Semiconductor equipment

Abstract

To provide a thin touch panel. Or, to provide a touch panel with high visibility. To do so. Or, to provide a lightweight touch panel. Or, a touch panel with reduced power consumption. We provide flannel. [Solution] A pair of conductive layers constituting a capacitive touch sensor have multiple openings It will have a mesh-like shape. Furthermore, the pair of conductive layers that make up the touch sensor will be the touch panel It is arranged inside a pair of substrates, and the pair of conductive layers and the circuit that drives the display element A transparent conductive layer capable of supplying a constant potential is provided in between.

Description

[Technical Field]

[0001] One aspect of the present invention relates to an input device. Another aspect of the present invention relates to a display device. One aspect of the present invention relates to an input / output device. Another aspect of the present invention relates to a touch panel.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the technical field is semiconductor devices, display devices, light-emitting devices, energy storage devices, and memory devices. Electronic equipment, lighting equipment, input devices, input / output devices, methods for driving them, or the manufacture thereof. Methods can be given as one example.

[0003] In this specification, a semiconductor device is defined as a device that can function by utilizing semiconductor properties. This refers to all types of devices, including semiconductor elements such as transistors, semiconductor circuits, computing devices, and memory devices. The device is a form of semiconductor device. Imaging device, display device, liquid crystal display device, light-emitting device, input Power devices, input / output devices, electro-optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.) (m), and electronic devices may have semiconductor devices. [Background technology]

[0004] In recent years, display devices equipped with touch sensors as a means of position input have been put into practical use. A display device equipped with a touch sensor is called a touch panel or touchscreen. (Hereafter, this will also be simply referred to as a "touch panel"). For example, mobile phones equipped with a touch panel Examples of mobile information terminals include smartphones and tablet devices.

[0005] One type of display device is a liquid crystal display device equipped with liquid crystal elements. For example, the pixel electrodes are... A transistor is used as a switching element that is arranged in a matrix shape and connected to each pixel electrode. Active matrix liquid crystal display devices using this have attracted attention.

[0006] For example, an active matrix liquid crystal display device using a transistor having a metal oxide as a channel formation region is known as a switching element connected to each pixel electrode. (Patent Documents 1 and Patent Document 2). (Patent Document 1 and Patent Document 2).

[0007] Liquid crystal display devices are broadly classified into two types: transmissive and reflective.

[0008] A transmissive liquid crystal display device uses a backlight such as a cold cathode fluorescent lamp or an LED, and utilizes the optical modulation effect of the liquid crystal to select a state where light from the backlight passes through the liquid crystal and is output outside the liquid crystal display device and a state where it is not output, and performs bright and dark displays, and further combines them to perform image display. The light from the backlight passes through the liquid crystal and is output outside the liquid crystal display device and a state where it is not output, and performs bright and dark displays, and further combines them to perform image display. Output, and by combining them, image display is performed. Output, and by combining them, image display is performed.

[0009] Also, a reflective liquid crystal display device utilizes the optical modulation effect of the liquid crystal to select a state where external light, that is, incident light is reflected by the pixel electrode and output outside the device and a state where the incident light is not output outside the device, and performs bright and dark displays, and further combines them to perform image display. A state where the incident light is reflected by the pixel electrode and output outside the device and a state where the incident light is not output outside the device. And by combining them, image display is performed. [[ID=3​​​​​​​​​​​​​​​​​​​​​​[Problems that the invention aims to solve]

[0011] The display panel allows users to touch the screen with their fingers or a stylus as part of the user interface. A touch panel with added input functionality is desired.

[0012] Furthermore, there is a demand for thinner and lighter electronic devices that incorporate touch panels. Therefore, there is a need to make the touch panel itself thinner and lighter.

[0013] For example, a touch panel has a touch sensor installed on the viewing side (display surface side) of the display panel. It can be considered a success.

[0014] For example, a configuration in which a capacitive touch sensor is superimposed on the display surface side of the display panel. In a touch panel, the pixels and wiring that make up the display panel and the electrodes and wiring that make up the touch sensor are used. When the distance between the line and the sensor decreases, noise occurs when the touch sensor drives the display panel. This can make the device more susceptible to interference, resulting in a decrease in the touch panel's detection sensitivity. There is.

[0015] One aspect of the present invention aims to provide a thin touch panel. One of the challenges is to provide a touch panel with high visibility. Alternatively, a lightweight touch panel One of the objectives is to provide a touch panel. Alternatively, to provide a touch panel with reduced power consumption. One of the objectives is to provide it.

[0016] Alternatively, one of the objectives is to provide a novel input device. One of the objectives is to provide [this]. [Means for solving the problem]

[0017] One aspect of the present invention comprises a first substrate, a first conductive layer, a second conductive layer, and a third conductive layer. A touch panel having a fourth conductive layer, a fifth conductive layer, an insulating layer, and a display element. The first conductive layer, the second conductive layer, and the third conductive layer are provided spaced apart on the same plane. In a plan view, the second conductive layer is located between the first conductive layer and the third conductive layer, and the first The conductive layer and the fourth conductive layer are electrically connected, and the third conductive layer and the fourth conductive layer are electrically connected. The second conductive layer and the fourth conductive layer are connected, and the first conductive layer has an overlapping portion with an insulating layer in between. The conductive layer has a mesh-like shape with multiple openings, and the openings and display elements, and the fifth conductive layer This means that the five conductive layers have overlapping regions, and the fifth conductive layer is positioned between the first conductive layer and the display element. Furthermore, the fifth conductive layer has the function of transmitting visible light.

[0018] Furthermore, in the above, it is preferable that the fifth conductive layer contains a metal oxide.

[0019] Furthermore, in the above, the fourth conductive layer and the fifth conductive layer are formed by processing the same film. It is preferable that it is.

[0020] Furthermore, in the above, it is preferable that the display element includes liquid crystal.

[0021] Furthermore, the above has a colored layer, and the colored layer, the opening, the display element, and the fifth conductive The layers preferably have overlapping portions.

[0022] Furthermore, in the above, the fifth conductive layer is electrically connected to a terminal to which a constant potential is supplied. It is preferable that they be present.

[0023] Furthermore, in the above, the second substrate is located above the first conductive layer, and the first conductive layer, the second The second conductive layer, the third conductive layer, the fourth conductive layer, and the fifth conductive layer are formed on the second substrate. It is preferable that this is done.

[0024] Furthermore, the above has a transistor that is electrically connected to the display element, It has a semiconductor layer, and the semiconductor layer and the fifth conductive layer have an oxide containing the same metal element. It is preferable to do so. In this case, the transistor has a first gate electrode and a second gate electrode. The semiconductor layer has a gate electrode, and the semiconductor layer is located between the first gate electrode and the second gate electrode, and the first Either the first or second gate electrode may contain an oxide containing the above-mentioned metal element. preferable.

[0025] Alternatively, the above has a transistor that is electrically connected to the display element, The material has a semiconductor layer, and the semiconductor layer and the fifth conductive layer contain the same oxide semiconductor. This is preferable. In this case, the transistor has a first gate electrode and a second gate electrode. The semiconductor layer is located between the first gate electrode and the second gate electrode, and the first gate Preferably, one of the electrodes or the second gate electrode contains an oxide semiconductor. [Effects of the Invention]

[0026] According to one aspect of the present invention, a thin touch panel can be provided. Or, a highly visible touch panel can be provided. We can provide a touch panel. Or, we can provide a lightweight touch panel. Or, This allows us to provide touch panels with reduced power consumption. [Brief explanation of the drawing]

[0027] [Figure 1] An example of the configuration of a touch panel module according to an embodiment. [Figure 2] An example of the configuration of a touch panel module according to an embodiment. [Figure 3] An example of the configuration of a touch panel module according to an embodiment. [Figure 4] An example of the configuration of a touch panel module according to an embodiment. [Figure 5] An example of the configuration of a touch panel module according to an embodiment. [Figure 6] An example of the configuration of a touch panel module according to an embodiment. [Figure 7] An example of the configuration of a touch panel module according to an embodiment. [Figure 8] An example of the configuration of a touch panel module according to an embodiment. [Figure 9] An example of the configuration of a touch panel module according to an embodiment. [Figure 10] An example of the configuration of a touch panel module according to an embodiment. [Figure 11] An example of the configuration of a touch panel module according to an embodiment. [Figure 12] An example of the configuration of a touch panel module according to an embodiment. [Figure 13] An example of the configuration of a touch panel module according to an embodiment. [Figure 14] An example of the configuration of a touch sensor according to an embodiment. [Figure 15] An example of the configuration of a touch sensor according to an embodiment. [Figure 16] An example of the configuration of a touch sensor according to an embodiment. [Figure 17] An example of the configuration of a touch sensor according to an embodiment. [Figure 18] An example of the configuration of a touch sensor according to an embodiment. [Figure 19] An example of the configuration of a touch sensor according to an embodiment. [Figure 20] An example of a touch panel configuration according to an embodiment. [Figure 21] A block diagram and timing chart diagram of a touch sensor according to an embodiment. [Figure 22] Circuit diagram of a touch sensor according to an embodiment. [Figure 23] A diagram illustrating a pixel equipped with a touch sensor according to an embodiment. [Figure 24] A diagram illustrating the operation of a touch sensor and pixels according to an embodiment. [Figure 25] A diagram illustrating a display module according to an embodiment. [Figure 26] A diagram illustrating an electronic device according to an embodiment. [Modes for carrying out the invention]

[0028] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0029] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0030] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0031] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0032] Furthermore, the words "membrane" and "layer" can be interchanged. There are cases where this is necessary. For example, changing the term "conductive layer" to "conductive film." In some cases, the term "insulating film" can be changed to "insulating layer." .

[0033] (Embodiment 1) This embodiment provides an example of the configuration of an input device (touch sensor) according to one aspect of the present invention, and the present invention An input / output device (touch panel) comprising an input device and a display device (display panel) in one embodiment. Examples will be explained with reference to the drawings.

[0034] In the following, a capacitive touch sensor is applied as a touch sensor according to one aspect of the present invention. Let me explain the case.

[0035] Furthermore, in this specification, etc., a touch panel has the function of displaying (outputting) images, etc. on its display surface. The system detects when an object, such as a finger or stylus, touches or approaches the display surface. It has the function of a touch sensor. Therefore, a touch panel is one form of an input / output device. ru.

[0036] Furthermore, in this specification, the substrate of the touch panel may be, for example, FPC (Flexible Printed Circuit). (print Circuit) or TCP (Tape Carrier Packag e) Connectors such as those listed above are attached, or the circuit board has COG (Chip On G A touch panel module is a device in which an IC (integrated circuit) is mounted using the lass method. Alternatively, it may simply be called a touch panel.

[0037] A capacitive touch sensor applicable to one aspect of the present invention comprises a pair of conductive layers. A capacitance is formed between the pair of conductive layers. When the object to be detected touches or comes into contact with the pair of conductive layers... Detection is performed by utilizing the fact that the capacitance between a pair of conductive layers changes when they are brought close together. It is possible.

[0038] Capacitive capacitance methods include surface capacitance and projected capacitance. There are several types of capacitance systems, including self-capacity systems and mutual-capacity systems. When using a mutual-capacity system... This is preferable because it enables simultaneous multi-point detection.

[0039] Furthermore, it is preferable that the pair of conductive layers constituting the touch sensor each have an opening. More preferably, it is preferable to have a mesh-like shape with multiple openings. It is preferable to arrange the opening and the display element so that they overlap each other. As a result, light from the display element is emitted to the outside through the aperture, thus creating a touch sensor. The pair of conductive layers that make up the sensor no longer need to be light-transmitting. In other words, the touch sensor The materials used for the two conductive layers are metals or alloys that have lower resistance than translucent conductive materials. This makes it possible to apply materials. Therefore, the effects of delays in detection signals are reduced, The detection sensitivity of the touch panel can be increased. Furthermore, such a configuration is suitable for portable devices. Furthermore, it can be suitably applied to large display devices such as televisions.

[0040] Furthermore, the side of the pair of conductive layers that make up the touch sensor that is visible to the viewer has a function to block visible light. It is preferable to provide a light-shielding layer having the conductive properties of the touch sensor. Even when a material that reflects visible light, such as metal, is used as a layer, the conductive layer This helps to suppress the reduction in visibility caused by the reflection of ambient light.

[0041] Furthermore, the pair of conductive layers that make up the touch sensor are, in a plan view, between the two display elements. It is preferable to place them overlapping with the region. At this time, the pair of conductive elements constituting the touch sensor Because the layers are positioned to avoid the optical path of light from the display elements, moiré patterns do not occur in principle. This produces the following effect. Here, moiré refers to the phenomenon that occurs when two or more periodic patterns are superimposed. This refers to the interference fringes that occur. Therefore, it enables the creation of touch panels with extremely high display quality. It is possible.

[0042] Furthermore, the display elements of the touch panel according to one aspect of the present invention include liquid crystal elements and MEMS. Optics using a Micro Electro Mechanical System Elements, organic EL (Electro-Luminescence) elements and light-emitting diodes ( LED (Light Emitting Diode), etc. (light-emitting elements, electrophoretic elements, etc.) Various display elements can be used.

[0043] Here, the touch panel uses a transmissive or reflective liquid crystal display element. It is preferable to apply a display device.

[0044] Furthermore, the pair of conductive layers constituting the touch sensor are made of the pair of substrates that the touch panel has It is preferable to place them on the inside. In particular, multiple conductive layers constituting the touch sensor are used. It is preferable to have a shape that has an opening. Such a conductive layer has a small surface area. This is possible. For example, the conductive layer constituting the touch sensor does not have an opening and is translucent. Compared to using a conductive film, the electrical noise when driving the display element is less A configuration that makes it difficult for the charge to be transmitted to the electrode layer can be made. That is, a display element and a tray can be placed between a pair of substrates. Even when both conductive films constituting the touch sensor are sandwiched together, high detection sensitivity can be achieved. As a result, we were able to create a touch panel that achieves both a thin profile and high detection sensitivity. ru.

[0045] And between the pair of conductive layers that make up the touch sensor and the circuit that drives the display element, It is more preferable to provide a conductive layer capable of supplying a constant potential. Such a conductive layer is a shield. It can function as a layer. Specifically, the conductive layer drives the display element. This prevents noise from the circuit from being transmitted to the touch sensor. Furthermore, the conductive layer As a result, the noise generated when driving the touch sensor affects the display elements and the circuits that drive them. Alternatively, it can prevent the signal from being transmitted to the wiring and other components of the circuit. For example, The timing of driving the indicator element and the timing of driving the touch sensor are staggered. Without taking measures such as suppressing the effects of noise, the display element and touch sensor The ability to drive both sensors simultaneously (to drive them synchronously), and the timing of these drives This makes it possible to drive the elements without synchronization. Therefore, for example, the driving of display elements. By increasing the frequency (also called the frame rate), smoother video display can be achieved. Furthermore, by increasing the drive frequency of the touch sensor, for example, detection accuracy can be improved. This enables the display element's drive frequency and the touch sensor's drive frequency to be controlled separately. It can be freely configured. For example, depending on the situation, either one or both of the drive frequencies can be used. By setting a low number for a period of time, it becomes possible to reduce power consumption.

[0046] Furthermore, the conductive layer and a portion of the pair of conductive layers constituting the touch sensor are made of the same conductive material. It is preferable to form it by processing a film. For example, a bridge placed at the intersection of a pair of conductive layers. The conductive layer for the shield and the conductive layer used as the shielding layer are made from the same conductive film. To form.

[0047] Furthermore, a conductive material with light-transmitting properties is used as the conductive layer that functions as a shielding layer. This is preferable. Alternatively, it is preferable to use an oxide semiconductor with reduced resistance. For example, Conductive metal oxides can be used. By using such materials, metals can be used. This eliminates the effects of oxidation that occur during the process, resulting in a highly reliable touch panel.

[0048] In the following section, a more specific example of one aspect of the present invention will be described with reference to the drawings.

[0049] [Example Configuration] Figure 1(A) is a schematic perspective view of a touch panel module 10 according to one embodiment of the present invention. Furthermore, Figure 1(B) is a schematic perspective view showing the pair of circuit boards of the touch panel module 10 separated. The touch panel module 10 has a configuration in which the substrate 31 and the substrate 21 are bonded together. The touch sensor 22 is located on the circuit board 21 side.

[0050] An FPC 41 is provided on the substrate 21. Also, on the display panel side of the substrate 21, It has a touch sensor 22. The touch sensor 22 has conductive layers 23, 24, 25, etc. It has wiring 29 that electrically connects these conductive layers to the FPC 41. 41 has the function of supplying external signals to the touch sensor 22. Alternatively, FPC4 1 has the function of outputting the signal from the touch sensor 22 to the outside. Note that FPC41 A form factor that does not have this feature is sometimes simply called a touch panel.

[0051] Furthermore, the substrate 21 on which the touch sensor 22 is formed can be considered a touch sensor substrate or a touch sensor substrate. It can also be used as a touch sensor module. For example, such a circuit board can be used on a display panel. By attaching it to the display surface of the device, it can also be used to form a touch panel.

[0052] The touch sensor 22 has multiple conductive layers 23, multiple conductive layers 24, and multiple conductive layers 25 The conductive layer 23 has a shape that is stretched in one direction. Furthermore, multiple conductive layers 23 have their stretch They are arranged in a direction intersecting the extension direction. Multiple conductive layers 24 are arranged in a direction that intersects with two adjacent conductive layers. It is provided so as to be located between the conductive layers 23. The conductive layer 25 is in the direction of extension of the conductive layer 23 and Two adjacent conductive layers 24 are electrically connected along the intersecting direction. That is, multiple conductive layers are connected. Among the electrical layer 24, several are arranged along a direction intersecting the extension direction of the conductive layer 23. The conductive layer 24 is electrically connected by the conductive layer 25.

[0053] Here, conductive layer 23 and conductive layer 25 have overlapping regions. An insulating layer is provided between the electrical layer 25 and the insulating layer.

[0054] A capacitance is formed between the adjacent conductive layer 23 and conductive layer 24. For example, projected electrostatic When using a capacitive drive method, one of the conductive layer 23 and conductive layer 24 is connected to the transmitting side The other end can be used as the receiving electrode.

[0055] In this configuration, the two conductive layers 24 are electrically connected by a conductive layer 25. The conductive layer 24 is shaped by being stretched in one direction, similar to the conductive layer 23, and the conductive layer 24 By having an insulating layer between them, a configuration without a conductive layer 25 may be adopted. At that time, parts of the conductive layer 23 and the conductive layer 24 overlap each other.

[0056] Furthermore, conductive films such as conductive layer 23, conductive layer 24, and conductive layer 25, that is, the components of the touch panel For example, materials with low resistivity are desirable for use in the wiring and electrodes. For example, metals such as silver, copper, and aluminum may be used. Furthermore, very thin Metal nano Wires may also be used. Examples include Ag nanowires, Cu nanowires, and Al nanowires. You may also use materials such as ya. In the case of Ag nanowires, for example, the light transmittance should be 89% or higher, and the sheet resistance should be 89% or higher. The resistance value can be achieved between 40Ω / □ and 100Ω / □. Because nanowires have high transmittance, they are suitable for electrodes used in display elements, such as pixel electrodes and common electrodes. Alternatively, the metal nanowire may be used.

[0057] A display unit 32 is provided on the circuit board 31. The display unit 32 is arranged in a matrix. It has a plurality of pixels 33. Preferably, each pixel 33 has a plurality of sub-pixel circuits. The sub-pixel circuits are electrically connected to the display elements. Also, the display unit is located on the substrate 31. It is preferable to have a circuit 34 that is electrically connected to the pixels 33 in 32. The circuit 34 is, for example, For example, a circuit that functions as a gate drive circuit can be applied. FPC42 is a display unit It has the function of supplying an external signal to at least one of 32 or circuit 34. It is preferable to mount the IC that functions as a source drive circuit on the substrate 31 or FPC 42. The IC may be mounted on the substrate 31 using the COG method, or the IC may be mounted on the FP You can also install C42, TAB, TCP, etc.

[0058] In one aspect of the present invention, a touch panel module is configured such that touch operations are performed by a touch sensor 22. Based on the change in capacity when it is broken, location information can be output. Also, the display unit 32 And, it can display images.

[0059] [Cross-sectional configuration example 1] The following describes an example of the cross-sectional configuration of the touch panel module 10 with reference to the drawings. The touch panel module 10 shown below uses a transverse field type liquid crystal display as its display element. This is an application of the element.

[0060] Figure 2 is a schematic cross-sectional view of the touch panel module 10. In Figure 2, as in Figure 1(A) The region including the FPC42, the region including the circuit 34, the region including the display unit 32, and the FPC41 This shows a cross-section of the region, including the area it contains.

[0061] Substrate 21 and substrate 31 are bonded together by an adhesive layer 141. The liquid crystal 152 is sealed in the region surrounded by the substrate 31 and the adhesive layer 141.

[0062] Between substrate 31 and substrate 21 is a touch sensor 22 including conductive layers 23 and 24. Connection part 101, wiring 29, display element 60, transistor 201, transistor 202, capacity A measuring element 203, a connection part 204, wiring 35, etc., are provided.

[0063] On the substrate 31 are insulating layers such as insulating layer 211, insulating layer 212, insulating layer 213, insulating layer 214, etc. A layer is provided. A portion of the insulating layer 211 serves as the gate insulating layer for each transistor. It functions, and other parts also function as dielectrics for the capacitive element 203. Insulating layer 212, The insulating layer 213 and the insulating layer 214 are provided covering each transistor, capacitive element 203, etc. The insulating layer 214 functions as a planarization layer. In a case where the insulating layer covering the ta etc. has three layers: insulating layer 212, insulating layer 213, and insulating layer 214 While it indicates a combination, it is not limited to this; it can be four or more layers, or even a single or two-layer structure. It is also acceptable to omit the insulating layer 214, which functions as a planarizing layer, if it is not needed. .

[0064] Furthermore, the substrate 31 has a conductive layer 221, a conductive layer 222, a conductive layer 223, and a semiconductor layer 231. A conductive layer 151, etc., is provided. Here, multiple materials obtained by processing the same conductive film are provided. Sometimes, layers are described using the same symbol.

[0065] The conductive layer 221 is used as the gate electrode of each transistor, as well as one electrode of the capacitive element 203, It can be used for wiring, etc. The conductive layer 222 is the source electrode of each transistor or It can be used as a drain electrode, the other electrode of the capacitive element 203, or wiring, etc. The conductive layer 223 is used as the other gate electrode of each transistor, or for wiring, etc. This is possible. The semiconductor layer 231 can be used as a semiconductor layer in a transistor, etc.

[0066] Figure 2 shows a cross-section of one subpixel as an example of the display unit 32. For example, a subpixel This subpixel must be one of the following: a subpixel that exhibits red light, a subpixel that exhibits green light, or a subpixel that exhibits blue light. This allows for full-color display. For example, the sub-pixel shown in Figure 2 is a transistor 2 It has 02, a capacitive element 203, a display element 60, and a colored layer 131R. Here, The sub-pixel circuit is composed of a transistor 202, a capacitive element 203, and wiring, etc.

[0067] Figure 2 shows an example of circuit 34 in which transistor 201 is provided.

[0068] Figure 2 shows examples of transistors 201 and 202, in which channels are formed. The semiconductor layer 231 is sandwiched between two gate electrodes (conductive layer 221, conductive layer 223). An example of its application is shown. Such a transistor has a different electric field compared to other transistors. It is possible to increase the effective mobility and increase the on-current. As a result, It is possible to create circuits capable of high-speed operation. Furthermore, it is possible to reduce the area occupied by the circuit section. This becomes possible. By applying a transistor with a large on-current, a display panel or a Even if the number of wires increases when the touch panel is made larger or higher resolution, each wire It is possible to reduce the signal delay and suppress display inconsistencies.

[0069] Here, in Figure 2, etc., for the sake of clarity, the transistor 20 is placed directly below the display element 60. This shows an example where elements 2 and capacitive elements 203 are arranged. In the case of a reflective liquid crystal display device. This includes transistors, capacitive elements, or wiring that constitutes the circuit, and the display element 60. By overlapping them, the aperture ratio can be increased. Also, in the case of transmissive liquid crystal display devices... In this configuration, a layer containing a light-transmitting material is placed below the display element 60, and the transistor 20 It is preferable to have a configuration in which elements such as 2 and the capacitive element 203 are not placed.

[0070] Furthermore, when using a reflective liquid crystal display device, the conductive layer 151 is transposed as shown in Figure 2. When placed in overlapping configuration with the semiconductor layer 231 of ZISTA 202, the aperture ratio of the subpixels can be increased. Therefore, it is preferable to provide a conductive layer 223 between the conductive layer 151 and the semiconductor layer 231. It is preferable that the conductive layer 223 reduces the influence of the electric field of the conductive layer 151 on the semiconductor layer 231. The signal is not transmitted, and malfunctions are suppressed. Note that if the conductive layer 223 is not provided, for example... As shown in Figure 3, the semiconductor layer 231 and the conductive layer 151 are arranged so that they do not overlap. It is preferable to do so.

[0071] Note that the transistors in circuit 34 and the transistors in display unit 32 have the same structure. It may be constructed in the same way. Also, all of the transistors in circuit 34 have the same structure. Alternatively, a combination of transistors with different structures may be used. Also, the display unit 32 Multiple transistors may all have the same structure, or they may have different structures. You may also use it in combination with other characters.

[0072] At least one of the insulating layers 212 and 213 covering each transistor is protected from water and hydrogen It is preferable to use a material that does not easily allow impurities such as to diffuse. That is, the insulating layer 212 and The insulating layer 213 can function as a barrier film. This makes it possible to effectively suppress the diffusion of impurities from the outside into the transistor. This enables the creation of highly reliable touch panels.

[0073] Figure 2 shows that the display element 60 has FFS (Fringe Field Switching). This shows an example using a liquid crystal element to which the mode is applied. The display element 60 has a conductive layer 1 It has 51, liquid crystal 152, and conductive layer 153. The orientation of the liquid crystal can be controlled by the electric field.

[0074] A conductive layer 153 is placed on the insulating layer 214. The conductive layer 153 is covered by the insulating layer A 215 is provided, and a conductive layer 151 is provided on the insulating layer 215. The conductive layer 151 is Through the openings provided in insulating layer 215, insulating layer 214, insulating layer 213, and insulating layer 212 It is electrically connected to either the source or drain of the transistor 202.

[0075] The conductive layer 151 has a comb-like upper surface shape, or an upper surface shape with slits (planar shape). It also has (also known as). Furthermore, the conductive layer 153 is arranged in overlap with the conductive layer 151. In the region overlapping with the colored layer 131R, etc., the conductive layer 151 is arranged on the conductive layer 153. It has a missing part.

[0076] In Figure 2, conductive layer 151 functions as a pixel electrode, and conductive layer 153 functions as a common electrode. The conductive layer 151 is provided on the upper layer and has a comb-like or slit-like upper surface shape. It is also possible to use a common electrode and a conductive layer 153 provided in the lower layer as a pixel electrode. In that case, the conductive layer 153 is electrically connected to either the source or drain of the transistor 202. You just need to connect to it.

[0077] On the side of substrate 21 facing substrate 31, there are insulating layer 126, light-shielding layer 115, insulating layer 127, and conductive layer 23, conductive layer 24, conductive layer 25, wiring 29, insulating layer 121, insulating layer 123, spacer 12 4. A colored layer 131R, a colored layer 131B, etc., are provided.

[0078] Figure 2 shows a cross-section of the intersection of conductive layer 23 and conductive layer 24. It is provided on the same plane as 24. Between conductive layer 25 and conductive layer 23 and conductive layer 24 An insulating layer 121 is provided. A portion of the conductive layer 25 overlaps with the conductive layer 23. The two conductive layers 24 sandwiching layer 23 are connected to the conductive layer 25 through an opening provided in the insulating layer 121. They are electrically connected.

[0079] The colored layer 131R is provided on the substrate 31 side of the conductive layer 27. An insulating layer 123 is provided covering the above.

[0080] In Figure 2, the display element 60 consists of a conductive layer 151, a part of the conductive layer 153, and a position above these. It is composed of a liquid crystal 152.

[0081] Furthermore, in the conductive layer 151, insulating layer 214, etc., the surface in contact with the liquid crystal 152 is made of liquid crystal 15 An orientation film may be provided to control the orientation of 2.

[0082] In the configuration shown in Figure 2, the conductive layer 23 is arranged so as not to overlap with the display element 60. This indicates that the opening in the conductive layer 23 and the display element 60 overlap. A conductive layer 23 is arranged therein. Alternatively, the conductive layer 23 is located between two adjacent subpixels. It can also be said that it is positioned so as to overlap with the region between the two conductive layers 151. It is possible. Note that although an example of conductive layer 23 is shown here, conductive layers 24 and 25 can be treated similarly. Preferably, the elements are arranged so as not to overlap with the display elements 60.

[0083] For example, if the display element 60 is a reflective liquid crystal element, the conductive layer 151 and conductive layer 15 Materials that reflect visible light can be used in either or both of the three. By using a material that reflects visible light, the aperture ratio can be increased. Also, conductive layer 153 A material that reflects visible light may be used for the first layer, and a material that transmits visible light may be used for the conductive layer 151. With this configuration, the display element 60 can be a reflective liquid crystal element.

[0084] On the other hand, if the display element 60 is a transmissive liquid crystal element, the conductive layer 151 and conductive layer 15 Materials that transmit visible light can be used in either or both of the three. Using a material that transmits visible light can increase the aperture ratio. Also, conductive layer 153 A material that transmits visible light may be used for the first layer, and a material that blocks visible light may be used for the conductive layer 151.

[0085] If the display element 60 is a transmissive liquid crystal element, for example, a polarizing plate (not shown) is placed between the display unit. Two are placed. Light from the backlight, which is positioned outside the polarizing plate, passes through the polarizing plate. It is incident. At this time, the voltage applied between conductive layer 151 and conductive layer 153 causes the liquid crystal 1 The orientation of 52 can be controlled, and the optical modulation of light can be controlled. That is, via a polarizer The intensity of the emitted light can be controlled. Furthermore, the incident light is specified by the colored layer 131R. Light outside the specified wavelength range is absorbed, resulting in emitted light that, for example, exhibits a red color. ru.

[0086] In addition to polarizing plates, circular polarizing plates can also be used, for example. Alternatively, a device consisting of a linear polarizer and a quarter-wavelength phase difference plate can be used. This reduces the dependence on the field of view.

[0087] Here, the display element 60 is defined as being approximately perpendicular to the thickness direction of the touch panel module 10. A pair of electrodes are positioned in the direction, and an electric field is applied to the liquid crystal 152 in a direction approximately perpendicular to the thickness direction. This shows a method of applying an electric field in the thickness direction. However, the electrode arrangement method is not limited to this, and The method of cutting may also be applied.

[0088] Liquid crystal elements applicable to the display element 60 include liquid crystal elements to which various modes are applied. It is possible to be in VA (Vertical Alignment) mode, TN (Twisted Nematic) mode, IPS (In-Plane Switch) ing) mode, FFS (Fringe Field Switching) mode, A SM(Axially Symmetrically aligned Micro-cell) Mode, OCB (Optically Compensated Birefringence) nce) mode, FLC (Ferroelectric Liquid Crystal ) mode, AFLC (AntiFerroelectric Liquid Cryst Liquid crystal elements to which the al) mode or similar are applied can be used.

[0089] Furthermore, the touch panel module 10 is equipped with a normally black type liquid crystal display device, for example, a vertical A transmissive liquid crystal display device employing vertical alignment (VA) mode may also be used. As for the name, MVA (Multi-Domain Vertical Alignment) t) Mode, PVA (Patterned Vertical Alignment) Mode You can use modes such as ASV mode.

[0090] Furthermore, a liquid crystal element is an element that controls the transmission or non-transmission of light through the optical modulation effect of liquid crystals. That is the case. Furthermore, the optical modulation effect of liquid crystals is due to the electric field acting on the liquid crystal (horizontal electric field, vertical electric field) It is controlled by an electric field (including a field or oblique electric field). Note that the liquid crystal used in the liquid crystal element is These include thermotropic liquid crystals, low molecular weight liquid crystals, polymer liquid crystals, and polymer dispersed liquid crystals (PDLC:P Olymer Dispersed Liquid Crystal, ferroelectric liquid crystal Antiferroelectric liquid crystals can be used. Depending on the conditions, these liquid crystal materials may have cholesterol It exhibits phases such as the smectic phase, cubic phase, chiral nematic phase, and isotropic phase.

[0091] Furthermore, either positive-type or negative-type liquid crystals may be used as the liquid crystal material. The optimal liquid crystal material should be used depending on the mode and design to be applied.

[0092] Furthermore, when employing a transverse electric field method, it is also possible to use a liquid crystal that exhibits a blue phase without using an alignment layer. The blue phase is one of the liquid crystal phases, and as the temperature of cholesteric liquid crystal is increased, the cholesteric phase This phase appears just before the transition from the blue phase to the isotropic phase. The blue phase only appears within a narrow temperature range. To improve the temperature range, a liquid crystal assembly containing several weight percent or more of chiral agent was mixed in. The resulting material is used in the liquid crystal layer. The liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent provides a fast response. It has a short intensity and is optically isotropic. Furthermore, it is a liquid crystal mixture containing a blue phase liquid crystal and a chiral agent. The resulting product does not require alignment processing and has low viewing angle dependence. Furthermore, it does not require an alignment layer. Therefore, rubbing is unnecessary, thus preventing electrostatic discharge damage caused by rubbing. This can be stopped, reducing defects and damage to liquid crystal displays during the manufacturing process.

[0093] The conductive layer 27 is provided to cover the area of ​​the display unit 32 where the conductive layer 25 is not provided. It is.

[0094] Furthermore, as shown in Figure 2, the conductive layer 25 and the conductive layer 27 are formed by processing the same film. It is preferable that this is the case.

[0095] It is preferable that conductive materials that transmit visible light are used for conductive layers 25 and 27.

[0096] The conductive layers 25 and 27, which transmit visible light, are made of a conductive material including, for example, a metal oxide. It is composed of including. For example, among the transparent conductive materials described later, metal oxides are used. It is possible to be there.

[0097] Alternatively, conductive layer 25 and conductive layer 27 contain the same metal element as the other conductive layers and semiconductor layers. It is preferable to use a metal oxide. In particular, the transistors of the touch panel module 10 When an oxide semiconductor is used in the semiconductor layer of a zista, conductive acids containing metal elements are used. It is preferable to apply a chemical agent.

[0098] By using a conductive metal oxide as the conductive layer 27, oxidation of its surface is suppressed. This enables the realization of a highly reliable touch panel module 10.

[0099] In Figure 2, the conductive layer 27 is arranged in superimposed on the conductive layer 23, conductive layer 24, etc. Therefore, to apply a common potential, ground potential, or any other arbitrary constant potential to the conductive layer 27 Therefore, when conductive layer 23 and conductive layer 24 are driven, the electrical energy emitted to the substrate 31 side Noise can be shielded. At the same time, the sub-pixel circuit provided on the substrate 31 is driven. When this is done, electrical noise emitted to the circuit board 21 can be shielded.

[0100] At this time, if a constant potential that does not affect the switching of the liquid crystal 152 is supplied to the conductive layer 27, That's fine. For example, you can use the ground potential, common potential, or any constant potential. Alternatively, the conductive layer 27 and the conductive layer 153 may be at the same potential.

[0101] Furthermore, by applying an appropriate potential to the conductive layer 27, the potential between the conductive layer 151 and the conductive layer 153 can be controlled. By reducing the component in the thickness direction of the electric field (direction of electric field lines) generated between them, it becomes more effective. This allows the electric field to be directed in a direction roughly perpendicular to the thickness (lateral direction). This suppresses alignment defects in the liquid crystal 152 and prevents malfunctions such as light leakage. It is possible.

[0102] A connection portion 204 is provided in the region near the edge of the substrate 31. The connection portion 204 is It is electrically connected to the FPC42 via the subsequent layer 242. In Figure 2, part of the wiring 35 and This shows an example in which the connection part 204 is formed by laminating conductive layers 223. A connecting portion 101 is provided in the region near the end of 21. The connecting portion 101 is connected to the connecting layer 2 It is electrically connected to the FPC41 via 41. In the configuration shown in Figure 2, one of the wires 29 The connecting portion 101 is formed by laminating the conductive layer and a conductive layer obtained by processing the same conductive film as the conductive layer 25. This shows an example of its composition.

[0103] Figure 2 also shows, as an example, a conductive layer 221 that functions as wiring, and a conductive layer that functions as wiring. This shows the cross-sectional structure of the intersection with the conductive layer 222. For example, the conductive layer 221 can be used as a scanning line. It is used as either or both of the wiring that functions as a capacitance line and the wiring that functions as a capacitance line, and the conductive layer 22 Line 2 can be used as wiring that functions as a signal line.

[0104] Here, the substrate above the substrate 21 is the substrate that is directly touched by the object to be detected, such as a finger or stylus. A polarizing plate or circular polarizing plate may be provided between the substrate 21 and the substrate. It is preferable to do so. In that case, a protective layer (ceramic coating, etc.) is provided on the substrate. This is preferable. The protective layer may be, for example, silicon oxide, aluminum oxide, yttrium oxide, Inorganic insulating materials such as yttria-stabilized zirconia (YSZ) can be used. Tempered glass may be used for the substrate. Tempered glass can be tempered using methods such as ion exchange or air cooling. By using materials that have undergone more physical or chemical treatment and have compressive stress applied to their surface, It is possible.

[0105] The insulating layer 123 allows impurities such as pigments contained in the colored layer 131R to diffuse into the liquid crystal 152. It functions as an overcoat to prevent this from happening.

[0106] The spacer 124 is provided on the insulating layer 123, and the distance between the substrate 21 and the substrate 31 is constant. It has a function to prevent it from getting too close. Figure 2 shows the spacer 124 and the structure on the substrate 31 side (for example) The example shows a case where the conductive layer 151 and the insulating layer 214 are not in contact, but when they are in contact... This is also fine. Here, we have shown an example where the spacer 124 is provided on the substrate 21 side, but the substrate It may be provided on the 31 side. For example, two conductive layers 151 that are present on two adjacent subpixels They can be placed in between. Alternatively, granular spacers may be used as spacer 124. While materials such as silica can be used as spacers, organic resins and rubber can also be used. It is preferable to use a material with elasticity. In this case, the granular spacer is compressed in the vertical direction. It may take on a modified shape.

[0107] Here, as shown in Figure 2, there is a spacer 124 and a conductive layer 23 (or conductive layer 24, conductive layer 2 It is preferable to place it in overlapping position with 5). This way, the portion where the display element 60 is placed Since spacer 124 is not placed there, light is absorbed, refracted or Because there is no scattering, the efficiency of light extraction can be improved.

[0108] In one embodiment of the present invention, a touch panel module 10 is provided with a conductive layer 23 and a conductive layer 24 A light-shielding layer 115 is provided on the substrate 21 side to suppress color mixing between adjacent subpixels. Therefore, the light-shielding layer 115 causes the conductive layer 23 and conductive layer 24 to reflect external light, thus improving visibility. This can suppress the deterioration of conductivity. Therefore, conductive layer 23, conductive layer 24 and Therefore, a material that reflects visible light can be used. Alternatively, a material that transmits visible light can be used. Even if they are present, there are parts where conductive layer 23 and conductive layer 24 are arranged and parts where they are not. Since the boundary is not visible, visibility can be improved.

[0109] On the other hand, since the conductive layer 27 is composed of a material that transmits visible light, the display element 60 and Light that has passed through the colored layer 131R, etc., passes through the conductive layer 27 and is emitted to the outside.

[0110] Note that Figure 2 shows a configuration in which the insulating layer 123 is provided covering the colored layer 131R, etc. Alternatively, the insulating layer 123 may be omitted. In this way, the touch panel module 1 The photomask and patterning processes required to create the zero can be omitted.

[0111] Figure 2 shows the case where the conductive layer 27 is positioned on the substrate 21 side of the colored layer 131R. However, these elements can simply be arranged in a layered manner; the configuration is not limited to this one.

[0112] The touch panel module 10 shown in Figure 3 has a conductive layer 27 that is positioned more than the colored layer 131R on the substrate 3 This shows an example of the configuration when placed on side 1.

[0113] Furthermore, the touch panel modules shown in Figures 4 and 5 have a conductive layer 27 that is wider than the insulating layer 123. This shows an example of the configuration when placed on the substrate 31 side.

[0114] Figures 4 and 5 differ in that the shape of the openings provided in the insulating layer 123 is different.

[0115] In Figure 4, the conductive layer 25 is formed so that it does not overlap with the insulating layer 123. An opening is formed in the insulating layer 123, including at that location and its vicinity.

[0116] On the other hand, in Figure 5, a portion of the insulating layer 123 is placed between the conductive layer 25 and the insulating layer 121. This shows the case where the insulating layer 123 has been processed. In this case, the conductive layer 25 and the conductive layer Layer 24 is electrically connected to the insulating layer 121 and the insulating layer 123 through openings provided in them. ru.

[0117] Figure 6 shows an example in which the colored layer 131R, etc., is placed on the substrate 21 side of the conductive layer 27. Furthermore, in the configuration shown in Figure 6, an insulating layer 127 is provided covering the colored layer 131R. The edge layer 127 covers the stepped areas such as the colored layer 131R, thereby covering the conductive layer 23 and conductive layer 2 The flatness of the surface to which the fourth-order particle is formed is improved, and the uniformity of the detection sensitivity can be enhanced.

[0118] The above is a description of example 1 of the cross-sectional configuration.

[0119] [Cross-sectional configuration example 2] The following describes an example of a cross-sectional configuration that differs in some aspects from the one described above. Specifically, An example of a cross-sectional configuration when oxide semiconductors are used for the electrolytic layer 25 and the conductive layer 27 will be described. ru.

[0120] Figure 7, compared to Figure 2, has an insulating layer 122 that covers the conductive layer 25, conductive layer 27, etc. They are mainly different.

[0121] The conductive layer 25 and the conductive layer 27 are composed of a low-resistance oxide semiconductor. This is preferable. In particular, acid is used in the semiconductor layer of the transistors in the touch panel module 10. When using an oxide semiconductor, it is preferable to use an oxide semiconductor with lower resistivity. stomach.

[0122] For example, the resistivity of the oxide semiconductor can be controlled as described later, thereby reducing the resistance of the conductive layer 27. It is possible.

[0123] Furthermore, the insulating layer 122 covering the conductive layer 25 and the conductive layer 27 contains a large amount of hydrogen. It is preferable to use an insulating layer. In particular, the insulating layer 122 contains an insulating film containing silicon nitride. It is preferable to do so.

[0124] By using a conductive metal oxide or a low-resistance oxide semiconductor as the conductive layer 27... As a result, oxidation of its surface is suppressed, and a highly reliable touch panel module 10 is realized. This makes it possible.

[0125] Figures 8, 9, 10, and 11 each show an example of the case where an insulating layer 122 is added to Figures 3, 4, 5, and 6, respectively. In Figures 8 to 11, the conductive layer 25 and the conductive layer 27 each include an oxide semiconductor containing the same metal as the semiconductor layer and the conductive layer 223 of the transistor. They are configured to include the semiconductor.

[0126] The above is the description of Cross-sectional Configuration Example 2.

[0127] [Modification Example] Hereinafter, examples of transistors having a top gate type structure in a touch panel according to one aspect of the present invention are shown in FIGS. 12 and 13.

[0128] The touch panel module shown in FIG. 12 mainly differs in the structure of the transistors 301 and 302 as compared with the configuration illustrated in FIG. 2. Since the configuration other than the structure of the transistors is substantially the same as that shown in FIG. 2, the same reference numerals are used for the same parts, and detailed description of the common parts will be omitted.

[0129] Further, the touch panel module shown in FIG. 13 shows an example of the case where a top gate type transistor is applied to the configuration illustrated in FIG. 7.

[0130] FIGS. 12 and 13 show examples of the case where a liquid crystal element to which the FFS mode is applied is used for the display element 60. The display element 60 has a conductive layer 151, a liquid crystal 152, and a conductive layer 153.

[0131] Transistors 301 and 302 have a semiconductor layer and a gate insulating layer on the buffer layer 300. It functions as an insulating layer and a gate electrode that overlaps with the semiconductor layer via a gate insulating layer. A conductive layer, an insulating layer covering the conductive layer which functions as a gate electrode, and a source electrode which functions as a gate electrode. It has a conductive layer and a conductive layer that functions as a drain electrode. Also, if it overlaps with the gate electrode The region of the semiconductor layer without resistance is made to have lower resistance than the channel formation region that overlaps with the gate electrode. This is preferable.

[0132] When using an oxide semiconductor layer, channel formation occurs in the region of the semiconductor layer that does not overlap with the gate electrode. To create a region with lower resistance than the region, impurity elements (rare) are added to the semiconductor layer that does not overlap with the gate electrode. It is preferable to add gases such as nitrogen, phosphorus, boron, and hydrogen. Helium, argon, etc. can be used. Furthermore, as a method for adding impurities, Methods using plasma or ion implantation can be used. Then, using the gate electrode as a mask, impurity elements are added in a self-aligned manner to a part of the oxide semiconductor layer. This allows for a reduction in resistance, which is preferable.

[0133] The capacitive element 203 has a conductive layer that functions as a gate electrode and a source electrode or drain electrode. A conductive layer that functions as an electrode and an insulating layer placed between them are formed as dielectrics. Furthermore, the connection portion 204 is formed by laminating a part of the wiring 35 with the conductive layer 223. The conductive layer 223 is formed using the sputtering method in an atmosphere containing oxygen gas. By doing so, oxygen or excess oxygen is added to the insulating layer 212, which is the surface on which the conductive layer 223 is formed. Furthermore, excess oxygen compensates for oxygen vacancies in the oxide semiconductor layers of transistors 301 and 302. This allows for the realization of highly reliable transistors. Furthermore, the insulating layer 212 and / Alternatively, when an excess of oxygen is supplied into the oxide semiconductor layer, the insulating layer 213 is the oxygen It is preferable to use a material that can suppress transmission.

[0134] The buffer layer 300 uses insulating materials such as silicon oxide or metal oxides. Examples of metal oxides used as 300 include aluminum, indium, gallium, and zinc. An oxide containing one or more of these elements is used. In addition, the buffer layer 300 contains water, hydrogen, etc. It is preferable to use a material that does not easily allow impurities to diffuse. That is, the buffer layer 300 is burr It can function as a film. With this configuration, transistor 301 This makes it possible to effectively suppress the diffusion of impurities from the outside into 302, This enables the creation of highly reliable touch panels.

[0135] The above is an explanation of the variations.

[0136] [Regarding each component] The following sections will explain each of the components listed above.

[0137] {substrate} The substrate of the touch panel can be made of a material having a flat surface. The substrate that extracts the light from the source is made of a material that transmits the light. For example, glass or quartz. Materials such as ceramics, sapphires, and organic resins can be used.

[0138] By using a thin substrate, it is possible to make the touch panel lighter and thinner. Furthermore, by using a substrate of sufficient thickness to be flexible, a flexible touch panel can be created. This can be achieved.

[0139] As the glass, for example, alkali-free glass, barium borosilicate glass, aluminoborosilicate glass, etc. can be used. etc. can be used.

[0140] As the material having flexibility and transparency to visible light, for example, glass with a thickness having a certain degree of flexibility, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other polyester resins, polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. can be mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. Further, a substrate impregnated with an organic resin in glass fibers or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used. Since a substrate using such a material is light in weight, a touch panel using the substrate can also be made lightweight. resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. can be mentioned. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. Further, a substrate impregnated with an organic resin in glass fibers or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used. resin, polyimide resin, PET, etc. can be preferably used. Further, a substrate impregnated with an organic resin in glass fibers or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used. resin, polyimide resin, PET, etc. can be preferably used. Further, a substrate impregnated with an organic resin in glass fibers or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used. Since a substrate using such a material is light in weight, a touch panel using the substrate can also be made lightweight. Since a substrate using such a material is light in weight, a touch panel using the substrate can also be made lightweight.

[0141] In addition, since the substrate on the side where light emission is not extracted does not have to have translucency, in addition to the substrates mentioned above, a metal substrate, a ceramic substrate, or a semiconductor substrate, etc. can also be used. Since metal materials and alloy materials have high thermal conductivity and can easily conduct heat to the entire sealing substrate, local temperature rise of the touch panel can be suppressed, which is preferable. In order to obtain flexibility and bendability, the thickness of the metal substrate is preferably 10 μm or more and 200 μm or less, and 20 μm or more and 5 the thickness of the metal substrate is preferably 10 μm or more and 200 μm or less, and 20 μm or more and 5 the thickness of the metal substrate is preferably 10 μm or more and 200 μm or less, and 20 μm or more and 5 It is more preferable that the particle size be 0 μm or less.

[0142] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, and nickel are used. Preferably, metals such as buckle, or alloys such as aluminum alloy or stainless steel are used. It is possible.

[0143] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating film on the surface. A substrate that has been treated may be used. For example, a coating method such as spin coating or dip coating, or an electric coating method may be used. An insulating film may be formed using methods such as deposition, vapor deposition, or sputtering, or in an oxygen atmosphere. In addition to leaving it exposed to air or heating it, an oxide film can be formed on the surface of the substrate by methods such as anodizing. That's fine.

[0144] A hard coat layer is applied to a flexible substrate to protect the surface of the touch panel from scratches, etc. (Example) For example, a silicon nitride layer, or a layer of material that can distribute pressure (for example, an aramid resin layer). It may be constructed by stacking elements such as ( ) and others. Also, the lifespan of the display element may be reduced due to moisture, etc. To suppress this, a flexible substrate may be laminated with an insulating film that has low water permeability. For example, silicon nitride, silicon oxide nitride, aluminum oxide, aluminum nitride, etc. Mechanical insulating materials can be used.

[0145] The substrate can also be constructed by stacking multiple layers. In particular, it can be configured to include a glass layer. This improves the barrier properties against water and oxygen, resulting in a more reliable touch panel. ru.

[0146] For example, a substrate is used in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the display element. It is possible. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness shall be between 25 μm and 100 μm. Glass layers of this thickness are resistant to water and oxygen. It can achieve both high barrier properties and flexibility simultaneously. Furthermore, the thickness of the organic resin layer is 10 μm. The thickness should be 200 μm or less, preferably 20 μm or more and 50 μm or less. Such organic resin By adding a layer, cracks and fractures in the glass layer are suppressed, and mechanical strength is improved. This can be achieved. By applying such a composite material of glass material and organic resin to a substrate, This allows for the creation of an extremely reliable and flexible touch panel.

[0147] {transistor} A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer. The above shows the case where a bottom-gate transistor is applied. It is.

[0148] The structure of the transistors in the touch panel according to one aspect of the present invention is not particularly limited. For example, it can be a staggered transistor or an inverse staggered transistor. Good. Furthermore, it can be either a top-gate or bottom-gate transistor structure. The semiconductor material used in transistors is not particularly limited; for example, oxide semiconductors, silicon Examples include cellulose and germanium.

[0149] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor having a region may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0150] Furthermore, semiconductor materials used in transistors include, for example, elements of Group 14 and compound semiconductors. Conductors or oxide semiconductors can be used as semiconductor layers. Typically, silicon-containing semiconductors... Conductors, semiconductors containing gallium arsenide, or oxide semiconductors containing indium can be applied.

[0151] In particular, it is preferable to use oxide semiconductors with a larger band gap than silicon. Using semiconductor materials with a wider band gap and lower carrier density than silicon This is preferable because it reduces the current when the transistor is off.

[0152] For example, the above oxide semiconductor may contain at least indium (In) or zinc (Zn). Preferably contains ). More preferably In-M-Zn oxide (where M is Al, Ti, G Oxides (metals such as a, Ge, Y, Zr, Sn, La, Ce, Hf, or Nd) Includes.

[0153] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. Alternatively, the crystals are oriented roughly perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystal regions. It is preferable to use an oxide semiconductor film that cannot be processed.

[0154] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitable for applications that are flexible and can be bent, such as touch panels. It can be used.

[0155] Furthermore, by using an oxide semiconductor with such crystalline properties as the semiconductor layer, the electrical properties This suppresses fluctuations and enables the creation of highly reliable transistors.

[0156] Furthermore, transistors using oxide semiconductors with a larger band gap than silicon, Due to its low off-current, the charge stored in the capacitor connected in series with the transistor can be stored for a long period of time. It is possible to hold it over a period of time. By applying such a transistor to a pixel, It also becomes possible to stop the drive circuit while maintaining the gradation of each pixel. As a result, it becomes extremely quiet. This enables the creation of display devices with reduced power consumption.

[0157] The semiconductor layer is, for example, made of at least indium, zinc, and M(Al, Ti, Ga, Y, Zr A film represented as In-M-Zn oxide containing metals such as La, Ce, Sn, or Hf. It is preferable to include it. Also, variations in the electrical characteristics of transistors using the oxide semiconductor. To reduce these, it is preferable to include stabilizers along with them.

[0158] As stabilizers, metals such as gallium, tin, and HAF are used, including the metals listed in M ​​above. Examples include nium, aluminum, or zirconium. Also, other stabilizers include... These are lanthanides: lanthanum, cerium, praseodymium, neodymium, samarium, Europium, gadolinium, terbium, dysprosium, holmium, erbium, Examples include thulium, ytterbium, and lutetium.

[0159] Examples of oxide semiconductors that constitute the semiconductor layer include In-Ga-Zn oxides, In- Al-Zn oxides, In-Sn-Zn oxides, In-Hf-Zn oxides, In-L α-Zn oxides, In-Ce-Zn oxides, In-Pr-Zn oxides, In-Nd -Zn oxides, In-Sm-Zn oxides, In-Eu-Zn oxides, In-Gd- Zn oxides, In-Tb-Zn oxides, In-Dy-Zn oxides, In-Ho-Z n-based oxides, In-Er-Zn-based oxides, In-Tm-Zn-based oxides, In-Yb-Zn In-Lu-Zn ​​oxides, In-Sn-Ga-Zn oxides, In-Hf- Ga-Zn oxides, In-Al-Ga-Zn oxides, In-Sn-Al-Zn oxides The materials used include In-Sn-Hf-Zn oxides and In-Hf-Al-Zn oxides. can.

[0160] In this context, In-Ga-Zn oxides are those that have In, Ga, and Zn as their main components. It means an oxide, and the ratio of In, Ga, and Zn is not specified. Other metal elements besides n may be present.

[0161] Furthermore, the semiconductor layer and the conductive layer may have the same metal element among the above-mentioned oxides. By using the same metal element for both the semiconductor layer and the conductive layer, manufacturing costs can be reduced. For example, manufacturing costs can be reduced by using metal oxide targets with the same metal composition. It can be done. Also, etching gas or etching when processing the semiconductor layer and conductive layer. The sealing solution can be used in common. However, the semiconductor layer and the conductive layer must be made of the same metal element. Even if they have the same properties, their composition may differ. For example, the fabrication process of transistors and capacitive elements. During this process, metal elements may detach from the film, resulting in a different metallic composition.

[0162] Furthermore, when the semiconductor layer is an In-M-Zn oxide, In and M are excluded from Zn and O. The atomic ratio of is preferably such that when the sum of In and M is 100 atomic%, In The atom is higher than 25 atomic%, M is less than 75 atomic%, and more preferably In is The value must be higher than 34 atomic percent and M must be less than 66 atomic percent.

[0163] The semiconductor layer has an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably Or it is 3 eV or more. Thus, oxide semiconductors with a wide energy gap are used. This reduces the transistor's off-current.

[0164] The thickness of the semiconductor layer is 3 nm to 200 nm, preferably 3 nm to 100 nm. More preferably, the wavelength is between 3 nm and 50 nm.

[0165] The semiconductor layer is made of In-M-Zn oxide (where M is Al, Ti, Ga, Ge, Y, Zr, Sn, L). In the case of a, Ce, Hf or Nd, the spars used to deposit In-M-Zn oxide films The atomic ratio of the metal elements in the tarring target is preferably such that In ≥ M and Zn ≥ M. It is so. The atomic ratio of metal elements in such a sputtering target is In:M:Z n=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=3:1:2 are preferred. The atomic ratio of the semiconductor layer to be deposited will be adjusted as an error for the sputtering process described above. This includes a variation of plus or minus 40% in the atomic ratio of metal elements contained in the target.

[0166] As the semiconductor layer, an oxide semiconductor film with a low carrier density is used. For example, the semiconductor layer is , carrier density is 1 × 1017 per cm 3 or less, preferably 1×10 15 per cm 3 or less , more preferably 1×10 13 per cm 3 or less, even more preferably 1×10 11 per cm 3 or less, more preferably 1×10 10 per cm 3 less than, and 1×10 -9 per cm 3 or higher carrier density oxide semiconductors can be used. Such oxide semiconductors are referred to as high purity intrinsic or substantially high purity intrinsic oxide semiconductors. As a result, the impurity concentration is low and the density of defect levels is low, so it can be said that the oxide semiconductor has stable characteristics.

[0167] Note that it is not limited to these, and those with an appropriate composition may be used according to the semiconductor characteristics and electrical characteristics (field effect mobility, threshold voltage, etc.) of the required transistor. Also, in order to obtain the semiconductor characteristics of the required transistor, it is preferable to make the carrier density, impurity concentration, defect density, atomic number ratio of metal element to oxygen, interatomic distance, density, etc. of the semiconductor layer appropriate .

[0168] In the semiconductor layer, if silicon or carbon, which is one of the Group 14 elements, is contained, oxygen deficiency in the semiconductor layer increases and it becomes n-type. Therefore, the concentration of silicon or carbon in the semiconductor layer (concentration obtained by secondary ion mass spectrometry (SIMS: Secondary Ion Mass Spectrometry)) is 2×10 18 atoms / cm 3 or less, preferably 2×10 17 atoms / cm 3The following applies:

[0169] Furthermore, alkali metals and alkaline earth metals generate carriers when they bond with oxide semiconductors. This can occur, and the transistor's off-current may increase. Therefore, half In the conductive layer, alkali metals or alkaline earth elements obtained by secondary ion mass spectrometry The concentration of the metal is 1 × 10⁻⁶. 18 atoms / cm 3 The following is preferably 2 × 10 16 Atom s / cm 3 Do the following:

[0170] Furthermore, if nitrogen is present in the semiconductor layer, electrons, which are carriers, are generated, and the carrier density increases. It increases and becomes more likely to become n-type. As a result, transients using oxide semiconductors containing nitrogen Sta is prone to normally-on properties. For this reason, for example, secondary ion mass spectrometry can be used. The nitrogen concentration obtained is 5 × 10 18 atoms / cm 3 The following is preferable:

[0171] Furthermore, the semiconductor layer may have a non-single-crystal structure, for example. A non-single-crystal structure is CAAC. -OS(C Axis Aligned-Crystalline Oxide Sem iconductor), including polycrystalline, microcrystalline, or amorphous structures. Non-single crystal In terms of structure, amorphous structures have the highest defect level density, and CAAC-OS has the highest defect level density. The degree is low.

[0172] The semiconductor layer may have an amorphous structure, for example. An amorphous oxide semiconductor film is, for example, made of The particle arrangement is disordered and does not contain crystalline components. Or, an amorphous oxide film is, for example, It has a completely amorphous structure and does not contain any crystalline parts.

[0173] Furthermore, the semiconductor layer consists of regions with an amorphous structure, regions with a microcrystalline structure, regions with a polycrystalline structure, and CAA The film may be a mixed film having two or more of the following: C-OS regions and single-crystal structure regions. The mixed film includes, for example, regions with an amorphous structure, regions with a microcrystalline structure, regions with a polycrystalline structure, and CAAC. -It may have two or more regions, either OS regions or single-crystal structure regions. The mixed film includes, for example, regions with an amorphous structure, regions with a microcrystalline structure, regions with a polycrystalline structure, and CAAC. - The stacked structure may have two or more regions, either the OS region or the single-crystal structure region. ru.

[0174] Alternatively, silicon is preferred as the semiconductor in which the transistor channel is formed. It is fine. Amorphous silicon may be used as silicon, but crystalline silicon is particularly desirable. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single-crystal silicon It is preferable to use materials such as n. In particular, polycrystalline silicon is suitable for lower temperatures compared to single-crystal silicon. It can be formed using [a specific method] and possesses higher field-effect mobility and higher reliability compared to amorphous silicon. By applying such polycrystalline semiconductors to pixels, the aperture ratio of the pixels can be improved. It is possible. Also, even if the display panel is extremely high resolution, the gate drive circuit and source drive circuit This makes it possible to form the paths on the same substrate as the pixels, reducing the number of components that make up electronic devices. It is possible.

[0175] {conductive layer} In addition to the gate, source, and drain of transistors, various components that make up a touch panel are also included. Materials that can be used for conductive layers such as wires and electrodes include aluminum, titanium, Chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and Examples include metals such as tungsten, or alloys in which tungsten is the main component. These materials can be used in single-layer or multi-layer structures. For example, silico A single-layer structure of an aluminum film containing , a double-layer structure in which an aluminum film is laminated on a titanium film, A two-layer structure consisting of an aluminum film laminated on a tungsten film, copper-magnesium-aluminium A two-layer structure in which a copper film is laminated on an alloy film, a two-layer structure in which a copper film is laminated on a titanium film, tungsten A two-layer structure in which a copper film is laminated on a titanium film, a titanium film or titanium nitride film, and on top of that, A luminium film or copper film is laminated, and then a titanium film or titanium nitride film is formed on top of it. A three-layer structure consisting of a molybdenum film or molybdenum nitride film, with an aluminum film layered on top of it. Alternatively, a copper film is laminated, and then a molybdenum film or molybdenum nitride film is formed on top of it, creating a three-layer structure. It has a structure, etc. Furthermore, oxides such as indium oxide, tin oxide, or zinc oxide may be used. Furthermore, using copper containing manganese is preferred because it improves the controllability of the shape through etching. It's nice.

[0176] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium or Graphene can be used. Alternatively, gold, silver, platinum, magnesium, nickel, and t Examples include sten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Metal materials or alloy materials containing such metal materials can be used. Alternatively, the nitrogen of the metal material can be used. Metallic compounds (e.g., titanium nitride) may also be used. When using these nitrides, they should be thinned to a degree that allows light to pass through. A laminated film of materials can be used as a conductive layer. For example, an alloy of silver and magnesium and an ink Using a multilayer film of tungsten oxide is preferable because it can improve conductivity.

[0177] Alternatively, it is preferable to use an oxide semiconductor similar to that used in the semiconductor layer as the conductive layer. The conductive layer exhibits lower electrical resistance than the region where channels are formed in the semiconductor layer. It is preferable that it is formed in this way.

[0178] For example, such conductive layers include conductive layer 25, conductive layer 27, and the second gate electrode of the transistor. It can be applied to conductive layers 223 that function as electrodes, or to other translucent materials. It can also be applied to the conductive layer.

[0179] {Method for controlling the resistivity of oxide semiconductors} Oxide semiconductor films that can be used as semiconductor layers and conductive layers have oxygen vacancies in the film and / or This is a semiconductor material whose resistivity can be controlled by the concentration of impurities such as hydrogen and water in the film. Yes. Therefore, a process that increases the oxygen vacancy and / or impurity concentration in the semiconductor layer and conductive layer is necessary. Alternatively, by selecting a treatment that reduces oxygen deficiency and / or impurity concentration, The resistivity of the oxide semiconductor film can be controlled.

[0180] Specifically, the oxide semiconductor film used for the conductive layer is subjected to plasma treatment, and the oxide semiconductor Increases oxygen vacancies in the film, and / or impurities such as hydrogen and water in oxide semiconductor films. By increasing this, an oxide semiconductor film with high carrier density and low resistivity can be created. This can be done. In addition, an insulating film containing hydrogen is formed in contact with an oxide semiconductor film, and the insulating film containing hydrogen is formed. By diffusing hydrogen from the edge film into the oxide semiconductor film, the carrier density is high and resistivity is reduced. This allows for the creation of oxide semiconductor films with low performance.

[0181] On the other hand, the semiconductor layer that functions as the channel region of the transistor is in contact with an insulating film containing hydrogen. The configuration shall not include an insulating film containing oxygen in at least one of the insulating films in contact with the semiconductor layer. Then, by applying an insulating film that can release oxygen, oxygen is supplied to the semiconductor layer. This is possible. In a semiconductor layer supplied with oxygen, oxygen deficiencies in the film or at the interface are filled, and resistance This results in an oxide semiconductor film with high resistance. Furthermore, as an insulating film capable of releasing oxygen, For example, a silicon oxide film or a silicon oxide nitride film can be used.

[0182] Furthermore, to obtain oxide semiconductor films with low resistivity, ion implantation and ion doping methods are used. Using methods such as plasma immersion ion implantation, hydrogen, boron, and ly N or nitrogen may be implanted into the oxide semiconductor film.

[0183] Furthermore, in order to obtain an oxide semiconductor film with low resistivity, the oxide semiconductor film is subjected to plasma treatment. It is permissible to do so. For example, typical plasma treatments include those using noble gases (He, Ne, A). Plasma using a gas containing one or more elements selected from r, Kr, Xe, hydrogen, and nitrogen Examples include plasma treatment. More specifically, plasma treatment in an Ar atmosphere, and mixing of Ar and hydrogen. Plasma treatment under a mixed gas atmosphere, plasma treatment under an ammonia atmosphere, Ar and ammonia Plasma treatment in a near-mixed gas atmosphere, or plasma treatment in a nitrogen atmosphere, etc. It can be listed.

[0184] As a result of the plasma treatment described above, the oxide semiconductor film has a lattice from which oxygen has been removed (or oxygen has been removed This creates an oxygen deficiency in the separated portion. This oxygen deficiency can be a factor in the generation of carriers. There are also the vicinity of the oxide semiconductor film, more specifically, below or above the oxide semiconductor film. When hydrogen is supplied from the insulating film in contact with the side, the hydrogen combines with the oxygen vacancy, It can sometimes generate electrons that are rear electrons.

[0185] On the other hand, oxide semiconductor films in which oxygen deficiencies are compensated and hydrogen concentration is reduced are highly purified intrinsically. Alternatively, it can be described as a substantially high-purity intrinsically purified oxide semiconductor film. Here, substantially intrinsically purified means The carrier density of the oxide semiconductor film is 8 × 10 11 pieces / cm 3 Less than 1 × 10 1 1 / cm 3 Less than 1 × 10 10 pieces / cm 3 It refers to being less than. High purity Oxide semiconductor films that are highly intrinsic or substantially high-purity intrinsic have few carrier sources. This allows for lower carrier density. Also, high-purity intrinsic or substantially high-purity intrinsic Because certain oxide semiconductor films have a low defect level density, it is possible to reduce the trap level density. Cut.

[0186] Furthermore, oxide semiconductor films that are high-purity intrinsic or substantially high-purity intrinsic exhibit a significant off-current. It is very small, with a channel width of 1 x 10 6 Even if the element has a channel length of 10 μm in μm, When the voltage between the drain electrode and the drain electrode (drain voltage) is in the range of 1V to 10V, the switch is off. The current is below the measurement limit of the semiconductor parameter analyzer, i.e., 1 × 10⁻⁶ -13 A or less and This characteristic can be obtained. Therefore, the above-mentioned high-purity intrinsic or substantially high-purity intrinsic A transistor that uses an oxide semiconductor film, which is a material, as the channel region is an electrical transistor. This results in a transistor with minimal variation in characteristics and high reliability.

[0187] For example, an insulating film containing hydrogen can be used as the insulating film in contact with the oxide semiconductor film used as the conductive layer. In other words, an insulating film capable of releasing hydrogen, typically a silicon nitride film, is used. Thus, hydrogen can be supplied to the conductive layer. As an insulating film capable of releasing hydrogen The hydrogen concentration in the membrane is 1 × 10 22 atoms / cm 3 This is preferable. By forming such an insulating film in contact with the conductive layer, hydrogen can be effectively incorporated into the conductive layer. This can be achieved by changing the configuration of the insulating film in contact with the semiconductor layer and the conductive layer. This allows for the control of the resistivity of oxide semiconductor films.

[0188] The hydrogen contained in the oxide semiconductor film reacts with the oxygen bonded to the metal atoms to form water. This forms an oxygen vacancy in the lattice (or the part from which oxygen has been removed). When hydrogen enters, electrons, which act as carriers, are sometimes generated. Also, some of the hydrogen In some cases, by bonding with oxygen atoms that bond with metal atoms, electrons, which act as carriers, can be generated. Therefore, the conductive layer provided in contact with the insulating film containing hydrogen is more volatile than the semiconductor layer. This results in an oxide semiconductor film with a high carrier density.

[0189] The semiconductor layer in which the channel region of a transistor is formed has hydrogen content reduced as much as possible. It is preferable that the semiconductor layer be obtained by secondary ion mass spectrometry. The hydrogen concentration is 2 × 10 20 atoms / cm 3 The following is preferably 5 × 10 19 Atom s / cm 3 More preferably 1 × 10 19 atoms / cm 3 Below, 5 x 10 18 a toms / cm 3 Less than 1 × 10 18 atoms / cm 3 The following are more preferable is 5 x 10 17 atoms / cm 3 More preferably 1 × 10 16 ate / c m 3 The following applies:

[0190] On the other hand, the conductive layer has a higher hydrogen concentration and / or oxygen vacancy than the semiconductor layer, and has lower resistivity. It is an oxide semiconductor film. The hydrogen concentration in the conductive layer is 8 × 10⁻⁶. 19 atoms / cm 3 Preferably 1 × 10 20 atoms / cm 3 The above is more comfortable 5x10 20 a toms / cm 3 That concludes the explanation. Furthermore, compared to the semiconductor layer, the hydrogen concentration in the conductive layer is It is 2 times or more, preferably 10 times or more. Also, the resistivity of the conductive layer is equal to the resistivity of the semiconductor layer. 1 x 10 -8 1×10 times more -1 It is preferable that it be less than a multiple, typically 1 × 10⁻⁶. -3 Ωcm or more, 1 × 10 4 Less than Ωcm, more preferably with a resistivity of 1 × 10⁻⁶. -3 Ωcm or larger 1 x 10 -1It should be less than Ωcm.

[0191] {insulating layer} Examples of insulating materials that can be used for each insulating layer, overcoat, spacer, etc. include In addition to resins such as acrylic and epoxy, and resins containing siloxane bonds, silicon oxide, Inorganic insulating materials such as silicon oxide nitride, silicon nitride, silicon nitride, and aluminum oxide. Materials can also be used.

[0192] {adhesive layer} The adhesive layer can be made of a curable resin such as a thermosetting resin, a photocuring resin, or a two-component curable resin. For example, acrylic resin, urethane resin, epoxy resin, or s Resins containing siloxane bonds, such as lycorn, can be used.

[0193] {connection layer} As a connecting layer, an anisotropic conductive film (ACF) is used. (Active Film) and anisotropic conductive paste (ACP: Anisotropic C) You can use inductive pastels, etc.

[0194] {Colored layer} Materials that can be used for the colored layer include metal materials, resin materials, pigments, or dyes. Examples include resin materials.

[0195] The above is a description of each component.

[0196] [Example of touch sensor configuration] Next, touch that can be applied to the touch panel module 10 according to one aspect of the present invention An example of the configuration of sensor 22 will be explained with reference to the drawing.

[0197] Figure 14(A) is a schematic top view (plan view) showing a part of the touch sensor 22. Figure 14(B) is a top schematic view, enlarged from the area enclosed by the dashed line in Figure 14(A). .

[0198] As shown in Figures 14(A) and 14(B), the conductive layer 23 has a smaller width at the point where it intersects with the conductive layer 25. It is preferable that it has a constricted shape so that it becomes narrower. It becomes possible to reduce the capacitance value. For example, in the case of a self-capacitance type touch sensor, The smaller the capacitance value of the capacitive element 11, the better the detection sensitivity can be.

[0199] Furthermore, between the adjacent conductive layer 23 and conductive layer 24, there is a conductive layer that is electrically insulated from them. It may have a layer 26. By having a conductive layer 26, the thickness of the touch sensor 22 This can prevent the formation of thin areas. For example, if conductive layer 23 and conductive layer 24 are the same When formed on a surface, these conductive layers are provided by adding a similarly formed conductive layer 26. This process improves the coverage of thin films formed after the layer formation process and allows for surface planarization. Furthermore, by making the thickness of the touch sensor 22 uniform, the brightness of light from the pixels that pass through it increases. This reduces unevenness in display quality, resulting in a touch panel with improved display quality.

[0200] Furthermore, Figure 14(C) shows that conductive layer 23 and conductive layer 24 are formed on different planes, and conductive layer This shows the case where 25 is not provided. In this case, the conductive layer 26 is conductive layer 23 or conductive It may be formed on the same plane as either of the layers 24, or on a different plane. Furthermore, if it is not necessary to provide the conductive layer 26, it may be omitted.

[0201] Figure 15(A) shows a top view of a portion of a touch sensor having a different pattern than that shown in Figure 14. This is a schematic diagram.

[0202] In the example shown in Figure 15(A), at the intersection of conductive layer 23 and conductive layer 24, conductive layer 23 The width is greater than the width of the conductive layer 24.

[0203] For example, the conductive layer 23 is arranged parallel to the long side direction of the display unit, and the conductive layer 24 is arranged parallel to the short side direction. When placed in this configuration, in order to prevent an increase in the resistance of the conductive layer 23, the conductive layer 2 is placed as shown in Figure 15. Making the width of layer 3 greater than that of the conductive layer 24 is particularly effective.

[0204] Figure 15(B) shows an example in which a conductive layer 25 is electrically connected to the conductive layer 23. As shown above, when a bridge is formed by the conductive layer 25, between the conductive layer 23 and the conductive layer 25 Contact resistance can affect detection sensitivity. Therefore, the conductive layer side with a bridge structure... Increasing the width is particularly effective. Note that in this case, the conductive layer 23 is on the short side of the display section. The conductive layers may be arranged parallel to the direction.

[0205] Figure 16(A) shows the rotation of a touch sensor 22 having multiple conductive layers 23 and multiple conductive layers 24. An example of a circuit diagram is shown. In Figure 16(A), for simplicity, there are six conductive layers 23 and six The diagram shows a configuration having a conductive layer 24, but the number is not limited to this configuration.

[0206] A single capacitive element 11 is formed between one conductive layer 23 and one conductive layer 24. Therefore, the capacitive elements 11 are arranged in a matrix.

[0207] In the projected self-capacitance method, a pulse voltage is scanned across each of the conductive layers 23 and 24. It is given such a value, and at that time it detects the value of the current flowing through itself. When the object to be detected approaches... Because the magnitude of the current changes, the position information of the object being detected can be obtained by detecting this difference. It can be obtained. Also, in the case of the projected mutual capacitance method, conductive layer 23 or conductive layer 24 A pulse voltage is applied to one of the two to scan, and the current flowing through the other is detected. This is used to obtain the location information of the detected object.

[0208] The conductive layer 23 and the conductive layer 24 each have a grid-like or mesh-like structure with multiple openings. It is preferable that it has a shape (like a sieve). Figure 16(B) shows the upper surface shape of a part of the conductive layer 23. An example of the form is shown.

[0209] The conductive layer 23 shown in Figure 16(B) is a grid having a lateral spacing P1 and a vertical spacing P2. It has a shape like this. Figure 16(B) shows the case where the spacing P1 and spacing P2 are of similar size. However, these may be arranged at different intervals. For example, as shown in Figure 16(C) The vertical spacing P2 can be made larger than the horizontal spacing P1, or vice versa. The same applies to the conductive layer 24.

[0210] The conductive layer 23 or conductive layer 24 has an aperture ratio (per unit area of ​​conductive layer 23 or conductive layer 24). The ratio of the opening area of ​​layer 24 is, for example, 20% or more and less than 100%, preferably 30% or more. It is preferable to have a region that is less than 00%, more preferably 50% or more and less than 100%. .

[0211] The aperture ratio can be easily calculated, for example, by the spacing P1, spacing P2, and the width of the conductive layer. It is possible. Alternatively, in the periodic unit region R shown in Figure 16(B), the area of ​​region R and region R The aperture ratio can be calculated by the ratio of the area of ​​the conductive layer 23 contained in the region. R is a region that forms the periodic unit of the pattern of the periodic conductive layer 23, and this is vertical and By arranging them periodically in the horizontal direction, a pattern of the conductive layer 23 can be formed.

[0212] In conductive layers 23 and 24, the width of the pattern constituting the lattice is, for example, 50 nm The thickness is 100 μm or less, preferably 1 μm or more and 50 μm or less, more preferably 1 μm or more and 2 μm or less. It is preferable to set it to 0 μm or less, thus reducing the pattern width that constitutes the grid. As a result, when overlapping apertures and pixels, as will be described later, it becomes possible to narrow the spacing between pixels. Therefore, it is possible to realize a touch panel with higher resolution and a higher aperture ratio.

[0213] Figure 17(A) is a schematic top view showing a further enlarged view of the boundary between conductive layer 23 and conductive layer 24. ru.

[0214] The conductive layer 23 and the conductive layer 24 each have a grid-like (also called a mesh-like or network-like) shape. It is preferable that the conductive layer 23 and conductive layer 24 each have a plurality It is preferable to have a shape that has openings (opening 23a and opening 24a). By arranging the aperture and the pixel to overlap, the light from the display element of the pixel is The conductive layer 23 and conductive layer 24 block light, or the conductive layer 23 and conductive layer 24 transmit light. This prevents excessive brightness reduction. As a result, it sacrifices pixel aperture ratio and light extraction efficiency. The touch sensor 22 can be applied to the touch panel without any sacrifices. It is preferable that the conductive layer 25 also be shaped so that it does not overlap with the pixels.

[0215] Also, as shown in Figure 17(A), at these boundaries, a portion of the conductive layer 23 and the conductive layer 2 The shape may be such that an opening 22a is formed surrounded by a part of 4. By doing so, it is possible to make the distance between the conductive layer 23 and the conductive layer 24 as small as possible. These capacities can be increased. In particular, when adopting a mutual capacity method, two guides It is preferable to reduce the distance between the electrochemical layers and increase the capacitance between them.

[0216] Figure 17(B) is a schematic top view of an enlarged section of the intersection of conductive layer 23 and conductive layer 24. The following shows an example in which two adjacent conductive layers 24 are electrically connected by a conductive layer 25. An insulating layer 121 (not shown) is provided between the conductive layers 23 and 24 and the conductive layer 25. Furthermore, the conductive layer 24 and the conductive layer 25 are separated by an opening provided in the insulating layer 121. They are electrically connected. The conductive layer 23 and the conductive layer 25 are connected to each other via the insulating layer 121. It has an overlapping area.

[0217] Figure 18(A) is a diagram showing the conductive layer 27 superimposed on Figure 17(B). Also, Figure 18(B The diagram shows the conductive layer 27 and conductive layer 25 at this time, indicated by dashed lines.

[0218] Thus, the conductive layer 27 is provided with an opening (also called a notch), and inside the opening A configuration can be made in which the conductive layer 25 is located in the part. In this way, the conductive layer 27 and The conductive layer 25 can be formed by processing the same conductive film.

[0219] Furthermore, when the conductive layer 27 and the conductive layer 25 are formed by processing different conductive films, the conductive layer 27 and the conductive layer 25 may overlap.

[0220] Figure 19(A) shows an example of a pattern different from Figures 17 and 18. Here, the conductive layer The diagram shows a schematic top view of the vicinity of the intersection of 23 and the conductive layer 24. The conductive layer 24 is connected to the conductive layer 25. It is more bridged. Also, in Figure 19(B), conductive layers 25 and 27 are shown with dashed lines. This is the diagram below.

[0221] In Figure 19, multiple stripe-shaped conductive layers 27 are provided along the stretching direction of the conductive layer 24. This shows an example. Multiple conductive layers 27 are located on the outer periphery of the display unit (for example, the part that overlaps with the circuit 34). It is preferable to have a configuration in which each component (etc.) is electrically connected and capable of supplying the same potential. The conductive layer 27 is wider where it overlaps with the display element, and narrower where it overlaps with the conductive layer 23. It has a constricted shape to reduce the overlapping area of ​​conductive layer 27 and conductive layer 23. This reduces the parasitic capacitance of the conductive layer 23.

[0222] [Example of aperture and pixel arrangement in the conductive layer] Each figure in Figure 20 shows the pixel and the subpixels contained within the pixel as viewed from the display side, and the conductive layer 2 This is a schematic diagram showing the positional relationship of 3. Note that the conductive layer 23 is used as an example in this explanation. The conductive layer 24 and conductive layer 25 can also have a similar configuration.

[0223] In Figure 20(A), pixel 33 consists of three sub-pixels: sub-pixel 33R, sub-pixel 33G, and sub-pixel 33B. This shows an example of being composed of subpixels. For example, subpixel 33R displays red, and subpixel The primary pixel 33G only needs to have the function of displaying green, and the sub-pixel 33B needs to have the function of displaying blue. The number of subpixels that pixel 33 has, and the types of colors of the subpixels, are not limited to these.

[0224] Multiple subpixels included in pixel 33 each have a display element. The display elements are: The liquid crystal elements mentioned above can be used. In addition, other light-emitting elements such as organic EL elements can be used. Elements, transmissive, semi-transmissive or reflective liquid crystal elements, electrophoretic methods and electronic powder fluids (registered trademark) Display elements (also called electronic ink) that display information using methods such as the ) method, shutter type MEM Examples include S-display elements and optical interference MEMS display elements. Sub-pixels are also part of the display element. In addition to the child, it has transistors, capacitive elements, and wiring that electrically connects them. It's okay to be there.

[0225] In the configuration shown in Figure 20(A), each of the multiple apertures of the conductive layer 23 is a sub-pixel 33R, It is arranged so as to overlap with one of the three subpixels, subpixel 33G and subpixel 33B. Thus, the aperture of the conductive layer 23 is arranged to overlap with one subpixel. It is preferable.

[0226] In Figure 20(B), a conductive layer 23 is placed between two adjacent subpixels exhibiting different colors. This shows the configuration. As shown in Figure 20(B), two adjacent sub-strokes exhibiting the same color Since no color mixing problem occurs between the elements, there is a portion here where the conductive layer 23 is not provided. This configuration is also acceptable.

[0227] In Figures 20(C) and (D), pixel 33 is larger compared to the configuration shown in Figures 20(A) and (B). Furthermore, an example is shown where there is a sub-pixel 33Y. The sub-pixel 33Y represents, for example, yellow. A pixel that can be shown can be applied. Note that white can be used instead of sub-pixel 33Y. It is also possible to apply pixels that can be displayed. In this way, more than three sub-pixels are available. By using a pixel 33 equipped with this feature, power consumption can be reduced.

[0228] Figures 20(A) to (D) show examples where each subpixel is arranged in a stripe pattern, For example, as shown in Figure 20(E), a configuration in which two subpixels of two colors are alternately arranged in one direction. That's good too.

[0229] Furthermore, the size of the subpixels of pixel 33 (for example, the area of ​​the region that contributes to the display) is, The subpixels may differ. For example, the subpixel that shows blue, which has relatively low visual sensitivity, may be made larger. It is also possible to reduce the size of subpixels that display green or red, which have relatively high visual sensitivity.

[0230] In Figures 20(F) and (G), among sub-pixels 33R, 33G, and 33B, This shows an example where the size of pixel 33B is larger than that of other subpixels. An example is shown where pixels 33R and sub-pixels 33G are arranged alternately, as shown in Figure 20(A), etc. The three subpixels are arranged in a stripe pattern, with each subpixel being of a different size. It can also be done this way.

[0231] As mentioned above, the positional relationship between the conductive layer 23 and the sub-pixels has been explained here, The same applies to the electrolytic layer 24 and the conductive layer 25. That is, a touch panel according to one aspect of the present invention The element has a region where the aperture 23a of the conductive layer 23 and one or more subpixels overlap each other, and The conductive layer 24 has an aperture 24a and one or more other subpixels that overlap with each other. As described above, each sub-pixel has a display element, so apertures 23a and 24a each It can also be said that it has regions that overlap with one or more display elements.

[0232] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0233] (Embodiment 2) This embodiment provides an example of an input device or a method for driving an input / output device according to one aspect of the present invention. Then, I will explain by referring to the drawings.

[0234] [Examples of sensor detection methods] Figure 21(A) is a block diagram showing the configuration of a mutually capacitive touch sensor. (A) shows the pulse voltage output circuit 601 and the current sensing circuit 602. See Figure 21. In (A), the electrode 621 to which a pulse voltage is applied and the electrode 622 to which the change in current is detected These are shown as six wires each for X1-X6 and Y1-Y6. Also, Figure 21( A) illustrates the capacitance 603 formed by the superposition of electrodes 621 and 622. They are present. Furthermore, electrodes 621 and 622 may be interchangeable in their function.

[0235] The pulse voltage output circuit 601 is used to sequentially apply pulse voltages to the wiring X1-X6. It is a circuit. When a pulse voltage is applied to the wiring X1-X6, capacitance 603 is formed. An electric field is generated between electrode 621 and electrode 622. Capacitance occurs due to shielding or other factors in this electric field between electrodes. By causing a change in the capacity of 603, the approach or contact of the object to be detected is detected. It is possible.

[0236] The current sensing circuit 602 detects the current in the Y1-Y6 wiring due to the change in capacitance of capacitor 603. This is a circuit for detecting changes in the temperature. In the wiring of Y1-Y6, the approach or contact of the object to be detected is detected. The detected current value does not change when there is no contact, but when the object being detected approaches or comes into contact with it... When the capacitance decreases, a change in the current value is detected. Note that current detection is performed by integrating multiple times. This can be done using roads or similar means.

[0237] Next, Figure 21(B) shows the input of the mutual capacitive touch sensor shown in Figure 21(A). The timing chart of the output waveform is shown. Figure 21(B) shows the timing of each matrix in one frame period. The system will detect the object to be detected. Also, in Figure 21(B), the case where no object to be detected is detected ( This shows two cases: one where the object to be detected is not touched, and another where the object to be detected is touched. Regarding the wiring of Y1-Y6, the waveforms shown represent the voltage values ​​corresponding to the detected current values. Yes, they are.

[0238] A pulse voltage is applied sequentially to the wiring of X1-X6, and Y1- The waveform changes in the Y6 wiring. If there is no approach or contact with the detected object, X1-X6 The waveforms of Y1-Y6 change uniformly in response to changes in the voltage of the wiring. Meanwhile, when the object to be detected approaches... Alternatively, at the point of contact, the current value decreases, and therefore the waveform of the corresponding voltage value also changes. ru.

[0239] In this way, by detecting changes in volume, the approach or contact of the object being detected can be detected. It is possible.

[0240] Furthermore, the pulse voltage output circuit 601 and the current detection circuit 602 are integrated into a single IC. It is preferable to implement it in a touch panel or on a circuit board inside the casing of an electronic device. Furthermore, when a touch panel is made flexible, the parasitic capacitance increases in the bent portion. However, there is a risk that the noise will have a significant impact, so it is better to use a device that is less susceptible to noise. It is preferable to use an IC to which a dynamic method is applied. For example, the signal-to-noise ratio (S / N ratio). It is preferable to use an IC to which a driving method that enhances ) is applied.

[0241] Furthermore, in Figure 21(A), only capacitor 603 is provided at the wiring intersection as a touch sensor. The configuration of a symmetric matrix type touch sensor was shown, but it is equipped with transistors and capacitors. An active-matrix type touch sensor may also be used. Figure 22 shows an active-matrix type This shows an example of a sensor circuit included in a touch sensor.

[0242] The sensor circuit consists of capacitor 603, transistor 611, transistor 612, and transistor It has a transistor 613. When a signal G2 is applied to the gate of transistor 613, the source or A voltage VRES is applied to one side of the drain, and the other side is connected to one electrode and the transistor with capacitance 603. Electrically connect to the gate of transistor 611. Transistor 611 is either source or drain. One end is electrically connected to either the source or drain of transistor 612, and the other end is connected to a voltage V SS is given. Transistor 612 is given signal G1 at its gate, source or drain The other end of the input is electrically connected to the wiring ML. Voltage VSS is applied to the other electrode of capacitance 603. It can be obtained.

[0243] Next, I will explain the operation of the sensor circuit. First, the signal G2 is transistor 613 When a potential is applied that turns on the transistor, the gate of transistor 611 is connected. A potential corresponding to the voltage VRES is applied to the n. Then, the transistor is used as the signal G2. By applying a potential that turns off 613, the potential at node n is maintained.

[0244] Next, the capacity of capacity 603 changes when a detected object such as a finger approaches or comes into contact with it. Consequently, the potential at node n changes from VRES.

[0245] The read operation applies a potential to signal G1 that turns on transistor 612. The current flowing through transistor 611, that is, the current flowing through wiring ML, is determined by the potential of do n. It changes. By detecting this current, it is possible to detect the approach or contact of the object being detected. can.

[0246] For transistors 611, 612, and 613, the channel is It is preferable to use a transistor in which an oxide semiconductor is applied to the semiconductor layer formed. By applying such a transistor to transistor 613, the potential of node n This makes it possible to maintain the VRES for a long period of time, and to resupply VRES to node n. This can reduce the frequency of refresh operations.

[0247] [Example configuration of an in-cell type touch panel] In the above, the electrodes constituting the touch sensor are placed on a substrate different from the substrate on which the display elements, etc., are provided. The example shown is formed on a board, but a touch sensor can be configured on a substrate on which display elements and the like are provided. The configuration may include one or both of the pair of electrodes.

[0248] The following describes the configuration of a touch panel in which a touch sensor is incorporated into a display unit having multiple pixels. Let's explain an example. Here, a liquid crystal element is applied as the display element provided in the pixel. Here is an example.

[0249] Figure 23(A) shows one of the pixel circuits provided in the display section of the touch panel illustrated in this configuration example. This is an equivalent circuit diagram for the section.

[0250] Each pixel has at least a transistor 3503 and a liquid crystal element 3504. Wiring 3501 is connected to the gate of inverter 3503, and wiring 35 is connected to either the source or the drain. 02 is electrically connected to each other.

[0251] The pixel circuit consists of multiple wires extending in the X direction (for example, wire 3510_1, wire 3510 _2) and a plurality of wires (e.g., wire 3511) extending in the Y direction, which are relative to each other They are arranged intersectingly, and a volume is formed between them.

[0252] Furthermore, among the pixels provided in the pixel circuit, some adjacent pixels are provided together. One electrode of the liquid crystal element is electrically connected, forming a single block. The lock consists of island-shaped blocks (for example, block 3515_1, block 3515_2) and They are classified into two types: a linear block extending in the Y direction (for example, block 3516), and a linear block extending in the Y direction. It is done. Note that Figure 23 shows only a part of the pixel circuit, but in reality there are two types. The blocks are repeatedly arranged in the X and Y directions.

[0253] The wiring 3510_1 (or 3510_2) extending in the X direction is connected to the island-shaped block 351 It is electrically connected to 5_1 (or block 3515_2). Note that X is not shown in the diagram. The wiring 3510_1 extending in the direction is discontinuous along the X direction via a linear block. Multiple island-shaped blocks 3515_1 arranged in the configuration are electrically connected. The existing wiring 3511 is electrically connected to the linear block 3516.

[0254] Figure 23(B) shows multiple wirings 3510 extending in the X direction and multiple wirings extending in the Y direction. This is an equivalent circuit diagram showing the connection configuration of line 3511. Each of the wirings 3510 extending in the X direction An input voltage or common potential can be applied to it. Also, wiring 3 extends in the Y direction. Each of the 511s is either input to the ground potential or electrically connected to the wiring 3511 and the detection circuit. It is possible.

[0255] The operation of the touch panel described above will be explained below using Figures 24(A) and 24(B).

[0256] Here, one frame period is divided into a writing period and a detection period. The writing period is for pixels. This is the period during which image data is written to the device, as shown in the wiring 3501 (G) in Figure 23(A). The lines (also called scan lines) are selected sequentially. Meanwhile, the detection period is determined by the touch sensor. This is a period during which sensing is performed, and wiring 3510 extending in the X direction is sequentially selected, and the input power Pressure is applied.

[0257] Figure 24(A) is an equivalent circuit diagram during the writing period. During the writing period, the X direction A common potential is input to both the wiring 3510 extending in the direction and the wiring 3511 extending in the Y direction. It can be done.

[0258] Figure 24(B) is an equivalent circuit diagram at a certain point in the detection period. During the detection period, the Y direction Each of the wirings 3511 extending in the direction is electrically connected to the detection circuit. Also, extending in the X direction Of the 3510 wires, the selected one receives the input voltage, while the others do not. A common potential is input.

[0259] Note that the drive methods exemplified here include not only the in-cell method but also the touch panel exemplified above. It can also be applied to the engine, and can be used in combination with the method shown in the above example of a driving method. Cut.

[0260] In this way, the image writing period and the period during which sensing is performed by the touch sensor are determined independently. It is preferable to install them in an upright position. This prevents touch caused by noise during pixel writing. This can suppress the decrease in sensor sensitivity.

[0261] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0262] (Embodiment 3) In this embodiment, a display device or display system having a display module according to one aspect of the present invention The rake and electronic equipment will be explained using Figures 25 and 26.

[0263] The display module 8000 shown in Figure 25 consists of an upper cover 8001 and a lower cover 8002. In between, the touch panel 8004 connected to the FPC8003, the frame 8009, and the print It has a circuit board 8010 and a battery 8011.

[0264] A touch panel module according to one aspect of the present invention is used, for example, in a touch panel 8004 It is possible.

[0265] The upper cover 8001 and lower cover 8002 are sized to fit the touch panel 8004. Furthermore, the shape and dimensions can be changed as needed.

[0266] The touch panel 8004 is a display panel using either a resistive or capacitive touch panel. It can be used superimposed on the touch panel 8004. It is also possible to incorporate touch panel functionality. It is also possible to install a light sensor in each of the four pixels to create an optical touch panel.

[0267] Furthermore, when a transmissive liquid crystal element is used, the backlight 8007 is shown in Figure 25. A backlight 8007 has a light source 8008. Note that in Figure 25 I have given an example of a configuration in which the light source 8008 is placed on the backlight 8007, but It is not limited to this. For example, a light source 8008 could be placed at the edge of the backlight 8007, and the light could be further expanded. A configuration using a scattering plate may also be used. In the case of composite or reflective panels, the configuration shall not include a backlight 8007. That's fine.

[0268] Frame 8009 provides protection for the display panel 8006, as well as the movement of the printed circuit board 8010. It has the function of an electromagnetic shield to block electromagnetic waves generated by the operation. The 8009 may also function as a heat sink.

[0269] The printed circuit board 8010 contains power supply circuits and signals for outputting video and clock signals. It has a power processing circuit. The power supply that provides power to the power supply circuit is an external commercial power supply. Alternatively, a separate power source, the battery 8011, may also be used. This can be omitted when using commercial power.

[0270] Additionally, the touch panel 8004 includes components such as polarizing plates, phase difference plates, and prism sheets. They may be provided as such.

[0271] Figures 26(A) through 26(H) show electronic devices. These electronic devices are enclosed in a housing. Body 5000, display unit 5001, speaker 5003, LED lamp 5004, operation keys 50 05 (including power switch or operation switch), connection terminal 5006, sensor 5007 ( Force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light, liquid, magnetism, temperature, chemical substances , sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor It may have a microphone 5008 (or a device that includes a function to measure infrared rays), etc. can.

[0272] Figure 26(A) shows a mobile computer, and in addition to the above, it has a switch 5009 It may have an infrared port 5010, etc. Figure 26(B) shows a portable recording device. A strip-type image playback device (for example, a DVD player), and in addition to those mentioned above, see Table 2. It may have a display unit 5002, a recording medium reading unit 5011, etc. Figure 26(C) is a Go It is a group-type display, and in addition to the above, it includes a second display unit 5002 and a support unit 5012 It may have earphones 5013, etc. Figure 26(D) is a portable gaming machine, and above In addition to those described above, it may also have a recording medium reading unit 5011, etc. Figure 26(E) It is a digital camera with a television receiving function, and in addition to the above, it has an antenna 5014, It may have a shutter button 5015, an imaging unit 5016, etc. Figure 26(F) is a portable It is a band-type gaming machine, and in addition to the above, it also has a second display unit 5002 and a recording medium reading unit 5011. , etc. Figure 26(G) is a portable television receiver, and the above-mentioned In addition, it may have a charger 5017 capable of transmitting and receiving signals, etc. Figure 26(H ) is a wristwatch-type information terminal, and in addition to the above, it includes band 5018, clasp 5019 It may have, etc. A display unit 500 mounted on a housing 5000 which also serves as the bezel. 1 has a non-rectangular display area. The display unit 5001 has an icon 502 that represents the time. 0, other icons 5021, etc. can be displayed.

[0273] The electronic devices shown in Figures 26(A) to 26(H) can have a variety of functions. For example, a function that displays various information (still images, videos, text images, etc.) on the display unit, Panel functions, calendar, date or time display functions, various software ( A function that controls processing by program, wireless communication function, and various functions using wireless communication function. Functions to connect to computer networks, and to transmit various data using wireless communication functions or The function of receiving data, reading programs or data recorded on the recording medium and displaying them on the display unit. It can have a display function, etc. Furthermore, in electronic devices having multiple display units In this system, one display unit primarily displays image information, and another display unit primarily displays text information. A function to display a three-dimensional image, or by displaying images that take parallax into account on multiple display units. It can have functions such as displaying images. Furthermore, in electronic devices having an imaging unit... For example, it has functions for taking still images, recording videos, and automatically or manually enhancing the captured images. Correction function, function to save captured images to a recording medium (external or built into the camera), capture It can have functions such as displaying the image on the display unit. The functions that electronic devices shown in 6(H) may have are not limited to these, and may include a variety of functions. It is possible to have.

[0274] The electronic device described in this embodiment has a display unit for displaying some kind of information. The display unit is characterized by the ability to apply the display device shown in the above embodiment. Cut.

[0275] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of Symbols]

[0276] 10 Touch panel modules 11 Capacitive elements 21 circuit boards 22 Touch Sensors 22a opening 23a opening 24a opening 23 Conductive layer 24 Conductive layer 25 Conductive layer 26 Conductive layer 27 Conductive layer 29 Wiring 31 circuit boards 32 Display section 33 pixels 33B subpixel 33G sub-pixels 33R sub-pixel 33Y subpixel 34 circuits 35 Wiring 41 FPC 42 FPC 60 display elements 101 Connection part 115 Light blocking layer 121 Insulating layer 122 Insulating layer 123 Insulating layer 124 Spacer 126 Insulating layer 127 Insulating layer 131B Colored layer 131R colored layer 141 Adhesive layer 151 Conductive layer 152 LCD 153 Conductive layer 201 Transistors 202 transistors 203 Capacitive element 204 Connection part 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 215 Insulating layer 221 Conductive layer 222 Conductive layer 223 Conductive layer 231 Semiconductor layer 241 Connecting Layer 242 Connecting Layers 300 buffer layers 301 Transistors 302 transistors 601 Pulse voltage output circuit 602 Current sensing circuit 603 capacity 611 transistors 612 transistors 613 Transistors 621 Electrode 622 Electrode 3501 Wiring 3502 Wiring 3503 Transistor 3504 Liquid crystal element 3510 Wiring 3510_1 Wiring 3510_2 Wiring 3511 Wiring 3515_1 block 3515_2 block 3516 blocks 5000 cabinets 5001 Display section 5002 Display section 5003 Speaker 5004 LED Lamp 5005 Operation Keys 5006 Connection terminal 5007 Sensor 5008 Microphone 5009 Switch 5010 Infrared Port 5011 Recording medium reading unit 5012 Support part 5013 Earphones 5014 Antenna 5015 Shutter button 5016 Imaging Unit 5017 charger 5018 Band 5019 Clasp 5020 Icons 5021 Icons 8000 Display Module 8001 Top cover 8002 Lower cover 8003 FPC 8004 Touch Panel 8006 Display Panel 8007 Backlight 8008 light source 8009 Frame 8010 Printed Circuit Board 8011 Battery

Claims

1. It comprises a first substrate, a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a fifth conductive layer, an insulating layer, and a liquid crystal display element. The first conductive layer, the second conductive layer, and the third conductive layer are provided spaced apart on the same plane. In a plan view, the second conductive layer is located between the first conductive layer and the third conductive layer. The first conductive layer and the fourth conductive layer are electrically connected. The third conductive layer and the fourth conductive layer are electrically connected. The second conductive layer and the fourth conductive layer have overlapping portions via the insulating layer, The first conductive layer has a mesh-like shape with a plurality of openings, The aperture, the liquid crystal display element, and the fifth conductive layer have overlapping regions. The fifth conductive layer is positioned between the first conductive layer and the liquid crystal display element. The fifth conductive layer has the function of transmitting visible light, A transistor is provided that is electrically connected to the liquid crystal display element. The transistor has a semiconductor layer, The semiconductor layer and the fifth conductive layer contain an oxide containing the same metal element. The fifth conductive layer is electrically connected to a terminal to which a constant potential is supplied. The transistor has a first gate electrode and a second gate electrode, The semiconductor layer is located between the first gate electrode and the second gate electrode. A semiconductor device wherein one of the first or second gate electrode comprises an oxide containing the metal element.

2. In claim 1, A touch panel is provided. The touch panel is a semiconductor device having the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the insulating layer.

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