Substrate transport apparatus, substrate processing apparatus, and substrate transport method

Abstract

The present invention provides a substrate transport device, a substrate processing device, and a substrate transport method that can acquire the warp shape of a substrate. [Solution] The light-emitting unit 27A and the light-receiving unit 27B face each other on a straight line LNE via a first measurement point MP1 set between the center CR and the end ED. The light-emitting unit 28A and the light-receiving unit 28B face each other on a straight line LNE via a second measurement point MP2 set between the first measurement point MP1 and the end ED. The control unit measures the first amount of warpage of the substrate by measuring the first width of the first valley in the first signal waveform output from the first mapping sensor 27 using a rotary encoder. The control unit measures the second amount of warpage of the substrate by measuring the second width of the second valley in the second signal waveform output from the second mapping sensor 28 using a rotary encoder. The control unit calculates the warpage shape of the substrate based on the first and second amounts of warpage.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device, a substrate processing device, and a substrate transfer method for loading and unloading substrates. Examples of substrates include semiconductor substrates, substrates for FPD (Flat Panel Display), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, substrates for solar cells, and the like. Examples of FPDs include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like.

Background Art

[0002] Conventional substrate processing devices include a mapping unit having a light projecting unit and a light receiving unit, and a control unit (see, for example, Patent Documents 1 and 2).

[0003] For example, in Patent Document 1, the substrate processing device operates as follows. While an optical axis is formed from the light projecting unit toward the light receiving unit, the light projecting unit and the light receiving unit are lowered. Thereby, the height position of the actual substrate is acquired. Thereafter, the control unit detects the difference between the actual height position and the standard substrate height position, and determines whether or not this difference is within an allowable range. When this difference is within the allowable range, the control unit sets the height position shifted downward by a set interval from the actual substrate height position as the approach hand height position.

[0004] Further, Patent Document 3 discloses a substrate processing device provided with two sets of mapping sensors (two pairs of light projectors and light receivers). Thereby, the substrate height is detected at two different positions in the front-rear direction with respect to the substrate in the carrier. By obtaining the inclination of the substrate based on the substrate heights at the two positions, contact between the hand and the substrate is avoided.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

[0006] However, conventional methods have the following problem: When removing a substrate from a carrier or placing a substrate into a carrier, if the clearance between the hand and the substrate is small, the hand may come into contact with the substrate, potentially damaging it. Factors that reduce the clearance include, for example, substrate warping, thick substrates such as bonded substrates, and at least one of the substrate height differences due to individual differences in the dimensions of the carrier.

[0007] In particular, the warping of the substrate changes into a bowl shape or an umbrella shape, making it difficult to determine the warp shape of the substrate using any of the conventional examples mentioned above.

[0008] The present invention has been made in view of these circumstances, and aims to provide a substrate transport device, a substrate processing device, and a substrate transport method that can acquire the warp shape of a substrate. [Means for solving the problem]

[0009] To achieve this objective, the present invention adopts the following configuration. That is, the substrate transport device according to the present invention is a substrate transport device for loading and unloading substrates, comprising: a stage on which a carrier for storing the substrate is placed; at least two mapping sensors; a sensor support member for supporting the mapping sensors; a lifting unit for moving the sensor support member in the vertical direction; a height sensor for measuring the height position of the mapping sensors; and a control unit. The first mapping sensor among the mapping sensors has a first light-emitting unit and a first light-receiving unit arranged in a horizontal width direction perpendicular to the loading and unloading direction for loading and unloading the substrate into and out of the carrier through an opening in the carrier, and the first light-emitting unit and the first light-receiving unit are arranged in a plan view so as to face each other via a first measurement point set between the center and the edge of the substrate on a straight line from the center of the substrate stored in the carrier toward the opening along the loading and unloading direction, and the second mapping sensor among the mapping sensors has a second light-emitting unit and a second light-emitting unit arranged in the width direction, and the second light-emitting unit and the second light-receiving unit are arranged in a plan view so as to face each other on the straight line, The first measurement point and the end are arranged to face each other via a second measurement point set between them, and the control unit moves the sensor support member in the lifting unit so that when the first mapping sensor and the second mapping sensor are operating, the first optical axis from the first light emitter toward the first light receiver and the second optical axis from the second light emitter toward the second light receiver pass through the substrate in the carrier, and the control unit adjusts the first signal waveform output from the first mapping sensor so that the substrate adjusts the first optical axis from the first light emitter toward the first light receiver. The first amount of warping at the first measurement point is measured by measuring the first width of the first valley where the light from the first unit is blocked and the first signal value decreases using the height sensor, and the second amount of warping at the second measurement point is measured by measuring the second width of the second valley where the second light from the second light-emitting unit is blocked by the substrate and the second signal value decreases using the height sensor in the second signal waveform output from the second mapping sensor, and the control unit calculates the warping shape of the substrate based on at least the first amount of warping and the second amount of warping.

[0010] According to the substrate transport apparatus of the present invention, the first light-emitting unit and the first light-receiving unit of the first mapping sensor are arranged to face each other via a first measurement point. The second light-emitting unit and the second light-receiving unit of the second mapping sensor are also arranged to face each other via a second measurement point. The first mapping sensor can measure a first amount of warpage of the substrate, and the second mapping sensor can measure a second amount of warpage of the substrate. Therefore, the warpage shape of the substrate can be obtained based on the first and second amounts of warpage.

[0011] Furthermore, in the above-described substrate transport device, it is preferable to further include a transport robot equipped with a hand for holding the substrate, which uses the hand to remove the substrate from the carrier placed on the stage. The transport robot can transport the substrate from the carrier based on the curvature shape of the substrate.

[0012] Furthermore, in the substrate transport device described above, the control unit preferably obtains the curvature shape of the substrate, which is a first quadratic curve along the insertion / removal direction of the curvature of the lower surface of the substrate, based on the first curvature amount at the first measurement point and the second curvature amount at the second measurement point, and assumes that a second quadratic curve along the width direction of the curvature is the same curve as the first quadratic curve, and calculates the curvature height position of the lower surface of the substrate where the clearance between the substrate and the hand is narrowest, based on the second quadratic curve, assuming that the hand is inserted below the substrate.

[0013] Based on the first and second curvature amounts, the curvature shape of the lower surface of the circuit board, which is recessed on the downward side, is obtained. Therefore, it is possible to calculate the curvature height position of the lower surface of the circuit board where the clearance between the circuit board and the hand is narrowest.

[0014] Furthermore, in the above-described substrate transport device, the carrier has a first slot for storing the first substrate, which is the substrate, and a second slot for storing the second substrate located one slot below the first slot, and the control unit calculates the insertion height position of the hand between the first substrate and the second substrate using the following formula, The insertion height position = (the curvature height position of the lower surface of the first substrate + the height position of the upper surface of the second substrate) ÷ 2 The control unit preferably uses the calculated insertion height position to cause the transport robot to insert the hand into the carrier in order to remove the first substrate from the carrier.

[0015] To insert a hand between the first and second substrates, the insertion height of the hand can be calculated based on the curvature height of the underside of the first substrate and the height of the upper surface of the second substrate. This insertion height takes into account the concave curvature shape on the underside of the first substrate. Therefore, it is possible to prevent the hand from contacting either the first or second substrate and damaging either of them.

[0016] Furthermore, in the substrate transport device described above, the carrier has a first slot for storing the first substrate, which is the substrate, and a second slot located one slot below the first slot that does not store any substrates. The control unit preferably uses an insertion height position, which is a predetermined distance below the curvature height position of the substrate, to cause the transport robot to insert the hand into the carrier in order to remove the first substrate from the carrier.

[0017] When a circuit board is placed in the first slot and no circuit board is placed in the second slot, which is one slot below the first slot, the insertion height of the hand can be calculated based on the curvature height of the underside of the circuit board in order to insert the hand below the circuit board. This takes into account the recessed curvature shape on the underside of the circuit board. Therefore, it is possible to prevent the hand from contacting the circuit board and damaging it.

[0018] Furthermore, in the above-described substrate transport device, the carrier has a first slot for storing the first substrate, which is the substrate, and a second slot for storing the second substrate, which is positioned one slot above the first slot. The control unit obtains the curvature shape of the substrate, which is a first quadratic curve along the insertion / removal direction of the curvature of the upper surface of the first substrate, based on the first curvature amount at the first measurement point and the second curvature amount at the second measurement point. It is preferable that the control unit assumes that the second quadratic curve along the width direction of the curvature is the same curve as the first quadratic curve, and calculates the curvature height position of the upper surface of the first substrate where the clearance between the first substrate and the hand is narrowest, based on the second quadratic curve, assuming that the hand is inserted above the first substrate.

[0019] Based on the first and second curvature amounts, the curvature shape of the upper surface of the substrate, which is recessed upwards, is obtained. Therefore, it is possible to calculate the curvature height position of the upper surface of the substrate where the clearance between the substrate and the hand is narrowest.

[0020] Furthermore, in the substrate transport device described above, the control unit calculates the insertion height position of the hand between the second substrate and the first substrate using the following formula: The insertion height position = (height position of the lower surface of the second substrate + the curvature height position of the upper surface of the first substrate) ÷ 2 The control unit preferably uses the calculated insertion height position to cause the transport robot to insert the hand into the carrier in order to remove the second substrate from the carrier.

[0021] To insert a hand between the upper second substrate and the lower first substrate, the insertion height of the hand can be calculated based on the height of the lower surface of the second substrate and the curvature height of the upper surface of the first substrate. This insertion height of the hand takes into account the recessed curvature shape on the upper side of the first substrate. Therefore, it is possible to prevent the hand from contacting either the first or second substrate and damaging either of them.

[0022] Also, in the above-described substrate transfer device, the second measurement point is set at an end of the substrate on the opening side of the carrier, and it is preferable that the control unit measures the thickness of the substrate by measuring the second width of the second valley portion of the second signal waveform output from the second mapping sensor with the height sensor. Thereby, the thickness of the substrate can be obtained.

[0023] Also, in the above-described substrate transfer device, it is preferable that the control unit obtains the height position of the substrate by measuring, with the height sensor, the height position corresponding to the minimum value of the second valley portion of the second signal waveform output from the second mapping sensor.

[0024] For example, assume that the height positions of the upper and lower surfaces of the substrate are measured, and then the center position of the two height positions is calculated to obtain the height position of the substrate. In this case, in order to obtain the height position of the substrate, two measurement operations of the two heights and an operation of calculating the center position are required. According to the present invention, since the height position corresponding to the minimum value of the second valley portion is measured by the height sensor, the height position of the substrate can be obtained by one measurement operation.

[0025] Also, in the above-described substrate transfer device, when the minimum value of the second valley portion is located between the first reference point of the first pulse and the second reference point of the second pulse continuously output from the height sensor, the control unit obtains a difference value between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the second valley portion. Further, by integrating the difference value with the moving speed of the second light projecting unit and the second light receiving unit, an internal division distance from the first reference point to the minimum value of the second valley portion is obtained. When obtaining the height position of the substrate, it is preferable to use the internal division distance. Thereby, the distance and position can be measured with a higher resolution than the resolution of the height sensor.

[0026] Furthermore, the substrate processing apparatus according to the present invention is characterized by comprising the above-described substrate transport device and a substrate processing unit that processes the substrate transported by the transport robot.

[0027] Furthermore, the substrate transport method according to the present invention is a substrate transport method in a substrate transport device for loading and unloading substrates, wherein the substrate transport device comprises a stage on which a carrier for storing the substrate is placed, at least two mapping sensors, a sensor support member for supporting the mapping sensors, a lifting unit for moving the sensor support member in the vertical direction, and a height sensor for measuring the height position of the mapping sensors, wherein the first mapping sensor has a first light-emitting unit and a first light-receiving unit arranged in a horizontal width direction perpendicular to the loading and unloading direction for loading and unloading the substrate into and out of the carrier through an opening in the carrier, and the first light-emitting unit and the first light-receiving unit are arranged in a plan view so as to face each other on a straight line from the center of the substrate stored in the carrier toward the opening along the loading and unloading direction, with a first measurement point set between the center and the edge of the substrate, and the second mapping sensor has a second light-emitting unit and a second light-emitting unit arranged in the width direction, and the second light-emitting unit and the second light-receiving unit are arranged in a plan view so as to face each other on the straight line toward the opening, with a first measurement point set between the center and the edge of the substrate, and The first and second mapping sensors are arranged to face each other via a second measurement point set between them and the aforementioned end, and the substrate transport method includes a mapping step of moving the sensor support member to the lifting unit so that when the first mapping sensor and the second mapping sensor are operating, the first optical axis from the first light emitter toward the first light receiving unit and the second optical axis from the second light emitter toward the second light receiving unit pass through the substrate in the carrier, and in the first signal waveform output from the first mapping sensor, the first light from the first light emitter is blocked by the substrate and the first signal The invention is characterized by comprising: a first warp amount measurement step of measuring the first width of the first valley where the value becomes smaller using the height sensor to measure the first warp amount of the first measurement point; a first warp amount measurement step of measuring the second width of the second valley in the second signal waveform output from the second mapping sensor where the second light from the second light-emitting unit is blocked by the substrate and the second signal value becomes smaller using the height sensor to measure the second warp amount of the second measurement point; and a warp shape calculation step of calculating the warp shape of the substrate based on at least the first warp amount and the second warp amount.

[0028] Furthermore, this specification also discloses the following inventions relating to substrate transport devices.

[0029] In other words, the substrate transport device further comprises a transport robot equipped with a first hand and a second hand that are arranged vertically and move integrally, the carrier having a first slot for storing the first substrate, which is the substrate, a second slot located one position below the first slot for storing the second substrate, and a third slot located one position below the second slot for storing the third substrate, the control unit in the first signal waveform output from the first mapping sensor, the second substrate from the first light-emitting unit The control unit measures the third width of the third valley where the first light is blocked and the first signal value decreases using the height sensor, thereby measuring the third amount of warpage of the second substrate. The control unit measures the fourth amount of warpage of the second substrate by measuring the fourth width of the fourth valley in the second signal waveform output from the second mapping sensor where the second light from the second light emitter is blocked by the second substrate and the second signal value decreases using the height sensor. The control unit then measures the first amount of warpage at the first measurement point and the second amount of warpage at the second measurement point. The control unit obtains the curvature shape of the first substrate, which is a first quadratic curve along the insertion / removal direction of the first curvature on the lower surface, assumes that a second quadratic curve along the width direction of the first curvature is the same curve as the first quadratic curve, and calculates the first curvature height position on the lower surface of the first substrate where the clearance between the first substrate and the first hand is narrowest, based on the second quadratic curve, assuming that the first hand is inserted below the first substrate, and the control unit calculates the second curvature height position on the lower surface of the first substrate based on the third curvature amount at the first measurement point and the fourth curvature amount at the second measurement point. The control unit obtains the curvature shape of the second substrate, which is a third quadratic curve along the insertion / removal direction of the second curvature on the lower surface of the substrate, assumes that the fourth quadratic curve along the width direction of the second curvature is the same curve as the third quadratic curve, and calculates the second curvature height position on the lower surface of the second substrate where the clearance between the second substrate and the second hand is narrowest, based on the fourth quadratic curve, and calculates the insertion height position of the two hands between the substrate and the third substrate using the following formula. The insertion height position = ((First curvature height position of the lower surface of the first substrate + Height position of the upper surface of the second substrate) ÷ 2 + (Second curvature height position of the lower surface of the second substrate + Height position of the upper surface of the third substrate) ÷ 2) ÷ 2 The control unit preferably uses the calculated insertion height position to cause the transport robot to insert the two hands into the carrier in order to remove the first and second substrates from the carrier.

[0030] To insert the first hand between the first and second substrates, and the second hand between the second and third substrates, the insertion heights of the two hands can be calculated based on the first curvature height position on the underside of the first substrate and the second curvature height position on the second substrate. These insertion heights of the two hands take into account the concave curvature shape on the underside of each of the first and second substrates. Therefore, it is possible to prevent the two hands from contacting any of the three substrates and damaging any of them. [Effects of the Invention]

[0031] According to the substrate transport apparatus, substrate processing apparatus, and substrate transport method of the present invention, the warp shape of the substrate can be obtained. [Brief explanation of the drawing]

[0032] [Figure 1] This is a plan view showing the substrate processing apparatus according to Example 1. [Figure 2] This is a cross-sectional view of a career. [Figure 3] This is a front view of the career path. [Figure 4] This is a longitudinal cross-sectional view showing a substrate processing apparatus according to an embodiment. [Figure 5] This is a side view showing the lid attachment / detachment mechanism. [Figure 6] This is a plan view showing the mapping sensor located in the standby position. [Figure 7] This is a plan view showing the mapping sensor located at the detection position. [Figure 8]This is a block of data regarding the control system for circuit board processing equipment. [Figure 9] This is a flowchart illustrating the operation of a substrate processing device. [Figure 10] This is a side view showing how light emitted from the light-emitting unit moves towards the light-receiving unit. [Figure 11] This is a longitudinal cross-sectional view showing the mapping operation. [Figure 12] (a) is a diagram showing the first signal waveform output from the first mapping sensor, (b) is a diagram showing the second signal waveform output from the second mapping sensor, and (c) is a diagram showing the pulse output from the rotary encoder. [Figure 13] This diagram illustrates a method for obtaining the amount of warping of the substrate at the first measurement point. [Figure 14] This is a side view showing how to calculate clearance. [Figure 15] (a) is a plan view showing the substrate within the carrier, the first and second measurement points by two mapping sensors, and the hand as it is assumed to be inserted into the carrier; (b) is a view of (a) from the EE arrow; and (c) is a view of (a) from the FF arrow. [Figure 16] This diagram illustrates a method for calculating the insertion height position of a hand to be inserted between two bowl-shaped circuit boards. [Figure 17] This diagram illustrates how to calculate the insertion height position of the hand when there is no circuit board in the slot below it. [Figure 18] This diagram illustrates a method for calculating the height position for removing a circuit board. [Figure 19] This figure illustrates a method for calculating the insertion height positions of two hands inserted between three substrates, according to Example 2. [Figure 20](a) is a diagram showing the first signal waveform output from the first mapping sensor according to Example 3, (b) is a diagram showing the second signal waveform output from the second mapping sensor according to Example 3, and (c) is a diagram showing the pulse output from the rotary encoder according to Example 3. [Figure 21] (a) is a view from arrow EE in Figure 15(a), and (b) is a view from arrow FF in Figure 15(a). [Figure 22] This diagram illustrates a method for calculating the insertion height position of a hand that is inserted between two umbrella-shaped substrates. [Figure 23] This diagram illustrates the method for calculating internal distance in a modified example. [Figure 24] This is a side view showing the sensor movement part related to another modified example. [Figure 25] This is a side view showing the sensor movement part related to another modified example. [Figure 26] This is a longitudinal cross-sectional view illustrating mapping related to other variations. [Modes for carrying out the invention]

[0033] Examples of the present invention will be described below. [Examples]

[0034] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the substrate processing apparatus 1 according to the embodiment. Figure 2 is a cross-sectional view of the carrier C, and Figure 3 is a front view of the carrier C. Figure 4 is a longitudinal cross-sectional view showing the substrate processing apparatus 1 according to the embodiment. Figure 5 is a side view showing the lid attachment / detachment section 11.

[0035] <1. Configuration of substrate processing equipment> Refer to Figure 1. The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 comprises an indexer block 2 and a processing block 3.

[0036] The horizontal direction in which the indexer block 2 and processing block 3 are positioned is called the front-to-back direction (X direction). The direction from processing block 3 towards indexer block 2 is forward, and the opposite direction is backward. The horizontal direction perpendicular to the front-to-back direction is called the width direction (Y direction). The direction perpendicular to both the front-to-back direction and the width direction is called the up-and-down direction (Z direction).

[0037] <1-1. Indexer Block> The indexer block 2 comprises at least one (e.g., two or four) load ports (openers) 5, a housing 7, and a transport robot IR. The load ports 5 are used for loading and unloading substrates W. Each load port 5 is equipped with a stage 9 and a lid attachment / detachment section 11 (see Figure 4). A carrier C is placed on the stage 9.

[0038] The carrier C houses multiple (e.g., 25) substrates W in a horizontal orientation, aligned vertically (Z-direction) at a predetermined pitch (e.g., 10 mm pitch) according to the design. The substrates W are formed, for example, in a disc shape. A Front Opening Unify Pod (FOUP) is used as the carrier C, but is not limited to this. For example, the carrier may be a cassette (open cassette) without a lid portion 17 (described later) that closes the opening 14 (described later).

[0039] Refer to Figures 2 and 3. The carrier C comprises a container (carrier body) 13, an opening 14, multiple pairs (e.g., 25 pairs) of shelves 15, 16, and a lid 17. The container 13 houses multiple substrates W. The opening 14 is provided on the front of the container 13. Each of the multiple substrates W is removed from and placed back into the carrier C through the opening 14. When the carrier C is being transported, the lid 17 that closes the opening 14 is attached to the container 13. When removing the substrates W from the carrier C, the lid 17 is removed from the container 13.

[0040] Multiple pairs of shelves 15, 16 are provided vertically within the container 13. In the vertical direction, the multiple pairs of shelves 15, 16 are arranged at a predetermined pitch (for example, a 10 mm pitch) according to the design. One substrate W is placed horizontally on each pair of shelves 15, 16. As shown in Figure 3, for example, 25 shelves 15 are provided on the left inner wall 13A of the container 13, and 25 shelves 16 are provided on the right inner wall 13B of the container 13.

[0041] Furthermore, within the carrier C, for example, the space between two pairs of vertically adjacent shelf sections 15 and 16 that accommodates one circuit board W is called a slot. Therefore, the carrier C is equipped with multiple (for example, 25) slots SL1 to SL25, each accommodating multiple (for example, 25) circuit boards W. The 25 slots SL1 to SL25 are arranged in order from bottom to top. Slot SL1 is the lowest slot, and slot SL25 is the highest slot.

[0042] Refer to Figures 1, 4, and 5. The two load ports 5 are arranged in the width direction (Y direction). The two load ports 5 are located at the front of the indexer block 2. Specifically, the two load ports 5 are located on the outside of the housing 7, on the front wall portion 7A of the housing 7. The wall portion 7A is provided with a passage opening 7B corresponding to the opening 14 of the carrier C placed on the stage 9 of each load port 5. For example, the transport robot IR removes the substrate W from the carrier C placed on the stage 9 through the passage opening 7B.

[0043] The lid attachment / detachment section 11 of the load port 5 includes a shutter section 19, a shutter forward / backward section 21, a shutter lifting / lowering section 23, and a rotary encoder (height sensor) 25. The shutter section 19 opens and closes the corresponding passage opening 7B. The shutter section 19 can also hold the lid section 17 of the carrier C. Therefore, the shutter section 19 can remove the lid section 17 from the carrier C or attach the lid section 17 to the carrier C.

[0044] The shutter advancement / retraction mechanism 21 moves the shutter unit 19 forward and backward in the front-rear direction (X direction). The shutter advancement / retraction mechanism 21 comprises, for example, an electric motor 21A, a screw shaft 21B, a slider 21C, and a guide rail 21D. Alternatively, the shutter advancement / retraction mechanism 21 may be equipped with an air cylinder instead of the electric motor 21A and screw shaft 21B. The slider 21C supports the shutter unit 19.

[0045] The shutter lifting unit 23 moves the shutter unit 19, two light-emitting units 27A, 28A (described later), two light-receiving units 27B, 28B (described later), and sensor support member 31 (described later) in the vertical direction (Z direction). The shutter lifting unit 23 includes, for example, an electric motor 23A, two pulleys 23B, 23C, a timing belt 23D, a slider 23E, and a guide rail 23F.

[0046] Two pulleys 23B and 23C are arranged vertically. The two pulleys 23B and 23C are rotatably supported around two horizontal axes AX1 and AX2, respectively. The two horizontal axes AX1 and AX2 each extend, for example, in the width direction (Y direction). A ring-shaped timing belt 23D is wrapped around the two pulleys 23B and 23C. A slider 23E is attached (fixed) to the timing belt 23D. A guide rail 23F is arranged to extend vertically. The slider 23E is guided vertically by the guide rail 23F. The slider 23E supports the shutter advance / return section 21.

[0047] The rotating output shaft of the electric motor 23A is connected, for example, to the lower pulley 23B. The electric motor 23A rotates the pulley 23B around the horizontal axis AX1. When the lower pulley 23B is rotated, the timing belt 23D rotates the upper pulley 23C around the horizontal axis AX2. When the electric motor 23A rotates the pulley 23B in the forward direction, the slider 23E, the shutter advance / retract section 21, the shutter section 19, the two light-emitting sections 27A, 28A, and the two light-receiving sections 27B, 28B rise along with the movement of the timing belt 23D. Conversely, when the electric motor 23A rotates the pulley 23B in the reverse direction, the slider 23E, the two light-emitting sections 27A, 28A, and the two light-receiving sections 27B, 28B, etc., descend along with the movement of the timing belt 23D.

[0048] The rotary encoder 25 measures the height position of the shutter unit 19 and the two mapping sensors 27, 28 (light-emitting units 27A, 28A and light-receiving units 27B, 28B). The rotary encoder 25 is connected, for example, to the upper pulley 23C. The rotary encoder 25 detects the amount of mechanical displacement of the rotation of the pulley 23C and outputs it as a pulse (pulse signal). By counting the number of pulses from the rotary encoder 25, the vertical movement of, for example, the shutter unit 19, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B can be obtained. Furthermore, the height position of the shutter unit 19, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B from their reference positions can be obtained.

[0049] The rotary output shaft of the electric motor 23A may be connected to the upper pulley 23C instead of the lower pulley 23B. The rotary encoder 25 may also be connected to the lower pulley 23B instead of the upper pulley 23C to detect the mechanical displacement of the lower pulley 23B. Furthermore, if the rotary output shaft of the electric motor 23A is connected to the lower pulley 23B, the rotary encoder 25 may also be connected to the lower pulley 23B. Additionally, a linear encoder may be provided as a height sensor instead of the rotary encoder 25.

[0050] Refer to Figures 6 and 7. The load port 5 further includes two mapping sensors 27 and 28 and a sensor movement unit 29.

[0051] The first mapping sensor 27 is used to measure the state of the substrate W (for example, the amount of warping of the substrate W). The warped substrate W is formed, for example, as a bowl shape with a concave bottom or an umbrella shape with a concave top. The second mapping sensor 28 is used to measure the state of the substrate W (for example, the height position and the amount of warping (thickness) of the substrate W). The first mapping sensor 27 comprises a light-emitting unit 27A and a light-receiving unit 27B. Similarly, the second mapping sensor 28 comprises a light-emitting unit 28A and a light-receiving unit 28B.

[0052] For example, through-type fiber sensors are used as the mapping sensors 27 and 28. For example, the first mapping sensor 27 further includes a light-emitting element (e.g., an LED: light-emitting diode), a light-receiving element, a first optical fiber, and a second optical fiber. The first optical fiber sends light from the light-emitting element to the light-emitting unit 27A. The second optical fiber sends the light received by the light-receiving unit 27B to the light-receiving element. The light-receiving element converts the received light into an electrical signal. The first mapping sensor 27 outputs a signal corresponding to the amount of light (received intensity) of the light received by the light-receiving unit 27B. The second mapping sensor 28 is configured similarly to the first mapping sensor 27.

[0053] The light-emitting units 27A, 28A and the light-receiving units 27B, 28B are provided, for example, on the upper surface of the shutter unit 19 via a sensor movement unit 29. The sensor movement unit 29 includes a sensor support member 31. The sensor support member 31 is formed, for example, in a C-shape in plan view. The sensor support member 31 supports two mapping sensors 27, 28 (two light-emitting units 27A, 28A and two light-receiving units 28A, 28B).

[0054] The two light-emitting units 27A and 28A are provided at the first end of the C-shaped sensor support member 31. The two light-receiving units 27B and 28B are provided at the second end of the sensor support member 31. The light-emitting units 27A and 28A and the light-receiving units 27B and 28B are positioned at the same height relative to each other.

[0055] The light-emitting section 27A and light-receiving section 27B of the first mapping sensor 27 are arranged in the width direction (Y direction). Similarly, the light-emitting section 28A and light-receiving section 28B of the second mapping sensor 28 are arranged in the width direction. The width direction is a horizontal direction perpendicular to the insertion / removal direction TD (Figures 6 and 7) in which multiple substrates W are inserted into and removed from the carrier C through the opening 14 of the carrier C.

[0056] The light-emitting section 27A and the light-receiving section 27B of the first mapping sensor 27 face each other. When there are no obstacles blocking the light, the light emitted from the light-emitting section 27A is received by the light-receiving section 27B. The optical axis LT1 connecting the light-emitting section 27A and the light-receiving section 27B extends in the width direction (Y direction).

[0057] Similarly, the light-emitting section 28A and the light-receiving section 28B of the second mapping sensor 28 face each other. When there are no obstacles blocking the light, the light emitted from the light-emitting section 28A is received by the light-receiving section 28B. The optical axis LT2 connecting the light-emitting section 28A and the light-receiving section 28B extends in the width direction.

[0058] The sensor movement unit 29 further includes, for example, an electric motor, a screw shaft, a guide rail, and a slider. Alternatively, the sensor movement unit 29 may be equipped with an air cylinder instead. The sensor movement unit 29 moves the two light-emitting units 27A, 28A, the two light-receiving units 27B, 28B, and the sensor support member 31 linearly in the front-rear direction (X direction). Normally, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B are in standby positions (see Figure 6). When mapping is performed, the sensor movement unit 29 moves the light-emitting units 27A, 28A and the light-receiving units 27B, 28B into the carrier C placed on the stage 9 (see Figure 7).

[0059] When the light-emitting units 27A, 28A and light-receiving units 27B, 28B are located in the detection position, they are arranged as follows: The light-emitting unit 27A and light-receiving unit 27B of the first mapping sensor 27 are arranged in a plan view on a straight line LNE, facing each other via a first measurement point MP1 set between the center CT and the edge ED of the substrate W1. The light-emitting unit 28A and light-receiving unit 28B of the second mapping sensor 28 are arranged in a plan view on a straight line LNE, facing each other via a second measurement point MP2 set between the first measurement point MP1 and the edge ED. The distance between the edge ED and the second measurement point MP2 is, for example, 5 mm. The distance between the edge ED and the first measurement point MP1 is, for example, 30 mm to 50 mm.

[0060] As shown in Figure 7, the linear LNE is a straight line extending from the center CT of substrate W1(W), one of the multiple substrates W housed in the carrier C, along the insertion / removal direction TD towards the aperture 14. The optical axis LT2, extending from the light-emitting section 28A to the light-receiving section 28B, intersects the peripheral edge of the substrate W in a plan view. The optical axis LT1 also intersects the substrate W in a plan view, but closer to the center CT than the optical axis LT2.

[0061] Note that the load port 5, or the load port 5 and the transport robot IR, correspond to the substrate transport device of the present invention. The shutter lifting unit 23 corresponds to the lifting unit of the present invention. The first mapping sensor 27 corresponds to the first mapping sensor of the present invention. The second mapping sensor 28 corresponds to the second mapping sensor of the present invention. The light emitting unit 27A corresponds to the first light emitting unit of the present invention, and the light emitting unit 28A corresponds to the second light emitting unit of the present invention. Also, the light receiving unit 27B corresponds to the first light receiving unit of the present invention, and the light receiving unit 28B corresponds to the second light receiving unit of the present invention. Optical axis LT1 corresponds to the first optical axis. Optical axis LT2 corresponds to the second axis.

[0062] Refer to Figures 1 and 4. Next, the transport robot IR will be described. The transport robot IR is located inside the housing 7. The transport robot IR transports the substrate W between the two carriers C of the two load ports 5 and the substrate mounting section PS (described later). For example, a horizontal articulated robot is used as the transport robot IR. The transport robot IR is equipped with a hand 41, an articulated arm 43, a lifting platform 45, and a height sensor 47.

[0063] The hand 41 holds the substrate W in a horizontal position. The transport robot IR uses the hand 41 to remove the substrate W from the carrier C placed on the stage 9 and to place the substrate W back into the carrier C.

[0064] The hand 41 is connected to the tip of the articulated arm 43. The base of the articulated arm 43 is connected to a lifting platform 45 so as to be rotatable around a vertical axis. The articulated arm 43 moves the hand 41 horizontally (XY direction). The articulated arm 43 can also change the orientation of the hand 41. The lifting platform 45 moves the hand 41 and the articulated arm 43 vertically (Z direction). The articulated arm 43 and the lifting platform 45 are each equipped with electric motors. A height sensor 47 measures the height position of the hand 41. The height sensor 47 is equipped with, for example, a rotary encoder or a linear encoder.

[0065] <1-2. Processing Block> Refer to Figure 1. Processing block 3 comprises at least one processing unit 51, a center robot CR, and a substrate mounting section (shelf) PS. The substrate mounting section PS is located between the transport robot IR and the center robot CR. The substrate mounting section PS can hold one or more substrates W.

[0066] The processing unit 51 performs a pre-set process on the substrate W. The processing unit 51 performs at least one of the following processes: coating a processing solution such as a resist, developing, washing, and polishing (grinding). The processing unit 51 includes, for example, a holding and rotating unit 53 and a nozzle 55. The holding and rotating unit 53 includes a spin chuck that holds one substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 55 discharges the processing solution onto the upper surface of the substrate W held by the holding and rotating unit 53.

[0067] Furthermore, if the processing unit 51 performs a cleaning process, it may be equipped with a brush. Also, if the processing unit 51 performs a polishing (grinding) process, it may be equipped with a polishing tool. In addition, the processing unit 51 may perform a dry etching process, an ashing process, or a film formation process.

[0068] The center robot CR is configured similarly to the transport robot IR. Briefly, the center robot CR is equipped with a hand 61 that holds a substrate W in a horizontal position. The center robot CR moves the hand 61 that holds the substrate W in the horizontal direction (XY direction) and the vertical direction (Z direction). The center robot CR also changes the orientation of the hand 61 around the vertical axis. The center robot CR transports the substrate W between at least one processing unit 51 and the substrate mounting section PS. Note that at least one of the center robot CR and the transport robot IR may have a reciprocating mechanism having, for example, a screw shaft and a guide rail instead of a multi-joint arm. This reciprocating mechanism moves the hand forward and backward.

[0069] <1-3. Control System for Substrate Processing Equipment> Refer to Figure 8. The substrate processing apparatus 1 comprises a control unit 71, a storage unit (storage medium) 73, and a notification unit 75. The control unit 71 controls each component of the substrate processing apparatus 1. The control unit 71 comprises one or more processors, such as a central processing unit (CPU). The storage unit 73 comprises at least one of the following: ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit 73 stores computer programs necessary to control each component of the substrate processing apparatus 1. The storage unit 73 also stores various operations (for example, steps S01 to S08 described later). The notification unit 75 comprises at least one of the following: a buzzer, a speaker, a lamp (light), a display such as a liquid crystal.

[0070] <2. Operation of the substrate processing device> The operation of the substrate processing apparatus 1 will be explained with reference to the flowchart in Figure 9. The carrier C has 25 slots SL1 to SL25 and is assumed to house 25 substrates W.

[0071] [Step S01] Placing the carrier onto the stage Carrier C is transported to one of the two load ports 5 shown in Figure 1, on stage 9. When carrier C is placed on stage 9, a sensor (not shown) detects that carrier C has been placed on stage 9 and notifies the control unit 71 of this.

[0072] Subsequently, the shutter portion 19 of the lid attachment / detachment portion 11 holds the lid portion 17 of the carrier C. Then, the shutter advance / retract portion 21 retracts the shutter portion 19 that is holding the lid portion 17. As a result, the lid portion 17 is removed from the carrier C and the passage opening 7B is opened. Then, the shutter lifting portion 23 lowers the shutter portion 19, the light-emitting portions 27A, 28A and the light-receiving portions 27B, 28B slightly in order to allow the light-emitting portions 27A, 28A and the light-receiving portions 27B, 28B to enter the carrier C.

[0073] [Step S02] Mapping As shown in Figure 6, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B are in standby positions. The sensor movement unit 29 moves the two light-emitting units 27A, 28A, etc. forward. As a result, as shown in Figure 7, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B are moved to the detection position.

[0074] In this configuration, the light-emitting unit 27A and the light-receiving unit 27B are arranged in a plan view so as to face each other on a straight line LNE, with a first measurement point MP1 set between the center CT and the end ED. Furthermore, the light-emitting unit 28A and the light-receiving unit 28B are arranged in a plan view so as to face each other on a straight line LNE, with a second measurement point MP2 set between the first measurement point MP1 and the end ED.

[0075] Subsequently, the two mapping sensors 27 and 28 are activated. This causes the light-emitting units 27A and 28A to emit light, and the light-receiving units 27B and 28B to enter a detection state where they can receive light. For example, the light emitted from the light-emitting unit 27A spreads out, for example, in a cone shape towards the light-receiving unit 27B, as shown in Figure 10. Alternatively, the light emitted from the light-emitting unit 27A may spread out, for example, in a fan shape, at least vertically, towards the light-receiving unit 27B. The light emitted from the light-emitting unit 27A is received by the light-receiving unit 27B. As a result, the first mapping sensor 27 outputs a signal corresponding to the amount of light received by the light-receiving unit 27B.

[0076] Similarly, the light emitted from the light-emitting unit 28A spreads out towards the light-receiving unit 28B, as shown in Figure 10. The second mapping sensor 28 outputs a signal corresponding to the amount of light received by the light-receiving unit 28B. The output signal is sent to the control unit 71.

[0077] For example, if the light emitted from the light-emitting unit 27A is not blocked by an obstacle including the substrate W, the light-receiving unit 27B receives a certain amount of light, and the first mapping sensor 27 outputs a signal S1 of a certain magnitude. This signal S1 will be called the "signal value S1 when light is not blocked". On the other hand, if the light from the light-emitting unit 27A is blocked by the substrate W, the amount of light received by the light-receiving unit 27B decreases. Therefore, the first mapping sensor 27 outputs a signal smaller than signal S1. The same applies to the second mapping sensor 28.

[0078] Subsequently, as shown in Figure 11, when the two mapping sensors 27 and 28 are operating, the shutter lifting unit 23 lowers the sensor support member so that the optical axis LT1 from the light-emitting unit 27A to the light-receiving unit 27B and the optical axis LT2 from the light-emitting unit 28A to the light-receiving unit 28B pass through the 25 substrates W in the carrier C. During the lowering, the light-emitting element and light-receiving element of the mapping sensor 27 may or may not lower together with the light-emitting unit 27A and the light-receiving unit 27B. The same applies to the mapping sensor 28.

[0079] As a result, the first mapping sensor 27 outputs the first signal waveform shown in Figure 12(a). The second mapping sensor 28 outputs the second signal waveform shown in Figure 12(b). The rotary encoder 25 outputs pulse signals (pulses) corresponding to the amount of movement of the light-emitting units 27A, 28A and the light-receiving units 27B, 28B, as shown in Figure 12(c). The first and second signal waveforms output from the two mapping sensors 27 and 28, and the pulses output from the rotary encoder 25 are sent to the control unit 71.

[0080] In Figures 12(a) and 12(b), the horizontal axis represents time, and the vertical axis represents signal intensity (voltage (mV)). In Figure 12(c), the horizontal axis represents time, and the vertical axis represents pulse ON (1) and OFF (0). After mapping, the sensor movement unit 29 moves the light-emitting units 27A, 28A and light-receiving units 27B, 28B from the detection position (see Figure 7) to the standby position (see Figure 6). Subsequently, the shutter lifting unit 23 lowers the shutter unit 19 to a position that does not obstruct the transport of the substrate W by the transport robot IR, as shown by the solid line in Figure 4.

[0081] [Step S03] Obtaining the height position, thickness, and warpage of the substrate. The control unit 71 acquires (detects) the state of the substrate W within the carrier C (e.g., the height position, thickness, and warpage of the substrate W) based on the first and second signal waveforms from the two mapping sensors 27 and 28 and the pulse from the rotary encoder 25. The order in which the height position, thickness, and warpage of the substrate W are acquired is not limited.

[0082] (1) First, we will explain the operation of acquiring the warp amount SA (SA1 to SA25) at the first measurement point MP1 of 25 substrates W. For example, we will assume that the warp amount SA1 of substrate W1 shown in Figure 11 is acquired.

[0083] The first signal waveform output from the first mapping sensor 27 contains 25 valleys VA1 to VA25 corresponding to the 25 substrates W. Each of the valleys VA1 to VA25 is a portion where the light from the light-emitting unit 27A is blocked by the corresponding substrate W, resulting in a smaller signal value. Figure 12(a) shows two valleys VA1 and VA2, respectively, corresponding to the two substrates W1 and W2 shown in Figure 11.

[0084] Refer to Figure 13. For example, when the light-emitting section 27A and light-receiving section 27B of the first mapping sensor 27 pass through the interface (upper and lower surfaces) of the substrate W, the signal output from the first mapping sensor 27 has the property of being approximately half the depth from the signal value S1 when not shielded to the minimum signal value. Therefore, the control unit 71 uses the rotary encoder 25 to measure the width of the section in the trough VA1 of the signal waveform that is less than or equal to half the depth DA1 from the signal value S1 when not shielded to the minimum signal value MNA1, thereby obtaining the amount of warping SA1 of the substrate W1 at the first measurement point MP1.

[0085] Let me explain in detail. The control unit 71 determines that the depth DA1 is approximately half when the signal value of the output signal from the first mapping sensor 27 is less than or equal to the threshold SKA. This threshold SKA is set in advance through experiments or other means. The control unit 71 counts the pulses in the interval below the threshold SKA, that is, the interval where the depth is approximately half or less than or equal to DA. As a result, the control unit 71 obtains the amount of warping SA1 of the substrate W1 (= amount of movement per pulse × number of pulses).

[0086] In other words, the control unit 71 uses the rotary encoder 25 to measure the width in the signal waveform where, for example, the signal value of the valley VA1 is below the threshold SKA. This allows the warp amount SA1 of the substrate W1 to be obtained. The remaining 24 warp amounts SA2 to SA25 of the substrates W are obtained in the same way as warp amount SA1. In Figure 13 and other figures, the code TT corresponds to the height position of the top surface of the substrate W, and the code TB corresponds to the height position of the bottom surface of the substrate W.

[0087] (2) Next, we will explain the operation of acquiring the warp amount SB (SB1 to SB25), i.e., the thickness TK (TK1 to TK25), at the second measurement point MP2 of the 25 substrates W. For example, we will assume that the warp amount SB1 of substrate W1 shown in Figure 11 is acquired.

[0088] The second signal waveform output from the second mapping sensor 28 contains 25 valleys VB1 to VB25 corresponding to the 25 substrates W. Each of the valleys VB1 to VB25 is a portion where the light from the light-emitting unit 28A is blocked by the corresponding substrate W, resulting in a smaller signal value. Figure 12(b) shows two valleys VB1 and VB2, respectively, corresponding to the two substrates W1 and W2 shown in Figure 11.

[0089] The amount of warpage SB1 of the substrate W1 is measured in the same way as the amount of warpage SA1. The control unit 71 obtains the amount of warpage SB1 of the substrate W1 by measuring the width of the section in the trough VB1 of the second signal waveform that is less than or equal to half of the depth DB1 from the signal value S1 when not shielded to the signal minimum MNB1 using the rotary encoder 25.

[0090] Let me explain in detail. The control unit 71 determines that the depth DB1 is approximately half when the signal value of the output signal from the second mapping sensor 28 is less than or equal to the threshold SKB (or less than the threshold SKB). This threshold SKB is set in advance through experiments or other means. The control unit 71 counts the number of pulses in the interval below the threshold SKB, that is, the interval where the depth is approximately half or less than the depth DB1. As a result, the control unit 71 obtains the amount of warping SB1 of the substrate W1 (= amount of movement per pulse × number of pulses).

[0091] In other words, the control unit 71 uses the rotary encoder 25 to measure the width in the signal waveform where, for example, the signal value of the valley VB1 is below the threshold SKB. This allows the warp amount RB1 of the substrate W1 to be obtained. The remaining 24 warp amounts SB2 to SB25 of the substrates W are also obtained in the same way as the warp amount SB1, based on the threshold SKB.

[0092] The edges of the substrate W are less affected by warping. Therefore, the thickness TK of the substrate W can be approximately obtained from the amount of warping SB. Thus, the 25 warping amounts SB1 to SB25 at the second measurement point MP2 correspond to the 25 thicknesses TK1 to TK25 of the two substrates W.

[0093] (3) Next, the operation for acquiring the height position of the substrate W will be described. When the light-emitting unit 28A and the light-receiving unit 28B pass the center position in the thickness direction of the substrate W, the signal output from the second mapping sensor 28 has the property of becoming a minimum value. Therefore, the control unit 71 acquires the height position HT1 of the substrate W by measuring the height position corresponding to the minimum value MNB1 of the signal at, for example, the valley VB1 of the second signal waveform from the second mapping sensor 28 using the rotary encoder 25.

[0094] For example, when the starting height position HTS of the mapping is used as a reference (see Figure 11), the control unit 71 counts pulses from the starting height position HTS to obtain the downward movement amount MV1 (= movement amount per pulse × number of pulses) from the starting height position HTS to the signal minimum value MNB1. The control unit 71 can also obtain the height position HT1 of the substrate W1 corresponding to the signal minimum value MNB1 of the valley VB1 from the starting height position HTS and the movement amount MV1.

[0095] Furthermore, for example, in the case of valley VB2, the height position HT2 of substrate W2 corresponding to the signal minimum MNB2 is obtained. By counting the pulses between the signal minimum MNB1 of valley VB1 and the signal minimum MNB2 of the next valley VB2, the amount of movement (distance) MV2 between two adjacent substrates W1 and W2 is obtained. Similarly, for the remaining 23 valleys VB3 to VB25, the height positions HT3 to HT25 of the 23 substrates W corresponding to the signal minimums MNB3 to MNB25 are obtained.

[0096] The signal waveform and signal value output from the first mapping sensor 27 correspond to the first signal waveform and first signal value of the present invention. The signal waveform and signal value output from the second mapping sensor 28 correspond to the second signal waveform and second signal value of the present invention. Valley VA1 corresponds to the first valley of the present invention. Valley VB1 corresponds to the second valley of the present invention. The section in which the signal value of valley VA1 is less than or equal to the threshold SKA corresponds to the first width of the present invention. The section in which the signal value of valley VB1 is less than or equal to the threshold SKB corresponds to the second width of the present invention.

[0097] [Step S04] Is the clearance above the standard value? Next, the control unit 71 calculates clearances CL1 to CL24 for the 25 substrates W and determines whether each of the clearances CL1 to CL24 is equal to or greater than a preset reference value. Clearances CL1 to CL24 (clearance CL) are the sum of the clearances between substrate WC and the hand 41 and between substrate WD and the hand 41, assuming that the hand 41 is placed between substrate WC and substrate WD, as shown in Figure 14.

[0098] First, let's explain how to calculate clearances CL1 to CL24. When clearances CL1 to CL24 are not specifically distinguished, they are referred to simply as "Clearance CL".

[0099] Figure 14 is a side view showing the method for calculating clearance CL. Clearance CL is calculated using either equation (1) or equation (2) below. Clearance CL = (Height position of board WC HT - Thickness of board WC TK ÷ 2) - (Height position of board WD HT + Thickness of board WD TK ÷ 2) - Thickness of hand 41 HH ... (1) Clearance CL = (Height position of the bottom surface of board WC - Height position of the top surface of board WD) - Thickness HH of hand 41 ... (2)

[0100] Here, the two circuit boards WC and WD are two circuit boards that are adjacent to each other vertically. Circuit board WC is housed in slot SL(n) (for example, slot SL25) within carrier C. Circuit board WD is housed in slot SL(n-1) (for example, slot SL24), which is located one slot below slot SL(n). Note that "n" is a natural number greater than or equal to 2.

[0101] The control unit 71 calculates the total clearance CL1 between the board W1 and the hand 41, and between the board W2 and the hand 41, assuming that the hand 41 is positioned between the two boards W1 and W2, using equation (1) or equation (2) above. In the same manner, 23 clearances CL2 to CL24 are calculated.

[0102] Next, the control unit 71 determines whether each of the 24 calculated clearances CL1 to CL24 is equal to or greater than a preset reference value. If at least one of the 24 clearances CL1 to CL24 is less than the reference value, the process proceeds to step S05. If all 24 clearances CL1 to CL24 are equal to or greater than the reference value, the process proceeds to step S06.

[0103] In this embodiment, each substrate W corresponds to the substrate of the present invention and the first substrate. When the substrate of the present invention is substrate W1, substrate W2 corresponds to the second substrate of the present invention. Also, when substrate W1 is housed in slot SL25, slot SL24 in which substrate W2 is housed corresponds to the second slot of the present invention.

[0104] [Step S05] Stop transporting the circuit board and trigger an alarm. The control unit 71 controls the transport robot IR to prevent it from removing any of the substrates W from the carrier C if at least one of the 24 clearances CL is smaller than a preset reference value. In other words, it stops the transport robot IR from removing any of the substrates W from the carrier C. If the clearance CL is small, when the hand 41 is inserted between two substrates W, the hand 41 may come into contact with at least one of the two substrates W, potentially damaging that substrate W.

[0105] Furthermore, if at least one of the 24 clearances CL1 to CL24 is smaller than a preset reference value, the control unit 71 will cause the notification unit 75 to notify that clearance C is smaller than the reference value. For example, this will be done by sounding a buzzer or flashing a lamp. This allows the operator to know that clearance CL is smaller than the reference value.

[0106] [Step S06] Insertion of the hand into the carrier and removal of the circuit board. If all 24 clearances CL1 to CL24 are above the standard value, the transport robot IR uses the hand 41 to insert the hand 41 between, for example, two substrates W1 and W2 in the carrier C placed on the stage 9. In this explanation, the substrates W are assumed to be formed in a bowl shape with a recess on the lower side.

[0107] First, the control unit 71 calculates the curvature height position HR of the lower surface of the substrate W in order to calculate the insertion height position IH of the hand 41. An example will be described where the hand 41 is inserted between two substrates W1 and W2 to remove substrate W1.

[0108] Figure 15(a) is a plan view showing the substrate W1 within the carrier C, the first measurement point MP1 and the second measurement point MP2 by the two mapping sensors 27 and 28, and the hand 41 as assumed to be inserted into the carrier C. Figure 15(b) is a view taken along the EE arrow in Figure 15(a). Figure 15(c) is a view taken along the FF arrow in Figure 15(a).

[0109] The control unit 71 acquires a quadratic curve CE1 along the inward / outward direction TD of the warp of the lower surface of the substrate W1, based on the amount of warp SA1 at the first measurement point MP1 and the amount of warp SB1 (thickness TK1) at the second measurement point MP2.

[0110] The cross-sectional shape of the warp can be approximated by a quadratic curve. Therefore, the constants of the quadratic curve are calculated from the warp amounts SA1 and SB1. Since there are three constants for the quadratic curve, it is difficult to obtain the quadratic curve using only two measurement points. However, assuming that the warp amount is maximum at the center CT of substrate W1, a quadratic curve (for example, y = a × x^2 + b) can be obtained using the two measurement points (i.e., warp amounts SA1 and SB1). This allows us to obtain the quadratic curve CE1 (warp shape) shown in Figure 15(b).

[0111] Since the curvature of the substrate W1 is a rotational body shape around an axis extending in the Z direction, the quadratic curve CF1 (cross-sectional shape) shown in Figure 15(c) has the same shape as the quadratic curve CE1 (cross-sectional shape) shown in Figure 15(b). Therefore, the control unit 71 processes the quadratic curve CF1 along the width direction (Y direction) of the curvature as being the same curve as the quadratic curve CE1. Then, assuming that the hand 41 is inserted below the substrate W1 (i.e., between the two substrates W1 and W2), the control unit 71 calculates the curvature height position HR1 on the bottom surface of the substrate W1 where the clearance between the bottom surface of the substrate W1 and the hand 41 is narrowest, based on the quadratic curve CF1. The position on the bottom surface of the substrate W1 where the clearance between the substrate W1 and the hand 41 is narrowest corresponds to the hand position HP.

[0112] Here, the hand position HP is the two inner ends of the two finger portions 41A and 41B of the hand 41, as shown in Figures 15(c) and 16. Therefore, for example, the control unit 71 calculates the amount of curvature BW1 of one of the hand positions HP from the quadratic curve CF1. Then, the control unit 71 calculates the curvature height position HR1 (HR) using, for example, the following equation (3). Warpage height position HR = Height position HT of substrate WC + (Thickness TK of substrate WC ÷ 2) - Warpage amount BW = Height position TF of top surface of substrate WC - Warpage amount BW …(3)

[0113] Similarly to substrate W1, the remaining 24 substrates W also have 24 quadratic curves CE2-CE25 (24 quadratic curves CF2-CF25), 24 warp amounts BW2-BW25, and 24 warp height positions HR2-HR25 calculated.

[0114] When there is no particular distinction between the 25 curvature amounts BW1 to BW25, they will be written as "Curvature Amount BW". When there is no particular distinction between the 25 curvature height positions HR1 to HR25, they will be written as "Curvature Height Position HR".

[0115] Next, the control unit 71 calculates the insertion height position IH of the hand 41 for removing the substrate W, as shown in Figure 16. The insertion height position IH is a height position that takes into account the curvature of the substrate W. Figure 16 is a diagram illustrating the method for calculating the insertion height position IH of the hand 41 to be inserted between two vertically adjacent substrates WC and WD. In Figure 16, the symbol H0 indicates that the height position HT is 0 (zero). The control unit 71 calculates the insertion height position IH of the hand 41 between substrates WC and WD using the following equation (4). Insertion height position IH = (Warp height position HR of substrate WC + Height position TF of the top surface of substrate WD) ÷ 2 …(4)

[0116] The control unit 71 calculates the insertion height position IH1 of the hand 41 for removing the substrate W1. Similarly, the control unit 71 calculates 23 insertion height positions IH2 to IH23 of the hand 41 for removing the 23 substrates W2 to W24 from slots SL2 to SL24.

[0117] In slot SL1, the hand 41 is not inserted between the two circuit boards W. Also, for example, circuit board WC may be stored in slot SL(n), but no circuit board W may be stored in the slot SL(n-1) one position below it. In these cases, as shown in Figure 17, the control unit 71 calculates the insertion height position IH24(IH), which is a height position that is a preset distance KY downward from the warp height position HR of the circuit board W.

[0118] Next, the control unit 71 calculates the removal height position TR of the substrate W, as shown in Figure 18. For example, the removal height position TR is calculated so that clearance G and clearance H are the same. Clearance G is the clearance between the top surface of slot SL(n) (e.g., slot SL25) and the top surface of substrate W. Clearance H is the clearance between the bottom surface of substrate W and the mounting surface of slot SL(n).

[0119] Specifically, the control unit 71 calculates the extraction height position TR using the following equation (5). Extraction height position TR = Height position HT of board WC - (Thickness TK of board WC ÷ 2) + (Slot height ST ÷ 2) = Height position BF of the bottom surface of board WC + (Slot height ST ÷ 2) ... (5)

[0120] The slot height ST is a preset value. For example, the lower limit of the SEMI (Semiconductor Equipment and Materials International) standard (6 mm) is used as the slot height ST. The control unit 71 calculates the removal height position TR1 of the substrate W1 using equation (5). In addition, the control unit 71 calculates the 24 removal height positions TR2 to TR25 for the 24 substrates W1 to W25, similar to the removal height position TR1.

[0121] After calculating the insertion height positions IH (IH1 to IH25) and the removal height positions TR (TR1 to TR25), the control unit 71, for example, uses the calculated insertion height position IH1 to have the transport robot IR insert the hand 41 into the carrier C in order to remove the substrate W1 from the carrier C. That is, the control unit 71 positions the hand 41 at the calculated insertion height position IH1 and has the transport robot IR insert the hand 41 into the carrier C. This allows the hand 41 to be inserted into the carrier C while taking into account the curvature of the substrate W1. Therefore, it is possible to prevent the hand 41 from coming into contact with the substrate W1.

[0122] Subsequently, the transport robot IR raises the hand 41 so that the substrate W1 is positioned at the retrieval height position TR1 corresponding to the substrate W1. This allows the hand 41 to hold the substrate W1. Then, the transport robot IR removes the substrate W1 from the carrier C while positioning it at the retrieval height position TR1. This allows the substrate W1 to be removed from the carrier C without contacting the shelves 15, 16, etc. inside the carrier C. After that, the transport robot IR transports the substrate W1 to the substrate mounting section PS. In the same manner as transporting the substrate W1, the transport robot IR sequentially transports the remaining 24 substrates W2 to W25 from the carrier C to the substrate mounting section PS.

[0123] [Step S07] Substrate processing The central robot CR removes the substrate W1 from the substrate mounting section PS and transports it to the processing unit 51. The processing unit 51 performs pre-set processing on the substrate W1 transported by the transport robot IR and the central robot CR. The central robot CR returns the substrate W1 processed by the processing unit 51 to the substrate mounting section PS. The remaining 24 substrates W are also transported by the central robot CR and processed by the processing unit 51.

[0124] [Step S08] Transport of the substrate to the carrier and transport of the carrier from the stage. The transport robot IR removes the substrate W1 from the substrate mounting section PS. Then, the transport robot IR transports the substrate W1 to the slot SL25 of the carrier C mounted on the stage 9, positioning the substrate W1 at the corresponding removal height position TR1. At this time, the hand 41 is still holding the substrate W1. Next, the transport robot IR lowers the hand 41 so that it is positioned at the insertion height position IH1. As a result, the substrate W1 is placed in the slot SL25. At this time, the hand 41 is no longer holding any of the substrates W. Subsequently, the control unit 71 removes the hand 41 from the carrier C while positioning the hand 41 at the insertion height position IH1.

[0125] Subsequently, similar to the process with substrate W1, the transport robot IR sequentially removes the remaining 24 substrates W from the substrate mounting section PS and places them in slots SL2 to SL25 of the carrier C.

[0126] After the 25 substrates W are placed in the carrier C, the lid attachment / detachment unit 11 attaches the lid 17, which is held by the shutter unit 19, to the carrier C (container 13), and closes the passage opening 7B with the shutter unit 19. Then the shutter unit 19 releases its hold on the lid 17. After that, the carrier C is transported from stage 9 of the load port 5 to the next destination.

[0127] In this embodiment, the light-emitting section 27A and the light-receiving section 27B of the first mapping sensor 27 are arranged to face each other via a first measurement point MP1. Similarly, the light-emitting section 28A and the light-receiving section 28B of the second mapping sensor 28 are arranged to face each other via a second measurement point MP2. The first mapping sensor 27 can measure the amount of warpage SA of the substrate W, and the second mapping sensor 28 can measure the amount of warpage SB of the substrate W. Therefore, the warpage shape of the substrate W can be obtained based on the amount of warpage SA and the amount of warpage SB of the substrate W.

[0128] Furthermore, the second measurement point MP2 is positioned closer to the outer edge of the substrate W than the first measurement point MP1. Therefore, the second mapping sensor 28 can measure the thickness TK (warpage amount SB) of the substrate W while suppressing the effects of warpage.

[0129] Furthermore, a transport robot IR equipped with a hand 41 for holding the substrate W is provided. The transport robot IR can transport the substrate W from the carrier C based on the curvature shape of the substrate W.

[0130] Furthermore, based on the warp amounts SA and SB, the warp shape of the lower surface of the substrate W, which is recessed on the lower side, is obtained (estimated). Therefore, for example, it is possible to calculate the warp height position HR1 of the lower surface of the substrate W1 at which the clearance between the lower surface of the substrate W1 and the hand 41 is narrowest.

[0131] Furthermore, for example, in order to insert the hand 41 between two substrates W1 and W2, the insertion height position IH1 of the hand 41 can be calculated based on the curvature height position HR1 of the lower surface of substrate W and the height position TF of the upper surface of substrate W. This insertion height position IH1 of the hand 41 takes into account the curved shape that is recessed on the lower side of substrate W1. Therefore, it is possible to prevent the hand 41 from contacting either of the two substrates W1 or W2 and damaging either of them.

[0132] Furthermore, consider a case where, for example, a circuit board W1 is stored in slot SL25, and no circuit board W is stored in slot SL24, which is one slot below slot SL25, or where a circuit board W is stored in slot SL1. In this case, for example, in order to insert a hand 41 below circuit board W1, the insertion height position IH1 of the hand 41 can be calculated based on the curvature height position SA1 of the lower surface of circuit board 41. This insertion height position IH1 takes into account the curved shape that is recessed on the lower side of circuit board W1. Therefore, it is possible to prevent the hand 41 from contacting circuit board W1 and damaging it.

[0133] Furthermore, the control unit 71 obtains the height position HT1 of the substrate W1 from, for example, the minimum value MNB1 of the valley VB1. For example, the height position HT1 of the substrate W1 may be obtained by measuring two height positions on the top and bottom surfaces of the substrate W1, and then calculating the center position of the two height positions. In this case, two measurement operations for the two heights and a calculation operation for the center position are required to obtain the height position HT1 of the substrate W1. According to this embodiment, since the height position HT1 corresponding to the minimum value MNB1 of the valley VB1 is measured by the rotary encoder 25, the height position HT1 of the substrate W1 can be obtained in a single measurement operation. [Examples]

[0134] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiment 1 will be omitted. Figure 19 is a diagram illustrating the method for calculating the insertion height position IH of the two hands 41 and 42 according to Embodiment 2.

[0135] In Example 1, the transport robot IR was equipped with a single hand 41. In contrast, in Example 2, the transport robot IR is equipped with two hands 41 and 42.

[0136] In the substrate processing apparatus 1 of Embodiment 2, the transport robot IR is equipped with two hands 41 and 42. Each of the two hands 41 and 42 holds one substrate W in a horizontal position. Therefore, the transport robot IR can transport two substrates W simultaneously. The two hands 41 and 42 are arranged at a preset distance KK (e.g., 10 mm) and in the vertical direction (Z direction). The two hands 41 and 42 are moved integrally by the transport robot IR.

[0137] In Figure 19, it is assumed that the carrier C contains multiple circuit boards W, including, for example, three boards W1, W2, and W3. Board W1 is housed in, for example, slot SL25. Board W2 is housed in slot SL24, one slot below slot SL25. Board W3 is housed in slot SL23, one slot below slot SL24.

[0138] Next, the method for calculating the insertion height position IH of the hands 41 and 42 will be explained with reference to steps S03 and S06 in Figure 9. Refer to Figure 12(a). The control unit 71 uses the rotary encoder 25 to measure the section in the first signal waveform output from the first mapping sensor 27 where the signal values ​​of the two valleys VA1 and VA2 corresponding to the two substrates W1 and W2 are below the threshold SKA. That is, the control unit 71 counts the pulses from the rotary encoder 25 within the section where the values ​​are below the threshold SKA. As a result, the control unit 71 obtains the two warp amounts SA1 and SA2 of the two substrates W1 and W2.

[0139] Refer to Figure 12(b). The control unit 71 uses the rotary encoder 25 to measure the section in the second signal waveform output from the second mapping sensor 28 where the signal values ​​of the three valleys VB1, VB2, and VB3 corresponding to the three substrates W1, W2, and W3 are below the threshold SKB. As a result, the control unit 71 obtains the three warp amounts SB1, SB2, and SB3 (three thicknesses TK1, TK2, and TK3) of the three substrates W1, W2, and W3. The control unit 71 also obtains the three height positions HT1, HT2, and HT3 of the three substrates W1, W2, and W3.

[0140] Refer to Figures 15(b) and 15(c). Subsequently, the control unit 71 obtains a quadratic curve CE1 along the inlet / outlet direction TD of the warp of the lower surface of the substrate W1, based on the warp amount SA1 at the first measurement point MP1 and the warp amount SB2 at the second measurement point MP2. Subsequently, the control unit 71 assumes that the quadratic curve CF1 along the width direction (Y direction) of the warp of the lower surface of the substrate W1 is the same curve as the quadratic curve CE1. Subsequently, the control unit 71 calculates the warp height position HR1 of the lower surface of the substrate W1 where the clearance between the substrate W1 and the hand 41 is narrowest, assuming that the hand 41 is inserted below the substrate W1, based on the quadratic curve CF1 (see Figures 15(c), 16, and 19).

[0141] Similarly, the control unit 71 obtains a quadratic curve CE2 along the in / out direction TD of the warp of the lower surface of the substrate W2 based on the warp amount SA2 at the first measurement point MP1 and the warp amount SB2 at the second measurement point MP2. Subsequently, it assumes that the quadratic curve CF2 along the width direction (Y direction) of the warp of the lower surface of the substrate W2 is the same curve as the quadratic curve CE2. Then, assuming that the band 42 is inserted below the substrate W2, the control unit 71 calculates the warp height position HR2 on the lower surface of the substrate W2 where the clearance between the substrate W2 and the hand 42 is narrowest, based on the quadratic curve CF2 (Figures 15(c), 16, and 19).

[0142] Subsequently, the control unit 71 calculates the insertion height of the two hands 41 and 42 between the substrate W and the substrate W3 using the following equation (6). Insertion height position IH = ((Warp height position HR1 of substrate W1 + Height position TF of the top surface of substrate W2) ÷ 2 + (Warp height position HR2 of substrate W2 + Height position TF of the top surface of substrate W3) ÷ 2) ÷ 2 … (6)

[0143] Here, the height position TF of the top surface of substrate W2 is calculated by the following equation (7). Also, the height position TF of the top surface of substrate W3 is calculated by the following equation (8). The height position TF of the top surface of circuit board W2 = height position HT2 of circuit board W2 + thickness TK2 ÷ 2 of circuit board W2 ... (7) The height position TF of the top surface of circuit board W3 = height position HT3 of circuit board W3 + thickness TK3 of circuit board W3 ÷ 2 ... (8)

[0144] The control unit 71 uses the calculated insertion height position IH to cause the transport robot IR to insert two hands 41 and 42 into the carrier C in order to remove the two substrates W1 and W2 from the carrier C. Similarly, when removing the two substrates W3 and W4, the insertion height position IH for the two hands 41 and 42 is calculated in the same way as with the two substrates W1 and W2.

[0145] According to this embodiment, for example, the curvature shape of the lower surfaces of the two indented substrates W1 and W2 is obtained based on the curvature amounts SA1 (first curvature amount), SB1 (second curvature amount), SA2 (third curvature amount), and SB2 (fourth curvature amount). Therefore, the curvature height position HR1 of the lower surface of substrate W1, where the clearance between the lower surface of substrate W1 and the hand 41 is narrowest, can be calculated. Similarly, the curvature height position HR2 of the lower surface of substrate W2, where the clearance between the lower surface of substrate W2 and the hand 42 is narrowest, can be calculated.

[0146] Furthermore, for example, in order to insert a hand 41 between substrates W1 and W2, and a hand 42 between substrates W2 and W3, the insertion height IH of the two hands 41 and 42 can be calculated based on the curvature height position HR1 (first curvature height position) of the lower surface of substrate W1 and the curvature height position HR2 (second curvature height position) of substrate W2. The insertion height IH of the two hands 41 and 42 takes into account the curved shape that is recessed on the lower side of each of the substrates W1 and W2. Therefore, it is possible to prevent the two hands 41 and 42 from contacting any of the three substrates W1 to W3 and damaging any of the three substrates W1 to W3. [Examples]

[0147] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 and 2 will be omitted.

[0148] Figure 20(a) shows the first signal waveform output from the first mapping sensor 27. Figure 20(b) shows the second signal waveform output from the second mapping sensor 28. Figure 20(c) shows the pulse output from the rotary encoder 25. Figure 21(a) is a view from arrow EE in Figure 15(a). Figure 21(b) is a view from arrow FF in Figure 15(a). Figure 22 is a diagram illustrating the method for calculating the insertion height position IH of the hand 41 according to Embodiment 3.

[0149] In Example 1, the control unit 71 calculated the insertion height IH of the hand 41 for a bowl-shaped substrate W that is recessed on the lower side. In contrast, in Example 3, the control unit 71 calculates the insertion height IH of the hand 41 for an umbrella-shaped substrate W that is recessed on the upper side.

[0150] In Example 3, the operation of inserting a hand 41 between substrate W1 and umbrella-shaped substrate W2 in order to remove the umbrella-shaped substrate W1 will be described. Substrate W2 is housed in slot SL24, and substrate W1 is housed in slot SL25, which is one slot above slot SL24.

[0151] First, the control unit 71 causes the lid attachment / detachment unit 11 to perform mapping, as shown in Figure 11. As a result, the first mapping sensor 27 outputs the first signal waveform shown in Figure 20(a). The second mapping sensor 28 also outputs the second signal waveform shown in Figure 20(b).

[0152] In Figure 20(a), the code TT of valley VA2 corresponds to time t1, and the code TB of valley VA2 corresponds to time t2. Also, in Figure 20(b), the code TT of valley VB2 corresponds to time t3, and the code TB of valley VB2 corresponds to time t4. Here, the difference value (absolute value) between time t1 and time t3 for code TT is greater than the difference value (absolute value) between time t2 and time t4 for code TB. Therefore, the control unit 71 determines, based on these two difference values, that the substrate W2 has an umbrella-shaped warp with an upward indentation.

[0153] Note that the code TT corresponds to the height position TF on the upper surface of the substrate W, and the code TB corresponds to the height position BF on the lower surface of the substrate W. Furthermore, the control unit 71 may determine that the substrate W has a bowl-shaped warp with a downward indentation if the difference value (absolute value) between time t2 and time t4 related to code TB is greater than the difference value (absolute value) between time t1 and time t3 related to code TT.

[0154] Next, the control unit 71 calculates the warp height position HR on the upper surface of the substrate W2. Based on the warp amount SA2 at the first measurement point MP1 and the warp amount SB2 at the second measurement point MP2, the control unit 71 obtains a quadratic curve CE2 (warp shape) along the in / out direction TD of the warp on the upper surface of the substrate W2.

[0155] Since the curvature shape of the upper surface of the substrate W2 is a rotational shape, the quadratic curve CF2 (cross-sectional shape) shown in Figure 21(b) has the same shape as the quadratic curve CE2 (cross-sectional shape) shown in Figure 21(a). Therefore, the control unit 71 processes the quadratic curve CF2 along the width direction (Y direction) of the curvature as being the same curve as the quadratic curve CE2.

[0156] Refer to Figures 21(b) and 22. Subsequently, the control unit 71 calculates the warp height position HR2 of the upper surface of substrate W2 at which the clearance between substrate W2 and hand 41 is narrowest, assuming that the hand 41 is inserted above substrate W2 (i.e., between the two substrates W1 and W2), based on the quadratic curve CF2. Specifically, the control unit 71 calculates the amount of warp BW2 corresponding to the hand position HP from the quadratic curve CF2. Then, the control unit 71 calculates the warp height position HR2 of substrate W2 using, for example, the following equation (9). Warp height position HR2 = (Height position of substrate W2 HT2 - (Thickness of substrate W2 TK2 ÷ 2)) + Warp amount BW2 = Height position of the bottom surface of substrate W2 BF + Warp amount BW2 …(9)

[0157] Next, as shown in Figure 22, the control unit 71 calculates the insertion height position IH1 for the hand 41 to remove the substrate W1. The insertion height position IH1 is a height position that takes into account the curvature of the substrate W2. The control unit 71 calculates the insertion height position IH1 of the hand 41 between the substrate W1 and the substrate W2 using the following equation (10). Insertion height position IH1 = (Height position BF of the bottom surface of substrate W1 + Warpage height position HR2 of substrate W2) ÷ 2 ... (10)

[0158] This calculates the insertion height position IH1 for the hand 41 between the two substrates W1 and W2. The control unit 71 uses the calculated insertion height position IH1 to move the hand 41 into the carrier C using the transport robot IR in order to remove substrate W1 from the carrier C. That is, the transport robot IR inserts the hand 41 into the carrier C while positioning it at the insertion height position IH1. Then, the transport robot IR raises the hand 41 to the removal height position TR1, thereby picking up substrate W1 with the hand 41. After that, the transport robot IR removes substrate W1 from the carrier C while positioning the hand 41 at the removal height position TR1.

[0159] In this embodiment, each substrate W corresponds to the substrate of the present invention and the first substrate. When the substrate of the present invention is substrate W2, substrate W1 corresponds to the second substrate of the present invention. Also, when substrate W1 is housed in slot SL24, slot SL25, in which substrate W2 is housed, corresponds to the second slot of the present invention.

[0160] According to this embodiment, for example, the curvature shape of the upper surface of the substrate W2, which is recessed upwards, is obtained based on the curvature amount SA2 and the curvature amount SB2. Therefore, the curvature height position SA2 of the upper surface of the substrate W2, where the clearance between the substrate W2 and the hand 41 above it is narrowest, can be calculated.

[0161] Furthermore, in order to insert the hand 41 between the upper substrate W1 and the lower substrate W2, the insertion height position IH1 of the hand 41 can be calculated based on the height position BF of the lower surface of substrate W1 and the curvature height position HR2 of the upper surface of substrate W2. This insertion height position IH1 of the hand 41 takes into account the curved shape that is recessed on the upper side of substrate W2. Therefore, it is possible to prevent the hand 41 from contacting either of the two substrates W1 or W2 and damaging either of them.

[0162] The present invention is not limited to the above embodiments and can be modified and implemented as follows.

[0163] (1) In the above-described embodiment, the control unit 71 obtained the height position of the substrate W by measuring the height position corresponding to the minimum value of the signal at the trough VB of the second signal waveform using the rotary encoder 25. Here, the measurement resolution of the height position depends on the resolution of the rotary encoder 25. Therefore, the measurement resolution can be increased by increasing the resolution of the rotary encoder 25. However, generally, high-resolution rotary encoders 25 are relatively expensive.

[0164] Therefore, for example, when mapping is being performed, the control unit 71 counts the number of pulses output from the rotary encoder 25 within a certain period of time and measures the frequency. Then, the control unit 71 calculates the movement speed IC (increasing gradient) by multiplying the measured frequency by the amount of movement per pulse (distance (unit: μm)). This movement speed IC is the vertical movement speed (Z direction) of the light-emitting units 27A, 28A and the light-receiving units 27B, 28B.

[0165] Refer to Figure 23. For example, when the minimum value MNB1 of the valley VB1 is located between the first reference point P1 of the first pulse PL1 output continuously from the rotary encoder 25 and the second reference point P2 of the second pulse PL2, the control unit 71 obtains the difference value DF (= mapping time T2 - pulse time T1) between the pulse time T1 corresponding to the first reference point P1 of the first pulse PL1 and the mapping time T2 corresponding to the minimum value MNB1 of the valley VB1.

[0166] Subsequently, the control unit 71 acquires the internal distance DS2 from the first reference point P1 to the minimum value MNB1 of the valley VB1 by integrating the difference value DF into the movement speed ICs of the light-emitting units 27A, 28A and the light-receiving units 27B, 28B. For example, the control unit 71 uses the internal distance DS2 when acquiring the height position of the substrate W1. For example, when acquiring the height position of the substrate W from the amount of movement between a preset height position P0 (for example, the starting height position HTS shown in Figure 11) and the minimum value MNB1 of the valley VB1, the control unit 71 calculates the distance (amount of movement) DS1 by counting the number of pulses (including the first pulse) included between the preset height position P0 and the minimum value MNB1 of the valley VB1. Then, the control unit 71 acquires the amount of movement between the first reference point P1 and the minimum value MNB1 of the first pulse PL1, i.e., the internal distance DS2. This allows for measuring distance (distance DS1 + internal distance DS2) with a higher resolution than that of the rotary encoder 25.

[0167] This modified example can be applied not only to the measurement of the minimum value MNB1 of the height position HT of the substrate W, but also to the measurement of the warpage amount SA (code TT and code TB) and the warpage amount SB (code TT and code TB) of the substrate W.

[0168] (2) In the embodiments and modifications described above, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B were moved linearly in the front-rear direction (X direction) by the sensor moving unit 29. In this respect, as shown in Figure 24, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B may be rotated around a horizontal axis AX5 extending in the width direction by the sensor moving unit 80. The sensor moving unit 80 comprises an arm 81 and a drive unit 83. The tip 81A of the arm 81 fixes the sensor support member 31 that supports the light-emitting unit 27A, etc.

[0169] Furthermore, a drive unit 83 is provided at the base end 81B of the arm 81, which is located on the opposite side of the tip end 81A via the horizontal axis AX5. The drive unit 83 causes the base end 81B to rotate around the horizontal axis AX5, thereby rotating the light-emitting units 27A, 28A and the light-receiving units 27B, 28B around the horizontal axis AX5. This may move the light-emitting units 27A, 28A and the light-receiving units 27B, 28B between a standby position and a detection position. The drive unit 83 includes, for example, an air cylinder or a linear actuator including an electric motor.

[0170] Furthermore, as shown in Figure 25, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B may each be moved by the sensor movement unit 90. The sensor movement unit 90 comprises horizontally extending arms 91, 92 and a drive unit 95. The light-emitting units 27A, 28A are attached to arm 91, and the light-receiving units 27B, 28B are attached to arm 92. The drive unit 95 comprises an electric motor. The drive unit 95 rotates the light-emitting units 27A, 28A around the vertical axis AX7 via arm 91. The drive unit 95 also rotates the light-receiving units 27B, 28B around the vertical axis AX8 via arm 92. As a result, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B are moved between a standby position and a detection position.

[0171] (3) In the embodiments and modifications described above, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B moved together with the shutter unit 19. However, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B may move independently of the shutter unit 19.

[0172] (4) In the embodiments and modifications described above, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B are provided on the lid attachment / detachment unit 11. In this regard, the light-emitting units 27A, 28A and the light-receiving units 27B, 28B may be provided, for example, at the tip of the hand 41 or articulated arm 43 of the transport robot IR.

[0173] (5) In the embodiments and modifications described above, the lid attachment / detachment unit 11 is equipped with two mapping sensors 27 and 28. However, the lid attachment / detachment unit 11 may be equipped with a single mapping sensor 27 instead of the mapping sensor 28. In this case, the control unit 71 performs two mapping operations.

[0174] Refer to Figure 26. The control unit 71 performs the first mapping. At this time, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B of the mapping sensor 27 in the in / out direction TD from the standby position shown in Figure 6 to the first detection position using the shutter extension / retraction unit 21. Specifically, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B using the shutter extension / retraction unit 21 so that, in a plan view, the light-emitting unit 27A and the light-receiving unit 27B face each other via a first measurement point MP1 set between the center CT and the edge ED of the first substrate in a straight line LNE (see Figure 7).

[0175] Subsequently, when the mapping sensor 27 is activated, the control unit 71 moves the light-emitting unit 27A, the light-receiving unit 27B, and the sensor support member 31 using the shutter lifting unit 23 so that the optical axis LT1 from the light-emitting unit 27A to the light-receiving unit 27B passes through multiple substrates W in the carrier C. As a result, the mapping sensor 27 outputs the first signal waveform shown in Figure 12(a). The rotary encoder 25 also outputs the pulse shown in Figure 12(c).

[0176] Subsequently, the control unit 71 performs a second mapping. At this time, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B in the in / out direction TD from the first detection position to the second detection position using the shutter extension / retraction unit 21. Specifically, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B using the shutter extension / retraction unit 21 so that, in a plan view, the light-emitting unit 27A and the light-receiving unit 27B face each other on a straight line LNE, via a second measurement point MP2 set between the first measurement point MP1 and the end ED.

[0177] Subsequently, when the mapping sensor 27 is activated, the control unit 71 moves the light-emitting unit 27A, the light-receiving unit 27B, and the sensor support member 31 using the shutter lifting unit 23 so that the optical axis LT1 from the light-emitting unit 27A to the light-receiving unit 27B passes through multiple substrates W in the carrier C. As a result, the mapping sensor 27 outputs the second signal waveform shown in Figure 12(b). The rotary encoder 25 also outputs the pulse shown in Figure 12(c).

[0178] In this way, the first and second signal waveforms can be acquired at two different locations in the inlet / outlet direction TD. The order of the two mappings and the direction of each mapping are not limited.

[0179] (6) In the embodiments and modifications described above, the second mapping sensor 28 was used to measure the height position of the substrate W. In this regard, the first mapping sensor 27 may also be used to measure the height position of the substrate W.

[0180] (7) In the embodiments and modifications described above, the control unit 71 obtained the height position HT1 of the substrate W1 from the time of the minimum value MNB1 of the valley VB1, for example. In this regard, the control unit 71 may obtain two height positions of the upper and lower surfaces of the substrate W1 from the symbols TT and TB of the valley VB1, for example, and obtain the midpoint of these two height positions as the height position HT1 of the substrate W1.

[0181] (8) In the embodiments and modifications described above, the substrate processing apparatus 1 is equipped with a control unit 71. The load port 5 or the transport robot IR may be equipped with a second control unit. The second control unit is equipped with one or more processors, such as a central processing unit (CPU). The second control unit is able to communicate with the control unit 71. The second control unit controls the respective components of the load port 5 and the transport robot IR. At least one of the control unit 71 and the second control unit corresponds to the control unit of the present invention.

[0182] Furthermore, the load port 5 or the transport robot IR may have a second storage unit in addition to the second control unit. The second storage unit may include, for example, at least one of ROM, RAM, and a hard disk. The second storage unit is capable of communicating with the second control unit. The second storage unit stores computer programs necessary to control the various components of the load port 5 and the transport robot IR. The storage unit 73 also stores various operations.

[0183] (9) In the embodiments and modifications described above, the substrate processing apparatus 1 (including the load port 5) measured the amount of warpage SA at the first measurement point MP1 and the amount of warpage SB at the second measurement point MP2 using two mapping sensors 27 and 28. In this regard, the substrate processing apparatus 1 (including the load port 5) may use three or more mapping sensors to measure three or more amounts of warpage at each of three or more measurement points. The control unit 71 may calculate the warpage shape of the substrate W based on these three or more amounts of warpage. The three or more pairs of light-emitting and light-receiving units of the three or more mapping sensors are provided on the sensor support member 31 at the same height relative to each other.

[0184] (10) In the embodiments and modifications described above, when mapping was performed, the shutter lifting unit 23 lowered the light-emitting units 27A, 28A and the light-receiving units 27B, 28B. In this regard, the shutter lifting unit 23 may raise the light-emitting units 27A, 28A and the light-receiving units 27B, 28B from bottom to top relative to the multiple substrates W. [Explanation of symbols]

[0185] 1 ... Substrate processing equipment 5… Load port IR… Transport robot 9… Stage 14…Aperture 23... Shutter lifting mechanism 25… Rotary encoder 27, 28 ... Mapping sensors 27A, 28A ... Light-emitting section 27B,28B … Light receiving section 31 ... Sensor support member 41, 42 ... Hand 47… Height sensor 51 ... Processing Unit 71 ... Control Unit 73 … Storage section TD… Direction of insertion / removal CT … center LNE … Straight line ED... End MP1… First measurement point MP2… Second measurement point S1 ... Signal value VA1~VA25 … Tanibe SA (SA1~SA25) ... Curvature VB1~VB25 … Tanibe MNB1~MNB25 … Minimum value TK (TK1~TK25) ... Thickness SB (SB1~SB25) ... Curve amount HT (HT1~HT25, HTS) ... Height position CE1~CE25 … Quadratic curve CF1~CF25 … Quadratic curve HP… Hand position BW1~BW25 ... Curvature HR1~HR25 ... Curve height position IH (IH1~IH24) ... Insertion height position TR(TR1~TR25) ... Take-out height position W(W1,W2,W3,WC,WD) ... Circuit board TF… Height position of the top surface BF… Height position of the bottom surface KY... distance IC … Movement speed PL1 ... First pulse PL2… Second pulse P1 … 1st reference point P2…Second reference point T1… Pulse time T2… Mapping time DF ... Difference value DS2 ... Internal distance division C... Career SL1~SL25 ... Slots SL(n) ... Slot SL(n-1) ... Slot

Claims

1. A circuit board transport device for loading and unloading circuit boards, A stage on which a carrier for housing the aforementioned substrate is placed, At least two mapping sensors, A sensor support member that supports the mapping sensor, A lifting mechanism for moving the sensor support member in the vertical direction, A height sensor for measuring the height position of the mapping sensor, It comprises a control unit and, The first mapping sensor among the mapping sensors has a first light-emitting unit and a first light-receiving unit arranged in a horizontal width direction perpendicular to the insertion / removal direction in which the substrate is inserted into and removed from the carrier through the opening of the carrier, The first light-emitting unit and the first light-receiving unit are arranged in a plan view so as to face each other via a first measurement point set between the center and the edge of the substrate, on a straight line extending from the center of the substrate housed in the carrier toward the opening along the insertion / removal direction, The second mapping sensor among the aforementioned mapping sensors is The device has a second light-emitting unit and a second light-emitting unit arranged in the width direction, The second light-emitting unit and the second light-receiving unit are arranged in a plan view so as to face each other on the straight line, with a second measurement point set between the first measurement point and the end. When the first mapping sensor and the second mapping sensor are operating, the control unit moves the sensor support member in the lifting unit so that the first optical axis from the first light-emitting unit toward the first light-receiving unit and the second optical axis from the second light-emitting unit toward the second light-receiving unit pass through the substrate in the carrier. The control unit measures the first curvature amount at the first measurement point by measuring the first width of the first valley in the first signal waveform output from the first mapping sensor, where the substrate blocks the first light from the first light-emitting unit and the first signal value becomes smaller, using the height sensor. The control unit measures the second curvature amount at the second measurement point by measuring the second width of the second valley in the second signal waveform output from the second mapping sensor, where the substrate blocks the second light from the second light-emitting unit and the second signal value becomes smaller, using the height sensor. The substrate transport device is characterized in that the control unit calculates the warp shape of the substrate based on at least the first warp amount and the second warp amount.

2. In the substrate transport apparatus according to claim 1, A substrate transport device comprising a transport robot equipped with a hand for holding the substrate, and further comprising the transport robot for using the hand to remove the substrate from the carrier placed on the stage.

3. In the substrate transport apparatus according to claim 2, The control unit obtains the curvature shape of the substrate, which is a first quadratic curve along the inlet / outlet direction of the curvature of the lower surface of the substrate, based on the first curvature amount at the first measurement point and the second curvature amount at the second measurement point. Assuming that the second quadratic curve along the width direction of the curvature is the same curve as the first quadratic curve, A substrate transport device characterized by calculating the position of the curvature height of the lower surface of the substrate at which the clearance between the substrate and the hand is narrowest, based on the second quadratic curve, assuming that the hand is inserted below the substrate.

4. In the substrate transport apparatus according to claim 3, The carrier has a first slot for housing the first substrate, which is the substrate, and a second slot for housing the second substrate, which is located one slot below the first slot. The control unit calculates the insertion height position of the hand between the first substrate and the second substrate using the following formula: The insertion height position = (the curvature height position of the lower surface of the first substrate + the height position of the upper surface of the second substrate) ÷ 2 The substrate transport apparatus is characterized in that the control unit uses the calculated insertion height position to cause the transport robot to insert the hand into the carrier in order to remove the first substrate from the carrier.

5. In the substrate transport apparatus according to claim 3, The carrier has a first slot for housing the first substrate, which is the substrate, and a second slot located one slot below the first slot, which does not house any substrates. The substrate transport device is characterized in that the control unit causes the transport robot to insert the hand into the carrier in order to remove the first substrate from the carrier, using an insertion height position which is a predetermined distance below the warp height position of the substrate.

6. In the substrate transport apparatus according to claim 2, The carrier has a first slot for housing the first substrate, which is the substrate, and a second slot for housing the second substrate, which is positioned one slot above the first slot. The control unit obtains the curvature shape of the substrate, which is a first quadratic curve along the inward / outward direction of the curvature of the upper surface of the first substrate, based on the first curvature amount at the first measurement point and the second curvature amount at the second measurement point. Assuming that the second quadratic curve along the width direction of the curvature is the same curve as the first quadratic curve, A substrate transport device characterized by calculating the position of the curvature height of the upper surface of the first substrate at which the clearance between the first substrate and the hand is narrowest, based on the second quadratic curve, assuming that the hand is inserted above the first substrate.

7. In the substrate transport apparatus according to claim 6, The control unit calculates the insertion height position of the hand between the second substrate and the first substrate using the following formula: The insertion height position = (height position of the lower surface of the second substrate + the curvature height position of the upper surface of the first substrate) ÷ 2 The substrate transport apparatus is characterized in that the control unit uses the calculated insertion height position to cause the transport robot to insert the hand into the carrier in order to remove the second substrate from the carrier.

8. In a substrate transport apparatus according to any one of claims 1 to 7, The second measurement point is set at the end of the substrate on the opening side of the carrier, The substrate transport apparatus is characterized in that the control unit measures the thickness of the substrate by measuring the second width of the second valley of the second signal waveform output from the second mapping sensor with the height sensor.

9. In a substrate transport apparatus according to any one of claims 1 to 7, The substrate transport apparatus is characterized in that the control unit obtains the height position of the substrate by measuring the height position corresponding to the minimum value of the second trough of the second signal waveform output from the second mapping sensor using the height sensor.

10. In the substrate transport apparatus according to claim 9, The control unit determines when the minimum value of the second valley is located between the first reference point of the first pulse and the second reference point of the second pulse, which are output continuously from the height sensor. The difference between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the second valley is obtained, and further, By integrating the difference value into the movement speed of the second light-emitting unit and the second light-receiving unit, the internal distance from the first reference point to the minimum value of the second valley is obtained. A substrate transport device characterized by using the internal distance when acquiring the height position of the substrate.

11. A substrate transport device according to claim 2, A substrate processing unit that processes the substrate transported by the transport robot, A substrate processing apparatus characterized by comprising:

12. A method for transporting substrates in a substrate transport device for loading and unloading substrates, The substrate transport device is A stage on which a carrier for housing the aforementioned substrate is placed, At least two mapping sensors, A sensor support member that supports the mapping sensor, A lifting mechanism for moving the sensor support member in the vertical direction, The system includes a height sensor for measuring the height position of the mapping sensor, The first mapping sensor among the mapping sensors has a first light-emitting unit and a first light-receiving unit arranged in a horizontal width direction perpendicular to the insertion / removal direction in which the substrate is inserted into and removed from the carrier through the opening of the carrier, The first light-emitting unit and the first light-receiving unit are arranged in a plan view so as to face each other via a first measurement point set between the center and the edge of the substrate, on a straight line extending from the center of the substrate housed in the carrier toward the opening along the insertion / removal direction, The second mapping sensor among the aforementioned mapping sensors is The device has a second light-emitting unit and a second light-emitting unit arranged in the width direction, The second light-emitting unit and the second light-receiving unit are arranged in a plan view so as to face each other on the straight line, with a second measurement point set between the first measurement point and the end. The substrate transport method is, A mapping step in which, when the first mapping sensor and the second mapping sensor are operating, the sensor support member is moved to the lifting unit so that the first optical axis from the first light-emitting unit toward the first light-receiving unit and the second optical axis from the second light-emitting unit toward the second light-receiving unit pass through the substrate in the carrier, A first warpage measurement step is performed by measuring the first width of the first valley in the first signal waveform output from the first mapping sensor, where the substrate blocks the first light from the first light-emitting unit and the first signal value becomes smaller, using the height sensor, thereby measuring the first warpage amount at the first measurement point. A first warp amount measurement step is performed by measuring the second width of the second valley in the second signal waveform output from the second mapping sensor, where the second light from the second light-emitting unit is blocked by the substrate and the second signal value becomes smaller, using the height sensor, thereby measuring the second warp amount at the second measurement point. A warp shape calculation step that calculates the warp shape of the substrate based on at least the first warp amount and the second warp amount, A substrate transport method characterized by comprising the following:

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