Superconducting coil device, superconducting coil, magnetic resonance imaging device, and method for manufacturing a superconducting coil device

Abstract

To improve the uniformity of the winding thickness of superconducting wire. [Solution] The superconducting coil device of the embodiment is a superconducting coil device in which a plurality of superconducting coils are stacked. The superconducting coil has a superconducting wire, an inner frame, and an outer frame. The superconducting wire forms a winding portion. The inner frame is around which the superconducting wire is wound. The outer frame is provided on the outside of the superconducting wire wound around the inner frame. The turns of the wound superconducting wire are spaced apart.

Description

Technical Field

[0005] , ,

[0001] The embodiments disclosed in this specification and the drawings relate to a superconducting coil device, a superconducting coil, a magnetic resonance imaging device, and a method for manufacturing a superconducting coil device.

Background Art

[0002] For example, in a magnetic resonance imaging device, a superconducting coil device including a high-temperature superconducting wire material containing a high-temperature superconducting magnet is used. As the high-temperature superconducting wire material, for example, REBCO (REBa2CuOy: RE is a rare earth element) wire material has attracted attention. Since the REBCO wire material is in a tape shape, the superconducting coil device is manufactured in a basic form of a flat coil called a pancake coil.

[0003] Since the superconducting coil device is used in a magnetic resonance imaging device, it is required to improve the uniformity of the magnetic field by winding the superconducting wire material with a uniform winding thickness. However, it is difficult to achieve a uniform winding thickness due to the thickness of the superconducting wire material itself and the crushing condition of the insulator between turns when the superconducting wire material is wound.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem that the embodiments disclosed in this specification and drawings aim to solve is to improve the uniformity of the winding thickness of superconducting wire. However, the problems that the embodiments disclosed in this specification and drawings aim to solve are not limited to the above problem. Problems corresponding to the effects of each configuration shown in the embodiments described later can also be positioned as other problems. [Means for solving the problem]

[0006] The superconducting coil device of the embodiment is a superconducting coil device in which a plurality of superconducting coils are stacked. The superconducting coil has a superconducting wire, an inner frame, and an outer frame. The superconducting wire forms a winding portion. The inner frame is around which the superconducting wire is wound. The outer frame is provided on the outside of the superconducting wire wound around the inner frame. The turns of the wound superconducting wire are spaced apart. [Brief explanation of the drawing]

[0007] [Figure 1] A diagram showing an overview of the superconducting coil device 1. [Figure 2] A plan view of the pancake coil 2A of the first embodiment. [Figure 3] Cross-sectional view along line III-III in Figure 2. [Figure 4] This diagram shows the state in which the high-temperature superconducting wire 16 and the inner frame 12 are fixed together before being wound around the inner frame 12. [Figure 5] An explanatory diagram illustrating the procedure for manufacturing a Pancake Coil 2A. [Figure 6] A diagram illustrating other processes when the tension on high-temperature superconducting wire material 14P is released. [Figure 7] A diagram showing the pancake coil 2B of the second embodiment. [Figure 8] A diagram showing the pancake coil 2C of the third embodiment. [Figure 9] A diagram illustrating the general structure of the apparatus for forming the resin layer 31 in the pancake coil 2C of the third embodiment. [Figure 10]A diagram illustrating the overview of the apparatus for forming the resin layer in the pancake coil of the fourth embodiment. [Figure 11] A diagram illustrating the overview of the apparatus for forming the resin layer in the pancake coil of the fifth embodiment. [Figure 12] A diagram showing the pancake coil 2F of the sixth embodiment. [Figure 13] A diagram showing the pancake coil 2G of the seventh embodiment. [Modes for carrying out the invention]

[0008] The superconducting coil device, superconducting coil, magnetic resonance imaging apparatus, and method for manufacturing the superconducting coil device will be described below with reference to the drawings. The superconducting coil device of the embodiment is used, for example, in a magnetic resonance imaging apparatus (MRI: Magnetic Resonance Imaging apparatus, hereinafter referred to as MRI apparatus). The superconducting coil device is formed by stacking a plurality of pancake coils.

[0009] Figure 1 shows an overview of the superconducting coil device 1. The superconducting coil device 1 is formed by stacking multiple superconducting coils, such as pancake coils 2. The superconducting coil device 1 is formed as a large coil by stacking and connecting multiple pancake coils 2. The superconducting coil device 1 can be used for magnetic applications, for example, by being mounted on an MRI device (not shown) to form a magnetic field around the subject.

[0010] Multiple pancake coils 2 all have similar configurations. The pancake coils 2 are configured in various ways. The structures of various pancake coils 2 will be described below with different embodiments. In the following description, the reference numeral "2" for the pancake coil 2 will be replaced with a different letter for each embodiment. The superconducting coil device 1 may be constructed by stacking pancake coils 2 of the same structure, or by stacking pancake coils 2 of different structures.

[0011] (First embodiment) Figure 2 is a plan view of the pancake coil 2A of the first embodiment, and Figure 3 is a cross-sectional view taken along line III-III of Figure 2. The pancake coil 2A includes, for example, a bottom plate 11, an inner frame 12, an outer frame 13, a high-temperature superconducting wire winding portion (hereinafter referred to as the winding portion) 14, and a resin layer 15. The winding portion 14 includes a high-temperature superconducting wire 16 and an insulating tape 17. The pancake coil 2A is a single pancake coil in which one layer of the winding portion 14 is formed.

[0012] The bottom plate 11 is, for example, a rectangular thin plate having an opening at a position corresponding to the inner frame 12. The inner frame 12 is provided at the central portion on one surface side of the bottom plate 11. The inner frame 12 has a cylindrical shape. The inner frame 12 is made of, for example, glass fiber reinforced plastics (Glass-Fiber-Reinforced Plastics, hereinafter referred to as GFRP), oxygen-free copper, stainless steel, aluminum alloy, or the like.

[0013] A rectangular outer frame 13 is provided on the outer peripheral portion on one surface side of the bottom plate 11. A cutout for accommodating the winding portion 14 is formed inside the outer frame 13. The outer frame 13 is made of, for example, GFRP, oxygen-free copper, stainless steel, aluminum alloy, or the like. In the following description, the direction in which the bottom plate 11 is provided is taken as the bottom, and the inner frame 12 and the outer frame 13 are assumed to be erected on the upper surface of the bottom plate 11.

[0014] The winding portion 14 is provided between the outer side of the inner frame 12 and the inner side of the outer frame 13 (between the inner frame 12 and the outer frame 13). The winding portion 14 is formed by winding the high-temperature superconducting wire 16 and the insulating tape 17 around the inner frame 12 in a co-wound state. Both the high-temperature superconducting wire 16 and the insulating tape 17 that form the winding portion 14 are in the form of tapes. The winding portion 14 may be formed by co-winding a member other than the insulating tape 17 around the high-temperature superconducting wire 16. A superconducting wire may be used instead of the high-temperature superconducting wire.

[0015] Figure 4 shows the state in which the high-temperature superconducting wire 16 and the inner frame 12 are fixed together before being wound around the inner frame 12. One end of the high-temperature superconducting wire 16 is fixed to the inner frame 12 with adhesive 16S. Examples of adhesives 16S used to fix the inner frame 12 and the high-temperature superconducting wire 16 include cyanoacrylate resin, epoxy resin, silylated urethane resin, and modified silicone resin.

[0016] The high-temperature superconducting wire 16 is, for example, a REBCO wire. The insulating tape 17 is in the form of a tape with approximately the same width as the high-temperature superconducting wire 16. The insulating tape 17 is wound around the inner frame 12 with the insulating tape 17 overlapping the high-temperature superconducting wire 16. Between each turn of the high-temperature superconducting wire 16, the insulating tape 17 is interposed, suppressing short circuits between turns in the high-temperature superconducting wire 16.

[0017] In the pancake coil 2A, the turns of the high-temperature superconducting wire 16 wound around the inner frame 12 are spaced apart. The insulating tape 17 between the turns of the high-temperature superconducting wire 16 is positioned spaced apart from the high-temperature superconducting wire 16. The insulating tape 17 may be in contact with the high-temperature superconducting wire 16. The insulating tape 17 is made of an insulating material.

[0018] The resin layer 15 is formed on the radially upper portion of the wound high-temperature superconducting wire 16 and insulating tape 17. The resin layer 15 covers the upper surface of the high-temperature superconducting wire 16 and insulating tape 17 and penetrates between the turns of the high-temperature superconducting wire 16 and insulating tape 17. The resin layer 15 functions to maintain the separated state of the high-temperature superconducting wire 16 between turns.

[0019] The spacing between turns of the high-temperature superconducting wire 16 is kept constant. A likelihood of approximately 0.5 to 5 mm is set for the distance between the inner frame 12 and the outer frame 13. This likelihood is the sum of the gaps between turns in the high-temperature superconducting wire 16. Therefore, the ideal spacing between turns in the high-temperature superconducting wire 16 is based on the value obtained by dividing the difference between the total winding thickness when the high-temperature superconducting wire 16 is tightly wound and the distance from the outside of the inner frame 12 to the inside of the outer frame 13 by the number of turns of the high-temperature superconducting wire 16, and is shown, for example, by (1) below. When insulating tape 17 is wound together with the high-temperature superconducting wire 16, the total winding thickness when the high-temperature superconducting wire 16 is tightly wound may be the total winding thickness when the high-temperature superconducting wire 16 and insulating tape 17 are tightly wound together. (Total thickness of high-temperature superconducting wire 16 and insulating tape 17) - (Distance between inner frame 12 and outer frame 13) / Number of turns ... (1)

[0020] The resin layer 15 is formed by applying it to the upper surface of the high-temperature superconducting wire 16 and the insulating tape 17. The resin layer 15 is composed of, for example, vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, silylated urethane resin, and modified silicone resin. Of these, the resin layer 15 is composed of high-viscosity resins with high viscosity, such as vinyl acetate resin, ethylene vinyl acetate resin, silylated urethane resin, and modified silicone resin.

[0021] Next, the procedure for manufacturing the superconducting coil device 1 of the embodiment will be described. The superconducting coil device 1 is manufactured, for example, by first manufacturing a plurality of pancake coils 2A and then stacking these plurality of pancake coils 2A. Here, the procedure for manufacturing the pancake coils 2A will be described.

[0022] Figure 5 is an explanatory diagram illustrating the procedure for manufacturing the pancake coil 2A. When manufacturing the pancake coil 2A, first, the high-temperature superconducting wire 16 is fixed to the inner frame 12 attached to the base plate 11 with adhesive 16S, as shown in Figure 4. Next, as shown in the upper part of Figure 5, the high-temperature superconducting wire material 14P, which consists of the high-temperature superconducting wire 16 and insulating tape 17 layered on top of each other, is wrapped around the inner frame 12 while being tightened. At this time, tension is applied to the high-temperature superconducting wire material 14P due to the tightening force.

[0023] After winding the entire length of the high-temperature superconducting wire material 14P around the inner frame 12, the end of the winding of the high-temperature superconducting wire material 14P is temporarily secured to maintain tension. Next, an outer frame 13 is placed on the bottom plate 11 so as to cover the outer circumference of the high-temperature superconducting wire material 14P, and the outer frame 13 is positioned around the high-temperature superconducting wire material 14P as shown in the middle section of Figure 5.

[0024] The outer frame 13 is provided on the outside of the high-temperature superconducting wire wound around the inner frame. The diameter of the cylindrical cutout inside the outer frame 13 is slightly wider than the diameter of the bottom surface of the high-temperature superconducting wire material 14P wound around the inner frame 12. Therefore, the high-temperature superconducting wire material 14P is entirely contained within the cylindrical cutout inside the outer frame 13.

[0025] After the outer frame 13 is attached to the base plate 11, the temporary fastening at the end of the winding of the high-temperature superconducting wire material 14P is removed to release the tension applied to the high-temperature superconducting wire material 14P. Upon release of the tension, the high-temperature superconducting wire material 14P expands in all directions inside the outer frame 13, as shown in the lower part of Figure 5, and is formed as a winding portion 14.

[0026] As the high-temperature superconducting wire material 14P expands, the high-temperature superconducting wire 16 within the high-temperature superconducting wire material 14P expands between the inner frame 12 and the outer frame 13, with the intervals between turns widening. The expansion of the high-temperature superconducting wire material 14P is suppressed by the outer frame 13, and then a spring force is applied to make the width between the turns of the high-temperature superconducting wire 16 uniform, so that the width between the turns of the high-temperature superconducting wire 16 becomes nearly uniform. As a result, the intervals between the turns of the high-temperature superconducting wire 16 widen, and the insulating tape 17 is placed in the space between the turns of the high-temperature superconducting wire 16.

[0027] Next, a resin layer 15 is formed above the winding portion 14. The resin layer 15 is formed, for example, by applying a high-viscosity resin and then drying the applied resin. The resin forming the resin layer 15 flows into the spaces between the turns of the high-temperature superconducting wire 16, and fills, for example, the upper part of the spaces between the turns of the high-temperature superconducting wire 16, maintaining the width between the turns of the high-temperature superconducting wire 16. In this way, the pancake coil 2A of the first embodiment is manufactured.

[0028] Multiple pancake coils 2A are manufactured using the same procedure. The multiple manufactured pancake coils 2A are stacked to produce the superconducting coil device 1 shown in Figure 1.

[0029] Figure 6 illustrates other processes when the tension of the high-temperature superconducting wire material 14P is released. From the time the tension of the high-temperature superconducting wire material 14P is released between the inner frame 12 and the outer frame 13 until the high-temperature superconducting wire material 14P expands between the inner frame 12 and the outer frame 13, vibration V may be applied to the high-temperature superconducting wire material 14P using a vibration-applying device such as a vibrator, as shown in Figure 6. By applying vibration V to the high-temperature superconducting wire material 14P, the width between turns of the high-temperature superconducting wire 16 can be made more uniform.

[0030] To apply vibration to the high-temperature superconducting wire material 14P, the vibration applying device may directly vibrate the high-temperature superconducting wire material 14P, or it may indirectly vibrate the high-temperature superconducting wire material 14P by vibrating the outer frame 13 or the bottom plate 11. The vibration V may be applied, for example, immediately after the high-temperature superconducting wire material 14P is placed between the inner frame 12 and the outer frame 13, or it may be applied after the temporary fastening at the end of the winding of the high-temperature superconducting wire material 14P is removed.

[0031] In the superconducting coil device 1 equipped with the pancake coil 2A of the first embodiment, the high-temperature superconducting wire 16 is provided with a winding section 14 in which it is spaced apart between turns. Therefore, the thickness of the high-temperature superconducting wire 16 itself and the crushing of the insulator between turns when the high-temperature superconducting wire 16 is wound are less likely to occur. Consequently, the uniformity of the winding thickness of the high-temperature superconducting wire 16 in the winding section 14 can be improved.

[0032] In the superconducting coil device 1 used in MRI equipment, it is necessary to generate a highly uniform magnetic field, so uniformity of the winding thickness of the pancake coil 2A is important. In this regard, the pancake coil 2A of the first embodiment is formed with spacing between turns. Therefore, adverse effects on the uniformity of the winding thickness due to the thickness of the high-temperature superconducting wire 16 and the crushing of the insulator between turns when winding the high-temperature superconducting wire material 14P can be eliminated. Thus, the uniformity of the winding thickness of the high-temperature superconducting wire 16 can be improved.

[0033] Furthermore, when manufacturing the pancake coil 2A of the first embodiment, the high-temperature superconducting wire material 14P is wound around the inner frame 12 while tightening it in the direction of the inner frame 12, ensuring that there are no gaps between turns. Subsequently, after placing the outer frame 13 around it, the tension applied to the high-temperature superconducting wire material 14P is released, forming a high-temperature superconducting wire 16 between the inner frame 12 and the outer frame 13, with gaps formed between turns.

[0034] Therefore, by utilizing the tension applied to the high-temperature superconducting wire material 14P, gaps between turns of the high-temperature superconducting wire material 14P can be formed, thus reducing the effort required to easily manufacture the winding portion 14. Furthermore, when releasing the tension applied to the high-temperature superconducting wire material 14P, vibration can be applied to the high-temperature superconducting wire material 14P using a vibration applying device, thereby more effectively forming gaps between turns.

[0035] (Second embodiment) Next, the pancake coil 2B of the second embodiment will be described. Figure 7 shows the pancake coil 2B of the second embodiment. In Figure 7, the upper section shows a plan view of the pancake coil 2B, and the lower section shows a cross-sectional view taken along line VII-VII of the plan view shown in the upper section. The pancake coil 2B comprises a base plate 11, an inner frame 12, an outer frame 13, a winding section 14, and a resin layer 15, similar to those of the first embodiment. The pancake coil 2B further comprises a heat transfer plate 21. In the following description, common components in each embodiment may be denoted by the same reference numerals, and detailed descriptions may be omitted.

[0036] As shown in the upper part of Figure 7, the heat transfer plate 21 includes two plates that form a semi-ring shape with a central angle of approximately 180° and are arranged opposite each other. The heat transfer plate 21 is positioned on the upper surface of the winding portion 14. The heat transfer plate 21 is made of, for example, a metal with high heat conductivity. The heat transfer plate 21 may also be made of a material other than metal, such as resin.

[0037] The heat transfer plate 21 is fixed to the inner frame 12 and outer frame 13 by bolts BL, for example. The resin layer 15 and the heat transfer plate 21 may be fixed to the inner frame 12 and outer frame 13 by other fasteners instead of bolts BL, or they may be bonded to the inner frame 12 and outer frame 13 with adhesive. The heat transfer plate 21 may be fixed to only one of the inner frame 12 or the outer frame 13.

[0038] The heat transfer plate 21 is fixed to the winding section 14 by the resin layer 15. The resin forming the resin layer 15 is pressed into the winding section 14 by the heat transfer plate 21, which is bolted to it. The lower part of Figure 7 shows the state in which the heat transfer plate 21 presses into the resin layer 15. Since the heat transfer properties of the heat transfer plate 21 are higher than those of the resin layer 15, the cooling efficiency of the winding section 14 can be increased. The resin layer 15 is made of a highly heat-conductive material, such as a metal, after the winding section 14 is formed between the inner frame 12 and the outer frame 13, and is made of a material with higher heat conductivity than the resin forming the resin layer 15.

[0039] The superconducting coil device 1 equipped with the pancake coil 2B of the second embodiment provides the same effects as the superconducting coil device 1 equipped with the pancake coil 2A of the first embodiment, and is also provided with a heat transfer plate 21 with high heat transfer properties. Therefore, the cooling efficiency of the winding portion 14 can be increased.

[0040] (Third embodiment) Next, the pancake coil 2C of the third embodiment will be described. Figure 8 shows the pancake coil 2C of the third embodiment. In Figure 8, the upper section shows a plan view of the pancake coil 2C, and the lower section shows a cross-sectional view of the plan view shown in the upper section along line VIII-VII. The pancake coil 2C of the third embodiment differs from the pancake coil 2B of the second embodiment mainly in that it has a perforated bottom plate 18, a resin layer 31, and a perforated heat transfer plate 22 instead of the bottom plate 11, resin layer 15, and heat transfer plate 21. In the following figures, bolts that fix the heat transfer plate to the outer frame may be omitted.

[0041] The perforated bottom plate 18 is made of the same material as the bottom plate 11 in the pancake coil 2B of the second embodiment, and has a number of ventilation holes 18H when viewed from above. The perforated heat transfer plate 22 is made of the same material as the heat transfer plate 21 in the pancake coil 2B of the second embodiment, and has a number of ventilation holes 22H when viewed from above.

[0042] The resin layer 31 is formed to fill the gap between the high-temperature superconducting wire 16 and the insulating tape 17 in the winding section 14 from below. The ventilation holes 18H in the perforated bottom plate 18 are filled with the resin that forms the resin layer 31. No resin layer is formed between the perforated heat transfer plate 22 and the winding section 14, so the perforated heat transfer plate 22 and the winding section 14 are separated and not in contact.

[0043] Next, the procedure for forming the resin layer 31 in the pancake coil 2C of the third embodiment will be described. Figure 9 is a diagram illustrating the overview of the apparatus for forming the resin layer 31 in the pancake coil 2C of the third embodiment. The apparatus for forming the resin layer 31 in the pancake coil 2C of the third embodiment includes, for example, a vacuum pump 40 and a resin retention tank 41. The resin retention tank 41 contains a low-viscosity resin 42 that forms the resin layer 31. The retained low-viscosity resin 42 is, for example, a resin with low viscosity, specifically, an epoxy resin.

[0044] When forming the resin layer 31, first, the resin-free pancake coil 2C', before the resin layer 31 is formed, is placed into the resin retention tank 41 where the low-viscosity resin 42 is retained, and the lower part of the resin-free pancake coil 2C' is immersed in the low-viscosity resin 42 retained in the resin retention tank 41. In this state, the vacuum pump 40 is connected to the upper surface of the perforated heat transfer plate 22 of the resin-free pancake coil 2C', and the vacuum pump 40 is activated to create a vacuum inside the resin-free pancake coil 2C'. The low-viscosity resin 42 flows into the inside of the resin-free pancake coil 2C' through the vents 18H of the perforated bottom plate 18 due to atmospheric pressure P1 and the suction force P2 of the vacuum pump 40, and the low-viscosity resin 42 penetrates between the winding sections 14. The resin-free pancake coil 2C' may be inverted, and the upper part of the resin-free pancake coil 2C' may be immersed in the low-viscosity resin 42 stored in the resin retention tank 41 to form the resin layer 31.

[0045] The suction force and suction time of the vacuum pump 40 are adjusted to push the low-viscosity resin 42 up to the desired height. By maintaining this state and allowing the low-viscosity resin 42 to solidify, a resin layer 31 is formed. Subsequently, the resin on the outside of the resin-less pancake coil 2C' is scraped off to produce the pancake coil 2C.

[0046] The superconducting coil device 1 equipped with the pancake coil 2C of the third embodiment provides the same effects as the superconducting coil device 1 equipped with the pancake coil 2B of the second embodiment, and also allows for the suitability of forming a resin layer with a low viscosity resin. Furthermore, since no resin layer is formed between the perforated heat transfer plate 22 and the winding portion 14, the thickness of the perforated heat transfer plate 22 can be increased.

[0047] (Fourth embodiment) Next, the pancake coil of the fourth embodiment will be described. The pancake coil of the fourth embodiment differs from the pancake coil 2C of the third embodiment in that a resin layer is formed over the entire inner surface of the resin-less pancake coil 2D'. The pancake coil of the fourth embodiment will be described by showing the method for forming the resin layer.

[0048] Figure 10 is a diagram illustrating the overview of an apparatus for forming a resin layer in a pancake coil according to the fourth embodiment. The apparatus for forming a resin layer in a pancake coil according to the fourth embodiment includes, for example, a vacuum pump 40 and a resin container 43. A low-viscosity resin 42 is sealed in the resin container 43. The low-viscosity resin 42 is, for example, a resin with low viscosity, specifically, an epoxy resin.

[0049] When forming a resin layer on the resin-less pancake coil 2D', first, the resin-less pancake coil 2D' is placed in a resin container 43 containing low-viscosity resin 42 so that the entire coil is immersed in the low-viscosity resin 42. The low-viscosity resin 42 flows into the interior of the resin-less pancake coil 2D' through the vents 18H of the perforated bottom plate 18 and the vents 22H of the perforated heat transfer plate 22. The low-viscosity resin 42 penetrates the entire interior of the resin-less pancake coil 2D', including between the winding sections 14.

[0050] Next, the vacuum pump 40 is connected to the inside of the resin container 43, and the inside of the resin container 43 is vacuum-suctioned by the vacuum pump 40. The suction force of the vacuum pump 40 vacuum-suctions the air bubbles BU contained in the low-viscosity resin 42, and the air contained in the low-viscosity resin 42 is removed by vacuum evacuation. After that, by repeatedly vacuum evacuation and release to the atmosphere, the low-viscosity resin 42 is pushed into the resin-less pancake coil 2D'. Once these processes are complete, the low-viscosity resin 42 is solidified. After that, the resin on the outside of the resin-less pancake coil 2D' is scraped off to produce the pancake coil.

[0051] The superconducting coil device 1 equipped with the pancake coil of the fourth embodiment provides the same effects as the superconducting coil device 1 equipped with the pancake coil 2A of the first embodiment, and can suitably form a resin layer with a low viscosity resin. Furthermore, since air bubbles in the low viscosity resin 42 are removed by vacuum suction, a high-density resin layer can be formed.

[0052] (Fifth embodiment) Next, the fifth embodiment of the pancake coil will be described. The fifth embodiment of the pancake coil differs from the third embodiment of the pancake coil 2C in that the resin layer is formed by an apparatus equipped with an ultrasonic generator 60 in the resin retention tank 41. Figure 11 is a diagram illustrating the overview of the apparatus for forming the resin layer in the fifth embodiment of the pancake coil. The fifth embodiment will be described by showing the method for forming the resin layer of the pancake coil.

[0053] The procedure for forming a resin layer on the resin-less pancake coil 2E' in the fifth embodiment differs from the procedure for forming a resin layer on the resin-less pancake coil 2C' in the third embodiment in that ultrasonic vibrations are applied to the low-viscosity resin 42 by an ultrasonic generator 60 when the inside of the resin-less pancake coil 2C' is vacuum-suctioned by a vacuum pump 40. Other aspects are the same as in the third embodiment.

[0054] The superconducting coil device 1 equipped with the pancake coil of the fifth embodiment provides the same effects as the superconducting coil device 1 equipped with the pancake coil 2C of the third embodiment. In addition, when the inside of the resin-less pancake coil 2C' is vacuum-suctioned by the vacuum pump 40, ultrasonic vibrations are applied to the low-viscosity resin 42 by the ultrasonic generator 60, allowing the resin to penetrate more effectively. Similarly, with respect to the pancake coil of the fourth embodiment, when the inside of the resin container is vacuum-suctioned by the vacuum pump 40, ultrasonic vibrations may be applied to the low-viscosity resin 42 by the ultrasonic generator 60.

[0055] (Sixth embodiment) Next, the pancake coil 2F of the sixth embodiment will be described. Figure 12 shows the pancake coil 2F of the sixth embodiment. In Figure 12, the upper section shows a plan view of the pancake coil 2F, and the lower section shows a cross-sectional view of the plan view shown in the upper section along line XII-XII. The pancake coil 2F of the sixth embodiment differs from the second embodiment mainly in that a lower heat transfer plate 23L is attached in place of the bottom plate 11.

[0056] Furthermore, the sixth embodiment differs from the second embodiment in that a lower resin layer 15L is provided between the lower heat transfer plate 23L and the winding portion 14. In the sixth embodiment, the upper heat transfer plate is referred to as the upper heat transfer plate 23U, and the upper resin layer is referred to as the upper resin layer 15U. In Figure 12, the upper resin layer 15U and the lower resin layer 15L are connected between turns of the winding portion 14, but the upper resin layer 15U and the lower resin layer 15L may be separated between turns of the winding portion 14.

[0057] When manufacturing the pancake coil 2F of the sixth embodiment, first, the upper resin layer 15U is formed using the same procedure as in the second embodiment, and the upper heat transfer plate 23U is fixed in place. Next, the pancake coil 2F being manufactured is inverted, and the lower resin layer 15L is formed using the same procedure as in the second embodiment, and the lower heat transfer plate 23L is fixed in place.

[0058] Subsequently, the pancake coil 2F being manufactured is flipped over again to form pancake coil 2F. In this way, a pancake coil can be formed in which the upper heat transfer plate 23U and the lower heat transfer plate 23L are provided in upper and lower layers. Even in a pancake coil in which the heat transfer plates 23 are provided in upper and lower layers, the uniformity of the winding thickness of the superconducting wire can be improved.

[0059] (Seventh Embodiment) Next, the pancake coil 2G of the seventh embodiment will be described. Figure 13 shows the pancake coil 2G of the seventh embodiment. In Figure 13, the left figure shows a plan view of the pancake coil 2G, and the right figure shows a cross-sectional view taken along line XIII-XIII in the left figure. The pancake coil 2G of the seventh embodiment differs from the pancake coil 2B of the second embodiment mainly in that it is a double pancake coil in which two layers of winding are formed.

[0060] The pancake coil 2G of the seventh embodiment comprises an upper coil layer 2GU and a lower coil layer 2GL. The upper coil layer 2GU comprises, for example, an upper inner frame 12U, an upper outer frame 13U, an upper winding portion 14U, and an upper resin layer 15U. The upper winding portion 14U comprises an upper high-temperature superconducting wire 16U and an upper insulating tape 17U.

[0061] The lower coil layer 2GL comprises, for example, a lower inner frame 12L, a lower outer frame 13L, a lower winding section 14L, and a lower resin layer 15L. The lower winding section 14L comprises a lower high-temperature superconducting wire 16L and a lower insulating tape 17L. A separator 19 is provided between the lower inner frame 12L and the upper inner frame 12U, the upper winding section 14U and the lower winding section 14L, and the upper outer frame 13U and the lower outer frame 13L. The upper coil layer 2GU and the lower coil layer 2GL are connected with the separator 19 in between, in a configuration where their orientations are reversed. Even in such a double pancake, the uniformity of the winding thickness of the superconducting wire can be improved.

[0062] According to at least one embodiment described above, a superconducting coil device having a superconducting wire that forms a winding portion, an inner frame around which the superconducting wire is wound, and an outer frame provided on the outside of the superconducting wire wound around the inner frame, wherein the turns of the wound superconducting wire are spaced apart, thereby improving the uniformity of the winding thickness of the superconducting wire.

[0063] While several embodiments have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims and their equivalents. [Explanation of Symbols]

[0064] 1. Superconducting coil device 2(2A,2B,2C,2D,2E,2F,2G) Pancake Coil 11 Bottom plate 12 Inner frame 13 Outer frame 14. Turning section 15,31 Resin layer 16 High-temperature superconducting wires 17. Insulating tape 18 Perforated bottom plate 18H Ventilation 19 Separator 21,23 Heat transfer plate 22 Perforated heat transfer plate 22H Ventilation 40 Vacuum pump 41 Resin retention tank 42 Low viscosity resin 43 Plastic containers 60 Ultrasonic generator BL Bolt BU bubbles P1 Atmospheric pressure P2 Suction power V vibration

Claims

1. A superconducting coil device in which multiple superconducting coils are stacked, The superconducting coil is, A superconducting wire forming a winding section, The inner frame around which the superconducting wire is wound, The system comprises an outer frame provided on the outside of the superconducting wire wound around the inner frame, The turns of the winding superconducting wire are spaced apart. Superconducting coil device.

2. The spacing between turns is based on the difference between the total winding thickness when the superconducting wire is tightly wound and the distance from the outside of the inner frame to the inside of the outer frame, divided by the number of turns of the superconducting wire. The superconducting coil device according to claim 1.

3. A resin layer is formed to maintain the separated state between turns of the superconducting wire. The superconducting coil device according to claim 1.

4. The resin layer is formed on at least one of the upper or lower parts of the wound superconducting wire in the radial direction. The superconducting coil device according to claim 3.

5. The heat transfer plate is fixed to the superconducting coil by the aforementioned resin layer. The superconducting coil device according to claim 4.

6. The heat transfer plate is bolted to at least one of the inner frame or the outer frame, and the resin forming the resin layer is pressed into the superconducting wire. The superconducting coil device according to claim 5.

7. The resin layer is formed by suctioning the resin accumulated in the resin retention tank, with the upper or lower part of the wound superconducting wire immersed in the resin retention tank in the resin retention tank. The superconducting coil device according to claim 3.

8. The resin in the resin retention tank is vacuum-suctioned. The superconducting coil device according to claim 7.

9. The superconducting coil includes a single pancake coil in which the winding portion is formed in one layer. The superconducting coil device according to claim 1.

10. The superconducting coil includes a double pancake coil in which the winding portion is formed in two layers. The superconducting coil device according to claim 1.

11. The end of the superconducting wire is bonded to the inner frame with resin. The superconducting coil device according to claim 1.

12. A superconducting coil in a superconducting coil device in which multiple superconducting coils are stacked, A superconducting wire forming a winding section, The inner frame around which the superconducting wire is wound, The system comprises an outer frame provided on the outside of the superconducting wire wound around the inner frame, The turns of the winding superconducting wire are spaced apart. Superconducting coil.

13. The superconducting coil device according to claim 1, Magnetic resonance imaging device.

14. The superconducting wire material that will form the winding portion is wound around an inner frame, while tightening it in the direction of the inner frame, and winding it so that there is no gap between turns. An outer frame is placed around the superconducting wire material, which is wound around the inner frame and is provided on the outside of the superconducting wire material. The tension caused by the clamping force of the superconducting wire material is released, and the superconducting wire, with gaps formed between the turns, is formed between the inner frame and the outer frame. Multiple superconducting coils are manufactured and stacked. A method for manufacturing a superconducting coil device.

15. When releasing the tension, vibration is applied to the superconducting wire material. A method for manufacturing a superconducting coil device according to claim 14.

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