Semiconductor equipment

Abstract

To increase the area of ​​the drive electrodes in semiconductor devices. [Solution] The semiconductor device 10 comprises a cell region 11 on which a cell 11A is provided, an outer peripheral region 12 surrounding the cell region 11, a gate electrode disposed in the outer peripheral region 12, and a drive electrode 21. The drive electrode 21 has an electrode portion 21A provided in the cell region and an outer peripheral electrode portion 21B formed in the outer peripheral region 12 at a distance from the electrode portion 21A. The outer peripheral region 12 is provided with insulating films 38, 39 that surround the cell region 11 in a plan view, and a gate finger 23 embedded in the insulating films 38, 39, connected to the gate electrode, and formed to surround the cell region 11. The insulating films 38, 39 have a front surface and a back surface that face opposite each other in the thickness direction of the insulating films 38, 39. The gate finger 23 is disposed spaced apart from both the front surface and the back surface in the thickness direction of the insulating films 38, 39.

Description

[Technical Field]

[0001] This disclosure relates to semiconductor devices. [Background technology]

[0002] For example, in semiconductor devices such as IGBTs (Insulated Gate Bipolar Transistors) used in automotive inverter devices, the emitter routing portion is formed integrally with the emitter electrode so as to surround the gate finger in order to suppress heat generation (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2018-120990

[0004] [overview] Incidentally, because the emitter routing section, gate finger, and emitter electrode are spaced apart from each other, there is a limit to how much of the semiconductor device's area that can be formed by the emitter electrode can be increased. It should be noted that this problem is not limited to IGBTs; it can similarly occur in other transistors such as MOSFETs (metal-oxide-semiconductor field-effect transistors).

[0005] The semiconductor device that solves the above problems includes a cell region provided with cells, an outer peripheral region surrounding the cell region, a gate electrode disposed in the outer peripheral region, an electrode portion provided in the cell region, and an outer peripheral electrode portion formed in the outer peripheral region at a distance from the electrode portion, and a driving electrode having the same. In the outer peripheral region, an insulating film provided so as to surround the cell region in a plan view, and a gate finger embedded in the insulating film, connected to the gate electrode, and formed so as to surround the cell region are provided. The insulating film has a front surface and a back surface facing opposite sides in the thickness direction of the insulating film, and the gate finger is disposed at a distance from both the front surface and the back surface in the thickness direction of the insulating film.

Brief Description of the Drawings

[0006] [Figure 1] FIG. 1 is a plan view of a semiconductor device according to the first embodiment. [Figure 2] FIG. 2 is an enlarged view of the gate electrode of the semiconductor device of FIG. 1 and its periphery. [Figure 3] FIG. 3 is a cross-sectional view showing the cross-sectional structure of the cell region of the semiconductor device of FIG. 1. [Figure 4] FIG. 4 is a cross-sectional view showing the cross-sectional structure of the outer peripheral region of the semiconductor device of FIG. 1. [Figure 5] FIG. 5 is a cross-sectional view showing the cross-sectional structure of the 5-5 line of the semiconductor device of FIG. 1. [Figure 6] FIG. 6 is a cross-sectional view showing the cross-sectional structure of the 6-6 line of the semiconductor device of FIG. 1. [Figure 7] FIG. 7 is a plan view of a semiconductor device of a comparative example. [Figure 8] FIG. 8 is a cross-sectional view showing the cross-sectional structure of the 8-8 line of the semiconductor device of the comparative example of FIG. 7. [Figure 9] FIG. 9 is a cross-sectional view showing the cross-sectional structure of the 9-9 line of the semiconductor device of the comparative example of FIG. 7. [Figure 10] FIG. 10 is a plan view of a semiconductor device according to the second embodiment. [Figure 11]FIG. 11 is an enlarged view of the gate electrode of the semiconductor device in FIG. 10 and its surroundings. [Figure 12] FIG. 12 is a cross-sectional view showing the cross-sectional structure of the 12-12 line of the semiconductor device in FIG. 10. [Figure 13] FIG. 13 is a cross-sectional view showing the cross-sectional structure of the 13-13 line of the semiconductor device in FIG. 10. [Figure 14] FIG. 14 is a plan view showing an enlarged view of the gate electrode of the semiconductor device of the modified example and its surroundings.

[0007] [Detailed Description] Hereinafter, embodiments of the semiconductor device will be described with reference to the drawings. The embodiments shown below illustrate configurations and methods for embodying the technical idea, and do not limit the materials, shapes, structures, arrangements, dimensions, etc. of each component to those described below.

[0008] [First Embodiment] (Configuration of Semiconductor Device) Referring to FIGS. 1 to 6, the configuration of an embodiment of the semiconductor device 10 will be described.

[0009] As shown in FIG. 1, the semiconductor device 10 of this embodiment is a trench gate type IGBT (Insulated Gate Bipolar Transistor). This semiconductor device 10 is used as a switching element, for example, in an in-vehicle inverter device. In this case, a current of, for example, 5 A or more and 1000 A or less flows through the semiconductor device 10.

[0010] As shown in Figure 1, the semiconductor device 10 is formed in the shape of a rectangular plate, for example. In this embodiment, the main surface 10s of the semiconductor device 10 is formed in the shape of a square, for example. In this embodiment, the length of one side of the main surface 10s is about 11 mm. That is, the chip size of the semiconductor device 10 in this embodiment is 11 mm square. The semiconductor device 10 has a back surface 10r (see Figure 3) facing away from the main surface 10s, and four side surfaces 10a to 10d formed between the main surface 10s and the back surface 10r. The side surfaces 10a to 10d are, for example, surfaces that connect the main surface 10s and the back surface 10r, and are perpendicular to both the main surface 10s and the back surface 10r.

[0011] In the following description, the direction in which the main surface 10s and the back surface 10r of the device face is referred to as the "z-direction." The z-direction can also be said to be the height direction of the semiconductor device 10. Two mutually orthogonal directions that are perpendicular to the z-direction are referred to as the "x-direction" and the "y-direction." In this embodiment, the side surfaces 10a and 10b of the device constitute both end surfaces in the x-direction of the semiconductor device 10, and the side surfaces 10c and 10d of the device constitute both end surfaces in the y-direction of the semiconductor device 10. For convenience, the direction from the back surface 10r toward the main surface 10s of the device is referred to as "upward," and the direction from the main surface 10s toward the back surface 10r of the device is referred to as "downward." Viewing the semiconductor device 10 from the z-direction is referred to as a "plan view."

[0012] As shown in Figure 2, the semiconductor device 10 is equipped with an emitter electrode 21, a gate electrode 22, and a collector electrode 27 (see Figure 3) as external electrodes for connecting to the outside of the semiconductor device 10.

[0013] The emitter electrode 21 is an electrode that constitutes the emitter of the IGBT and is the electrode through which the main current of the semiconductor device 10 flows. The emitter electrode 21 is formed on the main surface 10s of the device. An opening 21a is formed in the emitter electrode 21, closer to the side surface 10c of the device than to the center in the y direction and to the center in the x direction.

[0014] The gate electrode 22 is an electrode that constitutes the gate of the IGBT, and is the electrode to which a drive voltage signal for driving the semiconductor device 10 is supplied from outside the semiconductor device 10. The gate electrode 22 is formed on the main surface 10s of the device. The gate electrode 22 is formed within the opening 21a of the emitter electrode 21.

[0015] The collector electrode 27 is an electrode that constitutes the collector of the IGBT, and is the electrode through which the main current of the semiconductor device 10 flows. In other words, in the semiconductor device 10, the main current flows from the collector electrode 27 to the emitter electrode 21. The collector electrode 27 is formed on the back surface 10r of the device. More specifically, the collector electrode 27 is formed over the entire back surface 10r of the device.

[0016] As shown by the dashed lines in Figures 1 and 2, the semiconductor device 10 comprises a cell region 11 on which a plurality of cells 11A (see Figure 3) are formed, and an outer peripheral region 12 provided outside the cell region 11 so as to surround the cell region 11. Here, cell 11A refers to the main cell on which the transistor is formed. In other words, the cell region 11 is the region on which the transistor is formed. In this embodiment, the shape of the cell region 11 in plan view is rectangular.

[0017] An emitter electrode 21 is provided in the cell region 11. The emitter electrode 21 is formed over most of the cell region 11. In a plan view, the emitter electrode 21 has a shape that conforms to the shape of the cell region 11. Cell 11A is not formed in the part of the cell region 11 that overlaps with the gate electrode 22. In other words, the cell region 11 has a recessed area 11a that avoids the gate electrode 22.

[0018] The outer peripheral region 12 is a region where a termination structure is provided to improve the dielectric breakdown voltage of the semiconductor device 10. In a plan view, the outer peripheral region 12 is an annular region formed on the outer periphery of the main surface 10s of the device. In a plan view, the outer peripheral region 12 can also be described as the region of the main surface 10s of the device other than the cell region 11.

[0019] The outer peripheral region 12 contains a portion of the emitter electrode 21 and the gate electrode 22. The outer peripheral region 12 is also provided with a gate finger 23, a Field Limiting Ring (FLR) portion 24, and an equipotential ring 25. The emitter electrode 21, the gate electrode 22, the multiple (eight in this embodiment) field plates 24b of the FLR portion 24 (described later), and the equipotential ring 25 all contain a common metal film. This metal film is formed from a material containing, for example, AlCu (an alloy of aluminum and copper).

[0020] The gate finger 23 is configured to quickly supply the current supplied to the gate electrode 22 to the cell 11A in the portion of the emitter electrode 21 that is far from the gate electrode 22. The gate finger 23 is connected to the gate electrode 22.

[0021] The gate finger 23 is provided on the outer periphery of the emitter electrode 21. The gate finger 23 is formed to surround the cell region 11. The gate finger 23 is formed of metal wiring. In a plan view, the gate finger 23 is positioned to overlap with the outer periphery of the emitter electrode 21. In this embodiment, the gate finger 23 is formed of a material containing tungsten (W).

[0022] The gate finger 23 includes gate fingers 23A, 23B, and 23C. Gate finger 23A extends from the gate electrode 22 toward the device side 10a and is formed to surround the cell region 11 from the device side 10c, device side 10a, and device side 10d. Gate finger 23B extends from the gate electrode 22 toward the device side 10b and is formed to surround the cell region 11 from the device side 10c, device side 10b, and device side 10d. The tip of gate finger 23A and the tip of gate finger 23B face each other with a gap in the x direction in the portion closer to the device side 10d than the emitter electrode 21. In a plan view, gate finger 23C is formed in a position that overlaps with the gate electrode 22. Gate finger 23C connects gate finger 23A and gate finger 23B. Note that there may be multiple gate fingers 23.

[0023] The FLR section 24 is a termination structure for improving the breakdown voltage of the semiconductor device 10 and is provided outside the emitter electrode 21. The FLR section 24 is formed in an annular shape surrounding the emitter electrode 21 and the gate electrode 22. In this embodiment, the FLR section 24 is formed to be a closed annular shape. The FLR section 24 has the function of improving the breakdown voltage of the semiconductor device 10 by mitigating the electric field in the outer peripheral region 12 and suppressing the influence of external ions.

[0024] The equipotential ring 25 is a termination structure for improving the breakdown voltage of the semiconductor device 10, and is formed in an annular shape to surround the FLR portion 24. In this embodiment, the equipotential ring 25 is formed to be a closed annular shape. The equipotential ring 25 has the function of improving the breakdown voltage of the semiconductor device 10.

[0025] The semiconductor device 10 includes a passivation film 13 (see Figure 4) that covers both the cell region 11 and the outer peripheral region 12. The passivation film 13 covers the emitter electrode 21, the gate electrode 22, the FLR portion 24, and the equipotential ring 25. The passivation film 13 is a protective film that protects the semiconductor device 10 from the outside. The passivation film 13 is an organic insulating film formed from a material including, for example, polyimide (PI). Note that the passivation film 13 is omitted in Figures 1 and 2 for the sake of clarity.

[0026] The passivation film 13 is provided with a first opening (not shown) that exposes a portion of the emitter electrode 21 and a second opening (not shown) that exposes most of the gate electrode 22. The portion of the emitter electrode 21 exposed by the first opening constitutes the emitter electrode pad. The portion of the gate electrode 22 exposed by the second opening constitutes the gate electrode pad.

[0027] Figure 3 shows an example of a cross-sectional structure of a part of the cell region 11. For convenience, in Figure 3, some hatching of components of the semiconductor device 10 in the cell region 11 has been omitted.

[0028] As shown in Figure 3, the semiconductor device 10 includes a semiconductor substrate 30. The semiconductor substrate 30 is, for example, n - It is formed from a material containing silicon (Si) of a specific type. The semiconductor substrate 30 has a thickness of, for example, 50 μm to 200 μm.

[0029] The semiconductor substrate 30 has a substrate surface 30s and a substrate back surface 30r that face opposite each other in the z-direction. In other words, the z-direction can also be said to be the thickness direction of the semiconductor substrate 30. The semiconductor substrate 30 is arranged in order from the back surface 30r of the substrate toward the front surface 30s of the substrate, p + A collector layer 31 of type n, a buffer layer 32 of type n, and n -It has a structure in which a drift layer 33 of a certain type is laminated. On the back surface 30r of the substrate, a collector electrode 27 is formed. The collector electrode 27 is formed over substantially the entire surface of the back surface 30r of the substrate. The surface of the collector electrode 27 on the side opposite to the back surface 30r of the substrate constitutes the device back surface 10r of the semiconductor device 10.

[0030] As the p-type dopant of the collector layer 31, for example, B (boron), Al (aluminum), etc. are used. The impurity concentration of the collector layer 31 is, for example, 1×10 15 cm -3 or more and 2×10 19 cm -3 or less.

[0031] As the n-type dopant of the buffer layer 32 and the drift layer 33, for example, N (nitrogen), P (phosphorus), As (arsenic), etc. are used. The impurity concentration of the buffer layer 32 is, for example, from 1×10 15 cm -3 or more to 5×10 17 cm -3 or less. The impurity concentration of the drift layer 33 is lower than that of the buffer layer 32, for example, from 1×10 13 cm -3 or more to 5×10 14 cm -3 or less.

[0032] On the surface of the drift layer 33, that is, on the substrate surface 30s, a p-type base region 34 is formed. The base region 34 is formed over substantially the entire surface of the substrate surface 30s. The impurity concentration of the base region 34 is, for example, from 1×10 16 cm -3 or more to 1×10 18 cm -3 or less. The depth of the base region 34 from the substrate surface 30s is, for example, from 1.0 μm or more to 4.0 μm or less.

[0033] Multiple trenches 35 are arranged side by side on the surface (substrate surface 30s) of the base region 34 in the cell region 11. Each trench 35 extends, for example, along the y-direction and is spaced apart from each other in the x-direction. This divides the cell into stripe-shaped cells 11A. The spacing between adjacent trenches 35 in the x-direction (distance between the centers of the trenches 35) is, for example, 1.5 μm to 7.0 μm. The width of each trench 35 (dimension of the trench 35 in the x-direction) is, for example, 0.5 μm to 3.0 μm. Each trench 35 penetrates the base region 34 in the z-direction and extends partway through the drift layer 33. Note that each trench 35 may be formed in a grid pattern to divide the matrix-shaped cells 11A.

[0034] On the surface of the base region 34 in the cell region 11 (substrate surface 30s), n + An emitter region 36 of type 1 is formed. The emitter region 36 is located on both sides of the trench 35 in the x-direction. In other words, the emitter region 36 can be said to be located on both sides of the trench 35 in the direction of the trench 35 arrangement within the base region 34. Therefore, between adjacent trenches 35 in the x-direction, two emitter regions 36 are arranged with a gap between them in the x-direction. The depth of each emitter region 36 is, for example, 0.2 μm to 0.6 μm. Also, the impurity concentration of each emitter region 36 is higher than that of the base region 34, for example, 1 × 10⁻¹⁶. 19 cm -3 The above 5 x 10 20 cm -3 The following applies:

[0035] On the surface of the base region 34 in the cell region 11 (substrate surface 30s), p +A base contact region 37 of type 1 is formed. The base contact region 37 is located adjacent to the emitter region 36 in the x-direction. That is, the base contact region 37 is located between the x-direction of two emitter regions 36 that are located between adjacent trenches 35 in the x-direction. Each base contact region 37 may be formed deeper than the emitter region 36. The depth of each base contact region 37 is, for example, 0.2 μm or more and 0.8 μm or less. In addition, the impurity concentration of each base contact region 37 is higher than that of the base region 34, for example, 5 × 10⁻⁶. 18 cm -3 The above 1 x 10 20 cm -3 The following applies:

[0036] An insulating film 38 is integrally formed on both the inner surface of each trench 35 and the substrate surface 30s. Therefore, it can be said that the insulating film 38 is formed on the surface of the drift layer 33. The insulating film 38 has, for example, silicon oxide (SiO2). The thickness of the insulating film 38 is, for example, 1100 Å to 1300 Å. The insulating film 38 in the cell region 11 can also be said to constitute the gate insulating film. The insulating film 38 formed on the substrate surface 30s has a back surface 38r that faces the same side as the back surface 30r of the substrate. In this embodiment, the back surface 38r of the insulating film 38 is in contact with the substrate surface 30s.

[0037] An electrode material, such as polysilicon, is embedded in each trench 35 via an insulating film 38. The electrode material embedded in each trench 35 is electrically connected to either the gate electrode 22 (gate finger 23) or the emitter electrode 21. In other words, the electrode material embedded in each trench 35 forms a gate trench 22A and an emitter trench 21TE. In this embodiment, gate trenches 22A and emitter trenches 21TE are alternately provided in the arrangement direction of the multiple trenches 35. In this embodiment, both the gate trenches 22A and emitter trenches 21TE are embedded up to the open end of each trench 35.

[0038] An intermediate insulating film 39 is formed on the surface 38s of the insulating film 38 provided on the substrate surface 30s. The intermediate insulating film 39 has, for example, SiO2. The thickness of the intermediate insulating film 39 is thicker than that of the insulating film 38, for example, 3000 Å or more and 15000 Å or less.

[0039] The emitter electrode 21 is formed on the surface 39s of the intermediate insulating film 39. The intermediate insulating film 39 is an interlayer insulating film that fills both the space between the emitter electrode 21 and the gate trench 22A, and the space between the emitter electrode 21 and the emitter trench 21TE.

[0040] In the cell region 11, contact holes 40a are formed in both the intermediate insulating film 39 and the insulating film 38, exposing the base contact region 37. A portion of the emitter electrode 21 is embedded in the contact hole 40a and in contact with the base contact region 37.

[0041] Figure 4 shows an example of the cross-sectional structure of the outer peripheral region 12. As shown in Figure 4, a well region 34A, which is a semiconductor region of the second conductivity type (p-type in this embodiment), is formed in the outer peripheral region 12. The well region 34A is formed on the surface of the drift layer 33 (the substrate surface 30s of the semiconductor substrate 30). The depth of the well region 34A is greater than the depth of the base region 34. In this embodiment, the depth of the well region 34A is greater than the depth of the trench 35. The impurity concentration in the well region 34A is higher than the impurity concentration in the drift layer 33 and lower than the impurity concentration in the base region 34. In one example, the impurity concentration in the well region 34A is 1 × 10⁻⁶ 16 cm -3 The above 1 x 10 18 cm -3 The following applies:

[0042] The FLR portion 24 is formed outside the well region 34A. The FLR portion 24 consists of a plurality (four in this embodiment) of annular conductive and semiconductor regions that are spaced apart from each other.

[0043] Multiple (eight in this embodiment) annular guard rings 24a are formed on the substrate surface 30s of the semiconductor substrate 30. In this embodiment, each guard ring 24a is formed as a closed annular shape. Each guard ring 24a is partially formed in the drift layer 33. Each guard ring 24a is a semiconductor region of the second conductivity type (p-type in this embodiment) and is spaced apart from each other in a direction perpendicular to the z-direction. In this embodiment, the depth of each guard ring 24a is the same as the depth of the well region 34A. For example, B, Al, etc., are used as the p-type dopant for each guard ring 24a. The impurity concentration of each guard ring 24a is the same as the impurity concentration of the well region 34A, for example, 1 × 10⁻⁶ 16 cm -3 The above 1 x 10 18 cm -3 The following applies. In this case, each guard ring 24a and the well region 34A may be formed in the same process.

[0044] The FLR section 24 has multiple field plates 24b, which are provided in accordance with the multiple guard rings 24a. Each field plate 24b is provided on the intermediate insulating film 39. In a plan view, the field plates 24b are provided in a position that overlaps with the corresponding guard ring 24a.

[0045] The field plate 24b is in contact with the corresponding guard ring 24a. More specifically, openings 40b (see Figure 5) are individually formed in the intermediate insulating film 39 and insulating film 38 at positions corresponding to each guard ring 24a, exposing each guard ring 24a. Each field plate 24b is in individual contact with each guard ring 24a through the corresponding opening 40b. In this embodiment, each guard ring 24a and each field plate 24b are electrically floating.

[0046] The equipotential ring 25 is formed on the surface of the drift layer 33 (substrate surface 30s) and has a first conductivity type (n +It has a channel stop region (not shown) of type 38, internal wiring (not shown) provided within the insulating film 38 and the intermediate insulating film 39, and surface-side wiring 25a provided on the intermediate insulating film 39.

[0047] The channel stop region is formed from the position overlapping with the surface wiring 25a when viewed from the z direction to the side surface 10c of the device. The channel stop region is located outward (closer to the side surface 10c) relative to the internal wiring. The impurity concentration in the channel stop region is the same as, for example, the impurity concentration in the emitter region 36 (see Figure 3), which is 1 × 10⁻⁶. 19 cm -3 The above 5 x 10 20 cm -3 The following applies. In this case, for example, the channel stop region is formed in the same process as the emitter region 36.

[0048] The internal wiring is provided on an insulating film 38 and covered by an intermediate insulating film 39. The internal wiring is formed from an electrode material such as polysilicon. An oxide film is formed on the surface of the internal wiring.

[0049] The surface-side wiring 25a is positioned to overlap both the channel stop region and the internal wiring in a plan view. The surface-side wiring 25a is formed of a material including, for example, AlCu. The surface-side wiring 25a is electrically connected to both the channel stop region and the internal wiring. More specifically, a first opening is provided in the intermediate insulating film 39 and insulating film 38 at a position corresponding to the channel stop region. The surface-side wiring 25a has a first contact that contacts the channel stop region through the first opening. A second opening is provided in the intermediate insulating film 39 at a position corresponding to the internal wiring. The surface-side wiring 25a has a second contact that contacts the internal wiring through the second opening.

[0050] Figures 5 and 6 show examples of the cross-sectional structure of a portion of the cell region 11 and the outer peripheral region 12. For convenience, in Figures 5 and 6, the hatching of some components of the semiconductor device 10 in a portion of the cell region 11 and the outer peripheral region 12 has been omitted. Also, for convenience, the passivation film 13 has been omitted in Figures 5 and 6.

[0051] As shown in Figures 2, 5, and 6, in this embodiment, the well region 34A is provided adjacent to the cell region 11. In a plan view, the well region 34A is provided so as to surround the cell region 11. In a plan view, the well region 34A is formed in an annular shape with width in a direction perpendicular to the z direction (for example, the x or y direction). As shown in Figure 5, the well region 34A is formed in a position that overlaps with the gate electrode 22. In a plan view, it can also be said that the gate electrode 22 is located within the well region 34A.

[0052] The well region 34A comprises a first well region 34AA having a first width dimension around the cell region 11, and a second well region 34AB having a second width dimension larger than the first width dimension. The second well region 34AB is formed to fit into the recess 11a of the cell region 11. In plan view, the shape of the second well region 34AB is rectangular. In plan view, the second well region 34AB is formed in a position that overlaps with the gate electrode 22.

[0053] The first well region 34AA is connected to both ends of the second well region 34AB in the x-direction and is formed in an annular shape surrounding the cell region 11. The first well region 34AA is connected to the end of the second well region 34AB in the y-direction that is farther from the cell electrode portion 21A of the emitter electrode 21, which will be described later. In other words, the second well region 34AB is formed inward from the FLR portion 24 and adjacent to the FLR portion 24.

[0054] The well region 34A has an inner circumferential portion 34B, which is the part closer to the cell electrode portion 21A than the center in the width direction, and an outer circumferential portion 34C, which is the part further away from the cell electrode portion 21A than the center in the width direction. The outer circumferential portion 34C can also be said to be the part closer to the outer circumferential region 12 than the center in the width direction.

[0055] An insulating film 38 is formed on the substrate surface 30s in the outer peripheral region 12. An intermediate insulating film 39 is formed on the insulating film 38 formed on the substrate surface 30s. In other words, both the insulating film 38 and the intermediate insulating film 39 are formed across both the cell region 11 and the outer peripheral region 12.

[0056] A gate electrode 22 is formed on the surface 39s of the intermediate insulating film 39. The intermediate insulating film 39 can be described as an interlayer insulating film that fills the space between the gate electrode 22 and the well region 34A. Alternatively, the intermediate insulating film 39 can be described as an interlayer insulating film that fills the space between the multiple field plates 24b and the multiple guard rings 24a of the FLR portion 24 (see Figure 4 for both).

[0057] In this embodiment, the intermediate insulating film 39 and the insulating film 38 correspond to "insulating films". The surface 39s of the intermediate insulating film 39 corresponds to the "surface of the insulating film", and the back surface 38r of the insulating film 38 corresponds to the "back surface of the insulating film".

[0058] (Configuration of emitter electrode, gate electrode, and gate finger) The configurations of the emitter electrode 21, gate electrode 22, and gate finger 23A (23B) will be described with reference to Figures 2, 5, and 6. Note that the configuration of gate finger 23B is the same as that of gate finger 23A, so its description will be omitted.

[0059] The emitter electrode 21 is positioned in a location that overlaps with both the cell region 11 and the outer peripheral region 12 in a plan view. It can also be said that the emitter electrode 21 is positioned inward from the annular FLR portion 24.

[0060] The emitter electrode 21 includes a cell electrode portion 21A provided in the cell region 11, an outer peripheral electrode portion 21B provided in the outer peripheral region 12 at a distance from the cell electrode portion 21A, and a connecting portion 21G connecting the cell electrode portion 21A and the outer peripheral electrode portion 21B. In this embodiment, the cell electrode portion 21A, the outer peripheral electrode portion 21B, and the connecting portion 21G are integrally formed.

[0061] In a plan view, the cell electrode portion 21A covers the entire cell region 11. Therefore, the shape of the cell electrode portion 21A in a plan view is rectangular. In this embodiment, the cell electrode portion 21A corresponds to the "electrode portion".

[0062] In a plan view, the outer electrode portion 21B covers the inner region of the outer peripheral region 12. The inner region of the outer peripheral region 12 is the region located inward from the FLR portion 24 within the outer peripheral region 12. The outer electrode portion 21B is located outward from the gate finger 23. In other words, the outer electrode portion 21B covers the region of the inner peripheral region of the outer peripheral region 12 that is close to the FLR portion 24. Furthermore, the outer electrode portion 21B is formed to avoid the gate electrode 22. Thus, in a plan view, the outer electrode portion 21B can be described as a part provided in the outer peripheral region 12 at a distance from the cell region 11.

[0063] In a plan view, the outer electrode portion 21B covers the region of the well region 34A that is outside the gate finger 23, excluding the region that overlaps with the gate electrode 22. More specifically, the outer electrode portion 21B covers the portion of the outer periphery 34C of the second well region 34AB that is outside the gate electrode 22. Furthermore, the outer electrode portion 21B covers the region of the outer periphery 34C of the first well region 34AA that is outside the gate fingers 23A and 23B.

[0064] In this embodiment, the outer peripheral electrode portion 21B is provided in an annular shape surrounding the cell electrode portion 21A in a plan view. The outer peripheral electrode portion 21B is provided as the outer peripheral portion of the emitter electrode 21.

[0065] As described above, the emitter electrode 21 has an opening 21a where the gate electrode 22 is located. Both the outer peripheral electrode portion 21B and the connecting portion 21G include the portion of the emitter electrode 21 adjacent to the opening 21a in the x-direction, in other words, the portion of the emitter electrode 21 adjacent to the gate electrode 22 in the x-direction. In this embodiment, as shown in Figure 2, it can also be said that the opening 21a is formed across the outer peripheral electrode portion 21B and the connecting portion 21G in the x-direction.

[0066] As shown in Figures 5 and 6, the outer peripheral electrode portion 21B has an outer peripheral end 21C located outward from the gate electrode 22 in the y-direction. Here, the outer peripheral end 21C of the outer peripheral electrode portion 21B is the end closer to the FLR portion 24 among the two ends in the width direction of the annular outer peripheral electrode portion 21B which has a width. The outer peripheral end 21C has a portion that is positioned between the gate electrode 22 and the FLR portion 24 in the y-direction.

[0067] The connecting portion 21G is provided between the cell electrode portion 21A and the outer peripheral electrode portion 21B. In a plan view, the connecting portion 21G is positioned in the outer peripheral region 12 and covers the gate fingers 23A and 23B. Therefore, the connecting portion 21G covers the inner peripheral region of the outer peripheral region 12. In a plan view, the connecting portion 21G is formed to surround the entire circumference of the cell electrode portion 21A. In other words, the connecting portion 21G is formed in an annular shape with width.

[0068] In a plan view, the connecting portion 21G covers the region of the well region 34A that is inward of the gate finger 23, excluding the region that overlaps with the gate electrode 22. More specifically, the connecting portion 21G covers the portion of the inner circumference 34B of the second well region 34AB that is inward of the gate electrode 22. The connecting portion 21G also covers the inner circumference 34B and a part of the outer circumference 34C of the first well region 34AA. The connecting portion 21G covers the region of the outer circumference 34C of the first well region 34AA that overlaps with the gate fingers 23A and 23B in a plan view. In this way, the emitter electrode 21 covers the entire well region 34A with the outer circumference electrode portion 21B and the connecting portion 21G. The outer circumference electrode portion 21B has the connecting portion 21G. In a plan view, the gate fingers 23A and 23B are provided in positions that overlap with the outer circumference electrode portion 21B.

[0069] The insulating film 38 and the intermediate insulating film 39 are provided across both the cell region 11 and the outer peripheral region 12. Therefore, the insulating film 38 and the intermediate insulating film 39 are formed to cover the well region 34A.

[0070] Both the insulating film 38 and the intermediate insulating film 39 have first openings 41 and second openings 42 formed so as to penetrate the insulating film 38 and the intermediate insulating film 39. These openings 41 and 42 expose the well region 34A from the insulating film 38 and the intermediate insulating film 39. In other words, both the first opening 41 and the second opening 42 are located in positions that overlap with the well region 34A in a plan view.

[0071] The first opening 41 is formed on the side of the gate finger 23 opposite to the cell electrode portion 21A. In other words, the first opening 41 is formed at a position farther from the cell electrode portion 21A than the gate finger 23. The first opening 41 extends along the x-direction at a position overlapping with the outer peripheral end 21C. That is, the first opening 41 is formed on the side of the gate electrode 22 opposite to the cell electrode portion 21A in the y-direction.

[0072] The first opening 41 is formed in a position that overlaps with the outer periphery 34C of the well region 34A in a plan view. In this embodiment, the first opening 41 is formed in a position that overlaps with the outer periphery end of the well region 34A. The outer periphery end of the well region 34A is the end of the well region 34A in the width direction that is closer to the FLR portion 24.

[0073] The second opening 42 is formed closer to the cell electrode portion 21A relative to the gate finger 23. As shown in Figure 2, in a plan view, the second opening 42 has a recess 42a that is concave in shape along the shape of the opening 21a of the emitter electrode 21. In other words, the second opening 42 extending in the y direction is positioned to overlap with the gate electrode 22 when viewed from the x direction, and in a plan view, it has a bent shape that avoids the gate electrode 22.

[0074] The second opening 42 is formed in a position that overlaps with the inner circumference 34B of the well region 34A in a plan view. In this embodiment, the second opening 42 is formed in a position that overlaps with the inner circumferential end of the well region 34A. The inner circumferential end of the well region 34A is the end closer to the emitter electrode 21 among the two ends of the well region 34A in the width direction of the well region 34A.

[0075] The outer peripheral electrode portion 21B is formed to cover the first opening 41 in a plan view. The outer peripheral electrode portion 21B has a first contact 21D embedded in the first opening 41. Therefore, the shape of the first contact 21D in a plan view is the same as the shape of the first opening 41 in a plan view.

[0076] The connecting portion 21G is formed to cover the second opening 42 in a plan view. The connecting portion 21G has a second contact 21E embedded in the second opening 42. Therefore, the shape of the second contact 21E in a plan view is the same as the shape of the second opening 42 in a plan view.

[0077] The first contact 21D is in contact with the outer periphery 34C of the well region 34A. As a result, the outer electrode portion 21B is electrically connected to the well region 34A. In this embodiment, the first contact 21D is in contact with the outer periphery end of the well region 34A. That is, the outer electrode portion 21B is electrically connected to the well region 34A at the outer periphery end of the well region 34A. In a plan view, the first contact 21D is formed in an annular shape at the outer periphery end 21C of the outer electrode portion 21B. Therefore, the first contact 21D has a portion that is positioned on the opposite side of the cell electrode portion 21A from the gate electrode 22.

[0078] The second contact 21E is in contact with the inner circumference 34B of the well region 34A. This electrically connects the connection portion 21G to the well region 34A. In a plan view, the second contact 21E is formed in an annular shape at the inner end of the connection portion 21G. Here, the inner end of the connection portion 21G is the portion of the annular connection portion 21G that is closer to the cell electrode portion 21A in the width direction. Therefore, it can also be said that the second contact 21E has a portion positioned closer to the cell electrode portion 21A relative to the gate electrode 22. In this embodiment, the second contact 21E is in contact with the inner circumference end of the well region 34A. That is, the connection portion 21G is electrically connected to the well region 34A at its inner circumference end.

[0079] The gate finger 23 is embedded in an insulating film that includes an insulating film 38 and an intermediate insulating film 39. In this embodiment, the gate finger 23 is formed on the surface 38s of the insulating film 38 and is covered by the intermediate insulating film 39.

[0080] As shown in Figures 2 and 6, the gate fingers 23A and 23B (not shown in Figure 6) are positioned to overlap with the connection portion 21G in a plan view. The gate fingers 23A and 23B are positioned to overlap with the well region 34A in a plan view. It can also be said that the gate fingers 23A and 23B are positioned between the first contact 21D and the second contact 21E in a plan view. In this embodiment, in the width direction of the well region 34A, the gate fingers 23A and 23B are positioned near the center of the first well region 34AA. In one example, as shown in Figure 6, one of the multiple gate fingers 23A is positioned to overlap with the outer circumference 34C of the first well region 34AA in a plan view, and another is positioned to overlap with the inner circumference 34B of the first well region 34AA in a plan view. The remaining gate finger 23A is positioned in a plan view to coincide with the boundary between the inner circumference 34B and the outer circumference 34C of the first well region 34AA. The position of the gate fingers 23B relative to the first well region 34AA is the same as that of the gate fingers 23A.

[0081] As shown in Figure 5, the gate finger 23C is positioned in a plan view to overlap with the outer peripheral end (the end closer to the FLR portion 24) of the gate electrode 22 in the y-direction. In other words, the gate finger 23C is positioned between the first contact 21D and the second contact 21E, closer to the first contact 21D. It can also be said that the gate finger 23C is positioned in a plan view to overlap with the outer peripheral portion 34C of the second well region 34AB. In this embodiment, the gate finger 23C extends along the x-direction.

[0082] The intermediate insulating film 39 corresponding to the gate finger 23C has an opening 39a that exposes the gate finger 23A. In other words, the opening 39a is not formed in the intermediate insulating film 39 corresponding to the gate fingers 23A and 23B. The gate electrode 22 has an embedded electrode portion 22c embedded in the opening 39a. The embedded electrode portion 22c is in contact with the gate finger 23C. As a result, the gate electrode 22 and the gate finger 23 are electrically connected.

[0083] (Method of manufacturing semiconductor device 10) Next, an outline of the manufacturing method of the semiconductor device 10 of this embodiment will be described. The method for manufacturing the semiconductor device 10 is n - The process includes the steps of preparing a semiconductor substrate 30 having a p-type drift layer 33, forming a p-type well region 34A and a plurality of guard rings 24a on the semiconductor substrate 30, forming a plurality of trenches 35, forming an insulating film 38, and embedding polysilicon as an electrode material in each trench to form an emitter trench 21TE and a gate trench 22A. These steps are carried out by known methods.

[0084] The manufacturing method for the semiconductor device 10 includes a step of forming a gate finger 23. The gate finger 23 is formed by forming a metal wiring made of a material including, for example, tungsten (W) on the surface 38s of the insulating film 38.

[0085] The method for manufacturing the semiconductor device 10 includes the steps of forming an intermediate insulating film 39, forming openings 41 and 42 in both the intermediate insulating film 39 and the insulating film 38, and forming an opening 39a in the intermediate insulating film 39. First, the intermediate insulating film 39 is formed on the surface 38s of the exposed insulating film 38. In this case, the intermediate insulating film 39 is formed to cover the gate finger 23. Next, openings 39a, a first opening 41, and a second opening 42 are formed in both the intermediate insulating film 39 and the insulating film 38. Subsequently, an opening 39a is formed in the region of the intermediate insulating film 39 where the gate electrode 22 is formed. As a result, the gate finger 23C is exposed through the opening 39a.

[0086] The manufacturing method for the semiconductor device 10 includes a step of forming an emitter electrode 21, a gate electrode 22, a plurality of field plates 24b of the FLR portion 24, and an equipotential ring 25. This step is carried out by a known method. In this case, a first contact 21D, a second contact 21E, and an embedded electrode portion 22c are formed.

[0087] The manufacturing method for the semiconductor device 10 includes the steps of forming a buffer layer 32, a collector layer 31, and a collector electrode 27. Specifically, the buffer layer 32 and the collector layer 31 are sequentially formed by selective ion implantation and diffusion of n-type and p-type dopants into the back surface 30r of the semiconductor substrate 30. Subsequently, the collector electrode 27 is formed on the surface of the collector layer 31 opposite to the buffer layer 32. The semiconductor device 10 is manufactured through these steps.

[0088] (Operation of the first embodiment) The operation of the semiconductor device 10 of this embodiment will now be described. Figure 7 is a plan view of the comparative example semiconductor device 10X, Figure 8 is a cross-sectional view of the comparative example semiconductor device 10X of Figure 7, taken along line 8-8, and Figure 9 is a cross-sectional view of the comparative example semiconductor device 10X of Figure 7, taken along line 9-9.

[0089] As shown in Figures 7 to 9, the emitter electrode 21X of the comparative example semiconductor device 10X has an emitter routing section 21Y. The emitter routing section 21Y is an annular wiring that extends from the end of the emitter electrode 21X closer to the device side surface 10d in the y-direction, surrounding the emitter electrode 21X. The emitter routing section 21Y is integrated with the emitter electrode 21X. The emitter routing section 21Y is positioned outward from the gate electrode 22 and the gate finger 23X. In other words, both the gate electrode 22 and the gate finger 23X are positioned between the emitter electrode 21X and the emitter routing section 21Y.

[0090] As shown in Figure 9, the gate finger 23X has internal wiring 23XA embedded in the intermediate insulating film 39, external wiring 23XB formed on the intermediate insulating film 39, and connecting wiring 23XC connecting the internal wiring 23XA and the external wiring 23XB. Therefore, in a plan view, the external wiring 23XB cannot be positioned to overlap with the emitter electrode 21X, and is therefore positioned outward from the emitter electrode 21X. The external wiring 23XB of the gate finger 23X is integrated with the gate electrode 22. On the other hand, as shown in Figure 8, the internal wiring 23XA and the connecting wiring 23XC are provided within the intermediate insulating film 39, and therefore extend into the intermediate insulating film 39 at a position overlapping with the gate electrode 22.

[0091] As shown in Figure 9, since the external wiring 23XB of the gate finger 23X is located between the emitter routing section 21Y and the emitter electrode 21X, the emitter electrode 21X requires space to accommodate the external wiring 23XB. In other words, the emitter electrode 21X is formed to avoid the external wiring 23XB. Therefore, the emitter electrode 21X cannot be made larger by the amount of the external wiring 23XB of the gate finger 23X.

[0092] In this embodiment, as shown in Figures 5 and 6, the first contact 21D provided on the outer peripheral electrode portion 21B of the emitter electrode 21 is in contact with the outer peripheral portion 34C of the well region 34A. In other words, the first contact 21D corresponds to the emitter routing portion 21Y. The gate finger 23 is embedded by the intermediate insulating film 39 and the insulating film 38, and the connection portion 21G is formed so as to cover the gate finger 23. In other words, in a plan view, the emitter electrode 21 is formed in a position that overlaps with the gate finger 23. As a result, the emitter electrode 21 does not need to be formed to avoid the gate finger 23, and the size of the emitter electrode 21 can be made larger than that of the emitter electrode 21X.

[0093] (Effects of the first embodiment) The semiconductor device 10 of this embodiment provides the following advantages. (1-1) The semiconductor device 10 includes a cell region 11, a gate electrode 22 located in a region different from the cell region 11, an outer peripheral region 12 surrounding the cell region 11 and the region where the gate electrode 22 is located, an emitter electrode 21 having an outer peripheral electrode portion 21B formed in the outer peripheral region 12 at a distance from the cell electrode portion 21A, and a connecting portion 21G connecting the cell electrode portion 21A and the outer peripheral electrode portion 21B. The outer peripheral region 12 includes a well region 34A provided so as to surround the cell region 11, an insulating film 38 and an intermediate insulating film 39 covering the well region 34A, and a gate finger 23 embedded in the insulating film consisting of the insulating film 38 and the intermediate insulating film 39, connected to the gate electrode 22 and surrounding the cell region 11. The outer peripheral electrode portion 21B of the emitter electrode 21 is electrically connected to the well region 34A via a first opening 41 formed on the side of the intermediate insulating film 39 and the insulating film 38 opposite to the gate finger 23 from the cell electrode portion 21A.

[0094] With this configuration, since the connection portion 21G is formed to cover the gate finger 23, the size of the emitter electrode 21 can be increased. In other words, the area of ​​the emitter electrode 21 can be increased in a plan view. Therefore, the heat dissipation performance from the emitter electrode 21 can be improved.

[0095] (1-2) The well region 34A is formed in an annular shape with width and has an outer peripheral portion 34C which is a portion that is further away from the cell electrode portion 21A than the center in the width direction of the well region 34A. The outer peripheral electrode portion 21B has a first contact 21D that is in contact with the well region 34A. In a plan view, the first contact 21D is in contact with the outer peripheral portion 34C of the well region 34A.

[0096] In this configuration, the current flowing from the collector electrode 27 to the emitter electrode 21 flows to the cell electrode portion 21A via the outer periphery 34C and the first contact 21D of the well region 34A. As a result, the amount of current flowing from the collector electrode 27 to the emitter electrode 21 that flows to the cell electrode portion 21A via the outer periphery 34C and inner periphery 34B of the well region 34A is reduced. In other words, the path through which the current flowing from the collector electrode 27 to the emitter electrode 21 flows through the well region 34A is shortened. This reduces the heat generated by the current flowing through the well region 34A.

[0097] (1-3) The first contact 21D has a portion that is positioned on the opposite side of the cell electrode portion 21A from the gate electrode 22. With this configuration, since the outer peripheral electrode portion 21B has a portion that is positioned on the opposite side from the cell electrode portion 21A relative to the gate electrode 22, the area of ​​the emitter electrode 21 in a plan view can be made larger.

[0098] (1-4) In a plan view, a second opening 42 is formed in the insulating film 38 and the intermediate insulating film 39 at a position closer to the cell electrode portion 21A with respect to the gate finger 23. The outer peripheral electrode portion 21B has a second contact 21E that contacts the well region 34A through the second opening 42.

[0099] With this configuration, the current path from the collector electrode 27 to the emitter electrode 21 is increased by the first contact 21D and the second contact 21E, thereby increasing the amount of current flowing from the collector electrode 27 to the emitter electrode 21.

[0100] (1-5) The gate finger 23 is formed by metal wiring. With this configuration, the resistance of the gate finger 23 is reduced compared to the case where the gate finger 23 is formed of, for example, polysilicon. Therefore, current can be supplied quickly by the cell 11A through the gate finger 23.

[0101] (1-6) The gate finger 23 is positioned spaced apart from both the back surface 38r of the insulating film 38 and the front surface 39s of the intermediate insulating film 39. This configuration makes it possible to suppress the gate finger 23 from electrically connecting with either the semiconductor substrate 30 or the emitter electrode 21.

[0102] (1-7) The gate finger 23 is formed on the surface 38s of the insulating film 38 and is covered by the intermediate insulating film 39. With this configuration, the gate finger 23 is embedded within the insulating film consisting of the insulating film 38 and the intermediate insulating film 39, eliminating the need to form an opening in the intermediate insulating film 39. This simplifies the process of embedding the gate finger 23 within the insulating film consisting of the insulating film 38 and the intermediate insulating film 39.

[0103] [Second Embodiment] The semiconductor device 10 of the second embodiment will be described with reference to Figures 10 to 13. The semiconductor device 10 of this embodiment differs from the semiconductor device 10 of the first embodiment in the configuration of the emitter electrode 21. In the following description, the configuration that differs from the semiconductor device 10 of the first embodiment will be described in detail, and components common to the semiconductor device 10 of the first embodiment will be given the same reference numerals and their descriptions will be omitted.

[0104] As shown in Figure 10, the emitter electrode 21 has a recess 21b instead of an opening 21a. The recess 21b is located at the end of the emitter electrode 21 closer to the device side surface 10c and in the center in the x direction. The recess 21b opens toward the device side surface 10c. The gate electrode 22 is positioned in the recess 21b. Thus, in this embodiment, a portion of the emitter electrode 21 is not positioned between the gate electrode 22 and the FLR portion 24 in the y direction.

[0105] As shown in Figure 11, the gate electrode 22 is positioned so as to overlap with the end of the emitter electrode 21 in the y-direction that is closer to the device side surface 10c. More specifically, the end of the gate electrode 22 in the y-direction that is closer to the device side surface 10c and the end of the emitter electrode 21 in the y-direction that is closer to the device side surface 10c are aligned in the y-direction and spaced apart in the x-direction. Therefore, it can also be said that the gate electrode 22 is positioned so as to overlap with the outer peripheral end 21C of the outer peripheral electrode portion 21B of the emitter electrode 21.

[0106] As shown in Figures 11 and 12, the first contact 21D of the outer peripheral electrode portion 21B is not formed in the portion where the gate electrode 22 is located. Both ends 21DE of the first contact 21D in the direction in which the first contact 21D extends are located adjacent to the gate electrode 22 in the x-direction. Therefore, the first contact 21D can be said to be an open annular shape formed along the outer peripheral end 21C of the outer peripheral electrode portion 21B, except for the portion where the gate electrode 22 is located.

[0107] Thus, the contact portion 21DA of the first contact 21D, which is located closer to the side surface 10c of the device and extends in the x-direction, is located closer to the cell electrode portion 21A in the y-direction compared to the first contact 21D in the first embodiment. Therefore, as shown in Figure 13, the distance between the first contact 21D and the second contact 21E is smaller than the distance between the first contact 21D and the second contact 21E in the first embodiment. Consequently, as shown in Figures 12 and 13, both the width of the first well region 34AA and the width of the second well region 34AB of the well region 34A are reduced.

[0108] (Operation of the second embodiment) In the comparative example semiconductor device 10 shown in Figures 7 to 9, the emitter routing portion 21Y is located between the gate electrode 22 and the FLR portion 24, making it difficult to reduce the chip size of the comparative example semiconductor device 10X.

[0109] In addition, as shown in Figures 8 and 9, the emitter routing section 21Y is in contact with the well region 34A, so the width of the well region 34A increases by the amount of the emitter routing section 21Y formed. As a result, when current flows from the collector electrode 27 to the second contact 21E of the emitter electrode 21X through the well region 34A, the length of the path through which the current flows in the well region 34A increases. Since the well region 34A has a higher resistance than the emitter electrode 21X, it is prone to generating heat due to the current flowing through the well region 34A.

[0110] In this embodiment, as shown in Figure 11, the end of the emitter electrode 21 closer to the device side surface 10c in the y-direction and the end of the gate electrode 22 closer to the device side surface 10c in the y-direction are aligned with each other. In other words, a portion of the emitter electrode 21 is not formed between the gate electrode 22 and the FLR portion 24 in the y-direction. For this reason, the semiconductor device 10 can have a smaller chip size than the semiconductor device 10X of the comparative example.

[0111] Furthermore, in this embodiment, as shown in Figures 12 and 13, the width of the well region 34A decreases as the distance between the first contact 21D and the second contact 21E in the y-direction decreases. Therefore, when current flows from the collector electrode 27 (see Figure 2) to the second contact 21E of the emitter electrode 21 via the well region 34A, the length of the path through which the current flows in the well region 34A is shortened. Consequently, the amount of heat generated by the current flowing in the well region 34A can be reduced.

[0112] (Effects of the second embodiment) According to the semiconductor device 10 of this embodiment, in addition to the effects of (1-1), (1-2), (1-4) to (1-7) of the first embodiment, the following effects can be obtained.

[0113] (2-1) The gate electrode 22 is positioned to overlap with the outer peripheral end 21C of the outer peripheral electrode portion 21B of the emitter electrode 21. The first contact 21D is an open annular shape formed along the outer peripheral end 21C of the outer peripheral electrode portion 21B, except for the portion where the gate electrode 22 is located.

[0114] With this configuration, since the outer peripheral electrode portion 21B is not located outside the gate electrode 22, that is, since the first contact 21D is not positioned outside the gate electrode 22, the area of ​​the outer peripheral region 12 in plan view can be reduced. Therefore, the semiconductor device 10 can be miniaturized.

[0115] [Example of changes] The embodiments described above are illustrative of possible forms of the semiconductor device according to this disclosure and are not intended to limit its form. The semiconductor device according to this disclosure may take forms different from those illustrated in the embodiments described above. One example is a form in which some of the configurations of the embodiments described above are replaced, modified, or omitted, or a form in which new configurations are added to the embodiments described above. Furthermore, the following modifications can be combined with each other as long as they do not contradict each other technically. In the following modifications, parts common to the embodiments described above are denoted by the same reference numerals as in the embodiments described above, and their descriptions are omitted.

[0116] In the first embodiment, the shapes of the first contact 21D and the second contact 21E can be arbitrarily changed. For example, the first contact 21D may be formed as an open annular shape with a portion cut out. The second contact 21E may also be formed as an open annular shape with a portion cut out.

[0117] In each embodiment, the shape of the outer peripheral electrode portion 21B of the emitter electrode 21 can be arbitrarily changed. In one example, the outer peripheral electrode portion 21B may be formed as an open annular shape with a part of it cut out around the cell electrode portion 21A.

[0118] In each embodiment, the shape of the connection portion 21G of the emitter electrode 21 can be arbitrarily changed. In one example, the connection portion 21G may be formed as an open annular shape with a portion of the cell electrode portion 21A cut out.

[0119] In each embodiment, the position of the gate finger 23C relative to the gate electrode 22 can be arbitrarily changed in a plan view. In one example, in a plan view, the gate finger 23C may be located at the center of the gate electrode 22 in the y-direction.

[0120] In each embodiment, the shape of the gate finger 23C in plan view can be arbitrarily changed. In one example, as shown in Figure 14, the gate finger 23C may be formed to avoid the region RB of the gate electrode 22 to which a conductive member such as a wire is joined.

[0121] In each embodiment, another insulating film may be formed on the surface 39s of the intermediate insulating film 39. In this case, the surface of the other insulating film corresponds to the "surface of the insulating film". An example of the other insulating film is a barrier layer formed of a material containing silicon nitride. The barrier layer suppresses the penetration of external ions into the intermediate insulating film 39 and insulating film 38, and suppresses the charging of the intermediate insulating film 39 and insulating film 38 by external ions. In this case, the emitter electrode 21, the gate electrode 22, and a plurality of field plates 24b of the FLR portion 24 are formed on the surface of the barrier layer.

[0122] In each embodiment, the first contact 21D may be provided separately from the outer electrode portion 21B. The second contact 21E may also be provided separately from the connecting portion 21G. In this case, the first contact 21D and the second contact 21E may be formed from a material containing, for example, tungsten (W).

[0123] In each embodiment, the number of first contacts 21D and second contacts 21E can be arbitrarily changed. In one example, multiple first contacts 21D may be provided. In this case, the first contacts 21D may be spaced apart from each other in the width direction of the outer peripheral electrode portion 21B.

[0124] In each embodiment, the second contact 21E may be omitted from the connection portion 21G. In each embodiment, the position of the gate electrode 22 relative to the emitter electrode 21 can be arbitrarily changed. In one example, the gate electrode 22 may be located at one of the four corners of the emitter electrode 21.

[0125] In each embodiment, the number of gate fingers 23 can be arbitrarily changed. There may be one gate finger 23, two gate fingers 23, or four or more gate fingers 23. In each embodiment, the configuration in which the gate finger 23 is embedded in the insulating film 38 and the intermediate insulating film 39 can be arbitrarily changed. In one example, the gate finger 23 may be embedded in the intermediate insulating film 39. That is, the gate finger 23 may be positioned spaced apart from the surface 38s of the insulating film 38.

[0126] In each embodiment, the shape of the gate finger 23 in plan view can be arbitrarily changed. In one example, in plan view, the gate finger 23 may be formed in an annular shape surrounding the cell region 11.

[0127] In each embodiment, at least one of the FLR section 24 and the equipotential ring 25 may be omitted. In each embodiment, the emitter trenches 21TE and gate trenches 22A are arranged alternately, but the arrangement of the emitter trenches 21TE and gate trenches 22A can be arbitrarily changed.

[0128] In each embodiment, the semiconductor device 10 may be a planar gate type IGBT instead of a trench gate type IGBT. In each embodiment, the semiconductor device 10 is embodied as an IGBT, but it is not limited to this, and the semiconductor device 10 may be a trench-type SiCMOSFET (metal-oxide-semiconductor field-effect transistor) or a SiMOSFET. In this case, the source electrode of the MOSFET corresponds to the "drive electrode".

[0129] As used in this disclosure, the term “on / above” includes the meanings of “on / above” and “above / beyond” unless the context clearly indicates otherwise. Therefore, the expression “A is formed on B” is intended to mean that in this embodiment, A may be in contact with B and directly positioned on B, but as a modified example, A may be positioned above B without contacting B. In other words, the term “on / above” does not preclude structures in which other members are formed between A and B.

[0130] The z-direction used in this disclosure does not necessarily have to be vertical, nor does it have to coincide perfectly with the vertical. Therefore, the various structures described herein are not limited to the z-direction "up" and "down" being the same as the z-direction "up" and "down" being the same as the vertical. For example, the x-direction may be vertical, or the y-direction may be vertical.

[0131] [Note] The technical concepts that can be understood from each of the above embodiments and their respective modifications are described below. The reference numerals for the components of the embodiments corresponding to the components described in each appendix are shown in parentheses. These reference numerals are provided as examples to aid understanding, and the components described in each appendix should not be limited to those indicated by these reference numerals.

[0132] (Note A1) A cell region (11) in which cell (11A) is provided, The outer peripheral region (12) surrounding the cell region (11), The gate electrode (22) is located in the outer peripheral region (12), The drive electrode (21) comprises an electrode portion (21A) provided in the cell region (11), an outer peripheral electrode portion (21B) formed in the outer peripheral region (12) at a distance from the electrode portion (21A), and a connecting portion (21G) connecting the electrode portion (21A) and the outer peripheral electrode portion (21B), The outer peripheral region (12) includes, A well region (34A), which is a semiconductor region, is provided so as to surround the cell region (11), An insulating film (38, 39) is provided to cover the well region (34A) and surround the cell region (11) in a plan view, A gate finger (23) is provided, which is embedded in the insulating film (38, 39), connected to the gate electrode (22), and formed to surround the cell region (11). The connecting portion (21G) is formed on the insulating film (38,39) and straddles the gate finger (23). The outer peripheral electrode portion (21B) is electrically connected to the well region (34A). Semiconductor device (10).

[0133] (Appendix A2) The well region (34A) is formed in an annular shape with width, and has an outer peripheral portion (34C) which is a portion that is further away from the electrode portion (21A) than the center in the width direction of the well region (34A). Viewed from the thickness direction (z direction) of the insulating film (38,39), the contact (21D) is in contact with the outer peripheral portion (34C) of the well region (34A). The semiconductor device described in Appendix A1.

[0134] (Note A3) The contact (21D) has a portion that is positioned on the opposite side of the electrode portion (21A) from the gate electrode (22). Semiconductor equipment as described in Appendix A1 or A2.

[0135] (Note A4) The contact (21D) is formed in an annular shape at the outer peripheral end (21C) of the outer peripheral electrode portion (21B) when viewed from the thickness direction (z direction) of the insulating film (38,39). Semiconductor equipment as described in Appendix A3.

[0136] (Note A5) The gate electrode (22) is positioned to overlap with the outer peripheral end (21C) of the outer peripheral electrode portion (21B). The contact (21D) is an open annular shape formed along the outer peripheral end (21C) of the outer peripheral electrode portion (21B), except for the portion where the gate electrode (22) is located. Semiconductor equipment as described in Appendix A1 or A2.

[0137] (Note A6) The aforementioned opening is the first opening (41), Viewed from the thickness direction (z direction) of the insulating film (38,39), a second opening (42) is formed in the insulating film (38,39) at a position closer to the electrode portion (21A) relative to the gate finger (23). The aforementioned contact is the first contact (21D), The connecting portion (21G) has a second contact (21E) that contacts the well region (34A) through the second opening (42). A semiconductor device as described in any one of the appendices A1 to A5.

[0138] (Note A7) The gate finger (23) is formed by metal wiring. A semiconductor device as described in any one of the appendices A1 to A6.

[0139] (Note A8) The gate finger (23) is formed of a material containing tungsten. The semiconductor device described in Appendix A7.

[0140] (Note A9) Multiple gate fingers (23) are provided within the insulating film (38, 39), and are spaced apart from each other in a direction perpendicular to the thickness direction (z direction) of the insulating film (38, 39). A semiconductor device as described in any one of the appendices A1 to A8.

[0141] (Note A10) The insulating film (38,39) has a surface (39s) and a back surface (38r) that face opposite each other in the thickness direction (z direction) of the insulating film (38,39), The gate finger (23) is positioned spaced apart from both the surface (39s) and the back surface (38r) of the insulating film (38,39) in the thickness direction (z direction). A semiconductor device as described in any one of the appendices A1 to A9.

[0142] (Note A11) The insulating film (38,39) is The first insulating film (38) covers the well region (34A) and includes the back surface (38r), A second insulating film (39) is laminated on the first insulating film (38) and includes the surface (39s), It has, The gate finger (23) is formed on the first insulating film (38) and covered by the second insulating film (39). The semiconductor device described in Appendix A10.

[0143] (Note A12) Viewed from the thickness direction (z direction) of the insulating film (38,39), the gate finger (23) is positioned to overlap with the outer peripheral electrode portion (21B). Semiconductor equipment as described in Appendix A10 or A11.

[0144] (Note A13) The semiconductor device (10) is an IGBT, The drive electrode (21) is an emitter electrode. A semiconductor device as described in any one of the appendices A1 to A12.

[0145] (Note A14) The semiconductor device (10) is a trench gate type MOSFET, The drive electrode (21) is a source electrode. A semiconductor device as described in any one of the appendices A1 to A12.

[0146] (Note B1) A cell region (11) in which cell (11A) is provided, The outer peripheral region (12) surrounding the cell region (11), The gate electrode (22) is located in the outer peripheral region (12), The drive electrode (21) comprises an electrode portion (21A) provided in the cell region (11) and an outer peripheral electrode portion (21B) formed in the outer peripheral region (12) at a distance from the electrode portion (21A), The outer peripheral region (12) includes, In plan view, insulating films (38, 39) are provided so as to surround the cell region (11), A gate finger (23) is provided, which is embedded in the insulating film (38, 39), connected to the gate electrode (22), and formed to surround the cell region (11). The insulating film (38,39) has a surface (39s) and a back surface (38r) that face opposite each other in the thickness direction (z direction) of the insulating film (38,39), The gate finger (23) is positioned spaced apart from both the surface (39s) and the back surface (38r) of the insulating film (38,39) in the thickness direction (z direction). Semiconductor device (10).

[0147] (Note B2) The outer peripheral region (12) is provided with a well region (34A), which is a semiconductor region that surrounds the cell region (11). The well region (34A) is formed in an annular shape with width, and has an outer peripheral portion (34C) which is a portion that is further away from the electrode portion (21A) than the center in the width direction of the well region (34A). Viewed from the thickness direction (z direction) of the insulating film (38,39), the contact (21D) is in contact with the outer peripheral portion (34C) of the well region (34A). The semiconductor device described in Appendix B1.

[0148] (Note B3) The contact (21D) has a portion that is positioned on the opposite side of the electrode portion (21A) from the gate electrode (22). Semiconductor device as described in Appendix B2.

[0149] (Note B4) The contact (21D) is formed in an annular shape at the outer peripheral end (21C) of the outer peripheral electrode portion (21B) when viewed from the thickness direction (z direction) of the insulating film (38,39). Semiconductor equipment as described in Appendix B3.

[0150] (Note B5) The gate electrode (22) is positioned to overlap with the outer peripheral end (21C) of the outer peripheral electrode portion (21B). The contact (21D) is an open annular shape formed along the outer peripheral end (21C) of the outer peripheral electrode portion (21B), except for the portion where the gate electrode (22) is located. Semiconductor device as described in Appendix B2.

[0151] (Note B6) The drive electrode further has a connecting portion (21G) that connects the electrode portion (21A) and the outer peripheral electrode portion (21B), The aforementioned contact is the first contact (21D), The connecting portion (21G) has a second contact (21E) that contacts the well region (34A) at a position closer to the electrode portion (21A) relative to the gate finger (23). A semiconductor device as described in any one of the appendices B2 to B5.

[0152] (Note B7) The gate finger (23) is formed by metal wiring. A semiconductor device as described in any one of the appendices B1 to B6.

[0153] (Note B8) The gate finger (23) is formed of a material containing tungsten. Semiconductor device as described in Appendix B7.

[0154] (Note B9) Multiple gate fingers (23) are provided within the insulating film (38, 39), and are spaced apart from each other in a direction perpendicular to the thickness direction (z direction) of the insulating film (38, 39). A semiconductor device as described in any one of the appendices B1 to B8.

[0155] (Note B10) The outer peripheral region (12) is provided with a well region (34A), which is a semiconductor region that surrounds the cell region (11). The insulating film (38,39) is The first insulating film (38) covers the well region (34A) and includes the back surface (38r), A second insulating film (39) is laminated on the first insulating film (38) and includes the surface (39s), It has, The gate finger (23) is formed on the first insulating film (38) and covered by the second insulating film (39). A semiconductor device as described in any one of the appendices B1 to B9.

[0156] (Note B11) Viewed from the thickness direction (z direction) of the insulating film (38,39), the gate finger (23) is positioned to overlap with the outer peripheral electrode portion (21B). A semiconductor device as described in any one of the appendices B1 to B10.

[0157] (Note B12) The semiconductor device (10) is an IGBT, The drive electrode (21) is an emitter electrode. A semiconductor device as described in any one of the appendices B1 to B11.

[0158] (Note B13) The semiconductor device (10) is a trench gate type MOSFET, The drive electrode (21) is a source electrode. A semiconductor device as described in any one of the appendices B1 to B11.

[0159] (Note B14) At least a portion (23C) of the gate finger (23) is formed in a position overlapping with the gate electrode (22) and is in contact with the lower surface of the gate electrode (22). A semiconductor device as described in any one of the appendices B1 to B13.

[0160] (Note B15) The gate electrode (22) is formed of a material containing AlCu. A semiconductor device as described in any one of the appendices B1 to B14. [Explanation of Symbols]

[0161] 10...Semiconductor device, 11...Cell region, 11A...Cell, 12...Peripheral region, 21...Emitter electrode (driving electrode), 21A...Cell electrode portion (electrode portion), 21B...Peripheral electrode portion, 21C...Peripheral end, 21D...First contact (contact), 21E...Second contact, 21G...Connection portion, 22...Gate electrode, 23...Gate finger, 34A...Well region, 34C...Peripheral region, 38...Insulating film (first insulating film), 38r...Back surface (back surface of insulating film), 39...Intermediate insulating film (second insulating film), 39s...Front surface (front surface of insulating film), 41...First opening, 42...Second opening.

Claims

1. A cell area in which a cell is provided, The outer region surrounding the aforementioned cell region, A gate electrode arranged in the outer peripheral region, The device comprises a drive electrode having an electrode portion provided in the cell region and an outer peripheral electrode portion formed in the outer peripheral region at a distance from the electrode portion, In the aforementioned outer peripheral region, An insulating film is provided so as to surround the cell region in a plan view, A gate finger is provided, which is embedded in the insulating film, connected to the gate electrode, and formed to surround the cell region. The insulating film has a front surface and a back surface that face opposite each other in the thickness direction of the insulating film, The gate finger is positioned spaced apart from both the front and back surfaces in the thickness direction of the insulating film. Semiconductor equipment.

2. The outer peripheral region is provided with a well region, which is a semiconductor region that surrounds the cell region. The well region is formed in an annular shape with width, and has an outer peripheral portion which is a portion that is further away from the electrode portion than the center in the width direction of the well region. The outer peripheral electrode portion has a contact that is in contact with the well region. Viewed from the thickness direction of the insulating film, the contact is in contact with the outer periphery of the well region. The semiconductor device according to claim 1.

3. The contact has a portion that is positioned on the opposite side of the electrode portion from the gate electrode. The semiconductor device according to claim 2.

4. The contact is formed in an annular shape at the outer peripheral end of the outer peripheral electrode portion when viewed from the thickness direction of the insulating film. The semiconductor device according to claim 3.

5. The gate electrode is positioned to overlap with the outer peripheral end of the outer peripheral electrode portion. The contact is an open annular shape formed along the outer peripheral end of the outer peripheral electrode portion, except for the portion where the gate electrode is located. The semiconductor device according to claim 2.

6. The drive electrode further has a connecting portion that connects the electrode portion and the outer peripheral electrode portion. The aforementioned contact is the first contact, The connecting portion has a second contact that contacts the well region at a position closer to the electrode portion than the gate finger. The semiconductor device according to any one of claims 2 to 5.

7. The gate finger is formed by metal wiring. A semiconductor device according to any one of claims 1 to 6.

8. The gate finger is formed from a material containing tungsten. The semiconductor device according to claim 7.

9. The gate fingers are provided in multiple locations within the insulating film and are spaced apart from each other in a direction perpendicular to the thickness direction of the insulating film. A semiconductor device according to any one of claims 1 to 8.

10. The outer peripheral region is provided with a well region, which is a semiconductor region that surrounds the cell region. The insulating film is The first insulating film covers the well region and includes the back surface, A second insulating film is laminated on the first insulating film and includes the surface, It has, The gate finger is formed on the first insulating film and covered by the second insulating film. A semiconductor device according to any one of claims 1 to 9.

11. Viewed from the thickness direction of the insulating film, the gate finger is positioned to overlap with the outer peripheral electrode portion. A semiconductor device according to any one of claims 1 to 10.

12. The aforementioned semiconductor device is an IGBT, The aforementioned drive electrode is an emitter electrode. A semiconductor device according to any one of claims 1 to 11.

13. The semiconductor device is a trench gate type MOSFET, The drive electrode is the source electrode. A semiconductor device according to any one of claims 1 to 11.

14. At least a portion of the gate finger is formed in a position overlapping with the gate electrode and is in contact with the lower surface of the gate electrode. A semiconductor device according to any one of claims 1 to 13.

15. The gate electrode is formed of a material containing AlCu. A semiconductor device according to any one of claims 1 to 14.

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