Insert molding die

The insert molding die addresses bending and arrangement issues in electric wires by using a mold structure with a slide piece to partition the cavity, ensuring strength and precision in wire arrangement and design flexibility.

JP2026084415APending Publication Date: 2026-05-21SATOSEIKI
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SATOSEIKI
Filing Date
2024-11-11
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing methods for forming electric wires with insulating films face issues with strength, accuracy in arranging multiple conductive wires, and design limitations, particularly when forming multi-core configurations, as they bend under injection pressure and require separate connectors.

Method used

An insert molding die with a mold structure that includes a first and second mold forming a cavity, a slide piece with through-holes, and a mechanism to partition the cavity, allowing conductive wires to be inserted without bending, ensuring precise arrangement and design freedom.

Benefits of technology

The insert molding die maintains wire strength and precision, enabling easy routing and connection in multi-core configurations, and allows for customizable external shapes suitable for terminals and connectors.

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Abstract

Extruded products have low strength, making them difficult to route in designated locations. Furthermore, the lack of precision in the placement of multiple conductive wires makes connecting them difficult. [Solution] The lower mold plate 5 includes through holes 25, 23, 25 and is equipped with a slide piece 21 that slides within the main cavity 9, liquid-tightly separating the destination side from the rear side. With the conductive wires B2, B1, B2 passing through it, as the slide piece 21 is pushed and slides away from the injection side of the molten resin (M), the slide piece 21 moves under the pressure of the flow, so the molten resin (M) flows in at an appropriate flow rate, gently enveloping the conductive wires B2, B1, B2 guided by the slide piece 21, and flowing along the direction of movement of the slide piece 21. Therefore, the conductive wires B2, B1, B2 do not bend against the injection pressure, and accuracy of their placement is ensured. By connecting sub-cavities 11, ribs and bosses can be added to the molded product.
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