Semiconductor equipment

Abstract

The present invention provides a semiconductor device that reduces stress on the side of a straight section of a conductive member. [Solution] The semiconductor device includes a first conductive member 25 having a first straight portion 36 extending along the main surface 11 of a semiconductor substrate, and an organic insulating layer 55 formed on the semiconductor substrate and covering the first conductive member 25. The first straight portion 36 includes a first side edge portion 46 formed by a curve 47 that alternately bends to one side and the other side in a direction Y1 intersecting the longitudinal direction of the first straight portion 36 in a plan view. The first straight portion 36 includes a base portion 40 and a first side portion 41 including convex portions 44, 48 projecting from the base portion 40 in a direction Y1 intersecting the longitudinal direction of the first straight portion 36, and recesses 45, 49 recessed relative to the convex portions 44, 48. The first side edge portion 46 may be formed by a curve 47 that continuously connects the convex portions 44, 48 and the recesses 45, 49 along the longitudinal direction of the first straight portion 36 in a plan view.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device.

Background Art

[0002] For example, Patent Document 1 discloses a semiconductor package including a conductive member, a semiconductor device, a bonding layer, and a sealing resin. The semiconductor device is a flip-chip type LSI. The semiconductor device has an element body, a plurality of electrodes, and a surface protection film. The surface protection film is made of polyimide and covers the bases of the plurality of electrodes.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the ambient temperature of a structure in which a conductive member such as wiring or an electrode is covered with an organic insulating layer fluctuates, high residual stress may be generated in the straight portion of the conductive member. This stress is considered to apply an external force to the contacting organic insulating layer during expansion and contraction accompanying temperature changes.

[0005] One embodiment of the present disclosure provides a semiconductor device capable of reducing stress on the side portions of the straight portion of a conductive member.

Means for Solving the Problems

[0006] A semiconductor device according to one embodiment of the present disclosure includes a semiconductor substrate, a first conductive member formed on the semiconductor substrate and having a first straight portion extending along the main surface of the semiconductor substrate, and an organic insulating layer formed on the semiconductor substrate and covering the first conductive member, wherein the first straight portion includes a first side edge formed by curves that alternately bend to one side and the other side in a direction intersecting the longitudinal direction of the first straight portion in a plan view. [Effects of the Invention]

[0007] According to a semiconductor device according to one embodiment of the present disclosure, the stress on the side of the first straight portion of the first conductive member can be reduced. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic perspective view of a semiconductor device according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a planar enlargement view of the semiconductor chip shown in Figure 1. [Figure 3] Figure 3 is an enlarged view (first form) of the area enclosed by the dashed line III in Figure 2. [Figure 4] Figure 4 is a cross-sectional view along the line IV-IV shown in Figure 3. [Figure 5] Figure 5 is an enlarged view (second form) of the area enclosed by the dashed line III in Figure 2. [Figure 6] Figure 6 is a cross-sectional view along the line VI-VI shown in Figure 3. [Figure 7] Figure 7 is a flowchart showing a part of the semiconductor chip manufacturing process shown in Figure 1, in chronological order. [Figure 8] Figure 8 is a diagram illustrating the stress relaxation effect of the semiconductor device. [Modes for carrying out the invention]

[0009] <Embodiments of this Disclosure> First, embodiments of this disclosure will be listed and described.

[0010] A semiconductor device (1) according to one embodiment of the present disclosure includes a semiconductor substrate (4,15), a first conductive member (25) formed on the semiconductor substrate (4,15) and having a first straight portion (36) extending along the main surface (11) of the semiconductor substrate (4,15), and an organic insulating layer (55) formed on the semiconductor substrate (4,15) and covering the first conductive member (25), wherein the first straight portion (36) includes a first side edge portion (46) formed by curves (47) that alternately bend to one side and the other side in a direction intersecting the longitudinal direction of the first straight portion (36) in a plan view.

[0011] For example, if the first side edge of the first straight section is straight, fluctuations in ambient temperature may cause high stress to be generated on the first side of the first straight section due to the difference in thermal expansion coefficients between the first conductive member and the organic insulating layer. When this stress causes an external force to be applied to the organic insulating layer during expansion and contraction due to temperature changes, strain may occur in the organic insulating layer, potentially degrading its mechanical properties. However, in the semiconductor device according to this embodiment, since the first side edge is formed with a curve, the stress generated on the first side of the first straight section can be distributed. This reduces the overall stress on the first side of the first straight section of the first conductive member. As a result, strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0012] In a semiconductor device (1) according to one embodiment of the present disclosure, the first straight portion (36) includes a base portion (40) to which a joining member can be connected, and a first side portion (41) including convex portions (44, 48) projecting from the base portion (40) in a direction intersecting the longitudinal direction of the first straight portion (36) and recesses (45, 49) recessed relative to the convex portions (44, 48), and the first side edge portion (46) may be formed by a curve (47) in a plan view that continuously connects the convex portions (44, 48) and the recesses (45, 49) along the longitudinal direction of the first straight portion (36).

[0013] According to this configuration, since the stress generated in the first side portion including the convex portion and the concave portion is dispersed, even if additional stress is applied to the first straight portion when connecting the joining member to the base portion of the first straight portion, it is possible to suppress a decrease in the mechanical properties of the organic insulating layer. Further, the first conductive member does not meander as a whole to form an S shape, but a stress dispersion structure is configured by selectively forming convex portions and concave portions on the first side portion of the first straight portion. Therefore, since it is not necessary to widen the installation space for the first conductive member according to this embodiment, it is possible to suppress an increase in the size of the semiconductor device.

[0014] In the semiconductor device (1) according to an embodiment of the present disclosure, the base portion (40) is formed in a strip shape having a first width (W2), and the first width (W2) of the base portion (40) may be 10 times or more the protrusion amount (P1) of the convex portions (44, 48) from the base portion (40).

[0015] According to this configuration, for example, by forming convex portions with a protrusion amount of about 1 / 10 with respect to the width of an existing first conductive member (for example, wiring, electrode, etc.), the effect of stress dispersion in the first conductive member can be achieved. Conversely, even if a stress dispersion structure is formed by convex portions and concave portions, the first width of the base portion can be maintained relatively wide. As a result, many options (shape, thickness, etc. of the joining member) of the joining member that can be joined to the base portion can be left.

[0016] In the semiconductor device (1) according to an embodiment of the present disclosure, the first conductive member (25) includes a tip portion (39) including a part of the first straight portion (36), and a second straight portion (37) connected to the first straight portion (36) via a corner portion (38), and the first side edge portion (46) may be selectively formed on the first straight portion (36) among the first straight portion (36) and the second straight portion (37).

[0017] According to this configuration, since the first curved side edge portion is formed on the first straight portion including the tip portion where stress is likely to be generated due to fluctuations in the ambient temperature, stress can be effectively dispersed in the first conductive member.

[0018] In the semiconductor device (1) according to an embodiment of the present disclosure, the tip portion (39) of the first conductive member (25) has a first side surface (52) formed by a first arc (51) having a first radius of curvature (R1) in a plan view, and the first side edge portion (46) of the first conductive member (25) may have a second side surface (54) formed by a second arc (53) having a second radius of curvature (R2) smaller than the first radius of curvature (R1) in a plan view.

[0019] In the semiconductor device (1) according to an embodiment of the present disclosure, the first conductive member (25) includes, in a cross-sectional view, a first base layer (26) and a first coating layer (27) laminated on the first base layer (26) so as to protrude laterally from an end surface (29) of the first base layer (26), and the first side edge portion (46) may be selectively formed on the first coating layer (27).

[0020] According to this configuration, the curved first side edge portion is selectively formed on the first coating layer and may not be formed on the first base layer. Therefore, the number of process steps for forming the first side edge portion can be reduced.

[0021] In the semiconductor device (1) according to an embodiment of the present disclosure, the organic insulating layer (55) may have a pad opening (56) that exposes the base portion (40) of the first straight portion (36) as a pad (14).

[0022] According to this configuration, a bonding member such as a bonding wire can be connected to the base portion of the first straight portion through the pad opening.

[0023] A semiconductor device (1) according to one embodiment of the present disclosure may further include a second conductive member (59) connected to the base portion (40) of the first linear portion (36) within the organic insulating layer (55).

[0024] With this configuration, the aforementioned stress distribution structure suppresses the deterioration of the mechanical properties of the organic insulating layer surrounding the second conductive member. Therefore, the reliability of the connection between the first conductive member (first linear section) and the second conductive member can be improved.

[0025] In a semiconductor device (1) according to one embodiment of the present disclosure, the second conductive member (59) has a third linear portion (72) extending along the main surface (11) of the semiconductor substrate (4,15), and the third linear portion (72) may include a second side edge portion (79) formed by curves (80) that alternately bend to one side and the other side in a direction intersecting the longitudinal direction of the third linear portion (72) in a plan view.

[0026] With this configuration, since the second side edge is formed with a curve, the stress generated on the second side of the third straight section can be distributed. As a result, the stress on the second side of the third straight section of the second conductive member can be reduced overall. Consequently, the strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0027] In a semiconductor device (1) according to one embodiment of the present disclosure, the second conductive member (59) includes, in cross-sectional view, a second base layer (60) and a second coating layer (61) laminated on the second base layer (60) so as to protrude laterally from the end face (63) of the second base layer (60), and the second side edge (79) may be selectively formed on the second coating layer (61).

[0028] With this configuration, the curved second side edge is selectively formed in the second coating layer and does not necessarily have to be formed in the second base layer. Therefore, the number of steps in the process of forming the second side edge can be reduced.

[0029] A semiconductor device (1) according to one embodiment of the present disclosure may include an insulating layer laminated structure (17) formed between the first conductive member (25) and the semiconductor substrate (4, 15), and comprising at least a first inorganic insulating layer (18, 57) and a second inorganic insulating layer (19, 58) laminated on the first inorganic insulating layer (18, 57).

[0030] A semiconductor device (1) according to one embodiment of the present disclosure may include an integrated circuit element (16) formed on the semiconductor substrate (4, 15) and electrically connected to the first conductive member (25).

[0031] With this configuration, as described above, the stress on the first side of the first straight portion of the first conductive member can be reduced, making it possible to provide a semiconductor device including an integrated circuit with high insulation reliability of the organic insulating layer.

[0032] In the above, the numbers in parentheses represent the reference symbols for the corresponding components in the detailed explanations described later. However, these reference symbols are not intended to limit each of the above components to equivalents of the components described later.

[0033] <Detailed Description of Embodiments in This Disclosure> Next, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following detailed description, there are multiple components with ordinal names, but these ordinal numbers do not necessarily correspond to the ordinal numbers of the components described in the claims.

[0034] Figure 1 is a schematic perspective view of a semiconductor device 1 according to one embodiment of the present disclosure.

[0035] In this embodiment, the semiconductor device 1 is a so-called SOP (Small Outline Package). The semiconductor device 1 includes a sealing resin 2, a die pad 3, a semiconductor chip 4, a conductive bonding material 5, a plurality of lead terminals 6, and a plurality of conductors 7.

[0036] The sealing resin 2 may include, for example, an epoxy resin. The sealing resin 2 may also be referred to as a resin package. The sealing resin 2 is formed in a rectangular parallelepiped shape. The sealing resin 2 includes a first main surface 8 on one side, a second main surface 9 on the other side, and four sides 10A, 10B, 10C, and 10D connecting the first main surface 8 and the second main surface 12. The four sides 10A to 10D specifically include the first side 10A, the second side 10B, the third side 10C, and the fourth side 10D. The first side 10A and the second side 10B face each other. The third side 10C and the fourth side 10D face each other.

[0037] The die pad 3 is located within the sealing resin 2. The die pad 3 may be exposed from the second main surface 9. The die pad 3 includes a metal plate formed in a rectangular parallelepiped shape. The die pad 3 may contain at least one of Fe, Au, Ag, Cu, and Al. The die pad 3 may have an outer surface on which at least one of the Ni plating layer, Au plating layer, Ag plating layer, and Cu plating layer is formed.

[0038] The multiple lead terminals 6 include the first lead terminal 6A, the second lead terminal 6B, the third lead terminal 6C, the fourth lead terminal 6D, the fifth lead terminal 6E, the sixth lead terminal 6F, the seventh lead terminal 6G, and the eighth lead terminal 6H. The number of lead terminals 6 is adjusted according to the function of the semiconductor chip 4 and is not limited to the number shown in Figure 1.

[0039] The four lead terminals 6A to 6D are located on the first side surface 10A of the sealing resin 2. The four lead terminals 6A to 6D are spaced apart from the die pad 3. The four lead terminals 6A to 6D are arranged with spacing in the direction in which the first side surface 10A extends. The four lead terminals 6A to 6D are drawn out from inside the sealing resin 2 across the first side surface 10A to the outside of the sealing resin 2.

[0040] The four lead terminals 6E to 6H are located on the second side surface 10B of the sealing resin 2. The four lead terminals 6E to 6H are spaced apart from the die pad 3. The four lead terminals 6E to 6H are arranged with spacing in the direction in which the second side surface 10B extends. The four lead terminals 6E to 6H are drawn out from inside the sealing resin 2 across the second side surface 10B to the outside of the sealing resin 2.

[0041] The multiple lead terminals 6 may include at least one of Fe, Au, Ag, Cu, and Al. The multiple lead terminals 6 may have an outer surface on which at least one of the Ni plating layer, Au plating layer, Ag plating layer, and Cu plating layer is formed.

[0042] The semiconductor chip 4 includes, for example, an LSI (Large Scale Integration) chip. The semiconductor chip 4 is placed on a die pad 3. The semiconductor chip 4 has a first main surface 11 on one side and a second main surface 12 on the other side. Multiple element regions 13 are formed on the first main surface 11 of the semiconductor chip 4, into which elements constituting the circuit of the LSI are fabricated. The multiple element regions 13 may include, for example, a diode region 13A, a transistor region 13B, a resistor region 13C, etc. Multiple pads 14 are formed on the first main surface 11 of the semiconductor chip 4. The multiple pads 14 are arranged on the side of the four lead terminals 6A to 6D and the four lead terminals 6E to 6H on the first main surface 11 of the semiconductor chip 4. The multiple pads 14 are electrically connected to a functional element 16 (circuit element constituting the LSI), which will be described later.

[0043] The conductive bonding material 5 is interposed between the semiconductor chip 4 and the die pad 3, bonding the semiconductor chip 4 to the die pad 3. The conductive bonding material 5 includes solder or conductive paste. The solder may be lead-free solder. The solder may contain at least one of SnAgCu, SnZnBi, SnCu, SnCuNi, and SnSbNi. The metal paste may contain at least one of Au, Ag, and Cu. The conductive bonding material 5 is preferably made of silver paste. The silver paste is particularly preferably made of sintered silver paste. The sintered silver paste may contain a paste in which nano-sized or micro-sized Ag particles are dispersed in an organic solvent.

[0044] The number of conductors 7 is adjusted according to the function of the semiconductor chip 4 and is not limited to the number shown in Figure 1. The conductors 7 electrically connect the multiple lead terminals 6 and the multiple pads 14. In this embodiment, the conductors 7 include aluminum wire as an example of bonding wire. The conductors 7 may be gold wire or copper wire instead of aluminum wire.

[0045] The package configuration of semiconductor device 1 may be other than SOP. For example, semiconductor device 1 may have various package configurations such as TO (Transistor Outline), QFN (Quad For Non Lead Package), DFP (Dual Flat Package), DIP (Dual Inline Package), QFP (Quad Flat Package), SIP (Single Inline Package), or SOJ (Small Outline J-leaded Package), or similar packages.

[0046] Figure 2 is a planar enlargement of the semiconductor chip 4 in Figure 1, showing the area around the pad 14. Figure 3 is an enlargement of the area enclosed by the dashed line III in Figure 2 (first form). Figure 4 is a cross-sectional view along the line IV-IV shown in Figure 3.

[0047] Next, the first form of the semiconductor chip 4 will be described with reference to Figures 2 to 4.

[0048] First, regarding the cross-sectional structure of the semiconductor chip 4. Referring to Figure 4, the semiconductor chip 4 includes a semiconductor substrate 15. The semiconductor substrate 15 may be an epitaxial substrate including, for example, a base substrate containing Si and an epitaxial layer grown on the base substrate. Also, since the semiconductor chip 4 is formed in layers, it may be referred to as a semiconductor layer.

[0049] The first main surface 11 and the second main surface 12 of the semiconductor chip 4 may be the first main surface 11 and the second main surface 12 of the semiconductor substrate 15. Multiple functional elements 16 are formed on the first main surface 11 of the semiconductor substrate 15. The multiple functional elements 16 may include circuit elements that constitute an LSI, such as diodes, transistors, and resistors.

[0050] An insulating layer laminated structure 17 is formed on the first main surface 11 of the semiconductor substrate 15. The insulating layer laminated structure 17 includes a laminated structure of a plurality of inorganic insulating layers. In this embodiment, the insulating layer laminated structure 17 includes a first insulating layer 18, a second insulating layer 19, a third insulating layer 20, a fourth insulating layer 21, and a fifth insulating layer 22, which are laminated in order from the first main surface 11 of the semiconductor substrate 15. Each insulating layer 18 to 22 of the insulating layer laminated structure 17 includes an inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiN).

[0051] Each insulating layer 18-22 has a plurality of wirings 23 and a plurality of vias 24 that connect the wirings 23 located above and below each other. The wirings 23 are electrically connected to the functional element 16 via the vias 24. Thus, the insulating layer laminated structure 17 is configured as a multilayer wiring structure in which wirings 23 electrically connected to the functional element 16 are provided across a plurality of insulating layers 18-22. The plurality of wirings 23 may include known wiring materials such as Cu and Al. The plurality of vias 24 may include known via materials such as W.

[0052] A first conductive member 25 is formed on the insulating layer laminate structure 17. In this embodiment, the first conductive member 25 is the uppermost wiring layer that forms the pad 14 of the semiconductor chip 4, and may also be referred to as the first wiring layer. Furthermore, the first conductive member 25 is formed by a plurality of conductive layers, and may also be referred to as the first conductive layer.

[0053] In the cross-sectional view of Figure 4, the first conductive member 25 includes a first base layer 26 and a first coating layer 27 laminated on the first base layer 26. The first base layer 26 contains, for example, Cu, and in this embodiment may include a Cu plating layer. The first base layer 26 is connected, for example, to vias 24. Thus, the first conductive member 25 is electrically connected to the functional element 16 via the vias 24 and wiring 23.

[0054] The first coating layer 27 covers the first base layer 26. The first coating layer 27 integrally includes a first coating portion 28 that is in contact with the upper surface of the first base layer 26 and covers the first base layer 26, and a first protrusion portion 30 that protrudes laterally from the end face 29 of the first base layer 26. As a result, a first step 32 corresponding to the amount of protrusion of the first protrusion portion 30 is formed between the end face 29 of the first base layer 26 and the end face 31 of the first coating layer 27. The first protrusion portion 30 may hang down on the lower side (the side closer to the first main surface 11 of the semiconductor substrate 15) relative to the first coating portion 28. Therefore, the upper surface 33 of the first coating layer 27 may be inclined downward on both sides with respect to the portion on the first base layer 26. The first coating layer 27 may be formed thinner than the first base layer 26. For example, the first base layer 26 may have a thickness of 2 μm or more and 3 μm or less, and the first coating layer 27 may have a thickness of 1 μm or more and 2 μm or less.

[0055] In this embodiment, the first coating layer 27 includes a plurality of coating layers. The first coating layer 27 may include, for example, a first layer 34 in contact with the first base layer 26 and a second layer 35 laminated on the first layer 34. The first layer 34 may contain, for example, Ni, and in this embodiment may include a Ni plating layer. The second layer 35 may contain, for example, Pd, and in this embodiment may include a Pd plating layer. Although not shown, the first coating layer 27 may further include an Au plating layer on its outermost surface. The first layer 34 and the second layer 35 are laminated over both the first coating portion 28 and the first protrusion 30. As a result, the boundary between the first layer 34 and the second layer 35 may be exposed on the end face 31 of the first coating layer 27.

[0056] Next, the planar structure of the first conductive member 25 will be described. Referring to Figure 2, the first conductive member 25 extends over a wide area on the first main surface 11 of the semiconductor substrate 15. In this embodiment, the first conductive member 25 includes a first straight section 36 and a second straight section 37. The first straight section 36 and the second straight section 37 are each formed in a strip shape in plan view and are integrally connected via a corner section 38. Note that the first straight section 36 and the second straight section 37 are defined as strip-shaped because they are shown as being relatively wide relative to their length in Figure 2. In contrast, if the width of the first straight section 36 and the second straight section 37 is very small relative to its length, they may be defined as line-shaped or the like.

[0057] The first straight section 36 includes a tip 39, which is the end of the first conductive member 25. The end of the first conductive member 25 opposite to the tip 39 (not shown) may be connected to the via 24 mentioned above. The first straight section 36 and the second straight section 37 may intersect each other at an obtuse angle at the corner 38, as in the two first conductive members 25 on the left side of Figure 2. Alternatively, the first straight section 36 and the second straight section 37 may intersect each other at a right angle at the corner 38, as in the two first conductive members 25 on the right side of Figure 2. In other words, the angle of the corner 38 may be obtuse, right, or acute.

[0058] Referring to Figure 3, a more detailed explanation of the shape of the first straight section 36 will be provided. In Figure 3, the longitudinal direction (extension direction) of the first straight section 36 is defined as the first direction X1, and the direction perpendicular to the first direction X1 is defined as the second direction Y1.

[0059] The first linear section 36 includes a strip-shaped first base section 40 extending in a first direction X1 and first side sections 41 integrally formed on both sides of the first base section 40 in a second direction Y1. The first base section 40 is a conveniently defined strip-shaped region that can be extracted from the first linear section 36 while maintaining substantially the same outer shape as the first linear section 36, such as the inner region of the first boundary section 42 shown by a dashed line in Figure 3, or the inner region of the first boundary section 43 shown by a dashed line.

[0060] The first base portion 40 only needs to have a width that allows for the connection of a joining member such as the aforementioned conductor 7. The first base portion 40 may also have a first width W2 that is 80% or more, preferably 90% or more, of the width W1 of the first straight portion 36. For example, the width W1 of the first straight portion 36 may be 12 μm or more and 25 μm or less, and the first width W2 of the first base portion 40 may be 10 μm or more and 20 μm or less. The width W1 of the first straight portion 36 may also be the distance between the top of one first protrusion 44 and the top of the other first protrusion 44 in the second direction Y1.

[0061] In this embodiment, the first side portion 41 is the outer region of the first boundary portion 42 or the outer region of the first boundary portion 43, and has an uneven structure that does not affect the outer shape of the first straight portion 36. More specifically, the first side portion 41 includes a first convex portion 44 projecting from the first base portion 40 in the second direction Y1 and a first recess 45 recessed relative to the first convex portion 44. In this embodiment, the first straight portion 36 has a first side edge portion 46 formed by curves that alternately bend to one side (left side of the paper) and the other side (right side of the paper) of the second direction Y1. The first side edge portion 46 is the outer shape line of the first straight portion 36 extending in the first direction X1 in a plan view, and forms the side surface of the first straight portion 36. Therefore, the first side portion 41 of the first straight portion 36 is the region between the first base portion 40 and the first side edge portion 46, and the first convex portion 44 and the first concave portion 45 constituting the first side portion 41 are formed by the curved first side edge portion 46 which is continuously connected along the first direction X1.

[0062] The amount of protrusion P1 of the first convex portion 44 of the first side portion 41 should be such that it does not significantly alter the outer shape of the first straight portion 36. For example, compared to the first width W2 of the first base portion 40, the amount of protrusion P1 may be 1 / 10 or less of the first width W2 (i.e., the first width W2 is 10 times or more the amount of protrusion P1). In other words, even if a stress distribution structure is formed by the first convex portion 44 and the first recess 45, the first width W2 of the first base portion 40 can be kept relatively wide. As a result, many options for joining members that can be joined to the first base portion 40 (for example, the shape and thickness of wires and wiring) can be left open.

[0063] Furthermore, in this embodiment, the curved first side edge 46 may be a sinusoidal curve 47 extending along the first direction X1. As a result, the first side portion 41 includes a plurality of first curved convex portions 48 and a plurality of first curved concave portions 49 that are alternately formed along the first direction X1. In this case, the first width W2 of the first base portion 40 may be five times or more the amplitude A1 of the sinusoidal curve 47 from the first reference line 50 shown by the dashed line in Figure 3.

[0064] The first boundary portions 42 and 43 between the first side portion 41 and the first base portion 40 may be defined, for example, by a line formed by connecting the tops of the multiple first recesses 45 along the first direction X1 (the dashed line in Figure 3), or by forming a line parallel to that line (the dashed line in Figure 3) slightly inside the tops of the multiple first recesses 45.

[0065] The tip portion 39 of the first conductive member 25 has a first side surface 52 formed by a first circular arc 51 having a first radius of curvature R1 in a plan view. Compared to this first side surface 52, the first side edge 46 may have a second side surface 54 formed by a second circular arc 53 having a second radius of curvature R2 smaller than the first radius of curvature R1 in a plan view. If the first side edge 46 includes a sine curve 47, the curved surfaces of the first curved convex portion 48 and the first curved concave portion 49 may be formed by the second circular arc 53.

[0066] In this embodiment, a pair of first side edges 46 including a sine curve 47 are formed along the first direction X1. That is, both side edges of the first straight section 36 may be first side edges 46 including a sine curve 47. The pair of sine curves 47 may include one sine curve 47A and the other sine curve 47B. Comparing one sine curve 47A and the other sine curve 47B, the formation positions of the first curved protrusions 48 in the first direction X1 may differ from each other. For example, in the second direction Y1, the first curved protrusion 48 of one sine curve 47A may be offset from the first curved protrusion 48 of the other sine curve 47B.

[0067] In this embodiment, in the second direction Y1, the first curved convex portion 48 of one sine curve 47A faces the first curved concave portion 49 of the other sine curve 47B. Also, the first curved convex portion 48 of the other sine curve 47B faces the first curved concave portion 49 of one sine curve 47A. As a result, in the first direction X1, the first curved convex portion 48 (first curved concave portion 49) is alternately formed in a first side portion 41 including one sine curve 47A and a first side portion 41 including the other sine curve 47B.

[0068] Thus, the first straight section 36 has a first side section 41 that includes a first curved convex section 48 and a first curved concave section 49. On the other hand, for example, when observing the first straight section 36 at a low magnification, the curved portions of the first curved convex section 48 and the first curved concave section 49 of the sine curve 47 may appear pointed. In this case, the first side section 41 may be defined as being formed in a zigzag shape in plan view. The top shape of the first convex section 44 that protrudes outward from the zigzag shape may correspond to the shape of the curved surface of the first curved convex section 48.

[0069] Furthermore, the aforementioned first protrusion 44 and first recess 45 may be selectively formed on the first coating layer 27, of the first base layer 26 and first coating layer 27 constituting the first conductive member 25. Of course, they may also be formed on both the first base layer 26 and the first coating layer 27. In addition, as shown in Figure 3, the first protrusion 44 and first recess 45 may be selectively formed on the first straight section 36, or selectively formed on the second straight section 37, or formed on both the first straight section 36 and the second straight section 37.

[0070] Referring to Figure 4, a protective layer 55 is formed on the insulating layer laminate structure 17 so as to cover the first conductive member 25. The protective layer 55 contains an organic insulating resin. The organic insulating resin may include, for example, epoxy resin, phenolic resin, polyimide, etc. The protective layer 55 may be a resin layer having a higher coefficient of thermal expansion than the first conductive member 25. For example, the first coefficient of thermal expansion of Cu constituting the base layer of the first conductive member 25 is 16 × 10⁻⁶. -6 / ℃ or higher 18×10 -6 While the temperature is below / ℃, the second thermal expansion coefficient of the resin (for example, epoxy resin) constituting the protective layer 55 is 45 × 10 -6 / ℃ or higher 65×10 -6 The temperature may be below / ℃. The protective layer 55 has a pad opening 56 that exposes the first base portion 40 of the first straight portion 36 as a pad 14. The aforementioned conductor 7 is connected to the first conductive member 25 via this pad 14.

[0071] Figure 5 is an enlarged view (second form) of the area enclosed by the dashed line III in Figure 2. Figure 6 is a cross-sectional view along the line VI-VI shown in Figure 3.

[0072] Next, the second form of the semiconductor chip 4 will be described. In the following, structures corresponding to those described with reference to Figures 2 to 4 will be given the same reference numerals and their descriptions will be omitted.

[0073] First, referring to Figure 6, in the second embodiment, in the thickness direction of the semiconductor substrate 15, no wiring 23 and vias 24 are formed in the portion directly beneath the first conductive member 25 in the insulating layer laminated structure 17. In other words, the first conductive member 25 may face the semiconductor substrate 15 only through the insulating layer of the insulating layer laminated structure 17, without the use of conductive members such as wiring 23 and vias 24. The insulating layer laminated structure 17 in the second embodiment includes a laminated structure of a plurality of inorganic insulating layers, for example, a first insulating layer 57 and a second insulating layer 58. Each insulating layer of the insulating layer laminated structure 17 includes, for example, an inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiN).

[0074] The first insulating layer 57 and the second insulating layer 58 may be insulating layers made of the same insulating material but formed by different manufacturing methods. For example, the first insulating layer 57 may be a thermal silicon oxide film and the second insulating layer 58 may be a CVD (Chemical Vapor Deposition) silicon oxide film. In this case, the first insulating layer 57 may have a denser film quality than the second insulating layer 58.

[0075] Since no wiring 23 and via 24 are formed directly beneath the first conductive member 25, the first conductive member 25 does not need to be electrically connected to the functional element 16 formed on the semiconductor substrate 15. Instead of this connection, the first conductive member 25 may be electrically connected to a functional element 16 mounted on a semiconductor device 1 other than the semiconductor device 1, for example, via a conductor 7 connected to a pad 14.

[0076] A second conductive member 59 is formed on the first conductive member 25. The second conductive member 59 is a second layer of wiring laminated on the first conductive member 25, and may also be referred to as a second wiring layer. Furthermore, the second conductive member 59 is formed by multiple conductive layers, and may also be referred to as a second conductive layer.

[0077] The second conductive member 59 includes a second base layer 60 and a second coating layer 61 laminated on the second base layer 60. The second base layer 60 contains, for example, Cu, and in this embodiment may include a Cu plating layer. The second base layer 60 is connected to the first coating layer 27 of the first conductive member 25. Thus, the second conductive member 59 is physically connected to the first conductive member 25.

[0078] The second coating layer 61 covers the second base layer 60. The second coating layer 61 integrally includes a second coating portion 62 that is in contact with the upper surface of the second base layer 60 and covers the second base layer 60, and a second projection portion 64 that protrudes laterally from the end face 63 of the second base layer 60. As a result, a second step 66 corresponding to the amount of protrusion of the second projection portion 64 is formed between the end face 63 of the second base layer 60 and the end face 65 of the second coating layer 61. The second projection portion 64 may face the first base layer 26 of the first conductive member 25 with a part of the protective layer 55 in between.

[0079] The second protrusion 64 may hang down on the lower side (closer to the first main surface 11 of the semiconductor substrate 15) relative to the second coating portion 62. Therefore, the upper surface 67 of the second coating layer 61 may be inclined downward on both sides relative to the portion on the second base layer 60. The second coating layer 61 may be formed thinner than the second base layer 60. For example, the second base layer 60 may have a thickness of 2 μm or more and 3 μm or less, and the second coating layer 61 may have a thickness of 1 μm or more and 2 μm or less.

[0080] In this embodiment, the second coating layer 61 includes a plurality of coating layers. The second coating layer 61 may include, for example, a first layer 68 in contact with the second base layer 60 and a second layer 69 laminated on the first layer 68. The first layer 68 may contain, for example, Ni, and in this embodiment may include a Ni plating layer. The second layer 69 may contain, for example, Pd, and in this embodiment may include a Pd plating layer. Although not shown, the second coating layer 61 may further include an Au plating layer on its outermost surface. The first layer 68 and the second layer 69 are laminated over both the second coating portion 62 and the second protrusion 64. As a result, the boundary between the first layer 68 and the second layer 69 may be exposed on the end face 65 of the second coating layer 61.

[0081] Next, referring to Figure 5, the second conductive member 59 is formed in the protective layer 55 in a portion above the first conductive member 25 and extends so as to overlap the first conductive member 25 in a plan view. The second conductive member 59 has a connecting portion 70 connected to the tip portion 39 of the first conductive member 25. In Figure 5, the connecting portion 70 of the second conductive member 59 is shown with dashed hatching. For clarity, this hatching is applied to only one of the second conductive members 59.

[0082] The second conductive member 59 is bent upward at the connection portion 70 and extends in a direction that is diagonally upward away from the first conductive member 25. In Figure 5, the straight line shown at the end of the connection portion 70 is the bent portion 71 of the second conductive member 59. In this embodiment, in a plan view, the first conductive member 25 extends toward one side of the first direction X1, with the connection portion 70 between the first conductive member 25 and the second conductive member 59 as the boundary, and the second conductive member 59 extends toward the other side of the first direction X1. As a result, the first conductive member 25 and the second conductive member 59 are aligned in a straight line along the first direction X1.

[0083] In this embodiment, the second conductive member 59 includes a third linear portion 72. The third linear portion 72 is formed in a strip shape in plan view. In Figure 5, the third linear portion 72 is shown to be relatively wide relative to its length, and is therefore defined as strip-shaped. However, if the width of the third linear portion 72 is very small relative to its length, it may be defined as line-shaped or the like. The third linear portion 72 includes a tip portion 73, which is the end of the second conductive member 59. The tip portion 73 of the second conductive member 59 is the part that is physically connected to the first conductive member 25.

[0084] In the following, the longitudinal direction (extension direction) of the third straight section 72 is defined as the third direction X2, and the direction perpendicular to the third direction X2 is defined as the fourth direction Y2. In this embodiment, the third direction X2 and the fourth direction Y2 coincide with the first direction X1 and the second direction Y1, respectively.

[0085] The third linear section 72 includes a strip-shaped second base section 74 extending in the third direction X2 and second side sections 75 integrally formed on both sides of the second base section 74 in the fourth direction Y2. The second base section 74 is a region conveniently defined as a strip-shaped area that can be extracted from the third linear section 72, while maintaining approximately the same outer shape as the third linear section 72, such as the inner region of the second boundary section 76 shown by the dashed line in Figure 5.

[0086] The second base portion 74 may have a second width W4 that is 80% or more, preferably 90% or more, of the width W3 of the third straight portion 72. For example, the width W3 of the third straight portion 72 may be 8 μm or more and 20 μm or less, and the second width W4 of the second base portion 74 may be 7 μm or more and 16 μm or less. The width W3 of the third straight portion 72 may be the distance between the top of one second protrusion 77 and the top of the other second protrusion 77 in the fourth direction Y2. Also, the width W3 of the third straight portion 72 may be smaller than the width W1 of the first straight portion 36 of the first conductive member 25. This allows a connection margin to be provided on the side of the second conductive member 59 when connecting the second conductive member 59 to the first conductive member 25.

[0087] In this embodiment, the second side portion 75 is the outer region of the second boundary portion 76 and has an uneven structure that does not affect the outer shape of the third straight portion 72. More specifically, the second side portion 75 includes a second convex portion 77 projecting from the second base portion 74 in the fourth direction Y2 and a second recess 78 recessed relative to the second convex portion 77. In this embodiment, the third straight portion 72 has a second side edge portion 79 formed by curves that alternately bend to one side (left side of the paper) and the other side (right side of the paper) of the fourth direction Y2. The second side edge portion 79 is the outer shape line of the third straight portion 72 extending in the third direction X2 in a plan view and forms the side surface of the third straight portion 72. Therefore, the second side portion 75 of the third straight portion 72 is the region between the second base portion 74 and the second side edge portion 79, and the second convex portion 77 and the second concave portion 78 constituting the second side portion 75 are formed by the curved second side edge portion 79 which is continuously connected along the third direction X2.

[0088] The amount of protrusion P2 of the second convex portion 77 of the second side portion 75 should be such that it does not significantly alter the outer shape of the third straight portion 72. For example, compared to the second width W4 of the second base portion 74, the amount of protrusion P2 may be 1 / 10 or less of the second width W4 (i.e., the second width W4 may be 10 times or more the amount of protrusion P2). In this embodiment, the curved second side edge portion 79 may be a sinusoidal curve 80 extending along the third direction X2. As a result, the second side portion 75 includes a plurality of second curved convex portions 81 and a plurality of second curved recesses 82 that are alternately formed along the third direction X2. In this case, the second width W4 of the second base portion 74 may be 5 times or more the amplitude A2 of the sinusoidal curve 80 from the second reference line 83 shown by the dashed line in Figure 5.

[0089] The tip portion 73 of the second conductive member 59 has a third side surface 85 formed by a third arc 84 having a third radius of curvature R3 in a plan view. Compared to this third side surface 85, the second side edge portion 79 may have a fourth side surface 87 formed by a fourth arc 86 having a fourth radius of curvature R4 smaller than the third radius of curvature R3 in a plan view. If the second side edge portion 79 includes a sine curve 47, the curved surfaces of the second curved convex portion 81 and the second curved concave portion 82 may each be formed by the fourth arc 86.

[0090] In this embodiment, a pair of second side edges 79 including the sine curve 80 are formed along the third direction X2. That is, both side edges of the third straight section 72 may be second side edges 79 including the sine curve 80. The pair of sine curves 80 may include one sine curve 80A and the other sine curve 80B. Comparing one sine curve 80A and the other sine curve 80B, the formation positions of the second curved protrusions 81 in the third direction X2 may differ from each other. For example, in the fourth direction Y2, the second curved protrusion 81 of one sine curve 80A may be offset from the second curved protrusion 81 of the other sine curve 80B.

[0091] In this embodiment, in the fourth direction Y2, the second curved convex portion 81 of one sine curve 80A faces the second curved concave portion 82 of the other sine curve 80B. Also, the second curved convex portion 81 of the other sine curve 80B faces the second curved concave portion 82 of the one sine curve 80A. As a result, in the third direction X2, the second curved convex portion 81 (second curved concave portion 82) is alternately formed in a second side portion 75 including one sine curve 80A and a second side portion 75 including the other sine curve 80B.

[0092] Thus, as shown in Figure 5, the third straight section 72 has a second side section 75 that includes a second curved convex section 81 and a second curved concave section 82. On the other hand, if the magnification when observing the third straight section 72 is low, for example, the curved portions of the second curved convex section 81 and the second curved concave section 82 of the sine curve 80 may appear pointed. In this case, the second side section 75 may be defined as being formed in a zigzag shape in plan view. The top shape of the second convex section 77 that protrudes outward from the zigzag shape may correspond to the shape of the curved surface of the second curved convex section 81.

[0093] Furthermore, the aforementioned second protrusion 77 and second recess 78 may be selectively formed on the second coating layer 61 of the second base layer 60 and second coating layer 61 that constitute the second conductive member 59. Of course, they may also be formed on both the second base layer 60 and the second coating layer 61. Figure 7 is a flowchart showing a part of the manufacturing process of the semiconductor chip 4 in order of steps.

[0094] To manufacture the semiconductor chip 4, for example, a semiconductor wafer is prepared (step S1). The semiconductor wafer serves as the base for the semiconductor substrate 15. Next, a functional element 16 is formed on the main surface of the semiconductor wafer (step S2). The functional element 16 may be formed by known methods such as impurity implantation into the semiconductor substrate 15 or deposition of a resistive conductive material. Next, an insulating layer laminated structure 17 is formed on the semiconductor substrate 15 (step S3). The insulating layer laminated structure 17 may be formed by, for example, known multilayer wiring structure formation techniques.

[0095] Next, a first conductive member 25 is formed on the insulating layer laminated structure 17 (step S4). The first conductive member 25 is formed, for example, by plating and growing the materials for the first base layer 26 and the first coating layer 27 on the insulating layer laminated structure 17. Next, the first conductive member 25 is patterned (step S5). This forms a first side portion 41 including a first convex portion 44 and a first concave portion 45 on the first straight portion 36 of the first conductive member 25. Specifically, a mask having a pattern of a first side edge portion 46 (sine curve 47) is placed on the laminated structure of the first base layer 26 and the first coating layer 27, and the first convex portion 44 and the first concave portion 45 are formed by selectively etching the first coating layer 27 and the first base layer 26 through this mask. If the semiconductor chip 4 includes a second conductive member 59, the second conductive member 59 can be formed by repeating steps S4 and S5 after patterning the first conductive member 25.

[0096] Next, a protective layer 55 is formed on the insulating layer laminated structure 17 so as to cover the first conductive member 25 (step S6). For example, the protective layer 55 may be formed by setting a semiconductor wafer in a mold and filling the mold with a resin material. After that, the protective layer 55 is cured by heat treatment.

[0097] Next, a pad opening 56 is formed in the protective layer 55, exposing a portion of the first conductive member 25 as a pad 14. Subsequently, the semiconductor wafer is cut, and multiple semiconductor chips 4 are extracted. The aforementioned semiconductor chips 4 are obtained through the process including the above steps.

[0098] Figure 8 illustrates the stress relaxation effect of introducing an uneven structure. More specifically, Figure 8 shows the results of stress simulations performed on samples 1 and 2. Sample 1 is wiring 89 whose side edge 88 is formed by the aforementioned sinusoidal curve 47. Sample 2 is wiring 91 whose side edge 90 is formed in a straight line. In Figure 8, the areas with dashed hatching are regions where the stress is between 0.1% and 10%, compared to the stress in the other white areas which is set to 100%. Referring to Figure 8, it can be seen that in sample 1, which employs an uneven structure, the stress applied to the side of wiring 89 is distributed and reduced overall compared to sample 2, which does not employ an uneven structure.

[0099] Furthermore, a temperature cycling test was performed on sample 1. The test conditions were -65°C to 150°C, with 500 cycles (30 minutes each at high and low temperatures). After the test, a cross-sectional SEM image of sample 1 was observed, and no cracks originating from the side edges 88 of the wiring 89 were found in the protective layer 55 made of organic insulating resin. From this result, it is considered that in sample 1, the stress applied to the side of the wiring 89 was distributed by the uneven structure of the side edges 88 of the wiring 89.

[0100] As shown in the simulation results in Figure 8, in the semiconductor chip 4 according to this embodiment, the first side edge portion 46 is formed by a sinusoidal curve 47, which allows the stress generated on the first side portion 41 of the first straight portion 36 to be distributed. This reduces the overall stress on the first side portion 41 of the first straight portion 36 of the first conductive member 25. As a result, it is possible to suppress the strain generated in the protective layer 55 during expansion and contraction due to ambient temperature changes (for example, temperature changes during curing of the protective layer 55).

[0101] Furthermore, the stress distribution structure is not formed by the first conductive member 25 being meandering overall into an S shape, but rather by selectively forming the first convex portion 44 and the first concave portion 45 on the first side portion 41 of the first straight portion 36. Therefore, since there is no need to increase the installation space for the first conductive member 25, the size of the semiconductor chip 4 can be suppressed.

[0102] Furthermore, if the semiconductor chip 4 includes a second conductive member 59, and the second side edge 79 of this second conductive member 59 is also formed with a sinusoidal curve 80, the stress generated on the second side portion 75 of the third straight portion 72 can be distributed. This reduces the overall stress on the second side portion 75 of the third straight portion 72 of the second conductive member 59. As a result, the strain generated in the protective layer 55 during expansion and contraction due to temperature changes can be suppressed.

[0103] While embodiments of this disclosure have been described above, this disclosure can also be implemented in other forms.

[0104] For example, in the embodiment described above, the wiring layer of an LSI chip was used as an example of the first conductive member 25 and the second conductive member 59. However, the characteristic structures of the first conductive member 25 and the second conductive member 59 can also be used, for example, in the wiring, electrode, and coil structures of other semiconductor devices. More specifically, they can be used in the surface wiring of wafer-level CSPs (Wafer-level Chip Size Packages) and the coil junctions of isolation transformer elements.

[0105] The embodiments described herein are illustrative in all respects and should not be construed restrictively, and are intended to be modified in all respects.

[0106] The following features can be extracted from the description and drawings of this specification. In the following, the numbers in parentheses represent the reference numerals of the corresponding components in the detailed description above. However, these reference numerals are not intended to limit each component below to an equivalent of the components described above.

[0107] [Note 1-1] Semiconductor chips (4,15) and A first conductive layer (25) is formed on the semiconductor chip (4,15) and has a first straight portion (36) that extends along the main surface (11) of the semiconductor chip (4,15), It includes an organic insulating layer (55) formed on the semiconductor chip (4,15) and covering the first conductive layer (25), The semiconductor device (1) includes a base portion (40) having a joining region to which a joining member can be connected, and a first side portion (41) including protrusions (44, 48) projecting from the base portion (40) in a direction intersecting the longitudinal direction of the first linear portion (36), and recesses (45, 49) recessed relative to the protrusions (44, 48).

[0108] For example, if the first side of the first straight section is a straight line, fluctuations in ambient temperature may cause high stress to be generated in the first side of the first straight section due to the difference in thermal expansion coefficients between the first conductive layer and the organic insulating layer. When this stress causes an external force to be applied to the organic insulating layer during expansion and contraction due to temperature changes, strain may occur in the organic insulating layer, potentially degrading its mechanical properties. However, in the semiconductor device according to this embodiment, since the first side of the first straight section includes convex and concave portions, the stress generated in the first side of the first straight section can be distributed. This reduces the overall stress on the first side of the first straight section of the first conductive layer. As a result, strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0109] [Appendix 1-2] The semiconductor device (1) according to Appendix 1-1, wherein the convex portions (44, 48) and concave portions (45, 49) include a plurality of curved convex portions (48) and a plurality of curved concave portions (49) alternately formed by a sinusoidal curve (47) extending along the longitudinal direction of the first straight portion (36).

[0110] With this configuration, since the convex and concave portions are curved convex and curved concave portions, respectively, it is possible to prevent stress from concentrating at specific points on the convex and concave portions.

[0111] [Appendix 1-3] The semiconductor device (1) as described in Appendix 1-2, wherein the first side portion (41) of the first straight portion (36) is formed by a pair of sinusoidal curves (47A, 47B) extending along the longitudinal direction of the first straight portion (36).

[0112] This configuration allows stress to be distributed in each of the pair of first side sections of the first straight section.

[0113] [Appendix 1-4] The semiconductor device (1) as described in Appendix 1-3, wherein, in a direction intersecting the longitudinal direction of the first straight section (36), the curved convex portion (48) of one of the sinusoidal curves (47A) faces the curved concave portion (49) of the other sinusoidal curve (47B), and the curved convex portion (48) of the other sinusoidal curve (47B) faces the curved concave portion (49) of one of the sinusoidal curves (47A).

[0114] In this configuration, curved protrusions (curved recesses) are alternately formed on the first side of one side and the first side of the other side along the longitudinal direction of the first straight section. For example, consider the case where the stress in at least one of the curved protrusions and curved recesses (for example, the curved protrusions) is reduced compared to the other (for example, the curved recesses). In this case, the stress relaxation areas in the first straight section do not appear intermittently along the longitudinal direction of the first straight section, but rather appear alternately and continuously on the first side of one side and the first side of the other side. Therefore, the bias in the stress relaxation areas in the first straight section can be reduced.

[0115] [Appendix 1-5] The base portion (40) is formed in a strip shape having a first width (W2). The semiconductor device (1) according to any one of the appendices 1-2 to 1-4, wherein the first width (W2) of the base portion (40) is 5 times or more the amplitude (A1) of the sine curve (47).

[0116] This configuration allows for stress distribution in the first conductive layer by forming curved convex and concave sections with a sinusoidal curve having an amplitude of approximately 1 / 5 of the width of the existing first conductive layer (e.g., wiring, electrodes, etc.). Conversely, even when a stress distribution structure is formed by curved convex and concave sections, the first width of the base can be maintained relatively wide. As a result, a wide range of options for joining members (shape, thickness, etc.) that can be joined to the base can be maintained.

[0117] [Appendix 1-6] The first conductive layer (25) includes a tip portion (39) which includes a part of the first straight portion (36), and a second straight portion (37) which is connected to the first straight portion (36) via a corner portion (38). The semiconductor device (1) according to any one of the appendices 1-2 to 1-5, wherein the sinusoidal curve (47) is selectively formed on the first linear portion (36) of the first linear portion (36) and the second linear portion (37).

[0118] With this configuration, curved convex and curved concave sections are formed by a sinusoidal curve in the first straight section, including the tip where stress is likely to occur due to fluctuations in ambient temperature, so that stress can be effectively distributed in the first conductive layer.

[0119] [Appendix 1-7] The tip portion (39) of the first conductive layer (25) has a first side surface (52) formed by a first circular arc (51) having a first radius of curvature (R1) in a plan view, The semiconductor device (1) according to Appendix 1-6, wherein at least one of the curved convex portion (48) and the curved concave portion (49) of the sinusoidal curve (47) has a second side surface (54) formed by a second circular arc (53) having a second radius of curvature (R2) smaller than the first radius of curvature (R1) in a plan view.

[0120] [Appendix 1-8] The first conductive layer (25), in cross-sectional view, includes a first base layer (26) and a first coating layer (27) laminated on the first base layer (26) so as to protrude laterally from the end face (29) of the first base layer (26). The semiconductor device (1) according to any one of the appendices 1-1 to 1-7, wherein the first side portion (41), including the convex portions (44, 48) and the concave portions (45, 49), is selectively formed on the first coating layer (27).

[0121] According to this configuration, the first side portion, including the convex and concave portions, is selectively formed in the first coating layer and does not necessarily have to be formed in the first base layer. Therefore, the number of steps in the formation process of the convex and concave portions can be reduced.

[0122] [Appendix 1-9] The semiconductor device (1) according to any one of the appendices 1-1 to 1-8, wherein the organic insulating layer (55) has a pad opening (56) that exposes the base portion (40) of the first linear portion (36) as a pad (14).

[0123] With this configuration, a bonding member such as a bonding wire can be connected to the base portion of the first straight section through the pad opening.

[0124] [Appendix 1-10] A semiconductor device (1) according to any one of the appendices 1-1 to 1-8, further comprising a second conductive layer (59) connected to the base portion (40) of the first linear portion (36) within the organic insulating layer (55).

[0125] With this configuration, the aforementioned stress distribution structure suppresses the deterioration of the mechanical properties of the organic insulating layer surrounding the second conductive layer. Therefore, the reliability of the connection between the first conductive layer (first linear section) and the second conductive layer can be improved.

[0126] [Appendix 1-11] The second conductive layer (59) has a third linear portion (72) that extends along the main surface (11) of the semiconductor chip (4,15), The semiconductor device (1) according to Appendix 1-10, wherein the third linear portion (72) includes a second side portion (75) that, in a plan view, includes a second convex portion (77, 81) projecting in a direction intersecting the longitudinal direction of the third linear portion (72) and a second concave portion (78, 82) recessed relative to the second convex portion (77, 81).

[0127] With this configuration, since the second side of the third linear section includes a second convex portion and a second concave portion, the stress generated on the second side of the third linear section can be distributed. As a result, the stress on the second side of the third linear section of the second conductive layer can be reduced overall. Consequently, the strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0128] [Appendix 1-12] The second conductive layer (59), in cross-sectional view, includes a second base layer (60) and a second coating layer (61) laminated on the second base layer (60) so as to protrude laterally from the end face (63) of the second base layer (60). The semiconductor device (1) according to Appendix 1-11, wherein the second side portion (75), including the second protrusions (77, 81) and the second recesses (78, 82), is selectively formed on the second coating layer (61).

[0129] With this configuration, the second side portion, including the second protrusion and the second recess, is selectively formed in the second coating layer and does not need to be formed in the second base layer. Therefore, the number of steps required to form the second protrusion and the second recess can be reduced.

[0130] [Appendix 1-13] A semiconductor device (1) according to any one of the appendices 1-1 to 1-12, comprising an insulating layer laminate structure (17) formed between the first conductive layer (25) and the semiconductor chip (4, 15), and including at least a first inorganic insulating layer (18, 57) and a second inorganic insulating layer (19, 58) laminated on the first inorganic insulating layer (18, 57).

[0131] [Appendix 1-14] A semiconductor device (1) according to any one of the appendices 1-1 to 1-13, comprising an integrated circuit element (16) formed on the semiconductor chip (4, 15) and electrically connected to the first conductive layer (25).

[0132] With this configuration, as described above, the stress on the first side of the first linear portion of the first conductive layer can be reduced, making it possible to provide a semiconductor device including an integrated circuit with high insulation reliability of the organic insulating layer.

[0133] [Note 2-1] Semiconductor chips (4,15) and A first wiring layer (25) is formed on the semiconductor chip (4,15) and extends along the main surface (11) of the semiconductor chip (4,15), The semiconductor chip (4,15) includes an organic insulating layer (55) formed on the semiconductor chip (4,15) and covering the first wiring layer (25), The semiconductor device (1) has a first wiring layer (25) having a first side portion (41) that includes a zigzag shape (47) formed along the extending direction of the first wiring layer (25) in a plan view.

[0134] For example, if the first side of the first wiring layer is straight, fluctuations in ambient temperature may cause high stress to be generated in the first side of the first wiring layer due to the difference in thermal expansion coefficients between the first wiring layer and the organic insulating layer. When this stress causes an external force to be applied to the organic insulating layer during expansion and contraction due to temperature changes, strain may occur in the organic insulating layer, potentially degrading its mechanical properties. However, in the semiconductor device according to this embodiment, since the first side of the first wiring layer includes a zigzag shape, the stress generated in the first side of the first wiring layer can be distributed. This reduces the overall stress on the first side of the first wiring layer. As a result, strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0135] [Note 2-2] The semiconductor device (1) described in Appendix 2-1, wherein the top of the zigzag shape (47) is formed by a first circular arc (53) having a first radius of curvature (R2) in a plan view.

[0136] With this configuration, the curved top of the zigzag shape prevents stress from concentrating at that top.

[0137] [Appendix 2-3] The semiconductor device (1) as described in Appendix 2-2, wherein the first side portion (41) of the first wiring layer (25) is formed by a pair of zigzag shapes (47A, 47B) extending along the direction of extension of the first wiring layer (25).

[0138] This configuration allows stress to be distributed across each of the pair of first sides of the first wiring layer.

[0139] [Appendix 2-4] The semiconductor device (1) as described in Appendix 2-3, wherein, in a direction intersecting the extending direction of the first wiring layer (25), the protrusions (44, 48) of one of the zigzag shapes (47A) face the recesses (45, 49) of the other zigzag shape (47B), and the protrusions (44, 48) of the other zigzag shape (47B) face the recesses (45, 49) of one of the zigzag shapes (47A).

[0140] In this configuration, protrusions (recesses) are alternately formed on the first side of one side and the first side of the other side along the longitudinal direction of the first wiring layer. For example, consider the case where the stress in at least one of the protrusions and recesses (e.g., a protrusion) is reduced compared to the other (e.g., a recess). In this case, the stress relaxation areas in the first wiring layer do not appear intermittently along the longitudinal direction of the first wiring layer, but rather appear alternately and continuously on the first side of one side and the first side of the other side. Therefore, the uneven distribution of stress relaxation areas in the first wiring layer can be reduced.

[0141] [Appendix 2-5] The first wiring layer (25) includes a first straight section (36) including a tip (39) and a second straight section (37) connected to the first straight section (36) via a corner section (38). The semiconductor device (1) according to any one of the appendices 2-2 to 2-4, wherein the zigzag shape (47) is selectively formed on the first straight portion (36) of the first straight portion (36) and the second straight portion (37).

[0142] With this configuration, a zigzag shape is formed in the first straight section, including the tip where stress is likely to occur due to fluctuations in ambient temperature, thus effectively distributing stress in the first wiring layer.

[0143] [Appendix 2-6] The semiconductor device (1) as described in Appendix 2-5, wherein the leading edge of the first wiring layer (25) is formed by a second arc (51) having a second radius of curvature (R1) that is larger than the first radius of curvature (R2) in a plan view.

[0144] [Appendix 2-7] The first wiring layer (25), in cross-sectional view, includes a first base layer (26) and a first coating layer (27) laminated on the first base layer (26) so as to protrude laterally from the end face (29) of the first base layer (26). The semiconductor device (1) according to any one of the appendices 2-1 to 2-6, wherein the first side portion (41) including the zigzag shape (47) is selectively formed on the first coating layer (27).

[0145] With this configuration, the first side portion including the zigzag shape is selectively formed in the first coating layer and does not necessarily have to be formed in the first base layer. Therefore, the number of steps in the zigzag shape formation process can be reduced.

[0146] [Appendix 2-8] The semiconductor device (1) according to any one of the appendices 2-1 to 2-7, wherein the organic insulating layer (55) has a pad opening (56) that exposes the first wiring layer (25) as a pad (14).

[0147] With this configuration, bonding members such as bonding wires can be connected to the first wiring layer through the pad opening.

[0148] [Appendix 2-9] A semiconductor device (1) according to any one of the appendices 2-1 to 2-7, further comprising a second wiring layer (59) connected to the first wiring layer (25) within the organic insulating layer (55).

[0149] With this configuration, the aforementioned stress distribution structure suppresses the deterioration of the mechanical properties of the organic insulating layer surrounding the second wiring layer. Therefore, the connection reliability between the first and second wiring layers can be improved.

[0150] [Appendix 2-10] The semiconductor device (1) according to Appendix 2-9, wherein the second wiring layer (59) has a second side portion (75) that includes a second zigzag shape (80) formed along the extension direction of the second wiring layer (59) in a plan view.

[0151] With this configuration, the second side of the second wiring layer includes a second zigzag shape, which allows the stress generated on the second side of the second wiring layer to be distributed. As a result, the overall stress on the second side of the second wiring layer can be reduced. Consequently, the strain generated in the organic insulating layer during expansion and contraction due to temperature changes can be suppressed.

[0152] [Appendix 2-11] The second wiring layer (59), in cross-sectional view, includes a second base layer (60) and a second coating layer (61) laminated on the second base layer (60) so as to protrude laterally from the end face (63) of the second base layer (60). The semiconductor device (1) according to Appendix 2-10, wherein the second side portion (75) including the second zigzag shape (80) is selectively formed on the second coating layer (61).

[0153] In this configuration, the second side portion, which includes the second zigzag shape, is selectively formed in the second coating layer and does not necessarily have to be formed in the second base layer. Therefore, the number of steps required to form the second zigzag shape can be reduced.

[0154] [Appendix 2-12] A semiconductor device (1) according to any one of the appendices 2-1 to 2-11, comprising an insulating layer laminate structure (17) formed between the first wiring layer (25) and the semiconductor chip (4, 15), and including at least a first inorganic insulating layer (18, 57) and a second inorganic insulating layer (19, 58) laminated on the first inorganic insulating layer (18, 57).

[0155] [Appendix 2-13] A semiconductor device (1) according to any one of the appendices 2-1 to 2-12, comprising an integrated circuit element (16) formed on the semiconductor chip (4, 15) and electrically connected to the first wiring layer (25).

[0156] With this configuration, as described above, the stress on the first side of the first wiring layer can be reduced, making it possible to provide a semiconductor device including an integrated circuit with high insulation reliability of the organic insulating layer.

[0157] [Note 3-1] Semiconductor substrate (4,15) and A first conductive member (25) is formed on the semiconductor substrate (4,15) and has a first straight portion (36) extending along the main surface (11) of the semiconductor substrate (4,15) and has a first coefficient of thermal expansion, The semiconductor substrate (4,15) is formed on the semiconductor substrate (4,15), covers the first conductive member (25), and includes a resin layer (55) having a second thermal expansion coefficient higher than the first thermal expansion coefficient. The semiconductor device (1) includes a first side edge portion (46) formed by a curve (47) that alternately curves to one side and the other side in a direction intersecting the longitudinal direction of the first straight portion (36) in a plan view.

[0158] For example, if the first side edge of the first straight section is straight, when the ambient temperature fluctuates, the resin layer expands more than the first conductive member. Due to this difference in thermal expansion coefficients, high stress may be generated on the first side of the first straight section. When this stress causes an external force to be applied to the resin layer during expansion and contraction due to temperature changes, strain may occur in the resin layer, potentially degrading its mechanical properties. However, in the semiconductor device according to this embodiment, since the first side edge is formed with a curve, the stress generated on the first side of the first straight section can be distributed. This reduces the overall stress on the first side of the first straight section of the first conductive member. As a result, strain generated in the resin layer during expansion and contraction due to temperature changes can be suppressed.

[0159] [Note 3-2] The first straight portion (36) includes a base portion (40) to which a joining member can be connected, and a first side portion (41) which includes protrusions (44, 48) projecting from the base portion (40) in a direction intersecting the longitudinal direction of the first straight portion (36), and recesses (45, 49) recessed relative to the protrusions (44, 48). The semiconductor device (1) as described in Appendix 3-1, wherein the first side edge (46) is formed in a plan view by a curve (47) that continuously connects the convex portions (44, 48) and the concave portions (45, 49) along the longitudinal direction of the first straight portion (36).

[0160] With this configuration, the stress generated in the first side portion, including the convex and concave portions, is distributed, so even if further stress is applied to the first straight portion when connecting the joining member to the base portion of the first straight portion, the deterioration of the mechanical properties of the resin layer can be suppressed. Furthermore, the stress distribution structure is constructed by selectively forming convex and concave portions on the first side portion of the first straight portion, rather than the first conductive member being meandering and S-shaped overall. Therefore, since there is no need to increase the installation space for the first conductive member according to this embodiment, the size of the semiconductor device can be suppressed.

[0161] [Appendix 3-3] The base portion (40) is formed in a strip shape having a first width (W2), The semiconductor device (1) as described in Appendix 3-2, wherein the first width (W2) of the base portion (40) is 10 times or more the amount (P1) of the protrusions (44, 48) from the base portion (40).

[0162] This configuration allows for stress distribution in the first conductive member by forming a protrusion that is approximately 1 / 10th the width of the existing first conductive member (e.g., wiring, electrodes, etc.). Conversely, even when a stress distribution structure is formed by the protrusions and recesses, the first width of the base can be maintained relatively wide. As a result, a wide range of options for joining members (shape, thickness, etc.) that can be joined to the base can be maintained.

[0163] [Appendix 3-4] The first conductive member (25) includes a tip portion (39) which includes a part of the first straight portion (36), and a second straight portion (37) which is connected to the first straight portion (36) via a corner portion (38). The semiconductor device (1) according to any one of the appendices 3-1 to 3-3, wherein the first side edge portion (46) is selectively formed on the first straight portion (36) of the first straight portion (36) and the second straight portion (37).

[0164] With this configuration, a curved first side edge is formed on the first straight section, which includes the tip where stress is likely to occur due to fluctuations in ambient temperature, thus effectively distributing stress in the first conductive member.

[0165] [Appendix 3-5] The tip portion (39) of the first conductive member (25) has a first side surface (52) formed by a first circular arc (51) having a first radius of curvature (R1) in a plan view, The semiconductor device according to Appendix 3-4, wherein the first side edge (46) of the first conductive member (25) has a second side surface (54) formed by a second arc (53) having a second radius of curvature (R2) smaller than the first radius of curvature (R1) in a plan view.

[0166] [Appendix 3-6] The first conductive member (25), in cross-sectional view, includes a first base layer (26) and a first coating layer (27) laminated on the first base layer (26) so as to protrude laterally from the end face (29) of the first base layer (26). The semiconductor device (1) described in any one of the appendices 3-1 to 3-5, wherein the first side edge (46) is selectively formed on the first coating layer (27).

[0167] With this configuration, the curved first side edge is selectively formed on the first coating layer and does not necessarily have to be formed on the first base layer. Therefore, the number of steps in the formation process of the first side edge can be reduced.

[0168] [Appendix 3-7] The semiconductor device (1) as described in Appendix 3-2, wherein the resin layer (55) has a pad opening (56) that exposes the base portion (40) of the first straight portion (36) as a pad (14).

[0169] With this configuration, a bonding member such as a bonding wire can be connected to the base portion of the first straight section through the pad opening.

[0170] [Appendix 3-8] The semiconductor device (1) according to Appendix 3-2, further comprising a second conductive member (59) connected to the base portion (40) of the first linear portion (36) within the resin layer (55).

[0171] With this configuration, the aforementioned stress distribution structure suppresses the deterioration of the mechanical properties of the resin layer surrounding the second conductive member. Therefore, the reliability of the connection between the first conductive member (first straight section) and the second conductive member can be improved.

[0172] [Appendix 3-9] The second conductive member (59) has a third straight portion (72) that extends along the main surface (11) of the semiconductor substrate (4,15), The semiconductor device (1) according to Appendix 3-8, wherein the third straight portion (72) includes a second side edge portion (79) formed by a curve (80) that alternately curves to one side and the other side in a direction intersecting the longitudinal direction of the third straight portion (72) in a plan view.

[0173] With this configuration, since the second side edge is formed with a curve, the stress generated on the second side of the third straight section can be distributed. As a result, the stress on the second side of the third straight section of the second conductive member can be reduced overall. Consequently, the strain generated in the resin layer during expansion and contraction due to temperature changes can be suppressed.

[0174] [Appendix 3-10] The second conductive member (59), in cross-sectional view, includes a second base layer (60) and a second coating layer (61) laminated on the second base layer (60) so as to protrude laterally from the end face (63) of the second base layer (60). The semiconductor device (1) according to Appendix 3-8 or Appendix 3-9, wherein the second side edge (79) is selectively formed on the second coating layer (61).

[0175] With this configuration, the curved second side edge is selectively formed in the second coating layer and does not necessarily have to be formed in the second base layer. Therefore, the number of steps in the process of forming the second side edge can be reduced.

[0176] [Appendix 3-11] A semiconductor device (1) according to any one of the appendices 3-1 to 3-10, comprising an insulating layer laminate structure (17) formed between the first conductive member (25) and the semiconductor substrate (4, 15), and including at least a first inorganic insulating layer (18, 57) and a second inorganic insulating layer (19, 58) laminated on the first inorganic insulating layer (18, 57).

[0177] [Appendix 3-12] A semiconductor device (1) according to any one of the appendices 3-1 to 3-11, comprising an integrated circuit element (16) formed on the semiconductor substrate (4, 15) and electrically connected to the first conductive member (25).

[0178] With this configuration, as described above, the stress on the first side of the first straight portion of the first conductive member can be reduced, making it possible to provide a semiconductor device including an integrated circuit with high insulation reliability of the resin layer.

[0179] This application corresponds to Japanese Patent Application No. 2021-43633, filed with the Japan Patent Office on March 17, 2021, and the full disclosure of this application is incorporated herein by reference.

[0180] 1: Semiconductor device 2: Sealing resin 3: Die pad 4: Semiconductor chips 5: Conductive bonding material 6: Lead terminals 7: Conductor 8: First main surface 9: Second main surface 10A: First side 10B: 2nd side 10C: 3rd side 10D: 4th side 11: First main surface 12: Second main surface 13: Element area 13A: Diode region 13B: Transistor region 13C: Resistive element region 14: Pad 15: Semiconductor substrates 16: Functional elements 17: Insulating layer laminated structure 18: First insulating layer 19: Second insulating layer 20: Third insulating layer 21: Fourth insulating layer 22: Fifth insulating layer 23: Wiring 24: Beer 25: First conductive member 26: First base layer 27: 1st coating layer 28: First covering section 29: End face 30: 1st protrusion 31: End face 32: First step 33:Top surface 34: 1st layer 35: 2nd layer 36: 1st straight section 37: 2nd straight section 38: Corner section 39:Tip 40: First base section 41: First side 42: First boundary section 43: First boundary section 44: First protrusion 45: First recess 46:First side edge 47: Sine curve 47A: Sine curve 47B: Sine curve 48: First curved convex section 49: First curved recess 50: First reference line 51: First arc 52 :1st side 53: Second arc 54:Second side 55 :Protective layer 56: Pad opening 57: First insulating layer 58: Second insulating layer 59: Second conductive member 60: Second base layer 61:Second coating layer 62: Second covering section 63: End face 64:Second protrusion 65: End face 66: Second step 67:Top surface 68: 1st layer 69: 2nd layer 70: Connection part 71: Bending section 72: 3rd straight section 73:Tip 74: Second base section 75: Second side 76: Second boundary section 77: Second convex part 78: Second recess 79:Second side edge 80: Sine curve 80A: Sine curve 80B: Sine curve 81: Second curved convex section 82: Second curved recess 83: Second reference line 84: Third arc 85:Third side 86: Fourth arc 87: Fourth side view 88: Lateral area 89: Wiring 90: Lateral region 91: Wiring A1: Amplitude A2: Amplitude P1: Protrusion Amount P2: Prominence R1: First radius of curvature R2: Second radius of curvature R3: Third radius of curvature R4: 4th radius of curvature W1: width W2: The 1st picture W3: Page W4: 2nd picture X1: First direction X2: Third direction Y1: Second direction Y2: 4th direction

Claims

1. Semiconductor chips and A first conductive layer formed on the semiconductor chip and having a first linear portion extending along the main surface of the semiconductor chip, The semiconductor chip includes an organic insulating layer formed on the semiconductor chip and covering the first conductive layer, A semiconductor device wherein the first linear portion includes a base portion having a joining region to which a joining member can be connected, and a first side portion including a convex portion projecting from the base portion in a direction intersecting the longitudinal direction of the first linear portion, and a recessed portion recessed relative to the convex portion.

2. The semiconductor device according to claim 1, wherein the convex portion and the concave portion include a plurality of curved convex portions and a plurality of curved concave portions that are alternately formed by a sinusoidal curve extending along the longitudinal direction of the first straight portion.

3. The semiconductor device according to claim 2, wherein the first side portion of the first straight portion is formed by a pair of sinusoidal curves extending along the longitudinal direction of the first straight portion.

4. The semiconductor device according to claim 3, wherein, in a direction intersecting the longitudinal direction of the first straight section, the curved convex portion of one sine curve faces the curved concave portion of the other sine curve, and the curved convex portion of the other sine curve faces the curved concave portion of the one sine curve.

5. The base portion is formed in the shape of a strip having a first width. The semiconductor device according to any one of claims 2 to 4, wherein the first width of the base portion is five times or more the amplitude of the sine curve.

6. The first conductive layer includes a tip portion which includes a part of the first straight portion, and a second straight portion which is connected to the first straight portion via a corner portion. The semiconductor device according to any one of claims 2 to 5, wherein the sinusoidal curve is selectively formed on the first linear portion of the first linear portion and the second linear portion.

7. The leading edge of the first conductive layer has a first side surface formed by a first arc having a first radius of curvature in a plan view, The semiconductor device according to claim 6, wherein at least one of the curved convex portion and the curved concave portion of the sine curve has a second side surface formed by a second circular arc having a second radius of curvature smaller than the first radius of curvature in a plan view.

8. The first conductive layer, in cross-sectional view, includes a first base layer and a first coating layer laminated on the first base layer so as to protrude laterally from the end face of the first base layer. The semiconductor device according to any one of claims 1 to 7, wherein the first side portion including the convex portion and the concave portion is selectively formed in the first coating layer.

9. The semiconductor device according to any one of claims 1 to 8, wherein the organic insulating layer has a pad opening that exposes the base portion of the first linear portion as a pad.

10. The semiconductor device according to any one of claims 1 to 8, further comprising a second conductive layer connected to the base portion of the first linear portion within the organic insulating layer.

11. The second conductive layer has a third linear portion that extends along the main surface of the semiconductor chip, The semiconductor device according to claim 10, wherein the third linear portion includes, in a plan view, a second side portion including a second convex portion projecting in a direction intersecting the longitudinal direction of the third linear portion and a second recess recessed relative to the second convex portion.

12. The second conductive layer, in cross-sectional view, includes a second base layer and a second coating layer laminated on the second base layer so as to protrude laterally from the end face of the second base layer. The semiconductor device according to claim 11, wherein the second side portion including the second convex portion and the second recess is selectively formed in the second coating layer.

13. A semiconductor device according to any one of claims 1 to 12, comprising an insulating layer laminate structure formed between the first conductive layer and the semiconductor chip, and including at least a first inorganic insulating layer and a second inorganic insulating layer laminated on the first inorganic insulating layer.

14. The semiconductor device according to any one of claims 1 to 13, comprising an integrated circuit element formed on the semiconductor chip and electrically connected to the first conductive layer.

Images