Lithography apparatus, method for manufacturing articles, information processing apparatus, and program

Abstract

This technology provides advantages for improving throughput in jobs that perform transfer processing using one or more master plates on one or more substrates. [Solution] A lithography apparatus configured to perform a job of transferring a pattern onto one or more substrates having multiple shot areas using one or more master plates, comprising a master plate stage and a controller that determines the fastest transfer procedure to complete the job based on the number of master plates used in the job and the number of substrates to be processed.

Description

Technical Field

[0001] The present invention relates to a lithographic apparatus, a method of manufacturing an article, an information processing apparatus, and a program.

Background Art

[0002] In an exposure apparatus, a process of performing exposure on a single substrate using a plurality of reticles can be executed. Consider a transfer process step of applying such a process to substrates for one lot. In this transfer process step, exposure is performed while sequentially replacing a plurality of reticles for each substrate that is sequentially input.

[0003] In order to improve throughput, it is necessary to optimize the input order of substrates and reticles in order to shorten the time required for the transfer process step (see, for example, Patent Document 1). For example, when performing transfer processing on three substrates using three reticles A, B, and C, usually the transfer processing is performed in the order of the reticles specified by the user, so the reticles are used in the order of A→B→C, A→B→C, A→B→C, ···. On the other hand, if the order is changed to A→B→C, C→B→A, A→B→C, ···, the number of reticle replacements is reduced (in this case, it is reduced by one) compared to normal times, and the time required for the transfer process can be shortened.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in a system configuration with only one master plate stage and one master plate pre-alignment stage, when using the third and subsequent master plates, it is necessary to transport the master plates from the master plate stocker to the master plate pre-alignment stage. This transport of master plates from the stocker to the pre-alignment stage takes a relatively long time. Therefore, even if the order in which the master plates are used is carefully considered, this transport can become a bottleneck, limiting the effect of improving throughput.

[0006] The present invention provides a technique advantageous for improving throughput in jobs that perform transfer processing using one or more master plates on one or more substrates. [Means for solving the problem]

[0007] According to one aspect of the present invention, a lithography apparatus is provided that is configured to perform a job of transferring a pattern onto one or more substrates having a plurality of shot areas using one or more master plates, the apparatus comprising a master plate stage and a controller that determines the fastest transfer procedure that can complete the job based on the number of master plates used in the job and the number of substrates to be processed. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a technology that is advantageous for improving throughput in jobs that perform transfer processing using one or more master plates on one or more substrates. [Brief explanation of the drawing]

[0009] [Figure 1] A diagram showing the configuration of an exposure apparatus. [Figure 2] A flowchart for determining the transfer processing method. [Figure 3] Flowchart of the batch transfer processing method. [Figure 4] A flowchart illustrating the split transfer process when the number of original plates used is even. [Figure 5]A flowchart illustrating the split transfer process when the number of original plates used is odd. [Figure 6] Flowchart of a single-transfer processing method. [Figure 7] Timing chart for each transfer method. [Figure 8] Timing chart for each transfer method. [Figure 9] Timing chart for each transfer method. [Figure 10] A diagram showing the formulas for calculating the transfer process time for each transfer processing method. [Figure 11] A diagram showing the controller configuration. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] This disclosure relates to a lithography apparatus configured to perform a job of transferring patterns onto one or more substrates having multiple shot areas using one or more master plates. The lithography apparatus may be, for example, an exposure apparatus, an imprint apparatus, etc. Below, in order to provide specific examples, an embodiment in which the lithography apparatus is an exposure apparatus will be described.

[0012] FIG. 1 is a schematic diagram of an exposure apparatus 100 according to an embodiment. In this specification and the drawings, directions are indicated in an XYZ coordinate system in which the horizontal plane is defined as the XY plane. Generally, a substrate W, which is an object to be exposed, is placed on a substrate stage WS such that its surface is parallel to the horizontal plane (XY plane). Therefore, hereinafter, directions orthogonal to each other within the plane along the surface of the substrate W are defined as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis. Further, hereinafter, directions parallel to the X-axis, the Y-axis, and the Z-axis in the XYZ coordinate system are referred to as the X-direction, the Y-direction, and the Z-direction, respectively, and the rotational directions around the X-axis, the Y-axis, and the Z-axis are referred to as the θX-direction, the θY-direction, and the θZ-direction, respectively.

[0013] The exposure apparatus 100 is a projection exposure apparatus that exposes (transfers) an image of a pattern formed on a reticle R (reticle, mask) onto a substrate W (wafer) in, for example, a step-and-scan method. The exposure apparatus 100 may be an exposure apparatus using a step-and-repeat method instead of the step-and-scan method.

[0014] The exposure apparatus 100 includes a transfer unit 50 that transfers a pattern (e.g., a circuit pattern) formed on the reticle R onto the substrate W by projecting and exposing the pattern onto the substrate W. The transfer unit 50 may include a reticle stage RS, an illumination optical system 20, a projection optical system 2, and a substrate stage WS. The reticle stage RS holds the reticle R and is driven at least in the Y-direction. The reticle R on the reticle stage RS is illuminated via the illumination optical system 20 by light emitted from, for example, an excimer laser light source. Thereby, the pattern of the reticle R is projected onto the substrate W by the projection optical system 2 at a predetermined magnification. The substrate W is held by a substrate stage WS having drive shafts extending at least in the X-direction and the Y-direction.

[0015] The exposure apparatus 100 includes a reticle transfer mechanism RM that transfers the reticle R and a substrate transfer mechanism WM that transfers the substrate W. The substrate transfer mechanism WM includes a first substrate transfer robot 109 and a second substrate transfer robot SH.

[0016] The first substrate transfer robot 109 transfers substrates between the substrate relay unit 23 and the substrate pre-alignment stage WPA using the robot hand 109a. The first substrate transfer robot 109 can be further configured to transfer substrates between the substrate relay unit 23 and the substrate stage WS. The substrate relay unit 23 is a buffer device that relays substrates between an application / development device (not shown) outside the exposure apparatus 100. The substrate pre-alignment stage WPA performs approximate alignment with respect to the translational direction (XY direction) and the rotational direction (θZ direction) of the substrate.

[0017] The second substrate transfer robot SH transfers substrates between the substrate stocker 114 (substrate storage unit), the substrate pre-alignment stage WPA, and the substrate stage WS using the robot hand SHa. The substrate stocker 114 can have a shelf-like structure capable of storing a plurality of substrates. The substrate stocker 114 may be a FOUP or a carrier that can be removed from the exposure apparatus 100.

[0018] The original plate transport mechanism RM may include an original plate transport robot 108 and a rotary hand 14. The original plate transport robot 108 transports original plates between an original plate pod (not shown), an original plate stocker 105 (original plate storage unit), and an original plate pre-alignment stage RPA. The original plate stocker 105 has a shelf-like structure to store multiple original plates. The original plate pre-alignment stage RPA roughly positions the original plates in terms of translation (XY direction) and rotation (θZ direction). Optionally, the original plate transport robot 108 may be configured to transport original plates to a foreign matter inspection device FI that inspects the surface of the original plates for foreign matter. In this case, the original plate transport robot 108 takes the original plate to be exposed next from the original plate stocker 105 and transports it to the foreign matter inspection device FI. After inspection by the foreign object inspection device FI is completed, the original plate transport robot 108 removes the original plate from the foreign object inspection device FI and places it on the original plate pre-alignment stage RPA. On the original plate pre-alignment stage RPA, the original plate is aligned in the translational direction (XY direction) and rotational direction (θZ direction) so that the deviation from the alignment reference (not shown) is less than or equal to a predetermined amount (pre-alignment). After pre-alignment is completed, the exposure device 100 enters exposure standby mode.

[0019] The rotating hand 14 constitutes part of the original plate transport mechanism for transporting the original plate R between the original plate stage RS and the original plate stocker 105 or the foreign object inspection device 12. When exposure of the original plate R, which has been transported to the exposure position on the original plate stage RS, is completed, the original plate stage RS moves to the handover position with the rotating hand 14 and hands over the exposed original plate R to the rotating hand 14. Meanwhile, the rotating hand 14 receives the original plate that was placed on the original plate pre-alignment stage RPA and was in the exposure waiting state. At this time, both the exposed original plate R and the original plate that was waiting for exposure are placed on the rotating hand 14. In this state, the rotating hand 14 rotates and hands over the exposed original plate R to the original plate pre-alignment stage RPA and the original plate that was waiting for exposure to the original plate stage RS. Hereafter, this process will also be referred to as "original plate exchange".

[0020] Once exposure is complete, the original plate R is handed over to the original plate transport robot 108. If it is to be used for exposure again later, it is transported to the original plate stocker 105 for temporary storage. If the original plate R is not to be used for exposure again, it may be stored in an original plate pod (not shown).

[0021] The exposure apparatus 100 is equipped with a controller CNT that controls the operation of each part of the apparatus. The controller CNT is composed of, for example, a general-purpose or dedicated computer (information processing device) with a program built into it, and comprehensively controls each part of the apparatus according to the program. The controller CNT can function as an information processing device that creates a transfer processing schedule for a job. Figure 11 shows an example of the configuration of the controller CNT. The controller CNT may include, for example, a CPU 51 which is a central processing unit, a ROM 52 which holds a boot program and fixed data, and a RAM 53 which is a primary storage device that provides the work area of ​​the CPU 51 and holds temporary data. The controller CNT may also include a storage unit 54 which is a secondary storage device that can be composed of an HDD, SSD, etc. The storage unit 54 may store the OS 541, transfer information 542 which includes setting information for the exposure processing (transfer processing), a control program 543 for performing the transfer processing, etc. Furthermore, the controller CNT is connected to an input device 55 such as a keyboard or mouse that can be operated by the user, and a display device 56 which displays various information and a GUI. The user can perform operations to submit an exposure job via the GUI provided by the display device 56 or using the input device 55.

[0022] Furthermore, the functions of the controller CNT may be implemented by dedicated hardware rather than by the execution of software (programs). For example, the functions of the controller CNT can be implemented by a PLD such as an FPGA, or by an ASIC. Alternatively, the functions of the controller CNT may be implemented by a server computer or the like connected to the exposure apparatus 100 via a network or the like.

[0023] In this embodiment, the exposure apparatus 100 is configured to perform a job (exposure job) in which a pattern is transferred to one or more substrates having multiple shot areas to which the pattern is to be transferred using one or more master plates. The controller CNT can perform a process to determine the fastest possible transfer procedure to complete the exposure job based on the transfer information 542, which includes specifying the number of master plates and the number of substrates. The transfer information 542 may include, for example, the following information as information about the apparatus used in the submitted exposure job. • Number of original plates used (number of original plates used) • Time required for exchanging the master plate between the master plate pre-alignment stage RPA and the master plate stage RS using the rotary hand 14 (master plate exchange time), • The time required to transport the original plate from the original plate stocker 105 to the original plate pre-alignment stage RPA (original plate transport time), • Number of circuit boards used (number of circuit boards to be processed) • The time from when the substrate is brought in from the external coating / developing equipment until it is loaded onto the second substrate transport robot SH (first substrate transport time), • The time it takes for a circuit board to be loaded from the circuit board stocker 114 onto the second circuit board transport robot SH (second circuit board transport time).

[0024] The transfer information 542 may further include information about the marks to be used, whether or not a foreign object inspection is performed on the original plate to be used, the foreign object inspection time, the number of shot areas to be exposed, the alignment processing time, the calibration time, etc., which may affect the transfer processing step.

[0025] Furthermore, the control program 543 may include a program for executing multiple transfer processing methods in which the processing order of multiple shot areas on the substrate differs from that of the substrate, or a program for executing various transfer processing methods as described later. One of the multiple transfer processing methods may be selected based on the number of master plates used in a single transfer processing after substrate mounting, the number of transports to the substrate stocker 114, the substrate transport path, etc.

[0026] Figure 2 is a flowchart of the process for determining the transfer processing method to be used. Figure 10 shows the number of times the original plate and substrate are transported in each part of each of the multiple transfer processing methods (multiple transfer procedures), and the formula for calculating the time required for the transfer processing step derived based on these. In Figure 10, the possible transfer processing methods to be selected are a single transfer processing method, a divided transfer processing method, and a batch transfer processing method. The details of each of these transfer processing methods will be described later.

[0027] The following transfer information is used in the formula for calculating the time required for the transfer process shown in Figure 10. • Original plate exchange time RT1: The time required to exchange the original plate between the original plate pre-alignment stage RPA and the original plate stage RS using the rotary hand 14. • Original plate transport time RT2: The time required to transport the original plate from the original plate stocker 105 to the original plate pre-alignment stage RPA. • First substrate transport time WT1: The time from when the substrate is brought in from the external coating / developing equipment until it is loaded onto the second substrate transport robot SH. • Second board transfer time WT2: The time from when the board is taken from the board stocker 114 until it is loaded onto the second board transfer robot SH. • Number of original plates used: RC, • Number of circuit boards used: WC.

[0028] When a job is submitted, in S201, the controller CNT acquires the transfer information to be used in the job. In S202, the controller CNT checks the number of substrates to be used WC and the number of master plates to be used RC. If the number of substrates to be used WC is 1 or the number of master plates to be used RC is 1, the batch transfer processing method (described later) is the process that can shorten the transfer processing time, so in S205, the controller CNT decides to use the batch transfer processing method (S205). If the number of substrates to be used WC is 2 or more and the number of master plates to be used RC is 2 or more, the process proceeds to S203. In S203, the controller CNT applies the transfer information acquired in S201 to the calculation formula for each transfer processing method shown in Figure 10 to calculate the transfer processing time for each transfer processing method. As shown in Figure 10, the calculation formula differs depending on whether the number of original plates used is even or odd. Therefore, the controller CNT determines whether the number of substrates used WC is even or odd, and decides which calculation formula to apply accordingly. The calculation formulas for each transfer processing method in Figure 10 may be set individually for each number of original plates used to perform the transfer processing. In addition, for calculation purposes, the specification of whether or not to perform foreign object inspection on the original plates used in the job, the arrangement information of the original plates used, and each processing time included in the transfer information may be changed based on past transport times, job processing conditions, and conditions under which parallel processing is possible. This can improve the accuracy of calculating the transfer processing time.

[0029] In S204, the controller CNT determines the transfer processing method to be used, which has the shortest transfer processing time, based on the calculation results in S203.

[0030] The number of substrates used WC, obtained in S201 in Figure 2, can be selected for all or some of the multiple substrates present in the coating / developing apparatus. This allows specifying the number of substrates to be used when there is a limit to the number of substrates that can be removed from the coating / developing apparatus, or depending on the number of substrates that can be stored in the substrate stocker 114. For example, if there are 25 substrates in the coating / developing apparatus, the number of substrates used WC may be set to 15. In that case, the controller CNT calculates the transfer process time for each transfer process method with WC=15 according to the flowchart in Figure 2 and determines which transfer process method to use. Subsequently, for the remaining 10 of the 25 substrates in the coating / developing apparatus, the controller CNT calculates the transfer process time for each transfer process method with WC=15 according to the flowchart in Figure 2 and determines which transfer process method to use.

[0031] The following are specific examples of the process for determining the transfer method.

[0032] (Example 1) Consider the case where the following transcription information is given in S201. ·Original plate exchange time RT1=10 seconds, • Original plate transport time RT2 = 30 seconds, • First board transport time WT1 = 5 seconds, • Second substrate transport time WT2 = 30 seconds, • Number of original plates used: RC = 4 • Number of circuit boards used: WC = 25 Applying the above transfer information to the calculation formulas for each transfer processing method shown in Figure 10 (S203), the calculation results are 2910 seconds for the single transfer processing method, 1640 seconds for the split transfer processing method, and 2445 seconds for the batch transfer processing method. The controller CNT determines that the split transfer processing method, which has the shortest transfer processing time, is the transfer processing method to be used (S204).

[0033] (Example 2) Consider the case where the following transcription information is given in S201. ·Original plate exchange time RT1=20 seconds, • Original plate transport time RT2 = 30 seconds, • First board transport time WT1 = 5 seconds, • Second board transport time WT2 = 10 seconds, • Number of original plates used: RC = 4 • Number of circuit boards used: WC = 25 Applying the above transfer information to the calculation formulas for each transfer processing method shown in Figure 10 (S203), the calculation results are derived as follows: single transfer processing method: 1450 seconds, divided transfer processing method: 1660 seconds, and batch transfer processing method: 3205 seconds. The controller CNT determines the single transfer processing method, which has the shortest transfer processing time, as the transfer processing method to be used (S204).

[0034] The following describes specific examples of multiple transfer processing methods. In this embodiment, the multiple transfer processing methods may include a batch transfer processing method, a divided transfer processing method, and a single transfer method, as shown in Figure 10.

[0035] (Batch transfer processing method) The batch transfer processing method (first step) is a method in which, for each substrate used, a pattern transfer is performed on multiple shot areas while sequentially replacing all the master plates used on a single substrate without changing the substrate midway through the process. Figure 3 is a flowchart of the batch transfer processing method. In the batch transfer processing method, the following repeated processing is performed each time a single substrate is transported to the substrate stage WS (S301~S308). The condition for the termination of this repeated processing is when the number of substrate transport processes reaches the number of substrates used WC.

[0036] In S302, the controller CNT controls the second substrate transport robot SH to transport the substrate to the substrate stage WS.

[0037] Next, the following repetitive process is performed for each master plate transport process in which one master plate is transported to the master plate stage RS (S303~S306). The termination condition for this repetitive process is when the number of master plate transport processes reaches the number of master plates used RC.

[0038] In S304, the controller CNT controls the original plate transport robot 108 to transport the original plate to be used from the original plate stocker 105 to the original plate pre-alignment stage RPA. If the option for foreign object inspection is selected, the original plate is transported to the foreign object inspection device FI, and then to the original plate pre-alignment stage RPA. After pre-alignment is performed at the original plate pre-alignment stage RPA, the original plate is transported to the original plate stage RS via the rotary hand 14. At this time, if there is an original plate on the original plate stage RS that has completed exposure, the original plate is replaced, and the original plate that has completed exposure is stored in the original plate stocker 105 by the original plate transport robot 108. If there is an original plate to be used next, the controller CNT controls the original plate transport robot 108 to take the original plate from the original plate stocker 105 and transport it to the original plate pre-alignment stage RPA. If the option for foreign object inspection is selected, the original plate is transported to the foreign object inspection device FI, and then to the original plate pre-alignment stage RPA. Once pre-alignment is performed on the master plate pre-alignment stage (RPA), the system enters exposure standby mode.

[0039] In step S305, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0040] In S306, the controller CNT determines whether the transfer process has been completed using all the master plates. If there are still unprocessed master plates remaining, the process returns to S304, and the transfer process is carried out using new master plates. After the transfer process using all the master plates is completed for one substrate, in S307, the controller CNT unloads the substrate. That is, the controller CNT transports the substrate to the substrate transfer unit 23 in order to hand it over to the coating / developing machine.

[0041] In S308, the controller CNT determines whether the transfer process has been completed for all substrates. If there are still unprocessed substrates remaining, the process returns to S302, and the transfer process is performed on new substrates.

[0042] In the batch transfer processing method, the more original plates (RC) or substrates (WC) used, the more times the original plates are removed from the original plate stocker 105 and the more times the original plates are replaced, thus increasing the transfer processing time. On the other hand, when only one original plate (RC) or one substrate (WC) is used, the transfer processing time is shorter compared to the divided transfer processing method and the single transfer processing method. Furthermore, the batch transfer processing method is characterized by not removing substrates from the substrate stocker 114. In other words, the substrate stocker 114 is not used in the batch transfer processing method. Therefore, the longer the time required to transport the substrates from the substrate stocker 114, the shorter the transfer processing time becomes compared to the divided transfer processing method and the single transfer processing method.

[0043] (Partial transfer processing method) The divided transfer processing method (second step) is a method in which multiple master plates are divided into multiple sets, and the substrate to be transferred (the substrate held by the substrate stage WS) is replaced in units of master plate sets. Specifically, pattern transfer is performed on a portion of the multiple shot areas of the first substrate using the first set of master plates, and the first substrate is temporarily stored in the substrate stocker 114. Then, pattern transfer using the first set of master plates and storage of the substrates in the substrate stocker 114 are repeatedly performed on a portion of the multiple shot areas of each substrate from the second substrate onward. Next, the first substrate is taken out of the substrate stocker 114 and transported to the substrate stage WS, where pattern transfer using the second set of master plates is performed on the other shot areas of the first substrate, and the first substrate is stored in the substrate stocker 114 (or removed from the machine). Then, pattern transfer using the second set of master plates and storage of the substrates in the substrate stocker 114 (or removed from the machine) are repeatedly performed on the other shot areas of the second substrate onward.

[0044] For example, if there are 4 master plates (RC), the master plates are divided into two sets of two. Pattern transfer is performed on the first substrate using the first set of master plates, and the first substrate is stored in the substrate stocker 114. Next, pattern transfer is performed on the second substrate using the second set of master plates, and the second substrate is stored in the substrate stocker 114. After that, the first substrate is taken out of the substrate stocker 114 and transported to the substrate stage WS, where pattern transfer is performed on the first substrate using the second set of master plates, and the first substrate is stored in the substrate stocker 114 (or removed from the machine). After that, the second substrate is taken out of the substrate stocker 114 and transported to the substrate stage WS, where pattern transfer is performed on the second substrate using the second set of master plates, and the second substrate is stored in the substrate stocker 114 (or removed from the machine).

[0045] Figure 4 is a flowchart of the split transfer processing method when the number of master plates used is even. In the split transfer processing method, the following repetitive processing is performed for each master plate transport process in which one master plate is transported to the master plate stage RS (S401~S412). When the number of master plates used is even, the termination condition for the repetitive processing is when the number of master plate transport processes reaches the number of master plates used RC / 2. Note that this " / 2" is the value when there is one master plate pre-alignment stage RPA.

[0046] In S402, the original plates are transported to the original plate stage RS and the original plate pre-alignment stage RPA. Specifically, the controller CNT controls the original plate transport robot 108 to retrieve the original plates from the original plate stocker 105 and transport them to the original plate pre-alignment stage RPA. If the option for foreign object inspection is selected, the original plates are transported to the foreign object inspection device FI, and then to the original plate pre-alignment stage RPA. After pre-alignment is performed at the original plate pre-alignment stage RPA, the original plates are transported to the original plate stage RS via the rotary hand 14. At this time, if there are original plates on the original plate stage RS that have completed exposure, the original plates are replaced, and the original plates that have completed exposure are stored in the original plate stocker 105 by the original plate transport robot 108. Next, the controller CNT controls the original plate transport robot 108 to retrieve the original plates from the original plate stocker 105 and transport them to the original plate pre-alignment stage RPA. If the option for foreign object inspection is selected, the original plate is transported to the foreign object inspection device FI, and then to the original plate pre-alignment stage RPA. Once pre-alignment is performed on the original plate pre-alignment stage RPA, the system enters exposure standby mode. This completes the transport of the original plate to the original plate stage RS and the original plate pre-alignment stage RPA.

[0047] Next, for each board transport process in which one board is transported to the board stage WS, the following repetitive process is performed (S403~S411). The termination condition for this repetitive process is when the number of board transport processes reaches the number of boards used WC.

[0048] In S404, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrate to the substrate stage WS.

[0049] In step S405, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0050] In S406, the controller CNT controls the rotary hand 14 and the master plate stage RS to perform a master plate exchange. This transports the master plate from the master plate pre-alignment stage RPA to the master plate stage RS. After exposure (transfer) is complete, the master plate that has been transported from the master plate stage RS to the master plate pre-alignment stage RPA by the master plate exchange is stored in the master plate stocker 105 by the master plate transport robot 108.

[0051] In S407, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0052] In S408, the controller CNT checks whether processing has been completed up to the last master plate. If processing has not been completed up to the last master plate, in S409, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrates on the substrate stage WS to the substrate stocker 114. On the other hand, if processing has been completed up to the last master plate, in S410, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrates on the substrate stage WS to the substrate transfer unit 23 to be transferred to the coating / developing device.

[0053] In the processing loop from S403 to S411 described above, a pattern transfer using the first set of master plates is first performed on the first substrate. At this time, in S404, the first substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the subsequent processing from S403 to S411, a pattern transfer using the first set of master plates is performed on the second substrate. At this time, in S404, the second substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, pattern transfer using the first set of master plates is performed on all substrates, and each substrate is stored in the substrate stocker 114.

[0054] Next, in S402, the master plates used are replaced from the first set of master plates to the second set of master plates. Then, in the processes of S403 to S411, pattern transfer is performed on the first substrate using the second set of master plates. At this time, in S404, the first substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the processes that follow, S403 to S411, pattern transfer is performed on the second substrate using the second set of master plates. At this time, in S404, the second substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, pattern transfer using the second set of master plates is performed on all substrates. If the second set of master plates is the last set of master plates, each substrate is transported to the coating / developing apparatus via the substrate relay unit 23 (S410).

[0055] In the segmented transfer processing method when the number of original plates used is even, the number of repetitions for each original plate transport process is RC / 2 times, so the number of times the original plates are transported from the original plate stocker 105 is reduced compared to the single transfer processing method and the batch transfer processing method. Therefore, the longer the time required for transporting the original plates, the shorter the transfer processing time becomes compared to the single transfer processing method and the batch transfer processing method.

[0056] Figure 5 shows an example flowchart of the split transfer processing method when the number of master plates used is odd. In the split transfer processing method, the following repetitive processing is performed for each master plate transport process in which one master plate is transported to the master plate stage RS (S501~S514). When the number of master plates used is odd, the termination condition for the repetitive processing is when the number of master plate transport processes reaches (number of master plates used RC + 1) / 2. Note that this " / 2" is the value when there is one master plate pre-alignment stage RPA.

[0057] In S502, the controller CNT checks whether the original to be processed is the last original.

[0058] If the original plate to be processed is not the last original plate, in S503, the original plate is transported to the original plate stage RS and the original plate pre-alignment stage RPA. Specifically, the controller CNT controls the original plate transport robot 108 to take the original plate from the original plate stocker 105 and transport it to the original plate pre-alignment stage RPA (via the foreign object inspection device FI if the foreign object inspection option is selected). After pre-alignment is performed at the original plate pre-alignment stage RPA, the original plate is transported to the original plate stage RS via the rotary hand 14. At this time, if there is an original plate on the original plate stage RS that has completed exposure, the original plate is replaced, and the original plate that has completed exposure is stored in the original plate stocker 105 by the original plate transport robot 108. Next, the controller CNT controls the original plate transport robot 108 to take the original plate from the original plate stocker 105 and transport it to the original plate pre-alignment stage RPA (via the foreign object inspection device FI if the foreign object inspection option is selected). Once pre-alignment is performed at the original plate pre-alignment stage RPA, the system enters exposure standby mode. This completes the transfer of the original plate to the original plate stage RS and the original plate pre-alignment stage RPA.

[0059] If the original plate to be processed is the last original plate, in S504, the controller CNT transports the original plate, which was in exposure waiting state on the original plate pre-alignment stage RPA, to the original plate stage RS via the rotary hand 14. Here, since the original plate that was in exposure waiting state on the original plate pre-alignment stage RPA is the last original plate, there is no need to remove the original plate from the original plate stocker 105.

[0060] Next, for each board transport process in which one board is transported to the board stage WS, the following repetitive process is performed (S505~S513). The termination condition for this repetitive process is when the number of board transport processes reaches the number of boards used WC.

[0061] In S506, the controller CNT controls the second substrate transport robot SH to transport the substrate to the substrate stage WS.

[0062] In S507, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0063] In S508, the controller CNT checks whether processing has been completed up to the last master plate. If processing has been completed up to the last master plate, in S512, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrate on the substrate stage WS to the substrate transfer unit 23 for transfer to the coating / developing device. On the other hand, if processing has not been completed up to the last master plate, the process proceeds to S509.

[0064] In S509, the controller CNT controls the rotary hand 14 and the master plate stage RS to perform master plate exchange. This transports the master plate from the master plate pre-alignment stage RPA onto the master plate stage RS.

[0065] In S510, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0066] In step S511, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrates on the substrate stage WS to the substrate stocker 114.

[0067] In the processing loop from S505 to S513 described above, a pattern transfer using the first set of masters is first performed on the first substrate. At this time, in S506, the first substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the subsequent processing from S505 to S513, a pattern transfer using the first set of masters is performed on the second substrate. At this time, in S506, the second substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, pattern transfer using the first set of masters is performed on all substrates, and each substrate is stored in the substrate stocker 114.

[0068] In the next steps, S503 or S504, the master plates used are replaced from the first set of master plates to the second set of master plates. Then, in steps S505 to S513, the pattern is transferred to the first substrate using the second set of master plates. At this time, in S506, the first substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the next steps, S505 to S513, the pattern is transferred to the second substrate using the second set of master plates. At this time, in S506, the second substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, pattern transfer using the second set of master plates is performed on all substrates. If the second set of master plates is the last set of master plates, each substrate is transported to the coating / developing apparatus via the substrate relay unit 23 (S512).

[0069] In the segmented transfer processing method when the number of original plates used is odd, the number of repetitions for each original plate transport process is (number of original plates used RC + 1) / 2 times. Therefore, the number of times the original plates are transported from the original plate stocker 105 is reduced compared to the single transfer processing method and the batch transfer processing method. Consequently, the longer the time required for transporting the original plates, the shorter the transfer processing time becomes compared to the single transfer processing method and the batch transfer processing method.

[0070] Note that the " / 2" used in the termination conditions for the repetitive process in S401 in Figure 4 and S501 in Figure 5 is the value when there is one master plate pre-alignment stage RPA, as described above. This value varies depending on the number of master plates that can be held around the master plate stage RS. For example, if there are three master plate pre-alignment stage RPAs, the number of master plates that can be held by the master plate stage RS and the three master plate pre-alignment stage RPAs is four, so the value becomes " / 4". If there are two master plate pre-alignment stage RPAs, the number of master plates that can be held by the master plate stage RS and the two master plate pre-alignment stage RPAs is three, so the value becomes " / 3". Similarly, the formulas for calculating the number of each process and the transfer process time in the divided transfer processing method in Figure 10 also vary depending on the number of master plates that can be held around the master plate stage RS.

[0071] (Single transcription method) The single transfer processing method (third step) is a method in which, for each master plate used, a pattern transfer is performed on a portion of multiple shot areas while sequentially replacing all the substrates used without changing the master plate in between, and this process is repeated for each master plate used.

[0072] Figure 6 is a flowchart of the single-transfer processing method. In the single-transfer processing method, the following repetitive processing is performed for each original plate transport process in which one original plate is transported to the original plate stage RS (S601~S610). The termination condition for this repetitive processing is when the number of original plate transport processes reaches the number of original plates used RC.

[0073] In S602, the original plate is transported to the original plate stage RS. Specifically, the controller CNT controls the original plate transport robot 108 to retrieve the original plate from the original plate stocker 105 and transport it to the original plate pre-alignment stage RPA (via the foreign object inspection device FI if the foreign object inspection option is selected). After pre-alignment is performed at the original plate pre-alignment stage RPA, the original plate is transported to the original plate stage RS via the rotary hand 14. At this time, if there is an original plate on the original plate stage RS that has completed exposure, the original plate is replaced, and the original plate that has completed exposure is stored in the original plate stocker 105 by the original plate transport robot 108. Next, the controller CNT controls the original plate transport robot 108 to retrieve the original plate from the original plate stocker 105 and transport it to the original plate pre-alignment stage RPA (via the foreign object inspection device FI if the foreign object inspection option is selected). Once pre-alignment is performed at the original plate pre-alignment stage RPA, the system enters an exposure standby state. With the above steps completed, the transfer of the original plates to the original plate stage RS and the original plate pre-alignment stage RPA is finished.

[0074] Next, for each board transport process in which one board is transported to the board stage WS, the following repetitive process is performed (S603~S609). The termination condition for this repetitive process is when the number of board transport processes reaches the number of boards used WC.

[0075] In S604, the controller CNT controls the second substrate transport robot SH to transport the substrate to the substrate stage WS.

[0076] In step S605, the controller CNT controls the transfer unit 50 to transfer the pattern of the master plate on the master plate stage RS to the substrate on the substrate stage WS.

[0077] In S606, the controller CNT checks whether processing has been completed up to the last master plate. If processing has not been completed up to the last master plate, in S607, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrates on the substrate stage WS to the substrate stocker 114. On the other hand, if processing has been completed up to the last master plate, in S608, the controller CNT controls the first substrate transport robot 109 and the second substrate transport robot SH to transport the substrates on the substrate stage WS to the substrate transfer unit 23 to be transferred to the coating / developing device.

[0078] In the processing loop from S603 to S609 described above, a transfer process using the first master plate is first performed on the first substrate. At this time, in S604, the first substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the subsequent processing from S603 to S609, a transfer process using the first master plate is performed on the second substrate. At this time, in S404, the second substrate is transported from the substrate relay unit 23 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, a transfer process using the first master plate is performed on all substrates, and each substrate is stored in the substrate stocker 114.

[0079] Next, in S602, the master plate used is changed from the first master plate to the second master plate. Then, in the processes of S603 to S609, a transfer process using the second master plate is performed on the first substrate. At this time, in S604, the first substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In the processes that follow, S603 to S609, a transfer process using the second set of master plates is performed on the second substrate. At this time, in S604, the second substrate is transported from the substrate stocker 114 to the substrate stage WS by the first substrate transport robot 109 and the second substrate transport robot SH. In this way, a transfer process using the second master plate is performed on all substrates. If the second master plate is the last master plate, each substrate is transported to the coating / developing apparatus via the substrate relay unit 23 (S608).

[0080] In the single-transfer processing method, the number of times the original plate is exchanged between the original plate pre-alignment stage RPA and the original plate stage RS can be reduced compared to other methods. On the other hand, in the single-transfer processing method, the number of times the substrate is transported from the substrate stocker 114 is increased, but the shorter the time it takes to transport the substrate from the substrate stocker 114, the shorter the transfer processing time will be compared to the batch transfer processing method and the divided transfer processing method.

[0081] (Time reduction effect in each transfer method) Figure 7 shows the timing charts for each transfer processing method. Here, two substrates are used, and four master plates are used. In Figure 7, (a) is the timing chart for the batch transfer processing method, (b) is for the divided transfer processing method, and (c) is for the single transfer processing method. The horizontal axis represents time. The meaning of each symbol in the figure is as follows: • RT1: Time required for exchanging original plates between the original plate pre-alignment stage RPA and the original plate stage RS. • RT2: Time required for transporting the original plate from the original plate stocker 105 to the original plate pre-alignment stage RPA. • WT1: Time required for substrate transfer from coating / developing equipment (C / D) to the second substrate transfer robot SH. WT2: Time required to transfer a circuit board from the circuit board stocker 114 to the second circuit board transfer robot SH.

[0082] Figure 7 shows that the batch transfer method has the shortest transfer process time.

[0083] Figure 8 shows a timing chart for a transfer process performed under the same transfer conditions as in Figure 7, but with a longer RT2 time required for transporting the original plate from the original plate stocker 105 to the original plate pre-alignment stage RPA. Figure 8 shows that the transfer process time is shortest with the segmented transfer method. In other words, as the time required for transporting the original plate from the original plate stocker 105 to the original plate pre-alignment stage RPA increases, the segmented transfer method becomes advantageous in terms of transfer process time.

[0084] Figure 9 shows a timing chart for a transfer process performed under the same transfer conditions as in Figures 7 and 8, but with a longer time RT1 required for exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS. Figure 9 shows that the transfer process time is shortest with the single transfer method. In other words, as the time RT1 required for exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS increases, the single transfer method becomes advantageous in terms of transfer process time.

[0085] In each transfer processing method, the process of transporting the substrate from the coating / developing device to the second substrate transport robot SH may be executed in parallel with the process of exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS. Furthermore, the process of transporting the substrate from the coating / developing device to the second substrate transport robot SH may be executed in parallel with the process of transporting the original plate from the original plate stocker 105 to the original plate stage RS. In this case, the formula for calculating the transfer processing time is derived by considering the process of exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS.

[0086] Furthermore, the process of transporting the substrate from the substrate stocker 114 to the second substrate transport robot SH may be executed in parallel with the process of exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS. Also, the process of transporting the substrate from the substrate stocker 114 to the second substrate transport robot SH may be executed in parallel with the process of transporting the original plate from the original plate stocker 105 to the original plate stage RS. In that case, the formula for calculating the transfer process time is derived by taking into account the process of exchanging the original plate between the original plate pre-alignment stage RPA and the original plate stage RS.

[0087] According to the various embodiments described above, the productivity of an exposure apparatus that performs exposure processing (transfer processing) on ​​each substrate using multiple master plates can be improved.

[0088] <Embodiment of Article Manufacturing Method> The article manufacturing method in this embodiment is suitable for manufacturing articles such as microdevices, semiconductor devices, and elements having microstructures. The article manufacturing method of this embodiment includes a transfer step of transferring a pattern from a master plate onto a substrate using the above-mentioned lithography apparatus (exposure apparatus, imprint apparatus, etc.), and a processing step of processing the substrate onto which the pattern has been transferred in the transfer step. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0089] <Other Embodiments> The present invention can also be realized by supplying a program that implements one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and by a process in which one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0090] The disclosures herein include at least the following technologies: (Item 1) A lithography apparatus configured to perform a job of transferring patterns onto one or more substrates having multiple shot areas using one or more master plates, Original stage and The system includes a controller that determines the fastest transfer procedure to complete the job based on the number of master plates used and the number of substrates to be processed in the job. A lithography apparatus characterized by the following features. (Item 2) The aforementioned controller, The processing time for the job is calculated when each of the multiple transfer procedures is applied. Among the multiple transfer procedures, select the transfer procedure that has the shortest calculated processing time. A lithography apparatus as described in item 1, characterized by the features described herein. (Item 3) A plate transport mechanism for transporting the original plate, A substrate transport mechanism for transporting substrates, and a component thereof. The controller determines the fastest transfer procedure that can complete the job, based on the time required for the master plate to be transported by the master plate transport mechanism and the time required for the substrate to be transported by the substrate transport mechanism. A lithography apparatus as described in item 2, characterized by the features described herein. (Item 4) A master plate storage unit for storing multiple master plates, It further includes a master plate pre-alignment stage for performing pre-alignment of the master plate, The original plate transport mechanism is configured to transport the original plate between the original plate storage unit, the original plate pre-alignment stage, and the original plate stage. A circuit board storage section for storing multiple circuit boards, A board pre-alignment stage for performing board pre-alignment, A substrate stage that holds the substrate that has been pre-aligned in the substrate pre-alignment stage for pattern transfer, The substrate transport mechanism is configured to transport substrates between the outside, the substrate storage section, the substrate pre-alignment stage, and the substrate stage. A lithography apparatus as described in item 3, characterized by the features described herein. (Item 5) The aforementioned original plate transport mechanism is A master plate transport robot transports the master plate between the master plate storage unit and the master plate pre-alignment stage, Includes a rotary hand that rotates to exchange the master plate on the master plate pre-alignment stage with the master plate on the master plate stage, The substrate transport mechanism is A first substrate transport robot that transports a substrate between the outside, the substrate pre-alignment stage, and the substrate stage, The system includes the substrate storage unit, the substrate pre-alignment stage, and a second substrate transport robot that transports the substrate between the substrate and the substrate stage, The aforementioned controller, The time required for exchanging the master plate between the master plate stage and the master plate pre-alignment stage using the aforementioned rotating hand, The time required for the original plate to be transported from the original plate storage unit to the original plate pre-alignment stage by the original plate transport robot, The time from when the circuit board is brought in from the outside until it is loaded onto the second circuit board transport robot, Based on the time it takes for the substrate to be loaded from the substrate storage unit onto the second substrate transport robot, the fastest transfer procedure that can complete the job is determined. A lithography apparatus as described in item 4, characterized by the features described herein. (Item 6) The lithography apparatus according to item 4 or 5, characterized in that the plurality of transfer procedures include a first procedure in which the pattern transfer is performed on the plurality of shot areas while sequentially replacing all of the master plates used without changing the substrate midway, and this is repeated for each of the substrates to be processed. (Item 7) The lithography apparatus according to item 6, characterized in that the controller determines the first step as the transfer step that can complete the job in the fastest possible time when there is one substrate to be processed or one master plate to be used. (Item 8) The aforementioned multiple transfer procedures further include a second procedure in which the multiple master plates to be used are divided into multiple sets, and the substrates held by the substrate stage are replaced on a set-by-set basis of the master plates. The second step is, The process involves performing the pattern transfer on a portion of the plurality of shot regions of the first substrate using a first set of master plates, and then storing the first substrate in the substrate storage unit. The process involves repeatedly performing the pattern transfer using the first set of master plates to a portion of the shot area of ​​each substrate from the second substrate onward, and storing the substrate in the substrate storage section. The process involves performing the pattern transfer on other shot areas of the first substrate removed from the substrate storage unit using the second set of master plates, and then storing the first substrate in the substrate storage unit or transporting it to the outside. The process involves repeatedly performing the pattern transfer using the second set of master plates on the other shot areas of each of the second and subsequent substrates removed from the substrate storage unit, and then storing the substrate in the substrate storage unit or transporting it to the outside. A lithography apparatus according to item 6 or 7, characterized by including the following: (Item 9) The lithography apparatus according to any one of items 6 to 8, characterized in that the plurality of transfer procedures further include a third procedure in which the pattern transfer is performed on a portion of the plurality of shot areas while sequentially replacing all of the substrates to be processed without changing the master plate in between, and this is repeated for each of the master plates used. (Item 10) The lithography apparatus according to item 5, characterized in that the process of transporting a substrate brought in from an external source to the second substrate transport robot and the process of exchanging the original plate between the original plate stage and the original plate pre-alignment stage using the rotating hand are performed in parallel. (Item 11) The lithography apparatus according to item 5, characterized in that the process of transporting a substrate from the substrate storage unit to the second substrate transport robot and the process of exchanging the original plate between the original plate stage and the original plate pre-alignment stage using the rotating hand are performed in parallel. (Item 12) The lithography apparatus according to item 5, characterized in that the process of transporting a substrate from the substrate storage unit to the second substrate transport robot and the process of transporting a master plate from the master plate storage unit to the master plate stage are executed in parallel. (Item 13) The lithography apparatus according to any one of items 1 to 12, characterized in that the controller determines the transfer procedure that can complete the job in the fastest possible time, based on the specification of whether or not to perform foreign matter inspection of the original plate by a foreign matter inspection device. (Item 14) The lithography apparatus according to any one of items 1 to 13, characterized in that the lithography apparatus is an exposure apparatus that projects the pattern of the master plate onto the substrate via a projection optical system to transfer the pattern onto the substrate. (Item 15) A transfer process in which a pattern is transferred to a substrate using a lithography apparatus described in any one of items 1 to 14, A processing step for processing the substrate onto which the aforementioned pattern has been transferred, It has, A method for manufacturing an article, characterized by manufacturing an article from the processed substrate. (Item 16) An information processing device for creating a transfer processing schedule for a lithography apparatus configured to perform a job of transferring a pattern onto one or more substrates having multiple shot areas using one or more master plates, The system includes a processor that determines the fastest transfer procedure to complete the job based on the number of master plates used and the number of substrates to be processed. An information processing device characterized by the following: (Item 17) A lithography apparatus configured to perform a job of transferring patterns onto one or more substrates having multiple shot areas using one or more master plates, wherein the processor in the information processing device that creates the transfer processing schedule for the job, A process to determine the fastest transfer procedure that can complete the job, based on the number of master plates used and the number of substrates to be processed. A program characterized by causing the execution of a specific action.

[0091] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0092] 100: Exposure unit, CNT: Controller, R: Master plate, RS: Master plate stage, W: Substrate, RS: Master plate stage, RM: Master plate transport mechanism, WM: Substrate transport mechanism, 20: Illumination optical system, 2: Projection optical system, 50: Transfer unit, 105: Master plate stocker, 114: Substrate stocker

Claims

1. A lithography apparatus configured to perform a job of transferring patterns onto one or more substrates having multiple shot areas using one or more master plates, Original stage and A controller that determines the fastest transfer procedure to complete the job based on the number of master plates used in the job and the number of substrates to be processed, A lithography apparatus characterized by comprising the following:

2. The aforementioned controller, The processing time for the job is calculated when each of the multiple transfer procedures is applied. Among the multiple transfer procedures, select the transfer procedure that has the shortest calculated processing time. The lithography apparatus according to feature 1.

3. A plate transport mechanism for transporting the original plate, A substrate transport mechanism for transporting substrates, and a component thereof. The controller determines the fastest transfer procedure that can complete the job, based on the time required for the master plate to be transported by the master plate transport mechanism and the time required for the substrate to be transported by the substrate transport mechanism. The lithography apparatus according to feature 2.

4. A master plate storage unit for storing multiple master plates, It further includes a master plate pre-alignment stage for performing pre-alignment of the master plate, The original plate transport mechanism is configured to transport the original plate between the original plate storage unit, the original plate pre-alignment stage, and the original plate stage. A circuit board storage section for storing multiple circuit boards, A board pre-alignment stage for performing board pre-alignment, A substrate stage that holds the substrate that has been pre-aligned in the substrate pre-alignment stage for pattern transfer, The substrate transport mechanism is configured to transport substrates between the outside, the substrate storage section, the substrate pre-alignment stage, and the substrate stage. The lithography apparatus according to feature 3.

5. The aforementioned original plate transport mechanism is A master plate transport robot transports the master plate between the master plate storage unit and the master plate pre-alignment stage, Includes a rotary hand that rotates to exchange the master plate on the master plate pre-alignment stage with the master plate on the master plate stage, The substrate transport mechanism is A first substrate transport robot that transports a substrate between the outside, the substrate pre-alignment stage, and the substrate stage, The system includes the substrate storage unit, the substrate pre-alignment stage, and a second substrate transport robot that transports the substrate between the substrate and the substrate stage. The aforementioned controller, The time required for exchanging the master plate between the master plate stage and the master plate pre-alignment stage using the aforementioned rotating hand, The time required for the original plate to be transported from the original plate storage unit to the original plate pre-alignment stage by the original plate transport robot, The time from when the substrate is brought in from the outside until it is loaded onto the second substrate transport robot, Based on the time it takes for the substrate from the substrate storage unit to be loaded onto the second substrate transport robot, the fastest transfer procedure that can complete the job is determined. The lithography apparatus according to feature 4.

6. The lithography apparatus according to claim 4, characterized in that the plurality of transfer procedures include a first procedure of performing the pattern transfer on the plurality of shot areas while sequentially replacing all of the master plates used without changing the substrate midway, and repeating this for each of the substrates to be processed.

7. The lithography apparatus according to claim 6, characterized in that the controller determines the first step as the transfer step that can complete the job in the fastest possible time when there is one substrate to be processed or one master plate to be used.

8. The aforementioned multiple transfer procedures further include a second procedure in which the multiple master plates to be used are divided into multiple sets, and the substrates held by the substrate stage are replaced on a set-by-set basis of the master plates. The second procedure described above is, The process involves performing the pattern transfer on a portion of the plurality of shot regions of the first substrate using a first set of master plates, and then storing the first substrate in the substrate storage unit. The process involves repeatedly performing the pattern transfer using the first set of master plates to a portion of the shot area of ​​each substrate from the second substrate onward, and storing the substrate in the substrate storage section. The process involves performing the pattern transfer on other shot areas of the first substrate removed from the substrate storage unit using the second set of master plates, and then storing the first substrate in the substrate storage unit or transporting it to the outside. The process of repeatedly performing the pattern transfer using the second set of master plates on the other shot areas of each of the second and subsequent substrates removed from the substrate storage unit, and storing the substrate in the substrate storage unit or transporting it to the outside, A lithography apparatus according to claim 6, characterized by including the following.

9. The lithography apparatus according to claim 6, further comprising a third step of repeating for each of the original plates used the pattern transfer on a portion of the multiple shot areas while sequentially replacing all of the substrates to be processed without changing the original plate midway through.

10. The lithography apparatus according to claim 5, characterized in that the processes of transporting a substrate brought in from an external source to the second substrate transport robot and exchanging the original plate between the original plate stage and the original plate pre-alignment stage using the rotating hand are performed in parallel.

11. The lithography apparatus according to claim 5, characterized in that the process of transporting a substrate from the substrate storage unit to the second substrate transport robot and the process of exchanging the original plate between the original plate stage and the original plate pre-alignment stage using the rotating hand are performed in parallel.

12. The lithography apparatus according to claim 5, characterized in that the process of transporting a substrate from the substrate storage unit to the second substrate transport robot and the process of transporting a master plate from the master plate storage unit to the master plate stage are executed in parallel.

13. The lithography apparatus according to claim 1, further characterized in that the controller determines the transfer procedure that can complete the job in the fastest possible time, based on the specification of whether or not to perform foreign matter inspection of the original plate by the foreign matter inspection device.

14. The lithography apparatus according to claim 1, characterized in that the lithography apparatus is an exposure apparatus that projects the pattern of the master plate onto the substrate via a projection optical system to transfer the pattern onto the substrate.

15. A transfer step of transferring a pattern onto a substrate using a lithography apparatus according to any one of claims 1 to 14, A processing step for processing the substrate onto which the aforementioned pattern has been transferred, It has, A method for manufacturing an article, characterized by manufacturing an article from the processed substrate.

16. An information processing device for creating a transfer processing schedule for a lithography apparatus configured to perform a job of transferring a pattern onto one or more substrates having multiple shot areas using one or more master plates, The system includes a processor that determines the fastest transfer procedure to complete the job based on the number of master plates used and the number of substrates to be processed. An information processing device characterized by the following:

17. A lithography apparatus configured to perform a job of transferring patterns onto one or more substrates having multiple shot areas using one or more master plates, wherein the processor in the information processing device that creates the transfer processing schedule for the job, A process to determine the fastest transfer procedure that can complete the job, based on the number of master plates used and the number of substrates to be processed. A program characterized by causing the execution of a specific action.

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