Electronic device and method for assembling the electronic device

Abstract

To provide an electronic device that can efficiently dissipate heat generated from semiconductors, while also being small and lightweight. [Solution] The electronic device comprises a housing 20, a substrate 31, a semiconductor 33, a heat sink fin 50, a first protrusion 51, and a second recess 233. The first protrusion 51 is provided on the heat sink fin. The second recess is installed at a position on the housing corresponding to the first protrusion, and the surface of the second recess is spaced apart from the surface of the first protrusion and fits onto the first protrusion.

Description

Technical Field

[0001] The present disclosure relates to an electronic device and an assembly method thereof.

Background Art

[0002] The electronic component unit described in Patent Document 1 includes a substrate, a semiconductor package mounted on the surface of the substrate, a heat sink having a pressing plate installed on the semiconductor package, and a reinforcing plate disposed on the back surface of the substrate. In the above electronic component unit, the semiconductor package is pressed and fixed to the heat sink by fastening the corner portion of the reinforcing plate and the corner portion of the pressing plate with a fastener.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above electronic component unit, since the corners are partially fastened with fasteners, the semiconductor package and the heat sink are bent, and the distance between the semiconductor package and the heat sink cannot be made uniform. In addition, since electronic components cannot be mounted on the surface of the substrate in the region where the fasteners that fasten the semiconductor package and the heat sink together with the substrate contact, there is a problem that the electronic component unit becomes large-sized.

[0005] One aspect of the present disclosure provides an electronic device that can efficiently dissipate heat generated from a semiconductor and is small-sized and lightweight.

Means for Solving the Problems

[0006] An electronic device in one aspect of the present disclosure comprises a housing (20), a substrate (31), a semiconductor (33), a heat sink fin (50), a first protrusion (51) or a first recess (51), and a second recess (233) or a second protrusion (233). The housing has an opening (25) formed therein. The substrate is disposed inside the housing. The semiconductor is mounted on the substrate and disposed inside the housing. The heat sink fin is located above the semiconductor inside the housing, with a portion of it exposed through the opening. The first protrusion (51) or first recess is provided on the heat sink fin. The second recess is located in the housing position corresponding to the first protrusion, and the surface of the second recess is spaced apart from the surface of the first protrusion and fits into the first protrusion. The second protrusion is provided at a position on the housing corresponding to the first recess, and the surface of the second protrusion is spaced apart from the surface of the first recess so as to fit into the first recess.

[0007] According to one aspect of this disclosure, since the substrate on which the semiconductor is mounted and the heat sink fins are assembled to the housing without using a pressing member to press the semiconductor against the heat sink fins, the substrate does not flex, and the spacing between the semiconductor and the heat sink fins becomes uniform. Furthermore, because no pressing member is used, the electronic device can be made smaller and lighter. In addition, the assembly tolerances between the heat sink fins, semiconductor, substrate and housing are absorbed in the gap between the convex and concave portions, and the spacing between the semiconductor and the heat sink fins is maintained uniformly. Therefore, heat generated from the semiconductor can be efficiently dissipated, and the electronic device can be made smaller and lighter.

[0008] A method for assembling an electronic device in another aspect of the present disclosure involves attaching a heat sink fin (50) to a semiconductor (33), mounting the semiconductor with the heat sink fin attached to a substrate (31), inserting the substrate with the semiconductor mounted into a housing (20) and placing it inside the housing, exposing a portion of the heat sink fin from an opening (25) in the housing, and (i) fitting the first protrusion (51) of the heat sink fin into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) fitting the first recess of the heat sink fin into the second protrusion (233) such that the surface of the first recess is spaced apart from the surface of the second protrusion (233) of the housing.

[0009] According to another aspect of this disclosure, the electronic device can be assembled by attaching heat sinks to a semiconductor, mounting the semiconductor with the heat sinks attached to a substrate, inserting the substrate into a housing, and fitting the first convex portion into the second concave portion, or the first concave portion into the second convex portion.

[0010] A method for assembling an electronic device in yet another aspect of the present disclosure involves mounting a semiconductor (33) onto a substrate (31), attaching a heat sink fin (50) to the semiconductor mounted on the substrate, inserting the substrate with the semiconductor mounted onto it into a housing (20) and placing it inside the housing, exposing a portion of the heat sink fin from an opening (25) in the housing, and (i) fitting the first protrusion (51) of the heat sink fin into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) fitting the first recess (51) of the heat sink fin into the second protrusion (233) such that the surface of the first recess is spaced apart from the surface of the second protrusion of the housing.

[0011] According to yet another aspect of this disclosure, the electronic device can be assembled by mounting a semiconductor on a substrate, attaching heat sinks to the semiconductor mounted on the substrate, inserting the substrate into a housing, and fitting the first convex portion with the second concave portion, or the first concave portion with the second convex portion. [Brief explanation of the drawing]

[0012] [Figure 1] This figure schematically shows the vertical cross-section of the electronic device according to the first and second embodiments. [Figure 2] Figure 2A is a schematic diagram showing the heat dissipation fins of the electronic device according to the first and second embodiments. Figure 2B is a schematic diagram showing the housing according to the first and second embodiments. [Figure 3] Figures 3A to 3D schematically show the fitting of the recessed portion of the housing and the convex portion of the heat dissipation fin according to the first and second embodiments. [Figure 4] This diagram schematically shows the fitting of a protrusion on the housing and a recess on the heat dissipation fin according to another embodiment. [Figure 5]This diagram schematically illustrates the assembly method of the electronic device according to the first embodiment. [Figure 6] This figure schematically illustrates the assembly method of the electronic device according to the second embodiment. [Modes for carrying out the invention]

[0013] (First Embodiment) <1-1. Configuration of Electronic Devices> Referring to Figures 1 and 2, the configuration of the electronic device 10 according to this embodiment will be described. The electronic device 10 comprises a housing 20, a substrate 31, a semiconductor 33, a heat dissipation fin 50, a lid 200, a first fitting portion 51, a second fitting portion 233, an adhesive layer 60, and a sealing material 70.

[0014] The housing 20 is made of a metal material such as aluminum, aluminum alloy, copper, or copper alloy. The housing 20 has a rectangular parallelepiped shape with an open bottom. The housing 20 comprises four side surfaces 21, a top surface 23, and an intermediate surface 22. The top surface 23 has an inner surface 231 facing inward from the housing 20 and an outer surface 232 facing outward from the housing 20. A rectangular opening 25 is formed on the top surface 23. The intermediate surface 22 is located near the middle of the height of the housing 20. The intermediate surface 22 is parallel to the top surface 23 and connected to the four side surfaces 21. A rectangular opening 26 is formed on the intermediate surface 22. The opening 26 is larger than the opening 25.

[0015] The lid 200 is a plate-shaped component made of the same metal material as the housing 20. The lid 200 is attached to the lower ends 211 of the four sides 21. The substrate 31 is housed inside the housing 20. The substrate 31 is larger than the opening 26 and is mounted on the intermediate surface 22. In this embodiment, the substrate 31 is screwed to the intermediate surface 22.

[0016] The semiconductor 33 includes an interposer 333 and a plurality of chips 331, 332. The plurality of chips 331, 332 are mounted on the interposer 333. The interposer 333 includes wirings for electrically connecting between the plurality of chips 331, 332, wirings for electrically connecting each of the plurality of chips 331, 332 and the substrate 31, and the like. A plurality of solder balls 32 are arranged between the interposer 333 and the substrate 31. The plurality of solder balls 32 are arranged in a grid pattern. The interposer 333 is electrically connected to the substrate 31 via the plurality of solder balls 32.

[0017] The adhesive layer 60 is thinly and uniformly formed on the upper surface of the semiconductor 33, that is, on the upper surfaces of the plurality of chips 331, 332. The adhesive layer 60 is, for example, a silicon resin or an epoxy resin. A heat dissipation fin 50 described later is adhered to the adhesive layer 60. The adhesive layer 60 has a thickness X1 and an elastic modulus Y1.

[0018] When the adhesive layer 60 is a silicon resin, the heat resistance of the heat dissipation path from the semiconductor 33 to the heat dissipation fin 50 can be enhanced. When the adhesive layer 60 is a silicon resin or an epoxy resin mixed with a filler having a high thermal conductivity, the heat dissipation property of the heat dissipation path can be further enhanced.

[0019] The heat dissipation fin 50 is formed of a metal material such as aluminum, an aluminum alloy, copper, or a copper alloy. In the present embodiment, the heat dissipation fin 50 is formed of the same metal material as the housing 20. Thereby, under the environment of a thermal cycle, the thermal stress generated from the difference in the thermal expansion coefficients of the housing 20 and the heat dissipation fin 50 is reduced. The thermal cycle here is a change in which the housing 20, the heat dissipation fin 50, the semiconductor 33, and the substrate 31 are heated and expanded and then cooled and returned to their original states due to the heat generated from the semiconductor 33 described later.

[0020] The heat radiating fin 50 has a plate-like base 53 and a plurality of fins 52. The base 53 is larger than the opening 26. That is, the planar area of the base 53 is larger than the opening area of the opening 26. The base 53 has a first surface 531 and a second surface 532 on the opposite side of the first surface 531. When the heat radiating fin 50 is attached to the housing 20, the first surface 531 faces the semiconductor 33, and the second surface 532 faces the outside of the housing 20. The plurality of fins 52 are connected to the second surface 532 perpendicular to the base 53. For example, the plurality of fins 52 may be arranged at equal intervals.

[0021] The heat radiating fin 50 is disposed above the semiconductor 33 (i.e., above the plurality of chips 311, 312). Specifically, the heat radiating fin 50 is disposed such that the first surface 531 contacts the adhesive layer 60 disposed on the upper surface of the semiconductor 33. Thereby, the first surface 531 is joined to the upper surface of the semiconductor 33 via the adhesive layer 60.

[0022] In another embodiment, the housing 20 may be formed of a metal material different from the heat radiating fin 50. Also, in another embodiment, the electronic device 10 may not include the adhesive layer 60 disposed between the semiconductor 33 and the heat radiating fin 50. In this case, the heat radiating fin 50 may be placed such that the first surface 531 contacts the upper surface of the semiconductor 33.

[0023] The first fitting portion 51 is provided on the heat radiating fin 50. Specifically, as shown in FIG. 2A, the first fitting portion 51 is provided outside the plurality of fins 52 so as to surround the plurality of fins 52 on the second surface 532 of the base 53. Note that FIG. 2A shows the shape of the plurality of fins 52 simplified as a single rectangular parallelepiped. Also, in FIG. 2B, only the vicinity of the opening 25 of the housing 20 is cut out and shown, and the outer region thereof is omitted.

[0024] In this embodiment, the first fitting portion 51 is formed as a protrusion projecting from the second surface 532. The first fitting portion 51 protrudes in the same direction as the plurality of fins 52, but the amount of protrusion is smaller than that of the plurality of fins 52. In this embodiment, the first fitting portion 51 corresponds to the first protrusion of the present disclosure.

[0025] Furthermore, in this embodiment, the first mating portion 51 is formed integrally with the heat dissipation fin 50. For example, the heat dissipation fin 50 and the first mating portion 51 are formed integrally in a single mold. This reduces the number of parts in the electronic device 10.

[0026] In another embodiment, as shown in Figure 4, the first fitting portion 51 may be formed as a recess that extends from the second surface 532 toward the first surface 531. Furthermore, in yet another embodiment, the first fitting portion 51 may be formed separately from the heat dissipation fin 50 and attached to the second surface 532 of the heat dissipation fin 50 by adhesive, brazing, welding, or the like.

[0027] The second mating portion 233 is provided at a position on the housing 20 corresponding to the first mating portion 51 when the heat dissipation fins 50 are joined or placed on the semiconductor 33. Specifically, as shown in Figure 2B, the second mating portion 233 is provided on the inner surface 231 of the upper surface 23, outside the opening 25, so as to surround the opening 25.

[0028] In this embodiment, the second fitting portion 233 is formed as a recess corresponding to the first fitting portion 51. The length of the protrusion of the first fitting portion 51 is greater than the depth of the recess of the second fitting portion 233. In this embodiment, the second fitting portion 233 corresponds to the second recess of the present disclosure.

[0029] Furthermore, in this embodiment, the second fitting portion 233 is formed integrally with the housing 20. For example, the housing 20 and the second fitting portion 233 are formed integrally using a single mold. This reduces the number of parts in the electronic device 10.

[0030] In another embodiment, as shown in Figure 4, if the first fitting portion 51 is formed as a recess, the second fitting portion 233 may be formed as a protrusion that extends from the inner surface 231 inward to the housing 20. Furthermore, in yet another embodiment, the second fitting portion 233 may be formed separately from the housing 20 and attached to the inner surface 231 of the housing 20 by adhesive bonding, brazing, welding, or the like.

[0031] With the heat dissipation fins 50 bonded to or mounted on the semiconductor 33, the first fitting portion 51 fits into the second fitting portion 233. That is, the convex portion of the first fitting portion 51 fits into the concave portion of the second fitting portion 233. The first fitting portion 51 fits into the second fitting portion 233 with its surface spaced apart from the surface of the second fitting portion 233. That is, the surface of the convex portion is spaced apart from the surface of the concave portion, and a gap exists between the surface of the convex portion and the surface of the concave portion when the first fitting portion 51 fits into the second fitting portion 233. Also, the first fitting portion 51 fits into the second fitting portion 233 with its second surface 532 spaced apart from the inner surface 231. In other words, the heat dissipation fins 50 are assembled to the housing 20 without contacting the housing 20.

[0032] In another embodiment, even when the first fitting portion 51 is formed as a recess and the second fitting portion 233 is formed as a convex portion, the first fitting portion 51 fits into the second fitting portion 233 with the surface of the recess separated from the surface of the convex portion.

[0033] With the heat dissipation fins 50 assembled to the housing 20, the base 53 is located inside the housing 20, and the multiple fins 52 are exposed to the outside through the opening 25. Heat generated from the semiconductor 33 is released to the outside from the heat dissipation fins 50 via the adhesive layer 60, or released to the outside from the housing 20 via the adhesive layer 60 and the heat dissipation fins 50.

[0034] The sealing material 70 is placed between the first fitting portion 51 and the second fitting portion 233. That is, the sealing material 70 is placed between the convex portion and the concave portion. The sealing material 70 fills the gap between the housing 20 and the heat dissipation fins 50, sealing the housing 20. The sealing material 70 can be, for example, silicone resin, epoxy resin, or metal. If the sealing material 70 is silicone resin or epoxy resin, the airtightness of the housing 20 is improved, and the heat resistance of the heat dissipation path from the heat dissipation fins 50 to the housing 20 is improved. Also, if the sealing material 70 is a metal such as solder or brazing material, the thermal resistance of the heat dissipation path from the semiconductor 33 to the housing 20 via the heat dissipation fins 50 is reduced. That is, the heat dissipation performance of the heat dissipation path from the semiconductor 33 to the housing 20 via the heat dissipation fins 50 is improved.

[0035] The sealing material 70 has a thickness X2 and an elastic modulus Y2. Its thickness X1 is smaller than its thickness X2, and its elastic modulus Y1 is larger than its elastic modulus Y2. Therefore, the sealing material 70 is more easily deformed than the adhesive layer 60. Thus, when stress is generated in a thermal cycling environment due to the difference in thermal expansion coefficients between the heat dissipation fins 50, semiconductor 33, and substrate 31 and the housing 20, the sealing material 70 deforms more than the adhesive layer 60, absorbing the thermal stress. This reduces the thermal stress acting on the adhesive layer 60.

[0036] <1-2. Functions of the first and second mating parts> The presence of a gap (hereinafter referred to as the first gap) between the surface of the first mating portion 51 and the surface of the second mating portion 233 allows the assembly tolerance between the heat dissipation fin 50, semiconductor 33, substrate 31 and the housing 20 to be absorbed into the gap, while maintaining the mating between the heat dissipation fin 50 and the housing 20. Consequently, the spacing between the semiconductor 33 and the heat dissipation fin 50 is maintained uniformly while maintaining the mating between the heat dissipation fin 50 and the housing 20. Figure 3A shows a state in which the assembly tolerance is almost nonexistent and the heat dissipation fin 50, semiconductor 33, and substrate 31 are assembled to the housing 20 at a reference position. Figure 3B shows a state in which at least one of the heat dissipation fin 50, semiconductor 33, and substrate 31 is assembled to the housing 20 at a position shifted horizontally from the reference position. Even in such a case, the horizontal positional shift is absorbed by the first gap.

[0037] Furthermore, in addition to the first gap, the gap between the second surface 532 and the inner surface 231 (hereinafter referred to as the second gap) absorbs even more assembly tolerances. Figure 3C shows a state in which at least one of the heat dissipation fin 50, semiconductor 33, and substrate 31 is assembled to the housing 20 at a position tilted vertically with respect to the reference position. Even in such a case, the vertical and horizontal positional displacements are absorbed by the first and second gaps. Also, as shown in Figure 3D, even if the sealing material 70 overflows from the first gap, the excess sealing material 70 is absorbed in the second gap, so that the distance between the semiconductor 33 and the heat dissipation fin 50 is maintained uniformly.

[0038] <1-3. Assembly method> Referring to Figure 5, the assembly method of the electronic device 10 will be described. First, a thin, uniform adhesive layer 60 is formed on the upper surface of the semiconductor 33. Next, the base 53 of the heat dissipation fin 50 is placed on the adhesive layer 60, and the upper surface of the semiconductor 33 and the heat dissipation fin 50 are pressed and heated to harden the adhesive layer 60, integrating the semiconductor 33, adhesive layer 60, and heat dissipation fin 50. Next, the semiconductor 33 with the heat dissipation fin 50 attached is mounted on the substrate 31. Meanwhile, a sealing material 70 is injected into the second mating portion 233 of the housing 20.

[0039] Then, a circuit board 31 on which the semiconductor 33 is mounted is inserted from the bottom of the housing 20, and the circuit board 31 is screwed to the intermediate surface 22. In addition, multiple fins 52 of the heat dissipation fins 50 are exposed from the opening 25 of the housing 20, and the first fitting portion 51 is fitted into the second fitting portion 233 such that the surface of the first fitting portion 51 is spaced apart from the surface of the second fitting portion 233. Finally, a cover 200 is attached to the lower ends 211 of the four sides 21 of the housing 20, sealing the bottom of the housing 20.

[0040] <1-4. Effects> The first embodiment described in detail above provides the following effects. (1) Since the substrate 31 on which the semiconductor 33 is mounted and the heat dissipation fins 50 are assembled to the housing 20 without using a pressing member to press the semiconductor 33 against the heat dissipation fins 50, the semiconductor 33, heat dissipation fins 50, and substrate 31 do not flex, and the gap between the semiconductor 33 and the heat dissipation fins 50 becomes thin and uniform. In addition, because no pressing member is used, the electronic device 10 is made smaller and lighter. Furthermore, the assembly tolerance between the heat dissipation fins 50, semiconductor 33, substrate 31 and housing 20 is absorbed in the first gap, and the gap between the semiconductor 33 and the heat dissipation fins 50 is maintained to be thin and uniform. Therefore, the heat generated from the semiconductor 33 can be efficiently dissipated, and the electronic device 10 can be made smaller and lighter.

[0041] (2) Because the base 53 is larger than the opening 25, the base 53 and the housing 20 can be fitted together while exposing multiple fins 52 from the opening 25. (3) Because the housing 20 and the heat dissipation fins 50 are made of the same metal material, thermal stress caused by the difference in thermal expansion coefficients between the housing 20 and the heat dissipation fins 50 is reduced in a thermal cycling environment. Consequently, the thermal fatigue life of the housing 20 and the heat dissipation fins 50 can be extended in a thermal cycling environment.

[0042] (4) Since the first mating portion 51 is formed integrally with the heat dissipation fin 50, the number of parts can be reduced and costs can be lowered. (5) Since the second fitting portion 233 is formed integrally with the housing 20, the number of parts can be reduced and costs can be lowered.

[0043] (6) If the adhesive layer 60 is made of silicone resin, a heat dissipation path with high heat resistance can be realized. If the adhesive layer 60 is made of silicone resin or epoxy resin mixed with a filler with high thermal conductivity, the heat dissipation performance of the heat dissipation path can be further improved.

[0044] (7) By placing the sealing material 70 between the first fitting portion 51 and the second fitting portion 233, the first gap can absorb the assembly tolerances between the heat dissipation fins 50, semiconductor 33, substrate 31 and housing 20, while ensuring the airtightness of the housing 20.

[0045] (8) When the sealing material 70 is made of silicone resin or epoxy resin, the airtightness of the housing 20 can be improved, and the heat resistance of the heat dissipation path from the heat dissipation fins 50 to the housing 20 can be improved.

[0046] (9) When the sealing material 70 is metal or brazing material, the thermal resistance of the heat dissipation path from the semiconductor 33 to the housing 20 via the heat dissipation fins 50 is reduced, so that the heat generated from the semiconductor 33 can be dissipated more efficiently.

[0047] (10) The thickness X1 of the adhesive layer 60 is smaller than the thickness X2 of the sealing material 70, and the elastic modulus Y1 of the adhesive layer 60 is greater than the elastic modulus Y1 of the sealing material 70. As a result, when stress is generated in a thermal cycle environment due to the difference in thermal expansion coefficients of the heat dissipation fins 50, semiconductor 33 and substrate 31 and the housing 20, the sealing material 70 deforms more than the adhesive layer 60 to absorb the thermal stress and reduce the thermal stress acting on the adhesive layer 60. Consequently, the thermal cycle fatigue life of the adhesive layer 60 can be ensured and a heat dissipation path with excellent heat dissipation from the semiconductor 33 to the heat dissipation fins 50 can be maintained.

[0048] (11) A second fitting portion 233 is provided on the inner surface 231 of the housing 20, and a first fitting portion 51 is provided on the second surface 532 of the base 53. As a result, even if the base 53 and the substrate 31 on which the semiconductor 33 is mounted are formed to be larger than the opening 25 of the housing 20, the heat dissipation fins 50 and the substrate 31 can be easily assembled to the substrate 31 by inserting them from the bottom of the housing 20.

[0049] (12) The electronic device 10 can be assembled by attaching the heat dissipation fins 50 to the semiconductor 33, mounting the semiconductor 33 with the heat dissipation fins 50 attached to the substrate 31, inserting the substrate 31 into the housing 20, and fitting the first mating portion 51 into the second mating portion 233.

[0050] (2. Second Embodiment) <2-1. Differences from the First Embodiment> The second embodiment has the same basic configuration as the first embodiment, so the differences will be explained below. Note that the same reference numerals as in the first embodiment indicate the same components, and refer to the preceding description.

[0051] The configuration of the electronic device 10 according to the second embodiment is the same as that of the electronic device 10 according to the first embodiment, but the assembly method is different. The assembly method of the electronic device 10 according to the second embodiment will be described below.

[0052] <2-2. Assembly method> Referring to Figure 6, the assembly method of the electronic device 10 will be described. First, the semiconductor 33 is mounted on the substrate 31. Next, a thin, uniform adhesive layer 60 is formed on the upper surface of the semiconductor 33 mounted on the substrate 31. Then, the base 53 of the heat dissipation fin 50 is placed on top of the adhesive layer 60, and the upper surface of the semiconductor 33 and the heat dissipation fin 50 are pressed and heated to harden the adhesive layer 60, integrating the semiconductor 33, the adhesive layer 60, and the heat dissipation fin 50. Meanwhile, a sealing material 70 is injected into the second mating portion 233 of the housing 20.

[0053] Then, a circuit board 31 on which the semiconductor 33 is mounted is inserted from the bottom of the housing 20, and the circuit board 31 is screwed to the intermediate surface 22. In addition, multiple fins 52 of the heat dissipation fins 50 are exposed from the opening 25 of the housing 20, and the first fitting portion 51 is fitted into the second fitting portion 233 such that the surface of the first fitting portion 51 is spaced apart from the surface of the second fitting portion 233. Finally, a cover 200 is attached to the lower ends 211 of the four sides 21 of the housing 20, sealing the bottom of the housing 20.

[0054] <2-3. Effects> The second embodiment described in detail above achieves the effects (1) to (11) of the first embodiment described above, and further achieves the following effects.

[0055] (13) The electronic device 10 can be assembled by mounting the semiconductor 33 onto the substrate 31, attaching the heat dissipation fins 50 to the semiconductor 33 mounted on the substrate 31, inserting the substrate 31 into the housing 20, and fitting the first mating portion 51 into the second mating portion 233.

[0056] (3. Other Embodiments) Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above and can be implemented in various modified forms.

[0057] (a) Multiple functions of one component in the above embodiment may be realized by multiple components, or one function of one component may be realized by multiple components. Also, multiple functions of multiple components may be realized by one component, or one function realized by multiple components may be realized by one component. Furthermore, some of the configuration of the above embodiment may be omitted. Furthermore, at least some of the configuration of the above embodiment may be added to or replaced with the configuration of other above embodiments.

[0058] [Technical Concept Disclosed in This Specified Specification] [Item 1] A housing (20) having an opening (25) formed therein, The circuit board (31) located inside the aforementioned housing, A semiconductor (33) mounted on the aforementioned substrate and located within the aforementioned housing, A heat dissipation fin (50) is positioned above the semiconductor within the housing, with a portion of it exposed from the opening, A first convex portion (51) or a first concave portion (51) provided on the heat dissipation fin, A second recess (233) is provided at the position of the housing corresponding to the first protrusion, wherein the surface of the second recess is spaced apart from the surface of the first protrusion and is configured to fit into the first protrusion, or a second protrusion (233) is provided at the position of the housing corresponding to the first recess, wherein the surface of the second protrusion is spaced apart from the surface of the first recess and is configured to fit into the first recess. electronic equipment. [Item 2] The heat dissipation fin (50) has a base (53) located inside the housing and a plurality of fins (52) connected to the base and exposed from the opening (25), The base is larger than the opening. The electronic device described in item 1. [Item 3] The housing (20) and the heat dissipation fins (50) are formed from the same metal material. The electronic device described in item 1 or 2. [Item 4] (i) The first protrusion (51) or the first recess (51) is formed integrally with the heat dissipation fin (50), and / or (ii) The second recess (233) or the second protrusion (233) is formed integrally with the housing (20), An electronic device described in any one of items 1 to 3. [Item 5] The device further comprises an adhesive layer (60) disposed between the semiconductor (33) and the heat dissipation fin (50). An electronic device described in any one of items 1 to 4. [Item 6] The device further comprises a sealing material (70) disposed between the first protrusion (51) and the second recess (233), or between the first recess (51) and the second protrusion (233). An electronic device described in any one of items 1 through 5. [Item 7] The adhesive layer (60) is a silicone resin or an epoxy resin. An electronic device described in any one of items 1 through 5. [Item 8] The sealing material (70) is a silicone resin or an epoxy resin. An electronic device described in any one of items 1 through 6. [Item 9] The sealing material (70) is made of metal. An electronic device described in any one of items 1 through 6. [Item 10] The thickness of the adhesive layer (60) is less than the thickness of the sealing material (70). The elastic modulus of the adhesive layer is greater than the elastic modulus of the sealing material. An electronic device described in any one of items 5-9. [Item 11] The opening (25) is formed on the upper surface (23) of the housing (20). The upper surface has an inner surface (231) facing inward of the housing and an outer surface (232) opposite to the inner surface. The base (53) has a first surface (531) facing the semiconductor (33) and a second surface (532) opposite to the first surface. The first protrusion (51) or the first recess (51) is provided on the inner surface, The second recess (233) or the second protrusion (233) is provided on the second surface. An electronic device described in any one of items 1 through 10. [Item 12] The heat dissipation fin (50) is attached to the semiconductor (33), The semiconductor with the heat dissipation fins attached is mounted on a substrate (31), The substrate on which the semiconductor is mounted is inserted into the housing (20) and placed inside the housing. A portion of the heat dissipation fin is exposed from the opening (25) of the housing, and (i) the first protrusion (51) of the heat dissipation fin is fitted into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) the first recess of the heat dissipation fin is fitted into the second protrusion such that the surface of the first recess is spaced apart from the surface of the second protrusion (233) of the housing. Method for assembling electronic devices. [Item 13] The semiconductor (33) is mounted on the substrate (31), A heat dissipation fin (50) is attached to the semiconductor mounted on the substrate. The substrate on which the semiconductor is mounted is inserted into the housing (20) and placed inside the housing. A portion of the heat dissipation fin is exposed from the opening (25) of the housing, and (i) the first protrusion (51) of the heat dissipation fin is fitted into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) the first recess (51) of the heat dissipation fin is fitted into the second protrusion (233) such that the surface of the first recess is spaced apart from the surface of the second protrusion of the housing. Method for assembling electronic devices. [Explanation of Symbols]

[0059] 10...Electronic device, 20...Housing, 21...Side, 22...Intermediate surface, 23...Top surface, 25,26...Opening, 31...Substrate, 33...Semiconductor, 50...Heat dissipation fin, 51...First mating part, 52...Fin, 53...Base, 60...Adhesive layer, 70...Sealing material, 231...Inner surface, 232...Outer surface, 233...Second mating part, 531...First surface, 532...Second surface.

Claims

1. A housing (20) having an opening (25) formed therein, The circuit board (31) located inside the housing, A semiconductor (33) mounted on the aforementioned substrate and located within the aforementioned housing, A heat dissipation fin (50) is positioned above the semiconductor within the housing, with a portion of it exposed from the opening, A first convex portion (51) or a first concave portion (51) provided on the heat dissipation fin, A second recess (233) is provided at the position of the housing corresponding to the first protrusion, wherein the surface of the second recess is spaced apart from the surface of the first protrusion and is configured to fit into the first protrusion, or a second protrusion (233) is provided at the position of the housing corresponding to the first recess, wherein the surface of the second protrusion is spaced apart from the surface of the first recess and is configured to fit into the first recess. electronic equipment.

2. The heat dissipation fin (50) has a base (53) located inside the housing and a plurality of fins (52) connected to the base and exposed from the opening (25), The base is larger than the opening. The electronic device according to claim 1.

3. The housing (20) and the heat dissipation fins (50) are formed from the same metal material. The electronic device according to claim 1 or 2.

4. (i) The first protrusion (51) or the first recess (51) is formed integrally with the heat dissipation fin (50), and / or (ii) The second recess (233) or the second protrusion (233) is formed integrally with the housing (20), The electronic device according to claim 1 or 2.

5. The device further comprises an adhesive layer (60) disposed between the semiconductor (33) and the heat dissipation fin (50). The electronic device according to claim 1 or 2.

6. The present invention further comprises a sealing material (70) disposed between the first protrusion (51) and the second recess (233), or between the first recess (51) and the second protrusion (233). The electronic device according to claim 5.

7. The adhesive layer (60) is made of silicone resin or epoxy resin. The electronic device according to claim 5.

8. The sealing material (70) is a silicone resin or an epoxy resin. The electronic device according to claim 6.

9. The sealing material (70) is made of metal. The electronic device according to claim 6.

10. The thickness of the adhesive layer (60) is less than the thickness of the sealing material (70). The elastic modulus of the adhesive layer is greater than the elastic modulus of the sealing material. The electronic device according to claim 6.

11. The opening (25) is formed on the upper surface (23) of the housing (20). The upper surface has an inner surface (231) facing inward of the housing and an outer surface (232) opposite to the inner surface. The base (53) has a first surface (531) facing the semiconductor (33) and a second surface (532) opposite to the first surface. The first protrusion (51) or the first recess (51) is provided on the inner surface, The second recess (233) or the second protrusion (233) is provided on the second surface. The electronic device according to claim 2.

12. The heat dissipation fin (50) is attached to the semiconductor (33), The semiconductor with the heat dissipation fins attached is mounted on a substrate (31), The substrate on which the semiconductor is mounted is inserted into the housing (20) and placed inside the housing. A portion of the heat dissipation fin is exposed from the opening (25) of the housing, and (i) the first protrusion (51) of the heat dissipation fin is fitted into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) the first recess of the heat dissipation fin is fitted into the second protrusion such that the surface of the first recess is spaced apart from the surface of the second protrusion (233) of the housing. Method for assembling electronic devices.

13. The semiconductor (33) is mounted on the substrate (31), A heat dissipation fin (50) is attached to the semiconductor mounted on the substrate. The substrate on which the semiconductor is mounted is inserted into the housing (20) and placed inside the housing. A portion of the heat dissipation fin is exposed from the opening (25) of the housing, and (i) the first protrusion (51) of the heat dissipation fin is fitted into the second recess (233) such that the surface of the first protrusion is spaced apart from the surface of the second recess (233) of the housing, or (ii) the first recess (51) of the heat dissipation fin is fitted into the second protrusion (233) such that the surface of the first recess is spaced apart from the surface of the second protrusion of the housing. Method for assembling electronic devices.

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