Semiconductor module

Abstract

In semiconductor modules, this prevents corrosive gases from entering through the gap between the terminals and the case. [Solution] The semiconductor module (1) comprises a semiconductor element (50), a wiring board (60) on which the semiconductor element (50) is mounted, terminals (14-17) electrically connected to the wiring board (60), a case (20) that houses the semiconductor element (50) and the wiring board (60) and has a case through-hole (21c) into which the terminals (14-17) are inserted, an auxiliary block (30) fixed to the case (20) that sandwiches the base portion of the terminals (14-17) that protrudes to the outside from the case through-hole (21c), and a sealing material (A) that seals the gap between the terminals (14-17) and the case through-hole (21c) together with the auxiliary block (30) and adheres the auxiliary block (30) to the case (20).

Description

Technical Field

[0004] , , , , , , , , ,

[0005]

[0001] The present invention relates to a semiconductor module including a case that houses a semiconductor element and a wiring board.

Background Art

[0002] Conventionally, as a semiconductor module used in a power conversion device or the like, a semiconductor module including a case that houses a semiconductor element and a wiring board is known (see, for example, Patent Documents 1 to 3). This type of semiconductor module includes those in which terminals such as main terminals and auxiliary terminals are insert-molded with the case, and those in which the case is arranged such that the terminals are inserted into through-holes of the case.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a configuration where a terminal is inserted into a through-hole of a case, a gap is formed between the terminal and the through-hole. However, when the interval between terminals is narrow, it is difficult for a dispenser to supply a sealing material for filling the gap. Further, during the process of operating the dispenser, unintended adhesion of the sealing material to the terminals or defects due to contact of the dispenser with the terminals occur. If the gap between the terminal and the through-hole cannot be blocked, corrosive gases (such as hydrogen sulfide and sulfuric acid gas) will flow in.

[0005] On one side, an object of the present invention is to provide a semiconductor module capable of preventing the inflow of corrosive gases from the gap between the terminal and the case. [Means for solving the problem]

[0006] In one embodiment, the semiconductor module comprises a semiconductor element, a wiring board on which the semiconductor element is mounted, terminals electrically connected to the wiring board, a case having a case through-hole into which the terminals are inserted, and housing the semiconductor element and the wiring board, an auxiliary block fixed to the case and sandwiching the base portion of the terminals that protrudes to the outside from the case through-hole, and a sealing material that, together with the auxiliary block, seals the gap between the terminals and the case through-hole and adheres the auxiliary block to the case. [Effects of the Invention]

[0007] According to the above embodiment, it is possible to prevent corrosive gases from entering through the gap between the terminal and the case. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view showing a semiconductor module according to one embodiment. [Figure 2] This is a plan view showing a semiconductor module according to one embodiment. [Figure 3] This is a front view showing a semiconductor module before the case is placed, according to one embodiment. [Figure 4] This is a circuit diagram of a semiconductor module in one embodiment. [Figure 5] Figure 2 is a cross-sectional view of the VV region. [Figure 6] This is a cross-sectional view taken from VI-VI in Figure 2. [Figure 7A] This is a perspective view (part 1) illustrating the arrangement of auxiliary blocks in one embodiment. [Figure 7B] This is a perspective view (part 2) illustrating the arrangement of auxiliary blocks in one embodiment. [Figure 8A] This is a perspective view (part 1) illustrating the arrangement of auxiliary blocks in a first modified example of one embodiment. [Figure 8B]This is a perspective view (part 2) illustrating the arrangement of auxiliary blocks in a first modified example of one embodiment. [Figure 9A] This is a perspective view (part 1) illustrating the arrangement of auxiliary blocks in a second modified example of one embodiment. [Figure 9B] This is a perspective view (part 2) illustrating the arrangement of auxiliary blocks in a second modified example of one embodiment. [Figure 9C] This is a perspective view (part 3) illustrating the arrangement of auxiliary blocks in a second modified example of one embodiment. [Figure 10A] This is a perspective view (part 1) illustrating the arrangement of auxiliary blocks in a third modified example of one embodiment. [Figure 10B] This is a perspective view (part 2) illustrating the arrangement of auxiliary blocks in a third modified example of one embodiment. [Figure 11A] This is a perspective view (part 1) illustrating the arrangement of auxiliary blocks in a fourth modified example of one embodiment. [Figure 11B] This is a perspective view (part 2) illustrating the arrangement of auxiliary blocks in a fourth modified example of one embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, with reference to the drawings, the semiconductor module 1 according to an embodiment of the present invention will be described in detail. In each of the drawings to be referred to, the X, Y, and Z axes are shown for the purpose of defining the directions and each surface in the illustrated semiconductor module 1 and the like. The X, Y, and Z axes are orthogonal to each other and form a right-handed system. In the following description, the Z direction may be referred to as the vertical direction. Also, the plane including the X axis and the Y axis may be referred to as the upper surface or the lower surface. These directions and surfaces are expressions used for convenience of explanation, and depending on the mounting posture of the semiconductor module 1 and the like, the corresponding relationships with the XYZ directions may change. For example, in this specification, the surface facing the positive side (+Z direction) of the Z direction in the members constituting the semiconductor module 1 is referred to as the upper surface, and the surface facing the negative side (-Z direction) of the Z direction is referred to as the lower surface. However, the surface facing the negative side of the Z direction may be referred to as the upper surface, and the surface facing the positive side of the Z direction may be referred to as the lower surface. Also, in this specification, a plan view means a case where the upper surface (XY plane) of the semiconductor module 1 and the like is viewed perspectively from the positive side of the Z direction toward the negative side of the Z direction.

[0010] The vertical and horizontal ratios in each figure and the size relationships between the members are schematically shown, and do not necessarily match the relationships in the actually manufactured semiconductor module 1 and the like. For convenience of explanation, the size relationships between the members may be exaggerated in some cases. Also, between different drawings, the shapes of the same members may be different.

[0011] In the following description, as an example of the semiconductor module 1 according to an embodiment, a device applied to a power conversion device such as an inverter device for an industrial or in-vehicle motor will be cited. For this reason, in the following description, detailed descriptions of the same or similar configurations, functions, operations, assembly methods, etc. as those of known semiconductor modules will be omitted.

[0012] FIG. 1 is a perspective view showing the semiconductor module 1. FIG. 2 is a plan view showing the semiconductor module 1. FIG. 3 is a front view showing the semiconductor module 1 before the case 20 is arranged.

[0013] The semiconductor module 1 shown in Figures 1 and 2 comprises main terminals 11 to 13, auxiliary terminals 14 to 17, a case 20, two auxiliary blocks 30, a heat dissipation base 40 (see Figures 1 and 3), a plurality of semiconductor elements 50 (see Figure 3), and a plurality of wiring boards 60 (see Figure 3).

[0014] Each of the main terminals 11 to 13 is a downward-facing U-shaped metal component, electrically connected to the wiring board 60 (described later) by soldering at two points on its lower end. The main terminals 11 to 13 are the input and output terminals of the semiconductor module 1, and the main current flows through them. As shown in Figure 4, for example, main terminal 11 is the C1 terminal, main terminal 12 is the E2 terminal, and main terminal 13 is the C2E1 terminal.

[0015] Each of the main terminals 11 to 13 has a main terminal through hole 11a, 12a, and 13a at its upper end. Screws for the external terminal side (not shown) are inserted into these main terminal through holes 11a, 12a, and 13a. The main terminals 11 to 13 are positioned so that only their upper surfaces are exposed from the case 20.

[0016] Each of the auxiliary terminals 14 to 17 is electrically connected to the wiring board 60 by having its lower end joined to the wiring board 60 with solder or the like, and is a plate-shaped metal member that penetrates the case 20 and protrudes to the outside of the case 20 in a single protruding direction (positive Z direction). The auxiliary terminals 14 to 17 are terminals through which the main current, such as control terminals, does not flow. As shown in Figure 4, for example, auxiliary terminal 14 is the G1 terminal, auxiliary terminal 15 is the E1 terminal, auxiliary terminal 16 is the E2 terminal, and auxiliary terminal 17 is the G2 terminal.

[0017] Each of the auxiliary terminals 14 to 17 has protrusions 14a, 15a, 16a, and 17a, respectively, with their periphery removed in a U-shape. Protrusions 14a and 15a project towards the negative side in the Y direction, while protrusions 16a and 17a project towards the positive side in the Y direction. The Y direction, which is the projection direction of these protrusions 14a to 17a, is an example of a direction that intersects with the Z direction, which is the through-direction (extension direction) in which the auxiliary terminals 14 to 17 pass through the case through-hole 21c shown in Figures 5 and 6. As shown in Figure 5, the protrusions 14a to 17a are housed in the bulge 21c-1 of the case through-hole 21c. This bulge 21c-1 bulges out over the opening of the case through-hole 21c on the upper surface of the main body 21.

[0018] The case 20 is formed using a thermoplastic resin material such as PPS (Poly Phenylene Sulfide) or PA (Poly Amide), and is insulating. The case 20 has a main body 21 and a nut glove 22 positioned in the opening 21a of the main body 21 for fixing the screws of the external terminals mentioned above to the main terminals 11 to 13.

[0019] The case 20 is fixed, for example, to the lower surface of the main body 21 by adhesive to the periphery of the upper surface of the heat dissipation base 40. In a plan view, fastening holes 21b are provided at the four corners of the case 20 (main body 21) for fixing the case 20 together with the heat dissipation base 40 to a cooler (not shown). The main body 21 of the case 20 also has four through-holes 21c into which auxiliary terminals 14 to 17 are inserted, and houses the semiconductor element 50 and the wiring board 60.

[0020] As shown in Figure 1, the nut globe 22 has nuts 22a at positions corresponding to each of the main terminals 11 to 13. As shown in Figure 3, the nut globe 22 is inserted from the negative end in the X direction to the positive end in the X direction of the opening 21a of the body 21 after the body 21 is placed over the semiconductor element 50 and the wiring board 60 so that the main terminals 11 to 13 and auxiliary terminals 14 to 17 joined to the wiring board 60 are exposed to the outside. As a result, with the nut globe 22 sandwiching the main terminals 11 to 13 between itself and the side wall of the opening 21a, each nut 22a of the nut globe 22 is positioned below the main terminal through holes 11a, 12a, and 13a of the main terminals 11 to 13.

[0021] The heat dissipation base 40 has a rectangular shape in plan view. The heat dissipation base 40 has fastening holes 41 at the four corners in plan view. The heat dissipation base 40 is fastened to a cooler (not shown) together with the case 20 by screws inserted into the fastening holes 41 (shown as dashed lines, which are hidden lines in Figure 3).

[0022] The heat dissipation base 40 is a component that functions as a heat conductive member that conducts the heat generated by the semiconductor element 50 to the cooler, and is formed from a metal plate such as a copper plate or an aluminum plate.

[0023] The semiconductor element 50 is mounted on the wiring board 60. The semiconductor element 50 is, for example, an IGBT (Insulated Gate Bipolar Transistor), which is the switching element 50-1 shown in Figure 4, and an FWD (Free Wheeling Diode), which is the diode element 50-2. Other semiconductor elements, such as an RC (Reverse Conducting)-IGBT element, which integrates the switching element 50-1 and the diode element 50-2 connected in antiparallel to the switching element 50-1, may also be arranged as the semiconductor element 50. The switching element 50-1 and the diode element 50-2 in the semiconductor element 50 are not limited to a Si substrate, but may be formed on a semiconductor substrate using a wide bandgap semiconductor such as SiC (silicon carbide) or GaN (gallium nitride). Furthermore, the switching element 50-1 may be composed of, for example, a SiC-MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or a BJT (Bipolar Junction Transistor). Furthermore, the diode element 50-2 may be composed of, for example, a SiC-SBD (Schottky Barrier Diode), a JBS (Junction Barrier Schottky) diode, an MPS (Merged PN Schottky) diode, a PN diode, or the like.

[0024] The semiconductor element 50 is bonded to the first conductor layer 61 of the wiring board 60 and is electrically connected directly or indirectly to other semiconductor elements 50, the first conductor layer 61 of the wiring board 60, the main terminals 11-13, auxiliary terminals 14-17, etc., by wiring W. The wiring W is, for example, a metallic bonding wire. The wiring W may be replaced with other wiring such as leads formed by processing a metal plate such as a copper plate.

[0025] Multiple wiring boards 60 are joined to a common single heat dissipation base 40 at their lower surfaces (second conductor layer 62) by a bonding material such as solder. Each wiring board 60 has a rectangular shape in plan view and includes a first conductor layer 61, a second conductor layer 62, and an insulating layer 63. The wiring board 60 may be, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. The wiring board 60 may also be called a laminated substrate, an insulating circuit board, an insulating heat dissipation circuit board, etc.

[0026] The first conductor layer 61 is a component that functions as a wiring member in an inverter circuit, for example, and is provided in multiple separate portions on the upper surface of the insulating layer 63 using a metal plate or metal foil made of copper, aluminum, or the like. The first conductor layer 61 is electrically connected to other first conductor layers 61, semiconductor elements 50, main terminals 11-13, auxiliary terminals 14-17, etc., by wiring W. The first conductor layer 61 may also be called a conductor plate, conductor pattern, conductive layer, wiring pattern, etc.

[0027] The second conductor layer 62 functions as a heat conduction member that conducts heat generated in the inverter circuit to the heat dissipation base 40, and is provided on the lower surface of the insulating layer 63 using a metal plate or metal foil made of copper, aluminum, etc. The second conductor layer 62 (wiring board 60) is joined to the heat dissipation base 40 by a bonding material such as solder. The second conductor layer 62 may also be called a heat dissipation layer, heat sink, heat dissipation pattern, conductor pattern, etc.

[0028] The insulating layer 63 is, for example, a ceramic substrate. The insulating layer 63 is not limited to a specific substrate, but may be a ceramic substrate formed from a ceramic material such as aluminum nitride (AlN), aluminum oxide (Al2O3), silicon nitride (Si3N4), and a composite material of aluminum oxide (Al2O3) and zirconium oxide (ZrO2). The insulating layer 63 may also be, for example, a substrate molded from an insulating resin such as epoxy resin, a substrate impregnated with an insulating resin onto a base material such as glass fiber, or a substrate whose surface is coated with an insulating resin on a flat metal core.

[0029] The shape, number, and location of the main terminals 11-13, auxiliary terminals 14-17, semiconductor elements 50, and wiring boards 60 can be changed as appropriate. While it is desirable to have multiple units of these, the number of semiconductor elements 50 and wiring boards 60 can be any number. Furthermore, it is preferable that the semiconductor elements 50 and wiring boards 60 be sealed with an encapsulating material such as epoxy resin or silicone gel.

[0030] The auxiliary block 30 has, for example, a thin plate shape. The auxiliary block 30 may have a thicker shape such as a cube, but it is preferable that it be a thin material. The auxiliary block 30 has two block through holes 31. One of the auxiliary terminals 14 to 17 is inserted into the block through holes 31. One of the two auxiliary blocks 30 sandwiches the base portion of the auxiliary terminals 14 and 15 that protrudes to the outside from the case through hole 21c of the case 20. The other of the two auxiliary blocks 30 sandwiches the base portion of the auxiliary terminals 16 and 17 that protrudes to the outside from the case through hole 21c of the case 20.

[0031] As shown in Figure 7A, the auxiliary block 30 is preferably fixed to the case 20 (main body 21) after the case 20 (main body 21) has been placed, by the adhesive A, which is an example of a sealing material placed around the case through-hole 21c on the upper surface of the main body 21, being spread out. By placing the adhesive A between the auxiliary block 30 and the case 20 in this way, the adhesive A, together with the auxiliary block 30, seals the gap between the auxiliary terminals 14, 15 or auxiliary terminals 16, 17 and the case through-hole 21c of the case 20, as shown in Figure 7B, thereby fixing the auxiliary block 30 to the case 20 (main body 21). Note that some of the spread adhesive A may enter the case through-hole 21c or the block through-hole 31.

[0032] Adhesive A is, for example, silicone-based and is placed on the main body 21 in any shape, such as a rod. In the example in Figure 7A, adhesive A is placed in multiple separate pieces, but adhesive A may also be placed in other shapes, such as a sheet with through holes for passing through the auxiliary terminals 14-17. Adhesive A only needs to be placed around the case through hole 21c on the upper surface of the case 20 (main body 21), so compared to a configuration in which adhesive A is placed inside the case through hole 21c to seal the gap between the case through hole 21c and the auxiliary terminals 14-17, fine handling of the dispenser is unnecessary. In addition to adhesive A, a sealant and adhesive may be placed, or a non-adhesive sealant may be placed between the case 20 and the auxiliary block 30, and the auxiliary block 30 may be fixed to the case 20 by other means such as fitting, but by using adhesive A as the sealant, the case 20 and the auxiliary block 30 can be fixed while sealing the gap between the auxiliary terminals 14-17 and the case through hole 21c.

[0033] Furthermore, the auxiliary block 30 may have only a single block through-hole 31 into which one of the auxiliary terminals 14 to 17 is inserted, with the base portion sandwiched in between. In this case, the same number of auxiliary blocks 30 as the number of auxiliary terminals 14 to 17 will be arranged. Alternatively, the auxiliary block 30 may have three or more block through-holes 31. In addition, instead of the auxiliary terminals 14 to 17, the block through-holes 31 of the auxiliary block 30 may be used to insert main terminals or the like when they are arranged to penetrate the case 20.

[0034] As shown in Figure 8A (first modified example), the case 20 (main body 21) is preferably provided with a recess 21d into which the auxiliary block 30 is inserted in the through-direction (Z direction) through which the auxiliary terminals 14 to 17 pass through the case through-hole 21c. In this case, as shown in Figure 8B, the auxiliary block 30 does not protrude from the main body 21, and the protruding length of the auxiliary terminals 14 to 17 from the main body 21 can be increased. Note that the recess 21d of the case 20 (main body 21) may be into which only a part of the auxiliary block 30 is inserted.

[0035] As shown in Figure 9A (second modified example), the auxiliary block 130 may have two block notches 131 instead of the two block through holes 31 of the auxiliary block 30 described above. In this case, one of the auxiliary terminals 14 to 17 is inserted into the block notches 131 so that its base portion is sandwiched between them. The main body 121 (case 20) may also have a case notch 121d instead of a recess 21d. In this case, the auxiliary block 130 is inserted into the case notch 121d on the negative side in the X direction, and as shown in Figure 9C, the auxiliary block 130 does not protrude from the main body 121.

[0036] Furthermore, the case notch 121d of the case 20 (main body 121) may be into which a part of the auxiliary block 30 is inserted. Also, the negative X-direction, which is the insertion direction of the auxiliary block 130, is an example of a direction that intersects the through-direction (Z-direction) into which the auxiliary terminals 14-17 pass through the case through-hole 121c. It is also preferable that a bulge 121c-1 is provided in the case through-hole 121c. The auxiliary block 130 may also have one or more block notches 131 into which any of the auxiliary terminals 14-17 are inserted. In addition, the block notches 131 of the auxiliary block 130 may be into which the main terminals, etc., are inserted when they are arranged to pass through the case 20, rather than the auxiliary terminals 14-17.

[0037] Adhesive A may be placed on the auxiliary block 130 (e.g., the side) as shown in Figure 9A, or on the case notch 121d (e.g., the bottom) as shown in Figure 9B, or on both the auxiliary block 130 and the case notch 121d. In particular, it is desirable that adhesive A be placed on the end of the auxiliary block 130 on the insertion side (negative side in the X direction) and on the bottom surface of the case notch 121d.

[0038] As shown in FIG. 10A (third modification example), the case notch 221d and the auxiliary block 230 of the case 20 (main body 221) have a trapezoidal shape in plan view, and the width (Y direction) orthogonal to the insertion direction (negative X direction) of the auxiliary block 230 into the case notch 221d may become narrower as it goes in the insertion direction (L1 < L2). If the case notch 221d and the auxiliary block 230 have the same shape, as shown in FIG. 10B, the entire auxiliary block 230 is accommodated in the case notch 221d.

[0039] Note that the main body 221 of the case 20 is also provided with a case through-hole 221c having a bulging portion 221c-1. Further, as shown in FIG. 10A, the adhesive A may be arranged so as to sandwich each of the auxiliary terminals 14 to 17 at the case notch 221d (bottom surface). Further, the width (Y direction) orthogonal to the insertion direction (negative X direction) that becomes narrower as it goes in the insertion direction may be the width in the Z direction or is not limited to the width in the Y direction. Further, in this third modification example, the widths (Y direction) of the auxiliary block 230 and the case notch 221d orthogonal to the insertion direction (negative X direction) of the auxiliary block 230 become narrower as it goes in the insertion direction (negative X direction), but the widths (at least one of the X direction and the Y direction) of the auxiliary block 30 and the recess 21d shown in FIG. 8A above may become narrower as it goes in the insertion direction (negative Z direction).

[0040] As shown in FIG. 11A (fourth modification example), a block notch 331 is provided in the auxiliary block 330, and the case notches 121d and 221d in the main body 21 (case 20) may be omitted. Further, a recess 21d shown in FIG. 8A is provided in the main body 21, and at least a part of the auxiliary block 330 may be inserted into this recess 21d. In this case, as shown in FIG. 11B, the auxiliary block 330 will protrude from the main body 21 of the case 20 to the outside. However, unlike the auxiliary block 30 having the block through-hole 31 shown in FIG. 7A, since the block notch 331 is provided on the side surface of the auxiliary block 330, the auxiliary block 330 can be inserted from the side (in the negative X direction) of the auxiliary terminals 14 to 17.

[0041] In the embodiment described above, the semiconductor module 1 comprises a semiconductor element 50, a wiring board 60 on which the semiconductor element 50 is mounted, auxiliary terminals 14-17 (an example of terminals) electrically connected to the wiring board 60, a case 20 that houses the semiconductor element 50 and the wiring board 60 and has a case through-hole 21c into which the auxiliary terminals 14-17 are inserted, an auxiliary block 30 fixed to the case 20, sandwiching the base portion of the auxiliary terminals 14-17 that protrudes to the outside from the case through-hole 21c, and an adhesive A (an example of a sealing material) that seals the gap between the auxiliary terminals 14-17 and the case through-hole 21c together with the auxiliary block 30 and adheres the auxiliary block 30 to the case 20.

[0042] This prevents corrosive gases (such as hydrogen sulfide and sulfuric acid) from entering through the gap between the auxiliary terminals 14-17 and the case through-hole 21c, thanks to the auxiliary block 30 and adhesive A. Therefore, compared to a configuration using a dispenser to supply adhesive A to the gap between the auxiliary terminals 14-17 and the case through-hole 21c, this configuration avoids difficulties in accessing the dispenser, unintended adhesion of adhesive A to the auxiliary terminals 14-17 during the dispenser handling process, and defects caused by contact between the dispenser and the auxiliary terminals 14-17. Thus, according to this embodiment, it is possible to prevent the inflow of corrosive gases from the gap between the terminals (auxiliary terminals 14-17) and the case 20 (case through-hole 21c). This suppresses the growth of corrosion products inside the semiconductor module 1, improving the reliability of the semiconductor module 1. Furthermore, it expands the applications of the semiconductor module 1, as it can be used in highly corrosive environments. In addition, it suppresses the deterioration of appearance due to the exposure of adhesive A. Furthermore, compared to the configuration in which adhesive A is supplied to the outside of the semiconductor module 1, adhesive A is less likely to peel off, thus reliably preventing the generation of peeling debris and the inflow of corrosive gases.

[0043] Furthermore, in this embodiment, the auxiliary block 30 has a block through-hole 31 into which auxiliary terminals 14 to 17 are inserted so as to sandwich the base portion.

[0044] As a result, the auxiliary block 30 can seal the gap between the auxiliary terminals 14-17 and the case through-hole 21c around the block through-hole 31, covering the entire circumference of each of the auxiliary terminals 14-17. Therefore, the inflow of corrosive gases can be further prevented.

[0045] Furthermore, in this embodiment, the auxiliary block 30 has a plurality of block through holes 31 that sandwich the base portion.

[0046] This allows a single auxiliary block 30 to seal the gaps between multiple auxiliary terminals 14-17 and multiple case through-holes 21c. Therefore, the semiconductor module 1 can be made simpler in configuration. Furthermore, compared to the case where an auxiliary block 30 is placed at each of the adjacent auxiliary terminals 14-17, the assembly of the auxiliary block 30 can be made easier.

[0047] Furthermore, in the second to fourth modified examples of this embodiment (Figures 9A to 11B), the auxiliary blocks 130, 230, and 330 have block notches 131, 231, and 331 into which the auxiliary terminals 14 to 17 are inserted.

[0048] This allows the auxiliary blocks 130, 230, and 330 to be inserted from the side of the auxiliary terminals 14 to 17. Therefore, the assembly of the auxiliary blocks 130, 230, and 330 can be made easier compared to the case where the block through-holes 31 are provided.

[0049] Furthermore, in the second to fourth modified examples of this embodiment (Figures 9A to 11B), the auxiliary blocks 130, 230, and 330 have multiple block notches 131, 231, and 331.

[0050] This allows a single auxiliary block 130, 230, or 330 to seal the gaps between multiple auxiliary terminals 14-17 and multiple case through-holes 121c, 221c, or 21c. Therefore, the semiconductor module 1 can be made simpler in configuration. Furthermore, compared to the case where an auxiliary block 130, 230, or 330 is placed at each of the adjacent auxiliary terminals 14-17, the assembly of the auxiliary blocks 130, 230, or 330 can be made easier.

[0051] Furthermore, in the first modified example of this embodiment (Figures 8A and 8B), the case 20 has a recess 21d into which at least a portion of the auxiliary block 30 is inserted in the through-direction (Z direction) through which the auxiliary terminals 14 to 17 pass through the case through-hole 21c.

[0052] This prevents the auxiliary terminals 14-17 from having a reduced protrusion length from the main body 21 due to the auxiliary block 30 protruding from the main body 21 of the case 20. It also makes it less likely for adhesive A to leak to the outside of the main body 21.

[0053] Furthermore, in the second and third modified examples of this embodiment (Figures 9A to 10B), the case 20 (main body 121, 221) has case notches 121d, 221d into which at least a portion of the auxiliary blocks 130, 230 is inserted, in a direction (negative X direction) that intersects the through-direction (Z direction) in which the auxiliary terminals 14 to 17 pass through the case through-holes 121c, 221c.

[0054] This prevents the auxiliary terminals 14-17 from having a reduced protrusion length from the main body 121,221 of the case 20, due to the auxiliary blocks 130,230 protruding from the main body 121,221. Furthermore, if the auxiliary blocks 130,230 have block notches 131,231, the assembly of the auxiliary blocks 130,230 can be made even easier by inserting them from the side of the auxiliary terminals 14-17 and the case 20. In addition, it makes it less likely for adhesive A to leak to the outside of the main body 121,221.

[0055] Furthermore, in the third modified example of this embodiment (Figures 10A and 10B), the case notch 221d of the case 20 (main body 221) and the auxiliary block 230 have a width (Y direction) that is perpendicular to the insertion direction as you move toward the insertion direction (negative X direction) of the auxiliary block 230 into the case notch 221d (L1 <L2)。

[0056] This makes it easier to insert the auxiliary block 230 into the case 20, thus further simplifying the assembly of the auxiliary block 230.

[0057] Furthermore, in this embodiment, the auxiliary terminals 14 to 17 have projections 14a, 15a, 16a, and 17a that protrude in a direction (negative Y direction or positive Y direction) intersecting the through-hole (Z direction) that penetrates the case through-hole 21c, and the case through-hole 21c has a bulge 21c-1 that accommodates the projections 14a, 15a, 16a, and 17a.

[0058] As a result, even if the gap between the auxiliary terminals 14-17 and the case through-hole 21c becomes large due to the bulge 21c-1 provided in the case through-hole 21c, the gap can be sealed using the auxiliary block 30 and adhesive A. Therefore, the inflow of corrosive gas can be further prevented.

[0059] Furthermore, in this embodiment, the sealing material that fills the gap between the auxiliary terminals 14-17 and the case through-hole 21c is the adhesive A used to fix the auxiliary block 30 to the case 20.

[0060] This allows the adhesive A used to fix the auxiliary block 30 to the case 20 to seal the gap between the auxiliary terminals 14-17 and the case through-hole 21c. Therefore, a simple configuration can be used to prevent the inflow of corrosive gases.

[0061] Furthermore, in this embodiment, the terminals inserted into the case 20 and the auxiliary block 30 are auxiliary terminals 14 to 17, and the semiconductor module 1 further comprises main terminals 11 to 13 electrically connected to the wiring board 60.

[0062] Incidentally, the spacing between auxiliary terminals 14-17 is particularly narrow. Therefore, the gaps that are extremely difficult to seal even with the dispenser mentioned above can be sealed using the auxiliary block 30.

[0063] The semiconductor module according to the present invention is not limited to the embodiments described above, and may be modified, substituted, or transformed in various ways without departing from the spirit of the technical idea. Furthermore, if the technical idea can be realized in a different way by technological advancements or other derived technologies, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea.

[0064] The following are some of the inventions described in the specification and drawings of this application.

[0065] <Note 1> Semiconductor elements and A wiring board on which the aforementioned semiconductor elements are mounted, Terminals electrically connected to the aforementioned wiring board, A case having a through-hole into which the terminal is inserted, and housing the semiconductor element and the wiring board, The base portion of the terminal that protrudes to the outside from the through-hole in the case is sandwiched between an auxiliary block fixed to the case, A sealing material that seals the gap between the terminal and the through-hole in the case together with the auxiliary block, and adheres the auxiliary block to the case. A semiconductor module characterized by comprising the following features.

[0066] <Note 2> The auxiliary block has a block through-hole into which the terminal is inserted so as to sandwich the base portion. A semiconductor module as described in Appendix 1, characterized by the features described herein.

[0067] <Note 3> The auxiliary block has a plurality of holes through the block. A semiconductor module as described in Appendix 2, characterized by the features described herein.

[0068] <Note 4> The auxiliary block has a block notch into which the terminal is inserted so as to sandwich the base portion. A semiconductor module as described in Appendix 1, characterized by the features described herein.

[0069] <Note 5> The auxiliary block has a plurality of block notches. A semiconductor module as described in Appendix 4, characterized by the features described herein.

[0070] <Note 6> The case has a recess into which at least a portion of the auxiliary block is inserted in a through direction in which the terminal passes through the case through hole. A semiconductor module characterized by any one of the appendices 1 to 5.

[0071] <Note 7> The case has a case notch into which at least a portion of the auxiliary block is inserted in a direction intersecting the through-direction in which the terminals pass through the case through-hole. A semiconductor module characterized by any one of the appendices 1 to 6.

[0072] <Note 8> The case notch and the auxiliary block have a width that is perpendicular to the insertion direction as the auxiliary block is inserted into the case notch. A semiconductor module as described in Appendix 7, characterized by the features described herein.

[0073] <Note 9> The terminal has a projection that protrudes in a direction intersecting the through-direction that penetrates the case through-hole, The case through-hole has a bulge that accommodates the projection. A semiconductor module characterized by any one of the appendices 1 to 8.

[0074] <Note 10> The sealing material is an adhesive used to fix the auxiliary block to the case. A semiconductor module characterized by any one of the appendices 1 to 9.

[0075] <Note 11> The aforementioned terminal is an auxiliary terminal, The semiconductor module further comprises main terminals electrically connected to the wiring board. A semiconductor module characterized by any one of the appendices 1 to 10. [Industrial applicability]

[0076] As described above, the present invention has the effect of preventing corrosive gases from entering through the gap between the terminal and the case, and is particularly useful for inverter devices used in industrial or electrical equipment. [Explanation of Symbols]

[0077] 1. Semiconductor module 11~13 Main terminal 11a,12a,13a Main terminal through hole 14-17 Auxiliary terminals 14a,15a,16a,17a protrusion 20 cases 21 Main unit 21a opening 21b Fastening hole 21c Case through-hole 21c-1 Bulge 21d recess 22 Nut Gloves 22a Nut 30 Auxiliary Blocks 31 Block through holes 40 Heat dissipation base 41 Fastening hole 50 Semiconductor elements 50-1 Switching element 50-2 Diode element 60 Wiring board 61. First Conductor Layer 62 Second Conductor Layer 63 Insulating layer 121,221 units 121c, 221c Case through-holes 121c-1,221c-1 Bulge 121d, 221d Case cutout 130,230,330 Auxiliary Blocks 131,231,331 block notches A Adhesive W wiring

Claims

1. Semiconductor elements and A wiring board on which the aforementioned semiconductor elements are mounted, Terminals electrically connected to the aforementioned wiring board, A case having a through-hole into which the terminal is inserted, and housing the semiconductor element and the wiring board, The base portion of the terminal that protrudes to the outside from the through-hole in the case is sandwiched between an auxiliary block fixed to the case, A sealing material that seals the gap between the terminal and the through-hole in the case together with the auxiliary block, and adheres the auxiliary block to the case. A semiconductor module characterized by comprising the following features.

2. The auxiliary block has a block through-hole into which the terminal is inserted so as to sandwich the base portion. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

3. The auxiliary block has a plurality of holes through the block. The semiconductor module according to claim 2, characterized in that it is as described above.

4. The auxiliary block has a block notch into which the terminal is inserted so as to sandwich the base portion. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

5. The auxiliary block has a plurality of block notches. The semiconductor module according to claim 4, characterized by its features.

6. The case has a recess into which at least a portion of the auxiliary block is inserted in a through direction in which the terminal passes through the case through hole. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

7. The case has a case notch into which at least a portion of the auxiliary block is inserted in a direction intersecting the through-direction in which the terminals pass through the case through-hole. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

8. The case notch and the auxiliary block have a width that is perpendicular to the insertion direction as the auxiliary block is inserted into the case notch. The semiconductor module according to claim 7, characterized by its features.

9. The terminal has a projection that protrudes in a direction intersecting the through-direction that penetrates the case through-hole, The case through-hole has a bulge that accommodates the projection. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

10. The sealing material is an adhesive used to fix the auxiliary block to the case. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

11. The aforementioned terminal is an auxiliary terminal, The semiconductor module further comprises main terminals electrically connected to the wiring board. The semiconductor module according to claim 1, characterized in that it is a semiconductor module.

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