Processing equipment

Abstract

The surface roughness of a workpiece is measured without being constrained by its positional relationship with the workpiece's surface. [Solution] The processing device calculates the surface roughness by measuring the intensity distribution of scattered light from the surface of the workpiece that has been irradiated with light. In the processing device, since it is only necessary to measure the scattered light when measuring the intensity distribution of scattered light from the surface of the workpiece that has been irradiated with light, the surface roughness of the workpiece can be measured without being constrained by the positional relationship between the device and the surface of the workpiece.

Description

Technical Field

[0001] The technology of the present disclosure relates to a processing apparatus.

Background Art

[0002] In Patent Document 1, as roughness measurement by a laser confocal microscope, the roughness of the surface of a workpiece is evaluated.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, in order to detect the fine roughness of the surface of a workpiece, it is necessary to use high magnification lenses, specifically, 50x or 100x lenses. For this reason, the distance between the workpiece and the lens becomes several millimeters, and in the case of a complex shape with severe irregularities, the lens interferes with the workpiece and it is difficult to measure.

[0005] The technology of the present disclosure aims to provide a processing apparatus that can measure the roughness of the surface of a workpiece without being restricted by the positional relationship with the surface of the workpiece.

Means for Solving the Problems

[0006] In order to achieve the above object, a processing apparatus according to a first aspect of the technology of the present disclosure measures the intensity distribution of scattered light from the surface of a workpiece irradiated with light, and calculates the roughness of the surface from the measured intensity distribution.

Effects of the Invention

[0007] A first aspect of the technology of this disclosure measures the intensity distribution of scattered light from the surface of a workpiece that has been irradiated with light, and calculates the surface roughness from the measured intensity distribution. Since this measurement only requires measuring scattered light, the surface roughness of the workpiece can be measured without being constrained by the positional relationship between the measurement and the surface of the workpiece. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of an example of the processing apparatus 100 of this embodiment. [Figure 2] Figure 2 is a lower side view of an example of the processing apparatus 100. [Figure 3] Figure 3 is a lower front view of an example of the processing apparatus 100. [Figure 4A] Figure 4A is a block diagram showing an example of the electrical system of the processing apparatus 100. [Figure 4B] Figure 4B shows an example of how the areas of the workpiece 18 other than the irradiated area P are masked with a black, non-glossy sheet S. [Figure 5] Figure 5 shows an example of the scattering angle θs of scattered light SL from the irradiated area P of workpiece 18. [Figure 6] Figure 6 shows an example of the range of angles θo in which the detector 34 can detect scattered light from the irradiated area P of the workpiece 18 by moving the detector 34 along the rail 36. [Figure 7] Figure 7 is a schematic side view of an example of a processing apparatus for the first modified example. [Figure 8] Figure 8 is a schematic cross-sectional view of an example of one of the measuring units 20AH of the processing apparatus of the first modified example. [Modes for carrying out the invention]

[0009] [Embodiment] Embodiments of the technology of this disclosure will be described below with reference to the drawings.

[0010] (composition) FIG. 1 is a perspective view of an example of the processing apparatus 100 of the present embodiment. FIG. 2 is a bottom side view of an example of the processing apparatus 100. FIG. 3 is a bottom front view of an example of the processing apparatus 100.

[0011] In the present embodiment, as the processing apparatus 100, a grinding apparatus that grinds the surface of a workpiece 18 whose processed surface is a flat surface will be described.

[0012] As shown in FIG. 1, the processing apparatus 100 includes a movable table 12, a table guide mechanism 11, a grindstone head 13, a grindstone 14, a grindstone head guide mechanism 15, support columns 16, 17, and measurement units 20A, 20B. The grindstone 14 is an example of the "processing tool" of the technology of the present disclosure.

[0013] The movable table 12 reciprocates in one direction (X direction) in the horizontal plane by the table guide mechanism 11. The workpiece 18 to be ground is fixed on the movable table 12 by a fixing portion (not shown).

[0014] The grindstone head 13 is supported by a grindstone head guide mechanism 15 whose both sides are supported by support columns 16 and 17, and is supported so as to be movable up and down in the Z direction above the workpiece 18 held on the movable table 12 along a Z-direction rail (not shown) in the grindstone head guide mechanism 15.

[0015] The grindstone head 13 is movable in a direction (Y direction) orthogonal to the moving direction (X direction) of the movable table 12 along a Y-direction rail (not shown) in the grindstone head guide mechanism 15 by the grindstone head guide mechanism 15.

[0016] A grinding wheel 14 is attached to the lower end of a grinding wheel head 13. The grinding wheel 14 has a cylindrical shape, and its central axis 14C is parallel to the Y direction. The grinding wheel head 13 is lowered to such an extent that the grinding wheel 14 contacts the workpiece 18, and the workpiece 18 is moved in the X direction while the grinding wheel 14 is rotated, whereby the workpiece 18 is ground. By moving the grinding wheel head 13 in the Y direction and repeating the same process, the entire upper surface (machined surface) of the workpiece 18 can be ground. A procedure of bringing the grinding wheel 14 into contact with the workpiece 18 and moving it in the X direction from one end to the other end of the workpiece 18 is referred to as a "pass".

[0017] As shown in FIGS. 1 and 2, the processing apparatus 100 includes measurement units 20A and 20B that measure scattered light for calculating the roughness of the workpiece 18 on both sides in the moving direction of the workpiece 18 by the movable table 12 of the grinding wheel head 13 and the grinding wheel 14. As shown in FIG. 2, when the measurement units 20A and 20B measure scattered light, the workpiece 18 moves in the -X direction with respect to the measurement units 20A and 20B. The measurement unit 20A measures scattered light from the workpiece 18 before the grinding wheel 14 grinds the workpiece 18, and the measurement unit 20B measures scattered light from the workpiece 18 after the grinding wheel 14 grinds the workpiece 18. The grinding wheel head 13 is provided with a nozzle 24 that supplies lubricating oil or cooling water supplied through a pipe 22 to the surface of the workpiece 18 between the measurement unit 20A and the grinding wheel 14. The grinding wheel head 13 is provided with a wiper 28 supported by a support column 26 that removes the lubricating oil or cooling water on the surface of the workpiece 18 between the grinding wheel 14 and the measurement unit 20B. The measurement unit 20A measures scattered light from the workpiece 18 before the lubricating oil or cooling water is supplied and before the grinding wheel 14 grinds the workpiece 18, and the measurement unit 20B measures scattered light from the workpiece 18 after the lubricating oil or cooling water is removed and after the grinding wheel 14 grinds the workpiece 18.

[0018] Since the measurement units 20A and 20B have the same configuration, the configuration of measurement unit 20A will be described, and the description of measurement unit 20B will be omitted. As shown in Figure 3, the measurement unit 20A includes a plurality of light irradiation receiving units 30n1 to 30n15 in a range in the Y direction that includes the width of the grinding wheel head 13 and is longer than the said width of the grinding wheel head 13. Among the plurality of light irradiation receiving units 30n1 to 30n15, light irradiation receiving units 30n10 to 30n13 are located on the front side in the X direction of the grinding wheel head 13, and light irradiation receiving units 30n1 to 30n9, 30n14, and 30n15 are located on both sides of the front side in the X direction of the grinding wheel head 13.

[0019] Figure 4A is a block diagram showing an example of the electrical system of the processing apparatus 100. As shown in Figure 4A, the processing apparatus 100 includes a plurality of light irradiation receiving units 30n1 to 30n15, a recording device (i.e., a logger) 42, and a control device 50.

[0020] Since the multiple light irradiation receiving units 30n1 to 30n15 have the same configuration, the configuration of one light irradiation receiving unit 30n, which represents the multiple light irradiation receiving units 30n1 to 30n15, will be described, and the descriptions of the other light irradiation receiving units will be omitted. The light irradiation receiving unit 30n includes a light source 32 that irradiates the workpiece 18 with light at an incident angle of 45°, a detector 34 that detects scattered light SL from the irradiated area P of the workpiece 18, a moving mechanism (36, 38) that moves the detector 34 in a predetermined direction, and a drive device 40 that drives the motor 38 in the moving mechanism (36, 38).

[0021] The light source 32 is, for example, a laser light source 32 that emits laser light LL. The light source 32 is not limited to a laser light source 32, but can be any light source with a single wavelength and directionality. The longer the wavelength, the larger the divergence angle of the scattered light, and the shorter the wavelength, the smaller the divergence angle. In the workpiece of this embodiment, if the required roughness is in the range of, for example, 0.1 μm ≤ Ra ≤ 1.0 μm, visible light (wavelength 360 nm to 830 nm) is appropriate. Ra (arithmetic mean roughness) is one of the parameters for evaluating the surface roughness of the workpiece 18, and is the average of the absolute heights of the surface irregularities. Specifically, it is the average of the absolute heights of the surface irregularities from the reference plane.

[0022] Figure 4B shows an example of how the workpiece 18 is masked with a black, non-glossy sheet S, except for the area P to be irradiated. As shown in Figure 4B, when the workpiece 18 is masked with a black, non-glossy sheet S, the light source 32 may be a projector that emits a single color (for example, red, green, or blue is preferable).

[0023] When the light source 32 is a laser light source 32, the detector 34 is a PIN photodiode. A PIN photodiode is a semiconductor device used for light detection, and has a structure consisting of a P-type semiconductor (P-layer), an insulating layer (I-layer), and an N-type semiconductor (N-layer).

[0024] The moving mechanism (36, 38) includes a rail 36 for moving the detector 34 in a predetermined direction, and a motor 38 for moving the detector 34 along the rail. The moving mechanism (36, 38) is, for example, a rack and pinion mechanism.

[0025] Figure 5 shows an example of the scattering angle θs of scattered light SL from the irradiated area P of the workpiece 18. Figure 6 shows an example of the angle θo within the range in which the detector 34 can detect scattered light from the irradiated area P of the workpiece 18 as the detector 34 is moved along the rail 36.

[0026] As shown in Figure 5, scattered light SL from the irradiated area P on the surface of the workpiece 18 is scattered at a scattering angle θs on the plane where the detector 34 moves along the rail 36. Note that reflected light is omitted in Figure 5.

[0027] As will be described later, in this embodiment, a parameter indicating the roughness of the irradiated area P on the surface of the workpiece 18 is calculated based on the light intensity distribution of each scattered light on the surface, according to the Generalized Harvey-Shack theory. Therefore, in order to measure the light intensity distribution of each scattered light SL on the surface using the detector 34, the detector 34 moves a distance d so that the scattering range of the scattered light from the irradiated area P on the surface (determined by the scattering angle θs) can be measured. The angle θo is determined from the position of the irradiated area P, the position of the rail 36, and the distance d by which the detector 34 moves. More specifically, θo is obtained from the following equation using the distance l between the irradiated area P and the detector 34 at each predetermined position of the moving detector 34, and the distance d by which the detector 34 moves. θo = 2sin -1 (d / 2√((d 2 +4l 2 ) / 2))) As described above, a parameter indicating the roughness of the irradiated area P on the surface of the workpiece 18 is calculated based on the light intensity distribution of each scattered light. For this reason, the detector 34 needs to be able to measure each scattered light within a range determined by the scattering angle θs from the irradiated area P on the surface. Specifically, an angle θo is determined that defines the range on the surface in which the detector 34 can move and measure each scattered light. The angle θo is an angle relative to the position of the irradiated area P. Therefore, the scattering angle θs must be smaller than the angle θo, which is based on the position of the irradiated area P that defines the range in which the detector 34 can move and measure scattered light. In other words, θs and θo must have the following relationship. |θs|<|θo| (1)

[0028] The recording device (i.e., logger) 42 is a device that records the intensity distribution of scattered light from each detector 34 of a plurality of light irradiation receiving units 30n1 to 30n15.

[0029] The control device 50 is composed of a computer. The control device 50 is connected to a motor (not shown) that drives the table guide mechanism 11, the grinding wheel head guide mechanism 15, and the grinding wheel 14. The control device 50 is also connected to multiple light irradiation receiving units 30n1 to 30n15, each with a laser light source 32, a detector 34, and a drive device 40.

[0030] The control device 50 controls the table guide mechanism 11, the grinding wheel head guide mechanism 15, and a motor (not shown) that drives the grinding wheel 14, so that the entire upper surface (workpiece surface) of the workpiece 18 is ground by the grinding wheel 14.

[0031] When grinding the upper surface of the workpiece 18, the control device 50 controls the laser light sources 32 of the multiple light irradiation receiving units 30n1 to 30n15 and the drive device 40 to measure the scattered light from each irradiated area P on the surface of the workpiece 18 using the detectors 34 of the multiple light irradiation receiving units 30n1 to 30n15.

[0032] The scattered light from each irradiated area P on the surface of the workpiece 18, measured by the detectors 34 of each of the multiple light irradiation receiving units 30n1 to 30n15, is recorded (i.e., measured) by the recording device 42. The recording device 42 receives a trigger signal from the drive devices 40 of each of the multiple light irradiation receiving units 30n1 to 30n15 when the acceleration of the detection unit 34 is completed and the detection unit 34 enters constant-speed movement. The recording device 42 starts recording the scattered light when it receives the trigger signal and continues recording the scattered light for a time calculated from the constant-speed movement speed and distance d, and stops recording the scattered light when that time ends.

[0033] The control device 50 removes noise from the intensity portion of the scattered light from each detector 34 of the multiple light irradiation receiving units 30n1 to 30n15, and corrects the intensity of the scattered light, taking into account that the distance from the irradiated area P changes when the detector 34 moves.

[0034] The control device 50 calculates parameters indicating the surface roughness of the workpiece 18 according to the Generalized Harvey-Shack theory from the intensity portions of scattered light from each detector 34 of the multiple light irradiation receiving units 30n1 to 30n15, which are recorded (i.e., measured) by the recording device 42. The parameters include, firstly, the average height of the surface irregularities of the workpiece 18 (e.g., Ra (arithmetic mean roughness of height)), and secondly, the variation in the height of the surface irregularities of the workpiece 18 (e.g., Rq (root mean square of height)).

[0035] (action) First, the grinding of the workpiece 18 by the grinding wheel 14 will be explained. As described above, the control device 50 controls the table guide mechanism 11, the grinding wheel head guide mechanism 15, and a motor (not shown) that drives the grinding wheel 14, thereby rotating the grinding wheel 14 and moving the workpiece 18 in the X direction, and grinding the workpiece 18 in the X direction. During this grinding, the nozzle 24 supplies lubricating oil or cooling water supplied via the piping 22 to the part of the workpiece 18 to be ground before grinding by the grinding wheel 14. The grinding wheel head 13 is moved in the Y direction and the same process is repeated. This grinds the entire upper surface (worked surface) of the workpiece 18.

[0036] When grinding the upper surface of the workpiece 18, the control device 50 controls the laser light sources 32 of the multiple light irradiation receiving units 30n1 to 30n15 and the drive device 40 to measure the scattered light from each irradiated area P on the surface of the workpiece 18 using the detectors 34 of the multiple light irradiation receiving units 30n1 to 30n15.

[0037] In each of the multiple light irradiation receiving units 30n1 to 30n15, the drive unit 40 moves the detector 34 a distance d, and the detection unit 34 detects the intensity of each scattered light. As described above, the detection unit 34 detects the intensity of each scattered light while moving the detector 34 a distance d, so the detection unit 34 can detect the intensity of each scattered light scattered from the irradiated area P.

[0038] As shown in Figure 2, each detection unit 34 of the multiple light irradiation receiving units 30n10 to 30n13 of the measurement unit 20A measures the scattered light from the workpiece 18 before lubricating oil or cooling water is supplied and before the grinding wheel 14 grinds the workpiece 18.

[0039] Each detection unit 34 of the multiple light irradiation receiving units 30n10 to 30n13 of the measurement unit 20B measures the scattered light from the workpiece 18 after the lubricating oil or cooling water has been removed by the wiper 28 and the grinding wheel 14 has ground the workpiece 18.

[0040] The light irradiation receiving units 30n1~30n9, 30n14, and 30n15 of the measurement unit 20A and measurement unit 20B measure scattered light from the workpiece 18 on both the front and rear sides in the X direction of the grinding wheel head 13.

[0041] The scattered light from each irradiated area P on the surface of the workpiece 18, measured by the detectors 34 of multiple light irradiation receiving units 30n1 to 30n15, is recorded by the recording device 42.

[0042] The control device 50 calculates parameters indicating the surface roughness of the workpiece 18 according to the Generalized Harvey-Shack theory from the intensity portions of scattered light from each detector 34 of the multiple light irradiation receiving units 30n1 to 30n15 recorded by the recording device 42. The parameters include, firstly, the average height of the surface irregularities of the workpiece 18 (e.g., Ra (arithmetic mean roughness of height)) and secondly, the variation in the height of the surface irregularities of the workpiece 18 (e.g., Rq (root mean square of height)).

[0043] (effect) As described above, in this embodiment, the processing apparatus 100 for grinding the surface of the workpiece 18 calculates a parameter indicating the surface roughness of the workpiece 18 from the intensity portion of the scattered light at each irradiated area P on the surface of the workpiece 18. Therefore, in this embodiment, the surface roughness of the workpiece 18 can be measured without being constrained by the positional relationship between the surface of the workpiece 18 and the detection unit 34. Accordingly, in this embodiment, even if the position of the detection unit 34 is closer than the position of the detection unit in the conventional technology, the surface roughness of the workpiece 18 can be measured without interference with the surface of the workpiece 18. In this embodiment, the surface roughness of the workpiece 18 can be measured while grinding the workpiece 18.

[0044] In this embodiment, the scattering angle θs is smaller than the angle θo, which is based on the position of the irradiated area P that defines the range in which the detector 34 can move and measure scattered light. Therefore, in this embodiment, all scattered light scattered at the scattering angle θs is detected, making it possible to accurately calculate parameters indicating the surface roughness of the workpiece 18.

[0045] In this embodiment, the processing apparatus 100 includes a measuring unit 20A that measures scattered light from the workpiece 18 before lubricating oil or cooling water is supplied and before the grinding wheel 14 grinds the workpiece 18. Therefore, this embodiment allows for the detection of surface defects of the workpiece 18 before lubricating oil or cooling water is supplied.

[0046] In this embodiment, the processing apparatus 100 includes a measuring unit 20B that measures the scattered light from the workpiece 18 after the grinding wheel 14 has ground the workpiece 18. Therefore, in this embodiment, the accuracy (i.e., quality) of the grinding of the workpiece 18 by the grinding wheel 14 can be determined. Furthermore, if the surface of the workpiece 18 is ground without the supply of lubricating oil or cooling water, the surface of the workpiece 18 will become hotter, an oxide film will form, or the surface will become rougher. So-called burning occurs on the surface of the workpiece 18. Therefore, if an oxide film is formed and the scattered light distribution is generally smaller than the expected distribution, or if the surface roughness of the workpiece 18 is greater than the expected roughness, it can be determined that the supply of lubricating oil or cooling water is not good, and that there is a malfunction in the lubricating oil or cooling water supply device.

[0047] In this embodiment, the processing apparatus 100 includes a measuring unit 20A and a measuring unit 20B. Therefore, in this embodiment, if it is found that the surface roughness of the workpiece 18 before and after grinding is within a predetermined range, it is found that the grinding function of the grinding wheel 14 is poor, and it is found that the rigidity or strength of the grinding wheel 14 is not appropriate for the surface of the workpiece 18.

[0048] [Differentiation] Next, various modifications of this embodiment will be described. Since each modification is substantially the same as the embodiment described above, we will mainly describe the differences.

[0049] (First variation) (composition) The processing apparatus 100 in the above-described embodiment is a grinding apparatus that grinds the surface of a workpiece 18 whose surface to be processed is flat. The technology of this disclosure is not limited thereto.

[0050] Figure 7 is a schematic side view of an example of a processing apparatus of the first modified example. Figure 8 is a schematic cross-sectional view of an example of one of the measuring units 20AH of the processing apparatus of the first modified example.

[0051] As shown in Figures 7 and 8, the processing apparatus of the first modified example is a polishing apparatus for polishing the surface (curved surface) of a workpiece 18H such as a round bar or screw.

[0052] The processing apparatus of the first modified example comprises a tape polishing head 14H equipped with sandpaper for polishing the surface (curved surface) of a workpiece 18H, a measuring unit 20AH for measuring scattered light from the workpiece 18H before lubricating oil or cooling water is supplied and before the sandpaper polishes the workpiece 18H, and a measuring unit 20BH for measuring scattered light from the workpiece 18H after the lubricating oil or cooling water has been removed and after the sandpaper has polished the workpiece 18H. Note that the nozzle 24 and wiper 28, etc., are omitted in Figures 7 and 8. The tape polishing head 14H is an example of a "processing tool" of the technology of this disclosure.

[0053] Measurement unit 20AH and measurement unit 20BH are fixed together.

[0054] The workpiece 18H rotates clockwise when viewed from the right side of Figure 7 (front view in Figure 8) by a rotation mechanism (not shown), and moves from the right side of Figure 7 to the left side (from the front view in Figure 8 towards the back) by a moving mechanism (not shown).

[0055] The measurement units 20AH and 20BH have the same configuration as the measurement units 20A and 20B in the previously described embodiment, so their description will be omitted. In the first modified example, the multiple light irradiation receiving units 30n1 to 30n15 of the measurement units 20AH and 20BH are arranged in the longitudinal direction (axial direction) of the workpiece 18H. The measurement units 20AH and 20BH may each be equipped with a single light irradiation receiving unit.

[0056] (action) During polishing, the workpiece 18H rotates and moves from the right side to the left side in Figure 7 (from the front to the back in Figure 8). The leading edge of the workpiece 18H in the direction of movement is first positioned at the measuring unit 20AH, then moves under the tape polishing head 13H, and the rotating surface is polished by the sandpaper. The polished portion then moves under the measuring unit 20BH.

[0057] The measuring unit 20AH measures the scattered light from the workpiece 18H before lubricating oil or cooling water is supplied and before the sandpaper polishes the workpiece 18H.

[0058] The measuring unit 20BH measures the scattered light from the workpiece 18H after the lubricating oil or cooling water has been removed and the sandpaper has polished the workpiece 18H.

[0059] The control device 50 calculates parameters (Ra, Rq) indicating the surface roughness of the workpiece 18 according to the Generalized Harvey-Shack theory from the intensity portions of scattered light from each detector 34 of the multiple light irradiation receiving units 30n1 to 30n15 recorded by the recording device 42.

[0060] (effect) The first modified example has the same configuration as the embodiment described above, and therefore achieves the same effects as the embodiment described above.

[0061] (Other variations) In the embodiments described above and the first modification, the detection unit 34 moves in a linear direction, but the technology of this disclosure is not limited thereto, and it may move along a circumference centered on the irradiated area P. As a result, the detection unit moves while maintaining an equidistant distance from the irradiated area P, making it unnecessary to correct the intensity of scattered light in consideration of the fluctuation in distance.

[0062] In the embodiments and modifications described above, the detection unit 34 moves in a single straight line, but the technology of this disclosure is not limited thereto. The detector may also have two rails (a first rail on which the detector 32 is arranged, and a second rail whose center overlaps with the center of the first rail and which is perpendicular to the direction of the first rail for moving the first rail), or a detector that has multiple detection elements arranged in two dimensions. In this case, the detector that moves in two dimensions, or the multiple detection elements, are arranged such that the scattering angle θs is smaller than the angle based on the position of the irradiated area P that defines the range in which the scattered light can be measured by the detector.

[0063] The examples described above change the positions of the workpiece 18 and the measuring units 20A and 20B, and the positions of the workpiece 18H and the measuring units 20AH and 20BH. However, the technology of this disclosure is not limited to this, and the operator may move the measuring units 20A, 20B, 20AH, and 20BH.

[0064] Each of the above-described examples calculates a parameter indicating the roughness of the irradiated area P on the surface of the workpiece 18 based on the light intensity distribution of each scattered light on the surface, according to the Generalized Harvey-Shack theory. The techniques of this disclosure are not limited thereto. For example, the normal to the surface of the irradiated area P may be detected based on the light intensity distribution of each scattered light, the surface irregularities of the workpiece 18 may be calculated geometrically from the detected normal, and the roughness of the irradiated area P on the surface of the workpiece 18, specifically the average height of the surface irregularities of the workpiece 18, and secondly, the variation in the height of the surface irregularities of the workpiece 18 may be calculated from the surface irregularities of the workpiece 18. [Explanation of Symbols]

[0065] 100 Processing equipment 11 Table guidance mechanism 12 movable tables 13 Sharpening stone head 14 whetstones 15. Grinding wheel head guide mechanism 16, 17 Support column 20A, 20B Measurement section 30n1~30n15 Light irradiation receiver 32 light source 34 detectors 36 rails 38 Motors 42 Recording device 50 Control device

Claims

1. A processing device that measures the intensity distribution of scattered light from the surface of a workpiece irradiated with light, and calculates the surface roughness from the measured intensity distribution.

2. The scattering angle of the scattered light from the irradiated portion of the surface is smaller than the angle that defines the detection range of the detection unit for measuring each scattered light from the surface of the workpiece, with respect to the irradiated portion. The processing apparatus according to claim 1.

3. A processing tool for processing the surface of the workpiece, A measuring unit that measures scattered light from the surface of the workpiece, Equipped with, The measuring unit is provided at least one position on the surface before or after the workpiece position by the workpiece tool. The processing apparatus according to claim 1 or claim 2.

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