Manufacturing method for optical wiring components

Abstract

To provide a method for manufacturing optical wiring components that can produce optical wiring components inexpensively with fewer manufacturing steps, while achieving stable optical coupling efficiency with other optical components. [Solution] The present invention provides a method for manufacturing an optical wiring component comprising an optical connector, an optical waveguide, and a first refractive index matching section, comprising the steps of: preparing a first component and a second component that, when combined with each other, can constitute an optical connector having a first recess formed on its outer surface; fixing an optical waveguide to the optical connector by sandwiching the optical waveguide between the first component and the second component and bonding them with an adhesive so that the first end face of the optical waveguide protrudes into the first recess; supplying a resin composition so that it is positioned so that the first recess faces upward, covers the first end face of the optical waveguide, and accumulates in the first recess; and forming a first refractive index matching section by curing the supplied resin composition.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing optical wiring components.

Background Art

[0002] Patent Document 1 discloses an optical wiring component having an optical connector with an elastic body attached to the outer surface thereof, and an optical waveguide placed on a through-hole penetrating therethrough. In the optical connector with an elastic body, an elastic body having translucency and elasticity is arranged so as to cover the end face of the optical waveguide and the outer surface of the optical connector. Further, it is disclosed that the refractive index of the elastic body is set between the refractive index of the core portion of the optical waveguide and the refractive index of the core of the optical fiber.

[0003] According to such an optical wiring component, stable optical coupling efficiency can be realized with other optical components.

[0004] Further, Patent Document 1 discloses a method for manufacturing the above optical wiring component, in which an elastic body is obtained by molding a resin composition with a molding die and then curing it.

[0005] [[ID=--]] According to such a manufacturing method, the elastic body can be molded into a desired shape.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] In the manufacturing method described in Patent Document 1, since a molding die is used, an increase in manufacturing man-hours and an increase in manufacturing costs are problems.

[0008] It should be noted that there seems to be a duplicate tag in the original text. I have translated it as is while marking the potential issue. If this is an error in the original, it may need to be corrected for a more accurate translation context.The object of the present invention is to provide a method for manufacturing optical wiring components that can produce optical wiring components that achieve stable optical coupling efficiency with other optical components at low cost with fewer manufacturing steps. [Means for solving the problem]

[0009] These objectives are achieved by the present invention as described in (1) to (7) below. (1) A method for manufacturing an optical wiring component comprising an optical connector, an optical waveguide, and a first refractive index matching section, A step of preparing a first component and a second component that can constitute the optical connector, having a first recess formed on its outer surface when combined with each other, The process involves fixing the optical waveguide to the optical connector by sandwiching the optical waveguide between the first and second parts and bonding them with an adhesive, such that the first end face of the optical waveguide protrudes into the first recess, A step of supplying a resin composition such that the first recess faces upward, covers the first end face of the optical waveguide, and accumulates in the first recess, A step of forming the first refractive index matching portion by curing the supplied resin composition, A method for manufacturing optical wiring components, characterized by having the following features.

[0010] (2) The method for manufacturing an optical wiring component according to (1) above, wherein the step of forming the first refractive index matching portion includes a process of curing the resin composition by irradiating the resin composition with energy rays.

[0011] (3) A method for manufacturing an optical wiring component according to (1) or (2) above, wherein the step of supplying the resin composition includes a process of causing the resin composition accumulated in the first recess to protrude from the outer surface of the optical connector and form a convex curved surface.

[0012] (4) A method for manufacturing optical wiring components according to any one of (1) to (3) above, wherein the step of fixing the first component and the second component and the optical waveguide with the adhesive includes supplying the uncured adhesive between the first component and the optical waveguide and between the second component and the optical waveguide, respectively, and crushing it to cause the uncured adhesive to protrude into the first recess, and then curing the uncured adhesive to fix the first component and the second component and the optical waveguide with the adhesive.

[0013] (5) The optical wiring component further comprises a second refractive index matching section, The step of fixing the first component and the second component and the optical waveguide with the adhesive includes sandwiching the optical waveguide between the first component and the second component such that the second end face of the optical waveguide, opposite to the first end face of the optical waveguide, protrudes into a second recess formed on the outer surface of the optical connector by the first component and the second component, and fixing the first component and the second component and the optical waveguide with the adhesive. A step of arranging the second recess so that it faces upward, supplying a resin composition so that it covers the second end face of the optical waveguide and accumulates in the second recess, A step of forming the second refractive index matching portion by curing the supplied resin composition, A method for manufacturing optical wiring components according to any one of (1) to (4) above, further comprising:

[0014] (6) The process of sandwiching the optical waveguide between the first component and the second component is a process of housing the optical waveguide and the second component in a groove formed in the first component while they are stacked on top of each other, as described in any of (1) to (5) above, for manufacturing an optical wiring component.

[0015] (7) The process of sandwiching the optical waveguide with the first component and the second component is the process of accommodating the optical waveguide in a first groove formed in the first component, and the process of accommodating the second component in a second groove provided overlapping the first groove and having a width wider than the first groove. The method for manufacturing an optical wiring component according to any one of the above (1) to (5).

Effect of the Invention

[0016] According to the present invention, an optical wiring component that realizes a stable optical coupling efficiency with other optical components can be manufactured at a low cost with a small number of manufacturing steps.

Brief Description of the Drawings

[0017] [Figure 1] It is a perspective view showing a schematic configuration of an optical wiring component manufactured by the method for manufacturing an optical wiring component according to an embodiment. [Figure 2] It is a cross-sectional view of the optical wiring component shown in FIG. 1. [Figure 3] It is a cross-sectional view of the optical wiring component shown in FIG. 1. [Figure 4] It is a front view of the optical wiring component shown in FIG. 2 as viewed from the minus Y-axis side toward the plus Y-axis side. [Figure 5] It is a front view showing a modified example of the optical wiring component in FIG. 4. [Figure 6] It is a perspective view showing a partially enlarged view of the optical waveguide in FIG. 1. [Figure 7] It is a process diagram showing the configuration of the method for manufacturing an optical wiring component according to an embodiment. [Figure 8] It is a schematic diagram for explaining the method for manufacturing an optical wiring component shown in FIG. 7. [Figure 9] It is a schematic diagram for explaining the method for manufacturing an optical wiring component shown in FIG. 7. [Figure 10] It is a schematic diagram for explaining the method for manufacturing an optical wiring component shown in FIG. 7. [Figure 11] It is a schematic diagram for explaining the method for manufacturing an optical wiring component shown in FIG. 7. [Figure 12] It is a schematic diagram for explaining the method for manufacturing an optical wiring component shown in FIG. 7. [Figure 13] Figure 7 is a schematic diagram illustrating the manufacturing method of the optical wiring component shown. [Figure 14] Figure 7 is a schematic diagram illustrating the manufacturing method of the optical wiring component shown. [Figure 15] Figure 7 is a schematic diagram illustrating the manufacturing method of the optical wiring component shown. [Figure 16] Figure 7 is a schematic diagram illustrating the manufacturing method of the optical wiring component shown. [Figure 17] Figure 7 is a schematic diagram illustrating the manufacturing method of the optical wiring component shown. [Modes for carrying out the invention]

[0018] The method for manufacturing optical wiring components according to the present invention will be described in detail below based on preferred embodiments shown in the attached drawings.

[0019] 1. Optical wiring components Optical wiring components manufactured by the manufacturing method of optical wiring components according to this embodiment will be described.

[0020] Figure 1 is a perspective view showing the schematic configuration of an optical wiring component 1 manufactured by the optical wiring component manufacturing method according to the embodiment. Figures 2 and 3 are cross-sectional views of the optical wiring component 1 shown in Figure 1.

[0021] In the figures of this application, the X, Y, and Z axes are defined as three mutually orthogonal axes, and each axis is indicated by an arrow. The base end of the arrow is referred to as the negative side of each axis, and the tip end is referred to as the positive side of each axis. Furthermore, for illustrative purposes, the dimensional ratios of each part in each figure differ from those of the actual parts. Also, in Figures 2 and 3, some of the components shown in Figure 1 are omitted from the illustration.

[0022] 1.1.General configuration The optical wiring component 1 shown in Figures 1 to 3 comprises an optical connector 2, an optical waveguide 3, an adhesive layer 6, a first refractive index matching section 41 and a second refractive index matching section 42, and guide pins 51 to 54.

[0023] Such optical wiring component 1 is interposed between other optical components (not shown), such as optical fibers, and has the function of optically connecting them. The optical waveguide 3 has the function of relaying light between the other optical components. In addition, the first refractive index matching section 41 and the second refractive index matching section 42 are interposed between the optical waveguide 3 and the other optical components and contribute to reducing coupling loss. Furthermore, the guide pins 51 to 54 have the function of aligning the optical connector 2 and the other optical components and mechanically coupling them.

[0024] The optical connector 2 shown in Figures 2 and 3 has a first recess 23 and a second recess 24 that open to the outer surface, and holes 25 that open to the bottom surface 231 of the first recess 23 and the bottom surface 241 of the second recess 24, respectively.

[0025] The optical waveguide 3 is inserted into the hole 25. The first end face 31 of the optical waveguide 3, including the first inlet / outlet surface 311, may remain within the hole 25 or protrude outside the first recess 23, but preferably protrudes within the first recess 23. Similarly, the second end face 32 of the optical waveguide 3, including the second inlet / outlet surface 321, may remain within the hole 25 or protrude outside the second recess 24, but preferably protrudes within the second recess 24. The adhesive layer 6 then adheres the hole 25 and the optical waveguide 3.

[0026] The first refractive index matching section 41 is interposed between the first input / output surface 311 of the optical waveguide 3 and other optical components, and has the function of adjusting the refractive index difference between the two. The first refractive index matching section 41 also has a first convex curved surface 411 that protrudes from the outer surface of the optical connector 2. When connecting the optical wiring component 1 and other optical components, this first convex curved surface 411 makes gapless contact with the other optical components, contributing to the establishment of a stable connection with high optical coupling efficiency. Furthermore, since the first refractive index matching section 41 covers the first end surface 31 of the optical waveguide 3 and is housed in the first recess 23, it is difficult to peel off from the optical connector 2. With these functions, coupling loss between the optical waveguide 3 and other optical components can be reduced.

[0027] The second refractive index matching section 42 is interposed between the second input / output surface 321 of the optical waveguide 3 and other optical components, and has the function of adjusting the refractive index difference between the two. The second refractive index matching section 42 also has a second convex curved surface 421 that protrudes from the outer surface of the optical connector 2. When connecting the optical wiring component 1 and other optical components, this second convex curved surface 421 makes gapless contact with the other optical components, contributing to the establishment of a stable connection with high optical coupling efficiency. Furthermore, since the second refractive index matching section 42 covers the second end surface 32 of the optical waveguide 3 and is housed in the second recess 24, it is less likely to peel off from the optical connector 2. With these functions, coupling loss between the optical waveguide 3 and other optical components can be reduced.

[0028] In the optical wiring component 1 having the above configuration, the first refractive index matching portion 41 is housed in the first recess 23 and the second refractive index matching portion 42 is housed in the second recess 24. This prevents the outer edges of the first refractive index matching portion 41 and the second refractive index matching portion 42 from being exposed. As a result, the first refractive index matching portion 41 and the second refractive index matching portion 42 are less likely to peel off, enabling the realization of a highly reliable optical wiring component 1.

[0029] The second end face 32 and the second recess 24 are not limited to the above configuration. For example, the second recess 24 may be omitted in the optical connector 2, the second end face 32 may not protrude, or a mirror that converts the optical path may be used instead of the second end face 32.

[0030] Furthermore, although a second refractive index matching section 42 is provided in this embodiment, the second refractive index matching section 42 may be omitted, or the second refractive index matching section 42 may have a shape other than the second convex curved surface 421.

[0031] 1.2. Optical Connector The optical connector 2 shown in Figure 1 has a main body 21 (first component) and a cover 22 (second component). The optical waveguide 3 has a first main surface 301 and a second main surface 302 that are on opposite sides of each other, as shown in Figure 3. The main body 21 has a first support surface 211 that faces the first main surface 301, as shown in Figure 3. The cover 22 has a second support surface 221 that faces the second main surface 302, as shown in Figure 3. These first support surfaces 211 and second support surfaces 221 constitute a part of the inner wall surface of the hole 25. With this configuration, the hole 25 can be easily formed by sandwiching the optical waveguide 3 between the two components, and the optical waveguide 3 can be fixed to the optical connector 2. This makes it easy to fix the optical waveguide 3 to the optical connector 2.

[0032] In this embodiment, the optical connector 2 is composed of two components, but it may be composed of three or more components.

[0033] The shape of the optical connector 2 is not particularly limited and may be a rectangular parallelepiped shape as shown in Figure 1, with the Y-axis direction as the length, the X-axis direction as the width, and the Z-axis direction as the thickness, or it may be any other shape. The optical connector 2 may also include parts that conform to various connector standards (ferrule standards). Examples of such connector standards include PMT connectors, mini MT connectors, MT connectors specified in JIS C 5981, 16MT connectors, and 2D array type MT connectors.

[0034] Examples of constituent materials for the optical connector 2 include various resin materials such as phenolic resins, epoxy resins, olefin resins, urea resins, melamine resins, unsaturated polyester resins, and polyphenylene sulfide resins, as well as various metal materials such as stainless steel and aluminum alloys. Furthermore, the constituent materials for the optical connector 2 may also include inorganic fillers such as glass fillers and ceramic fillers.

[0035] The length of the optical connector 2 is preferably 3 to 100 mm, more preferably 5 to 30 mm, and even more preferably 7 to 15 mm. The width of the optical connector 2 is preferably 2 to 70 mm, more preferably 3 to 20 mm, and even more preferably 4 to 10 mm. The thickness of the optical connector 2 is preferably thinner than its width.

[0036] As shown in Figures 2 and 3, a first recess 23 is opened on the outer surface of the optical connector 2, on the side facing the negative Y-axis. The first refractive index matching portion 41 is housed in the first recess 23. In other words, the first recess 23 prevents the outer edge of the first refractive index matching portion 41 from being exposed by housing it. This prevents the outer edge of the first refractive index matching portion 41 from peeling off. In addition, the contact area between the inner surface of the first recess 23 and the first refractive index matching portion 41 is wider than when the first refractive index matching portion 41 is placed on a flat surface, thus increasing the adhesive strength of the first refractive index matching portion 41. These effects effectively prevent the detachment of the first refractive index matching portion 41.

[0037] Furthermore, if the first refractive index matching portion 41 is not housed within the first recess 23, the outer edge of the first refractive index matching portion 41 will be exposed. This exposed outer edge tends to peel off easily. Once the outer edge peels off, it can spread throughout the entire portion, potentially leading to the detachment of the first refractive index matching portion 41.

[0038] Furthermore, one end of the hole 25 is open at the bottom surface 231 of the first recess 23. The optical waveguide 3 is inserted into the hole 25, and the first end face 31 protrudes into the first recess 23. This allows the first end face 31 and its nearby side surface to be covered by the first refractive index matching portion 41. With this configuration, the first end face 31 can be protected from external pressure and contamination, and a state in which the first end face 31 and the first refractive index matching portion 41 are in contact can be reliably formed.

[0039] Furthermore, because the first end face 31 protrudes into the first recess 23, the first refractive index matching portion 41 can be positioned to enclose the first end face 31. This allows for a larger contact area between the optical waveguide 3 and the first refractive index matching portion 41, thereby improving their adhesion. As a result, the increase in coupling loss due to delamination of the first refractive index matching portion 41 can be suppressed.

[0040] Furthermore, it is preferable that the first end face 31 of the optical waveguide 3 protrudes to the extent that it remains within the first recess 23, as shown in Figures 2 and 3. In other words, it is preferable that the depth d1 of the first recess 23 is deeper than the length L1 by which the first end face 31 protrudes from the bottom surface 231. This allows the first end face 31 to be protected more reliably by the first refractive index matching section 41. In addition, the probability of deformation near the first end face 31 being caused by external pressure can be kept low.

[0041] The depth d1 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 100 μm or less. This suppresses the exposure of the outer edge of the first refractive index matching portion 41 while preventing the volume of the first refractive index matching portion 41 from becoming unnecessarily large. If the depth d1 falls below the lower limit, the first refractive index matching portion 41 becomes too thin, which may cause the first refractive index matching portion 41 to peel off easily or reduce the amount of deformation when the first refractive index matching portion 41 is compressed. On the other hand, if the depth d1 exceeds the upper limit, the first refractive index matching portion 41 becomes too thick, which requires increasing the protrusion length L1 of the first end face 31. In that case, the vicinity of the first end face 31 of the optical waveguide 3 may deform.

[0042] The length L1 is preferably 2% to 100% of the depth d1, more preferably 5% to 80%, and even more preferably 20% to 60%. This allows for optimization of the protrusion length L1 of the first end face 31 with respect to the depth d1 of the first recess 23. Furthermore, the length L1 is preferably 5 μm to 80 μm, and more preferably 10 μm to 50 μm. This allows for particularly optimal optimization of the protrusion length L1 of the first end face 31.

[0043] Furthermore, as mentioned above, the first end face 31 may pass through the first recess 23 and protrude to the extent that it extends beyond the opening of the first recess 23 towards the negative Y-axis. In other words, the length L1 may exceed 100% of the depth d1. Even in this case, the first end face 31 can be protected if it is covered by the first refractive index matching portion 41.

[0044] As shown in Figures 2 and 3, a second recess 24 is opened on the outer surface of the optical connector 2, on the side facing the positive Y-axis. The second refractive index matching portion 42 is housed in the second recess 24. In other words, the second recess 24 prevents the outer edge of the second refractive index matching portion 42 from being exposed by housing it. This prevents the outer edge of the second refractive index matching portion 42 from peeling off. In addition, the contact area between the inner surface of the second recess 24 and the second refractive index matching portion 42 is wider than when the second refractive index matching portion 42 is placed on a flat surface, so the adhesive strength of the second refractive index matching portion 42 can be increased. These effects effectively prevent the detachment of the second refractive index matching portion 42.

[0045] Furthermore, if the second refractive index matching portion 42 is not housed within the second recess 24, the outer edge of the second refractive index matching portion 42 will be exposed. This exposed outer edge tends to peel off easily. Once the outer edge peels off, it may lead to the second refractive index matching portion 42 falling off.

[0046] Furthermore, the other end of the hole 25 is open at the bottom surface 241 of the second recess 24. The optical waveguide 3 is inserted into the hole 25, and the second end face 32 protrudes into the second recess 24. This allows the second end face 32 and its nearby side surface to be covered by the second refractive index matching portion 42. With this configuration, the second end face 32 can be protected from external pressure and contamination, and a state in which the second end face 32 and the second refractive index matching portion 42 are in contact can be reliably formed.

[0047] Furthermore, because the second end face 32 protrudes into the second recess 24, the second refractive index matching portion 42 can be positioned to enclose the second end face 32. This allows for a larger contact area between the optical waveguide 3 and the second refractive index matching portion 42, thereby improving their adhesion. As a result, the increase in coupling loss due to delamination of the second refractive index matching portion 42 can be suppressed.

[0048] Furthermore, it is preferable that the second end face 32 of the optical waveguide 3 protrudes to the extent that it remains within the second recess 24, as shown in Figures 2 and 3. In other words, it is preferable that the depth d2 of the second recess 24 is deeper than the length L2 to which the second end face 32 protrudes from the bottom surface 241. This allows the second end face 32 to be protected more reliably by the second refractive index matching section 42. In other words, even when external pressure is applied, the probability of deformation near the second end face 32 can be kept low.

[0049] The depth d2 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 100 μm or less. This suppresses the exposure of the outer edge of the second refractive index matching portion 42 while preventing the volume of the second refractive index matching portion 42 from becoming unnecessarily large. If the depth d2 falls below the lower limit, the second refractive index matching portion 42 becomes too thin, which may make the second refractive index matching portion 42 more prone to peeling or reduce the amount of deformation when the second refractive index matching portion 42 is compressed. On the other hand, if the depth d2 exceeds the upper limit, the second refractive index matching portion 42 becomes too thick, which requires increasing the protrusion length L2 of the second end face 32. In that case, the vicinity of the second end face 32 of the optical waveguide 3 may deform.

[0050] The length L2 is preferably 2% to 100% of the depth d2, more preferably 5% to 80%, and even more preferably 20% to 60%. This allows for optimization of the protrusion length L2 of the second end face 32 relative to the depth d2 of the second recess 24. Furthermore, the length L2 is preferably 5 μm to 80 μm, and more preferably 10 μm to 50 μm. This allows for particularly optimal optimization of the protrusion length L2 of the second end face 32.

[0051] Furthermore, as mentioned above, the second end face 32 may pass through the second recess 24 and protrude to the extent that it extends outwards from the opening of the second recess 24 towards the positive Y-axis. In other words, the length L2 may exceed 100% of the depth d2. In this case as well, the second end face 32 can be protected if it is covered by the second refractive index matching portion 42.

[0052] Furthermore, let N be the normal to the first end face 31 of the optical waveguide 3. When viewing the optical wiring component 1 from above the normal N, it is preferable that the bottom surface 231 of the first recess 23 sandwiches the first end face 31. In other words, it is preferable that the bottom surface 231 is located on both the Z-axis positive side and the Z-axis negative side via the first end face 31. As a result, the first refractive index matching portion 41 housed in the first recess 23 extends on both sides of the Z-axis, sandwiching the first end face 31. Therefore, the probability that the first convex surface 411 will be a surface with its vertex near the first end face 31 increases. A first convex surface 411 of this shape is likely to come into contact with other optical components to which the optical wiring component 1 is connected, near its vertex. Therefore, the formation of gaps at connection points is particularly suppressed, and coupling loss between the first end face 31 and other optical components is easily suppressed.

[0053] If the first refractive index matching portion 41 is present and the first end face 31 cannot be directly seen, then the first refractive index matching portion 41 can be removed and the exposed first end face 31 can be arranged as described above.

[0054] Similarly, with respect to the bottom surface 241 of the second recess 24, just like the bottom surface 231 of the first recess 23, it is preferable that when viewing the optical wiring component 1 from the normal to the second end face 32, the bottom surface 241 of the second recess 24 sandwiches the second end face 32.

[0055] As shown in Figures 1 and 2, the optical connector 2 has pin holes 261 and 262 opening on the outer surface facing the negative Y-axis, and pin holes 263 and 264 opening on the outer surface facing the positive Y-axis. Pin holes 261 to 264 function as guide holes when aligning the optical connector 2 with other optical components.

[0056] In this embodiment, a portion of each of the guide pins 51 to 54 is inserted into and fixed in the pin holes 261 to 264. The other portions of each of the guide pins 51 to 54 protrude from the pin holes 261 to 264. Each protruding portion of the guide pins 51 to 54 is inserted into a guide hole provided in another optical component.

[0057] In this embodiment, pin holes 261 and 263 are connected to each other inside the optical connector 2. That is, as shown in Figure 2, pin holes 261 and 263 are connected to each other to form a single through-hole. This makes it easier to form pin holes 261 and 263 and to ensure alignment and shape compatibility between them. Similarly, in this embodiment, pin holes 262 and 264 are connected to each other inside the optical connector 2. This makes it easier to form pin holes 262 and 264 and to ensure alignment and shape compatibility between them. Note that pin holes 261 and 263, and pin holes 262 and 264, may be separated from each other.

[0058] Furthermore, in this embodiment, guide pins 51 and 53 are connected to each other. That is, guide pins 51 and 53 are connected to each other to form a single rod-shaped member, with both ends protruding from pin holes 261 and 263. This reduces the number of parts and makes it easier to align the position and shape of guide pins 51 and 53. Similarly, in this embodiment, guide pins 52 and 54 are connected to each other. That is, guide pins 52 and 54 are connected to each other to form a single rod-shaped member, with both ends protruding from pin holes 262 and 264. This makes it easier to align the position and shape of guide pins 52 and 54. Moreover, the contact area between guide pins 51 and 53 and pin holes 261 and 263, and the contact area between guide pins 52 and 54 and pin holes 262 and 264 are increased, thereby increasing the fixing force of guide pins 51 to 54. Note that guide pins 51, 53 and guide pins 52, 54 may each be separate components.

[0059] The pin holes 261-264 and guide pins 51-54 may be provided as needed, and may be omitted if other fastening means are used. Furthermore, only the guide pins 51-54 may be omitted. In that case, the pin holes 261-264 may be used as guide holes.

[0060] Figure 4 is a front view of the optical wiring component 1 shown in Figure 2, viewed from the negative Y-axis side towards the positive Y-axis side. Note that the first refractive index matching section 41 is not shown in Figure 4.

[0061] The main body 21 of the optical connector 2 shown in Figure 4 has a first groove 213 that opens on the Z-axis positive side, and a second groove 215 that also opens on the Z-axis positive side and is wider than the first groove 213. The first groove 213 opens to the bottom surface of the second groove 215.

[0062] The first groove 213 houses the optical waveguide 3. The width of the first groove 213 is set to match the width of the optical waveguide 3. This makes it easy to align the optical waveguide 3 with respect to the optical connector 2.

[0063] The lid 22 (second component) is housed in the second groove 215. A portion of the lid 22 is also housed in the first groove 213. In this case, the thickness of the hole 25, defined by the main body 21 and the lid 22 as shown in Figure 3, can be precisely controlled. That is, the lid 22, being bonded to the second groove 215, cannot move further toward the optical waveguide 3. Therefore, excessive pressure on the optical waveguide 3 is prevented. Consequently, the adhesive layer 6 is not excessively compressed by the optical waveguide 3 or the lid 22, and the thickness of the adhesive layer 6 can be precisely controlled. Therefore, for example, the adhesive layer 6 can be made slightly thicker, allowing it to absorb stress due to thermal expansion. This reduces the stress generated in the optical waveguide 3, suppressing an increase in transmission loss.

[0064] Figure 5 is a front view showing a modified example of the optical wiring component 1 in Figure 4. Note that the first refractive index matching section 41 is not shown in Figure 5.

[0065] The main body 21 of the optical connector 2 shown in Figure 5 has a groove 217 that opens on the Z-axis positive side. The groove 217 houses the optical waveguide 3 and the cover 22 (second component), which are stacked on top of each other in the Z-axis direction. The width of the groove 217 is set to match the width of the optical waveguide 3 and the cover 22. This allows the thickness of the adhesive layer 6 to be easily adjusted according to the load pressing on the cover 22. In addition, the amount of adhesive used to make up the adhesive layer 6 can be minimized.

[0066] 1.3.Optical waveguide Figure 6 is a perspective view showing an enlarged portion of the optical waveguide 3 in Figure 1.

[0067] The optical waveguide 3 shown in Figure 6 is in the form of a sheet that extends along the XY plane. The optical waveguide 3 shown in Figure 6 comprises a laminate 310 in which a first support layer 308, a first cladding layer 306, a core layer 303, a second cladding layer 307, and a second support layer 309 are stacked in this order from the negative Z-axis side.

[0068] As shown in Figure 6, the core portion 304 formed in the core layer 303 has a surface intersecting the X-axis in contact with the side cladding portion 305, a surface on the negative Z-axis side in contact with the first cladding layer 306, and a surface on the positive Z-axis side in contact with the second cladding layer 307. The refractive index of the core portion 304 is higher than that of these cladding regions.

[0069] The core portion 304 extends between the first inlet / outlet surface 311 and the second inlet / outlet surface 321, and connects them optically. The planar shape (pattern) of the extending core portion 304 is not particularly limited and may be a linear pattern as shown in Figures 2 and 6, a pattern in which the core portions 304 intersect each other, a pattern in which the core portion 304 branches into multiple parts, a pattern in which multiple core portions 304 merge, or a pattern that combines two or more of these types. Furthermore, the core portion 304 may be provided with any function to modulate the light propagating through the core portion 304.

[0070] Furthermore, at least a portion of the side cladding portion 305 and at least one of the first cladding layer 306 and the second cladding layer 307 may be integrated into a single unit.

[0071] The average thickness of the core layer 303 is not particularly limited, but is preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and even more preferably about 10 to 70 μm.

[0072] The constituent material of the core layer 303 is not particularly limited, but examples include resin materials, glass materials, silicon materials, or composite materials of these with other materials. Of these, resin materials are preferably used from the viewpoint of impact resistance and ease of handling.

[0073] The average thickness of the first cladding layer 306 and the second cladding layer 307 is preferably about 1 to 200 μm, more preferably about 3 to 100 μm, and even more preferably about 5 to 60 μm.

[0074] Furthermore, the constituent materials of the first cladding layer 306 and the second cladding layer 307 are appropriately selected from, for example, the materials listed above as constituent materials for the core layer 303.

[0075] Furthermore, at least one of the first cladding layer 306 and the second cladding layer 307 may be provided as needed and may be omitted.

[0076] The first support layer 308 is provided on the Z-axis negative side of the first cladding layer 306. The second support layer 309 is provided on the Z-axis positive side of the second cladding layer 307. By providing the first support layer 308 and the second support layer 309, the core layer 303, the first cladding layer 306, and the second cladding layer 307 are protected from heat, external forces, and the like.

[0077] The constituent materials of the first support layer 308 and the second support layer 309 are not particularly limited, but examples include resin materials, glass materials, silicon materials, or composite materials of these with other materials. Of these, resin materials are preferably used from the viewpoint of impact resistance and ease of handling.

[0078] The first support layer 308 and the second support layer 309 may be provided as needed, but may be omitted.

[0079] 1.4.Adhesive layer As shown in Figures 2 and 3, the hole 25 of the optical connector 2 and the optical waveguide 3 are bonded to each other via an adhesive layer 6. As shown in Figure 3, the adhesive layer 6 has an adhesive layer 61 that bonds the body 21 of the optical connector 2 to the optical waveguide 3, and an adhesive layer 62 that bonds the cover 22 to the optical waveguide 3.

[0080] The adhesive layers 61 and 62 may be cured products of any adhesive. Specific examples of adhesives include epoxy adhesives, acrylic adhesives, urethane adhesives, silicone adhesives, olefin adhesives, and various hot-melt adhesives (polyester-based, modified olefin-based).

[0081] The adhesive layer 61 spreads between the first main surface 301 of the optical waveguide 3 and the first support surface 211 of the main body 21, bonding them together. The adhesive layer 61 does not need to extend over the entire area between them; it may be provided only in a portion of it.

[0082] Furthermore, the adhesive layer 61 may be contained between the first main surface 301 and the first support surface 211, but as shown in Figure 3, it may also protrude into the first recess 23 and the second recess 24. As a result, the protruding adhesive layer 61 adheres to the side surface of the optical waveguide 3, forming a fillet shape. A fillet shape refers to a smooth curved surface connecting the bottom surface 231 of the first recess 23 and the side surface of the optical waveguide 3. Since such a shape has the function of alleviating stress concentration, the fillet-shaped adhesive layer 61 reinforces the vicinity of the first end surface 31 and the second end surface 32 of the optical waveguide 3. The first recess 23 and the second recess 24 also contribute to preventing the protruding adhesive layer 61,62 from flowing out to the outer surface of the optical connector 2.

[0083] The adhesive layer 62 extends between the second main surface 302 of the optical waveguide 3 and the second support surface 221 of the cover 22, bonding them together. The adhesive layer 62 does not need to extend over the entire area between them; it may be provided only in a portion of it.

[0084] Furthermore, the adhesive layer 62 may be contained between the second main surface 302 and the second support surface 221, but as shown in Figure 3, it may also protrude into the first recess 23 and the second recess 24. As a result, the protruding adhesive layer 62 adheres to the side surface of the optical waveguide 3, forming a fillet shape. The fillet-shaped adhesive layer 62 reinforces the vicinity of the first end surface 31 and the second end surface 32 of the optical waveguide 3.

[0085] 1.5. Refractive Index Matching Section The first refractive index matching section 41 and the second refractive index matching section 42 are transparent at the wavelength of light incident on the optical waveguide 3. For example, when light with a wavelength of 850 nm is incident on them, if the insertion loss of the first refractive index matching section 41 and the second refractive index matching section 42 is 2 dB or less, they can be said to be "transparent".

[0086] The first refractive index matching section 41 is interposed between the first input / output surface 311 of the optical waveguide 3 and other optical components to adjust the refractive index difference between them. The second refractive index matching section 42 is interposed between the second input / output surface 321 of the optical waveguide 3 and other optical components to adjust the refractive index difference between them. Therefore, the refractive index of the first refractive index matching section 41 and the refractive index of the second refractive index matching section 42 are set appropriately according to the refractive index of the other optical components, but as an example, it is preferable that they are between the refractive index of the core section 304 and 1.400. This allows for optimal adjustment of the refractive index difference with many optical components, such as optical fibers, and thus effectively suppresses coupling loss.

[0087] The first refractive index matching section 41 and the second refractive index matching section 42 may be elastic. Elasticity refers to the property of deforming when an external force is applied and returning to its original shape when the external force is removed. As a result, when another optical component is pressed against the optical wiring component 1, the first refractive index matching section 41 and the second refractive index matching section 42 are each appropriately compressed and deformed, suppressing the formation of gaps. Consequently, coupling loss can be suppressed effectively and stably. It can also contribute to suppressing damage to the optical waveguide 3 due to compressive stress.

[0088] The first refractive index matching section 41 has a first convex curved surface 411. The first convex curved surface 411 is a curved surface that protrudes from the outer surface of the optical connector 2 toward the negative Y-axis. Having such a first convex curved surface 411 makes it difficult for gaps such as air layers to form between the first refractive index matching section 41 and other optical components. Therefore, coupling loss can be suppressed.

[0089] The shape of the first convex surface 411 is not particularly limited as long as it is a surface that protrudes towards the negative side of the Y-axis; it may be spherical or aspherical. Furthermore, a portion of it may be flat.

[0090] The second refractive index matching section 42 has a second convex curved surface 421. The second convex curved surface 421 is a curved surface that protrudes from the outer surface of the optical connector 2 toward the positive Y-axis. Having such a second convex curved surface 421 makes it difficult for gaps such as air layers to form between the second refractive index matching section 42 and other optical components. As a result, coupling loss can be suppressed.

[0091] The shape of the second convex surface 421 is not particularly limited as long as it is a curved surface that protrudes towards the positive Y-axis; it may be spherical or aspherical. Furthermore, a portion of it may be flat.

[0092] The first refractive index matching portion 41 may be located only in a part of the first recess 23, but preferably it extends throughout the entire recess. In other words, it is preferable that the first refractive index matching portion 41 extends so that the bottom surface 231 of the first recess 23 is not exposed. As a result, the outer edge of the first refractive index matching portion 41 comes into contact with the inner surface of the first recess 23, making the first refractive index matching portion 41 less likely to peel off. In addition, it is possible to prevent the first refractive index matching portion 41 from deforming more than necessary when it undergoes compression deformation. Therefore, it is possible to suppress the peeling off of the first refractive index matching portion 41 due to compression deformation.

[0093] The second refractive index matching portion 42 may be located only in a portion of the second recess 24, but preferably it extends throughout the entire recess. This causes the outer edge of the second refractive index matching portion 42 to come into contact with the inner surface of the second recess 24, making the second refractive index matching portion 42 less likely to peel off. Furthermore, it prevents the second refractive index matching portion 42 from deforming more than necessary when it undergoes compressive deformation. Therefore, it is possible to suppress the peeling off of the second refractive index matching portion 42 due to compressive deformation.

[0094] The protrusion height h1 of the first refractive index matching portion 41 (the distance from the outer surface of the optical connector 2 shown in Figure 2 to the tip surface of the first refractive index matching portion 41) is preferably 3 μm or more, more preferably 5 μm to 50 μm, and even more preferably 7 μm to 30 μm. If the protrusion height h1 is within the above range, the probability that the first refractive index matching portion 41 will come into contact with other optical components first when the optical wiring component 1 and other optical components are brought close to each other increases. In addition, a necessary and sufficient amount of compressive deformation can be secured in the first refractive index matching portion 41.

[0095] The protrusion height h2 of the second refractive index matching portion 42 (the distance from the outer surface of the optical connector 2 shown in Figure 2 to the tip surface of the second refractive index matching portion 42) is preferably 3 μm or more, more preferably 5 μm to 50 μm, and even more preferably 7 μm to 30 μm. If the protrusion height h2 is within the above range, the probability that the second refractive index matching portion 42 will come into contact with other optical components first when the optical wiring component 1 and other optical components are brought close to each other increases. In addition, a necessary and sufficient amount of compressive deformation can be secured in the second refractive index matching portion 42.

[0096] Examples of constituent materials for the first refractive index matching section 41 and the second refractive index matching section 42 include transparent polyamide, polyolefin, fluororesin, polyester, (meth)acrylic resin, plastic resins such as polycarbonate, epoxy resin, oxetane resin, vinyl ether resin, melamine resin, phenolic resin, silicone resin, and curable resins such as transparent polyimide. Materials containing one or more of these materials are used.

[0097] The constituent materials of the first refractive index matching section 41 and the second refractive index matching section 42 may, if necessary, include various thermoplastic elastomers such as styrene-based, polyolefin-based, polyvinyl chloride-based, polyurethane-based, polyester-based, polyamide-based, polybutadiene-based, trans-polyisoprene-based, fluororubber-based, and chlorinated polyethylene-based materials.

[0098] As mentioned above, the first refractive index matching section 41 and the second refractive index matching section 42 preferably satisfy an insertion loss of 2 dB or less when light with a wavelength of 850 nm is incident on them. This insertion loss can be measured, for example, in accordance with the measurement method for insertion loss in section 4.6.1 of the Test Method for Polymer Optical Waveguides (JPCA-PE02-05-01S-2008), a standard created by the Japan Electronics Circuits Manufacturers Association.

[0099] The surfaces of the first refractive index matching portion 41 and the second refractive index matching portion 42 may be subjected to surface treatment as needed. Examples of surface treatments include surface modification treatments such as corona treatment and plasma treatment, film formation treatments such as liquid repellency treatment, low-reflection coating, and protective coating.

[0100] 1.6. Guide pins Guide pins 51-54 are inserted into and fixed in pin holes 261-264. Guide pins 51-54 protrude from the optical connector 2.

[0101] The protruding portions of guide pins 51-54 are inserted into guide holes provided in other optical components when optically connecting the optical wiring component 1 to other optical components. This makes it easy to align the optical wiring component 1 with other optical components.

[0102] The method for fixing the guide pins 51-54 to the pin holes 261-264 is not particularly limited, and for example, an adhesive may be used, but in this embodiment, press-fitting is employed. By press-fitting the guide pins 51-54 into the pin holes 261-264, they can be fixed without using adhesive, thus reducing the man-hours required for fixing. In addition, the occurrence of problems caused by adhesive adhering to the guide pins 51-54 can be suppressed.

[0103] Examples of materials that make up the guide pins 51-54 include metal materials, ceramic materials, resin materials, and the like.

[0104] 2. Manufacturing method of optical wiring components Next, a method for manufacturing an optical wiring component according to the embodiment will be described. In the following description, the method for manufacturing the optical wiring component 1 shown in Figure 1 will be used as an example.

[0105] Figure 7 is a process diagram showing the configuration of a method for manufacturing an optical wiring component according to an embodiment. Figures 8 to 17 are schematic diagrams illustrating the method for manufacturing the optical wiring component shown in Figure 7.

[0106] The manufacturing method shown in Figure 7 comprises a preparation step S102, an adhesion step S104, a resin composition supply step S106, a curing step S108, a resin composition supply step S110, and a curing step S112.

[0107] 2.1. Preparation process In preparation step S102, the main body 21 (first component) and the cover 22 (second component) are prepared. The main body 21 and the cover 22 are components that constitute the optical connector 2 when combined with each other. When the main body 21 and the cover 22 are combined, a first recess 23 and a second recess 24 are formed on the outer surface of the optical connector 2, as shown in Figure 14. The first recess 23 is composed of a step 275 provided on the outer surface of the main body 21 shown in Figure 9 and a step 285 provided on the outer surface of the cover 22 shown in Figure 13. The second recess 24 is composed of a step 276 provided on the outer surface of the main body 21 shown in Figure 9 and a step 286 provided on the outer surface of the cover 22 shown in Figure 13.

[0108] In this embodiment, the first component is the main body 21 and the second component is the lid 22, but the shapes of the first and second components are not limited to these. For example, the first and second components may have the same shape as each other.

[0109] 2.2.Gluing process In bonding step S104, first, as shown in Figure 8, adhesive 60 is applied to the first main surface 301 of the optical waveguide 3. The adhesive 60 may be a semi-solid sheet, but a liquid adhesive is preferably used. The liquid adhesive 60 spreads out and is easily controlled to an appropriate thickness when it is crushed in a step described later.

[0110] Next, as shown in Figure 9, the optical waveguide 3 and the main body 21 are placed on top of each other so that the first main surface 301 of the optical waveguide 3 and the first support surface 211 of the main body 21 face each other. As a result, the adhesive 60 is compressed between the first main surface 301 and the first support surface 211 and spreads into the gap between the two surfaces.

[0111] At this time, it is preferable to set the amount of adhesive 60 applied so that any excess adhesive 60 before curing protrudes from the gap between the first main surface 301 and the first support surface 211 into the steps 275 and 276. As a result, the protruding adhesive 60 forms a fillet shape due to surface tension. Subsequently, by curing the adhesive 60, an adhesive layer 61 is obtained that fixes the optical waveguide 3 and the main body 21 as shown in Figure 10.

[0112] As mentioned above, the fillet-shaped adhesive layer 61 has the function of alleviating stress concentration, and therefore reinforces the vicinity of the first end face 31 and the second end face 32 of the optical waveguide 3.

[0113] Furthermore, it is preferable that the adhesive layer 61 is distributed so as to surround the side surfaces of the optical waveguide 3 (the surfaces intersecting the X-axis and the Z-axis), as shown in Figure 11. This allows for good reinforcement of the vicinity of the first end face 31 of the optical waveguide 3.

[0114] Next, as shown in Figure 12, adhesive 60 is applied to the second main surface 302 of the optical waveguide 3 fixed to the main body 21.

[0115] Next, as shown in Figure 13, the lid 22 and the optical waveguide 3 are placed on top of each other so that the second support surface 221 of the lid 22 and the second main surface 302 of the optical waveguide 3 face each other. In other words, the optical waveguide 3 is sandwiched between the main body 21 and the lid 22. As a result, the adhesive 60 is compressed between the second support surface 221 and the second main surface 302 and spreads into the gap between the two surfaces.

[0116] At this time, it is preferable to set the amount of adhesive 60 applied so that any excess adhesive 60 before curing protrudes from the gap between the second support surface 221 and the second main surface 302 into the steps 285 and 286. As a result, the protruding adhesive 60 forms a fillet shape due to surface tension. Subsequently, by curing the adhesive 60, an adhesive layer 62 is obtained that fixes the lid 22 and the optical waveguide 3 as shown in Figure 14. This results in the adhesive body 10 shown in Figure 14.

[0117] As mentioned above, the fillet-shaped adhesive layer 62 has the function of alleviating stress concentration, and therefore reinforces the vicinity of the first end face 31 and the second end face 32 of the optical waveguide 3.

[0118] Furthermore, in bonding step S104, the optical waveguide 3 is fixed with adhesive 60 while adjusting the position of the optical waveguide 3 sandwiched between the main body 21 and the lid 22 so that the first end face 31 of the optical waveguide 3 protrudes into the first recess 23 formed in the adhesive body 10. Similarly, in bonding step S104, the optical waveguide 3 is fixed with adhesive 60 while adjusting the position of the optical waveguide 3 sandwiched between the main body 21 and the lid 22 so that the second end face 32 of the optical waveguide 3 protrudes into the second recess 24 formed in the adhesive body 10.

[0119] As mentioned above, the first end face 31 may remain within the first recess 23 or protrude outside the first recess 23. Similarly, the second end face 32 may remain within the hole 25 or protrude outside the second recess 24.

[0120] Furthermore, the assembly order in bonding step S104 is not limited to the order described above. For example, the optical waveguide 3 may be bonded to the cover 22 first, and then to the main body 21, or the main body 21 and the cover 22 may be bonded together, and then the optical waveguide 3 may be inserted into the formed hole 25 and bonded.

[0121] The lid 22 may also have through holes 226 as shown in Figure 1. These through holes 226 may have functions such as releasing air when excess adhesive 60 spreads, or irradiating energy rays to cure the adhesive 60 in the curing process S108 described later.

[0122] 2.3.Resin composition supply process In the resin composition supply step S106, as shown in Figure 15, the adhesive body 10 is positioned so that the first recess 23 faces upward U. Next, the resin composition 40 is supplied from the dispenser 45 toward the first recess 23. The supplied resin composition 40 accumulates in the first recess 23 and covers the first end face 31 of the optical waveguide 3.

[0123] Once the resin composition 40 accumulates in the first recess 23, its further spread can be suppressed. This allows the resin composition 40 to be supplied to the desired location.

[0124] Furthermore, the resin composition 40 is supplied with the first recess 23 facing upward U. The resin composition 40 accumulated in the first recess 23 is then made to protrude from the outer surface of the optical connector 2. As a result, the upper surface of the supplied resin composition 40 becomes a convex curved surface that protrudes upward due to surface tension. In particular, when the optical waveguide 3 protrudes into the first recess 23, the area near the apex of the convex curved surface is supported from below, making it easier to form a convex curved surface with the position of the optical waveguide 3 as the apex. Furthermore, by adjusting the amount of resin composition 40 supplied, the supplied resin composition 40 is supported by the inner surface of the first recess 23 and is more likely to bulge beyond the opening of the first recess 23.

[0125] In this way, a smooth convex curved surface can be formed by utilizing the surface tension of the resin composition 40 that accumulates in the first recess 23 without using a mold or the like. Then, a molded body of the resin composition 40 capable of forming the first refractive index matching portion 41 shown in Figure 3 can be formed. In other words, according to this embodiment, the first refractive index matching portion 41 can be formed inexpensively with fewer manufacturing steps.

[0126] Furthermore, the curvature of the first convex surface 411 can be controlled by the size of the first recess 23 when viewed from above U, and the amount of resin composition 40 supplied. For this reason, this process is suitable for repeatedly forming curved surfaces with the same curvature. In other words, according to this embodiment, optical wiring components 1 can be mass-produced efficiently.

[0127] 2.4.Curing process In curing step S108, although not shown in the figure, the molded resin composition 40 is subjected to a curing treatment.

[0128] The curing method is appropriately selected depending on the curing reaction of the resin composition 40, and examples include irradiation with energy rays such as light, ultraviolet rays, and electron beams, and heating. Of these, irradiation with energy rays is preferably used. In Figures 16 and 17, irradiation with ultraviolet rays (UV) is performed as the curing treatment. With irradiation with energy rays, the resin composition 40 can be cured without significantly changing its shape. Therefore, the molded resin composition 40 hardens while maintaining its shape. As a result, the first refractive index matching portion 41 having a first convex curved surface 411 with high shape accuracy can be efficiently manufactured.

[0129] 2.5.Resin composition supply process In the resin composition supply step S110, although not shown, the adhesive body 10 is positioned so that the second recess 24 faces upward U. Next, the resin composition 40 is supplied toward the second recess 24. The supplied resin composition 40 accumulates in the second recess 24 and covers the second end face 32 of the optical waveguide 3.

[0130] When the resin composition 40 accumulates in the second recess 24, its further spread can be suppressed. This allows the resin composition 40 to be supplied to the desired location.

[0131] Furthermore, by supplying the resin composition 40 with the second recess 24 facing upward U, a molded body of the resin composition 40 capable of forming the second refractive index matching portion 42 shown in Figure 3 can be formed without using a mold or the like. In addition, the curvature of the second convex curved surface 421 can be controlled by the size of the second recess 24 when viewed from above U and the amount of resin composition 40 supplied.

[0132] 2.6.Curing process In the curing step S112, the molded resin composition 40 is subjected to a curing treatment. As a result, the molded resin composition 40 hardens while maintaining its shape. Consequently, a second refractive index matching portion 42 having a second convex curved surface 421, as shown in Figure 3, is obtained. As described above, the optical wiring component 1 shown in Figure 3 is obtained.

[0133] 3. Effects achieved by the above embodiment The method for manufacturing an optical wiring component according to the above embodiment is a method for manufacturing an optical wiring component 1 comprising an optical connector 2, an optical waveguide 3, and a first refractive index matching section 41, and comprises a preparation step S102, an bonding step S104, a resin composition supply step S106, and a curing step S108. In the preparation step S102, a body 21 (first component) and a cover 22 (second component) are prepared, which, when combined with each other, can constitute an optical connector 2 having a first recess 23 formed on its outer surface. In the bonding step S104, the optical waveguide 3 is fixed to the optical connector 2 by sandwiching the optical waveguide 3 between the body 21 and the cover 22 and bonding them with adhesive 60 so that the first end face 31 of the optical waveguide 3 protrudes into the first recess 23. In the resin composition supply step S106, the first recess 23 is positioned to face upward U, and the resin composition 40 is supplied so as to cover the first end face 31 of the optical waveguide 3 and accumulate within the first recess 23. In the curing step S108, the supplied resin composition 40 is cured to form the first refractive index matching portion 41.

[0134] With this configuration, an optical wiring component 1 that achieves stable optical coupling efficiency with other optical components can be manufactured inexpensively with fewer manufacturing steps. Furthermore, since the first recess 23 accommodates the first refractive index matching portion 41, exposure of the outer edge of the first refractive index matching portion 41 can be suppressed. As a result, an optical wiring component 1 in which the first refractive index matching portion 41 is less likely to peel off can be obtained.

[0135] In the method for manufacturing optical wiring components according to the above embodiment, the curing step S108 (step for forming the first refractive index matching portion 41) may include a process of curing the resin composition 40 by irradiating the resin composition 40 with energy rays.

[0136] With this configuration, the molded resin composition 40 maintains its shape until it hardens. As a result, a first refractive index matching section 41 having a first convex curved surface 411 with high shape accuracy can be efficiently manufactured.

[0137] In the method for manufacturing optical wiring components according to the above embodiment, the resin composition supply step S106 (step of supplying the resin composition 40) may include a process of causing the resin composition 40 accumulated in the first recess 23 to protrude from the outer surface of the optical connector 2 and form a convex curved surface.

[0138] With this configuration, a smooth convex curved surface can be formed by utilizing the surface tension of the resin composition 40 without using a mold or the like. Furthermore, a molded body of the resin composition 40 capable of forming a first refractive index matching portion 41 can be formed.

[0139] In the manufacturing method of the optical wiring component according to the above embodiment, the bonding step S104 (a step of fixing the main body 21 (first component) and the cover 22 (second component) and the optical waveguide 3 with adhesive 60) may include a process in which the adhesive 60 is supplied to the space between the main body 21 and the optical waveguide 3, and between the cover 22 and the optical waveguide 3, respectively, and then crushed to cause the adhesive 60 to protrude into the first recess 23, and then the adhesive 60 is cured to fix the main body 21 and the cover 22 and the optical waveguide 3 with adhesive 60.

[0140] With this configuration, the excess adhesive 60 forms a fillet shape due to surface tension. Then, by curing the adhesive 60, a fillet-shaped adhesive layer 61 is obtained. Since the fillet-shaped adhesive layer 61 has the function of relieving stress concentration, it can reinforce the vicinity of the first end face 31 of the optical waveguide 3.

[0141] In the method for manufacturing an optical wiring component according to the above embodiment, the optical wiring component 1 may further include a second refractive index matching portion 42. In this case, the bonding step S104 (a step of fixing the main body 21 (first component) and the cover 22 (second component) and the optical waveguide 3 with adhesive 60) includes a process of sandwiching the optical waveguide 3 between the main body 21 and the cover 22 such that the second end face 32 of the optical waveguide 3, opposite to the first end face 31 of the optical waveguide 3, protrudes into a second recess 24 formed on the outer surface of the optical connector 2 by the main body 21 and the cover 22, and fixing the main body 21 and the cover 22 and the optical waveguide 3 with adhesive 60.

[0142] In this case, the process may further include a resin composition supply step S110 and a curing step S112. In the resin composition supply step S110, the resin composition 40 is supplied so that the second recess 24 faces upward, covers the second end face 32 of the optical waveguide 3, and accumulates in the second recess 24. In the curing step S112, the supplied resin composition 40 is cured to form a second refractive index matching portion 42.

[0143] With this configuration, an optical wiring component 1 capable of connecting other optical components with stable optical coupling efficiency can be manufactured inexpensively with fewer manufacturing steps. Furthermore, since the first recess 23 accommodates the first refractive index matching portion 41 and the second recess 24 accommodates the second refractive index matching portion 42, exposure of the outer edges of the first refractive index matching portion 41 and the second refractive index matching portion 42 can be suppressed. As a result, an optical wiring component 1 is obtained in which the first refractive index matching portion 41 and the second refractive index matching portion 42 are less likely to peel off.

[0144] In the manufacturing method of the optical wiring component according to the above embodiment, the process of sandwiching the optical waveguide 3 between the main body 21 (first component) and the cover 22 (second component) may be a process of accommodating the optical waveguide 3 and the cover 22 in a state where they are stacked on top of each other in a groove 217 formed in the main body 21.

[0145] With this configuration, the thickness of the adhesive layer 6 can be easily adjusted according to the load applied to the lid 22. Furthermore, the amount of adhesive used to constitute the adhesive layer 6 can be minimized.

[0146] In the manufacturing method of the optical wiring component according to the above embodiment, the process of sandwiching the optical waveguide 3 between the main body 21 (first component) and the cover 22 (second component) may be a process of housing the optical waveguide 3 in a first groove 213 formed in the main body 21, and housing the cover 22 in a second groove 215 that overlaps the first groove 213 and has a wider width than the first groove 213.

[0147] With this configuration, the cover 22 is bonded to the second groove 215, preventing it from moving further toward the optical waveguide 3. This prevents excessive pressure from being applied to the optical waveguide 3. As a result, the adhesive layer 6 is not excessively compressed by the optical waveguide 3 or the cover 22, and the thickness of the adhesive layer 6 can be precisely controlled. Therefore, for example, the adhesive layer 6 can be made slightly thicker, and stress due to thermal expansion can be absorbed by the adhesive layer 6. This reduces the stress generated in the optical waveguide 3 and suppresses the increase in transmission loss.

[0148] Although the method for manufacturing optical wiring components of the present invention has been described above based on the illustrated embodiments, the present invention is not limited to these. For example, the method for manufacturing optical wiring components of the present invention may be modified by adding any desired steps to the above embodiments. [Explanation of Symbols]

[0149] 1 Optical wiring components 2 Optical connectors 3 Optical waveguide 6 Adhesive layer 10 Adhesive body 21 Main unit 22 Lid 23 First recess 24. Second recess 25 Hole 31 First end surface 32 Second end face 40 Resin composition 41 First refractive index matching section 42 Second refractive index matching section 45 Dispensers 51 Guide pins 52 Guide pins 53 Guide pins 54 Guide pins 60 Adhesives 61 Adhesive layer 62 Adhesive layer 211 1st support surface 213 First groove 215 2nd groove 217 Groove 221 Second support surface 226 Through hole 231 Bottom 241 Bottom 261 pinholes 262 pin holes 263 pin holes 264 pin holes 275 steps 276 steps 285 steps 286 steps 301 First Main Surface 302 Second Main Surface 303 Core Layer 304 Core section 305 Side cladding section 306 First Cladding Layer 307 Second Cladding Layer 308 1st support layer 309 Second support layer 310 Laminate 311 First Inlet / Outlet Surface 321 Second Inlet / Outlet Surface 411 1st convex surface 421 Second convex surface N normal S102 Preparation process S104 Adhesion process S106 Resin composition supply process S108 Curing process S110 Resin composition supply process S112 Curing process U upward UV ultraviolet light L1 Length L2 Length d1 depth d2 depth h1 Projection height h2 projection height

Claims

1. A method for manufacturing an optical wiring component comprising an optical connector, an optical waveguide, and a first refractive index matching section, A step of preparing a first component and a second component that can constitute the optical connector, having a first recess formed on its outer surface when combined with each other, The process involves fixing the optical waveguide to the optical connector by sandwiching the optical waveguide between the first and second parts and bonding them with an adhesive, such that the first end face of the optical waveguide protrudes into the first recess, A step of supplying a resin composition such that the first recess faces upward, covers the first end face of the optical waveguide, and accumulates in the first recess, The steps include forming the first refractive index matching portion by curing the supplied resin composition, A method for manufacturing optical wiring components, characterized by having the following features.

2. The method for manufacturing an optical wiring component according to claim 1, wherein the step of forming the first refractive index matching portion includes a process of curing the resin composition by irradiating the resin composition with energy rays.

3. The method for manufacturing an optical wiring component according to claim 1 or 2, wherein the step of supplying the resin composition includes a process of causing the resin composition accumulated in the first recess to protrude from the outer surface of the optical connector and form a convex curved surface.

4. A method for manufacturing an optical wiring component according to claim 1 or 2, wherein the step of fixing the first component and the second component and the optical waveguide with the adhesive includes supplying the uncured adhesive between the first component and the optical waveguide, and between the second component and the optical waveguide, respectively, and crushing it to cause the uncured adhesive to protrude into the first recess, and then curing the uncured adhesive, thereby fixing the first component and the second component and the optical waveguide with the adhesive.

5. The optical wiring component further comprises a second refractive index matching section, The step of fixing the first component and the second component and the optical waveguide with the adhesive includes sandwiching the optical waveguide between the first component and the second component such that the second end face of the optical waveguide, opposite to the first end face, protrudes into a second recess formed on the outer surface of the optical connector by the first component and the second component, and fixing the first component and the second component and the optical waveguide with the adhesive. The process involves arranging the second recess so that it faces upward, supplying a resin composition so that it covers the second end face of the optical waveguide and accumulates within the second recess, The steps include forming the second refractive index matching portion by curing the supplied resin composition, A method for manufacturing an optical wiring component according to claim 1 or 2, further comprising:

6. The method for manufacturing an optical wiring component according to claim 1 or 2, wherein the process of sandwiching the optical waveguide between the first component and the second component is a process of housing the optical waveguide and the second component in a groove formed in the first component while they are stacked on top of each other.

7. A method for manufacturing an optical wiring component according to claim 1 or 2, wherein the process of sandwiching the optical waveguide between the first component and the second component is a process of housing the optical waveguide in a first groove formed in the first component, and a process of housing the second component in a second groove that overlaps the first groove and has a wider width than the first groove.

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