Catalytic metal foil and its applications

Abstract

The present invention provides improved methods, systems, and devices for easily, efficiently, and inexpensively patterning catalysts onto substrates to form electrical circuits, as well as methods for manufacturing such circuits from them. [Solution] The intended metal foil is preferably roughened to an Ra of at least 0.1 μm and has a bottom surface supporting the catalytic material. The metal foil is etchable and is typically aluminum or a derivative thereof, with a thickness of less than 500 μm. Methods and systems for forming circuits from catalytic metal foil are also disclosed. The catalytic material supporting the surface of the metal foil is applied to a substrate and, in some embodiments, laminated between them with a thermosetting resin or thermoplastic resin, or with an organic material that first coats the catalytic material. The metal foil is removed to expose the catalytic material, and a conductor is plated onto the catalytic material.

Description

Technical Field

[0001] The field of the present invention relates to methods and systems for manufacturing conductive patterns.

Background Art

[0002] The following description contains information that is useful for understanding the present invention. It is not admitted that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any of the publications specifically or implicitly referenced are prior art.

[0003] Due to the competition in the manufacturing of electrical circuits continuing to drive down profit margins, there is a need to improve the simplicity, efficiency, and cost - effectiveness of manufacturing protocols in order to maintain competitiveness in the market. For example, Patent Document 1 by Brummett et al. teaches using a Mylar film immersed in an electroless plating catalyst solution to thermally transfer a catalyst onto a substrate for electroless deposition. However, transporting a pre - immersed Mylar film causes problems such as the Mylar material decomposing over time, further causing problems with storage stability, transportation, and durability. Also, Mylar has a low melting and decomposition temperature and does not retain its original shape at temperatures above 150°C. This limits the use of this material and technology for thermoplastic materials with normal curing temperatures above 150°C. Furthermore, requiring the user to immerse Mylar in the catalyst solution is unnecessarily complex and limits the market user base for the product.

[0004] All publications identified in this specification are incorporated by reference as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference. If the definition or use of a term in an incorporated reference conflicts or contradicts the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.

[0005] Addressing durability in part, Patent Document 2 by Ogawa et al. teaches applying the nucleus of an electroless plating catalyst to a metal foil to improve the durability of a product. However, Patent Document 2 does not teach, for example, the use of a metal foil as a sacrificial transfer medium to transfer the catalyst to a substrate for plating. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] U.S. Patent No. 4006047 [Patent Document 2] U.S. Patent No. 7740936 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Therefore, there is still a need for improved methods, systems, and devices for easily, efficiently, and inexpensively patterning catalysts onto substrates to form electrical circuits, as well as for methods for manufacturing such circuits from them. [Means for solving the problem]

[0008] The subject matter of the present invention provides systems, methods, and devices related to catalytic metal foils, as well as their use and devices derived therefrom. The metal foil has a bottom surface on which a catalytic material is disposed, at least a portion of which is typically roughened by etching or dendrite growth, or in some embodiments by oxidation or a combination thereof. The metal foil is etchable or otherwise removable and is preferably composed of one of aluminum, anodized aluminum, copper, tin, or alloys thereof. The metal foil is preferably less than 500 μm thick, for example, less than 400 μm, 300 μm, 200 μm, 100 μm, 80 μm, 60 μm, 50 μm, or less than 10 μm. In some embodiments, portions of the bottom surface (e.g., portions roughened by dendrite growth, portions roughened by etching, etc.) have an arithmetic mean roughness (Ra) of at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm.

[0009] In some embodiments, the catalytic material comprises a catalytic precursor for at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. Alternatively, or in combination, the catalytic material comprises at least one of catalytic Ag, catalytic Au, catalytic Pt, catalytic Pd, catalytic Cu, catalytic Ni, catalytic Co, or catalytic Rh. The catalytic material is typically arranged as a layer having a thickness between the atomic radius of the components of the catalytic material (e.g., catalytic metal, Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, etc.) and 500 μm, utilizing an organometallic precursor such as an organometallic compound (e.g., as a metal ink, reducing metal ink, thermally reducing metal ink, etc.). The organometallic compound can be stabilized by chelation or interaction of counteranions. Alternatively, or in combination, the catalytic material is arranged as a plurality of particles (e.g., metal ink, reduced metal ink, chemically reduced metal ink, etc.) having an average radius between the atomic radius of the catalytic material component (e.g., catalytic metal, Ag, Au, Pt, Pd, Cu, Ni, Co, Rh, etc.) and 100 nm. In some embodiments, the ink includes several metal particles (of one or more metals) that provide a relatively wide application for the ink or catalytic precursor, for example, by avoiding unstable catalytic precursor conditions due to high concentrations of precursor in the ink.

[0010] The catalyst layer may also be deposited by sputtering, evaporation, or chemical deposition. The subject matter of the present invention is a system and method for forming an electrical circuit, and further, a circuit formed thereby. A method for forming an electrical circuit is envisioned using a metal foil having a surface having a catalytic material. The surface of the metal foil having the catalytic material is applied to the surface of a substrate, and the metal foil is laminated onto the substrate. The metal foil (preferably an etchable or removable metal foil) is then removed (e.g., by etching) to expose the catalytic material on the surface of the substrate. A first conductor is then electrolessly metal-plated onto the exposed catalytic material. Further conductors may be plated (e.g., by electroplating), and additional metal foil may be laminated onto the conductors and etched as needed for the electrical circuit pattern. Metal foils containing such layers are the subject of the present invention, as described below.

[0011] In some embodiments, the surface of a metal foil having a catalyst material is coated with a coating layer of either a B-stage (curable) thermosetting resin (e.g., epoxy resin, polyimide precursor, urethane resin, acrylic resin) or a thermoplastic material, or a combination thereof, and is referred to herein as a resin-coated catalyst foil (RCCF®). In some embodiments, the coating layer is a laminating material (e.g., conventional resins used for lamination such as epoxy resin for FR4, conventional resins used for resin-coated foils (RCF) such as R-FR10 (Panasonic), and conventional resins used for bonding films such as ABF (Ajinomoto Fine Techno)). Next, the resin-coated metal foil is laminated onto a substrate so that the coating layer is adjacent to the substrate. Then, the metal foil (preferably an etchable or removable metal foil) is removed (e.g., by etching) to expose the catalyst material on the surface of the coating layer (e.g., if the coating layer is a B-stage resin, the lamination cures it to a C-stage resin, etc.). Next, the exposed catalyst material is electrolessly metal-plated with a first conductor. Further conductors can be plated (e.g., by electroplating), additional metal foils can be laminated onto the conductors, and the electrical circuit patterns can be etched as needed.

[0012] In some embodiments, the catalyst material is (i) a catalyst precursor for at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalytic Ag, catalytic Au, catalytic Pt, catalytic Pd, catalytic Cu, catalytic Ni, catalytic Co, or catalytic Rh, or a combination thereof. In some methods using the catalyst precursor, the catalyst precursor is reduced to a catalyst (e.g., thermal reduction, chemical reduction) before the step of applying the surface of the metal foil to the surface of the substrate, or in some embodiments, after the metal foil has been etched. The metal foil is typically made of one of aluminum, anodized aluminum, copper, tin, and alloys thereof. In some embodiments, an adhesive layer is applied between the surface of the metal foil having the catalyst material and the surface of the substrate.

[0013] In some embodiments, preceramic polymers, ceramics or composites of metal oxides, polymers or metal oxide particles, borides nitrides, etc., are coated onto the surface of the metal foil, the surface of the catalyst layer, or both. The coating layer may further coat the layer deposited on the catalyst material, with a thickness not exceeding 500 μm, 100 μm, 10 μm, or 1 μm. The thickness varies depending on the coating material.

[0014] A layer of organic material can be further arranged on the catalyst material layer with a thickness of 10 μm, 5 μm, 1 μm, 0.5 μm, or 0.1 μm or less. The catalyst material layer is preferably 500 nm, 100 nm, 50 nm, or 20 nm or less in thickness. The organic material is preferably a copolymer of an alkali-reactive polymer portion and an alkali-nonreactive polymer portion. In a preferred embodiment, the copolymer further contains a functional group having a lone pair of electrons, or otherwise contains at least one of nitrogen or sulfur. The preferred alkali-reactive polymer portion has at least one polyimide, amide, ester, or thioester. Generally, the copolymer has a composition of alkali-reactive polymer portion and alkali-nonreactive polymer portion between 5%:95% and 95%:5% in terms of molecular weight, respectively.

[0015] The organic material is preferably selected to protect the catalyst material from diffusion (e.g., between thermal processes, laminations, etc.) or otherwise from the catalyst material or from any transition or damage to its catalytic activity. In some embodiments, the organic material is selected to improve the bonding strength of the catalyst material to the substrate or to absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. The organic material is selected to have at least 25%, 50%, 75%, or 100% higher adhesion (e.g., mechanical, chemical, dispersive, diffusive, electrostatic, etc.) to the substrate than the adhesion that the catalyst material has to the substrate.

[0016] The method may further include the step of applying a plating resist in a negative circuit pattern onto an exposed catalyst material prior to the electroless metal plating step. The plating resist is then preferably removed (e.g., by etching) after the electroless metal plating step. It is also intended to apply an etching resist in a positive circuit pattern onto an exposed catalyst material prior to the electroless metal plating step. The catalyst material not covered by the etching resist is then removed (e.g., by etching), and the etching resist is preferably removed thereafter. In some embodiments, the plating resist is further applied on a first conductor in a negative circuit pattern, and a second conductor is electrolytically deposited on the exposed portion of the first conductor. The plating resist is preferably removed, and the portion of the first conductor not covered by the second conductor is further removed.

[0017] In some embodiments, a permanent plating resist is further applied in a negative circuit pattern onto the exposed catalyst material prior to the electroless metal plating step. After electroless plating, the intention is to electrolytically deposit a second conductor onto the first conductor and apply an etching resist in a positive circuit pattern onto the second conductor. The first and second conductors not covered by the etching resist are preferably removed as well as the etching resist.

[0018] In some embodiments, a metal is plated onto the surface of a substrate. An etching resist layer is further applied on the metal-plated surface in the shape of the circuit pattern, or in at least a portion of the circuit pattern. The metal not covered by the etching resist layer is etched from the surface. The etching resist is then removed from the surface, leaving the plated metal in the shape of the pattern or a portion of the pattern.

[0019] Systems and methods for manufacturing metal foil are further conceived. A portion of the metal foil is coated with a catalytic ink, and the catalytic ink coating has a precursor dissolved in a solvent. The catalytic ink coating is then dried on the metal foil, followed by reduction of the catalytic precursor (e.g., thermal reduction, chemical reduction, etc.) to deposit a catalyst (e.g., active catalyst) on the portion of the metal foil. This is preferably etchable or otherwise removable. The metal foil is typically one of aluminum, anodized aluminum, copper, tin, or an alloy thereof, and preferably has a thickness of less than 500 μm, for example, 200 μm, 100 μm, 80 μm, 50 μm, 30 μm, 20 μm, or less than 10 μm. In some embodiments, the portion of the metal foil coated with the catalytic ink is roughened by etching or dendrite growth, or oxidation, or a combination thereof. Alternatively, or in combination, that portion of the metal foil has an Ra of at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm. In some embodiments, the precursor ink contains metal particles or one or more metals.

[0020] The catalyst is typically at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, and optionally is arranged as a layer having a thickness between the atomic radius of the components of the catalyst (e.g., the catalyzing metal, Ag, Au, Pt, Pd, Cu, Ni, Co, Rh, etc.) and 500 μm. Alternatively, or in combination, the catalyst is arranged as a plurality of particles having an average radius between the atomic radius of the components of the catalyst and 100 nm. The catalyst ink is typically coated on the metal foil by at least one of dip coating, roller coating, spray coating, spinner coating, bar coating, curtain coating, blade coating, air knife coating, cast coating, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, or a combination thereof. In some embodiments, the portion of the metal foil coated with the metal ink is one complete surface of the metal foil (e.g., one complete side).

[0021] Various objectives, features, aspects, and advantages of the subject matter of the present invention will become more apparent from the following detailed description of the preferred embodiments, together with the accompanying drawings in which like numerals represent like components.

Brief Description of the Drawings

[0022] [Figure 1] A diagram showing a flowchart for manufacturing a catalyzed metal foil of the subject matter of the present invention. [Figure 2A] A diagram showing a catalyzed metal foil of the subject matter of the present invention. [Figure 2B] A diagram showing another catalyzed metal foil of the subject matter of the present invention. [Figure 3A] A diagram showing steps of a method of the subject matter of the present invention. [Figure 3B] A diagram showing further steps in the method of Figure 3A. [Figure 3C] The same as above. [Figure 3D] The same as above. [Figure 4A] A diagram showing steps of another method of the subject matter of the present invention. [Figure 4B] Figure 4A shows a further step in the method. [Figure 4C] Same as above. [Figure 4D] Same as above. [Figure 5] A diagram illustrating yet another step of the subject matter of the present invention. [Figure 6] A diagram illustrating yet another step of the subject matter of the present invention. [Figure 7A] A diagram illustrating the steps of another method relating to the subject matter of the present invention. [Figure 7B] Figure 7A shows a further step in the method. [Figure 7C] Same as above. [Figure 7D] Same as above. [Figure 8] A diagram illustrating yet another step of the subject matter of the present invention. [Figure 9A] A diagram illustrating the steps of another method relating to the subject matter of the present invention. [Figure 9B] Figure 9A shows a further step in the method. [Figure 9C] Same as above. [Figure 9D] Same as above. [Figure 10] A diagram showing a flowchart of the process related to the subject of this invention. [Figure 11] A diagram showing a flowchart of another process related to the subject matter of the present invention. [Modes for carrying out the invention]

[0023] The subject of the present invention is to provide systems, methods, and devices related to catalytic metal foils, as well as to provide a method for forming electrical circuits and circuits formed therefrom using such foils.

[0024] Figure 1 shows a flowchart for manufacturing the catalytic metal foil that is the subject of the present invention. Figure 2A shows a catalytic metal foil 200A of the subject matter of the present invention. The catalytic metal foil 200 comprises a metal foil 210 which is etchable or removable and is typically one of aluminum, anodized aluminum, copper, tin, or an alloy thereof, and has a surface 212. The catalyst 220 is typically deposited on the surface 212 by coating the surface 212 with a catalytic ink having a precursor of the catalyst 220, and then reducing the catalytic ink to deposit the catalyst 220 on the surface 212. The surface 212 is preferably roughened and has an Ra of, for example, at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm. In some embodiments, an optional layer 230A may be further coated on top of the catalyst 220 (or on top of the catalytic ink, etc., before reduction). The optional layer may be one or more polymers described herein, or may be a preceramic polymer, a ceramic or composite of metal oxides, a polymer, metal oxide particles, a nitride or boride (e.g., titanium dioxide, zirconium dioxide, cerium dioxide, yttrium oxide, or composites thereof with a perceramic polymer, which may be an epoxy in step A, step B, or step C). In some embodiments including the optional layer 230A, for example, if the optional layer 230A contains one or more preceramic polymers, a ceramic or composite of metal oxides, a further optional layer 240 may be further coated on top of the optional layer 230A. In such embodiments, the further optional layer 240 typically contains one or more polymers.

[0025] Figure 2B shows one embodiment of catalytic metal foil 200A labeled 200B, where an optional layer is an organic material layer 230B. The organic material 230B is a copolymer comprising an alkali-reactive polymer and an alkali-nonreactive polymer, typically with a thickness of 1 μm to 0.1 μm or less. In some embodiments, the copolymer further comprises a functional group having a lone pair of electrons, such as nitrogen or sulfur. The preferred alkali-reactive polymer has at least one polyimide, amide, ester, or thioester. Generally, the copolymer has an alkali-reactive polymer to alkali-nonreactive polymer composition between 5%:95% and 95%:5% in terms of molecular weight, respectively.

[0026] Figure 3A shows a method 300 for manufacturing a catalytic substrate 360A using catalytic metal foil 310. In step 330, the surface 314 (having catalyst 316) of the catalytic metal foil 310 is laminated onto the surface 322 of a substrate 320 (e.g., a prepreg, a curable film, a thermoplastic substrate) to produce an intermediate material 340. In step 350, the removable metal foil 312 is removed from the intermediate material 340 (e.g., by etching) to form a catalytic substrate 360A having catalyst 316 deposited on the substrate 320. In some embodiments, catalytic metal foil 200A can be used instead of catalytic metal foil 310 and may include, for example, an optional layer 230A or a further optional layer 240 as described. In such embodiments, the catalytic metal foil 360A appears as catalytic metal foil 360B including an optional layer 230A as shown in Figure 3B, or catalytic metal foil 360C including an optional layer 230A and a further optional layer 240 as shown in Figure 3C. In the embodiment of Figure 3D, catalytic metal foil 200B including catalytic metal foil 360D having the organic material layer 230B as described above is used instead of catalytic metal foil 310.

[0027] Figure 4A shows a method 400 for manufacturing a partial circuit 460A using the catalyst substrate 310 of Figure 3A. In step 410, a temporary resist layer 430 is formed across the catalyst 422 and deposited on the substrate 420 (e.g., a dielectric substrate). The temporary resist layer 430 is formed, exposing a portion 422a of the catalyst 422, leaving a negative pattern 432 in the form of a partial circuit. In step 440, the conductor 424 is electroplated onto the exposed portion 422a of the catalyst 422, while the temporary resist layer 430 prevents electroplating onto any portion of the catalyst 422 covered by the layer 430. In step 450, the temporary resist layer 430 is peeled off from the catalyst 422 (e.g., chemically), exposing the catalyst 422 and leaving the portion 422a and the plated conductor 424 on the substrate 420, forming the partial circuit 460A. In the optional step 470, the catalyst 422 is further removed from the substrate 420 (e.g., by etching) to obtain the partial circuit 460A.

[0028] In some embodiments, the catalytic metal foil 200A can be used instead of the catalytic metal foil 310, and for example, includes an optional layer 230A or a further optional layer 240, as described. In such embodiments, the subcircuit 460A appears as a subcircuit 460B including an optional layer 230A, as shown in Figure 4B, or as a subcircuit 460C including an optional layer 230A and a further optional layer 240, as shown in Figure 4C. In the embodiment of Figure 4D, catalytic metal foil 200B is used instead of catalytic metal foil 310, and includes an organic material layer 230B.

[0029] Figure 5 shows a method 500 for manufacturing a partial circuit 580 using the catalyst substrate 310 of Figure 3. In step 510, a temporary resist layer 530 is formed across the catalyst 522 and deposited on the substrate 520 (e.g., a dielectric substrate). As shown, the temporary resist layer 530 is formed while leaving a portion of the catalyst 522a exposed. In step 540, the exposed portion of the catalyst 522a is removed (e.g., by etching), leaving only the covered portion of the catalyst 522b covered by the temporary resist layer 530. In step 550, the temporary resist layer 530 is peeled off, exposing the remaining portion of the catalyst 522b. In step 560, a conductor 570 is electroplated onto the catalyst 522b to produce the partial circuit 580.

[0030] In some embodiments, the catalytic metal foil 200A can be used instead of the catalytic metal foil 310, and for example, includes an optional layer 230A or a further optional layer 240, as described. In such embodiments, the subcircuit 580 appears as a subcircuit 460B including an optional layer 230A, as shown in Figure 4B, or as a subcircuit 460C including an optional layer 230A and a further optional layer 240, as shown in Figure 4C. In some embodiments, the catalytic metal foil 200B can be used instead of the catalytic metal foil 310. The subcircuit 580 appears as a subcircuit 460D including an organic material 230B, as shown in Figure 4D.

[0031] Figure 6 shows a method 600 for manufacturing a partial circuit 680 using the catalytic substrate 310 of Figure 3. In step 610, the conductor 624 is electroless plated onto the catalyst 622 deposited on the substrate 620. The conductor 624 is typically plated to a thickness of 500 μm, 400 μm, 300 μm, 200 μm, 100 μm, or less than 50 μm, or to at least the minimum thickness required for the electroplating of the conductor to propagate. In step 630, a temporary resist layer 640 is formed on the conductor 624, and the negative pattern 642 leaves a portion 624a of the conductor 624 exposed to the negative pattern of part of the circuit. In step 650, the conductor 626 is electroplated onto the portion 624a of the conductor 624. In step 660, the temporary resist layer 640 is peeled off, exposing the conductor 624. In step 670, the exposed portion of conductor 624 and the portion beneath catalyst 622 are removed (e.g., by etching) to generate the partial circuit 680.

[0032] In some embodiments, the catalytic metal foil 200A can be used instead of the catalytic metal foil 310, and for example, includes an optional layer 230A or a further optional layer 240, as described. In such embodiments, the subcircuit 680 appears as a subcircuit 460B including an optional layer 230A, as shown in Figure 4B, or as a subcircuit 460C including an optional layer 230A and a further optional layer 240, as shown in Figure 4C. In some embodiments, the catalytic metal foil 200B can be used instead of the catalytic metal foil 310. The subcircuit 680 appears as a subcircuit 460D including an organic material 230B, as shown in Figure 4D.

[0033] Figure 7A shows a method 700 for manufacturing a partially embedded circuit 750A using the catalytic substrate 310 of Figure 3. In step 710, a permanent resist layer 730 is formed on the catalyst 722 deposited on the substrate 720. The permanent resist layer 730 is formed such that a negative pattern 732 exposes a portion 722a of the catalyst 722. In step 740, a conductor 724 is electroplated onto the exposed portion 722a of the catalyst 722 to generate the partially embedded circuit 750A.

[0034] In some embodiments, catalytic metal foil 200A can be used instead of catalytic metal foil 310, for example, including an optional layer 230A or a further optional layer 240, as described. In such embodiments, the subcircuit 750A appears as subcircuit 750B including an optional layer 230A, as shown in Figure 7B, or as subcircuit 750C including an optional layer 230A and a further optional layer 240, as shown in Figure 7C. In the embodiment of Figure 7D, catalytic metal foil 200B is used instead of catalytic metal foil 310, which includes an organic material layer 230B.

[0035] Figure 8 shows a method 800 for manufacturing a partial circuit 880 using the catalytic substrate 310 of Figure 3. In step 810, the conductor 824 is electroless plated onto the catalyst 822 deposited on the substrate 820. The conductor 824 is typically plated to a thickness of 500 μm, 400 μm, 300 μm, 200 μm, 100 μm, or less than 50 μm, or at least the minimum thickness required for the electroplating of the conductor to propagate. In step 810, the conductor 826 is typically electroplated onto the conductor 824 to a thickness of at least 2, 3, 4, 5, 6, 7, 8, 9, 10, or 20 times or more the thickness of the conductor 824. In step 840, a temporary resist layer 840 is formed on the conductor 826 in the pattern of the circuit, leaving the exposed portion 826a of the conductor 826. In step 860, the exposed portion 826a of the conductor 826 and the portion of the catalyst 822 beneath portion 826a are removed (e.g., by etching), leaving portion 826b of the conductor 826 covered by the temporary resist layer 850 and portion 822b of the underlying catalyst 822. In step 870, the temporary resist layer 850 is peeled off, exposing portion 826b of the conductor 826 in the pattern of the circuit, and a partial circuit 880 is created.

[0036] In some embodiments, the catalytic metal foil 200A can be used instead of the catalytic metal foil 310, and for example, includes an optional layer 230A or a further optional layer 240, as described. In such embodiments, the subcircuit 880 appears as a subcircuit 460B including an optional layer 230A, as shown in Figure 4B, or as a subcircuit 460C including an optional layer 230A and a further optional layer 240, as shown in Figure 4C. In some embodiments, the catalytic metal foil 200B can be used instead of the catalytic metal foil 310. The subcircuit 880 appears as a subcircuit 460D including an organic material 230B, as shown in Figure 4D.

[0037] Figure 9A shows a method 900 for manufacturing a catalytic substrate 970A using catalytic metal foil 910. In step 920, the surface 913 of the catalytic metal foil 910 (on which the catalyst 914 is deposited) is coated with a B-stage resin 916. In step 930, the B-stage resin 916, together with the catalyst 914 and metal foil 912, is laminated onto the surface 944 of a substrate 942 (e.g., a prepreg, a curable film, a thermoplastic substrate) to produce an intermediate material 950. During the lamination step, the B-stage resin 916 is cured to form a C-stage resin 917. In step 960, the removable metal foil 912 is etched from the intermediate material 950 to form a catalytic substrate 970 having the catalyst 914 deposited on the cured C-stage resin 917 deposited on the substrate 942.

[0038] Figure 9A shows the use of resins in stages B and C, but it is intended that other materials or resins may be used. For example, polymers, combinations of polymers, or specially formulated polymers may be used to have a beneficial or detrimental effect on the function or performance of the substrate 942. If the substrate 942 contains an electrical circuit, a polymer that bonds or adheres well to the substrate is used, preferably a polymer that does not alter the performance of the circuit at all or does not exceed a desired tolerance. Layer 916 or 917 is preferably thin, less than 100 μm, 50 μm, 20 μm, 10 μm, less than 5 μm, or less than 0.5 μm. In a preferred embodiment, such a polymer or resin layer is 0.5 μm to 0.1 μm thick, but may be less than 100 nm, less than 50 nm, or less than 10 nm if practical or preferred.

[0039] In some embodiments, the catalytic metal foil 200A can be used instead of the catalytic metal foil 310, and for example, includes an optional layer 230A or a further optional layer 240, as described. In such embodiments, the catalytic substrate 970A appears as a catalytic substrate 970B including an optional layer 230A, as shown in Figure 9B, or as a catalytic substrate 970C including an optional layer 230A and a further optional layer 240, as shown in Figure 9C. In the embodiment of Figure 9D, the catalytic metal foil 200B is used in the catalytic substrate 970D instead of the catalytic metal foil 310 including an organic material layer 230B.

[0040] Figure 10 shows a flowchart of process 1000, which includes starting material 1010, intermediate material 1020, intermediate material 1030, and finished material 1040. Starting material 1010 includes a removable material 101 (e.g., an etchable metal, etchable aluminum, etchable copper, removable plastic film, etc.) and a catalyst layer 1014 deposited on the surface of the removable metal 1012. A polymer layer 1016 is deposited on the surface of the catalyst layer 1014. Preferably, the content of the polymer layer 1016 is specifically selected, designed, or formulated to favorably bond or adhere to the catalyst layer, to the surface of a binder sheet 1022 (e.g., a prepreg, binder film, adhesive sheet), or both. For example, the polymer layer 1016 may contain a variant of a single polymer having high strength or bonding specificity to the binder sheet 1022, or it may contain a number of polymer variants having desirable bonding or adhesive properties, physical resistance (temperature resistance, flexibility, durability, etc.), electrical properties (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or it may be doped with other materials to impregnate the polymer layer 1016 with such desirable properties. Furthermore, in preferred embodiments, the polymer layer 1016 is between 1 μm and 0.01 μm, but may be less than 500 nm, less than 100 nm, or less than 50 nm if practical or preferred. Reducing separation between the catalyst layer 1014 and the binder sheet 1022, or further between the catalyst layer 1014 and the substrate 1024, is absolutely important in some embodiments.

[0041] The intermediate material 1020 comprises a removable metal 1012, a catalyst layer 1014, and a polymer layer 1016, and further comprises a binder sheet 1022 and a substrate 1024. As mentioned, the content of the polymer layer 1016 is preferably selected to maintain a strong bond or adhesion between the surface of the catalyst layer 1014 and the surface of the binder sheet 1022. Similarly, the binder sheet 1022 is selected to maintain a strong bond or adhesion between the surface of the binder sheet 1022 and the surface of the substrate 1024. In some embodiments, the polymer layer 1016 is selected to maintain a strong bond or adhesion to a broad class of binder sheets, the binder sheet 1022 is selected to maintain a strong bond or adhesion to a broad class of substrates, or both.

[0042] Intermediate material 1030 includes a removable metal 1012, a catalyst layer 1014, a polymer layer 1016, a bonding sheet 1022, and a substrate 1024 bonded or bonded together (e.g., laminated) as shown. The finished material is obtained by removing the etchable metal 1012 and exposing the surface of the catalyst layer 1014. It is intended that the finished material 1040 can be further processed to obtain a finished material 1040 by plating, for example, a conductor, in a pattern, in bulk, or both (e.g., electroless, electrolytic, various combinations thereof). Such methods are useful for adding power lines, circuit patterns, new or improved RF performance or functionality, etc., to the substrate 1024 or finished material 1040A, for example, if the substrate 1024 already contains electrical circuits or various electronic components having rated, approved, evaluated, or certified performance tolerances or characteristics.

[0043] Figure 10 shows a method and device for adding a catalyst layer or a catalyst-coated etchable or removable metal layer to one side of a substrate, but such teachings are further intended to be applied to adding a catalyst layer or a catalyst-coated etchable or removable metal layer to more than a portion of a substrate, for example, multiple portions of a single side of a substrate, more portions of one side of a substrate, or multiple portions of multiple sides of a substrate.

[0044] Figure 11 shows a flowchart of process 1100, which includes starting material 1110, intermediate material 1120, intermediate material 1130, intermediate material 1140, and finished material 1150. Starting material 1110 includes a removable material 1112 (e.g., an etchable metal, etchable aluminum, etchable copper, removable plastic film, etc.) and a catalyst layer 1114 deposited on the surface of the removable metal 1112. A metal oxide layer 1116 is deposited on the surface of the catalyst layer 1114. Preferably, the metal oxide layer 1116 is specially selected, designed, or formulated to favorably bond or adhere to the catalyst layer 1114. Furthermore, the metal oxide layer 1116 preferably protects the subsequent polymer layer 118 from diffusion and promotes good adhesion of the metal oxide layer 1116, and thereby of the starting material 1110, to the polymer layer 1118.

[0045] The intermediate material 1120 further comprises a polymer layer 1118 deposited on the surface of the metal oxide layer 1116. Preferably, the content of the polymer layer 1118 is specially selected, designed, or formulated to favorably bond or adhere to the catalyst layer 1116, to the surface of the binder sheet 1122 (e.g., prepreg, binder film, adhesive sheet), to the metal oxide layer 1116, or a combination thereof. For example, the polymer layer 1118 may contain a variant of a single polymer having high strength or high bonding specificity to the binder sheet 1122, or it may contain a number of polymer variants having desired bonding or adhesive properties, physical resistance (temperature resistance, flexibility, durability, etc.), or electrical properties (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or it may be doped with other materials to impregnate the polymer layer 1118 with such desired properties. Furthermore, in preferred embodiments, the combined thickness of the metal oxide layer 1116 and the polymer layer 1118 is between 1.0 μm and 0.01 μm, but may be less than 500 nm, less than 100 nm, or less than 50 nm if practical or preferred. Reducing separation between the catalyst layer 1114 and the binder sheet 1122, or further between the catalyst layer 1114 and the substrate 1124, is absolutely important in some embodiments.

[0046] The intermediate material 1130 comprises a removable metal 1112, a catalyst layer 1114, a metal oxide layer 1116, and a polymer layer 1118, and further comprises a binder sheet 1122 and a substrate 1124. As mentioned, the content of the polymer layer 1118 is preferably selected to maintain a strong bond or adhesion between the metal oxide layer 1116 (therefore the catalyst layer 1114 and the removable metal 1112) and the surface of the binder sheet 1122. Similarly, the binder sheet 1122 is selected to maintain a strong bond or adhesion between the binder sheet 1122 and the surface of the substrate 1124. In some embodiments, the polymer layer 1118 is selected to maintain a strong bond or adhesion to a broad class of binder sheets, the binder sheet 1122 is selected to maintain a strong bond or adhesion to a broad class of substrates, or both.

[0047] Intermediate material 1140 includes a removable metal 1112, a catalyst layer 1114, a metal oxide layer 1116, a polymer layer 1118, a bonding sheet 1122, and a substrate 1124 bonded or joined together (e.g., laminated) as shown. Finished material 1150 is obtained by removing the removable metal 1112 and exposing the surface of the catalyst layer 1114. It is intended that finished material 1140 can be further processed to produce finished material 1150 by plating, for example, conductors, in patterns, in bulk, or both (e.g., electroless, electrolytic, various combinations thereof). Such methods are useful for adding power lines, circuit patterns, novel or improved RF performance or functionality, etc., to substrate 1124 or finished material 1150, for example, if substrate 1124 already contains electrical circuits or various electronic components having rated, approved, evaluated, or certified performance tolerances or characteristics.

[0048] Figure 11 shows a method and device for adding a catalyst layer or a catalyst-coated or removable metal layer to one side of a substrate, but such teachings are further intended to be applied to adding a catalyst layer or a catalyst-coated or removable metal layer to more than a portion of a substrate, for example, multiple portions of a single surface of a substrate, more than one side of a substrate, or multiple portions of multiple surfaces of a substrate.

[0049] The following discussion provides many exemplary embodiments of the subject matter of the present invention. While each embodiment represents a single combination of the elements of the present invention, the subject matter of the present invention is considered to encompass all possible combinations of the disclosed elements. Thus, if one embodiment includes elements A, B, and C, and a second embodiment includes elements B and D, the subject matter of the present invention is considered to encompass other remaining combinations of A, B, C, or D, even if not explicitly disclosed.

[0050] Where used herein, unless otherwise indicated by context, the term “to be joined to” is intended to include both direct joining (where the two joined elements are in contact with each other) and indirect joining (where at least one additional element is positioned between the two elements). Thus, the terms “to be joined to” and “to be joined with” are used as synonyms.

[0051] In some embodiments, numerical values ​​representing properties such as the amount and concentration of components, reaction conditions, etc., used to describe and claim specific embodiments of the present invention should be understood to be modified in some cases by the term “approximately.” Therefore, in some embodiments, the numerical parameters shown herein and in the appended claims are approximations that may vary depending on the desired properties to be obtained by the particular embodiment. In some embodiments, the numerical parameters should be interpreted by applying common rounding techniques in light of the number of significant figures reported. Although the numerical ranges and parameters representing a wide range of some embodiments of the present invention are approximations, the numerical values ​​shown in specific examples are reported as accurately as possible. The numerical values ​​presented in some embodiments of the present invention may include certain errors that inevitably arise from the standard deviation found in each test measurement.

[0052] Unless the context indicates otherwise, all ranges described herein should be interpreted as including their endpoints, and open-ended ranges should be interpreted as including only commercially useful values. Similarly, all lists of values ​​should be considered to include intermediate values ​​unless the context indicates otherwise.

[0053] As used herein and throughout the following claims, the meanings of “a,” “an,” and “the” include multiple references unless the context explicitly indicates otherwise. Also, as used herein, the meaning of “in” includes “in” and “on” unless the context explicitly indicates otherwise.

[0054] All methods described herein may be carried out in any suitable order, unless otherwise indicated herein or unless it is clearly inconsistent with the context. The use of any examples or exemplary language (e.g., "etc.") provided relating to specific embodiments herein is intended merely to further illustrate the invention and not to limit the scope of the invention as otherwise claimed. The language in the specification should not be construed as indicating unclaimed elements essential to the carrying out of the invention.

[0055] The grouping of alternative elements or embodiments of the Invention disclosed herein should not be construed as limitation. Elements of each group may be referenced and claimed individually or in any combination with other elements of the group or other elements found herein. One or more elements of a group may be included in or removed from a group for convenience and / or patentability reasons. If such inclusion or removal occurs, the specification shall be deemed to include the modified group and therefore satisfy the description of all Markush groups used in the appended claims.

[0056] Those skilled in the art will see that many modifications beyond those already described are possible without departing from the concept of the present invention. Therefore, the subject matter of the present invention should not be limited to the technical idea of ​​the appended claims. Furthermore, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible way that is consistent with the context. In particular, the terms “comprises” and “comprising” should be interpreted to refer to an element, component, or step in a non-exclusive manner indicating that the referenced element, component, or step may exist, be utilized, or be combined. Where a claim in the specification refers to at least one selected from the group consisting of A, B, C… and N, the text should be interpreted as requiring only one element from the group, and not A+N, or B+N, etc. (Example configuration) [Configuration Example 1] A metal foil having a surface, A catalyst material layer disposed on a part of the surface of the metal foil, wherein the metal foil is removable. The aforementioned metal foil. [Configuration Example 2] The metal foil according to Example 1, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 3] The metal foil according to Example 1, wherein a portion of the surface of the metal foil is oxidized or roughened. [Configuration Example 4] The metal foil according to Example 1, wherein the metal foil has a thickness of less than 500 μm. [Configuration Example 5] The metal foil according to Example 1, wherein a portion of the surface has an arithmetic mean roughness (Ra) of at least 0.1 μm. [Configuration Example 6] The metal foil according to Example 1, wherein the catalyst material comprises a catalyst precursor for one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. [Configuration Example 7] The metal foil according to Example 1, wherein the catalyst material is at least one of catalytic Ag, catalytic Au, catalytic Pt, catalytic Pd, catalytic Cu, catalytic Ni, catalytic Co, or catalytic Rh. [Configuration Example 8] The metal foil according to Configuration Example 1, wherein the catalyst material is arranged as a layer having a thickness between the atomic radius of the catalytic material component and 500 μm. [Configuration Example 9] The metal foil according to Configuration Example 1, wherein the catalyst material is arranged as a plurality of particles having an average radius between the atomic radius of the catalytic material component and 100 nm. [Configuration Example 10] The metal foil according to Example 1, wherein the catalyst material is made from one or more catalytic precursors. [Configuration Example 11] The metal foil according to configuration example 10, wherein one or more catalytic precursors are applied in ink form. [Configuration Example 12] The metal foil according to Example 1, wherein the catalyst layer is deposited by CVD (chemical vapor deposition), PVD (physical vapor deposition), or vacuum deposition technology. [Configuration Example 13] The metal foil according to Example 1, wherein the catalyst layer is coated with a preceramic polymer or ceramic material. [Configuration Example 14] The catalyst layer is further coated with an adhesive material, as described in Configuration Example 13, for the metal foil. [Configuration Example 15] The metal foil according to Configuration Example 1, wherein a coating layer comprising at least one of a B-stage epoxy or thermoplastic material is disposed on the catalyst material. [Configuration Example 16] The metal foil according to Configuration Example 1, wherein a coating layer containing a laminated material is disposed on the catalyst material. [Configuration Example 17] The metal foil according to Example 16, wherein the laminated material includes at least one of epoxy resin, resin-coated foil, or bonding film resin. [Configuration Example 18] The metal foil according to Example 1, further comprising a polymer layer disposed on a portion of the catalyst material, wherein the thickness of the polymer layer is 500 μm or less. [Configuration Example 19] The metal foil according to Configuration Example 18, wherein the polymer layer is selected to have at least one of a strong binding affinity to the catalyst material or a strong binding affinity to the binding sheet. [Configuration Example 20] The metal foil according to Example 1, further comprising a layer of a preceramic polymer, ceramic, metal oxide composite, polymer, metal oxide particles, nitride, or boride disposed on a portion of the catalyst material. [Configuration Example 21] The metal foil according to configuration example 20, further comprising a polymer layer disposed on a portion of the layer deposited on the catalyst material, wherein the thickness of the polymer layer is 500 μm or less. [Configuration Example 22] The metal foil according to Example 3, further comprising a layer of organic material with a thickness of 1 μm or less disposed on the catalyst material layer, wherein the surface of the metal foil is roughened. [Configuration Example 23] The metal foil according to configuration example 22, wherein the surface of the metal foil is roughened by etching. [Configuration Example 24] The metal foil according to Example 22, wherein the catalyst material is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or combinations thereof. [Configuration Example 25] The metal foil according to configuration example 22, wherein the catalyst material layer has a thickness of 100 nm or less. [Configuration Example 26] The metal foil according to Example 22, wherein the organic material is a copolymer containing an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 27] The metal foil according to example 26, wherein the copolymer has a functional group having a lone pair of electrons. [Configuration Example 28] The metal foil according to example 27, wherein the functional group contains one of nitrogen or sulfur. [Configuration Example 29] The metal foil according to Example 26, wherein the alkali-reactive polymer comprises at least one of polyimide, amide, ester, or thioester. [Configuration Example 30] The copolymer is a metal foil according to Example 26, wherein the composition of the alkali-reactive polymer to the alkali-non-reactive polymer is between 5%:95% and 95%:5% in terms of molecular weight. [Configuration Example 31] The metal foil according to Configuration Example 22, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. [Configuration Example 32] The metal foil according to Configuration Example 22, wherein the organic material is selected to have at least 30% higher adhesion to the substrate than the adhesion of the catalyst material to the substrate. [Configuration Example 33] A method for forming an electrical circuit using a metal foil having a surface on which a catalyst material is supported, The steps include applying the surface of the metal foil supporting the catalyst material to the surface of the substrate, The steps include laminating the aforementioned metal foil onto the substrate, The steps include etching the metal foil to expose the catalyst material, The process includes the step of electrolessly metal-plating a first conductor onto the exposed catalyst material, The aforementioned metal foil is removable. The aforementioned method. [Configuration Example 34] The method according to Example 33, wherein the catalyst material is (i) a catalyst precursor for at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalytic Ag, catalytic Au, catalytic Pt, catalytic Pd, catalytic Cu, catalytic Ni, catalytic Co, or catalytic Rh. [Configuration Example 35] The method according to Configuration Example 34, wherein the catalyst precursor is reduced to a catalyst before the step of applying the surface of the metal foil to the surface of the substrate. [Configuration Example 36] The method according to Configuration Example 34, wherein the catalyst precursor is reduced to a catalyst after the step of etching the metal foil. [Configuration Example 37] The method according to Configuration Example 33, further comprising the steps of applying a plating resist in a negative circuit pattern onto the exposed catalyst material before the electroless metal plating step, and removing the plating resist after the electroless plating step. [Configuration Example 38] Before the electroless metal plating step, The steps include applying an etching resist with a positive circuit pattern onto the exposed catalyst material, The steps include etching the catalyst material that is not covered by the etching resist, The step of removing the etching resist and The method described in example 33, further including the method described in example 33. [Configuration Example 39] The steps include applying a plating resist to the first conductor in a negative circuit pattern, The steps include electrolytically depositing a second conductor onto the exposed portion of the first conductor, The step of removing the aforementioned plating resist, The steps of removing the portion of the first conductor that is not covered by the second conductor and The method described in example 33, further including the method described in example 33. [Configuration Example 40] The method according to Configuration Example 33, further comprising the step of applying a permanent plating resist in a negative circuit pattern onto the exposed catalyst material prior to the electroless metal plating step. [Configuration Example 41] After the electroless plating step, The steps include electrodepositing a second conductor onto the first conductor, The steps include applying an etching resist in the form of a positive circuit pattern on the second conductor, The steps include etching the first conductor and the second conductor that are not covered by the etching resist, The step of removing the etching resist and The method described in example 33, further including the method described in example 33. [Configuration Example 42] The method according to Configuration Example 33, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 43] The method according to Configuration Example 33, further comprising the step of applying an adhesive layer between the surface of the metal foil supporting the catalyst material and the surface of the substrate. [Configuration Example 44] The method according to Configuration Example 33, further comprising the step of applying a polymer layer onto the surface of the catalyst material and bonding the polymer layer to the substrate. [Configuration Example 45] The method according to Configuration Example 44, further comprising the step of bonding a bonding sheet to at least one of the surfaces of the polymer layer or the substrate. [Configuration Example 46] The method according to Example 44, wherein the polymer layer has a thickness of 500 μm or less. [Configuration Example 47] The method according to Example 33, further comprising the step of applying a layer of a preceramic polymer, ceramic, metal oxide composite, polymer, metal oxide particles, nitride, or boride. [Configuration Example 48] The method according to Configuration Example 44, further comprising the step of applying a metal oxide layer on the surface of the catalyst material before the step of applying the polymer layer. [Configuration Example 49] The method according to Configuration Example 33, further comprising the step of applying a layer of organic material with a thickness of 1 μm or less to the catalyst material before applying the metal foil to the substrate, thereby roughening the surface of the metal foil. [Configuration Example 50] The method according to configuration example 49, wherein the surface of the metal foil is roughened by etching. [Configuration Example 51] The method according to Example 49, wherein the catalyst material is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or combinations thereof. [Configuration Example 52] The method according to Configuration Example 49, wherein the catalyst material has a thickness of 100 nm or less. [Configuration Example 53] The method according to Example 50, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 54] The method according to Example 53, wherein the copolymer has a functional group having a lone pair of electrons. [Configuration Example 55] The method according to Example 54, wherein the functional group comprises one of nitrogen or sulfur. [Configuration Example 56] The method according to Example 53, wherein the alkali-reactive polymer comprises at least one of polyimide, amide, ester, or thioester. [Configuration Example 57] The copolymer is the method according to Example 53, wherein the composition of the alkali-reactive polymer to the alkali-non-reactive polymer is between 5%:95% and 95%:5% in terms of molecular weight. [Configuration Example 58] The method according to Configuration Example 49, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. [Configuration Example 59] The method according to Configuration Example 49, wherein the organic material is selected to have at least 30% higher adhesion to the substrate than the adhesion of the catalyst material to the substrate. [Configuration Example 60] The coating step involves coating a portion of a metal foil with a catalytic ink, wherein the catalytic ink includes a precursor dissolved in a solvent. The steps include drying the coating of the catalyst ink, A step of reducing the catalyst precursor to deposit the catalyst on a portion of the metal foil, wherein the metal foil is removable, and the deposit step A method for manufacturing metal foil, including [a specific component]. [Configuration Example 61] The method according to Example 60, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 62] The method according to configuration example 60, wherein a portion of the metal foil is oxidized. [Configuration Example 63] The method according to Example 60, wherein the metal foil has a thickness of less than 500 μm. [Configuration Example 64] The method according to configuration example 60, wherein a portion of the metal foil has an Ra of at least 0.1 μm. [Configuration Example 65] The method according to Example 60, wherein the catalyst is at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. [Configuration Example 66] The method according to Configuration Example 60, wherein the catalyst is arranged as a layer having a thickness between the atomic radius of the catalyst components and 500 μm. [Configuration Example 67] The method according to Configuration Example 60, wherein the catalyst is arranged as a plurality of particles having an average radius between the atomic radius of the catalyst components and 500 nm. [Configuration Example 68] The method according to Example 60, wherein the step of coating the catalyst ink includes at least one of dip coating, roller coating, spray coating, spinner coating, gravure coating, flexographic coating, bar coating, comma coating, inkjet printing, curtain coating, slot die coating, or screen printing. [Configuration Example 69] The method according to configuration example 60, wherein the portion of the metal foil is one complete surface of the metal foil. [Configuration Example 70] The method according to Example 60, further comprising the step of applying a polymer layer onto the surface of the dried catalyst ink coating. [Configuration Example 71] The method according to Configuration Example 60, further comprising the step of applying a polymer layer onto the surface of the catalyst. [Configuration Example 72] The method according to Example 71, wherein the polymer layer has a thickness of 500 μm or less. [Configuration Example 73] The method according to Configuration Example 60, further comprising the step of applying a metal oxide layer onto the surface of the catalyst. [Configuration Example 74] The method according to Configuration Example 71, further comprising the step of applying a metal oxide layer onto the surface of the polymer layer. [Configuration Example 75] The method according to Example 60, further comprising the step of applying an organic material with a thickness of 1 μm or less to the catalyst, wherein a portion of the metal foil is roughened. [Configuration Example 76] The method according to configuration example 75, wherein a portion of the metal foil is roughened by etching. [Configuration Example 77] The method according to Example 75, wherein the catalyst is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or combinations thereof. [Configuration Example 78] The method according to Configuration Example 75, wherein the catalyst has a thickness of 100 nm or less. [Configuration Example 79] The method according to Example 75, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 80] The method according to Example 79, wherein the copolymer has a functional group having a lone pair of electrons. [Configuration Example 81] The method according to Example 80, wherein the functional group comprises one of nitrogen or sulfur. [Configuration Example 82] The method according to Example 79, wherein the alkali-reactive polymer comprises at least one of polyimides, amides, esters, or thioesters. [Configuration Example 83] The copolymer is the method according to Example 79, wherein the composition of the alkali-reactive polymer to the alkali-non-reactive polymer is between 5%:95% and 95%:5% in terms of molecular weight. [Configuration Example 84] The method according to Configuration Example 75, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. [Configuration Example 85] The method according to configuration example 75, wherein the organic material restricts the diffusion of the catalyst. [Configuration Example 86] The method according to Configuration Example 75, wherein the organic material is selected to have at least 30% higher adhesion to the substrate than the adhesion of the catalyst to the substrate. [Configuration Example 87] A method for forming an electrical circuit using a metal foil having a surface on which a catalyst material is supported, The steps include depositing a coating layer on the surface of the metal foil supporting the catalyst material, The steps include applying the surface of the metal foil on which the catalyst material and the coating layer are supported to the surface of the substrate, The steps include laminating the aforementioned metal foil onto the substrate, The steps include etching the metal foil to expose the catalyst material, The process includes the step of electrolessly metal-plating a first conductor onto the exposed catalyst material, The aforementioned metal foil is removable. The aforementioned method. [Configuration Example 88] The method according to Configuration Example 87, wherein the coating layer comprises at least one of a B-stage epoxy or a thermoplastic material. [Configuration Example 89] The method according to Example 87, wherein the catalyst material is (i) a catalyst precursor for at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalytic Ag, catalytic Au, catalytic Pt, catalytic Pd, catalytic Cu, catalytic Ni, catalytic Co, or catalytic Rh. [Configuration Example 90] The method according to Configuration Example 89, wherein the catalyst precursor is reduced to a catalyst before the step of applying the surface of the metal foil to the surface of the substrate. [Configuration Example 91] The method according to Configuration Example 89, wherein after the step of etching the metal foil, the catalyst precursor is reduced to a catalyst. [Configuration Example 92] Prior to the electroless metal plating step, the step of applying a plating resist in the form of a negative circuit pattern to the exposed catalyst material, A step to remove the plating resist after the electroless metal plating step and The method described in Example 87, further including the method described in Example 87. [Configuration Example 93] Before the electroless metal plating step, The steps include applying an etching resist with a positive circuit pattern onto the exposed catalyst material, The steps include etching the catalyst material that is not covered by the etching resist, The step of removing the etching resist and The method described in Example 87, further including the method described in Example 87. [Configuration Example 94] The steps include applying a plating resist to the first conductor in a negative circuit pattern, The steps include electrolytically depositing a second conductor onto the exposed portion of the first conductor, The step of removing the aforementioned plating resist, The steps of removing the portion of the first conductor that is not covered by the second conductor and The method described in Example 87, further including the method described in Example 87. [Configuration Example 95] The method according to Configuration Example 87, further comprising the step of applying a permanent plating resist in a negative circuit pattern onto the exposed catalyst material before the electroless metal plating step. [Configuration Example 96] After the electroless plating step, The steps include electrodepositing a second conductor onto the first conductor, The steps include applying an etching resist in the form of a positive circuit pattern on the second conductor, The steps include etching the first conductor and the second conductor that are not covered by the etching resist, The step of removing the etching resist and The method described in Example 87, further including the method described in Example 87. [Configuration Example 97] The method according to Example 87, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 98] The method according to configuration example 87, further comprising the step of applying an adhesive layer between the surface of the metal foil supporting the catalyst material and the surface of the substrate. [Configuration Example 99] The method according to Configuration Example 87, wherein the coating layer includes a polymer. [Configuration Example 100] The method according to Configuration Example 87, wherein the step of laminating the metal foil onto the substrate includes laminating the coating layer onto the bonding sheet. [Configuration Example 101] The method according to Example 87, wherein the coating layer has a thickness of 500 μm or less. [Configuration Example 102] The method according to Example 87, wherein the coating layer comprises a preceramic polymer, a ceramic or composite of metal oxides, a polymer, metal oxide particles, a nitride, or a boride. [Configuration Example 103] The method according to Configuration Example 102, further comprising the step of coating the aforementioned coating layer with a polymer layer. [Configuration Example 104] The method according to Example 87, wherein the coating layer contains an organic material with a thickness of 1 μm or less, and the surface of the metal foil is roughened. [Configuration Example 105] The method according to configuration example 104, wherein the surface of the metal foil is roughened by etching. [Configuration Example 106] The method according to Configuration Example 104, wherein the catalyst is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or combinations thereof. [Configuration Example 107] The method according to Configuration Example 104, wherein the catalyst material has a thickness of 100 nm or less. [Configuration Example 108] The method according to Example 104, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 109] The method according to Example 108, wherein the copolymer has a functional group having a lone pair of electrons. [Configuration Example 110] The method according to Example 109, wherein the functional group comprises one nitrogen or sulfur. [Configuration Example 111] The method according to Example 108, wherein the alkali-reactive polymer comprises at least one of polyimide, amide, ester, or thioester. [Configuration Example 112] The copolymer is the method according to Example 108, wherein the composition of the alkali-reactive polymer to the alkali-non-reactive polymer is between 5%:95% and 95%:5% in terms of molecular weight. [Configuration Example 113] The method according to Configuration Example 104, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. [Configuration Example 114] The method according to Configuration Example 105, wherein the organic material is selected to have at least 30% higher adhesion to the substrate than the adhesion of the catalyst material to the substrate.

Claims

1. A metal foil having a surface, A catalyst material layer disposed on a part of the surface of the metal foil, wherein the metal foil is removable. The aforementioned metal foil.

2. The metal foil according to claim 1, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof.

3. The metal foil according to claim 1, wherein a portion of the surface of the metal foil is oxidized or roughened.

4. The metal foil according to claim 1, wherein the catalyst material comprises a catalyst precursor for one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh.

5. The metal foil according to claim 1, wherein the catalyst material is made from one or more catalytic precursors.

6. The metal foil according to claim 5, wherein one or more catalytic precursors are applied in ink form.

7. The metal foil according to claim 1, wherein a coating layer comprising at least one of a B-stage epoxy or thermoplastic material is disposed on the catalyst material.

8. The metal foil according to claim 1, wherein a coating layer containing a laminated material is disposed on the catalyst material.

9. The metal foil according to claim 3, further comprising a layer of organic material with a thickness of 1 μm or less disposed on the catalyst material layer, wherein the surface of the metal foil is roughened.

10. The metal foil according to claim 9, wherein the surface of the metal foil is roughened by etching.

11. The metal foil according to claim 9, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer.

12. The metal foil according to claim 11, wherein the copolymer has a functional group having a lone pair of electrons.

13. The metal foil according to claim 12, wherein the functional group comprises one of nitrogen or sulfur.

14. The metal foil according to claim 11, wherein the alkali-reactive polymer comprises at least one of polyimide, amide, ester, or thioester.

15. The metal foil according to claim 11, wherein the copolymer has a composition of the alkali-reactive polymer versus the alkali-non-reactive polymer that is between 5%:95% and 95%:5% in terms of molecular weight.

16. The metal foil according to claim 9, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes.

17. The coating step involves coating a portion of a metal foil with a catalytic ink, wherein the catalytic ink includes a precursor dissolved in a solvent. The steps include drying the coating of the catalyst ink, A step of reducing the catalyst precursor to deposit the catalyst on a portion of the metal foil, wherein the metal foil is removable, and the deposit step A method for manufacturing metal foil, including [a specific component].

18. The method according to claim 17, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof.

19. The method according to claim 17, wherein a portion of the metal foil is oxidized.

20. The method according to claim 17, wherein the step of coating the catalyst ink includes at least one of dip coating, roller coating, spray coating, spinner coating, gravure coating, flexographic coating, bar coating, comma coating, inkjet printing, curtain coating, slot die coating, or screen printing.

21. The method according to claim 17, wherein the portion of the metal foil is one complete surface of the metal foil.

22. The method according to claim 17, further comprising the step of applying a polymer layer onto the surface of the catalyst.

23. The method according to claim 17, further comprising the step of applying an organic material with a thickness of 1 μm or less to the catalyst, wherein a portion of the metal foil is roughened.

24. The method according to claim 23, wherein a portion of the metal foil is roughened by etching.

25. The method according to claim 23, wherein the catalyst is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or combinations thereof.

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