Holding device

Abstract

This invention provides a technology to improve heat uniformity in a holding device. [Solution] The holding device comprises a plurality of flow path forming members that form a flow path through which the refrigerant flows, and a joint that connects the plurality of flow path forming members to each other, with a gap that communicates with the flow path formed between the flow path forming members and the joint.

Description

Technical Field

[0001] The present invention relates to a holding device.

Background Art

[0002] Conventionally, a holding device having a flow path through which a refrigerant flows and holding an object has been known (for example, Patent Documents 1 to 4).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, even with the prior art such as Patent Documents 1 to 4, there is still room for improvement in the technology for improving the temperature uniformity in the holding device.

[0005] An object of the present invention is to provide a technology for improving the temperature uniformity in a holding device.

Means for Solving the Problems

[0006] The present invention has been made to solve at least a part of the above problems and can be realized in the following forms.

[0007] (1) According to one embodiment of the present invention, a holding device for holding an object is provided. The holding device comprises a plurality of flow path forming members that form a flow path through which a refrigerant flows, and a joint that joins the plurality of flow path forming members to each other, wherein a gap that communicates with the flow path is formed between the flow path forming members and the joint.

[0008] In this configuration, the gap formed between the flow path forming member and the joint is in communication with the flow path, allowing the refrigerant flowing through the flow path to enter and exit. This allows the refrigerant to circulate over a wider area inside the holding device than the area occupied by the flow path. Therefore, the uniformity of the heat distribution in the holding device can be improved.

[0009] (2) The holding device of the above form further has a mounting surface on which the object is placed, each of the plurality of flow path forming members has a plate shape having a pair of main surfaces, each of the pair of main surfaces is arranged parallel to the mounting surface, the joint is in contact with at least one of the pair of main surfaces of the flow path forming member, and the plurality of flow path forming members and the joint are stacked. With this configuration, the flow path forming members having a pair of main surfaces are arranged parallel to the mounting surface, and the joint is in contact with one of the pair of main surfaces of the flow path forming member. As a result, the gap through which the refrigerant enters and exits is formed along a direction parallel to the mounting surface, thereby improving uniform heat distribution on the mounting surface.

[0010] (3) A holding device of the above form, wherein in a cross-section including the central axis of the holding device and including a plurality of cross-sections of the flow channels, there is a first specific region as a specific region including the space between the flow channel forming member and the joint, and a second specific region located between the first specific region and the specific flow channel closest to the first specific region among the plurality of flow channels, and the length of the portion in the second specific region where the flow channel forming member and the joint are in contact may be shorter than the length of the portion in the first specific region where the flow channel forming member and the joint are in contact. According to this configuration, in a cross-section including the central axis of the holding device and including a plurality of cross-sections of the flow channels, when a first specific region including the space between the flow channel forming member and the joint and a second specific region closer to the specific flow channel than the first specific region are set, the length of the portion in the second specific region where the flow channel forming member and the joint are in contact is shorter than the length of the portion in the first specific region where the flow channel forming member and the joint are in contact. In other words, in the second specific region relatively close to the specific flow path, there are relatively many gaps where the flow path forming member and the joint are not in contact, thus widening the area over which the refrigerant can spread. On the other hand, in the first specific region relatively far from the specific flow path, the portion in contact between the flow path forming member and the joint becomes longer, allowing multiple flow path forming members to be reliably joined via the joint.

[0011] (4) In the above-described form of the holding device, the length of the portion in which the flow path forming member included in the specific region and the joint portion are in contact may decrease as the center of the specific region approaches the specific flow path. With this configuration, a gap is formed such that the length of the portion in which the flow path forming member and the joint portion are in contact decreases as the center of the specific region approaches the specific flow path. This makes it possible to increase the joining force of the flow path forming member via the joint portion while widening the area over which the refrigerant can reach.

[0012] (5) In the above-described form of the holding device, the end of the joint on the flow path side may be formed to protrude. With this configuration, since the end of the joint on the flow path side is formed to protrude, the flow of refrigerant through the flow path is more likely to become turbulent. That is, because the flow of refrigerant is more likely to become turbulent, heat exchange between the flow path forming member or joint and the refrigerant is promoted. This makes it possible to improve the cooling efficiency of the refrigerant.

[0013] (6) In the above-described form of the holding device, the joint portion may be made of metal. With this configuration, the joint portion is made of a metal with relatively high thermal conductivity. As a result, the coldness of the refrigerant is more easily transmitted to the flow path forming member through the joint portion, thereby improving the cooling performance of the holding device.

[0014] Furthermore, the present invention can be realized in various forms, for example, in the form of a method for manufacturing a holding device, a system equipped with a holding device, a method for controlling the holding device and the system equipped with a holding device, a computer program for manufacturing the holding device and the system equipped with a holding device, and so on. [Brief explanation of the drawing]

[0015] [Figure 1] This is a perspective view of the holding device of the first embodiment. [Figure 2] This is a cross-sectional view of the holding device according to the first embodiment. [Figure 3] This is an enlarged view of section A in Figure 2. [Figure 4] This is the first figure illustrating the features of the holding device according to the first embodiment. [Figure 5] This is a second figure illustrating the features of the holding device according to the first embodiment. [Figure 6] This is the third figure illustrating the features of the holding device of the first embodiment. [Figure 7] This is the fourth figure illustrating the features of the holding device according to the first embodiment. [Figure 8] This figure illustrates the effect of the holding device of the first embodiment. [Figure 9] It is a cross-sectional view of the holding device of the second embodiment. [Figure 10] It is a cross-sectional view of the holding device of the third embodiment. [Figure 11] It is a cross-sectional view of the holding device of the fourth embodiment. [Figure 12] It is a cross-sectional view of the holding device of the fifth embodiment. [Figure 13] It is a cross-sectional view of the holding device of the sixth embodiment.

Embodiments for Carrying out the Invention

[0016] <First Embodiment> FIG. 1 is a perspective view of the holding device 1 of the first embodiment. FIG. 2 is a cross-sectional view of the holding device 1 of the first embodiment, showing a cross-section including the central axis C1 of the holding device 1. The holding device 1 of the first embodiment is provided in, for example, an etching device or the like, and is a so-called electrostatic chuck that holds the wafer W by adsorbing it with an electrostatic attraction force. The holding device 1 includes a first member 10, a second member 20, and a bonding layer 30. In the holding device 1, as shown in FIG. 1, the first member 10, the bonding layer 30, and the second member 20 are laminated in this order from the minus side in the z-axis direction (lamination direction). In the present embodiment, the holding device 1 is a columnar body having a substantially circular cross-sectional shape perpendicular to the lamination direction. Note that FIGS. 1 and 2 schematically show the arrangement of each part and do not accurately represent the dimensional ratio of each part.

[0017] The first member 10 is a substantially circular member mainly formed of silicon carbide (SiC). Inside the first member 10, a flow path 100 through which a refrigerant such as a fluorine-based inert liquid or water flows is formed. The first member 10 functions as a cooling part in the holding device 1. The detailed configuration of the first member 10 will be described later.

[0018] The second member 20 is a substantially circular flat plate member made of alumina (Al2O3). The second member 20 functions as a holding part for holding the wafer W in the holding device 1. The second member 20 has a mounting surface 20a on which the wafer W is placed. The wafer W placed on the mounting surface 20a is attracted and fixed to the mounting surface 20a by the electrostatic attraction generated by the chuck electrode 21 located inside the second member 20. In this embodiment, a heater electrode 22 for heating the wafer W that is attracted and fixed to the mounting surface 20a is built into the second member 20. The material forming the second member 20 may be aluminum nitride (AlN), silicon carbide, etc. In addition to the chuck electrode 21 and heater electrode 22, the second member 20 may also have a high-frequency electrode built into it.

[0019] The bonding layer 30 is positioned between the first member 10 and the second member 20, and joins the first member 10 and the second member 20. The bonding layer 30 is a brazing material containing aluminum (Al). The bonding layer 30 in this embodiment has a substantially disc shape with an outer diameter the same size as the second member 20. Holes (tunnels) (not shown) are formed in the bonding layer 30 along the stacking direction of the holding device 1. Terminals for supplying current to the chuck electrode 21 and lift pins (not shown) used when detaching the wafer W from the mounting surface 20a are inserted through the holes formed in the bonding layer 30.

[0020] Next, the features of the holding device 1 of this embodiment will be described. The first member 10 of the holding device 1 comprises a plurality of flow path forming members 11, 12, and 13 that form a flow path 100 through which the refrigerant flows, and joining parts 14 and 15 that join the plurality of flow path forming members 11, 12, and 13. In the first member 10, the plurality of flow path forming members 11, 12, and 13 and the joining parts 14 and 15 are stacked. Specifically, as shown in Figure 2, in the first member 10, the flow path forming member 11, the joining part 14, the flow path forming member 12, the joining part 15, and the flow path forming member 13 are stacked in that order from the positive side in the z-axis direction.

[0021] Each of the multiple channel-forming members 11, 12, and 13 is made of silicon carbide. Channel-forming member 11 has a plate shape with a pair of main surfaces 11a and 11b, and each of the pair of main surfaces 11a and 11b is arranged to be parallel to the mounting surface 20a. Channel-forming member 12 has a plate shape with a pair of main surfaces 12a and 12b, and each of the pair of main surfaces 12a and 12b is arranged to be parallel to the mounting surface 20a. Channel-forming member 13 has a plate shape with a pair of main surfaces 13a and 13b, and each of the pair of main surfaces 13a and 13b is arranged to be parallel to the mounting surface 20a. Channel-forming member 12 has a space 12c that becomes a channel 100 when sandwiched between channel-forming member 11 and channel-forming member 13. The space 12c is open to each of the pair of main surfaces 12a and 12b. Furthermore, the materials used to form the flow channel forming members 11, 12, and 13 may include aluminum, titanium (Ti), molybdenum (Mo), alloys containing these metals, SUS, alumina, aluminum nitride, metal-ceramic composite materials (MMC, Metal Matrix Composites) such as Al / SiC and Ti / SiC.

[0022] The joints 14 and 15 are made of metal. In this embodiment, the joints 14 and 15 are made of aluminum. The joint 14 is positioned between the flow path forming member 11 and the flow path forming member 12. The joint 15 is positioned between the flow path forming member 12 and the flow path forming member 13. The joints 14 and 15 may also be made of resin materials such as silicone or epoxy, or titanium.

[0023] The joint portion 14 is in contact with the other main surface 11b of the pair of main surfaces 11a, 11b of the flow path forming member 11, and is in contact with one of the pair of main surfaces 12a, 12b of the flow path forming member 12. The joint portion 14 joins the flow path forming member 11 and the flow path forming member 12 together. The joint portion 15 is in contact with the other main surface 12b of the pair of main surfaces 12a, 12b of the flow path forming member 12, and is in contact with one of the pair of main surfaces 13a, 13b of the flow path forming member 13. The joint portion 15 joins the flow path forming member 12 and the flow path forming member 13 together.

[0024] Figure 3 is an enlarged view of section A in Figure 2. Figure 3 shows a schematic diagram of a portion of the cross-sectional view of the holding device 1 shown in Figure 2, specifically the section where the flow path forming member 11 and the flow path forming member 12 are joined by the joint 14. In the holding device 1 of this embodiment, a gap 110 communicating with the flow path 100 is formed between the flow path forming members 11, 12 and the joint 14. In Figure 3, the gap 110, which is not visible in the cross-section shown in Figure 3, is indicated by a dotted line. This allows the refrigerant flowing through the flow path 100 to enter and exit the gap 110. Note that while Figure 3 shows the gap 110 formed between the flow path forming members 11, 12 and the joint 14, a gap 110 communicating with the flow path 100 is also formed between the flow path forming members 12, 13 and the joint 15.

[0025] Here, we will explain how to determine whether the gap 110 formed between the flow path forming members 11, 12, 13 and the joints 14, 15 in the holding device 1 communicates with the flow path 100. A cutaway model of the holding device 1 including the central axis C1 is made. Specifically, the holding device 1 is made in a state where the cross section as shown in Figure 2 is visible. When liquid is flowed through the flow path 100 of the made cutaway model, the extent to which the liquid spreads is observed. If the gap 110 communicates with the flow path 100, the liquid seeps out from the flow path 100 into the gap 110, so the area over which the liquid flows is wider than the flow path 100. If the gap 110 does not communicate with the flow path 100, or if the gap 110 is not formed, the area over which the liquid flows is the same as the flow path 100. In this way, by observing the extent to which the liquid flows through the flow path 100, it is possible to determine whether the gap 110 communicates with the flow path 100. However, the method for determining whether or not the gap 110 is in communication with the flow path 100 is not limited to this.

[0026] In the holding device 1 of this embodiment, the gap 110 is formed within a range of 0.1 mm to 3 mm from the ends of the joints 14 and 15 on the flow path 100 side. Specifically, in the cross-section of the first member 10 shown in Figure 3, if position P11 is defined as the position where the distance from the end 14a of the joint 14 in the negative direction of the y-axis is 0.1 mm, and position P12 is defined as the position where the distance from the end 14a of the joint 14 in the negative direction of the y-axis is 3 mm, then the gap 110 in the holding device 1 of this embodiment is formed within the range R1 between position P11 and position P12, as shown in Figure 3. When the gap 110 is formed within the range R1, it is possible to improve the uniformity of heat in the holding device 1 while ensuring a certain degree of bonding strength between the flow path forming member 11 and the joint 14. The range in which such a gap 110 is formed is the same between the flow path forming member 12 and the joint 14, and between the flow path forming members 12, 13 and the joint 15. In this embodiment, the "distance from the end of the joint on the flow path side" is not limited to the distance on the negative side of the y-axis, but can be any "distance" in the direction away from the flow path in a horizontal plane including the x-axis and y-axis.

[0027] In the holding device 1 of this embodiment, the end 14a of the joint 14 on the flow path 100 side is formed to protrude toward the flow path 100. As shown in Figure 3, the end 14a of the joint 14 on the flow path 100 side is located between the other main surface 11b of the flow path forming member 11 and the one main surface 12a of the flow path forming member 12. The refrigerant flowing through the flow path 100 enters and exits the gap 110 through the space between the other main surface 11b of the flow path forming member 11 and the one main surface 12a of the flow path forming member 12.

[0028] Figure 4 is a first diagram illustrating the features of the holding device 1 of this embodiment. Figure 5 is a second diagram illustrating the features of the holding device 1 of this embodiment. Figures 4 and 5 are cross-sectional SEM images of the holding device 1. Figures 4 and 5 show the portion where the flow channel forming member 11 and the flow channel forming member 12 of the first member 10 are joined by a joint 14. Figure 5 is a cross-sectional SEM image that is an enlarged view of a part of section B of the cross-sectional SEM image shown in Figure 4. From the cross-sectional SEM image of Figure 4, it can be confirmed that gaps 110 are formed between the flow channel forming member 11 and the joint 14, and between the flow channel forming member 12 and the joint 14. In Figure 5, gaps 110 that are not visible in the cross-sectional SEM image are shown by dashed lines. The gaps 110 visible in the cross-sectional SEM image of Figure 5 are in communication with the flow channel 100 via the gaps 110 shown by dashed lines. In addition, the cross-sectional SEM images in Figures 4 and 5 include a white arrow D100 indicating the direction in which the flow channel 100 is formed relative to the gap 110.

[0029] Figure 6 is a third diagram illustrating the features of the holding device 1 of this embodiment. Figure 6 is a cross-section of the holding device 1 that includes the central axis C1 and contains multiple cross-sections of the flow path 100. Specifically, Figure 6 is a schematic cross-sectional view of the portion where the flow path forming member 11 and the flow path forming member 12 are joined by the joint 14. In the first member 10 of this embodiment, in the cross-section of the holding device 1 that includes the central axis C1, there is a first specific region SR1 as a specific region including the space between the flow path forming member 11 and the joint 14, and a second specific region SR2 located between the specific flow path 100S, which is the closest of the multiple flow paths 100 to the first specific region SR1, and the first specific region SR1. In such a case, the length of the portion in the second specific region SR2 where the flow path forming member 11 and the joint 14 are in contact is shorter than the length of the portion in the first specific region SR1 where the flow path forming member 11 and the joint 14 are in contact.

[0030] Here, the relationship between the first specific region SR1 and the second specific region SR2 described above will be explained using Figure 6. In Figure 6, the first specific region SR1 is defined, which includes the space between the flow path forming member 11 and the joint 14. Next, the specific flow path 100S that is closest to the first specific region SR1 is defined from among the multiple flow paths 100 (in Figure 6, this corresponds to the flow path 100 located to the left of the flow path forming member 12). Next, in Figure 6, the second specific region SR2 is defined, which is located between the specific flow path 100S and the first specific region SR1. Comparing the lengths of the parts where the flow path forming member 11 and the joint 14 are in contact in the first specific region SR1 and the second specific region SR2 defined in this way, the length of the part where the flow path forming member 11 and the joint 14 are in contact in the second specific region SR2 is shorter than the length of the part where the flow path forming member 11 and the joint 14 are in contact in the first specific region SR1. In other words, the length of the gap 110 included in the second specific region SR2 is longer than the length of the gap 110 included in the first specific region SR1. This relationship between the length of the portion where the flow path forming member 11 and the joint 14 are in contact is the same for the portion between the flow path forming member 12 and the joint 14, the portion between the flow path forming member 12 and the joint 15, and the portion between the flow path forming member 13 and the joint 15. Note that since Figure 6 is explained using a cross section perpendicular to the x-axis, the length of the portion where the flow path forming member 11 and the joint 14 are in contact is the length in the y-axis direction. However, the length of the portion where the flow path forming members 11, 12, 13 and the joints 14, 15 are in contact only if it is the "length" in a horizontal plane including the x-axis and y-axis.

[0031] Furthermore, as shown in Figure 6, in the first member 10 of this embodiment, the length of the portion in contact between the flow channel forming member 11 included in the multiple specific regions SR1, SR2, SR3, SR4 and the joint portion 14 decreases as the centers CS11, CS12, CS13, CS14 of each of the multiple specific regions SR1, SR2, SR3, SR4 approach the specific flow channel 100S. Specifically, in Figure 6, centers CS11, CS12, CS13, CS14 are set for each of the multiple specific regions SR1, SR2, SR3, SR4. In Figure 6, the centers CS11, CS12, CS13, CS14 are in the order of center CS14, center CS13, center CS11, and center CS12, in order from furthest from the specific flow channel 100S. When multiple specific regions SR1, SR2, SR3, and SR4 are in such a relative position, the length of the portion in which the flow path forming member 11 and the joint 14 in a specific region SR1 are in contact is shorter than the length of the portion in which the flow path forming member 11 and the joint 14 in a specific region SR3 are in contact. Similarly, the length of the portion in which the flow path forming member 11 and the joint 14 in a specific region SR3 are in contact is shorter than the length of the portion in which the flow path forming member 11 and the joint 14 in a specific region SR4 are in contact. Conversely, the length of the portion where the flow path forming member 11 and the joint 14 are not in contact, i.e., the gap 110, becomes shorter as it moves away from the specific flow path 100S. This relationship between the length of the portion in which the flow path forming member 11 and the joint 14 are in contact is also similar between the flow path forming member 12 and the joint 14, between the flow path forming member 12 and the joint 15, and between the flow path forming member 13 and the joint 15.

[0032] Figure 7 is the fourth diagram illustrating the features of the holding device 1 of this embodiment. Figure 7 shows the results of measuring the length of the portion where the channel forming member 11 and the joint 14 are in contact with each other for the first member 10 of this embodiment. In Figure 7, the centers of the captured "SEM images" are set to be at positions 0.1 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, and 2.5 mm from the channel 100. The "SEM images" shown in Figure 7 are captured so that a distance of 120 μm is included between the channel forming member 11 and the joint 14. Each of the six "SEM images" is marked with a dotted white frame WB indicating the portion where the channel forming member 11 and the joint 14 are not in contact.

[0033] Figure 7 shows the "length (μm) of the non-contact portion" between the channel forming member 11 and the joint 14, measured using each of the six "SEM images". Figure 7 also shows the "non-contact rate (%)" as the length of the non-contact portion relative to a 120 μm length included in the SEM image, using the measured length of the non-contact portion between the channel forming member E12 and the joint E14. As shown in Figure 7, it was confirmed that the "length (μm) of the non-contact portion" increases as the "distance from the channel (mm)" decreases, and the "non-contact rate (%)" increases as the "distance from the channel (mm)" decreases. In other words, it can be said that the smaller the "distance from the channel (mm)", the more gaps 110 are formed between the channel forming member 11 and the joint 14.

[0034] Next, the manufacturing method of the holding device 1 will be described. In the manufacturing method of the holding device 1, the first member 10 and the second member 20 are manufactured separately, and then the first member 10 and the second member 20 are joined together.

[0035] In the fabrication of the first member 10, first, multiple disc-shaped members made of silicon carbide and multiple disc-shaped members made of aluminum are prepared. One of the multiple disc-shaped members made of silicon carbide is processed to form a space 12c that will become a flow channel 100. Aluminum disc-shaped members are placed on each of the pair of main surfaces of the silicon carbide disc-shaped member from which the space 12c has been processed, and a laminate is fabricated by sandwiching the silicon carbide disc-shaped member that has been processed together with the aluminum disc-shaped member using the remaining silicon carbide disc-shaped members. By heating the fabricated laminate to a predetermined temperature and applying pressure, the multiple silicon carbide disc-shaped members are joined by the aluminum disc-shaped members, and the first member 10 having a flow channel 100 is fabricated.

[0036] In the fabrication of the first member 10 of this embodiment, when the laminate is heated and pressure is applied, the gap 110 is formed by adjusting both the temperature of the heated laminate and the pressure applied to the laminate. For example, in the first member 10, when the temperature of the heated laminate is 580°C, the gap 110 communicating with the flow path 100 can be formed within an appropriate range (for example, range R1 shown in Figure 3) by setting the pressure applied to the laminate to 5 MPa to 13 MPa. As another example, when the temperature of the heated laminate is 600°C, the gap 110 can be formed within an appropriate range by setting the pressure applied to the laminate to 3 MPa to 10 MPa. In this way, by adjusting both the temperature and the pressure, the gap 110 is formed between the flow path forming members 11, 12, 13 and the joints 14, 15. If the temperature of the heated laminate is low, or if the pressure applied to the laminate is small, gaps are more likely to form, which may reduce the bonding strength of the flow path forming members by the joints. If the temperature of the heated laminate is high, or if the pressure applied to the laminate is high, gaps may not form easily, which could reduce the uniformity of heat in the holding device. However, the method for manufacturing the first member 10 is not limited to this.

[0037] In the fabrication of the first member 10 of this embodiment, an aluminum disc-shaped member is used to join multiple silicon carbide disc-shaped members. Therefore, when the laminate is heated and pressurized, a relatively large pressure acts on the laminate. As a result, a large force acts on the corner 12d (see Figure 3) of the flow channel forming member 12 on the flow channel 100 side, which could potentially destroy the joints 14 and 15. However, in the fabrication of the first member 10 of this embodiment, the flow channel forming members 11, 12, 13 and the joints 14 and 15 are joined such that a gap 110 is formed between the flow channel forming members 11, 12, 13 and the joints 14 and 15, and the joining area between the flow channel forming members 11, 12, 13 and the joints 14 and 15 gradually increases as it moves away from the end 14a. This allows the stress acting on the corner 12d to be distributed, thereby suppressing damage to the first member 10.

[0038] In preparing the second component 20, first, several green sheets and a metallizing paste are prepared. A pattern that will become the chuck electrode 21 and heater electrode 22 is printed onto the surface of a specific green sheet from among the several green sheets using the metallizing paste, and then fired. This creates the second component 20 having the chuck electrode 21 and heater electrode 22.

[0039] After manufacturing the first member 10 and the second member 20, a brazing material containing aluminum is applied to one of the pair of main surfaces of the first member 10, or to one of the pair of main surfaces of the second member 20. Next, the applied brazing material is sandwiched between the first member 10 and the second member 20, and the entire assembly is heated. This manufactures a holding device 1 in which the first member 10 and the second member 20 are joined via a bonding layer 30. However, the method of manufacturing the holding device 1 is not limited to this.

[0040] Figure 8 illustrates the effects of the holding device 1 of this embodiment. Figure 8 is a schematic cross-sectional view of the first member 10 of the holding device 1, showing a part of the cross-section perpendicular to the central axis C1 of the holding device 1. The cross-section shown in Figure 8 is a cross-section including the flow path 100, and is, for example, a cross-section passing near the other main surface 11b of the flow path forming member 11. In Figure 8, the flow of refrigerant in the flow path 100 is indicated by a white arrow F1. In the holding device 1 of this embodiment, as shown in Figure 8, a gap 110 communicating with the flow path 100 is formed, so the refrigerant flowing in the flow path 100 also flows into the gap 110, as shown by the white arrow F2 in Figure 8. As a result, when the holding device 1 is viewed from the mounting surface 20a side (z-axis direction), the range in which the refrigerant flows is the sum of the flow path 100 and the gap 110, thus improving the uniformity of heat on the mounting surface 20a.

[0041] As described above, with respect to the holding device 1 of this embodiment, the gap 110 formed between the flow path forming members 11, 12, 13 and the joints 14, 15 is in communication with the flow path 100, allowing the refrigerant flowing through the flow path 100 to enter and exit. This allows the refrigerant to be distributed over a wider area inside the holding device 1 than the area occupied by the flow path 100. Therefore, the uniformity of the heat distribution of the holding device 1 can be improved.

[0042] Furthermore, according to the holding device 1 of this embodiment, each of the flow path forming members 11, 12, and 13, each having a pair of main surfaces 11a, 11b, 12a, 12b, 13a, and 13b, is arranged parallel to the mounting surface 20a. The joints 14 and 15 are in contact with one of the main surfaces 11b, 12a, 12b, 13a, and 13b of the pair of main surfaces 11a, 11b, 12a, 12b, 13a, and 13b of the flow path forming members 11, 12, and 13. As a result, the gap 110 through which the refrigerant enters and exits is formed along a direction substantially parallel to the mounting surface 20a, thereby improving the uniformity of heat on the mounting surface 20a.

[0043] Furthermore, according to the holding device 1 of this embodiment, when a first specific region SR1 including the space between the flow path forming member 11 and the joint 14 is set in the cross-section of the holding device 1 having a plurality of flow paths 100, and a second specific region SR2 closer to the specific flow path 100S than the first specific flow region, the length of the portion in which the flow path forming member 11 and the joint 14 are in contact in the second specific region SR2 is shorter than the length of the portion in which the flow path forming member 11 and the joint 14 are in contact in the first specific region SR1. In other words, in the second specific region SR2 which is relatively close to the specific flow path 100S, a relatively large portion where the flow path forming member 11 and the joint 14 are not in contact, i.e., a gap 110, is formed, so the area over which the refrigerant can spread is widened, while in the first specific region SR1 which is relatively far from the specific flow path 100S, the portion in contact between the flow path forming member 11 and the joint 14 is longer, so that the flow path forming member 11 and the flow path forming member 12 can be reliably joined via the joint 14.

[0044] Furthermore, according to the holding device 1 of this embodiment, the length of the portion in contact between the flow path forming members 11, 12, 13 and the joints 14, 15 is such that the length of the portion in contact with the flow path forming members 11, 12, 13 decreases as the center of the specific region approaches the specific flow path 100S. This allows for a wider range of refrigerant distribution while increasing the bonding force of the flow path forming members 11, 12, 13 via the joints 14, 15.

[0045] Furthermore, according to the holding device 1 of this embodiment, in the manufacturing of the first member 10, the flow path forming members 11, 12, 13 and the joints 14, 15 are joined together such that the joining area between the flow path forming members 11, 12, 13 and the joints 14, 15 gradually increases as it moves away from the end 14a. This allows the stress acting on the corner 12d of the flow path forming member 12 to be distributed, thereby suppressing damage to the first member 10.

[0046] Furthermore, according to the holding device 1 of this embodiment, the ends of the joints 14 and 15 on the flow path 100 side are formed to protrude, which makes the flow of refrigerant through the flow path 100 more prone to turbulence. In other words, because the flow of refrigerant is more prone to turbulence, heat exchange between the flow path forming members 11, 12, and 13 and the joints 14 and 15 and the refrigerant is promoted. This makes it possible to improve the cooling efficiency of the refrigerant.

[0047] Furthermore, in the holding device 1 of this embodiment, the joints 14 and 15 are made of aluminum, which has relatively high thermal conductivity. As a result, the cold energy of the refrigerant is more easily transferred to the flow path forming members 11, 12, and 13 through the joints 14 and 15, thereby improving the cooling performance of the holding device 1.

[0048] <Second Embodiment> Figure 9 is a cross-sectional view of the holding device 2 of the second embodiment. The holding device 2 of the second embodiment differs from the holding device 1 of the first embodiment (Figure 2) in the configuration of the first component.

[0049] The holding device 2 of the second embodiment comprises a first member 40, a second member 20, and a bonding layer 30. The holding device 2 is an electrostatic chuck that is installed in, for example, an etching apparatus and holds the wafer W by attracting it with electrostatic force.

[0050] The first member 40 is a substantially circular member mainly made of silicon carbide (SiC). The first member 40 comprises a plurality of flow path forming members 11, 12, 13 that form a flow path 400 through which the refrigerant flows, and joining portions 44, 15 that join the plurality of flow path forming members 11, 12, 13. As shown in Figure 9, the joining portion 44 is arranged over the entire surface of the other main surface 11b of the flow path forming member 11 and joins the flow path forming member 11 and the flow path forming member 12.

[0051] In the holding device 2, gaps 410 communicating with the flow path 400 are formed between the flow path forming member 12 and the joint 44, between the flow path forming member 12 and the joint 15, and between the flow path forming member 13 and the joint 15. In the holding device 2, a relatively large number of gaps 410 are formed on the flow path 400 side between the flow path forming members 12, 13 and the joints 44, 15. As a result, when the holding device 2 is viewed from the mounting surface 20a side, the area in which the refrigerant flows is the sum of the flow path 400 and the gaps 410, thereby improving the uniformity of heat on the mounting surface 20a.

[0052] As described above, with respect to the holding device 2 of this embodiment, the gap 410 formed between the flow path forming members 12, 13 and the joints 44, 15 is in communication with the flow path 400, allowing the refrigerant flowing through the flow path 400 to enter and exit. This allows the refrigerant to be distributed over a wider area inside the holding device 2 than the area occupied by the flow path 400. Therefore, the uniformity of the heat distribution of the holding device 2 can be improved.

[0053] <Third Embodiment> Figure 10 is a cross-sectional view of the holding device 3 of the third embodiment. The holding device 3 of the third embodiment differs from the holding device 1 of the first embodiment (Figure 2) in the configuration of the first component.

[0054] The holding device 3 of the third embodiment comprises a first member 50, a second member 20, and a bonding layer 30. The holding device 3 is an electrostatic chuck that is installed in, for example, an etching apparatus and holds the wafer W by attracting it with electrostatic force.

[0055] The first member 50 is a substantially circular member mainly made of silicon carbide (SiC). The first member 50 comprises a plurality of flow path forming members 11, 12, 13 that form a flow path 500 through which a refrigerant flows, and joining portions 54, 55 that join the plurality of flow path forming members 11, 12, 13. As shown in Figure 10, the joining portion 54 is arranged over the entire surface of the other main surface 11b of the flow path forming member 11 and joins the flow path forming member 11 and the flow path forming member 12. As shown in Figure 10, the joining portion 55 is arranged over the entire surface of one main surface 13a of the flow path forming member 13 and joins the flow path forming member 12 and the flow path forming member 13.

[0056] In the holding device 3, gaps 510 communicating with the flow path 500 are formed between the flow path forming member 12 and the joint 54, and between the flow path forming member 12 and the joint 55. In the holding device 3, a relatively large number of gaps 510 are formed on the flow path 500 side between the flow path forming member 12 and the joints 54 and 55. As a result, when the holding device 3 is viewed from the mounting surface 20a side, the area in which the refrigerant flows is the sum of the flow path 500 and the gaps 510, thereby improving the uniformity of heat on the mounting surface 20a.

[0057] As described above, with respect to the holding device 3 of this embodiment, the gap 510 formed between the flow path forming member 12 and the joints 54 and 55 is in communication with the flow path 500, allowing the refrigerant flowing through the flow path 500 to enter and exit. This allows the refrigerant to be distributed over a wider area inside the holding device 3 than the area occupied by the flow path 500. Therefore, the uniformity of the heat distribution of the holding device 3 can be improved.

[0058] <Fourth Embodiment> Figure 11 is a cross-sectional view of the holding device 4 of the fourth embodiment. The holding device 4 of the fourth embodiment differs from the holding device 1 of the first embodiment (Figure 2) in the configuration of the first component.

[0059] The holding device 4 of the fourth embodiment comprises a first member 60, a second member 20, and a bonding layer 30. The holding device 4 is an electrostatic chuck that is installed in, for example, an etching apparatus and holds the wafer W by attracting it with electrostatic force.

[0060] The first member 60 is a substantially circular member mainly made of silicon carbide (SiC). The first member 60 comprises a plurality of flow path forming members 61, 13 that form a flow path 600 through which the refrigerant flows, and a joint 62 that joins the flow path forming member 61 and the flow path forming member 13. The flow path forming member 61 is made of silicon carbide (SiC). The flow path forming member 61 has a plate shape with a pair of main surfaces 61a, 61b, and each of the pair of main surfaces 61a, 61b is arranged to be parallel to the mounting surface 20a. A space 61c that becomes a flow path 600 is formed on the other main surface 61b of the pair of main surfaces 61a, 61b of the flow path forming member 61. As shown in Figure 11, the joint 62 is in contact with the other main surface 61b of the flow path forming member 61. The joint 62 joins the flow path forming member 61 and the flow path forming member 13.

[0061] In the holding device 4, gaps 610 communicating with the flow path 600 are formed between the flow path forming member 61 and the joint 62, and between the flow path forming member 13 and the joint 62. In the holding device 4, a relatively large number of gaps 610 are formed on the flow path 600 side between the flow path forming members 61, 13 and the joint 62. As a result, when the holding device 4 is viewed from the mounting surface 20a side, the area in which the refrigerant flows is the sum of the flow path 600 and the gaps 610, thereby improving the uniformity of heat on the mounting surface 20a.

[0062] As described above, with respect to the holding device 4 of this embodiment, the gap 610 formed between the flow path forming members 61, 13 and the joint 62 is in communication with the flow path 600, allowing the refrigerant flowing through the flow path 600 to enter and exit. This allows the refrigerant to be distributed over a wider area inside the holding device 4 than the area occupied by the flow path 600. Therefore, the uniformity of the heat distribution of the holding device 4 can be improved.

[0063] <Fifth Embodiment> Figure 12 is a cross-sectional view of the holding device 5 of the fifth embodiment. The holding device 5 of the fifth embodiment differs from the holding device 1 of the first embodiment (Figure 2) in the configuration of the first component.

[0064] The holding device 5 of the fifth embodiment comprises a first member 70, a second member 20, and a bonding layer 30. The holding device 5 is an electrostatic chuck that is installed in, for example, an etching apparatus and holds the wafer W by attracting it with electrostatic force.

[0065] The first member 70 is a substantially circular member mainly made of silicon carbide (SiC). The first member 70 comprises a plurality of flow path forming members 61, 13 that form a flow path 700 through which the refrigerant flows, and a joint 72 that joins the flow path forming member 61 and the flow path forming member 13. As shown in Figure 12, the joint 72 is arranged over the entire surface of one main surface 13a of the flow path forming member 13 and joins the flow path forming member 61 and the flow path forming member 13.

[0066] In the holding device 5, a gap 710 communicating with the flow path 700 is formed between the flow path forming member 61 and the joint 72. In the holding device 5, a relatively large number of gaps 710 are formed on the flow path 700 side between the flow path forming members 61, 13 and the joint 72. As a result, when the holding device 5 is viewed from the mounting surface 20a side, the area in which the refrigerant flows is the sum of the flow path 700 and the gaps 710, thereby improving the uniformity of heat on the mounting surface 20a.

[0067] As described above, with respect to the holding device 5 of this embodiment, the gap 710 formed between the flow path forming member 61 and the joint 72 is in communication with the flow path 700, allowing the refrigerant flowing through the flow path 700 to enter and exit. This allows the refrigerant to circulate over a wider area inside the holding device 5 than the area occupied by the flow path 700. Therefore, the uniformity of the heat distribution of the holding device 5 can be improved.

[0068] <Sixth Embodiment> Figure 13 is a cross-sectional view of the holding device 6 of the sixth embodiment. Compared with the holding device 1 of the first embodiment (Figure 3), the holding device 6 of the sixth embodiment has a different shape for the joint portion of the first member.

[0069] The holding device 6 of the sixth embodiment comprises a first member 80, a second member 20, and a bonding layer 30. The holding device 6 is an electrostatic chuck that is installed in, for example, an etching apparatus and holds the wafer W by attracting it with electrostatic force.

[0070] The first member 80 is a substantially circular member mainly made of silicon carbide (SiC). The first member 80 comprises a plurality of flow path forming members 11, 12, 13 that form a flow path 800 through which the refrigerant flows, and joints 84, 15 that join the plurality of flow path forming members 11, 12, 13. As shown in Figure 13, the joint 84 joins the flow path forming member 11 and the flow path forming member 12. In the holding device 6 of this embodiment, a gap 810 that communicates with the flow path 800 is formed between the flow path forming members 11, 12, 13 and the joints 14, 15.

[0071] The joint portion 84 is formed such that the end portion 84a on the flow path 800 side protrudes into the flow path 800. That is, the end portion 84a of the joint portion 84 is located within the flow path 800, as shown in Figure 13. In the holding device 6, gaps 810 communicating with the flow path 800 are formed between the flow path forming member 11 and the joint portion 84, and between the flow path forming member 12 and the joint portion 84. In this embodiment, as shown in Figure 13, the gaps 810 are formed to be included in the range R6 between a position P61 where the distance from the inner wall surface 12e of the flow path forming member 12 in the negative y-axis direction is 0.1 mm and a position P62 where the distance from the inner wall surface 12e of the flow path forming member 12 in the negative y-axis direction is 3 mm.

[0072] As described above, with the holding device 6 of this embodiment, the gap 810 formed between the flow path forming members 11, 12, 13 and the joints 84, 15 is in communication with the flow path 800, allowing the refrigerant flowing through the flow path 800 to enter and exit. This allows the refrigerant to circulate over a wider area inside the holding device 6 than the area occupied by the flow path 800. Therefore, the uniformity of the heat distribution of the holding device 6 can be improved.

[0073] Furthermore, according to the holding device 6 of this embodiment, the end portion 84a of the joint portion 84 on the flow path 800 side is formed to protrude into the flow path 800, which makes the flow of refrigerant through the flow path 800 more turbulent. In other words, because the flow of refrigerant is more likely to become turbulent, the exchange of heat between the flow path forming members 11, 12, 13 and the joint portions 84, 15 and the refrigerant is further promoted. This makes it possible to improve the cooling efficiency of the refrigerant.

[0074] <Modified form of this embodiment> The present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from its spirit, for example, the following modifications are also possible.

[0075] [Example 1] In the embodiments described above, the holding device is a so-called electrostatic chuck, provided in an etching apparatus or the like, that holds the wafer W by attracting it with electrostatic force. However, the technical fields to which the holding device is applied are not limited to this. It can be applied in any technical field where it is necessary to hold an object in some form. Therefore, the method of holding the object is not limited to attraction by electrostatic force.

[0076] [Differentiation 2] In the above-described embodiment, the plate-shaped flow path forming member having a pair of main surfaces is assumed to be arranged such that each of the pair of main surfaces is parallel to the mounting surface. The shape of the flow path forming member and the positional relationship between the pair of main surfaces of the flow path forming member and the mounting surface are not limited to this. Each of the pair of main surfaces of the flow path forming member does not have to be arranged parallel to the mounting surface. In this case, the gap formed between the flow path forming member and the joint may be formed along a direction other than that substantially parallel to the mounting surface.

[0077] [Difference 3] In the above-described embodiment, the relationship between the length of the portion in contact with the channel forming member and the joint in a plurality of specific regions, including the space between the channel forming member and the joint, is assumed to be shorter closer to the specific channel than further away from the specific channel, and to become shorter as it approaches the specific channel. The relationship between the length of the portion in contact with the channel forming member and the joint in a plurality of specific regions is not limited to this.

[0078] [Differentiation Example 4] In the embodiment described above, as explained with reference to Figure 6, the relationship regarding the length of the portion in contact between the flow channel forming member and the joint between multiple specific regions was assumed to be the same for each of the flow channel forming members 11, 12, 13 and joints 14, 15 of the first member. However, this relationship does not necessarily have to hold for all of the flow channel forming members 11, 12, 13 and joints 14, 15. Even if it is only partially held, it is possible to improve heat uniformity.

[0079] [Difference 5] In the above-described embodiment, the end of the joint on the flow path side is formed to protrude. The shape of the end of the joint on the flow path side is not limited to this. It may be flat, but forming it in a protruding shape can disrupt the flow of refrigerant through the flow path, thereby improving the cooling efficiency of the refrigerant.

[0080] [Modification 6] In the embodiments described above, the joint was assumed to be formed of metal. However, the material used to form the joint is not limited to this.

[0081] [Difference 7] In the above-described embodiment, the holding device comprises a first member, a second member, and a joining layer that joins the first member and the second member. The configuration of the holding device is not limited to this. It may include a plurality of flow path forming members and joining portions that join the flow path forming members to each other.

[0082] The embodiments of this specification have been described above based on the embodiments and modifications described above. The embodiments described above are for the purpose of facilitating understanding of this specification and do not limit it. This specification may be modified and improved without departing from its spirit and the scope of the claims, and equivalents thereof are included in this specification. Furthermore, any technical features that are not described as essential in this specification may be deleted as appropriate.

[0083] <Application Example 1> A holding device for holding an object, Multiple channel forming members that form a channel through which the refrigerant flows, The system includes a joint that connects a plurality of the aforementioned flow path forming members to each other, A gap is formed between the channel forming member and the joint portion, which communicates with the channel. holding device. <Application Example 2> The holding device described in Application Example 1 further, It has a mounting surface on which the object is placed, Each of the multiple flow path forming members is It has a plate shape with a pair of main surfaces, Each of the pair of main surfaces is arranged to be parallel to the aforementioned mounting surface, The joint portion is in contact with at least one of the pair of main surfaces of the flow path forming member. The plurality of channel forming members and the joint portion are characterized in that they are stacked together. holding device. <Application Example 3> A holding device as described in Application Example 1 or Application Example 2, In a cross-section that includes the central axis of the holding device and contains multiple cross-sections of the flow path, The specific region including the space between the flow path forming member and the joint portion includes a first specific region and a second specific region located between the specific flow path closest to the first specific region and the first specific region among the plurality of flow paths. The length of the portion in which the flow channel forming member and the joint portion in the second specific region are in contact is shorter than the length of the portion in which the flow channel forming member and the joint portion in the first specific region are in contact. holding device. <Application Example 4> A holding device described in any one of the examples from Application Example 1 to Application Example 3, The length of the portion in which the channel forming member and the joint portion within the specified region are in contact is characterized in that it becomes shorter as the center of the specified region approaches the specified channel. holding device. <Application Example 5> A holding device described in any one of Application Examples 1 to 4, The end of the joint on the flow path side is characterized by being formed to protrude. holding device. <Application Example 6> A holding device described in any one of Application Examples 1 to 5, The aforementioned joint is characterized by being formed of metal. holding device. [Explanation of symbols]

[0084] 1,2,3,4,5,6...holding device 11, 12, 13, 61 ... Flow channel forming member 11a,11b,12a,12b,13a,13b,61a,61b...main surface 14,15,44,54,55,62,72,84…Joint part 100S ...Specific channel 14a, 84a … (end of joint) 20a ... Mounting surface 100, 400, 500, 600, 700, 800 ...flow channels 110, 410, 510, 610, 710, 810 ... gaps C1...center axis SR1... First specific area SR2... Second specific area SR3... Third specific area SR4... Fourth specific area W...wafer

Claims

1. A holding device for holding an object, Multiple channel forming members that form a channel through which the refrigerant flows, The system includes a joint that connects a plurality of the aforementioned flow path forming members to each other, A gap is formed between the channel forming member and the joint portion, which communicates with the channel. holding device.

2. The holding device according to claim 1 further, It has a mounting surface on which the object is placed, Each of the multiple flow path forming members is It has a plate shape with a pair of main surfaces, Each of the pair of main surfaces is arranged to be parallel to the aforementioned mounting surface, The joint portion is in contact with at least one of the pair of main surfaces of the flow path forming member. The plurality of channel forming members and the joint portion are characterized in that they are stacked together. holding device.

3. A holding device according to claim 1 or claim 2, In a cross-section that includes the central axis of the holding device and contains multiple cross-sections of the flow path, The specific region including the space between the flow path forming member and the joint portion includes a first specific region and a second specific region located between the specific flow path closest to the first specific region and the first specific region among the plurality of flow paths. The length of the portion in which the flow channel forming member and the joint portion in the second specific region are in contact is shorter than the length of the portion in which the flow channel forming member and the joint portion in the first specific region are in contact. holding device.

4. A holding device according to claim 3, The length of the portion in which the channel forming member and the joint portion within the specified region are in contact is characterized in that it becomes shorter as the center of the specified region approaches the specified channel. holding device.

5. A holding device according to claim 1 or claim 2, The end of the joint on the flow path side is characterized by being formed to protrude. holding device.

6. A holding device according to claim 1 or claim 2, The aforementioned joint is characterized by being formed of metal. holding device.

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