Thermal conductive sheet, and method for manufacturing a thermal conductive sheet

The thermal conductive sheet with deformable protrusions on a metal layer addresses cracking and stress issues, ensuring efficient heat dissipation and reliability by enhancing adhesion and thermal conductivity.

JP2026063982APending Publication Date: 2026-04-13DEXERIALS CORP
1 Cites -1 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DEXERIALS CORP
Filing Date
2024-10-01
Publication Date
2026-04-13

AI Technical Summary

Technical Problem

Conventional thermal conductive sheets face issues with cracking during reliability tests due to uniform bonding agent adhesion, require high-pressure pressing, and fail to relieve stress, leading to poor reliability and thermal conductivity.

Method used

A thermal conductive sheet with protrusions on a metal layer containing sinterable metal particles, having an aspect ratio of 0.2 or more, and a contact area of 20% or more, which are deformable to relieve stress and enhance adhesion, ensuring high thermal conductivity and reliability.

Benefits of technology

The sheet effectively dissipates heat while relieving stress, reducing peeling and lifting, and providing excellent adhesion, thus achieving both high thermal conductivity and reliability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026063982000001_ABST
    Figure 2026063982000001_ABST
Patent Text Reader

Abstract

To provide a thermal conductive sheet that can relieve stress in response to applied pressure, while simultaneously achieving reliability and high thermal conductivity. [Solution] A thermal conductive sheet having a metal layer and a plurality of protrusions on at least a first surface of the metal layer, wherein the protrusions contain sinterable metal particles.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Heated bonding material stuck with bond essentially consisting of metal nanoparticle and second metal particle, and electric apparatus bonding method

    JP2023038748A