Drying apparatus, drying method, and method for manufacturing a display panel

Abstract

This technology provides advantages for ensuring uniform drying of the liquid film on the substrate within the substrate plane. [Solution] A drying apparatus for drying a liquid film placed on a substrate comprises a chamber, a flow straightening cover that covers the substrate in the internal space of the chamber, a gas discharger disposed inside the flow straightening cover, a pressure reducing mechanism that reduces the pressure in the internal space of the chamber while the substrate is covered by the flow straightening cover, and a supply unit that supplies fluid to the gas discharger.

Description

Technical Field

[0001] The present invention relates to a drying apparatus, a drying method, and a method for manufacturing a display panel.

Background Art

[0002] In the manufacture of devices such as OLED (Organic Light Emitting Diode) displays, there is a process of disposing a liquid film of an organic material on a substrate and subjecting the liquid film to drying under reduced pressure. Patent Document 1 describes a method in which an organic functional ink is applied to a coating area on a substrate to form a film, and then the film is dried in a chamber of a drying apparatus. In this method, the shape of the film after drying is made uniform by supplying a solvent from around the coating area and setting the pressure in the chamber to be below the vapor pressure of the solvent of the organic functional ink. The drying apparatus described in Patent Document 1 has a solvent supply mechanism that supplies a solvent to four corners of the coating area of the substrate, and the solvent supply mechanism includes a pipe for supplying the solvent and a porous member as a solvent supply port provided at the tip of the pipe.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, since there is no member for regulating the gas flow in the internal space of the chamber during reduced pressure, it is difficult to make the drying of the liquid film on the substrate uniform within the plane of the substrate.

[0005] An object of the present invention is to provide a technology advantageous for making the drying of the liquid film on the substrate uniform within the plane of the substrate.

Means for Solving the Problems

[0006] One aspect of the present invention relates to a drying apparatus for drying a liquid film placed on a substrate, the drying apparatus comprising a chamber, a flow straightening cover that covers the substrate in the internal space of the chamber, a gas discharger disposed inside the flow straightening cover, a pressure reducing mechanism that reduces the internal space of the chamber while the substrate is covered by the flow straightening cover, and a supply unit that supplies fluid to the gas discharger. [Effects of the Invention]

[0007] According to the present invention, an advantageous technique is provided for uniformly drying a liquid film on a substrate within the plane of the substrate. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic diagram showing the configuration of a film formation system according to one embodiment. [Figure 2] A schematic cross-sectional view showing an example of the configuration of a drying apparatus. [Figure 3] A diagram illustrating a circuit board. [Figure 4] A diagram showing an example of the structure of a porous material used as a gas emitter. [Figure 5] A plan view of a first configuration example of a supply unit that is advantageous for uniformly drying the liquid film of organic material applied to each effective region of a substrate. [Figure 6] A plan view of a second configuration example of a supply unit that is advantageous for uniformly drying the liquid film of organic material applied to each effective area of ​​the substrate. [Figure 7] This diagram illustrates a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 8] A cross-sectional diagram illustrating a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 9] A cross-sectional diagram illustrating a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 10] A cross-sectional diagram illustrating a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 11]A cross-sectional diagram illustrating a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 12] A cross-sectional diagram illustrating a drying method in which a liquid film of organic material placed on a substrate is dried using a drying apparatus. [Figure 13] A schematic cross-sectional view showing another example of the configuration of the supply unit that supplies fluid to the gas emitter. [Modes for carrying out the invention]

[0009] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the following embodiments do not limit the invention as defined in the claims. While multiple features are described in the embodiments, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the accompanying drawings, the same reference numeral is used for identical or similar drawings, and redundant descriptions are omitted.

[0010] Figure 1 schematically shows the configuration of a film formation system 100 of one embodiment suitable for manufacturing organic display panels. In one aspect, the film formation system 100 can be understood as a system for forming an organic material film on a substrate S. In another aspect, the film formation system 100 can be understood as an apparatus for processing organic material on a substrate S. The organic material film may be, for example, a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of an organic light-emitting diode (OLED). The process for manufacturing an organic EL device may include a film formation step of forming an organic material film such as a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer on a substrate S. The film formation step of forming an organic material film may include a coating step of placing a liquid film of the organic material on the substrate S by coating the organic material in a liquid state onto the substrate S, a drying step of forming a dry film by drying the liquid film, and a firing step of firing the dry film. The organic material may be a solution containing a solute and a solvent for forming the organic material film.

[0011] The film formation system 100 may comprise a plurality of processing units and a transport mechanism 9 for transporting substrates S between the plurality of processing units. Each processing unit may include a processing chamber. The film formation system 100 may comprise a transport chamber 10 connected to each of the processing chambers of the plurality of processing units, and the transport mechanism 9 may be located inside the transport chamber 10. The transport chamber 10 may be arranged to be surrounded by each of the processing chambers of the plurality of processing units. The film formation system 100 may be a multi-chamber type processing system.

[0012] In one example, the processing apparatus may include a coating apparatus 1 and a drying apparatus 4. The coating apparatus 1 performs a coating process to coat a liquid organic material onto a substrate S. The drying apparatus 4 performs a drying process to dry the liquid organic material coated onto the substrate S by the coating apparatus 1.

[0013] From another perspective, the plurality of processing apparatuses may include, for example, a coating apparatus 1, a cleaning apparatus 2, a load lock apparatus 3, a drying apparatus 4, a firing apparatus 5, a cooling apparatus 6a, an alignment apparatus 6b, an unload lock apparatus 7, and a buffer apparatus 8. The processing chambers respectively possessed by the coating apparatus 1, the drying apparatus 4, and the firing apparatus 5 can also be called a coating chamber, a drying chamber, and a firing chamber. The coating chamber is a processing chamber for performing a coating process of disposing a liquid film on the substrate S by coating an organic material in a liquid state on the substrate S. The drying chamber is a processing chamber for performing a drying process of drying the liquid film disposed on the substrate S by the coating apparatus 1 to obtain a dried film. The firing chamber is a processing chamber for performing a firing process of firing the dried film on the substrate S that has undergone the drying process to obtain an organic material film. The load lock apparatus 3 can be used as an interface for transporting the substrate S from the outside of the film forming system 100 to the inside of the film forming system 100. The cooling apparatus 6a and the alignment apparatus 6b are configured to be disposed in one processing chamber in this example, but the cooling apparatus 6a and the alignment apparatus 6b may be disposed in different processing chambers from each other. The cooling apparatus 6a can be configured to cool the substrate washed by the cleaning unit 2 and the substrate on which the dried film has been fired by the firing apparatus 5. The cooling apparatus 6a can control the temperature of the substrate so that, for example, the temperature or temperature distribution of the substrate falls within ±0.2°C of the target temperature. The alignment apparatus 6b can be configured to align, for example, the substrate supplied to the coating apparatus 1. The alignment can be performed, for example, with respect to the positions in the X-axis direction and the Y-axis direction and the rotation around the Z-axis in the XYZ coordinate system. Further, the alignment apparatus 6b may perform alignment of the substrate unloaded from the film forming system 100.

[0014] The unload lock device 7 may be configured as an interface for transporting the substrate S, which has finished processing in the film formation system 100, from the film formation system 100 to the outside. The load lock device 3 and the unload lock device 7 may be shared. The buffer device 8 may be used to move the substrate S inside the film formation system 100 in the event of an error in the film formation system 100. An additional transport chamber 11 may be provided between the transport chamber 10 and the coating device 1.

[0015] The film formation system 100 may further include a control unit 20. The control unit 20 may consist of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program installed, or a combination of all or part of these. The control unit 20 may be configured to control, for example, the coating device 1, the cleaning device 2, the drying device 4, the firing device 5, the cooling device 6a, the alignment device 6b, and the transport mechanism 9 based on control information provided by an external device.

[0016] FIG. 2 schematically shows a configuration example of the drying device 4. The drying device 4 can dry the liquid film F disposed on the substrate S by the coating device 1. The drying device 4 can include a chamber 400, a flow rectifying cover 402 that covers the substrate S in the internal space IS of the chamber 400, and a gas emitter 403 disposed inside the flow rectifying cover 402. The drying device 4 can also include a decompression mechanism 412 that decompresses the internal space IS of the chamber 400 in a state where the substrate S is covered by the flow rectifying cover 402, and a supply unit 405 that supplies a fluid to the gas emitter 403. The drying device 4 can also include a substrate holding unit 401 that holds the substrate S in the internal space IS of the chamber 400. The flow rectifying cover 402 has one or more openings 411. The flow rectifying cover 402 can also have a side wall SW that is disposed so as to surround the space above the effective region (pixel array region) where the liquid film F of the organic material is disposed by the coating device 1. Thereby, compared with the case where the flow rectifying cover 402 is not used, the drying of the liquid film F at the end of the effective region is delayed, and as a result, the drying of the liquid film F in the entire effective region can be made uniform.

[0017] The drying device 4 can also include a drive mechanism 404 that moves the flow rectifying cover 402 and the substrate S closer to each other or farther away from each other so as to cover the substrate S. The drive mechanism 404 can be configured, for example, to move the flow rectifying cover 402 closer to the substrate S so as to cover the substrate S or to move the flow rectifying cover 402 away from the substrate S so that a space is formed between the substrate S and the flow rectifying cover 402. Alternatively, the drive mechanism 404 can be configured to move the substrate holding unit 401 closer to the flow rectifying cover 402 so as to cover the substrate S or to move the substrate holding unit 401 away from the flow rectifying cover 402 so that a space is formed between the substrate S and the flow rectifying cover 402. Alternatively, the drive mechanism 404 can be configured to drive both the flow rectifying cover 402 and the substrate holding unit 401.

[0018] The supply unit 405 may supply the fluid to the gas emitter 403 in a gaseous state, or it may supply the fluid to the gas emitter 403 in a liquid state. The supply unit 405 may include a supply passage 413 that is arranged to penetrate the side wall of the chamber 400 that supplies the fluid to the gas emitter 403. The supply passage 413 may be configured, for example, to penetrate the side wall of the flow straightening cover 402. The flow straightening cover 402 may include a partition 410 that divides the space enclosed by the side wall SW of the flow straightening cover 402 into a plurality of regions, in which case the gas emitter 403 may include a portion provided in the partition 410. Preferably, the fluid supplied to the gas emitter 403 is the same as the solvent contained in the organic material coated on the substrate S by the coating device 1. Alternatively, preferably, the fluid supplied to the gas emitter 403 is a substance having a vapor pressure close to the vapor pressure of the organic material coated on the substrate S by the coating device 1. The fluid may contain at least one of n-hexane, cyclohexanone, diethylene glycol diethylene ether, diethylene glycol monomethyl ethyl ether, dipropylene glycol dimethyl ether, and dipropylene glycol monomethyl ether.

[0019] The gas emitter 403 may include a porous body that absorbs a fluid and releases the fluid in a gaseous state. The porous body may be, for example, 50-800 m 2The material may have a specific surface area within the range of / g. The term porous material may be interpreted broadly, and porous materials may be composed of, for example, cloth, nonwoven fabric, cotton, alumina gel, or silica gel. However, porous materials are preferably composed of inorganic or metallic materials, for example, a metal nanoporous alloy or nanoporous copper in which a large number of open pores are formed in a metal member. Metal nanoporous alloys can be formed by immersing a precursor alloy containing decomposed components in an alloy liquid, selectively dissolving the decomposed components, and allowing the remaining metal to self-assemble a porous structure, in accordance with the reaction design guidelines for the molten metal component method. Nanoporous copper can be produced, for example, by using an aluminum-copper alloy powder (particle size of the powder is, for example, 100 micrometers or less) and dealloying the aluminum with sodium hydroxide. Generally, the diameter of the pores in a porous material affects the adsorption and desorption behavior of gases to and from the surface of the porous material, and a larger diameter makes it easier to release gases adsorbed on the surface. The diameter and its distribution can be designed to achieve a target vapor pressure distribution in the space above the substrate S.

[0020] Figure 3(a) illustrates a substrate S for manufacturing an organic display panel. The substrate S may have one or more effective regions (pixel array regions) 101 to which organic material is applied by a coating apparatus 1, and non-effective regions 111 arranged to surround each effective region 101. Here, the organic material may be applied to each of the multiple pixels (sub-pixels) in each effective region 101. Figure 3(b) illustrates one effective region 101. The effective region 101 has an end portion 101b and a central portion 101a surrounded by the end portion 101b. The rectifier cover 402 may have side walls SW arranged to surround the space above the effective region (pixel array region) 101 to which the liquid film F of organic material is placed by the coating apparatus 1. This delays the drying of the liquid film F at the end portion 101b of the effective region 101 compared to when the rectifier cover 402 is not used, and as a result, the drying of the liquid film throughout the effective region 101 can be made more uniform. However, since the organic material is not applied to the outside of the end portion 101b, the concentration of the solvent (solvent volatilized from the organic material) in the space above the end portion 101b is lower than the concentration of the solvent (solvent volatilized from the organic material) in the space above the central portion 101a. Therefore, the drying of the organic material at the end portion 101b (volatilization of the solvent in the organic material) is faster than the drying of the organic material at the central portion 101a (volatilization of the solvent in the organic material). For this reason, it is preferable to place the gas emitter 403 close to the end portion 101b and increase the gas concentration in the space close to the end portion 101b with the gas emitted from the gas emitter 403. This makes it possible to equalize the gas concentration in the space above the effective region 101 and equalize the drying of the organic material (volatilization of the solvent in the organic material) throughout the entire effective region 101.

[0021] Figure 3(c) illustrates a substrate S having effective regions (pixel array regions) 101 and 102 with different areas. An ineffective region 111 is arranged to surround the effective region 101, and an ineffective region 112 is arranged to surround the effective region 102. In this example, the area of ​​the effective region 102 is larger than the area of ​​the effective region 101, and the area of ​​the ineffective region 112 is larger than the area of ​​the ineffective region 111. Therefore, the amount of gas supplied from the gas emitter 403 to the ineffective region 112 can be controlled to be greater than the amount of gas supplied from the gas emitter 403 to the ineffective region 111.

[0022] The surface area of ​​the porous material as the gas emitter 403 will be explained with reference to Figures 4(a) to (d). Let φ be the porosity of the porous material, d be its thickness, and h be its height. The porosity is the ratio of the volume of voids (spaces) to the total volume of the porous material, and is correlated with the surface area of ​​the pores or specific surface area of ​​the porous material. In a porous material, the surface area A of the pores that can adsorb gas is expressed as A = φ × d × h. The surface area A of the porous material can be determined according to the distribution of the liquid film to be dried on the substrate S. In addition, in the coating apparatus 1, organic material may also be applied to the non-effective area 111 in order to suppress drying of the edge 101b of the effective area 101.

[0023] Figure 4(b) is a plan view of a first configuration example of a gas emitter 403 (porous body) for uniformly drying a liquid film of organic material applied to each effective region 101 of a substrate S. The gas emitter 403 of the first configuration example shown in Figure 4(b) has a frame shape with four sides, and at least one of the four sides has a portion with varying thickness. In other words, the gas emitter 403 of the first configuration example shown in Figure 4(b) has a frame shape with four sides, and each of the four sides has a portion with varying thickness. In other words, the gas emitter 403 of the first configuration example shown in Figure 4(b) has a corner portion 422 thickness d greater than the central portion 421 thickness d.

[0024] Figure 4(c) is a plan view of a second configuration example of a gas emitter 403 (porous body) for uniformly drying a liquid film of organic material applied to each effective region 101 of the substrate S. The gas emitter 403 of the second configuration example shown in Figure 4(c) has a frame shape with four sides, and at least one of the four sides has a portion with a changing height. In other words, the gas emitter 403 of the second configuration example shown in Figure 4(c) has a frame shape with four sides, and each of the four sides has a portion with a changing height. In other words, the gas emitter 403 of the second configuration example shown in Figure 4(c) has a corner portion 422 height h greater than the central portion 421 height h.

[0025] Figure 4(d) is a plan view of a third configuration example of a gas emitter 403 (porous body) for uniformly drying a liquid film of organic material applied to each effective region 101 of the substrate S. The gas emitter 403 of the third configuration example shown in Figure 4(d) has a frame shape with four corners 422 and four sides, and the void ratio φ at each corner 422 is greater than the void ratio φ at the center 421 of each side.

[0026] Figure 5 is a plan view of a first configuration example of a supply unit 405 that is advantageous for uniformly drying the liquid film F of organic material applied to each effective region 101 of the substrate S. Note that the first configuration example of the supply unit 405 may be used in combination with any of the first to third configuration examples of the gas emitter 403 shown in Figures 4(b) to (d). The supply unit 405 may include a plurality of supply passages 432 connected to a plurality of locations on the gas emitter 403 (porous body), and a fluid controller 433 that individually controls the amount of fluid supplied to the gas emitter 403 through the plurality of supply passages 432. Each supply passage 432 may be configured to supply fluid to the gas emitter 403 via a supply port 431.

[0027] Figure 6 is a plan view of a second configuration example of a supply unit 405 that is advantageous for uniformly drying the liquid film of organic material applied to each effective region 101 of the substrate S. Note that the second configuration example of the supply unit 405 may be used in combination with any of the first to third configuration examples of the gas emitter 403 shown in Figures 4(b) to (d). The gas emitter 403 (porous body) has a frame shape, and the supply unit 405 may include a fluid containment chamber 441 arranged along the frame shape so as to be able to supply fluid to the gas emitter 403, and an adjustment mechanism 443 for adjusting the cross-sectional area of ​​multiple locations in the internal space 442 of the fluid containment chamber 441. Here, the cross-sectional area of ​​the fluid containment chamber 441 along the side of the frame shape of the gas emitter 403 can be evaluated by a cross section perpendicular to that side.

[0028] The following describes a first example of a drying method for drying a liquid film F of an organic material placed on a substrate S using a drying apparatus 4, with reference to Figures 7(a), 8, 9, and 10. This drying method can be controlled by a control unit 20. First, in step S701, a holding step may be performed in which a fluid is held in a gas emitter 403 located inside a flow straightening cover 402 located in the internal space IS of a chamber 400, as schematically shown in Figures 8(a) and (b). Here, as schematically shown in Figures 8(a) and (b), a fluid 455 may be supplied to the gas emitter 403 through a supply passage 413 by a supply unit 405, and the fluid may be held in the gas emitter 403 by adsorption of the fluid 455 onto the gas emitter 403.

[0029] Next, in step S702, as schematically shown in Figure 9(a), a loading process may be performed in which the substrate S coated with a liquid film F of organic material by the coating apparatus 1 is transported into the internal space IS of the chamber 400 by the transport mechanism 9. Next, in step S703, a holding process may be performed in which the substrate S is held in the substrate holding section 401. The substrate holding section 401 has, for example, a support member that receives the substrate S from the transport mechanism 9, and after the support member receives the substrate S from the transport mechanism 9, the substrate S may be transferred from the support member to the substrate holding section 401 by the support member descending or the substrate holding section 401 rising. Here, it is preferable that the period during which the supply section 405 supplies fluid 455 to the gas emitter 403 includes at least a portion of the period from when the transport of the substrate S to the chamber 400 is started until the substrate S is covered by the flow straightening cover 402. This may contribute to improving the throughput of the process of drying the liquid film F.

[0030] Next, in step S704, a drive step may be performed in which at least one of the rectifier cover 402 and the substrate holding part 401 is driven by the drive mechanism 404 so as to cover the substrate S, as schematically shown in Figure 9(b). Next, in step S705, a depressurization step may be performed in which the internal space IS of the chamber 400 is depressurized by the depressurization mechanism 412 while the substrate S is covered by the rectifier cover 402, as schematically shown in Figure 10(a). As a result, the solvent in the liquid film F may volatilize, and the organic material constituting the liquid film F may dry and a dry film may be formed. Next, in step S706, a drive step may be performed in which at least one of the rectifier cover 402 and the substrate holding part 401 is driven by the drive mechanism 404 so as to separate the rectifier cover 402 from the substrate S, as schematically shown in Figure 10(b). Furthermore, in step S706, as schematically shown in Figure 10(b), an unloading process may be performed in which the substrate S is unloaded from the internal space IS of the chamber 400 by the transport mechanism 9.

[0031] The following describes a second example of a drying method for drying a liquid film F of an organic material placed on a substrate S using a drying apparatus 4, with reference to Figures 7(b), 8, 9, 10, 11, and 12. This drying method can be controlled by a control unit 20. First, in step S711, a holding step may be performed in which a fluid is held in a gas emitter 403 located inside a flow straightening cover 402 located in the internal space IS of a chamber 400, as schematically shown in Figures 8(a) and (b). Here, as schematically shown in Figures 8(a) and (b), a fluid 455 may be supplied to the gas emitter 403 through a supply passage 413 by a supply unit 405, and the fluid may be held in the gas emitter 403 by adsorption of the fluid 455 onto the gas emitter 403.

[0032] Next, in step S712, as schematically shown in Figure 11(a), a loading process may be performed in which the substrate S coated with a liquid film F of organic material by the coating apparatus 1 is loaded into the internal space IS of the chamber 400 by the transport mechanism 9. Next, in step S713, a driving process may be performed in which the flow straightening cover 402 is driven by the drive mechanism 404 to cover the substrate S. Here, the flow straightening cover 402 has a holding mechanism (not shown) for holding the substrate S, and the substrate S can be held by the flow straightening cover 402. Here, it is preferable that the period during which the supply unit 405 supplies fluid 455 to the gas discharger 403 includes at least a portion of the period from when the transport of the substrate S to the chamber 400 is started until the flow straightening cover 402 covers the substrate S. This may contribute to improving the throughput of the drying process of the liquid film F.

[0033] Next, in step S714, a drive step may be performed in which the rectifier cover 402 holding the substrate S is driven by the drive mechanism 404 so that the substrate S is held by the substrate holding portion 401, as schematically shown in Figure 9(b).

[0034] Next, in step S715, as schematically shown in Figure 10(a), a depressurization step may be performed in which the internal space IS of the chamber 400 is depressurized by the depressurization mechanism 412 while the substrate S is covered by the rectifier cover 402. As a result, the solvent in the liquid film F may volatilize, and the organic material constituting the liquid film F may dry out and a dry film may be formed. Next, in step S716, as schematically shown in Figure 12(a), a driving step is performed in which the rectifier cover 402 holding the substrate S is driven by the driving mechanism 404 so that the substrate S is separated from the substrate holding part 401. Also in step S716, as schematically shown in Figure 12(b), an unloading step may be performed in which the substrate S is unloaded from the internal space IS of the chamber 400 by the transport mechanism 9.

[0035] Figure 13 schematically shows another configuration example of the supply unit 405 that supplies fluid 455 to the gas emitter 403. The supply unit 405 may include a container 451 for storing the fluid 455 to be supplied to the gas emitter 403, and a container drive mechanism 452 for driving the container 451. For example, as schematically shown in Figure 13(a), the container 451 storing the fluid 455 may be placed in the internal space IS of the chamber 400 by the container drive mechanism 452. Then, as schematically shown in Figure 13(b), the flow straightening cover 402 may be placed in the fluid 455 by the drive mechanism 404. This allows the fluid 455 to be supplied to the gas emitter 403 and the fluid 455 to be held by the gas emitter 403.

[0036] The following describes, as an example of a method for manufacturing articles, a method for manufacturing displays such as organic light-emitting diodes (OLEDs). The manufacturing method may include a placement step (coating step) in which a liquid film is placed on a substrate using a coating apparatus 1, a drying step in which the liquid film on the substrate after the placement step is dried using a drying apparatus 4, and a processing step in which the substrate after the drying step is processed to obtain a display panel. A firing step may be performed between the drying step and the processing step. The manufacturing method may involve performing the placement step and the drying step, or the placement step, the drying step and the firing step, multiple times, thereby forming multiple organic layers including a light-emitting layer. The manufacturing method may include a step of forming a lower electrode before the step of forming the multiple organic layers, and a step of forming an upper electrode after the step of forming the multiple organic layers.

[0037] This specification and drawings include the following disclosures: (Item 1) A drying apparatus for drying a liquid film placed on a substrate, Chamber and, A rectifier cover covering the substrate is provided in the internal space of the chamber, A gas emitter is positioned inside the aforementioned rectifier cover, A pressure reducing mechanism for reducing the internal space of the chamber while the substrate is covered by the rectifier cover, A supply unit that supplies fluid to the gas emitter, A drying apparatus characterized by being equipped with the following features. (Item 2) The supply unit supplies the fluid in a gaseous state to the gas discharger. A drying apparatus as described in item 1, characterized by the features described herein. (Item 3) The supply unit supplies the fluid in liquid form to the gas emitter. A drying apparatus as described in item 1, characterized by the features described herein. (Item 4) The supply unit includes a supply passage that is arranged to penetrate the side wall of the chamber in order to supply fluid to the gas discharger. A drying apparatus according to any one of items 1 to 3, characterized by the features described herein. (Item 5) The supply path is configured to penetrate the side wall of the flow straightening cover. A drying apparatus as described in item 4, characterized by the features described herein. (Item 6) The rectifier cover includes a partition that divides the space enclosed by the sides of the rectifier cover into multiple regions. A drying apparatus according to any one of items 1 to 5, characterized by the features described herein. (Item 7) The gas emitter includes a portion provided in the partition. A drying apparatus as described in item 6, characterized by the features described herein. (Item 8) The gas emitter includes a porous body that absorbs the fluid and releases the fluid in a gaseous state. A drying apparatus according to any one of items 1 to 7, characterized by the features described herein. (Item 9) The gas emitter has a frame shape with four sides, and at least one of the four sides has a portion with varying thickness. A drying apparatus as described in item 8, characterized by the features described above. (Item 10) The gas emitter has a frame shape with four sides, and at least one of the four sides has a portion with a changing height. A drying apparatus as described in item 8, characterized by the features described above. (Item 11) The gas emitter has a frame shape with four corners and four sides, and the void ratio at each corner is greater than the void ratio at the center of each side. A drying apparatus as described in item 8, characterized by the features described above. (Item 12) The supply unit includes a plurality of supply lines connected to a plurality of locations of the gas discharger, and a fluid controller that individually controls the amount of fluid supplied to the gas discharger through the plurality of supply lines. A drying apparatus as described in item 8, characterized by the features described above. (Item 13) The gas emitter has a frame shape, The supply unit includes a fluid containment chamber arranged along the frame shape so as to be able to supply the fluid to the gas discharger, and an adjustment mechanism for adjusting the cross-sectional area of ​​multiple locations within the internal space of the fluid containment chamber. A drying apparatus as described in item 8, characterized by the features described above. (Item 14) The period during which the supply unit supplies the fluid to the gas discharger includes at least a portion of the period from when the transport of the substrate to the chamber begins until the rectifier cover covers the substrate. A drying apparatus according to any one of items 1 to 13, characterized by the features described herein. (Item 15) A drying method for drying a liquid film placed on a substrate, A holding process involves holding fluid in a gas discharger positioned inside a flow straightening cover located within the internal space of the chamber, The process includes a depressurization step of reducing the internal space of the chamber while the substrate is covered by the rectifier cover, In the depressurization step, the gas discharger releases the fluid in a gaseous state. A drying method characterized by the following. (Item 16) In the holding step, the gas emitter holds the fluid in a gaseous state. The drying method described in item 15, characterized by the features described herein. (Item 17) In the holding step, the gas emitter holds the fluid in a liquid state. The drying method described in item 15, characterized by the features described herein. (Item 18) The gas emitter includes a porous body that absorbs the fluid and releases the fluid in a gaseous state. A drying method according to any one of items 15 to 17, characterized by the features described herein. (Item 19) The period during which the holding step is performed includes at least a portion of the period from when the transport of the substrate to the chamber is started until the rectifier cover covers the substrate. A drying method according to any one of items 15 to 18, characterized by the features described herein.

[0038] (Item 20) A method for manufacturing a display panel, A placement process in which a liquid film is placed on a substrate, A drying step of drying the liquid film using a drying apparatus described in any one of items 1 to 14, A processing step to obtain a display panel by processing the substrate that has undergone the drying step, A method for manufacturing a display panel, characterized by including the following: (Item 21) A placement process in which a liquid film is placed on a substrate, A drying step of drying the liquid film by the drying method described in any one of items 15 to 19, A processing step to obtain a display panel by processing the substrate that has undergone the drying step, A method for manufacturing a display panel, characterized by including the following: (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0039] S: Substrate, F: Liquid film, 4: Drying device, 401: Substrate holder, 402: Cover member, 403: Gas emitter, 405: Supply unit, 412: Pressure reducing mechanism

Claims

1. A drying apparatus for drying a liquid film placed on a substrate, Chamber and, A rectifier cover covering the substrate is provided in the internal space of the chamber, A gas emitter is positioned inside the aforementioned rectifier cover, A pressure reducing mechanism for reducing the internal space of the chamber while the substrate is covered by the rectifier cover, A supply unit that supplies fluid to the gas emitter, A drying apparatus characterized by being equipped with the following features.

2. The supply unit supplies the fluid in a gaseous state to the gas discharger. The drying apparatus according to feature 1.

3. The supply unit supplies the fluid in liquid form to the gas emitter. The drying apparatus according to feature 1.

4. The supply unit includes a supply passage that is arranged to penetrate the side wall of the chamber in order to supply fluid to the gas discharger. The drying apparatus according to feature 1.

5. The supply path is configured to penetrate the side wall of the flow straightening cover. The drying apparatus according to feature 4.

6. The rectifier cover includes a partition that divides the space enclosed by the sides of the rectifier cover into multiple regions. The drying apparatus according to feature 1.

7. The gas emitter includes a portion provided in the partition. The drying apparatus according to feature 6.

8. The gas emitter includes a porous body that absorbs the fluid and releases the fluid in a gaseous state. The drying apparatus according to feature 1.

9. The gas emitter has a frame shape with four sides, and at least one of the four sides has a portion with varying thickness. The drying apparatus according to feature 8.

10. The gas emitter has a frame shape with four sides, and at least one of the four sides has a portion whose height changes. The drying apparatus according to feature 8.

11. The gas emitter has a frame shape with four corners and four sides, and the void ratio at each corner is greater than the void ratio at the center of each side. The drying apparatus according to feature 8.

12. The supply unit includes a plurality of supply lines connected to a plurality of locations of the gas discharger, and a fluid controller that individually controls the amount of fluid supplied to the gas discharger through the plurality of supply lines. The drying apparatus according to feature 8.

13. The gas emitter has a frame shape, The supply unit includes a fluid containment chamber arranged along the frame shape so as to be able to supply the fluid to the gas discharger, and an adjustment mechanism for adjusting the cross-sectional area of ​​multiple locations within the internal space of the fluid containment chamber. The drying apparatus according to feature 8.

14. The period during which the supply unit supplies the fluid to the gas discharger includes at least a portion of the period from when the transport of the substrate to the chamber begins until the rectifier cover covers the substrate. A drying apparatus according to any one of claims 1 to 13.

15. A drying method for drying a liquid film placed on a substrate, A holding process involves holding fluid in a gas discharger positioned inside a flow straightening cover located within the internal space of the chamber, The process includes a depressurization step of reducing the internal space of the chamber while the substrate is covered by the rectifier cover, In the depressurization step, the gas discharger releases the fluid in a gaseous state. A drying method characterized by the following.

16. In the holding step, the gas emitter holds the fluid in a gaseous state. The drying method according to feature 15.

17. In the holding step, the gas emitter holds the fluid in a liquid state. The drying method according to feature 15.

18. The gas emitter includes a porous body that absorbs the fluid and releases the fluid in a gaseous state. The drying method according to feature 15.

19. The period during which the holding step is performed includes at least a portion of the period from when the transport of the substrate to the chamber is started until the rectifier cover covers the substrate. The drying method according to any one of claims 15 to 18.

20. A method for manufacturing a display panel, A placement process in which a liquid film is placed on a substrate, A drying step of drying the liquid film using a drying apparatus according to any one of claims 1 to 13, A processing step to obtain a display panel by processing the substrate that has undergone the drying step, A method for manufacturing a display panel, characterized by including the following:

21. A placement process in which a liquid film is placed on a substrate, A drying step of drying the liquid film by the drying method described in any one of claims 15 to 18, A processing step to obtain a display panel by processing the substrate that has undergone the drying step, A method for manufacturing a display panel, characterized by including the following:

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