3D modeling of pressure flow within a processing chamber
A computer-implemented method using a digital model and subset pressure sensors addresses the challenge of direct pressure measurement in vacuum chambers by deriving a 3D pressure distribution, enabling precise pressure control and predictive maintenance.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- VAT HOLDING AG
- Filing Date
- 2025-11-14
- Publication Date
- 2026-05-27
AI Technical Summary
Existing methods for determining pressure within a vacuum chamber during processing are hindered by the difficulty of placing pressure sensors near the object, which can affect the processing and be influenced by the process conditions, necessitating an improved method to accurately determine pressure without direct measurement.
A computer-implemented method using a digital model and a subset of pressure sensors to derive a 3D pressure distribution model, allowing pressure determination in a target area without direct sensor placement, achieved through a training process involving fluid flow changes and pressure value acquisition.
Enables precise pressure control and prediction in the target area, facilitating high-precision processing and predictive maintenance by deriving pressure distribution models without direct sensor placement, improving system reliability and efficiency.
Smart Images
Figure 2026087518000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a computer-implemented method for determining the pressure within a target area of a processing chamber. The pressure flow within the processing chamber is modeled in a training process using a plurality of pressure sensors, such that during the application of a process within the processing chamber, the pressure within the target area can be determined using only a subset of these pressure sensors, for example, only a single pressure sensor.
[0002] Vacuum applications are typically carried out within a vacuum chamber system. These applications are carried out, for example, in the fields of IC manufacturing, semiconductor manufacturing, or substrate manufacturing and need to be performed in a protected atmosphere free of contaminating particles.
[0003] For example, German Patent No. 102023001573 discloses a vacuum system for processing an object. The vacuum system comprises an evacuable vacuum chamber configured to receive a semiconductor element or a substrate to be processed or manufactured. The chamber comprises at least one opening through which the semiconductor element or other substrate can be inserted into and removed from the vacuum chamber. For example, in a manufacturing plant for semiconductor wafers or liquid crystal substrates, highly sensitive semiconductor or liquid crystal elements pass sequentially through several processing vacuum chambers, and the components located within the processing vacuum chambers are processed by processing devices. Two vacuum valves and pressure sensors enable adjustment of the pressure within the vacuum chamber.
[0004] A pressure sensor can only determine the pressure at the location being measured. However, the pressure can change within the vacuum chamber while fluid is flowing, i.e., when the vacuum valve is controlled to allow fluid flow into and / or out of the processing chamber. It is desirable to directly determine the pressure within the area of the vacuum chamber, i.e., where the object being processed is located. However, placing a pressure sensor in the area of the area, i.e., next to the object, is difficult and cumbersome. On the one hand, the presence of the sensor may adversely affect the processing of the object. On the other hand, process conditions in the area of the area, and the presence of the object, may affect the sensor reading.
[0005] Therefore, an object of the present invention is to provide an improved method for determining the pressure within a target area while an object is being processed within that area of a vacuum chamber.
[0006] A specific objective is to provide a method that eliminates the need to directly measure pressure values collected within a target area while an object is being processed.
[0007] At least one of these objectives is achieved by the computer implementation method described in claim 1, the system described in claim 11, and / or a dependent claim of the present invention.
[0008] A first aspect of the present invention relates to a computer implementation method for determining the pressure within a target area of a processing chamber. The processing chamber comprises a support structure for supporting an object to be processed within the processing chamber, at least one controllable fluid inlet, at least one controllable fluid outlet, and a set of pressure sensors, wherein the set of pressure sensors comprises a plurality of pressure sensors.
[0009] This method includes providing a digital model of a processing chamber and conducting a training process, the training process being: - Applying a predetermined change in chamber pressure by changing the fluid flow within the processing chamber, wherein changing the fluid flow includes providing at least one predetermined fluid flow into the processing chamber by at least one fluid inlet and providing at least one predetermined fluid flow out of the processing chamber by at least one fluid outlet. - During changes in chamber pressure, a series of pressure values are obtained by a set of pressure sensors, Includes.
[0010] Next, the method includes deriving a three-dimensional pressure distribution model that provides information about the pressure in at least the target region, based on a digital model of the processing chamber and a series of acquired pressure values. The method further includes performing a pressure determination process to determine the target pressure associated with the target region. The determination process is: - Measuring one or more pressure values using a subset of multiple pressure sensors, - Determining the target pressure based on a 3D pressure distribution model and one or more pressure values, Includes.
[0011] According to some embodiments of this method, a subset of pressure sensors comprises fewer pressure sensors than a set of pressure sensors. For example, a subset of pressure sensors may comprise exactly one pressure sensor. Optionally, after the training process is completed, the method includes "blanking," e.g., blocking or physically removing one or more pressure sensors from the set of pressure sensors from the processing chamber.
[0012] In some embodiments of this method, none of the pressure sensors in a subset of pressure sensors are located within the target area. In some embodiments, none of the pressure sensors in a set of pressure sensors are located within the target area.
[0013] According to some embodiments of this method, one or more pressure values are measured within a first region of the processing chamber, the first region relating to the spatial arrangement of a subset of pressure sensors, and the target region being different from the first region.
[0014] According to some embodiments of this method, a set of pressure sensors comprises at least a first pressure sensor and a second pressure sensor, a series of pressure values are acquired by the first and second pressure sensors, and a pressure distribution model is derived by processing the pressure information from the first and second pressure sensors.
[0015] In some embodiments, the first pressure sensor is positioned at a first location relating to a first region of the pressure chamber (the first region being distinct from the target region), and one or more pressure values are measured by the first pressure sensor alone. In these embodiments, determining the target pressure includes processing one or more pressure values and a pressure distribution model, and deriving the target pressure based on the processing of one or more pressure values and the pressure distribution model.
[0016] In some embodiments, the second pressure sensor is not part of a subset of pressure sensors, and in particular, after performing the training process, the second pressure sensor is "blanked," for example, by being shut off or physically removed from the processing chamber.
[0017] According to some embodiments of this method, each pressure sensor in a set of pressure sensors monitors changes in pressure and provides an individual pressure profile based on the monitored changes in pressure, and the acquisition of a series of pressure values is provided.
[0018] In some embodiments, deriving a pressure distribution model includes comparing individual pressure profiles provided by each of the pressure sensors and deriving the progression of pressure changes through the processing chamber. For example, the progression of pressure changes may be derived by processing individual pressure profiles and time information related to the training process.
[0019] According to some embodiments of this method, the target pressure is related to a processing area within a processing chamber, the processing area comprises at least partially a support structure, and in particular, the processing area is the target area.
[0020] According to some embodiments, the method includes a predictive maintenance process that includes determining a deviation from a pressure distribution model based on one or more pressure values, and predicting the need for maintenance of the processing chamber or its components (e.g., valves or pumps) based on the deviation. Predicting the need for maintenance may include identifying a failure of a component of the processing chamber. Optionally, during the predictive maintenance process, one or more pressure values are measured by a set of pressure sensors.
[0021] According to some embodiments, the method includes a chamber matching process that comprises comparing a pressure distribution model with a pressure distribution model of another processing chamber (e.g., a pressure distribution model of the same or essentially the same processing chamber) and, based on the comparison, identifying problems with components of the processing chamber (e.g., valves or pumps).
[0022] A second aspect of the present invention relates to a vacuum processing system comprising a processing chamber and a controller.
[0023] The processing chamber is - A support structure that supports the object to be processed in the processing chamber, - at least one controllable fluid inlet and at least one controllable fluid outlet, - A set of pressure sensors, wherein the set of pressure sensors comprises multiple pressure sensors, It is equipped with.
[0024] The controller is -Processing a three-dimensional pressure distribution model of a processing chamber, wherein the pressure distribution model provides information regarding the pressure within at least one predetermined region of the processing chamber; -Measuring one or more pressure values by at least a subset of a plurality of pressure sensors; -Determining a target pressure based on the pressure distribution model and the one or more pressure values; configured to determine a target pressure within a target region of the processing chamber.
[0025] According to some embodiments of the system, the controller is configured to derive a pressure distribution model, and deriving the pressure distribution model comprises performing a training process, wherein: -Applying a predetermined change in chamber pressure by changing a fluid flow within the processing chamber, wherein changing the fluid flow comprises providing at least one predetermined fluid flow into the processing chamber by at least one fluid inlet and providing at least one predetermined fluid flow out of the processing chamber by at least one fluid outlet; -Acquiring a series of pressure values by a set of pressure sensors during the change in chamber pressure; wherein performing the training process comprises the above.
[0026] Deriving the pressure distribution model further comprises processing a digital model of the processing chamber together with the series of pressure values, and deriving the pressure distribution model based on the processing of the digital model and the series of pressure values.
[0027] According to some embodiments of the system, the controller is configured to control the measurement of one or more pressure values at a location or region different from the target region, and in particular, none of the pressure sensors of a subset of the pressure sensors is disposed in the target region.
[0028] According to some embodiments of the system, the controller is according to the method of the first aspect of the present invention. -Implement the training process (120), - Deriving the pressure distribution model (13) (130), - Determining the target pressure (16) (160) It is configured to implement and control this.
[0029] A third aspect of the present invention relates to a computer program product stored in a machine-readable carrier, in particular in a controller of a system according to a second aspect of the present invention, or a computer program product embodied by electromagnetic waves having a program code segment having program code for performing or controlling the method according to a first aspect of the present invention, wherein the computer program product comprises computer executable instructions for performing the method, and in particular, the computer program product is configured such that when executed, the steps of the method are performed automatically.
[0030] The present invention will be described in detail below with reference to exemplary embodiments accompanied by drawings. [Brief explanation of the drawing]
[0031] [Figure 1] This figure shows a first embodiment of the vacuum processing system according to the present invention. [Figure 2] This figure shows a second embodiment of the vacuum processing system according to the present invention. [Figure 3] This figure shows a first embodiment of the method according to the present invention. [Figure 4] This figure shows the derivation of the pressure profile within the target area based on multiple measured pressure profiles. [Figure 5] This diagram shows the inputs and outputs of the control unit. [Figure 6] This figure shows the data flow in the control unit implementing this method.
[0032] Figure 1 schematically shows the structure of a first embodiment of a vacuum processing system 1 according to the present invention for processing an object 5, such as a semiconductor wafer, under vacuum conditions. The structure includes a vacuum volume 2 (processing chamber), a first vacuum valve 32, and a second vacuum valve 34. A fluid inlet 22 connects the processing chamber 2 to the first vacuum valve 32, and a fluid outlet 24 connects the processing chamber 2 to the second vacuum valve 34.
[0033] The first vacuum valve 32 may be an (upstream) vent valve, which, when opened, allows for the inflow of a mass or volume of fluid into the chamber 2. The vacuum valve 32 is designed as a control valve, thus allowing for a controlled setting of the opening cross-section, and therefore the setting of the amount of fluid flowing through the valve 32 per unit time. The fluid may be, for example, a process gas, a precursor gas, or an (inert) gas used to clean the chamber 2. The fluid source may be provided as a tank or together with a mass flow controller (MFC).
[0034] The second vacuum valve 34 may be a (downstream) exhaust valve, which, when opened, results in the outflow of a mass or volume of fluid from the chamber. The vacuum valve 34 is also designed as a regulating valve, thus allowing for a controlled setting of the opening cross-section, and therefore the setting of the amount of fluid flowing through the valve 34 per unit time. In addition to connection to volume 2, the second vacuum valve 34 is preferably connected to a vacuum pump, thus resulting in the pumping of fluid from volume 2. Compared to a simple "on / off" valve, a vacuum regulating valve offers the advantage that each flow can be set with great precision by such a valve. Combined with the present invention, this can result in further improvements in the regulation of the internal chamber pressure.
[0035] The vacuum system 1 also includes pressure sensors 25 and 26. The pressure sensors 25 and 26 are connected to the vacuum volume 2 so that the current actual pressure in the vacuum volume 2 can be determined by the sensors 25 and 26.
[0036] Furthermore, the vacuum system 1 includes a control unit 3. The control unit 3 is connected to pressure sensors 25 and 26, a first vacuum valve 32, and a second vacuum valve 34.
[0037] The connection to the pressure sensor 25 is preferably unidirectional, i.e., the control unit 3 receives pressure information provided by the pressure sensor 25. On the other hand, the connection to the two valves 32 and 34 can be unidirectional or bidirectional, i.e., the valves 32 and 34 can receive signals to control and change the valve opening on the one hand, and the connection can be designed so that the control unit 3 receives information from each valve, in particular information regarding the opening state.
[0038] The control unit 3 may be designed to adjust the actual pressure based on a predetermined target pressure in the vacuum volume 2. The predetermined target pressure defines negative and positive pressure ranges. The adjustment of the actual pressure relates, in particular, to the adjustment or control of the pressure within the vacuum volume for the processing process. For this purpose, the control unit 3 has a correspondingly configured adjustment function. The adjustment function can be implemented, in particular, as an algorithm or as a computer implementation method. The actual pressure is adjusted by continuously recording the actual pressure using a pressure sensor 25 and controlling two valves 22, 24 accordingly.
[0039] In the fluid flow entering and leaving chamber 2 (i.e., through one or both of the two valves 22 and 24), the pressure within the chamber changes, for example, depending on the position within the chamber relative to valves 22 and 24. With respect to the target pressure, the three-dimensional target area 20 is around the object 5 being processed (processing area), but the pressure sensors 25 and 26 are located outside the processing area and therefore cannot directly measure the pressure within the target area 20. As a result, the control unit 3 is configured to implement the method according to the present invention for determining the pressure within the target area 20.
[0040] Figure 2 schematically shows the structure of a second embodiment of the vacuum processing system 1 according to the present invention. As already described with respect to Figure 1, the system comprises a processing chamber 2 and a control unit 3. The chamber 2 includes a support structure 21 for supporting an object to be processed in the processing chamber. A fluid inlet 22 and a fluid outlet 24, as well as a set of pressure sensors 25, 26, and 27, which are controllable by the control unit, are provided as part of the processing chamber 2. The control unit 3 receives measured pressure values from the sensors 25, 26, and 27 and is configured to control the fluid flow into the processing chamber through the fluid inlet 22 and the fluid flow out of the processing chamber through the fluid outlet 24.
[0041] In many applications, high-precision control of gas pressure is required in the area surrounding a wafer or other object (the processing area) during processing. Knowing the gas pressure in the processing area is necessary to enable this pressure control.
[0042] Therefore, in the illustrated processing chamber, the area of interest related to pressure is around the support structure 21. However, since it is not feasible to use a pressure sensor on the support structure 21 (at least during processing), no pressure sensor is provided in this area.
[0043] Figure 3 is a flowchart illustrating an exemplary embodiment of method 100 according to the present invention. In the first step, a processing chamber is provided 110. For example, this processing chamber may be one of those described above in Figures 1 and 2. Next, a digital model of this processing chamber is provided 115. For example, the digital model may be a digital twin. The digital model includes at least a 3D configuration of the processing chamber, and information regarding the fluid inlet and outlet, as well as the location of pressure sensors. Providing the digital model may include, for example, generating the digital model by a control unit of a vacuum processing system comprising the processing chamber.
[0044] According to the present invention, the method 100 includes a training process 120 that uses a number of pressure sensors, i.e., at least two pressure sensors in a processing chamber.
[0045] The training process 120 includes providing a predetermined fluid flow into a processing chamber 122 and / or providing a predetermined fluid flow from the processing chamber 124. Providing the predetermined fluid flow 122,124 may include, for example, directly defining and measuring a gas inlet and defining the valve position of a gas outlet. Direct measurement of the gas outlet is not necessary, as the gas outlet flow can be calculated from the gas inlet and pressure changes within the chamber. In these fluid flows, a series of pressure values are acquired by each of the relevant pressure sensors 126. Based on the acquired pressure values and a digital model of the processing chamber, a pressure distribution model can be derived 130 that provides information about the three-dimensional distribution of pressure within the processing chamber. Using a large number of pressure sensors for training 120 and carefully selecting their distribution within the chamber, i.e., their relative positions in three dimensions, improves the accuracy of the pressure distribution model.
[0046] Optionally, each pressure sensor monitors pressure changes and provides individual pressure profiles based on the monitored pressure changes, and acquiring a series of pressure values 126 is provided. In this case, deriving a pressure distribution model 130 includes comparing the individual pressure profiles provided by each pressure sensor with a physical model and deriving the progression of pressure changes through the processing chamber. For example, the progression of pressure changes can be derived by processing individual pressure profiles and time information related to the training process.
[0047] After the training process 120 is completed, a subset of pressure sensors may be shut off or physically removed ("blank") 140. If the set of pressure sensors used during training includes pressure sensors located within the area of study, for example, on a support structure that supports an object during processing, at least these pressure sensors will be blanked.
[0048] During the processing of an object in the processing chamber, pressure values are measured in a first region of the processing chamber that is not the target region, using a reduced number of pressure sensors, for example, only a single pressure sensor.
[0049] A pressure distribution model and measured pressure values in a first region may be used to determine the pressure values in the region of interest without the need to directly measure them.160 Then, based on the determined pressure values, the fluid flow may be controlled, for example, to give a specific pressure value to the region of interest.170
[0050] Optionally, this method may be used for predictive maintenance. In that case, all pressure sensors can be used to measure pressure during the processing of an object. For example, step 140 of blanking the pressure sensors may be omitted, or the blanked pressure sensors may be turned on again as needed (e.g., once a week or once every 100 processes). This makes it possible to determine deviations from the pressure distribution model, which can be used to determine early system failures, such as a decrease in pumping speed and the need for service. Inter-chamber matching can also be performed. This may include comparing the pressure distribution models of multiple processing chambers, identifying problems between them, and relating these problems to process or hardware components.
[0051] Figure 4 shows the derivation of the pressure in the processing area (wafer level) based on the pressure measured in other areas of the processing chamber. To enable efficient control of the gas pressure in the processing area, the method according to the present invention includes a pressure distribution model generated by physical modeling merged with recorded process data. This technique is -Generate a physical model of the system, -During process training, pressure data is recorded from pressure sensors mounted at various chamber positions. - To construct a pressure distribution model of the chamber, the physical model is merged with the recorded pressure data. - Use a pressure distribution model to control the pressure within the processing area. It is equipped with a control unit.
[0052] The diagram shows three curves 45, 46, and 47 representing pressure values measured over a specific period by three pressure sensors distributed within a processing chamber. Acquiring a series of pressure values during training may involve each pressure sensor monitoring the pressure changes and further providing such individual pressure profiles 45, 46, and 47 based on the monitored pressure changes.
[0053] The fourth curve 50 represents the pressure values determined for the area of interest, i.e., the processing area of the wafer or other object. Together, these derived pressure values, based on the measured pressure values 45, 46, and 47, and based on the physical model of the processing system, generate a pressure profile 50 associated with the area of interest.
[0054] In some embodiments, the pressure sensor located in the target area may be used during training and then turned off or removed (blanked) since it cannot be used during the processing of the object (e.g., a wafer). In other embodiments, no pressure sensor is located in the target area, even during training.
[0055] Figure 5 shows the inputs and outputs of a control unit 3 in an exemplary embodiment of the processing system according to the present invention. The inputs include the actual pressure, which includes the pressure measured during training by a set of pressure sensors (e.g., three sensors) and the pressure measured during processing by a subset of pressure sensors (e.g., one sensor). The inputs also include the target pressure of the area under consideration (the wafer processing area) and the current process, e.g., the current processing step and processing recipe. To vary the pressure in the wafer processing area to match the target pressure, the outputs include the simulated pressure in the wafer processing area and / or the position of the system valves.
[0056] Figure 6 schematically shows the data flow in a control unit in an exemplary embodiment of the method according to the present invention. A digital model 11 of the processing chamber is provided to the control unit. During training, a series of pressure values 12 are generated by pressure sensors and provided to the control unit. Based on the digital model 11 and the series of pressure values 12, the control unit generates a pressure distribution model 13. During processing of the wafer (or other object) in the chamber, the pressure is measured by (at least) a subset of pressure sensors. These measured pressures 15 are supplied to the control unit. Based on the pressure distribution model 13 and the measured pressures 15, the control unit calculates a target pressure 16 related to the area of interest, i.e., the processing area around the wafer.
[0057] While the present invention is illustrated above with partial reference to several preferred embodiments, it should be understood that numerous modifications and combinations of different features of the embodiments are possible. All of these modifications are within the scope of the appended claims.
Claims
1. A computer implementation method (100) for determining the pressure within a target area (20) of a processing chamber (2), wherein the processing chamber is - A support structure (21) for supporting the object (5) to be processed in the processing chamber, - At least one controllable fluid inlet (22), and at least one controllable fluid outlet (24), - A set of pressure sensors, wherein the set of pressure sensors comprises a plurality of pressure sensors (25, 26, 27) and Equipped with, The above method (100) - Step (115) of providing a digital model (11) of the processing chamber (2), - A step in which the training process (120) is carried out, - A step of applying a predetermined change in chamber pressure by changing the fluid flow within the processing chamber (2), wherein changing the fluid flow includes the steps of providing at least one predetermined fluid flow into the processing chamber by at least one fluid inlet (22) (122) and providing at least one predetermined fluid flow from the processing chamber by at least one fluid outlet (24) (124), - During the aforementioned change in chamber pressure, the set of pressure sensors acquires a series of pressure values (12) (126) Steps including, - A step (130) of deriving a three-dimensional pressure distribution model (13) based on the digital model (11) of the processing chamber and the series of pressure values (12), wherein the pressure distribution model provides information about the pressure in at least the target region (20), - A step of carrying out a pressure determination process for determining the target pressure (16) related to the target region (20), wherein the determination process is - A step (150) of measuring one or more pressure values (15) using a subset of the plurality of pressure sensors (25, 26, 27), - A step (160) to determine the target pressure (16) based on the pressure distribution model (13) and the one or more pressure values (15) Steps and A computer implementation method (100) including the above.
2. The method according to claim 1 (100), wherein the subset of pressure sensors comprises fewer pressure sensors than the set of pressure sensors.
3. The method according to claim 1 or 2 (100), wherein none of the pressure sensors among the subset of pressure sensors are located within the target area (20).
4. The method according to any one of claims 1 to 3 (100), wherein the one or more pressure values (15) are measured within a first region (140) of the processing chamber, the first region relating to the spatial arrangement of a subset of pressure sensors, and the target region (20) being different from the first region.
5. - The pressure sensor set comprises at least a first pressure sensor (25) and a second pressure sensor (26), - The series of pressure values (12) are acquired by the first and second pressure sensors (25, 26) (126), - The pressure distribution model (13) is derived by processing the pressure information of the first and second pressure sensors (25, 26) (130). The method according to any one of claims 1 to 4 (100).
6. The method according to claim 5 (100), wherein the second pressure sensor (26) is not part of a subset of the pressure sensors.
7. The method (100) according to any one of claims 1 to 6, wherein each pressure sensor (25, 26, 27) of the set of pressure sensors monitors changes in pressure and provides individual pressure profiles (45, 46, 47) based on the monitored changes in pressure, the step (126) of acquiring a series of pressure values (12).
8. The method (100) according to any one of claims 1 to 7, wherein the target pressure (16) is related to a processing area within the processing chamber (2), and the processing area comprises at least partially the support structure (21).
9. Includes a predictive maintenance process, wherein the predictive maintenance process is - A step of determining the deviation from the pressure distribution model (13) based on the one or more pressure values (15), - A step of predicting the need for maintenance of the processing chamber (2) or its components based on the aforementioned deviation. The method according to any one of claims 1 to 8 (100), including the method according to any one of claims 1 to 8.
10. This includes a chamber matching process, and the chamber matching process is - A step of comparing the pressure distribution model (13) with the pressure distribution model of another processing chamber, - A step of identifying a problem with the components of the processing chamber (2) based on the above comparison. The method according to any one of claims 1 to 9 (100), including the method according to any one of claims 1 to 9.
11. A vacuum processing system (1), - Processing chamber (2), - A support structure (21) that supports the object (5) to be processed in the processing chamber, - At least one controllable fluid inlet (22), and at least one controllable fluid outlet (24), - A set of pressure sensors, wherein the set of pressure sensors comprises a plurality of pressure sensors (25, 26, 27) and A processing chamber (2) is provided, - Controller (3), - Processing a three-dimensional pressure distribution model (13) of the processing chamber (2), wherein the pressure distribution model (13) provides information regarding the pressure within at least one predetermined region of the processing chamber (2). - Measuring one or more pressure values (15) by at least a subset of the plurality of pressure sensors (150), - Determining the target pressure (16) based on the pressure distribution model (13) and the one or more pressure values (15) (160) A controller (3) is configured to determine (160) the target pressure (16) within the target area (20) of the processing chamber (2). A vacuum processing system (1) is provided with the following:
12. The controller (3) is configured to derive (130) the pressure distribution model (13), and the deriving of the pressure distribution model is - This involves carrying out the training process (120), - Applying a predetermined change in chamber pressure by changing the fluid flow within the processing chamber, wherein the change in the fluid flow includes providing at least one predetermined fluid flow into the processing chamber (2) through the at least one fluid inlet (22) (122) and providing at least one predetermined fluid flow from the processing chamber (2) through the at least one fluid outlet (24) (124), - During the aforementioned change in chamber pressure, a series of pressure values (12) are obtained by the set of pressure sensors (126) Implementing (120), - Processing the digital model (11) of the processing chamber (2) together with the series of pressure values (12), - Deriving the pressure distribution model (13) based on the processing of the digital model (11) and the series of pressure values (12) The vacuum processing system (1) according to claim 11, including the above.
13. The vacuum processing system (1) according to claim 11 or 12, wherein the controller (3) is configured to control the measurement (150) of one or more pressure values (15) in a position or region different from the target region (20).
14. The controller (3) is configured according to the method (100) described in any one of claims 1 to 10. - A step of carrying out the training process (120) - Step (130) of deriving the pressure distribution model (13), - Step (160) to determine the target pressure (16) and A vacuum processing system (1) according to any one of claims 11 to 13, configured to perform and control the following.
15. A computer program product, embodied by electromagnetic waves having program code segments stored in a machine-readable carrier or having program code for implementing or controlling the method (100) according to any one of claims 1 to 10, wherein the computer program product comprises computer-executable instructions for implementing the method according to any one of claims 1 to 10.