Composition, sheet-like material, laminate, method for manufacturing the composition, and chip-type multilayer electronic component

Abstract

Provided is a composition containing a glass transition temperature adjuster capable of improving the Tg of a binder resin. 【Solution means】A composition containing an inorganic powder, a binder resin, and a glass transition temperature adjuster, wherein the glass transition temperature adjuster contains a compound having a structure represented by the following general formula (1). TIFF2026058035000015.tif34156 (In general formula (1), R 1 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 4 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.)

Description

[Technical Field]

[0001] The present invention relates to compositions, sheet-like materials, laminates, methods for manufacturing compositions, and chip-type laminated electronic components. [Background technology]

[0002] Generally, ceramic green sheets for multilayer ceramic electronic components are manufactured by forming a sheet from a slurry of ceramic particles and a binder resin. For example, vinyl acetate resin can be used as the binder resin.

[0003] Plasticizers are sometimes added to slurries to improve moldability when forming them into sheets, and to improve adhesion when laminating the formed sheets. Adding plasticizers lowers the glass transition temperature (Tg) of the binder resin, thereby improving the plasticity of the slurry. Phthalates have been used as plasticizers for this purpose.

[0004] Patent Document 1 discloses a ceramic green sheet characterized by containing ceramic powder, a binder resin, a plasticizer added in a proportion exceeding the saturation amount relative to the binder resin, and a solvent, and discloses the use of a phthalate ester as the plasticizer. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2002-179925 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] When using the plasticizer described in Patent Document 1, the Tg of the binder resin decreases, but from the perspective of moldability and the like, there is a demand to increase the Tg of the binder resin (binding resin). Also, in Patent Document 1, the phthalic acid ester used as the plasticizer is a concern regarding the influence on human health, and there is a problem that the environmental load is large when using such a compound.

Means for Solving the Problems

[0007] The present invention is an invention made to solve the above problems, and an object of the present invention is to provide a composition containing a glass transition temperature adjuster capable of improving the Tg of the binder resin.

[0008] The composition of the present invention includes inorganic powder, a binder resin, and a glass transition temperature adjuster, and the glass transition temperature adjuster includes a compound having a structure represented by the following general formula (1).

[0009]

Chemical formula

[0010] The sheet-like material of the present invention includes the composition of the present invention. <�

[0011] The laminate of the present invention is formed by laminating the sheet-like material of the present invention.

[0012] The method for producing the composition of the present invention includes a grinding step of grinding an inorganic material to obtain an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature regulator, wherein the glass transition temperature regulator includes a compound having a structure represented by the following general formula (1).

[0013] [ka] (In general formula (1), R 1 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 2 A hydrocarbon group has 1 to 12 carbon atoms. In general formula (1), R 3 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 4 (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

[0014] The chip-type multilayer electronic component of the present invention comprises a base body formed by stacking multiple ceramic firing sheets, and when the base body is viewed from the side, a striped pattern perpendicular to the stacking direction is formed on the base body. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a composition containing a glass transition temperature regulator that can improve the Tg of a binder resin. [Brief explanation of the drawing]

[0016] [Figure 1A] Figure 1A is a schematic cross-sectional view showing an example of a sheet-like material according to the present invention. [Figure 1B] Figure 1B is an enlarged view of the dashed line area in Figure 1A. [Figure 2A] Figure 2A is a schematic diagram of an example of a process for producing a laminate using the sheet-like material of the present invention. [Figure 2B] Figure 2B is a schematic diagram of an example of a process for producing a laminate using the sheet-like material of the present invention. [Figure 3] Figure 3 is a side view schematically showing an example of a green body in which a plurality of fired sheets are laminated. [Figure 4] Figure 4 is a graph of the loss factor (Tanδ) of dynamic viscoelasticity measurement in an embodiment of the present invention. **[Embodiments for Carrying Out the Invention]**

[0017] Hereinafter, the composition, sheet-like material, laminate, method for producing the composition, and chip-type multilayer electronic component of the present invention will be described. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the gist of the present invention. Combinations of two or more of the individual preferred configurations of the present invention described in the following embodiments are also within the scope of the present invention.

[0018] The drawings shown below are schematic diagrams, and dimensions, aspect ratios, scales, etc. may be different from those of actual products.

[0019] Also, the embodiments shown below are illustrative, and it is needless to say that partial substitution or combination of the configurations shown in the embodiments is arbitrarily possible.

[0020] The composition of the present invention contains inorganic powder, binder resin, and glass transition temperature adjuster, and the glass transition temperature adjuster contains a compound having a structure represented by the following general formula (1). [[ID=2-eight]]

[0021] **[Chemical Formula]** (In general formula (1), R 1 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms. In general formula (1), R 4(A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

[0022] The compound represented by the above general formula (1) can raise the Tg of the binder resin. Therefore, a composition containing inorganic powder, a binder resin, and a glass transition temperature regulator makes it easier to adjust plasticity and improves moldability. Accordingly, when using the composition of the present invention, sheet-like materials can be suitably molded. Furthermore, the molded sheet-like materials become less prone to deformation. Furthermore, when the sheet-like material is stacked to create a laminate, deformation of the laminate can be prevented. Consequently, when the laminate is fired to form the base material for chip-type multilayer electronic components, variations in the appearance quality and electrical characteristics of the base material are reduced. As a result, the yield is improved.

[0023] The principle by which the Tg of the binder resin can be increased in this way can be thought to be as follows. Binder resins are generally composed of molecules that have polar groups. Because compounds having the structure represented by the general formula (1) are bulky, they are less likely to orient themselves to the polar groups of the molecules constituting the binder resin. Therefore, compounds having the structure represented by the general formula (1) are less likely to penetrate between the molecules constituting the binder resin. Consequently, the molecules constituting the binder resin tend to aggregate together. This increases the Tg of the binder resin.

[0024] Also, R 1 , R 2 , R 3 R 4 With the above structure, compounds having the structure represented by general formula (1) are liquid at room temperature (25°C), making them easy to handle.

[0025] The components of the present invention will be described in detail below.

[0026] (Inorganic powder) In the composition of the present invention, the inorganic powder is a ceramic powder composite. In this case, a ceramic green sheet can be produced by forming the composition of the present invention into a sheet-like material.

[0027] In the composition of the present invention, the inorganic powder preferably contains at least one selected from the group consisting of zirconia, thian, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, and glass ceramics. These materials are suitable for manufacturing chip-type multilayer electronic components using the compositions of the present invention.

[0028] In the composition of the present invention, the size of the inorganic powder is not particularly limited, but it is preferable that the average particle diameter is 0.01 μm or more and 50 μm or less.

[0029] In the composition of the present invention, the inorganic powder content is preferably 65% ​​by weight or more and 96% by weight or less, and more preferably 74% by weight or more and 95% by weight or less. As will be described in more detail later, the composition of the present invention is used to produce a sheet-like material. This sheet-like material is laminated and fired to become the base material for a chip-type multilayer electronic component. When the inorganic powder content falls within the above range, the resulting material will have a suitable density and strength for functioning as part of a chip-type multilayer electronic component.

[0030] (Binder resin) In the composition of the present invention, the binder resin preferably contains at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic, and urethane, and more preferably contains polyvinyl acetate. These binder resins are suitable for molding the compositions of the present invention into predetermined shapes because they can bond inorganic powders together.

[0031] In particular, when the binder resin is polyvinyl acetate, compounds having the structure represented by the above general formula (1) are bulky and therefore do not easily orient themselves toward the acetyloxy groups of the molecules constituting polyvinyl acetate. Therefore, compounds having the structure represented by the general formula (1) above do not easily enter the spaces between the molecules constituting polyvinyl acetate, making it easier for polyvinyl acetate molecules to aggregate. This increases the Tg of polyvinyl acetate. Therefore, the Tg of polyvinyl acetate can be adjusted by a glass transition temperature adjusting agent, thereby improving the moldability of the composition of the present invention.

[0032] In the composition of the present invention, the binder resin is preferably included in an emulsion state. In this case, the inorganic powder in the composition of the present invention does not concentrate in some areas and is easily dispersed.

[0033] The composition of the present invention preferably contains 5 to 50 parts by weight, more preferably 10 to 30 parts by weight, and even more preferably 10 to 20 parts by weight of binder resin per 100 parts by weight of inorganic powder. If the amount of binder resin is less than 5 parts by weight per 100 parts by weight of inorganic powder, the low amount of binder resin makes it difficult to adequately bond the inorganic powders together. As a result, when the composition is molded into a predetermined shape, the molded product becomes prone to breakage. If the amount of binder resin exceeds 50 parts by weight relative to 100 parts by weight of inorganic powder, the amount of inorganic powder becomes relatively small. This leads to larger dimensional changes during firing and increased stress due to shrinkage, making cracks more likely to occur.

[0034] (Glass transition temperature regulator) In the composition of the present invention, the structure R represented by general formula (1) 1 R may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms. 1 It may contain unsaturated bonds or be composed solely of saturated bonds, but it is preferable that it be composed solely of saturated bonds. R 1 When R contains unsaturated bonds, it restricts rotation within the molecule, resulting in a rigid, planar structure in the region where the unsaturated bonds are present. On the other hand, R 1When a molecule consists only of saturated bonds, intramolecular rotation is not restricted, resulting in a slower increase in Tg compared to molecules containing unsaturated bonds. The choice between including or excluding unsaturated bonds depends on the desired Tg. Furthermore, apart from Tg considerations, molecules composed solely of saturated bonds are more materially stable and easier to manage than those containing unsaturated bonds. Note, R 1 It is preferable that it is a 2-ethylhexyl group.

[0035] In the composition of the present invention, the structure R represented by general formula (1) 2 This may be a linear, branched, or cyclic hydrocarbon group having 1 to 12 carbon atoms. R 2 If it is a cyclic hydrocarbon group, it may also be a heterocycle. Also, R 2 It is preferable that it is a benzene ring. Also, R 2 It may contain unsaturated bonds, or it may consist only of saturated bonds.

[0036] In the composition of the present invention, the structure R represented by general formula (1) 3 R may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms. 3 It may contain unsaturated bonds or be composed solely of saturated bonds, but it is preferable that it be composed solely of saturated bonds. Note, R 3 It is preferable that it is a 2-ethylhexyl group.

[0037] In the composition of the present invention, the structure R represented by general formula (1) 4 R may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms. 4 It may contain unsaturated bonds or be composed solely of saturated bonds, but it is preferable that it be composed solely of saturated bonds. Note, R 4 It is preferable that it is a 2-ethylhexyl group.

[0038] In the compositions of the present invention, the compound having the structure represented by general formula (1) may include tricarboxylic acid derivatives such as trimellitic acid, aconitic acid, propane-1,2,3-tricarboxylic acid, and cyclohexane-1,2,4-tricarboxylic acid. Examples of such tricarboxylic acid derivatives include alkyl trimellitic acid esters, alkyl aconitate esters, alkyl propane-1,2,3-tricarboxylic acid esters, and alkyl cyclohexane-1,2,4-tricarboxylic acid esters. In this case, the structure represented by general formula (1) has a carboxyl group residue (i.e., R 1 , R 3 or R 4 (In the case of a hydrogen atom) there may be cases like this.

[0039] In the compositions of the present invention, the compound having the structure represented by general formula (1) is preferably tris(2-ethylhexyl) trimellitate, as shown in general formula (2) below.

[0040] [ka]

[0041] The above-mentioned alkyl tricarboxylate is inexpensive, which can reduce the manufacturing cost of the composition of the present invention.

[0042] In the composition of the present invention, it is preferable that the amount of glass transition temperature adjusting agent is 0.01 parts by weight or more and 5 parts by weight or less, and more preferably 0.1 parts by weight or more and 1.0 part by weight or less, per 100 parts by weight of inorganic powder. If the amount of glass transition temperature adjusting agent is less than 0.01 parts by weight per 100 parts by weight of inorganic powder, the Tg of the binder resin will not rise sufficiently. When the amount of glass transition temperature adjusting agent exceeds 5 parts by weight per 100 parts by weight of inorganic powder, the effect of raising the Tg of the binder resin approaches its upper limit, making it uneconomical.

[0043] (solvent) The composition of the present invention may further contain a solvent. Examples of solvents include diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, texanol, eugenol, terpineol, dihydroterpineol, benzyl alcohol, ethanol, isophorone, methyl ethyl ketone, and diethyl ketone. These solvents are useful in uniformly mixing the inorganic powder, binder resin, and plasticizer in the composition of the present invention.

[0044] In the composition of the present invention, the solvent content is preferably 0.05% by weight or more and 20% by weight or less.

[0045] (Other additives) The composition of the present invention may also contain other additives such as dispersants, plasticizers, defoamers, and wetting agents. Examples of dispersants include ammonium polycarboxylates and maleic anhydride-styrene copolymers. Examples of plasticizers include diglycerin, polyglycerin, and alkyl hydroxy acids. Examples of antifoaming agents include polyalkylene glycol, dimethylpolysiloxane, and octadecanol. Examples of humectants include polyalkylene glycol and polyglycerin.

[0046] (Regarding the proportions of each component) In the composition of the present invention, it is preferable that the inorganic powder is present in an amount of 5 to 50 parts by weight of binder resin per 100 parts by weight of inorganic powder, and that the glass transition temperature adjusting agent is present in an amount of 0.01 to 5 parts by weight per 100 parts by weight of inorganic powder, it is more preferable that the inorganic powder is present in an amount of 10 to 30 parts by weight of binder resin and that the glass transition temperature adjusting agent is present in an amount of 0.01 to 5 parts by weight per 100 parts by weight of inorganic powder, and it is even more preferable that the inorganic powder is present in an amount of 10 to 20 parts by weight of binder resin and that the glass transition temperature adjusting agent is present in an amount of 0.1 to 1.0 part by weight per 100 parts by weight of inorganic powder. When the composition of the present invention contains inorganic powder, a binder resin, and a glass transition temperature regulator in such proportions, the Tg of the binder resin is suitably improved. As a result, the moldability of the composition of the present invention is improved.

[0047] In the composition of the present invention, the weight ratio (wt%) of the binder resin to the weight of the glass transition temperature regulator is preferably 0.5 or more and 5000 or less, and more preferably 2.5 or more and 200 or less.

[0048] Next, a method for producing the composition of the present invention will be described. The method for producing the composition of the present invention includes a grinding step of grinding an inorganic material to obtain an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature regulator, wherein the plasticizer includes a compound having a structure represented by the following general formula (1).

[0049] [ka] (In general formula (1), R 1 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 2 A hydrocarbon group has 1 to 12 carbon atoms. In general formula (1), R 3 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 4 (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

[0050] The Tg of the binder resin can be increased by using a glass transition temperature regulator containing a compound having the structure represented by the general formula (1) above. In other words, the plasticity of the manufactured composition can be adjusted by using a glass transition temperature regulator.

[0051] In the method for producing the composition of the present invention, in the mixing step, it is preferable to mix the inorganic powder, the binder resin, and the plasticizer such that, per 100 parts by weight of the inorganic powder, the binder resin is 5 parts by weight or more and 50 parts by weight or less, and the plasticizer is 0.01 parts by weight or more and 5 parts by weight or less. Furthermore, in the mixing step, it is more preferable to mix the inorganic powder, the binder resin, and the plasticizer such that, per 100 parts by weight of the inorganic powder, the binder resin is 10 parts by weight or more and 30 parts by weight or less, and the plasticizer is 0.01 parts by weight or more and 5 parts by weight or less. Even more preferable is to mix the inorganic powder, the binder resin, and the plasticizer such that, per 100 parts by weight of the inorganic powder, the binder resin is 10 parts by weight or more and 20 parts by weight or less, and the plasticizer is 0.1 parts by weight or more and 1.0 part by weight or less. When the composition produced contains inorganic powder, a binder resin, and a glass transition temperature regulator in such proportions, the Tg of the binder resin is suitably improved. As a result, the moldability of the produced composition is improved.

[0052] Next, a chip-type multilayer electronic component manufactured using the composition of the present invention will be described. A chip-type multilayer electronic component manufactured using the composition of the present invention is also one embodiment of the present invention. Furthermore, when manufacturing chip-type multilayer electronic components, sheet-like materials using the composition of the present invention and laminates formed by stacking these sheet-like materials are produced, and these sheet-like materials and laminates are also embodiments of the present invention.

[0053] Figure 1A is a schematic cross-sectional view showing an example of a sheet-like material according to the present invention. Figure 1B is an enlarged view of the dashed line area in Figure 1A. When manufacturing the chip-type multilayer electronic component of the present invention, first, as shown in Figure 1A, the composition of the present invention is formed into a sheet to form a sheet-like material 10a. The method for forming the composition of the present invention into a sheet is not particularly limited, and conventionally known methods such as using a bar coater or printing can be employed.

[0054] Furthermore, when producing the sheet-like material 10a, the specific gravity of the binder resin is lower than that of the inorganic powder, so as shown in Figure 1B, the density of the binder resin 11a increases as it approaches the upper surface of the sheet-like material 10a.

[0055] After forming the sheet-like material 10a, vias (not shown) may be formed on the sheet-like material 10a as needed, and conductive paste (not shown) may be placed on the sheet-like material 10a. The vias and conductive paste can be made from conventionally known materials, and conventionally known methods can also be used for their formation and arrangement.

[0056] Figures 2A and 2B are schematic diagrams of an example of a process for producing a laminate using the sheet-like material of the present invention. Next, as shown in Figure 2A, multiple sheets of material 10a are prepared. Then, as shown in Figure 2B, the sheet-like material 10a is laminated and compressed to produce a mother block 20a, which is a laminated body. The crimping conditions are not particularly limited, and conventionally known methods can be employed.

[0057] Afterward, the mother block 20a may be cut into a predetermined shape to form a chip. Furthermore, if necessary, the edges of the chip-shaped material may be given a rounded chamfer.

[0058] Furthermore, both the mother block 20a and the chip-like material are included in the laminate of the present invention. Since these laminates are made using the composition of the present invention, they are resistant to deformation. Therefore, variations in the appearance quality and electrical properties of the base material produced through the processes described later are reduced.

[0059] Next, the chip-like material is degreased and fired. As a result, the sheet-like material 10a becomes a fired sheet 10, and a base body 20 consisting of multiple fired sheets 10 stacked together can be produced, as shown in Figure 3. Figure 3 is a schematic side view showing an example of a base body made up of multiple fired sheets stacked together. During this firing process, the conductive paste formed on the sheet-like material 10a becomes the internal electrode.

[0060] Furthermore, during firing, the binder resin 11a contained in the sheet-like material 10a is thermally decomposed and becomes pores 11. As described above, in the sheet-like material 10a, the density of the binder resin 11a increases as you approach the top surface. Therefore, in areas where the density of the binder resin 11a is high, the density of the pores 11 also increases. Consequently, as shown in Figure 3, when the base material 20 is viewed from the side, these pores 11 appear to be formed linearly in a direction perpendicular to the lamination direction. As shown in Figure 3, the base body 20 is made up of multiple fired sheets 10 stacked on top of each other, so when the base body 20 is viewed from the side, a striped pattern perpendicular to the stacking direction is formed on the base body 20.

[0061] The base body 20 may have external electrodes or the like formed on it as needed.

[0062] The chip-type multilayer electronic component of the present invention can be manufactured using this method.

[0063] As described above, when the base body 20 is viewed from the side, it has stripes that are perpendicular to the stacking direction. Therefore, in the chip-type multilayer electronic component of the present invention that includes the base body 20, these stripes can be used as a guide to identify the side of the chip-type multilayer electronic component. In other words, when observing a chip-type multilayer electronic component, the observer can recognize that the surface on which the striped pattern is formed is the side, and the surface on which the striped pattern is not formed is the top or bottom. Therefore, with the chip-type multilayer electronic component of the present invention, there is no need to form other identification markings on the sides, top, or bottom of the base body. Therefore, manufacturing costs can be reduced.

[0064] This specification describes the following inventions.

[0065] The present invention (1) comprises an inorganic powder, a binder resin, and a glass transition temperature regulator, wherein the glass transition temperature regulator is a composition having a structure represented by the following general formula (1).

[0066] [ka] (In general formula (1), R 1 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 2 A hydrocarbon group has 1 to 12 carbon atoms. In general formula (1), R 3 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 4 (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

[0067] The present invention (2) is the composition according to the present invention (1), wherein the glass transition temperature regulator is a derivative of at least one tricarboxylic acid selected from the group consisting of trimellitic acid, aconitic acid, propane-1,2,3-tricarboxylic acid, and cyclohexane-1,2,4-tricarboxylic acid.

[0068] Invention (3) is the composition according to Invention (1) or (2), wherein the above composition further comprises a solvent.

[0069] The present invention (4) is a composition according to any one of the present inventions (1) to (3), wherein the binder resin comprises at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic, urethane, polyvinylpyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether.

[0070] The present invention (5) is a composition according to any one of the present inventions (1) to (4) in which the inorganic powder is a ceramic powder.

[0071] The present invention (6) is a composition according to any one of the present inventions (1) to (4), wherein the inorganic powder comprises at least one selected from the group consisting of zirconia, thiania, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, and glass ceramics.

[0072] The present invention (7) is a composition according to any one of the present inventions (1) to (6), wherein the inorganic powder is present in an amount of 100 parts by weight, the binder resin is present in an amount of 5 parts by weight or more and 50 parts by weight or less, and the plasticizer is present in an amount of 0.01 parts by weight or more and 5 parts by weight or less.

[0073] The present invention (8) is a sheet-like material comprising the composition described in any of the present inventions (1) to (7).

[0074] The present invention (9) is a laminate formed by stacking multiple sheet-like materials described in the present invention (8).

[0075] The present invention (10) is a method for producing a composition comprising a grinding step of grinding an inorganic material to obtain an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature adjusting agent, wherein the glass transition temperature adjusting agent comprises a compound having a structure represented by the following general formula (1).

[0076] [ka] (In general formula (1), R 1 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 2 A hydrocarbon group has 1 to 12 carbon atoms. In general formula (1), R 3 A hydrocarbon group is a group consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R 4 (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

[0077] The present invention (11) is a method for producing the composition described in the present invention (10), wherein in the mixing step, the inorganic powder, the binder resin, and the glass transition temperature adjusting agent are mixed such that, for every 100 parts by weight of the inorganic powder, the amount of the binder resin is 5 parts by weight or more and 50 parts by weight or less, and the amount of the glass transition temperature adjusting agent is 0.01 parts by weight or more and 5 parts by weight or less.

[0078] The present invention (12) is a chip-type multilayer electronic component comprising a base body formed by laminating a plurality of ceramic firing sheets, wherein when the base body is viewed from the side, a striped pattern perpendicular to the lamination direction is formed on the base body. [Examples]

[0079] The following are examples that more specifically disclose the compositions and other components of the present invention. However, the present invention is not limited to the following examples.

[0080] (Examples) A mixture of ferrite, 50 parts by weight of pure water, 0.5 parts by weight of ammonium polycarboxylate (dispersant) per 100 parts by weight of ferrite, and ferrite was prepared by grinding the mixture using a ball mill to produce ferrite powder (inorganic powder).

[0081] Next, ferrite powder, polyvinyl acetate (binder resin), and tris(2-ethylhexyl) trimellitate (glass transition temperature regulator) were mixed in the proportions shown in Table 1 to prepare the slurry-like composition according to the example.

[0082] Next, the composition according to the example was degassed, and then coated onto a PET film in a sheet-like manner and dried with hot air to produce a sheet-like material (thickness: approximately 50 μm) according to the example.

[0083] (Comparative example) Except for not using tris(2-ethylhexyl) trimellitate (glass transition temperature regulator) when preparing the slurry-like composition, and instead blending ferrite powder and polyvinyl acetate (binder resin) in the proportions shown in Table 1, a sheet-like material (thickness: approximately 50 μm) according to the comparative example was prepared in the same manner as the examples.

[0084] (Dynamic viscoelasticity measurement and Tg calculation) Next, the sheet-like materials according to the examples and comparative examples were pressed together to create a laminate with a thickness of 500 μm. Next, the laminates according to the examples and comparative examples were cut to a width × length = 10 mm × 50 mm to be used as test samples. Next, dynamic viscoelasticity measurements were performed using test samples from the examples and comparative examples. Dynamic viscoelasticity measurements were performed using a viscoelasticity measuring device (model name: DMA7000, manufacturer: Hitachi High-Tech Science Co., Ltd.) within a measurement temperature range of -30 to 100°C. Based on the results of dynamic viscoelasticity measurements, the Tg of the binder resin contained in the compositions of the examples and comparative examples was calculated. The results are shown in Table 1.

[0085] [Table 1]

[0086] As shown in Table 1, it was found that using tris(2-ethylhexyl) trimellitic acid as a glass transition temperature regulator increased the Tg of polyvinyl acetate contained in the composition.

[0087] (Relationship between the amount of glass transition temperature regulator used and Tg) Except for the proportions of ferrite powder, polyvinyl acetate (binder resin), and tris(2-ethylhexyl) trimellitate (glass transition temperature regulator) shown in Table 2, the Tg of polyvinyl acetate in each formulation was calculated using the same method as described in "Dynamic Viscoelasticity Measurement and Tg Calculation" above. The degree to which the Tg of polyvinyl acetate increased compared to the Tg of polyvinyl acetate in the comparative example above was evaluated according to the following criteria. The results are shown in Table 2.

[0088] (Evaluation criteria for the temperature rise of Tg) The Tg of polyvinyl acetate in the above comparative example is defined as "T0", and the Tg of polyvinyl acetate in each example is defined as "T x When this is done, evaluations A1 and A2 satisfy the following relationship. A1: 5℃≦(T x -T0) A2:(T x -T0)<5℃

[0089] [Table 2]

[0090] Furthermore, the graphs of the loss coefficient (Tanδ) from the dynamic viscoelasticity measurements in each example were examined to confirm whether or not the peaks were separated. If the peaks are separated, it means that polyvinyl acetate and tris(2-ethylhexyl) trimellitate are separated in that composition. The evaluation criteria are as follows. The results are shown in Table 3. B1: The peaks are not separated. B2: The peaks are separated.

[0091] [Table 3]

[0092] As a representative example of cases where the peaks are separated, Figure 4 shows a graph of the loss coefficient (Tanδ) from the dynamic viscoelasticity measurement for an example using 10 wt% polyvinyl acetate and 1.4 wt% tris(2-ethylhexyl) trimellitate. Figure 4 is a graph of the loss coefficient (Tanδ) of the dynamic viscoelasticity measurement in an embodiment of the present invention.

[0093] As shown in Figure 4, the graph of the loss coefficient (Tanδ) from the dynamic viscoelasticity measurement in the example shows two peaks, one around 18°C ​​and another around 48°C. The peak around 48°C is thought to be the peak of polyvinyl acetate aggregates. In the composition, the presence of tris(2-ethylhexyl) trimellitic acid makes it difficult for the molecules constituting polyvinyl acetate to orient themselves toward the acetyloxy group, causing the polyvinyl acetate molecules to aggregate. This is thought to increase the Tg of the polyvinyl acetate. However, if the proportion of tris(2-ethylhexyl) trimellitate becomes too high, it is thought that some of the polyvinyl acetate molecules will aggregate and form aggregates. When such aggregates form, the peaks are thought to separate, as shown in Figure 4. The formation of aggregates can lead to a decrease in the strength of sheet-like materials and laminates, so it is preferable to avoid such aggregates.

[0094] In the above evaluation, embodiments that simultaneously satisfy evaluations A1 and B1 can be evaluated as "Excellent," while all other embodiments can be evaluated as "Available." This evaluation is shown in Table 4.

[0095] [Table 4]

[0096] As shown in Tables 2 to 4, it was found that by adjusting the ratio of polyvinyl acetate to tris(2-ethylhexyl) trimellitate, the Tg of the polyvinyl acetate in the composition according to the examples could be adjusted, and separation of polyvinyl acetate and tris(2-ethylhexyl) trimellitate could be prevented. [Explanation of symbols]

[0097] 10 baking sheets 10 10a Sheet-like material 11 Stomata 11a Binder resin 20 base body 20a Mother Block

Claims

1. It comprises inorganic powder, a binder resin, and a glass transition temperature regulator. The glass transition temperature regulator is a composition having a structure represented by the following general formula (1). 【Chemistry 1】 (In general formula (1), R １ These are hydrocarbon groups consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R ２ These are hydrocarbon groups with 1 to 12 carbon atoms. In general formula (1), R ３ These are hydrocarbon groups consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R ４ (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

2. The composition according to claim 1, wherein the glass transition temperature regulator is a derivative of at least one tricarboxylic acid selected from the group consisting of trimellitic acid, aconitic acid, propane-1,2,3-tricarboxylic acid, and cyclohexane-1,2,4-tricarboxylic acid.

3. The composition according to claim 1, further comprising a solvent.

4. The composition according to claim 1, wherein the binder resin comprises at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic, urethane, polyvinylpyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether.

5. The composition according to claim 1, wherein the inorganic powder comprises ceramic powder.

6. The composition according to claim 1, wherein the inorganic powder comprises at least one selected from the group consisting of zirconia, thian, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, and glass ceramics.

7. The composition according to claim 1, wherein the inorganic powder is present in an amount of 100 parts by weight, the binder resin is present in an amount of 5 parts by weight or more and 50 parts by weight or less, and the plasticizer is present in an amount of 0.01 parts by weight or more and 5 parts by weight or less.

8. A sheet-like material comprising the composition described in any one of claims 1 to 7.

9. A laminate comprising a plurality of sheet-like materials as described in claim 8.

10. A grinding process that crushes inorganic materials to produce inorganic powder, The process includes a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature adjusting agent. The glass transition temperature regulator is a method for producing a composition comprising a compound having a structure represented by the following general formula (1). 【Chemistry 2】 (In general formula (1), R １ These are hydrocarbon groups consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R ２ These are hydrocarbon groups with 1 to 12 carbon atoms. In general formula (1), R ３ These are hydrocarbon groups consisting of a hydrogen atom and 1 to 12 carbon atoms. In general formula (1), R ４ (A hydrocarbon group is a hydrogen atom with 1 to 12 carbon atoms.)

11. A method for producing the composition according to claim 10, wherein in the mixing step, the inorganic powder, the binder resin, and the glass transition temperature adjusting agent are mixed such that, with respect to 100 parts by weight of the inorganic powder, the amount of the binder resin is 5 parts by weight or more and 50 parts by weight or less, and the amount of the glass transition temperature adjusting agent is 0.01 parts by weight or more and 5 parts by weight or less.

12. It has a base body made of multiple ceramic firing sheets stacked together, A chip-type multilayer electronic component in which, when viewed from the side, the base body has a striped pattern formed on it perpendicular to the stacking direction.

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