Stacked filter device

Abstract

This enables the realization of a multilayer filter device that allows for easy adjustment of the coupling between multiple resonators. [Solution] The filter device 1 comprises resonators 11 and 12 and a laminate 50 including a plurality of dielectric layers 51 to 74. Resonator 11 includes an inductor L1 that is not electrically connected to ground. Resonator 12 includes an inductor L2 that is not electrically connected to ground. Inductor L1 includes a conductor layer 661 extending on a first plane perpendicular to the lamination direction T of the plurality of dielectric layers 51 to 74 and a pair of columnar conductors T1a and T1b. Inductor L2 includes a conductor layer 731 extending on a second plane perpendicular to the lamination direction T and a pair of columnar conductors T2a and T2b. At least a portion of the conductor layer 661 and at least a portion of the conductor layer 731 overlap each other when viewed from the lamination direction T.

Description

Technical Field

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[0001] The present invention relates to a laminated filter device including a plurality of resonators and a laminate.

Background Art

[0002] One of the electronic components used in communication devices is a band-pass filter including a plurality of resonators. Each of the plurality of resonators is, for example, an LC resonator configured using an inductor and a capacitor. In particular, band-pass filters used in small communication devices are required to be miniaturized. As a band-pass filter suitable for miniaturization, one using a laminate including a plurality of laminated dielectric layers and a plurality of conductor layers is known.

[0003] Patent Document 1 describes a filter device including a plurality of resonators that are electromagnetically coupled to each other. Each of the plurality of resonators includes an inductor configured by a via that is a columnar conductor extending in the stacking direction of the plurality of dielectric layers.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a band-pass filter using a laminate, when each of the plurality of resonators includes an inductor configured by a columnar conductor as in the filter device of Patent Document 1, the magnitude of magnetic coupling between two resonators is adjusted, for example, by the distance between two columnar conductors included in the two resonators. However, depending on the configuration of the laminate, there may be cases where the distance between the two columnar conductors cannot be adjusted sufficiently.

[0006] The above problem applies not only to inductors composed of a single columnar conductor, but also to inductors containing multiple columnar conductors. Furthermore, the above problem applies not only to bandpass filters, but to all multilayer filter devices equipped with an inductor containing at least one columnar conductor.

[0007] This invention has been made in view of the above problems, and its objective is to provide a stacked filter device that allows for easy adjustment of the coupling between multiple resonators. [Means for solving the problem]

[0008] The stacked filter device of the present invention comprises a first input / output terminal, a second input / output terminal, a ground terminal connected to ground, a first resonator and a second resonator provided between the first input / output terminal and the second input / output terminal in the circuit configuration, and a stacked laminate for integrating the first input / output terminal, the second input / output terminal, the first resonator and the second resonator, including a plurality of stacked dielectric layers. The first resonator includes a first inductor not electrically connected to the ground terminal, and the second resonator includes a second inductor not electrically connected to the ground terminal. The first inductor includes a first conductor layer extending on a first plane perpendicular to the stacking direction of the plurality of dielectric layers, and a pair of first columnar conductors connected to the vicinity of both ends of the first conductor layer and extending in a direction parallel to the stacking direction. The second inductor includes a second conductor layer extending in a second plane perpendicular to the stacking direction, and a pair of second columnar conductors connected to the vicinity of both ends of the second conductor layer and extending in a direction parallel to the stacking direction. At least a portion of the first conductor layer and at least a portion of the second conductor layer overlap each other when viewed from the stacking direction. [Effects of the Invention]

[0009] In the stacked filter device of the present invention, at least a portion of the first conductor layer and at least a portion of the second conductor layer overlap each other when viewed from the stacking direction. As a result, according to the present invention, it is possible to realize a stacked filter device in which the coupling between the first resonator and the second resonator can be easily adjusted. [Brief explanation of the drawing]

[0010] [Figure 1] This is a circuit diagram showing an example of the circuit configuration of a stacked filter device according to one embodiment of the present invention. [Figure 2] This is a perspective view showing the external appearance of a stacked filter device according to one embodiment of the present invention. [Figure 3] This is an explanatory diagram showing the pattern formation surface of the first dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 4] This is an explanatory diagram showing the pattern formation surface of the second dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 5] This is an explanatory diagram showing the pattern formation surface of the third dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 6] This is an explanatory diagram showing the pattern formation surface of the fourth dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 7] This is an explanatory diagram showing the pattern formation surface of the fifth dielectric layer in a laminate of a laminated filter device according to one embodiment of the present invention. [Figure 8] This is an explanatory diagram showing the pattern formation surface of the sixth dielectric layer in a laminate of a laminated filter device according to one embodiment of the present invention. [Figure 9] This is an explanatory diagram showing the pattern formation surface of the seventh dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 10] This is an explanatory diagram showing the pattern formation surface of the eighth dielectric layer in a laminate of a stacked filter device according to one embodiment of the present invention. [Figure 11] It is an explanatory diagram showing the pattern formation surface of the 9th to 15th dielectric layers in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 12] It is an explanatory diagram showing the pattern formation surface of the 16th dielectric layer in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 13] It is an explanatory diagram showing the pattern formation surface of the 17th dielectric layer in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 14] It is an explanatory diagram showing the pattern formation surface of the 18th to 22nd dielectric layers in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 15] It is an explanatory diagram showing the pattern formation surface of the 23rd dielectric layer in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 16] It is an explanatory diagram showing the pattern formation surface of the 24th dielectric layer in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 17] It is an explanatory diagram showing the surface opposite to the pattern formation surface of the 24th dielectric layer in the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 18] It is a perspective view showing the inside of the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 19] It is a plan view showing a part of the inside of the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 20] It is a plan view showing a part of the inside of the laminate of the multilayer filter device according to an embodiment of the present invention. [Figure 21] It is a characteristic diagram showing the passing attenuation characteristics obtained by simulation.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. First, referring to FIG. 1, an outline of the configuration of a stacked filter device (hereinafter simply referred to as a filter device) 1 according to this embodiment will be described. FIG. 1 is a circuit diagram showing the circuit configuration of the filter device 1. The filter device 1 is configured to function as a bandpass filter that selectively passes signals having frequencies within a predetermined passband.

[0012] The filter device 1 includes a first input / output terminal 2, a second input / output terminal 3, and a plurality of resonators. Each of the first and second input / output terminals 2 and 3 is a terminal for inputting or outputting a signal. That is, when a signal is input to the first input / output terminal 2, the signal is output from the second input / output terminal 3. When a signal is input to the second input / output terminal 3, the signal is output from the first input / output terminal 2.

[0013] The plurality of resonators are provided between the first input / output terminal 2 and the second input / output terminal 3 in terms of circuit configuration. Also, the plurality of resonators are configured such that two adjacent resonators are electromagnetically coupled in terms of circuit configuration. In the present application, the expression "in terms of circuit configuration" is used to refer to the arrangement on the circuit diagram rather than the arrangement in the physical configuration.

[0014] The plurality of resonators include resonators 11, 12, 13, and 14. The pair of resonators 11 and 12 is provided between the pair of resonators 13 and 14 and the first input / output terminal 2. The pair of resonators 13 and 14 is provided between the pair of resonators 11 and 12 and the second input / output terminal 3. In particular, in this embodiment, the resonators 11 to 14 are provided in this order from the first input / output terminal 2 toward the second input / output terminal 3. That is, the resonator 11 is provided between the first input / output terminal 2 and the resonator 12. The resonator 14 is provided between the second input / output terminal 3 and the resonator 13.

[0015] Resonators 11 to 14 are all open-ended resonators. That is, each of resonators 11 to 14 contains an inductor whose ends are not electrically connected to ground. In this embodiment in particular, each of the inductors in resonators 11 to 14 is not electrically connected to the ground terminal described later.

[0016] Next, an example of the circuit configuration of the filter device 1 will be described with reference to Figure 1. The resonator 11 includes an inductor L1 having a first end and a second end located on opposite sides of each other, a capacitor C1 connected to the first end, and a capacitor C2 connected to the second end. In terms of the circuit configuration, the first end is located closer to the first input / output terminal 2 and the second input / output terminal 3 than the second end. Capacitors C1 and C2 are each connected to ground.

[0017] The resonator 12 includes an inductor L2 having a first and second end located on opposite sides of each other, a capacitor C3 connected to the first end, and a capacitor C4 connected to the second end. The first end is located closer to the first input / output terminal 2 and the second input / output terminal 3 than the second end in terms of the circuit configuration. Capacitors C3 and C4 are each connected to ground.

[0018] The resonator 13 includes an inductor L3 having a first and second end located on opposite sides of the circuit, a capacitor C5 connected to the first end, and a capacitor C6 connected to the second end. The first end is located closer to the first input / output terminal 2 and the second input / output terminal 3 than the second end in the circuit configuration. Capacitors C5 and C6 are each connected to ground.

[0019] The resonator 14 includes an inductor L4 having a first and second end located on opposite sides of each other, a capacitor C7 connected to the first end, and a capacitor C8 connected to the second end. The first end is located closer to the first input / output terminal 2 and the second input / output terminal 3 than the second end in terms of the circuit configuration. Capacitors C7 and C8 are each connected to ground.

[0020] The first end of inductor L1 is connected to the first input / output terminal 2. The first end of inductor L4 is connected to the second input / output terminal 3.

[0021] The filter device 1 further includes capacitors C9, C10, C11, C12, C13, and C14. Capacitor C9 connects the first terminal of inductor L1 to the first terminal of inductor L2. Capacitor C10 connects the second terminal of inductor L1 to the second terminal of inductor L2. Capacitor C11 connects the first terminal of inductor L2 to the first terminal of inductor L3. Capacitor C12 connects the second terminal of inductor L2 to the second terminal of inductor L3. Capacitor C13 connects the first terminal of inductor L3 to the first terminal of inductor L4. Capacitor C14 connects the second terminal of inductor L3 to the second terminal of inductor L4.

[0022] Resonators 11 and 12 are magnetically coupled and capacitively coupled via capacitors C9 and C10. Resonators 12 and 13 are magnetically coupled and capacitively coupled via capacitors C11 and C12. Resonators 13 and 14 are magnetically coupled and capacitively coupled via capacitors C13 and C14. In Figure 1, the curves labeled M represent the magnetic coupling between the two resonators.

[0023] Next, with reference to Figure 2, other components of the filter device 1 will be described. Figure 2 is a perspective view showing the external appearance of the filter device 1.

[0024] The filter device 1 includes a laminate 50. The laminate 50 includes a plurality of stacked dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through-holes). The first input / output terminal 2, the second input / output terminal 3, the resonators 11-14 and the capacitors C9-C14 are integrated into the laminate 50.

[0025] The laminate 50 has a bottom surface 50A and an upper surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the bottom surface 50A and the upper surface 50B. Side surfaces 50C and 50D face opposite each other, and side surfaces 50E and 50F also face opposite each other. Side surfaces 50C to 50F may be perpendicular to the bottom surface 50A and the upper surface 50B.

[0026] Here, as shown in Figure 2, we define the X, Y, and Z directions. The X, Y, and Z directions are orthogonal to each other. In this embodiment, the Z direction is defined as one direction parallel to the stacking direction T. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. Furthermore, the expression "when viewed from a predetermined direction (for example, the stacking direction T)" means viewing the object from a position at a distance in the predetermined direction or one direction parallel to the predetermined direction.

[0027] As shown in Figure 2, the bottom surface 50A is located at the -Z edge of the laminate 50. The top surface 50B is located at the Z edge of the laminate 50. The filter device 1 may be mounted on the mounting substrate, for example, with the bottom surface 50A facing the mounting surface of the mounting substrate.

[0028] Side 50C is located at the -X end of the laminate 50. Side 50D is located at the X end of the laminate 50. Side 50E is located at the -Y end of the laminate 50. Side 50F is located at the Y end of the laminate 50.

[0029] The filter device 1 further includes electrodes 111, 112, 113, 114, 115, 116, 117, and 118. Electrode 111 is positioned from the bottom surface 50A through the side surface 50C to the top surface 50B. Electrode 112 is positioned from the bottom surface 50A through the side surface 50D to the top surface 50B. Each of electrodes 113 to 115 is positioned from the bottom surface 50A through the side surface 50E to the top surface 50B. Electrodes 113 to 115 are arranged in this order in the X direction. Each of electrodes 116 to 118 is positioned from the bottom surface 50A through the side surface 50F to the top surface 50B. Electrodes 116 to 118 are also arranged in this order in the X direction.

[0030] Electrode 111 corresponds to the first input / output terminal 2, and electrode 112 corresponds to the second input / output terminal 3. Each of electrodes 113 to 118 is connected to ground. For convenience, each of electrodes 113 to 118 may be called a "ground terminal".

[0031] Next, with reference to Figures 3 to 17, an example of multiple dielectric layers and multiple conductors constituting the laminate 50 will be described. In this example, the laminate 50 includes 24 stacked dielectric layers. Hereinafter, these 24 dielectric layers will be referred to as the 1st to 24th dielectric layers, from bottom to top. The 1st to 24th dielectric layers will also be denoted by reference numerals 51 to 74.

[0032] In Figures 4, 7 through 15, multiple circles represent multiple through-holes. Multiple through-holes are formed in each of the dielectric layers 52 and 55-73. Each of the multiple through-holes is formed by filling the through-hole holes with conductive paste. Each of the multiple through-holes is connected to an electrode, a conductive layer, or another through-hole. In the following description, the connection relationships between each of the multiple through-holes and the electrodes, conductive layers, or other through-holes are described in the state in which the 1st to 24th dielectric layers 51-74 are stacked. Also, in Figures 4, 7 through 15, multiple specific through-holes among the multiple through-holes are each labeled with a reference numeral.

[0033] Figure 3 shows the pattern formation surface of the first dielectric layer 51. Parts of each of the electrodes 111 to 118 are formed on the pattern formation surface of the dielectric layer 51.

[0034] Figure 4 shows the pattern formation surface of the second dielectric layer 52. Conductor layers 521, 522, 523, 524, 525, and 526 are formed on the pattern formation surface of the dielectric layer 52. Conductor layers 521 to 526 are connected to electrodes 113 to 118 (see Figure 2), respectively.

[0035] In Figure 4, the through-hole denoted as 52T5 is connected to the conductor layer 521. In the following description, the through-hole denoted as 52T5 will simply be referred to as through-hole 52T5. Through-holes denoted as other than through-hole 52T5 will also be referred to in the same way as through-hole 52T5.

[0036] The through-holes 52T6, 52T7, 52T8, 52T9, and 52T10 shown in Figure 4 are connected to the conductor layers 522, 523, 524, 525, and 526, respectively.

[0037] Figure 5 shows the pattern formation surface of the third dielectric layer 53. Conductor layers 531, 532, and 533 are formed on the pattern formation surface of the dielectric layer 53. Through holes 52T5 and 52T8 are connected to the conductor layer 531. Through holes 52T6 and 52T9 are connected to the conductor layer 532. Through holes 52T7 and 52T10 are connected to the conductor layer 533.

[0038] Figure 6 shows the pattern formation surface of the fourth dielectric layer 54. Conductor layers 541 and 542 are formed on the pattern formation surface of the dielectric layer 54.

[0039] Figure 7 shows the pattern formation surface of the fifth dielectric layer 55. Conductor layers 551, 552, 553, and 554 are formed on the pattern formation surface of the dielectric layer 55. The through holes 55T1a, 55T1b, 55T4a, and 55T4b shown in Figure 7 are connected to the conductor layers 551, 552, 553, and 554, respectively.

[0040] Figure 8 shows the pattern formation surface of the sixth dielectric layer 56. Conductor layers 561, 562, 563, and 564 are formed on the pattern formation surface of the dielectric layer 56. The through holes 56T2a, 56T2b, 56T3a, and 56T3b shown in Figure 8 are connected to the conductor layers 561, 562, 563, and 564, respectively. The through holes 55T1a, 55T1b, 55T4a, and 55T4b are connected to the through holes 56T1a, 56T1b, 56T4a, and 56T4b shown in Figure 8, respectively.

[0041] Figure 9 shows the pattern formation surface of the seventh dielectric layer 57. Conductor layers 571, 572, 573, 574, 575, and 576 are formed on the pattern formation surface of the dielectric layer 57. Conductor layers 571 and 572 are connected to electrodes 111 and 112 (see Figure 2), respectively. Through holes 56T1a, 56T1b, 56T2a, 56T2b, 56T3a, 56T3b, 56T4a, and 56T4b are connected to through holes 57T1a, 57T1b, 57T2a, 57T2b, 57T3a, 57T3b, 57T4a, and 57T4b shown in Figure 9, respectively.

[0042] Figure 10 shows the pattern formation surface of the eighth dielectric layer 58. Conductor layers 581 and 582 are formed on the pattern formation surface of the dielectric layer 58. The through holes 57T1a, 57T1b, 57T2a, 57T2b, 57T3a, 57T3b, 57T4a, and 57T4b are connected to the through holes 58T1a, 58T1b, 58T2a, 58T2b, 58T3a, 58T3b, 58T4a, and 58T4b shown in Figure 10, respectively.

[0043] Figure 11 shows the pattern formation surfaces of the 9th to 15th dielectric layers 59-65. The through-holes 58T1a, 58T1b, 58T2a, 58T2b, 58T3a, 58T3b, 58T4a, and 58T4b are connected to the through-holes 59T1a, 59T1b, 59T2a, 59T2b, 59T3a, 59T3b, 59T4a, and 59T4b formed in dielectric layer 59, respectively. In addition, in dielectric layers 59-65, through-holes with the same sign that are adjacent vertically are connected to each other.

[0044] Figure 12 shows the pattern formation surface of the 16th dielectric layer 66. Conductor layers 661 and 662 are formed on the pattern formation surface of the dielectric layer 66. Conductor layer 661 has a first end and a second end located at both ends in the longitudinal direction of conductor layer 661. Conductor layer 662 also has a first end and a second end located at both ends in the longitudinal direction of conductor layer 662.

[0045] The through-hole 59T1a formed in the dielectric layer 65 and the through-hole 66T1a shown in Figure 12 are connected to the vicinity of the first end of the conductor layer 661. The through-hole 59T1b formed in the dielectric layer 65 and the through-hole 66T1b shown in Figure 12 are connected to the vicinity of the second end of the conductor layer 661. The through-hole 59T4a formed in the dielectric layer 65 and the through-hole 66T4a shown in Figure 12 are connected to the vicinity of the first end of the conductor layer 662. The through-hole 59T4b formed in the dielectric layer 65 and the through-hole 66T4b shown in Figure 12 are connected to the vicinity of the second end of the conductor layer 662. The through-holes 59T2a, 59T2b, 59T3a, and 59T3b formed in the dielectric layer 65 are connected to the through-holes 66T2a, 66T2b, 66T3a, and 66T3b shown in Figure 12, respectively.

[0046] Figure 13 shows the pattern formation surface of the 17th dielectric layer 67. Conductor layers 671 and 672 are formed on the pattern formation surface of the dielectric layer 67. Conductor layer 671 has a first end and a second end located at both ends in the longitudinal direction of conductor layer 671. Conductor layer 672 also has a first end and a second end located at both ends in the longitudinal direction of conductor layer 672.

[0047] Through-hole 66T1a is connected to the vicinity of the first end of conductor layer 671. Through-hole 66T1b is connected to the vicinity of the second end of conductor layer 671. Through-hole 66T4a is connected to the vicinity of the first end of conductor layer 672. Through-hole 66T4b is connected to the vicinity of the second end of conductor layer 672. Through-holes 66T2a, 66T2b, 66T3a, and 66T3b are connected to through-holes 67T2a, 67T2b, 67T3a, and 67T3b shown in Figure 13, respectively.

[0048] Figure 14 shows the pattern formation surfaces of the 18th to 22nd dielectric layers 68-72. Through-holes 67T2a, 67T2b, 67T3a, and 67T3b are connected to through-holes 68T2a, 68T2b, 68T3a, and 68T3b formed in dielectric layer 68, respectively. In dielectric layers 68-72, through-holes with the same sign that are adjacent vertically are connected to each other.

[0049] Figure 15 shows the pattern formation surface of the 23rd dielectric layer 73. Conductor layers 731 and 732 are formed on the pattern formation surface of the dielectric layer 73. Conductor layer 731 has a first end and a second end located at both ends in the longitudinal direction of conductor layer 731. Conductor layer 732 also has a first end and a second end located at both ends in the longitudinal direction of conductor layer 732.

[0050] The through-hole 68T2a formed in the dielectric layer 72 and the through-hole 73T2a shown in Figure 15 are connected to the vicinity of the first end of the conductor layer 731. The through-hole 68T2b formed in the dielectric layer 72 and the through-hole 73T2b shown in Figure 15 are connected to the vicinity of the second end of the conductor layer 731. The through-hole 68T3a formed in the dielectric layer 72 and the through-hole 73T3a shown in Figure 15 are connected to the vicinity of the first end of the conductor layer 732. The through-hole 68T3b formed in the dielectric layer 72 and the through-hole 73T3b shown in Figure 15 are connected to the vicinity of the second end of the conductor layer 732.

[0051] Figure 16 shows the pattern formation surface of the 24th dielectric layer 74. Conductor layers 741 and 742 are formed on the pattern formation surface of the dielectric layer 74. Conductor layer 741 has a first end and a second end located at both ends in the longitudinal direction of conductor layer 741. Conductor layer 742 has a first end and a second end located at both ends in the longitudinal direction of conductor layer 742.

[0052] Through-hole 73T2a is connected to the vicinity of the first end of conductor layer 741. Through-hole 73T2b is connected to the vicinity of the second end of conductor layer 741. Through-hole 73T3a is connected to the vicinity of the first end of conductor layer 742. Through-hole 73T3b is connected to the vicinity of the second end of conductor layer 742.

[0053] Figure 17 shows the side of the 24th dielectric layer 74 opposite to the pattern formation surface. Mark 121 is formed on this surface.

[0054] The laminate 50 shown in Figure 2 is constructed by stacking dielectric layers 51 to 74, with the pattern-forming surface of the first dielectric layer 51 becoming the bottom surface 50A of the laminate 50, and the surface of the 24th dielectric layer 74 opposite to the pattern-forming surface becoming the top surface 50B of the laminate 50. Figure 2 shows the mark 121 shown in Figure 17.

[0055] Figure 18 shows the interior of the laminate 50, which is constructed by stacking dielectric layers 51 to 74 from the first to the 24th layer. As shown in Figure 18, multiple conductor layers and multiple through-holes, as shown in Figures 3 to 17, are stacked inside the laminate 50. Note that mark 121 is omitted in Figure 18.

[0056] The following describes the correspondence between the circuit components of the filter device 1 shown in Figure 1 and the internal components of the laminate 50 shown in Figures 3 to 17. The conductor layers 661 and 671 and the through-holes 55T1a, 55T1b, 56T1a, 56T1b, 57T1a, 57T1b, 58T1a, 58T1b, 59T1a, 59T1b, 66T1a, and 66T1b constitute at least a part of the inductor L1.

[0057] Conductor layers 731, 741 and through holes 56T2a, 56T2b, 57T2a, 57T2b, 58T2a, 58T2b, 59T2a, 59T2b, 66T2a, 66T2b, 67T2a, 67T2b, 68T2a, 68T2b, 73T2a, 73T2b constitute at least a portion of the inductor L2.

[0058] Conductor layers 732, 742 and through holes 56T3a, 56T3b, 57T3a, 57T3b, 58T3a, 58T3b, 59T3a, 59T3b, 66T3a, 66T3b, 67T3a, 67T3b, 68T3a, 68T3b, 73T3a, 73T3b constitute at least a portion of the inductor L3.

[0059] Conductor layers 662, 672 and through holes 55T4a, 55T4b, 56T4a, 56T4b, 57T4a, 57T4b, 58T4a, 58T4b, 59T4a, 59T4b, 66T4a, 66T4b constitute at least a portion of the inductor L4.

[0060] The conductive layers 531, 551 and the dielectric layers 53, 54 between these conductive layers constitute at least a part of capacitor C1. The conductive layers 531, 552 and the dielectric layers 53, 54 between these conductive layers constitute at least a part of capacitor C2. The conductive layers 532, 541, 561 and the dielectric layers 53-55 between these conductive layers constitute at least a part of capacitor C3. The conductive layers 532, 542, 562 and the dielectric layers 53-55 between these conductive layers constitute at least a part of capacitor C4.

[0061] The conductive layers 532, 541, and 563, and the dielectric layers 53 to 55 between these conductive layers, constitute at least a part of capacitor C5. The conductive layers 532, 542, and 564, and the dielectric layers 53 to 55 between these conductive layers, constitute at least a part of capacitor C6. The conductive layers 533, 553, and the dielectric layers 53 and 54 between these conductive layers, constitute at least a part of capacitor C7. The conductive layers 533, 554, and the dielectric layers 53 and 54 between these conductive layers, constitute at least a part of capacitor C8.

[0062] Conductor layers 551, 573 and dielectric layers 55, 56 between these conductor layers constitute at least a part of capacitor C9. Conductor layers 552, 574 and dielectric layers 55, 56 between these conductor layers constitute at least a part of capacitor C10. Conductor layers 573, 575, 581 and dielectric layer 57 between these conductor layers constitute at least a part of capacitor C11. Conductor layers 574, 576, 582 and dielectric layer 57 between these conductor layers constitute at least a part of capacitor C12. Conductor layers 553, 575 and dielectric layers 55, 56 between these conductor layers constitute at least a part of capacitor C13. Conductor layers 554, 576 and dielectric layers 55, 56 between these conductor layers constitute at least a part of capacitor C14.

[0063] Next, the structural features of the filter device 1 according to this embodiment will be described. First, the features related to the inductors L1 to L4 will be described with reference to Figures 1 to 19. Figure 19 is a plan view showing a part of the interior of the filter device 1. Figure 19 shows the conductor layers 661, 662, 731, and 732 that make up the inductors L1 to L4. As shown in Figure 19, the inductors L1 to L4 are arranged in this order from side surface 50C of the laminated body 50 toward side surface 50D of the laminated body 50.

[0064] As shown in Figure 18, inductors L1 to L4 are all inductors wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting multiple through-holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. Each of the inductors L1 to L4 includes at least one conductor layer and multiple columnar conductors.

[0065] Furthermore, each of the inductors L1 to L4 is also a rectangular or nearly rectangular winding. In the case of a rectangular or nearly rectangular winding, the number of turns can be counted as 1 / 4 of a turn per side of the rectangle, when the winding is considered as a rectangle. In this embodiment, each of the inductors L1 to L4 has 3 / 4 of a turn.

[0066] The inductor L1 includes a conductor layer 661 and a pair of columnar conductors T1a and T1b, each connected to the vicinity of both ends of the conductor layer 661. The conductor layer 661 extends along a first plane perpendicular to the lamination direction T. In this embodiment in particular, the first plane is part of the pattern-forming surface of the dielectric layer 66. Columnar conductor T1a is connected to the vicinity of the first end of the conductor layer 661. Columnar conductor T1b is connected to the vicinity of the second end of the conductor layer 661.

[0067] The columnar conductor T1a is formed by connecting through-holes 55T1a, 56T1a, 57T1a, 58T1a, and 59T1a in series. The columnar conductor T1b is formed by connecting through-holes 55T1b, 56T1b, 57T1b, 58T1b, and 59T1b in series. In this embodiment in particular, the columnar conductors T1a and T1b are spaced apart in a direction parallel to the Y direction. The columnar conductors T1a and T1b may be positioned at the same or approximately the same position in a direction parallel to the X direction.

[0068] The inductor L1 is wound around a first axis perpendicular to the stacking direction T such that an opening is formed surrounded by the conductor layer 661, the columnar conductor T1a, and the columnar conductor T1b. The opening of the inductor L1 may be demarcated by the conductor layer 661, the columnar conductor T1a, and the columnar conductor T1b, and by an imaginary straight line connecting the -Z end of the columnar conductor T1a and the -Z end of the columnar conductor T1b. The first axis may extend in a direction parallel to the X direction.

[0069] The inductor L1 further includes a conductor layer 671 and through-holes 66T1a and 66T1b that electrically connect the conductor layer 661 and the conductor layer 671. The conductor layer 671 extends along the pattern-forming surface of the dielectric layer 67, i.e., the surface perpendicular to the stacking direction T. The planar shape of the conductor layer 671 (shape as viewed from the stacking direction T) may be the same as or nearly the same as the planar shape of the conductor layer 661, or it may be a similar shape to the planar shape of the conductor layer 661.

[0070] The inductor L2 includes a conductor layer 731 and a pair of columnar conductors T2a and T2b, each connected to the vicinity of both ends of the conductor layer 731. The conductor layer 731 extends along a second plane perpendicular to the lamination direction T. In this embodiment in particular, the second plane is part of the pattern-forming surface of the dielectric layer 73. Columnar conductor T2a is connected to the vicinity of the first end of the conductor layer 731. Columnar conductor T2b is connected to the vicinity of the second end of the conductor layer 731.

[0071] The columnar conductor T2a is formed by connecting through-holes 56T2a, 57T2a, 58T2a, 59T2a, 66T2a, 67T2a, and 68T2a in series. The columnar conductor T2b is formed by connecting through-holes 56T2b, 57T2b, 58T2b, 59T2b, 66T2b, 67T2b, and 68T2b in series. In this embodiment in particular, the columnar conductors T2a and T2b are spaced apart in a direction parallel to the Y direction. The columnar conductors T2a and T2b may be positioned at the same or approximately the same position in a direction parallel to the X direction.

[0072] The inductor L2 is wound around a second axis perpendicular to the stacking direction T such that an opening is formed surrounded by the conductor layer 731, the columnar conductor T2a, and the columnar conductor T2b. The opening of the inductor L2 may be demarcated by the conductor layer 731, the columnar conductor T2a, and the columnar conductor T2b, and by an imaginary straight line connecting the -Z end of the columnar conductor T2a and the -Z end of the columnar conductor T2b. The second axis may extend in a direction parallel to the X direction.

[0073] The inductor L2 further includes a conductor layer 741 and through-holes 73T2a and 73T2b that electrically connect the conductor layer 731 and the conductor layer 741. The conductor layer 741 extends along the pattern-forming surface of the dielectric layer 74, i.e., the surface perpendicular to the stacking direction T. The planar shape of the conductor layer 741 may be the same as or substantially the same as the planar shape of the conductor layer 731, or it may be a similar shape to the planar shape of the conductor layer 731.

[0074] The inductor L3 includes a conductor layer 732 and a pair of columnar conductors T3a and T3b, respectively, connected to the vicinity of both ends of the conductor layer 732. The conductor layer 732 extends along a third plane perpendicular to the lamination direction T. In this embodiment in particular, the third plane is another part of the pattern-forming surface of the dielectric layer 73. Columnar conductor T3a is connected to the vicinity of the first end of the conductor layer 732. Columnar conductor T3b is connected to the vicinity of the second end of the conductor layer 732.

[0075] The columnar conductor T3a is formed by connecting through-holes 56T3a, 57T3a, 58T3a, 59T3a, 66T3a, 67T3a, and 68T3a in series. The columnar conductor T3b is formed by connecting through-holes 56T3b, 57T3b, 58T3b, 59T3b, 66T3b, 67T3b, and 68T3b in series. In this embodiment, the columnar conductors T3a and T3b are particularly spaced apart in a direction parallel to the Y direction. The columnar conductors T3a and T3b may be positioned at the same or approximately the same location in a direction parallel to the X direction.

[0076] The inductor L3 is wound around a third axis perpendicular to the stacking direction T such that an opening is formed surrounded by the conductor layer 732, the columnar conductor T3a, and the columnar conductor T3b. The opening of the inductor L3 may be demarcated by the conductor layer 732, the columnar conductor T3a, and the columnar conductor T3b, and by an imaginary straight line connecting the -Z end of the columnar conductor T3a and the -Z end of the columnar conductor T3b. The third axis may extend in a direction parallel to the X direction.

[0077] The inductor L3 further includes a conductor layer 742 and through-holes 73T3a and 73T3b that electrically connect the conductor layer 732 and the conductor layer 742. The conductor layer 742 extends along the pattern-forming surface of the dielectric layer 74, i.e., the surface perpendicular to the stacking direction T. The planar shape of the conductor layer 742 may be the same as or substantially the same as the planar shape of the conductor layer 732, or it may be a similar shape to the planar shape of the conductor layer 732.

[0078] The inductor L4 includes a conductor layer 662 and a pair of columnar conductors T4a and T4b, respectively, connected to the vicinity of both ends of the conductor layer 662. The conductor layer 662 extends along a fourth plane perpendicular to the lamination direction T. In this embodiment in particular, the fourth plane is another part of the pattern-forming surface of the dielectric layer 66. Columnar conductor T4a is connected to the vicinity of the first end of the conductor layer 662. Columnar conductor T4b is connected to the vicinity of the second end of the conductor layer 662.

[0079] The columnar conductor T4a is formed by connecting through-holes 55T4a, 56T4a, 57T4a, 58T4a, and 59T4a in series. The columnar conductor T4b is formed by connecting through-holes 55T4b, 56T4b, 57T4b, 58T4b, and 59T4b in series. In this embodiment in particular, the columnar conductors T4a and T4b are spaced apart in a direction parallel to the Y direction. The columnar conductors T4a and T4b may be positioned at the same or approximately the same position in a direction parallel to the X direction.

[0080] The inductor L4 is wound around a fourth axis perpendicular to the stacking direction T such that an opening is formed surrounded by the conductor layer 662, the columnar conductor T4a, and the columnar conductor T4b. The opening of the inductor L4 may be demarcated by the conductor layer 662, the columnar conductor T4a, and the columnar conductor T4b, and by an imaginary straight line connecting the -Z end of the columnar conductor T4a and the -Z end of the columnar conductor T4b. The fourth axis may extend in a direction parallel to the X direction.

[0081] The inductor L4 further includes a conductor layer 672 and through-holes 66T4a and 66T4b that electrically connect the conductor layer 662 and the conductor layer 672. The conductor layer 672 extends along the pattern-forming surface of the dielectric layer 67, i.e., the surface perpendicular to the stacking direction T. The planar shape of the conductor layer 672 may be the same as or nearly the same as the planar shape of the conductor layer 662, or it may be a similar shape to the planar shape of the conductor layer 662.

[0082] Inductors L1 to L4 are provided in this order from side 50C to side 50D. As shown in Figure 2, in this embodiment, a portion of the electrode 111 constituting the first input / output terminal 2 is provided on side 50C. Also, a portion of the electrode 112 constituting the second input / output terminal 3 is provided on side 50D. Therefore, it can also be said that inductors L1 to L4 are provided in this order from the first input / output terminal 2 to the second input / output terminal 3. Furthermore, as shown in Figure 1, inductors L1 to L4 are components of resonators 11 to 14, respectively. Therefore, it can also be said that resonators 11 to 14 are provided in this order from the first input / output terminal 2 to the second input / output terminal 3.

[0083] Inductors L1 to L4 are arranged such that their respective openings overlap when viewed from the X direction. Alternatively, the columnar conductors T1a of inductor L1, T2a of inductor L2, T3a of inductor L3, and T4a of inductor L4 may be arranged so that they overlap each other when viewed from the X direction. The columnar conductors T1b of inductor L1, T2b of inductor L2, T3b of inductor L3, and T4b of inductor L4 may also be arranged so that they overlap each other when viewed from the X direction.

[0084] Next, the characteristics related to the pair of inductors L1 and L2 will be described. Inductors L1 and L2 are adjacent to each other with a gap in between within the laminate 50. The first surface on which the conductor layer 661 of inductor L1 extends and the second surface on which the conductor layer 731 of inductor L2 extends are at different positions in the lamination direction T. In this embodiment in particular, the first surface is part of the pattern-forming surface of the dielectric layer 66, and the second surface is part of the pattern-forming surface of the dielectric layer 73, which is at a different position from the dielectric layer 66 in the lamination direction T. Since the dielectric layer 73 is located between the dielectric layer 66 and the upper surface 50B of the laminate 50, the conductor layer 731 is located between the conductor layer 661 and the upper surface 50B of the laminate 50.

[0085] Inductors L1 and L2 are arranged such that their respective openings overlap when viewed from the X direction. Furthermore, when viewed from the stacking direction T, at least a portion of the conductor layer 661 of inductor L1 and at least a portion of the conductor layer 731 of inductor L2 overlap. In this embodiment in particular, the conductor layer 661 extends outward from a pair of columnar conductors T1a and T1b toward inductor L2. The conductor layer 731 extends outward from a pair of columnar conductors T2a and T2b toward inductor L1. As a result, at least a portion of the conductor layer 661 and at least a portion of the conductor layer 731 overlap each other when viewed from the stacking direction T. In Figure 19, hatching is applied to the overlapping portion of the conductor layers 661 and 731 for convenience. In the example shown in Figure 19, a portion of the conductor layer 661 in the longitudinal direction and a portion of the conductor layer 731 in the longitudinal direction and a portion of the conductor layer 731 in the width direction overlap.

[0086] Furthermore, in the example shown in Figure 19, the conductor layer 661 includes a first portion spaced apart from a pair of columnar conductors T1a and T1b in a direction parallel to the X direction, a second portion connecting the first portion to columnar conductor T1a, and a third portion connecting the first portion to columnar conductor T1b. The conductor layer 731 includes a first portion spaced apart from a pair of columnar conductors T2a and T2b in a direction parallel to the X direction, a second portion connecting the first portion to columnar conductor T2a, and a third portion connecting the first portion to columnar conductor T2b. The first portion of the conductor layer 661 and the first portion of the conductor layer 731 may each extend in a direction parallel to the Y direction.

[0087] The dimensions of the first portion of the conductor layer 661 in the direction parallel to the Y direction and the dimensions of the first portion of the conductor layer 731 in the direction parallel to the Y direction may be the same or different. Also, the spacing between a pair of columnar conductors T1a, T1b in the direction parallel to the Y direction and the spacing between a pair of columnar conductors T2a, T2b in the direction parallel to the Y direction may be the same or different.

[0088] One of the conductor layers 661, 731 may include a portion that does not overlap with the other conductor layer 661, 731 when viewed from the stacking direction T. In the example shown in Figure 19, the conductor layer 661 includes a portion that does not overlap with the conductor layer 731 when viewed from the stacking direction T, and the conductor layer 731 includes a portion that does not overlap with the conductor layer 661 when viewed from the stacking direction T.

[0089] In this embodiment, the planar shape of the conductor layer 671 of inductor L1 is the same as or substantially the same as the planar shape of the conductor layer 661, and the planar shape of the conductor layer 741 of inductor L2 is the same as or substantially the same as the planar shape of the conductor layer 731. Therefore, the description of the conductor layers 661 and 731 also applies to the conductor layers 671 and 741.

[0090] The columnar conductor T1a of inductor L1 connects conductor layer 551 and conductor layer 661. The columnar conductor T1b of inductor L1 connects conductor layer 552 and conductor layer 661. The columnar conductor T2a of inductor L2 connects conductor layer 561 and conductor layer 731. The columnar conductor T2b of inductor L2 connects conductor layer 562 and conductor layer 731. The first dimension, which is the respective dimension of the columnar conductors T1a and T1b in the stacking direction T, and the second dimension, which is the respective dimension of the columnar conductors T2a and T2b in the stacking direction T, may be different from each other. In this embodiment in particular, the second dimension is larger than the first dimension.

[0091] In this embodiment, the spacing between the columnar conductors T2a and T2b is the same as or approximately the same as the spacing between the columnar conductors T1a and T1b. Since the second dimension is larger than the first dimension, the opening of inductor L2 is larger than the opening of inductor L1.

[0092] Next, we will briefly explain the characteristics related to the pair of inductors L3 and L4. The above explanation for the pair of inductors L1 and L2 also applies to the pair of inductors L3 and L4. If we replace inductors L1 and L2, conductor layers 661, 671, 731, 741, columnar conductors T1a, T1b, T2a, T2b, the first surface and the second surface in the above explanation for the pair of inductors L1 and L2 with inductors L3 and L4, conductor layers 662, 672, 732, 742, columnar conductors T3a, T3b, T4a, T4b, the third surface and the fourth surface, respectively, we get the explanation for the pair of inductors L3 and L4.

[0093] Furthermore, the shapes and arrangements of inductors L1 and L2 and inductors L3 and L4 may be symmetrical with respect to a virtual plane that intersects the center of the laminate 50 in a direction parallel to the X direction. That is, inductors L1 and L4 may be symmetrical with respect to the virtual plane, and inductors L2 and L3 may be symmetrical with respect to the virtual plane.

[0094] Next, the characteristics related to capacitors C1 to C8 will be explained with reference to Figures 1 to 18 and Figure 20. Figure 20 is a plan view showing a part of the inside of the filter device 1. Figure 20 shows the conductive layers 531 to 533, 541, 542, 551 to 554, and 561 to 564 that make up capacitors C1 to C8.

[0095] Capacitor C1 of resonator 11 includes a conductor layer 551 connected to one end of the columnar conductor T1a of inductor L1, which is located opposite to the conductor layer 661, and a conductor layer 531 facing the conductor layer 551 and connected to ground. Capacitor C2 includes a conductor layer 552 connected to one end of the columnar conductor T1b of inductor L1, which is located opposite to the conductor layer 661, and a conductor layer 531 facing the conductor layer 552 and connected to ground. Conductor layers 551 and 552 are not connected to conductor layer 531, nor are they connected to any other conductors electrically connected to ground. Therefore, inductor L1 is not electrically connected to ground.

[0096] Capacitor C3 of resonator 12 includes a conductor layer 561 connected to one end of the columnar conductor T2a of inductor L2, which is located opposite to the conductor layer 731, and a conductor layer 532 facing the conductor layer 561 and connected to ground. Capacitor C4 of resonator 12 includes a conductor layer 562 connected to one end of the columnar conductor T2b of inductor L2, which is located opposite to the conductor layer 731, and a conductor layer 532 facing the conductor layer 562 and connected to ground. Conductor layers 561 and 562 are not connected to conductor layer 532, nor are they connected to any other conductors electrically connected to ground. Therefore, inductor L2 is not electrically connected to ground.

[0097] The capacitor C5 of the resonator 13 includes a conductor layer 563 connected to one end of the columnar conductor T3a of the inductor L3, which is located opposite the conductor layer 732, and a conductor layer 532 facing the conductor layer 563 and connected to ground. The capacitor C6 of the resonator 13 includes a conductor layer 564 connected to one end of the columnar conductor T3b of the inductor L3, which is located opposite the conductor layer 732, and a conductor layer 532 facing the conductor layer 564 and connected to ground. Conductor layers 563 and 564 are not connected to conductor layer 532, nor are they connected to any other conductors electrically connected to ground. Therefore, the inductor L3 is not electrically connected to ground.

[0098] The capacitor C7 of the resonator 14 includes a conductor layer 553 connected to one end of the columnar conductor T4a of the inductor L4, which is located opposite the conductor layer 662, and a conductor layer 533 facing the conductor layer 553 and connected to ground. The capacitor C8 of the resonator 14 includes a conductor layer 554 connected to one end of the columnar conductor T4b of the inductor L4, which is located opposite the conductor layer 662, and a conductor layer 533 facing the conductor layer 554 and connected to ground. Conductor layers 553 and 554 are not connected to conductor layer 533, nor are they connected to any other conductors electrically connected to ground. Therefore, the inductor L4 is not electrically connected to ground.

[0099] In the examples shown in Figures 2 to 5 and Figure 20, the conductor layer 531, which constitutes capacitors C1 and C2 and is connected to ground, the conductor layer 532, which constitutes capacitors C3 to C6 and is connected to ground, and the conductor layer 533, which constitutes capacitors C7 and C8 and is connected to ground, are physically separated. That is, the conductor layers 531 and 532 are spaced apart and not connected to each other. Similarly, the conductor layers 532 and 533 are spaced apart and not connected to each other. Furthermore, the conductor layers 531 to 533 are not electrically connected to each other within the laminate 50.

[0100] Next, an example of the characteristics of the filter device 1 according to this embodiment, obtained by simulation, will be described. The simulation uses the model of the embodiment and the model of the comparative example. The model of the embodiment is the model of the filter device 1 according to this embodiment. The model of the comparative example is the model of the filter device of the comparative example.

[0101] The configuration of the comparative example filter device is basically the same as the configuration of filter device 1 according to this embodiment. However, in the comparative example filter device, the conductor layer 661 of inductor L1 and the conductor layer 731 of inductor L2 do not overlap when viewed from the stacking direction T, and the conductor layer 732 of inductor L3 and the conductor layer 662 of inductor L4 do not overlap when viewed from the stacking direction T.

[0102] Figure 21 is a characteristic diagram showing the pass-through attenuation characteristics obtained by simulation. In Figure 21, the horizontal axis represents frequency, and the vertical axis represents attenuation. In Figure 21, reference numeral 91 indicates the pass-through attenuation characteristics of the embodiment model, and reference numeral 92 indicates the pass-through attenuation characteristics of the comparative example model.

[0103] One of the characteristics required of a bandpass filter is that the attenuation changes sharply in the frequency range close to the passband. Figure 21 shows that the model in the example achieves a characteristic in which the attenuation changes sharply in the high-frequency range of the passband, compared to the model in the comparative example.

[0104] Next, the operation and effects of the filter device 1 according to this embodiment will be described. In this embodiment, at least a portion of the conductor layer 661 of inductor L1 and at least a portion of the conductor layer 731 of inductor L2 overlap each other when viewed from the stacking direction T. As a result, according to this embodiment, the coupling between the resonator 11 including inductor L1 and the resonator 12 including inductor L2 can be strengthened compared to the case where the conductor layers 661 and 731 do not overlap. Similarly, in this embodiment, at least a portion of the conductor layer 732 of inductor L3 and at least a portion of the conductor layer 662 of inductor L4 overlap each other when viewed from the stacking direction T. As a result, according to this embodiment, the coupling between the resonator 13 including inductor L3 and the resonator 14 including inductor L4 can be strengthened compared to the case where the conductor layers 732 and 662 do not overlap.

[0105] Furthermore, according to this embodiment, as can be seen from the simulation results shown in Figure 21, by strengthening the coupling between resonators 11 and 12 and between resonators 13 and 14, the attenuation can be changed sharply in the high-frequency range of the passband.

[0106] The following describes the effects related to the strength of the coupling between resonators 11 and 12. The strength of the coupling between resonators 11 and 12 can be adjusted by the relative positional relationship between the conductor layers 661 and 731. Specifically, for example, the strength of the coupling between resonators 11 and 12 can be adjusted by adjusting the shape and area of ​​the overlapping portion of conductor layer 661 and 731, and the spacing between the conductor layers 661 and 731.

[0107] Another method for adjusting the coupling strength between resonators 11 and 12 is to adjust the spacing between the pair of columnar conductors T1a and T1b of inductor L1 and the pair of columnar conductors T2a and T2b of inductor L2. However, depending on the configuration of the laminate 50, it may not be possible to adjust the spacing sufficiently. For example, in this embodiment, the conductor layers 531 constituting capacitors C1 and C2 connected to both ends of inductor L1 and the conductor layers 532 constituting capacitors C3 and C4 connected to both ends of inductor L2 are spaced apart. The spacing between the conductor layers 531 and 532 is determined by characteristics or manufacturing considerations. Therefore, depending on the shape of the conductor layers 531 and 532 and the spacing between them, it may not be possible to reduce the spacing sufficiently. As a result, it may not be possible to adjust the coupling strength between resonators 11 and 12 sufficiently. The above description of conductor layers 531 and 532 also applies to conductor layers 541, 542, 551, 552, 561, and 562 that constitute capacitors C1 to C4.

[0108] In contrast, according to this embodiment, the coupling strength between the resonators 11 and 12 can be adjusted regardless of the distance between the pair of columnar conductors T1a and T1b and the pair of columnar conductors T2a and T2b.

[0109] Furthermore, in this embodiment, resonators 11 and 12 are open-ended resonators. Resonator 11 includes an inductor L1 whose ends are not electrically connected to ground. Resonator 12 includes an inductor L2 whose ends are not electrically connected to ground. If at least one of resonators 11 and 12 is a short-circuited resonator that includes an inductor connected to a ground conductor layer with one end electrically connected to ground, the function of the ground conductor layer as ground may be weakened depending on the path from the ground conductor layer to ground. As a result, the coupling strength between resonators 11 and 12 may deviate from the desired strength. In contrast, according to this embodiment, by making resonators 11 and 12 open-ended resonators, fluctuations in the coupling strength between resonators 11 and 12 can be suppressed.

[0110] The coupling strength between resonators 11 and 12 may be adjusted by the shape and arrangement of both inductors L1 and L2, or by the shape and arrangement of either L1 or L2. In this embodiment, in particular, resonator 11 is positioned between the first input / output terminal 2 and resonator 12. Therefore, for example, the characteristics of inductor L1 may be adjusted so that desired characteristics are achieved with respect to an external circuit of the filter device 1 connected to the first input / output terminal 2, and then the shape and arrangement of inductor L2 may be adjusted so that the coupling strength between resonators 11 and 12 is adjusted.

[0111] The above explanation regarding the effect related to the strength of the coupling between resonators 11 and 12 also applies to resonators 13 and 14.

[0112] It should be noted that the present invention is not limited to the embodiments described above, and various modifications are possible. For example, as long as the requirements of the claims are met, the configuration of each of the resonators 11 to 14 is not limited to the examples shown in the embodiments, but is arbitrary. Also, the number of resonators is not limited to four, but may be two, three, or five or more.

[0113] Furthermore, the configuration of each inductor L1 to L4 is not limited to the examples shown in the embodiment, but is arbitrary, as long as the requirements of the claims are met. For example, the first conductor layer connected to the pair of columnar conductors T1a and T1b of inductor L1 may be placed between the second conductor layer connected to the pair of columnar conductors T2a and T2b of inductor L2 and the upper surface 50B of the laminate 50. Also, the fourth conductor layer connected to the pair of columnar conductors T4a and T4b of inductor L4 may be placed between the third conductor layer connected to the pair of columnar conductors T3a and T3b of inductor L3 and the upper surface 50B of the laminate 50.

[0114] Furthermore, the first surface on which the first conductor layer extends is part of the pattern-forming surface of the dielectric layer 66, and the fourth surface on which the fourth conductor layer extends is another part of the pattern-forming surface of the dielectric layer 66. That is, one surface (pattern-forming surface) of the dielectric layer 66 includes the first surface and the fourth surface. The first surface and the fourth surface are in the same position in the stacking direction T. However, the first surface and the fourth surface may be in different positions in the stacking direction T. Similarly, the second surface on which the second conductor layer extends is part of the pattern-forming surface of the dielectric layer 73, and the third surface on which the third conductor layer extends is another part of the pattern-forming surface of the dielectric layer 73. That is, one surface (pattern-forming surface) of the dielectric layer 73 includes the second surface and the third surface. The second surface and the third surface are in the same position in the stacking direction T. However, the second and third surfaces may be in different positions in the stacking direction T.

[0115] Furthermore, the planar shape of each of the first and second conductor layers may be such that, when viewed from the stacking direction T, one of the first and second conductor layers overlaps with the entire other. Similarly, the planar shape of each of the third and fourth conductor layers may be such that, when viewed from the stacking direction T, one of the third and fourth conductor layers overlaps with the entire other.

[0116] Furthermore, the planar shapes of the first to fourth conductor layers are not limited to the example shown in Figure 19. For example, the planar shapes of the first to fourth conductor layers can be any shape, such as a shape extending in one direction, a shape including at least a curved portion, or an L-shape. Alternatively, one of the first and second conductor layers may have the planar shape shown in Figure 19, while the other of the first and second conductor layers may have any of the above-mentioned planar shapes. Similarly, one of the third and fourth conductor layers may have the planar shape shown in Figure 19, while the other of the third and fourth conductor layers may have any of the above-mentioned planar shapes.

[0117] As described above, the stacked filter device of the present invention comprises a first input / output terminal, a second input / output terminal, a ground terminal connected to ground, a first resonator and a second resonator provided between the first input / output terminal and the second input / output terminal in the circuit configuration, and a stacked laminate for integrating the first input / output terminal, the second input / output terminal, the first resonator and the second resonator, which are stacked dielectric layers. The first resonator includes a first inductor that is not electrically connected to the ground terminal. The second resonator includes a second inductor that is not electrically connected to the ground terminal. The first inductor includes a first conductor layer extending on a first plane perpendicular to the stacking direction of the plurality of dielectric layers, and a pair of first columnar conductors that are connected to the vicinity of both ends of the first conductor layer and extend in a direction parallel to the stacking direction. The second inductor includes a second conductor layer extending in a second plane perpendicular to the stacking direction, and a pair of second columnar conductors connected to the vicinity of both ends of the second conductor layer and extending in a direction parallel to the stacking direction. At least a portion of the first conductor layer and at least a portion of the second conductor layer overlap each other when viewed from the stacking direction.

[0118] In the stacked filter device of the present invention, the first surface and the second surface may be at different positions from each other in the stacking direction.

[0119] Furthermore, in the stacked filter device of the present invention, the first conductor layer and a pair of first columnar conductors may be arranged such that a first opening is formed surrounded by the first conductor layer and the pair of first columnar conductors. The second conductor layer and a pair of second columnar conductors may be arranged such that a second opening is formed surrounded by the second conductor layer and the pair of second columnar conductors. The sizes of the first opening and the second opening may be different from each other. The first opening and the second opening may face each other in a direction intersecting the stacking direction.

[0120] Furthermore, in the stacked filter device of the present invention, one of the first conductor layer and the second conductor layer may include a portion that does not overlap with the other of the first conductor layer and the second conductor layer when viewed from the stacking direction.

[0121] Furthermore, in the stacked filter device of the present invention, the first resonator may be located between the first input / output terminal and the second resonator.

[0122] Furthermore, the stacked filter device of the present invention may further include a first capacitor connected to one end of a first inductor and a second capacitor connected to one end of a second inductor. The first capacitor may include a first capacitor conductor layer connected to one end of a pair of first columnar conductors and a second capacitor conductor layer facing the first capacitor conductor layer and connected to ground. The second capacitor may include a third capacitor conductor layer connected to one end of a pair of second columnar conductors and a fourth capacitor conductor layer facing the third capacitor conductor layer and connected to ground. The second capacitor conductor layer and the fourth capacitor conductor layer may be spaced apart and not connected to each other.

[0123] Furthermore, the stacked filter device of the present invention may further include, in terms of circuit configuration, a third resonator and a fourth resonator provided between the first and second resonators and the second input / output terminal. The third and fourth resonators may be integrated into the stacked structure. The third resonator may include a third inductor that is not electrically connected to the ground terminal. The fourth resonator may include a fourth inductor that is not electrically connected to the ground terminal. The third inductor may include a third conductor layer extending on a third plane perpendicular to the stacking direction, and a pair of third columnar conductors connected to the vicinity of both ends of the third conductor layer and extending in a direction parallel to the stacking direction. The fourth inductor may include a fourth conductor layer extending on a fourth plane perpendicular to the stacking direction, and a pair of fourth columnar conductors connected to the vicinity of both ends of the fourth conductor layer and extending in a direction parallel to the stacking direction. At least a portion of the third conductive layer and at least a portion of the fourth conductive layer may overlap each other when viewed from the stacking direction. The first surface and the fourth surface may be in the same position in the stacking direction. The second surface and the third surface may be in the same position in the stacking direction.

[0124] The first resonator, second resonator, third resonator, and fourth resonator may be provided in this order from the first input / output terminal toward the second input / output terminal. The first conductor layer and a pair of first columnar conductors may be arranged to form a first opening surrounded by the first conductor layer and the pair of first columnar conductors. The second conductor layer and a pair of second columnar conductors may be arranged to form a second opening surrounded by the second conductor layer and the pair of second columnar conductors. The third conductor layer and a pair of third columnar conductors may be arranged to form a third opening surrounded by the third conductor layer and the pair of third columnar conductors. The fourth conductor layer and a pair of fourth columnar conductors may be arranged to form a fourth opening surrounded by the fourth conductor layer and the pair of fourth columnar conductors. The first opening, second opening, third opening, and fourth opening may overlap each other when viewed from a direction intersecting the stacking direction. [Explanation of symbols]

[0125] 1...Stacked filter device, 2...First input / output terminal, 3...Second input / output terminal, 11~14...Resonator, 50...Laminate, 50A...Bottom surface, 50B...Top surface, 50C~50F...Side surface, 51~74...Dielectric layer, 111~118...Electrode, 121...Mark, C1~C14...Capacitor, L1~L4...Inductor, T1a, T1b, T2a, T2b, T3a, T3b, T4a, T4b...Columnar conductor.

Claims

1. The first input / output terminal and The second input / output terminal, The ground terminal connected to the ground, In terms of circuit configuration, a first resonator and a second resonator are provided between the first input / output terminal and the second input / output terminal, The laminate includes a plurality of stacked dielectric layers, and comprises a first input / output terminal, a second input / output terminal, a first resonator, and a second resonator, The first resonator includes a first inductor that is not electrically connected to the ground terminal. The second resonator includes a second inductor that is not electrically connected to the ground terminal. The first inductor includes a first conductor layer extending in a first plane perpendicular to the stacking direction of the plurality of dielectric layers, and a pair of first columnar conductors connected to the vicinity of both ends of the first conductor layer and extending in a direction parallel to the stacking direction. The second inductor includes a second conductor layer extending in a second plane perpendicular to the stacking direction, and a pair of second columnar conductors connected to the vicinity of both ends of the second conductor layer and extending in a direction parallel to the stacking direction. A stacked filter device characterized in that at least a portion of the first conductor layer and at least a portion of the second conductor layer overlap each other when viewed from the stacking direction.

2. The stacked filter apparatus according to claim 1, characterized in that the first surface and the second surface are located at different positions from each other in the stacking direction.

3. The first conductor layer and the pair of first columnar conductors are arranged such that a first opening is formed, surrounded by the first conductor layer and the pair of first columnar conductors. The second conductor layer and the pair of second columnar conductors are arranged such that a second opening is formed, surrounded by the second conductor layer and the pair of second columnar conductors. The stacked filter apparatus according to claim 1, characterized in that the size of the first opening and the size of the second opening are different from each other.

4. The stacked filter apparatus according to claim 3, characterized in that the first opening and the second opening face each other in a direction intersecting the stacking direction.

5. The stacked filter apparatus according to claim 1, characterized in that one of the first conductor layer and the second conductor layer includes a portion that does not overlap with the other of the first conductor layer and the second conductor layer when viewed from the stacking direction.

6. The stacked filter apparatus according to claim 1, characterized in that the first resonator is located between the first input / output terminal and the second resonator.

7. Furthermore, a first capacitor connected to one end of the first inductor, The device comprises a second capacitor connected to one end of the second inductor, The first capacitor includes a first capacitor conductor layer connected to one end of the pair of first columnar conductors, and a second capacitor conductor layer facing the first capacitor conductor layer and connected to the ground. The second capacitor includes a third capacitor conductor layer connected to one end of the pair of second columnar conductors, and a fourth capacitor conductor layer facing the third capacitor conductor layer and connected to the ground. The stacked filter apparatus according to claim 1, characterized in that the second capacitor conductor layer and the fourth capacitor conductor layer are spaced apart and not connected to each other.

8. Furthermore, the circuit configuration includes a third resonator and a fourth resonator provided between the first and second resonators and the second input / output terminal. The third resonator and the fourth resonator are integrated into the laminate, The third resonator includes a third inductor that is not electrically connected to the ground terminal. The fourth resonator includes a fourth inductor that is not electrically connected to the ground terminal. The third inductor includes a third conductor layer extending in a third plane perpendicular to the stacking direction, and a pair of third columnar conductors connected to the vicinity of both ends of the third conductor layer and extending in a direction parallel to the stacking direction. The fourth inductor includes a fourth conductor layer extending in a fourth plane perpendicular to the stacking direction, and a pair of fourth columnar conductors connected to the vicinity of both ends of the fourth conductor layer and extending in a direction parallel to the stacking direction. The stacked filter apparatus according to claim 1, characterized in that at least a portion of the third conductor layer and at least a portion of the fourth conductor layer overlap each other when viewed from the stacking direction.

9. The first surface and the fourth surface are in the same position in the stacking direction, The stacked filter apparatus according to claim 8, characterized in that the second surface and the third surface are in the same position in the stacking direction.

10. The stacked filter apparatus according to claim 8, characterized in that the first resonator, the second resonator, the third resonator, and the fourth resonator are provided in this order from the first input / output terminal toward the second input / output terminal.

11. The first conductor layer and the pair of first columnar conductors are arranged such that a first opening is formed, surrounded by the first conductor layer and the pair of first columnar conductors. The second conductor layer and the pair of second columnar conductors are arranged such that a second opening is formed, surrounded by the second conductor layer and the pair of second columnar conductors. The third conductor layer and the pair of third columnar conductors are arranged such that a third opening is formed, surrounded by the third conductor layer and the pair of third columnar conductors. The fourth conductor layer and the pair of fourth columnar conductors are arranged such that a fourth opening is formed, surrounded by the fourth conductor layer and the pair of fourth columnar conductors. The stacked filter apparatus according to claim 8, characterized in that the first opening, the second opening, the third opening, and the fourth opening overlap each other when viewed from a direction intersecting the stacking direction.

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