Compounds, compositions, resin films, and optical filters

Abstract

This invention provides a compound that exhibits excellent heat resistance and oxidation resistance, and can stably maintain its absorbance properties even when maintained under high temperature or high temperature and high humidity conditions. It also provides a resin film in which desired optical properties are ensured by applying the compound, and provides applications for the compound. [Solution] The compound is the compound shown in chemical formula 1 below. JPEG2026069446000032.jpg4455 ...chemical formula 1

Description

[Technical Field]

[0001] This specification discloses compounds and their uses. [Background technology]

[0002] Compounds that can be used as absorbers, such as compounds that transmit visible light with high transmittance while absorbing near-infrared light, can be applied to a variety of uses.

[0003] For example, imaging devices using CCD (Charge-Coupled Device) or CMOS (Complementary Metal-Oxide-Semiconductor) image sensors, as well as infrared sensors, can use absorbents because they contain silicon photodiodes that are sensitive to the near-infrared region.

[0004] Examples of absorbents include phthalocyanine-based, cyanine-based, metal dithiol complex-based, squarylium-based, and diimonium salt-based compounds.

[0005] Phthalocyanine compounds are known as near-infrared compounds, but they have the problem of high absorption in the visible light region. Cyanine compounds, on the other hand, have a narrow near-infrared absorption range when used alone, and must be used in mixtures with other compounds. Furthermore, metal dithiol complex compounds have low solubility, requiring additional dispersion equipment when applied to films, making them difficult to use in applications requiring high transmittance.

[0006] Furthermore, iminium or diimonium compounds are known to be compounds that can absorb light with wavelengths of 900 nm or greater. However, iminium or diimonium compounds have the problem of losing their absorbance properties in high-temperature and / or high-humidity environments due to their low thermal stability and low resistance. Compositions containing the aforementioned compounds have the problem of losing their spectral properties as they harden due to their low thermal stability and low oxidation resistance.

[0007] There is a need for a compound that possesses high thermal stability while maintaining its light absorption properties in high-temperature and / or high-humidity environments. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] This specification discloses compounds and their uses.

[0009] This specification aims to disclose compounds that exhibit excellent heat resistance and oxidation resistance, and that can stably maintain their absorbance properties even when high temperature or high temperature and high humidity conditions are maintained. Furthermore, this specification aims to provide resin films in which desired optical properties are ensured by applying the aforementioned compounds. Finally, this specification aims to disclose applications of the aforementioned compounds. [Means for solving the problem]

[0010] The term "room temperature" refers to the natural temperature that has not been artificially heated or cooled. For example, room temperature may be any temperature within the range of approximately 10°C to 30°C, or a temperature of approximately 23°C, 25°C, or 27°C.

[0011] Of the physical properties mentioned herein, those affected by the measurement temperature are those measured at room temperature unless otherwise specified.

[0012] Unless otherwise specified, the unit of temperature referred to in this specification is Celsius (°C).

[0013] The term "atmospheric pressure" refers to the natural pressure that has not been artificially pressurized or depressurized, and typically means a pressure of approximately 730 mmHg to 790 mmHg.

[0014] Of the physical properties mentioned herein, those affected by the measurement pressure are those measured at normal pressure unless otherwise specified.

[0015] Of the physical properties mentioned herein, those affected by the measured humidity are those measured at standard humidity conditions unless otherwise specified.

[0016] Standard humidity refers to a relative humidity within the range of 40% to 60%, for example, a relative humidity of approximately 55% or 60%.

[0017] Where an optical property (e.g., refractive index) referred to herein differs with wavelength, unless otherwise specified, the optical property is defined as a property for light with a wavelength of 520 nm.

[0018] The terms "transmittance" or "absorptance," unless otherwise specified, refer to the actual transmittance (measured transmittance) or actual absorptance (measured absorptance) observed within a specific wavelength or a predetermined wavelength range, and are based on an incident angle of 0 degrees.

[0019] The terms "average transmittance" or "average absorptiveness," unless otherwise specified, refer to the result of measuring the transmittance or absorptiveness at each wavelength, increasing the wavelength by 1 nm from the shortest wavelength within a given wavelength range, and then calculating the arithmetic mean of the measured transmittance or absorptiveness. For example, the average transmittance or average absorptiveness in the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittance or absorptiveness measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0020] The term "maximum transmittance" or "maximum absorptive rate" refers to the highest transmittance or absorptive rate measured at each wavelength while increasing the wavelength by 1 nm increments from the shortest wavelength within a given wavelength range. For example, the maximum transmittance or absorptive rate in the wavelength range of 350 nm to 360 nm is the highest transmittance or absorptive rate among those measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0021] The term "minimum transmittance" or "minimum absorptive" refers to the lowest transmittance or absorptive value measured at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a given wavelength range. For example, the minimum transmittance or absorptive value within the wavelength range of 350 nm to 360 nm is the lowest transmittance or absorptive value among those measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0022] In this specification, the angle of incidence is the angle relative to the normal of the surface being evaluated. For example, the transmittance of an optical filter at an angle of incidence of 0 degrees means the transmittance for light incident in a direction substantially parallel to the normal of the optical filter surface. This definition of the angle of incidence applies similarly to other properties such as transmittance and absorptance.

[0023] The term "alkyl group" can mean, unless otherwise specified, a linear or branched alkyl group having 1 to 30, 1 to 24, 1 to 20, 1 to 16, 1 to 12, 1 to 8, or 1 to 4 carbon atoms, or a cyclic alkyl group having 3 to 30, 3 to 24, 3 to 20, 3 to 16, 3 to 12, or 3 to 8 carbon atoms.

[0024] The aforementioned cyclic alkyl group includes alkyl groups having only a cyclic structure and alkyl groups containing a cyclic structure.

[0025] The term "alkenyl group" may, unless otherwise specified, mean a linear or branched acyclic alkenyl group having 2-30, 2-24, 2-20, 2-16, 2-12, 2-8, or 2-4 carbon atoms, or a cyclic alkenyl group having 3-30, 3-24, 3-20, 3-16, 3-12, or 3-8 carbon atoms.

[0026] The aforementioned cyclic alkenyl group includes alkenyl groups that have only a cyclic structure and alkenyl groups that include a cyclic structure.

[0027] The term "alkynyl group" can refer to a linear or branched acyclic alkynyl group having 2-20, 2-16, 2-12, 2-8, or 2-4 carbon atoms, or a cyclic alkynyl group having 3-30, 3-24, 3-20, 3-16, 3-12, or 3-8 carbon atoms.

[0028] The aforementioned cyclic alkynyl group includes both alkynyl groups having only a cyclic structure and alkynyl groups containing a cyclic structure.

[0029] The term "alkoxy group" may mean, unless otherwise specified, a linear or branched alkoxy group having 1 to 30, 1 to 24, 1 to 20, 1 to 16, 1 to 12, 1 to 8, or 1 to 4 carbon atoms, or a cyclic alkoxy group having 3 to 30, 3 to 24, 3 to 20, 3 to 16, 3 to 12, or 3 to 8 carbon atoms.

[0030] The aforementioned cyclic alkoxy group includes both alkoxy groups having only a cyclic structure and alkoxy groups containing a cyclic structure.

[0031] The term "aryl group" refers to a substituent formed by removing one hydrogen atom from an aromatic hydrocarbon cyclic compound, and the aromatic hydrocarbon cyclic compound may be a monocyclic or polycyclic compound.

[0032] Unless otherwise specified, the aryl group may be an aryl group having 6 to 48 carbon atoms, 6 to 42 carbon atoms, 6 to 36 carbon atoms, 6 to 30 carbon atoms, 6 to 24 carbon atoms, 6 to 18 carbon atoms, or 6 to 12 carbon atoms, for example, a phenyl group, a tolyl group, a xylyl group, or a naphthyl group.

[0033] The aryl group may be, for example, a heteroaryl group, and the heteroaryl group has a structure in which a heteroatom other than a carbon atom, such as O, N, or S, is included in the ring structure of the aryl group.

[0034] The alkyl group, alkenyl group, alkynyl group, alkoxy group, and aryl group may be substituted with one or more substituents. In this case, the substituents may be one or more selected from the group consisting of halogens (chlorin (Cl), iodine (I), bromine (Br), fluorine (F)), aryl groups, heteroaryl groups, epoxy groups, alkoxy groups, cyano groups, amino groups, carboxyl groups, acryloyl groups, methacryloyl groups, acryloyloxy groups, methacryloyloxy groups, carbonyl groups, and hydroxyl groups, but are not limited to these.

[0035] This specification discloses compounds.

[0036] The aforementioned compound may also be an absorbent. The term "absorbent" refers to a compound that can absorb light in any wavelength range.

[0037] The aforementioned compound may also be the compound represented by the following chemical formula 1.

[0038] [ka] ...chemical formula 1

[0039] In chemical formula 1, either X or Y may be a single bond and the other a double bond. For example, in chemical formula 1, X may be a single bond and Y may be a double bond.

[0040] In chemical formula 1, either R1 or R2 (for example, R1) can form the structure of chemical formula 2 below, and the other (for example, R2) may be hydrogen or deuterium. In the above case, for example, the substituent that does not form the structure of chemical formula 2 may be deuterium.

[0041] [ka] ...Chemical formula 2

[0042] In chemical formula 2, R5 may be carbon, as R1 in chemical formula 1.

[0043] In chemical formula 2, R6 to R8 may each be independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0044] In chemical formula 2, R9~R 12 These may be hydrogen or deuterium, independently of each other. In some cases, in chemical formula 2, R9 and R 10 , R 10 and R 11 and / or R 11 and R 12 These substituents may be linked to each other to form an aromatic structure. In the above case, substituents that do not form an aromatic structure may be hydrogen or deuterium.

[0045] The aforementioned aromatic structure may be, for example, an aromatic structure having 6 to 36, 6 to 30, 6 to 24, 6 to 18, or 6 to 12 carbon atoms, and may also be a benzene structure, for example.

[0046] Such aromatic or benzene structures may be substituted with at least one deuterium atom.

[0047] In other examples, R1 and R2 of chemical formula 1 can together form the structure of chemical formula 3 shown below.

[0048] [ka] ...chemical formula 3

[0049] In Chemical Formula 3, R 13 and R 14 Any one of them may be R1 in Chemical Formula 1, and the other one may be R2 in Chemical Formula 2. Such R 13 and R 14 may each be carbon.

[0050] In Chemical Formula 3, R 15 ~R 20 are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group, an alkylcarbonyl group, an alkoxy group, an alkylamino group, an alkylsilyl group, an amino group, a nitro group, a nitrile group, a hydroxy group, a cyano group or -NR[[ID=1 ]] a R b and may be. In such a case, the said R a and R b may each independently be hydrogen, deuterium, an alkyl group, an alkyloxy group, an alkylcarbonyl group, an alkoxy group, an alkylamino group, an alkylsilyl group, an amino group, a nitro group, a nitrile group, a hydroxy group or a cyano group.

[0051] <00 / / 00352>In Chemicals Formula 3, R 21 and R 22 may each independently be hydrogen or deuterium. In other examples, R 21 and R 22 may be linked to each other to form an aromatic structure. The said aromatic structure may be, for example, an aromatic structure having 6 to 36, 6 to 30, 6 to 24, 6 to 18, or 6 to 12 carbon atoms, and may be, for example, a benzene structure. Such an aromatic structure or benzene structure may be substituted with at least one deuterium.

[0052] Also, in Chemical Formula 1, any one of R3 and R4 (for example, R3) forms the structure of the following Chemical Formula 4, and the other one (for example, R4) may be hydrogen or deuterium. In such a case, the substituent that does not form the structure of Chemical Formula 4 may be, for example, deuterium.

[0053] [ka] ...chemical formula 4

[0054] In chemical formula 4, R 23 This can also be carbon as R3 in chemical formula 1.

[0055] In chemical formula 4, R 24 ~R 26 Each of these may independently be hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0056] In chemical formula 4, R 27 ~R 30 Each of these may independently be hydrogen or deuterium. In this case, R 27 and R 28 , R 28 and R 29 and / or R 29 and R 30 These substituents may be linked to each other to form an aromatic structure. In the above case, substituents that do not form an aromatic structure may be hydrogen or deuterium.

[0057] The aforementioned aromatic structure may be, for example, an aromatic structure having 6 to 36, 6 to 30, 6 to 24, 6 to 18, or 6 to 12 carbon atoms, and may also be a benzene structure, for example.

[0058] Such aromatic or benzene structures may be substituted with at least one deuterium atom.

[0059] In other examples, R3 and R4 in chemical formula 1 may together form the structure of chemical formula 5 below.

[0060] [ka] ...chemical formula 5

[0061] In chemical formula 5, R 31 and R 32 One of them may be R3 of chemical formula 1, and the other may be R4 of chemical formula 1. 31 and R 32 Each of these may be carbon.

[0062] In chemical formula 5, R 33 ~R 38 Each of these independently represents hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR. a R b That's fine.

[0063] In the above, R a and R b Each of these may independently be hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0064] In chemical formula 5, R 39 and R 40 Each of these atoms may independently be hydrogen or deuterium, or they may be linked together to form an aromatic structure. The aromatic structure may be, for example, an aromatic structure having 6-36, 6-30, 6-24, 6-18, or 6-12 carbon atoms, and may also be a benzene structure. Such an aromatic structure or benzene structure may be substituted with at least one deuterium atom.

[0065] The compound of chemical formula 1 may, for example, be a compound represented by any one of the following chemical formulas 6 to 9.

[0066] [ka] ...chemical formula 6

[0067] In chemical formula 6, R 41 ~R 54 Each of these independently represents hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR. a R b It may also be the case that R a and R b Each of these may independently be hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0068] In one example, R in chemical formula 6 41 ~R 45 and R 48 ~R 52 Each of these is independently a hydrogen atom, an alkyl group, an alkyloxy group, or an alkylcarbonyl group, and R 46 , R 47 , R 53 and R 54 These may each be deuterium.

[0069] [ka] ...chemical formula 7

[0070] In chemical formula 7, R 55 ~R 70 Each of these independently represents hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR. a R b It may also be the case that R a and R bEach of these may independently be hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0071] In one example, R in chemical formula 7 55 , R 56 , R 61 , R 64 , R 69 and R 70 Each of these is independently a hydrogen atom, an alkyl group, an alkyloxy group, or an alkylcarbonyl group, and R 57 ~R 60 , R 62 , R 63 , R 65 ~R 68 These may each be deuterium.

[0072] [ka] ...chemical formula 8

[0073] In chemical formula 8, R 71 ~R 90 Each of these independently represents hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR. a R b It may also be the case that R a and R b Each of these may independently be hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

[0074] In one example, R in chemical formula 8 71 ~R 75 and R 77 ~R 81is independently a hydrogen, alkyl group, alkyloxy group or alkylcarbonyl group, and R 76 and R 82 ~R 90 may each be deuterium.

[0075] [Chemical formula] ···Chemical formula 9

[0076] In Chemical formula 9, R 91 ~R 110 may each be independently a hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group or -NR a [[ID=2,6]]R b In such a case, the said R a and R b may each be independently a hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group or cyano group.

[0077] In one exemplary case, R 92 , R 99 , R 100 , R 102 , R 109 and R 110 are each independently a hydrogen, alkyl group, alkyloxy group or alkylcarbonyl group, and R 91 , R 93 ~R 98 , R 101 and R 103 ~R 108 may each be deuterium.

[0078] Since the compounds represented by the said Chemical formula 1 and Chemical formula 6 to Chemical formula 9 contain an absorption edge, they can have a structure capable of exhibiting the property of absorbing light of a desired wavelength.

[0079] For example, the absorption edge may be a skeleton or structure having a so-called resonance structure and / or conjugated bond.

[0080] Light absorption by compounds, particularly organic compounds, is known to be due to the energy difference (△E) between the ground state and the excited state. This difference can also be explained as the energy difference between the HOMO (Highest Occupied Molecular Orbital) and the LUMO (Lowest Unoccupied Molecular Orbital).

[0081] Generally, organic absorbers may contain resonance structures and / or conjugated bonds as absorption edges capable of exhibiting light absorption effects. This may form a framework that allows the compound as a whole to exhibit desired light absorption properties.

[0082] The specific types of absorption edges or skeletons described above are not particularly limited. As is well known, the resonance effect refers to the interaction between a lone pair of electrons in a molecule and an adjacent π-bonding pair of electrons, and substituents or skeletons that cause such resonance effects are well known. Furthermore, a conjugated bond is a system in which two or more double bonds are separated by a single bond, and it is known that as the length of such a conjugated bond increases, the energy difference between the HOMO and LUMO decreases, and the absorption band shifts to the longer wavelength side.

[0083] For example, the absorption edge may be a skeleton or structure that causes the compound disclosed herein to exhibit an absorption maximum in the wavelength range of 650 nm to 900 nm.

[0084] The compounds disclosed herein may exhibit an absorption maximum wavelength in the range of 650 nm to 900 nm. The lower limit of the absorption maximum wavelength may be approximately 650 nm, 660 nm, 670 nm, 680 nm, 690 nm, 700 nm, 710 nm, 720 nm, 730 nm, 740 nm, 750 nm, 760 nm, or 765 nm, as in other examples. The upper limit of the absorption maximum wavelength may be approximately 900 nm, 800 nm, 790 nm, 780 nm, 770 nm, 760 nm, 750 nm, 740 nm, 730 nm, 720 nm, or 710 nm. The absorption maximum wavelength may be within a range that is greater than or greater than any one of the lower limits mentioned above, or within a range that is greater than or greater than any one of the lower limits mentioned above, and at the same time less than or less than any one of the upper limits mentioned above.

[0085] As described above, resonance structures and conjugated bonds determine the energy difference (ΔE) between the ground state and the excited state of a compound, or the energy difference between the HOMO (Highest Occupied Molecular Orbital) and the LUMO (Lowest Unoccupied Molecular Orbital). Since the absorption maximum wavelength is determined by this energy difference, the structure of the absorption edge can be determined so that the compound can have an absorption maximum wavelength within the aforementioned range.

[0086] R in the aforementioned chemical formula 6 46 , R 47 , R 53 and R 54 At least one, two or more, or all of the following, R in chemical formula 7 57 ~R 60 , R 62 , R 63 and R 65 ~R 68 At least one, two or more, or all of the following, R in chemical formula 8 76 and R 82 ~R 90At least one, two or more, or all of the following, and / or R in chemical formula 9 91 , R 93 ~R 98 , R 101 and R 103 ~R 108 At least one, two or more, or all of them contain deuterium.

[0087] Here, the meaning of "containing deuterium" may include, for example, cases where the substituent is deuterium, or a deuterium-substituted alkyl group, an alkenyl group substituted with at least one deuterium, an alkynyl group substituted with at least one deuterium, an alkoxy group substituted with at least one deuterium, an aryl group substituted with at least one deuterium, an aryloxy group substituted with at least one deuterium, an arylamino group substituted with at least one deuterium, an alkylamino group substituted with at least one deuterium, a heteroaryl group substituted with at least one deuterium, an alkylsilyl group substituted with at least one deuterium, or an arylsilyl group substituted with at least one deuterium.

[0088] The compounds disclosed herein can ensure excellent heat resistance and / or oxidation resistance without the deuterium affecting the absorbance properties of the compounds. More specifically, the compound represented by chemical formula 1 can ensure excellent heat resistance and / or oxidation resistance due to the deuterium contained in it, and the compound represented by any one of chemical formulas 6 to 9 can ensure excellent heat resistance and / or oxidation resistance due to the presence of deuterium.

[0089] The lower limit of the number of deuterium atoms contained in the compound disclosed herein may be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, or 14, and the upper limit may be 200, 100, 90, 80, 70, 60, 50, 40, 30, 20, 19, 18, 17, 16, 15, 10, 9, 8, 7, 6, 5, or 4. The number of deuterium atoms may be within a range that is greater than or greater than any one of the lower limits mentioned above, or within a range that is greater than or greater than any one of the lower limits mentioned above, and at the same time less than or less than any one of the upper limits mentioned above.

[0090] The number of deuterium atoms may be the number of moles of deuterium contained in 1 mole of the compound.

[0091] The deuterium substitution rate of the compound may be above a certain level. Theoretically, the deuterium substitution rate is the ratio of the number of moles of deuterium after deuterium substitution to the total number of moles of hydrogen contained in 1 mole of the compound before deuterium substitution. The lower limit of the deuterium substitution rate may be around 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, or 90%, and the upper limit may be around 100%, 99%, 98%, 97%, 96%, 95%, 94%, 93%, 92%, 91%, 90%, 89%, 88%, 87%, 86%, 85%, 84%, 83%, 82%, 81%, 80%, 79%, 78%, 77%, 76%, or 75%. The ratio may be within a range that is greater than or greater than any one of the aforementioned lower limits, or within a range that is greater than or greater than any one of the aforementioned lower limits, and at the same time less than or less than any one of the aforementioned upper limits. Furthermore, the deuterium substitution rate can represent the degree to which hydrogen directly bonded to carbon is substituted with deuterium. A method for measuring such a deuterium substitution rate is described in "5. Deuterium Substitution Rate" of the Examples section of this specification.

[0092] The compounds disclosed herein can achieve heat resistance by controlling the deuterium substitution rate. The carbon-deuterium bond has lower stretching and bending energy than the carbon-hydrogen bond. Therefore, it is understood that the carbon-deuterium bond can reduce intramolecular vibrational energy compared to the carbon-hydrogen bond, thereby ensuring heat resistance while maintaining absorption properties even in high-temperature and high-humidity environments.

[0093] The compounds disclosed herein can also ensure oxidation resistance by controlling the deuterium substitution rate. In the case of deuterium-substituted compounds, as described above, the intramolecular vibrational energy decreases, and as a result, the oxidation potential increases. Due to the increase in oxidation potential, oxidation is suppressed even in high-temperature and high-humidity environments, and the absorbance properties can also be maintained, compared to compounds that have not been deuterium-substituted. The compounds can have an appropriate level of molar weight. For example, the lower limit of the molar mass may be around 300 g / mol, 400 g / mol, 450 g / mol, 500 g / mol, 505 g / mol, 510 g / mol, 515 g / mol, 520 g / mol, 525 g / mol, 530 g / mol, 535 g / mol, 540 g / mol, 545 g / mol, 550 g / mol, 555 g / mol, 560 g / mol, 565 g / mol, 570 g / mol, 575 g / mol, 580 g / mol, 585 g / mol, 590 g / mol, 595 g / mol, 600 g / mol, 605 g / mol, 610 g / mol, 615 g / mol, 620 g / mol, or 625 g / mol. The upper limit of the molar mass may be approximately 3,000 g / mol, 2,500 g / mol, 2,000 g / mol, 1,500 g / mol, 1,000 g / mol, 900 g / mol, 800 g / mol, 700 g / mol, 690 g / mol, 680 g / mol, 670 g / mol, 660 g / mol, 650 g / mol, 640 g / mol, 630 g / mol, 620 g / mol, 610 g / mol, 600 g / mol, 550 g / mol, 540 g / mol, 530 g / mol, 520 g / mol, or 510 g / mol. The molar mass may be within a range where it is greater than or greater than any one of the aforementioned lower limits, or greater than or less than any one of the aforementioned upper limits, or greater than or greater than any one of the aforementioned lower limits, and simultaneously less than or less than any one of the aforementioned upper limits.

[0094] The compound may have excellent heat resistance. For example, the 5% thermal decomposition temperature of the compound (hereinafter, "Td 5%") may be within a predetermined range. For example, the lower limit of Td 5% of the compound may be around 200°C, 210°C, 220°C, 230°C, 240°C, 250°C, 260°C, 270°C, 280°C, or 290°C. The upper limit of Td 5% may be around 500°C, 480°C, 460°C, 440°C, 420°C, 400°C, 380°C, 360°C, 350°C, 340°C, 330°C, 320°C, 310°C, 300°C, 290°C, 280°C, 270°C, 260°C, or 250°C. The aforementioned Td 5% may be within the range of being greater than or greater than any one of the aforementioned lower limits, or within the range of being less than or less than any one of the aforementioned upper limits, or within the range of being greater than or greater than any one of the aforementioned lower limits, and simultaneously less than or less than any one of the aforementioned upper limits.

[0095] The aforementioned Td 5% is the temperature at which a 95% weight loss occurs during the TGA (Thermogravimetric Analysis) analysis of the compound. Such a Td 5% is determined through TGA (Thermogravimetric Analysis), and the TGA (Thermogravimetric Analysis) method is described in "3. Analysis of Thermal Decomposition Temperature (Td 5%)" in the Examples section of this specification.

[0096] The aforementioned compounds can be obtained through known methods for synthesizing organic compounds and deuterium substitution methods.

[0097] The compounds of chemical formula 1 and / or the structures of chemical formulas 6-9 described above are structures of absorbents known as so-called squarylium compounds. Various methods for producing squarylium compounds are known in the industry. For example, the compound can be produced by substituting a reactant used in the production process of known squarylium absorbents with deuterium and applying this reactant to the synthesis process of the squarylium absorbent. Alternatively, the compound can also be produced by synthesizing a squarylium absorbent according to a known synthesis method and then substituting at least some or all of the hydrogen in the synthesized absorbent with deuterium.

[0098] There are no particular restrictions on the deuterium substitution method described above. For example, a method of mixing the deuterium of the compound to be substituted with deuterium at an appropriate temperature can be applied. The lower limit of the mixing temperature described above may be, for example, around 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, or 120°C, and the upper limit may be around 300°C, 280°C, 260°C, 240°C, 220°C, 200°C, 180°C, 160°C, 140°C, or 120°C. The mixing temperature may be within a range that is greater than or greater than any one of the lower limits described above, or within a range that is less than or less than any one of the upper limits described above, or within a range that is greater than or greater than any one of the lower limits described above, and at the same time less than or less than any one of the upper limits described above.

[0099] The mixing time is not particularly limited and can be adjusted, for example, by considering the desired substitution rate. For example, the lower limit of the mixing time may be around 3 hours, 6 hours, 9 hours, 12 hours, 15 hours, 18 hours, 21 hours, or 24 hours, and the upper limit may be around 72 hours, 36 hours, or 24 hours. The mixing time may be within a range where it is greater than or greater than any one of the lower limits mentioned above, or less than or equal to any one of the upper limits mentioned above, or both greater than or greater than any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0100] Furthermore, the mixing may also be carried out in the presence of additional compounds that can assist, promote, or initiate the substitution of deuterium. For example, the compound that acts as a catalyst for the substitution of deuterium may be any one of the following: silver oxide (Ag2O), silver acetate (AgOAc), silver trifluoride acetate (CFCOOAg), silver carbonate (Ag2CO3), palladium acetate (Pd(OAc)2), palladium chloride (PdCl2), bis(acetonitrile)dichloropalladium (PdCl2(CH3CN)2), tris(dibenzylideneacetone)dipalladium (Pd2(dba)3), tetrakis(triphenylphosphine)palladium (Pd(PPh3)4), and bis(dibenzylideneacetone)palladium (Pd(dba)2), but is not limited to these as long as it is a compound that can act as a catalyst during deuterium substitution. Furthermore, compounds that act as ligands during deuterium substitution include, for example, allyldiphenylphosphine, allyldiphenylphosphine oxide, benzyldiphenylphosphine, 1-[2-[Bis(tert-butyl)phosphino]phenyl]-3,5-diphenyl-1H-pyrazole, Bis[2-(diadamantylphosphino)ethyl]amine, Bis(5H-dibenzo[a,d]cyclohepten-5-yl)phenylphosphine, 2-[Bis(3,5-di-tert-butyl-4-methoxyphenyl)phosphino]benzaldehyde, 2,6-Bis(di-tert-butylphosphinomethyl)pyridine, Bis(dicyclohexylphosphinophenyl)ether, Bis(diethylamino)phenylphosphine, and 1,3-Bis-(2,6-diisopropylphenyl)-[1,3,2]diazaphospholidine. 2-oxide, Bis(dimethylamino)chlorophosphine, 2-[Bis(3,5-dimethylphenyl)phosphino]benzaldehyde, 2,2′-Bis(diphenylphosphino)-1,1′-biphenyl、Bis(4-fluorophenyl)phenylphosphine oxide、Bis[4-(3,3,4,4,5,5,5-heptafluoro-2,2-bis(trifluoromethyl)pentyl)phenyl]phenylphosphine、1,1′-bis(phenylphosphinidene)ferrocene、(2-Bromophenyl)dicyclohexylphosphine、(2-Bromophenyl)diphenylphosphine、tert-Butyldicyclohexylphosphine、tert-Butyldiisopropylphosphine、tert-Butyldiphenylphosphine、Di-tert-butyl(2,2-diphenyl-1-methyl-1-cyclopropyl)phosphine、2-Chloro-1,3-bis(2,6-diisopropylphenyl)-1,3,2-diazaphospholidine、2-Dicyclohexylphosphino-2′,6′-bis(N,N-dimethylamino)biphenyl、1-(Dicyclohexylphosphino)-2,2-Diphenyl-1-methylcyclopropane、Dicyclohexyl(2,2-diphenyl-1-methyl-1-cyclopropyl)phosphine、Cyclohexyldiphenylphosphine、2-(Dicyclohexylphosphino)-1,1-diphenyl-1-propene、Dicyclohexyl(1-methyl-2,2-diphenylvinyl)phosphine、Di(1-adamantyl)-2-dimethylaminophenylphosphine、Di-1-adamantylphosphine、Di(1-adamantyl)-(2-triisopropylsiloxyphenyl)phosphine、(5H-Dibenzo[a,d]cyclohepten-5-yl)diphenylphosphine、(R)-(-)-1-[(S)-2-(di(3,It may be any one of the following: 5-bis-trifluoromethylphenylphosphino)ferrocenyl]ethyldicyclohexylphosphine, (R)-(-)-1-[(S)-2-(di(3,5-bis-trifluoromethylphenyl)phosphino)ferrocenyl]ethyldi(3,5-dimethylphenyl)phosphine, P,P-Dichloroferrocenylphosphine, (R)-(-)-N,N-Dimethyl-1-[(S)-2-(diphenylphosphino)ferrocenyl]ethylamine, and 1,2,3,4,5-Pentaphenyl-1′-(di-tert-butylphosphino)ferrocene, but it is not limited to these as long as it is a compound that can act as a ligand when deuterium substitution occurs.

[0101] This specification also discloses compositions comprising the compound. The term “composition” may mean a mixture comprising the compound and other components, or a mixture comprising two or more compounds.

[0102] Compositions containing such compounds essentially contain the compounds disclosed herein and may further contain other necessary components.

[0103] For example, the composition may further contain a resin component that acts as a binder. There are no particular restrictions on the type of resin component used in such cases, and known resin components used to form resin films, such as near-infrared resin films, can be used. In this specification, the compound component may exhibit appropriate compatibility or solubility with the various known resin components.

[0104] Examples of resin components include, but are not limited to, one or more of the following: cyclic olefin (COP, Cycloolefin) resins, polyarylate resins, polyester resins, polysulfone resins, polyethersulfone resins, poly(p-phenylene) resins, polyarylene etherphosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins, or silicone resins, as well as various other organic resins or organic-inorganic hybrid resins.

[0105] While not particularly limited, the compounds described herein can be mixed with cyclic orifine resins, among the known binder resin components, to form resin films exhibiting excellent performance. Therefore, in one example, the resin component may be a cyclic orifine resin.

[0106] When a resin component is applied, there are no particular restrictions on its ratio. For example, the resin component may be present in such a way that the weight ratio of the compound to 100 parts by weight of the resin component is in the range of 0.001 parts by weight to 10 parts by weight. The lower limit of the weight ratio of the compound to 100 parts by weight of the resin component may be approximately 0.001 parts by weight, 0.005 parts by weight, 0.01 parts by weight, 0.05 parts by weight, 0.1 parts by weight, 0.5 parts by weight, 1 part by weight, 1.1 parts by weight, 1.2 parts by weight, 1.3 parts by weight, or 1.4 parts by weight in other examples, and the upper limit may be approximately 10 parts by weight, 9 parts by weight, 8 parts by weight, 7 parts by weight, 6 parts by weight, 5 parts by weight, 4 parts by weight, 3 parts by weight, 2 parts by weight, or 1.5 parts by weight. The ratio may be within a range where it is greater than or greater than any one of the aforementioned lower limits, or greater than or less than any one of the aforementioned upper limits, or greater than or greater than any one of the aforementioned lower limits, and at the same time less than or less than any one of the aforementioned upper limits.

[0107] For example, the composition may further include a solvent in which the compound and / or the resin component is dispersed. In such a case, there are no particular restrictions on the type of solvent applied, and known solvents used to form resin films, such as near-infrared resin films, can be used. In this specification, the compound component may exhibit suitable compatibility or solubility with a variety of known solvents.

[0108] Examples of solvents include, but are not limited to, methylene chloride, cyclohexanone, toluene, methyl ethyl ketone, methyl isobutyl ketone, propylene glycol methyl ether acetate, diethylene glycol monoethyl ether 3-methoxybutanol, ethylene glycol monobutyl ether acetate, 4-hydroxy-4-methyl-2-pentanone, gamma butyrolactone, cyclohexanone, pyridone, chloroform, 1,4-dioxane, cyclohexanone, ortho-dichlorobenzene, chlorobenzene, aliphatic alcohols with 2 or more carbon atoms (e.g., isobutyl alcohol, isopropyl alcohol, ethanol, isopropanol, butanol, etc.), butyl acetate, tetrahydrofuran, or xylene.

[0109] When a solvent is used, there are no particular restrictions on its ratio, and the ratio can be adjusted within a range that allows for proper dispersion of the compound and / or resin components.

[0110] The composition may include, but is not limited to, other necessary components in addition to the components described above. These optional components include, but are not limited to, adhesion promoters, leveling agents, antistatic agents, heat stabilizers, light stabilizers, antioxidants, dispersants, flame retardants, lubricants, or plasticizers.

[0111] This specification also relates to uses of the compound or composition.

[0112] For example, this specification may relate to a resin film to which the compound or composition is applied.

[0113] Such a resin film may include at least a resin component and the aforementioned compound.

[0114] In such cases, the specific types of resin components and the ratio of the resin components to the compound are as described in the section on compound composition.

[0115] The resin film may be a film capable of absorbing light within a predetermined wavelength range. In one example, the resin film may be an infrared resin film or a near-infrared resin film. Such a resin film can exhibit absorption characteristics in at least a portion of the wavelength range, for example, within the range of approximately 650 nm to 900 nm.

[0116] For example, the resin film may exhibit an absorption maximum wavelength in the range of 650 nm to 900 nm. The lower limit of the absorption maximum wavelength may be approximately 650 nm, 660 nm, 670 nm, 680 nm, 690 nm, 700 nm, 710 nm, 720 nm, 730 nm, 740 nm, 750 nm, 760 nm, or 765 nm, as in other examples. The upper limit of the absorption maximum wavelength may be approximately 900 nm, 800 nm, 790 nm, 780 nm, 770 nm, 760 nm, 750 nm, 740 nm, 730 nm, 720 nm, or 710 nm. The absorption maximum wavelength may be within a range that is greater than or exceeds any one of the lower limits mentioned above, or within a range that is less than or equal to any one of the upper limits mentioned above, or within a range that is greater than or exceeds any one of the lower limits mentioned above, and at the same time is less than or equal to any one of the upper limits mentioned above.

[0117] Due to these characteristics, the resin film can be applied to various devices such as optical filters and infrared sensors, possessing excellent optical properties and excellent physical properties such as heat resistance.

[0118] For example, the transmittance at the absorption maximum of the resin film may be below a certain level. Its upper limit may be around 50%, 49%, 48%, 47%, 46%, 45%, 44%, 43%, 42%, 41%, or 40%, and its lower limit may be around 0.1%, 1%, 10%, 15%, 20%, 25%, 30%, 35%, or 39%. The transmittance at the absorption maximum may be within a range where it is greater than or greater than any one of the lower limits mentioned above, or less than or equal to any one of the upper limits mentioned above, or both greater than or greater than any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0119] For example, the resin film may be such that the absolute value of △A in the following formula 1 is less than or equal to a predetermined value.

[0120] [Formula 1] △A = 100 × (A f -A i ) / A i

[0121] In Equation 1, A f This is the transmittance at the wavelength of absorption maximum of the resin film maintained at 85°C and 85% relative humidity for 120 hours, and A i This is the transmittance at the absorption maximum wavelength of the resin film before it is maintained at 85°C and 85% relative humidity for 120 hours, and the absorption maximum wavelength is within the wavelength range of 650nm to 900nm.

[0122] The upper limit of the absolute value of △A in Equation 1 may be approximately 50%, 40%, 30%, 20%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1.5%, 1.4%, 1.3%, 1.2%, 1.1%, 1%, 0.9%, 0.8%, 0.7%, 0.6%, 0.5%, 0.4%, 0.3%, 0.2%, 0.1%, or 0%, and the lower limit is not particularly restricted, but may be approximately 0% or 0.1%. The absolute value of △A may be within the range of being less than or equal to any one of the upper limits mentioned above, or within the range of being greater than or equal to any one of the lower limits mentioned above, while simultaneously being less than or equal to any one of the upper limits mentioned above.

[0123] In the above formula 1, A f The upper limit may be around 20%, 19%, 18%, 17%, 16%, 15%, 14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.9%, 0.8%, 0.7%, 0.6%, 0.5%, 0.4%, 0.3%, 0.2%, or 0.1%, and the lower limit may be around 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1%. f This may be within the range of being less than or equal to any one of the upper limits mentioned above, or being greater than or equal to any one of the lower limits mentioned above, while simultaneously being less than or equal to any one of the upper limits mentioned above.

[0124] The resin film may be such that the absolute value of Δλ in the following formula 2 is less than or equal to a predetermined value.

[0125] [Formula 2] Δλ = 100 × (λ f -λ i ) / λ i .

[0126] In equation 2, λ f λ is the absorption maximum wavelength of the resin film maintained at 85°C and 85% relative humidity for 120 hours. iThis is the absorption maximum wavelength of the resin film before it is maintained at 85°C and 85% relative humidity for 120 hours, and this absorption maximum wavelength is located within the wavelength range of 650nm to 900nm.

[0127] The upper limit of the absolute value of △λ in Equation 2 may be approximately 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or 0.5%, and its lower limit may be 0%. The absolute value of △λ may be within the range of being less than or equal to any one of the upper limits mentioned above, or within the range of being greater than or equal to any one of the lower limits mentioned above, while simultaneously being less than or equal to any one of the upper limits mentioned above.

[0128] In the above equation 2, λ f and λ i Each of these may be within the range of 650 nm to 900 nm. f and λ i The lower limits for each may be approximately 650nm, 660nm, 670nm, 680nm, 690nm, 700nm, 710nm, 720nm, 730nm, 740nm, 750nm, 760nm, or 765nm. f and λ i The upper limits for each may be approximately 900nm, 800nm, 790nm, 780nm, 770nm, 760nm, 750nm, 740nm, 730nm, 720nm, or 710nm. f and λ i Each of these may be within the range of being greater than or exceeding any one of the aforementioned lower limits, or less than or equal to any one of the aforementioned upper limits, or both greater than or exceeding any one of the aforementioned lower limits and less than or equal to any one of the aforementioned upper limits.

[0129] Through the aforementioned absorption properties, the resin film can be applied to various devices such as optical filters or infrared sensors, enabling the efficient achievement of desired characteristics.

[0130] In this specification, the resin film can be formed in known ways, insofar as the compounds or compositions of this specification are applied. For example, the resin film can be formed by coating with the compound composition in an appropriate manner and performing a curing or drying step if necessary.

[0131] There are no particular limitations on the thickness of the resin film, and the thickness can be adjusted considering the desired properties. In one example, the resin film may have a thickness in the range of approximately 0.5 to 20 μm.

[0132] This specification also relates to optical filters. The optical filter may include a substrate layer and the resin film formed on one or both sides of the substrate layer.

[0133] Figure 1 shows an example of the optical filter in which the resin film (200) is formed on one surface of the substrate layer (100).

[0134] The optical filter, by including the aforementioned resin film, can exhibit excellent performance. For example, the optical filter can efficiently and accurately block unwanted infrared light while achieving a visible light transmission band with high transmittance.

[0135] There are no particular restrictions on the type of transparent substrate applied to the optical filter; known transparent substrates for optical filters can be used.

[0136] In one example, the substrate layer may be a so-called near-infrared absorbing substrate. A near-infrared absorbing substrate is a substrate that exhibits absorption characteristics in at least a portion of the near-infrared region. So-called blue glass, which exhibits the above characteristics by containing copper, is a typical example of a near-infrared absorbing substrate. Such a near-infrared absorbing substrate is useful for constructing an optical filter that blocks light in the near-infrared region, but due to its absorption characteristics, it is disadvantageous in terms of ensuring high transmittance in the visible light region and also in terms of durability. In this specification, by selecting a near-infrared absorbing substrate and combining it with a specific resin film, it is possible to provide an optical filter that efficiently blocks desired light, exhibits high transmittance characteristics in the visible light region, and has excellent durability.

[0137] As the infrared absorbing substrate, a substrate exhibiting an average transmittance of a certain level or higher within the range of 425 nm to 560 nm can be used. The lower limit of the average transmittance may be around 75%, 77%, 79%, 81%, 83%, 85%, 87%, or 89%, and the upper limit may be around 98%, 96%, 94%, 92%, or 90%. The average transmittance may be within a range where it is greater than or greater than any one of the aforementioned lower limits, or within a range where it is greater than or greater than any one of the aforementioned lower limits, and at the same time less than or less than any one of the aforementioned upper limits.

[0138] As the infrared absorbing substrate, a substrate exhibiting a maximum transmittance of a certain level or higher within the range of 425 nm to 560 nm can be used. The lower limit of the maximum transmittance may be around 80%, 82%, 84%, 86%, 88%, or 90%, and the upper limit may be around 100%, 98%, 96%, 94%, 92%, or 90%. The maximum transmittance may be within a range where it is greater than or greater than any one of the aforementioned lower limits, or within a range where it is greater than or greater than any one of the aforementioned lower limits, and at the same time less than or less than any one of the aforementioned upper limits.

[0139] As the infrared absorbing substrate, a substrate exhibiting an average transmittance of a certain level or higher within the range of 350 nm to 390 nm can be used. The lower limit of the average transmittance may be around 75%, 77%, 79%, 81%, or 83%, and the upper limit may be around 98%, 96%, 94%, 92%, 90%, 88%, 86%, or 84%. The average transmittance may be within a range where it is greater than or greater than any one of the aforementioned lower limits, or within a range where it is greater than or greater than any one of the aforementioned lower limits, and at the same time less than or less than any one of the aforementioned upper limits.

[0140] As the infrared absorbing substrate, a substrate exhibiting a maximum transmittance of a certain level or higher within the range of 350 nm to 390 nm can be used. The lower limit of the maximum transmittance may be around 80%, 82%, 84%, 86%, or 87%, and the upper limit may be around 100%, 98%, 96%, 94%, 92%, 90%, or 88%. The maximum transmittance may be within a range where it is greater than or greater than any one of the lower limits mentioned above, or within a range where it is greater than or greater than any one of the lower limits mentioned above, and at the same time less than or less than any one of the upper limits mentioned above.

[0141] The infrared absorbing substrate may have a transmittance at a wavelength of 700 nm within a certain range. The lower limit may be approximately 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, or 28%, and the upper limit may be approximately 45%, 43%, 41%, 39%, 37%, 35%, 33%, 31%, or 29%. The transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or within a range that is less than or less than any one of the upper limits mentioned above, or within a range that is greater than or greater than any one of the lower limits mentioned above, and simultaneously less than or less than any one of the upper limits mentioned above.

[0142] The infrared absorbing substrate may have an average transmittance within a certain range in the range of 700 nm to 800 nm. The lower limit may be around 5%, 7%, 9%, 11%, 13%, 15%, 15.5%, 16%, or 16.5%, and the upper limit may be around 30%, 28%, 26%, 24%, 22%, 20%, 18%, or 17%. The average transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or within a range that is less than or less than any one of the upper limits mentioned above, or within a range that is greater than or greater than any one of the lower limits mentioned above, and at the same time less than or less than any one of the upper limits mentioned above.

[0143] The infrared absorbing substrate may have a maximum transmittance within a certain range in the range of 700 nm to 800 nm. The lower limit may be around 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, or 28%, and the upper limit may be around 43%, 41%, 39%, 37%, 35%, 33%, 31%, or 29%. The maximum transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or less than or less than any one of the upper limits mentioned above, or greater than or greater than any one of the lower limits mentioned above, and simultaneously less than or less than any one of the upper limits mentioned above.

[0144] The infrared absorbing substrate may have an average transmittance within a certain range in the range of 800 nm to 1000 nm. The lower limit may be around 3%, 5%, 7%, 9%, or 11%, and the upper limit may be around 20%, 18%, 16%, 14%, or 12%. The average transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or less than or less than any one of the upper limits mentioned above, or both greater than or greater than any one of the lower limits mentioned above and less than or less than any one of the upper limits mentioned above.

[0145] The infrared absorbing substrate may have a maximum transmittance within a certain range in the range of 800 nm to 1000 nm. The lower limit may be around 5%, 7%, 9%, 11%, 13%, or 15%, and the upper limit may be around 30%, 28%, 26%, 24%, 22%, 20%, 18%, or 16%. The maximum transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or less than or less than any one of the upper limits mentioned above, or greater than or greater than any one of the lower limits mentioned above, and simultaneously less than or less than any one of the upper limits mentioned above.

[0146] The infrared absorbing substrate may have an average transmittance within a certain range in the range of 1000 nm to 1200 nm. The lower limit may be around 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, or 25%, and the upper limit may be around 50%, 48%, 46%, 44%, 42%, 40%, 38%, 36%, 34%, 32%, 30%, 28%, or 26%. The average transmittance may be within a range that is greater than or greater than any one of the lower limits mentioned above, or within a range that is less than or less than any one of the upper limits mentioned above, or within a range that is greater than or greater than any one of the lower limits mentioned above, and at the same time less than or less than any one of the upper limits mentioned above.

[0147] The infrared absorbing substrate may have a maximum transmittance within a certain range in the range of 1000 nm to 1200 nm. The lower limit may be around 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, or 36%, and the upper limit may be around 70%, 68%, 66%, 64%, 62%, 60%, 58%, 56%, 54%, 52%, 50%, 48%, 46%, 44%, 42%, 40%, 38%, or 36%. The maximum transmittance may be within a range that is greater than or exceeds any one of the lower limits mentioned above, or less than or equal to any one of the upper limits mentioned above, or greater than or exceeding any one of the lower limits mentioned above, and simultaneously less than or equal to any one of the upper limits mentioned above.

[0148] The infrared absorbing substrate can be combined with the resin film specified herein to form the desired optical filter.

[0149] As such a substrate, a substrate known as infrared absorbing glass can be used. Such glass is an absorbing glass manufactured by adding CuO or the like to phosphate fluoride glass or phosphate glass. Therefore, in one example, as specified herein, a CuO-containing phosphate fluoride glass substrate or a CuO-containing phosphate glass substrate can also be used as the infrared absorbing substrate. In the above, phosphate glass also includes K-phosphate glass in which part of the glass skeleton is composed of SiO2. Such absorbing glasses are publicly known, and for example, the glass disclosed in Korean Patent No. 10-2056613, etc., or other commercially available absorbing glasses (for example, commercially available products from HOYA, SCHOTT, PTOT, etc.) can be used.

[0150] Such infrared absorbing substrates contain copper. In this specification, substrates having a copper content in the range of 1% to 7% by weight can be used. In other examples, the copper content may be approximately 1.5% or more by weight, 2% or more by weight, 2.5% or more by weight, 2.6% or more by weight, 2.7% or more by weight, or 2.8% or more by weight, or approximately 6.5% or less by weight, 6% or less by weight, 5.5% or less by weight, 5% or less by weight, 4.5% or less by weight, 4% or less by weight, 3.5% or less by weight, 3% or less by weight, or 2.9% or less by weight. Substrates having such a copper content tend to exhibit the aforementioned optical properties and can be combined with the resin film to form an optical filter with desired properties.

[0151] The copper content can be confirmed using X-ray fluorescence spectrometry (WD XRF, Wavelength Dispersive X-Ray Fluorescence Spectrometry). When X-rays are irradiated onto a specimen (substrate layer) using this equipment, characteristic secondary X-rays are generated from individual elements of the specimen, and the equipment detects these secondary X-rays according to the wavelength of each element. The intensity of the secondary X-rays is proportional to the elemental content, and therefore, quantitative analysis can be performed through the intensity of the secondary X-rays measured according to the wavelength of each element.

[0152] The thickness of the infrared absorbing substrate can be adjusted, for example, within a range of approximately 0.03 mm to 5 mm, but is not limited thereto.

[0153] The optical filters described herein may further include other known components necessary for the substrate layer and resin film.

[0154] For example, the optical filter may further include a dielectric film. The dielectric film may further include, for example, a so-called dielectric film on one or both sides of the substrate layer.

[0155] Figures 2 and 3 show examples of optical filters with a dielectric film (300) added, where the dielectric film (300) is formed on one or both sides of a laminated structure including a substrate layer (100) and a resin film (200).

[0156] Such dielectric films are constructed by repeatedly stacking a low refractive index dielectric material and a high refractive index dielectric material, and are used to form so-called IR reflective layers and AR (Anti-reflection) layers. In this specification, such known dielectric films for forming IR reflective layers and AR layers can also be applied.

[0157] Therefore, the dielectric film may be a multilayer structure comprising at least two sublayers, each with a different refractive index, or it may include a multilayer structure in which the two types of sublayers are repeatedly stacked.

[0158] The type of material forming the dielectric film, i.e., the material forming each of the sublayers, is not particularly limited, and known materials can be used. Typically, SiO2 or Na5Al3F is used to manufacture the low refractive index sublayer. 14 Fluorides such as Na3AlF6 or MgF2 can be used, and amorphous silicon, TiO2, Ta2O5, Nb2O5, ZnS, or ZnSe can be used to produce the high refractive index sublayer, but the materials used herein are not limited to those stated above.

[0159] The method for forming the dielectric film described above is not particularly limited, and for example, it can be formed by applying a known deposition method. In the industry, methods for controlling the reflection or transmission characteristics of the dielectric film by considering the thickness and number of layers of the deposited sublayer are known, and in this specification, the dielectric film can be formed according to such a known method.

[0160] Furthermore, the optical filter may further include a resin film that exhibits absorption characteristics to ultraviolet light (hereinafter referred to as an ultraviolet resin film), which is distinct from the resin film. However, such a resin film is not an essential component; for example, an ultraviolet compound, as described later, can be introduced into a single resin film together with the compounds disclosed in this specification.

[0161] In one example, the ultraviolet resin film can be designed to exhibit an absorption maximum in the wavelength range of approximately 300 nm to 390 nm.

[0162] The aforementioned ultraviolet resin film may contain only an ultraviolet compound, or, if necessary, two or more ultraviolet compounds.

[0163] For example, known compounds that exhibit an absorption maximum in the wavelength range of approximately 300 nm to 390 nm can be used as ultraviolet compounds.

[0164] The materials and construction methods for such an ultraviolet resin film are not particularly limited, and known materials and construction methods can be applied.

[0165] Typically, ultraviolet resin films are formed using a material that combines an ultraviolet compound, which is designed to exhibit a desired absorption maximum, with a transparent resin. In this case, the transparent resin can be a resin component applicable to the compound composition.

[0166] Optical filters can be added to various other layers besides those mentioned above, as long as they do not impair the desired effect.

[0167] This specification also relates to an imaging device including the optical filter. In this case, the configuration of the imaging device and the application method of the optical filter are not particularly limited, and known configurations and application methods can be applied.

[0168] Furthermore, the applications of the optical filters described herein are not limited to the imaging device described above, but can also be applied to various other applications requiring near-infrared filtering, such as display devices like PDPs.

[0169] This specification also relates to an infrared sensor including the resin film. The configuration of the infrared sensor is not particularly limited as long as it includes the resin film, and can be configured, for example, by introducing the resin film into a known motion sensor, proximity sensor, or gesture sensor.

[0170] Furthermore, the applications of the compound compositions or resin films described herein are not limited to the optical filters, infrared sensors, and / or imaging devices, but can also be applied to various other applications requiring infrared filtering, such as electronic components like LiDAR. [Effects of the Invention]

[0171] This specification discloses compounds and their applications. This specification provides compounds that exhibit excellent heat resistance and oxidation resistance, and can stably maintain their absorbance properties even under high-temperature or high-temperature, high-humidity conditions. Furthermore, this specification provides resin films to which the aforementioned compounds can be applied to ensure desired optical properties. This specification also provides applications for the aforementioned compounds. [Brief explanation of the drawing]

[0172] [Figure 1] This figure shows an exemplary structure of an optical filter disclosed herein. [Figure 2] This figure shows an exemplary structure of an optical filter disclosed herein. [Figure 3] This figure shows an exemplary structure of an optical filter disclosed herein. [Figure 4] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 5] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 6] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 7] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 8] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 9]This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 10] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Figure 11] This figure shows the absorbance characteristics of resin films containing the compounds of the examples or comparative examples before and after high-temperature and high-humidity evaluation. [Modes for carrying out the invention]

[0173] The compounds disclosed herein will be described in detail below through examples and comparative examples, but the scope of such compounds is not limited by the examples below.

[0174] 1. Method for measuring the absorption maximum wavelength The absorption maximum wavelength of the compound was evaluated using a standard method. Specifically, the sample (compound) was dissolved in chloroform for approximately 10 minutes. -5 After dissolving at concentration M, the absorption maximum wavelength was evaluated using measurement equipment (Agilent, Varian Cary 4000).

[0175] 2. Evaluation of the transmittance spectrum The transmittance spectrum was measured using a spectrophotometer (Perkinelmer, Lambda750 spectrophotometer) on specimens obtained by cutting the material to be measured (e.g., a resin film) into pieces with dimensions of 10 mm in width and 10 mm in length. The transmittance spectrum was measured at different wavelengths according to the equipment's manual. The specimen was positioned on a straight line between the spectrophotometer's measurement beam and the detector, and the transmittance spectrum was confirmed with the measurement beam incident angle set to 0 degrees. This incident angle of 0 degrees is substantially parallel to the direction normal to the specimen surface.

[0176] In a transmittance spectrum, the average transmittance within a predetermined wavelength range is the result of measuring the transmittance at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength in the wavelength range, and then calculating the arithmetic mean of the measured transmittances. The maximum transmittance is the highest transmittance among those measured while increasing the wavelength by 1 nm, and the minimum transmittance is the lowest transmittance among those measured while increasing the wavelength by 1 nm. For example, the average transmittance in the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm, and the maximum transmittance in the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, and 355 The highest transmittance among those measured at wavelengths of 350nm, 356nm, 357nm, 358nm, 359nm, and 360nm is the lowest transmittance among those measured at wavelengths of 350nm, 351nm, 352nm, 353nm, 354nm, 355nm, 356nm, 357nm, 358nm, 359nm, and 360nm.

[0177] 3.Thermal decomposition temperature (Td 5%) analysis Thermogravimetric analysis (TGA) of the compound was performed using Shinco's TGA N-1000 equipment. Approximately 3 mg of the sample (compound) was used for the analysis, with a temperature range of 25°C to 800°C, a heating rate of 10°C / min, and a 60cm² temperature range. 3 The analysis was performed under a nitrogen (N2) atmosphere at a rate of [number] minutes. The Td decomposition temperature used was the value at a weight loss of 95% (Td 5%).

[0178] 4.Mass analysis (Maldi-tof) Mass analysis of the compounds was performed using a MALDI TOF Voyager DE-STR (Applied Biosystems, USA), measured in positive mode in reflector mode, and analyzed using a dithranol matrix.

[0179] 5. Deuterium substitution rate The deuterium substitution rate of a compound is determined by hydrogen nuclear magnetic resonance ( 1 The analysis was performed via 1H NMR. The deuterium-substituted compound (sample compound) and the compound with the same structure before deuterium substitution (reference compound) were compared. 1 Each of the above reference compounds was subjected to 1H-NMR analysis. 1 The position and area of ​​the hydrogen peak of the compound in question were confirmed by 1H-NMR analysis, and the sample compound... 1 ¹H-NMR analysis was performed to determine the position and area of ​​the non-deuterium hydrogen peaks and the deuterium peaks of the compound. By comparing the aforementioned peak positions and areas, the deuterium substitution rate was confirmed.

[0180] The substitution rate was calculated using the following formula A.

[0181] [Formula A] Replacement rate=100×D / H

[0182] In formula A, D is the relative to the sample compound. 1 This is the integral value of the deuterium peak in 1H-NMR analysis, where H is relative to the reference compound. 1 This is the integral value of the hydrogen peak in 1H-NMR analysis.

[0183] On the other hand, 1 ¹H NMR analysis was performed using a JEOL JNM-ECX400, by dissolving the sample compound or reference compound in CDCl3 containing TMS (tetramethylsilane), and chemical transfer was expressed in ppm.

[0184] Example 1. Compound A, represented by the chemical formula A below, was synthesized using the following method.

[0185] [ka] ···Chemical formula A

[0186] In chemical formula A, D is either hydrogen or deuterium, but at least one of D is deuterium.

[0187] Compound A was synthesized using compound E of chemical formula E from Comparative Example 1. 0.01 mol of compound E from Comparative Example 1, 0.54 g of silver carbonate (Ag2CO3), and 1.34 g of cyclohexyldiphenylphosphine were placed in a three-necked flask equipped with a reflux apparatus. Subsequently, 0.1 mL of toluene and excess deuterium oxide were added, and the mixture was stirred at approximately 120°C for 24 hours. Then, 10 mL of dichloromethane and 5 mL of water were added to the flask, and the mixture was further stirred for approximately 30 minutes. The dichloromethane layer was separated from the mixture using a fractionation funnel, and the target compound (compound A) was obtained by recrystallization after adding methanol (Maldi-tof m / z 630.01 [M+H]). + ).

[0188] The deuterium substitution rate of compound A in Example 1 was approximately 79.1%.

[0189] Example 2. Compound B, represented by the chemical formula B below, was synthesized using the following method.

[0190] [ka] ...Chemical formula B

[0191] In chemical formula B, D is either hydrogen or deuterium, but at least one of D is deuterium.

[0192] Compound B was synthesized in the same manner as in Example 1, except that compound F with chemical formula F from Comparative Example 2 was used instead of compound E from Comparative Example 1 (Maldi-tof m / z 518.19 [M+H]). + ).

[0193] The deuterium substitution rate of compound B in Example 2 was approximately 74.2%.

[0194] Example 3. Compound C, with the following chemical formula C, was synthesized using the method described below.

[0195] [ka] ...Chemical formula C

[0196] In chemical formula C, D is either hydrogen or deuterium, but at least one of D is deuterium.

[0197] Compound C was synthesized in the same manner as in Example 1, except that compound G from Comparative Example 3 was used instead of compound E from Comparative Example 1 (Maldi-tof m / z 622.03 [M+H]). + ).

[0198] The deuterium substitution rate of compound C in Example 3 was approximately 91.3%.

[0199] Example 4. Compound D, with the following chemical formula D, was synthesized using the method described below.

[0200] [ka] ...Chemical formula D

[0201] In chemical formula D, D is either hydrogen or deuterium, but at least one of D is deuterium.

[0202] The compound D was synthesized in the same manner as in Example 1, except that compound H of Comparative Example 4 was used instead of compound E of Comparative Example 1 (Maldi-tof m / z 621.57 [M+H] + ).

[0203] The deuterium substitution rate of the compound D of Example 4 was about 90.5%.

[0204] Comparative Example 1. Compound E of the following chemical formula E was synthesized by the following method.

[0205]

Chemical formula

[0206] 1 g of squaric acid, 4 g of N-(1-isobutyl-2,3,3-trimethyl-2,3,6,7-tetrahydro-1H-indol-4-yl)acetamide, and 4 g of triethyl orthoformate were placed in a beaker. After adding 20 mL of n-butanol as a solvent, the mixture was stirred at about 90 °C for about 3 hours. Then, after cooling the reaction mixture using an ice bath for about 60 minutes, 40 mL of ethanol was added to obtain the target compound (Compound E) (Maldi-tof m / z 626.34 [M+H] + ).

[0207] <� The deuterium substitution rate of the compound E of Comparative Example 1 was 0%.

[0208] Comparative Example 2. Compound F of the following chemical formula F was synthesized by the following method.

[0209]

Chemical formula

[0210] 1 g of squaric acid, 5.5 g of 1-isobutyl-2,3,3-trimethyl-3H-indol-1-ium bromide, and 4 g of triethyl orthoformate were placed in a beaker. 20 mL of n-butanol was added as a solvent, and the mixture was stirred at approximately 90°C for approximately 3 hours. The reaction mixture was cooled using an ice bath for 60 minutes, and 40 mL of ethanol was added to obtain the target compound (compound F) (Maldi-tof m / z 508.32 [M+H]). + ).

[0211] The deuterium substitution rate of the obtained compound was 0%.

[0212] Comparative Example 3. Compound G, with the chemical formula G shown below, was synthesized using the following method.

[0213] [ka] ...Chemical formula G

[0214] 1 g of squaric acid, 4.95 g of 1-isobutyl-2,3,3-trimethyl-2,3-dihydro-1H-benzo[g]indole, and 4 g of triethyl orthoformate were placed in a beaker. 20 mL of n-butanol was added as a solvent, and the mixture was stirred at approximately 90°C for approximately 3 hours. The reaction mixture was cooled using an ice bath for 60 minutes, and 40 mL of ethanol was added to obtain the target compound (compound G) (Maldi-tof m / z 612.4 [M+H]). + ).

[0215] The deuterium substitution rate of the aforementioned compound was approximately 0%.

[0216] Comparative Example 4. Compound H of the following chemical formula H was synthesized by the following method.

[0217] [Chemical Formula] ···Chemical formula H

[0218] 1 g of squaric acid, 6.4 g of 3-isobutyl-1,1,2-trimethyl-1H-benzo[e]indol-3-ium bromide, and 4 g of triethyl orthoformate were placed in a beaker. After adding 20 mL of n-butanol as a solvent, the mixture was stirred at about 90 °C for about 3 hours. Subsequently, the reaction product was cooled in an ice bath for 60 minutes, and 40 mL of ethanol was added to obtain the target compound (Compound H) (Maldi-tof m / z 608.4 [M+H] + ).

[0219] The deuterium substitution rate of the said compound was 0%.

[0220] Table 1 summarizes the absorption capabilities of the compounds of each example and comparative example. In Table 1, T%(λmax) is the transmittance at each absorption maximum wavelength confirmed by the above "1. Method for Measuring Absorption Maximum Wavelength". Td 5% in Table 1 is the temperature (Td 5%) at which 95% weight loss of the compound occurred in the TGA (Thermogravimetric analysis) analysis of the above "3. Analysis of Thermal Decomposition Temperature (Td 5%)".

[0221] [Table 1]

[0222] Through Table 1, it can be confirmed that each compound of Examples 1 to 4 exhibits excellent heat resistance while showing absorption characteristics equivalent to those of Comparative Examples 1 to 4.

[0223] Test Example 1. A coating solution was prepared by mixing a cyclic olefin resin (TOPAS, 5013F-04), a compound, and a solvent (Cyclohexanone). The compound used was one synthesized in the examples or comparative examples. The mixing ratio of the cyclic olefin resin, compound, and solvent was approximately 69.3:0.99:29.7 by weight (cyclic olefin resin:compound:solvent). The coating solution was applied to a transparent substrate (SCHOTT glass substrate) and maintained at 140°C for approximately 2 hours to form a resin film with a thickness of approximately 6 μm.

[0224] Table 2 below summarizes the transmittance of the resin film manufactured using the compound of the example as the coating liquid compound, before and after reliability evaluation in the visible light and infrared regions. Table 3 below summarizes the transmittance of the resin film manufactured using the compound of the comparative example as the coating liquid compound, before and after reliability evaluation in the visible light and infrared regions.

[0225] The reliability evaluation described above involves maintaining the resin film at 85°C and 85% relative humidity for 120 hours. In Tables 2 and 3 below, B represents the results before the reliability evaluation, and A represents the results after the reliability evaluation. Also, in Tables 2 and 3 below, λmax represents the transmittance at each absorption maximum wavelength confirmed in "1. Absorption Maximum Wavelength Measurement Method".

[0226] In Tables 2 and 3 below, △ represents the percentage change (%) of each characteristic before and after the reliability evaluation, calculated as 100 × (AB) / B. In the above, A is the value indicated by A in Tables 2 and 3 below, and B is the value indicated by B in Tables 2 and 3 below. In Tables 2 and 3 below, T is the transmittance at the relevant wavelength. min This is the minimum transmittance within the relevant wavelength range, and T ave This refers to the average transmittance within the given wavelength range.

[0227] [Table 2]

[0228] [Table 3]

[0229] Test example 2. Figures 4-11 show the evaluation results for resin films manufactured using the compounds of Examples 1-4 and Comparative Examples 1-4 according to the method of Test Example 1. In Figures 4-11, the horizontal axis represents wavelength (nm), and the vertical axis represents transmittance (%). Results indicated as "before high temperature and high humidity" are the results immediately after the resin film was manufactured, while results indicated as "after high temperature and high humidity" are the results after reliability evaluation (same conditions as in Test Example 1) was performed on the resin film.

[0230] Referring to Figures 4-11, the resin film using the compound in the example shows only a slight change in absorbance properties before and after high temperature and humidity. In contrast, the resin film using the compound in the comparative example shows a very large change in absorbance properties before and after high temperature and humidity, and it can be confirmed that the absorbance properties are almost completely lost.

[0231] The main points from Figures 4-11 are summarized in Table 4 below. In Table 4 below, A f λ is the transmittance at the wavelength of absorption maximum of the resin film maintained at 85°C and 85% relative humidity for 120 hours, f This is the wavelength of the absorption maximum at this time, and A i λ is the transmittance at the absorption maximum wavelength of the resin film before it is maintained at 85°C and 85% relative humidity for 120 hours, i This is the wavelength of the absorption maximum at that time.

[0232] In Table 4 below, △A is 100 × (A f -A i ) / A i The value is calculated as follows: △λ is 100 × (λ f -λ i ) / λ i This is the value calculated using [the formula / method].

[0233] [Table 4]

[0234] Comparing the results in Tables 1-4 and Figures 4-11, it can be seen that while the spectral characteristics of the compounds in the examples and the comparative examples are similar, there are significant differences in their absorption characteristics when applied to a resin film and / or after high-temperature and high-humidity evaluation. From this, it can be confirmed that the compound can absorb light in the infrared region due to its unique structure, and at the same time has excellent heat resistance and / or oxidation resistance, effectively forming a resin film with superior performance. [Explanation of Symbols]

[0235] 100: Base material layer 200: Resin film 300: Dielectric film

Claims

1. A compound represented by the following chemical formula 1, containing one or more deuterium atoms, 【Chemistry 1】 ...Chemical formula 1 In chemical formula 1, one of X and Y is a single bond, and the other is a double bond. R １ It forms the structure of chemical formula 2 below, R ２ is either hydrogen or deuterium, or R １ and R ２ Together, they form the structure of the following chemical formula 3, R ３ It forms the structure of chemical formula 4 below, R ４ is either hydrogen or deuterium, or R ３ and R ４ Together they form the structure of chemical formula 5 below, 【Chemistry 2】 ...Chemical formula 2 In Chemical Formula 2, R ５ is carbon as R in Chemical Formula 1 １ , and R ６ to R ８ are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group, an alkylcarbonyl group, an alkoxy group, an alkylamino group, an alkylsilyl group, an amino group, a nitro group, a nitrile group, a hydroxy group or a cyano group, R ９ ~R １２ Each is independently hydrogen or deuterium, but R ９ and R １０ , R １０ and R １１ , or R １１ and R １２ These molecules link together to form deuterium-substituted or unsubstituted aromatic structures. 【Transformation 3】 ...Chemical formula 3 In chemical formula 3, R １３ and R １４ One of them is R of chemical formula 1 １ And the other one is R of chemical formula 1. ２ Each of them is carbon, and R １５ ~R ２０ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And, The aforementioned R ａ and R ｂ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. R ２１ and R ２２ Each of these elements is either hydrogen or deuterium, or linked together to form a deuterium-substituted or unsubstituted aromatic structure. 【Chemistry 4】 ...Chemical formula 4 In chemical formula 4, R ２３ This is R of chemical formula 1. ３ As carbon, R ２４ ~R ２６ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. R ２７ ~R ３０ Each is independently hydrogen or deuterium, but R ２７ and R ２８ , R ２８ and R ２９ , or R ２９ and R ３０ These molecules link together to form a benzene structure that is substituted or unsubstituted with deuterium. 【Transformation 5】 ...Chemical formula 5 In chemical formula 5, R ３１ and R ３２ One of them is R of chemical formula 1 ３ And the other one is R of chemical formula 1. ４ Each of them is carbon, and R ３３ ~R ３８ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And, The aforementioned R ａ and R ｂ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. R ３９ and R ４０ A compound characterized in that each element is either hydrogen or deuterium independently, or linked together to form a benzene structure that is substituted or unsubstituted with deuterium.

2. The aforementioned R １ This forms the structure of the chemical formula 2, and the R ２ The compound according to claim 1, wherein deuterium is present.

3. In the above chemical formula 2, the R ６ ~R ８ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ９ ~R １２ The compound according to claim 2, wherein each of them is independently deuterium.

4. In the above chemical formula 2, the R ６ ~R ８ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ９ and R １０ These are linked together to form an aromatic structure substituted with deuterium, and the R １１ and R １２ The compound according to claim 2, wherein deuterium is present.

5. In the above chemical formula 1, the R ３ This forms the structure of chemical formula 4, and the R ４ The compound according to claim 2, wherein deuterium is present.

6. In the above chemical formula 4, the R ２４ ~R ２６ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ２７ ~R ３０ The compound according to claim 5, wherein each of these is deuterium.

7. In the above chemical formula 4, the R ２４ ~R ２６ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ２７ and R ２８ Each of these is deuterium, and the R ２９ and R ３０ The compound according to claim 5, wherein the compounds are linked together to form an aromatic structure substituted with deuterium.

8. In the above chemical formula 1, the R １ and R ２ The compound according to claim 1, wherein the compound forms the structure of the chemical formula 3.

9. In the chemical formula 3, the R １５ to R ２０ are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group, an alkoxy group or -NR ａ R ｂ ; the R ａ and R ｂ are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group or an alkylcarbonyl group; and the R ２１ and R ２２ are each deuterium. The compound according to claim 8.

10. In the above chemical formula 3, the R １５ ~R ２０ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ２１ and R ２２ The compound according to claim 8, wherein the compounds are linked together to form an aromatic structure substituted with deuterium.

11. In the above chemical formula 1, the R ３ and R ４ The compound according to claim 8, wherein the compound forms the structure of the chemical formula 5.

12. In the chemical formula 5, the R ３３ to R ３８ are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group, an alkoxy group or -NR ａ R ｂ ; the R ａ and R ｂ are each independently hydrogen, deuterium, an alkyl group, an alkyloxy group or an alkylcarbonyl group; and the R ３９ and R ４０ are each deuterium. The compound according to claim 11.

13. In the above chemical formula 5, the R ３３ ~R ３８ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, or alkoxy group, and the R ３９ and R ４０ The compound according to claim 11, wherein the compounds are linked together to form an aromatic structure substituted with deuterium.

14. The aforementioned chemical formula 1 is represented by one of the following chemical formulas 6 to 9: 【Transformation 6】 ...Chemical formula 6 In chemical formula 6, R ４１ ~R ５４ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And in the foregoing, R ａ and R ｂ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. 【Transformation 7】 ...Chemical formula 7 In chemical formula 7, R ５５ ~R ７０ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And in the foregoing, R ａ and R ｂ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. 【Transformation 8】 ...Chemical formula 8 In chemical formula 8, R ７１ ~R ９０ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And in the foregoing, R ａ and R ｂ Each of these is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group. 【Chemistry 9】 ...Chemical formula 9 In chemical formula 9, R ９１ ~R １１０ Each of these independently consists of hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, cyano group, or -NR ａ R ｂ And in the foregoing, R ａ and R ｂ The compound according to claim 1, wherein each of them is independently hydrogen, deuterium, alkyl group, alkyloxy group, alkylcarbonyl group, alkoxy group, alkylamino group, alkylsilyl group, amino group, nitro group, nitrile group, hydroxy group, or cyano group.

15. The compound according to claim 1, wherein the deuterium substitution rate is 10% or more.

16. A composition comprising a resin component and the compound described in claim 1, wherein the composition comprises 0.001 to 10 parts by weight of the compound per 100 parts by weight of the resin component.

17. A resin film comprising a resin component and the compound described in claim 1, exhibiting an absorption maximum in the wavelength range of 650 nm to 900 nm.

18. The resin film according to claim 17, wherein ΔA in the following formula 2 is 50% or less. [Formula 2] △A=100×(A ｆ -A ｉ ) / A ｉ In equation 2, A ｆ A is the transmittance at the wavelength of absorption maximum of the resin film maintained at 85°C and 85% relative humidity for 120 hours. ｉ This is the transmittance at the wavelength of absorption maximum of the resin film before it is maintained at 85°C and 85% relative humidity for 120 hours.

19. The resin film according to claim 17, wherein the absolute value of Δλ in the following formula 3 is 10% or less. [Formula 3] △λ=100×(λ) ｆ -l ｉ ) / l ｉ . In equation 3, λ ｆ λ is the absorption maximum wavelength of the resin film maintained at 85°C and 85% relative humidity for 120 hours. ｉ This is the maximum absorption wavelength of the resin film before it is maintained at 85°C and 85% relative humidity for 120 hours.

20. Substrate layer, and An optical filter comprising a resin film according to claim 17, formed on one or both sides of the substrate layer.

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