Laser position confirmation cleaning device

Abstract

We provide a laser position confirmation cleaning device that allows you to confirm the cleaning position. [Solution] The laser position confirmation cleaning device includes a base unit 1 on which a die unit is placed, a drive unit 2 including a carrier plate 27 that can move along the left-right direction D1, the front-rear direction D2 perpendicular to the left-right direction D1, and the up-down direction D3 perpendicular to the left-right direction D1 and the front-rear direction D2, a nozzle unit 3 connected to the bottom side of the carrier plate 27 and including a nozzle seat body 31 and at least one nozzle 32 fixed to the nozzle seat body 31 and spraying a chemical agent toward the die unit, and a laser unit 4 connected to the front side of the carrier plate 27 and emitting laser light toward the die unit, wherein the area where the emitted laser light is irradiated onto the die unit coincides with the area on the die unit where the chemical agent sprayed from at least one nozzle 32 is located.

Description

Technical Field

[0001] The present invention relates to a cleaning device, and particularly to a laser position confirmation cleaning device.

Background Art

[0002] With the progress of the wafer packaging process, the electronic components on the wafer surface have become more precise. Such electronic components are likely to be damaged easily when contaminants such as minute dust, dirt, and particles adhere to them.

[0003] Therefore, cleaning the wafer with a chemical agent, as disclosed in Patent Document 1 for a processing device and a processing method, is a necessary step.

[0004] However, since many of the various chemical agents used for wafer cleaning are transparent, it is difficult for an operator to confirm whether the cleaning by the chemical agent is being performed along the planned path when cleaning the wafer with a conventional cleaning device.

[0005] Then, it is difficult for the operator to confirm the process of cleaning the wafer with a conventional cleaning device, and doubts arise as to whether the cleaning has been reliably performed. Therefore, there is room for improvement in the conventional cleaning device.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] An object of the present invention is to provide a laser position confirmation cleaning device that can overcome the above drawbacks.

Means for Solving the Problems

[0008] The present invention is suitable for cleaning die units, A base unit for mounting the die unit, A drive unit including a carrier plate that can move along the left-right direction, the front-rear direction perpendicular to the left-right direction, and the up-down direction perpendicular to the left-right direction and the front-rear direction, A nozzle unit is connected to the bottom side of the carrier plate and includes a nozzle seat body and at least one nozzle fixed to the nozzle seat body for spraying a chemical agent toward the die unit. The present invention provides a laser position confirmation cleaning device, which includes a laser unit connected to the front side of the carrier plate and for emitting laser light toward the die unit, wherein the area on the die unit irradiated by the emitted laser light overlaps with the area on the die unit where a chemical agent ejected from at least one nozzle is located. [Effects of the Invention]

[0009] The laser position confirmation cleaning apparatus of the present invention is configured such that a laser unit connected to the front side of a carrier plate and a nozzle unit connected to the bottom side of the carrier plate move together, and the laser light emitted from the laser unit overlaps with the chemical ejected from at least one nozzle to indicate the position of the ejected chemical, thereby making it easier to confirm the cleaning process of the die unit. [Brief explanation of the drawing]

[0010] [Figure 1] This perspective view shows a first embodiment of the laser position confirmation cleaning device of the present invention, and also shows that multiple dies are mounted on a tray. [Figure 2] This is a side view showing an embodiment of the laser position confirmation cleaning apparatus described above, including multiple dies and trays. [Figure 3] A front view showing an embodiment of the laser position confirmation cleaning apparatus described above, including multiple dies and trays. [Figure 4]It is a cross-sectional view taken along line IV-IV of FIG. 3. [Figure 5] It is a partially enlarged view showing an embodiment of the above laser position confirmation cleaning apparatus, a plurality of dies, and trays. [Figure 6] It is a perspective view showing a second embodiment of the laser position confirmation cleaning apparatus of the present invention and showing that a plurality of dies are attached to a tray. [Figure 7] It is a perspective view showing a third embodiment of the laser position confirmation cleaning apparatus of the present invention and a die.

Embodiments for Carrying out the Invention

[0011] Hereinafter, the present invention will be described in detail.

[0012] As shown in FIGS. 1 to 3, the first embodiment of the laser position confirmation cleaning apparatus of the present invention is suitable for cleaning the die unit 9.

[0013] In this embodiment, the die unit 9 includes a tray 92 and a plurality of dies 91 attached to the tray 92.

[0014] In addition, in other variations of this embodiment, the die unit 9 includes only the die 91 and omits the tray 92.

[0015] The die 91 can be applied to a large substrate or advanced packaging technology (CoWoS, Chip-on-Wafer-on-Substrate).

[0016] The laser position confirmation cleaning apparatus of this embodiment includes a base unit 1, a drive unit 2, a nozzle unit 3, a laser unit 4, and a photographing unit 5.

[0017] The base unit 1 is for placing the die 91 of the die unit 9.

[0018] In this embodiment, the base unit 1 includes two base plates 11 extending along the left - right direction D1, two transport roller assemblies 12 rotatably installed on the two base plates 11 respectively, and two transport belts 13 installed on the two transport roller assemblies 12 so as to operate by the rotation of the two transport roller assemblies 12 respectively for placing the die unit 9.

[0019] The two base plates 11 are installed at intervals along the front - rear direction D2 orthogonal to the left - right direction D1.

[0020] The drive unit 2 includes a left - right slide pedestal 21, a left - right slider assembly 22 installed on the left - right slide pedestal 21 so as to slide along the left - right direction D1, a front - rear slide pedestal 23 fixed to the left - right slider assembly 22, a front - rear slider assembly 24 installed on the front - rear slide pedestal 23 so as to slide along the front - rear direction D2, an up - down slide pedestal 25 fixed to the front - rear slider assembly 24, an up - down slider assembly 26 installed on the up - down slide pedestal 25 so as to slide along the up - down direction D3 orthogonal to the left - right direction D1 and the front - rear direction D2, and a carrier plate 27 fixed to the up - down slider assembly 26.

[0021] With the above - mentioned structure of the drive unit 2, the carrier plate 27 can move along the left - right direction D1, the front - rear direction D2, and the up - down direction D3.

[0022] The carrier plate 27 has a plate body 271 and two extension plates 272 connected to the plate body 271 and extending along the up - down direction D3.

[0023] The nozzle unit 3 is connected to the bottom side of the carrier plate 27. And the nozzle unit 3 includes a nozzle seat body 31, a plurality of nozzles 32 fixed to the nozzle seat body 31 for ejecting the medicine towards the die unit 9, and a plurality of auxiliary nozzles 33 fixed to the nozzle seat body 31.

[0024] The nozzle seat body 31 is rotatably mounted on two extension plates 272 and receives a cleaning agent for the die 91 via a flexible tube (not shown).

[0025] Multiple nozzles 32 communicate with the nozzle base body 31 and, as shown in Figure 2, spray the chemical towards the die 91 and tray 92 along an oblique direction D4 that intersects the front-rear direction D2 and the up-down direction D3.

[0026] Multiple auxiliary nozzles 33 are connected to a blower (not shown) and eject guide airflow toward the die 91 and tray 92.

[0027] In this embodiment, the number of nozzles 32 and auxiliary nozzles 33 is six each.

[0028] The chemical sprayed from nozzle 32 is SC-1 solution (Standard Clean 1), SC-2 solution (Standard Clean 2), or other cleaning solution.

[0029] In other variations of this embodiment, the number of nozzles 32 and auxiliary nozzles 33 can be 1 to 5, or 7 or more.

[0030] As shown in Figures 4 and 5, the laser unit 4 is connected to the front side of the carrier plate 27. Furthermore, the laser unit 4 is designed to emit a cross-shaped laser beam toward the die 91 and the tray 92.

[0031] The areas on the die 91 and tray 92 where the emitted cross-shaped laser beam is irradiated overlap with the areas on the die 91 and tray 92 where the chemical ejected from the multiple nozzles 32 is located. In other words, the range of the cross-shaped laser beam is the cross-shaped area shown by the dashed line in the diagram.

[0032] The laser unit 4 includes a laser mounting base 41 connected to the front side of the carrier plate 27 and a laser emitter 42 fixed to the laser mounting base 41.

[0033] The laser emitter 42 is for emitting a cross-shaped laser beam along the vertical direction D3 toward the die 91 and tray 92.

[0034] In this embodiment, the laser emitter 42 is a red laser diode (semiconductor laser).

[0035] The shooting unit 5 is installed on the bottom side of the vertical sliding base 25 of the drive unit 2, and is used to shoot toward the die 91 and tray 92 to generate multiple images.

[0036] The multiple images show that during the cleaning process of the die 91, the areas where the cross-shaped laser beam emitted from the laser unit 4 irradiates the die 91 and tray 92 overlap with the areas on the die 91 and tray 92 where the chemical sprayed from the multiple nozzles 32 is located. This allows the operator to easily confirm the cleaning process of the die 91 after cleaning.

[0037] During actual operation, the cross-shaped laser beam emitted from the laser unit 4 indicates the position of the chemicals ejected from multiple nozzles 32. This allows the operator to more easily confirm the cleaning process of the die 91 by directly checking it on-site during cleaning or by reviewing multiple images after cleaning.

[0038] As shown in Figure 6, a second embodiment of the laser position confirmation cleaning apparatus of the present invention is suitable for cleaning a plurality of dies 91 that are also mounted on a tray 92.

[0039] The laser position confirmation cleaning device of this embodiment also includes a base unit 1, a drive unit 2, a nozzle unit 3, a laser unit 4, and an imaging unit 5.

[0040] Regarding the differences, in the second embodiment, the distance between the two base plates 11 along the front-rear direction D2 is greater than the distance between the two base plates 11 along the front-rear direction D2 in the first embodiment, which allows for the cleaning of trays 92 of a different width than in the first embodiment.

[0041] In the second embodiment as well, the cross-shaped laser beam emitted from the laser unit 4 indicates the position of the chemicals ejected from the multiple nozzles 32, making it easier for the operator to confirm whether the cleaning process of the die 91 meets the requirements.

[0042] As shown in Figure 7, a third embodiment of the laser position confirmation cleaning apparatus of the present invention is also suitable for cleaning the die unit 9.

[0043] In this embodiment, the die unit 9 includes only the die 91 or a wafer (not shown).

[0044] The laser position confirmation cleaning device of this embodiment also includes a base unit 1', a drive unit 2, a nozzle unit 3, a laser unit 4, and an imaging unit 5.

[0045] Regarding the differences, in the third embodiment, the base unit 1' does not include the base plate 11, transport roller assembly 12, and transport belt 13 as in the first and second embodiments, but includes a base body 14 and a vacuum suction unit 15 rotatably mounted on the base body 14.

[0046] The vacuum suction unit 15 sucks the die 91 or wafer, rotates the die 91 or wafer relative to the base body 14, and cleans the die 91 or wafer together with the nozzle unit 3.

[0047] In this way, the third embodiment also uses a cross-shaped laser beam emitted from the laser unit 4 to indicate the position of the chemicals ejected from the multiple nozzles 32, making it easier for the operator to confirm whether the cleaning process of the die 91 or wafer meets the requirements.

[0048] According to the above configuration, the laser position confirmation cleaning apparatus of the present invention has the following effects.

[0049] (1) In the first to third embodiments, the laser unit 4 connected to the front side of the carrier plate 27 and the nozzle unit 3 connected to the bottom side of the carrier plate 27 move together, and the laser light emitted from the laser unit 4 overlaps with the drugs ejected from the multiple nozzles 32 to indicate the position of the ejected drugs, making it easier to confirm the cleaning process of the die unit 9.

[0050] (2) In the first to third embodiments, the shooting unit 5 generates multiple images, allowing the operator to confirm the cleaning process of the die unit 9 after cleaning.

[0051] (3) In the third embodiment, the base body 14 and vacuum suction unit 15 installed on the base unit 1' are used to rotate the die unit 9 relative to the base body 14 by the vacuum suction unit 15, thereby cleaning the die unit 9 together with the nozzle unit 3.

[0052] Therefore, the laser position confirmation cleaning apparatus of the present invention makes it easier to confirm the cleaning process of the die unit 9, and thus reliably achieves the objectives of the present invention.

[0053] The above embodiments are illustrative in illustrating the principles and effects of the present invention and do not limit it. Those skilled in the art can make some modifications and alterations to the above embodiments, provided they do not deviate from the spirit and scope of the invention. Therefore, all modifications and alterations made by those skilled in the art, provided they do not deviate from the spirit of the invention, should also be considered to fall within the scope of protection of the present invention. [Industrial applicability]

[0054] The laser position-checking cleaning apparatus of the present invention is suitable for cleaning dies and wafers. [Explanation of Symbols]

[0055] 1. 1' Base Unit 11 Base plate 12 Transport Roller Assembly 13 Transport belt 14 Base Unit 15 Vacuum suction section 2 Drive Unit 21 Left and right sliding base 22 Left and Right Slider Assembly 23 Front and rear sliding base 24 Front and rear slider assembly 25 Up / Down Sliding Base 26 Upper and Lower Slider Assembly 27 Carrier board 271 Board body 272 Stretched plate 3 Nozzle Units 31 Nozzle base body 32 nozzles 33 Auxiliary nozzle 4 Laser Units 41 Laser mounting base 42 Laser emitters 5. Shooting Unit 9 Die Unit 91 Die 92 trays D1 Left / right direction D2 Anteroposterior direction D3 Vertical Direction

Claims

1. Suitable for cleaning die units, A base unit for mounting the die unit, A drive unit including a carrier plate that can move along the left-right direction, the front-rear direction perpendicular to the left-right direction, and the up-down direction perpendicular to the left-right direction and the front-rear direction, A nozzle unit is connected to the bottom side of the carrier plate and includes a nozzle seat body and at least one nozzle fixed to the nozzle seat body for spraying a chemical agent toward the die unit. A laser position confirmation cleaning device comprising: a laser unit connected to the front side of the carrier plate and for emitting laser light toward the die unit, wherein the portion of the die unit irradiated by the emitted laser light overlaps with the portion of the die unit where a chemical ejected from at least one nozzle is located.

2. The laser position confirmation cleaning apparatus according to claim 1, wherein the laser unit is for emitting a cross-shaped laser beam toward the die unit.

3. The base unit includes two base plates extending along the left-right direction, two transport roller assemblies rotatably mounted on each of the two base plates, and two transport belts mounted on each of the two transport roller assemblies so as to be operated by the rotation of the two transport roller assemblies, for supporting the die unit. The laser position confirmation cleaning device according to claim 1, wherein the two base plates are installed with an interval between them along the front-to-back direction.

4. The base unit includes a base body and a vacuum suction unit rotatably mounted on the base body. The laser position confirmation cleaning apparatus according to claim 1, wherein the vacuum suction section is for suctioning the die unit.

5. The laser position confirmation cleaning apparatus according to claim 1, further comprising a shooting unit installed in the drive unit and for shooting toward the die unit to generate a plurality of images.

6. The carrier plate comprises a plate body and two extended plates connected to the plate body and extending along the vertical direction. The nozzle seat body is rotatably mounted on the two extension plates, The laser position confirmation cleaning apparatus according to claim 1, wherein at least one nozzle sprays a chemical agent toward the die unit along an oblique direction intersecting the front-rear direction and the up-down direction.

7. The laser position confirmation cleaning apparatus according to claim 1, wherein the nozzle unit further includes at least one auxiliary nozzle fixed to the nozzle seat body, the at least one auxiliary nozzle ejects a guide airflow toward the die unit.

8. The laser unit includes a laser mounting base connected to the front side of the carrier plate and a laser emitter fixed to the laser mounting base. The laser position confirmation cleaning apparatus according to claim 1, wherein the laser emitter is for emitting laser light toward the die unit along the vertical direction.

9. The aforementioned drive unit includes left and right sliding bases, A left and right slider assembly is installed on the left and right sliding base so as to be able to slide along the left and right direction, The front and rear sliding bases are fixed to the left and right slider assemblies, A front and rear slider assembly is installed on the front and rear sliding base so as to be able to slide along the front and rear direction, The upper and lower sliding bases are fixed to the front and rear slider assemblies, Includes an upper and lower slider assembly mounted on the upper and lower sliding base so as to be able to slide along the upper and lower direction, The laser position confirmation cleaning device according to claim 1, wherein the carrier plate is fixed to the upper and lower slider assembly.

Images