Light-emitting device and light-emitting module

Abstract

Bring the light emitted from the light-emitting device close to the side of the package. [Solution] A light-emitting device comprising: a base having a first upper surface, a second upper surface located above the first upper surface, a first outer surface, and a second outer surface located opposite the first outer surface; one or more light-emitting elements disposed on the base; one or more reflective members disposed on the first upper surface, in a top view, between the one or more light-emitting elements and the first outer surface, and reflecting light emitted in a first direction from the one or more light-emitting elements; a lid joined to the second upper surface and having a first side facing the same direction as the first outer surface; and a lens member disposed above the lid, joined to the lid, and having a first side facing the same direction as the first outer surface, wherein in a cross-sectional view through a plane perpendicular to the first outer surface and perpendicular to the first upper surface, the first side of the lens member is located in a first direction relative to the first side of the lid and in a direction opposite to the first direction relative to the first outer surface.

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a light-emitting module.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2019-207788 discloses a light-emitting device including a light-emitting element, a light reflection member, a package, and a lens member. In this light-emitting device, the light-emitting element and the light reflection member are disposed in a closed space of the package, and light emitted from the package passes through the lens member and is emitted from the light-emitting device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Disclosed is an invention that solves the problem of bringing the light emitted from the light-emitting device closer to the side surface of the package.

[0005] Alternatively, instead of the above problems, an invention that solves the problem of reducing the weight of the light-emitting device is disclosed.

[0006] Alternatively, instead of each of the above problems, an invention that solves the problem of miniaturizing the light-emitting device is disclosed.

[0007] Note that in this specification, inventions that comprehensively solve a plurality of the above problems are also disclosed.

Means for Solving the Problems

[0008] The light-emitting device disclosed in the embodiment comprises: a substrate having a first upper surface, a second upper surface located above the first upper surface, a first outer surface, and a second outer surface located opposite the first outer surface; one or more light-emitting elements disposed on the substrate; one or more reflective members disposed on the first upper surface, in a top view, between the one or more light-emitting elements and the first outer surface, and reflecting light emitted from the one or more light-emitting elements in a first direction; a lid joined to the second upper surface and having a first side surface facing the same direction as the first outer surface; and a lens member disposed above the lid, joined to the lid, and having a first side surface facing the same direction as the first outer surface, wherein in a cross-sectional view along a plane perpendicular to the first outer surface and perpendicular to the first upper surface, and passing through the reflective member, the first side surface of the lens member is located in a first direction relative to the first side surface of the lid and in a direction opposite to the first direction relative to the first outer surface.

[0009] In at least one of the one or more inventions disclosed by the embodiments, the light emitted from the light-emitting device can be brought closer to the side of the package. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a perspective view of a light-emitting device according to an embodiment. [Figure 2] Figure 2 is a side view of the light-emitting device according to the embodiment, viewed from the Y direction. [Figure 3A] Figure 3A is a side view of the light-emitting device according to the embodiment, viewed from the X direction. [Figure 3B] Figure 3B is a partially enlarged view of Figure 3A, enlarged in the Y direction rather than the Z direction, in order to explain the positional relationship of the sides of the base, lid, and optical member according to the embodiment. [Figure 4A] Figure 4A is a top view of the light-emitting device according to the embodiment. [Figure 4B] Figure 4B is a partially enlarged view of Figure 4A, enlarged in the Y direction rather than the X direction, in order to explain the positional relationship of the sides of the substrate, lid, and optical member according to the embodiment. [Figure 5] FIG. 5 is a cross-sectional view of the light-emitting device according to the embodiment taken along the V-V cross-sectional line in FIG. 4A. [Figure 6] FIG. 6 is a cross-sectional view of the light-emitting device according to the embodiment taken along the VI-VI cross-sectional line in FIG. 4A. [Figure 7] FIG. 7 is a perspective view for explaining the internal configuration of the package of the light-emitting device according to the embodiment. [Figure 8] FIG. 8 is a top view for explaining the internal configuration of the package of the light-emitting device according to the embodiment. [Figure 9] FIG. 9 is a top view of the package according to the embodiment. [Figure 10] FIG. 10 is a cross-sectional view of the package according to the embodiment taken along the X-X cross-sectional line in FIG. 9. [Figure 11] FIG. 11 is a top view of the substrate according to the embodiment. [Figure 12] FIG. 12 is a bottom view of the substrate according to the embodiment. [Figure 13] FIG. 13 is a cross-sectional view of the substrate according to the embodiment taken along the XIII-XIII cross-sectional line in FIG. 11. [Figure 14] FIG. 14 is a top view of the submount on which the light-emitting element according to the embodiment is mounted. [Figure 15] FIG. 15 is a side view of the submount on which the light-emitting element according to the embodiment is mounted. [Figure 16] FIG. 16 is a perspective view of the light-emitting module according to the embodiment. [Figure 17] FIG. 17 is a top view of the light-emitting module according to the embodiment. [Figure 18] FIG. 18 is a top view of the wiring board according to the embodiment. [Figure 19] FIG. 19 is a partially enlarged view of FIG. 17 for explaining distances D1 to D3 in the light-emitting module according to the embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0011] In this specification and in the claims, with respect to polygons such as triangles and quadrilaterals, the term "polygon" shall include shapes in which the corners of the polygon have been rounded, chamfered, or otherwise modified. Furthermore, shapes in which modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides shall also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this specification and in the claims.

[0012] Furthermore, the same applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0013] Furthermore, in this specification or the claims, descriptions such as up and down (up / down), left and right, front and back, front and back (front / back), and front and back merely describe relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0014] Furthermore, directions such as the X, Y, and Z directions may be indicated in the drawings using arrows. The direction of these arrows is consistent across multiple drawings representing the same embodiment. In the drawings, the direction of arrows marked X, Y, and Z is considered the positive direction, and the opposite direction is considered the negative direction. For example, the direction indicated by an X at the end of the arrow is the X direction and is also the positive direction. In this specification, the direction that is both the X direction and the positive direction will be referred to as the "positive X direction," and the opposite direction will be referred to as the "negative X direction." When referring to the "X direction," both the positive and negative directions are included. The same applies to the Y and Z directions.

[0015] Furthermore, in this specification, when an object is identified as "one or more" and described accordingly, the form in which there is one object and the form in which there are multiple objects are described together. Accordingly, the description identifying an object as "one or more" supports any of the embodiments comprising one or more objects, embodiments comprising at least one object, and embodiments comprising multiple objects.

[0016] Furthermore, in this specification, descriptions describing "one or each" of an object are a combined description of one object in an embodiment having one object, one object in an embodiment having multiple objects, and each of the multiple objects in an embodiment having multiple objects. Accordingly, descriptions describing "one or each" of an object support any of the following: in an embodiment having one object, this one object provides the description; in an embodiment having multiple objects, at least one of these objects provides the description; in an embodiment having multiple objects, each of these multiple objects provides the description; and in an embodiment having one or more objects, all objects provide the description.

[0017] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. "Component" refers to an object that is treated as a single physical unit. An object that is treated as a single physical unit can also be an object that is treated as a single part in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily have to be treated as a single physical unit. For example, "part" is used when considering a part of one component, or when considering multiple components together as a single object.

[0018] Furthermore, the distinction between "component" and "part" as described above does not indicate an intention to consciously limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this alone does not mean that the applicant recognizes that treating this component as a physical unit is indispensable for the application of the present invention.

[0019] Furthermore, in this specification or the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Also, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same prefix as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0020] For example, if there are components designated as “First,” “Second,” and “Third” in this specification to distinguish them, and these components are described in the claims as “First” and “Third” in this specification, then for readability, the components may be distinguished in the claims as “First” and “Second.” In this case, the components designated as “First” and “Second” in the claims refer to the components designated as “First” and “Third” in this specification, respectively. This rule is not limited to components, but can be applied to other subjects in a reasonable and flexible manner.

[0021] The following describes embodiments for carrying out the present invention. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only forms in which the present invention is realized. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for the sake of ease of understanding.

[0022] <First Embodiment> A light-emitting device 1 according to the first embodiment will be described. Figures 1 to 15 are drawings illustrating an exemplary form of the light-emitting device 1. Figure 1 is a perspective view of the light-emitting device 1. Figure 2 is a side view of the light-emitting device 1 viewed from the Y direction. Figure 3A is a side view of the light-emitting device 1 viewed from the X direction. Figure 3B is a partially enlarged view of Figure 3A, with a larger magnification ratio in the Y direction than in the Z direction, in order to explain the positional relationship of the sides of the base body 11, the lid 14, and the optical member 70. Figure 4A is a top view of the light-emitting device 1. Figure 4B is a partially enlarged view of Figure 4A, with a larger magnification ratio in the Y direction than in the X direction, in order to explain the positional relationship of the sides of the base body 11, the lid 14, and the optical member 70. Figure 5 is a cross-sectional view of the light-emitting device 1 along the VV section line in Figure 4A. Figure 6 is a cross-sectional view of the light-emitting device 1 along the VI-VI section line in Figure 4A. Figure 7 is a perspective view illustrating the internal configuration of the package 10 of the light-emitting device 1. Figure 8 is a top view illustrating the internal configuration of the package 10 of the light-emitting device 1. Figure 9 is a top view of the package 10. Figure 10 is a cross-sectional view of the package 10 along the XX section in Figure 9. Figure 11 is a top view of the substrate 11. Figure 12 is a bottom view of the substrate 11. Figure 13 is a cross-sectional view of the substrate 11 along the XIII-XIII section in Figure 11. Figure 14 is a top view of the submount 30 on which the light-emitting element 20 is mounted. Figure 15 is a side view of the submount 30 on which the light-emitting element 20 is mounted.

[0023] The light-emitting device 1 comprises a plurality of components. These plurality of components include a package 10, one or more light-emitting elements 20, one or more submounts 30, one or more reflective members 40, multiple wirings 60, optical members 70, and bonding members 80.

[0024] Furthermore, the light-emitting device 1 may have other components. For example, the light-emitting device 1 may have additional light-emitting elements in addition to the one or more light-emitting elements 20. Also, the light-emitting device 1 may not have some of the components listed here.

[0025] First, let's explain each component.

[0026] (Package 10) Package 10 comprises a base 11 and a lid 14. Package 10 is formed by joining the lid 14 to the base 11. Within package 10, an internal space is defined where other components are arranged. This internal space is a closed space surrounded by the base 11 and the lid 14. Furthermore, this internal space can be a space sealed in a vacuum or airtight state.

[0027] In a top view, the outer edge shape of package 10 is rectangular. This rectangle can have a long side and a short side. In the illustrated package 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of package 10 does not have to be rectangular in a top view.

[0028] In package 10, an internal space is formed where other components are arranged. The first upper surface 11A of package 10 is part of the region that defines the internal space. In addition, each inner surface 11E and the lower surface 14B of package 10 are part of the region that defines the internal space.

[0029] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0030] In a top view, the outer edge shape of the base 11 is rectangular. In a top view, the outer edge shape of the base 11 is the same as the outer edge shape of the package 10. In a top view, the outer edge shape of the first top surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first top surface 11A is parallel to the direction of the long side of the outer edge shape of the base 11. Note that in a top view, the outer edge shape of the first top surface 11A does not have to be rectangular.

[0031] In a top view, the first top surface 11A is surrounded by the second top surface 11C. The second top surface 11C is an annular surface that surrounds the first top surface 11A in a top view. The second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second top surface 11C is called the inner frame of the second top surface 11C, and the frame defined by the outer edge of the second top surface 11C is called the outer frame of the second top surface 11C.

[0032] The outer edge shape of the second upper surface 11C is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 11C1, a second side 11C2, a third side 11C3, and a fourth side 11C4. The second side 11C2 is parallel to the first side 11C1. The third side 11C3 is perpendicular to the first side 11C1. The fourth side 11C4 is parallel to the third side 11C3. The first side 11C1 is the long side of this rectangle.

[0033] The inner edge shape of the second upper surface 11C is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 11C5, a second side 11C6, a third side 11C7, and a fourth side 11C8. The second side 11C6 is parallel to the first side 11C5. The third side 11C7 is perpendicular to the first side 11C5. The fourth side 11C8 is parallel to the third side 11C7. The first side 11C5 is the long side of this rectangle. For convenience, the sides of the outer edge rectangle and the sides of the inner edge rectangle will be distinguished and referred to as the outer edge side and the inner edge side, respectively.

[0034] The base 11 has a recess surrounded by a frame formed by the second upper surface 11C. The recess defines a portion of the base 11 that is recessed below the second upper surface 11C. The first upper surface 11A is part of the recess. One or more inner surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0035] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, each stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0036] Each of the stepped portions 11F is located inside the inner frame of the second upper surface 11C when viewed from above. Each of the stepped portions 11F is formed along part or all of the inner surface 11E when viewed from above. In the base body 11, the side surface 11H is an inner surface, but side surface 11H and inner surface 11E are different surfaces. Each of the inner surfaces 11E and each of the side surfaces 11H are perpendicular to the first upper surface 11A. Perpendicularity here allows for a difference of ±3 degrees.

[0037] One or more stepped sections 11F may include a first stepped section 11F1 and a second stepped section 11F2. The first stepped section 11F1 and the second stepped section 11F2 are provided at positions where their respective side surfaces 11H face each other. The first stepped section 11F1 and the second stepped section 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0038] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be made of different materials. The base 11 may be composed of a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0039] The base portion 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0040] The lower surface of the base portion 11M constitutes part or all of the area of ​​the lower surface 11B of the base body 11. If the lower surface of the base portion 11M constitutes part of the area of ​​the lower surface 11B of the base body 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base body.

[0041] The base body 11 has a plurality of wiring sections 12A. The plurality of wiring sections 12A include one or more first wiring sections 12A1 arranged in the internal space of the package 10 and one or more second wiring sections 12A2 provided on the outer surface of the package 10.

[0042] One or each of the first wiring sections 12A1 is provided on the upper surface 11G of the stepped section 11F. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the first stepped section 11F1. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the second stepped section 11F2.

[0043] One or each of the second wiring sections 12A2 is provided on the lower surface 11B of the package 10. One or each of the second wiring sections 12A2 is provided on the lower surface of the frame section 11N. The second wiring section 12A2 may be provided on an outer surface different from the lower surface 11B of the package 10.

[0044] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the first stepped portion 11F1 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the first stepped portion 11F1, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0045] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the second stepped portion 11F2 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the second stepped portion 11F2, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0046] In the base 11, one or each of the first wiring sections 12A1 are electrically connected to a second wiring section 12A2. One or more first wiring sections 12A1 are electrically connected to different second wiring sections 12A2.

[0047] The base body 11 has a joining pattern 13A. The joining pattern 13A is provided on the second upper surface 11C. The joining pattern 13A is provided in an annular shape. The joining pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the joining pattern 13A.

[0048] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material for the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0049] Here, the main material refers to the material that accounts for the largest proportion in mass or volume of the object being considered. Furthermore, if the object is formed from a single material, that material is the main material. In other words, for a material to be the main material includes the possibility of that material accounting for 100% of the total.

[0050] The base body 11 may be formed using a base member and a frame member formed using different main materials. The base member can be formed using, for example, a metal or a composite containing a metal, graphite, diamond, or other material with excellent heat dissipation properties as the main material. Examples of metals that can be used as the main material of the base member include copper, aluminum, or iron. Examples of composites containing a metal that can be used as the main material of the base member include copper molybdenum or copper tungsten. The frame member can be formed using, for example, a ceramic as the main material, as mentioned above as the main material of the base body 11.

[0051] The wiring section 12A can be formed, for example, using a metal material as the main material. Examples of the metal material that serves as the main material for the wiring section 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring section 12A can be composed of, for example, one or more metal layers.

[0052] The bonding pattern 13A can be formed, for example, using a metallic material as the main material. Examples of metallic materials that can be used as the main material for the bonding pattern 13A include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 13A can be composed of, for example, one or more metallic layers.

[0053] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is constructed in the shape of a rectangular parallelepiped. However, the shape of the lid 14 does not have to be a rectangular parallelepiped.

[0054] The outer edge shape of the upper surface 14A of the lid 14 is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 14A1, a second side 14A2, a third side 14A3, and a fourth side 14A4. The second side 14A2 is parallel to the first side 14A1. The third side 14A3 is perpendicular to the first side 14A1. The fourth side 14A4 is parallel to the third side 14A3. The first side 14A1 is the long side of this rectangle.

[0055] The lid 14 is joined to the base 11. The lower surface 14B of the lid 14 is joined to the second upper surface 11C of the base 11. The lid 14 is joined to the joining pattern 13A of the base 11. The lid 14 is joined to the base 11 via adhesive.

[0056] The lid 14 is joined to the base 11 such that, in a top view, the first side 14A1 of the lid 14 is positioned closer to the first side 11C1 of the outer edge of the base 11 than the second side 14A2 of the lid 14. The lid 14 is joined to the base 11 such that, in a top view, the second side 14A2 of the lid 14 is positioned closer to the second side 11C2 of the outer edge of the base 11 than the first side 14A1 of the lid 14.

[0057] The lid 14 is joined to the base 11 such that, when viewed from above, the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14A2 of the lid 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14A1 of the lid 14. By using a lid 14 that satisfies this condition, the size of the lid 14 can be reduced, and the weight of the light-emitting device 1 can be reduced.

[0058] In a top view, the difference between the distance from the second edge 11C2 of the outer edge of the base 11 to the second edge 14A2 of the lid 14 and the distance from the first edge 11C1 of the outer edge of the base 11 to the first edge 14A1 of the lid 14 is 300 μm or more. Alternatively, this difference may be 500 μm or more. Alternatively, this difference may be 600 μm or more. The larger this difference, the greater the miniaturization of the lid 14.

[0059] In a top view, the outer edge of the lower surface 14B of the lid 14 lies on the second upper surface 11C of the base 11. As a result, a closed space is formed inside the package 10 when the lid 14 is joined to the base 11. In a top view, the distance from the second edge 11C2 of the outer edge of the base 11 to the second edge 14A2 of the lid 14 is smaller than the distance from the second edge 11C2 of the outer edge of the base 11 to the second edge 11C6 of the inner edge of the base 11.

[0060] The lid 14 is joined to the base 11 such that, when viewed from above, the distance from the third side 11C3 of the outer edge of the base 11 to the third side 14A3 of the lid 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14A1 of the lid 14. By using a lid 14 that satisfies this condition, the size of the lid 14 can be reduced.

[0061] The lid 14 is joined to the base 11 such that, when viewed from above, the distance from the fourth edge 11C4 of the outer edge of the base 11 to the fourth edge 14A4 of the lid 14 is greater than the distance from the first edge 11C1 of the outer edge of the base 11 to the first edge 14A1 of the lid 14. By using a lid 14 that satisfies this condition, the size of the lid 14 can be reduced.

[0062] The lid 14 is translucent, meaning it transmits light. Here, translucency means that the transmittance of light incident on the lid 14 is 80% or more. The lid 14 may also have a non-translucent region (a region that does not transmit light) in part.

[0063] The lid 14 can be formed, for example, using glass as the main material. The lid 14 can also be formed, for example, using sapphire as the main material.

[0064] (Light-emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has a long side and a short side. The external shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has a long side and a short side. However, the shape of the upper surface 21A and the external shape of the light-emitting element 20 when viewed from above are not limited to these.

[0065] The light-emitting element 20 has a light-emitting surface 22 that emits light. For example, a side surface 21C can be the light-emitting surface 22. The side surface 21C that becomes the light-emitting surface 22 intersects with the short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0066] The light-emitting element 20 emits light with an emission peak wavelength in the range of 320 nm to 530 nm. Alternatively, the light-emitting element 20 emits light with an emission peak wavelength in the range of 430 nm to 480 nm. Examples of light-emitting elements 20 that emit light with such emission peak wavelengths include light-emitting elements containing nitride semiconductors. As nitride semiconductors, for example, GaN-based semiconductors such as GaN, InGaN, and AlGaN can be used. Note that the light emitted from the light-emitting element 20 is not limited to the above wavelength range.

[0067] The light-emitting element 20 can be, for example, a semiconductor laser element. Furthermore, the light-emitting element 20 can be a single-emitter semiconductor laser element consisting of one emitter. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element consisting of multiple emitters. Note that the light-emitting element 20 is not limited to a semiconductor laser element; it may also be a light-emitting diode or the like.

[0068] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20.

[0069] A semiconductor laser element emits directional laser light. Divergent light with a broad spread is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 22. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface of the semiconductor laser element.

[0070] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the FFP's light intensity distribution, is referred to as light traveling along the optical axis, or light passing through the optical axis. Furthermore, in the FFP's light intensity distribution, 1 / e is applied to the peak intensity value. 2 Light with the above intensity will be referred to as the main part of the light.

[0071] The shape of the FFP (Fiber Focused Plane) of the light emitted from the semiconductor laser element is an ellipse, with the stacking direction being longer than the direction perpendicular to the stacking direction, in a plane parallel to the light emission surface 22. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Furthermore, the major axis direction of the elliptical shape of the FFP can be called the speed axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction of the semiconductor laser element.

[0072] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2The angle at which light of a certain intensity spreads is defined as the divergence angle of the semiconductor laser element. Here, the divergence angle is calculated by dividing the light of peak intensity (light passing through the optical axis) by 1 / e of the peak intensity. 2 The angle of light divergence is expressed as the angle formed by light of intensity 1 / e of the peak light intensity. 2 In addition to the light intensity, it can also be determined from, for example, the light intensity at half the peak light intensity. In this specification, when we simply refer to the "angle of light divergence," we mean 1 / e of the peak light intensity. 2 This refers to the angle of light divergence at a given light intensity.

[0073] The divergence angle in the speed axis direction of light emitted from a semiconductor laser element can be between 15 degrees and 35 degrees. The divergence angle in the slow axis direction of this light can be greater than 0 degrees and less than or equal to 10 degrees. Furthermore, the divergence angle in the speed axis direction is greater than the divergence angle in the slow axis direction.

[0074] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered the mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A may have a short side and a long side. However, the shape of the upper surface 31A does not have to be rectangular.

[0075] The external shape of the submount 30 in a top view is rectangular. This rectangle of the submount 30 may have a short side and a long side. However, the external shape of the submount 30 in a top view does not have to be rectangular. In a top view, the submount 30 may have an external shape in which the length in one direction (hereinafter referred to as the short side direction of the submount 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same direction as the X direction, and the long side direction is the same direction as the Y direction.

[0076] For example, the length of the submount 30 in the short side direction is 800 μm or more and 1050 μm or less. Also, the length of the submount 30 in the long side direction is 1500 μm or more and 2000 μm or less. Furthermore, the difference between the length in the long side direction and the length in the short side direction of the submount 30 is 700 μm or more and 950 μm or less.

[0077] (Reflective member 40) The reflective member 40 has a lower surface 41A and a light-reflecting surface 41B that reflects light. The light-reflecting surface 41B is inclined with respect to the lower surface 41A. The straight line connecting the lower end and upper end of the light-reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined with respect to the lower surface 41A is called the inclination angle of the light-reflecting surface 41B.

[0078] The light-reflecting surface 41B is flat. However, the light-reflecting surface 41B may be curved. The inclination angle of the light-reflecting surface 41B is 45 degrees. However, the inclination angle of the light-reflecting surface 41B does not have to be 45 degrees.

[0079] The main material of the reflective member 40 can be glass or metal. It is preferable to use a heat-resistant material as the main material of the reflective member 40. For example, the main material can be glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 can also be formed using Si as the main material.

[0080] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B with the main material, the general shape of the reflective member 40 may be formed with the main material, and the light-reflecting surface 41B may be formed on the surface of the general shape. In this case, the light-reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0081] The light-reflecting surface 41B has a reflectance of 90% or more with respect to the peak wavelength of light irradiated onto it. This reflectance may also be 95% or more. Furthermore, this reflectance may be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0082] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become connection points with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. The metal can be, for example, gold, aluminum, silver, copper, etc.

[0083] (Optical component 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 exerts an optical effect on the light incident upon it. Examples of optical effects exerted on light by the optical component 70 include focusing, collimation, diffusion, polarization, diffraction, multiplexing, light guidance, reflection, and wavelength conversion.

[0084] The optical member 70 has an optical surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optical surface. Alternatively, the optical surface may be located at a position different from the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical surface may be formed inside the optical member 70 rather than on its surface.

[0085] The optical component 70 may have one or more lens surfaces 71D. The lens surface 71D is the optical working surface of the optical component 70. The optical component 70 having a lens surface 71D may also be called a lens component. Light that passes through the lens surface 71D and is emitted from the optical component 70 is subjected to optical effects such as focusing, diffusion, or collimation by the optical component 70. For example, the optical component 70 is a collimating lens that emits collimated light after light incident on the optical component 70.

[0086] One or each lens surface 71D is located on the upper surface 71A side. Alternatively, the lens surface 71D may be located on the lower surface 71B side. The upper surface 71A and the lower surface 71B are flat. One or each lens surface 71D intersects with the upper surface 71A. In a top view, one or each lens surface 71D is surrounded by the upper surface 71A.

[0087] In a top view, the outer shape of the optical element 70 is rectangular. However, the outer shape of the optical element 70 in a top view does not have to be rectangular. The bottom surface 71B is flat. No lens surface 71D is formed on the bottom surface 71B side of the optical element 70. The shape of the bottom surface 71B is rectangular. However, the shape of the bottom surface 71B does not have to be rectangular.

[0088] In the optical member 70, the portion that overlaps with the lens surface 71D when viewed from above is defined as the lens portion 72A. In the optical member 70, the portion that overlaps with the upper surface 71A when viewed from above is defined as the non-lens portion 72B. The non-lens portion 72B surrounds the lens portion 72A when viewed from above. The lower surface 71B has a region that constitutes the lower surface of one or each of the lens portions 72A and a region that constitutes the lower surface of the non-lens portion 72B.

[0089] The optical member 70 may have a plurality of lens surfaces 71D formed in a continuous line in one direction. In a top view, the direction in which the plurality of lens surfaces 71D are aligned is called the lens connection direction. In the illustrated optical member 70, the connection direction is the same direction as the X direction.

[0090] The multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D lie on a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that this parallelism includes a difference of ±5 degrees.

[0091] Some or all of the multiple lens surfaces 71D may have the same curvature, and two or more of these lens surfaces 71D may have the same curvature. All of the multiple lens surfaces 71D may have the same curvature.

[0092] The optical component 70 is translucent. The optical component 70 has a transmittance of 80% or more for the peak wavelength of light incident on it. The optical component 70 may have a translucent region and a non-translucent region (hereinafter referred to as the non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using glass such as BK7, for example.

[0093] (Jointing member 80) The joining member 80 is formed when the adhesive hardens. The adhesive is used to join multiple components. For example, an ultraviolet-curing resin adhesive can be used as the adhesive. Alternatively, a thermosetting resin adhesive can be used as the adhesive. As an ultraviolet-curing resin adhesive, epoxy resin or acrylate resin adhesives can be used. As a thermosetting resin adhesive, epoxy resin or silicone resin adhesives can be used.

[0094] Next, the light-emitting device 1 will be described.

[0095] (Light-emitting device 1) In the light-emitting device 1, one or more light-emitting elements 20 are arranged in the internal space of the package 10. The one or more light-emitting elements 20 are arranged on the substrate 11. The one or more light-emitting elements 20 are arranged on the first upper surface 11A.

[0096] Each of the light-emitting elements 20 emits light in a first direction. Light is emitted from the light-emitting surface 22 of the light-emitting element 20 in the first direction. Light passing through the optical axis emitted from the light-emitting surface 22 propagates from the light-emitting surface in the first direction.

[0097] Here, the outer surface 11D and inner surface 11E of the package 10 located in the first direction from the light-emitting surface 22 are referred to as the first outer surface 11D1 and the first inner surface 11E1, respectively. The outer surface 11D opposite to the first outer surface 11D1 is referred to as the second outer surface 11D2, and the inner surface 11E facing the first inner surface 11E1 is referred to as the second inner surface 11E2.

[0098] The first outer surface 11D1 intersects with the first side 11C1 of the outer edge of the second upper surface 11C. The second outer surface 11D2 intersects with the second side 11C2 of the outer edge of the second upper surface 11C. The first inner surface 11E1 intersects with the first side 11C5 of the inner edge of the second upper surface 11C. The second inner surface 11E2 intersects with the second side 11C6 of the inner edge of the second upper surface 11C.

[0099] The light-emitting surface 22 of one or each of the light-emitting elements 20 is located between the median line of the opposing first inner surface 11E1 and second inner surface 11E2 and the first inner surface 11E1 when viewed from above. In one or each of the light-emitting elements 20, the side surface 21C opposite to the light-emitting surface 22 is located between this median line and the second inner surface 11E2.

[0100] In the light-emitting device 1, one or more light-emitting elements 20 may be composed of multiple light-emitting elements 20. The multiple light-emitting elements 20 are arranged in a line in one direction on the substrate 11. When viewed from above, the multiple light-emitting elements 20 are arranged in a line in a second direction perpendicular to the first direction. Each of the multiple light-emitting elements 20 can be composed of light-emitting elements 20 that emit light with the same emission peak wavelength, light with an emission peak wavelength difference of 20 nm or less, or light of the same color. Note that two or more different colors of light may be emitted from the multiple light-emitting elements 20.

[0101] The first stepped portion 11F1 and the second stepped portion 11F2 of the package 10 face each other in the second direction. The side surface 11H that intersects with the light-emitting surface 22 of the light-emitting element 20 faces the side surface 11H of either the first stepped portion 11F1 or the second stepped portion 11F2. The side surface 11H is a side surface perpendicular to the first inner side surface 11E1.

[0102] One or more light-emitting elements 20 are arranged on one or more submounts 30. One or each of the light-emitting elements 20 are arranged on the substrate 11 via the submounts 30. One light-emitting element 20 is arranged on one or each of the submounts 30.

[0103] The longitudinal direction of one or each submount 30 is the same as the first direction. The short direction of one or each submount 30 is the same as the second direction. One or more submounts 30 may consist of multiple submounts 30 arranged in the second direction with their longitudinal and short directions aligned. The light-emitting device 1 may have the same number of submounts 30 as the light-emitting elements 20.

[0104] Multiple submounts 30 can all be of the same shape. Multiple light-emitting elements 20 that emit light of the same emission peak wavelength, light with an emission peak wavelength difference of 20 nm or less, or light of the same color can each be arranged in a one-to-one ratio on multiple submounts 30 of the same shape.

[0105] In the light-emitting device 1, one or more reflective members 40 are arranged in the internal space of the package 10. The one or more reflective members 40 are arranged on the base body 11. The one or more reflective members 40 are arranged on the first upper surface 11A. The first inner surface 11E1 is located in a first direction relative to the one or more reflective members 40.

[0106] One or more reflective members 40 are positioned between one or more light-emitting elements 20 and the first outer surface 11D1 when viewed from above. One or more reflective members 40 are positioned with their light-reflecting surfaces 41B facing the light-emitting elements 20. One or more reflective members 40 have a side surface 41C facing the first inner surface 11E1.

[0107] One or more reflective members 40 reflect light emitted from one or more light-emitting elements 20 in a first direction. Light emitted from the light-emitting elements 20 in a first direction is irradiated onto one or each of the light-reflecting surfaces 41B. The light traveling along the optical axis irradiated onto one or each of the light-reflecting surfaces 41B is reflected vertically upward to the first upper surface 11A.

[0108] One or more reflective members 40 are positioned at a distance of less than 0.55 mm from the first inner surface 11E1 when viewed from above. This distance may also be 0.46 mm or less. This distance may also be less than 0.33 mm. The shorter this distance, the closer the light irradiated onto the light-reflecting surface 41B can be brought to the first inner surface 11E1, and the closer the light emitted from the light-emitting device 1 can be brought to the side of the package 10. One or more reflective members 40 are positioned at a distance of 0.22 mm or more from the first inner surface 11E1 when viewed from above.

[0109] One or more reflective members 40 can be composed of multiple reflective members 40. The multiple reflective members 40 are arranged in a line in the second direction. All of the multiple reflective members 40 can be reflective members 40 of the same shape. The light-emitting device 1 may have the same number of reflective members 40 as the light-emitting element 20.

[0110] In a top view, the displacement (difference) in the first direction of the lower end positions of the light-reflecting surfaces 41B between the multiple reflective members 40 is smaller than the displacement in the first direction of the light-emitting surfaces 22 between the multiple light-emitting elements 20. By precisely aligning the multiple reflective members 40, the light emitted from each light-emitting element 20 can be emitted from the light-emitting device 1 in a aligned manner.

[0111] In the light-emitting device 1, one or more light-emitting elements 20 are electrically connected to the package 10 by multiple wires 60. One or more light-emitting elements 20 are electrically connected to the wiring section 12A. This allows them to receive power from an external power source via the second wiring section 12A2.

[0112] In the light-emitting device 1, the optical member 70 is positioned above the package 10. The optical member 70 is positioned above the lid 14 and is joined to the lid 14. The optical member 70 is joined to the lid 14 via an adhesive. Between the lid 14 and the optical member 70, the adhesive hardens to form a joining member 80.

[0113] Light emitted from package 10 enters the optical element 70, undergoes an optical effect, and is emitted from the optical element 70. For example, light emitted from package 10 passes through the lens surface 71D of the optical element 70, becomes collimated light, and is emitted from the optical element 70. As a result, collimated light is emitted from the light-emitting device 1.

[0114] In the light-emitting device 1, the lid 14 has a first side surface 14C1 which faces the same direction as the first outer surface 11D1. The lid 14 also has a second side surface 14C2 which faces the same direction as the second outer surface 11D2. The second side surface 14C2 is the side surface 14C opposite to the first side surface 14C1.

[0115] In the light-emitting device 1, the optical member 70 has a first side surface 71C1 which faces the same direction as the first outer surface 11D1. The lid 14 also has a second side surface 71C2 which faces the same direction as the second outer surface 11D2. The second side surface 71C2 is the side surface 71C opposite to the first side surface 71C1.

[0116] The first side surface 71C1 of the optical element 70 is located in a first direction relative to the first side surface 14C1 of the lid 14, and in the opposite direction relative to the first outer surface 11D1, in a cross-sectional view taken through a plane perpendicular to the first outer surface 11D1 and perpendicular to the first top surface 11A (hereinafter referred to as the first cross-sectional view). By arranging the optical element 70 in this manner, the light emitted from the light-emitting device 1 can be brought closer to the side surface of the package.

[0117] In the first cross-sectional view, the distance in the first direction from the first side surface 71C1 to the first outer surface 11D1 is 0.22 mm or more. This makes it easier to mount the optical element 70 so that it does not protrude beyond the package 10 in the first direction due to tolerances. If the optical element 70 protrudes from the package 10, the outer edge shape of the light-emitting device 1 when viewed from above will be larger than when the optical element 70 does not protrude from the package 10. In that case, the light emitted from the light-emitting device 1 will be further away from the outer edge of the light-emitting device 1 when viewed from above, which may be undesirable.

[0118] In the first cross-sectional view, the distance in the first direction from the first side surface 14C1 of the lid 14 to the first side surface 71C1 of the optical element 70 is 0.03 mm or more. By having the optical element 70 protrude 0.03 mm or more beyond the lid 14 in the first direction, it becomes easier to illuminate the lens surface 71D of the optical element 70 with divergent light emitted from the package 10.

[0119] In a top view, the first side surface 71C1 of the optical element 70 does not overlap with either the first side surface 14C1 or the first outer surface 11D1 of the lid 14, and is located between the first side surface 14C1 and the first outer surface 11D1 of the lid 14. In a top view, this positional relationship is maintained along the entire edge of the first side surface 71C1, allowing light to be emitted close to the side of the package 10 from any position along the first side surface 71C1.

[0120] In a top view, the distance in the first direction from the first side surface 14C1 of the lid 14 to the first outer surface 11D1 is smaller than the distance in the first direction from the second side surface 14C2 of the lid 14 to the second outer surface 11D2.

[0121] In a top view, the maximum distance in the first direction from the second side surface 14C2 to the second inner surface 11E2 of the lid 14 is 0.57 mm or less. This ensures that the area in which the lid 14 is joined to the base 11 is secured. In a top view, the minimum distance in the first direction from the first inner surface 11E1 to the first side surface 14C1 of the lid 14 is 0.96 mm or more. This ensures that the area in which a sufficient joining state can be obtained when joining the optical member 70 to the lid 14 is secured.

[0122] In a top view, the maximum distance in the first direction from the first side surface 14C1 to the first outer surface 11D1 of the lid 14 is 0.25 mm or less. By positioning the first side surface 71C1 of the optical element 70 within a width of 0.25 mm or less, the light emitted from the light-emitting device 1 can be brought closer to the side of the package while ensuring a bonding area with the optical element 70.

[0123] The distance from the first outer surface 11D1 to the lens surface 71D is shorter than the distance from the second outer surface 11D2 to the lens surface 71D. The optical working surface (lens surface 71D) of the optical element 70 is positioned closer to the first outer surface 11D1.

[0124] With respect to the first direction, the distance from the first side surface 14C1 of the lid 14 to the first side surface 71C1 of the optical member 70 is smaller than the distance from the second side surface 14C2 of the lid 14 to the second side surface 71C2 of the optical member 70. The optical member 70 is positioned closer to the first side surface 14C1 of the lid 14.

[0125] The first side surface 71C1 of the optical element 70 is included in the non-lens portion 72B. In a top view, the shortest distance in the first direction from the first side surface 71C1 of the optical element 70 to the outer edge of the lens portion 72A is 0.262 mm or less.

[0126] In a top view, the first side surface 14C1 of the lid 14 overlaps with the non-lens portion 72B, but does not overlap with the outer edge of the lens portion 72A. In a top view, the first side surface 14C1 does not overlap with the lens portion 72A. Note that the entire first side surface 14C1 does not need to overlap with the non-lens portion 72B. This prevents the lens portion 72A from becoming too large.

[0127] The joining member 80 is provided near the outer edge of the optical member 70 when viewed from above. Adhesive is applied to four locations, and the adhesive at each location hardens without touching each other, forming the joining member 80. The four locations where the adhesive is applied correspond to the vicinity of the four corners of the lower surface of the optical member 70. The joining member 80 can come into contact with the lower surface 71B of the optical member 70 up to the point where it reaches the intersection line of the lower surface 71B and the first side surface 71C1. This increases the bonding area of ​​the adhesive and strengthens the bond.

[0128] <Second Embodiment> A light-emitting module 901 according to the second embodiment will now be described. Figures 1 to 19 are drawings illustrating an exemplary form of the light-emitting module 901. Figures 1 to 15 are as described in the first embodiment. Figure 16 is a perspective view of the light-emitting module 901. Figure 17 is a top view of the light-emitting module 901. Figure 18 is a top view of the wiring board 101. Figure 19 is a partially enlarged view of Figure 17 to illustrate the distances D1 to D3 in the light-emitting module 901.

[0129] The light-emitting module 901 comprises multiple components. These components include one or more light-emitting devices 1 and a wiring board 101.

[0130] The light-emitting module 901 may also have other components. For example, the light-emitting module 901 may have a different light-emitting device than the light-emitting device 1. Also, the light-emitting module 901 may not have some of the components listed here.

[0131] (Wiring board 101) The wiring board 101 has a top surface 101A, a bottom surface 101B, and one or more sides 101C. The wiring board 101 has a plate-like shape. In a top view, the outer edge shape of the wiring board 101 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the direction of the short side of this rectangle is the same as the X direction, and the direction of the long side is the same as the Y direction.

[0132] The wiring board 101 includes a heat dissipation section 101D, an electrode section 101E, and an insulating section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0133] The insulating portion 101F insulates the heat dissipation portion 101D from the electrode portion 101E. The insulating portion 101F is provided on the wiring board 101 to insulate the electrical connection between the heat dissipation portion 101D and the electrode portion 101E.

[0134] Two connection areas 101G are provided on the upper surface 101A of the wiring board 101. The two connection areas 101G are arranged side by side in one direction. Hereafter, the two connection areas 101G will be distinguished and referred to as the first connection area 101G1 and the second connection area 101G2.

[0135] Each connection region 101G includes a region where the electrode portion 101E is exposed from the insulating portion 101F when viewed from above. Each connection region 101G also includes a region where the heat dissipation portion 101D is exposed from the insulating portion 101F when viewed from above. In the direction where the two connection regions 101G are aligned, the distance D1 between the first connection region 101G1 and the second connection region 101G2 is 0.4 mm or less. Furthermore, this distance is 0.25 mm or more.

[0136] The wiring board 101 comprises a heat dissipation member 111, a plurality of electrode members 121, and one or more insulating members 131. The heat dissipation section 101D includes the heat dissipation member 111, the electrode section 101E includes a plurality of electrode members 121, and the insulating section 101F includes one or more insulating members 131.

[0137] The heat dissipation member 111 can use a metallic material as its main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the heat dissipation member 111. It is preferable that the heat dissipation member 111 be formed from a material with excellent heat dissipation properties. The heat dissipation member 111 may be formed containing 95% by mass or more of copper.

[0138] The electrode member 121 can use a metallic material as its main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the electrode member 121.

[0139] The insulating member 131 is formed of an insulating material. For example, polyimide can be used as the main material of the insulating member 131. Alternatively, the main material of the insulating member 131 can be glass epoxy, which is obtained by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and curing the thermosetting insulating resin, or liquid crystal polymer. Furthermore, a resist such as solder resist can be used in the insulating member.

[0140] (Light-emitting module 901) In the light-emitting module 901, one or more light-emitting devices 1 are mounted on the wiring board 101. The upper surface 101A of the wiring board 101 can be called the mounting surface, and the wiring board 101 can be called a mounting board. In the light-emitting module 901, light-emitting devices 1 are arranged in each connection area 101G.

[0141] One or more light-emitting devices 1 can consist of two or more light-emitting devices 1, including a first light-emitting device 1A and a second light-emitting device 1B. The first light-emitting device 1A is located in the first connection area 101G1, and the second light-emitting device 1B is located in the second connection area 101G2.

[0142] The first light-emitting device 1A and the second light-emitting device 1B are arranged so that the first outer surface 11D1 of the first light-emitting device 1A and the first outer surface 11D1 of the second light-emitting device 1B face each other. This allows the light emitted from each light-emitting device 1 to be brought closer together. Furthermore, by setting the distance D1 between the first connection area 101G1 and the second connection area 101G2 to 0.25 mm or more and 0.4 mm or less, the light emitted from each light-emitting device 1 is brought closer together while suppressing unintended leakage or contact between the two light-emitting devices, leading to improved production stability.

[0143] The direction opposite to the first direction in the first light-emitting device 1A becomes the first direction in the second light-emitting device 1B. Hereafter, unless otherwise specified, the first direction in the first light-emitting device 1A and the first direction in the second light-emitting device 1B will simply be referred to as "first direction".

[0144] The first outer surface 11D1 of the first light-emitting device 1A is located inside the outer edge of the first connection region 101G1 when viewed from above, and the first outer surface 11D1 of the second light-emitting device 1B is located inside the outer edge of the second connection region 101G2 when viewed from above.

[0145] The distance D2 in the first direction from the first outer surface 11D1 of the first light-emitting device 1A to the first outer surface 11D1 of the second light-emitting device 1B is 0.4 mm or more and less than 1.5 mm. Setting this distance to 0.4 mm or more allows for stable bonding of the first light-emitting device 1A and the second light-emitting device 1B to the wiring board 101, while setting it to less than 1.5 mm allows the two light-emitting devices 1 to be placed closer together.

[0146] In a top view, the distance D3 in the first direction between the optical axis of the lens portion 72A of the optical element 70 of the first light-emitting device 1A and the optical axis of the lens portion 72A of the optical element 70 of the second light-emitting device 1B is less than 6.36 mm. This distance may be less than 5.88 mm. These two lens portions 72A are arranged side by side in the first direction. Note that the distance D3 is greater than the width of the lens portions 72A in the first direction.

[0147] Although embodiments of the present invention have been described above, the light-emitting devices and light-emitting modules of the present invention are not strictly limited to the light-emitting devices or light-emitting modules of each embodiment. In other words, the present invention is not limited to the external form or structure of the light-emitting devices or light-emitting modules disclosed in each embodiment. The present invention can be applied without requiring all components to be present. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, or change of material, and the invention described in the claims is then specified to be applicable.

[0148] Through the information described herein so far, the following technical matters are disclosed: (Section 1) A base having a first upper surface, a second upper surface located above the first upper surface, a first outer surface, and a second outer surface located opposite the first outer surface, One or more light-emitting elements arranged on the substrate, On the first upper surface, in a top view, one or more reflective members are arranged between the one or more light-emitting elements and the first outer surface, and reflect light emitted from the one or more light-emitting elements in a first direction, A lid having a first side surface that is joined to the second upper surface and faces the same direction as the first outer surface, A lens member is positioned above the lid, joined to the lid, and having a first side surface facing the same direction as the first outer surface, Equipped with, A light-emitting device having a plane perpendicular to the first outer surface and perpendicular to the first upper surface, and in a cross-sectional view through the plane passing through the reflective member, the first side surface of the lens member is located in the first direction relative to the first side surface of the lid and in the direction opposite to the first direction relative to the first outer surface. (Section 2) The light-emitting device according to item 1, wherein, in a top view, the first side surface of the lens member does not overlap with either the first side surface or the first outer surface of the cover, and is located between the first side surface and the first outer surface of the cover. (Section 3) The substrate has a first inner surface located in the first direction relative to the one or more reflective members, and a second inner surface facing the first inner surface. The light-emitting device according to claim 1 or 2, wherein, in a top view, the one or more reflective members are positioned at a distance of less than 0.33 mm from the first inner surface. (Section 4) The light-emitting device according to any one of claims 1 to 3, wherein, in a top view, the maximum distance in the first direction from the first side surface to the first outer surface of the lid is 0.25 mm or less. (Section 5) The lens member has a lens portion and a non-lens portion that surrounds the lens portion when viewed from above. The first side surface of the lens member is included in the non-lens portion, The light-emitting device according to any one of claims 1 to 4, wherein, when viewed from above, the shortest distance in the first direction from the first side surface of the lens member to the outer edge of the lens portion is 0.262 mm or less. (Section 6) The light-emitting device according to item 5, wherein, in a top view, the first side surface of the cover overlaps with the non-lens portion and does not overlap with the outer edge of the lens portion. (Section 7) The lid has a second side facing the opposite side of the first side, The lens member has a second side surface opposite to the first side surface, The light-emitting device according to any one of claims 1 to 6, wherein, with respect to the first direction, the distance from the first side surface of the lid to the first side surface of the lens member is smaller than the distance from the second side surface of the lid to the second side surface of the lens member. (Section 8) A first light-emitting device which is a light-emitting device described in any one of paragraphs 1 to 7, A second light-emitting device which is a light-emitting device described in any one of paragraphs 1 to 7, A mounting substrate having a mounting surface provided with a first connection region and a second connection region arranged in a unidirectional direction, Equipped with, The first light-emitting device is located in the first connection area, The second light-emitting device is located in the second connection area, A light-emitting module in which a first light-emitting device and a second light-emitting device are arranged such that the first outer surface of the first light-emitting device and the first outer surface of the second light-emitting device face each other. (Section 9) The light-emitting module according to item 8, wherein, in a top view, the distance in the first direction between the optical axis of the lens in the lens member of the first light-emitting device and the optical axis of the lens in the lens member of the second light-emitting device is less than 5.88 mm. [Industrial applicability]

[0149] The light-emitting device or light-emitting module described in the embodiment can be used in a projector. In other words, a projector is one application to which the present invention applies. However, the present invention is not limited to this and can be used in various applications such as lighting, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of Symbols]

[0150] 1. Light-emitting device 1A First light-emitting device 1B Second light-emitting device 10 packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11C1, 11C5, first side 11C2, 11C6, second side 11C3, 11C7, third side 11C4, 11C8, 4th side 11D External surface 11D1 1st outer surface 11D2 2nd outer surface 11E Inside surface 11E1 1st inner surface 11E2 2nd inner surface 11th floor step section 11F1 First step section 11F2 Second step section 11G top surface 11H side 11M base 11N frame 12A wiring section 12A1 1st wiring section 12A2 2nd wiring section 13A Joint Pattern 14 Lid 14A Top 14A1 First side 14A2 Second side 14A3 Third side 14A4 Fourth side 14B Bottom 14C side 14C1 1st side 14C2 2nd side 20 Light-emitting elements 21A Top 21B Bottom surface 21C side 22 Light exit surface 30 Submount 31A Top 31B Bottom surface 31C side 40 Reflective material 41A Bottom 41B Light reflective surface 41C side 60 Wiring 70 Optical components (lens components) 71A Top 71B Bottom side 71C side 71C1 1st side 71C2 2nd side 71D Lens surface (optical surface) 72A Lens section 72B Non-lens section 80 Joining member 101 Wiring board 101A Top 101B Bottom surface 101C side 101D Heat dissipation part 101E Electrode section 101F Insulation 101G connection area 101G1 First connection area 101G2 Second Connection Area 111 Heat dissipation component 121 Electrode Member 131 Insulating material 901 Light-emitting module

Claims

1. A base having a first upper surface, a second upper surface located above the first upper surface, a first outer surface, and a second outer surface located opposite the first outer surface, One or more light-emitting elements arranged on the substrate, On the first upper surface, in a top view, one or more reflective members are arranged between the one or more light-emitting elements and the first outer surface, and reflect light emitted from the one or more light-emitting elements in a first direction, A lid having a first side surface that is joined to the second upper surface and faces the same direction as the first outer surface, A lens member is positioned above the lid, joined to the lid, and having a first side surface facing the same direction as the first outer surface, Equipped with, A light-emitting device having a plane perpendicular to the first outer surface and perpendicular to the first upper surface, and in a cross-sectional view through the plane passing through the reflective member, the first side surface of the lens member is located in the first direction relative to the first side surface of the lid, and in the direction opposite to the first direction relative to the first outer surface.

2. The light-emitting device according to claim 1, wherein, in a top view, the first side surface of the lens member does not overlap with either the first side surface or the first outer surface of the cover, and is located between the first side surface and the first outer surface of the cover.

3. The substrate has a first inner surface located in the first direction relative to the one or more reflective members, and a second inner surface facing the first inner surface. The light-emitting device according to claim 1, wherein, in a top view, the one or more reflective members are arranged at a distance of less than 0.33 mm from the first inner surface.

4. The light-emitting device according to claim 1, wherein, in a top view, the maximum distance in the first direction from the first side surface to the first outer surface of the lid is 0.25 mm or less.

5. The lens member has a lens portion and a non-lens portion that surrounds the lens portion when viewed from above. The first side surface of the lens member is included in the non-lens portion, The light-emitting device according to claim 1, wherein, in a top view, the shortest distance in the first direction from the first side surface of the lens member to the outer edge of the lens portion is 0.262 mm or less.

6. The light-emitting device according to claim 5, wherein, in a top view, the first side surface of the cover overlaps with the non-lens portion and does not overlap with the outer edge of the lens portion.

7. The lid has a second side facing the opposite side of the first side, The lens member has a second side surface opposite to the first side surface, With respect to the first direction, the distance from the first side surface of the lid to the first side surface of the lens member is smaller than the distance from the second side surface of the lid to the second side surface of the lens member, as described in claim 1.

8. A first light-emitting device which is a light-emitting device according to any one of claims 1 to 7, A second light-emitting device which is a light-emitting device according to any one of claims 1 to 7, A mounting substrate having a mounting surface provided with a first connection region and a second connection region arranged in a unidirectional direction, Equipped with, The first light-emitting device is arranged in the first connection area, The second light-emitting device is located in the second connection area, A light-emitting module in which a first light-emitting device and a second light-emitting device are arranged such that the first outer surface of the first light-emitting device and the first outer surface of the second light-emitting device face each other.

9. The light-emitting module according to claim 8, wherein, in a top view, the distance in the first direction between the optical axis of the lens in the lens member of the first light-emitting device and the optical axis of the lens in the lens member of the second light-emitting device is less than 5.88 mm.

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