Apparatus for visual inspection and method for visual inspection

Abstract

The present invention provides a visual inspection device that can prevent defects from occurring in element chips formed by dicing. [Solution] In this visual inspection device 100, the control unit 41 determines that, in the captured image 50, among the defect candidates 213, those that do not reach the defect determination line L2 with respect to the outer peripheral line L1 as the starting point, and that reach the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2, are analytical chips (replacement timing determination chips 213c) to be used for analysis, and performs control to notify the detection result of the analytical chips.

Description

Technical Field

[0001] The present invention relates to an appearance inspection apparatus and an appearance inspection method.

Background Art

[0002] Conventionally, an appearance inspection apparatus has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a defect inspection apparatus (appearance inspection apparatus) that detects defects generated in element chips formed by dicing.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, although the defect inspection apparatus (appearance inspection apparatus) of Patent Document 1 can detect defects generated in element chips formed by dicing, it cannot prevent defects from occurring in the element chips formed by dicing. For this reason, an appearance inspection apparatus and an appearance inspection method capable of preventing defects from occurring in element chips formed by dicing are desired.

[0006] The present invention has been made to solve the above problems, and one object of the present invention is to provide an appearance inspection apparatus and an appearance inspection method capable of preventing defects from occurring in element chips formed by dicing.

Means for Solving the Problems

[0007] To achieve the above objective, the visual inspection apparatus in the first aspect of this invention includes an imaging unit that images a rectangular element chip including an element formation region on which an element is formed and a surrounding region provided around the element formation region, and a control unit that, in the image of the element chip captured by the imaging unit, determines that among the defect candidates, those that reach a defect determination line set outside the element formation region and inside the outer peripheral line, with the outer peripheral line set as the starting point, are defects in the surrounding region of the element chip. The control unit determines that, in the image of the defect candidate, those that do not reach the defect determination line with the outer peripheral line as the starting point, but reach a chipping determination line set between the outer peripheral line and the defect determination line, are analytical chips used for analysis, and controls the detection result of the analytical chips to be reported.

[0008] In the first aspect of this invention, the visual inspection apparatus, as described above, determines, in the captured image, that among the defect candidates, those that do not reach the defect judgment line, starting from the outer edge line, but reach the chipping judgment line set between the outer edge line and the defect judgment line, are analytical chips to be used for analysis, and controls the apparatus to notify the detection result of the analytical chips. Here, analytical chips are defect candidates that do not reach the defect judgment line, starting from the outer edge line, but reach the chipping judgment line set between the outer edge line and the defect judgment line. Therefore, although they are not defects, they are chips that are relatively close to defects. Accordingly, the user of the visual inspection apparatus can analyze the notified detection result of the analytical chips to consider countermeasures to prevent the occurrence of defects. As a result, it is possible to prevent defects from occurring in the element chips formed by dicing. Furthermore, chipping for analysis includes, for example, chipping for determining replacement timing used in analysis to determine the timing of replacing the cutting tool used to form the element chip, chipping for determining appearance trends used in analysis to determine the trends of the external characteristics (shape, area, etc.) of chipping, chipping for determining occurrence location trends used in analysis to determine the trends of occurrence locations in the surrounding area of ​​the element chip (the upper part, lower part, left part, right part, upper left corner part, upper right corner part, lower left corner part, and lower right corner part of the surrounding area of ​​the element chip), and chipping for determining material dependence used in analysis to determine the dependence of chipping on the material of the element chip, etc.

[0009] In the visual inspection apparatus in the first phase described above, preferably, the analytical chipping is a replacement timing determination chipping used for analysis to determine the replacement timing of the cutting tool used for cutting to form element chips, and the control unit controls the detection result of the replacement timing determination chipping so that the replacement timing of the cutting tool can be determined. With this configuration, the user of the visual inspection apparatus can determine the appropriate replacement timing of the cutting tool by analyzing the detected result of the reported replacement timing determination chipping. In other words, by analyzing the detected result of the reported replacement timing determination chipping, the user of the visual inspection apparatus can replace the cutting tool before it deteriorates to the point where defects occur in the element chip formed by dicing. Alternatively, by analyzing the detected result of the reported replacement timing determination chipping, the user of the visual inspection apparatus can replace the cutting tool after some replacement timing determination chipping has occurred in the element chip formed by dicing. As a result, it is possible to prevent cutting tools that are not yet significantly deteriorated from being replaced with new ones.

[0010] In a configuration in which the control unit performs control to notify the detection result of chipping for determining replacement timing, preferably, a display unit is further provided, and the control unit performs control to display the detection result of chipping for determining replacement timing on the display unit in a manner that allows for the identification of the detection trend of chipping for determining replacement timing according to the usage history of the cutting tool. With this configuration, the user of the visual inspection device can easily recognize the detection trend of chipping for determining replacement timing according to the usage history of the cutting tool by analyzing the detection result of chipping for determining replacement timing displayed on the display unit in a manner that allows for the identification of the detection trend of chipping for determining replacement timing according to the usage history of the cutting tool. As a result, the appropriate replacement timing of the cutting tool can be easily determined.

[0011] In a configuration in which the control unit controls the display unit to display the detection results of chips for determining replacement timing, in a manner that allows for the identification of the detection trend of chips for determining replacement timing according to the usage history of the cutting tool, preferably, the imaging unit images a plurality of units under inspection, including element chips, and the control unit controls the display unit to display the detection results of chips for determining replacement timing for each of the plurality of units under inspection, arranged in the order in which the cutting by the cutting tool for forming the element chips occurred. With this configuration, the control unit can easily control the display unit to display the detection results of chips for determining replacement timing, in a manner that allows for the identification of the detection trend of chips for determining replacement timing according to the usage history of the cutting tool.

[0012] In a configuration in which the control unit performs control to notify the detection result of chips for determining replacement timing, preferably further comprising a display unit, the control unit performs at least one of the following: control to display the number of chips for determining replacement timing per predetermined length along the outer perimeter line in different ways for each magnitude of the number of chips for determining replacement timing per predetermined length along the outer perimeter line, and control to display the number of chips for determining replacement timing per predetermined length along the outer perimeter line in a frequency distribution on the display unit. With this configuration, the user of the visual inspection device can easily visually recognize the details of the chip detection result for determining replacement timing by analyzing the number of chips for determining replacement timing per predetermined length along the outer perimeter line displayed on the display unit in different ways for each magnitude of the number of chips for determining replacement timing per predetermined length along the outer perimeter line, and in at least one of the frequency distributions.

[0013] In the visual inspection apparatus described in the first aspect above, preferably, an operating unit is further provided, and the control unit sets the position between the outer circumference line of the chipping determination line and the defect determination line based on the operation received by the operating unit. With this configuration, the user of the visual inspection apparatus can arbitrarily set the position between the outer circumference line of the chipping determination line and the defect determination line.

[0014] Furthermore, in order to achieve the above objective, the visual inspection method in the second aspect of this invention comprises the steps of: acquiring an image of an element chip in which a rectangular element chip including an element formation region on which an element is formed and a surrounding region provided around the element formation region is imaged; determining in the image that, among the defect candidates, a defect candidate that reaches a defect determination line set outside the element formation region and inside the outer peripheral line, using the outer peripheral line set on the outer periphery of the surrounding region as a starting point is a defect in the surrounding region of the element chip; determining in the image that, among the defect candidates, a defect candidate that does not reach the defect determination line, using the outer peripheral line as a starting point, but reaches a chipping determination line set between the outer peripheral line and the defect determination line is an analytical chip to be used for analysis; and notifying the detection result of the analytical chip.

[0015] In the second aspect of this invention, the visual inspection method includes the steps of: determining, in the captured image, that among the defect candidates, those that do not reach the defect determination line, but reach a chipping determination line set between the outer perimeter line and the defect determination line, using the outer perimeter line as a starting point, are analytical chips to be used for analysis; and notifying the detection result of the analytical chips. As a result, similar to the visual inspection apparatus in the first aspect, the user of the visual inspection method can analyze the notified detection result of the analytical chips to consider countermeasures to prevent the occurrence of defects. As a result, similar to the visual inspection apparatus in the first aspect, it is possible to prevent the occurrence of defects in the element chips formed by dicing. [Effects of the Invention]

[0016] According to the present invention, it is possible to provide an appearance inspection apparatus and an appearance inspection method that can prevent defects from occurring in element chips formed by dicing, as described above. [Brief explanation of the drawing]

[0017] [Figure 1] It is a schematic diagram showing the overall configuration of an appearance inspection apparatus according to an embodiment of the present invention. [Figure 2] It is a plan view showing an inspection unit according to an embodiment of the present invention. [Figure 3] It is a plan view showing an element chip according to an embodiment of the present invention. [Figure 4] It is a diagram showing an imaging image according to an embodiment of the present invention. [Figure 5] It is an enlarged view of part V in FIG. 4. [Figure 6] It is a diagram showing a state in which the detection result of chipping for determining replacement timing according to an embodiment of the present invention is displayed on a display unit as a heat map and a histogram. [Figure 7] It is a diagram showing a state in which the detection result of chipping for determining replacement timing according to an embodiment of the present invention is displayed on a display unit as a thumbnail of a heat map. [Figure 8] It is a diagram showing a state in which the detection result of chipping for determining replacement timing according to an embodiment of the present invention is displayed on a display unit as a thumbnail of a histogram. [Figure 9] It is a flowchart showing an appearance inspection method according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0019] [Appearance Inspection Apparatus] Referring to FIGS. 1 to 8, the configuration of an appearance inspection apparatus 100 according to an embodiment of the present invention will be described.

[0020] (Overall Configuration of Appearance Inspection Apparatus) As shown in Figure 1, the visual inspection device 100 is included in the unit under inspection 200 and is a device for inspecting the appearance of element chips 211 (see Figure 2) formed by dicing (cutting) with a cutting tool. As shown in Figure 2, the unit under inspection 200 includes a plurality of element chips 211 arranged in a matrix. The plurality of element chips 211 in the unit under inspection 200 are formed by dicing the substrate along the dicing line DL. Each of the plurality of element chips 211 has a substantially rectangular shape. As shown in Figure 3, each of the plurality of element chips 211 includes an element formation region 211a on which the element (semiconductor element) is formed, and a peripheral region 211b provided around the element formation region 211a. In the unit under inspection 200, dicing areas 212 are formed between the plurality of element chips 211 along the dicing line DL.

[0021] In the following description, the horizontal and vertical directions in which the multiple element chips 211 are arranged in the unit under inspection 200 (see Figure 2) will be referred to as the X direction and the Y direction, respectively. Furthermore, with the unit under inspection 200 placed on the mounting section 10 (see Figure 1), which will be described later, the direction perpendicular to the X and Y directions (up and down direction) will be referred to as the Z direction. Additionally, one side (up) and the other side (down) of the Z direction will be referred to as the Z1 side and the Z2 side, respectively.

[0022] As shown in Figure 1, the visual inspection device 100 comprises a mounting unit 10, an imaging unit 20, a moving mechanism 30, a control unit 41, a storage unit 42, an operation unit 43, and a display unit 44.

[0023] The mounting section 10 is configured to allow the inspection unit 200 to be mounted on the Z1 side.

[0024] The imaging unit 20 is configured to image the element chip 211 (see Figure 2). Specifically, the imaging unit 20 is positioned on the Z1 side of the mounting unit 10 so as to image the element chip 211 included in the unit under inspection 200 mounted on the mounting unit 10 from the Z1 side. The imaging unit 20 includes a 2D camera for imaging the element chip 211. Image data of the element chip 211 captured by the camera is output to the control unit 41. The visual inspection device 100 inspects multiple units under inspection 200, including the element chip 211 after dicing. That is, the imaging unit 20 images multiple units under inspection 200, including the element chip 211.

[0025] The moving mechanism 30 is configured to move the mounting unit 10 relative to the imaging unit 20 in the XY plane. Specifically, the moving mechanism 30 includes an X-direction moving mechanism 31 that moves the mounting unit 10 along the X direction, and a Y-direction moving mechanism 32 that moves the mounting unit 10 along the Y direction. The X-direction moving mechanism 31 and the Y-direction moving mechanism 32 are, for example, linear motion mechanisms combining a servo motor or pulse motor with a ball screw, or linear motion mechanisms using a linear motor. The moving mechanism 30 is located on the Z2 side of the mounting unit 10.

[0026] The control unit 41 is configured to control each part of the visual inspection device 100. Specifically, the control unit 41 controls the imaging unit 20 to image the element chip 211 (see Figure 2). The control unit 41 controls the movement mechanism 30 to move the mounting unit 10 relative to the imaging unit 20. The control unit 41 alternately controls the imaging unit 20 to image each of the multiple element chips 211 arranged in a matrix in the unit under inspection 200, and controls the movement mechanism 30 to move the mounting unit 10 relative to the imaging unit 20. Based on the image data of the multiple element chips 211 input from the imaging unit 20, the control unit 41 generates multiple imaged images 50 (see Figure 4) of the element chip 211. The control unit 41 controls the display unit 44 to display the images. The control unit 41 performs control based on the operation received by the operation unit 43. The control unit 41 includes an arithmetic unit such as a CPU (Central Processing Unit), and storage devices such as ROM (Read Only Memory) and RAM (Random Access Memory).

[0027] As shown in Figure 5, the control unit 41 (see Figure 1) determines the defect candidate 213 in the captured image 50 of the element chip 211 captured by the imaging unit 20. Specifically, the control unit 41 determines that an area in the surrounding region 211b where the pixel value is smaller than a predetermined value (for example, a value close to the pixel value in the dicing area 212) is a defect candidate 213.

[0028] The control unit 41 (see Figure 1) determines in the captured image 50 that any defect candidate 213 that reaches a defect determination line L2, which is set to be outside the element formation region 211a and inside the outer peripheral line L1, using the outer peripheral line L1 set on the outer perimeter of the surrounding region 211b as a starting point, is a defect 213a in the surrounding region 211b of the element chip 211. In other words, in the captured image 50, the control unit 41 determines any defect candidate 213 that is continuous from the outer peripheral line L1 to the defect determination line L2 is a defect 213a. In addition, in the captured image 50, the control unit 41 determines any defect candidate 213 that is partially on the element formation region 211a side of the defect determination line L2 but is not continuous from the outer peripheral line L1 is a non-defect 213b.

[0029] The control unit 41 determines, in the captured image 50, that among the defect candidates 213, those that start from the outer peripheral line L1, do not reach the defect determination line L2, and reach the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2 are not defects 213a, but rather replacement timing determination chipping 213c used to determine the timing for replacing the cutting tool used to cut for forming the element chip 211. In other words, in the captured image 50, the control unit 41 determines that among the defect candidates 213, those that are not continuous from the outer peripheral line L1 to the defect determination line L2, but are continuous from the outer peripheral line L1 to the chipping determination line L3, are replacement timing determination chipping 213c. Note that replacement timing determination chipping 213c is an example of "analysis chipping" in the claims.

[0030] As shown in Figure 1, the memory unit 42 stores a program used for control by the control unit 41. The memory unit 42 is configured to store the captured image 50 (see Figure 4), information about the defect candidate 213 (see Figure 5), information about the defect 213a (see Figure 5), information about the replacement timing determination chipping 213c (see Figure 5), etc. The memory unit 42 stores information used by the control unit 41 to determine the defect candidate 213, the defect 213a, and the replacement timing determination chipping 213c. The information used by the control unit 41 to determine the defect candidate 213, the defect 213a, and the replacement timing determination chipping 213c includes the position of the outer peripheral line L1 (see Figure 5), the position of the defect determination line L2 (see Figure 5) between the element formation region 211a (see Figure 5) and the outer peripheral line L1, the position of the chipping determination line L3 (see Figure 5) between the outer peripheral line L1 and the defect determination line L2, etc.

[0031] The operation unit 43 is configured to accept operations from the operator. The operation unit 43 is, for example, a keyboard, mouse, touch panel, etc. The operation unit 43 accepts operations related to the position of the chipping determination line L3 (see Figure 5). Based on the operations related to the position of the chipping determination line L3 received by the operation unit 43, the control unit 41 sets the position of the chipping determination line L3 between the outer circumference line L1 (see Figure 5) and the defect determination line L2 (see Figure 5).

[0032] The display unit 44 is configured to display images such as the captured image 50 of the element chip 211 (see Figure 4), an image showing the detection result of the defect 213a (see Figure 5), and an image showing the detection result of the chipping 213c (see Figure 5) for determining the replacement timing. The display unit 44 is, for example, a liquid crystal display, a touch panel, etc.

[0033] (Notification of the detection result of chipping for determining replacement timing) As shown in Figure 6, the control unit 41 (see Figure 1) controls the display unit 44 to display the detection result of the replacement timing determination chipping 213c (see Figure 5) so that the timing for replacing the cutting tool can be determined. In other words, the control unit 41 controls the system to notify the detection result of the replacement timing determination chipping 213c so that the timing for replacing the cutting tool can be determined.

[0034] The control unit 41 (see Figure 1) controls the display unit 44 to display the number of replacement timing determination chippings 213c (see Figure 5) per predetermined length along the outer peripheral line L1 (see Figure 5) in different ways depending on the size of the number of replacement timing determination chippings 213c per predetermined length along the outer peripheral line L1. Specifically, the control unit 41 calculates the number of replacement timing determination chippings 213c per predetermined length (for example, 1 cm) along the outer peripheral line L1 for each dicing line DL. Then, the control unit 41 controls the display unit 44 to display the number of replacement timing determination chippings 213c per predetermined length along the outer peripheral line L1 for each dicing line DL in different colors depending on the size of the number of replacement timing determination chippings 213c per predetermined length along the outer peripheral line L1. In other words, the control unit 41 controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 as a heat map 61 for each dicing line DL. In Figure 6, the difference in color in the heat map 61 is shown by the difference in hatching. In Figure 6, the control unit 41 shows an example in which the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 is displayed as a heat map 61 for each dicing line DL along the vertical direction. However, the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 may also be displayed as a heat map 61 for each dicing line DL along the horizontal direction.

[0035] The control unit 41 (see Figure 1) controls the display unit 44 to display the number of replacement timing determination chippings 213c (see Figure 5) per predetermined length along the outer perimeter line L1 (see Figure 5) as a frequency distribution. Specifically, the control unit 41 controls the display unit 44 to display a histogram 62 with the number of replacement timing determination chippings 213c per predetermined length along the outer perimeter line L1 and the number of dicing lines DL as classes and frequencies, respectively, calculated for each dicing line DL. The control unit 41 also controls the display unit 44 to display the histogram 62 alongside a heat map 61. In Figure 6, an example is shown in which the histogram 62 displays colors corresponding to the number of replacement timing determination chipping 213c per predetermined length along the outer circumference line L1 in the heatmap 61. However, it is not necessary to display colors corresponding to the number of replacement timing determination chipping 213c per predetermined length along the outer circumference line L1 in the histogram 62.

[0036] As shown in Figures 7 and 8, the control unit 41 controls the display unit 44 to display the detection results of the replacement timing determination chipping 213c (see Figure 5) for each of the multiple units under inspection 200, arranged in the order in which the units under inspection 200 were cut by the cutting tool for forming the element chip 211. In other words, the control unit 41 (see Figure 1) controls the display unit 44 to display the detection results of the replacement timing determination chipping 213c in a way that allows identification of the detection trend of the replacement timing determination chipping 213c according to the usage history of the cutting tool. Specifically, as shown in Figure 7, the control unit 41 controls the display unit 44 to display multiple heat maps 61 corresponding to each of the multiple units under inspection 200 as thumbnails 71, arranged in the order in which the multiple units under inspection 200 were cut by the cutting tool. Furthermore, as shown in Figure 8, the control unit 41 controls the display unit 44 to display multiple histograms 62 corresponding to each of the multiple units 200 under inspection as thumbnails 72, arranged in the order of the multiple units 200 under inspection that were cut by the cutting tool. By checking at least one of the thumbnails 71 and 72, the user of the visual inspection device 100 can easily recognize the detection trend of the chipping 213c for determining the replacement timing according to the usage history of the cutting tool. The number of heatmaps 61 and histograms 62 displayed in the display unit 44 may be configured to be arbitrarily set based on the operator's operation of the operation unit 43.

[0037] The control unit 41 (see Figure 1) may also control the display unit 44 to classify the chipping 213c (see Figure 5) for determining the replacement timing of each of the multiple units 200 under inspection according to predetermined feature quantities (length, width, area, brightness, shape, clarity, depth, penetration length, color unevenness, etc.) and display them.

[0038] [Visual Inspection Method] Referring to Figure 9, a visual inspection method according to one embodiment of the present invention will be described.

[0039] As shown in Figure 9, first, in step S1, the control unit 41 acquires an image 50 of the element chip 211, which is a rectangular element chip 211 including an element formation region 211a on which the element is formed and a surrounding region 211b provided around the element formation region 211a.

[0040] Next, in step S2, the control unit 41 sets an outer peripheral line L1 on the outer periphery of the surrounding region 211b in the captured image 50.

[0041] Next, in step S3, the control unit 41 sets a defect determination line L2 in the captured image 50, outside the element formation region 211a and inside the outer peripheral line L1.

[0042] Next, in step S4, the control unit 41 sets a chipping determination line L3 between the outer peripheral line L1 and the defect determination line L2 in the captured image 50.

[0043] Next, in step S5, the control unit 41 determines the defect candidate 213 in the captured image 50 of the element chip 211 captured by the imaging unit 20.

[0044] Next, in step S6, the control unit 41 determines that, in the captured image 50, any defect candidate 213 that reaches a defect determination line L2, which is set to be outside the element formation region 211a and inside the outer peripheral line L1, using the outer peripheral line L1 set on the outer periphery of the surrounding region 211b as a starting point, is a defect 213a in the surrounding region 211b of the element chip 211.

[0045] Next, in step S7, the control unit 41 determines that, in the captured image 50, among the defect candidates 213, those that do not reach the defect determination line L2 with respect to the outer peripheral line L1 as the starting point, and that reach the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2, are replacement timing determination chipping 213c used to determine the replacement timing of the cutting tool that cuts the element chip 211.

[0046] Next, in step S8, the control unit 41 controls the display unit 44 to display the detection result of the replacement timing determination chipping 213c so that the timing for replacing the cutting tool can be determined. In other words, the control unit 41 controls the display unit 44 to notify the detection result of the replacement timing determination chipping 213c so that the timing for replacing the cutting tool can be determined. Then the visual inspection method flow ends.

[0047] In the above flow, step S2 (setting the outer perimeter line L1) may be performed after step S3 (setting the defect judgment line L2) and before step S4 (setting the chipping judgment line L3). Also, step S5 (determining the defect candidate 213) may be performed after step S2 (setting the outer perimeter line L1) and before step S3 (setting the defect judgment line L2), or after step S3 (setting the defect judgment line L2) and before step S4 (setting the chipping judgment line L3). Furthermore, step S6 (determining the defect) may be performed after step S7 (determining the chipping 213c for replacement timing determination) and before step S8 (displaying the detection result of the chipping 213c for replacement timing determination), or after step S8.

[0048] [Effects of this embodiment] In this embodiment, the following effects can be obtained.

[0049] (Effectiveness of the visual inspection device) In this embodiment, as described above, the control unit 41 determines that, in the captured image 50, among the defect candidates 213, those that start from the outer peripheral line L1, do not reach the defect determination line L2, and reach the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2 are analytical chipping (replacement timing determination chipping 213c) to be used for analysis. The control unit 41 also performs control to notify the detection result of the analytical chipping. Here, since the analytical chipping is among the defect candidates 213 that starts from the outer peripheral line L1, does not reach the defect determination line L2, and reaches the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2, it is not defect 213a, but it is chipping in a state relatively close to defect 213a. Therefore, the user of the visual inspection device 100 can consider countermeasures to prevent the occurrence of defect 213a by analyzing the notified detection result of the analytical chipping. As a result, it is possible to prevent the occurrence of defects 213a in the element chip 211 formed by dicing.

[0050] Furthermore, in this embodiment, as described above, the analysis chipping is a replacement timing determination chipping 213c used for analysis to determine the replacement timing of the cutting tool used for cutting to form the element chip 211. The control unit 41 then controls the system to notify the detection result of the replacement timing determination chipping 213c so that the replacement timing of the cutting tool can be determined. As a result, the user of the visual inspection device 100 can determine the appropriate replacement timing of the cutting tool by analyzing the notified detection result of the replacement timing determination chipping 213c. In other words, by analyzing the notified detection result of the replacement timing determination chipping 213c, the user of the visual inspection device 100 can replace the cutting tool before it deteriorates to the point where defects occur in the element chip 211 formed by dicing. Alternatively, by analyzing the notified detection result of the replacement timing determination chipping 213c, the user of the visual inspection device 100 can replace the cutting tool after some replacement timing determination chipping 213c has occurred in the element chip 211 formed by dicing. As a result, it is possible to prevent cutting tools that are not yet significantly deteriorated from being replaced with new ones.

[0051] Furthermore, in this embodiment, as described above, the visual inspection device 100 includes a display unit 44. The control unit 41 controls the display unit 44 to display the detection results of the replacement timing determination chipping 213c in a way that allows the user to identify the detection trend of the replacement timing determination chipping 213c according to the usage history of the cutting tool. As a result, the user of the visual inspection device 100 can easily recognize the detection trend of the replacement timing determination chipping 213c according to the usage history of the cutting tool by analyzing the detection results of the replacement timing determination chipping 213c displayed on the display unit 44 in a way that allows the user to identify the detection trend of the replacement timing determination chipping 213c according to the usage history of the cutting tool. As a result, the appropriate replacement timing for the cutting tool can be easily determined.

[0052] Furthermore, in this embodiment, as described above, the imaging unit 20 images a plurality of units 200 under inspection, including the element chip 211. The control unit 41 then controls the display unit 44 to display the detection results of the replacement timing determination chipping 213c for each of the plurality of units 200 under inspection, arranged in the order in which the cutting was performed by the cutting tool for forming the element chip 211. This allows the control unit 41 to easily control the display unit 44 to display the detection results of the replacement timing determination chipping 213c in a way that identifies the detection trend of the replacement timing determination chipping 213c according to the usage history of the cutting tool.

[0053] Furthermore, in this embodiment, as described above, the visual inspection device 100 includes a display unit 44. The control unit 41 controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer perimeter line L1 in different ways for each magnitude of the number of replacement timing determination chipping 213c per predetermined length along the outer perimeter line L1, and also controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer perimeter line L1 as a frequency distribution. As a result, the user of the visual inspection device 100 can easily visually recognize the details of the detection results of the replacement timing determination chipping 213c by analyzing the number of replacement timing determination chipping 213c per predetermined length along the outer perimeter line L1 displayed on the display unit 44 in different ways for each magnitude of the number of replacement timing determination chipping 213c per predetermined length along the outer perimeter line L1, and at least one of the frequency distributions.

[0054] Furthermore, in this embodiment, as described above, the visual inspection device 100 includes an operation unit 43. The control unit 41 sets the position of the chipping determination line L3 between the outer perimeter line L1 and the defect determination line L2 based on the operation regarding the position of the chipping determination line L3 received by the operation unit 43. This allows the user of the visual inspection device 100 to arbitrarily set the position of the chipping determination line L3 between the outer perimeter line L1 and the defect determination line L2.

[0055] (Effectiveness of visual inspection methods) In this embodiment, as described above, the visual inspection method includes step S4, in the captured image 50, a defect candidate 213 that, starting from the outer peripheral line L1, does not reach the defect determination line L2, but reaches the chipping determination line L3 set between the outer peripheral line L1 and the defect determination line L2, is determined to be an analytical chip (a chip for determining replacement timing 213c) to be used for analysis. The visual inspection method also includes step S5, which notifies the detection result of the analytical chip. As a result, similar to the visual inspection device 100, the user of the visual inspection method can analyze the notified detection result of the analytical chip to consider countermeasures to prevent the occurrence of defects 213a. As a result, similar to the visual inspection device 100, it is possible to prevent the occurrence of defects 213a in the element chip 211 formed by dicing.

[0056] [Differentiation] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims.

[0057] For example, in the above embodiment, the control unit 41 is shown to control the display unit 44 to display the detection result of the replacement timing determination chipping 213c so that the timing for replacing the cutting tool can be determined, but the present invention is not limited to this. In the present invention, the control unit may also control the speaker to generate an audio message indicating that the number of replacement timing determination chipping

[0058] Furthermore, in the above embodiment, the control unit 41 controls the display unit 44 to display the detection results of the chipping 213c for determining the replacement timing in each of the multiple units under inspection 200, arranged in the order in which the cutting was performed by the cutting tool for forming the element chip 211. However, the present invention is not limited to this. In the present invention, the control unit does not need to control the display unit to display the detection results of the chipping for determining the replacement timing in each of the multiple units under inspection, arranged in the order in which the cutting was performed by the cutting tool for forming the element chip.

[0059] Furthermore, in the above embodiment, an example was shown in which the control unit 41 controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 in different ways for each magnitude of the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1, and controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 in a frequency distribution, but the present invention is not limited thereto. In the present invention, the control unit may perform only one of the following: control the display unit to display the number of replacement timing determination chipping per predetermined length along the outer peripheral line in different ways for each magnitude of the number of replacement timing determination chipping per predetermined length along the outer peripheral line L1, and control the display unit to display the number of replacement timing determination chipping per predetermined length along the outer peripheral line in a frequency distribution.

[0060] Furthermore, in the above embodiment, an example was shown in which the control unit 41 controls the display unit 44 to display the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1 in different colors for each dicing line DL, according to the size of the number of replacement timing determination chipping 213c per predetermined length along the outer peripheral line L1. However, the present invention is not limited to this. In the present invention, the control unit may control the display unit to display the number of replacement timing determination chipping per predetermined length along the outer peripheral line in different hatching, patterns, etc., for each dicing line, according to the size of the number of replacement timing determination chipping per predetermined length along the outer peripheral line. Furthermore, the control unit may control the display unit to show the number of replacement timing determination chips per predetermined length along the outer circumference line in different colors, hatching, patterns, etc., for each of the multiple surrounding areas located on one side of the dicing area along the dicing line and the multiple surrounding areas located on the other side of the dicing area along the dicing line, according to the size of the number of replacement timing determination chips per predetermined length along the outer circumference line.

[0061] Furthermore, in the above embodiment, an example was shown in which the control unit 41 controls the display unit 44 to display a histogram 62 in which the number of replacement timing determination chippings 213c per predetermined length along the outer peripheral line L1 and the number of dicing lines DL, calculated for each dicing line DL, are represented as classes and frequencies, respectively. However, the present invention is not limited to this. In the present invention, the control unit may control the display unit to display a bar graph, line graph, etc., in which the number of replacement timing determination chippings per predetermined length along the outer peripheral line and the number of dicing lines, calculated for each dicing line, are represented as classes and frequencies, respectively. Alternatively, the control unit may control the display unit to display a histogram, bar graph, line graph, etc., in which the number of replacement timing determination chippings per predetermined length along the outer peripheral line and the number of dicing lines, calculated for at least one of the multiple surrounding areas located on one side of the dicing area along the dicing line and the multiple surrounding areas located on the other side of the dicing area along the dicing line, are represented as classes and frequencies, respectively.

[0062] Furthermore, in the above embodiment, an example was shown in which the control unit 41 sets the position of the chipping determination line L3 between the outer perimeter line L1 and the defect determination line L2 based on an operation regarding the position of the chipping determination line L3 received by the operation unit 43, but the present invention is not limited to this. In the present invention, the control unit does not have to be configured to set the position of the chipping determination line between the outer perimeter line and the defect determination line based on an operation regarding the position of the chipping determination line received by the operation unit.

[0063] Furthermore, in the above embodiment, the analytical chipping is a replacement timing determination chipping 213c used in analysis to determine the timing for replacing the cutting tool used to form the element chip 211, and the control unit 41 performs control to notify the detection result of the replacement timing determination chipping 213c so that the timing for replacing the cutting tool can be determined. However, the present invention is not limited to this. In the present invention, the analytical chipping is an appearance trend determination chipping used in analysis to determine the trend of the appearance characteristics (shape, area, etc.) of the chipping, and the control unit performs control to notify the detection result of the appearance trend determination chipping so that the trend of the appearance characteristics of the chipping can be determined. Furthermore, the analysis chipping is a chipping used for determining the tendency of occurrence locations in the surrounding area of ​​the chip (the upper part, lower part, left part, right part, upper left corner, upper right corner, lower left corner, and lower right corner of the surrounding area of ​​the element chip), and the control unit may perform control to notify the detection result of the chipping tendency determination chip so that the tendency of occurrence locations in the surrounding area of ​​the chip can be determined. Furthermore, the analysis chipping is a chipping used for determining material dependence, which is used for determining the dependence of chipping on the material of the element chip, and the control unit may perform control to notify the detection result of the chipping dependence on the material of the element chip so that the dependence of chipping on the material of the element chip can be determined. [Explanation of Symbols]

[0064] 20 Imaging Department 41 Control Unit 43 Operation section 44 Display section 50 captured images 100 Visual Inspection Device 200 units under inspection 211 element chip 211a Element formation region 211b Surrounding area 213 Defective candidate 213a Defect 213c Replacement timing determination chipping (analysis chipping) L1 Outer Line L2 Defect Detection Line L3 Chipping detection line

Claims

1. An imaging unit that images a rectangular element chip including an element formation region on which the element is formed and a surrounding region provided around the element formation region, The system includes a control unit that, in the image of the element chip captured by the imaging unit, determines that any defect candidate that reaches a defect determination line set to be outside the element formation region and inside the outer peripheral line, using the outer peripheral line set on the outer periphery of the surrounding region as a starting point, is a defect in the surrounding region of the element chip. The control unit, In the captured image, among the defect candidates, those that do not reach the defect determination line, using the outer perimeter line as a starting point, but reach a chipping determination line set between the outer perimeter line and the defect determination line, are determined to be analytical chipping to be used for analysis, An appearance inspection device that performs control to notify the detection results of the aforementioned chipping for analysis.

2. The aforementioned chipping for analysis is a chipping for determining replacement timing used in analysis to determine the replacement timing of the cutting tool used for cutting to form the element chip, The visual inspection apparatus according to claim 1, wherein the control unit performs control to notify the detection result of the chipping for determining the replacement timing so that the timing for replacing the cutting tool can be determined.

3. It also includes a display unit, The visual inspection apparatus according to claim 2, wherein the control unit controls the display unit to display the detection result of the chipping for determining the replacement timing, so as to be able to identify the detection trend of the chipping for determining the replacement timing according to the usage history of the cutting tool.

4. The imaging unit images a plurality of units under inspection, including the element chip, The visual inspection apparatus according to claim 3, wherein the control unit controls the detection result of the replacement timing determination chipping in each of the plurality of units to be inspected, and displays the results on the display unit, with the plurality of units to be inspected arranged in the order in which the cutting by the cutting tool for forming the element chip was performed.

5. It also includes a display unit, The visual inspection apparatus according to claim 2, wherein the control unit performs at least one of the following: controlling the display unit to display the number of replacement timing determination chips per predetermined length along the outer perimeter line in a different manner for each magnitude of the number of replacement timing determination chips per predetermined length along the outer perimeter line; and controlling the display unit to display the number of replacement timing determination chips per predetermined length along the outer perimeter line in a frequency distribution.

6. It also has an operating section, The visual inspection apparatus according to claim 1, wherein the control unit sets the position of the chipping determination line between the outer peripheral line and the defect determination line based on an operation received by the operation unit.

7. The steps include acquiring an image of the element chip, which is a rectangular element chip including an element formation region on which the element is formed and a surrounding region provided around the element formation region, In the captured image, the steps include determining that among the defect candidates, those that reach a defect determination line set outside the element formation region and inside the outer peripheral line, using the outer peripheral line set on the outer periphery of the surrounding region as a starting point, are defects in the surrounding region of the element chip; In the captured image, the step of determining that among the defect candidates, those that do not reach the defect determination line, using the outer perimeter line as a starting point, and that reach a chipping determination line set between the outer perimeter line and the defect determination line, are analytical chips to be used for analysis. A visual inspection method comprising the step of notifying the detection result of the aforementioned chipping for analysis.

Images