Gaming machines

Abstract

To provide a gaming machine with optimized output to earphones. [Solution] A gaming machine having a predetermined circuit board, wherein the gaming machine has a first sound output means capable of outputting sound, the gaming machine is configured to be connectable to a second sound output means capable of outputting sound, the predetermined circuit board includes a first circuit and a second circuit and is a circuit board that processes an output signal to the second sound output means, and the second circuit is a circuit to which the audio signal processed by the first circuit is input via a predetermined capacitor.

Description

Technical Field

[0006] , , , , , , ,<0000​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​[Effects of the Invention]

[0007] According to the present invention, it is possible to provide a gaming machine with optimized output to earphones. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of slot machine 100 from the front (player side). [Figure 2] This figure shows an example of the winning line. [Figure 3] This is a circuit block diagram of the control unit. [Figure 4] This figure shows an example of the circuit board configuration of slot machine 100. [Figure 5] This is a circuit block diagram of the peripheral board 4191, the earphone amplifier board 4192, and the earphone jack board 4193. [Figure 6] Figure 5 shows an example of the circuit of the earphone amplifier board 4192. [Figure 7] (a) is a table explaining the terms used in the drawing, and (b) is a table explaining the terminal numbers shown in Figure 5. [Figure 8] This diagram shows the connection configuration and pinout of the peripheral board 4191, the earphone amplifier board 4192, and the earphone jack board 4193. [Figure 9] (a) is a table showing the absolute maximum ratings of the earphone amplifier board 4192, (b) is a table showing the recommended operating conditions, and (c) is a table showing the electrical characteristics. [Figure 10] (a) is a diagram showing an example of the circuit of the power supply noise filter 4192a, (b) is a diagram showing an example of the circuit of the DC 5V power supply circuit 4192b, and (c) is a diagram showing an example of the circuit of the reference power supply generation circuit 4192c. [Figure 11] (a) is a diagram showing an example of the audio input level adjustment circuit 4192d, and (b) is a diagram showing an example of the differential amplifier circuit 4192e. [Figure 12](a) is a diagram showing an example of the circuit of the current amplification circuit 4192f, and (b) is a diagram showing an example of the reset control circuit. [Figure 13] It is a timing chart showing changes in the current amplification circuit 4192f at startup and power-off. [Figure 14] (a) is a diagram showing an example of the circuit of the audio output circuit 4192g, and (b) is a diagram showing an example of the circuit of the detection signal noise filter 4192h. [Figure 15] (a) is a diagram showing an example of the circuit of the earphone jack 4193a, (b) is a diagram showing the state where the earphone plug is not inserted, and (c) is a diagram showing the state where the earphone plug is inserted. [Figure 16] It is a diagram showing an example in which a part of the circuit in FIG. 6 is replaced with an IC4192i including the functions of a differential amplifier and current amplification, and the reference power supply generation circuit 4192c is deleted. [Figure 17] It is a diagram showing a part corresponding to the IC4192i in FIG. 16 in the circuit diagram of FIG. 6. [Figure 18] It is a diagram showing an example in which the earphone amplifier board 4192 in FIG. 4 is replaced with an earphone unified board 4194 capable of outputting audio to both wired and wireless earphones. [Figure 19] It is a circuit block diagram of the earphone unified board 4194 shown in FIG. 18. [Figure 20] It is a diagram showing a region corresponding to the ground. [Figure 21] It is a diagram showing an example of the installation location of the earphone jack. [Figure 22] It is a diagram showing an example of the installation location of the earphone jack of a pachinko machine. <​​​​​​​​​​(a) is a top view of the first sub-control board of a slot machine according to one embodiment of the present invention; (b) is a diagram showing the arrangement of each component of the audio circuit shown in (a); (c) is a diagram showing the terminal arrangement of the audio amplifier IC shown in (a) and (b); and (d) is a cross-sectional view of (a) along the YY line. [Figure 27] (a) is a circuit diagram showing the signal lines of the audio circuit shown in Figure 26(a), and (b) is a circuit diagram showing the power lines of the audio circuit shown in Figure 26(a). [Figure 28] (a) is a top view of the first sub-control board on which the components of the first sub-control unit of a slot machine according to one embodiment of the present invention are arranged, and (b) and (c) are diagrams illustrating the ground of the first sub-control board shown in (a). [Figure 29] This is a top view of the first sub-control board of a slot machine according to one embodiment of the present invention (modified example). [Figure 30] (a) is a circuit diagram of the signal lines of the audio circuit shown in Figure 29, and (b) is a circuit diagram of the power lines of the audio circuit shown in Figure 29. [Figure 31] (a) is a diagram showing the first layer of the first sub-control board shown in Figure 29, and (b) is a diagram showing the third layer of the first sub-control board shown in Figure 29. [Figure 32] (a) is a diagram showing the fourth layer of the first sub-control board shown in Figure 29, and (b) is a diagram showing the fifth layer of the first sub-control board shown in Figure 29. [Figure 33] (a) is a diagram showing the seventh layer of the first sub-control board shown in Figure 29, and (b) is a diagram showing the eighth layer of the first sub-control board shown in Figure 29. [Figure 34] (a), (b), and (c) are diagrams illustrating the arrangement layout of audio circuits provided on the first sub-control board of a slot machine according to one embodiment of the present invention. [Figure 35] (a), (b), and (c) are diagrams illustrating the position of the output terminals of the audio amplifier IC of a slot machine according to one embodiment of the present invention, and (d), (e), and (f) are diagrams illustrating the arrangement of each component of the audio circuit of a slot machine according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] Hereinafter, a slot machine embodying an embodiment of the gaming machine of the present invention will be described with reference to the drawings.

[0010] The slot machine of this embodiment, described below, is a gaming machine that proceeds through a series of games in which a predetermined number of game tokens are inserted, and multiple reels, each decorated with multiple types of symbols, start to rotate when a predetermined rotation start instruction operation is received, and the success or failure of internal winnings of multiple types of roles is determined by lottery based on the reception of the rotation start instruction operation, and each of the multiple reels stops rotating individually when a predetermined rotation stop instruction operation is received, and if the conditions determined by the role based on the result of the lottery and the combination of symbols when the multiple reels stop match predetermined payout conditions, game tokens are paid out and the game ends, and if they do not match, the game ends without paying out game tokens.

[0011] First, the basic configuration of the slot machine 100 will be explained using Figures 1 and 2. Figure 1 is an external perspective view of the slot machine 100 as seen from the front (player side). Figure 2 is a diagram showing an example of a winning line.

[0012] The slot machine 100 shown in Figure 1 is an example of a gaming machine according to the present invention, and comprises a main body 101 and a front door 102 attached to the front side of the main body 101 and which can be opened and closed relative to the main body 101. Inside the center of the main body 101 (not shown), there are three reels (left reel 110, middle reel 111, right reel 112) with multiple types of symbols arranged on their outer surfaces, and are configured to rotate inside the slot machine 100. These reels 110 to 112 are driven to rotate by a drive device such as a stepping motor.

[0013] In this embodiment, each pattern is printed at equal intervals in appropriate numbers on a strip-shaped member, and this strip-shaped member is attached to a predetermined circular cylindrical frame material to constitute each reel 110 to 112. From the player's perspective, approximately three patterns are displayed vertically from the display window 113 on the reels 110 to 112, so that a total of nine patterns are visible. To explain in detail using Figure 2, the pattern displayed on the upper part of the left reel 110 (position 1 in the figure) is the left reel upper pattern, the pattern displayed on the middle part of the left reel 110 (position 2 in the figure) is the left reel middle pattern, the pattern displayed on the lower part of the left reel 110 (position 3 in the figure) is the left reel lower pattern, the pattern displayed on the upper part of the middle reel 111 (position 4 in the figure) is the middle reel upper pattern, the pattern displayed on the middle part of the left reel 111 (position 5 in the figure) is the middle reel middle pattern, and the pattern on the lower part of the middle reel 111 is the middle reel upper pattern. The symbols displayed on the first row (position 6 in the diagram) are called the lower row symbols of the middle reel, the symbols displayed on the upper row of the right reel 112 (position 7 in the diagram) are called the upper row symbols of the right reel, the symbols displayed on the middle row of the right reel 112 (position 8 in the diagram) are called the middle row symbols of the right reel, and the symbols displayed on the lower row of the right reel 112 (position 9 in the diagram) are called the lower row symbols of the right reel. Each of the symbols on each reel 110 to 112 is displayed vertically in groups of three, for a total of nine symbols, through the display window 113. By rotating each of the reels 110 to 112, the combination of symbols visible to the player changes. In other words, each of the reels 110 to 112 functions as a display device that can display multiple combinations of symbols in a variable manner. In addition to reels, other electronic image display devices such as liquid crystal displays can also be used as such display devices. Furthermore, in this embodiment, three reels are provided inside the center of the slot machine 100, but the number of reels and their installation positions are not limited to this.

[0014] A backlight (not shown) is positioned on the back of each reel 110 to 112 to illuminate the individual symbols displayed in the display window 113. It is desirable that the backlight be shielded for each symbol so that each symbol is illuminated evenly. Inside the slot machine 100, an optical sensor (not shown) consisting of a light-emitting part and a light-receiving part is provided near each reel 110 to 112, and a light-shielding piece of a certain length provided on the reel passes between the light-emitting part and the light-receiving part of this optical sensor. Based on the detection result of this optical sensor, the rotational position of the symbols on the reels is determined, and the reels 110 to 112 are stopped so that the target symbol is displayed on the winning line.

[0015] The winning line indicator lamp 120 is a lamp that indicates an active winning line. A winning line is a line on which it is determined whether or not a combination of symbols corresponding to a winning combination has been displayed. In this embodiment, only one line is provided, the middle winning line L1, which consists of the middle symbols on the left reel, the middle symbols on the middle reel, and the middle symbols on the right reel. Figure 2 shows this winning line L1. The active winning lines (hereinafter sometimes simply referred to as "active lines") are predetermined by the number of tokens bet as the game medium. The slot machine 100 shown in Figure 1 requires 3 tokens, and when the number of tokens inserted is less than 3, none of the winning lines are active. When 3 tokens are bet, winning line L1 becomes active. When a winning line becomes active, the game can be started by operating the start lever 135. Note that the number of winning lines is not limited to one line. For example, in addition to the middle winning line L1, a total of three lines may be set as valid winning lines: a diagonal winning line consisting of the upper symbol on the left reel, the middle symbol on the middle reel, and the lower symbol on the right reel; and an upward winning line consisting of the lower symbol on the left reel, the middle symbol on the middle reel, and the upper symbol on the right reel. Alternatively, a number of winning lines corresponding to the number of bets may be set as valid winning lines.

[0016] The notification lamp 123 is a lamp that informs the player, for example, that they have internally won a specific winning combination in the internal lottery described later, or that they are in a specific game state. The coin insertion lamp 124 is a lamp that informs the player that they can insert coins. The replay lamp 122 is a lamp that informs the player that they can replay the game (no need to insert coins) if they won a replay combination, which is one of the winning combinations, in the previous game. The reel panel lamp 128 is a lamp for visual effects.

[0017] The bet buttons 130 to 132 are buttons for inserting a predetermined number of tokens (called credits) electronically stored in the slot machine 100. In this embodiment, one token is inserted each time bet button 130 is pressed, two tokens are inserted when bet button 131 is pressed, and three tokens are inserted when bet button 132 is pressed. Hereinafter, bet button 132 will also be called the MAX bet button. The game token insertion lamp 129 lights up a number of lamps corresponding to the number of tokens inserted, and when the predetermined number of tokens has been inserted, the game start lamp 121 lights up to indicate that the game can be started.

[0018] The medal slot 141 is where the player inserts medals to start playing. That is, medals can be inserted electronically using the bet buttons 130 to 132, or by actually inserting medals into the medal slot 141 (insertion operation). Insertion includes both methods.

[0019] The stored tokens indicator 125 is a display for showing the number of tokens electronically stored in the slot machine 100. The game information display 126 is a display for showing various internal information numerically. The payout tokens indicator 127 is a display for showing the number of tokens that will be paid out to the player as a result of winning a prize. In the following, the expression "given to the player" may be used interchangeably with "paid out to the player". In this embodiment, the stored tokens indicator 125, the game information display 126, and the payout tokens indicator 127 are all composed of 7-segment (SEG) displays.

[0020] The start lever 135 is a lever-type switch used to start the rotation of reels 110 to 112. That is, by inserting the desired number of tokens into the token slot 141 or by operating the bet buttons 130 to 132 and then operating the start lever 135, the reels 110 to 112 will start to rotate. The operation of the start lever 135 is called the game start operation.

[0021] The stop button unit 136 is equipped with stop buttons 137 to 139, consisting of a left stop button 137, a middle stop button 138, and a right stop button 139. The stop buttons 137 to 139 are button-type switches for individually stopping the reels 110 to 112 that have started rotating by operating the start lever 135, and each is associated with a specific reel. More specifically, the left reel 110 can be stopped by operating the left stop button 137, the middle reel 111 can be stopped by operating the middle stop button 138, and the right reel 112 can be stopped by operating the right stop button 139. Hereinafter, operations on the stop buttons 137 to 139 will be referred to as stop operations, with the first stop operation being the first stop operation, the next stop operation being the second stop operation, and the last stop operation being the third stop operation. The reels that are stopped in response to these stop operations will be referred to as the first stop reel, the second stop reel, and the third stop reel, respectively. Furthermore, the sequence in which the stop buttons 137 to 139 are pressed to stop all of the rotating reels 110 to 112 is called the operation sequence or pressing order. Moreover, the operation sequence in which the first stop operation is the left reel 110 is called the "forward pressing operation sequence" or simply "forward pressing," and the operation sequence in which the first stop operation is the right reel 112 is called the "reverse pressing operation sequence" or simply "reverse pressing." In addition, a light-emitting element may be provided inside each of the stop buttons 137 to 139, and if the stop buttons 137 to 139 can be operated, the light-emitting element can be illuminated to inform the player.

[0022] The medal return button 133 is a button to be pressed to remove medals if they become jammed. The settlement button 134 is a button to settle the medals electronically stored in the slot machine 100 and the medals that have been bet, and to dispense them from the medal payout opening 155. The door keyhole 140 is a hole for inserting a key to unlock the front door 102 of the slot machine 100.

[0023] A title panel 162 is provided at the bottom of the stop button unit 136 for displaying the model name and for attaching various certification labels. Below the title panel 162 are a medal payout opening 155 and a medal tray 161.

[0024] The sound hole 145 is a hole for outputting sound from speaker 277 (see Figure 3), which is located at the bottom inside the slot machine 100, to the outside. The side lamps 144, located on the left and right sides of the front door 102, are decorative lamps to enhance the gaming experience. A performance device 160 is installed at the top of the front door 102, and a sound hole 143 is provided at the top of the performance device 160 for outputting sound from speaker 272 (see Figure 3), which is located at the top inside the slot machine 100, to the outside. This display device 160 includes a shutter (shielding device) 163 consisting of two horizontally opening and closing shutters, a right shutter 163a and a left shutter 163b, and a display image display device 157 (liquid crystal display device) positioned behind the shutter 163. When the right shutter 163a and the left shutter 163b are opened horizontally outward in front of the display image display device 157, the display screen of the display image display device 157 appears on the front (player side, front side) of the slot machine 100. Note that any display device capable of displaying various display images and various game information is acceptable, rather than a liquid crystal display device. For example, a multi-segment display (7-segment display), a dot matrix display, an organic EL display, a plasma display, a reel (drum), or a display device consisting of a projector and a screen may be used. The display screen is rectangular and configured so that the entire screen is visible to the player. In this embodiment, the display screen is rectangular, but it may also be square. Furthermore, decorative elements (not shown) can be placed around the periphery of the display screen, so that a portion of the periphery of the display screen is hidden by these elements, resulting in the display screen appearing to have an irregular shape. In this embodiment, the display screen is a flat surface, but it may also be a curved surface. Note that this display image display device 157 is an example of a display means and a notification means.

[0025] <Control Unit Circuit Configuration> Next, the circuit configuration of the control unit of the slot machine 100 will be explained in detail using Figure 3. Note that Figure 3 shows a circuit block diagram of the control unit.

[0026] The control unit of the slot machine 100 is broadly composed of a main control unit 300 that controls the progress of the game, a first sub-control unit 400 that controls the main effects in accordance with command signals (hereinafter simply referred to as "commands") transmitted by the main control unit 300, and a second sub-control unit 500 that controls various devices based on commands transmitted from the first sub-control unit 400. Here, regarding the main control unit 300, since a large data capacity would make it difficult to verify the program and could lead to security problems such as becoming a breeding ground for illegal modifications, the data capacity of the ROM 306 and RAM 308 of the main control unit 300 is limited. The main control unit 300 is an example of a means for determining winning combinations and a means for granting bonuses.

[0027] <Main Control Unit> First, let's describe the main control unit 300 of the slot machine 100. The main control unit 300 is equipped with a basic circuit 302 that controls the entire main control unit 300. This basic circuit 302 is equipped with a CPU 304, a ROM 306 that stores control program data, lottery data used when internally drawing winning combinations, the arrangement of reel symbols and stopping positions, a RAM 308 for temporarily storing data, an I / O 310 for controlling the input and output of various devices, a counter timer 312 for measuring time, number of spins, etc., and a WDT (watchdog timer) 314. Note that other storage devices may be used instead of the ROM 306 and RAM 308, and this also applies to the first sub-control unit 400 and the second sub-control unit 500 which will be described later. The CPU 304 of this basic circuit 302 operates by receiving a clock signal of a predetermined period output by a crystal oscillator 315b as the system clock. Furthermore, when power is turned on, the CPU 304 transmits the frequency division data stored in a predetermined area of ​​the ROM 306 to the counter timer 312. The counter timer 312 determines the interrupt time based on the received frequency division data and sends an interrupt request to the CPU 304 at each interrupt time. The CPU 304 then performs monitoring of various sensors and transmits drive pulses based on this interrupt request. For example, if the clock signal output by the crystal oscillator 315b is set to 8MHz, the frequency division value of the counter timer 312 is set to 1 / 256, and the frequency division data in the ROM 306 is set to 47, the reference interrupt time will be 256 × 47 ÷ 8MHz = 1.504ms.

[0028] The main control unit 300 includes a random number generation circuit 316, which is used as a hardware random number counter that varies a value in the range of 0 to 65535 based on a clock signal input from the crystal oscillator 315a, and a startup signal output circuit 338 that outputs a startup signal (reset signal) when the power is turned on. When the CPU 304 receives a startup signal from this startup signal output circuit 338, it starts game control (starts the main processing of the main control unit, which will be described later).

[0029] Furthermore, the main control unit 300 is equipped with a sensor circuit 320, and the CPU 304 monitors the status of various sensors 318 (bet button 130 sensor, bet button 131 sensor, bet button 132 sensor, medal reception sensor for medals inserted from the medal slot 141, start lever 135 sensor, left stop button 137 sensor, middle stop button 138 sensor, right stop button 139 sensor, settlement button 134 sensor, medal dispensing sensor for medals dispensed from the medal dispensing device 180, optical sensor for the left reel 110, optical sensor for the middle reel 111, optical sensor for the right reel 112, etc.) at interrupt intervals.

[0030] Furthermore, if the sensor circuit 320 detects a high level from the start lever sensor, it outputs a signal indicating this detection to the random number generation circuit 316. Upon receiving this signal, the random number generation circuit 316 latches the value at that moment and stores it in a register that stores the random value used for the lottery.

[0031] Two medal reception sensors are installed in the internal passage of the medal slot 141 to detect whether or not a medal has passed through. Two start lever sensors are installed inside the start lever 135 to detect the player's start operation. The left stop button sensor 137, the middle stop button sensor 138, and the right stop button sensor 139 are installed on the corresponding stop buttons 137 to 139, respectively, to detect the player's operation of the stop buttons.

[0032] The bet button 130 sensor, bet button 131 sensor, and bet button 132 sensor are installed on the corresponding bet buttons 130 to 132, respectively, and detect the insertion operation when inserting tokens electronically stored in RAM 308 as tokens to be used in the game. The payout button 134 sensor is installed on payout button 134. When payout button 134 is pressed once, the electronically stored tokens are paid out (the value stored in RAM 308 is cleared and the same number of tokens are dispensed). The token dispensing sensor is a sensor for detecting the tokens to be dispensed by the token dispensing device 180. Note that each of the above sensors may be a non-contact type sensor or a contact type sensor.

[0033] The optical sensors on the left reel 110, the middle reel 111, and the right reel 112 are installed at predetermined positions on the mounting bases of each reel 110 to 112, and each time a light-shielding piece provided on the reel frame passes over them, they reach an L level. The rotational position information, which indicates how much the reel has rotated from the reference position between the time it reaches an L level and the next time it reaches an L level, is calculated based on the value obtained by counting the clock signal output by the crystal oscillator 315b. When the CPU 304 detects the L level signal, it determines that the reel has rotated once and resets the rotational position information of the reel to zero. This rotational position information is stored in the RAM 308 of the main control unit 300.

[0034] The main control unit 300 includes a drive circuit 322 that drives the stepping motors provided on the reel devices 110 to 112, a drive circuit 324 that drives the solenoid provided on the medal selector 170 that sorts the inserted medals, a drive circuit 326 that drives the motor provided on the medal dispensing device 180, and a drive circuit 328 that drives various lamps 336 (winning line indicator lamp 120, notification lamp 123, game medal insertion ready lamp 124, replay lamp 122, game medal insertion lamp 129, game start lamp 121, stored number indicator 125, game information indicator 126, and payout number indicator 127).

[0035] Furthermore, an information output circuit 334 is connected to the basic circuit 302, and the main control unit 300 outputs game information of the slot machine 100 (for example, information indicating the state of the game) to an information input circuit 652 provided by an external hall computer (not shown) via this information output circuit 334.

[0036] Furthermore, the main control unit 300 includes a voltage monitoring circuit 330 that monitors the voltage value of the power supply supplied to the main control unit 300 from the power management unit (not shown). The voltage monitoring circuit 330 outputs a low voltage signal to the basic circuit 302 indicating that the voltage has dropped when the voltage value of the power supply falls below a predetermined value (9V in this embodiment).

[0037] Furthermore, the main control unit 300 is equipped with an output interface for sending commands to the first sub-control unit 400, enabling communication with the first sub-control unit 400. Information communication between the main control unit 300 and the first sub-control unit 400 is unidirectional; the main control unit 300 is configured to send signals such as commands to the first sub-control unit 400, but the first sub-control unit 400 is configured not to send signals such as commands to the main control unit 300.

[0038] <Deputy Commander> Next, the first sub-control unit 400 of the slot machine 100 will be described. The first sub-control unit 400 receives control commands transmitted by the main control unit 300 via an input interface. The first sub-control unit 400 is equipped with a basic circuit 402 that controls the entire first sub-control unit 400 based on these control commands. This basic circuit 402 is equipped with a CPU 404, a RAM 408 for temporarily storing data, an I / O 410 for controlling the input and output of various devices, and a counter timer 412 for measuring time, number of spins, etc. The CPU 404 of the basic circuit 402 operates by receiving a clock signal of a predetermined period output by a crystal oscillator 414 as the system clock. The ROM 406 stores control programs and data for controlling the entire first sub-control unit 400, data for controlling the backlight lighting patterns and various indicators, etc.

[0039] The CPU 404 transmits frequency division data stored in a predetermined area of ​​the ROM 406 to the counter timer 412 via the data bus at a predetermined timing. The counter timer 412 determines the interrupt time based on the received frequency division data and sends an interrupt request to the CPU 404 at each interrupt time. The CPU 404 controls each IC and circuit based on the timing of this interrupt request.

[0040] Furthermore, the first sub-control unit 400 is equipped with a sound source IC 418, and speakers 272 and 277 are connected to the sound source IC 418 via an output interface. The sound source IC 418 controls the sound output from the amplifier and speakers 272 and 277 in response to instructions from the CPU 404. The sound source IC 418 is connected to an S-ROM (sound ROM) in which sound data is stored, and the sound data acquired from this ROM is amplified by the amplifier and output from speakers 272 and 277.

[0041] Furthermore, the first sub-control unit 400 is provided with an earphone circuit 419 for outputting sound to an externally inserted earphone 280. The earphone circuit 419 controls the output sound (such as amplifier control) in response to instructions from the CPU 404.

[0042] Furthermore, the first sub-control unit 400 is equipped with a drive circuit 422, and various lamps 420 (upper lamp, lower lamp, side lamp 144, title panel lamp, bet button lamp, reel backlight, etc.) are connected to the drive circuit 422 via an input / output interface.

[0043] Furthermore, the first sub-control unit 400 is equipped with a drive circuit 424 that drives the motor of the shutter 163, and the shutter 163 is connected to the drive circuit 424 via an output interface. This drive circuit 424 outputs a drive signal to a stepping motor (not shown) provided on the shutter 163 in response to a command from the CPU 404.

[0044] Furthermore, the first sub-control unit 400 is equipped with a sensor circuit 426, to which a shutter sensor 428 is connected via an input interface. The CPU 404 monitors the status of the shutter sensor 428 at interrupt intervals.

[0045] Furthermore, the CPU 404 transmits and receives signals to the second sub-control unit 500 via an output interface. The second sub-control unit 500 performs various controls of the performance device 160, including the display control of the performance image display device 157. The second sub-control unit 500 may be composed of multiple control units, such as a control unit that controls the display of the performance image display device 157 and a control unit that controls various performance drive devices (for example, a control unit that controls the motor drive of the shutter 163).

[0046] The second sub-control unit 500 receives control commands transmitted by the first sub-control unit 400 via an input interface and includes a basic circuit 502 that controls the entire second sub-control unit 500 based on these control commands. This basic circuit 502 is equipped with a CPU 504, a RAM 508 for temporarily storing data, an I / O 510 for controlling the input and output of various devices, and a counter timer 512 for measuring time, counts, etc. The CPU 504 of the basic circuit 502 operates by receiving a clock signal of a predetermined period output by a crystal oscillator 514 as the system clock. The ROM 506 stores control programs and data for controlling the entire second sub-control unit 500, as well as data for image display, etc.

[0047] The CPU 504 transmits frequency division data stored in a predetermined area of ​​the ROM 506 to the counter timer 512 via the data bus at a predetermined timing. The counter timer 512 determines the interrupt time based on the received frequency division data and sends an interrupt request to the CPU 404 at each interrupt time. The CPU 504 controls each IC and circuit based on the timing of this interrupt request.

[0048] Furthermore, the second sub-control unit 500 is equipped with a VDP 516 (video display processor), to which a ROM 506 and a VRAM 518 are connected via a bus. Based on signals from the CPU 504, the VDP 516 reads image data stored in the ROM 506, generates a display image using the work area of ​​the VRAM 518, and displays the image on the image display device 157.

[0049] In a gaming machine, various circuit boards are arranged inside, but due to limited space, multiple circuit boards and various operation units are connected as needed with harnesses. Figure 4 shows an example of circuit board connections inside a gaming machine. For example, the main control board 300B, which houses the main control unit 300, is connected to the relay board RB1 by harness HB1. This relay board RB1 is further connected to the lever unit 135U (equipped with start lever 135), the stop button unit 136U (equipped with stop buttons 137-139), the bet button unit 132U (equipped with bet buttons 130, 132, and payout button 134) by harnesses HA1-HA5. Similarly, the sub-control board 400B, which houses the first sub-control unit 400, is connected to the menu button unit, the chance button unit, and various display devices (LCD control board, movable unit, lighting board, speaker, earphone amplifier board, etc.) via harnesses and relay boards. By using such harnesses, circuit boards and components can be efficiently arranged in a limited space.

[0050] <Regarding the earphone amplifier board and earphone jack board> The earphone amplifier board 4192 shown in Figure 4 generates power for the earphone output, generates a reference power supply for the operational amplifier output, adjusts the output level of the audio signal to match the earphone volume, transmits an earphone insertion / removal detection signal to peripheral boards, and drives the output and stop of the audio signal using a reset signal. The earphone jack board 4193 handles earphone connection and earphone insertion / removal detection. The configuration of these boards will be explained below using Figures 5 to 15.

[0051] [Regarding the circuit board connections] Figure 5 is a circuit block diagram of the peripheral board 4191, the earphone amplifier board 4192, and the earphone jack board 4193. Note that this peripheral board 4191 is a simplified representation of the circuits related to the earphone amplifier board 4192 from the sub-control board 400B and relay board 4190 in Figure 4. Figure 6 is a diagram showing an example of the circuit of the earphone amplifier board 4192 shown in Figure 5. Figure 7(a) is a table showing explanations of terms used in the drawings, and (b) is a table showing explanations of the terminal numbers shown in Figure 5. Figure 8 is a diagram showing the connection configuration and pin arrangement of the peripheral board 4191, the earphone amplifier board 4192, and the earphone jack board 4193, respectively.

[0052] The peripheral board 4191 and the earphone amplifier board 4192 are connected at the locations marked with circled numbers 1 to 8 in Figure 5.

[0053] At the connection point marked with the circled number 1 in Figure 5, the power supply voltage (VDD) is supplied from the peripheral board 4191 to the earphone amplifier board 4192.

[0054] At the connection points numbered 2 to 5 in circles in Figure 5, the peripheral board 4191 outputs left and right ± audio signals (Lin+, Lin-, Rin+, Rin-) to the earphone amplifier board 4192. In this embodiment, the output audio waveform is divided into upper and lower halves, with the upper waveform output as the + audio signal and the lower waveform inverted vertically output as the - audio signal. These + and - audio signals are output for both the left and right channels. The digital amplifier on the peripheral board 4191 may also output audio signals to both the earphone amplifier board and the speaker amplifier board. Alternatively, the digital amplifier on the peripheral board 4191 may output audio signals only to the earphone amplifier board, in which case a separate digital amplifier for the speaker may be mounted. Furthermore, the digital amplifier for the earphone and the digital amplifier for the speaker may be mounted on a single board or on separate boards.

[0055] At the connection point marked with the circled number 6 in Figure 5, a reset signal (RESET) is output from the peripheral board 4191 to the earphone amplifier board 4192.

[0056] At the connection point marked with the circled number 7 in Figure 5, the earphone amplifier board 4192 outputs an earphone jack insertion detection signal (JACK DET OUT) to the peripheral board 4191.

[0057] In Figure 5, at the connection point circled with the number 8, the ground (DGND) of the peripheral board 4191 is connected to the earphone amplifier board 4192. To distinguish it from the ground of the earphone amplifier board 4192, the ground of the peripheral board 4191 is referred to as the digital ground, and the ground of the earphone amplifier board 4192 is referred to as the analog ground.

[0058] Figure 8 shows that in the harness connecting the peripheral board 4191 and the earphone amplifier board 4192, pin numbers 1 to 8 of this harness correspond to the connection parts numbered 1 to 8 in circles in Figure 5.

[0059] The earphone amplifier board 4192 and the earphone jack board 4193 are connected at the locations indicated by the circled numbers 9-12 in Figure 5 (the circled Greek numerals 1-4 on the earphone jack board 4193 side).

[0060] At the connection points numbered 9 and 10 in the circle in Figure 5, the left and right earphone audio signals (LOUT and ROUT) are output from the earphone amplifier board 4192 to the earphone jack board 4193.

[0061] At the connection point marked with the circled number 11 in Figure 5, the earphone amplifier board 4192 receives the earphone jack insertion detection signal (JACK DET IN) from the earphone jack board 4193.

[0062] In Figure 5, at the connection point marked with the circled number 12, the analog ground (AGND) of the earphone amplifier board 4192 is connected to the earphone jack board 4193.

[0063] Figure 8 shows that in the harness connecting the earphone amplifier board 4192 and the earphone jack board 4193, pins 1 to 4 of this harness correspond to the connection parts numbered 9 to 12 in circles in Figure 5.

[0064] The earphone jack board 4193 and the housing chassis (FG) are connected at the location circled with the Greek numeral 5 in Figure 5. Figure 8 shows that in the harness connecting the earphone jack board 4193 and the housing chassis, pin number 1 of this harness corresponds to the connection point circled with the Greek numeral 5 in Figure 5.

[0065] The absolute maximum ratings and recommended operating conditions for the earphone amplifier board 4192 are shown in Figures 9(a) and 9(b). The electrical characteristics of the earphone amplifier board 4192 are shown in Figure 9(c).

[0066] [Circuit configuration of the earphone amplifier board] Figures 5 and 6 show the power supply circuitry for the earphone amplifier board 4192, which includes a power supply noise filter 4192a, a DC 5V power supply circuit 4192b, and a reference power supply generation circuit 4192c. In addition, circuits for processing audio signals from the peripheral board 4191 are provided, which include an audio input level adjustment circuit 4192d, a differential amplifier circuit 4192e, a current amplifier circuit 4192f, and an audio output circuit 4192g. Furthermore, a noise filter 4192h for detecting the earphone jack input from the earphone jack board 4193, which will be described later, is provided.

[0067] There is a significant difference in level between the output of the digital amplifier on peripheral board 4191 and the input of the earphones (the former is 12V or 24V, the latter is 5V or 3.3V). If the output level of the digital amplifier is reduced to match the earphones, distortion may occur in the output waveform, potentially degrading the sound quality. Therefore, in this embodiment, the output of the digital amplifier on peripheral board 4191 is not reduced, and instead, the earphone amplifier board 4192 is configured to adjust the level to match the input level of the earphones. Specifically, the level is adjusted using a combination of the audio input level adjustment circuit 4192d (attenuated to 1 / 11), the differential amplifier circuit 4192e (amplified to 2 times), and the current amplifier circuit 4192f (amplified to 2 times) (attenuated to about 4 / 11). Of course, the increase or decrease of these levels may be adjusted as appropriate. Below, an example of these circuits will be explained in detail with reference to drawings.

[0068] [Power supply noise filter] Figure 10(a) shows an example of the circuit of the power supply noise filter 4192a. The power supply voltage VDD, digital ground DGND, and analog ground AGND of the peripheral board 4191 are connected to this circuit. The internal power supply voltage VDD of the earphone amplifier board 4192 is also connected to this circuit.

[0069] In the power supply noise filter 4192a, the power supply voltage VDD supplied from the peripheral board 4191 to the earphone amplifier board 4192 is de-noised and smoothed by capacitors C1 and C2, and is used as the internal power supply voltage VDD of the earphone amplifier board 4192. In addition, a resistor R1 is provided to limit the inrush current to these capacitors.

[0070] Furthermore, in this power supply noise filter 4192a, diode D1 (hereinafter referred to as the first diode D1), whose cathode is connected to the digital ground DGND, and diode D2 (hereinafter referred to as the second diode D2), whose cathode is connected to the analog ground AGND, are provided in parallel between the digital ground DGND and the analog ground AGND. If these diodes D1 and D2 were not present and the digital ground DGND and analog ground AGND were directly connected, noise from the peripheral board 4191 (noise generated from LEDs, motor control, LCD, etc.) may leak to the analog ground AGND and be output as noise from the earphones. Such noise is difficult to notice when other audio is being output, but in a silent state it is easily noticed as white noise output from the earphones, causing discomfort to the player.

[0071] The power supply noise filter 4192a incorporates the two diodes D1 and D2 described above to solve the above problem. On the earphone amplifier board 4192, even in a silent state, the potential of the analog ground AGND is slightly higher than the potential of the digital ground DGND (approximately 0.6V). On the other hand, the voltage due to noise is mostly lower than this potential difference (approximately 0.2V). Therefore, in a silent state, even if noise is generated on the peripheral board 4191, the cathode potential of the second diode D2 remains higher than the anode potential, and this noise does not pass through the second diode D2 and does not leak to the analog ground AGND side. And of course, the first diode D1 does not allow noise from the digital ground DGND side to pass through.

[0072] As explained above, by providing the first diode D1 and the second diode D2 in parallel between the digital ground DGND and the analog ground AGND, it is possible to prevent noise from the peripheral board 4191 from leaking into the analog ground AGND side, thereby reducing noise in silent conditions.

[0073] Furthermore, since the audio output from the earphones swings between positive and negative relative to the digital ground DGND, a current supply path is required between the digital ground DGND and the analog ground AGND to supply current. The above configuration of the first diode D1 and the second diode D2 can also secure this current supply path.

[0074] [DC 5V power supply circuit] Figure 10(b) shows an example of the DC 5V power supply circuit 4192b. In the DC 5V power supply circuit 4192b, the power supply voltage VDD (for internal use of the earphone amplifier board 4192) drives a linear regulator, generating the DC 5V voltage used by the earphone amplifier board 4192. Capacitors C14 and C15 on the input side (power supply voltage VDD side) of the linear regulator are provided for noise removal and smoothing of the power supply voltage VDD, and capacitors C16 and C17 on the output side (DC 5V voltage side) of the linear regulator are provided for noise removal and smoothing of the DC 5V voltage. Diode D3, which is connected in parallel with the linear regulator, is provided to protect the linear regulator from reverse voltage that occurs when the power is interrupted.

[0075] [Reference power generation circuit] Figure 10(c) shows an example of the circuit of the reference power supply generation circuit 4192c. The reference power supply generation circuit 4192c generates the bias voltage (2.5V in this embodiment) for the audio input / output signals in the differential amplifier circuit 4192e, which will be described later. Specifically, the intermediate voltage of DC 5V (2.5V in this embodiment) generated by the voltage divider resistors R20 and R21 is output as the bias voltage for the audio input / output signals via a voltage follower using the operational amplifier IC4. In this configuration, a bias voltage that follows the fluctuation of the ground relative to the power supply voltage can be generated, and the influence of ground fluctuations can be suppressed.

[0076] Capacitor C22 on the input side (DC 5V voltage side) of the voltage follower is provided to prevent the op-amp IC4 from oscillating due to parasitic capacitance from the pattern wiring (suppression of parasitic capacitance) and for noise reduction. Capacitor C26 on the output side of the voltage follower is provided for noise reduction and smoothing of the bias voltage of the audio input / output signal. Capacitor C26 also suppresses parasitic capacitance on the output side of op-amp IC4. Resistor R22 is provided to limit the inrush current to capacitor C26.

[0077] [Audio input level adjustment circuit] Figure 11(a) shows an example of the audio input level adjustment circuit 4192d. In Figures 5 and 6, the audio input level adjustment circuit 4192d is shown as a voltage divider circuit for the left and right ± audio signals respectively, but all of these voltage divider circuits have a common configuration, and Figure 11(a) will explain this voltage divider circuit.

[0078] In the audio input level adjustment circuit 4192d, the level of the audio signal from peripheral board 4191 is adjusted using voltage divider resistors R2 and R6 in order to process the output of the digital amplifier on peripheral board 4191 to match the output level of the earphones. In this embodiment, the level of the audio signal from peripheral board 4191 is reduced (adjusted to 1 / 11 in this example, reducing from a maximum of approximately 12V to about 1.09V) taking into account the maximum output of the digital amplifier on peripheral board 4191 (approximately 12V in this example) and the amplification by subsequent circuits (differential amplifier circuit 4192e, current amplifier circuit 4192f). This protects the circuit in case the audio signal level is excessive.

[0079] [Differential amplifier circuit] Figure 11(b) shows an example of the differential amplifier circuit 4192e. Figures 5 and 6 show circuits that integrate (convert to single output) the audio signals adjusted by the audio input level adjustment circuit 4192d for both the left and right channels. These circuits have a common configuration for both the left and right channels, and Figure 11(b) describes this circuit.

[0080] Figure 11(b) shows that a negative audio signal (L / Rin-) and a positive audio signal (L / Rin+) are input to the audio input level adjustment circuit 4192d, as indicated on the left edge of the diagram. The DC component of these input ± audio signals is cut by electrolytic capacitors C3 and C4, respectively. These electrolytic capacitors C3 and C4 are responsible for the AC coupling process shown in Figure 5.

[0081] Furthermore, due to the bias voltage described later, the voltage on the differential amplifier circuit 4192e side (to the right of electrolytic capacitors C3 and C4 in the diagram) is higher than the voltage on the audio input level adjustment circuit 4192d side (to the left of electrolytic capacitors C3 and C4 in the diagram). In this embodiment, electrolytic capacitors are used considering their voltage resistance to this potential difference. In addition, since the differential amplifier IC1 cannot have a high input impedance (resistors R10, R11), electrolytic capacitors with large capacitances are used to adjust the frequency characteristics to an appropriate value.

[0082] Furthermore, while it is conceivable to use ceramic capacitors instead of electrolytic capacitors, ceramic capacitors can generate noise due to vibration (piezoelectric effect). When voltage or signal is applied to a ceramic capacitor, the ceramic inside the capacitor resonates, generating noise. In addition, various vibrations are generated in gaming machines due to game operations on various control parts and the operation of various devices, and it is undesirable for noise caused by such vibrations to be mixed into the input part of the differential amplifier circuit 4192e, as this will be output as noise from the sound output section. Moreover, in the case of earphones, this noise is even more pronounced, so from this perspective, in this embodiment, an electrolytic capacitor is used for the capacitor at the input part of the differential amplifier circuit 4192e.

[0083] After AC coupling processing, the difference between the positive audio signal and the negative audio signal is amplified and output by the differential amplifier IC1. As explained above, the positive audio signal corresponds to the upper waveform of the original audio waveform, and the negative audio signal corresponds to the lower waveform of the original audio waveform inverted vertically. Therefore, the original audio waveform is obtained by taking the difference between the positive audio signal and the negative audio signal. In this embodiment, the amplification factor of the differential amplifier IC1 is 1x, but the amplitude of the output audio signal is approximately twice that of the respective amplitudes of the ± audio signals whose levels have been adjusted by the audio input level adjustment circuit 4192d.

[0084] Furthermore, in this embodiment, the bias voltage (2.5V) of the audio input / output signal generated by the reference power supply generation circuit 4192c is applied to the + input side of the differential amplifier IC1. Therefore, the audio signal output from the differential amplifier IC1 is a signal centered on the bias voltage. Note that since the differential amplifier IC1 operates between 5V and ground (0V), if no bias voltage is applied, it will not be able to output the - audio signal and will only output a half-wave signal of the + audio signal. For this reason, by applying a bias voltage, the waveform of the - audio signal is raised above 0V, enabling the output of the full waveform.

[0085] Furthermore, in this embodiment, since an inverting amplifier circuit using differential amplifier IC1 is configured, the original audio waveform can be obtained from differential amplifier IC1 by inverting the input audio signal (inputting the negative audio signal to the + input side and the positive audio signal to the - input side). Note that the configuration for integrating ± audio signals is not limited to this circuit configuration; for example, a non-inverting amplifier circuit may be used, or a separate inverting circuit may be combined.

[0086] In this embodiment, we have described a case where the digital amplifier on the peripheral board 4191 outputs ± audio signals obtained by splitting the original audio waveform into upper and lower halves. However, this can also be applied to digital amplifiers that output other audio signals. For example, it can be applied when the original audio waveform is used as the + audio signal and the inverted version of this waveform is used as the - audio signal. Furthermore, in this modified example, it can also be applied to a configuration where only one of the ± audio signals is used (the other is output as 0V). However, depending on the level of the audio signal used, it may be necessary to change the degree of level adjustment in the audio input level adjustment circuit 4192d.

[0087] In addition, a small-capacitance ceramic capacitor C7 (220pF in this example) is provided to prevent the amplification circuit from oscillating due to high-frequency noise.

[0088] Here, we will explain the polarity of electrolytic capacitors C3 and C4, which are responsible for AC coupling. On the differential amplifier IC1 side, separated by the electrolytic capacitors, the bias voltage of the audio input / output signal generated by the reference power supply generation circuit 4192c (2.5V in this embodiment) is applied. On the other hand, on the side where the audio signal is input (left side in the diagram), separated by electrolytic capacitors C3 and C4, audio signals exceeding this bias voltage are not input (maximum of about 1.09V in this example). For this reason, the polarity of electrolytic capacitors C3 and C4 is set so that the differential amplifier side is positive, rather than the side where the audio signal is input.

[0089] Furthermore, these electrolytic capacitors C3 and C4 also play a role in preventing the reverse flow of DC components from the differential amplifier IC1 side. If DC components were to flow back from the differential amplifier IC1 side, the digital amplifier of the peripheral device 4191 might detect these DC components and activate (or shut down) its protection function. However, in this embodiment, since the electrolytic capacitors C3 and C4 prevent DC components from flowing back from the differential amplifier IC1 side, it is possible to prevent the digital amplifier of the peripheral device 4191 from malfunctioning and shutting down.

[0090] [Current amplification circuit and reset control circuit] Figure 12(a) shows an example of the current amplifier circuit 4192f. Figures 5 and 6 show the circuits corresponding to the left and right audio signals output from the differential amplifier circuit 4192e, but these circuits have a common configuration for both the left and right channels, and Figure 12(a) will explain this circuit.

[0091] Figure 12(a) shows at the far left of the diagram that the audio signal (in) integrated by the differential amplifier circuit 4192e is input. The DC component of this audio signal is cut by the film capacitor C12. This film capacitor C12 is responsible for the AC coupling process shown in Figure 5. Although the differential amplifier circuit 4192e side (to the left of the film capacitor C12 in the diagram) and the current amplifier circuit 4192f side (to the right of the film capacitor C12 in the diagram) are configured to have the same bias voltage (2.5V in both cases) in the design, there will be some fluctuation in the actual voltage. In this embodiment, a non-polarized capacitor (film capacitor C12) is used to accommodate this potential difference (reverse voltage).

[0092] While non-polarized capacitors include ceramic capacitors in addition to film capacitors, as mentioned above, ceramic capacitors can generate noise (piezoelectric effect) due to vibration. In gaming machines, various vibrations are generated by game operations on various control parts and the operation of various devices, and it is undesirable for noise caused by such vibrations to be mixed into the input part of the current amplification circuit 4192f, as this will be output as noise from the sound output section. Furthermore, in the case of earphones, this noise is even more pronounced, so from this perspective, in this embodiment, a film capacitor is used as the capacitor at the input part of the current amplification circuit 4192f.

[0093] The AC-coupled audio signal is amplified and output by the operational amplifier IC3. In this embodiment, the operational amplifier IC3 performs a 2x amplification using non-inverting amplification. The operational amplifier IC3 also has a built-in function to generate a BIAS voltage (2.1V in this example), and the audio signal output from the operational amplifier IC3 is a signal centered around the BIAS voltage.

[0094] The operational amplifier IC3 has a built-in mute function, and its output can be turned off (muted) by inputting a signal (Lo) to the MUTE terminal. In this embodiment, the reset signal output from the CPU of the peripheral board 4191 (Lo for reset on (mute), Hi for reset off, see Figure 9(c)) is input to this MUTE terminal via the reset control circuit. The reset control circuit will be described below.

[0095] Figure 12(b) shows an example of a reset control circuit. This circuit receives a reset signal (RESET) output from the CPU of peripheral board 4191 and outputs it to the MUTE terminal. In this circuit, resistor R18 and capacitor C18 constitute a noise filter.

[0096] Here, we will explain the operation to suppress pop noise output during startup and power outage. During startup, the power supply voltage first fluctuates. Then, in the earphone amplifier board 4192, the DC 5V power supply circuit 4192b generates the DC 5V voltage used in each circuit, but this voltage fluctuates even before it reaches 5V. The output of the operational amplifier changes in accordance with these voltage fluctuations. The graph in Figure 13 shows that the power supply voltage VDD fluctuates at the beginning of the startup time and reaches the specified value. It also shows that the output voltage (LOUT, ROUT) of operational amplifier IC3 rises to the specified value with a delay compared to the power supply voltage.

[0097] Such voltage fluctuations can cause popping noises from the earphones, which can be unpleasant for the player. Therefore, at startup, a reset-on signal (Lo input to the MUTE terminal) is output from the peripheral board 4191 to the earphone amplifier board 4192, thereby turning off the audio output and preventing the output of popping noises.

[0098] Furthermore, the electrolytic capacitor C19, located between the BIAS terminal and the analog ground of the operational amplifier IC3, has a capacitance that affects the startup time of the operational amplifier IC3. In this embodiment, its capacitance is set so that the voltage fluctuation during startup is gradual (suppressing pop noise).

[0099] In this embodiment, as shown in Figure 13, a configuration is adopted in which the reset-off signal is output after the power supply voltage VDD and the startup time of the operational amplifier IC3 have elapsed.

[0100] Furthermore, voltage fluctuations occur during power outages, similar to power-on, resulting in pop noise from the earphones. Therefore, during power outages, a reset-on signal (Lo input to the MUTE terminal) is output from the peripheral board 4191 to the earphone amplifier board 4192 before the power supply voltage and the output voltage of the operational amplifier IC3 fluctuate. This configuration turns off the audio output and prevents pop noise. Figure 13 shows that the reset-on signal is output before the power supply voltage VDD and the fall-off time of the operational amplifier IC3. Note that the period indicated by symbol B in Figure 13 is longer than the period indicated by symbol C, and the fall-off time is longer than the power-up time.

[0101] In this embodiment, an operational amplifier IC3 with a built-in mute function is used, but the configuration for preventing pop noise output is not limited to this example. For example, a linear regulator in the DC 5V power supply circuit 4192b with a built-in output stop function may be used, and the output of the linear regulator may be stopped using a reset signal from the peripheral board 4191 during startup and power outage. Furthermore, in this embodiment, a configuration is used in which the peripheral board 4191 outputs a reset signal during startup and power outage, but this reset signal may also be output by the earphone amplifier board 4192. For example, one may focus on the voltage fluctuations of the power supply voltage line and output a reset signal by detecting the rising (or falling) point of this voltage.

[0102] Furthermore, to prevent the output of pop noise, the system may be configured to include a detection means capable of detecting the rise and fall of the power supply voltage, and a mute means capable of muting the audio signal, wherein the mute means releases the mute after a first time has elapsed since the detection means detected the rise of the voltage, and the mute means mutes after a second time has elapsed since the detection means detected the fall of the voltage. Additionally, the system may be provided with a reset signal output means capable of outputting a reset signal, the starting point of the first time may be when the reset signal transitions from a first state to a second state (for example, when it transitions from an output state to a non-output state), and the starting point of the second time may be when the reset signal transitions from a second state to a first state (for example, when it transitions from a non-output state to an output state). Furthermore, the mute means may be composed of circuit components other than operational amplifiers, and may be implemented by shorting the audio output to ground or opening the circuit using transistors, FETs, relays, etc.

[0103] [Audio output circuit] Figure 14(a) shows an example of the audio output circuit 4192g. Figures 5 and 6 show the circuits corresponding to the left and right audio signals output from the current amplifier circuit 4192f, but these circuits have a common configuration for both the left and right channels, and Figure 14(a) will explain this circuit.

[0104] In the audio output circuit 4192g shown in Figure 14(a), the audio signal amplified by the current amplification circuit 4192f is input from the left end. The DC component of this audio signal is cut by capacitor C23. This capacitor C23 is responsible for the AC coupling process shown in Figure 5. The audio signal with the DC component cut is output to the earphone jack board 4193. In this circuit, resistor R23 is provided to prevent overcurrent from occurring and damaging the circuit when the output side is short-circuited to ground when an earphone plug is inserted. Resistor R26 is provided to prevent oscillation when an earphone plug is not inserted and to discharge any remaining charge when the earphone plug is removed, preventing noise from being generated by the remaining charge when the earphone plug is later inserted. Ceramic capacitor C27 is provided to prevent pop noise caused by contact when earphones are connected and to prevent chattering.

[0105] [Noise filter for detection signals] Figure 14(b) shows an example of the circuit of the noise filter 4192h for detection signals. In this circuit, the earphone jack insertion detection signal is input from the earphone jack board 4193 from the right end (JACK DET IN). Noise is removed from this detection signal by a filter formed by resistor R28 and ceramic capacitor C25 and output to peripheral board 4191 (JACK DET OUT). When the earphone plug is not inserted, the terminal on the earphone jack board 4193 is in contact with ground, and a Lo signal is output to the peripheral board 4191 as a detection signal. In contrast, when the earphone plug is inserted, the terminal on the earphone jack board 4193 is not in contact with ground, and at this time a voltage is supplied by the pull-up resistor R25, and a Hi signal is output to the peripheral board 4191 as a detection signal. In Figure 14(b), the wiring from ground through ceramic capacitor C25 is connected to the left side of resistor R28. However, depending on the results of actual board durability tests or noise tests, this wiring may be connected to the right side of resistor R28 (the earphone jack board 4193 side). In this configuration, the level of noise transmitted from ground to the peripheral board 4191 via ceramic capacitor C25 can be reduced by resistor R28.

[0106] [Circuit configuration of the earphone jack board] The earphone jack circuit board 4193 shown in Figure 5 is provided with an earphone jack 4193a and a surge absorber 4193b.

[0107] Figure 15(a) shows an example of the circuit of the earphone jack 4193a. The ground of this earphone jack 4193a is connected to the ground of the earphone jack board 4193 (connected to the analog ground AGND of the earphone amplifier board 4192). The left and right audio output terminals from the earphone amplifier board 4192 are connected to the left and right input terminals of the earphone plug. In addition, a terminal is provided to output a detection signal for the earphone plug.

[0108] The left and right audio output terminals from the earphone amplifier board 4192 are each connected to the ground terminal via an insulator (hatched downwards to the right in the diagram), and operate when an earphone plug is inserted. This operation changes the earphone plug detection signal. This will be explained below.

[0109] Figure 15(b) shows the state before inserting the earphone plug. In this state, the detection signal output terminal of the earphone plug is in contact with the ground of the earphone jack board 4193. Therefore, a Lo signal is output as a detection signal from the detection signal noise filter 4192h of the earphone amplifier board 4192 to the peripheral board 4191.

[0110] Figure 15(c) shows the state with the earphone plug inserted. In this state, the output terminal of the earphone plug's detection signal is not in contact with the ground of the earphone jack board 4193. Therefore, the noise filter 4192h for the detection signal on the earphone amplifier board 4192 is supplied with a voltage from the pull-up resistor R25 connected to the 5V power supply, and a Hi signal is output to the peripheral board 4191 as a detection signal. Note that the signal line of the earphone plug and the insertion detection signal are insulated from each other.

[0111] The surge absorber 4193b on the earphone jack circuit board 4193 is a mechanism for removing static electricity from the outside and is located between the ground (AGND) of the earphone jack circuit board 4193 and the ground (FG) of the housing. When earphones are connected, the earphones come into contact with the ground (AGND) of the earphone jack circuit board 4193, and at this time, static electricity from the outside can be removed.

[0112] [Regarding the replacement of circuit elements] The circuit diagram shown in Figure 6 is an example, and components may be replaced as appropriate as long as the configuration has the necessary functions. For example, Figure 16 shows a configuration in which part of the circuit in Figure 6 is replaced with IC 4192i, which incorporates the functions of a differential amplifier and current amplifier, and the reference power supply generation circuit 4192c is removed. Also, Figure 17 shows that part of the differential amplifier circuit 4192e, part of the current amplifier circuit 4192f, and part of the audio output circuit 4192g in the circuit in Figure 6 correspond to IC 4192i. In the differential amplifier circuit 4192e in Figure 6, electrolytic capacitors C3 to C6 are used because a bias voltage (2.5V) is applied, but in the example in Figure 16, ceramic capacitors are used because a bias voltage (2.5V) is not required (there is no reference power supply generation circuit 4192c).

[0113] Furthermore, while the audio output circuit 4192g in Figure 14(a) includes a capacitor C23 for cutting the DC component, in the example in Figure 16, a resistor is connected in parallel to the capacitor corresponding to this capacitor C23 (the capacitor to which the signal from IC4192i is input). The value of this resistor can be set to an appropriate value based on the results of actual board durability tests or noise tests, or a configuration without a resistor may be used. Alternatively, depending on the performance of IC4192i, a configuration without both these capacitors and resistors may be used.

[0114] Furthermore, in the detection signal noise filter 4192h shown in Figure 14(b), the wiring from ground through ceramic capacitor C25 is connected to the left side of resistor R28. However, in the example shown in Figure 16, this wiring is connected to the right side (earphone jack board 4193 side) of the resistor (indicated as R14 in Figure 16) to which the earphone jack insertion detection signal is input. In this configuration, the level of noise transmitted from ground through the capacitor to the peripheral board 4191 can be reduced by resistor R14. Thus, the position of the capacitor may be changed or the capacitor may be omitted depending on the results of actual board durability tests or noise tests.

[0115] [Regarding the unified circuit board for earphones] In the above embodiment, the earphone amplifier board 4192 was described in which the audio signal from the relay board 4190 is converted into an audio signal for wired earphones and output to the earphone jack board 4193 (Figure 4, etc.). Here, the audio signal from the relay board 4190 can be used not only for wired earphones but also for audio output to wireless earphones. Figure 18 shows a configuration in which the earphone amplifier board 4192 of Figure 4 is replaced with an earphone unification board 4194 that can output audio to both wired and wireless earphones. The earphone unification board 4194 will be described below.

[0116] Figure 19 is a circuit block diagram of the earphone unified board 4194. In Figure 19, the connection points to the sub-control board 400B are indicated by circled numbers 1 to 8, and the connection points to the earphone jack board 4193 are indicated by circled numbers 9 to 12. Note that in Figure 18, the sub-control board 400B is connected to the earphone unified board 4194 via the relay board 4190, but in Figure 19, the relay board 4190 is omitted to make the input and output between the sub-control board 400B and the earphone unified board 4194 easier to understand, and parts of the sub-control board 400B unrelated to the earphone unified board 4194 are omitted, and related circuits are shown in a simplified manner. As will be explained in more detail later, the earphone unified board 4194 employs a configuration that uses three types of grounds. In the following explanation, these three types of grounds will be referred to as digital ground (DGND), analog ground (AGND), and jack ground (JGND).

[0117] At the connection point marked with the circled number 1 in Figure 19, the power supply voltage (5V) is supplied from the sub-control board 400B to the earphone amplifier board 4192.

[0118] In Figure 19, at the connection point marked with the circled number 2, the ground (GND) on the sub-control board 400B is connected to the analog ground (AGND) on the earphone unification board 4194.

[0119] At the connection point circled with the number 3 in Figure 19, analog signals containing output sound information related to the sound effects and other output sounds of the gaming machine are input from the audio amplifier IC on the sub-control board 400B to the differential amplifier circuit 4194b on the earphone unification board 4194. More specifically, the left and right ± audio signals (Lin+, Lin-, Rin+, Rin-) are input. Note that in Figure 19, these audio signals are simplified and shown as a single signal line 4194f.

[0120] At the connection point marked with the circled number 4 in Figure 19, a digital signal (for example, compliant with the SPDIF standard) containing output sound information related to the sound effects and other output sounds of the gaming machine is input from the sub-control board 400B to the wireless earphone module 4194c of the earphone unification board 4194.

[0121] Furthermore, the audio amplifier IC on the sub-control board 400B may be configured to output audio signals (output sound information related to the output sounds of the game machine, such as sound effects) not only to the earphone unified board 4194 but also to the speaker amplifier board of the slot machine. Alternatively, a separate digital amplifier for the speaker may be mounted, and the audio amplifier IC on the sub-control board 400B may output audio signals (output sound information related to the output sounds of the game machine, such as sound effects) only to the earphone unified board 4194. In addition, the amplifier for the earphone and the amplifier for the speaker may be mounted on a single board or on separate boards. Note that in Figure 19, the digital audio signal is simplified and shown as signal line 4194g.

[0122] The connection points numbered 5 to 7 in circles in Figure 19 are used for input and output of UART signals and reset signals (RESET) for the CPU of the sub-control board 400B to control the operation of the wireless earphone module 4194c. Specifically, the connection point numbered 5 in circles is shown as signal line 4194h in Figure 19 as wiring for transmitting a UART signal from the sub-control board 400B to the wireless earphone module 4194c on the earphone unification board 4194; the connection point numbered 6 in circles is shown as signal line 4194i in Figure 19 as wiring for receiving a UART signal from the wireless earphone module 4194c on the earphone unification board 4194 to the sub-control board 400B; and the connection point numbered 7 in circles is shown as signal line 4194j in Figure 19 as wiring for transmitting a reset signal (RESET) from the sub-control board 400B to the wireless earphone module 4194c on the earphone unification board 4194.

[0123] In Figure 19, at the connection point marked with the circled number 8, the ground (GND) on the sub-control board 400B is connected to the digital ground (DGND) on the earphone unification board 4194.

[0124] At the connection point circled with the number 9 in Figure 19, the earphone jack insertion detection signal (JACK DET IN) from the earphone jack board 4193 is input to the earphone unification board 4194. Alternatively, the earphone jack insertion detection signal (JACK DET IN) may be input to the wireless earphone module 4194c, and then to the CPU of the sub-control board 400B using the UART signal (via the wireless earphone module 4194c). The CPU of the sub-control board 400B then controls the audio output from the speaker to the earphones based on this insertion detection signal. Alternatively, this insertion detection signal may be input to the CPU of the sub-control board 400B via a terminal not shown, without going through the wireless earphone module 4194c. Thus, the insertion detection signal may be configured to be input to the CPU of the sub-control board 400B via the wireless earphone module 4194c, or it may be configured to be input to the CPU of the sub-control board 400B without going through the wireless earphone module 4194c. Furthermore, when wireless earphones are connected, the connection signal for the wireless earphones is input to the CPU of the sub-control board 400B using the UART signal, and control is performed to switch the audio output from the speaker to the earphones.

[0125] Furthermore, when the CPU of the sub-control board 400B receives an insertion detection signal or a wireless earphone connection signal and performs control to switch the audio output from the speaker to the earphones, the display image display device 157 may display connection notification information indicating that wired or wireless earphones have been connected. The connection notification information may also indicate that the audio output has switched from the speaker to the earphones. The connection notification information may also indicate both that wired or wireless earphones have been connected and that the audio output has switched from the speaker to the earphones. This allows the player to recognize that the earphones are effectively connected. On the other hand, when the wired or wireless earphones are disconnected, the display image display device 157 may display disconnection notification information indicating that the connection has been disconnected. The disconnection notification information may also indicate that the audio output has switched from the earphones to the speaker. The disconnection notification information may also indicate both that the wired or wireless earphones have been disconnected and that the audio output has switched from the earphones to the speaker. This allows the player to recognize when the connection with the earphones has been disconnected. Furthermore, these connection and disconnection notification messages may be hidden after being displayed for a predetermined period of time. Additionally, during the period when wired or wireless earphones are connected and the audio output has switched from the speaker to the earphones, a special icon indicating that earphones are connected (or / or that the audio output has switched from the speaker to the earphones) may be displayed for that period of time. As a result, the sound effects are output from the earphones, allowing the player to adjust the volume to their liking without disturbing those around them.

[0126] At the connection points circled with numbers 10 and 11 in Figure 19, the left and right earphone audio signals are output from the earphone unification board 4194 to the earphone jack board 4193.

[0127] In Figure 19, at the connection point marked with the circled number 12, the jack ground (JGND) of the earphone unified board 4194 is connected to the ground of the earphone jack board 4193.

[0128] Figure 19 shows the power supply circuit 4194a provided on the earphone unified board 4194. This power supply circuit 4194a steps down the 5V power supply voltage supplied from the sub-control board 400B to 3.3V using a step-down circuit and supplies it to the wireless earphone module 4194c, etc., within the earphone unified board 4194. The stage before the step-down circuit of the power supply circuit 4194a has the same configuration as the power supply noise filter 4192a in Figure 10(a). That is, it is provided with two capacitors for noise reduction and smoothing, and a resistor to limit the inrush current to these capacitors. Furthermore, two diodes with different orientations are provided in parallel between the analog ground (AGND) and the jack ground (JGND) for noise reduction.

[0129] The wireless earphone module 4194c processes either analog or digital input signals and outputs audio via both wired and wireless connections. The 4194c allows selection of whether to use analog or digital input signals via a register setting. This register setting can be controlled by the CPU of the sub-control board 400B using a UART signal. If an unselected signal is input, the 4194c ignores it.

[0130] First, when an analog signal is selected as the input to the wireless earphone module 4194c, the analog signal amplified by the differential amplifier circuit 4194b is output to the earphone jack board 4193 via the amplifier circuit 4194d, and the A / D converted and, if necessary, compressed or encrypted signal is output (transmitted) wirelessly to the wireless earphone.

[0131] Furthermore, if a digital signal is selected as the input to the wireless earphone module 4194c, the digital signal input from the sub-control board 400B is converted to an analog signal and output to the earphone jack board 4193 via the amplification circuit 4194d. At the same time, the D / D converted and, if necessary, compressed or encrypted signal is output (transmitted) wirelessly to the wireless earphone.

[0132] In other words, the wireless earphone module 4194c supports both analog and digital signal inputs, and also supports both wired and wireless outputs. In this embodiment, the analog signal amplified by the differential amplifier circuit 4194b is input through the microphone terminal of the wireless earphone module 4194c, but another terminal capable of audio input may be used. The wireless standard or method is not particularly limited and may be, for example, Bluetooth®. Furthermore, if the connection of a wired or wireless earphone is detected, the wireless earphone module 4194c may be configured to restrict the signal output for unconnected earphones. Also, if neither wired nor wireless earphones are connected, the wireless earphone module 4194c may be configured to restrict the signal output for both wired and wireless earphones.

[0133] In the amplification circuit 4194d, the audio signals from the wireless earphone module 4194c are integrated (converted to single outputs) for both the left and right channels, the current is amplified, and then the signal is output to the audio output circuit 4194e.

[0134] The audio output circuit 4194e processes the audio signal from the amplification circuit 4194d and outputs it to the earphone jack board 4193. This circuit includes a resistor (shown in Figure 19 as the resistor at the input from the amplification circuit 4194d) to prevent the output side from short-circuiting to ground when an earphone plug is inserted, which would cause overcurrent and damage the circuit. In addition, a resistor and a capacitor are provided in parallel between the audio signal path and the jack ground. The resistor is provided to prevent oscillation when the earphone plug is not inserted and to discharge any remaining charge when the earphone plug is removed, preventing noise caused by the remaining charge when the earphone plug is later inserted. The capacitor is provided to prevent pop noise caused by contact when earphones are connected and to prevent chattering.

[0135] The earphone unified board 4194 described above can process the input signal, whether it is an analog or digital signal, and output audio via both wired and wireless connections. There are advantages and disadvantages to processing analog signals versus digital signals. For example, comparing A / D conversion and D / D conversion, the former has less output delay than the latter, while the latter has less noise. Considering these differences, the sub-control board 400B could be configured to output only analog signals or only digital signals; however, the earphone unified board 4194 can be used in either of these configurations. In other words, the sub-control board 400B can utilize both analog and digital signals for audio output. Whether the sub-control board 400B is configured to output audio signals (sound information related to output sound) as analog signals only, or as digital signals only, the earphone unification board 4194 can be used regardless of the audio signal output format of the sub-control board 400B, because the wireless earphone module 4194c allows input of both analog and digital signals.

[0136] Furthermore, if the sub-control board 400B is configured to output only analog signals or only digital signals, unused signal lines on the earphone unified board 4194 may be affected by noise. The various ICs used in the earphone unified board 4194 are terminated in their internal circuit configuration, so termination on the earphone unified board 4194 is basically not required. However, to further improve noise immunity, termination may be performed separately on the earphone unified board 4194. For example, by terminating the input-side wiring of the earphone unified board 4194, the effects of noise can be suppressed even when signal lines are not used (including in the case of disconnection). In this embodiment, a configuration is adopted in which pull-up resistors or pull-down resistors are provided on the input-side wiring to set the potential of unused signal lines to a desired voltage and suppress the effects of noise. In this way, by terminating unused signal lines on the earphone unified board 4194, it is possible to maintain commonality regarding earphone output regardless of the configuration in which audio signals are output from the sub-control board 400B, without depending on the specifications of the sub-control board 400B.

[0137] Furthermore, on the sub-control board 400B side, it is preferable to terminate terminals corresponding to unused signal lines, for example, by connecting them to ground via a resistor (or directly). It is preferable to perform the termination process as close as possible to the terminal (connector). By terminating unused signal lines (terminals) on the sub-control board 400B side in this way, the impact of noise on the earphone unification board 4194 can be suppressed.

[0138] Furthermore, the above explanation described how the earphone unified board 4194 is configured to use three types of grounds: digital ground (DGND), analog ground (AGND), and jack ground (JGND). These grounds will be explained below using Figure 20. Figure 20 shows the regions corresponding to the grounds.

[0139] The analog ground (AGND) is used as the ground for the analog signal input circuit and a portion of the power supply circuit 4194a. Furthermore, the ground of the analog signal circuit on the sub-control board 400B side (in this case, the audio amplifier IC) is connected to this analog ground (AGND). In Figure 20, the region using the analog ground (AGND) (hereinafter referred to as the analog input region) is indicated by a downward-sloping hatch.

[0140] The digital ground (DGND) is used as the ground for the digital signal input circuit and the wireless earphone module 4194c. Furthermore, the ground of a portion of the digital signal circuit on the sub-control board 400B side is connected to this digital ground (DGND). In Figure 20, the area using the digital ground (DGND) (hereinafter referred to as the digital input area) is shown by a downward-sloping hatch. Note that the digital ground (DGND) is configured to be connected to the analog ground (AGND) at a single point (single-point ground 4194k). In Figure 19, the location where the digital ground (DGND) and analog ground (AGND) are connected at a single point is shown near the connection point to the sub-control board 400B side. As shown in Figure 19, it is preferable to provide the single-point ground 4194k as close as possible to the connector for connection to the sub-control board 400B side.

[0141] The jack ground (JGND) is used as the ground for all areas except the analog input region and the digital input region (elements on the earphone jack board 4193 side). Furthermore, the ground of the earphone jack board 4193 is connected to this jack ground (JGND). Figure 20 shows the region using the jack ground (JGND) (hereinafter referred to as the wired output region) without hatching. Note that the jack ground (JGND) and the analog ground (AGND) are connected via two diodes that are installed in parallel with different orientations (see power supply circuit 4194a).

[0142] The earphone unified circuit board 4194 handles different signals in its analog input area, digital input area, and wired output area. Therefore, to minimize mutual interference, such as when analog and digital signals are mixed, the grounds for each area are separated.

[0143] Furthermore, the analog ground (AGND) and digital ground (DGND) are also connected to the ground on the sub-control board 400B, and it is preferable to prevent any potential difference from occurring between these grounds. As explained above, the digital ground (DGND) and analog ground (AGND) are connected at a single point on the earphone unified board 4194, and the configuration ensures that no potential difference occurs for the DC component. On the other hand, for the high-frequency component, the impedance due to the wiring can suppress the mixing of analog and digital signals.

[0144] Furthermore, when connecting grounds on the earphone unified board 4194, filters, resistors, etc., may be provided as appropriate.

[0145] <Regarding the location of the earphone jack> Figure 21 shows an example of the location of the earphone jack in the slot machine 100. It is preferable to install the earphone jack in a location that does not interfere with gameplay in the slot machine 100. In Figure 21, the upper left (position P1), the left side of the stop button and start lever (position P2), the lower left (position P3), and the bottom (position P4) of the slot machine 100 are shown. Installing the earphone jack in these positions will prevent it from interfering with the operation of gameplay. In addition, in the case of position P1, even a short earphone cable can be used, and it is easy to know that the player is away from their seat by leaving the earphones plugged in. Also, in the case of so-called medalless games, actual medals are not dispensed into the tray, so position P4 will not interfere with the dispensing process. Furthermore, considering the burden of replacement work in the event of a malfunction in the earphone jack, it is preferable to install it in a location on the front door that is easy to maintain.

[0146] Alternatively, instead of providing an earphone jack on the front, it may be provided on the back of the gaming machine, allowing the use of earphones on the front using an extension cord from the back of the machine. Alternatively, instead of providing an earphone jack on the front, it may be provided on the front using an extension cord from a circuit board inside the gaming machine (for example, a circuit board that supplies left and right audio output signals, such as the earphone jack circuit board 4193).

[0147] <Regarding the application of earphones to pachinko machines> Figures 1 to 21 above illustrate the use of a slot machine 100 as an example of a gaming machine that can use earphones. However, the type of gaming machine is not limited to slot machines; for example, it may also be applied to a pachinko machine. Figure 22 shows an example of a pachinko machine equipped with an earphone jack. Figure 23 shows an example of the internal circuit board configuration of a pachinko machine to which the earphone amplifier board 4192 shown in Figure 5 etc. is applied. Figure 24 shows an example of the internal circuit board configuration of a pachinko machine to which the unified earphone board 4194 shown in Figure 19 is applied.

[0148] It is preferable to install the earphone jack in a location that does not interfere with gameplay on the pachinko machine. Figure 22 shows the upper left of the pachinko machine 100a (position P5), the lower left of the game board (position P6), the lower left of the pachinko machine 100a (position P7), and the bottom of the game board (position P8). Installing the earphone jack in these locations ensures that it does not interfere with the operation of the game. In the case of position P5, even a short earphone cable can be used, and it is easy to tell that the player is away from their seat by leaving the earphones plugged in. Furthermore, considering the burden of replacement work in the event of a malfunction in the earphone jack, it is preferable to install it in a location on the front door that is easy to maintain.

[0149] Alternatively, instead of providing an earphone jack on the front, it may be provided on the back of the gaming machine, allowing the use of earphones on the front using an extension cord from the back of the machine. Alternatively, instead of providing an earphone jack on the front, it may be provided on the front using an extension cord from a circuit board inside the gaming machine (for example, a circuit board that supplies left and right audio output signals, such as the earphone jack circuit board 4193).

[0150] In the circuit board configurations shown in Figures 23 and 24, the sub-control board 401 controls the audio output, and from this board, connections are made to the earphone amplifier board 4192 (earphone unified board 4194 in Figure 24) and the earphone jack board 4193 via the panel frame sub-relay board 205, frame sub-relay board 213, and relay board 213d. In this circuit board configuration, the sub-control board 401, panel frame sub-relay board 205, frame sub-relay board 213, and relay board 213d correspond to the peripheral board 4191 in Figure 5. Thus, the earphone amplifier board 4192 (earphone unified board 4194 in Figure 24) and the earphone jack board 4193 can be applied regardless of the type of gaming machine. Furthermore, to facilitate maintenance, it is preferable to place related boards (for example, relay board 213d, earphone amplifier board 4192, and earphone unified board 4194) close to the earphone jack. In the circuit board configurations shown in Figures 23 and 24, the upper frame relay board 213b and the lower frame relay board 213c are provided in accordance with the position of the front door. However, if the relay board 213d is to be located closer to the earphone jack, it may be incorporated into these boards.

[0151] ≪Correspondence between the structure of the invention and its embodiments≫ The configuration of the invention based on the above embodiment will be described below, with reference to the corresponding configuration.

[0152] In the above explanation, A gaming machine having a first circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to allow connection of a second sound output means (e.g., earphones) capable of outputting sound, The first substrate is a substrate that includes a circuit for processing the output signal to the second sound output means, The first substrate is a substrate that includes a first circuit (for example, a diode configuration with alternating polarities). A gaming machine characterized by the following features was described.

[0153] This gaming machine provides a gaming machine with optimized output to earphones.

[0154] Furthermore, the gaming machines described above, The first circuit is a circuit that includes a predetermined diode configuration (for example, a diode configuration with alternating polarities). A gaming machine characterized by the following features was described.

[0155] This gaming machine prevents ground noise from flowing into the first circuit board, thus preventing noise from being generated in the earphones.

[0156] Furthermore, in the above explanation, A gaming machine having a first circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to allow connection of a second sound output means (e.g., earphones) capable of outputting sound, The first substrate is a substrate that includes a circuit for processing the output signal to the second sound output means, The first substrate is a substrate that includes a first circuit (for example, a reference power supply generation circuit 4192c). A gaming machine characterized by the following features was described.

[0157] This gaming machine provides a gaming machine with optimized output to earphones.

[0158] Furthermore, the gaming machines described above, The first circuit is a circuit that includes a predetermined power supply circuit (for example, a voltage divider resistor and a voltage follower), The predetermined power supply circuit is a circuit that generates a bias voltage (2.5V) for the output of the output sound to the second sound output means. A gaming machine characterized by the following features was described.

[0159] This gaming machine can stabilize the voltage related to the earphone output to suppress noise.

[0160] Furthermore, in the above explanation, A gaming machine having a first circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to allow connection of a second sound output means (e.g., earphones) capable of outputting sound, The first substrate is a substrate that includes a circuit for processing the output signal to the second sound output means, The first substrate is a substrate that includes a first circuit (for example, a differential amplifier circuit 4192e). A gaming machine characterized by the following features was described.

[0161] This gaming machine provides a gaming machine with optimized output to earphones.

[0162] Furthermore, the gaming machines described above, The first circuit is a circuit that includes a predetermined differential amplifier circuit. A gaming machine characterized by the following features was described.

[0163] This gaming machine allows for the integration of two output signals to match the earphone output.

[0164] Furthermore, in the above explanation, A gaming machine having a first circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to allow connection of a second sound output means (e.g., earphones) capable of outputting sound, The first substrate is a substrate that includes a circuit for processing the output signal to the second sound output means, The first substrate is a substrate that includes a first circuit (for example, a current amplifier circuit 4192f). A gaming machine characterized by the following features was described.

[0165] This gaming machine provides a gaming machine with optimized output to earphones. Furthermore, the gaming machines described above, The first circuit is a circuit whose output is limited by a reset signal input during the power supply's rising or falling edge. A gaming machine characterized by the following features was described.

[0166] This gaming machine can prevent pop-up noise when the power is turned on or off.

[0167] Furthermore, in the above explanation, A gaming machine having a predetermined circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means (for example, earphones) capable of outputting sound. The aforementioned predetermined substrate includes a first circuit (e.g., a differential amplifier circuit 4192e) and a second circuit (e.g., a current amplifier circuit 4192f), and is a substrate that processes the output signal to the second sound output means. The second circuit is a circuit to which the audio signal processed in the first circuit is input via predetermined capacitors (for example, film capacitors C12 and C13). A gaming machine characterized by the following features was described.

[0168] This gaming machine provides a gaming machine with optimized output to earphones.

[0169] Furthermore, the gaming machines described above, The bias voltage of the first circuit is configured to be equal to the bias voltage of the second circuit (for example, both are 2.5V in Figure 6). The aforementioned predetermined capacitor is a non-polarized capacitor. A gaming machine characterized by the following features was described.

[0170] Even if the design reference voltage is the same for both the first and second circuits, the reference voltage will fluctuate due to changes in potential caused by noise. If a component has polarity, this can result in a reverse voltage and cause malfunctions. In the above-mentioned gaming machine, using non-polarized components reduces the risk of malfunctions even if the reference voltage fluctuates.

[0171] Furthermore, the gaming machines described above, The first circuit is a circuit that includes a predetermined differential amplifier circuit, The second circuit is a circuit that includes a predetermined current amplification circuit, The aforementioned predetermined capacitor is a film capacitor. A gaming machine characterized by the following features was described.

[0172] When ceramic capacitors are used in a circuit that amplifies the output signal, vibrations from the gaming machine are converted into electrical energy via the ceramic capacitor and included in the output signal, resulting in these vibrations being output as noise. However, by using film capacitors, vibration resistance in the amplification circuit, which has no polarity constraints, can be improved, preventing vibrations from the gaming machine from being output as noise.

[0173] Furthermore, in the above explanation, A gaming machine having a predetermined circuit board (for example, an earphone amplifier circuit board 4192), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means (for example, earphones) capable of outputting sound. The aforementioned predetermined substrate includes a first circuit (for example, a differential amplifier circuit 4192e) and is a substrate that processes the output signal to the second sound output means. The first circuit is a circuit to which an audio signal is input via predetermined capacitors (for example, electrolytic capacitors C3 to C6). A gaming machine characterized by the following features was described.

[0174] This gaming machine provides a gaming machine with optimized output to earphones.

[0175] Furthermore, the gaming machines described above, The first circuit is a circuit that includes a predetermined differential amplifier circuit, The aforementioned predetermined capacitor is an electrolytic capacitor. A gaming machine characterized by the following features was described.

[0176] When ceramic capacitors are used in a circuit that amplifies the output signal, vibrations from the gaming machine are converted into electrical energy via the ceramic capacitor and included in the output signal, resulting in these vibrations being output as noise. However, by using electrolytic capacitors, the vibration resistance of the amplification circuit can be improved, preventing vibrations from the gaming machine from being output as noise.

[0177] Furthermore, in the above explanation, A gaming machine having a predetermined circuit board (for example, an earphone unified circuit board 4194), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means (for example, wired earphones or wireless earphones) capable of outputting sound. The predetermined circuit board is a circuit board that includes a first circuit (for example, a wireless earphone module 4194c) that processes an output signal to the second sound output means based on the input sound information. The aforementioned predetermined circuit board is a circuit board that includes a first wiring (e.g., signal line 4194f) capable of transmitting sound information of a first form (e.g., analog form) (hereinafter referred to as "first sound information"), The aforementioned predetermined circuit board is a circuit board that includes a second wiring (e.g., signal line 4194g) capable of transmitting sound information in a second form (e.g., digital form) (hereinafter referred to as "second sound information"), The first circuit is the circuit to which the first wiring is connected. The first circuit is the circuit to which the second wiring is connected. A gaming machine characterized by the following features was described.

[0178] This gaming machine provides a gaming machine with optimized output to earphones.

[0179] Also, A gaming machine having control means (for example, a sub-control board 400B) and a predetermined board (for example, an earphone unified board 4194), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means (for example, wired earphones or wireless earphones) capable of outputting sound. The predetermined circuit board is a circuit board that includes a first circuit (for example, a wireless earphone module 4194c) that processes an output signal to the second sound output means based on the input sound information. The aforementioned predetermined circuit board is a circuit board that includes a first wiring (e.g., signal line 4194f) capable of transmitting sound information of a first form (e.g., analog form) (hereinafter referred to as "first sound information"), The aforementioned predetermined circuit board is a circuit board that includes a second wiring (e.g., signal line 4194g) capable of transmitting sound information in a second form (e.g., digital form) (hereinafter referred to as "second sound information"), The first circuit is the circuit to which the first wiring is connected. The first circuit is the circuit to which the second wiring is connected. The control means is capable of outputting the first sound information to the predetermined circuit board. A gaming machine characterized by the following features was described.

[0180] This gaming machine provides a gaming machine in which the output of audio data in a predetermined format to the earphones is optimized.

[0181] Also, A gaming machine having control means (for example, a sub-control board 400B) and a predetermined board (for example, an earphone unified board 4194), The aforementioned gaming machine has a first sound output means (for example, speakers 272, 277) capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means (for example, wired earphones or wireless earphones) capable of outputting sound. The predetermined circuit board is a circuit board that includes a first circuit (for example, a wireless earphone module 4194c) that processes an output signal to the second sound output means based on the input sound information. The aforementioned predetermined circuit board is a circuit board that includes a first wiring (e.g., signal line 4194f) capable of transmitting sound information of a first form (e.g., analog form) (hereinafter referred to as "first sound information"), The aforementioned predetermined circuit board is a circuit board that includes a second wiring (e.g., signal line 4194g) capable of transmitting sound information in a second form (e.g., digital form) (hereinafter referred to as "second sound information"), The first circuit is the circuit to which the first wiring is connected. The first circuit is the circuit to which the second wiring is connected. The control means is capable of outputting the second sound information to the predetermined circuit board. A gaming machine characterized by the following features was described.

[0182] This gaming machine provides a gaming machine in which the output of audio data in a predetermined format to the earphones is optimized.

[0183] Furthermore, the gaming machines described above, The aforementioned first sound information is sound information in analog format, The aforementioned second sound information is sound information in digital format. A gaming machine characterized by the following features was described.

[0184] This gaming machine can accommodate any format in which the control system outputs sound information, thus improving versatility. In other words, it can be used as an earphone output board that is independent of the output format of the control system, thus increasing its versatility.

[0185] [Third Embodiment] The speaker of a gaming machine is required to output sound stably. The third embodiment provides a gaming machine that solves this problem. In the following, only the configurations, functions, and processes that differ from the above embodiment will be described, and other configurations, functions, and processes will be described in more detail, with the same reference numerals used for the same parts. In the following description, the reference numerals that are common to the embodiments in Figures 1 to 24 will take precedence in the following description.

[0186] <Speakers> Figure 25 is an external view of the slot machine of this embodiment (third embodiment), showing the position of the speakers to which the audio amplifier IC 418 of this embodiment is connected. The slot machine 100 of this embodiment is equipped with upper speakers 272 (upper left speaker 272a, upper right speaker 272b) located behind the sound hole 143, middle speakers 275 (middle left speaker 275a, middle right speaker 275b) located behind the winning line indicator lamp 120 and reel panel lamp 128, and lower speakers 277 (lower left speaker 277a, lower right speaker 277b) located behind the sound hole 145, and is characterized by the component layout of the audio circuit around the audio amplifier IC 418 connected to these three speakers. In other words, in this embodiment, the component layout of the audio circuit is designed to stably output sound.

[0187] Here, the upper left speaker 272a and the upper right speaker 272b of the upper speaker 272 are of the same type. Also, the left middle speaker 275a and the right middle speaker 275b of the middle speaker 275 are of the same type. Also, the lower left speaker 277a and the lower right speaker 277b of the lower speaker 277 are of the same type. On the other hand, the upper speaker 272 (upper left speaker 272a, upper right speaker 272b) and the middle speaker 275 (left middle speaker 275a, right middle speaker 275b) are of different types. Also, the middle speaker 275 (left middle speaker 275a, right middle speaker 275b) and the lower speaker 277 (lower left speaker 277a, lower right speaker 277b) are of different types. Furthermore, the upper speaker 272 (upper left speaker 272a, upper right speaker 272b) and the lower speaker 277 (lower left speaker 277a, lower right speaker 277b) are different types of speakers. There are also audio circuits corresponding to the upper speaker 272 (upper left speaker 272a, upper right speaker 272b), the middle speaker 275 (middle left speaker 275a, middle right speaker 275b), and the lower speaker 277 (lower left speaker 277a, lower right speaker 277b). This embodiment aims to enhance the enjoyment of the game by improving the functionality of these audio circuits.

[0188] <Audio Circuit Arrangement> Figure 26(a) is a top view of the first sub-control board 401 on which the components of the first sub-control unit 400 are arranged, and shows the component layout of the audio circuit 450 around the audio amplifier IC 418. Hereafter, the +X direction in Figure 26 will be referred to as right, the -X direction as left, the +Y direction as up, and the -Y direction as down. The board surface shown in Figure 26(a) of the first sub-control board 401 is sometimes referred to as the component surface or front surface, and the board surface on the opposite side is sometimes referred to as the solder surface or back surface.

[0189] As shown in Figure 26(a), the first sub-control board 401 includes an audio circuit 450A for the upper speaker 272, an audio circuit 450B for the middle speaker 275, an audio circuit 450C for the lower speaker 275, and an audio circuit 450D for the woofer. Audio circuits 450A and 450B are located at the left edge of the first sub-control board 401, and audio circuit 450C is located at the right edge of the first sub-control board 401. In other words, audio circuits 450A, 450B, and 450C (hereinafter, when referring to these three collectively, or including audio circuit 450D, they will be referred to as audio circuit 450) are all located close to the edge of the first sub-control board 401. The audio output from audio circuit 450 requires a large amount of power and thus a large power supply, resulting in a large magnetic field influence on other components. Therefore, the audio circuit 450 is placed at the edge of the first sub-control board 401 (the CPU 404 is located in the center of the first sub-control board 401) to minimize interference with other logic communication signals and power supply systems.

[0190] Furthermore, audio circuits 450A and 450B are connected to connector CN1 near audio circuit 450A, and audio circuit 450C is connected to connector CN3 near audio circuit 450C. This is because audio circuits 450 require a large amount of power, and longer wiring would result in greater power loss due to voltage drop. Therefore, this is a measure to shorten the wiring length and avoid power loss. In other words, the first sub-control board 401 of this embodiment has a first connector (e.g., connector CN1) connected to audio circuit 450 (e.g., audio circuit 450A), and a second connector (e.g., connector CN2) connected to a circuit other than audio circuit 450, with the first connector being closer to audio circuit 450 than the second connector. The second connector (for example, connector CN2) may be a connector electrically connected to a liquid crystal display device, a connector electrically connected to an operation button used to trigger the start of an effect (such as a push button effect, rapid-fire effect, or long-press effect) or to customize the effect, a connector electrically connected to various LEDs, or a connector electrically connected to the main control board.

[0191] Although audio circuits 450A and 450B are connected to a common connector CN1, resulting in a configuration where multiple audio circuits are connected to one connector, the configuration is not limited to this. For example, connector CN-A may correspond to audio circuit 450A, connector CN-B to audio circuit 450B, connector CN-C to audio circuit 450C, and so on, where one audio circuit is connected to one connector. Furthermore, as will be explained in detail later using Figures 29 to 33, a configuration where one audio circuit is connected to multiple connectors is also possible. Specifically, for example, in the audio circuit of the middle speaker, the output of the left speaker is connected to connector CN-L and the output of the right speaker is connected to connector CN-R, while in the audio circuit of the lower speaker, the output of the left speaker is connected to connector CN-L and the output of the right speaker is connected to connector CN-R. In the examples shown in Figures 29 to 33 (multiple connectors for one audio circuit), the audio circuit and the corresponding connector are located far apart. However, even in configurations where multiple connectors are connected to one audio circuit, it is also possible to have a configuration where the corresponding connector is located near the audio circuit, as shown in Figure 26(a).

[0192] As shown in Figure 26(a), the audio circuits 450 all have their components (e.g., audio amplifier IC 418, coil L, resistor R, capacitor C, electrolytic capacitor EC, etc.) arranged in a nearly identical layout. This allows for the equalization of the audio output performance of the three speakers (upper speaker 272, middle speaker 275, and lower speaker 277), thereby stabilizing the audio output. For example, the vertical spacing t1 between the two coils L arranged in the audio circuit 450 is nearly identical. By making the spacing t1 between the coils L nearly identical, the heat generation effect of the three speakers can be made equivalent, stabilizing the audio output and also achieving a uniform noise reduction effect. Furthermore, even if different types of speakers are installed, the positional relationship of the components constituting the audio circuit is nearly identical, making it easy to recognize that they are speaker-related components, allowing for quick response if a problem occurs in the audio output. In other words, it is immediately clear where on the circuit board to focus attention.

[0193] Furthermore, no electronic components are placed in the region of the gap t1 between coils L, at least on the component side. This prevents the heat generated by coils L from affecting other components. It also improves heat dissipation compared to when components are placed in the gap t1. The same effect can be achieved by not placing components in the solder side region corresponding to the gap t1, although components may be placed there as the effect of heat generation is reduced compared to the component side.

[0194] In audio circuits 450 (audio circuits 450A, 450B, and 450C), two coils L are provided because the upper speaker 272, middle speaker 275, and lower speaker 277 are stereo output speakers, while in audio circuit 450D, one coil L is provided because the woofer is a monaural output speaker.

[0195] Figure 26(b) is a diagram showing the arrangement of the components of the audio circuit 450. The amplifier circuit 450 generally comprises an audio amplifier IC 418, two coils L, multiple resistors R, multiple capacitors C, and an electrolytic capacitor EC. The audio amplifier IC 418 is positioned midway between the two coils L. More specifically, the two coils L are positioned symmetrically with respect to a virtual extension line L4 that divides the audio amplifier IC 418 vertically. In other words, in the case of the audio amplifier IC 418 and the two coils L, the layout (corresponding to the first positional relationship) is such that at least a part of the audio amplifier IC 418 is included in the intermediate portion of the two coils L (the region between the virtual extension lines of both the end edge of one coil facing the other coil and the end edge of the other coil facing the first coil, and consisting of a virtual extension line with a distance t1). For example, the audio amplifier IC 418 may be laid out symmetrically with respect to the two coils L, or it may be laid out eccentrically with respect to one of the two coils L. As a result, in the case of stereo output, by making the length of the wiring pattern from the audio amplifier IC to both coils L uniform, the likelihood (or likelihood) of noise generation is also made uniform, stabilizing the audio output and achieving a well-balanced audio output.

[0196] The audio circuit 450 of this embodiment is provided with two LC filters LCF for selectively removing high-frequency noise. That is, the LC filters LCF of this embodiment have the function of low-pass filters that cut high-frequency signals. The LC filter LCF consists of one coil L and two capacitors C to the right of the coil L. In this embodiment, both the coil L and the capacitors C of the LC filter LCF are provided on the front (top) surface of the first sub-control board 401, but the coil L may be provided on the front (top) surface while the capacitors C are provided on the back (bottom) surface (both the coil L and capacitors C may be on the back surface, or the coil L may be on the back surface and the capacitors C may be on the front surface). In addition, the Zobel filter ZOF, which prevents oscillation and noise caused by the speaker load (back electromotive force from the speaker), consists of one capacitor and two resistors R to the left of the coil L. In this embodiment, the Zobel filter ZOF is provided on the left side of the coil L, that is, on the side opposite to the connector CN to which the audio circuit 450 is connected. However, it may also be provided on the right side of the coil L, that is, on the connector CN side to which the audio circuit 450 is connected. In this embodiment, both the capacitor C and the resistor R of the Zobel filter ZOF are provided on the front (top) surface of the first sub-control board 401. However, the capacitor C may be provided on the front (top) surface while the resistor R is provided on the back (bottom) surface (both the capacitor C and resistor R may be on the back surface, or the capacitor C may be on the back surface and the resistor R may be on the front surface).

[0197] Figure 27 shows the circuit diagram of the audio circuit 450. Figure 27(a) shows the circuit diagram of the signal system, and Figure 27(b) shows the circuit diagram of the power supply system. As shown in Figure 27(a), the audio signal is output from the output terminal of the audio amplifier IC 418, first through the LC filter LCF, then through the Zobel filter ZOF, and finally to the connector CN. The power supply bypass capacitor PBC shown in the power supply circuit diagram is a capacitor installed between the power supply and ground, and by bypassing (redirecting) noise to ground, it enables the supply of a stable power supply to the circuit.

[0198] In this embodiment, the coil L of the LC filter LCF uses a coreless coil, but a coil with a core may also be used. The constants of each element of the LC filter LCF are determined based on the switching frequency of the digital amplifier (20kHz to 350kHz). Specifically, a coil L of 10 to 15μH is desirable, and in the case of a 10μH coil L, a capacitor C of 0.33μF is used, and in the case of a 15μH coil L, a capacitor C of 0.22μF is used.

[0199] Note that the capacitor C1 (a capacitor that suppresses high-frequency noise) placed between the LC filter LCF and the Zobel filter is optional. More specifically, if the capacitor C used in the LC filter LCF is a ceramic capacitor, it is preferable to use capacitor C1, but if a film capacitor is used, capacitor C1 is not necessary. In the case of a ceramic capacitor, the piezoelectric effect (electrostrictive effect) when voltage is applied causes the ceramic capacitor to expand and contract, so this expansion and contraction can be suppressed. In this case, it is preferable that the capacitance of capacitor C1 is smaller than that of capacitor C that constitutes the LC filter. For example, if the capacitor C of the LC filter is 0.33μF, then it should be 0.01μF to 0.1μF. If the capacitance of capacitor C1 is large, an LC filter LCF will be formed by capacitor C1 (the LC filter LCF will work twice), resulting in muffled sound and preventing the output of sound with the intended sound quality.

[0200] Furthermore, capacitor C2 before connector CN is a high-pass filter for the tweeter. When the left and right speakers are connected in parallel, with one speaker handling low-mid frequencies and the other handling high frequencies (tweeter), it is used to cut the low-mid frequencies from the other speaker. If the left and right speakers are connected one-to-one, it is not necessary to use it, as one speaker can handle the low-mid frequencies from the start and the other handles the high frequencies.

[0201] Figure 26(c) shows the terminal arrangement of the audio amplifier IC418. As shown in Figure 26(c), the terminals for the left speaker (output terminal and power terminal) LT are provided in a straight line (left-right direction) on the upper edge of the rectangular audio amplifier IC418, and the terminals for the right speaker (output terminal and power terminal) RT are provided in a straight line (left-right direction) on the lower edge of the rectangular audio amplifier IC418.

[0202] Figure 26(d) is a cross-sectional view taken along the YY line in Figure 26(a). Because the audio amplifier IC 418 and coil L in this embodiment generate a large amount of heat, ventilation holes 405 are provided in the substrate case 403 covering the first sub-control board 401 near the audio amplifier IC 418 or coil L. The ventilation holes 405 may be ventilation holes 405a formed on the upper or lower surface (hereinafter referred to as the upper and lower surfaces) of the substrate case 403, ventilation holes 405b formed spanning the upper and lower surfaces and the side surface, or both ventilation holes 405a and 405b may be provided. Alternatively, a fan may be provided instead of the ventilation holes 405, or a fan may be provided together with the ventilation holes 405. This enhances the heat dissipation effect of the audio amplifier IC 418 and coil L, which generate a large amount of heat, and allows for concentrated heat dissipation of components that tend to generate a lot of heat.

[0203] Figure 28(b) shows the ground region GND and the region without ground N-GND of the first sub-control board 401 (a control board with the same configuration as the audio circuit 450 shown in Figure 26(a)) shown in Figure 28(a). As shown in Figure 28(b), the region where the coils L of audio circuits 450A, 450B, 450C, and 450D are located is designated as the region without ground N-GND (first example of ground GND). This prevents potential instability caused by the magnetic field generated by the coil L of audio circuit 450.

[0204] Figure 28(c) shows a different potential adjustment method than that shown in Figure 28(b). As shown in Figure 28(c), the ground VC1 of the region where audio circuits 450A and 450B are located, and the ground VC2 of the region where audio circuits 450C and 450D are located, may be wired separately from the ground GND of the region where the other circuits are located. In this case, a slit-shaped region N-GND, which does not have a ground connection, may be provided between each region to physically separate them. For example, the regions may be completely separated, such as between ground VC1 and ground GND (second example of ground GND), or they may be separated so that some regions are connected, such as between ground VC2 and ground GND (third example of ground GND). This method also prevents potential instability due to the magnetic field generated by the coil L of audio circuit 450. Note that while Figure 28(c) shows the second and third examples of separating the ground (GND), it is not necessary for both the second and third examples to coexist on a single board; it is sufficient for either the second or third example to be implemented on a single board.

[0205] <Modified Arrangement of Audio Circuits> Next, the first sub-control board 401A of Modified Arrangement 1 will be described using Figures 29 to 33. Hereafter, the +X direction shown in Figure 29 will be referred to as right, the -X direction as left, the +Y direction as up, and the -Y direction as down. Figure 29 is a top view of the component side of the first sub-control board 401A, showing the component layout of the audio circuit 451 around the audio amplifier IC 418. Figure 30 is a circuit diagram of the audio circuit 451. The first sub-control board 401A is also composed of multiple layers, and Figure 31(a) shows the first layer of the first sub-control board 401A, Figure 31(b) shows the third layer, Figure 32(a) shows the fourth layer, Figure 32(b) shows the fifth layer, Figure 33(a) shows the seventh layer, and Figure 33(b) shows the eighth layer. In Figures 31 to 33, the light gray area represents the ground area (GND), the white area represents the area without ground (N-GND), and the dark gray shaded area represents the wiring pattern of the audio signal from the audio amplifier IC 418 to connector CN.

[0206] As shown in Figure 29, the first sub-control board 401A is equipped with an audio circuit 451A for the upper speaker 272, an audio circuit 451B for the middle speaker 275, and an audio circuit 451C for the lower speaker 277, near the center of the first sub-control board 401A. More specifically, the three audio circuits 451 (referred to collectively as audio circuit 451) are arranged near the center of the first sub-control board 401A in the order of audio circuit 451A, audio circuit 451B, and audio circuit 451C, from top to bottom.

[0207] As shown in Figure 29, all audio circuits 451 have their components (for example, audio amplifier IC 418, coil L, resistor R, capacitor C, electrolytic capacitor EC, etc.) arranged in a substantially identical layout. This allows for uniform performance of the audio output and stabilizes the audio output. In general, audio circuit 451 comprises an audio amplifier IC 418, multiple coils L, multiple resistors R, multiple capacitors C, and an electrolytic capacitor EC.

[0208] Figure 30 shows the circuit diagram of the audio circuit 451. Figure 30(a) shows the circuit diagram of the signal system, and Figure 30(b) shows the circuit diagram of the power supply system. As shown in Figure 30(a), the audio signal is output from the output terminal of the audio amplifier IC 418, first through the LC filter LCF, then through the Zobel filter ZOF, and finally to the connector CN. Also, in the power supply system circuit diagram in Figure 30(b), a power supply bypass capacitor PBC is provided to remove noise, similar to Figure 27(b). Capacitors C1 (C207, C208, C209, C222 in Figure 30) connected to the BST terminal are bootstrap capacitors for voltage boosting and play a role in assisting the output of the positive and negative terminals. Capacitors C1 are not necessary in the case of the audio amplifier IC 418 which does not have a BST terminal. Capacitors C2 (C238, C299, C303, C304 in Figure 30) are provided for noise suppression from the speaker.

[0209] In this embodiment, the coil L of the LC filter LCF uses a coreless coil, but a coil with a core may also be used. The constants of each element of the LC filter LCF are determined based on the switching frequency of the digital amplifier (20kHz to 350kHz). Specifically, a coil L of 10 to 15μH is used, with a capacitor C of 0.33μF used for a 10μH coil L, and a capacitor C of 0.22μF used for a 10μH coil L.

[0210] Returning to Figure 29, the audio output signal wiring C1 from audio circuit 451A to the upper speaker 272 (specifically, the upper left speaker 272a and the upper right speaker 272a) is connected to connector CN1 located in the center of the left edge of the first sub-control board 401A. The audio output signal wiring C2 from audio circuit 451B to the right of the middle speaker 275 (specifically, the middle speaker 275b) and from audio circuit 451C to the right of the lower speaker 277 (specifically, the lower speaker 277b) is connected to connector CN2 located below the left edge of the first sub-control board 401a. The audio output signal wiring C3 from audio circuit 451B to the left of the middle speaker 275 (specifically, the middle speaker 275a) and from audio circuit 451C to the left of the lower speaker 277 (specifically, the lower speaker 277a) is connected to connector CN3 located below the right edge of the first sub-control board 401A.

[0211] Here, we will explain the flow of audio signals from the audio circuit 451 to connector CN using Figures 31 to 33.

[0212] Wiring C1 is connected from the audio circuit 451A to connector C1 via routes C1-1a in Figure 31(a), C1-1b in Figure 33(b), C1-2 in Figure 32(b), C1-3 in Figure 31(a), C1-4 in Figure 32(a), and C1-5 in Figure 31(a).

[0213] Wiring C2 is connected from audio circuits 451B and 451C to connector C2 via routes C2-1a in Figure 31(a), C2-1b in Figure 33(b), C2-2 in Figure 32(b), C2-3 in Figure 31(a), and C2-4 in Figure 32(a).

[0214] Wiring C3 connects from audio circuits 451B and 451C to connector C3 via paths C3-1a in Figure 31(a), C3-1b in Figure 33(b), C3-2 in Figure 32(b), C3-3 in Figure 31(a), and C3-4 in Figure 33(a). In this way, the wiring pattern from the audio amplifier IC to the connector may be configured via multiple layers.

[0215] As shown in Figure 31(a), the region where the coil L of the audio circuit 451 (audio circuit 451A, audio circuit 451B, audio circuit 451C) is located is a region N-GND without a GND connection. This prevents potential instability caused by the magnetic field generated by the coil L of the audio circuit 451. Alternatively, as shown in Figure 28(c), the ground GND of the region of the audio circuit 451 (audio circuit 451A, audio circuit 451B, audio circuit 451C) may be separated from the ground GND of the other circuit regions and wired separately.

[0216] [Other Variations] Using diagram 34(a) of the audio circuit component arrangement, the arrangement of components for multiple (specifically two) audio circuits 450 will be explained. In Figure 34(a), one audio circuit is denoted as 450A and the other audio circuit as 450B. Also, in Figure 34(a), virtual extension lines are shown along with each component that makes up the audio circuit 450 (audio amplifier IC 418, coil L, resistor R, electrolytic capacitor EC). A virtual extension line generally represents a straight line that forms the outer outline of the audio circuit 450, which is composed of multiple components, or a straight line that passes through the center of a given component.

[0217] In Example 1 of Figure 34(a), both audio circuits 450A and 450B are located within the area enclosed by virtual extension lines L1, L2, L3, and L4, and the coil L, capacitor C, and resistor R are positioned symmetrically with respect to the audio amplifier IC 418 (the coil L, capacitor C, and resistor R are positioned symmetrically with respect to the virtual extension line VL that divides the audio amplifier IC 418 into left and right halves). In addition, the electrolytic capacitor EC is located to the right of the power supply IC 418 and parallel to the audio amplifier IC 418.

[0218] In this way, the component layouts within the two audio circuits can be made nearly identical, and the coil L, capacitor C, and resistor R can be placed in symmetrical positions with respect to the audio amplifier IC 418.

[0219] In Example 2 of Figure 34(a), similar to Example 1, both audio circuits 450A and 450B are located within the area enclosed by virtual extension lines L1, L2, L3, and L4, and the coil L, capacitor C, and resistor R are positioned symmetrically with respect to the audio amplifier IC 418 (the coil L, capacitor C, and resistor R are positioned symmetrically with respect to the virtual extension line VL that divides the audio amplifier IC 418 into left and right halves). However, the positional relationship between the electrolytic capacitor EC and the audio amplifier IC 418 is different from that of Example 1. In Example 2, the electrolytic capacitor EC is positioned below the position of the audio amplifier IC 418. Thus, the lower end of the electrolytic capacitor EC may be offset from the lower end of the audio amplifier IC 418.

[0220] Here, in Examples 1 and 2 of Figure 34(a), the audio circuits 450A and 450B have substantially the same component layout, but it is not necessary for the layout of all components to be substantially the same. For example, as shown in Example 3 of Figure 34(a), the electrolytic capacitor EC may be placed in an inverted position. The layout of the other components is substantially the same as in Examples 1 and 2. Specifically, in audio circuit 450A, the electrolytic capacitor EC is placed to the right of the audio amplifier IC 418, while in audio circuit 450B, the electrolytic capacitor EC is placed to the left of the audio amplifier IC 418. In this way, audio circuits 450A and 450B may be placed in a symmetrical positional relationship.

[0221] In Example 4 of Figure 34(a), both audio circuits 450A and 450B are located within the area enclosed by virtual extension lines L1, L2, L3, and L4. However, unlike Examples 1 to 3, the components near coil L (coil L, capacitor C, resistor R) are not arranged symmetrically with respect to the audio amplifier IC 418. On the other hand, the components near the audio amplifier IC 418 (capacitor C, resistor R) are arranged symmetrically with respect to the power supply IC 418. Note that audio circuits 450A and 450B in Example 4 of Figure 34(a) have substantially the same component layout within the audio circuits.

[0222] Note that in Examples 1 to 4 of Figure 34(a), the electrolytic capacitor EC was not placed between the two coils L, but it is also possible to place the electrolytic capacitor EC between the two coils L. Also, in the diagrams shown in Examples 1 to 4 of Figure 34(a), capacitors involved in other electronic processing were not shown, but it is also possible to include capacitors involved in other electronic processing.

[0223] From the above, the audio amplifier IC418 and the two coils L are laid out such that at least a part of the audio amplifier IC418 is included in the intermediate portion of the two coils L (the region between the virtual extension lines of both the end edge of one coil on the side of the other coil and the end edge of the other coil on the side of the other coil, and the region consisting of virtual extension lines with a distance t1. The shaded region between virtual extension line L1' and virtual extension line L5' shown in Figure 34). (This corresponds to the first positional relationship.) For example, the audio amplifier IC418 may be laid out so as to be symmetrical with respect to the two coils L, or the audio amplifier IC418 may be laid out so as to be eccentric with respect to one of the two coils L.

[0224] Furthermore, in the case of the audio amplifier IC 418 and capacitor C, the layout may be such that capacitor C is located between the audio amplifier 418 and coil L (corresponding to the second positional relationship), or the layout may be such that coil L is located between the audio amplifier 418 and capacitor C (corresponding to the second positional relationship), that is, in the direction of output of the audio signal as seen from the audio amplifier 418, the positional relationships are "audio amplifier IC → capacitor C → coil L" and "audio amplifier IC → coil L → capacitor C". Also, the layout of capacitor C is symmetrical with respect to the audio amplifier IC 418, the layout of capacitor C is symmetrical with respect to the two coils L, and the layout of capacitor C is symmetrical with respect to one coil L. In the case of the audio amplifier IC 418 and electrolytic capacitor EC, at least a part of electrolytic capacitor EC is located inward from the virtual extension line L4 along the end on the side of the audio amplifier IC 418 that has the power supply terminals, and on the side opposite to the side where coil L is located in the audio amplifier IC 418 (corresponding to another example of the second positional relationship, or the fourth positional relationship).

[0225] Furthermore, the layout of the coil L and capacitor C may be such that the capacitor C is located between the coil L and the audio amplifier IC 418 (corresponding to the third positional relationship), or between the coil L and the connector CN (corresponding to the third positional relationship). In other words, the positional relationship is such that the capacitor C is located closer to the audio amplifier IC 418 when viewed from the coil L, or the positional relationship is such that the capacitor C is located closer to the connector CN, which is on the opposite side of the audio amplifier IC 418 when viewed from the coil L. Also, the capacitor C is laid out so as to be symmetrical with respect to one coil L and / or two coil Ls. In the case of the coil L and electrolytic capacitor EC, the electrolytic capacitor EC is positioned eccentrically on one side of the two coils L, and at least a portion of the electrolytic capacitor EC is positioned inward from the imaginary extension line L5 of the end of the coil L on the opposite side from the other coil L, at least a portion of the electrolytic capacitor is positioned inward from the imaginary extension line L4 along the end on the opposite side of the audio amplifier IC 418 where the coil L is positioned, and at least a portion of the electrolytic capacitor EC is positioned inward from the extension line L3 of the end of the connector side of the two coils L (corresponding to another example of the third positional relationship, or the fifth positional relationship). Furthermore, electronic components such as a capacitor C and / or a resistor R are placed between the coil L and the electrolytic capacitor EC, and the electrolytic capacitor EC is positioned on the side of the audio amplifier IC 418 that has the power supply terminals (the side closer to the power supply terminals), thereby preventing close contact with the coil L and minimizing the amount of heat generated by the coil L that reaches the electrolytic capacitor EC. Note that, as shown in Example 4, the same effect can be achieved by positioning the coil L and electrolytic capacitor EC apart even without any components between them.

[0226] Furthermore, the audio amplifier IC418, coil L, and capacitor C are arranged such that at least a portion of the audio amplifier IC418 is included in the region formed by the virtual extension line of the distance t1 between it and the two coils L, and the capacitor C is arranged to be symmetrical with respect to the audio amplifier IC418 and / or coil L. In addition, the electrolytic capacitor EC is positioned on one side of the audio amplifier IC418 and on one side of the two coils L, and the virtual extension line of one of the edges of the electrolytic capacitor EC is laid out so that it overlaps with the audio amplifier IC418 and / or coil L.

[0227] • The audio circuit layout diagram 34(b) on the first sub-control board shows an example of the layout of the audio circuit 450 on the first sub-control board 401. In Figure 34(b), audio circuit 1 is denoted as 450X, audio circuit 2 as 450Y, and audio circuit 3 as 450Z.

[0228] Example 1 in Figure 34(b) shows a first sub-control board 401X in which the audio circuits 450X, 450Y, and 450Z are each located at or near the edge of the board. In the first sub-control board 401X, the audio circuits 450X and 450Y are located at one edge (specifically, the left edge), and the audio circuit 450Z is located at the other edge (specifically, the right edge). In addition, the first connector CN1 is located near the audio circuits 450X and 450Y, and the second connector CN2 is located near the audio circuit 450Z.

[0229] According to the first sub-control board 401X shown in Example 1 of FIG. 34(b), by providing the audio circuit at the end, it is possible to reduce the influence of noise due to the switching frequency on other components. In addition, the correspondence between the connector CN (audio circuit) and the speaker is easy to understand, and there is an effect that it becomes easier to identify the defective part. Further, when the output sound from the game table is felt to be noisy during the inspection work, the connector of the harness connecting the connector CN and the speaker may be removed. Since the audio circuit, the connector CN connected to the corresponding speaker, and the connector CN are located in the vicinity in this way, it becomes easy to know which connector should be removed, and the work efficiency can be improved.

[0230] Example 2 of FIG. 34(b) shows a first sub-control board 401Y in which both the audio circuit 450X and the audio circuit 450Y are aggregated and arranged in one edge area of the board (specifically, the upper right 1 / 4 area of the board). Further, the connector CN is arranged in the vicinity of the audio circuit 450X and the audio circuit 450Y.

[0231] According to the first sub-control board 401Y shown in Example 2 of FIG. 34(b), by concentrating the audio circuits at the edge, it is possible to further reduce the influence of noise on other components. In addition, it is easy to identify the connector CN connected to the speaker, and it is possible to instantaneously identify the connector CN to be pulled out when a popping sound occurs. Further, heat-generating components such as the audio amplifier IC418 and the coil L can be concentrated and heat can be dissipated intensively.

[0232] Example 3 of FIG. 34(b) shows a first sub-control board 401Z in which both the audio circuit 450X and the audio circuit 450Y are arranged in the central area of the board. Further, the first connector CN1 is arranged in the vicinity of the audio circuit 450X, and the second connector CN2 is arranged in the vicinity of the audio circuit 450Y.

[0233] According to the first sub-control board 401Z shown in Example 3 of FIG. 34(b), by arranging heat-generating components such as the audio amplifier IC 418 and the coil L at the central part of the board, the heat can be dispersed to the whole board, and it is easier to exert the heat dissipation effect. In addition, in the point that the connector CN and the audio circuit are located in the vicinity, the correspondence relationship between the connector CN and the audio circuit becomes easy to understand, and the efficiency of the inspection work is improved.

[0234] • In the above embodiment and modified examples, the component layouts within the audio circuit 450 were identical or nearly identical (including the inversion target), but the component layouts may be different for each audio circuit 450. Figure 34(c) shows the first sub-control board 401J in which the component layouts of audio circuit 450X and audio circuit 450Y are different. The audio circuit 450X and audio circuit 450Y differ in the positional relationship between the audio amplifier IC 418 and coil C, and the positional relationship between the audio amplifier IC 418 and electrolytic capacitor EC. Furthermore, a capacitor C is also placed, and capacitor C is placed on the side of the audio amplifier IC 418 where coil L is not placed. In the case of audio circuit 450X, coil L is placed in the direction parallel to the audio amplifier IC 418 (left and right direction), and capacitor C is placed in the direction perpendicular to the audio amplifier IC 418 (up and down direction). On one side in the perpendicular direction, there is coil L corresponding to the (+) output terminal and (-) output terminal of one coil L, and on the other side in the perpendicular direction, there is coil L corresponding to the (+) output terminal and (-) output terminal of the other coil L. In the case of audio circuit 450Y, coil L is placed in the direction perpendicular to the audio amplifier IC 418 (up in the diagram, but it can also be down or up and down direction), and capacitor C is placed in the direction parallel to the audio amplifier IC 418 (left and right direction). On one side in the parallel direction, there is coil L corresponding to the (+) output terminal and (-) output terminal of one coil L, and on the other side in the parallel direction, there is coil L corresponding to the (+) output terminal and (-) output terminal of the other coil L. However, in both audio circuits 450X and 450Y, the components are arranged within the regions enclosed by the dashed-dotted virtual extension lines shown in Figure 34(c). Here, the rectangular region S1 enclosed by the virtual extension lines of audio circuit 450X and the rectangular region S2 enclosed by the virtual extension lines of audio circuit 450Y are approximately identical in shape and area (specifically, the length and width of the rectangles are approximately identical). This is true not only for the dashed-dotted virtual extension lines but also for the dotted virtual extension lines along the ends of each component, with each component being arranged within the regions enclosed by the dotted virtual extension lines.In audio circuit 450X, region S1 is formed by the virtual extension line along the end of the electrolytic capacitor EC, the virtual extension line along the end of the coil L, and the virtual extension line along the end of the capacitor C. In audio circuit 450Y, region S2 is formed by the virtual extension line along the end of the electrolytic capacitor EC, the virtual extension line along the end of the coil L, and the virtual extension line along the end of the audio amplifier IC 418.

[0235] Furthermore, the audio amplifier IC418 and the coils L are laid out within the region between the virtual extension lines of both the end of one coil on the other coil side and the end of the other coil on the other coil side (the region consisting of the virtual extension lines of the spacing between the coils L) (within the first range), and the distance from the audio amplifier IC418 to each coil L is approximately the same (w1 ≈ w2, w3 ≈ w4) within a range (another example within the first range). This allows the wiring length to be made approximately equal, and the sound output can be made uniform for the left and right outputs. Note that "w1·w2" and "w3·w4" may be different or approximately the same.

[0236] Furthermore, in the relationship between the audio amplifier IC418 and capacitor C, capacitor C is laid out so as to be approximately symmetrical with respect to the audio amplifier IC418 in both parallel and perpendicular directions, and is also laid out within the range S1 and S2 (the second range) enclosed by virtual extension lines from the ends of each component. This makes it possible to achieve uniformity in the left output, right output, (+) output, and (-) output, as well as space saving in the audio circuit.

[0237] Furthermore, the coils L and capacitors C are laid out within a range (the third range) such that the distance from capacitor C to each coil L is approximately the same (w5 ≈ w6). Although the distances w7 and w8 from capacitor C to each coil L in the audio circuit 450Y are not shown in the diagram, these distances are also approximately the same (w7 ≈ w8). This allows for approximately equal wiring lengths, resulting in uniform sound output between the left and right outputs.

[0238] Even if the component layout differs for each audio circuit 450, it is sufficient that each component in each audio circuit 450 is placed within a predetermined area of ​​the same range. In this case as well, the performance of multiple speakers can be made uniform to stabilize the audio output.

[0239] Figures 35(a) to (c) show the arrangement of the output terminals of the audio amplifier IC 418. In Figures 35(a) to (c), the coil for the left speaker is denoted as LL, the coil for the right speaker as RL, the output terminal for the left speaker of the audio amplifier IC 418 as LT, and the output terminal for the right speaker as RT. Also, the area to the left of the audio amplifier IC 418 is denoted as LS, and the area to the right is denoted as RS, with respect to the center line VL that divides the audio amplifier IC 418 into left and right halves.

[0240] In this embodiment, as shown in Figure 26, the two coils LL and RL are positioned symmetrically with respect to the center line VL of the audio amplifier IC418. In this case, to avoid crossings and shorten the distance of the wiring between the audio amplifier IC418 and coil L, it is preferable that the output terminal LT and the coil LL for the left speaker are connected in the same region LS, and the output terminal RT and the coil RL for the right speaker are connected in the same region RS. Figures 35(a) to (c) show examples of the arrangement of the output terminals of the audio amplifier IC418 in such a case, with the output terminal LT located in the left region LS and the output terminal RT located in the right region RS.

[0241] For example, as shown in Figure 35(a), the output terminal LT may be arranged linearly on the left side of the rectangular audio amplifier IC 418, and the output terminal RT may be arranged linearly on the right side. In other words, the direction in which the output terminals of the audio amplifier IC are arranged is perpendicular to the longitudinal direction of the coil L. Note that a layout in which at least a part of the audio amplifier IC 418 is included in the region formed by the virtual extension line between the two coils L, and the direction in which the output terminals of the audio amplifier IC 418 are arranged is perpendicular to the longitudinal direction of the coil L, may be considered as an example of the first positional relationship.

[0242] Furthermore, as shown in Figure 35(b), for example, output terminals LT may be arranged in an L-shape across the corners on the left and top sides of the rectangular audio amplifier IC 418, and output terminals RT may be arranged in an L-shape across the corners on the right and top sides. In other words, the arrangement of the output terminals of the audio amplifier IC will be a mixture of directions perpendicular to and parallel to the longitudinal direction of the coil L. Note that a layout in which at least a part of the audio amplifier IC 418 is included in the region formed by the virtual extension line between the two coils L, and the arrangement of the output terminals of the audio amplifier IC 418 is perpendicular to and parallel to the longitudinal direction of the coil L, may be considered as an example of the first positional relationship.

[0243] Alternatively, as shown in Figure 35(c), for example, the output terminal LT may be arranged linearly on the left side of the upper half of the rectangular audio amplifier IC 418, facing the left region LS, and the output terminal RT may be arranged linearly on the right side of the upper half, facing the right region RS. In other words, the direction in which the output terminals of the audio amplifier IC are arranged is parallel to the longitudinal direction of the coil L. Note that a layout in which at least a part of the audio amplifier IC 418 is included in the region formed by the virtual extension line between the two coils L, and the direction in which the output terminals of the audio amplifier IC 418 are arranged is parallel to the longitudinal direction of the coil L, may be considered as an example of the first positional relationship.

[0244] In all cases shown in Figures 35(a) to (c), the wiring crossing between the audio amplifier IC 418 and the coil L can be avoided, and the wiring distance can be shortened.

[0245] • Layout diagrams 35(d) to (f) of the audio circuit components schematically show the layout of the components constituting the audio circuit 450 when they are arranged linearly in the vertical direction. Note that 35(d) to (f) show examples where the LC filter LCF consists of two coils L and four capacitors C (more precisely, one coil L and two capacitors C for the left speaker, and one coil L and two capacitors C for the right speaker), and the Zobel filter ZOF consists of two capacitors C and two resistors R (more precisely, one capacitor C and one resistor for the left speaker, and one capacitor C and one resistor R for the right speaker).

[0246] For example, in the audio circuit 450D shown in Figure 35(d), the components are arranged in the following order from top to bottom: connector CN, Zobel filter ZOF, capacitor C of LC filter LCF, coil L of LC filter LCF, audio amplifier IC 418, and electrolytic capacitor EC. In the audio circuit 450 of this embodiment, as shown in the circuit diagram of Figure 28, the audio signal flows in the order of audio amplifier IC 418 → coil L of LC filter LCF → capacitor C of LC filter LCF → Zobel filter ZOF → connector CN. Therefore, with the component arrangement shown in Figure 35(d), it is possible to wire the audio amplifier IC 418 and connector CN over the shortest distance. In other words, the wiring pattern is optimized for each filter, resulting in good wiring efficiency and improved filter effectiveness. However, there is a disadvantage in that heat tends to accumulate because the audio amplifier IC 418 and coil L are in close proximity.

[0247] In Figure 35(d), the layout of the audio amplifier IC and coil L is such that at least a portion of the audio amplifier IC 418 is included in the region formed by the virtual extension of the distance between the two coils L (first positional relationship). This improves the wiring efficiency between the audio amplifier IC and coil L, and further stabilizes the output by making the bias in the wiring pattern distance between the left output and the right output as equal as possible. In addition, the layout of the audio amplifier IC and capacitor C is such that coil L is located between the audio amplifier IC and capacitor C (second positional relationship). This allows for sequential wiring in the filter circuit, enabling the shortest possible wiring pattern. In addition, the layout of the coil L and capacitor C is such that capacitor C is located between coil L and connector CN (third positional relationship). This allows for sequential wiring in the filter circuit, enabling the shortest possible wiring pattern.

[0248] Although not shown in Figure 35(d), a bootstrap capacitor may be provided between the coil L of the LC filter LCF and the audio amplifier IC 418.

[0249] For example, in the audio circuit 450E shown in Figure 35(e), the components are arranged from top to bottom in the following order: connector CN, Zobel filter ZOF, LC filter LCF coil L, LC filter LCF capacitor C, audio amplifier IC 418, and electrolytic capacitor EC. In the case of the component arrangement shown in Figure 35(e), the distance is longer than in the case of the component arrangement shown in Figure 35(d) because the coil L → capacitor C in the LC filter LCF is not in the same order as in the circuit. However, since the current flows in the order of audio amplifier IC 418 → LC filter LCF → Zobel filter ZOF → connector CN, this can be considered a preferable wiring arrangement.

[0250] According to the audio circuit 450E shown in Figure 35(e), the audio amplifier IC 418 and coil L, which tend to generate heat, are separated by a capacitor C, which has the advantage of preventing heat from accumulating. However, because the LC filter LCF is not arranged in the correct order, the wiring pattern becomes longer, which has the disadvantage of being susceptible to noise interference.

[0251] In Figure 35(e), the layout of the audio amplifier IC and coil L is such that at least a portion of the audio amplifier IC 418 is included in the region formed by the virtual extension of the distance between the two coils L (first positional relationship). This improves the wiring efficiency between the audio amplifier IC and coil L, and further stabilizes the output by making the bias in the wiring pattern distance between the left output and the right output as equal as possible. In addition, the layout of the audio amplifier IC and capacitor C is such that capacitor C is located between the audio amplifier IC and coil L (second positional relationship). This allows for a distance between the audio amplifier IC and coil L, suppressing heat buildup. In addition, the layout of the coil L and capacitor C is such that capacitor C is located between coil L and audio amplifier IC (third positional relationship). This allows for a distance between the audio amplifier IC and coil L, suppressing heat buildup. Furthermore, by placing the capacitor C of the Zobel filter between coil L and connector CN, sequential wiring can be achieved in the filter circuit, resulting in the shortest possible wiring pattern.

[0252] For example, in the audio circuit 450F shown in Figure 35(f), the components are arranged from top to bottom in the following order: connector CN, capacitor C of the LC filter LCF, coil L of the LC filter LCF, Zobel filter ZOF, audio amplifier IC 418, and electrolytic capacitor EC. The top and bottom positions of the LC filter LCF and Zobel filter ZOF may be reversed.

[0253] According to the audio circuit 450F shown in FIG. 35(f), the audio amplifier IC 418 and the coil L, which tend to generate heat, are separated by the capacitor C, so there is an advantage that heat does not concentrate. However, since the Zobel filter ZOF is not near the connector CN, there is also a disadvantage that the effect of countermeasures against the back electromotive force from the speaker is reduced.

[0254] In FIG. 35(f) as well, the audio amplifier IC and the coil L are arranged such that at least a part of the audio amplifier IC 418 is included in the region formed by the virtual extension line of the interval between the two coils L (the first positional relationship). Thereby, the wiring efficiency between the audio amplifier IC and the coil L can be improved, and further, the deviation of the distance of the wiring pattern can be equalized as much as possible between the left output and the right output to achieve output stabilization. Also, the audio amplifier IC and the capacitor C are arranged such that the capacitor C is positioned between the audio amplifier IC and the coil L (the second positional relationship). Thereby, the separation distance between the audio amplifier IC and the coil L can be provided, and heat concentration can be suppressed. Also, the coil L and the capacitor C are arranged such that the capacitor C is positioned between the coil L and the audio amplifier IC (the third positional relationship). Thereby, the separation distance between the audio amplifier IC and the coil L can be provided, and heat concentration can be suppressed.

[0255] In this embodiment, the audio amplifier IC is used as the IC in the audio circuit, but it is not limited to this, and a sound source IC may be used. Also, the configuration regarded as "substantially the same" in this embodiment may be a "same" configuration, and the configuration regarded as "same" may be a "substantially the same" configuration. Also, the positional relationship in this embodiment indicates the layout of components with respect to each other or the components in the target circuit configuration. Also, in this embodiment, the audio circuit includes "audio amplifier IC → LC filter composed of coil L and capacitor C → Zobel filter composed of resistor R and capacitor C (→ connector)", which is the wiring path of the audio signal.

[0256] <Summary of Embodiments> (1) As described above, the gaming machine according to the above embodiment (for example, a slot machine 100) comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits comprises a first component (for example, an audio amplifier IC 418, etc.), a second component (for example, a coil L, etc.), and a third component (for example, a capacitor C, etc.), and the positional relationship of the first component, the second component, and the third component is substantially the same in each of the plurality of audio circuits on the first circuit board (for example, Figure 26(a), etc.). This is the first basic configuration.

[0257] According to the first basic configuration, stable sound output can be achieved by making the performance of the audio output of multiple audio circuits approximately uniform.

[0258] In this first basic configuration, the first preferred configuration is such that, in each of the plurality of audio circuits on the first substrate, the first component and the second component are arranged in a first positional relationship, the first component and the third component are arranged in a second positional relationship, and the second component and the third component are arranged in a third positional relationship (for example, as shown in Figure 26(a)).

[0259] According to the first preferred configuration, by making the arrangement of the three components the same, the performance of the audio output of multiple audio circuits can be made substantially uniform, and audio can be output stably.

[0260] In this first preferred configuration, the first component is an audio amplifier element (e.g., audio amplifier IC418), the second component is a coil (e.g., coil L), the third component is a capacitor (e.g., capacitor C), and the plurality of audio circuits each include a filter circuit (e.g., an LC filter LCF) consisting of the coil and the capacitor, which is the second preferred configuration.

[0261] According to the second preferred configuration, stable audio output is possible by keeping the noise reduction substantially the same.

[0262] In this first basic configuration, first preferred configuration, or second preferred configuration, the first substrate further comprises control means (e.g., CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means are arranged (e.g., Figure 26(a)), which constitutes a third preferred configuration.

[0263] This third preferred configuration makes it possible to prevent the magnetic field from the audio circuit from affecting other components.

[0264] Furthermore, according to the above embodiment of the gaming machine (for example, a slot machine 100), the gaming machine comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits comprises a first component (for example, an audio amplifier IC 418, etc.), a second component (for example, a coil L, etc.), and a third component (for example, a capacitor C, etc.), and in each of the plurality of audio circuits on the first circuit board, the first component, the second component, and the third component are arranged within substantially the same predetermined range (for example, Figures 26(a), 34(c), etc.), which is a second basic configuration.

[0265] According to the second basic configuration, stable sound output can be achieved by making the performance of the audio output of multiple audio circuits approximately uniform.

[0266] In this second basic configuration, a fourth preferred configuration is one in which, in each of the plurality of audio circuits on the first substrate, the first component and the second component are arranged within a first range, the first component and the third component are arranged within a second range, and the second component and the third component are arranged within a third range (for example, Figures 26(a) and 34(c), etc.).

[0267] According to the fourth preferred configuration, by making the arrangement ranges of the three components the same, the performance of the audio output of multiple audio circuits can be made substantially uniform, and audio can be output stably.

[0268] In the fourth preferred configuration, the first component is an audio amplifier element (e.g., audio amplifier IC418), the second component is a coil (e.g., coil L), the third component is a capacitor (e.g., capacitor C), and each of the plurality of audio circuits includes a filter circuit (e.g., an LC filter LCF) consisting of the coil and the capacitor, which is the fifth preferred configuration.

[0269] According to this fifth preferred configuration, stable audio output is possible by keeping the noise reduction substantially the same.

[0270] In the second basic configuration, the fourth preferred configuration, or the fifth preferred configuration, the first substrate further comprises control means (e.g., CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means are arranged (e.g., Figure 26(a)), which constitutes the sixth preferred configuration.

[0271] This sixth preferred configuration makes it possible to prevent the magnetic field from the audio circuit from affecting other components.

[0272] (2) Furthermore, according to the above embodiment of the gaming machine (for example, a slot machine 100), the gaming machine comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits comprises a first component (for example, an audio amplifier IC 418, etc.), a plurality of second components (for example, two coils L, etc.), and a third component (for example, a capacitor C, etc.). The third basic configuration is as follows: In each of the plurality of audio circuits on the first substrate, the positional relationship between the first component, the plurality of second components, and the third component is substantially the same (for example, as shown in Figure 26(a)); and in each of the plurality of audio circuits on the first substrate, if one of the plurality of second components is designated as component A and the other as component B, then at least a part of the first component is included in the region between the virtual extension line of the edge of component A facing component B and the virtual extension line of the edge of component B facing component A (for example, as shown in Figure 26(a)).

[0273] According to the third basic configuration, stable sound output can be achieved by roughly equalizing the performance of the audio output of multiple audio circuits. Furthermore, the wiring pattern length between the first component and the multiple second components can be balanced with respect to the multiple second components, for example, enabling the equalization of the output balance between the left and right speakers.

[0274] In the third basic configuration, a seventh preferred configuration is one in which, in each of the plurality of audio circuits on the first substrate, the first component and the plurality of second components are arranged in a first positional relationship, the first component and the third component are arranged in a second positional relationship, and the plurality of second components and the third component are arranged in a third positional relationship (for example, as shown in Figure 26(a)).

[0275] According to the seventh preferred configuration, by making the arrangement of the three components the same, the performance of the audio output of multiple audio circuits can be made substantially uniform, and audio can be output stably.

[0276] In the seventh preferred configuration, the first component is an audio amplifier element (e.g., audio amplifier IC418), the second component is a coil (e.g., coil L), the third component is a capacitor (e.g., capacitor C), and the plurality of audio circuits each include a filter circuit (e.g., an LC filter LCF) consisting of the coil and the capacitor, which constitutes the eighth preferred configuration.

[0277] According to the eighth preferred configuration, stable audio output is possible by keeping the noise reduction substantially the same.

[0278] In the third basic configuration, the seventh preferred configuration, or the eighth preferred configuration, the first substrate further comprises control means (e.g., CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means are arranged (e.g., Figure 26(a)), which constitutes the ninth preferred configuration.

[0279] According to the ninth preferred configuration, it is possible to prevent the influence of the magnetic field from the audio circuit from affecting other components.

[0280] (3) Furthermore, according to the above embodiment of the gaming machine (for example, a slot machine 100), the gaming machine comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits is a first component (for example, an audio amplifier IC 41 The fourth basic configuration comprises a first circuit board (e.g., 8), a plurality of second components (e.g., two coils L), and a third component (e.g., a capacitor C), wherein in each of the plurality of audio circuits on the first circuit board, the positional relationship between the first component, the plurality of second components, and the third component is substantially the same (e.g., Figure 26(a)), and in each of the plurality of audio circuits on the first circuit board, the spacing between the plurality of second components is substantially the same, and no components are mounted in the area consisting of this spacing (e.g., Figure 26(a)).

[0281] According to the fourth basic configuration, stable audio output can be achieved by roughly equalizing the performance of the audio output of multiple audio circuits. In addition, by not placing components between multiple second components, the effects of heat generated by the second components can be prevented.

[0282] In the fourth basic configuration, the tenth preferred configuration is that in each of the plurality of audio circuits on the first substrate, the first component and the plurality of second components are arranged in a first positional relationship, the first component and the third component are arranged in a second positional relationship, and the plurality of second components and the third component are arranged in a third positional relationship (for example, as shown in Figure 26(a)).

[0283] According to this preferred configuration, by making the arrangement of the three components the same, the performance of the audio output of multiple audio circuits can be made nearly uniform, and audio can be output stably.

[0284] In the tenth preferred configuration, the eleventh preferred configuration is that the first component is an audio amplifier element (e.g., an audio amplifier IC 418), the second component is a coil (e.g., a coil L), the third component is a capacitor (e.g., a capacitor C), and each of the plurality of audio circuits includes a filter circuit (e.g., an LC filter LCF) consisting of the coil and the capacitor.

[0285] According to the 11th preferred configuration, stable audio output is possible by keeping the noise reduction substantially the same.

[0286] In the fourth basic configuration, the tenth preferred configuration, or the eleventh preferred configuration, the first substrate further comprises control means (e.g., CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means are arranged (e.g., Figure 26(a)), which is the twelfth preferred configuration.

[0287] According to the twelfth preferred configuration, it is possible to prevent the influence of the magnetic field from the audio circuit from affecting other components.

[0288] (4) Furthermore, according to the above embodiment of the gaming machine (for example, a slot machine 100), the gaming machine comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits comprises a first component (for example, an audio amplifier IC 418, etc.) and a second component (for example, a coil L, etc.) The fifth basic configuration comprises a first circuit board and a third component (for example, a capacitor C), wherein the positional relationship between the first component, the second component, and the third component is substantially the same in each of the plurality of audio circuits on the first circuit board (for example, Figure 26(a), etc.), the first circuit board is provided with a connector that can be electrically connected to at least one of the plurality of speakers (for example, a connector CN1 connected to the upper speaker 272), and the connector is disposed near at least one of the plurality of audio circuits (for example, Figure 26(a), etc.).

[0289] According to the fifth basic configuration, stable sound output can be achieved by roughly equalizing the performance of the audio output of multiple audio circuits. Furthermore, the correspondence between speakers and audio circuits can be easily recognized. For example, if a loud volume is suddenly emitted from a speaker during maintenance work, it becomes easier to identify the connector of the speaker whose output needs to be disabled, which contributes to reducing the time required for disabling.

[0290] In the fifth basic configuration, the thirteenth preferred configuration is one in which, in each of the plurality of audio circuits on the first substrate, the first component and the second component are arranged in a first positional relationship, the first component and the third component are arranged in a second positional relationship, and the second component and the third component are arranged in a third positional relationship (for example, as shown in Figure 26(a)).

[0291] According to the 13th preferred configuration, by making the arrangement of the three components the same, the performance of the audio output of multiple audio circuits can be made substantially uniform, and audio can be output stably.

[0292] A 14th preferred configuration is that the first component is an audio amplifier element (e.g., an audio amplifier IC 418), the second component is a coil (e.g., a coil L), the third component is a capacitor (e.g., a capacitor C), and each of the plurality of audio circuits includes a filter circuit (e.g., an LC filter LCF) using the coil and the capacitor.

[0293] According to the 14th preferred configuration, stable sound output is possible by making the noise reduction substantially the same. In the 5th basic configuration, the 13th preferred configuration, or the 14th preferred configuration, the first substrate further comprises control means (e.g., CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means is arranged (e.g., Figure 26(a)), which is the 15th preferred configuration.

[0294] According to the 15th preferred configuration, it is possible to prevent the influence of the magnetic field from the audio circuit from affecting other components.

[0295] (5) Furthermore, according to the above embodiment of the gaming machine (for example, a slot machine 100), the gaming machine comprises a plurality of speakers of different types (for example, speakers 272, 275, 277, etc.), a plurality of audio circuits (for example, audio circuits 450A, 450B, 450C, etc.) electrically connected to each of the plurality of speakers and capable of outputting audio signals, and a first circuit board (for example, a first sub-control board 401, etc.) on which the plurality of audio circuits are arranged, wherein each of the plurality of audio circuits comprises a first component (for example, an audio amplifier IC 418, etc.) and a second component (for example, a coil L, etc.) The sixth basic configuration comprises a first circuit board and a third component (for example, a capacitor C), wherein the positional relationship between the first component, the second component, and the third component is substantially the same in each of the plurality of audio circuits on the first circuit board (for example, Figure 26(a), etc.), at least one side of the first circuit board is covered with a cover (for example, a circuit board case 403, etc.) (for example, Figure 26(d), etc.), and the cover is provided with heat dissipation means (for example, ventilation holes 405, a fan, etc.) near the position where a certain audio circuit among the plurality of audio circuits is arranged (for example, Figure 26(d), etc.).

[0296] According to the sixth basic configuration, by making the performance of the audio output of multiple audio circuits nearly uniform, stable audio output can be achieved, and heat dissipation can be promoted, preventing malfunctions of components.

[0297] In the sixth basic configuration, the sixteenth preferred configuration is such that, in each of the plurality of audio circuits on the first substrate, the first component and the second component are arranged in a first positional relationship, the first component and the third component are arranged in a second positional relationship, and the second component and the third component are arranged in a third positional relationship (for example, as shown in Figure 26(a)).

[0298] According to the 16th preferred configuration, by making the arrangement of the three components the same, the performance of the audio output of multiple audio circuits can be made substantially uniform, and audio can be output stably.

[0299] In the 16th preferred configuration, the 17th preferred configuration is that the first component is an audio amplifier element (e.g., an audio amplifier IC 418), the second component is a coil (e.g., a coil L), the third component is a capacitor (e.g., a capacitor C), and each of the plurality of audio circuits includes a filter circuit (e.g., an LC filter LCF) consisting of the coil and the capacitor.

[0300] According to the 17th preferred configuration, stable audio output is possible by keeping the noise reduction substantially the same.

[0301] In the sixth basic configuration, the sixteenth preferred configuration, or the seventeenth preferred configuration, the first substrate further comprises control means (e.g., a CPU 404), and the plurality of audio circuits are arranged on the first substrate closer to the edge of the first substrate than the location where the control means are arranged (e.g., Figure 26(a)), which is the eighteenth preferred configuration.

[0302] According to the 18th preferred configuration, it is possible to prevent the influence of the magnetic field from the audio circuit from affecting other components.

[0303] ≪Other≫ In this embodiment, a slot machine 100 using medals (coins) as the game medium is shown as an example of a game machine, but it is not limited to this, and can be applied to slot machines using game balls (for example, pachinko balls), pachinko machines, arrangement ball game machines, jankyu game machines, smart ball, etc.

[0304] Furthermore, the slot machine may be a slot machine that operates on a mobile device (smartphone, game console) or personal computer using a program that simulates the operation based on the above configuration, and which only exchanges electronic data without using tokens. In this case, the game medium contains digitized data equivalent to tokens, the insertion of the game medium includes inputting digitized data from a predetermined external device (electronic storage device), and the payout of the game medium includes outputting digitized data to a predetermined external device (electronic storage device).

[0305] Although this embodiment has been described above, it is not limited to the embodiments described above. Various modifications and changes can be made to the embodiments of the present invention without departing from the spirit of the present invention, and such modifications and changes are also included in the technical scope of the present invention. Furthermore, the actions and effects described in the embodiments of the invention are merely a list of the most preferred actions and effects resulting from the present invention, and the actions and effects according to the present invention are not limited to those described in the embodiments of the present invention. [Explanation of symbols]

[0306] 100 slot machines 110-112 reels 113 Display window 130-132 Bet Button 135 Start lever 137-139 Stop button 157 Visual Display Device 272,277 speakers 420 Various Lamps 300 Main Control Unit 400 First Sub-control Unit 500 Second Sub-control Unit

Claims

1. A gaming machine having a predetermined circuit board, The aforementioned gaming machine has a first sound output means capable of outputting sound, The aforementioned gaming machine is configured to be connectable to a second sound output means capable of outputting sound, The aforementioned predetermined substrate includes a first circuit and a second circuit, and is a substrate that processes the output signal to the second sound output means. The second circuit is a circuit to which the audio signal processed by the first circuit is input via a predetermined capacitor. A gaming machine characterized by the following features.

2. A gaming machine according to claim 1, The bias voltage of the first circuit is configured to be equal to the bias voltage of the second circuit. The aforementioned predetermined capacitor is a non-polarized capacitor. A gaming machine characterized by the following features.

3. A gaming machine according to claim 1 or 2, The first circuit is a circuit that includes a predetermined differential amplifier circuit, The second circuit is a circuit that includes a predetermined current amplification circuit, The aforementioned predetermined capacitor is a film capacitor. A gaming machine characterized by the following features.

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