, the light is transmitted, reflected, or blocked by the edge of the wafer.

[0062] The UV light sources of this disclosure may be provided in various shapes, sizes, and configurations depending on the application requirements. For example, a light source may have a circular shape, characterized by a central light-emitting region surrounded by a circular or elliptical lens. This design is particularly advantageous for focused illumination. In another embodiment, a light source may have a rectangular or square shape. This has the advantage that multiple light sources can be easily integrated on a printed circuit board (PCB).

[0063] These multiple light sources 101 can be arranged in an array. For example, UV-emitting LED chips that can be configured to operate in series or parallel can be used.

[0064] As used herein, the term “detector” refers to any object or component configured to sense, measure, and / or analyze UV ​​light, preferably UV-A light, emitted from multiple light sources after interacting with, for example, a target or medium (e.g., a wafer as defined herein).

[0065] In some embodiments, each light source is paired with at least one corresponding detector configured to detect the precise location where UV light intersects with or is blocked by the outer edge of the wafer.

[0066] According to this disclosure, multiple detectors can convert incident light into electrical signals or other measurable outputs, which can then be processed by a suitable processor to extract relevant information. Non-limiting examples of suitable detectors include photodiodes, photomultiplier tubes, and charge-coupled devices (CCDs).

[0067] Preferably, the detector is a photodiode designed to detect UV light. It has been found herein that, advantageously, the photodiode can provide a better signal transmission / detection speed.

[0068] The advantage of this device is that multiple detectors can be specially designed to match the wavelength, preferably, intensity, of light emitted from multiple light sources, thereby ensuring accurate and efficient detection of the wafer.

[0069] In a preferred embodiment, as schematically shown in Figure 1, at least three light sources are paired with at least three detectors, such as three light sources paired with three detectors, five light sources paired with five detectors, or seven light sources paired with seven detectors. This creates three, five, or seven separate detection points, respectively. Since the positions of the light sources and detectors are known and fixed, these points can be used to mathematically determine the coordinates of the wafer using triangulation relationships. The appropriate number and arrangement of light sources and detectors may vary depending on the size of the wafer.

[0070] Figure 2 schematically shows another exemplary embodiment of the device 200 described herein. The device 200 may be used to perform the method described herein to locate the center of a wafer and / or precisely position a wafer in a semiconductor processing system.

[0071] In the illustrated example, device 200 includes five light sources 201, five detectors 202, a processor 203 operably connected to the detectors 202, and a support 204. Device 200 allows a substantially circular wafer 205 to be handled by a robot (not shown), while simultaneously detecting the wafer's coordinates, such as the wafer's center and / or wafer radius.

[0072] Generally, the device 200 may have a U-shape with two spaced-apart legs for passing the wafer 205 as it moves along a defined path. The first leg 206 may support five spaced-apart light sources 201, and the second leg 207 may support three spaced-apart detectors 202, so that the light sources 201 and detectors 202 are positioned on either side of the wafer 205 while it passes through the device. The interior of the device 208 is not limited to a specific shape, but may be substantially circular with a radius sufficient to accommodate the wafer 205.

[0073] Figure 3 schematically shows another exemplary embodiment of the device 300 described herein. The device 300 may be used to perform the method described herein to locate the center of a wafer and / or precisely position a wafer in a semiconductor processing system.

[0074] In the illustrated example, device 300 includes seven light sources 301, seven detectors 302, a processor 303 operably connected to the detectors 302, and a support 304. Device 300 allows a substantially circular wafer 305 to be handled by a robot (not shown), while simultaneously detecting the wafer's coordinates, such as the wafer's center and / or its radius.

[0075] Generally, the device 300 may have a U-shape with two spaced-apart legs for passing the wafer 305 as it moves along a defined path. The first leg 306 may support five spaced-apart light sources 301, and the second leg 307 may support three spaced-apart detectors 302, so that the light sources 302-1 and detectors 302 are positioned on either side of the wafer 305 while it passes through the device. The interior of the device 308 is not limited to a specific shape, but may be substantially circular with a radius sufficient to accommodate the wafer 305.

[0076] In the embodiment, the electrical output signals of the multiple detectors may have a first value when a beam of UV light is incident on the surfaces of the multiple detectors, and a second value when the beam is not incident on the multiple detectors. When a wafer is passed through the device during operation, the outputs of the multiple detectors may change from the first value to the second value, and vice versa.

[0077] In certain embodiments, as shown in Figure 1, the multiple detectors 102 may be positioned opposite the multiple light sources 101 such that the optical paths from the multiple light sources 101 to the multiple detectors 102 include predetermined locations within the device 100. For example, the light sources and detectors may be directly aligned with each other. Alternatively, the light sources and detectors may be positioned at different angles, depending on scattering, fluorescence, or diffusion for light detection. It is clear that those skilled in the art will understand how to position the light sources and detectors for optimal detection accuracy.

[0078] The design of this detector, including its shape, size, and configuration, can be modified depending on the application. For example, the detector may have a circular active area, or it may have a square or rectangular shape.

[0079] An advantage of this detector is that it does not necessarily require optical filters to prevent undesirable wavelengths from reaching the active region of each detector.

[0080] In a preferred embodiment, each light source 101 is independently operable to emit UV-A light including radiation having a wavelength of at least 315 nm to a maximum of 400 nm, and each detector 102 is independently operable to receive the UV-A light and generate an electrical signal.

[0081] Preferably, each light source is capable of independently operating to emit UV-A light at a peak wavelength of approximately 365 nm, and preferably, each detector is capable of independently operating to receive UV-A light at a peak wavelength of approximately 365 nm.

[0082] It is clear that the peak wavelength of the light source 101 refers to a specific wavelength at which the material emits light with maximum intensity, while the peak wavelength of the detector 102 refers to a specific wavelength at which the material is most sensitive or responds with the highest efficiency. It has been found herein that when the peak wavelengths of multiple light sources and multiple detectors closely match, this can lead to improvements in data transmission and wafer detection.

[0083] The distance between the light source 101 and the detector 102 is determined by the size of the wafer or other substrate being handled by the device, and is optionally arranged independently in an array. In embodiments, the positions of the light source and detector may be adjustable to increase or decrease the distance between each component while maintaining the linear and diagonal relationships discussed above. Thus, the device 100 can be advantageously adapted to wafers of different sizes.

[0084] In a particular embodiment, the vertical distance between the multiple light sources and the multiple detectors is at least 10 mm to a maximum of 300 mm, or at least 10 mm to a maximum of 290 mm, or at least 10 mm to a maximum of 280 mm, or at least 10 mm to a maximum of 270 mm, or at least 10 mm to a maximum of 260 mm, or at least 10 mm to a maximum of 250 mm, or at least 10 mm to a maximum of 200 mm, or at least 10 mm to a maximum of 150 mm, or at least 10 mm to a maximum of 100 mm, or at least 15 mm to a maximum of 100 mm.

[0085] In certain embodiments, the device further comprises a housing surrounding the plurality of light sources and the plurality of detectors, the housing having holes that allow light to pass between the plurality of light sources and the plurality of detectors.

[0086] A housing suitable for enclosing the plurality of light sources and the plurality of detectors is typically designed to protect the components and optimize their performance. The housing may be made of a suitable metal or plastic material and may have a circular or rectangular shape depending on the application.

[0087] In a preferred embodiment, the housing is provided with holes, which may have a size in the range of 0.1 to 3.0 mm, preferably 0.5 mm to 2 mm. It has been found herein that the hole size can control the intensity of UV light emitted from multiple light sources. This, advantageously, makes it possible to improve the quality of signals measured by multiple detectors.

[0088] In certain embodiments, the device may further comprise one or more low-pass filters connected to or connectable to multiple light sources and / or multiple detectors. This can advantageously ensure that only specific light having the desired frequency / wavelength reaches the target, thereby improving the clarity and quality of the results.

[0089] For example, when used in conjunction with multiple light sources 101, the low-pass filter can be useful in controlling the frequency (or wavelength) of the emitted light.

[0090] Alternatively, when used in conjunction with multiple detectors 102, the low-pass filter can help control the frequency (or wavelength) of the incident light, thereby improving signal quality and reducing noise.

[0091] As used herein, the term “processor” refers to a computing device or component configured to receive and analyze data or signals generated by multiple detectors to determine the center of a wafer.

[0092] In some embodiments, the processor may be configured to perform functions such as signal processing, data analysis, and / or control operations.

[0093] In some embodiments, the processor may be configured to interpret the detected signal, extract relevant information, and / or apply algorithms to make decisions based on the data.

[0094] In some embodiments, the processor may be configured to provide feedback for coordinating the operation of multiple light sources and multiple detectors. This has the advantage that the overall accuracy and functionality of the system may be enhanced.

[0095] In certain embodiments, the processor comprises field-effect transistors, preferably metal oxide semiconductor field-effect transistors. The field-effect transistors enable the conversion of (analog) electrical signals generated by multiple detectors into digital output signals. This is advantageous as it allows for advanced processing, analysis, and decision-making.

[0096] The digital signal output generated by the processor can be manipulated, stored, or analyzed using software algorithms. This enables pattern recognition, data logging, and real-time monitoring of the wafer as it passes through the device.

[0097] In certain embodiments, the device further comprises a signal amplifier positioned between a plurality of detectors 102 and a processor 103, wherein the signal amplifier is configured to amplify the electrical signals generated by the plurality of detectors 102.

[0098] Non-limiting examples of suitable signal amplifiers include transimpedance amplifiers (TIAs) and operational amplifiers (Op-Amps).

[0099] To further improve signal processing, the device may also include a comparator positioned between the signal amplifier and the processor 103. The comparator may work with the signal amplifier to convert the analog signal (output from the amplifier) ​​into a digital signal, or to trigger specific actions based on signal strength. For example, the comparator may generate a clean digital pulse signal.

[0100] In certain embodiments, the detectors are photodiodes, and the device further comprises a signal amplifier positioned between the photodiodes and a processor, the signal amplifier being configured to convert the current generated by the photodiodes into a voltage signal.

[0101] In certain embodiments, the detectors are photodiodes, and the device further comprises a signal amplifier and a comparator positioned between the photodiodes and a processor, wherein the signal amplifier is configured to convert the current generated by the photodiodes into a voltage signal, which can then be converted within the comparator to generate a digital signal.

[0102] In an exemplary embodiment, the plurality of detectors are photodiodes, and the signal amplifier is a transimpedance amplifier, which is configured to convert the current generated by the photodiodes into a voltage signal.

[0103] In certain embodiments, the device further comprises grounding conductive plates (109, 209, 309) configured to remove static electricity accumulated in the wafer during the operation of the device. This has the advantage that the wafer can be discharged during wafer movement to avoid electrostatic discharge during further processing steps in the semiconductor processing system. The grounding conductive plates are preferably connected to the support 104.

[0104] In certain embodiments, the device is connected to or can be connected to a robot configured to move wafers within a semiconductor processing system. The robot may be configured to move wafers along a predetermined path within the semiconductor processing system. For example, the robot may be designed to ensure precise positioning and safe handling of wafers throughout various stages of a manufacturing process, including wafer transfers between process chambers, storage cassettes, and inspection stations.

[0105] Figure 4 schematically shows an exemplary embodiment 400 in which the device 401 is connected to, or can be connected to, a robot configured to move wafers within a semiconductor processing system. In the exemplary configuration, the robot comprises a multi-axis articulated arm system having a wafer end effector specifically designed for gripping, lifting, and manipulating wafers. The arm system is driven by a combination of rotary and linear actuators, allowing for precise control of the robot's movement in multiple degrees of freedom. The robot architecture typically includes a base 404, an arm assembly 403, and an end effector 402, each optimized to handle wafers of various diameters.

[0106] The end effector 402 consists of an adaptive gripping mechanism, which, depending on the specific application and wafer material, uses one or more of the following: vacuum suction, electrostatic force, or edge contact gripping. The gripping mechanism is designed to securely hold the wafer while minimizing the risk of mechanical stress, particle generation, or slippage during transport.

[0107] In a preferred embodiment, the device may be capable of operating as an integrated alignment system for precisely determining the position and orientation of a wafer during handling.

[0108] In a preferred embodiment, the device may be coupled to a robot, and the device and the robot may be operably connected to a system controller configured to control multiple light sources, multiple detectors, a processor, and the movement of a wafer in motion. The system controller may include a central processing unit (CPU), memory, and support circuitry (or I / O). Software instructions and data may be coded and stored in memory to issue instructions to the CPU. A program (or computer instruction) readable by the system controller determines which tasks are executable on the wafer. In some implementations, the program is software readable by the system controller, and the software includes code for generating and storing at least wafer position information, sequences of movement of various controlled components, and any combination thereof. The system controller may be coupled to the respective components of the device and the robot through appropriate cabling.

[0109] The system controller may include a processor, logic circuits, and / or any combination of hardware and software adapted to use the device and perform the methods of the disclosure. For example, the system controller may include program code that can operate to activate multiple light sources to illuminate a wafer in response to the reception of a signal indicating that center discovery should be initiated (e.g., that a wafer is expected to be present). The system controller may include program code that can operate to discover the edges and center of a wafer in the device using the multiple light sources and multiple detectors in accordance with the methods detailed below and illustrated in Figures 5-6. The system controller may include program code adapted to calibrate the device to control the intensity of the light sources and / or adjust the gain of the detectors. The system controller may also include interface ports, memory, a clock, a power supply, and other components to support the operation of the system controller.

[0110] Although the above paragraph refers to a single system controller, it should be understood that multiple system controllers may be used in the implementation described herein.

[0111] For example, in one implementation, a first controller controls the movement of a wafer by a robot, and a second controller controls the automation of the wafer discovery procedure provided in this disclosure. The first controller, configured to use data from the second controller, can immediately use the information about the wafer's position calculated by the second controller to adjust the movement of a robot configured to handle the wafer. For example, if measurements indicate that the wafer has been systematically displaced over a certain distance, the first controller can instruct the robot to transport the wafer to a corrected transport position, thereby compensating for the systematic displacement.

[0112] Another aspect of this disclosure provides a method for finding the center of a wafer in a semiconductor processing system. The method is preferably, - A process of providing a wafer to a device comprising multiple light sources, multiple detectors, and processors operably connected to the multiple detectors, - The process of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors, and thereby generating an electrical signal, - The process includes converting an electrical signal into a digital output signal within the processor, thereby determining the center of the wafer.

[0113] It is clear that the (preferred) embodiments of the device according to the aspects of this disclosure and the related advantages are also the (preferred) embodiments of the method for finding the center of a wafer in a semiconductor processing system according to the aspects of this disclosure, and vice versa.

[0114] Figure 5 shows a flowchart of an exemplary embodiment of a method 400 for finding the center of a wafer in a semiconductor processing system according to an aspect of the present disclosure. The method is initiated after a wafer is provided to a device including a plurality of light sources, a plurality of detectors, and a processor operably connected to the plurality of detectors as described herein (501). The wafer discovery procedure includes emitting UV light from the plurality of light sources such that the outer periphery or edge of the wafer is illuminated as the wafer passes through the device (502). By passing the wafer through the device, a series of light rays emitted from the plurality of light sources are blocked and reflected at the edge of the wafer and detected by the plurality of detectors, preferably positioned on the opposite side of the plurality of light sources (503). The detected UV light emitted from the plurality of light sources and / or secondary radiation from the wafer subsequently generate an electrical signal (504). The electrical signal generated by the plurality of detectors is then transmitted to a processor operably connected to the plurality of detectors. This signal is then converted into a digital output signal within the processor (505), thereby enabling the determination of the wafer's position and accurate measurement of the wafer's edge profile.

[0115] Next, the wafer's edge profile can be used by a processor to geometrically calculate the wafer's center position. Typically, this involves fitting circles to the detected edge points and finding the center of the circle corresponding to the wafer's center. It is preferable that the calculation takes into account all detected edge points to ensure that the center is accurately determined, even if the wafer has irregular shapes or minor defects along its edges.

[0116] The following description illustrates how the (off-center) center point of a wafer may be calculated in embodiments of this disclosure. First, the device is calibrated by determining the center of a calibration wafer, the locations of multiple light sources, and optionally, the location of a wafer boat designed to reliably hold and support the wafer during various stages of wafer processing. The center of each individual wafer may then be determined by an offset from the center of the calibrated wafer. More specifically, the coordinates of the wafer center of each subsequent wafer may be determined by measuring the distance between each light source of the multiple light sources and the leading edge (i.e., the first part of the wafer to enter the processing tool, machine, or system) and trailing edge (i.e., the last part of the wafer to enter the processing tool, machine, or system). Based on these measurements and the radius of each wafer, the coordinates of the wafer center are calculated through a standard triangulation relationship.

[0117] If the wafer is not perfectly centered within the device, the processor can further calculate the true center based on the edge profile. This allows for wafer position correction, ensuring that subsequent processes (such as lithography or etching) are accurately aligned with the actual center of the wafer.

[0118] In some embodiments, the processor can acquire and store data (e.g., coordinates of a wafer location, such as the wafer center) for later processing, or analyze the data in real time.

[0119] As shown in Figure 5, Method 500 can be repeated indefinitely as the wafer moves through various locations in the semiconductor processing system (507). Additional steps may be provided in this specification before, during, and after the steps of the Method described above, and it is understood that some of the steps described may be replaced or omitted for other implementations of the Method. For example, although not shown, Method 500 may also detect any misalignment, tilt, or eccentricity and adjust the handling or processing equipment in the semiconductor processing system accordingly.

[0120] Method 500 may be executed as a software routine by a system controller (as described herein) operably connected to the device.

[0121] Another aspect of this disclosure provides a method for precisely positioning a wafer in a semiconductor processing system. The method is preferably, - A process of providing a wafer to a device coupled to a robot, which includes multiple light sources, multiple detectors, and processors operably connected to the multiple detectors, - A process of moving a wafer along a path using a robot, - The process of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors positioned on the opposite side of the wafer, thereby generating an electrical signal, - A process of converting electrical signals into digital output signals within the processor, thereby determining the center of the wafer, -A process of determining the difference between the center of the wafer and the ideal center point of the wafer by using a device, -The process includes correcting any positional differences during the subsequent movement of the wafer by the robot.

[0122] It is clear that the (preferred) embodiments and related advantages of the device and the method for finding the center of a wafer in a semiconductor processing system according to the embodiments of the disclosure are also the (preferred) embodiments of the method for precise positioning of a wafer in a semiconductor processing system according to the embodiments of the disclosure, and vice versa.

[0123] Figure 6 shows a flowchart of an exemplary embodiment of a method 600 for precisely positioning a wafer in a semiconductor processing system according to an aspect of the present disclosure. The method is initiated after a wafer is provided to a device including a plurality of light sources, a plurality of detectors, and a processor operably connected to the plurality of detectors as described herein (601). The device is coupled to a robot configured to move the wafer to various locations in the semiconductor processing system. The wafer is then moved along a path by the robot (602), and the wafer passes through the robot-coupled device to determine the center of the wafer during movement by the robot.

[0124] The wafer discovery procedure includes emitting UV light from multiple light sources such that the outer periphery or edge of the wafer is illuminated as the wafer passes through the device (603). By passing the wafer through the device, a series of light rays emitted from the multiple light sources are blocked, reflected at the edge of the wafer, and detected by multiple detectors preferably positioned on the opposite side of the multiple light sources (604). The detected UV light emitted from the multiple light sources and / or secondary radiation from the wafer subsequently generate an electrical signal (605). The electrical signal generated by the multiple detectors is then transmitted to a processor operably connected to the multiple detectors. This signal is then converted into a digital output signal within the processor (606), thereby enabling the determination of the wafer's position and accurate measurement of the wafer's edge profile. Subsequently, it becomes possible to determine the center of the wafer by mathematical calculation (as described above) (607).

[0125] If the wafer is not perfectly centered within the device during or after movement by the robot, the difference in the wafer's position relative to its ideal center point is determined (608). The robot coupled to the device then corrects for the wafer's positional difference or deviation (609) to ensure that subsequent processes (such as lithography or etching) are precisely aligned with the actual center of the wafer.

[0126] As shown in Figure 6, Method 600 can be repeated indefinitely as the wafer moves through various locations in the semiconductor processing system (610). Additional steps may be provided in this specification before, during, and after the steps of the Method described above, and it is understood that some of the steps described may be replaced or omitted for other implementations of the Method. For example, although not shown, Method 600 may also detect any misalignment, tilt, or eccentricity and adjust the handling or processing equipment in the semiconductor processing system accordingly.

[0127] Details of various robotic movement and handling operations of wafers are well known in the art, and any such movement or handling function may be appropriately used in the processes described herein and shown in Figure 6. This includes various combinations of robotic extension, retraction, and rotation, Z-axis movement, and any other operations that may be usefully used for wafer handling during semiconductor manufacturing.

[0128] In certain embodiments, determining the difference in the wafer's position relative to its ideal center point may involve comparing the determined center of the wafer with its ideal center point. More specifically, the method advantageously provides that deviations from the wafer's center to the actual wafer's center can be compensated for during movement by various robots.

[0129] In certain embodiments, compensation for any positional differences may be performed during the movement of the wafer from its original location to its target location. The original and target locations may be any locations within the semiconductor processing system, including other robots or robot handlers, buffers or transfer stations, any type of process module, and / or other modules for supplementary processes such as cleaning, scanning, or other processes.

[0130] In certain embodiments, correcting for any positional difference is performed by placing the wafer in a staging position and picking up the wafer at the corrected position.

[0131] In certain embodiments, moving wafers along a path using a robot includes loading the wafers into a wafer boat and then inserting them into a processing chamber of a semiconductor processing system. The “wafer boat” as used herein is a carrier specifically designed to securely hold and support wafers during various stages of wafer processing, including heat treatments such as oxidation, diffusion, and annealing, as well as during transport and storage. The boat is configured to maintain wafers in a fixed orientation and spacing, ensuring uniform processing and minimizing the risk of damage or contamination.

[0132] In certain embodiments, the semiconductor processing system is a single-wafer or batch processing system.

[0133] Method 600 may be executed as a software routine by a system controller described herein that is operably connected to the device and the robot.

[0134] This disclosure further encompasses semiconductor processing systems, and the system is - A processing chamber having one or more openings for receiving wafers, - A device comprising multiple light sources, each independently operable to emit UV light including radiation having a wavelength of at least 10 nm to a maximum of 400 nm; a plurality of detectors, each independently operable to receive the UV light and generate an electrical signal; and a processor operably connected to the plurality of detectors and configured to process the generated electrical signals to determine the center of the wafer. - A robot operably connected to the device for precisely positioning the wafer within the processing chamber.

[0135] In certain embodiments, the processing chamber is a vertical furnace. The “vertical furnace” described herein may, in embodiments, be a furnace for performing processes such as oxidation, film deposition, or diffusion. The furnace operates in a vertical configuration to optimize space utilization, enhance heat treatment uniformity, and enable precise control of environmental conditions within the processing chamber.

[0136] In certain embodiments, the system further comprises a wafer boat configured to introduce wafers into a processing chamber, and a robot configured to load wafers into the wafer boat. Typically, the wafer boat is designed so that wafers can be arranged parallel and spaced apart.

[0137] During operation of the system, wafers can be loaded and unloaded from the wafer boat by using a robot operably connected to the device. While the wafer is being moved by the robot, the device is used to determine the position of the wafer and to correct for deviations of the wafer's center using the methods currently disclosed. After loading the wafer boat, the wafer boat may subsequently be placed on a suitable vertically movable platform or lift that raises the wafer boat into the process chamber.

[0138] In some implementations, the system is designed to electrically interface with all wafer processing systems, i.e., to easily adapt to interface with all wafer processing systems. This interface is designed to be inherently simple for increased flexibility. The system includes an interactive and configurable system interface, which can, for example, use serial data transfer for communication with and / or control by a host system or controller. However, the presence and use of such an interface are optional and not essential for operation. [Explanation of Symbols]

[0139] 100 devices 101 Light source 102 Detectors 103 Processors 104 Support 105 wafers 106 First leg 107 Second leg 108 devices 109 Grounding conductive plate 200 devices 201 Light source 202 detectors 203 Processors 204 Support 205 wafers 206 First leg 207 Second leg 208 devices 209 Grounding conductive plate 300 devices 301 Light source 302 Detector 303 Processor 304 Support 305 wafer 306 First leg 307 Second leg 308 devices 309 Grounding conductive plate 401 Devices 402 End Effector 403 Arm Assembly 404 Base

Claims

1. A device configured to locate the center of a wafer in a semiconductor processing system, wherein the device is - A plurality of light sources, each capable of independently operating to emit UV light including radiation having wavelengths of at least 10 nm to a maximum of 400 nm, - A plurality of detectors, each of which is capable of independently operating to receive the UV light and generate an electrical signal, - A processor operably connected to the plurality of detectors and configured to process the generated electrical signals to determine the center of the wafer, A device equipped with the following features.

2. The device according to claim 1, wherein each light source is independently operable to emit UV-A light including radiation having a wavelength of at least 315 nm to a maximum of 400 nm, and each detector is independently operable to receive the UV-A light and generate an electrical signal.

3. The device according to claim 1, wherein each light source is capable of independently operating to emit UV-A light at a peak wavelength of 365 nm, and each detector is capable of independently operating to receive UV-A light at a peak wavelength of 365 nm.

4. The device according to claim 1, wherein the plurality of light sources are light-emitting diodes.

5. The device according to claim 1, wherein the plurality of detectors are photodiodes.

6. The device according to claim 1, further comprising a signal amplifier disposed between the plurality of detectors and a processor, wherein the signal amplifier is configured to amplify the electrical signals generated by the plurality of detectors.

7. The device according to claim 1, wherein the wafer comprises one or more materials selected from the group consisting of silicon carbide, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, sapphire, and combinations thereof, and the wafer comprises silicon carbide as a bulk semiconductor material.

8. The device according to claim 1, wherein the plurality of detectors are positioned on the opposite side of the plurality of light sources such that the optical paths from the plurality of light sources to the plurality of detectors include predetermined positions within the device.

9. The device according to claim 8, wherein the vertical distance between the plurality of light sources and the plurality of detectors is at least 10 mm to a maximum of 300 mm.

10. The device according to claim 1, further comprising a housing surrounding the plurality of light sources and the plurality of detectors, wherein the housing has holes that allow light to pass between the plurality of light sources and the plurality of detectors.

11. The device according to claim 10, wherein the hole has a size in the range of 0.1 to 3.0 mm.

12. The device according to claim 1, further comprising a grounding conductive plate configured to remove static electricity accumulated during the operation of the device.

13. The device according to claim 1, wherein the device is connected to or can be connected to a robot configured to move the wafer in a semiconductor processing system.

14. A method for finding the center of a wafer in a semiconductor processing system, wherein the method is - A process of providing a wafer to a device comprising multiple light sources, multiple detectors, and a processor operably connected to the multiple detectors, - A step of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors, thereby generating an electrical signal, - A step of converting the electrical signal within the processor and thereby determining the center of the wafer, A method that includes [a certain feature].

15. The method according to claim 14, wherein each light source is independently operable to emit UV-A light including radiation having a wavelength of at least 315 nm to a maximum of 400 nm, and each detector is independently operable to receive the UV-A light and generate an electrical signal.

16. The method according to claim 14, wherein the plurality of light sources are light-emitting diodes.

17. The method according to claim 14, wherein the plurality of detectors are photodiodes.

18. A method for precisely positioning a wafer in a semiconductor processing system, wherein the method is - A process of providing a wafer to a device coupled to a robot, comprising multiple light sources, multiple detectors, and processors operably connected to the multiple detectors, - A step of moving the wafer along the path using the robot, - A step of irradiating the outer periphery of the wafer with UV light containing radiation having a wavelength of at least 10 nm to a maximum of 400 nm emitted from the plurality of light sources, detecting the UV light from the plurality of light sources and / or secondary radiation from the wafer with the plurality of detectors positioned on the opposite side of the wafer, thereby generating an electrical signal, - A step of converting the electrical signal within the processor and thereby determining the center of the wafer, - A step of determining the difference between the center of the wafer and the ideal center point by using the device, - A step of correcting any positional differences during the subsequent movement of the wafer by the robot, A method that includes [a certain feature].

19. The method according to claim 18, wherein the correction of any positional difference is performed while the wafer is moving from its original location to the target location.

20. The method according to claim 18, wherein the semiconductor processing system is a single wafer or batch processing system, and the semiconductor processing system comprises a vertical furnace configured to process wafers.

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