Mounting board and method for manufacturing the same

Abstract

By reducing the amount of resin injected, we provide a mounting substrate that can reduce manufacturing costs through weight reduction and lower material costs. [Solution] The present invention comprises a case 21, an upper substrate 11 disposed inside the case 21, a lower substrate 12 disposed inside the case 21, facing the upper substrate 11 and electrically connected to the upper substrate 11, and a potting resin 31 injected into the case 21 and covering the upper substrate 11 and the lower substrate 12, wherein the surface 31a of the potting resin 31 is inclined with respect to the respective surfaces of the upper substrate 11 and the lower substrate 12.

Description

Technical Field

[0001] The present invention relates to a mounting substrate and a method for manufacturing the same.

Background Art

[0002] In an apparatus with a layout where a plurality of substrates are arranged parallel to each other in the vertical direction, when potting the whole with resin, it is necessary to inject the resin up to the uppermost substrate, and the increase in the amount of resin due to potting the space that is not originally required for potting has led to an increase in the product weight and material cost.

[0003] Also, when the upper and lower limit values of the resin height for potting are different for components mounted on the substrate, it is not possible to pot components with different heights with a single injection of resin, and measures such as injecting in two steps while providing a partition plate or a frame and performing curing have been taken. Related techniques are described in Patent Document 1.

[0004] Therefore, there is a need to eliminate the need for resin injection in two steps and reduce the amount of resin injection, thereby reducing the product weight and suppressing the manufacturing cost due to a reduction in material cost.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Various aspects of the present invention aim to provide a mounting substrate and a method for manufacturing the same that can suppress the manufacturing cost due to weight reduction and material cost reduction by reducing the amount of resin injection.

Means for Solving the Problems

[0007] Various aspects of the present invention will be described below.

[0008] [1] Case and, An upper circuit board placed inside the case, The lower circuit board is located inside the case, A potting resin is injected into the case and covers the upper and lower substrates, It has, The mounting substrate is characterized in that the surface of the potting resin is inclined with respect to the respective surfaces of the upper substrate and the lower substrate.

[0009] According to the mounting substrate described in [1] above in one aspect of the present invention, the surface of the potting resin is inclined with respect to the respective surfaces of the upper and lower substrates, so that regions with low and high resin heights can be created from the respective surfaces of the upper and lower substrates to the surface of the potting resin. That is, with a single resin injection, the height of the potting resin from the upper and lower substrates can be made different. In other words, for mounting components that require different heights of potting resin from the substrate, mounting components that require a higher height can be placed in the substrate region where the resin height is higher, and mounting components that require a lower height can be placed in the substrate region where the resin height is lower, thereby reducing the amount of resin injected and eliminating the need for two-stage resin injection. As a result, the mounting substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0010] [2] In the above [1], In claim 1, A first electronic component mounted on the lower substrate and entirely covered by the potting resin, A second electronic component is mounted on one side of the upper substrate, with its lower part covered by the potting resin and its upper part exposed from the potting resin, A third electronic component is mounted on the other side of the upper substrate, with its lower part covered by the potting resin and its upper part exposed from the potting resin, It has, A mounting substrate characterized in that the height from the surface of the upper substrate on which the third electronic component is mounted to the surface of the potting resin is higher than the height from the surface of the upper substrate on which the second electronic component is mounted to the surface of the potting resin.

[0011] According to the mounting substrate described in [2] above in one aspect of the present invention, the height from the surface of the upper substrate on which the third electronic component is mounted to the surface of the potting resin is higher than the height from the surface of the upper substrate on which the second electronic component is mounted to the surface of the potting resin. In other words, the third electronic component, which requires a high height from the surface of the upper substrate to the surface of the potting resin, is placed in a substrate region with a high potting resin height, and the second electronic component, which requires a low height from the surface of the upper substrate to the surface of the potting resin, is placed in a substrate region with a low potting resin height. This reduces the amount of resin injected and eliminates the need for two-stage resin injection. As a result, the mounting substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0012] [3] In the above [2], The second electronic component is a component with a limited depth to which it can be embedded in the potting resin. The mounting substrate is characterized in that the third electronic component has a required depth to be embedded in the potting resin.

[0013] According to the mounting substrate described in [3] above in one aspect of the present invention, the second electronic component is a component with a limited potting resin height, and the third electronic component is a component that requires a certain height for potting resin. By arranging the electronic components in this way, the amount of resin injected can be reduced, and the need for two-stage resin injection can be eliminated. As a result, the mounting substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0014] [4] In the above [3], The second electronic component is a connector. The mounting substrate is characterized in that the third electronic component is an electronic component having lead wires. The electronic component having the lead wires is, for example, a capacitor.

[0015] [5] An upper circuit board and a lower circuit board that faces the upper circuit board and is electrically connected to the upper circuit board are arranged inside the case. A method for manufacturing a mounting substrate, characterized in that the case is tilted so that the surfaces of the upper substrate and the lower substrate are inclined with respect to a horizontal plane, and a potting resin covering the upper substrate and the lower substrate is injected into the case, thereby forming a potting resin having a surface inclined with respect to the surfaces of the upper substrate and the lower substrate.

[0016] According to the manufacturing method of the mounting substrate described in [5] above, which is one aspect of the present invention, the case is tilted so that the surfaces of the upper and lower substrates are inclined with respect to the horizontal plane, and potting resin covering the upper and lower substrates is injected into the case, thereby forming potting resin having a surface inclined with respect to the surfaces of the upper and lower substrates. As a result, it is possible to create areas with low and high resin heights from the surfaces of the upper and lower substrates to the surface of the potting resin. That is, with a single injection of resin, the heights of the potting resin from the upper and lower substrates can be different. In other words, for mounting components that require different heights of potting resin from the substrate, mounting components that require a higher height can be placed in the substrate area where the resin height is higher, and mounting components that require a lower height can be placed in the substrate area where the resin height is lower, thereby reducing the amount of resin injected and eliminating the need to perform resin injection in two stages by providing partition plates or frames. As a result, the mounting substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs. [Effects of the Invention]

[0017] According to various aspects of the present invention, it is possible to provide a mounting substrate and a method for manufacturing the same that can reduce manufacturing costs by reducing the amount of resin injected, thereby reducing weight and material costs. [Brief explanation of the drawing]

[0018] [Figure 1] It is a cross-sectional view showing the structure of a mounting substrate according to one aspect of the present invention.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the form and details thereof can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below.

[0020] (First Embodiment) FIG. 1 is a cross-sectional view showing the structure of a mounting substrate according to one aspect of the present invention. This mounting substrate is three-dimensionally arranged. [[ID=​​​Furthermore, potting resin 31 is injected into the case 21, and this potting resin 31 covers the upper substrate 11 and the lower substrate 12. The surface 31a of the potting resin 31 is inclined with respect to the respective surfaces of the upper substrate 11 and the lower substrate 12. In other words, the surface 31a of the potting resin 31 is inclined, not parallel, with respect to the bottom surface 21a of the case 21. The respective surfaces of the upper substrate 11 and the lower substrate 12 are flat or nearly parallel with respect to the bottom surface 21a of the case 21.

[0022] A first electronic component 41 is mounted on the lower substrate 12, and the first electronic component 41 is entirely covered with potting resin 31. It is preferable that the first electronic component 41 is entirely or above a certain height covered with potting resin 31. The first electronic component 41 is, for example, a surface mount component, a capacitor, a coil, or a busbar.

[0023] Furthermore, a second electronic component 42 is mounted on one side of the upper circuit board 11. The lower part of the second electronic component 42 is covered by potting resin 31, and the upper part is exposed from the potting resin 31. The second electronic component 42 is a component that has a limit on the depth to which it can be embedded in the potting resin 31 (potting height). In other words, the second electronic component 42 is a component for which the upper limit of the potting height is determined. The second electronic component 42 may be, for example, a connector, terminal block, electrolytic capacitor, or transformer.

[0024] Furthermore, a third electronic component 43 is mounted on the other side of the upper substrate 11. The lower part of the third electronic component 43 is covered by potting resin 31, and the upper part of the third electronic component 43 is exposed from the potting resin 31. The third electronic component 43 is a component that has a required depth (required potting height) that it must be embedded in the potting resin 31. In other words, the third electronic component 43 is a component for which the lower limit of the potting height is determined. The third electronic component 43 is an electronic component with lead wires, such as a capacitor or a semiconductor.

[0025] The height (depth) from the surface of the upper substrate 11 on which the third electronic component 43 is mounted to the surface of the potting resin 31 is higher (deeper) than the height (depth) from the surface of the upper substrate 11 on which the second electronic component 42 is mounted to the surface of the potting resin 31. Also, the height from the bottom surface 21a of the case 21 to the surface of the potting resin 31 (depth of the potting resin 31) is lower on the side of the first electronic component 41 and higher on the side of the third electronic component 43, and the height where the second electronic component 42 is located is between the height of the first electronic component 41 and the third electronic component 43. The surface of the potting resin 31 is flat.

[0026] Furthermore, a fourth electronic component 44 is mounted on the lower substrate 12, located next to the first electronic component 41 and taller than the surface of the upper substrate 11. The lower part of the fourth electronic component 44 is covered by potting resin 31, with the upper part exposed from the potting resin 31. The fourth electronic component 44 may be, for example, a connector, a terminal block, or an electrolytic capacitor.

[0027] Furthermore, a fifth electronic component 45 is mounted on the upper substrate 11, located next to the third electronic component 43 and on one side of the case 21. The fifth electronic component 45 is entirely covered with potting resin 31. The fifth electronic component 45 may be, for example, a surface mount component, a coil, or a busbar. Furthermore, the sixth electronic component 46 is preferably a component that is covered entirely or above a certain height by the potting resin 31, such as a capacitor.

[0028] According to this embodiment, since the surface 31a of the potting resin 31 is inclined with respect to the respective surfaces of the upper substrate 11 and the lower substrate 12, it is possible to create areas with low and high resin heights from the respective surfaces of the upper substrate 11 and the lower substrate 12 to the surface 31a of the potting resin 31. In other words, with a single resin injection, the height of the potting resin from the upper substrate 11 and the lower substrate 12 can be made different. That is, for mounted components that require different heights of potting resin 31 from the substrate, mounted components that require a higher height can be placed in the substrate area where the resin height is higher, and mounted components that require a lower height can be placed in the substrate area where the resin height is lower, thereby preventing the injection of resin into unnecessary areas and reducing the amount of resin injected. Furthermore, it eliminates the need to use a partition plate or the like to inject resin in two stages to prevent the injection of resin into unnecessary areas. As a result, the mounted substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0029] Furthermore, according to this embodiment, the height from the surface of the upper substrate 11 on which the third electronic component 43 is mounted to the surface of the potting resin 31 is higher than the height from the surface of the upper substrate 11 on which the second electronic component 42 is mounted to the surface of the potting resin 31. In other words, the third electronic component 43, which requires a higher height from the surface of the upper substrate 11 to the surface of the potting resin 31, is placed in a substrate region where the potting resin 31 is taller, and the second electronic component 42, which requires a lower height from the surface of the upper substrate 11 to the surface of the potting resin 31, is placed in a substrate region where the potting resin 31 is shorter. This reduces the amount of resin injected and eliminates the need for two-stage resin injection. As a result, the mounted substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0030] Furthermore, in this embodiment, the second electronic component 42 is a component with a limited height for the potting resin 31, while the third electronic component 43 is a component that requires a certain height for the potting resin 31. By arranging the electronic components in this way, the amount of resin injected can be reduced, eliminating the need for two-stage resin injection. As a result, the mounted substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs.

[0031] (Second embodiment) The manufacturing method for the mounting substrate shown in Figure 1 is described below. First, the upper substrate 11 and the lower substrate 12, which faces the upper substrate 11 and is electrically connected to it, are placed inside the case 21. The upper substrate 11 and the lower substrate 12 are in the state shown in Figure 1, as described in the first embodiment. Next, with the case 21 tilted so that the surfaces of the upper substrate 11 and the lower substrate 12 are inclined with respect to the horizontal plane, potting resin 31 covering the upper substrate 11 and the lower substrate 12 is injected into the case 21. This forms a potting resin 31 having a surface 31a that is inclined with respect to the surfaces of the upper substrate 11 and the lower substrate 12.

[0032] According to the manufacturing method of the mounting substrate of this embodiment, the case 21 is tilted so that the surfaces of the upper substrate 11 and the lower substrate 12 are inclined with respect to the horizontal plane, and potting resin 31 covering the upper substrate 11 and the lower substrate 12 is injected into the case 21, thereby forming potting resin 31 having a surface 31a that is inclined with respect to the surfaces of the upper substrate 11 and the lower substrate 12. As a result, it is possible to create areas where the height of the resin from the surfaces of the upper substrate 11 and the lower substrate 12 to the surface 31a of the potting resin 31 is low and areas where it is high. In other words, with a single injection of resin, the height of the potting resin from the upper substrate 11 and the lower substrate 12 can be different. In other words, for mounting components that require different heights of potting resin 31 from the substrate, mounting components that require a higher height can be placed in the substrate area where the resin height is high, and mounting components that require a lower height can be placed in the substrate area where the resin height is low, thereby reducing the amount of resin injected and eliminating the need to perform resin injection in two stages by providing partition plates or frames. As a result, the mounted substrate can be made lighter, and manufacturing costs can be suppressed by reducing material costs. In this embodiment, the inclined surface 31a of the potting resin 31 is a linearly continuous inclined surface because the potting resin 31 is injected with the case 21 tilted. [Explanation of symbols]

[0033] 11 Upper circuit board 12 Lower board 21 cases 31 Potting resin 31a Surface of potting resin 41. First Electronic Component 42. Second Electronic Component 43. The third electronic component

Claims

1. The case and An upper circuit board placed inside the case, The lower circuit board is located inside the case, A potting resin is injected into the case and covers the upper and lower substrates, It has, The mounting substrate is characterized in that the surface of the potting resin is inclined with respect to the respective surfaces of the upper substrate and the lower substrate.

2. In claim 1, A first electronic component mounted on the lower substrate and entirely covered by the potting resin, A second electronic component is mounted on one side of the upper substrate, with its lower part covered by the potting resin and its upper part exposed from the potting resin, A third electronic component is mounted on the other side of the upper substrate, with its lower part covered by the potting resin and its upper part exposed from the potting resin, It has, A mounting substrate characterized in that the depth from the surface of the upper substrate on which the third electronic component is mounted to the surface of the potting resin is greater than the depth from the surface of the upper substrate on which the second electronic component is mounted to the surface of the potting resin.

3. In claim 2, The second electronic component is a component with a limited depth to which it can be embedded in the potting resin. The mounting substrate is characterized in that the third electronic component has a required depth to be embedded in the potting resin.

4. In claim 3, The second electronic component is a connector. The mounting substrate is characterized in that the third electronic component is an electronic component having lead wires.

5. An upper circuit board and a lower circuit board that faces the upper circuit board and is electrically connected to it are arranged inside the case. A method for manufacturing a mounting substrate, characterized in that the case is tilted so that the surfaces of the upper substrate and the lower substrate are inclined with respect to a horizontal plane, and a potting resin covering the upper substrate and the lower substrate is injected into the case, thereby forming a potting resin having a surface inclined with respect to the surfaces of the upper substrate and the lower substrate.

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