Electrical connection unit

Abstract

One embodiment provides an electrical connection unit that can improve heat dissipation. [Solution] An electrical connection unit of one embodiment comprises an electronic component, an insulating base member having a plate-like or sheet-like planar portion including a first surface facing the electronic component and a second surface facing the opposite side of the first surface, a busbar supported on the planar portion and electrically connected to the electronic component, a heat dissipation member facing the second surface and to which the base member is fixed, and a plurality of fins thermally connected to the heat dissipation member, wherein the planar portion has fin holes penetrating from the first surface to the second surface, and the plurality of fins protrude from the fin holes in a position aligned with the electronic component.

Description

Technical Field

[0001] Embodiments of the present invention relate to an electrical connection unit.

Background Art

[0002] An electrical connection unit having an electronic component and a bus bar electrically connected to the electronic component is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, improvement in heat dissipation is expected for the electrical connection unit.

[0005] One embodiment provides an electrical connection unit capable of improving heat dissipation.

Means for Solving the Problems

[0006] An electrical connection unit according to one embodiment includes an insulating base member having a plate-shaped or sheet-shaped planar portion including an electronic component, a first surface facing the electronic component, and a second surface facing the opposite side of the first surface, a bus bar supported by the planar portion and electrically connected to the electronic component, a heat dissipation member facing the second surface to which the base member is fixed, and a plurality of fins thermally connected to the heat dissipation member. The planar portion has fin holes penetrating from the first surface to the second surface, and the plurality of fins protrude from the fin holes to a position aligned with the electronic component.

Effects of the Invention

[0007] According to one embodiment, heat dissipation can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] A cross-sectional view showing an electrical connection unit of an embodiment. [Figure 2] A perspective view illustrating the main body of the embodiment. [Figure 3] A perspective view illustrating one subunit of an embodiment. [Figure 4] A perspective view showing the electronic components and connecting components of the embodiment. [Figure 5] A perspective view illustrating the wiring substrate of the embodiment. [Figure 6] A perspective view showing a partially disassembled wiring substrate of the embodiment. [Figure 7] Cross-sectional view of the electrical connection unit on the F7-F7 line shown in Figure 3. [Figure 8] Cross-sectional view of the electrical connection unit on the F8-F8 line shown in Figure 3. [Figure 9] Figure 3 shows an enlarged view of the electrical connection unit in F9. [Figure 10] Figure 9 shows a cross-sectional view of the electrical connection unit on the F10-F10 line. [Figure 11] Figure 3 shows an enlarged view of a modified electrical connection unit in F9. [Modes for carrying out the invention]

[0009] The embodiments will be described below with reference to the drawings. In the following description, components having the same or similar functions will be denoted by the same reference numerals. Duplication of these components may be omitted. The components described below do not limit the scope of the embodiments.

[0010] In this disclosure, terms are defined as follows: “Connection” may include electrical connections, not just mechanical ones. That is, “Connection” may include cases where two elements to be connected are directly connected, not just cases where two elements to be connected are connected with another element in between. “Accommodation” may include cases where only a part of a part is accommodated, not just cases where the entire part is accommodated (with another part of the part protruding). “Facing” means that the virtual projections of two objects overlap when viewed from a particular direction. That is, “Facing” may include cases where two objects face each other with another member present between them, not just cases where two objects face each other. “Parallel,” “orthogonal,” or “same” may include cases where they are “approximately parallel,” “approximately orthogonal,” or “approximately the same,” respectively.

[0011] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows: The +X direction is the direction from the first end 110e1 to the second end 110e2 of the metal plate 110, which will be described later (see Figure 2). The -X direction is the direction opposite to the +X direction. Hereinafter, when the +X direction and the -X direction are not distinguished, they will simply be referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (e.g., are orthogonal to) the X direction. The +Y direction is the direction from the third end 110e3 to the fourth end 110e4 of the metal plate 110, which will be described later (see Figure 2). The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and the -Y direction are not distinguished, they will simply be referred to as the "Y direction". The +Z direction and the -Z direction are directions that intersect (e.g., are orthogonal to) the X direction and the Y direction. The +Z direction is the direction from the metal plate 110 (described later) toward the main body MU (see Figure 2). The -Z direction is the opposite direction to the +Z direction. Hereafter, if the +Z direction and the -Z direction are not distinguished, they will simply be referred to as the "Z direction". The Z direction is an example of the "first direction". The Y direction is an example of the "second direction". The X direction is an example of the "third direction".

[0012] Hereinafter, when the X direction and the Y direction are not distinguished, it may be referred to as the "horizontal direction". Hereinafter, the Z direction may be referred to as the "vertical direction". Also hereinafter, the +Z direction side may be referred to as "up" and the -Z direction side may be referred to as "down". However, these expressions are for convenience of explanation and do not limit the gravitational direction (installation posture of the electrical connection unit 1).

[0013] (Embodiment) <1. Configuration of Electrical Connection Unit> FIG. 1 is a cross-sectional view showing the electrical connection unit 1 of the embodiment. The electrical connection unit 1 is an in-vehicle device mounted on a vehicle such as an EV (Electric Vehicle), HEV (Hybrid Electric Vehicle), or PHEV (Plug-in Hybrid Electric Vehicle). The electrical connection unit 1 may be referred to as, for example, an "electrical connection box" or a "junction box". However, the electrical connection unit 1 is not limited to a box-shaped device.

[0014] The electrical connection unit 1 has, for example, a housing 5, a main body portion MU, a metal plate 110, a plurality of heat transfer members 120 (see FIG. 2), a plurality of fins 90, and a plurality of insulating covers 130 (see FIG. 2).

[0015] <2. Housing> First, the housing 5 will be described. The housing 5 forms the outer shell of the electrical connection unit 1. The housing 5 includes, for example, a base 6 (first member) and a cover 7 (second member). The base 6 is a member that covers the main body portion MU and the metal plate 110 from below. The base 6 is, for example, plate-shaped along the horizontal direction or bowl-shaped with the +Z direction open. The base 6 is, for example, made of synthetic resin. The cover 7 is a member that covers the main body portion MU and the metal plate 110 from above. The base 6 is, for example, bowl-shaped with the -Z direction open. The cover 7 is, for example, made of synthetic resin. In the present embodiment, the base 6 and the cover 7 are combined to form a box-shaped housing 5. Note that the shape of the housing 5 is not limited to the above example. For example, the metal plate 110 described later may function as part or all of the base 6. Also, the housing 5 may be omitted.

[0016] In the present embodiment, the electrical connection unit 1 includes a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region that emphasizes heat dissipation. In the first region R1, for example, electronic components 10S with a large heat generation amount are arranged. On the other hand, the second region R2 is a region that emphasizes mountability. In the second region R2, for example, electronic components 10T that have a smaller heat generation amount compared to the electronic components 10S and / or require a more complex mounting structure compared to the electronic components 10S are arranged. However, these contents do not limit the content of the electrical connection unit 1 of the present disclosure. For example, the heat generation amount of the electronic components 10T may be larger than the heat generation amount of the electronic components 10S.

[0017] <3. Main Body Portion> Next, the main body portion MU will be described. Figure 2 is a perspective view illustrating the main body MU. The main body MU is the part of the electrical connection unit 1 that performs the main function (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed, for example, by connecting a plurality of subunits SU. In this embodiment, the main body MU has two subunits SU (subunits SUS and SUT). Each subunit SU may be referred to as a "circuit configuration".

[0018] The subunit SUS has a primary electrical function. The subunit SUS includes, for example, a plurality of electronic components 10S and a wiring substrate 40S. The plurality of electronic components 10S are electrically connected to the wiring substrate 40S. The base plate 41S (described later) included in the subunit SUS is an example of a "first base member".

[0019] The subunit SUT has a second electrical function. This second function is, for example, a function different from the first function. The subunit SUT includes, for example, a plurality of electronic components 10T and a wiring structure 40T. The plurality of electronic components 10T are electrically connected to the wiring structure 40T. The base member 41T (described later) included in the subunit SUT is an example of a "second base member".

[0020] In this embodiment, the subunit SUS is a subunit SU that prioritizes heat dissipation. The subunit SUS is positioned in the first region R1 of the electrical connection unit 1 described above. The subunit SUS faces the first region A1 of the metal plate 110, which will be described later, in the Z direction.

[0021] On the other hand, subunit SUT is a subunit SU that prioritizes ease of mounting. Subunit SUT is positioned, for example, on the +Y direction side with respect to subunit SUS. Subunit SUT is positioned in the second region R2 of the electrical connection unit 1 described above. Subunit SUT faces the second region A2 of the metal plate 110, which will be described later, in the Z direction. Hereafter, when electronic component 10S and electronic component 10T are not distinguished, they will simply be referred to as "electronic component 10".

[0022] The main body MU does not have to be divided into multiple subunits SU, as in the example described above. For example, the multiple subunits SU may be formed as a single unit. For example, the base plate 41S of the cable routing substrate 40S and the base member 41T of the cable routing structure 40T may be formed as a single unit from one piece of material. The base member 41T of the cable routing structure 40T has a three-dimensional structure that is thicker in the Z direction than the base plate 41S of the cable routing substrate 40S. Also, if the cable routing substrate 40S and the cable routing structure 40T are not distinguished, the cable routing substrate 40S and the cable routing structure 40T may simply be referred to as "cable routing structure 40".

[0023] <4. Configuration of Subunit SUS> Next, we will explain the configuration of the subunit SUS. Figure 3 is a perspective view illustrating a subunit SUS. The subunit SUS includes, for example, a plurality of electronic components 10, a plurality of connecting components 20, and a wiring substrate 40S. The connecting components 20 are members that form vertical electrical circuits. The connecting components 20 may also be referred to as "vertical wiring members."

[0024] <4.1 Electronic Components> First, let's describe the electronic components 10. The electronic components 10 are electronic components that are mounted in each subunit SU according to the required functions. The electronic components 10 may be, for example, connectors, fuses, relays (e.g., mechanical relays or semiconductor relays), capacitors, branching components, various sensors (e.g., current sensors or voltage sensors), electronic control units, or electronic component units that combine two or more of these. However, the types of electronic components 10 are not limited to the examples above. The electronic components 10 may be, for example, heat-generating components that generate heat when energized.

[0025] In this embodiment, the multiple electronic components 10 include electronic components 10S that generate a relatively large amount of heat when energized. The electronic components 10S are relays (e.g., mechanical relays or semiconductor relays), pyrofuses, or current sensors (e.g., current sensors with shunt resistors). However, the type of electronic component 10S is not limited to the above examples.

[0026] Figure 4 is a perspective view showing an electronic component 10S and a connecting component 20. The electronic component 10S is, for example, an electronic component in which a plurality of terminals 13 are arranged in a row at one end of the electronic component 10S. The electronic component 10S has, for example, a case 11, a component body 12, a plurality of terminals 13, and a plurality of mounting parts 14.

[0027] (case) The case 11 is an outer casing that forms most of the external shape of the electronic component 10S. The case 11 is made of, for example, synthetic resin and has insulating properties. The case 11 houses the component body 12. The case 11 and the component body 12 may be formed as a single unit.

[0028] In this embodiment, the case 11 has insulating ribs 11a that protrude horizontally (e.g., in the Y direction) and extend in the Z direction. The insulating ribs 11a are, for example, plate-shaped and aligned horizontally (e.g., in the Y direction) and in the Z direction. The insulating ribs 11a extend, for example, along the entire length of the case 11 in the Z direction. The insulating ribs 11a are positioned between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating ribs 11a electrically insulate terminals 13A and 13B. In this embodiment, a portion of the insulating ribs 11a is positioned between the first portions 21 (described later) of two connecting components 20 connected to the electronic component 10S. The insulating ribs 11a electrically insulate the first portions 21 of the two connecting components 20 connected to the electronic component 10S.

[0029] (Main body of the component) The main body of the component 12 is the part that performs the main function of the electronic component 10S. For example, if the electronic component 10S is a relay, the main body of the component 12 includes a switching part (e.g., a contact part) that switches between a conductive state and a non-conductive state. For example, if the electronic component 10S is a fuse, the main body of the component 12 includes a fuse that melts when an overcurrent flows. For example, if the electronic component 10S is a capacitor, the main body of the component 12 includes a part that stores electric charge.

[0030] (Terminals) Terminal 13 is an electrical connection part exposed to the outside of case 11. Terminal 13 is electrically connected to the component body 12 inside case 11. In this embodiment, the electronic component 10S includes terminals 13A and terminal 13B as a plurality of terminals 13. One of terminals 13A and terminal 13B is the positive terminal. The other of terminals 13A and terminal 13B is the negative terminal. One of terminals 13A and terminal 13B is an example of a "first terminal". The other of terminals 13A and terminal 13B is an example of a "second terminal".

[0031] In this embodiment, terminals 13A and 13B are provided at one end of the electronic component 10S in the horizontal direction (e.g., the Y direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the X direction). Each of terminals 13A and 13B faces in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h into which a fastening member 71 (e.g., a screw or bolt), described later, is attached. The mounting hole 13h opens in the horizontal direction (e.g., the Y direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10S has a screw groove.

[0032] (Mounting part) The mounting portion 14 is a part for fixing the electronic component 10S. The mounting portion 14 has a mounting hole 14h into which a fastening member 116 (for example, a screw or bolt, see Figure 3) is attached. The mounting hole 14h opens in the Z direction. The mounting hole 14h is a through hole through which the fastening member 116 passes. The destination for fixing the mounting portion 14 will be described later.

[0033] <4.2 Connecting Components> Next, the connecting component 20 will be described. The connecting component 20 is a component that electrically connects the electronic component 10S and the wiring substrate 40S. The connecting component 20 forms part of the current-carrying circuit in the subunit SUS. The connecting component 20 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The connecting component 20 may also be referred to as a "metal component".

[0034] In this embodiment, the connecting component 20 electrically connects the electronic component 10S to the busbar 42 (see Figure 3) included in the routing substrate 40S. In this embodiment, the length L12 of the connecting component 20 in the longitudinal direction (e.g., Y direction) of the electronic component 10S is smaller than the longitudinal length L11 of the electronic component 10S. The connecting component 20 has, for example, a first portion 21 and a second portion 22.

[0035] (Part 1) The first part 21 of the connecting component 20 is the part that connects to the terminal 13 of the electronic component 10S. The first part 21 is a plate-like or rectangular parallelepiped-shaped part that extends in the Z direction. The first part 21 extends in the Z direction along one end of the electronic component 10S (for example, the end in the Y direction). The first part 21 is an upright part that stands upright in the Z direction relative to the routing substrate 40S (for example, relative to the bus bar 42 described later). The first part 21 is adjacent to the electronic component 10S in the horizontal direction (for example, the Y direction). For example, the first part 21 is adjacent to the terminal 13 of the electronic component 10S in the horizontal direction (for example, the Y direction) and is connected to the terminal 13 of the electronic component 10S from the horizontal direction (for example, the Y direction).

[0036] The first portion 21 of the connecting part 20 has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) is passed. The first mounting hole 21h opens horizontally (e.g., in the Y direction). The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10S by the fastening member 71 passed through the first mounting hole 21h engaging with the mounting hole 13h of the terminal 13 of the electronic component 10S.

[0037] (Second part) The second portion 22 of the connecting component 20 is the portion that connects to the bus bar 42 (see Figure 3). The second portion 22 protrudes horizontally (e.g., in the Y direction) from the -Z direction end of the first portion 21. The second portion 22 is a plate portion that runs horizontally. The second portion 22 is adjacent to the bus bar 42 in the Z direction and connects to the bus bar 42 from the Z direction. The second portion 22 of the connecting component 20 is attached from the Z direction to a fastening member 43 (e.g., a screw or bolt, see Figure 3) that protrudes from the bus bar 42 in the +Z direction, and is physically and electrically connected to the bus bar 42. In this embodiment, the second portion 22 of the connecting component 20 has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second portion 22 has the fastening member 43 passed through the second mounting hole 22h. Then, the second portion 22 is fixed to the busbar 42 by engaging the tip of the fastening member 43, which is passed through the second mounting hole 22h, with the engaging member 44 (for example, a nut, see Figure 3). In this embodiment, the first portion 21 and the second portion 22 form an L-shaped single connecting component 20.

[0038] In this embodiment, the busbar 42 is positioned at a distance from the terminal 13 of the electronic component 10S (for example, at a distance in the Z direction). The connecting component 20 is positioned between the electronic component 10S and the busbar 42. In this disclosure, "the connecting component is positioned between the electronic component and the busbar" is not limited to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting component is positioned between the electronic component and the busbar" may also refer to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X or Y direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10S and the busbar 42.

[0039] <4.3 Circuit board for cable routing> Next, we will explain the wiring substrate 40S. Figure 5 is a perspective view illustrating the cable routing substrate 40S. The cable routing substrate 40S is a member that forms at least a portion of the electrical conduction path between a plurality of electronic components 10 (e.g., a plurality of electronic components 10S), and / or at least a portion of the electrical conduction path between an electronic component 10 (e.g., electronic component 10S) included in a subunit SUS and an electronic component 10 included in another subunit SU (e.g., subunit SUT). In this disclosure, "cable routing substrate" means a substrate-type cable routing structure. "Substrate-type" means that, when viewed as a whole, regardless of the fine shape, it is in the shape of a plate along a single plane. In this disclosure, "plate-like," "sheet-like," or "plane" is not limited to cases where it is perfectly flat, but may include cases where there are fixing structures or ribs protruding in the Z direction, or where there are uneven shapes on the surface that follow the thickness of the busbar. In this embodiment, the cable routing substrate 40S is in the shape of a plate along the X and Y directions.

[0040] The cable routing substrate 40S includes, for example, a base plate 41S, one or more (e.g., multiple) bus bars 42, and multiple fastening members 43. In this embodiment, the base plate 41S and the multiple bus bars 42 are integrated by insert molding. For example, the cable routing substrate 40S is formed as a single piece by insert molding of the bus bars 42 with the base plate 41S after the fastening members 43 have been fixed to the bus bars 42. That is, the bus bars 42 are integrated with the base plate 41S without using fastening members such as screws or bolts. The cable routing substrate 40S may be formed by a different structure instead of insert molding. Modified examples in which the cable routing substrate 40S is formed by a different structure will be described later.

[0041] Figure 6 is a perspective view showing a partially disassembled wiring substrate 40S. For convenience of explanation, the base plate 41S, bus bar 42, and fastening member 43 will be described below with reference to a drawing of the partially disassembled wiring substrate 40S.

[0042] <4.3.1 Base Plate> The base plate 41S is a support member that integrally supports a plurality of busbars 42 arranged horizontally with spacing between them. The base plate 41S is made of, for example, synthetic resin and has insulating properties. The base plate 41S electrically insulates the plurality of busbars 42. The base plate 41S is an example of a "base member". The base plate 41S may also be called an "insulating substrate". The base plate 41S has, for example, a flat portion 51, a frame portion 52, and a plurality of fixing portions 53 (see Figure 8).

[0043] (Plane part) The flat portion 51 is a plate-shaped part formed within the base plate 41S. The flat portion 51 is plate-shaped and oriented horizontally. The flat portion 51 forms the main part of the base plate 41S. The flat portion 51 forms the base (insulating base) of the base plate 41S. In this embodiment, the flat portion 51 extends across the entire width of the base plate 41S in the X direction and across the entire width of the base plate 41S in the Y direction, excluding the frame portion 52 of the base plate 41S.

[0044] The planar portion 51 has a first surface 51a and a second surface 51b (see Figure 8). The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a plane that aligns with the horizontal direction. The first surface 51a faces a plurality of electronic components 10 (for example, a plurality of electronic components 10S). The second surface 51b is located on the opposite side from the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a plane that aligns with the horizontal direction. The second surface 51b faces the metal plate 110 (see Figure 2). The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction. In this embodiment, the thickness T11 of the planar portion 51 in the Z direction is smaller than the thickness T1 of the busbar 42 in the Z direction (for example, the thickness of the horizontal plate portion 42p described later in the Z direction) (see Figure 8). The thickness T11 of the flat portion 51 in the Z direction may be the same as the thickness T1 of the busbar 42 in the Z direction, or it may be greater than the thickness T1 of the busbar 42 in the Z direction.

[0045] The planar portion 51 has, for example, one or more (e.g., multiple) housing portions 55, each of which accommodates a busbar 42. The multiple housing portions 55 are formed apart from each other in the X or Y direction. Each housing portion 55 is, for example, a through hole that penetrates the planar portion 51 in the Z direction. Alternatively, the housing portion 55 may be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction. In this disclosure, "the housing portion penetrates the planar portion in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 penetrates the planar portion 51 in the Z direction (for example, the remaining portion of the housing portion 55 may be a recess recessed in the Z direction, or it may be provided inside the base plate 41S and not exposed to the outside of the base plate 41S). Similarly, in this disclosure, "the housing portion is recessed in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 is recessed in the Z direction (for example, the remaining portion of the housing portion 55 may be a through hole penetrating the planar portion 51 in the Z direction, or it may be provided inside the base plate 41S and not exposed to the outside of the base plate 41S).

[0046] Each housing section 55 has an external shape that corresponds to the shape of the bus bar 42 it houses when viewed from the Z direction. A plurality of housing sections 55 may include, for example, four housing sections 55A, 55B, 55C, and 55D. Housing section 55A is provided in correspondence with bus bar 42A, which will be described later, and houses at least a portion of bus bar 42A. Housing section 55B is provided in correspondence with bus bar 42B, which will be described later, and houses at least a portion of bus bar 42B. Housing section 55C is provided in correspondence with bus bar 42C, which will be described later, and houses at least a portion of bus bar 42C. Housing section 55D is provided in correspondence with bus bar 42D, which will be described later, and houses at least a portion of bus bar 42D.

[0047] The flat portion 51 has fin holes 56, separate from the housing portion 55. The fin holes 56 penetrate in the Z direction from the first surface 51a to the second surface 51b.

[0048] The fin holes 56 are located near the nearest electronic component 10S among the multiple electronic components 10S. Viewed from the Z direction, the fin holes 56 are located next to the nearest electronic component 10S among the multiple electronic components 10S. Viewed from the Z direction, the fin holes 56 may be located next to the nearest electronic component 10S on the +X side, for example, as shown in Figure 5. Viewed from the Z direction, the distance between the fin holes 56 and the nearest electronic component 10S may be smaller than, for example, the width of the nearest electronic component 10S in the direction of alignment (e.g., the X direction). Viewed from the Z direction, the distance between the fin holes 56 and the nearest electronic component 10S may be smaller than, for example, half the width of the electronic component 10S in the direction of alignment (e.g., the X direction).

[0049] Viewed from the Z direction, the fin holes 56 may have, for example, a rectangular opening. The fin holes 56 are open so that multiple fins 90 can pass through in the Z direction. The rectangular shape of the fin holes 56 may be larger than, for example, a rectangle in the XY plane that circumsects and surrounds multiple fins 90 together.

[0050] (Frame) The frame portion 52 is provided at the peripheral end of the base plate 41S. The frame portion 52 is a reinforcing rib that protrudes vertically from the end of the flat portion 51 (see Figure 7). The width (thickness) H11 of the frame portion 52 in the Z direction is, for example, less than half of the width (thickness) H12 of the electronic component 10 in the Z direction (see Figure 7). Note that the frame portion 52 may be omitted.

[0051] (fixed part) The fixing portion 53 is the part that is fixed to the metal plate 110 (see Figure 8). The fixing portion 53 has a mounting hole 53h that penetrates the base plate 41S in the Z direction. A fastening member 115 (for example, a screw or bolt), which will be described later, is passed through the mounting hole 53h.

[0052] <4.3.2 Busbar> The busbar 42 is a routing member (electrical connection member) included in the routing substrate 40S. The busbar 42 is, for example, a routing member for electrically connecting multiple electronic components (e.g., multiple electronic components 10S). Alternatively, the busbar 42 may be a routing member for electrically connecting an electronic component 10 (e.g., electronic component 10S) to an electronic component 10 included in another subunit SU (e.g., subunit SUT). The busbar 42 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy) and is conductive. As shown in Figure 3, this embodiment includes multiple busbars 42, for example, four busbars 42A, 42B, 42C, and 42D. The four busbars 42A, 42B, 42C, and 42D are arranged horizontally with space between them. The four busbars 42A, 42B, 42C, and 42D include portions that are arranged on the same plane. The four busbars 42A, 42B, 42C, and 42D are supported by the flat portion 51 of the base plate 41S. In this disclosure, "the busbars are supported by the flat portion" is not limited to the case where the busbars 42 are housed in the housing portion 55, but may also include cases where the busbars 42 are attached to the first surface 51a or the second surface 51b of the flat portion 51.

[0053] As shown in Figures 5 and 6, at least a portion of each busbar 42 is plate-shaped and extends horizontally. At least a portion of each busbar 42 is housed in the housing 55 and extends along the planar portion 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing 55. Hereinafter, the portion of each busbar 42 that extends horizontally in a plate-like shape may be referred to as the "horizontal plate portion 42p". The horizontal plate portion 42p is an example of a "plate portion". The busbar 42 is a member that forms a horizontal electrical circuit. The busbar 42 may also be referred to as a "horizontal wiring member".

[0054] Each busbar 42 has, for example, a connector 61, a connector 62, and an extension 63. The connector 61 is located in the middle of the busbar 42 or at the first end of the busbar 42. The connector 61 is the portion that connects directly or via a connector 20 to an electronic component 10 (e.g., electronic component 10S). The connector 61 includes, for example, a portion that overlaps with the connector 20 when viewed from the Z direction. The connector 61 is adjacent to the connector 20 in the Z direction and connects to the connector 20 from the Z direction. Alternatively, the connector 61 may be adjacent to a terminal 13 of the electronic component 10 in the Z direction and connect directly to the terminal 13 of the electronic component 10 from the Z direction.

[0055] The connector 62 is located in the middle of the busbar 42 or at the second end of the busbar 42. The connector 62 is the portion that connects to another electronic component 10 directly or via another connector 20. Alternatively, the connector 62 may be connected to another busbar 42 (for example, a busbar 42 included in another subunit SU) or to a busbar for external connections.

[0056] The extension portion 63 extends from the connecting portion 61 in the X or Y direction. The extension portion 63 is provided between the connecting portion 61 and the connecting portion 62. The extension portion 63 extends across the connecting portion 61 and the connecting portion 62. The extension portion 63 connects the connecting portion 61 and the connecting portion 62.

[0057] In this embodiment, the horizontal plate portion 42p described above includes at least the entirety of the connecting portion 61 and a part of the extension portion 63. That is, at least the entirety of the connecting portion 61 and a part of the extension portion 63 are housed in the housing portion 55 and are located on the same plane.

[0058] In this embodiment, the extensions 63 of some busbars 42 are housed in the housing 55, so that they extend across both sides of the region that overlaps with the electronic component 10 when viewed from the Z direction. For example, the extensions 63 extend across the region that overlaps with the electronic component 10 when viewed from the Z direction, across the -Y direction and the +Y direction of the region that overlaps with the electronic component 10. In other words, by being housed in the housing 55, the busbars 42 can be routed along a better path (for example, a shorter path) without being obstructed by the presence of the electronic component 10.

[0059] Furthermore, one or more busbars 42 may have an extension 64 in addition to the connection portion 61, connection portion 62, and extension portion 63. The extension 64 is a portion of the busbar 42 that is extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension 64 is a portion that is not used for electrical connection. For example, the extension 64 is located on the opposite side of the extension portion 63 from the connection portion 61 (or connection portion 62). The extension 64 is plate-shaped and runs horizontally. The extension 64 is included in the horizontal plate portion 42p. The extension 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension 64 extends to a region that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10 when viewed from the Z direction.

[0060] (Exposed structure on the upper side of each busbar) In this embodiment, at least a portion of the busbar 42 is exposed on the upper side of the base plate 41S. For example, the connecting portion 61, connecting portion 62, and extension portion 63 of the busbar 42 are exposed to the outside of the base plate 41S on the upper side of the base plate 41S (the side of the first surface 51a of the flat portion 51). For example, the extension portion 63 of the busbar 42 is exposed to the outside of the base plate 41S on the upper side of the base plate 41S over its entire length, at least between the connecting portion 61 and the connecting portion 62.

[0061] (Exposed structure on the underside of each busbar) In this embodiment, at least a portion of the busbar 42 is exposed on the lower side of the base plate 41S. For example, the entirety of the connecting portion 61 and at least a portion of the extension portion 63 are exposed to the outside of the base plate 41S on the lower side of the base plate 41S (the second surface 51b side of the flat portion 51). In this embodiment, a gap S1 is formed between the flat portion 51 of the base plate 41S and the metal plate 110 (see Figure 7). The busbar 42 includes an exposed portion 42u exposed in the gap S1 (see Figure 7). The exposed portion 42u includes, for example, the entirety of the connecting portion 61 and at least a portion of the extension portion 63.

[0062] <4.3.3 Fastening Members> Next, the fastening member 43 will be described. As shown in Figure 7, the fastening member 43 is a component for fixing the bus bar 42 to the connecting component 20 corresponding to the bus bar 42. The fastening member 43 is, for example, a crimping bolt fixed to the bus bar 42. The fastening member 43 is an example of a "fastening part".

[0063] In this embodiment, at least one of the connecting portion 61 and connecting portion 62 of the bus bar 42 has a through hole 42h. The through hole 42h penetrates the bus bar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The circumferential surface of the shaft portion 43a has screw grooves. The head portion 43b has a larger diameter than the shaft portion 43a. The fastening member 43 is crimped and fixed to the bus bar 42 with the shaft portion 43a passing through the through hole 42h of the bus bar 42, and the head portion 43b being crimped and fixed to the bus bar 42. With this fixing, the fastening member 43 is electrically and physically connected to the bus bar 42 with the shaft portion 43a protruding from the through hole 42h of the bus bar 42 in the +Z direction. Note that the fastening member 43 is not limited to crimping and may be fixed to the bus bar 42 by welding or other methods.

[0064] In this embodiment, the connecting component 20 is attached to the fastening member 43 from the Z direction, with the connecting component 20 already fixed to the electronic component 10 by the fastening member 71. For example, the connecting component 20 is inserted into the second mounting hole 22h of the second portion 22 of the fastening member 43 by inserting the shaft portion 43a of the fastening member 43. Then, the engaging member 44 (e.g., a nut) is engaged with the shaft portion 43a of the fastening member 43 that protrudes from the second mounting hole 22h of the second portion 22 of the connecting component 20. The engaging member 44 is attached to the shaft portion 43a along the Z direction. This engagement fixes the second portion 22 of the connecting component 20 to the fastening member 43.

[0065] <5. Heat transfer components> First, let's explain the heat transfer component 120. The heat transfer member 120 is a member for transferring heat generated by the electronic component 10 (e.g., electronic component 10S) when energized, and / or heat generated by the busbar 42 itself (Joule heat) when energized, to the metal plate 110. The heat transfer member 120 is, for example, an elastic heat transfer sheet (e.g., a thermally conductive silicone sheet). The heat transfer member 120 is formed of a material with a higher thermal conductivity than, for example, the base plate 41S (or base member 41T). However, the heat transfer member 120 is not limited to the above example, and may be a heat transfer member formed of a thermally conductive gel or other material. In this embodiment, the heat transfer member 120 is insulating.

[0066] In this embodiment, the heat transfer member 120 is partially provided on the wiring substrate 40S (see Figure 2). For example, the heat transfer member 120 is positioned so as to overlap with a part of the bus bar 42 when viewed from the Z direction. The heat transfer member 120 is positioned between the bus bar 42 and the flat portion 111 of the metal plate 110, which will be described later. For example, the heat transfer member 120 is positioned between the exposed portion 42u of the bus bar 42 and the flat portion 111 of the metal plate 110, and is in contact with the exposed portion 42u of the bus bar 42 and the flat portion 111 of the metal plate 110, respectively. The heat transfer member 120 transfers heat from the electronic component 10 (e.g., electronic component 10S) to the bus bar 42, and / or heat generated by the bus bar 42, from the bus bar 42 to the flat portion 111 of the metal plate 110.

[0067] In this embodiment, the heat transfer member 120 is positioned near the electronic component 10 (e.g., electronic component 10S) and overlaps with a portion of the bus bar 42 when viewed from the Z direction. In this embodiment, the heat transfer member 120 is positioned overlapping with the connecting component 20 when viewed from the Z direction. In other words, the heat transfer member 120 is positioned overlapping with the connecting portion 61 or 62 of the bus bar 42 when viewed from the Z direction. The heat transfer member 120 transfers the heat that moves from the electronic component 10S to the bus bar 42 via the connecting component 20, and then transfers it from the bus bar 42 to the flat portion 111 of the metal plate 110.

[0068] <6. Fixing structure for wiring substrates and electronic components> Next, the fixing structure of the wiring substrate 40S and the electronic components 10 will be described. As shown in Figure 8, the metal plate 110 has, for example, a flat portion 111 (described later), as well as a fixing portion 112 and a fixing portion 113.

[0069] The fixing portion 112 is a fixing portion for fixing the base plate 41S to the metal plate 110. When viewed from the Z direction, the fixing portion 112 is provided at a position corresponding to the fixing portion 53 of the base plate 41S. The fixing portion 112 is a cylindrical or prismatic boss that protrudes in the +Z direction from the flat portion 111 of the metal plate 110. The fixing portion 112 has an engagement hole 112h that opens in the +Z direction. The inner circumferential surface of the engagement hole 112h has a screw groove.

[0070] As described above, the fixing portion 53 of the base plate 41S has a mounting hole 53h. A fastening member 115 (for example, a screw or bolt) is passed through the mounting hole 53h. When the fastening member 115 passed through the mounting hole 53h of the fixing portion 53 of the base plate 41S engages with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base plate 41S is fixed to the metal plate 110.

[0071] The fixing portion 113 is a fixing portion for directly fixing the electronic component 10 (for example, electronic component 10S) to the metal plate 110 without using the base plate 41S. The fixing portion 113 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed from the Z direction. The fixing portion 113 is a cylindrical or prismatic boss that protrudes from the flat portion 111 in the +Z direction. The fixing portion 113 has an engagement hole 113h that opens in the +Z direction. The inner circumferential surface of the engagement hole 113h has a screw groove.

[0072] In this embodiment, the flat portion 51 of the base plate 41S has a through hole 51h. The through hole 51h penetrates the flat portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 113 of the metal plate 110. The fixing portion 113 of the metal plate 110 protrudes through the through hole 51h of the base plate 41S to the same position as the first surface 51a of the flat portion 51, or to the +Z direction side of the first surface 51a of the flat portion 51. The mounting portion 14 of the electronic component 10 is in contact with the fixing portion 113 at the same position as the first surface 51a of the flat portion 51, or to the +Z direction side of the first surface 51a of the flat portion 51.

[0073] A fastening member 116 (for example, a screw or bolt) is passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 from the +Z direction side. When the fastening member 116 passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 113h of the fixing portion 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without going through the base plate 41S. Alternatively, the electronic component 10 may be fixed to a fixing portion provided on the base plate 41S.

[0074] <8. Finn> This section describes several fins 90. Each of the multiple fins 90 is thermally connected to the metal plate 110. The multiple fins 90 may be integrally molded with the metal plate 110, for example. As shown in Figures 9 and 10, the multiple fins 90 may include, for example, a first fin 91, a second fin 92, and a third fin 93.

[0075] Multiple fins 90 are positioned near the nearest electronic component 10S among multiple electronic components 10S. Multiple fins 90 protrude in a position aligned with the electronic component 10S in the X direction. Each of the multiple fins 90 extends in the Z direction. For example, multiple fins 90 may extend in the Z direction from the metal plate 110 within the fin holes 56 and protrude from the fin holes 56 in a position aligned with the nearest electronic component 10S. Multiple fins 90 may be positioned, for example, next to the nearest electronic component 10S on the +X direction side. The spacing between multiple fins 90 and the nearest electronic component 10S may be, for example, smaller than the width of the nearest electronic component 10S in the direction of alignment (e.g., the X direction). The spacing between multiple fins 90 and the nearest electronic component 10S may be, for example, smaller than half the width of the electronic component 10S in the direction of alignment (e.g., the X direction). The -X-facing side of the multiple fins 90 (the first plate surface 91a described later) may, for example, directly face the side surface 10f of the nearest electronic component 10S, which faces in the +X direction, without the need for any other components.

[0076] Each of the multiple fins 90 is a plate member having a pair of plate surfaces facing the X direction. The multiple fins 90 are arranged apart from each other in the X direction. Each of the multiple fins 90 may be, for example, a plate member having a pair of plate surfaces parallel to the side surface 10f. The multiple fins 90 may be, for example, plate members arranged parallel to each other in the X direction.

[0077] Each of the multiple fins 90 is a rigid member. Each of the multiple fins 90 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy) and has heat conductivity.

[0078] The first fin 91 has a first plate surface 91a facing the -X direction and a second plate surface 91b facing the +X direction. The first plate surface 91a faces the side surface 10f at a distance in the X direction. The first plate surface 91a is parallel to the side surface 10f. The first plate surface 91a faces the side surface 10f directly, for example, without any other member in between.

[0079] The second fin 92 has a third plate surface 92a facing the -X direction and a fourth plate surface 92b facing the +X direction. The third plate surface 92a faces the second plate surface 91b with a gap in the X direction. The third plate surface 92a is parallel to the second plate surface 91b. The third plate surface 92a has the same size as the second plate surface 91b. The third plate surface 92a faces the second plate surface 91b directly, for example, without any other member in between.

[0080] The third fin 93 has a fifth surface 93a facing the -X direction and a sixth surface 93b facing the +X direction. The fifth surface 93a faces the fourth surface 92b with a gap in the X direction. The fifth surface 93a is parallel to the fourth surface 92b. The fifth surface 93a has the same size as the fourth surface 92b. The fifth surface 93a faces the fourth surface 92b directly, for example, without any other member in between.

[0081] Furthermore, when providing multiple fins 90, the height of the cable routing structure 40T in the Z-direction may be configured to be greater than the height of the cable routing substrate 40S in the Z-direction. By providing a difference in height between the cable routing substrate 40S and the cable routing structure 40T, a sufficient space for air to flow easily is formed above the cable routing substrate 40S. In addition, by making the cable routing substrate 40S thinner than the cable routing structure 40T, it is easier to provide fin holes 56 and expose multiple fins 90.

[0082] <9. Metal plate and insulating cover> Next, we will return to Figure 2 and describe the metal plate 110 and the insulating cover 130.

[0083] <9.1 Metal Plate> The metal plate 110 is a component that ensures the rigidity of the electrical connection unit 1 and enhances the heat dissipation of the electrical connection unit 1. The metal plate 110 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 110 is an example of a "rigid component". The metal plate 110 may also be referred to as a "metal component" or a "heat dissipation component".

[0084] The metal plate 110 is rectangular in shape along the X and Y directions. The metal plate 110 has a first end 110e1, a second end 110e2, a third end 110e3, and a fourth end 110e4. The first end 110e1 and the second end 110e2 are a pair of longitudinal ends of the metal plate 110, separated in the X direction. The third end 110e3 and the fourth end 110e4 are a pair of transverse ends of the metal plate 110, separated in the Y direction. The metal plate 110 includes, for example, a flat portion 111, the aforementioned plurality of fixing portions 112 (see Figure 8), and the aforementioned plurality of fixing portions 113 (see Figure 8).

[0085] The flat portion 111 is a plate-shaped part within the metal plate 110. The flat portion 111 is plate-shaped and oriented horizontally. The flat portion 111 forms the main part of the metal plate 110. The flat portion 111 forms the base (metal base) of the metal plate 110. The flat portion 111 is large enough to cover the two subunits SU from below.

[0086] In this embodiment, the planar portion 111 has a first region A1 and a second region A2. The first region A1 is, for example, the region on the -Y direction side of the planar portion 111. The subunit SUS described above faces the first region A1 of the planar portion 111 when viewed from the Z direction. That is, the multiple electronic components 10S and the base plate 41S included in the subunit SUS face the first region A1 of the planar portion 111 in the Z direction.

[0087] The second region A2 is, for example, the region on the +Y direction side of the planar portion 111. The subunit SUT described above faces the second region A2 of the planar portion 111 when viewed from the Z direction. That is, the multiple electronic components 10T and the base member 41T included in the subunit SUT face the second region A2 of the planar portion 111 in the Z direction.

[0088] <9.2 Insulating Cover> The insulating cover 130 is a member for preventing a finger from touching the current-carrying path of the sub-unit SU. The insulating cover 130 is made of, for example, a synthetic resin and has insulating properties. The insulating cover 130 is, for example, box-shaped with the -Z direction side open. The insulating cover 130 has a plurality of ventilation holes 130h. The insulating cover 130 covers part or all of the corresponding sub-unit SU. Note that the insulating cover 130 is not limited to a box-shaped member, and may be a sheet-shaped member that covers the current-carrying path of the main body unit MU. Also, the insulating cover 130 may be omitted.

[0089] <10. Advantages> <A. Advantages related to fins> The plurality of fins 90 of the present embodiment project from the fin holes 56 to positions aligned with the electronic component 10S. With this configuration, the space around the electronic component 10S can be effectively utilized for heat dissipation. In addition, the heat trapped in the portion of the metal plate 110 that overlaps the electronic component 10S when viewed from the Z direction is radiated to the surroundings of the electronic component 10S via the plurality of fins 90. Therefore, the heat dissipation performance can be improved.

[0090] Also, each of the plurality of fins 90 of the present embodiment extends in the Z direction. With this configuration, the space extending in the Z direction around the electronic component 10S can be effectively utilized. Therefore, the heat dissipation performance can be improved.

[0091] The electrical connection unit 1 of the present embodiment includes a metal plate 110. With this configuration, the metal plate 110 has a structure that can integrally support the wiring substrate 40S and has a function of easily transferring heat to the plurality of fins 90. Therefore, it is easy to improve the heat dissipation performance.

[0092] Each heat transfer member 120 of the present embodiment is disposed between the metal plate 110 and the corresponding bus bar 42. With this configuration, the heat of the electronic component 10S is easily transmitted to the metal plate 110 via the bus bar 42. Therefore, the heat dissipation performance can be improved.

[0093] The electrical connection unit 1 of this embodiment is an integrally molded product of a metal plate 110 and a plurality of fins 90. With this configuration, the number of components can be reduced. In addition, with this configuration, the heat dissipation efficiency from the metal plate 110 to the plurality of fins 90 can be improved.

[0094] <B. Advantages regarding multiple area divisions in the electrical connection unit> As a comparative example, consider a configuration in which an electronic component that should prioritize heat dissipation and an electronic component that should prioritize mountability are attached to one base member. In such a configuration, when a thin base member is adopted, it becomes difficult to improve the mountability, and when a relatively thick base member is adopted, it may become difficult to improve the heat dissipation.

[0095] On the other hand, in the electrical connection unit 1 of this embodiment, the base member 41T of the wiring structure body 40T has a three-dimensional structure that is thicker in the Z direction than the base plate 41S of the wiring substrate 40S.

[0096] According to such a configuration, by using the base plate 41S having the flat portion 51, an electronic component 10S that emphasizes heat dissipation can be arranged near the metal plate 110, and the metal plate 110 can be used as a heat dissipation member to promote heat dissipation. On the other hand, by using the base member 41T having a three-dimensional structure that is thick in the Z direction, an electronic component 10T that emphasizes mountability can be appropriately mounted. By such proper use of areas, an electrical connection unit 1 that can achieve both heat dissipation and mountability can be provided.

[0097] <11. Variations> Next, several variations will be described. In each variation, the configuration other than that described below is the same as the configuration of the above-described embodiment.

[0098] (First Variation) The fin holes 56 are not limited to being located in a position adjacent to the nearest electronic component 10S among the multiple electronic components 10S. For example, the fin holes 56 may be located adjacent to each of two adjacent electronic components 10S, or between two adjacent electronic components 10S. For example, the fin holes 56 may be located adjacent to each of two adjacent electronic components 10S, or at an equal distance from each of two adjacent electronic components 10S.

[0099] (Second variation) The heat dissipation member to which the multiple fins 90 are thermally connected is not limited to the metal plate 110. For example, the multiple fins 90 may be thermally connected to a metal block that faces the second surface 51b and is fixed to the base plate 41S, as an alternative heat dissipation member to the metal plate 110.

[0100] (Third variation) The multiple fins 90 and the metal plate 110 are not limited to being a single molded product. The multiple fins 90 can be connected in any way as long as they are thermally connected to the metal plate 110. For example, the multiple fins 90, which are separate from the metal plate 110, may be fixed so as to be in contact with the metal plate 110. For example, the multiple fins 90, which are separate from the metal plate 110, may be fixed to the metal plate 110 via a heat transfer member.

[0101] (Fourth variation) The positions where the multiple fins 90 protrude are not limited to positions aligned with the electronic component 10S in the X direction. For example, the positions where the multiple fins 90 protrude may be positions aligned with the electronic component 10S in the Y direction.

[0102] (Fifth variation) The area on which multiple fins 90 are provided is not limited to one location on the base plate 41S. As an example, as shown in Figure 11, the area on which multiple fins 90 are provided may be at multiple locations on the base plate 41S. In this case, the multiple fins 90 may protrude from fin holes 56 provided closest to each of the multiple electronic components 10S, to a position aligned with the nearest electronic component 10S.

[0103] (Sixth variation) The routing substrate 40S is not limited to a structure in which the base plate 41S and the bus bar 42 are integrated by insert molding. For example, the base plate 41S, which is provided with a housing portion 55 for housing the bus bar 42, may be molded, and then the bus bar 42 may be placed in the housing portion 55. In this case, the bus bar 42 may be fixed to the housing portion 55 by fitting, or by adhesive or other fixing means. In these cases, potting may be applied to fill the gap between the bus bar 42 and the housing portion 55.

[0104] (Seventh variation) The base member of the cable routing substrate 40S is not limited to a base plate 41S having a plate-shaped flat portion 51. The cable routing substrate 40S may also be a base member having a sheet-shaped flat portion 51 (for example, an insulating sheet). In this case, a portion of the flat portion 51 may conform to the outer shape of the bus bar 42 to form the housing portion 55. In this disclosure, "sheet-shaped" or "sheet" is not limited to a member with a thickness of 1 mm or more, and may also include a member with a thickness of less than 1 mm (so-called film).

[0105] (Variation 8) The base plate 41S of the cable routing substrate 40S may include a plurality of members (plate members or sheet members). The plurality of members are provided so as to sandwich a plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members may be integrated by sandwiching a plurality of bus bars 42, for example, by lamination molding. The plurality of members form a planar portion 51. In this case, the housing portion 55 may be formed hollow inside the base plate 41S (between the plurality of members). The plurality of members may be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members may be, for example, flexible sheet members. The planar portion 51 formed by the plurality of members has openings that expose at least the connection portions 61 and 62 of the bus bars 42.

[0106] (9th variation) The connection between the electronic component 10 and the busbar 42 is not limited to a connection via the connecting component 20. The electronic component 10 may be directly connected to the busbar 42 using fastening members (e.g., bolts or screws) or welding.

[0107] Several embodiments and modifications have been described above. However, the embodiments and modifications are not limited to the examples described above. For example, the modifications described above may be implemented in combination with each other. [Explanation of Symbols]

[0108] 1. Electrical connection unit 5 cabinets 6 Base 7 Cover 10 Electronic Components 10f side 10S Electronic Components 10T Electronic Components 11 cases 11a Insulating rib 12. Main body of the component 13 terminals 13A terminal 13B terminal 13h mounting holes 14 Mounting part 14h mounting holes 20 connecting parts 21 Part 1 21h First mounting hole 22 Part 2 22h Second mounting hole 40 Cable management structure 40S Cable Management Board 40T Cable Management Structure 41S Base plate (base component) 41T Base component 42 Bus Bar 42A Busbar 42B Busbar 42C Busbar 42D Busbar 42e1 edge 42h through hole 42p horizontal plate part 42u exposed part 43 Fastening members 43a Shaft 43b Head 44 Engaging member 51 Plane part 51a 1st page 51b 2nd side 51h through hole 52 Frame section 53 Fixed part 53h Mounting Hole 55 Accommodation 55A Accommodation Section 55B Storage area 55C Storage Unit 55D Storage Unit 56 holes for fins 61 Connection part 62 Connection part 63 Stretching section 64 Extension 71 Fastening Members 90 fins 91 First Fin 91a 1st plate surface 91b 2nd plate surface 92 Second Fin 92a 3rd plate surface 92b 4th board surface 93 Third Fin 93a 5th plate surface 93b 6th board surface 110 Metal plate (heat dissipation component) 110e1 1st end 110e2 2nd end 110e3 3rd end 110e4 4th end 111 Plane section 112 Fixed part 112h Engagement hole 113 Fixed part 113h Engagement hole 115 Fastening member 116 Fastening Members 120 Heat transfer components 130 Insulating cover 130h ventilation holes A1 1st area A2 2nd area H11 Width (Thickness) H12 Width (Thickness) MU Main Unit R1 1st area R2 2nd area S1 Gap SU Subunit SUS subunit SUT Subunit

Claims

1. Electronic components and, An insulating base member having a plate-like or sheet-like planar portion including a first surface facing the electronic component and a second surface facing the opposite side of the first surface, A busbar supported on the flat portion and electrically connected to the electronic component, A heat dissipation member facing the second surface and to which the base member is fixed, Multiple fins thermally connected to the heat dissipation member, Equipped with, The planar portion has fin holes that penetrate from the first surface to the second surface, The plurality of fins protrude from the fin holes in a position aligned with the electronic components. Electrical connection unit.

2. Each of the plurality of fins extends in the thickness direction of the planar portion. The electrical connection unit according to claim 1.

3. The heat dissipation member comprises a metal plate. The electrical connection unit according to claim 1 or 2.

4. The system further comprises a heat transfer member disposed between the heat dissipation member and the busbar. The electrical connection unit according to claim 1 or 2.

5. The heat dissipation member and the plurality of fins are integrally molded products. The electrical connection unit according to claim 1 or 2.

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