Apparatus and method for detecting waist depth of through-vias in TGV glass substrates

Abstract

This invention provides a device for detecting the waist depth of through-vias in TGV glass substrates. [Solution] The system comprises a first depth-of-field camera, a first sighting light source, and a microcontroller unit. The first depth-of-field camera and the first sighting light source are installed above and below a glass substrate having at least one glass substrate through-via, respectively, and facing the upper and lower surfaces of the glass substrate at an oblique angle, respectively, or they are installed below and above the glass substrate, respectively, and facing the lower and upper surfaces of the glass substrate at an oblique angle, respectively. The microcontroller unit is electrically connected to the first depth-of-field camera and the first sighting light source. The first sighting light source is used to emit a first sighting beam and illuminate the glass substrate at an oblique angle, the first depth-of-field camera is used to acquire a first image, and the microcontroller unit is used to obtain at least one detection result of at least one glass substrate through-via based on the first image.

Description

Technical Field

[0001] The present invention relates to a device and method for detecting the waist depth of through vias in a Through Glass Via (TGV) glass substrate. More specifically, it relates to a device and method for detecting the waist depth of through vias in a TGV glass substrate (Via waist depth detection device and method for through Glass Via (TGV) substrate), which irradiates a glass substrate with an oblique-direction light source and uses a depth-of-field camera to photograph the glass substrate obliquely to obtain the detection result of the through vias in the glass substrate.

Background Art

[0002] Conventional two-dimensional (2D) chip packaging technology can no longer meet the current requirements for chip speed, efficiency, and slimming. Therefore, two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have been proposed. Since 2.5D and 3D chip packaging technologies need to use an interposer with through vias to electrically connect different chips, conventionally, a silicon substrate with through silicon vias (TSV) (note: a silicon substrate with TSV is also referred to as a TSV silicon substrate) has been used as the interposer. However, since silicon is a Group 4A semiconductor material, the surrounding charge carriers can move freely under the action of an electric or magnetic field, which may affect adjacent circuits and signals and have a significant impact on the performance of the chip. In addition, since the glass material has no charge carriers that can move freely, it has good dielectric performance and a thermal expansion coefficient (CTE) close to that of silicon. Therefore, a glass substrate with through glass vias (TGV) (note: a glass substrate with TGV is also referred to as a TGV glass substrate) has been proposed and is replacing the silicon substrate as the interposer.

[0003] The manufacturing method for glass substrates with through-vias involves first modifying the glass substrate by irradiating it with a laser at predetermined locations where through-vias will be formed. Next, through-vias are formed at predetermined locations using immersion etching. Figure 1 is a schematic plan view from above of a glass substrate having through-vias according to one embodiment of the present invention. Figure 2 is a schematic side view of the cross-section shown in Figure 1. The cross-section in Figure 2 is a cross-section along the cross-sectional line AA in Figure 1. The glass substrate 1 has a plurality of through-vias 12 that penetrate the upper surface 10 and the lower surface 12 of the glass substrate 1. Each through-via 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and there is a waist depth between the upper surface 10 and the lower surface 11. Through-vias 122 are formed in the waist depth and have one waist depth D. The waist depth D of the through-via 122 is defined as the height difference from the narrowest position of the through-via 122 to the upper surface 10 of the glass substrate 1. The upper opening 121 and the lower opening 123 have opening diameters Rt and Rb, respectively, and the through-via 122 in the waist depth forms a through-via diameter Rm. [Overview of the project] [Problems that the invention aims to solve]

[0004] The ratio of waist depth D to aperture diameter Rt, or the ratio of thickness T to aperture diameter Rb after subtracting waist depth D, is an important basis for evaluating whether the glass substrate through via 12 of the glass substrate 1 is good. One conventional method involves using X-rays for detection. However, using X-rays for detection can damage the glass substrate 1, potentially causing other defects in the glass substrate 1. Another conventional method involves first filling the glass substrate via 12 with a lossless plasticizer, then removing the lossless plasticizer to enable measurement of the aforementioned information. However, this method requires filling with the lossless plasticizer, which presents problems not only with cost and detection time, but also with the issue of the lossless plasticizer remaining in the glass substrate via 12.

[0005] This invention was made through diligent research by the inventors in view of the above-mentioned problems, and its purpose is to provide a novel waist depth detection device for through-vias in TGV glass substrates. [Means for solving the problem]

[0006] To solve the above problems, a waist depth detection device for through-vias in a TGV glass substrate, according to one aspect of the present invention, comprises a first depth-of-field camera, a first sighting light source, and a microcontroller unit. The first depth-of-field camera and the first sighting light source are installed above and below a glass substrate having at least one through-via, respectively, and are obliquely facing the upper and lower surfaces of the glass substrate, respectively, or are installed below and above the glass substrate, respectively, and are obliquely facing the lower and upper surfaces of the glass substrate, respectively. The microcontroller unit is electrically connected to the first depth-of-field camera and the first sighting light source. The first sighting light source is used to emit a first sighting beam and illuminate the glass substrate obliquely, the first depth-of-field camera is used to acquire a first image, and the microcontroller unit is used to obtain at least one detection result for at least one through-via of the glass substrate based on the first image.

[0007] Furthermore, in order to achieve the above objective, another aspect of the present invention, a method for detecting the waist depth of through-vias in a TGV glass substrate, is performed in a waist depth detection device for through-vias in a TGV glass substrate, and the first depth-of-field camera and the first sighting light source of the TGV glass substrate through-via waist depth detection device are moved and rotated, and the first depth-of-field camera and the first sighting light source are installed above and below the glass substrate having at least one through-via, respectively, and are positioned diagonally opposite to the upper and lower surfaces of the glass substrate, respectively, or the first depth-of-field camera and the first sighting light source are positioned below and above the glass substrate respectively The process includes: installing the device and facing the lower and upper surfaces of the glass substrate at an oblique angle; using a microcontroller unit of the TGV glass substrate through-via waist depth detection device to control a first depth-of-field camera and a first sighting light source, the first sighting light source being used to emit a first sighting beam and irradiate the glass substrate at an oblique angle, and the first depth-of-field camera being used to acquire a first image; and using a microcontroller unit of the TGV glass substrate through-via waist depth detection device to obtain at least one detection result for at least one glass substrate through-via based on the first image.

[0008] In summary, the present invention provides a waist depth detection device and method for through-vias in optical TGV glass substrates that do not require the filling of lossless plastic material. It detects the waist depth of through-vias in TGV glass substrates, reduces detection time and costs, and further prevents breakage of the glass substrate. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view from above of a glass substrate having through-vias according to one embodiment of the present invention. [Figure 2] This is a schematic side view of the cross-section shown in Figure 1. [Figure 3] This is a schematic top view of a glass substrate as detected by a through-via waist depth detection device for TGV glass substrates according to one embodiment of the present invention. [Figure 4]This is a schematic cross-sectional view of a glass substrate as detected by a through-via waist depth detection device for TGV glass substrates according to one embodiment of the present invention. [Figure 5] This is a schematic diagram showing the first and second images according to one embodiment of the present invention. [Figure 6] These are schematic diagrams showing the first and second images relating to another embodiment of the present invention. [Figure 7] This is a schematic side cross-sectional view showing a device for detecting the waist depth of through vias in a TGV glass substrate for glass substrate detection according to another embodiment of the present invention. [Figure 8A] This is a schematic inclined view showing a partial structure of a waist depth detection device for a glass substrate according to another embodiment of the present invention. [Figure 8B] This is a schematic front view showing a partial structure of a waist depth detection device for a glass substrate according to another embodiment of the present invention. [Figure 8C] This is a schematic side view showing a partial structure of a glass substrate waist depth detection device according to another embodiment of the present invention. [Modes for carrying out the invention]

[0010] The embodiments of the waist depth detection device for through vias in a TGV glass substrate according to the present invention will be described below with reference to Figures 3 to 6. However, the present invention is not limited to these embodiments, and the components, materials, etc. described below can be modified in various ways within the scope of the spirit of the present invention.

[0011] Figure 3 is a schematic top view of a glass substrate detected by a through-via waist depth detection device for TGV glass substrates according to one embodiment of the present invention. Figure 4 is a schematic cross-sectional view of a glass substrate detected by a through-via waist depth detection device for TGV glass substrates according to one embodiment of the present invention. The cross-sectional view of glass substrate 1 in Figure 4 shows the cross-section obtained by cutting along the cross-sectional line BB in Figure 3. The waist depth detection device for through vias in a TGV glass substrate comprises at least a first depth-of-field camera 21, a first sighting light source 24, and a microcontroller unit 25.

[0012] The first depth-of-field camera 21 and the first sighting light source 24 are installed above and below the glass substrate 1, respectively, which has at least one glass substrate through via 12, and are positioned obliquely opposite the upper surface 10 and lower surface 11 of the glass substrate 1, respectively, or the first depth-of-field camera 21 and the first sighting light source 24 are installed below and above the glass substrate 1, respectively, and are positioned obliquely opposite the lower surface 11 and upper surface 10 of the glass substrate 1. In this embodiment, the first depth-of-field camera 21 and the first sighting light source 24 are installed above and below the glass substrate 1, respectively, which has at least one glass substrate through via 12. Furthermore, the statement that the first depth-of-field camera 21 and the first sighting light source 24 are obliquely facing the upper surface 10 and lower surface 11 of the glass substrate 1 means that the extending direction of the imaging end of the first depth-of-field camera 21 and the extending direction of the exit end of the first sighting light source 24 each have a first oblique angle between them and the upper surface 10 and lower surface 11 of the glass substrate 1, in the range of 15 to 75 degrees, preferably in the range of 30 to 45 degrees.

[0013] The microcontroller unit 25 is electrically connected to and controls the first depth-of-field camera 21 and the first sighting light source 24. The first sighting light source 24 is used to emit a first sighting beam L1 and illuminate the glass substrate 1 at an oblique angle, the first depth-of-field camera 21 is used to acquire a first image, and the microcontroller unit 25 is used to obtain at least one detection result of at least one glass substrate through-via 12 based on the first image. The detection result includes at least the waist depth D of the glass substrate through via 12, and by obtaining the waist depth D and the upper opening diameter Rt, the depth-to-width ratio of the glass substrate through via 12 can be calculated. The waist depth D of the through via 122 is defined as the height difference from the narrowest point of the through via 122 to the upper surface 10 of the glass substrate 1. Furthermore, the sighting accuracy of the first sighting beam L1 and the maximum discrimination depth of the first depth-of-field camera 21 are related to the depth of the through via 12 in the glass substrate, i.e., the thickness T of the glass substrate 1.

[0014] Furthermore, the waist depth detection device for through vias in the TGV glass substrate may further include a second depth-of-field camera 22 and a second sighting light source 23. When the first depth-of-field camera 21 and the first sighting light source 24 are installed above and below the glass substrate 1, respectively, the second depth-of-field camera 22 and the second sighting light source 23 are installed below and above the glass substrate 1, respectively, and are positioned diagonally opposite to the lower surface 11 and upper surface 10 of the glass substrate 1, respectively. When the first depth-of-field camera 21 and the first sighting light source 24 are installed above and above the glass substrate 1, respectively, the second depth-of-field camera 22 and the second sighting light source 23 are installed above and below the glass substrate 1, respectively, and are positioned diagonally opposite to the upper surface 10 and lower surface 11 of the glass substrate 1, respectively. In this embodiment, the second depth-of-field camera 22 and the second sighting light source 23 are installed below and above the glass substrate 1, respectively. Furthermore, the statement that the second depth-of-field camera 22 and the second sighting light source 23 are obliquely facing the lower surface 11 and upper surface 10 of the glass substrate 1 means that the extending direction of the imaging end of the second depth-of-field camera 22 and the extending direction of the exit end of the second sighting light source 23 have a second oblique angle between them and the upper surface 10 and lower surface 11 of the glass substrate 1, in the range of 15 to 75 degrees, preferably in the range of 30 to 45 degrees. In addition, in the example of Figure 4, the first sighting light source 24 and the first depth-of-field camera 21 are arranged diagonally, and the second sighting light source 23 and the second depth-of-field camera 22 are arranged diagonally. Moreover, the first oblique angle and the second oblique angle may be the same or different, and the present invention is not limited thereto.

[0015] The microcontroller unit 25 is electrically connected to and controls the second depth-of-field camera 22 and the second sighting light source 23. The second sighting light source 23 is used to emit a second sighting beam L2 and illuminate the glass substrate 1 at an oblique angle, and the beam color (wavelength band of light) of the first sighting beam L1 is different from the beam color (wavelength band of light) of the second sighting beam L2. The second depth-of-field camera 22 is used to acquire a second image, and the microcontroller unit 25 obtains at least one detection result of at least one glass substrate through-via 12 based on the first and second images. The colors of the beams of the first alignment beam L1 and the second alignment beam L2 are selected from red, green, and blue, but the present invention is not limited thereto. Further, the alignment accuracy of the second alignment beam L2 and the maximum discrimination depth of the second depth-of-field camera 22 are related to the depth of the through-hole of the glass substrate through-hole 12, that is, the thickness T of the glass substrate 1.

[0016] Furthermore, the waist depth detection device for the through-holes of the TGV glass substrate further includes a frame and a mounting structure. The mounting structure is installed in the frame and is used to mount the glass substrate 1 by contacting a plurality of corners of the glass substrate 1. The first alignment light source 24 and the second depth-of-field camera 22 are movably installed on the frame and adjacent to the inner bottom side of the frame. The second alignment light source 23 and the first depth-of-field camera 21 are movably installed on the frame and adjacent to the inner upper side of the frame. Alternatively, the second alignment light source 23 and the first depth-of-field camera 21 are movably installed on the frame and adjacent to the inner bottom side of the frame, and the first alignment light source 24 and the second depth-of-field camera 22 are movably installed on the frame and adjacent to the inner upper side of the frame. In this embodiment, the first alignment light source 24 and the second depth-of-field camera 22 are movably installed on the frame and adjacent to the inner bottom side of the frame. The second alignment light source 23 and the first depth-of-field camera 21 are movably installed on the frame and adjacent to the inner upper side of the frame.

[0017] Furthermore, the waist depth detection device for the through vias of the TGV glass substrate further includes a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism. The first transmission mechanism, the second transmission mechanism, the third transmission mechanism, and the fourth transmission mechanism are respectively connected to the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23, and cause the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23 to perform two-dimensional movement or three-dimensional movement, and rotate the first depth-of-field camera 21, the first collimation light source 24, the second depth-of-field camera 22, and the second collimation light source 23, and are used to adjust their plurality of oblique direction angles.

[0018] FIG. 5 is a schematic configuration diagram showing a first image and a second image according to an embodiment of the present invention. In an embodiment where only the first depth-of-field camera 21 and the first collimation light source 24 are installed and the second depth-of-field camera 22 and the second collimation light source 23 are not installed, the first image shows at least one upper opening 121, a lower opening 123, a through via 122 of the glass substrate through via 12 of the glass substrate 1, and a partial image of the glass substrate 1 near the upper opening 121, the lower opening 123, and the through via 122. The upper opening 121, the lower opening 123, and the through via 122 form a dogbone shape. The color of the dogbone shape is the color of the beam of the first collimation beam L1, and the color of the outer region of the dogbone shape is different from the color of the beam of the first collimation beam L1. For example, the color of the outer region of the dogbone shape is darker than the color of the beam of the first collimation beam L1.

[0019] In an embodiment in which a first depth-of-field camera 21, a first sighting light source 24, a second depth-of-field camera 22, and a second sighting light source 23 are installed, the first image shows the upper opening 121, lower opening 123, and through via 122 of at least one glass substrate through via 12 of the glass substrate 1, as well as a partial image of the glass substrate 1 near the upper opening 121, lower opening 123, and through via 122, where the upper opening 121, lower opening 123, and through via 122 form a dogbone shape. The color of the dogbone shape is the beam color of the first sighting beam L1, and the color of the outer region of the dogbone shape is a mixture of the beam color of the first sighting beam L1 and the beam color of the second sighting beam L2.

[0020] The second image shows the upper opening 121, lower opening 123, and through via 122 of at least one glass substrate through via 12 of the glass substrate 1, as well as an image of a portion of the glass substrate 1 near the upper opening 121, lower opening 123, and through via 122, where the upper opening 121, lower opening 123, and through via 122 form a dogbone shape. The color of the dogbone shape is the beam color of the second sighting beam L2, and the color of the outer region of the dogbone shape is a mixture of the beam color of the first sighting beam L1 and the beam color of the second sighting beam L2.

[0021] Figure 6 is a schematic diagram showing the first and second images according to another embodiment of the present invention. The present invention obtains the waist depth D of the glass substrate through via 12 by illuminating and photographing in an oblique direction. Therefore, in some situations, two adjacent dogbone shapes may overlap in the same single image (see the left side of Figure 6), and one lower opening 123 of one dogbone shape may overlap one upper opening 121 of the other dogbone shape.

[0022] To enable the user to conveniently observe the first and / or second image, the microcontroller unit 25 further processes the two overlapping dogbone shapes in the first image to separate them, and processes the two overlapping dogbone shapes in the second image to separate them (see the right side of Figure 6). Furthermore, in a situation where a first sighting light source 24 and a second sighting light source 23 are present, the microcontroller unit 25 can distinguish two dogbone shapes of different colors and associate the dogbone shapes of different colors, then uses an algorithm to separate the two overlapping dogbone shapes in the first image, and processes the two overlapping dogbone shapes in the second image.

[0023] Furthermore, based on the above, the present invention further provides a method for detecting through-vias in a glass substrate. The glass substrate through-via detection method is performed in a TGV glass substrate through-via waist depth detection device, and the first depth-of-field camera and first sighting light source of the TGV glass substrate through-via waist depth detection device are moved and rotated, and the first depth-of-field camera and first sighting light source are installed above and below the glass substrate having at least one glass substrate through-via, and are positioned diagonally opposite the upper and lower surfaces of the glass substrate, respectively, or the first depth-of-field camera and first sighting light source are installed below and above the glass substrate, respectively, and are positioned opposite the lower and upper surfaces of the glass substrate. The process includes: a step of facing each surface obliquely; a step of using a microcontroller unit of a TGV glass substrate through-via waist depth detection device to control a first depth-of-field camera and a first sighting light source, the first sighting light source being used to emit a first sighting beam and irradiate the glass substrate obliquely, and the first depth-of-field camera being used to acquire a first image; and a step of using a microcontroller unit of a TGV glass substrate through-via waist depth detection device to obtain at least one detection result for at least one glass substrate through-via based on the first image.

[0024] In conclusion, the present invention provides a waist depth detection device and method for optical TGV glass substrate through-vias that do not require filling with lossless plasticizing material, and detects the waist depth of through-vias in TGV glass substrates. This reduces detection time and costs, and further prevents breakage of the glass substrate.

[0025] The present invention can be implemented in various other forms without departing from its spirit or main features. Therefore, the embodiments described above are merely illustrative in all respects and should not be constrained. The scope of the invention is defined by the claims and is not restricted by the text of the specification. Furthermore, any modifications or changes within the equivalent scope of the claims are all within the scope of the invention. [Explanation of Symbols]

[0026] 1. Glass substrate 10 Top side 11 Bottom side 12 glass substrate through-vias 121 Upper opening 122 Through vias 123 Lower opening 21. First depth-of-field camera 22. Second depth-of-field camera 23 Second collimated light source 24 1st collimated light source 25 Microcontroller Unit Rt Upper opening diameter Rb Lower opening diameter Rm Through via diameter D Waist depth T thickness L1 First sighting beam L2 Second sighting beam AA section line BB cross section line

Claims

1. A first depth-of-field camera (21) and a first sighting light source (24) are installed above and below a glass substrate (1) having at least one glass substrate through via (12), and are positioned obliquely opposite the upper surface (10) and lower surface (11) of the glass substrate (1), respectively, or are installed below and above the glass substrate (1), respectively, and are positioned obliquely opposite the lower surface (11) and upper surface (10) of the glass substrate (1), respectively. The system comprises a microcontroller unit (25) electrically connected to the first depth-of-field camera (21) and the first sighting light source (24), The first sighting light source (24) is used to emit a first sighting beam (L1) and irradiate the glass substrate (1) in an oblique direction. The first depth-of-field camera (21) is used to acquire a first image. The microcontroller unit (25) is used to obtain at least one detection result of at least one glass substrate through-via (12) based on the first image. The detection result is characterized by including the waist depth of the glass substrate through via (12), A device for detecting the waist depth of through-vias in TGV glass substrates.

2. A second depth-of-field camera (22) and a second sighting light source (23), wherein the first depth-of-field camera (21) and the first sighting light source (24) are installed above and below the glass substrate (1), respectively, and the second depth-of-field camera (22) and the second sighting light source (23) are installed below and above the glass substrate (1), respectively, and are positioned diagonally opposite to the lower surface (11) and the upper surface (10) of the glass substrate (1), respectively, or The first depth-of-field camera (21) and the first sighting light source (24) are installed below and above the glass substrate (1), respectively, and the second depth-of-field camera (22) and the second sighting light source (23) are installed above and below the glass substrate (1), respectively, and further comprising a second depth-of-field camera (22) and a second sighting light source (23) that are obliquely facing the upper surface (10) and the lower surface (11) of the glass substrate (1), respectively. The TGV glass substrate through-via waist depth detection device according to claim 1, characterized in that the microcontroller unit (25) is electrically connected to the second depth-of-field camera (22) and the second sighting light source (23), the second sighting light source (23) is used to emit a second sighting beam (L2) and illuminate the glass substrate (1) obliquely, the wavelength band of the light of the first sighting beam (L1) is different from the wavelength band of the light of the second sighting beam (L2), the second depth-of-field camera (22) is used to acquire a second image, and the microcontroller unit (25) is used to obtain at least one detection result of at least one glass substrate through-via (12) based on the first image and the second image.

3. The waist depth detection device for through vias of a TGV glass substrate according to claim 2, characterized in that the beam color of the first sighting beam (L1) and the beam color of the second sighting beam (L2) are selected from red, green, and blue.

4. The TGV glass substrate through via waist depth detection device according to claim 2, wherein there is a first oblique angle of 30 to 45 degrees between the extending direction of the imaging end of the first depth-of-field camera (21) and the extending direction of the ejection end of the first sighting light source (24) and the upper surface (10) and the lower surface (11) of the glass substrate (1), and there is a second oblique angle of 30 to 45 degrees between the extending direction of the imaging end of the second depth-of-field camera (22) and the extending direction of the ejection end of the second sighting light source (23) and the upper surface (10) and the lower surface (11) of the glass substrate (1), and the first oblique angle is the same as or different from the second oblique angle.

5. Frame and, The frame further comprises a mounting structure installed within the frame and used to support the glass substrate (1) by contacting multiple corners of the glass substrate (1), The waist depth detection device for through vias of a TGV glass substrate according to claim 4, characterized in that the first sighting light source (24) and the second depth-of-field camera (22) are movably installed in the frame and adjacent to the inner bottom side of the frame, and the second sighting light source (23) and the first depth-of-field camera (21) are movably installed in the frame and adjacent to the inner upper side of the frame, or the second sighting light source (23) and the first depth-of-field camera (21) are movably installed in the frame and adjacent to the inner bottom side of the frame, and the first sighting light source (24) and the second depth-of-field camera (22) are movably installed in the frame and adjacent to the inner upper side of the frame.

6. The waist depth detection device for through vias of a TGV glass substrate according to claim 5, further comprising: a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism, which are connected to the first depth-of-field camera (21), the first sighting light source (24), the second depth-of-field camera (22), and the second sighting light source (23), respectively, and are used to cause the first depth-of-field camera (21), the first sighting light source (24), the second depth-of-field camera (22), and the second sighting light source (23) to move in two or three dimensions, and to adjust a plurality of the oblique angles by rotating the first depth-of-field camera (21), the first sighting light source (24), the second depth-of-field camera (22), and the second sighting light source (23).

7. The first image shows the upper opening (121), lower opening (123), and through via (122) of at least one glass substrate through via (12) of the glass substrate (1), and a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the beam color of the first sighting beam (L1), and the color of the outer region of the dogbone shape is a mixture of the beam color of the first sighting beam (L1) and the beam color of the second sighting beam (L2), as described in claim 2, for a waist depth detection device for a through via of a TGV glass substrate.

8. The second image shows the upper opening (121), lower opening (123), and through via (122) of at least one glass substrate through via (12) of the glass substrate (1), and a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the color of the second sighting beam (L2), and the color of the outer region of the dogbone shape is a mixture of the color of the first sighting beam (L1) and the color of the second sighting beam (L2), characterized in that the waist depth detection device for through vias of a TGV glass substrate according to claim 7.

9. The TGV glass substrate through-via waist depth detection device according to claim 8, characterized in that the microcontroller unit (25) is used to process two superimposed dogbone shapes in the first image to separate the two superimposed dogbone shapes in the first image, and to process two superimposed dogbone shapes in the second image to separate the two superimposed dogbone shapes in the second image.

10. A method for detecting the waist depth of a through-via in a TGV glass substrate, which is performed in a device for detecting the waist depth of a through-via in a TGV glass substrate, The first depth-of-field camera (21) and the first sighting light source (24) of the TGV glass substrate through-via waist depth detection device are moved and rotated, wherein the first depth-of-field camera (21) and the first sighting light source (24) are installed above and below the glass substrate (1) having at least one glass substrate through-via (12), and are positioned obliquely opposite the upper surface (10) and lower surface (11) of the glass substrate (1), respectively, or the first depth-of-field camera (21) and the first sighting light source (24) are installed below and above the glass substrate (1), respectively, and are positioned obliquely opposite the lower surface (11) and upper surface (10) of the glass substrate (1), The process involves using the microcontroller unit (25) of the through-via waist depth detection device of the TGV glass substrate to control the first depth-of-field camera (21) and the first sighting light source (24), the first sighting light source (24) being used to emit a first sighting beam (L1) and irradiate the glass substrate (1) in an oblique direction, and the first depth-of-field camera (21) being used to acquire a first image, The step includes using the microcontroller unit (25) of the through-via detection device for the TGV glass substrate to obtain at least one detection result for at least one of the glass substrate through-vias (12) based on the first image, A method for detecting the waist depth of a through-via (12) in a TGV glass substrate, characterized in that the detection result includes the waist depth of the through-via (12) in the glass substrate.

11. The method for detecting the waist depth of a through via in a TGV glass substrate according to claim 10, characterized in that the extension direction of the imaging end of the first depth-of-field camera (21) and the extension direction of the exit end of the first sighting light source (24) each have a first oblique angle of 30 to 45 degrees between them and the upper surface (10) and the lower surface (11) of the glass substrate (1).

12. The first image shows the upper opening (121), lower opening (123), and through via (122) of at least one glass substrate through via (12) of the glass substrate (1), and a partial image of the glass substrate (1) near the upper opening (121), the lower opening (123), and the through via (122), wherein the upper opening (121), the lower opening (123), and the through via (122) form a dogbone shape, the color of the dogbone shape is the color of the first sighting beam (L1), and the color of the outer region of the dogbone shape is different from the color of the first sighting beam (L1), characterized in that the waist depth detection method for a through via of a TGV glass substrate according to claim 10.

Images