Substrate processing apparatus, static elimination apparatus, and method for manufacturing articles

Abstract

This technology provides advantages for detecting the state of the irradiation area that is irradiated with X-rays. [Solution] A substrate processing apparatus is provided, comprising: a holding unit for holding the substrate; a plurality of irradiation units arranged around the holding unit for irradiating the substrate with X-rays to remove static electricity from the substrate; a detection unit for detecting the dose of X-rays irradiated from each of the plurality of irradiation units; and a processing unit that performs processing to detect the state of each of the plurality of irradiation units based on the detection results of the detection units, wherein the number of detection units is less than the number of the plurality of irradiation units.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus, a static elimination apparatus, and a method for manufacturing articles. [Background technology]

[0002] In the exposure process used to manufacture liquid crystal display devices and the like, static electricity (charge) that accumulates on the substrate (glass substrate) while it is being transported can damage the TFT elements, and the discharge of the charge on the substrate can cause the exposure equipment to malfunction. Therefore, ionizers and the like are used to remove static electricity from the substrate.

[0003] The lifespan (usable period) of an ionizer depends on the degradation of the X-ray tube inside the irradiation unit. While there are several failure modes for the X-ray tube, degradation tends to progress in all modes depending on the operating time, i.e., the X-ray irradiation time. Therefore, as the X-ray irradiation time increases, the dose output by the X-ray tube decreases, leading to a decline in the ionizer's static elimination performance. Consequently, the irradiation unit of the ionizer needs to be replaced periodically.

[0004] Regarding technologies related to the degradation of X-ray tubes, a technology has been proposed that predicts and notifies the replacement time of an X-ray tube based on the operating status of the X-ray inspection device (see Patent Document 1). In addition, a technology has been proposed that predicts the degradation of an X-ray tube based on the cumulative dose of X-rays and the dose detected by the X-ray detector (see Patent Document 2). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2003-51397 [Patent Document 2] Patent No. 4748869 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, when predicting X-ray tube degradation based on the operating status of the X-ray inspection device, variations in lifespan due to individual differences in X-ray tubes are not taken into account. Therefore, there is a possibility that the device may incorrectly notify the user that the X-ray tube has reached the end of its lifespan even though it has not actually reached it. Furthermore, there is a possibility that an X-ray tube that has reached the end of its lifespan may continue to be used because it is not detected (predicted) as such.

[0007] Furthermore, in recent years, substrate sizes have been increasing in order to enlarge displays and improve display productivity. To quickly eliminate static electricity from such substrates, the number of ionizer irradiation units required is increasing. In conventional technology, when predicting the lifespan of an X-ray tube using an X-ray detector, it is necessary to prepare an X-ray detector according to the number of X-ray tubes, which complicates the equipment configuration.

[0008] This invention has been made in view of the problems of the prior art, and its exemplary objective is to provide a technology that is advantageous for detecting the state of an irradiation unit that irradiates with X-rays. [Means for solving the problem]

[0009] To achieve the above objective, a substrate processing apparatus as one aspect of the present invention is a substrate processing apparatus for processing a substrate, comprising: a holding unit for holding the substrate; a plurality of irradiation units arranged around the holding unit and irradiating the substrate with X-rays to remove static electricity from the substrate; a detection unit for detecting the dose of X-rays irradiated from each of the plurality of irradiation units; and a processing unit that performs processing to detect the state of each of the plurality of irradiation units based on the detection results of the detection units, wherein the number of detection units is less than the number of the plurality of irradiation units.

[0010] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0011] According to the present invention, for example, it is possible to provide a technique advantageous for detecting the state of an irradiation unit that irradiates X-rays.

Brief Description of the Drawings

[0012] [Figure 1] It is a schematic diagram showing the configuration of a substrate processing apparatus as one aspect of the present invention. [Figure 2] It is a flowchart for explaining the deterioration detection process in the present embodiment. [Figure 3] It is a diagram for explaining the deterioration detection process in the present embodiment. [Figure 4] It is a diagram for explaining the deterioration detection process in the present embodiment. [Figure 5] It is a diagram for explaining an example of normalization of the dose of an ionizer head. [Figure 6] It is a flowchart for explaining the operation sequence of a substrate processing apparatus. [Figure 7] It is a flowchart for explaining the deterioration detection process in the present embodiment. [Figure 8] It is a diagram for explaining an example of a method for estimating the life of an ionizer head.

Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0014] In this embodiment, the substrate processing apparatus for processing a substrate includes a lithography apparatus, a measurement apparatus, an inspection apparatus, and the like. The lithography apparatus is an apparatus for forming a pattern on a substrate, and includes, for example, an exposure apparatus, an imprint apparatus, a drawing apparatus, and the like. The exposure apparatus includes an apparatus that projects the pattern of a master (mask or reticle) onto the substrate to expose the substrate. The imprint apparatus includes an apparatus that forms a pattern of an imprint material on the substrate by molding the imprint material on the substrate with a mold (mold). Note that the imprint apparatus also includes a planarization apparatus that planarizes the composition on the substrate using a mold having a flat surface. The drawing apparatus includes an apparatus that draws a pattern on the substrate using a charged particle beam (such as an electron beam or an ion beam). The measurement apparatus is an apparatus for measuring a substrate, and includes, for example, an alignment measurement apparatus used for alignment between the master and the substrate. The inspection apparatus is an apparatus for inspecting a substrate, and includes, for example, an overlay inspection apparatus that inspects the overlay accuracy of the patterns formed on the substrate.

[0015] FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 as one aspect of the present invention. The substrate processing apparatus 1 is used in a lithography process, which is a manufacturing process of devices such as liquid crystal display elements and semiconductor devices. In this embodiment, the substrate processing apparatus 1 is embodied as an exposure apparatus that transfers the pattern of a master to a substrate by exposing the substrate using the master. As shown in FIG. 1, the substrate processing apparatus 1 includes a substrate holding mechanism SHM, a substrate elevating unit SLU, ionizer heads 8a, 8b, 8c, and 8d (irradiation windows 10a, 10b, 10c, and 10d), a control unit 9, and detection units 11a and 11b.

[0016] The substrate holding mechanism SHM includes a substrate stage 2 disposed on a main body base (not shown) and a substrate holding unit 4 disposed on the substrate stage 2. The substrate holding unit 4 includes, for example, a substrate chuck and holds the substrate 3 via a holding surface 4A on which the substrate 3 is placed.

[0017] The substrate 3 is a substrate that is subject to a predetermined process, namely exposure, and in this embodiment, it has a rectangular shape. The substrate 3 is brought into the substrate processing apparatus 1 from the outside, exposed in the substrate processing apparatus 1, and then discharged from the substrate processing apparatus 1 to the outside. Within the plane of the substrate 3, one corner is defined as the origin 6 of the substrate 3, the direction of the longer side from the origin 6 is defined as the Y direction, and the direction of the shorter side from the origin 6 is defined as the X direction. Furthermore, the direction of the normal to the plane containing the origin 6 of the substrate 3 is defined as the Z direction.

[0018] The substrate lifting unit SLU includes a plurality of lifting members 7 and a lifting drive unit 5 that drives (lifts and lowers) each of the plurality of lifting members 7 in the Z direction. The lifting members 7 are support members that support the substrate 3 and are also called lift bars. In this embodiment, the lifting members 7 are arranged in parallel along the Y direction and have the same length as the long side of the substrate 3. The substrate lifting unit SLU has the function of lifting and lowering the substrate 3 relative to the holding surface 4A of the substrate holding unit 4 via the lifting members 7 that support the substrate 3.

[0019] In this embodiment, the ionizer heads 8a to 8d, the control unit 9, and the detection units 11a and 11b constitute an ionizer IZR (static elimination device). The ionizer IZR eliminates static electricity from the substrate 3 (object) in order to suppress electrostatic discharge (ESD) caused by charges accumulated on the substrate 3 due to peeling charge that occurs between the substrate 3 and the substrate holding unit 4 when the substrate 3 is unloaded.

[0020] The ionizer heads 8a to 8d are arranged around the substrate holder 4. The ionizer heads 8a to 8d are X-ray irradiation units that irradiate the substrate 3 with X-rays through irradiation windows 10a to 10d to remove static electricity from the substrate 3. In this embodiment, the ionizer heads 8a to 8d are arranged along the long side of the substrate 3, and the irradiation windows 10a to 10d are directed toward the substrate 3. Furthermore, the ionizer heads 8a and 8b (multiple first irradiation units) and the ionizer heads 8c and 8d (multiple second irradiation units) are arranged facing each other with the substrate 3 as the center, and more specifically, with the substrate holder 4 in between. The X-rays irradiated by the ionizer heads 8a to 8d are classified as soft X-rays, and specifically have wavelengths of about 1 nm to 0.2 nm.

[0021] Detection units 11a and 11b detect the dose of X-rays irradiated from each of the multiple ionizer heads 8a to 8d (hereinafter referred to as "ionizer head dose"). Detection unit 11a is configured as a unit (first detection unit) that detects the doses of ionizer heads 8a and 8b, and detection unit 11b is configured as a unit (second detection unit) that detects the doses of ionizer heads 8c and 8d. For example, ionization chambers and GM (Geiger-Mueller) counters can be used for detection units 11a and 11b, but are not limited to these. For example, a configuration using a semiconductor element with a PIN structure and an amplification circuit that amplifies the detection signal is suitable for detection units 11a and 11b because it is easy to realize a compact configuration. Detection units 11a and 11b are sensitive to the same wavelength band as the X-rays irradiated by ionizer heads 8a to 8d.

[0022] The detection units 11a and 11b are provided, for example, on the lifting members 7 arranged in parallel along the Y direction. In this embodiment, the detection unit 11a is provided on the surface 7A of the lifting members 7 arranged on the side of the ionizer heads 8a and 8b, and as described above, detects the doses of the ionizer heads 8a and 8b. The detection unit 11b is provided on the surface 7B of the lifting members 7 arranged on the side of the ionizer heads 8c and 8d, and as described above, detects the doses of the ionizer heads 8c and 8d. In this embodiment, the detection units 11a and 11b are not provided in a one-to-one ratio with respect to the ionizer heads 8a to 8d, and the number of detection units 11a and 11b (number installed) is less than the number of ionizer heads 8a to 8d (number installed).

[0023] The control unit 9 is composed of a computer (information processing device) including, for example, a CPU and memory. The control unit 9 comprehensively controls each part of the substrate processing device 1 according to a program stored in the memory unit, etc., to operate the substrate processing device 1. In the following description, the control unit 9 will be described with particular attention to its control of the ionizer IZR of the substrate processing device 1. For example, in this embodiment, the control unit 9 functions as a processing unit that performs a process (degradation detection process) to detect the state of each of the multiple ionizer heads 8a to 8d, specifically the degradation state indicating the degree of degradation, based on the detection results of the detection units 11a and 11b. In the degradation detection process, the control unit 9 controls the multiple ionizer heads 8a to 8d, specifically controlling the irradiation (irradiation ON) or non-irradiation (irradiation OFF) of each of the multiple ionizer heads 8a to 8d.

[0024] The loading and unloading of substrates 3 into the substrate processing apparatus 1 will now be described. After exposure, which is a predetermined process, is completed, the substrate 3 is lifted in the Z direction by the lifting drive unit 5 while supported by the lifting member 7 (i.e., raised from the holding surface 4A), and is unloaded from the substrate processing apparatus 1 via a transport unit provided outside the substrate processing apparatus 1. Similarly, when loading substrates 3, the substrate 3 is loaded into the substrate processing apparatus 1 via the transport unit and supported (placed) on the lifting member 7. The substrate 3 supported by the lifting member 7 is lowered to the holding surface 4A by the lifting drive unit 5 and held by the substrate holding unit 4 via the holding surface 4A.

[0025] The degradation detection process in this embodiment will now be described with reference to Figure 2. This degradation detection process is performed by the control unit 9 comprehensively controlling each part of the ionizer IZR.

[0026] In S101, the X-ray irradiation state of each of the multiple ionizer heads 8a to 8d is turned OFF.

[0027] In S102, the detection units 11a and 11b respectively detect (acquire) the doses of the ionizer heads 8a to 8d. The doses detected in S102 are acquired as dark noise for each ionizer head because the irradiation state of the multiple ionizer heads 8a to 8d is OFF. Here, the dark noise of ionizer heads 8a and 8b is referred to as dark noise 12a, and the dark noise of ionizer heads 8c and 8d is referred to as dark noise 12b.

[0028] In S103, the detection units 11a and 11b each detect (acquire) the doses of the multiple ionizer heads 8a to 8d. In S103, when the detection unit 11a or 11b detects the X-ray dose, the control unit 9 sequentially controls the irradiation ON or OFF of each of the multiple ionizer heads 8a to 8d. Specifically, the control unit 9 individually controls the irradiation ON or OFF of each ionizer head 8a to 8d so that the dose of X-rays emitted from one of the multiple ionizer heads 8a to 8d is detected by the detection unit 11a or 11b. For example, the control unit 9 controls only ionizer head 8a to irradiate ON and the other ionizer heads 8b to 8d to irradiate OFF, so that the detection unit 11a detects the dose 13a of ionizer head 8a. Once the detection of dose 13a for ionizer head 8a is complete, the control unit 9 controls ionizer head 8a to irradiation OFF and ionizer head 8b to irradiation ON, and the detection unit 11a detects dose 13b for ionizer head 8b. Once the detection of dose 13b for ionizer head 8b is complete, the control unit 9 controls ionizer head 8b to irradiation OFF and ionizer head 8c to irradiation ON, and the detection unit 11b detects dose 13c for ionizer head 8c. Once the detection of dose 13c for ionizer head 8c is complete, the control unit 9 controls ionizer head 8c to irradiation OFF and ionizer head 8d to irradiation ON, and the detection unit 11b detects dose 13d for ionizer head 8d. Figure 3 shows the doses 13a and 13b for ionizer heads 8a and 8b detected in S103, and Figure 4 shows the doses 13c and 13d for ionizer heads 8c and 8d detected in S103. In Figures 3 and 4, the vertical axis represents dose, and the horizontal axis represents time. Figures 3 and 4 also show the dark noise 12a and 12b detected in S101, respectively.

[0029] In S104, the doses 13a to 13d detected in S103 are corrected based on the dark noises 12a and 12b detected in S102 to obtain corrected values ​​(corrected doses). Specifically, as shown in Figure 3, the corrected dose 14a is obtained by subtracting the dark noise 12a detected in S102 from the dose 13a detected in S103 (noise correction). Similarly, the corrected dose 14b is obtained by subtracting the dark noise 12a detected in S102 from the dose 13b detected in S103 (noise correction). Likewise, as shown in Figure 4, the corrected doses 14c and 14d are obtained by subtracting the dark noise 12b detected in S102 from the doses 13c and 13d detected in S103, respectively.

[0030] In S104, it is determined whether each of the corrected doses 14a to 14d obtained in S104 exceeds a preset threshold 15. If each of the corrected doses 14a to 14d exceeds the threshold 15, the process proceeds to S106. If each of the corrected doses 14a to 14d does not exceed the threshold 15, the process proceeds to S107.

[0031] In S106, for each of the ionizer heads 8a to 8d, the corrected doses 14a to 14d each exceed the threshold 15, so it is determined that the state is not deteriorated (i.e., normal), and the deterioration detection process is terminated.

[0032] In S107, among the ionizer heads 8a to 8d, if the corrected dose 14a to 14d exceeds the threshold 15, it is determined (detected) that the ionizer head is in a deteriorated state, and the deterioration detection process is terminated.

[0033] In step 104, when obtaining the corrected doses 14a to 14d, it is preferable to normalize the doses 13a to 13d detected by each of the detection units 11a and 11b. For example, by previously obtaining the irradiation angle characteristics of the ionizer heads 8a to 8d and the incident angle characteristics of the detection units 11a and 11b, it is possible to perform normalization of distance and angle for each ionizer head. Here, the irradiation angle characteristics and the incident angle characteristics indicate how the irradiation dose or the incident dose changes depending on the irradiation angle or the incident angle, with the irradiation dose or the incident dose in the normal direction of the X-ray irradiation surface or the incident surface being set to 100%.

[0034] Referring to FIG. 5, an example of normalizing the dose 13a (corrected dose 14a) of the ionizer head 8a will be described. FIG. 5 shows the positional relationship between the ionizer head 8a and the detection unit 11a on the XY plane, and the path along which the X-ray irradiated from the ionizer head 8a enters the detection unit 11a is taken as the X-ray path 16a. As shown in FIG. 5, if the angle from the X-ray path 16a to the irradiation direction of the ionizer head 8a is taken as the head angle 17a, the irradiation angle characteristics of the ionizer head 8a and, from the head angle 17a, the head angle reduction coefficient D ha can be obtained. Similarly, if the angle from the X-ray path 16a to the detection direction of the detection unit 11a is taken as the detection angle 19a, the incident angle characteristics of the detection unit 11a and, from the detection angle 19a, the detection angle attenuation coefficient D da can be obtained. Further, if the length of the X-ray path 16a is x and the linear absorption coefficient of the X-ray in the air is μ, the distance attenuation coefficient D length is represented by the following equation (1). Dlength = e (-ux) ···(1) If the corrected dose 14a obtained in step 104 is taken as I 14a , then from the head angle attenuation coefficient D ha , the detection angle attenuation coefficient D da , and the distance reduction coefficient D length , the normalized dose S 14a is represented by the following equation (2). S 14a = I 14a D ha Dda D length ...(2) The normalized dose of ionizer head 8a is determined by equations (1) and (2). Similarly, the normalized doses of ionizer heads 8b to 8d are determined. Then, it is determined whether the normalized doses of each of ionizer heads 8a to 8d exceed the threshold 15 (S105).

[0035] In this way, coefficients for normalizing the X-ray dose are determined based on the positional relationship between each of the ionizer heads 8a to 8d and the detection units 11a and 11b, the directivity of each ionizer head, the attenuation characteristics of each ionizer head, and the directivity of each detection unit. Then, the state of each of the ionizer heads 8a to 8d is detected based on the result of multiplying each of the X-ray doses 13a to 13d (corrected doses 14a to 14d) detected by the detection units 11a and 11b by the coefficient. This makes it possible to determine (detect) the deterioration of the ionizer heads according to a certain standard, regardless of the positional relationship between the ionizer heads 8a to 8d and the detection units 11a and 11b.

[0036] Furthermore, when detecting the dose of each ionizer head 8a to 8d in S103, in order to shorten the time required for detection, the ionizer heads, which are arranged facing each other, may be simultaneously turned ON for irradiation and the dose may be detected by the detection units 11a and 11b respectively. For example, the ionizer heads 8a and 8c are turned ON for irradiation, the dose of ionizer head 8a is detected by the detection unit 11a, and the dose of ionizer head 8c is detected by the detection unit 11b. After that, the ionizer heads 8a and 8c are turned OFF for irradiation, and the ionizer heads 8b and 8d are turned ON for irradiation, the dose of ionizer head 8b is detected by the detection unit 11a, and the dose of ionizer head 8d is detected by the detection unit 11b. In this case, it is preferable to place a shielding unit BM made of stainless steel or the like between the detection unit 11a and the detection unit 11b so that X-rays that have passed through one of the detection units 11a and 11b do not enter the other detection unit. Specifically, a shielding section BM is provided to block the paths of X-rays irradiated from ionizer heads 8a and 8b and incident on the detection section 11b, and the paths of X-rays irradiated from ionizer heads 8c and 8d and incident on the detection section 11a. The shielding section BM includes, for example, a first shielding material BM1 provided between the side surface 7A of the lifting member 7 on the ionizer heads 8a and 8b side and the detection section 11a, and a second shielding material BM2 provided between the side surface 7B of the lifting member 7 on the ionizer heads 8c and 8d side and the detection section 11b. It is also possible to make the entire lifting member 7 function as the shielding section BM by constructing the lifting member 7 from a shielding material such as stainless steel.

[0037] Furthermore, when determining the presence or absence of degradation in each of the ionizer heads 8a to 8d in S107, the initial dose of each ionizer head may be set to 100%, and the degree of degradation may be determined from the corrected dose. Then, the presence or absence of degradation in each of the ionizer heads 8a to 8d may be determined by comparing this degree of degradation with an appropriate threshold.

[0038] Furthermore, the threshold value 15 used in S105 may be changed depending on the content and environment of the processing performed in the substrate processing apparatus 1. For example, when forming (transferring) a fine pattern onto the substrate 3, high static elimination performance is required to reduce the effects of peeling charge, so the value of the threshold value 15 may be increased to set a stricter judgment criterion.

[0039] Next, with reference to Figure 6, the degradation detection process in the operation sequence of the substrate processing apparatus 1 will be described.

[0040] Once the exposure process, which is a predetermined process for the substrate 3, is completed, in S201, the lifting drive unit 5 lifts the substrate 3 from the holding surface 4A (lifts up the substrate 3) in order to remove the substrate 3 from the substrate processing apparatus 1.

[0041] In S202, in order to suppress the delamination charge that occurs when lifting up the substrate 3 in S201, the ionizer heads 8a to 8d are turned ON and X-rays are irradiated from the ionizer heads 8a to 8d. From the viewpoint of suppressing delamination charge (discharging static electricity from the substrate 3), it is preferable to perform S202 in parallel with S201 or prior to S201.

[0042] In S203, the substrate 3, which was lifted up in S201, is unloaded from the substrate processing apparatus 1.

[0043] When the substrate 3 is unloaded from the substrate processing apparatus 1, degradation detection processing is performed in S204. The degradation detection processing is as described with reference to Figure 2, so a detailed explanation is omitted here. Note that S204 may be performed each time a substrate 3 is unloaded, or it may be performed per lot, or per predetermined lot.

[0044] Once the degradation detection process is complete, in S205, a new substrate 3 is transported to the substrate processing apparatus 1 via an externally provided transport unit.

[0045] In S206, the lifting drive unit 5 lifts down the substrate 3, which was brought into the substrate processing apparatus 1 in S205, onto the holding surface 4A. The substrate 3, lifted down by the lifting drive unit 5, is held by the substrate holding unit 4 via the holding surface 4A.

[0046] In S207, the ionizer heads 8a to 8d are turned OFF to stop the irradiation of X-rays from the ionizer heads 8a to 8d (X-ray irradiation is stopped).

[0047] In addition, in S204, the degradation detection process shown in Figure 7 may be performed instead of the degradation detection process shown in Figure 2. Here, the degradation detection process shown in Figure 7 will be explained. However, since S101 to S107 are as described above, a detailed explanation will be omitted here. If it is determined in S106 that the ionizer heads 8a to 8d are not in a degraded state, in S301, the ionizer heads 8a to 8d are turned ON to irradiate and X-rays are irradiated from the ionizer heads 8a to 8d. In this way, by turning ON the ionizer heads 8a to 8d before starting the loading of the substrate 3 (S205), the charging of the substrate 3 during loading can be efficiently suppressed (the substrate 3 can be efficiently discharged). If it is determined in S107 that any of the ionizer heads 8a to 8d are in a degraded state, in S302, an error indicating that the ionizer heads 8a to 8d are in a degraded state is notified. In error notification, it is preferable to identify and notify which of the ionizer heads 8a to 8d is in a degraded state.

[0048] Furthermore, if it is determined in S107 that any of the ionizer heads 8a to 8d are in a degraded state, the lifespan (usable period) of the other ionizer heads that are not degraded should be estimated based on their condition. For example, as shown in Figure 8, a trend 23 is generated by plotting the corrected doses 14a to 14d over time for each of the ionizer heads 8a to 8d, and a predicted dose value 24 is calculated from the trend 23 using linear extrapolation. If the predicted dose value 24 falls below the threshold 15 within a predetermined period 25, that ionizer head is determined to be in a degraded state in the near future. Information regarding the lifespan (usable period) of such ionizer heads can be notified, for example, through a user interface provided by the substrate processing device 1, prompting the replacement of the ionizer heads and thus reducing the downtime of the substrate processing device 1. Note that information regarding the lifespan of the ionizer heads may also be notified together with an error indicating that ionizer heads 8a to 8d are in a degraded state. Figure 8 illustrates an example of a method for estimating the lifetime of ionizer heads 8a to 8d. In Figure 8, the vertical axis represents dose, and the horizontal axis represents time.

[0049] Furthermore, if it is determined in S107 that any of the ionizer heads 8a to 8d are in a deteriorated state, the driving (lifting and lowering) speed of the substrate 3 by the lifting drive unit 5 may be reduced according to the degree of deterioration. For example, if it is determined that the ionizer head 8a is in a deteriorated state, the current dose is determined as a percentage of the initial dose of the ionizer head 8a (which is set to 100%), and the driving speed of the substrate 3 by the lifting drive unit 5 is reduced according to that percentage. This ensures that the substrate 3 can be sufficiently discharged even if the ionizer head 8a is in a deteriorated state, thereby improving the yield of the substrate processing device 1.

[0050] Thus, according to this embodiment, even if the number of detection units for detecting the dose of the ionizer heads is less than the number of ionizer heads, the degradation state of each ionizer head can be detected. Therefore, in addition to simplifying the configuration of the substrate processing apparatus 1, it contributes to reducing the downtime of the substrate processing apparatus 1 and improving the yield.

[0051] The method for manufacturing an article in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.). Such a manufacturing method includes the steps of forming a pattern on a substrate using a substrate processing apparatus 1, processing the substrate on which the pattern has been formed, and manufacturing an article from the processed substrate. Such a manufacturing method may also include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article in this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0052] The disclosures herein include the following substrate processing apparatus, static elimination apparatus, and method for manufacturing articles.

[0053] (Item 1) A substrate processing apparatus for processing substrates, A holding portion for holding the substrate, A plurality of irradiation units are arranged around the holding portion and irradiate the substrate with X-rays to remove static electricity from the substrate, A detection unit for detecting the dose of X-rays emitted from each of the plurality of irradiation units, A processing unit that performs processing to detect the state of each of the multiple irradiation units based on the detection result of the detection unit, It has, The number of the detection units is less than the number of the multiple irradiation units. A substrate processing apparatus characterized by the following:

[0054] (Item 2) The system further includes a control unit that controls the plurality of irradiation units, The control unit sequentially controls the irradiation or non-irradiation of each of the multiple irradiation units when the detection unit detects the X-ray dose. A substrate processing apparatus according to item 1, characterized in that it is a substrate processing apparatus.

[0055] (Item 3) The system further includes a control unit that controls the plurality of irradiation units, When the detection unit detects the X-ray dose, the control unit individually controls the irradiation or non-irradiation of each of the multiple irradiation units so that the detection unit can detect the X-ray dose emitted from one of the multiple irradiation units. A substrate processing apparatus according to item 1, characterized in that it is a substrate processing apparatus.

[0056] (Item 4) The plurality of irradiation units include a plurality of first irradiation units and a plurality of second irradiation units, The plurality of first irradiation units and the plurality of second irradiation units are arranged facing each other with the holding unit in between. A substrate processing apparatus according to any one of items 1 to 3, characterized by the above.

[0057] (Item 5) The holding portion holds the substrate via the holding surface on which the substrate is placed, The system further includes a lifting mechanism that moves the substrate up and down relative to the holding surface via a support member that supports the substrate, The detection unit is provided on the support member, A substrate processing apparatus according to item 4, characterized in that

[0058] (Item 6) The detection unit is A first detection unit is provided on the side of the support member facing the plurality of first irradiation units, and detects the dose of X-rays irradiated from each of the plurality of first irradiation units, A second detection unit is provided on the side of the support member facing the plurality of second irradiation units, and detects the dose of X-rays irradiated from each of the plurality of second irradiation units, including, A substrate processing apparatus according to item 5, characterized in that it is a substrate processing apparatus.

[0059] (Item 7) The substrate processing apparatus according to item 6, further comprising a path for X-rays irradiated from the plurality of first irradiation units and incident on the second detection unit, and a shielding unit that shields the path for X-rays irradiated from the plurality of second irradiation units and incident on the first detection unit.

[0060] (Item 8) The shielding portion is, A first shielding material is provided between the side of the support member facing the plurality of first irradiation portions and the first detection portion, A second shielding material is provided between the side of the plurality of second irradiation portions of the support member and the second detection portion, including, A substrate processing apparatus according to item 7, characterized by the features described therein.

[0061] (Item 9) The holding portion holds the substrate via the holding surface on which the substrate is placed, The system further includes a lifting mechanism that moves the substrate up and down relative to the holding surface via a support member that supports the substrate, The detection unit, after the substrate has been lifted from the holding surface by the lifting unit and transported to the outside of the substrate processing device, detects the dose of X-rays irradiated from each of the plurality of irradiation units. A substrate processing apparatus according to any one of items 1 to 8, characterized by the above.

[0062] (Item 10) The processing unit performs the following processing: Based on the positional relationship between each of the plurality of irradiation units and the detection unit, the directivity of each of the plurality of irradiation units, the attenuation characteristics of each of the plurality of irradiation units, and the directivity of the detection unit, a coefficient for normalizing the dose of X-rays detected by the detection unit is determined. Based on the result obtained by multiplying the X-ray dose detected by the detection unit by the coefficient, the state of each of the multiple irradiation units is detected. A substrate processing apparatus according to any one of items 1 to 9, characterized by the above.

[0063] (Item 11) The substrate processing apparatus according to any one of items 1 to 10, characterized in that the state includes a deterioration state indicating the degree of deterioration of each of the plurality of irradiation units.

[0064] (Item 12) The substrate processing apparatus according to any one of items 1 to 11, characterized in that the processing unit predicts the usable period of each of the plurality of irradiation units based on the state of each of the plurality of irradiation units.

[0065] (Item 13) The substrate processing apparatus according to item 12, characterized in that the processing unit notifies information regarding the usable period of each of the plurality of irradiation units.

[0066] (Item 14) The substrate processing apparatus according to any one of items 1 to 13, characterized in that the substrate processing apparatus is a lithography apparatus for forming a pattern on the substrate.

[0067] (Item 15) The substrate processing apparatus according to any one of items 1 to 14, characterized in that the substrate processing apparatus is an exposure apparatus that projects a pattern of a master plate onto the substrate and exposes the substrate.

[0068] (Item 16) The substrate processing apparatus according to any one of items 1 to 15, characterized in that the X-rays include soft X-rays.

[0069] (Item 17) A plurality of irradiation units are arranged around a holding unit that holds an object, and irradiate the object with X-rays to remove static electricity from the object, A detection unit for detecting the dose of X-rays emitted from each of the plurality of irradiation units, A processing unit that performs processing to detect the state of each of the multiple irradiation units based on the detection result of the detection unit, It has, The number of the detection units is less than the number of the multiple irradiation units. A static elimination device characterized by the following features.

[0070] (Item 18) A step of forming a pattern on a substrate using a substrate processing apparatus described in any one of items 1 to 16, A step of processing the substrate on which the pattern has been formed in the above step, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

[0071] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0072] 1: Substrate processing device 3: Substrate 4: Substrate holding unit 4A: Holding surface 5: Lifting drive unit 7: Lifting member 8a, 8b, 8c, 8d: Ionizer head 9: Control unit 11a, 11b: Detection unit IZR: Ionizer

Claims

1. A substrate processing apparatus for processing substrates, A holding portion for holding the substrate, A plurality of irradiation units are arranged around the holding portion and irradiate the substrate with X-rays to remove static electricity from the substrate, A detection unit for detecting the dose of X-rays irradiated from each of the plurality of irradiation units, A processing unit that performs processing to detect the state of each of the multiple irradiation units based on the detection result of the detection unit, It has, The number of the detection units is less than the number of the multiple irradiation units. A substrate processing apparatus characterized by the following:

2. The system further includes a control unit that controls the plurality of irradiation units, The control unit sequentially controls the irradiation or non-irradiation of each of the plurality of irradiation units when the detection unit detects the X-ray dose. The substrate processing apparatus according to claim 1.

3. The system further includes a control unit that controls the plurality of irradiation units, When the detection unit detects the X-ray dose, the control unit individually controls the irradiation or non-irradiation of each of the multiple irradiation units so that the detection unit can detect the X-ray dose emitted from one of the multiple irradiation units. The substrate processing apparatus according to claim 1.

4. The plurality of irradiation units include a plurality of first irradiation units and a plurality of second irradiation units, The plurality of first irradiation units and the plurality of second irradiation units are arranged facing each other with the holding unit in between. The substrate processing apparatus according to claim 1.

5. The holding portion holds the substrate via the holding surface on which the substrate is placed, The system further includes a lifting mechanism that moves the substrate up and down relative to the holding surface via a support member that supports the substrate, The detection unit is provided on the support member, The substrate processing apparatus according to feature 4.

6. The detection unit is A first detection unit is provided on the side of the support member facing the plurality of first irradiation units, and detects the dose of X-rays irradiated from each of the plurality of first irradiation units, A second detection unit is provided on the side of the support member facing the plurality of second irradiation units, and detects the dose of X-rays irradiated from each of the plurality of second irradiation units, including, The substrate processing apparatus according to feature 5.

7. The substrate processing apparatus according to claim 6, further comprising a path for X-rays irradiated from the plurality of first irradiation units and incident on the second detection unit, and a shielding unit that shields the path for X-rays irradiated from the plurality of second irradiation units and incident on the first detection unit.

8. The shielding portion is, A first shielding material is provided between the side of the support member facing the plurality of first irradiation portions and the first detection portion, A second shielding material is provided between the side of the support member facing the plurality of second irradiation portions and the second detection portion, including, The substrate processing apparatus according to feature 7.

9. The holding portion holds the substrate via the holding surface on which the substrate is placed, The system further includes a lifting mechanism that moves the substrate up and down relative to the holding surface via a support member that supports the substrate, The detection unit, after the substrate has been lifted from the holding surface by the lifting unit and transported to the outside of the substrate processing device, detects the dose of X-rays irradiated from each of the plurality of irradiation units. The substrate processing apparatus according to claim 1.

10. The processing unit performs the following processing: Based on the positional relationship between each of the plurality of irradiation units and the detection unit, the directivity of each of the plurality of irradiation units, the attenuation characteristics of each of the plurality of irradiation units, and the directivity of the detection unit, a coefficient for normalizing the dose of X-rays detected by the detection unit is determined. Based on the result obtained by multiplying the X-ray dose detected by the detection unit by the coefficient, the state of each of the multiple irradiation units is detected. The substrate processing apparatus according to claim 1.

11. The substrate processing apparatus according to claim 1, characterized in that the aforementioned state includes a deterioration state indicating the degree of deterioration of each of the plurality of irradiation units.

12. The substrate processing apparatus according to claim 1, characterized in that the processing unit predicts the usable period of each of the plurality of irradiation units based on the state of each of the plurality of irradiation units.

13. The substrate processing apparatus according to claim 12, characterized in that the processing unit notifies the user of information regarding the usable period of each of the plurality of irradiation units.

14. The substrate processing apparatus according to claim 1, characterized in that the substrate processing apparatus is a lithography apparatus for forming a pattern on the substrate.

15. The substrate processing apparatus according to claim 1, characterized in that the substrate processing apparatus is an exposure apparatus that projects a pattern of a master plate onto the substrate and exposes the substrate.

16. The substrate processing apparatus according to claim 1, characterized in that the X-rays include soft X-rays.

17. A plurality of irradiation units are arranged around a holding unit that holds an object, and irradiate the object with X-rays to remove static electricity from the object, A detection unit for detecting the dose of X-rays irradiated from each of the plurality of irradiation units, A processing unit that performs processing to detect the state of each of the multiple irradiation units based on the detection result of the detection unit, It has, The number of the detection units is less than the number of the multiple irradiation units. A static elimination device characterized by the following features.

18. A step of forming a pattern on a substrate using a substrate processing apparatus according to any one of claims 1 to 16, A step of processing the substrate on which the pattern has been formed in the above step, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

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