Films for packaging and packaging

Abstract

The objective is to develop a packaging film that offers excellent barrier properties and high processability. [Solution] The solution comprises a sealant material, a substrate located on one side of the sealant material, a primer coat layer located between the sealant material and the substrate, a coating material, and an inorganic vapor deposition layer, wherein the coating material is a resin layer containing a thermoplastic styrene elastomer, the primer coat layer is a resin layer containing at least one selected from acrylic resin, polyurethane, and liquid paraffin, and the inorganic vapor deposition layer is SiO x It consists of a vapor-deposited layer containing [a specific substance].

Description

[Technical Field]

[0001] This invention relates to a film for packaging and packaging. [Background technology]

[0002] Packaging films with barrier properties such as oxygen barrier and water vapor barrier are widely used as packaging materials for food, pharmaceuticals, and other products. For example, Patent Document 1 proposes a barrier laminated film comprising a gas barrier coating film provided on an unstretched polyolefin resin film and an aluminum vapor-deposited layer provided on the gas barrier coating film. The invention of Patent Document 1 has oxygen barrier properties, water vapor barrier properties, light shielding properties and gloss properties equivalent to those of aluminum vapor-deposited polyethylene terephthalate (aluminum vapor-deposited PET), and improvements have been made to adhesion and heat sealability. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2013-22918 [Overview of the project] [Problems that the invention aims to solve]

[0004] For certain applications, packaging films require even higher barrier properties (especially water vapor barrier properties). Replacing aluminum vapor deposition with silica vapor deposition to improve water vapor barrier properties presents a problem: the barrier properties decrease after bag manufacturing (poor processability).

[0005] This invention has been made in view of the above circumstances, and aims to provide a packaging film that has excellent barrier properties and high processability. [Means for solving the problem]

[0006] As a result of diligent research, the inventors of this invention have obtained the following findings. Inorganic vapor-deposited layers (especially silica vapor-deposited layers) are rigid and brittle compared to resin films. Therefore, when packaging films are manufactured, if mechanical force is applied to the packaging film or if it is subjected to overheating, the silica vapor-deposited layer cannot follow the expansion and contraction or bending of the resin film, resulting in detachment or cracking. We discovered that providing a protective layer of a specific material to the silica vapor-deposited layer can prevent detachment and cracking of the silica vapor-deposited layer, and thus completed the present invention.

[0007] The packaging film of the present invention has the following configuration. <1> The material comprises a sealant material, a substrate located on one side of the sealant material, a primer coat layer, a coating material, and an inorganic vapor deposition layer located between the sealant material and the substrate. The primer coat layer is a resin layer comprising at least one selected from acrylic resin, polyurethane, and liquid paraffin. The coating material is a resin layer containing a thermoplastic styrene elastomer. The inorganic vapor-deposited layer is SiO x A packaging film that has a vapor-deposited layer containing a vapor-deposited layer. <2> From the substrate side, the primer coat layer, the coating material, and the vapor-deposited substrate are positioned in this order. The vapor-deposited substrate has the vapor-deposited layer, <1> The packaging film described above. <3> The coating further comprises paraffin. <1> or <2> The packaging film described above. <4> The primer coat layer further comprises an epoxy resin. <1> ~ <3> A packaging film as described in any of the following. <5> <1> ~ <4> A packaging body made from a packaging film described in any of the above. [Effects of the Invention]

[0008] The packaging film of the present invention offers excellent barrier properties and improved processability.

Brief Description of the Drawings

[0009] [Figure 1] It is a cross-sectional view of a film for a package according to an embodiment of the present invention. [Figure 2] It is a cross-sectional view of a film for a package according to another embodiment of the present invention.

Modes for Carrying Out the Invention

[0010] (Film for Package) The film for a package of the present invention has a sealant material, a base material located on one surface of the sealant material, a primer coat layer located between the sealant material and the base material, a coating material, and an inorganic vapor deposition layer. The distribution form of the film for a package may be a roll-shaped wound body or a laminate of sheets cut out into a rectangular shape or the like.

[0011] The film for a package according to an embodiment of the present invention will be described with reference to the drawings. The film 1 for a package in FIG. 1 is a laminate in which a base material 10, a primer coat layer 20, a coating material 30, a vapor-deposited base material 40, and a sealant material 50 are laminated in this order. In the present embodiment, the base material 10, the primer coat layer 20, the coating material 30, the vapor-deposited base material 40, and the sealant material 50 are in close contact with each other. Also, in the present embodiment, the vapor-deposited base material 40 has a base layer 42 and an inorganic vapor deposition layer 44 located on one surface of the base layer 42. That is, the film 1 for a package of the present embodiment has a sealant material 50, a base material 10, a primer coat layer 20 located between the sealant material 50 and the base material 10, a coating material 30, and an inorganic vapor deposition layer 44.

[0012] The thickness T1 of the film 1 for the package is appropriately determined in consideration of the intended use (e.g., the size and capacity of the package after bag-making, etc.). The thickness T1 is preferably, for example, 30 to 120 μm, more preferably 40 to 80 μm. When the thickness T1 is at least the above lower limit value, the strength and rigidity of the film 1 for the package can be further enhanced. When the thickness T1 is at most the above upper limit value, the flexibility of the film 1 for the package can be further enhanced, and handling becomes easier. In this article, the thickness is, for example, the average value of the values measured with a thickness gauge for 10 randomly selected points.

[0013] The oxygen permeability of the film 1 for the package is preferably 2.0 mL / (m 2 ·day) or less, more preferably 1.5 mL / (m 2 ·day) or less, still more preferably 1.0 mL / (m 2 ·day) or less. When the oxygen permeability of the film 1 for the package is at most the above upper limit value, deterioration of the contents can be suppressed more favorably. The lower the oxygen permeability of the film 1 for the package, the more preferable it is, and the lower limit value of the oxygen permeability is preferably 0 mL / (m 2 ·day). In this article, the oxygen permeability can be measured according to the test method for oxygen gas permeability by the electrolytic sensor method described in Appendix A of JIS K7126-2:2006. The oxygen permeability of the film 1 for the package can be adjusted by the material and thickness of the base material 10, the material and thickness of the coating material 30, the type and thickness of the inorganic vapor deposition layer 44 or the primer coat layer 20 described later, and combinations thereof.

[0014] The water vapor permeability of the film 1 for the package is preferably 1.0 g / (m 2 ·day) or less, more preferably 0.6 g / (m 2 ·day) or less, still more preferably 0.3 g / (m 2 ·day) or less. When the water vapor permeability of the base material 10 is at most the above upper limit value, deterioration of the contents can be suppressed more favorably. The lower the water vapor permeability, the more preferable it is, and the lower limit value of the water vapor permeability is preferably 0 g / (m 2 ·day). Water vapor transmission can be measured according to the test method described in JIS K7129:2008 for humidity sensors, using test condition 1 as shown in Table A.1. The water vapor transmission rate can be adjusted by the material and thickness of the substrate 10, the material and thickness of the primer coat layer 20, the material and thickness of the coating material 30, the type and thickness of the inorganic vapor deposition layer 44 (described later), and combinations thereof.

[0015] <Base material>

[0016] The base material 10 is a resin film. Examples of materials for the base material 10 include polyester film, polyolefin film, polyamide (PA) film, cellophane, and laminates thereof. Examples of polyester films include polyethylene terephthalate (PET), biaxially oriented PET (OPET), and polybutylene terephthalate (PBT). Examples of polyolefin films include polypropylene (PP), biaxially oriented polypropylene (OPP), unoriented polypropylene (CPP), high-density polyethylene (HDPE), and medium-density polyethylene (MDPE). Examples of polyamide (PA) films include biaxially oriented nylon (ONy). Examples of laminates include laminates of the above-mentioned resin films. Since the strength of the packaging film 1 can be further increased, the base layer 42 is preferably PET, OPET, PP, OPP, or PA, and more preferably OPET or ONy.

[0017] The thickness T10 of the base material 10 is preferably 10 to 30 μm, and more preferably 10 to 20 μm. If the thickness T10 is above the lower limit, the strength and rigidity of the packaging film 1 can be further increased. In addition, if the thickness T10 is above the lower limit, the water vapor barrier properties of the packaging film 1 can be further increased. If the thickness T10 is below the upper limit, the flexibility of the packaging film 1 can be increased, making it easier to handle. The thickness T10 is determined by observing the cross-section of the packaging film 1, cut in the thickness direction, under a microscope (for example, at 200x magnification), and taking the average value of 10 randomly selected points.

[0018] The base material 10 may have a single-layer structure or a multi-layer structure. The substrate 10 may have printing applied to its surface or between its layers.

[0019] <Primer coat layer> The primer coat layer 20 is a resin layer containing at least one selected from acrylic resin, polyurethane, and liquid paraffin. By having the primer coat layer 20, the packaging film 1 can enhance interlayer adhesion and improve the barrier properties of the packaging film 1. Acrylic resins, polyurethanes, and liquid paraffins are collectively referred to as PC major polymers.

[0020] Examples of acrylic resins include polymers of acrylic acid esters (polyacrylic acid), polymers of methacrylic acid esters (polymethacrylic acid), polymers of acrylamide (polyacrylamide), and copolymers of acrylic acid esters and methacrylic acid esters.

[0021] Examples of acrylic acid esters include methyl acrylate, ethyl acrylate, butyl acrylate, and other acrylic acid esters having an alkyl group with 1 to 5 carbon atoms; sodium acrylate and potassium acrylate.

[0022] Examples of methacrylic acid esters include methyl methacrylate, ethyl methacrylate, and butyl methacrylate, which have an alkyl group having 1 to 5 carbon atoms.

[0023] The acrylic resin constituting the primer coat layer 20 is preferably sodium polyacrylate, polymethacrylate, or polyacrylamide.

[0024] The molecular weight of the acrylic resin constituting the primer coat layer 20 is preferably 7,000 to 30,000.

[0025] The acrylic resin constituting the primer coat layer 20 may contain constituent units other than acrylic acid esters, methacrylic acid esters, and acrylamide (collectively, (meth)acrylic acid). However, the (meth)acrylic acid content is preferably 50 mol% or more, more preferably 80 mol% or more, even more preferably 90 mol% or more, and may be 100 mol% based on the total number of constituent units of the acrylic resin constituting the primer coat layer 20.

[0026] Examples of polyurethanes include A3210 manufactured by Mitsui Chemicals, Inc.

[0027] Examples of liquid paraffin include Kaneda's Hycol K160. The molecular weight of the liquid paraffin is preferably, for example, 200 to 1500, and more preferably 300 to 800.

[0028] The content of the main PC polymer relative to the total mass of the primer coat layer 20 is preferably 70% by mass or more, more preferably 75% by mass or more, and even more preferably 80% by mass or more. If the content of the main PC polymer is above the lower limit mentioned above, the barrier properties can be further enhanced. The upper limit of the content of the main PC polymer relative to the total mass of the primer coat layer 20 is preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less. When the content of the main PC polymer is below the above upper limit, the barrier properties can be further enhanced.

[0029] The primer coat layer 20 may further contain epoxy resin, a surface roughening agent, etc. The primer coat layer 20, by containing epoxy resin, can further improve its adhesion to other layers. If the primer coat layer 20 contains epoxy resin, the epoxy resin content is preferably more than 0% by mass and 20% by mass or less, and more preferably 2% to 5% by mass, relative to the total mass of the primer coat layer 20.

[0030] The primer coat layer 20, by containing a surface roughening agent, exhibits an anchoring effect, thereby further improving adhesion with other layers. Examples of surface roughening agents include SiO2 and ZnO2. If the primer coat layer 20 contains a surface roughening agent, the amount of the surface roughening agent is preferably more than 0% by mass and 10% by mass or less, and more preferably 1 to 5% by mass, relative to the total mass of the primer coat layer 20.

[0031] The thickness T20 of the primer coat layer 20 is preferably 0.1 to 10 μm, more preferably 0.5 to 5.0 μm, and even more preferably 1.0 to 3.0 μm. If the thickness T20 is above the lower limit, the barrier properties can be further enhanced. If the thickness T20 is below the upper limit, the adhesion can be further enhanced.

[0032] <Coating material> The coating material 30 is a resin layer containing thermoplastic styrene elastomer (TPS). The packaging film 1, by having the coating material 30, enhances the toughness and heat resistance of the inorganic vapor-deposited layer 44, protecting the inorganic vapor-deposited layer 44 from mechanical forces or heat applied to the packaging film 1 during bag making. This enhances the toughness and heat resistance of the inorganic vapor-deposited layer 44, thereby further improving the barrier properties of the packaging film 1.

[0033] Examples of TPS include styrene-isoprene-styrene polymer (SIS), styrene-butadiene-styrene polymer (SBS), styrene-ethylene-butadiene-styrene polymer (SEBS), and styrene-ethylene-propylene-styrene polymer (SEPS).

[0034] The preferred MFR (Melt Flow Rate) of TPS is 0.5 to 10.0 g / 10 min.

[0035] The TPS content in the coating material 30 is preferably 50% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and may be 100% by mass, based on the total mass of the resin constituting the coating material 30.

[0036] Examples of resins other than TPS that make up the coating material 30 include polystyrene and polyolefin.

[0037] The coating material 30 may contain paraffin. By containing paraffin, the water vapor barrier properties of the coating material 30 can be further enhanced. As paraffin, a chain-like saturated hydrocarbon having 20 to 100 carbon atoms is preferred, and a chain-like saturated hydrocarbon having 100 to 700 carbon atoms is more preferred. If the number of carbon atoms is above the lower limit, further improvement in water vapor barrier properties can be achieved. If the number of carbon atoms is below the upper limit, adhesion can be further improved.

[0038] If the coating material 30 contains paraffin, the paraffin content is preferably 3 to 30% by mass, and more preferably 5 to 20% by mass, based on 100% by mass of the total of paraffin and resin. If the paraffin content is above the lower limit, the water vapor barrier properties can be further enhanced. If the paraffin content is below the upper limit, the adhesion can be further enhanced.

[0039] The thickness T30 of the coating material 30 is preferably 1 to 5 μm, and more preferably 2 to 3 μm. If the thickness T30 is greater than or equal to the lower limit above, further improvement in barrier properties can be achieved. The thickness T30 can be determined, for example, by observing the cross-section of the packaging film 1 cut in the thickness direction under a microscope (e.g., 200x magnification) and taking the average value of 10 randomly selected points.

[0040] <Vapour-deposition base material> The vapor-deposited substrate 40 has a base layer 42 and an inorganic vapor-deposited layer 44 located on one side of the base layer 42. In this embodiment, the inorganic vapor-deposited layer 44 is located on the side facing the sealant material 50, but the present invention is not limited thereto, and the inorganic vapor-deposited layer 44 may be located on the side facing the substrate 10.

[0041] ≪Base layer≫ The base layer 42 is a resin film. The material of the base layer 42 is the same as the material of the substrate 10. The material of the base layer 42 may be the same as the material of the substrate 10, or it may be different. The thickness T42 of the base layer 42 is preferably 10 to 30 μm, and more preferably 12 to 20 μm. The thickness T42 may be the same as or different from the thickness T10.

[0042] ≪Inorganic vapor deposited layer≫ The inorganic vapor deposition layer 44 is a layer in which inorganic material is deposited on the surface of the base layer 42. The inorganic vapor deposition layer 44 is made of SiO x The vapor-deposited layer contains SiO. x Vapor-deposited layer (where x is 1 to 2) or SiO x A binary deposition layer of the inorganic vapor deposition layer and another metal oxide (e.g., Al2O3) is preferred. That is, the inorganic vapor deposition layer 44 can be, for example, a silica vapor deposition layer or silica-alumina (SiO2O3). x A vapor-deposited layer (Al2O3) is preferred. When the inorganic vapor deposition layer 44 is a binary vapor deposition layer, SiO2 is the total mass of the inorganic vapor deposition layer 44. x The content is preferably 40-90% by mass, more preferably 50-80% by mass, and even more preferably 60-70% by mass. SiO in the inorganic vapor deposition layer 44 x The content can be measured according to JIS K1150-1994.

[0043] The thickness T44 of the inorganic vapor deposition layer 44 is preferably 20 to 100 nm, more preferably 35 to 85 nm, and even more preferably 50 to 70 nm. If the thickness T44 is above the lower limit, the oxygen barrier and water vapor barrier properties of the packaging film 1 can be further enhanced. If the thickness T44 is below the upper limit, the occurrence of delamination due to cohesive failure can be suppressed. Therefore, the impact resistance of the packaging film 1 can be further enhanced. The thickness T44 can be determined, for example, by observing the cross-section of the packaging film 1 cut in the thickness direction under a microscope (e.g., 200x magnification) and taking the average value of 10 randomly selected points.

[0044] <Sealant material> The sealant material 50 is not particularly limited as long as it is a material that can be heat-sealed. Examples of sealant material 50 include resin sheets containing polyolefin. Examples of polyolefin resins contained in sealant material 50 include polypropylene (PP), polyethylene (PE), ethylene / vinyl acetate copolymer (EVA), ethylene / acrylic acid copolymer (EAA), ethylene / methacrylic acid copolymer (EMAA), ethylene / methyl acrylate copolymer (EMA), ethylene / methyl methacrylate copolymer (EMMA), ethylene / ethyl acrylate copolymer (EEA), and ionomer resins. Examples of polyethylene (PE) include low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). Among these, PP and PE are preferred as the polyolefin of the sealant material 50. These polyolefin resins may be used individually or in combination of two or more types.

[0045] The sealant material 50 may contain resins other than polyolefin, or additives, etc. These may be used individually or in combination of two or more types.

[0046] The thickness T50 of the sealant material 50 is preferably 10 to 80 μm, and more preferably 20 to 50 μm. If the thickness T50 is above the lower limit, the seal strength can be increased. If the thickness T50 is below the upper limit, the flexibility of the packaging film 1 can be increased. The thickness T50 of the sealant material 50 is determined by observing the cross-section of the packaging film 1, cut in the thickness direction, under a microscope (for example, at 200x magnification), and taking the average value of 10 randomly selected points.

[0047] The sealant material 50 may be a single layer or a multi-layer structure of 2 to 4 layers.

[0048] <Manufacturing method> The packaging film 1 of the present invention can be manufactured by a conventionally known method for manufacturing multilayer films. For example, a primer coat layer 20 and a covering material 30 are provided on one side of a base material 10, and then a vapor-deposited base material 40 and a sealant material 50 are provided on the surface of the covering material 30 to form a packaging film 1.

[0049] Methods for providing a primer coat layer 20 on the surface of the substrate 10 include gravure printing. Methods for applying the coating material 30 to the surface of the primer coat layer 20 include gravure printing. One method for providing the vapor-deposited substrate 40 on the surface of the coating material 30 is to bond the vapor-deposited substrate 40 to the coating material 30 with or without an adhesive. One method for providing a sealant material 50 to the surface of the vapor-deposited substrate 40 is to adhere a pre-prepared sealant material 50 to the vapor-deposited substrate 40. Alternatively, one method is to melt the resin constituting the sealant material 50 and coat it onto the vapor-deposited substrate 40 using a T-die.

[0050] (packaging) The packaging body of the present invention is a bag made by forming a bag from the packaging film of the present invention. Examples of packaging materials include bags made by heat-sealing the sealant materials 50 of packaging film 1 together. Examples of packaging forms include gusseted bags, three-sided sealed bags, four-sided sealed bags, gusseted bags, stand-up pouches, and resealable versions of these. Additionally, examples of packaging forms include vertical pillow packaging bags.

[0051] <Manufacturing method for packaging> The method for manufacturing the packaging is determined appropriately according to the form of the packaging. An example of a manufacturing method for pillow packaging bags is described below.

[0052] Using a pillow packaging machine, the packaging film 1 is unwound from the rolled material, and the contents are wrapped in the packaging film while the back and both ends are heat-sealed. When the packaging film 1 is unwound, mechanical force is applied to the packaging film 1, such as by being pulled by the guide roll of the pillow packaging machine. In addition, when the packaging film 1 is unwound, heat is applied to the packaging film 1 due to friction with the guide roll. Furthermore, when heat sealing is performed, the packaging film 1 becomes overheated. The packaging film 1 of this embodiment has a base material 10, a sealant material 50, a primer coat layer 20, a coating material 30, and a vapor-deposited base material 40 located between them, and these layers are in close contact with each other. As a result, the inorganic vapor-deposited layer 44 follows the other layers, preventing damage to the inorganic vapor-deposited layer 44 due to mechanical force or heat (detachment, cracking, etc.).

[0053] (Other embodiments) The packaging film of the above-described embodiment has a vapor-deposited substrate between the sealant material and the substrate, but the present invention is not limited thereto. The packaging film 100 shown in Figure 2 is an example of a packaging film that does not have a vapor-deposited substrate between the sealant material and the substrate. The packaging film 100 will be described below, but components that are the same as those in packaging film 1 will be given the same reference numerals and their descriptions will be omitted. As shown in Figure 2, the packaging film 100 has a base material 10, an inorganic vapor deposition layer 44, a primer coat layer 20, a covering material 30, and a sealant material 50 in this order. In this embodiment, the inorganic vapor deposition layer 44 is located on one side of the substrate 10. That is, in this embodiment, the substrate 10 and the inorganic vapor deposition layer 44 form the vapor deposition substrate.

[0054] In the above-described embodiment, the primer coat layer 20, the coating material 30, and the inorganic vapor deposition layer 44 (vapor deposition substrate 40) are positioned in this order from the substrate 10 side, but the present invention is not limited to this. The positional relationship between the primer coat layer 20, the coating material 30, and the inorganic vapor deposition layer 44 may be in any order.

[0055] (effect) As described above, the packaging film of the present invention has a primer coat layer, a coating material, and an inorganic vapor deposition layer between the substrate and the sealant material, which suppresses damage to the inorganic vapor deposition layer in the packaging film. For this reason, the packaging film of the present invention has excellent barrier properties and processability, and the resulting packaging has excellent barrier properties. [Examples]

[0056] (Materials used) <Base material> • Base material 1: 12μPET, PET film with a thickness of 12μm. • Substrate 2: 15μNy, 15μm thick polyamide film. • Base material 3: 20μ OPP, PP film with a thickness of 20μm. • Substrate 4: 12 μm thick PET with SiO x (60nm thick) deposited onto the surface.

[0057] <Sealant material> • 30μPE: Low-density polyethylene film (LDPE), 30μm thick. • 30μPP: Unoriented polypropylene film (CPP), 30μm thick. • 30μEVA: Ethylene / vinyl acetate copolymer (EVA), 30μm thick.

[0058] <Coating material> • SIS: Styrene-isoprene-styrene polymer, Kraton D, SIS. SEPS: Styrene-ethylene-propylene-styrene polymer, manufactured by Kuraray Co., Ltd., Septon 2002. Paraffin: Artience KH FRPW F58N.

[0059] <Primer coat layer (PC layer)> • PMMA: Manufactured by Mitsubishi Chemical Corporation, Metabrane. • Polyurethane: Manufactured by Mitsui Chemicals, A3210. • Epoxy resin: Manufactured by Mitsubishi Chemical Corporation, 827. • Liquid paraffin: Kaneda Corporation, Highcol K160. • SiO2: Manufactured by Mizusawa Chemical Industries, Ltd., Mizukasil.

[0060] <Vapour-deposition base material> • Deposition substrate 1: 12 μm thick PET with SiO x (60nm thick) deposited onto the surface. • Deposition substrate 2: 12 μm thick PET with SiO x This is a material with Al2O3 (60 nm thick) deposited on it. x :Al2O3=60:40 (mass ratio). • Deposition substrate 3: PET with a thickness of 12 μm onto which Al2O3 (60 nm thick) has been deposited. • Vapor deposition substrate 1' (comparative vapor deposition substrate): 15 μm EVOH, EVOH with a thickness of 15 μm.

[0061] (Evaluation method) <Evaluation of water vapor barrier properties (WVTR)> For each example, the vapor-deposited film, the packaging film immediately after curing and immediately after gel-testing, and the packaging itself were measured for water vapor transmission under test condition 1 described in Table A.1, in accordance with the test method described in JIS K7129:2008 for the moisture sensor method, and the results are shown in the table.

[0062] <Evaluation of oxygen barrier properties (O2TR)> For each example, the vapor-deposited film, the packaging film immediately after curing and immediately after gel test, and the packaging itself were measured for oxygen gas permeability according to the test method for oxygen gas permeability using the electrolytic sensor method described in Annex A of JIS K7126-2:2006, and the results are shown in the table.

[0063] <Gelbotest> The gelbo test was performed using a gelboflex tester (manufactured by Rigaku Kogyo Co., Ltd., MIL-B131H). Under conditions of 23°C and 65% relative humidity, a 21cm x 29cm packaging film was twisted 400° with a 3-inch (7.62cm) stroke using the gelboflex tester. This reciprocating motion was repeated 100 times at a speed of 40 times per minute (40 times / min).

[0064] <Bag making> Using a horizontal pillow packaging machine (NSW type, manufactured by Omori Machinery Co., Ltd.), the packaging film for each example was made into bags to obtain a packaging body (50 mm x 100 m x 20 mm back-sealed).

[0065] (Experimental Examples 1-5, 7) A packaging film similar to packaging film 1 in Figure 1 was manufactured according to the specifications in Tables 1 and 2. A PC layer and a coating material were applied to the substrate using gravure printing. Next, the vapor-deposited substrate was bonded to the coating material with an adhesive, and the sealant material was bonded to the coating material with an adhesive. The materials were then cured at room temperature for 24 hours to obtain packaging films for each example. The water vapor barrier and oxygen barrier properties of the packaging film immediately after curing, the packaging film immediately after gel positivity testing, and the packaging itself were evaluated, and the results are shown in the table.

[0066] (Example 6) A packaging film was obtained in the same manner as in Example 1, except that base material 4 was used instead of base material 1, and vapor-deposited base material 1 was omitted. The water vapor barrier and oxygen barrier properties of the packaging film immediately after curing, the packaging film immediately after gel positivity testing, and the packaging itself were evaluated, and the results are shown in the table.

[0067] (Comparative Examples 1-4) A packaging film was obtained in the same manner as in Examples 1 to 7, except for the layer configuration shown in Table 1. The water vapor barrier and oxygen barrier properties of the packaging film immediately after curing, the packaging film immediately after gel positivity testing, and the packaging itself were evaluated, and the results are shown in the table.

[0068] [Table 1]

[0069] [Table 2]

[0070] As shown in Tables 1-2, in Examples 1-7 to which the present invention was applied, the WVTR of the packaging was 0.45 g / (m²). 2 The WVTR is less than or equal to the WVTR of the packaging film immediately after curing (packaging film before processing), and the increase in WVTR of the packaging film is 0.05 g / (m²). 2 The O2TR of the package was less than or equal to (day). In addition, in Examples 1 to 7, the O2TR of the package was 1.25 mL / (m²). 2 The O2TR of the packaging is less than or equal to the O2TR of the packaging film immediately after curing, and the increase in O2TR of the packaging is 0.35 mL / (m²). 2 It was less than (day) Comparative Example 1 is an example without a PC layer. Comparative Example 2 is an example without a coating material. Comparative Example 3 is an example without an inorganic vapor-deposited film. Comparative Example 4 is an example in which an EVOH film is used instead of a vapor-deposited substrate. In Comparative Examples 1-4, the WVTR of the packaging was 1.30 g / (m²). 2 The curing time is 0.2 to 0.70 g / (m²) or longer, and the increase in WVTR of the packaging body compared to the WVTR of the packaging film immediately after curing is 0.2 to 0.70 g / (m²). 2 The O2TR of the packaged material was less than or equal to 0.95 mL / (m²). In addition, in Comparative Examples 1-4, the O2TR of the packaged material was 0.95 mL / (m²). 2 The curing time is 0.05 to 0.60 mL / (m²) or longer, and the increase in O2TR of the packaging compared to the O2TR of the packaging film immediately after curing is 0.05 to 0.60 mL / (m²). 2 It was less than (day) These results confirm that applying the present invention can improve barrier properties and processability. [Explanation of Symbols]

[0071] 1,100 Packaging film 10 Base material 20 Primer coat layer 30 Covering material 40 Vapor deposition substrate 42 Base layer 44 Inorganic vapor deposition layer 50 sealant

Claims

1. The material comprises a sealant material, a substrate located on one side of the sealant material, a primer coat layer, a coating material, and an inorganic vapor deposition layer located between the sealant material and the substrate. The primer coat layer is a resin layer comprising at least one selected from acrylic resin, polyurethane, and liquid paraffin. The coating material is a resin layer containing a thermoplastic styrene elastomer. The inorganic vapor-deposited layer is SiO ｘ A packaging film that has a vapor-deposited layer containing a vapor-deposited layer.

2. From the substrate side, the primer coat layer, the coating material, and the vapor-deposited substrate are positioned in this order. The packaging film according to claim 1, wherein the vapor-deposited substrate has the vapor-deposited layer.

3. The packaging film according to claim 1, wherein the coating material further comprises paraffin.

4. The packaging film according to claim 1, wherein the primer coat layer further comprises an epoxy resin.

5. A packaging body made from a packaging film according to any one of claims 1 to 4.

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